Thickness Uniformity Improvement Kit for Thermal Epitaxial Processing

Abstract

The embodiments described in this specification relate to a susceptor kit. The susceptor kit includes a susceptor support plate including a plurality of susceptor lift pin holes and a plurality of susceptor support holes, a plurality of susceptor supports recessed in the plurality of susceptor support holes and coupled to the susceptor support plate, and a lift pin assembly. The plurality of susceptor supports receive a plurality of susceptor support pins. The support body supports a support pin link in a spaced relationship with respect to the susceptor support plate. The lift pin assembly is received in the plurality of susceptor lift pin holes. The lift pin assembly includes a lift pin cap and a susceptor lift pin including a susceptor retaining plate. A susceptor support plate stopper is receivable within the susceptor lift pin holes.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to the heat treatment of thin films on substrates such as silicon wafers. More specifically, embodiments of the present disclosure relate to a processing kit for epitaxial deposition.

Background Art

[0002] In solid-state integrated circuit manufacturing, epitaxial processing is generally carried out in an epitaxial processing chamber. A substrate disposed on a substrate support in the epitaxial processing chamber is generally heated by lamps positioned above and / or below the substrate.

[0003] However, during processing, various chamber components may create shadows on the substrate support. This shadow impedes the heat from the lamps used to heat the substrate support and the substrate, causing a non-uniform temperature distribution and, as a result, non-uniform deposition. Therefore, improved hardware for epitaxial deposition is needed.

Summary of the Invention

[0004] The present disclosure generally relates to the heat treatment of thin films on substrates such as silicon wafers. More specifically, embodiments of the present disclosure relate to a processing kit for epitaxial deposition.

[0005] In one embodiment, a susceptor kit includes a susceptor support plate, a plurality of susceptor supports, and a lift pin assembly. The susceptor support plate includes a plurality of susceptor lift pin holes and a plurality of susceptor support holes. The plurality of susceptor supports are recessed within the plurality of susceptor support holes and coupled to the susceptor support plate. Each of the plurality of susceptor supports includes two or more susceptor support pins for supporting a substrate support. The susceptor lift pin assembly is received within the plurality of susceptor lift pin holes.

[0006] In another embodiment, the susceptor kit includes a susceptor support plate, a plurality of susceptor supports, and a lift pin assembly. The susceptor support plate includes a plurality of susceptor lift pin holes and a plurality of susceptor support holes. The plurality of susceptor supports are recessed within the plurality of susceptor support holes and coupled to the susceptor support plate. Each of the plurality of susceptor supports includes two or more susceptor support pins that support a substrate support. The lift pin assembly is received within the plurality of susceptor lift pin holes.

[0007] In another embodiment, the susceptor kit includes a susceptor support plate that includes a plurality of susceptor lift pin holes and a plurality of susceptor support holes, a plurality of susceptor supports that are recessed within the plurality of susceptor support holes and coupled to the susceptor support plate, and a lift pin assembly. The plurality of susceptor supports include a support body and a support pin link. A support connector is received by a support anchor of the susceptor support plate to secure the support body to the susceptor support plate. The support pin link receives a plurality of susceptor support pins. The support body supports the support pin link in a spaced-apart relationship to the susceptor support plate. The lift pin assembly is received within the plurality of susceptor lift pin holes. The lift pin assembly includes a lift pin cap and a susceptor lift pin that includes a susceptor retaining plate. A susceptor support plate stopper is receivable within the susceptor lift pin hole.

[0008] The present disclosure, as generally described above, may be described in more detail with reference to embodiments in such a manner as to enable a person skilled in the art to understand the features enumerated above in detail, and some of which are illustrated in the accompanying drawings. However, it should be noted that the accompanying drawings illustrate only exemplary embodiments, and thus the present disclosure should not be considered to be limited in scope as it may admit other equally effective embodiments.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3A

Figure 3B

Figure 3C

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Figure 6A

Figure 6B

Figure 6C

[0010] For ease of understanding, the same reference numbers are used to designate the same elements common to the drawings, where possible. It is contemplated that the elements and features of one embodiment may be beneficially incorporated into other embodiments without further recitation.

[0011] The present disclosure generally relates to the heat treatment of thin films on substrates such as silicon wafers. More specifically, embodiments of the present disclosure relate to a susceptor kit for thermally sensitive epitaxial deposition.

[0012] FIG. 1 is a schematic cross-sectional view of an epitaxial system 100 according to an embodiment of the present disclosure. The epitaxial system 100 is utilized to grow an epitaxial film on a substrate such as substrate 102. The epitaxial system 100 creates a cross-flow of precursors across the upper surface 150 of the substrate 102.

[0013] The epitaxial system 100 includes an upper body 156, a lower body 148 disposed below the upper body 156, and a flow module 112 disposed between the upper body 156 and the lower body 148. The upper body 156, the flow module 112, and the lower body 148 form a chamber body. Disposed within the chamber body are a substrate support 106 (e.g., a susceptor), an upper window 108 (e.g., a dome), a lower window 110 (e.g., a dome), a plurality of upper lamps 141, and a plurality of lower lamps 143.

[0014] The controller 120 communicates with the epitaxial system 100 and is used to control processes such as those described herein. The controller 120 is configured to receive data or inputs as sensor readings from the epitaxial system 100. The controller 120 comprises or communicates with a system model of the epitaxial system 100. The system model includes an epitaxial deposition model. The system model is a program configured to monitor the deposition process within the epitaxial system 100 throughout the deposition process. The epitaxial system 100 is further configured to store readings and calculations in the memory 135.

[0015] The readings and calculations include previous sensor readings, as well as any other previous sensor readings within the epitaxial system 100. The readings and calculations further include stored calculated values since the sensor readings were measured by the sensor 153 within the epitaxial system 100 and passed through the system model. Thus, the controller 120 is configured to both search for the stored readings and calculations and store the readings and calculations in the memory 135 for future use. By maintaining the previous readings and calculations within the memory 135, the controller 120 can adjust the system model over time to reflect a more accurate one of the epitaxial system 100.

[0016] In the embodiments described herein, the controller 120 includes a programmable central processing unit (CPU) 155 that operates with the memory 135 and a display unit (not shown). The controller 120 monitors the deposition, gas flow, temperature, and operation of the shaft body 118 within the epitaxial system 100. A support circuit 158 is coupled to the CPU 155 to support the processor in a conventional manner. In some embodiments, the controller 120 includes a plurality of controllers 120 such that the stored readings and calculations and the system model are stored within a controller 120 separate from the controller 120 that operates the epitaxial system 100. In other embodiments, the system model and the stored readings and calculations are all stored within the controller 120.

[0017] Controller 120 is configured to control the deposition, gas flow, temperature, and operation of the shaft body 118 within the epitaxial system 100. Controller 120 is configured to adjust aspects of the epitaxial system 100 based on sensor readings, system models, and stored readings and calculations. Controller 120 includes embedded software and compensation algorithms to calibrate the deposition, gas flow, temperature, and operation of the shaft body 118 within the epitaxial system 100. Controller 120 may include machine learning algorithms and may use regression or clustering techniques. The algorithms may be unsupervised or supervised algorithms.

[0018] The substrate support 106 is disposed between the upper window 108 and the lower window 110. A plurality of upper lamps 141 are disposed between the upper window 108 and the lid 154. The lid 154 includes a plurality of sensors 153 disposed therein for measuring the temperature within the epitaxial system 100. A plurality of lower lamps 143 are disposed between the lower window 110 and the floor 152. The plurality of lower lamps 143 form the lower lamp assembly 145.

[0019] The processing volume 136 is formed between the upper window 108 and the lower window 110. The processing volume 136 has a substrate support 106 disposed therein. The substrate support 106 includes an upper surface on which the substrate 102 is disposed. The substrate support 106 is attached to a shaft body 118. The shaft body 118 is connected to a motion assembly 121. The motion assembly 121 includes one or more actuators and / or adjustment devices that effect movement and / or adjustment of the shaft body 118 and / or the substrate support 106 within the processing volume 136. The motion assembly 121 includes a rotation actuator 122 that rotates the shaft body 118 and / or the substrate support 106 about the longitudinal axis A of the epitaxial system 100. The motion assembly 121 further includes a vertical actuator 124 that moves the substrate support 106 up and down in the z-direction. The motion assembly 121 includes an inclination adjustment device 126 used to adjust the planar orientation of the substrate support 106 and a lateral adjustment device 128 used to adjust the positions of adjacent shaft bodies 118 and substrate supports 106 within the processing volume 136.

[0020] The substrate support 106 may include lift pin holes 107 disposed therein. The lift pin holes 107 are sized to accommodate lift pins 132 for lifting the substrate 102 from the substrate support 106 either before or after the deposition process is performed. The lift pins 132 may rest on lift pin stoppers 134 when the substrate support 106 is lowered from the processing position to the transfer position.

[0021] The flow module 112 includes a plurality of process gas inlets 114, a plurality of purge gas inlets 164, and one or more exhaust gas outlets 116. The plurality of process gas inlets 114 and the plurality of purge gas inlets 164 are disposed on the side opposite to one or more exhaust gas outlets 116 of the flow module 112. One or more flow guides 146 are disposed below the plurality of process gas inlets 114 and one or more exhaust gas outlets 116. The flow guide 146 is disposed above the purge gas inlet 164. The liner 163 is disposed on the inner surface of the flow module 112 to protect the flow module 112 from reaction gases used during the deposition process. The process gas inlet 114 and the purge gas inlet 164 are positioned to flow gas parallel to the upper surface 150 of the substrate 102 disposed within the processing volume 136. The process gas inlet 114 is fluidly connected to a process gas source 151. The purge gas inlet 164 is fluidly connected to a purge gas source 162. One or more exhaust gas outlets 116 are fluidly connected to an exhaust pump 157. The process gas source 151 and the purge gas source 162 may each be configured to supply one or more precursors or process gases into the processing volume 136.

[0022] FIG. 2 is a schematic cross-sectional view of susceptor kit 200 coupled to substrate support 106. Susceptor kit 200 includes susceptor support plate 202 that adheres to shaft body 118 between shaft body 118 and substrate support 106. Susceptor support plate 202 supports substrate support 106 within process volume 136 of epitaxial system 100, as shown in FIG. 1. The distance D1 from the upper surface of susceptor support plate 202 to the bottom surface of substrate support 106 is from about 20 mm to about 40 mm. Susceptor kit 200 further includes a plurality of susceptor supports 204 and lift pin assembly 205. Susceptor supports 204 are received within a plurality of susceptor support holes 208 in susceptor support plate 202. Susceptor supports 204 couple susceptor support plate 202 to substrate support 106. Lift pin assembly 205 further includes susceptor lift pin 212 that includes lift pin cap 214 and susceptor support plate stopper 216. In one embodiment, lift pin cap 214 and susceptor support plate stopper 216 have a frustoconical shape that is inverted top to bottom. Lift pin cap 214 is received within a plurality of susceptor lift pin holes 107 in substrate support 106, and susceptor support plate stopper 216 is received within a plurality of susceptor lift pin holes 206 in susceptor support plate 202. Susceptor lift pin holes 107 have a corresponding frustoconical shape that is inverted top to bottom to receive the frustoconical shape of lift pin cap 214. Susceptor support plate lift pin holes 206 have a corresponding frustoconical shape that is inverted top to bottom to receive susceptor lift pin 212. Susceptor support plate 202 has a thickness t of from about 2 mm to about 5 mm. Susceptor support plate 202 further includes a diameter d1 of from about 200 mm to about 500 mm. Diameter d1 of susceptor support plate 202 is substantially equal to diameter d2 of the substrate support. In one embodiment, susceptor support plate 202 includes a material with a high UV light transmittance (T), e.g., a material through which UV light can efficiently transmit. In one embodiment, the material has T > 80%. In one embodiment, the high UV transmittance material includes a quartz material.

[0023] Figure 3A is a schematic cross-sectional view of the susceptor kit 200 along the cut line A-A. The susceptor support 204 includes a plurality of susceptor support pins 302. The susceptor support pins 302 are positioned radially from the center of the susceptor support plate 202 (shown in FIGS. 3B and 3C) about the periphery of the susceptor support plate 202 that contacts the edge of the substrate support 106. In the illustrated embodiment, each susceptor support 204 (shown in FIG. 2) includes two susceptor support pins 302, and the susceptor support pins 302 are positioned radially at about 60° intervals. The six contact points help distribute the thermal contact with the substrate support 106 and assist in positioning (e.g., centering) the substrate support 106 within the processing volume 136. In the illustrated embodiment, the lift pin holes 107 are positioned radially at about 120° intervals such that the lift pin holes 107 are between every other susceptor support pin 302. However, other radial spacings are contemplated by the present disclosure. The lift pin holes 107 are at a radial distance R1 of from about 100 mm to about 120 mm from the center of the substrate support 106. The susceptor support pins 302 include a silicon carbide material, although other materials are contemplated.

[0024] Figure 3B is a schematic cross-sectional view of the susceptor kit 200 along the cut line B-B. The susceptor support 204 further includes a support pin link 304. The support pin link 304 receives the susceptor support pins 302 across between the two susceptor support pins 302 for each susceptor support 204, as shown in FIGS. 6A-6C. The susceptor support 204 further includes a support body 604, as shown in FIGS. 6A-6C. The support body 604 supports the support pin link 304 in a spaced-apart relationship to the susceptor support plate 202.

[0025] FIG. 3C is a schematic cross-sectional view of the susceptor support plate 202 along the cutting line C-C. The susceptor support plate 202 further includes a susceptor support hole 208 for receiving the susceptor support 204. In the illustrated embodiment, the susceptor support hole 208 and the susceptor support plate lift pin holes 210 are radially aligned and positioned radially every approximately 120°. However, other radial spacings are contemplated by the present disclosure. The susceptor support hole 208 is a radial distance R2 of from about 165 mm to about 185 mm from the center of the susceptor support plate 202. The susceptor lift pin holes 206 are a radial distance R3 of from about 100 mm to about 120 mm from the center of the susceptor support plate 202. The radial distances R1 and R3 are substantially the same, e.g., ± about 1 mm.

[0026] FIG. 4 is a schematic cross-sectional view of the lift pin assembly 205. The lift pin cap 214 is a frustum of a cone with the bottom and top reversed, including a bottom surface 411 and a top surface 413. The top surface 413 of the lift pin cap 214 is substantially flat to facilitate even contact with the substrate 102. The bottom surface 411 includes a lift pin alignment hole 415 for receiving the susceptor lift pin 212. In one embodiment, the lift pin alignment hole 415 has a tapered design, and the side wall 417 of the lift pin alignment hole 415 is tapered outwardly from the upper portion 418 to the bottom surface 411 of the lift pin alignment hole 415. The tapered design of the lift pin alignment hole 415 enables the susceptor lift pin 212 to be easily aligned with the lift pin alignment hole 415. The lift pin cap 214 further includes a flared side wall 419. The flared side wall 419 extends outwardly from the bottom surface 411 to the top surface 413 such that the diameter of the lift pin cap 214 increases from the bottom surface 411 to the top surface 413. The flared side wall 419 aligns the lift pin cap 214 with the lift pin hole 107 and prevents the lift pin cap 214 from passing through the lift pin hole 107 of the substrate support 106. In one embodiment, the lift pin cap 214 includes a material that is thermally compatible with the material of the substrate support 106. For example, the material of the lift pin cap 214 includes silicon carbide or graphite coated with silicon carbide.

[0027] The first end 420 of the susceptor lift pin 212 is received within the lift pin alignment hole 415. The second end 422 of the susceptor lift pin 212 is opposite the first end 420 of the susceptor lift pin 212. The susceptor support plate stopper 216 is configured between the first end 420 and the second end 422 of the susceptor lift pin 212. The susceptor support plate stopper 216 further includes a flare portion 424 and a stopper portion 426. The flare portion 424 is oriented toward the second end 422 of the susceptor lift pin 212, and the stopper portion 426 is oriented toward the first end 420 of the susceptor lift pin 212. The flare portion 424 extends outwardly toward the stopper portion 426 of the susceptor lift pin 212. The flare portion 424 of the susceptor support plate stopper 216 aligns the susceptor support plate stopper 216 with the plurality of susceptor lift pin holes 206. The stopper portion 426 of the susceptor support plate stopper 216 prevents the susceptor lift pin 212 from passing through the plurality of susceptor lift pin holes 206.

[0028] The second end 422 of the susceptor lift pin 212 is engaged by the lift pin stopper 134 when the susceptor support plate 202 is lowered from the processing position to the transfer position within the processing volume 136. As the susceptor support plate is continuously lowered within the processing volume, the first end 420 of the susceptor lift pin 212 is received into the lift pin alignment hole 415 and engages the upper portion 418 of the lift pin alignment hole 415. The susceptor lift pin 212 engages the substrate 102 on the upper surface 413 of the lift pin cap 214 to separate the substrate 102 from the substrate support 106. To facilitate alignment of the substrate 102 by the robot arm on the substrate support 106, the lift pin cap 214 may lift the substrate 102 from the substrate support 106 prior to the deposition process when engaged by the susceptor lift pin 212. The lift pin cap 214 may also lift the substrate 102 from the substrate support 106 after the deposition process when engaged by the susceptor lift pin 212, positioning the processed substrate 102 to be removed from the processing volume 136 by the robot and replaced with the substrate 102 to be processed within the processing volume 136. The susceptor lift pin 212 may rest on the lift pin stopper 134 when the substrate support 106 is lowered from the processing position to the transfer position. While in the processing position, the susceptor lift pin 212 is not engaged with the lift pin cap 214. The lift pin cap 214 is recessed within the lift pin hole 107 such that the lift pin cap 214 does not contact the substrate 102 while in the processing position.

[0029] In one embodiment, the susceptor lift pin 212 and the lift pin stopper 134 comprise a material having a high UV light transmittance (T), for example, a material through which UV light can efficiently transmit. In one embodiment, the material has T > 80%. In one embodiment, the high UV transmittance material comprises a quartz material.

[0030] FIG. 5 is a schematic cross-sectional view of an alternative lift pin cap 514 and an alternative susceptor lift pin 512. The lift pin cap 514 may be used in place of the lift pin cap 214, and the susceptor lift pin 512 may be used in place of the susceptor lift pin 212. The lift pin cap 514 includes a side wall 519, a top surface 513, and a bottom surface 511. The bottom surface 511 has a lift pin alignment hole 515 for receiving the susceptor lift pin 512. The lift pin alignment hole is defined by an upper portion 518 of the lift pin alignment hole 515, a side wall 517 of the lift pin alignment hole 515, and a bottom lip 527 of the lift pin alignment hole 515. The side wall 517, the upper portion 518, and the bottom lip 527 form a generally circular cavity. The susceptor lift pin 512 further includes a first end cap 528 at a first end 520 of the susceptor lift pin 512. The first end cap 528 is received in the lift pin alignment hole 515 for engaging the upper portion 518 of the lift pin cap 514. The diameter d3 of the first end cap 528 is substantially the same as the diameter d4 of the lift pin alignment hole 515, for example, ±0.1 mm. The first end cap 528 can be inserted into the lift pin alignment hole 515 when the first end cap 528 and the lift pin alignment hole 515 are aligned. If the first end cap 528 and the lift pin alignment hole 515 are not aligned, the first end cap 528 will not fit into the lift pin alignment hole 515. When the alternative susceptor lift pin 512 is in the processing position, for example, when the lift pin cap 514 is recessed within the lift pin hole 107, the susceptor lift pin is held within the lift pin cap 514 by the first end cap 528. In this embodiment, the susceptor support plate stopper 216 is not used.

[0031] The first end cap 528 of the susceptor lift pin 512 engages the substrate 102 on the upper surface 513 of the lift pin cap 514 to separate the substrate 102 from the substrate support 106. To align the substrate 102 on the substrate support 106, the susceptor lift pin 512 may lift the substrate 102 from the substrate support 106 prior to the deposition process. The susceptor lift pin 512 may also lift the substrate 102 from the substrate support 106 after the deposition process and position the processed substrate 102 to be removed from the processing volume 136 by a robot and replaced with a substrate to be processed within the processing volume 136.

[0032] In one embodiment, the susceptor lift pin 512 comprises a material having a high UV light transmittance (T), for example, a material through which UV light can efficiently transmit. In one embodiment, the material has T > 80%. In one embodiment, the high UV transmittance material comprises a quartz material. In one embodiment, the lift pin cap 514 comprises a material that is thermally compatible with the material of the substrate support 106, for example, the material of the lift pin cap 514 comprises silicon carbide or graphite coated with silicon carbide.

[0033] FIG. 6A is a schematic cross-sectional view of susceptor support 204. FIG. 6B is a schematic cross-sectional view of susceptor support 204 taken along cutting line D-D. FIG. 6C is a schematic cross-sectional view of susceptor support 204 taken along cutting line E-E. Susceptor support 204 includes susceptor support pins 302, support pin links 304, support connectors 602, and a support body 604. Support body 604 is partially recessed within susceptor support hole 208 and is fixed to susceptor support plate 202 by support connectors 602 (i.e., pins). Support connectors 602 pass through support body 604 above susceptor support hole 208. Susceptor support plate 202 further includes a plurality of support anchors 606 on the inner and outer sides of susceptor support hole 208. The inner side of susceptor support hole 208 is the side of susceptor support hole 208 closest to the center of susceptor support plate 202, and the outer side of susceptor support hole 208 is the side of susceptor support hole 208 farthest from the center of susceptor support plate 202. Support anchors 606 receive the exposed ends of support connectors 602 in a pivotal connection to fix susceptor support 204 to susceptor support plate 202. Support anchors 606 include cavities for receiving support connectors 602. Support body 604 is sized relative to susceptor support hole 208 such that susceptor support 204 can pivot within susceptor support hole 208. Susceptor support 204 pivots between approximately ±5° about axis A. The ability of susceptor support 204 to pivot allows susceptor support pins 302 to maintain six-point contact with substrate support 106. The width W1 of support body 604 (shown in FIG. 6C) is from about 10 mm to about 30 mm. The width W2 of susceptor support hole 208 is from about 12 mm to about 32 mm. The difference between width W2 and width W1 should be approximately ±2 mm.

[0034] The susceptor support body 604 extends away from the susceptor support plate 202 toward the substrate support 106. The support pin link 304 further includes a pin flange 608. The pin flange 608 extends perpendicularly from the support pin link 304 and the support body 604 toward the center of the susceptor support plate 202. The pin flange 608 further has a support pin hole 610 for receiving a susceptor support pin 302 (as shown in FIG. 6B). The distance D2 (as shown in FIG. 6B) from the upper surface of the susceptor support plate 202 to the upper part of the pin flange 608 is from about 20 mm to about 40 mm. The distance D3 (as shown in FIG. 6A) between the support body 604 and the midpoint of the support pin hole 610 is from about 10 mm to about 15 mm.

[0035] In one embodiment, the components of the susceptor support 204 and the support anchor 606 include a material with a high UV light transmittance (T), for example, a material through which UV light can efficiently penetrate. In one embodiment, the material has T > 80%. In one embodiment, the high UV transmittance material includes a quartz material.

[0036] Using a material with a high UV transmittance for the components of the susceptor kit 200 helps to eliminate the influence of the shadow of the components on the substrate support 106. More uniform heating of the substrate support 106 leads to more uniform heating of the substrate 102, enabling more uniform deposition on the substrate, that is, a thickness uniformity range of less than 1%.

[0037] In summary, the susceptor kit includes a susceptor support plate, a plurality of susceptor supports, and a lift pin assembly. The susceptor support plate includes a plurality of susceptor lift pin holes and a plurality of susceptor support holes. The plurality of susceptor supports are recessed within the plurality of susceptor support holes and coupled to the susceptor support plate. Each of the plurality of susceptor supports includes two or more susceptor support pins for supporting the substrate support. The susceptor lift pin assembly is received in the plurality of susceptor lift pin holes.

[0038] In another embodiment, the susceptor kit includes a susceptor support plate, a plurality of susceptor supports, and a lift pin assembly. The susceptor support plate includes a plurality of susceptor lift pin holes and a plurality of susceptor support holes. The plurality of susceptor supports are recessed within the plurality of susceptor support holes and coupled to the susceptor support plate. Each of the plurality of susceptor supports includes two or more susceptor support pins that support a substrate support. The lift pin assembly is received within the plurality of susceptor lift pin holes.

[0039] In another embodiment, the susceptor kit includes a susceptor support plate that includes a plurality of susceptor lift pin holes and a plurality of susceptor support holes, a plurality of susceptor supports that are recessed within the plurality of susceptor support holes and coupled to the susceptor support plate, and a lift pin assembly. The plurality of susceptor supports include a support body and a support pin link. The support connector is received by a support anchor of the susceptor support plate to fix the support body to the susceptor support plate. The support pin link receives a plurality of susceptor support pins. The support body supports the support pin link in a spaced-apart relationship with respect to the susceptor support plate. The lift pin assembly is received within the plurality of susceptor lift pin holes. The lift pin assembly includes a lift pin cap and a susceptor lift pin that includes a susceptor retaining plate. The susceptor support plate retainer is receivable within the susceptor lift pin hole.

[0040] The foregoing is directed to embodiments of the present disclosure, but other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the following claims.

Claims

1. A susceptor support plate having a plurality of susceptor lift pin holes and a plurality of susceptor support holes, and a plurality of susceptor supports recessed in the plurality of susceptor support holes and coupled to the susceptor support plate, each of the plurality of susceptor supports including two or more susceptor support pins for supporting a substrate support, and a lift pin assembly received in the plurality of susceptor lift pin holes A susceptor kit comprising.

2. The susceptor kit according to claim 1, wherein the plurality of susceptor support holes and the susceptor supports are radially spaced 120 degrees apart.

3. The susceptor kit according to claim 1, wherein a plurality of the susceptor support pins are radially spaced 60 degrees apart.

4. The susceptor kit according to claim 1, wherein the susceptor support pins contain silicon carbide.

5. The susceptor kit according to claim 1, wherein the susceptor support plate, the susceptor supports, and the lift pin assembly include a material having a UV transmittance of more than 80%.

6. The susceptor kit according to claim 5, wherein the material of the susceptor support plate, the susceptor supports, and the lift pin assembly is quartz.

7. The susceptor support further includes a support body and a support pin link, a support connector is received by a support anchor of the susceptor support plate to fix the support body to the susceptor support plate, the support pin link receives the susceptor support pin, and the support body supports the support pin link in a spaced relationship with respect to the susceptor support plate. The susceptor kit according to claim 1.

8. The susceptor kit according to claim 7, wherein the width W1 of the support body is from 10 mm to 30 mm, and the width W2 of the susceptor support hole is from 12 mm to 32 mm.

9. The susceptor kit according to claim 1, wherein the susceptor support pivots between ±5° about an axis aligned with the susceptor support hole within the susceptor support hole.

10. A susceptor support plate having a plurality of susceptor lift pin holes and a plurality of susceptor support holes, and A plurality of susceptor supports recessed in the plurality of susceptor support holes and coupled to the susceptor support plate, each of the plurality of susceptor supports including two or more susceptor support pins for supporting a substrate support. A lift pin assembly received in the plurality of susceptor lift pin holes A susceptor kit comprising. **Claim 11** The susceptor kit according to claim 10, wherein the lift pin assembly further includes a lift pin cap and a susceptor lift pin, the susceptor lift pin includes a susceptor retaining plate, the susceptor support plate retaining further includes a flare portion and a retaining portion, and the flare portion has a side wall that extends outwardly toward the retaining portion. **Claim 12** The susceptor kit according to claim 11, wherein the lift pin cap has a top surface and a bottom surface, and the bottom surface has a lift pin alignment hole. **Claim 13** The susceptor kit according to claim 11, wherein the lift pin cap is made of silicon carbide. **Claim 14** The susceptor kit according to claim 10, wherein the susceptor support plate, the susceptor support, and the susceptor lift pin include a material having a UV transmittance of more than 80%. **Claim 15** The susceptor kit according to claim 10, wherein the plurality of susceptor support holes and the susceptor supports are radially spaced 120 degrees apart, and the plurality of susceptor support pins are radially spaced 60 degrees apart. **Claim 16** A susceptor support plate comprising a plurality of susceptor lift pin holes and a plurality of susceptor support holes; A plurality of susceptor supports recessed in the plurality of susceptor support holes, coupled to the susceptor support plate, and each including a support body and a support pin link, wherein a support connector is received by a support anchor of the susceptor support plate to fix the support body to the susceptor support plate, the support pin link receives a plurality of susceptor support pins, and the support body supports the support pin link in a spaced relationship with respect to the susceptor support plate. A lift pin assembly receivable in the plurality of susceptor lift pin holes, the lift pin assembly further comprising a lift pin cap and a susceptor lift pin, the susceptor lift pin comprising a susceptor retaining plate, and a susceptor support plate stopper being receivable within the susceptor lift pin holes. A susceptor kit comprising the same. **Claim 17** The susceptor kit according to claim 16, wherein the width W1 of the support body is from 10 mm to 30 mm, and the width W2 of the susceptor support hole is from 12 mm to 32 mm. **Claim 18** The susceptor kit according to claim 16, wherein the susceptor support pivots within the susceptor support hole between ±5° about an axis aligned with the susceptor support hole. **Claim 19** The susceptor kit according to claim 16, wherein the susceptor support plate, the susceptor support, and the susceptor lift pin comprise a material having a UV transmittance of more than 80%. **Claim 20** The susceptor kit according to claim 16, wherein the plurality of susceptor support holes and the susceptor supports are radially spaced 120 degrees apart, and the plurality of susceptor support pins are radially spaced 60 degrees apart.

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