Stacked electronic device and method of manufacturing such a device

Abstract

A first layer (2) of a first thermoplastic polymer material, the first layer (2) comprising a through cavity (8); an electronic module (7) at least partially inserted into the through cavity (8) of the first layer (2); and an adhesive second layer (3) of a second material having better adhesion than the first material, the adhesive second layer (3) being at least partially in contact with the first layer (2) and the electronic module (7), and the first layer (2) being at least partially in contact with the electronic module (7), a laminated electronic device.

Description

Technical Field

[0001] The present invention relates to a laminated electronic device, particularly a laminated electronic device obtained by pressing.

Background Art

[0002] Today, ID cards such as credit cards, identity cards, driver's license cards, advertising cards, ski package cards, and point cards for receiving discount privileges are manufactured using laminated electronic devices. Such devices include electronic modules integrated within stacks of layers of materials. Generally, the materials used are thermoplastic polymers, which are said to deform and creep under the action of pressing, more specifically hot pressing, so-called lamination.

[0003] Generally, an electronic module can include some of the information to be protected, such as identification information, and is assembled with layers of materials to obtain a laminated electronic device. Next, the laminated electronic device is hot pressed so that the layers of materials are fused, and an integrated card body, a so-called final product or functional laminate, in which the electronic module and the information to be protected are integrated, is obtained. The final product can maintain the integrity between the electronic module and various information written in the material layer, prevent its decomposition, and make it very difficult to forge.

[0004] However, when an electronic module is integrated into a stack of material layers, stress occurs between the module and the material layer, often creating vulnerable areas in the material that can serve as the starting point for material rupture. These stresses can have a destructive effect on the card, and when the card is subjected to mechanical stresses such as daily wear, the tension is relieved in the form of cracks, more specifically microcracks, in the material layer surrounding the module. Such microcracks lead to premature deterioration of the card. Also, cracks can be accelerated by mechanical stresses such as bending and torsion that occur naturally over the lifespan of the card.

[0005] For example, reference may be made to U.S. Patent Application Publication No. 2015 / 0298389, which discloses a method for protecting an electrical component within a support layer of a functional laminate, the method comprising providing a first hole, a second hole, and an opening connecting the first hole and the second hole in the support layer; disposing an electrical component within the first hole; disposing plastic material pellets within the second hole; and flowing the pellet material from the second hole through the opening towards the first hole while bypassing and surrounding the electrical component. However, such a method is complex and requires an operation to seal the first hole in order to obtain a functional laminate having a smooth appearance that is uniform with other cards.

[0006] Reference may be made to European Patent Application Publication No. 3005244, which discloses an intermediate electronic device comprising a support provided with a cavity, an electronic module, a space at the interface between the module and the support, and a flexible or elastic material disposed within the device so as to at least partially fill or cover the space between the module and the support. However, there is a possibility that a gap remains around the entire periphery of the electronic module between the module and the support, and the electronic module is not sufficiently held within the device.

[0007] Reference may also be made to U.S. Patent Application Publication No. 2012 / 0201994, which discloses a laminated device comprising a thermoplastic film as a substrate layer, an opening in the substrate layer, a functional component disposed within the opening, an additional film on the substrate layer, and a flexible, elastic, and heat-resistant coating material surrounding the functional component and having a coefficient of thermal expansion equal to or greater than that of the substrate layer. However, it is necessary to use a large amount of a coating material having a specific coefficient of thermal expansion, and the manufacturing method becomes very expensive. SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] Accordingly, one object is to provide means for restricting the occurrence of cracks in a laminated electronic device, particularly at the level of electronic modules integrated within such a device. Another object is to provide means for restricting the occurrence of microcracks within the device while sufficiently restricting the movement of the electronic modules within the device. Another object is to provide a laminated electronic device that is easy to manufacture while being able to reduce manufacturing costs.

Means for Solving the Problems

[0009] According to one aspect: - a first layer of a first thermoplastic polymer material, the first layer having a through cavity, - an electronic module at least partially inserted into the through cavity of the first layer, and - an adhesive second layer of a second material having a higher adhesive force than the first material, the adhesive second layer being at least partially in contact with the first layer and the electronic module A laminated electronic device is provided that includes.

[0010] The first layer is at least partially in contact with the electronic module.

[0011] Accordingly, by providing a device in which the first layer is at least partially in contact with the electronic module, good mechanical strength of the module is promoted. The adhesive second layer can restrict the movement of the electronic module toward the first layer during the pressing step, i.e., the so-called lamination step, at a temperature that allows creep of the first material. Accordingly, the generation of stress exerted on the first layer by the electronic module in accordance with the moving direction of the electronic module is restricted. The generation of stress following a specific direction, which may promote the occurrence of cracks within the first layer, is avoided. Further during pressing, the first layer creeps toward the electronic module held in place by the adhesive second layer, and when the first layer is at least partially in contact with the electronic module, the stress exerted on the electronic module by the first layer is uniformly dispersed around the electronic module.

[0012] According to another aspect, a method of manufacturing a stacked electronic device is provided, the method comprising an assembly operation for obtaining a stacked electronic device, the assembly operation comprising: - providing a first layer of a first thermoplastic polymer material, the first layer comprising a through cavity; - at least partially inserting an electronic module into the through cavity of the first layer such that the electronic module is positioned away from the first layer; - providing an adhesive second layer of a second material having a higher adhesive force than the first material; and - bringing the adhesive second layer into at least partial contact with the first layer and the electronic module comprising.

[0013] The method comprises, after the assembly operation, pressing the stacked electronic device at a temperature that enables at least the first material to creep, whereby the first layer creeps towards the electronic module and comes into at least partial contact with the electronic module.

Brief Description of the Drawings

[0014] The objects, targets, features and advantages of the present invention will become more clearly apparent from the following detailed description of the embodiments and implementations shown in the accompanying drawings:

[0015]

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DETAILED DESCRIPTION OF THE INVENTION

[0016] The drawings are given by way of example and are not intended to limit the present invention. They are schematic representations of the principles intended to facilitate understanding of the present invention and are not necessarily plotted to the scale of actual use.

[0017] Before beginning a detailed examination of the embodiments and implementations of the present invention, optional features that may be used in combination or alternatively are shown below. - The electronic module has a front surface and a back surface, the first layer has a front surface and a back surface, and the adhesive second layer has a front surface that at least partially contacts the back surface of the electronic module and the back surface of the first layer. By arranging the adhesive layer so as to at least partially contact the back surface of the electronic module, the amount of adhesive layer material used is limited. - The second material is strictly harder than the first material. The hardness can limit the deformation (or creep) of the adhesive second layer during pressing, and can avoid the adhesive second layer moving the electronic module towards the first layer according to the moving direction. - The electronic module includes a connection area and a logic circuit electrically coupled to the connection area. The device includes an electrical circuit including an electric wire having a first portion electrically coupled to the connection area and a second portion at least partially in contact with the first layer. The device includes a third layer of a third thermoplastic polymer material, the third layer including a through cavity, whereby the electronic module is at least partially inserted into the through cavity of the third layer, and the third layer is at least partially in contact with the first layer and the first and second portions of the electric wire. Thus, a communication electronic module, such as an RFID (or Radio Frequency Identification) tag, can be provided. - The device includes a fourth layer of a fourth thermoplastic polymer material, the fourth layer including a cavity, whereby the electronic module is at least partially inserted into the cavity of the fourth layer, and the fourth layer is at least partially in contact with the third layer and the electronic module. The thickness of the third layer is greater than or equal to the sum of the thicknesses of the connection area and the first portion, and the thickness is measured along an axis passing through the first, second, and third layers. Thus, the stress applied to the first portion of the electric wire is limited by the fourth layer during pressing. - The electronic module includes a base having a first surface forming the back surface of the electronic module and a second surface opposite the first surface. The connection area is in contact with the second surface, and the thickness of the first layer is greater than or equal to the thickness of the base, and the thickness is measured along an axis passing through the first, second, and third layers. - The thickness of the fourth layer is greater than or equal to the difference between the thickness of the electronic module and the sum of the thicknesses of the first and third layers, and the thickness is measured along an axis passing through the first, second, third, and fourth layers. Thus, it is guaranteed that the fourth layer is flush with or covers the front surface of the electronic module. - The first, third, and fourth materials are based on the same thermoplastic polymer. - The device comprises a support layer of a fifth thermoplastic polymer material, the support layer comprising additional cavities, an adhesive second layer being at least partially inserted into the additional cavities, and the support layer being in at least partial contact with the first layer. - The thickness of the second layer is less than or equal to the thickness of the support layer, and the thickness of the second layer is measured along an axis passing through the first, second and third layers. - The electronic module has a front face and a back face, the first layer has a front face and a back face, and the adhesive second layer has a back face that is in at least partial contact with the front face of the electronic module and the front face of the first layer. - The electronic module comprises a connection region and a logic circuit electrically coupled to the connection region, and the device comprises a first antenna electrically coupled to the connection region and a second antenna that is in at least partial contact with the first layer and is inductively coupled to at least the first antenna. - The second antenna comprises a first portion that is spirally arranged around the first antenna and is inductively coupled to the first antenna, and a second portion that is spirally arranged around the first portion and is inductively coupled to an electronic device located away from the device. - The device comprises a third layer of a third thermoplastic polymer material, the third layer being in at least partial contact with the first layer, the second layer, and the second antenna. - The device comprises an additional layer of an additional thermoplastic polymer material, the additional layer being in at least partial contact with the first layer and the electronic module. - The additional material is strictly harder than the first material. - The device comprises a cover layer of a cover thermoplastic polymer material, the cover layer being in at least partial contact with the first layer and the additional layer. - The device comprises an additional cover layer of an additional thermoplastic polymer material, the additional cover layer covering the third layer. - The electronic module has a front face and a back face, the first layer has a front face and a back face, the adhesive second layer has a front face, and the assembly operation comprises the step of bringing the adhesive second layer into at least partial contact with the back face of the electronic module and the back face of the first layer. - The electronic module includes a connection area and a logic circuit electrically coupled to the connection area. The assembly operation includes providing an electrical circuit including an electric wire having a first portion electrically coupled to the connection area and a second portion at least partially contacting the first layer, providing a third layer of a third thermoplastic polymer material, the third layer including a through cavity for at least partially inserting the electronic module into the through cavity, contacting the third layer at least partially with the first layer and the second portion, whereby the first portion is disposed at a position away from the third layer, and the pressing operation includes creeping the third layer toward the first portion and at least partially contacting the first portion. - The assembly operation includes providing a fourth layer of a fourth thermoplastic polymer material, the fourth layer including a cavity for at least partially inserting the electronic module into the cavity, and contacting the fourth layer at least partially with the third layer. The thickness of the third layer is greater than or equal to the sum of the thicknesses of the connection area and the first portion, the thickness being measured along an axis passing through the first, second, and third layers. The fourth layer is formed to cover the first portion of the electric wire, and the pressing operation includes creeping the fourth layer toward the electronic module and at least partially contacting the electronic module. - The assembly operation includes providing a support layer of a fifth thermoplastic polymer material, the support layer covering the back surface of the adhesive second layer and at least partially covering the back surface of the first layer. - The adhesive second layer has a back surface, and the assembly operation includes contacting the adhesive second layer at least partially with the front surface of the electronic module and the front surface of the first layer. - The assembly operation includes providing a first antenna electrically coupled to the connection area and a second antenna at least partially contacting the first layer, whereby the second antenna is inductively coupled to at least the first antenna.

[0018] A material, film, or layer “based on” Material A should be understood to be a material, film, or layer that consists only of this Material A, or that consists of this Material A and, in some cases, other materials.

[0019] Figures 1 and 13 show a laminated electronic device 1, particularly a functional device after the pressing process has been carried out. A “functional device” should be understood to be a device 1 that can be used immediately, and device 1 is preferably an ID card such as a credit card, an identity card, a driver's license card, an advertising card, a ski package card, or a point card for receiving discounts. Device 1 is in a so-called laminated form because it comprises a stack of a plurality of layers 2 - 6 and 203 - 205. Device 1 comprises at least one electronic module 7 inserted within layers 2 - 6 and 203 - 205.

[0020] Generally, device 1 comprises at least one first layer 2 of a first thermoplastic polymer material, and the first layer 2 comprises a through cavity 8. The first layer 2 is intended to form a support for the electronic module 7. The thermoplastic polymer material is a material that can creep under the influence of pressing, particularly pressing at a specific temperature. For example, the thermoplastic polymer material can be based on polycarbonate. In this case, the specific temperature used during pressing can be between 165 °C and 190 °C. Furthermore, the electronic module 7 is at least partially inserted within the through cavity 8 of the first layer 2. In particular, due to the creeping of layers 2, 4 - 6 and 203 - 205, during the manufacture of device 1, the gap between the electronic module 7 and the different layers 2, 4 - 6 and 203 - 205, so-called support layers, can be filled.

[0021] More specifically, the device 1 comprises an adhesive second layer 3 of a second material having a higher adhesion than the first material, preferably a strictly higher adhesion than the first material. The adhesive second layer 3 is at least partially in contact with the first layer 2 and the electronic module 7. The adhesive second layer 3 is configured to keep the electronic module 7 stationary during the pressing process. In fact, due to pressing, layers 2, 4-6 and 203-205 may creep, and the module 7 may move, forming a fragile area. The second layer 3 may creep slightly during the pressing process, but the material of the second layer 3 is selected such that the second layer 3 creeps less than the other layers 2, 4-6 and 203-205 of the device 1. By arranging the adhesive second layer 3 in contact with both the module 7 and the first layer 2, the first layer 2 can creep towards the electronic module 7 during pressing while keeping the electronic module 7 fixed. In this way, a device 1 is obtained in which the first layer 2 is at least partially in contact with the electronic module 7. This makes it easier to hold the electronic module 7 in place within the device 1.

[0022] For example, the second material is based on polyamide. Further, the second material may have a bonding force of 14 N / mm 2 or more. The "bonding force" should be understood as the force that needs to be exerted on the second material to separate the second material from the support to which it is bonded. In other words, the required force corresponds to the shear force.

[0023] Generally, device 1 comprises a plurality of layers 2-6 and 203-205 arranged one on top of the other along a main axis X. Further, the electronic module 7 has a front face 10 and a back face 11, the first layer 2 has a front face 12 and a back face 13, and the adhesive second layer 3 has a front face 14 and a back face 15. More specifically, the front face 14 of the adhesive second layer 3 is at least partially in contact with the back face 11 of the electronic module 7 and the back face 13 of the first layer 2. Preferably, the surface of the front face 14 of the adhesive second layer 3 is strictly larger than the surface of the back face 11 of the electronic module 7. In other words, the adhesive second layer 3 covers the back face 11 of the electronic module 7. When the device 1 includes the first and second layers 2, 3, the main axis X passes through the second layer 3 and the first layer 2 in that order. When the device 1 includes a plurality of layers 2-6, the main axis X passes through the second layer 3 and the first layer 2, the third layer 4, and the fourth layer 5 in that order. In other words, the main axis X is perpendicular to the plane in which the faces 12-15 of the first layer 2 and the second layer 3 generally extend. More specifically, the main axis X is perpendicular to the plane in which the faces of the layers 2-6 of the device 1 generally extend.

[0024] Advantageously, the second material of the adhesive second layer 3 has a strictly higher hardness than the first material of the first layer 2, in particular in order to keep the electronic module 7 immobile during the pressing of the device 1. Further, due to the hardness of the material of the second layer 3, its creep during pressing is limited, and thus it is easier to hold the electronic module 7 in place. For example, a second layer of polyamide with a hardness of 80-100 on the Shore D scale can be made. The Shore D unit is a scale for measuring the hardness of a material, i.e., for measuring the penetration resistance of a material. The Shore D scale is created using a device that can apply a penetrator to the material and measure the depth of its indentation. Further, it is also possible to make the first layer 2 of polycarbonate with a hardness of 60-78 on the Shore D scale.

[0025] According to another advantage, the electronic module 7 comprises a connection area 20 and a logic circuit 21 electrically coupled to the connection area 20 via a conductive connection 22. Further, the device 1 comprises an electrical circuit 23 including an electric wire 24 having a first part 25 electrically coupled to the connection area 20 and a second part 26 at least partially in contact with the first partial layer 2. In particular, the first part 25 is directly connected to the connection area 20. The second part 26 is arranged in contact with the first layer 2, and, for example, as shown in FIGS. 1, 4 to 11, the second part 26 penetrates the first layer 2 partially. Further, the device 1 comprises a third layer 4 of a third thermoplastic polymer material for integrating the electrical circuit 23. The third layer 4 includes a front face 27 and a back face 28. The third layer 4 further comprises a through cavity 9, whereby the electronic module 7 is at least partially inserted into the through cavity 9 of the third layer 4. In other words, the through cavity 9 of the third layer 4 faces the through cavity 8 of the first layer 2, i.e., is arranged on the opposite side thereof. The third layer 4 is at least partially in contact with the first layer 2 and the first and second parts 25, 26 of the electric wire 24. The electrical circuit 24 can be constituted by an antenna, and thus, a device 1 comprising a communication electronic module 7, for example an RFID tag, is provided.

[0026] Furthermore, the thickness E3 of the second layer 3 can be less than or equal to the thickness E2 of the first layer 2. The thicknesses E2, E3 of the first layer 2 and the second layer 3 are measured along an axis passing through the first, second and third layers 2 to 4, specifically the main axis X. Preferably, the thickness E3 of the second layer 3 is strictly smaller than the thickness of the first layer 2, and thus, it is possible to reduce the amount of the second material used as compared to the amount of the first material.

[0027] According to another advantage, the electronic module 7 comprises a base 30 having a first face forming the back 14 of the electronic module 7 and a second face 31 opposite the first face. The electronic module 7 may comprise a package 39 in which the logic circuit 21 is integrated. The package 39 projects from the second face 31 of the electronic module 7. The connection area 20 is in contact with the second face 31. Preferably, the thickness E2 of the first layer 2 is greater than or equal to the thickness Ee of the base 30, and the thicknesses E2, Ee are measured along an axis passing through the first, second, and third layers 2-4, specifically along the main axis X, as shown in FIG. 2.

[0028] Furthermore, the device 1 may comprise a fourth layer 5 of a fourth thermoplastic polymer material, the fourth layer 5 having a front face 60 and a back face 61. The fourth layer 5 has a front face 60 and a back face 61 with a discontinuous surface. In other words, the fourth layer 5 comprises a cavity 62, whereby the electronic module 7 is at least partially inserted into the cavity 62 of the fourth layer 5. The cavity 62 of the fourth layer 5 may be through or closed. Furthermore, the fourth layer 5 is at least partially in contact with the third layer 4 and the electronic module 7. The thickness E5 of the fourth layer 5 is greater than or equal to the difference between the thickness of the electronic module 7 and the sum of the thickness of the first layer E2 and the thickness of the third layer E4, and the thickness is measured along the main axis X. This means that E5 = Em - (E2 + E4), where Em corresponds to the thickness of the electronic module 7 measured along the main axis X. As shown in FIGS. 1, 6, 7, and 9-11, the front face 60 of the fourth layer 5 is flush with the front face 10 of the electronic module 7. The thickness E5 of the fourth layer 5 is measured along an axis passing through the first, second, third, and fourth layers 2-5, specifically along the main axis X.

[0029] Furthermore, the thickness E4 of the third layer 4 is greater than or equal to the sum of the thicknesses of the connection area 20 and the first portion 25 of the electric wire 24, and the thickness is measured along the main axis X. Thus, when the fourth layer 5 creeps during pressing, the stress exerted on the first portion 25 by the fourth layer 5 is limited.

[0030] In particular, the front face 27 of the third layer 4 is at least partially in contact with the rear face 61 of the fourth layer 5.

[0031] The first, third, and fourth materials may be based on the same thermoplastic polymer, preferably polycarbonate, more preferably polycarbonate with a shore D hardness of 75 to 85, which can simplify the manufacture of the device 1. Advantageously, the second material is strictly harder than the first, third, and fourth materials.

[0032] Advantageously, the device 1 comprises a support layer 6 of a fifth thermoplastic polymer material. Preferably, the fifth material is based on the same material as the first, third, and fourth layers 2, 4, and 5. The support layer 6 will have a front face and a rear face that are continuous so as to cover the rear face 15 of the adhesive second layer 3 and at least partially cover the rear face 13 of the first layer 2, as shown in FIG. 10. Alternatively, the support layer 6 may comprise additional through or closed cavities 63 for at least partially inserting the adhesive second layer 3. When the front face of the support layer 6, i.e., the face that is at least partially in contact with the rear face 13 of the first layer 2, is continuous, the additional cavity 63 may be closed, as shown in FIGS. 1, 7, and 9. In this case, the support layer 6 is at least partially in contact with the first layer 2. Alternatively, as shown in FIG. 11, the additional cavity 63 is through and the adhesive second layer 3 is at least partially inserted into the additional cavity 63.

[0033] Figures 2 to 7 show the main steps of a method for manufacturing the stacked electronic device 1 as described above. Generally, the method comprises an assembly operation for obtaining the stacked electronic device 1. The assembly operation, as shown in Figure 2, comprises a step of providing a first layer 2 of a first thermoplastic polymer material, the first layer 2 comprising a through cavity 8; a step of providing an electronic module 7; and a step of providing an adhesive second layer 3 of a second material having a higher adhesive force than the first material. The assembly operation further comprises a step of at least partially inserting the electronic module 7 into the through cavity 8 of the first layer 2, thereby positioning the electronic module 7 away from the first layer 2. In other words, there is a space 65 between the module 7 and the first layer 2. Next, the assembly operation comprises a step of at least partially bringing the adhesive second layer 3 into contact with the first layer 2 and the electronic module 7. For example, the module 7 can be attached to the front face 14 of the second layer 3, and then the second layer 3 can be brought into contact with the first layer 2. Thereafter, the assembly operation can comprise a step of arranging portions 25, 26 of an electric wire 24 on the first layer 2 and a connection region 20, as shown in Figures 4 and 8. For example, the first portion 25 can be welded to the connection region 20. Thereafter, it is possible to at least partially bring a third layer 4 into contact with the first layer 2. Preferably, the back face of the third layer 4 is at least partially brought into contact with the front face of the first layer 2, as shown in Figure 5. Further, as shown in Figure 6, it is possible to at least partially bring a fourth layer 5 into contact with the third layer 4. In one embodiment shown in Figure 6, the thickness E4 of the third layer 4 is greater than or equal to the sum of the thickness of the connection region 20 and the thickness of the first portion 25 of the electric wire 24. Thus, the fourth layer 5 can be arranged on the first portion 25 and come into contact with the first portion 25 of the electric wire 24. Preferably, the thickness E4 of the third layer 4 is strictly greater than the sum of the thickness of the connection region 20 and the thickness of the first portion 25 of the electric wire 24. In this case, the first portion 25 is located away from the back face 61 of the fourth layer 5, that is, the fourth layer 5 is not in contact with the first portion 25. Thus, the stress exerted on the first portion 25 by the fourth layer 5 during pressing is further limited. Thereby, the fourth layer 5 can creep better towards the electronic module 7 and can more easily cover the first portion 25 of the electric wire 24.Advantageously, the assembly operation may comprise a step of bringing the support layer 6 into contact at least partially with the first layer 2, as shown in FIG. 7.

[0034] After the assembly operation, the method comprises pressing the stacked electronic device 7 at a temperature that allows creep of at least the first material, such that the first layer 2 creeps towards the electronic module 7 and comes into contact at least partially with the electronic module 7. Advantageously, the specific temperature also allows creep of the materials of the first, third, fourth, and fifth layers 2, 3-5, as well as the material of the support layer 6. In other words, the specific temperature is selected to be greater than or equal to the maximum value of the creep temperatures of the respective materials of the first, third-fifth materials.

[0035] FIG. 9 shows the device 1 before the pressing step, and comprises an additional layer 70, preferably of the same material as the first layer 2, for covering the electronic module 7. The additional layer 70 has a front and a back with a continuous surface covering the electronic module 7 and the front face 60 of the fourth layer 5. Further, the third layer 4 is arranged at a position remote from the first portion 25 of the line 24. For example, the first layer 2 has an inner edge 80 forming a through cavity 8 of the first layer 2, the third layer 4 has an inner edge 81 forming a through cavity 9 of the third layer 4, and the inner edges 80, 81 may be offset along the main axis X or aligned along the main axis X, as shown in FIGS. 5-7 and 9-11. Preferably, the third layer 4 is arranged away from the first portion 25 such that no stress is applied to the first portion 25 during creep of the third layer 4. The first portion 25 is at least partially inserted into the through cavity 9 of the third layer 4. In this case, creep of the third layer 4 and the fourth layer 5 is promoted and the first portion 25 of the line 24 is covered.

[0036] According to yet another variant, the through cavity 9 of the third layer 4 has a diameter greater than or equal to the diameter of the through cavity 8 of the first layer 2. The diameter is measured along an axis perpendicular to the main axis X.

[0037] Figure 10 shows the device 1 before the pressing step. The fourth layer 5 has an additional cavity 100, that is, the front surface 60 and the back surface 61 of the fourth layer 5 are not continuous. Figure 11 shows the device 1 before pressing, where the support layer 6 has a through cavity 63 for at least partially inserting the adhesive second layer 3.

[0038] Figures 12 to 14 show another embodiment of the laminated electronic device 1. According to this other embodiment, the adhesive second layer 3 has a back surface 15 that at least partially contacts the front surface 10 of the electronic module 7 and the front surface 12 of the first layer 2. Preferably, the surface of the back surface 15 of the adhesive second layer 3 is strictly larger than the surface of the front surface 10 of the electronic module 7. In other words, the adhesive second layer 3 covers the front surface 10 of the electronic module 7. The main axis X passes through the first layer 2 and the second layer 3 in sequence.

[0039] According to another advantage, the device 1 comprises a first antenna 200 electrically coupled to the connection region 20 of the electronic module 7 and a second antenna 201 that at least partially contacts the first layer 2. More specifically, the second antenna 201 is at least inductively coupled to the first antenna 200. In other words, the second antenna 201 is not electrically connected to the first antenna 200 by an electric wire. The mutual inductive coupling between the first antenna 200 and the second antenna 201 is also a so-called magnetic coupling. The first antenna 200 and the second antenna 201 are configured to perform data exchange with an electronic device located at a position remote from the device, such as a credit card reader, by electromagnetic waves. Therefore, since there is no wired electrical connection between the second antenna 201 and the electronic module 7, the energy of the electromagnetic wave generated from or transmitted to the second antenna 201 hardly affects the electronic module 7. In particular, the first antenna 200 forms a closed circuit with the logic circuit 21 so as to be able to receive or supply an electrical signal. For example, the first antenna 200 and the second antenna 201 each include an electric wire, and the first antenna 200 and the second antenna 201 are said to be linear. Alternatively, the antennas 200, 201, or each of the antennas 200, 201 may include a conductive flat strip. According to another variant, the antennas 200, 201, or each of the antennas 200, 201 may be manufactured by depositing a conductive ink.

[0040] Generally, the second antenna 201 comprises at least one part 210, 211 arranged spirally around the first antenna 200. Advantageously, in order to improve data exchange, the second antenna 201 may comprise a first part 210 arranged spirally around the first antenna 200 so as to be inductively coupled to the first antenna 200, and a second part 211 arranged spirally around the first part 210 so as to be inductively coupled to an electronic device located at a position away from the device. Generally, each antenna 200, 201 comprises a conductive element (such as a wire, a conductive strip, or a conductive ink, etc.) arranged spirally within the device in order to generate and receive a magnetic field enabling inductive coupling between the antennas 200, 201. For example, the first antenna 200 and the second antenna 201 are planar coils.

[0041] In particular, the first portion 210 and the second portion 211 are each arranged in a spiral shape, whereby the diameter of the coil of the second portion 211 is strictly larger than the diameter of the coil of the first portion 210. Also, attention is drawn to the first portion 210, the small loop 210, the second portion 211, and the large loop 211, because the diameter of the coil of the large loop 211 is strictly larger than the diameter of the coil of the small loop 210. More specifically, there is a distance between the coil of the large proximal loop 211 closest to the electronic module 7 and the coil of the small loop 210 farthest from the electronic module 7. That distance is strictly larger than the difference between the coils of the small loop 210. Thus, the large loop 211 is configured to exchange data with an electronic device located at a position away from the device 1. Further, the small loop 210 exchanges these data with the first antenna 200 and is configured to transmit and receive these data to and from the electronic module 7, particularly the logic circuit 21 of the module 7. In this case, the small loop 210 functions as a relay for data exchange between the electronic module 7 and an electronic device located at a position away from the device 1. The second antenna 201 is also a so-called power antenna because it is configured to receive electromagnetic waves having a frequency of 10 to 20 MHz. More specifically, the large loop 211 is electrically coupled to the small loop 210. For example, the same conductive element is arranged in a spiral shape to form the small loop 210 and the large loop 211, respectively. For example, two ends of the same conductive element forming the small loop and the large loop can be connected to each other.

[0042] In the embodiments shown in FIGS. 12 and 13, the device 1 may comprise a third layer 4 of a third thermoplastic polymer material, as defined above. In this embodiment, the third layer 4 is at least partially in contact with the first layer 2, the second layer 3, and the second antenna 201. The third layer 4 protects the electronic module 7 and the second antenna 201, and more specifically, can improve the retention of the electronic module 7 in the first layer 2. The device 1 may further comprise an additional layer 203 of an additional thermoplastic polymer material, which is at least partially in contact with the first layer 2 and the electronic module 7. The additional layer 203 has a front face 300 and a back face 301 intended to be in contact with the electronic module 7. Preferably, the additional layer 203 covers the back face 11 of the electronic module 7, in other words, the surface of the front face 300 of the additional layer 203 is strictly larger than the surface of the back face 11 of the electronic module 7.

[0043] Device 1 may also include a cover layer 204 of a thermoplastic polymer cover material, and the cover layer 204 is at least partially in contact with the first layer 2 and the additional layer 203. For example, the additional layer 203 includes at least one adhesive surface 300, 301. Preferably, the back surface 301 of the additional layer 203 is adhesive. Thus, the adhesive back surface 301 of the additional layer 203 can keep a part of the cover layer 204 located on the opposite side of the electronic module 7 stationary during the pressing process. In fact, due to pressing, layers 2, 4 - 6 and 203 - 205 will creep, which may move the part of the cover layer 204 located on the opposite side of the electronic module 7, leading to the formation of a vulnerable area between the back surface 11 of the electronic module 7 and the cover layer 204. For example, the additional layer 203 may include a support layer made of polycarbonate having a surface to which an adhesive is applied. The adhesive can be a polyurethane resin or an epoxy resin, i.e., an epoxide polymer (or polyepoxide). In another example, the additional layer 203 includes an additional thermoplastic polymer material that can be polymerized by ultraviolet irradiation. In this case, the additional layer 203 is arranged in contact with the cover layer 204 in the form of a paste, and then the additional layer 203 is polymerized by ultraviolet irradiation. By polymerization, the additional layer 203 that adheres to the cover layer 204 cures. Advantageously, the additional material of the additional layer 203 is strictly harder than the first material. For example, the hardness of the additional material can be between 80 and 100 on the Shore D scale. For example, the additional material is based on polyamide. For example, the additional material is the same as the second material of the second layer 3.

[0044] Device 1 may further include an additional cover layer 205 of an additional thermoplastic polymer material, and the additional cover layer 205 covers the third layer 4.

[0045] The cover and the additional material can be based on the same thermoplastic polymer as that of the first layer 2, preferably made of polycarbonate, more preferably made of polycarbonate having a hardness between 75 and 85 on the Shore D scale, which simplifies the manufacture of Device 1.

[0046] When device 1 includes layers 2 to 4, 203 to 205, the main axis X passes through the cover layer 204, the additional layer 203, the first layer 2, the second layer 3, the third layer 4, and the additional cover layer 205 in this order.

[0047] Furthermore, FIGS. 12 and 13 show the main steps of another embodiment of a method for manufacturing the stacked device 1. According to this other embodiment, the assembly operation comprises the step of bringing the adhesive second layer 3 into at least partial contact with the front face 10 of the electronic module 7. Next, simultaneously with or preferably after bringing into contact with the front face, the method comprises the step of bringing the adhesive second layer 3 into contact with the front face 12 of the first layer 2. Furthermore, the assembly operation may comprise the step of electrically coupling the first antenna 200 to the connection region 20 of the electronic module, for example by welding, before bringing the adhesive second layer 3 into contact with the front face 10 of the electronic module 7. Next, the method may comprise the step of bringing the second antenna 201 into at least partial contact with the first layer 2.

Claims

Claim 1 - A first layer (2) of a first thermoplastic polymer material, the first layer (2) comprising a through cavity (8); - An electronic module (7) at least partially inserted into the through cavity (8) of the first layer (2); and - An adhesive second layer (3) of a second material having a higher adhesion than the first material, the adhesive second layer (3) being at least partially in contact with the first layer (2) and the electronic module (7) comprising wherein the first layer (2) is at least partially in contact with the electronic module (7), a laminated electronic device. Claim 2 The device according to claim 1, wherein the electronic module (7) has a front surface (10) and a back surface (11), the first layer (2) has a front surface (12) and a back surface (13), and the adhesive second layer (3) has a front surface (14) that is at least partially in contact with the back surface (11) of the electronic module (7) and the back surface (13) of the first layer (2). Claim 3 The device according to any one of claims 1 to 2, wherein the electronic module (7) comprises a connection region (20) and a logic circuit (21) electrically coupled to the connection region (20), the device comprises an electric wire (24) having a first portion (25) electrically coupled to the connection region (20) and a second portion (26) at least partially in contact with the first layer (2), the device comprises a third layer (4) of a third thermoplastic polymer material, the third layer (4) comprises a through cavity (9), whereby the electronic module (7) is at least partially inserted into the through cavity (9) of the third layer (4), and the third layer (4) is at least partially in contact with the first layer (2) and the first portion (25) and the second portion (26) of the electric wire (24). Claim 4 Comprising a fourth layer (5) of a fourth thermoplastic polymer material, said fourth layer (5) comprising a cavity (62), whereby said electronic module (7) is at least partially inserted into said cavity (62) of said fourth layer (5), said fourth layer (5) being in at least partial contact with said third layer (4) and said electronic module (7), said third layer (4) having a thickness (E4) greater than or equal to the sum of the thicknesses of said connection region (20) and said first portion (25), said thickness being measured along an axis (X) passing through said first, said second, and said third layers (2 - 4), the device according to claim 3.

5. Said electronic module (7) comprises a base (30) having a first face forming said back face (11) of said electronic module (7) and a second face (31) opposite said first face, said connection region (20) being in contact with said second face (31), the thickness (E2) of said first layer (2) being greater than or equal to the thickness (Ee) of said base (30), said thicknesses (E2, Ee) being measured along said axis passing through said first, said second and said third layers (2 - 4), the device according to any one of claims 3 - 4.

6. The thickness (E5) of said fourth layer (5) is greater than or equal to the difference between the thickness of said electronic module (7) and the sum of the thicknesses of said first layer (E2) and said third layer (E4), said thickness being measured along an axis (X) passing through said first, said second, said third and said fourth layers (2 - 5), the device according to claim 5.

7. Said first, said third and said fourth materials are based on the same thermoplastic polymer, the device according to claim 5.

8. Comprising a support layer (6) of a fifth thermoplastic polymer material, said support layer (6) comprising an additional cavity (63), said adhesive second layer (3) being at least partially inserted into said additional cavity (63), said support layer (6) being in at least partial contact with said first layer (2), the device according to claim 7.

9. The thickness (E3) of said second layer (3) is less than or equal to the thickness of said support layer (6), said thickness (E3) of said second layer (3) being measured along an axis (X) passing through said first, said second, and said third layers (2 - 4), the device according to claim 8.

10. The electronic module (7) has a front face (10) and a back face (11), the first layer (2) has a front face (12) and a back face (13), and the adhesive second layer (3) has a back face (15) that is at least partially in contact with the front face (10) of the electronic module (7) and the front face (12) of the first layer (2). The device according to claim 1.

11. The electronic module (7) comprises a connection area (20) and a logic circuit (21) electrically coupled to the connection area (20). The device comprises a first antenna (200) electrically coupled to the connection area (20) and a second antenna (201) that is at least partially in contact with the first layer (2) and inductively coupled to at least the first antenna (200). The device according to claim 10.

12. The second antenna (201) comprises a first portion (210) spirally arranged around the first antenna (200) so as to be inductively coupled to the first antenna (200), and a second portion (211) spirally arranged around the first portion (210) so as to be inductively coupled to an electronic device located at a position away from the device. The device according to claim 11.

13. Comprising a third layer (4) of a third thermoplastic polymer material, the third layer (4) being at least partially in contact with the first layer (2), the second layer (3) and the second antenna (201). The device according to any one of claims 10 to 12.

14. Comprising an additional layer (203) of additional thermoplastic polymer material, the additional layer (203) being at least partially in contact with the first layer (2) and the electronic module (7). The device according to claim 13.

15. The additional material is strictly harder than the first material. The device according to claim 14.

16. Comprising a cover layer (204) of thermoplastic polymer cover material, the cover layer (204) being at least partially in contact with the first layer (2) and the additional layer (203). The device according to claim 14 or 15.

17. Comprising an additional cover layer (205) of additional thermoplastic polymer material, the additional cover layer (205) covering the third layer (4). The device according to claim 16.

18. The device according to any one of claims 1 to 17, wherein the hardness of the second material is strictly higher than the hardness of the first material.

19. A method of manufacturing a laminated electronic device, comprising an assembly operation for obtaining a laminated electronic device (1), the assembly operation comprising: - providing a first layer (2) of a first thermoplastic polymer material, the first layer (2) comprising a through cavity; - inserting an electronic module (7) at least partially into the through cavity of the first layer (2) such that the electronic module (7) is positioned away from the first layer (2); - providing an adhesive second layer (3) of a second material having a higher adhesive force than the first material; and - bringing the adhesive second layer (3) into contact at least partially with the first layer (2) and the electronic module (7); characterized in that after the assembly operation, the method comprises pressing the laminated electronic device (1) at a temperature that allows creep of at least the first material, whereby the first layer (2) creeps towards the electronic module (7) and comes into at least partial contact with the electronic module (7).

20. The method according to claim 19, wherein the electronic module (7) has a front face and a back face, the first layer (2) has a front face and a back face, the adhesive second layer (3) has a front face, and the assembly operation comprises bringing the adhesive second layer (3) into at least partial contact with the back face of the electronic module (7) and the back face of the first layer (2).

21. The electronic module (7) comprises a connection region and a logic circuit electrically coupled to the connection region. The assembly operation comprises providing an electric wire (24) having a first portion electrically coupled to the connection region and a second portion at least partially contacting the first layer (2), providing a third layer (4) of a third thermoplastic polymer material, the third layer (4) comprising a through cavity for at least partially inserting the electronic module (7) into the through cavity, and at least partially contacting the third layer (4) with the first layer (2) and the second portion, whereby the first portion is disposed away from the third layer (4). The pressing operation comprises creeping the third layer (4) towards the first portion and at least partially contacting the first portion. The method according to claim 20.

22. The assembly operation comprises providing a fourth layer (5) of a fourth thermoplastic polymer material, the fourth layer (5) comprising a cavity for at least partially inserting the electronic module (7) into the cavity, and at least partially contacting the fourth layer (5) with the third layer (4). The thickness (E4) of the third layer (4) is greater than or equal to the sum of the thickness of the connection region (20) and the thickness of the first portion (25). The thickness is measured along an axis (X) passing through the first, second, and third layers (2 - 4). The fourth layer (5) is formed to cover the first portion of the electric wire (24). The pressing operation comprises creeping the fourth layer (5) towards the electronic module (7) and at least partially contacting the electronic module (7). The method according to claim 21.

23. The assembly operation comprises providing a support layer (6) of a fifth thermoplastic polymer material, the support layer (6) covering the back surface (15) of the adhesive second layer (3) and at least partially covering the back surface of the first layer (2). The method according to claim 22.

24. The electronic module (7) has a front face (10) and a back face (11), the first layer (2) has a front face (12) and a back face (13), the adhesive second layer (3) has a back face (15), and the assembly operation comprises the step of bringing the adhesive second layer (3) into at least partial contact with the front face (10) of the electronic module (7) and the front face (12) of the first layer (2). The method according to claim 19.

25. The electronic module (7) comprises a connection area (20) and a logic circuit (21) electrically coupled to the connection area (20), and the assembly operation comprises the step of providing a first antenna (200) electrically coupled to the connection area (20) and a second antenna (201) brought into at least partial contact with the first layer (2), whereby the second antenna (201) is inductively coupled to at least the first antenna (200). The method according to claim 24.

26. The second antenna (201) comprises a first portion (210) spirally arranged around the first antenna (200) so as to be inductively coupled to the first antenna (200), and a second portion (211) spirally arranged around the first portion (210) so as to be inductively coupled to an electrical device arranged away from the device. The method according to claim 25.

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