Active material-based deformable multi-material objects or structures and methods for 4D printing by volumetric stitching

Abstract

The three-dimensional deformable structure includes a set of individual basic components, so-called IECs, that form a single-piece assembly. The IECs include active or inactive materials, and at least one portion of the set of IECs includes at least three connection means. The connection means of each of the IECs in question is arranged to cooperate with at least one connection means of an IEC adjacent to the IEC in question to connect the IEC in question to the adjacent IEC. For at least one portion of the set of IECs, at least one of the connection means of a given IEC is positioned on an opposite side of at least one other of the connection means of the IEC in question. At least one portion of the set of IECs includes so-called "active" IECs that are spatially arranged in the deformable structure such that at least one property of the deformable structure is changed in response to the application of at least one stimulus.

Description

[Technical Field]

[0001] The present invention relates to the technical field of four-dimensional printing, also known as 4D printing. This technology is based on the creation of three-dimensional objects, also known as 3D objects, by adding matter, so that the so-called 4D objects can change shape or functionality over time when stimulated. [Background technology]

[0002] 4D printing techniques are known from the prior art, which are limited to printing 4D objects based on a single active substance under external stimuli that tend to make the structure flexible and barely withstand large mechanical stresses.

[0003] The materials used are known as smart or active materials, which are adaptive and / or evolving materials because one or more of their properties can be altered by the application of an energy stimulus.

[0004] Nevertheless, when it comes to multi-material objects or structures, current manufacturing techniques use materials with similar properties that are printed by the same additive manufacturing process. To account for the creation of objects composed of similar and dissimilar materials, several additive manufacturing processes should be used, and therefore, this technique should be treated as a technique for assembling prefabricated heterogeneous elements. The use of adhesive or pressure-sensitive adhesive interfaces to secure elements together seems obvious. When incorrectly selected, these adhesives can become a restricting component, potentially limiting the durability of the assembly. Furthermore, adhesives play a role in restricting desired changes in the shape of the assembly. Adhesives also do not allow the use of all types of potentially usable materials. Finally, the adhesive process may be irreversible, preventing the individual disassembly and recovery / reuse of prefabricated elements.

[0005] Detachable mechanical connections are also known in the prior art, nevertheless these connections have the problem of being unattainable for prefabricated elements intended to have isotropic behavior. Summary of the Invention [Problem to be solved by the invention]

[0006] Specifically, the present invention provides: - aims to provide a deformable object or structure consisting of or comprising at least one smart or active material, which may comprise individual pre-fabricated elements of a metal / ceramic material, preferably of a metal / ceramic material, and individual pre-fabricated elements made of a polymer material, preferably of a polymer; and / or - aims to provide transformable objects or structures made of active or smart materials whose shape and / or other physical and / or other chemical properties can be changed by the application of an energy stimulus; and / or - aims to provide a transformable object or structure made of smart material, the change of which shape and / or other physical and / or other chemical properties can be enhanced and / or controlled by the application of at least one stimulus; and / or - aims to provide a method for producing a deformable object or structure by assembling individual prefabricated elements; and / or - to provide a variety of deformable objects or structures whose structure can be changed at any time; and / or - Aiming to provide easily reusable and transformable objects or structures; and / or - To provide a deformable object or structure that can be disassembled individually without the prefabricated elements being degraded or deteriorated, thereby making the prefabricated elements usable again. [Means for solving the problem]

[0007] To this end, a three-dimensional deformable structure or object, so-called deformable structure, is provided, which comprises a set of individual elementary components, so-called IECs (Individual Elementary Components) or voxels, forming a monolithic assembly. The IECs, preferably each IEC, are preferably made of an active or inactive material. At least one portion of the set of IECs comprises at least three connecting means. The connecting means of each IEC under consideration is arranged to cooperate with at least one connecting means of an IEC adjacent to the IEC under consideration, preferably to connect the IEC under consideration to an IEC adjacent to the IEC under consideration, preferably reversibly, to the adjacent IEC. For at least one portion of the set of IECs, preferably for each IEC, at least one of the connecting means of the IEC under consideration is preferably positioned on the opposite side of at least one other of the connecting means of the IEC under consideration. At least one portion of the IECs of the set of IECs comprises so-called active IECs that are preferably spatially arranged in the deformable structure in a specific and / or predetermined manner such that at least one property of the deformable structure is altered in response to the application of at least one stimulus, preferably over all or part of the structure.

[0008] The IECs may have different dimensions, advantageously identical, and may advantageously be cubic in shape.

[0009] The attachment means can be mechanical, physical, and / or chemical attachment means.

[0010] The deformable structure may be defined as a smart object or a smart structure.

[0011] Preferably, at least one stimulus is an energy stimulus.

[0012] Preferably, according to the present invention, by three-dimensionally deformable structure this is to be understood as a structure that is capable of and / or arranged to change one or more of its geometrical, physical, mechanical and / or chemical properties in response to the application of one or more external stimuli.

[0013] Preferably, the deformable structure is capable of and / or arranged to perform a deformation function in response to the application of one or more external stimuli.

[0014] Preferably, the deformable structure is capable of and / or arranged to change its shape and / or configuration in response to the application of one or more external stimuli.

[0015] Preferably, the convertible structure according to the present invention is arranged to be disassembled or removed in whole or in part without its structure and / or its properties being degraded or deteriorated.

[0016] By coupled, this may be understood as joining, connecting, associating, holding, reconnecting, assembling, joining, attaching, interlocking, or fastening.

[0017] Preferably, one, some or each of the connecting means is arranged to connect the IEC under consideration to one, some or each of the adjacent IECs in a reversible manner.

[0018] Preferably, the connecting or coupling means of the IEC under consideration and the connecting or coupling means of another one of the IECs cooperating with the IEC under consideration can form a pair of connecting or coupling means.

[0019] Preferably, the coupling means and / or the arrangement of the coupling means for the activated IECs and / or the spatial arrangement of the activated IECs allows the deformable structure to undergo substantial mechanical deformation induced by at least one energy stimulus.

[0020] Preferably, the IECs forming or creating the periphery of the deformable structure may comprise at least one connection means and / or may be connected to at least one adjacent IEC. The IECs forming or creating the periphery of the deformable structure may comprise at least two, preferably at least three, connection means.

[0021] By periphery of the deformable structure this may be understood as the outer surface or outer side of the deformable structure. The periphery of the deformable structure may be continuous or discontinuous, i.e. may comprise irregularities and / or recesses and / or indentations and / or notches and / or grooves and / or slots and / or protrusions.

[0022] Preferably, at least one partial IEC of the set of IECs comprising at least three connection means corresponds to IECs that do not form or create the periphery of the deformable structure. Even more preferably, at least one partial IEC of the set of IECs comprising at least three connection means corresponds to all of the IECs except for the IECs that form or create the periphery of the deformable structure.

[0023] The coupling elements of one IEC may be identical or different.

[0024] Preferably, the connection means of each of the IECs is complementary to at least one connection means of one, some or each of the other IECs. Even more preferably, the connection means of each of the IECs under consideration is complementary to at least one connection means of one, some or each of the IECs adjacent to the IEC under consideration.

[0025] Preferably, the coupling means of the IEC under consideration are arranged to cooperate with coupling means of IECs adjacent to the IEC under consideration. Preferably, each of the coupling means of the IEC under consideration cooperates with at least one coupling means of an adjacent IEC distinct from the IEC under consideration to couple the IEC under consideration to the adjacent IEC.

[0026] Preferably, the configuration of the deformable structure makes it versatile, even more preferably, since its shape and / or configuration can be changed in a controlled manner by disassembly of portions of the individual pre-fabricated elements. The deformable structure can be completely disassembled and the individual IECs recovered and preferably reused or recycled.

[0027] Preferably, excluding the IECs that form or create the periphery of the deformable structure, each of the IECs of the deformable structure comprises at least four, preferably at least five, even more preferably at least six, preferably at least eight connection means.

[0028] Preferably, the IECs, preferably all of the IECs, are or consist of prefabricated elements.

[0029] The set of IECs may comprise, and preferably consist of, only active IECs. Preferably, the set of IECs comprises active IECs and inactive IECs. By inactive IECs, this can be understood as IECs that are unresponsive to at least one stimulus, preferably unresponsive to all types of stimuli. By active IECs, this can be understood as IECs that are responsive to at least one stimulus. By responsive to at least one stimulus, this can be understood as the tendency or ability of an IEC or substance to change the properties of the IEC or substance, or to have the properties of the IEC or substance changed under the influence of the stimulus.

[0030] The set of IECs may comprise active IECs and inactive IECs. - arranged to contribute to and / or enhance and / or control the modification of at least one property of the deformable structure, for example by distributing in a controlled manner the mechanical stresses induced by the deformation of the active IECs throughout the deformable structure; and / or - made from a material that contributes to and / or enhances and / or controls the modification of at least one property of the deformable structure, for example by distributing in a controlled manner the mechanical stresses induced by the deformation of the active IEC throughout the deformable structure.

[0031] The active IECs and / or inactive IECs may be composed of the same or different substances as one, some, or each of the substances that make up the other active IECs and / or inactive IECs.

[0032] Preferably, the active IECs form a network that is preferably arranged relative to the inactive IECs such that application of an energy stimulus results in modification of at least one property of the deformable structure. More preferably, the active IECs form a network that is preferably arranged relative to the inactive IECs such that local application of an energy stimulus contributes to and / or enhances and / or controls modification of at least one property of the deformable structure.

[0033] Preferably at least one, even more preferably several or each of the connecting means is a bonding means.

[0034] Preferably, the coupling or connecting means comprises: - at least one protrusion cooperating with a recess, indentation or compartment, and / or - a cutout or notch cooperating with a cutout or notch, and / or - a cutout or notch cooperating with at least one projection or protrusion, and / or - at least one protrusion or projection cooperating with at least one surface or side of the IEC The present invention is characterized in that it comprises, preferably consists of, or is formed by,

[0035] By protrusion in this application this can be understood as a protrusion. By depression in this application this can be understood as a recess, indentation or compartment. By notch in this application this can be understood as a cutout.

[0036] The connecting or joining means may be or include a key, a tooth or jaw, commonly a so-called "Haas joint", a rod, a channel, a tenon, a mortise and groove, a claw, a half-breed joint, a joint or a dovetail joint.

[0037] Preferably, the connecting or coupling means of the IEC under consideration and the connecting or coupling means of the IEC cooperating with the IEC under consideration may form a key pair, a tooth pair or a reciprocal jaw, generally a so-called "Haas joint", a rod-guide pair, a tenon-mortise pair, a groove-claw pair, a half-breed joint, a joint, a dovetail joint or a tenon-type tooth.

[0038] Preferably, each of the IECs comprises four or more sides, and at least three of the sides of each of the IECs of at least one part of the set of IECs comprise at least three connection means each comprising at least one connection means, and said at least three sides of each of the IECs of at least one part of the set of IECs comprise at least three connection means each connected by at least one connection means to a side of one other of the IECs of the deformable structure.

[0039] Preferably, each of the IECs comprises four or more sides. Preferably, at least four of the sides of each of the IECs of at least one portion of the set of IECs comprising at least three coupling means each comprise at least one coupling means. Preferably, each of the at least four sides of each of the IECs of at least one portion of the set of IECs comprising at least three coupling means is coupled to one side of another one of the IECs of the deformable structure by at least one coupling means.

[0040] By "side" this may be understood as a continuous or discontinuous face or surface. By "side" this may be understood as a face or surface from which a protrusion extends or a face or surface in which a depression is formed.

[0041] Preferably, each of the IECs further comprises at least two connection means, still more preferably at least three connection means, still more preferably four connection means. Preferably, the connection means of each of the IECs under consideration comprises: - a conduit for the passage of fluids and / or energy and / or signals from the IEC under consideration to an adjacent IEC or from an adjacent IEC to the IEC under consideration, or - Electrical linkage between the IEC under consideration and the adjacent IEC is preferably arranged to cooperate with at least one means for linking an adjacent IEC to the IEC under consideration so as to reversibly form

[0042] Preferably, for each IEC, at least one of the connection means of the considered IEC is positioned on an opposite side of at least one other of the connection means of the considered IEC.

[0043] Preferably, each connection means of one IEC is complementary to at least one connection means of one, some or each of the other IECs. Even more preferably, each connection means of a considered IEC is complementary to at least one connection means of one, some or each of the IECs adjacent to the considered IEC.

[0044] Preferably, the connection means of each of the IECs under consideration are arranged to cooperate with the connection means of the IECs adjacent to the IEC under consideration so as to allow the passage of fluids and / or energy and / or signals through the IEC under consideration towards at least three IECs adjacent to the IEC under consideration or conversely from those three IECs.

[0045] Preferably, at least one stimulus is - an electrical change, preferably a current or a voltage, and / or a temperature change and / or a mechanical force, stress or pressure and / or a change in the concentration of a compound circulating in the deformable structure, - passing, flowing or propagating at least in part in or through the deformable structure, preferably in or through the active and / or inactive IECs, via the connecting means.

[0046] Preferably, the deformable structure is arranged such that at least one stimulus passes, flows or propagates, at least in part, to or through the coupling means of the IEC.

[0047] The compound may be a liquid and / or gas and / or solid and / or gel. A solid compound may be suspended in a liquid or may be in solution.

[0048] Preferably, the at least one stimulus is injected into at least one connection means of one or more of the IECs that form or create the periphery of the deformable structure when passing or flowing into or through the deformable structure. Preferably, the at least one connection means of the one or more IECs into which the at least one stimulus is injected is comprised, located or disposed on an outer side or outer surface of the deformable structure. Preferably, the outer side or outer surface of the deformable structure consists of or is formed by the outer side or outer surface of the IECs that form or create the periphery of the deformable structure.

[0049] Preferably, the at least one stimulus is preferably an energy stimulus. More preferably, the at least one stimulus is electrical, preferably a current or a voltage, and / or an electric field and / or a magnetic field and / or a temperature change and / or an electromagnetic wave and / or a mechanical force, a mechanical stress, a mechanical pressure and / or a compound surrounding the deformable structure or a change in the concentration of a compound surrounding the deformable structure, preferably if the at least one stimulus is external to or applied to or from the outside of the deformable structure.

[0050] If the at least one stimulus is external to the deformable structure, the at least one stimulus may propagate from outside the deformable structure to or through the deformable structure.

[0051] The deformable structure may be arranged such that at least one of its properties, preferably at least one of the properties of at least one of the active IECs, is altered in response to the application of at least one external stimulus that propagates in or through the deformable structure and / or in response to at least one stimulus that passes or flows into or through the deformable structure via the coupling means of the IECs.

[0052] Preferably, the electromagnetic radiation may have one or more specific or predetermined monochromatic wavelengths and / or may be a specific or predetermined range of wavelengths. Preferably, the one or more monochromatic wavelengths or range of electromagnetic wavelengths are in the ultraviolet and / or infrared and / or visible ranges.

[0053] Preferably, the modification or change in at least one property of the object or deformable structure is a change in shape and / or geometry and / or composition and / or volume and / or optical properties and / or mechanical properties and / or chemical properties and / or thermal conductivity and / or electrical conductivity.

[0054] By optical property this can be understood as a change in refractive index and / or polarization and / or turbidity and / or color.

[0055] By mechanical properties of the deformable structure or IEC, this can be understood as Young's modulus, shear modulus or Poisson's ratio. Preferably, the deformable structure has a modulus of 10 Pascal to 10 7 It has a Young's modulus comprised between 100 and 1000 kJ / cm².

[0056] Preferably, the IEC comprises or consists of a polymer and / or a metal and / or a ceramic and / or a gel, preferably viscoelastic and / or a piezoelectric material and / or a shape memory material.

[0057] According to the present invention, there is also provided a method for manufacturing a single-piece three-dimensional deformable structure, preferably a deformable structure according to the present invention. The method comprises the step of providing a set of individual basic components, so-called IECs, which comprise an active or inactive material. At least one portion of the IECs of the set of IECs comprises at least three connection means. For at least one portion of the IECs of the set of IECs, at least one of the connection means of the considered IEC is preferably positioned on the opposite side of at least one other of the connection means of the considered IEC, and at least one portion of the set of IECs comprises so-called active IECs.

[0058] The manufacturing method further comprises the step of assembling the set of IECs, preferably reversibly, via a robotic system by successively interlocking at least one connection means of one IEC with at least one connection means of another one of the IECs and spatially arranging the active IECs in an assembly, preferably in the deformable structure, preferably in a specific and / or predetermined manner, the IECs being preferably obtained by additive manufacturing such that at least one property of the deformable structure is altered in response to the application of at least one stimulus, preferably over all or part of the deformable structure or outside the deformable structure.

[0059] Preferably, according to a first alternative, the step of assembling the set of IECs, the so-called assembly step, comprises: simultaneously or sequentially forming at least two separate, single-piece layers or planes of IECs by sequentially interlocking at least one means for connecting the IECs with at least one means for connecting another one of the IECs, and then combining the formed layer with another one of the formed layers by interlocking at least one connection means of each of the IECs of the formed layer with at least one connection means of each of the IECs of another one of the formed layers; Includes:

[0060] Preferably, according to a second alternative combinable with the first alternative, the step of assembling the IEC comprises: sequentially interlocking at least one means for connecting one IEC with at least one means for connecting another one of the IECs to simultaneously or sequentially form a row of at least three separate, single pieces of IECs, and then combining the formed rows with another one of the formed rows by interlocking at least one coupling means of each of the IECs in the formed row with at least one coupling means of each of the IECs in another one of the formed rows to form at least one single layer of IECs; and thereafter combining the formed layer with the other formed rows or with another one of the formed layers by interlocking at least one connection means of each of the IECs of the formed layer with at least one connection means of each of the IECs of the other formed rows or with at least one connection means of each of the IECs of the other one of the formed layers, respectively; Includes:

[0061] Multi-material 4D printing makes it possible to construct dissimilar objects or structures, at least one of which is active. This offers greater freedom to distribute spatial and temporal behavior, as well as greater freedom to integrate energy stimuli at the core of the object or structure. The present invention relates to multi-material 4D printing of deformable objects or structures in a volumetric construction strategy consisting of the assembly of prefabricated elements, so-called voxels or IECs (hence the name additive manufacturing). These voxels are made from materials that allow the 4D object to change shape and / or properties under the action of energy stimuli, which can be external and / or internal.

[0062] In this application, unless otherwise indicated or incompatible, the features described apply to the first and second alternatives of the method.

[0063] By "associate" this may be understood as joining, connecting, reconnecting or attaching.

[0064] By "interlocking" this may be understood as embedding, fitting, nesting, joining, engaging, or inserting.

[0065] Preferably, the robot system comprises an articulated arm. Preferably, the robot system, preferably the articulated arm, is capable of and / or is arranged to move the IEC according to three axes, more preferably according to six axes. Preferably, the articulated arm is a so-called six-axis arm.

[0066] The robotic system may be capable of movement and / or may be arranged to move.

[0067] The robotic system may be coupled to or may comprise optical means or a shape recognition system for guiding and / or controlling and / or assisting the robotic system during assembly.

[0068] Preferably, the manufacturing method includes the step of forming and assembling a row or layer of IECs over a base. Preferably, the base comprises a set of receiving locations, each receiving location comprising at least one reversible coupling means arranged to cooperate with at least one coupling means of at least one IEC. Preferably, the step of forming and assembling the row or layer of IECs over the base consists in interlocking at least one coupling means of each of the IECs of the row or layer with at least one reversible coupling means of a different receiving location.

[0069] According to a first alternative, the step of forming and assembling the row of IECs over the base may comprise or consist in forming and depositing a first row of IECs of the deformable structure, and depositing one or more other rows of IECs over and / or from the first row.

[0070] The step of forming and assembling layers of IECs over the base may consist in forming and depositing a first layer of IECs of the deformable structure and depositing one or more other layers of IECs over that first row, or depositing all of the other layers of the deformable structure over and / or from that first row.

[0071] Preferably, the step of assembling IECs according to the first and second alternatives comprises forming and assembling rows or layers of IECs across a base.

[0072] Preferably, the step of depositing and assembling a first row or first layer of IECs over the base is part of or included in the step of forming at least two separate, single-piece layers of IECs according to the first and second alternatives and / or forming at least three separate, single-piece rows of IECs according to the second alternative and / or assembling each formed row, or each layer, with another one of the formed layers or with each other one of the formed rows, according to the second alternative.

[0073] Preferably, the base is intended to serve as a reference frame for the robotic system and / or has the effect of stabilizing the assembly during manufacturing.

[0074] Preferably, each connection means of each receiving location of the base is complementary to at least one connection means of one, some or each of the IECs.

[0075] The step of forming and assembling the rows or layers of IECs over the foundation may involve the use of one or more foundations.

[0076] Preferably, the manufacturing method includes a step of temporarily storing the IECs separately by row, layer, set or subset during assembly of the IECs over the base and / or before assembly of the IC, preferably before the step of assembling the IECs with or without the base.

[0077] Preferably, each of the IECs stored across the base is not assembled or connected to any other one of the stored IECs.

[0078] Storing the IECs may include using one or more bases that may be the same or different from the bases used for forming and assembling the rows or layers of IECs across the bases. One or more of the bases may be areas dedicated for storage of the IECs.

[0079] Preferably, the manufacturing method includes the step of handling and transporting the IEC by a robotic system. Preferably, the handling and transporting step further includes sequentially and reversibly coupling at least one coupling means of the IEC with at least one reversible coupling means of the robotic system.

[0080] Preferably, the articulated arm of the robotic system comprises a coupling means.

[0081] Preferably, the manufacturing method includes a step of disassembling all or part of an IEC, or all or part of a row and / or layer of IECs, consisting of a single-piece deformable structure that has been manufactured or is being manufactured, by separating the IEC under consideration from one or more of the adjacent IECs to which it is connected by disengaging one or more connection means of the IEC under consideration from one or more connection means of adjacent IECs with which the one or more connection means of the IEC under consideration cooperate by interlocking, or one or more connection means of the IEC under consideration are mutually interlocked.

[0082] Preferably, the disassembly is performed by a robotic system.

[0083] The manufacturing method may include one or more steps of manufacturing all or part of the IECs of the set of IECs. The step of manufacturing all or part of the IECs may result from an additive manufacturing process, a subtractive manufacturing process, or a form- ing manufacturing process. The manufacturing step may be part of or consist of the step of providing the set of IECs.

[0084] Preferably, the method of manufacture comprises: In databases or storage, one or more individual IECs having different spatial forms and / or containing or consisting of different materials; and / or One or more subsets of IECs among the subsets of IECs that have different spatial forms and / or contain or consist of different materials Preferably, the method includes the step of determining, from the selected individual IECs or selected subsets, an arrangement of one or more of the subsets relative to one another in the deformable structure such that application of the at least one stimulus results in modification of at least one property of the deformable structure.

[0085] The method according to the invention is particularly suitable for implementing the device according to the invention, and even more preferably is specially designed for implementing the device according to the invention, and thus any feature of the method according to the invention can be incorporated into the device according to the invention, and any feature of the device according to the invention can be incorporated into the method according to the invention.

[0086] Other advantages and particularities of the invention will become apparent from the accompanying drawings, which are given below and on reading the detailed description of non-limiting implementations and embodiments. [Brief explanation of the drawings]

[0087] [Figure 1] 1A-1C are schematic diagrams of embodiments of three-dimensional deformable structures according to the present invention, illustrating the alteration of the three-dimensional form of the deformable structure in response to the application of a stimulus; [Figure 2] 1 is a schematic diagram of an embodiment of a three-dimensional deformable structure according to the present invention, showing an example of the spatial distribution of active and inactive voxels within the deformable structure; [Figure 3] 1A-1C are schematic diagrams of two embodiments of a three-dimensional deformable structure according to the invention, showing examples of different spatial distributions of active and inactive voxels within the deformable structure; [Figure 4] 4 is a schematic diagram of two three-dimensional deformable structures of FIG. 3, each having a different arrangement of active and inactive voxels, illustrating the alteration of the three-dimensional shape of the deformable structure in response to the application of a stimulus. [Figure 5] 1 is a schematic diagram of an embodiment of a voxel and an embodiment of a means for combining voxels; [Figure 6] 1 is a schematic diagram of an embodiment of a voxel and an embodiment of a means for combining voxels; [Figure 7] 1 is a schematic illustration of the principle of a method for manufacturing a three-dimensional deformable structure according to the invention; [Figure 8] 1 is a schematic view of an embodiment of the means used for the implementation of the method for manufacturing a three-dimensional deformable structure according to the invention; [Figure 9]1 is a schematic illustration of a voxel assembly that can be used for the implementation of a method for manufacturing a three-dimensional deformable structure according to the invention; DETAILED DESCRIPTION OF THE INVENTION

[0088] Without being limiting, the embodiments described hereinafter that are variations of the invention that include only a selection of described features in isolation from other described features (even if this selection is isolated in a sentence that includes these other features) may be considered, specifically, if this selection of features is sufficient to provide a technical advantage or to differentiate the invention over the prior art. This separation includes at least one feature, preferably a functional feature without structural details, or a functional feature with only a portion of structural details, if only this portion is sufficient to provide a technical advantage or to differentiate the invention over the prior art.

[0089] 1 to 9, an embodiment of the present invention is shown.

[0090] According to an embodiment, and with reference to Figures 1 to 3 and 6, three-dimensional deformable structures 1 according to the invention, so-called structures 1, are depicted. These structures 1 comprise a set of individual basic components 2, so-called IECs 2, which form a single set of components. The IECs 2 consist of either active or inactive materials. IECs 2 made from active materials are active IECs 21, whereas IECs 2 made from inactive materials are inactive IECs 21. Figures 1, 3 and 4 are schematic illustrations obtained by simulation. According to a non-limiting embodiment, the simulations were obtained by using Euler-Bernoulli beam calculations and / or by combining the results of these calculations with a genetic algorithm.

[0091] According to an embodiment, referring to structures (c) and (d) of Fig. 1, structure 1 further comprises spatial regions 222 or voxels 222 that are empty or do not comprise IEC2. Structure 1 may comprise only active IECs 221. Nevertheless, structure 1 with particularly interesting properties can be obtained by combining, according to an appropriate spatial arrangement, voxels 222 that do not comprise IEC2 or voxels that comprise active IECs 221 with inactive IECs 21 or voxels that comprise inactive IECs in structure 1.

[0092] Voxels 222 with no IECs 2, active IECs 221, and inactive IECs 21 are spatially distinctly arranged in structure 1 such that at least one property of structure 1 is altered in response to application of at least one stimulus.

[0093] By way of non-limiting example, the active IEC 221 can be, by way of non-limiting example, a shape memory polymer, a shape memory alloy, an electroactive polymer, a liquid crystal elastomer, a hydrogel, or a piezoelectric material. By way of non-limiting example, the passive IEC 21 can be a polymer such as an elastomer, a metal alloy, a ceramic, or a glass.

[0094] The IEC2 allows for a 3D space to be based. The IEC2 can have any shape and any size. For example, the IEC2 can be spherical, cylindrical, ovoid, prismatic, conical, or pyramidal. For example, the IEC2 can have a size ranging from 10 μm to several millimeters, depending on the accuracy of the system for manufacturing the IEC2. Typically, the IEC2 has a size ranging from 5 mm to 1 cm.

[0095] According to the embodiment, the IECs 2 forming the structure 1 depicted in the embodiment comprise at least six connection means 3. Apart from the IECs 2 with one or more faces forming the outer face of the structure 1, one, some or each connection means 3 on one face of the IEC 2 under consideration is arranged to cooperate with one, some or each connection means 3 present on a face of an IEC 2 adjacent to the IEC 2 under consideration. Thus, the IEC 2 under consideration is connected to at least one of the IECs 2 adjacent to it by one, some or each connection means 3. According to the disclosed embodiment, apart from the IECs 2 with one or more faces forming the outer face of the structure 1, each IEC 2 of the structure 1 is connected to each of the IECs 2 adjacent to it.

[0096] Preferably, the connecting means 3 are reversibly connectable, nevertheless the invention does not exclude permanent connection of the IEC 2 under consideration with one, several or each of the IECs 2 adjacent to it with the connecting means 3, for example by snap fastening.

[0097] According to the disclosed non-limiting embodiment, for each IEC2, at least one of the connection means 3 of the considered IEC2 is located on one side of the considered IEC2 that is opposite to one side of the considered IEC2 that is provided with at least one other of the connection means 3.

[0098] According to the non-limiting embodiment shown in Figures 1-3, the property of structure 1 that is altered in response to the application of at least one stimulus is the shape or spatial configuration of structure 1. According to the embodiment, the active IECs 221 are hydrogels, the voxels 222 are stimulated with highly inert materials to best match regions of empty space, and the inert IECs 21 are flexible polymers or elastomers, for example, as listed above. In the absence of a stimulus, structure 1 has a linear shape 111. Upon application of a stimulus, structure 1 deforms to assume a predetermined non-linear shape 112. To achieve a desired or specific configuration 112 upon application of a stimulus, active IECs 221 can be spatially arranged relative to one another, voxels 222 without IECs 2 can be spatially arranged relative to active IECs 221 and / or inactive IECs 21, and inactive IECs 21 can be spatially arranged relative to active IECs 221 and / or inactive IECs 21, and voxels 222 without IECs 2 can be spatially arranged relative to active IECs 221 and / or inactive IECs 21, for example, structure 1 derived from a database. According to a non-limiting embodiment shown in FIG. 1, the active IECs 221 are made of a hydrogel and the inactive IECs 21 are made of an elastomer, and the deformation occurs under the effect of a thermal stimulus in an aqueous medium. For example, active IECs 221 made of a liquid crystal elastomer or a shape memory polymer can be used to induce similar deformations under the effect of a thermal stimulus. Also, depending on (a) and (c) of structure 1, a series of bends can be observed along structure 1, such that the form 112 taken in the stimulus has a series of curves and structure 1 has a serpentine manner of shape 112. According to the invention, it is proposed to change the spatial arrangement or form of voxels 222, active IECs 221 and inactive IECs 21 relative to each other and / or their number in structure 1 derived from the database, in order to obtain better and / or different deformations of structure 1.According to the non-limiting embodiment shown in Structures (b) and (d), this new configuration or arrangement of voxels 222, active IECs 221, and inactive IECs 21 relative to each other within Structure 1 is calculated to allow additional deformation, e.g., tension, within and along the structure. Structure 1(b) is derived from Structure 1(a), and Structure 1(d) is derived from Structure 1(c).

[0099] Nevertheless, despite the illustrated properties that can be seen, the modified properties are in the form of Structure 1, according to the disclosed non-limiting embodiments, and other properties of Structure 1 can be modified by selecting other active and / or inactive materials.

[0100] 2, embodiments of structure 1 are shown, each having a different spatial arrangement of different active and inactive IECs 21. The illustrated structure 1 comprises an overlap of two layers 61, 62 of IECs 2. The illustrated structure 1 has a linear configuration 111 in the absence of a stimulus. Application of a stimulus will induce a deformation of the structure 1 such that the structure 1 assumes a different configuration 112.

[0101] Two structures 1, each with a different spatial arrangement of active and inactive IECs 221, 21, are shown in Figure 3. Similarly to Figure 3, the two structures 1 shown comprise two overlapping layers 61, 62 of IECs 2 and have a linear morphology 111 in the absence of a stimulus.

[0102] Referring to Figure 4, the effect of applying a stimulus on each of the two structures 1 depicted in Figure 3 is shown. It can be observed that despite the spatial arrangement of the active IECs 221 and inactive IECs 21 being substantially different between the two structures 1, application of the stimulus results in the same configuration 112. Both structures 1 bend upon application of the stimulus to assume the same curved shape 112.

[0103] 5 and 6, different connecting means 3 considered in the context of the present invention are shown by way of non-limiting examples. These examples are illustrative rather than limiting. According to an embodiment, the connecting means 3 are coupling means capable of reversibly connecting one IEC 2 to another IEC 2.

[0104] The coupling means 3 according to the present invention may be a protrusion 31, a projection 31, a bead 31, a recess 32, a depression 32, a compartment 32, a cutout 33, or a notch 33. One face of the IEC 2 may be provided with one or more coupling means 3. One face of the IEC 2 may have the same coupling means 3, i.e., a single type of coupling means 3. According to the present invention, two opposite side faces or two opposite faces of the IEC 2 may, but do not necessarily, be parallel to each other. One, several, or each face of the IEC 2 under consideration may have the same coupling means 3 that differ from one, several, or each one, several, or each one of the coupling means 3 on one, several, or each other face of the IEC 2 under consideration. One, several, or each coupling means 3 of the IEC 2 under consideration may differ from one, several, or each one of the coupling means 3 on one, several, or each one of the IEC 2 adjacent to the IEC 2 under consideration.

[0105] The IEC 2 may also comprise a conduit 4 for the passage of a fluid from the IEC 2 under consideration to an adjacent IEC 2 or from an adjacent IEC 2 to the IEC 2 under consideration. IEC 2 (a) in FIG. 5 and (a), (b), (d), (e), (f), and (g) in FIG. 6 comprise conduits 4 on at least two of their faces. The conduits 4 may comprise or be at least partially formed by openings 4 extending into or through the wall of the IEC 2. The conduits may also comprise or be formed by protrusions 3 extending beyond the wall of the IEC 2. Furthermore, the conduits 4 may wholly or partially form the coupling means 3.

[0106] Referring to IEC2 (c), (d) and (f) in Figure 5 and (b) and (f) in Figure 6, each face of IEC2 comprises a single coupling means 3, 31, 3, 32, 3, 33 or 4, 3, 32 per face.

[0107] 6(a), (g), (e) of the IEC 2 in Fig. 5 and (a), (c), (d), (e) and (f) of Fig. 6, it can be considered that at least one face of the IEC 2 comprises several coupling means 3, 31 and 3, 32, or 3, 31 and 4, 3, 32, or 3, 31 and 3, 33. In this case, the coupling means 3, 31 and 3, 32, or 3, 31 and 4, 3, 32, or 3, 31 and 3, 33 of one face are arranged to cooperate with one, some or all of the coupling means 3 of one face of an adjacent IEC 2. Nevertheless, it can also be considered that different coupling means 3, 31 and 3, 32, or 3, 31 and 4, 3, 32, or 3, 31 and 3, 33 of one face of the IEC 2 form a single coupling means 3. In this case, the coupling means 3,31 and 3,32 or 3,31 and 4, 3,32 or 3,31 and 3,33 on one side are arranged to cooperate with one, some or all of the coupling means 3 on one side of the adjacent IEC 2.

[0108] One or more coupling means 3 on one side of the considered IEC 2 may be different from one or more coupling means 3 on another side of the considered IEC 2. This makes it possible to facilitate a change in the properties of the structure 1 in a given direction, for example a deformation of the structure in a given direction. This makes it possible to restrict, limit or prevent a change in the properties of the structure 1 in a given direction, for example a deformation of the structure in a given direction.

[0109] 7 to 9, an embodiment of a method for manufacturing a structure 1 according to the present invention is shown.

[0110] Referring to FIG. 7, a schematic diagram illustrating the concept of an embodiment of a method for manufacturing a structure 1 according to the present invention is depicted. The first step of the method consists in providing a set of individual IECs 2 according to the present invention. The IECs 2 may be obtained by any means, in particular commercially available, without a step of designing the IECs 2 being part of the process. As a non-limiting example, the IECs can be obtained by an additive method, preferably 3D printing, or by a subtractive method. As a non-limiting example, obtaining the IECs 2 by 3D printing is shown in FIG. 7. 3D printing of IECs made from polymers, metals, and composite materials is shown.

[0111] The method also includes assembling the IECs 2 using a robotic system 5. The IECs 2 are assembled by the robotic means 5 by sequentially interlocking at least one connection means 3 of the IECs 2 with at least one connection means of another one of the IECs 2. The IECs 2 are assembled to spatially arrange the active IECs in the structure 1, which is fabricated such that at least one property of the structure 1 is altered in response to the application of at least one stimulus. The spatial arrangement is performed such that the active IECs 221 are arranged in a predetermined manner relative to each other, to voxels 222 that do not comprise IECs 2, and to inactive IECs 21.

[0112] According to a non-limiting refinement, the method comprises a step of selecting, in the database, from a subset of IECs comprising active IECs and / or inactive IECs. Starting from or simultaneously with the selection step, and depending on the desired or sought modification of at least one property of the structure 1, the method comprises a step of determining, from the selected individual IECs and / or the selected subset, one or more arrangements of the selected individual IECs and / or the selected subset relative to one other individual IECs and / or the subset of IECs in the deformable structure 1 to be manufactured, such that application of at least one stimulus produces the desired modification of at least one desired property of the structure 1.

[0113] According to a non-limiting embodiment, the robot means 5 is an articulated arm 5 mounted on an assembly / disassembly station 9. The articulated arm 5 comprises, at its movable end, reversible coupling means 51 for gripping or fixing the IECs 2 to be assembled or disassembled. The station also comprises a base 8. The base 8 comprises a set of receiving locations 81. Each receiving location 81 comprises at least one reversible coupling means 82 arranged to cooperate with at least one coupling means 3 of each of the IECs 2 to be assembled / disassembled. The base 8 comprises an assembly area that can also be used for temporary storage for individual IECs 2, for one or more rows 71, 72, 73, 74 of IECs 2 or for one or more layers 61, 62, 63, 64 of IECs 2. In the rows 71, 72, 73, 74 of IECs 2 or in the layers 61, 62, 63, 64 of IECs 2, some of the IECs 2, preferably the connecting means 3 of the IECs 2, one or more faces of which form the outer surface of the structure 1, preferably each connecting means 3 cooperates with a reversible connecting means 82 of a separate receiving location 81 of the base 8. According to an embodiment, the assembly / disassembly station 9 comprises an area 83 for storing the IECs 2, dedicated exclusively to the storage of the IECs 2. The storage area 83 may also comprise a set of receiving locations 81. Each receiving location 81 comprises at least one reversible connecting means 82 arranged to cooperate with at least one connecting means 3 of each of the IECs 2 to be assembled / disassembled.

[0114] The manufacturing method also comprises, according to a first alternative, a step, the so-called assembly step, consisting in assembling the set of IECs 2, which comprises forming at least two separate, single-piece layers 61, 62 of IECs 2. Forming the layers 61, 62 consists in successively interlocking at least one connecting means 3 of one IEC 2 with at least one connecting means of another one of the IECs 2. Following the formation of the layers 61, 62, the formed layer 61 or 62 is combined with another one of the formed layers 61, 62 by interlocking at least one connecting means 3 of each of the IECs 2 of the formed layer 61, 62 with at least one connecting means 3 of each of the IECs 2 of the other one of the formed layers 61, 62.

[0115] As many layers 61, 62 as needed can be assembled. Additionally, layers 61, 62 can be assembled to sets of already formed layers 61, 62, and sets of already formed layers 61, 62 can be assembled with other sets of already formed layers 61, 62.

[0116] According to a second alternative, the assembly step consists in forming at least three separate, single-piece rows 71, 72, 73, 74 of IECs 2. Forming the rows 71, 72, 73, 74 consists in successively interlocking at least one coupling means 3 of one IEC 2 with at least one coupling means of another one of the IECs 2. Following the formation of the rows 71, 72, 73, 74, at least one single-piece layer 63, 64 of IECs 2 is formed. Forming the layer 63, 64 consists in combining the formed rows 71, 73 with another one of the formed rows 72, 74 by interlocking at least one coupling means 3 of each of the IECs 2 of the formed rows 71, 73 with at least one coupling means 3 of each of the IECs 2 of the other one of the formed rows 72, 74. Following the formation of the at least one single-piece layer 63, 64, at least one formed layer 63, 64 - according to a first alternative, assembled with other formed columns 71, 72 or 73, 74, or According to a second alternative, the other formed layers 64, 64 are assembled together one another.

[0117] Assembly of at least one formed layer 63, 64 with another formed row 71, 72 or 73, 74 or with another one of the formed layers 64, 63 involves connecting at least one connecting means 3 of each IEC 2 of at least one formed layer 63, 64 to - according to a first alternative, with at least one coupling means 3 of each of the IECs 2 of the other formed rows 71, 72 or 73, 74, or - according to a second alternative, at least one connecting means 3 for each of the other IECs 2 of the formed layers 64, 63; This is done by interlocking.

[0118] The two alternatives for the assembly steps can be combined and performed in parallel.

[0119] The step of forming and / or assembling the rows 71, 72, 73, 74 or layers 61, 62, 63, 64 of IECs 2 can be carried out wholly or partially over the base 8. The step of forming and assembling the rows 71, 72, 73, 74 or layers 61, 62, 63, 64 of IECs 2 over the base 8 consists in interlocking at least one coupling means 3 of each of the IECs 2 of the rows 71, 72, 73, 74, of the layers 61, 62, 63, 64 or of the layers 61, 62, 63, 64 with at least one reversible coupling means 82 of different receiving locations 81 of the base 8.

[0120] An advantage of the method for manufacturing the structure 1 and of the manufactured structure 1 or the structure 1 being manufactured is that it is possible to disassemble all or part of the IECs 2 constituting the manufactured structure 1 or the structure 1 being manufactured, all or part of the rows 71, 72, 73, 74 of IECs 2, or all or part of the stored IECs 2 or all or part of the layers 61, 62, 63, 64 of IECs 2 that do not span the base 8. It is therefore possible to separate or pull away the IEC 2 under consideration from one or more of the adjacent IECs 2 to which it is connected, by releasing one or more of the connecting means 3 of the IEC 2 under consideration that cooperate by interlocking with one or more connecting means 3 of the adjacent IECs 2 to which it is connected.

[0121] Of course, the invention is not limited to the examples described and many configurations can be made to these examples without departing from the scope of the invention.

[0122] Therefore, the variants can be combined together with the previously described embodiments. for each IEC2 considered, the IEC2 considered comprises electrical connection means 4 between the IEC2 considered and the IEC2 adjacent to the IEC2 considered, preferably at least three electrical connection means 4; one or more coupling means 3 of one IEC 2 form the electrical coupling means 4 of the IEC 2;

[0123] Furthermore, different features, forms, variations and embodiments of the invention can be associated with one another according to various combinations, to the extent that they are not mutually exclusive or incompatible with one another. [Explanation of symbols]

[0124] 1. Three-dimensional deformable structure 2 Individual basic components, IEC 3 Connecting means, coupling means, protrusions 4. Conductions, openings, and electrical connection means 5 Robot system, robot means, articulated arm 8. Base 9 Assembly / Disassembly Stations 21 Inert IEC 31 protrusion, protrusion, bead 32 Recesses, depressions, compartments 33 Cutting, Cutting Out 51 Coupling means 61, 62, 63, 64 layers Columns 71, 72, 73, 74 81 Acceptance location 82 Connection means 83 Storage area 111 Linear form 112 Non-linear forms, curved shapes 221 Active IEC 222 spatial regions, empty voxels 61, 62 IEC2 layer

Claims

1. A three-dimensional deformable structure (1) comprising a set of individual basic components (2), so-called IECs or voxels, which form a unitary assembly, the IECs comprising an active or inactive material, at least one portion of the set of IECs comprising at least three connecting means (3), each connecting means of the IEC under consideration being arranged to cooperate with at least one connecting means of an adjacent IEC to connect the IEC under consideration to an IEC adjacent to the IEC under consideration, and for at least one portion of the set of IECs, at least one of the connecting means of the IEC under consideration is positioned on an opposite side of at least one other of the connecting means of the IEC under consideration, and at least one portion of the set of IECs comprising so-called active IECs (221, 222) spatially arranged in the deformable structure such that at least one property of the deformable structure is changed in response to the application of at least one stimulus.

2. The three-dimensional deformable structure (1) according to claim 1, wherein at least one of said connecting means (3) is a coupling means.

3. The coupling means (3) at least one protrusion (31) or projection cooperating with a recess (32), depression or compartment; and / or a cutout (33) or notch cooperating with the cutout or notch, and / or a cutout or notch cooperating with at least one projection or protrusion; and / or At least one protrusion or projection cooperating with at least one surface of the IEC The three-dimensional deformable structure (1) according to claim 2, comprising:

4. 4. A three-dimensionally deformable structure (1) according to any one of claims 1 to 3, wherein each of the IECs (2) has four or more sides, at least three of the sides of each of the IECs of the at least one portion of the set of IECs have at least three connection means (3) each having at least one connection means, and the at least three sides of each of the IECs of the at least one portion of the set of IECs have at least three connection means each connected to a side of another one of the IECs of the deformable structure by at least one connection means.

5. Each of said IECs (2) further comprises at least three connection means (3), the connection means of each of the IECs under consideration being: a conduit (4) for the passage of a fluid from the IEC under consideration to the adjacent IEC or from the adjacent IEC to the IEC under consideration, or (4) an electrical connection between the IEC under consideration and the adjacent IEC; 5. A three-dimensionally deformable structure (1) according to any one of claims 1 to 4, arranged to cooperate with at least one means for connecting adjacent IECs to the IEC under consideration so as to form.

6. At least one stimulus is an electrical change and / or a temperature change and / or a mechanical force, stress or pressure and / or a change in a compound circulating in the deformable structure or in the concentration of a compound circulating in the deformable structure, 6. Three-dimensional deformable structure (1) according to claim 5, passing in the deformable structure via the connecting means (3).

7. 7. The three-dimensional deformable structure (1) according to any one of claims 1 to 6, wherein the at least one stimulus is an electric and / or electric field and / or magnetic field and / or temperature change and / or electromagnetic wave and / or mechanical force, or mechanical stress, or mechanical pressure and / or a change in a compound surrounding the deformable structure or in the concentration of a compound surrounding the deformable structure.

8. 8. A three-dimensional deformable structure (1) according to any one of claims 1 to 7, wherein the modification of at least one property of the deformable structure is a change in shape and / or volume and / or optical properties and / or mechanical properties and / or chemical properties and / or thermal conductivity and / or electrical conductivity.

9. 9. The three-dimensional deformable structure (1) according to any one of claims 1 to 8, wherein the IEC (2) comprises or consists of a polymer and / or a metal and / or a ceramic and / or a gel and / or a piezoelectric material and / or a shape memory material.

10. A method for manufacturing a single-piece three-dimensional deformable structure (1), comprising: - providing a set of individual basic components (2), so-called IECs, which comprise an active or inactive material, and at least one part of the IECs of the set of IECs comprises at least three connection means (3), and for at least one part of the IECs of the set of IECs, at least one of the connection means of the IEC under consideration is positioned on the opposite side of at least one other of the connection means of the IEC under consideration, and at least one part of the set of IECs comprises so-called active IECs (221, 222); assembling the set of IECs via a robotic system (5) by sequentially interlocking at least one means for connecting an IEC with at least one means for connecting another one of the IECs and spatially arranging the active IECs in the assembly such that at least one property of the three-dimensional deformable structure is altered in response to application of at least one stimulus; A method for providing the above.

11. The step of assembling the IECs of the set, the so-called assembly step, comprises: sequentially interlocking at least one means for connecting the IECs with at least one means for connecting another one of said IECs to form at least two separate, single-piece layers (61, 62) of IECs, and then combining the formed layer (61) with another one of the formed layers (62) by interlocking at least one connection means of each of the IECs of the formed layer with at least one connection means of each of the IECs of another one of the formed layers; or sequentially interlocking at least one means for connecting one IEC with at least one means for connecting another one of said IECs to form at least three separate, single-piece rows (71, 72, 73, 74) of IECs; and then combining the formed rows (71, 73) with another one of the formed rows (72, 74) by interlocking at least one connection means of each of the IECs in the formed row with at least one connection means of each of the IECs in another one of the formed rows to form at least one single layer (63, 64) of IECs; and thereafter combining the formed layer with the other formed rows or with another one of the formed layers (63) by interlocking at least one connection means of each of the IECs of the formed layer with at least one connection means of each of the IECs of each of the other formed rows or with at least one connection means of each of the IECs of another one of the formed layers (64), respectively; The method of claim 10, comprising:

12. 12. The method according to claim 11, comprising the step of forming and assembling a row (71, 72, 73, 74) or layer (61, 62, 63, 64) of IECs (2) over a base (8), the base comprising a set of receiving locations (81), each receiving location comprising at least one reversible coupling means (82) arranged to cooperate with at least one coupling means (3) of at least one IEC, and the step of forming and assembling the row or layer of IECs over the base consists in interlocking at least one coupling means of each of the IECs of the row or layer with at least one reversible coupling means of a different receiving location.

13. 13. The method of claim 12, comprising the step of temporarily storing the IECs (2) separately across the base (8) before or during assembly of the IECs for each row (71, 72, 73, 74) or layer (61, 62, 63, 64).

14. 14. The method according to any one of claims 10 to 13, comprising a step of handling and transporting the IEC (2) by the robotic system (5), said handling and transporting step further comprising continuously and reversibly coupling at least one coupling means (3) of the IEC with at least one reversible coupling means (51) of the robotic system.

15. 15. The method of claim 14, considered in combination with claim 11, comprising disassembling all or part of the IEC (2) consisting of the single-piece deformable structure (1) manufactured or being manufactured, or all or part of a row (71, 72, 73, 74) and / or layer (61, 62, 63, 64) of an IEC, by disengaging the one or more connecting means (3) of the IEC under consideration from the one or more connecting means of an adjacent IEC with which the one or more connecting means of the IEC under consideration cooperate by interlocking, thereby separating the IEC under consideration from one or more of the adjacent IECs to which the IEC under consideration is connected.

16. In the database, one or more individual IECs (2) having different spatial forms and / or comprising or consisting of different materials; and / or One or more subsets of IECs among the subsets of IECs having different spatial forms and / or comprising or consisting of different materials selecting determining, from said selected individual IECs and / or said selected subset, one or more arrangements of said selected individual IECs and / or said subset relative to one another in said deformable structure (1), such that application of said at least one stimulus results in modification of at least one property of said deformable structure; 16. The method of any one of claims 10 to 15, comprising:

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