Heat Sink for 3D Electronic Module

Abstract

The present invention is a heat sink component (40) intended to thermally connect an optoelectronic sensor (10) to a rigid mount (30) made of a thermally conductive material and cooled by external cooling means, The optoelectronic sensor (10) is mounted on a printed circuit (20), and the mount has at least one fixing boss (32) and an opening (31) intended to accommodate the optoelectronic sensor (10), The heat sink component (40) is - a base (41) intended to be disposed in thermal contact with at least one fixing boss (32) of the mount, - a protrusion (42) intended to be disposed in thermal contact with the lower surface of the optoelectronic sensor (10) through a hole passing through the printed circuit (20) relates to a heat sink component (40) including.

Description

Technical Field

[0001] The present invention relates to the field of 3D optoelectronic modules for imaging, particularly spatial imaging. More specifically, the present invention relates to the thermal management of image sensors used in connection with space applications, whether scientific or industrial.

Background Art

[0002] In the space industry, it is desirable to miniaturize optoelectronic imaging modules while using high-performance optoelectronic sensors with higher resolution.

[0003] In connection with spatial imaging, it is necessary to keep the image sensor at a stable low temperature in order to ensure its proper operation. The performance of optoelectronic sensors drops sharply as the temperature rises. The dark current increases, and as a result, black becomes gray during detection. This is a problem in space applications where black is dominant in most images. These problems are amplified by the use of sensors with even higher resolution. With the same sensor technology, increasing the resolution leads to an increase in power consumption, and as a result, the sensor dissipates more heat during its operation.

[0004] Therefore, it is fundamentally important to reduce the thermal noise in the imager in order to operate under low-light conditions. "Thermal noise" means the noise generated by the thermal motion of charge carriers.

[0005] One problem that needs to be overcome in this regard is to keep the optoelectronic sensor in a 3D electronic module for space applications at a low temperature. One general objective is to ensure that the operating temperature of the optoelectronic sensor is low in order to reduce thermal noise and thus dark current. This makes it possible to improve the quality of the image.

[0006] Prior Art / Prior Art Constraints The currently adopted solution for cooling the sensor is to add a Peltier heat exchanger and a heat sink for dissipating heat. However, this type of solution is costly. In addition, implementing and carrying out this solution remains complex. This is because it is not easy to access the surface responsible for the heat exchange of the sensor in order to install such a device in a 3D electronic module. Therefore, the implementation of the heat exchanger will sacrifice the compactness of the 3D module.

[0007] European Patent No. 3340303 B1 describes a 3D electronic module including a optoelectronic sensor and a thermally conductive rigid mount in the form of a frame delimiting an opening for housing the sensor. The mount is cooled passively and functions as a heat mass. However, the area of contact between the mount and the sensor is limited to the periphery of the sensor. This increases the thermal resistance between the sensor and the mount and limits the heat exchange area.

[0008] Addressing the problem and providing solutions In order to alleviate the limitations of existing solutions regarding improving the heat dissipation of optoelectronic sensors incorporated in 3D electronic modules, the present invention proposes a heat sink component that is inexpensive, simple to implement, and adapted to the three-dimensional structure of the electronic module. The heat sink component enables a reduction in thermal resistance of 4 °C / W (from 7 °C / W to 3 °C / W) compared to the solution described in European Patent No. 3340303 B1. The heat sink component according to the present invention makes it possible to maximize the area for heat exchange between the sensor and the mount, regardless of how the sensor is held on the mount. In addition, the present invention proposes a 3D electronic module implemented such that the heat sink component according to the present invention forms a thermal circuit connecting the sensor to an interface cooled by external means. In addition, the present invention provides a method for manufacturing the 3D electronic module according to the present invention.

[0009] The solution according to the present invention makes it possible to improve the quality of images in low-light environments by reducing the thermal noise in the sensor. The reduction of thermal noise is achieved by reducing the thermal resistance between the sensor and the thermal mass of the module. The thermal resistance between the sensor and the thermal mass of the module is reduced by increasing the thermal exchange area between the sensor and the thermal mass of the module.

[0010] With this solution, the temperature of the sensor can be more effectively controlled, and thus it is possible to keep the sensor at a low temperature without losing the compactness of the 3D module.

[0011] In addition, the heat sink component according to the present invention makes it possible to reduce the manufacturing and assembly costs compared to the solutions of the prior art.

[0012] In addition, the solution according to the present invention is suitable for any optical sensor having a free surface on its connection array of the LGA (Land Grid Array), BGA (Ball Grid Array), CGA (Column Grid Array) or PGA (Pin Grid Array) type.

Prior Art Documents

Patent Documents

[0013]

Patent Document 1

Summary of the Invention

Means for Solving the Problems

[0014] One subject of the present invention is a heat sink component intended to thermally connect an optoelectronic sensor to a rigid mount made of a thermally conductive material and cooled by external cooling means. The optoelectronic sensor is mounted on a printed circuit. The mount has at least one fixing boss and an opening intended to accommodate the optoelectronic sensor. The heat sink component - A base intended to be disposed in thermal contact with at least one fixed boss of the stand - A protrusion intended to be disposed in thermal contact with the lower surface of the optoelectronic sensor through a hole passing through the printed circuit including

[0015] According to one particular aspect of the invention, the base is constituted by one or more connected arms

[0016] According to one particular aspect of the invention, the arms are in the same plane in a first plane

[0017] According to one particular aspect of the invention, the arms are connected via a common central intersection surface

[0018] According to one particular aspect of the invention, the protrusion extends from the central intersection surface

[0019] According to one particular aspect of the invention, the arms are connected via a mechanical fixture in the form of a frame or ring connecting the arms to each other

[0020] According to one particular aspect of the invention, the protrusion extends from the mechanical fixture

[0021] According to one particular aspect of the invention, the protrusion has a flat first upper surface

[0022] According to one particular aspect of the invention, each arm includes at least one end having a second upper surface intended to be adhered to the base of the associated fixed boss

[0023] According to one particular aspect of the invention, each arm includes at least one end having a shape that conforms to the shape of the associated side surface of the fixed boss

[0024] Another subject of the invention is - An optoelectronic sensor mounted on a printed circuit - A rigid mount cooled by an external cooling means, having a central opening intended to house an optoelectronic sensor and having at least one fixed boss. - A heat sink component according to the present invention A 3D electronic module including

[0025] According to one particular aspect of the invention, the optoelectronic sensor includes a housing in which a photosensitive chip having a flat active surface is housed, and on the surface opposite the housing, electrical connection pins are connected to a printed circuit through an opening in the mount.

[0026] According to one particular aspect of the invention, the height of the protrusion is selected to obtain a free space volume between the base and the printed circuit.

[0027] According to one particular aspect of the invention, the sensor is molded with an epoxy resin.

[0028] Another subject of the invention is a manufacturing method for manufacturing a 3D electronic module according to the invention, i - Fixing the optoelectronic sensor to the mount by adhering the optoelectronic sensor to the edge of the central opening using a thermally conductive adhesive. ii - Drilling the printed circuit to create holes aligned with the fixed bosses of the mount and the protrusions of the heat sink component. iii - After inserting the fixed bosses into the dedicated holes, assembling the assembly formed by the optoelectronic sensor and the mount to the printed circuit. iv - Assembling the assembly formed by the optoelectronic sensor, the mount, and the printed circuit to the heat sink component by inserting the protrusions into the dedicated holes and adhering the end of the base to the support bosses using a thermally conductive adhesive. A manufacturing method including

[0029] According to one particular aspect of the invention, the method further includes molding the optoelectronic sensor with an epoxy resin after step i) of fixing.

[0030] Other features and advantages of the present invention should become clearer by reading the following description with reference to the accompanying drawings below.

Brief Description of the Drawings

[0031]

Figure 1a

Figure 1b

Figure 1c

Figure 1d

Figure 2a

Figure 2b

Figure 2c

Figure 3a

Figure 3b

Figure 4

Modes for Carrying Out the Invention

[0032] In the remainder of this specification, the expressions "front", "rear", "above", and "below" are used with reference to the orientation of the drawings being described. Considering that each element can be arranged in other orientations, the terms related to direction are shown for illustrative purposes only and are not intended to be limiting.

[0033] Figure 1a shows a first perspective view of an electronic module 1 according to a first embodiment of the present invention. The electronic module 1 includes a optoelectronic sensor 10 mounted on a printed circuit 20, a rigid mount 30, and a heat sink component 40. Figure 1a shows the electronic module 1 from the side of the active surface of the optoelectronic sensor 10. Figure 1b shows a second perspective view of the electronic module according to the first embodiment of the present invention. Figure 1b shows the electronic module 1 from the side of the heat sink component 40.

[0034] The optoelectronic sensor 10 includes a housing 101 that houses a photosensitive chip 102. The photosensitive chip 102 has a first flat active surface (orthogonal to the axis Z) that can convert photons into electric charges. The sensor further includes electrical connection pins 103 on the opposite surface (the lower surface in this example) of the housing 101 that is orthogonal to the axis Z. The pins 103 are intended to connect the photosensitive chip to the conductive tracks of the printed circuit 20. In Figure 1b, the printed circuit 20 is shown transparently so that the distribution of the pins and the lower surface of the optoelectronic sensor 10 can be seen. The pins 103 partially occupy the lower surface of the housing 101 in order to leave a portion of the surface pin-free. In the illustrated example, this is the central surface of the lower surface of the sensor 10. The pins 103 can be of the LGA (Land Grid Array), BGA (Ball Grid Array), CGA (Column Grid Array) or PGA (Pin Grid Array) type.

[0035] The printed circuit 20 can be embodied by a PCB (Printed Circuit Board) type circuit that includes conductive tracks. The conductive tracks are connected to the pins to carry the signals coming from the optoelectronic sensor 10. Alternatively, it is also possible to stack a plurality of printed circuits under the sensor 10. The printed circuits can be interconnected by metal vias or lateral conductive tracks.

[0036] The pedestal 30 is manufactured in the form of a rigid frame where the sensor 10 is disposed and adhered through its rear surface including the pin 103. The pedestal 30 serves to mechanically stabilize the sensor 10. The pedestal includes an opening 31 in which the sensor 10 is received. The periphery of the lower surface of the sensor 10 rests on a part of the peripheral surface of the opening 31. Due to the opening 31, the pin 103 can pass through towards the printed circuit 20. The opening 31 is substantially rectangular, but does not necessarily have to be so. The sensor 10 is fixed to the pedestal 30 at the peripheral contact surface of the opening 31 by a thermally conductive adhesive. Advantageously, the sensor 10 is molded with an epoxy resin, preferably an epoxy resin filled with silica beads. Thereby, the sensor can be mechanically stabilized by the frame of the pedestal 30.

[0037] As a non-limiting example, the pedestal 30 is made of steel or aluminum.

[0038] In addition, the pedestal 30 has a plurality of fixing bosses 32 for mechanically stabilizing the pedestal 30 and thus the 3D module 10. The printed circuit 20 has holes aligned with the positions of the fixing bosses 32. The fixing bosses 32 are inserted into the associated holes when the printed circuit 20 is assembled to the pedestal 30 by soldering. The fixing bosses 32 are inserted into the holes in the printed circuit 20 so as to obtain electrical contact between the pin 103 of the sensor and the metal tracks of the printed circuit 20 through the opening 31.

[0039] Furthermore, the pedestal 30 functions as the thermal mass of the entire 3D electronic module assembly 1. More specifically, the pedestal 30 functions as a thermal interface for the sensors of the 3D electronic module. The pedestal 30 is cooled by external cooling means (not shown for simplicity). The cooling means can be realized using various active means (e.g., heat pipes) or passive means (e.g., Peltier devices) connected through a mechanical interface available in the 3D electronic module. Thus, the temperature of the pedestal is generally maintained at a low target value in relation to the present invention.

[0040] The heat sink component 40 includes a base portion 41 and a protrusion 42 extending from the base portion toward the lower surface of the sensor 10. The base portion 41 is fixed to at least one fixing boss 32 by adhesion using a thermally conductive adhesive. Thereby, it becomes possible to create at least one thermal contact point between the base portion 41 and the pedestal functioning as a thermal mass.

[0041] In addition, the protrusion 42 extends from the base portion through a hole aligned with the position of the protrusion 42 until it reaches the lower surface of the sensor 10. The protrusion is inserted into a related hole in the printed circuit 20, and its height is selected such that the protrusion abuts against the lower surface of the sensor 10. Thereby, it becomes possible to form at least one surface for thermally contacting between the heat sink component 40 and the sensor 10 to be cooled. The surface for contact between the protrusion 42 and the lower surface of the sensor 10 is placed in the region of the surface without the pin 103.

[0042] Advantageously, the protrusion 42 has a flat upper surface. It is possible to fix the upper surface of the protrusion 42 to the lower surface of the sensor 10 using a thermally conductive adhesive. Thereby, it becomes possible to improve the mechanical robustness of the structure of the 3D electronic module.

[0043] As a result, a heat removal circuit for removing heat from the sensor 10 to the pedestal 30 functioning as a thermal mass is formed. By introducing the heat sink component 40, it becomes possible to increase the area for heat exchange between the pedestal 30 and the sensor 10. Therefore, according to the present invention, it is possible to reduce the thermal resistance between the pedestal and the sensor without increasing the size of the 3D electronic module as compared with a structure having no such exhaust heat component.

[0044] Advantageously, the base 41 is made of a plurality of connected arms, more particularly of arms 412 and 411 that lie in the same plane and cross each other at their center. The first arm 411 connects the first fixing boss to the fixing boss diagonally opposite it. The second arm 412 connects the second fixing boss to the fixing boss diagonally opposite it. The second fixing boss is adjacent to the first fixing boss. Each arm has, at one of its ends, a plane that is supported on the lower surface of the associated fixing boss. The end of each arm is fixed to the associated fixing boss by a thermally conductive adhesive. By using arms, it is possible to lighten the weight of the heat sink component 40 without reducing the mechanical robustness of the component 40. The length of each of the arms 411 and 412 is greater than or equal to the length of the diagonal of the frame of the rigid gantry 30.

[0045] The two arms 412 and 411 are connected via a central intersection surface S0 common to the two arms. The protrusion 42 extends from said intersection surface S0 towards the sensor 10 attached to the gantry.

[0046] FIG. 1c shows a cross-sectional view of an electronic module according to a first embodiment to understand the heat removal path. The interface between the protrusion 42 and the lower surface of the sensor 10 functions as a heat exchange surface that receives a part of the heat generated by the sensor during operation. The amount of heat recovered at the interface I0 is transmitted by heat conduction through the protrusion 42 and the arms 411 and 412 of the base 41. The heat path formed by the heat sink component 40 guides the heat towards the interfaces I1 and I2 between each arm of the base 41 and the associated fixing boss 31 of the gantry 30. Note that the gantry is cooled by external cooling means. This makes it possible to avoid overheating during operation of the sensor 10 by removing the heat generated by the Joule heating effect. Thus, this makes it possible to keep the sensor 10 at the target temperature and minimize the thermal noise in said sensor.

[0047] In the first embodiment, the base 41 of the heat sink component 40 will be supported on the lower surface of the boss 32. Thereby, while minimizing the mechanical stress applied by the protrusion 42 to the sensor 10, it becomes possible to improve the mechanical robustness of the 3D electronic module.

[0048] The length of the protrusion 42 is selected so as to contact the lower surface of the sensor 10 through the printed circuit 20 and the opening 31. Advantageously, it is possible to design the length of the protrusion 42 so as to obtain a free space volume V0 between the base 41 and the printed circuit 20. The free space V0 can be used to accommodate additional electronic components in order to obtain a more compact 3D electronic module.

[0049] FIG. 1d shows a perspective view of only the heat sink component 40 according to the first embodiment of the present invention. As a non-limiting example, the protrusion 42 has a parallelepiped shape with a flat upper surface. The flat upper surface functions as a surface for heat exchange with the sensor. Each of the arms 411 and 412 has a flat shape in order to improve the stability of the 3D electronic module after assembly. Due to the ends of the arms being flat, it becomes possible to achieve a neat assembly in which the arms 411 and 412 are placed on the fixing boss 32, and at the same time, it becomes possible to maximize the area available for heat exchange between the gantry 30 and the heat sink component 40.

[0050] The heat sink component 40 is made of a heat conductive material such as metal (aluminum, steel, etc.), light metal alloy, or heat conductive polymer or graphene.

[0051] FIG. 2a shows a perspective view of the electronic module 1 according to the second embodiment of the present invention. FIG. 2b shows a cross-sectional view of the electronic module according to the second embodiment of the present invention. FIG. 2c shows a perspective view of the heat sink component according to the second embodiment of the present invention.

[0052] The second embodiment of the present invention re-uses the same features as the first embodiment, except for the shape 41 at the ends of the arms 411 and 412 of the base 41. Each end of the arms 411, 412 forming the base 41 of the heat sink component 40 has a shape that conforms to the shape of the relevant side surface of the fixing boss. As a non-limiting example, when the shape of the fixing boss is cylindrical, the shape of each end of the arm is an arc of a circle, as shown in Figure 2c. The heat sink component is assembled to the gantry as follows. As shown in Figure 2a, the arcuate ends of the arms embrace the side surface of the relevant cylindrical fixing boss. Thereby, a sliding connection guided by the fixing boss 32 is formed. The heat sink component is inserted into the structure of the gantry until the upper part of the protrusion 42 and the lower surface of the sensor 10 are in contact with each other. A thermally conductive adhesive is applied to the upper surface of the protrusion 42 in order to mechanically fix the heat sink component 40 to the connected assembly formed by the sensor 10, the printed circuit 20 and the gantry 30.

[0053] The lengths of the arms 411 and 412 are equal to the length of the diagonal of the frame of the gantry so that the base 41 can be inserted as a slider guided by the fixing boss 32.

[0054] The advantage of the second embodiment over the first embodiment is that, structurally, the heat sink component is centrally located with respect to the frame of the gantry, which facilitates assembly.

[0055] Figure 3a shows a perspective view of the heat sink component 40 according to the third embodiment of the present invention. According to this embodiment, the arms 411 and 412 are also connected via a mechanical fixture 43 in the form of a frame or ring that connects the arms 411 and 412 to each other. This makes it possible to improve the mechanical robustness of the heat sink component. A partial region of the lower surface of the sensor 10 (the partial region is aligned with the mechanical fixture 43) can be made without connection pins. In that case, it is conceivable to create one or more protrusions extending from the mechanical fixture 43 towards the partial region. Therefore, the surface area for heat exchange increases compared to each of the previous embodiments.

[0056] Figure 3b shows a perspective view of a heat sink component according to a fourth embodiment of the present invention. In the fourth embodiment, the base is a plane including holes 420, 421, 422, 423 to lighten the weight of the component. Additionally, according to this embodiment, access can be made to components attached to the free space volume V0 between the base 41 and the printed circuit 20. Additionally, due to these holes, the volume V0 can incorporate components with a height greater than that of protrusions extending beyond the base 41.

[0057] Therefore, the advantages over the previous embodiments of the third and fourth embodiments are increased mechanical robustness and reduced thermal resistance.

[0058] More generally, the shape of the base 41 is not limited to a multiple-arm structure. It is conceivable that the shape of the base is adapted according to the shape of the frame of the gantry (rectangular, circular, etc.). As an example, it is conceivable to manufacture a planar ring (or frame) connecting the base 41 in the form of a solid plane parallel to the lower surface of the sensor or the support surface of the gantry boss.

[0059] Figure 4 shows a flowchart of the steps of a manufacturing method P1 for manufacturing an electronic module 1 according to the present invention.

[0060] The first step i) is a step of fixing the optoelectronic sensor 10 to the gantry 30 by adhering the optoelectronic sensor 10 to the edge of the central opening 31 using a thermally conductive adhesive. The sensor 10 is disposed in the opening 31 of the frame of the gantry 30. The periphery of the lower surface of the sensor 10 rests on a part of the peripheral surface of the opening 31. The sensor 10 is disposed centrally with respect to the opening 31. Thereby, the sensor 10 and the gantry 30 are mechanically assembled.

[0061] The second step ii) is a step of perforating the printed circuit 20 to create holes aligned with at least one protrusion 42 of the fixing boss 32 of the gantry and the heat sink component 40.

[0062] Alternatively, it is also conceivable to use a printed circuit 20 that has already been perforated by the manufacturer.

[0063] The third step iii) is to assemble the assembly formed by the sensor 10 and the mount 30 to the printed circuit 20 by inserting the fixing boss 32 into the dedicated holes. The mount 30 is inserted into the printed circuit 20 through the holes associated with the bosses until the pins 103 of the sensor contact the metal tracks of the printed circuit 20.

[0064] Next, the printed circuit 20 is assembled to the sensor 10 by soldering the pins to the metal tracks of the printed circuit.

[0065] The fourth step iv) is to assemble the assembly formed by the optoelectronic sensor 10, the mount 30, and the printed circuit 20 to the heat sink component 40. This step is performed by inserting the protrusion 42 into the dedicated holes through the printed circuit 20 until the upper part of the protrusion 42 abuts against the lower surface of the sensor 10. The end of the base 41 is assembled to the fixing boss 32 using a thermally conductive adhesive. The thermally conductive adhesive may be applied to the upper surface of the protrusion 42 that is in contact with the lower surface of the sensor 10.

[0066] Optionally, method P1 includes, after the first step i), molding the optoelectronic sensor 10 with an epoxy resin in order to strengthen the mechanical connection between the sensor and the mount.

[0067] Optionally, method P1 includes molding the assembly formed by the sensor, the mount, the printed circuit, and the heat sink component with resin. By doing so, the entire assembled structure is protected.

Claims

1. A heat sink component (40) intended to thermally connect an optoelectronic sensor (10) to a rigid mount (30) made of a thermally conductive material and cooled by external cooling means, wherein the optoelectronic sensor (10) is mounted on a printed circuit (20), and the mount has at least one fixing boss (32) and an opening (31) intended to accommodate the optoelectronic sensor (10), the heat sink component (40) comprising: - a base (41) intended to be disposed in thermal contact with at least one fixing boss (32) of the mount, - a protrusion (42) intended to be disposed in thermal contact with the lower surface of the optoelectronic sensor (10) through a hole passing through the printed circuit (20). Heat sink component (40).

2. The heat sink component (40) according to claim 1, wherein the base (41) is composed of one or more connected arms (411, 412).

3. The heat sink component (40) according to claim 2, wherein the arms (411, 412) are in the same plane in a first plane (P1).

4. The heat sink component (40) according to claim 3, wherein the arms (411, 412) are connected via a common central intersection surface (S0).

5. The heat sink component (40) according to claim 4, wherein the protrusion (42) extends from the central intersection surface.

6. The heat sink component (40) according to any one of claims 2 to 5, wherein the arms (411, 412) are connected via a mechanical fixture (43) in the form of a frame or ring connecting the arms (411, 412) to each other.

7. The heat sink component (40) according to claim 6, wherein the protrusion (42) extends from the mechanical fixture (43).

8. The heat sink component (40) according to any one of claims 1 to 7, wherein the protrusion (42) has a flat first upper surface.

9. The heat sink component (40) according to any one of claims 2 to 8, wherein each arm (411, 412) includes at least one end having a second upper surface intended to be adhered to the base of the associated fixing boss.

10. The heat sink component (40) according to any one of claims 2 to 8, wherein each arm (411, 412) includes at least one end having a shape conforming to the shape of the associated side surface of the fixing boss.

11. - An optoelectronic sensor (10) mounted on a printed circuit (20), - A rigid mount (30) cooled by external cooling means, having a central opening (31) intended to house the optoelectronic sensor and having at least one fixing boss (32), - A heat sink component (40) according to any one of claims 1 to 10 comprising a 3D electronic module (1).

12. The optoelectronic sensor (10) includes a housing (101) containing a photosensitive chip (102) having a flat active surface. On the surface opposite to the housing (101), electrical connection pins (103) are connected to the printed circuit (20) through the opening (31). The 3D electronic module (1) according to claim 11.

13. The height of the protrusion is selected to obtain a free space volume (V0) between the base (41) and the printed circuit (20). The 3D electronic module (1) according to claim 11 or 12.

14. The sensor (10) is molded with an epoxy resin. The 3D electronic module (1) according to claim 11 or 13.

15. A manufacturing method (P1) for manufacturing the 3D electronic module (1) according to any one of claims 11 to 14, i - Fixing the optoelectronic sensor (10) to the mount (30) by adhering the optoelectronic sensor (10) to the edge of the central opening (31) using a thermally conductive adhesive, ii - Drilling the printed circuit (20) to create holes aligned with the fixing boss (32) of the mount and the protrusion of the heat sink component, iii - After inserting the fixing boss (32) into the dedicated hole, assembling the assembly formed by the optoelectronic sensor (10) and the mount (30) to the printed circuit (20), iv - Inserting the protrusion (32) into the dedicated hole and adhering the end of the base (41) to the support boss (32) using a thermally conductive adhesive to assemble the assembly formed by the optoelectronic sensor (10), the mount (30), and the printed circuit (20) to the heat sink component comprising a manufacturing method (P1).

16. For creating the 3D electronic module according to claim 14, and further including, after the step i) of fixing, a step of molding the optoelectronic sensor (10) with an epoxy resin, the manufacturing method (P1) according to claim 15.

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