High-efficiency LED substrate heater for deposition applications

Abstract

An optical array disposed on a pedestal configured to deposit a material on a substrate includes a plurality of optical elements, a window, and an array of pinholes. The optical elements are disposed on a printed circuit board (PCB). The optical elements are configured to emit light. The window is composed of a light-transmissive material that covers the optical elements disposed on the PCB. The array of pinholes is disposed between the optical elements and the window. The pinholes are aligned perpendicular to the optical elements and direct the light emitted by the optical elements through the window to heat the substrate.

Description

Cross - reference to related applications

[0001] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 388,704, filed on July 13, 2022. The entire disclosure of the above application is incorporated herein by reference.

Technical Field

[0002] The present disclosure generally relates to semiconductor processing systems, and more specifically to a high - efficiency LED substrate heater for deposition applications.

Background Art

[0003] The description of the background art provided herein is for the purpose of generally presenting the content of the present disclosure. Within the scope described in this background art section, research by the inventors named at the present time, as well as aspects of the description that cannot be separately regarded as prior art at the time of filing, are not admitted as prior art against the present disclosure, whether expressly or impliedly.

[0004] Substrate processing systems generally include a plurality of processing chambers (also called process modules) that perform deposition, etching, and other processes on substrates such as semiconductor wafers. Examples of processes that can be performed on a substrate include chemical vapor deposition (CVD), plasma - enhanced CVD (PECVD), chemically - excited plasma vapor deposition (CEPVD), atomic layer deposition (ALD), epitaxial deposition, sub - atmospheric CVD, plasma - enhanced ALD (PEALD), and numerous other deposition processes that require maintaining the substrate at a high temperature. Further examples of processes that can be performed on a substrate include etching (e.g., chemical etching, plasma etching, reactive ion etching, etc.) and cleaning processes.

[0005] During processing, the substrate is placed on a susceptor such as a substrate support or pedestal, or a chuck (ESC) etc. within the processing chamber of the substrate processing system. In some processes, during deposition, a gas mixture containing one or more precursors may be introduced into the processing chamber, plasma may be struck, and a chemical reaction may be activated. In other processes, during etching, a gas mixture containing an etching gas may be introduced into the processing chamber, plasma may be struck, and a chemical reaction may be activated. A computer-controlled robot is used to transfer the substrate from one processing chamber to another in the order in which the substrate is to be processed.

Summary of the Invention

[0006] An optical array disposed on a pedestal configured to deposit material on a substrate includes a plurality of optical elements, a window, and an array of pinholes. The optical elements are disposed on a printed circuit board (PCB). The optical elements are configured to emit light. The window is composed of a light-transmissive material that covers the optical elements disposed on the PCB. The array of pinholes is disposed between the optical elements and the window. The pinholes are aligned perpendicular to the optical elements and direct the light emitted by the optical elements through the window to heat the substrate.

[0007] In a further feature, the optical array further includes a lens disposed between the optical element and the pinhole. The lens is aligned with the optical element and the pinhole and converges the light from the optical element to the pinhole.

[0008] In a further feature, the optical element includes a lens that converges the light from the optical element to the pinhole.

[0009] In a further feature, the array of pinholes is composed of a metal or dielectric material.

[0010] In a further feature, the array of pinholes is integrated with the window in a monolithic assembly.

[0011] In a further feature, the array of pinholes is coated with a reflective material on the side facing the window. The reflective material does not cover the pinholes.

[0012] In a further feature, the array of pinholes is coated with an anti-reflective material on the side facing the optical element.

[0013] In a further feature, the window is coated with an anti-reflective material on the side facing the optical element, and on the side facing the substrate, it is coated with a material that is anti-reflective to the wavelength of the light emitted by the optical element and reflective to infrared wavelengths.

[0014] In a further feature, the window is coated with an anti-reflective material on the side facing the optical element. The window further includes a reflective material coated on the anti-reflective material. The reflective material includes a metal film and pinholes.

[0015] In a further feature, the optical element includes a light-emitting diode.

[0016] In a further feature, the optical element includes a light-emitting diode configured to emit light having a wavelength between 530 nm and 1000 nm.

[0017] In a further feature, the optical array is circular. The optical element and the pinholes are arranged concentrically from the inner diameter to the outer diameter of the optical array.

[0018] In a further feature, the optical array further includes a lens disposed between the optical element and the pinholes. The optical array is circular. The optical element, the pinholes, and the lens are arranged concentrically from the inner diameter to the outer diameter of the optical array. The lens is aligned with the optical element and the pinholes and converges the light from the optical element onto the pinholes.

[0019] In a further feature, the pinholes are cylindrical.

[0020] In a further feature, the pinhole is conical and has a base facing the optical element.

[0021] In a further feature, the PCB further comprises one or more driver circuits configured to control the power supply to the optical element.

[0022] In a further feature, the PCB further comprises one or more driver circuits configured to control the operation of a selected one of the optical elements.

[0023] In a further feature, the PCB further comprises a driver circuit configured to control the light emitted by the optical element. The driver circuit is disposed on the same side of the PCB as the optical element, on the opposite side of the PCB, or on both sides of the PCB.

[0024] In a further feature, the optical array further comprises a heat sink attached to the PCB on the side opposite to the side on which the optical element is disposed.

[0025] In a further feature, the window is hermetically attached to the PCB.

[0026] In a further feature, the system comprises an optical array and a pedestal. The pedestal comprises a stem portion and a base portion fixed to the stem portion. The optical array is disposed on the base portion of the pedestal.

[0027] In a further feature, the base portion and the optical array are in the same plane.

[0028] In a further feature, the base portion and the optical array are circular. The outer diameter of the optical array is less than or equal to the outer diameter of the base portion.

[0029] In a further feature, the base portion and the optical array are circular. The outer diameter of the array is less than or equal to the outer diameter of the substrate.

[0030] In a further feature, the base portion and the optical array are circular. The outer diameter of the array is at least the same as the outer diameter of the substrate.

[0031] In a further feature, the pedestal further comprises a shaft and an actuator. The shaft is disposed through the stem portion, the base portion, and the center of the array. The actuator is coupled to the shaft and is configured to move the substrate relative to the pedestal.

[0032] In a further feature, the pedestal further comprises a shaft and an actuator. The shaft is disposed through the stem portion, the base portion, and the center of the array. The actuator is coupled to the shaft and is configured to move the substrate perpendicular to the plane in which the base portion is located.

[0033] In a further feature, the pedestal further comprises a shaft and an actuator. The shaft is disposed through the stem portion, the base portion, and the center of the array. The actuator is coupled to the shaft and is configured to rotate the substrate relative to the base portion.

[0034] In a further feature, the pedestal further comprises a shaft and an actuator. The shaft is disposed through the stem portion, the base portion, and the center of the array. The shaft comprises a conduit for receiving gas and a plurality of holes in fluid communication with the conduit near a first end of the shaft proximate to the array. The actuator is coupled to a second end of the shaft and is configured to move the substrate perpendicular to the plane in which the base portion is located. When the shaft rises above the array, the plurality of holes radially supply gas above the window.

[0035] In a further feature, the array of pinholes is connected to a ground potential.

[0036] Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims, and the drawings. The detailed description and specific examples are intended for illustration only and are not intended to limit the scope of the disclosure.

Brief Description of the Drawings

[0037] The present disclosure will be more fully understood from the detailed description and the accompanying drawings.

[0038]

Figure 1A

[0039]

Figure 1B

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Figure 2

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Figure 3

[0042]

Figure 4A

Figure 4B

Figure 4C

Figure 4D

[0043]

Figure 5A

Figure 5B

Figure 5C

Figure 5D

[0044]

Figure 6

[0045]

Figure 7

[0046]

Figure 8

[0047]

Figure 9

Figure 10

[0048] In the drawings, reference numerals may be reused to identify similar and / or identical elements.

DETAILED DESCRIPTION OF THE INVENTION

[0049] Generally, in deposition applications, a resistive heating pedestal or susceptor is used to heat a substrate. The pedestal includes a heat conductor, which is typically made of a metal such as aluminum, and integrally houses a heater element that heats the heat conductor. The heat conductor diffuses a heat flux to heat the substrate disposed on the pedestal during processing. The substrate is thermally coupled to the pedestal by gas conduction combined with radiation between the substrate and the heated pedestal.

[0050] Since it is difficult to mount a heating element for local heating on the monolithic body of the pedestal, the resistance heating pedestal has limited ability to adjust or regulate the local heating of the substrate in a recipe - controllable manner. The ability to adjust or regulate the local heating of the substrate is further limited because the heat conductor locally diffuses heat to enhance temperature uniformity across the pedestal. On the other hand, materials with low thermal conductivity such as ceramics face the challenge of striking a balance between keeping the thermal resistance low enough to enable local heating and having sufficiently high fracture toughness and thermal shock resistance to prevent accidental breakage. Another limitation regarding the thermal uniformity across the substrate is proximity to the chamber wall and radiative and conductive heat losses, which vary across different parts of the substrate and thus need to be compensated in the form of different heating powers by the heating element.

[0051] Instead, an optical array such as an LED array disposed within or on the pedestal can be used to heat the substrate. Different from other heating elements, the optical array comprises optical elements such as LEDs that can emit light to optically heat the substrate. The optical array can adjust or regulate the local heating of the substrate in a recipe - controllable manner. The substrate can be heated by light of shorter wavelengths, but photo - induced corrosion may occur at wavelengths less than 530 nm. Therefore, the wavelength for optical heating of the substrate is preferably selected between 530 nm and 1000 nm. Heating based on the optical array provides recipe - controlled and highly adjustable substrate heating, thereby adjusting the thermal uniformity, improving the unit process, and compensating for problems in upstream or downstream processes.

[0052] In vacuum deposition applications, the optical array is enclosed within a sealed housing. Light from the optical array generally irradiates the substrate through a light - transmissive window made of quartz or sapphire. In some examples, the substrate and the optical array may be stationary relative to each other. Alternatively, the substrate and the optical array may rotate relative to each other.

[0053] The window needs to be kept clean to prevent fluctuations in the window's light transmission efficiency due to parasitic deposition on the window's surface. In applications where the substrate is placed directly on the window, purge schemes such as purging the edge through annular or annularly arranged gas purge openings can be used to keep the window clean. Alternatively, when the substrate is separated from the window and the process pressure exceeds a threshold (e.g., at least 40 Torr, etc.), a crossed-flow gas purge configuration utilizing the Coanda effect can be used. Alternatively, the window may be subjected to periodic dry chemical cleaning. These features are also applicable to aqueous (wet) deposition applications.

[0054] From an environmental, social, and governance (ESG) perspective, LEDs are superior in performance to other heaters. LED heating may be inefficient in terms of the conversion of electrical power to thermal power. However, because the temperature of LEDs is low, LED heating can prevent radiative losses to the remaining part of the processing chamber. Specifically, due to the directional heating provided by LEDs, the optical array heats only the substrate and not the processing chamber. Furthermore, LED heating can also provide zone heating control for applications that use only heat and do not use plasma. Therefore, LED heating provides a more efficient wafer heating system than other heating forms.

[0055] Generally, an optical array-based heater converts from about one-third to about one-half of the power supplied to the LEDs into optical power. Of the optical power, about 60% heats the substrate and 40% is reflected back from the substrate. The reflected power heats the metal core PCB that supplies power to the LED PCB and the heat sink disposed below the metal core PCB. The LED PCB is generally coated with a white paint to reduce heat absorption. However, the surface area occupied by the LEDs and their associated electrical contact pads is quite large compared to the total surface area of the LED PCB. Further, a portion of the waste heat heats the electronics of the metal core PCB that supplies power to the LED PCB, setting an upper limit on the available operating substrate temperature during processing. To eliminate this limitation, it is necessary to increase the optical heating efficiency of the optical array-based heater. The present disclosure provides a system that minimizes the optical power absorbed by the LED PCB and maximizes the optical power available for heating the substrate.

[0056] Specifically, an array of pinholes (pinhole array) with small apertures is disposed above the LED array. The pinhole array can be composed of a metal or a dielectric material (e.g., glass coated with a dielectric material). A light collecting layer is disposed between the LED array and the pinhole array to collect the light from the LEDs through the small apertures in the pinhole array. For example, the light collecting layer may be composed of an array of focusing lenses manufactured as a single assembly using printing or other manufacturing methods. Alternatively, the LED array may be manufactured such that each LED includes a built-in lens.

[0057] The pinhole array is coated with a super-reflective coating (e.g., barium sulfate, dielectric thin film, or metal and dielectric thin film) on the side opposite to the LEDs (i.e., the side facing the substrate). The super-reflective coating does not cover the pinholes themselves but covers the remaining surface area of the pinhole array. Optionally, an anti-reflective coating may be applied to the pinhole array on the side facing the LEDs. With these coatings, the pinhole array transmits the maximum light power from the LEDs through the window and heats the substrate.

[0058] Furthermore, the window disposed above the LED array may be coated with a suitable coating that reduces the amount of light reflected back through the window and reduces infrared heat transfer from the substrate to the LED array. Specifically, the first coating applied to the side of the window facing the substrate (i.e., the side facing the wafer) causes the secondary light reflected from the bottom surface of the substrate to be reflected back to the bottom surface of the substrate. Therefore, the first coating improves the light heating efficiency of the LED array. The first coating has anti-reflective properties at the wavelength of the light emitted by the LEDs and allows light to pass from the pinhole array to the substrate (i.e., the wafer). Furthermore, the first coating has reflective properties at infrared wavelengths and can reduce infrared heat transfer from the substrate to the LED array. Also, it is preferable to apply a second anti-reflective coating to the side of the window facing the LEDs, so that the maximum amount of light from the pinhole array passes through the window and heats the substrate (i.e., the wafer). The second coating also has reflective properties at infrared wavelengths and can reduce infrared heat transfer from the substrate to the LED array.

[0059] Alternatively, the pinhole array does not have to be a separate element. Instead, a layer of reflective coating can be applied over the anti-reflective coating on the side of the window opposite the LED, and pinholes can be provided in the layer of the reflective coating itself. That is, the pinholes can be provided in the layer of the reflective coating itself. Thus, a window having an anti-reflective coating applied to the top and bottom surfaces and a layer of reflective coating with pinholes can be manufactured as a monolithic assembly instead of the window and the pinhole array being two separate components.

[0060] In a monolithic assembly, the anti-reflective coating between the reflective coating and the window is formed by a blanket coating process (e.g., blanket deposition of a film). However, the anti-reflective coating functions as a reflective coating in the presence of the reflective coating beneath the anti-reflective coating. The anti-reflective layer is designed such that at the pinholes, it nominally transmits all light without reflecting. A reflective coating containing a metal layer is hardly affected by the coating beneath the metal layer because, for example, the skin depth of the metal is small compared to the thickness of the metal.

[0061] When using a dielectric film to form the reflective layer, the anti-reflective layer may interact with the reflective layer, and the film design can be complicated because all dielectric layers for anti-reflection and reflection need to be considered. Instead, using a metal film for the reflective layer simplifies the design of the metal film because the electromagnetic field of light cannot penetrate the metal film and the light cannot interact with the anti-reflective layer. Any material used beneath the metal film to form the reflective layer (and pinholes) does not affect the functions of the reflective layer and the anti-reflective layer because the metal film in the reflective layer is thick enough (i.e., much thicker than the skin depth of the metal). When the metal film is much thicker than the skin depth, the metal film makes the anti-reflective coating invisible to light. Such functionality cannot be achieved when the reflective layer is composed of a dielectric film.

[0062] The net effect of the system is to significantly increase the optical power supplied to the substrate by the LED array by reusing the secondary light reflected by the substrate and reducing the heat transfer from the substrate to the LED array in order to heat the substrate. The reflective pinhole array significantly increases the surface area of the reflective surface of the pinhole array to be much larger than 90%, reducing the optical power flowing into the heating of the electronics powering the LEDs. Thus, the system increases the available operating temperature of the optical array-based heater and reduces losses to the heat sink over a wide range of processes used to process the substrate.

[0063] FIG. 1A shows an example of an optical array 10 according to the present disclosure. The optical array 10 includes an LED array 12, a lens array 14, and a pinhole array 16. The LED array 12 includes a plurality of LEDs 22. The lens array 14 includes a plurality of lenses 24. The pinhole array 16 includes a plurality of pinholes 26. The LEDs 22, the lenses 24, and the pinholes 26 are aligned perpendicular to each other. As will be described in detail below with reference to FIGS. 2-7, the LEDs 22 are disposed on a metal core PCB and a transmissive window is disposed above the pinhole array 16. A substrate 30 is placed above the optical array 10 (i.e., above the window).

[0064] As indicated by the arrow, the light from each LED 22 passes through the corresponding pinhole 26 and is focused onto the substrate 30 by the corresponding lens 24. A part of the light incident on the substrate 30 is absorbed by the substrate 30 and used to heat the substrate 30. Most of the light incident on the substrate 30 generally reflects back from the bottom of the substrate 30. However, the light reflected back from the substrate 30 cannot pass through the surface of the pinhole array 16 and instead reflects back to the bottom of the substrate 30, where another portion of this light is again absorbed by the substrate 30, and so on. To enhance this effect, the surface of the pinhole array 16 facing the substrate 30 is coated with a reflective coating for the wavelength that is most readily absorbed by the surface. Thus, the heating efficiency of the optical array 10 is improved. These and other features of the present disclosure are described in detail below. The optical array 10 is shown and described in further detail as the optical array 150 with reference to FIGS. 1B - 10.

[0065] The remainder of the present disclosure is configured as follows. In Section 1, an example of a system for processing a substrate according to the present disclosure is shown and described with reference to FIG. 1B. This system provides an example of an environment in which the optical array and pedestal described with reference to FIGS. 2 - 10 can be implemented. In Section 2, examples of optical arrays used in the pedestal for heating a substrate within the system of FIG. 1B are shown and described with reference to FIGS. 2 - 8. In Section 3, examples of pedestals with optical arrays used for heating a substrate within the system of FIG. 1B using a vacuum clamp are shown and described with reference to FIGS. 9 and 10. Section 1: Example of a Substrate Processing System

[0066] FIG. 1B shows an example of a substrate processing system (hereinafter, System 100). System 100 can be used to process a substrate using a chemical vapor deposition (CVD), plasma - enhanced CVD (PECVD), chemically - excited plasma vapor deposition (CEPVD), atomic layer deposition (ALD), or plasma - enhanced ALD (PEALD) process.

[0067] System 100 includes a processing chamber 101 and a gas distribution system 102. The gas distribution system 102 includes a plurality of gas sources 104, a plurality of valves 106 connected to the gas sources 104, and a plurality of mass flow controllers (MFCs) 108 connected to the valves 106. The gas sources 104 supply various gases including process gases, precursors, purge gases, inert gases, cleaning gases, etc. The MFCs 108 control the mass flow rate of the gases.

[0068] In some applications, the gas distribution system 102 further includes a vapor supply system 110 for supplying one or more vaporized precursors through one or more valves 112. One or more gases from the MFCs 108, and, if used, one or more vaporized precursors are supplied to a mixing manifold 114. The gas or gas mixture from the mixing manifold 114 is supplied to the processing chamber 101 through a valve assembly (e.g., a pulse valve manifold or PVM assembly) 116.

[0069] The processing chamber 101 includes a showerhead 120 and a pedestal 130. The showerhead 120 is attached to the upper plate of the processing chamber 101. The showerhead 120 receives the gas or gas mixture from the mixing manifold 114 through the valve assembly 116. The showerhead 120 is composed of a base portion 122 and a stem portion 124. The stem portion 124 extends from the center of the base portion 122 and is attached to the upper plate of the processing chamber 101. The base portion 122 is cylindrical and has a plurality of through holes (not shown) through which the gas or gas mixture is supplied into the processing chamber 101.

[0070] The pedestal 130 is composed of a base portion 132 and a stem portion 134. The stem portion 134 can be generally cylindrical or Y-shaped, and a tapered (i.e., the top of the Y) portion is attached to the bottom of the base portion 132. The stem portion 134 extends from the base portion 132 and is attached to the bottom of the processing chamber 101. The base portion 132 is also cylindrical. The substrate 140 is disposed on the upper surface of the base portion 132 of the pedestal 130 during processing.

[0071] Although not shown, the base portion 132 of the pedestal 130 may include lift pins for holding, lowering, and raising the substrate 140 with respect to the base portion 132 of the pedestal 130. Optionally, a shaft (shown and described below) extending through the stem portion 132 and the base portion 132 of the pedestal 130 may be used to hold, lower, and raise the substrate 140 with respect to the base portion 132 of the pedestal 130. The lift pins and the shaft can be used in combination to hold, lower, and raise the substrate 140 with respect to the base portion 132 of the pedestal 130.

[0072] The substrate 140 may be clamped to the base portion 132 using one of many clamping methods. Examples of clamping methods include vacuum clamping, electrostatic clamping, and mechanical clamping. An example of a pedestal 130 with a vacuum clamp that can be used within the processing chamber 101 is shown and described below with reference to FIGS. 9 and 10.

[0073] The base portion 132 includes an optical array (e.g., an LED array) 150 for heating the substrate 140, as shown and described in detail below. The optical array 150 includes optical elements (e.g., LEDs), lenses, a pinhole array, and a transmission window (all shown and described below with reference to FIGS. 2 - 8). The LEDs preferably emit light having a wavelength selected between 530 nm and 1000 nm for optical heating of the substrate 140. Through the transmission window, light from the LEDs, lenses, and pinhole array within the optical array 150 is incident on the bottom surface of the substrate 140 to heat the substrate 140.

[0074] The substrate 140 may be heated while being held above the optical array 150 (e.g., by lift pins or shafts passing through the optical array 150). The substrate 140 may be heated when placed on the optical array 150 without being clamped. The substrate 140 may be heated when placed on the optical array 150 while being clamped to the pedestal 130 using any of the clamping methods described above.

[0075] A purge gas (e.g., an inert gas) from one of the gas sources 104 is supplied to the stem portion 134 through the valve 152. The purge gas flows radially upward and across the window of the optical array 150 to clean the window and maintain its transparency, as will be described in detail below. Examples of the pedestal 130 with the optical array 150 and the purge mechanism that can be used within the processing chamber 101 are shown and described in detail below with reference to FIGS. 9 and 10.

[0076] In some applications (e.g., in PECVD and PEALD processes), the substrate 140 may be processed using plasma. The system 100 includes a radio frequency (RF) system 142 used to generate plasma within the processing chamber 101. The RF system 142 includes an RF generator 144 and a matching circuit 146. The RF system 142 supplies RF power to the showerhead 120 while the pedestal 130 is grounded. Alternatively, although not shown, RF power can be supplied to the pedestal 130 while the showerhead 120 is grounded. The RF power activates the gas or gas mixture supplied through the showerhead 120 and generates plasma between the showerhead 120 and the substrate 140 disposed on the pedestal 130.

[0077] The shower head 120 and the pedestal 130 are provided with temperature sensors 126 and 136 for sensing the temperatures of the shower head 120 and the pedestal 130. The shower head 120 and the pedestal 130 are provided with cooling channels (not shown). A coolant circulates through the cooling channels to control the temperatures of the shower head 120 and the pedestal 130. The coolant supply device 160 can supply the coolant to the cooling channels in the shower head 120 and the pedestal 130 via valves 162 and 164.

[0078] Generally, one or more actuators shown at 170 may be used to move the pedestal 130 relative to the shower head 120. Also, one of the actuators 170 may be used to move and rotate a shaft (shown in FIGS. 9 and 10) passing through the stem portion 134 of the pedestal 130 to lift and rotate the substrate 140. The purge gas used to clean the window of the optical array 150 is supplied through the valve 152 via a conduit in the shaft as shown and described below with reference to FIGS. 9 and 10.

[0079] A vacuum pump 180 is connected to the bottom of the processing chamber 101 through a valve 182. The vacuum pump 180 is used to maintain the vacuum in the processing chamber 101 and to discharge reactants and process by-products from the processing chamber 101. Further, when a vacuum clamp is used, the vacuum pump 180 is connected to the stem portion 134 of the pedestal 130 through a valve 184. The vacuum pump 180 maintains the vacuum by an annular volume (shown and described below) around the shaft at the stem portion 134 of the pedestal 130 and clamps the substrate 140 to the pedestal 130.

[0080] Further, the stem portion 134 constitutes a conduit (shown in FIGS. 9 and 10) that provides electrical connection to various electrical elements disposed in the base portion 132 of the pedestal 130. For example, the electrical elements include the optical array 150, the temperature sensors 126 and 136, and other electrical elements (e.g., clamp electrodes when the pedestal 130 includes an electrostatic chuck) disposed in the base portion 132 of the pedestal 130.

[0081] The controller 190 controls various elements of the system 100 (e.g., the gas distribution system 102, valves, the RF system 142, the optical array 150, the coolant supply device 160, the actuator 170, the vacuum pump 180, etc.). The controller 190 receives data from the temperature sensors 126, 136 and controls the temperature of the shower head 120 and the pedestal 130 by controlling the optical array 150 and the coolant supply device 160. These and other features of the system 100 will be described in more detail below. Section 2: Optical Array

[0082] Figures 2-8 show various examples of the optical array 150. Figure 2 shows a top view of the optical array 150. Figure 3 shows a cross-sectional view of the optical array 150 taken along the line A-A shown in Figure 2. Figures 4A-4D show a first example (embodiment) of the optical array 150 in which the pinhole array is implemented as a separate element. Figures 5A-5D show a second example (embodiment) of the optical array 150 in which the pinhole array is integrated with the window (i.e., the window and the pinhole array are a monolithic assembly). Figure 6 shows a top view of the pinhole array, indicating that the pinholes coincide with the LEDs. Figure 7 shows a top view of the lens array, indicating that the lenses coincide with the LEDs. Figure 8 shows a block diagram of the circuit for controlling the optical array 150. Next, Figures 2-8 will be described in detail below.

[0083] In FIG. 2, the optical array 150 is generally circular and has a radius smaller than the outer diameter (OD) of the base portion 132 of the pedestal 130. The radius of the optical array 150 is approximately equal to or at least equal to the radius of the substrate 140. For example, the optical array 150 includes a plurality of LEDs 200 disposed on a printed circuit board (PCB) 201. The PCB 201 may be a metal core PCB. For example, the LEDs 200 are arranged in concentric circles 202 on the PCB 201. For illustrative purposes, only a few concentric circles 202 are shown, but the number of concentric circles 202 may vary. For example, the concentric circles 202 may be more densely packed than the illustrated concentric circles. Further, the number of LEDs 200 in each concentric circle 202 may be more than the illustrated number. Thus, the concentric circles 202 and the LEDs 200 are arranged at a higher density in the optical array 150 than illustrated. The concentric circles 202 and the LEDs 200 extend from the inner annular region 204 of the optical array 150 to the OD of the optical array 150. The LEDs 200 emit light having a wavelength preferably selected between 530 nm and 1000 nm for optically heating the substrate 140. The light emitted by the LEDs 200 optically heats the substrate 140.

[0084] The LEDs 200 may be arranged in concentric circles 202 in different patterns. For example, in some of the concentric circles 202, the LEDs 200 may be arranged at a higher density than in other concentric circles 202. For example, the LEDs 200 within a portion (e.g., a zone or quadrant) of the optical array 150 may be arranged at a higher density than other portions of the optical array 150. Further, the size, luminosity, and / or wavelength(s) of the LEDs 200 may vary from concentric circle 202 or portion to portion. Any combination of these and further features of the LEDs 200 may be used in the optical array 150.

[0085] The optical array 150 includes one or more driver circuits (hereinafter referred to as "drivers") 206 disposed on the PCB 201. Although multiple drivers 206 are shown, a single driver 206 may be used. The following description of the driver 206 applies when a single driver is used. As will be described in detail below, the driver 206 controls the LEDs 200. For example, the driver 206 may be disposed on the same side of the PCB 201 as the LEDs 200, on the opposite side of the PCB 201, or on both sides of the PCB 201. For example, one or more of the drivers 206 may be disposed along different radii on the PCB 201. For example, the driver 206 may be disposed on the PCB 201 in a regular pattern or an irregular pattern (e.g., randomly). The driver 206 will be described in more detail below with reference to FIG. 8.

[0086] In FIG. 3, the optical array 150 further includes a window 210, a lens (e.g., a convex lens) 220, and a pinhole array 222. The lens 220 is disposed above the LEDs 200. For example, the lens 220 may be in the form of a lens array (shown in FIG. 7) that can be disposed on top of the LEDs 200. As shown in FIG. 7, the lenses 220 in the lens array are also disposed in a concentric circle 202 pattern so that the lenses 220 are aligned or coincide with the LEDs 200. Alternatively, the lens 220 may be integrated within the LEDs 200. That is, each LED may have a lens. In any embodiment, the lens 220 converges (i.e., focuses) the light emitted by the LEDs onto the pinholes in the pinhole array 222.

[0087] The pinhole array 222 can be implemented as a separate element as shown and described below with reference to FIGS. 4A-4D. In an alternative design, the pinhole array 222 can be integrated into the window 210 as a monolithic assembly as shown and described below with reference to FIGS. 5A-5D. When used as a separate element, the pinhole array 222 is composed of a metal or dielectric material (e.g., glass coated with a dielectric material). As shown in FIG. 6, a plurality of holes are drilled in the pinhole array 222. Similar to the lens 220, the holes are drilled in the pinhole array 222 in a concentric circle 202 pattern such that the holes are aligned or coincide with the LEDs 200. Thus, the holes in the LEDs 200, lens 220, and pinhole array 222 (i.e., the pinholes 223 shown in FIGS. 4A-5B) are aligned perpendicular to each other. The holes in the lens 220 and pinhole array 222 provide a straight-line path for the light from the LEDs 200 to the window above the optical array 150 and further through the window to the substrate 140 (shown in FIGS. 1, 9, and 10). An alternative design is described with reference to FIGS. 5A-5D.

[0088] In any embodiment, the window 210 is composed of a material having light transmissivity, chemical resistance, and electrical insulation such as quartz or sapphire. The window 210 has an opening in a central region that coincides with the inner annular region 204 of the optical array 150. The opening has a diameter that matches the diameter of the inner annular region 204 of the optical array 150. The inner and outer peripheral edges of the window 210 are sealed and attached to the inner and outer peripheral edges of the optical array 150, respectively. Thus, the optical array 150 and the window 210 form a sealed enclosure in which the LEDs 200, PCB 201, lens 220, and pinhole array 222 are housed. A heat sink 205 is attached to the bottom surface of the PCB 201. The heat sink 205 removes heat from the PCB 201.

[0089] Figures 4A to 4D show a first example of the optical array 150 in more detail. In Figure 4A, the pinhole array 222 is implemented as a separate element. The pinhole array 222 includes pinholes 223 formed in the pinhole array 222, as described above. When the substrate of the pinhole array 222 is thin, the pinholes 223 may penetrate straight through, as shown in Figures 4A and 4B. Alternatively, when the substrate is considerably thick or of sufficient thickness, the pinholes 223 may have a dishhole shape that substantially takes into account the focusing angle of the focused light. Two non-limiting examples of pinholes 223 having a dishhole shape are shown in Figures 4C and 4D. Although the pinholes 223 are shown generally as circular, cylindrical, and conical, the pinholes 223 may have other shapes.

[0090] The pinhole array 222 further includes a first coating 224 applied to a first side (i.e., the side facing the substrate 140) opposite the LEDs 200. For example, the first coating 224 is composed of an optically super-reflective material (e.g., barium sulfate, a dielectric thin film, or a metal and dielectric thin film). The first coating 224 does not cover the pinholes 223 within the pinhole array 222, but covers the remaining surface area of the pinhole array 222, as shown in Figure 4B. Optionally, a second coating 226 composed of an anti-reflection material may also be applied to the pinhole array 222 on the second side facing the LEDs 200. With these coatings 224, 226, the pinhole array 222 transmits maximum light power from the LEDs 200 through the window 210 and heats the substrate 140.

[0091] Furthermore, window 210 may be coated with a suitable coating that reduces the amount of light reflected back through the window and reduces infrared heat transfer from the substrate to the LED array. Specifically, a first coating 228 is applied to the side facing the substrate 140. The first coating 228 reflects the secondary light reflected from the bottom surface of the substrate 140 back to the bottom surface of the substrate 140, as indicated by the dotted arrow. Therefore, the first coating 228 improves the light heating efficiency of the LED array.

[0092] The first coating 228 has antireflectivity at the wavelength of the light emitted by the LEDs 200 and can transmit the light from the pinhole array 222 through the substrate 140. Furthermore, the first coating 228 has reflectivity at infrared wavelengths and reduces infrared heat transfer from the substrate 140 to the optical array 150. A second coating 230, which is composed of an antireflective material, is also preferably applied to the side facing the LEDs 200. The second coating 230 transmits the maximum amount of light from the pinhole array 222 through the window 210 and heats the substrate 140. The second coating 230 also has reflectivity at infrared wavelengths and can reduce infrared heat transfer from the substrate 140 to the optical array 150.

[0093] Figures 5A - 5D show a second example of the optical array 150 with an alternative design of the pinhole array 222. In the alternative design, the pinhole array 222 is not a separate element. Rather, a layer of reflective coating 232 is applied over the second coating 230 on the LED-facing side of the window 210, and pinholes 223 are provided in the layer of reflective coating 232 itself. That is, as shown in Figure 5B, pinholes 223 are provided in the layer of reflective coating 232 itself to form the pinhole array 222. Referring to Figures 4A and 4B and as shown for the pinholes 223 in the pinhole array 222 described above, the pinholes 223 in the layer of reflective coating 232 are also arranged in concentric circles 202. Thus, the window 210 having anti-reflection coatings (i.e., the first and second coatings 228, 230) on the top and bottom surfaces and a layer of reflective coating 232 with pinholes 223 is manufactured as a monolithic assembly. Further, as shown in Figures 5C and 5D, the pinholes 223 shown in Figures 5A and 5B can also be shaped as shown with reference to Figures 4C and 4D and as shown for the pinholes 223 in the pinhole array 222 described above.

[0094] In the monolithic assembly, the anti-reflection coating (i.e., the second coating 230) between the reflective coating 232 and the window 210 is formed by a blanket coating process (e.g., blanket deposition of a film). However, the anti-reflection coating (i.e., the second coating 230) functions as a reflective coating in the presence of the reflective coating 232 underlying the anti-reflection coating. The anti-reflection coating (i.e., the second coating 230) is designed such that all light can pass through without reflection at the nominal pinholes 223. The reflective coating 232, which is composed of the metal film 234, is little affected by other coatings that may be present beneath the metal film 234 since the skin depth of the metal in the metal film 234 is less than the thickness of the metal 234.

[0095] Since the metal film 234 is used for the reflective coating 232, the electromagnetic field of light cannot pass through the metal film 234, and the light cannot interact with the antireflection layer (i.e., the second coating 230). Since the metal film 234 in the reflective coating 232 is thick enough (i.e., much thicker than the skin depth of the metal in the metal film 234), any material used under the metal film 234 to form the reflective coating 232 (and the pinhole 223) does not affect the function of the reflective coating 232 and the function of the antireflection layer (i.e., the second coating 230). When the metal film 234 is much thicker than the skin depth of the metal in the metal film 234, the metal film 234 makes the antireflection coating (i.e., the second coating 230) invisible to light.

[0096] The coating materials described above are composed of a dielectric film in which a low refractive index material and a high refractive index material are alternately laminated. Examples of the coating materials used for the coatings described above include MgF2, TiO2, Ta2O5, Al2O3, ZrO2, and SiO2. The thickness of the coating is selected to maximize the antireflection performance or the reflection performance. For example, in the case of a single-layer film coating, a thickness of λ / 4 can be used for antireflection (destructive interference), and a thickness of λ / 2 can be used for reflection (constructive interference), where λ is the wavelength of the light emitted by the LEDs 200. Other design considerations include the wavelength range of light and the angle of incidence.

[0097] FIG. 6 shows a top view of the pinhole array 222. The illustrated figure is the same regardless of whether the pinhole array 222 is implemented as a separate element as shown in FIGS. 4A and 4B or is implemented monolithically (i.e., integrated with the window 210 as a single assembly) as shown in FIGS. 5A and 5B. As described above, the pinholes 223 are arranged in a concentric circle 202 shape, similar to the LEDs 200. Therefore, regardless of the implementation of the pinhole array 222, the pinholes 223, the lens 220, and the LEDs 200 are aligned perpendicular to each other as described above.

[0098] FIG. 7 shows a top view of the lens 220. The illustrated figure is the same whether the lens 220 is implemented in the form of a lens array (i.e., as a separate element) or integrated within the LEDs 200 as described above. Further, as described above, the lens 220 is arranged in a concentric circle 202 shape, similar to the LEDs 200. Thus, regardless of the implementation of the lens 220, the pinhole 223, the lens 220, and the LEDs 200 are aligned perpendicular to each other as described above. Specifically, each lens 220 is aligned perpendicular to the corresponding LED 200, and each pinhole 223 is aligned perpendicular to the corresponding lens 220 and the corresponding LED 200. Thus, the pinhole 223, the lens 220, and the LEDs are on the same line, providing a straight path for the light from the LEDs 200 through the lens 220, the pinhole 223, and the window 210 to the substrate 140.

[0099] FIG. 8 shows a circuit for controlling the LEDs 200. Each driver 206 may control a set (group) of the LEDs 200. The controller 190 may control the LEDs 200 by controlling the driver 206. For example, after the substrate 140 is placed within the processing chamber 101 and before the substrate 140 descends onto the pedestal 130 to deposit a film on the substrate 140, while the substrate 140 is held above the pedestal 130, the driver 206 may supply power to the LEDs 200 at a first power level to preheat the substrate 140. Thereafter, after a predetermined time elapses during which the substrate 140 is preheated and before and after the substrate 140 descends onto the pedestal 130, the driver 206 may supply a reduced amount of power to the LEDs 200 at a second power level to heat the substrate 140. Thereafter, after a film is deposited on the substrate 140 and before the substrate 140 is lifted from the pedestal 130 and removed from the processing chamber 101, the driver 206 may supply a reduced amount of power to the LEDs 200 at a third power level.

[0100] Furthermore, in any of the above steps, driver 206 may further control the power supplied to LEDs 200. For example, each driver 206 may control the duty cycle (on time / off time) of respective LEDs 200. For example, each driver 206 may control the intensity (luminance) of respective LEDs 200. For example, controller 190 may control driver 206 such that only the selected concentric circle 202-shaped LEDs or only some of those LEDs are turned on or off at different times. For example, controller 190 may control driver 206 such that only one or more LEDs 200 within a set (e.g., a zone or portion of optical array 150) are turned on or off at different times. For example, controller 190 may control driver 206 such that LEDs 200 or different portions of LEDs 200 can output various amounts of light (i.e., light heating power) at different times. Driver 206 may control the power supplied to LEDs 200 gradually or in steps. Any combination of these controls and further controls may be used to control LEDs 200.

[0101] In some examples, some or all of the control provided by controller 190 may be offloaded (in the form of hardware, firmware, or a combination thereof) within one or more drivers 206. In some examples, one or more drivers 206 may control the remaining drivers 206. Further, substrate 140 is rotatable relative to optical array 150, as described later. Controller 190 and / or driver 206 can control LEDs 200 separately before and after substrate 140 rotates. Thus, by controlling one or more LEDs 200, the light heating of various portions of substrate 140 can be controlled.

[0102] When the optical array 150 and the window 210 are used in the pedestal 130 shown in FIG. 1B, they may include any embodiment of the lens 220 and the pinhole 223 described above with reference to FIGS. 2-7. For example, the optical array 150 may comprise a lens 220 in the form of a lens array, or a lens 220 integrated with the LEDs 200. For example, the optical array 150 may comprise a pinhole array 222 mounted as a separate element or as a monolithic assembly (i.e., integrated with the window 210). Furthermore, any combination of these embodiments of the lens 220 and the pinhole 223 may be used.

[0103] The pinhole array 222, when composed of a metallic material and mounted as a separate element, or when composed of a reflective coating 232 including a metal film 234, can also function as a Faraday shield. Specifically, the pinhole array 222 can prevent electromagnetic interference by the light emitted by the LEDs 200 when the RF system 142 is used to generate plasma within the processing chamber 101. To prevent interference, as shown in FIGS. 9 and 10, the pinhole array 222 can be grounded (i.e., connected to ground potential) when mounted on the pedestal 130. Section 3: Vacuum Clamp

[0104] FIGS. 9 and 10 show an example of the optical array 150 mounted on the pedestal 130 when using a vacuum clamp to clamp the substrate 140 to the pedestal 130. Furthermore, these figures show, together with the vacuum clamp, a purge mechanism used to keep the window 210 clean and a rotation mechanism used to rotate the substrate 140 relative to the optical array 150. FIG. 9 shows an example of the vacuum clamp. FIG. 10 shows the purge of the window 210 when the substrate 140 is lifted from and rotated on the pedestal 130. Alternatively, although not shown, any other clamping method (e.g., electrostatic clamping and mechanical clamping) may be used to clamp the substrate 140 to the pedestal 130 comprising the optical array 150.

[0105] In FIG. 9, the optical array 150 with the window 210 is disposed in an annular cavity 138 formed in the base portion 132 of the pedestal 130. The annular cavity 138 is formed by removing material from the upper surface of the base portion 132 of the pedestal 130, excluding the central region of the upper surface of the base portion 132 of the pedestal 130. The depth of the annular cavity 138 is equal to the height of the optical array 150 and the window 210. The optical array 150 and the base portion 132 of the pedestal 130 are on the same plane. Accordingly, the upper surface of the window 210 is at the same height as the upper end 139 of the base portion 132 of the pedestal 130. The substrate 140 is disposed on the upper surface of the window 210 during processing. The substrate 140 is clamped to the pedestal 130 using a vacuum clamp described later.

[0106] The stem portion 134 of the pedestal 130 includes a shaft 250. The shaft 250 extends through the centers of the stem portion 134 and the base portion 132 of the pedestal 130. The shaft 250 is composed of a T-shaped end portion (i.e., the horizontal portion forming the upper part of the T-shape) and a distal end (i.e., the vertical portion forming the lower part of the T-shape). The T-shaped end portion of the shaft 250 extends through the inner annular region 204 of the optical array 150, the opening of the window 210, and the central region of the upper surface of the base portion 132 of the pedestal 130. The upper surface of the T-shaped end portion of the shaft 250 is at the same height as the upper surface of the window 210. The bottom surface of the T-shaped end portion of the shaft 250 is at the same height as the central region of the upper surface of the base portion 132 of the pedestal 130 and is placed thereon. The diameter of the T-shaped end portion of the shaft 250 is slightly smaller than the diameters of the inner annular region 204 of the optical array 150 and the opening of the window 210.

[0107] The distal end of the shaft 250 extends through the lower end of the stem portion 134 of the pedestal 130. The distal end of the shaft 250 extends through a vacuum pump 180 attached to the lower end of the stem portion 134 of the pedestal 130. One of the actuators 170 is attached to the distal end of the shaft 250. The actuator 170 can move the shaft 250 through the vacuum pump 180, through the stem portion 134 and the base portion 132 of the pedestal 130 to raise and lower the substrate 140. In FIG. 10, when the substrate 140 is lifted, the substrate 140 is held by the T-shaped end of the shaft 250. Also, when the substrate 140 is lifted, the actuator 170 can rotate the shaft 250 to rotate the substrate 140 relative to the optical array 150.

[0108] A conduit 252 passes through the shaft 250. The conduit 252 and the shaft 250 are coaxial. The conduit 252 extends through the shaft 250 to the T-shaped end of the shaft 250. The shaft 250 includes a plurality of holes 254 that radially penetrate the T-shaped end of the shaft 250. Near the T-shaped end of the shaft 250, one end of the conduit 252 connects to the plurality of holes 254. The distal end of the conduit 252 extends from the distal end of the shaft 250. The distal end of the conduit 252 is connected to one of the gas sources 104 through a valve 152 (shown in FIG. 1B). In FIG. 3B, when the shaft 250 lifts the substrate 140, purge gas is supplied through the conduit 252. The purge gas flows through the conduit 252, exits through the holes 254, traverses the window 210 in the direction of the arrow shown to clean the window 210, and flows radially upward above the window.

[0109] The stem portion 134 of the pedestal 130 further includes a conduit 256 that passes through an electrical connection (e.g., an insulated wire or conductor) to electrical elements within the base portion 132 of the pedestal 130. The distal end of the electrical connection is connected to a controller 190 (shown in FIG. 1B). The conduit 256 penetrates and extends through the stem portion 134 of the pedestal 130. The conduit 256 extends into the base portion 132 of the pedestal 130 to the inner annular region 204 of the optical array 150. The conduits 252, 256, and the shaft 250 are coaxial. The diameter of the conduit 256 is larger than the diameter of the shaft 250.

[0110] The stem portion 134 of the pedestal 130 further includes a conduit 258. The diameter of the conduit 258 is larger than the diameter of the conduit 256 and smaller than the diameter of the stem portion 134 of the pedestal 130. The conduits 258, 252, 256, and the shaft 250 are coaxial. The first end of the conduit 258 is in fluid communication with a vacuum pump 180. The second end of the conduit 258 passes through the stem portion 134 of the pedestal 130 and extends into the base portion 132 of the pedestal 130. The second end of the conduit 258 extends into the base portion 132 of the pedestal 130 to a point below the optical array 150. At the second end, the conduit 258 connects to a first set of conduits (or passages) 260 that radially penetrate the base portion 132 of the pedestal 130 below the optical array 150. The conduits 260 extend to the OD of the base portion 132 of the pedestal 130. The conduits 260 are in fluid communication with the conduit 258.

[0111] The second set of conduits 262 passes through the base portion 132 of the pedestal 130 and penetrates perpendicularly to the first set of conduits 260. The conduit 262 extends from the conduit 260 through the optical array 150 and the window 210. The conduit 262 is in fluid communication with the conduits 260, 258. Thus, when clamping the substrate 140 to the pedestal 130, the controller 190 operates the vacuum pump 180 and opens the valve 184 (shown in FIG. 1B) to create a vacuum in the conduits 258, 260, 262. Due to the vacuum in the conduits 258, 260, 262, the substrate 140 is clamped to the pedestal 130. After the substrate is clamped to the pedestal 130, the controller 190 controls the optical array 150 as described above to heat the substrate 140 according to the process performed on the substrate 140.

[0112] In FIG. 10, when it is necessary to rotate the substrate 140 relative to the optical array 150, the controller 190 controls the vacuum pump 180 and the valve 184 to reduce the vacuum in the conduits 258, 260, 262. The vacuum in the conduits 258, 260, 262 is reduced sufficiently so that the shaft 250 can lift the substrate 140. The controller 190 operates the actuator 170 to lift and rotate the substrate 140 by the shaft 250. In some applications, the optical array 150 can be rotated relative to the substrate 140 by lifting and stationary the substrate 140 and rotating the pedestal 130.

[0113] When the substrate 140 is lifted, the controller 190 opens the valve 152 (shown in FIG. 1B) to allow the purge gas to flow through the conduit 252 and through the holes 254. The purge gas flows radially upward above the window 210 and across the window 210 through the conduit 252 and the holes 254, as indicated by the arrows in FIG. 10. The flow of the purge gas above and across the window 210 removes any material that may have been deposited on the window 210. The controller 190 controls the valves 152 and 184 (shown in FIG. 1B) so that the vacuum pump 180 continues to draw through the conduits 258, 260, 262 and through the processing chamber 101 (shown in FIG. 1B). Thus, the material removed from the window 210 is exhausted from the processing chamber 101.

[0114] Thereafter, the actuator 170 lowers the shaft 250 to place the substrate 140 back on the pedestal 130. Next, the substrate 140 is vacuum clamped as described above. The optical array 150 reheats the substrate 140 as described above. The procedure is repeated as necessary until the processing of the substrate 140 is complete.

[0115] The foregoing description is merely illustrative in nature and is not intended to limit the present disclosure, its application, or uses. The broad teachings of the present disclosure can be implemented in a variety of forms. Thus, while this disclosure includes particular examples, other modifications will be apparent upon consideration of the drawings, specification, and following claims, and the true scope of the present disclosure should not be so limited.

[0116] It should be understood that one or more steps within a method may be performed in a different order (or simultaneously) without changing the principles of the present disclosure. Further, while each embodiment has been described as having certain features, any one or more of those features described with respect to any embodiment of the present disclosure may be implemented in and / or combined with the features of any other embodiment, even if the combination is not explicitly stated. In other words, the embodiments described herein are not mutually exclusive, and substituting one or more embodiments for each other still falls within the scope of the present disclosure.

[0117] Spatial and functional relationships between elements (e.g., between modules, between circuit elements, between semiconductor layers, etc.) are described using various terms such as "connected", "engaged", "coupled", "adjacent", "next to", "on top of", "above", "below", and "disposed". When a relationship between a first element and a second element is described in the above disclosure, unless explicitly stated to be "direct", the relationship may be a direct relationship with no other intervening elements between the first element and the second element, but there may also be an indirect relationship with one or more intervening elements (spatially or functionally) between the first element and the second element. As used herein, the expression "at least one of A, B, and C" should be interpreted to mean the logical (A OR B OR C) using non-exclusive logical OR, and should not be interpreted to mean "at least one of A, at least one of B, and at least one of C".

[0118] In some embodiments, the controller is part of a system, and that system may be part of the examples described above. Such a system may include semiconductor processing equipment, such as one or more processing tools, one or more chambers, one or more processing platforms, and / or specific processing components (e.g., wafer pedestals, gas flow systems, etc.). These systems may be integrated with electronics for controlling the operation of the system before, during, and after processing of a semiconductor wafer or substrate. The electronics may sometimes be referred to as a "controller" and may control various components or sub-parts of one or more systems.

[0119] The controller may be programmed to control any of the processes disclosed herein, depending on the processing requirements and / or the type of system, such as the supply of process gases, temperature setting (e.g., heating and / or cooling), pressure setting, vacuum setting, power setting, radio frequency (RF) generator setting, RF matching circuit setting, frequency setting, flow rate setting, fluid supply setting, position and motion setting, transfer of wafers into and out of the tool, and transfer of wafers into and out of other transfer tools and / or load locks connected or coupled by interface to a particular system.

[0120] Broadly, the controller may be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receives instructions, issues instructions, controls operations, enables cleaning operations, enables endpoint measurements, etc. The integrated circuits may include chips in the form of firmware that stores program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software).

[0121] Program instructions are instructions communicated to a controller in the form of various individual settings (or program files) that may define operating parameters for executing a particular process on or for a semiconductor wafer or for a system. The operating parameters may, in some embodiments, be part of a recipe defined by a process engineer and may achieve one or more processing steps during the manufacture of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0122] The controller may, in some embodiments, be part of a computer that is integrated with, coupled to, otherwise network-connected to, or a combination of these, the system, or may be coupled to such a computer. For example, the controller may be within the “cloud,” may be all or part of a fab host computer system, thereby enabling remote access to wafer processing. The computer may enable remote access to the system, monitor the current progress of fabrication operations, inspect the history of past fabrication operations, examine trends or performance metrics from multiple fabrication operations, change the parameters of the current process, set the processing steps following the current process, or initiate a new process.

[0123] In some examples, a remote computer (e.g., a server) can provide process recipes to the system via a network, which can include a local network or the Internet. The remote computer can include a user interface that enables input of parameters and / or settings or programming. These parameters and / or settings are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data, and the data specifies parameters for each processing step performed during one or more operations. It should be understood that the parameters can be specific to the type of process being performed and the type of tool that the controller is configured to couple to or control.

[0124] Thus, as described above, the controller can be distributed, such as by comprising one or more separate controllers that are network-connected to each other and operate towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such a purpose is one or more integrated circuits on a chamber that communicate with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer), and when combined, these control the process on the chamber.

[0125] Exemplary systems can include, but are not limited to, plasma etching chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel edge etching chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etching (ALE) chambers or modules, ion implantation chambers or modules, tracking chambers or modules, and any other semiconductor processing system related to or usable in the fabrication and / or manufacture of semiconductor wafers.

[0126] As described above, depending on one or more process steps performed by a tool, the controller may communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, proximate tools, tools located throughout the factory, a main computer, another controller, or a tool used for material transfer to and from a wafer container at a tool location and / or load port within a semiconductor manufacturing factory.

Claims

1. An optical array disposed on a base configured to deposit material onto a substrate, A plurality of optical elements arranged on a printed circuit board (PCB), wherein each optical element is configured to emit light, A window made of a light-transmitting material that covers the optical element placed on the PCB, The optical array comprises an array of pinholes disposed between the optical element and the window, wherein the pinholes are aligned vertically with the optical element to direct the light emitted by the optical element through the window in order to heat the substrate.

2. The optical array according to claim 1, further, An optical array comprising a lens disposed between the optical element and the pinhole, wherein the lens is aligned with the optical element and the pinhole, and focuses the light from the optical element onto the pinhole.

3. The optical array according to claim 1, The optical element is an optical array comprising a lens for focusing the light from the optical element onto the pinhole.

4. The optical array according to claim 1, The aforementioned array of pinholes is an optical array composed of a metal or dielectric material.

5. The optical array according to claim 1, The aforementioned array of pinholes is an optical array integrated with the window in a monolithic assembly.

6. The optical array according to claim 1, An optical array in which the array of pinholes is coated with a reflective material on the side facing the window, and the reflective material does not cover the pinholes.

7. The optical array according to claim 1, The aforementioned pinhole array is an optical array in which an anti-reflective material is coated on the side facing the optical element.

8. The optical array according to claim 1, The aforementioned window is, On the side facing the optical element, an anti-reflective material is coated. An optical array in which the side facing the substrate is coated with a material that prevents the reflection of the wavelength of light emitted by the optical element and reflects infrared wavelengths.

9. The optical array according to claim 1, An optical array wherein the window is coated with an anti-reflective material on the side facing the optical element, and the window further includes a reflective material coated on the anti-reflective material, the reflective material including a metal film and the pinholes.

10. The optical array according to claim 1, The optical element is an optical array comprising light-emitting diodes.

11. The optical array according to claim 1, The optical element is an optical array comprising light-emitting diodes configured to emit light having a wavelength between 530 nm and 1000 nm.

12. The optical array according to claim 1, The optical array is circular, and the optical elements and pinholes are arranged concentrically from the inner diameter to the outer diameter of the optical array.

13. The optical array according to claim 1, further, The optical element and the pinhole are provided with a lens disposed between them. The optical array is circular, The optical elements, the pinholes, and the lenses are arranged concentrically from the inner diameter to the outer diameter of the optical array. The lens is aligned with the optical element and the pinhole, and is part of an optical array that focuses the light from the optical element into the pinhole.

14. The optical array according to claim 1, The aforementioned pinhole is a cylindrical optical array.

15. The optical array according to claim 1, The optical array wherein the pinhole is conical in shape and has a base facing the optical element.

16. The optical array according to claim 1, The PCB further comprises one or more driver circuits configured to control the power supply to the optical elements, an optical array.

17. The optical array according to claim 1, The PCB further comprises one or more driver circuits configured to control the operation of selected optical elements, wherein the optical array is further comprising the PCB.

18. The optical array according to claim 1, The optical array further comprises a PCB with a driver circuit configured to control the light emitted by the optical element, wherein the driver circuit is located on the same side of the PCB as the optical element, on the opposite side of the PCB, or on both sides of the PCB.

19. The optical array according to claim 1, further, An optical array comprising a heat sink attached to the PCB on the side opposite to the side on which the optical elements are arranged.

20. The optical array according to claim 1, The aforementioned window is an optical array sealed and mounted on the PCB.

21. It is a system, The optical array described in claim 1, The aforementioned base and Equipped with, The aforementioned base is, The stem part, The base portion fixed to the aforementioned stem portion and Equipped with, The optical array is disposed on the base portion of the pedestal, in a system.

22. The system according to claim 21, The base portion and the optical array are located on the same plane in the system.

23. The system according to claim 21, A system in which the base portion and the optical array are circular, and the outer diameter of the optical array is less than or equal to the outer diameter of the base portion.

24. The system according to claim 21, A system in which the base portion and the optical array are circular, and the outer diameter of the optical array is less than or equal to the outer diameter of the substrate.

25. The system according to claim 21, A system in which the base portion and the optical array are circular, and the outer diameter of the optical array is at least the same as the outer diameter of the substrate.

26. The system according to claim 21, The aforementioned base is, The stem portion, the base portion, and the shaft disposed through the center of the optical array, An actuator connected to the shaft and configured to move the substrate relative to the base, A system that further enhances this feature.

27. The system according to claim 21, The aforementioned base is, The stem portion, the base portion, and the shaft disposed through the center of the optical array, An actuator connected to the shaft and configured to move the substrate perpendicular to a plane in which the base portion is located, A system that further enhances this feature.

28. The system according to claim 21, The aforementioned base is, The stem portion, the base portion, and the shaft disposed through the center of the optical array, An actuator connected to the shaft and configured to rotate the substrate relative to the base portion, A system that further enhances this feature.

29. The system according to claim 21, The aforementioned base is, A shaft disposed through the stem portion, the base portion, and the center of the optical array, comprising a conduit for receiving gas and a plurality of holes that are in fluid communication with the conduit near the first end of the shaft adjacent to the optical array, An actuator, which is coupled to the second end of the shaft and configured to move the substrate perpendicular to a plane in which the base portion is located, Furthermore, As the shaft rises above the optical array, the plurality of holes supply the gas radially above the window, in a system.

30. The system according to claim 21, The aforementioned array of pinholes is connected to ground potential in the system.

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