Ultra-low loss hydrocarbon resin composition

Abstract

Ultra-low loss curable hydrocarbon resin compositions containing vinylbenzyl compounds, their preparation and their use for manufacturing articles for application in the electrical / electronic industry.

Description

[Technical Field]

[0001] The present invention relates to vinylbenzyl-based resin compositions, processes for their preparation, and their use in various applications, such as the production of prepregs, laminates for printed wiring boards, molding compounds, and adhesives.

[0002] The present invention relates to a resin composition that provides a cured product with high heat resistance, low water absorption, and excellent dielectric properties, which are desirable properties for organic insulating materials used in electronic devices such as communication devices. [Background technology]

[0003] With the development of wireless networks and satellite communications, electronic products tend to require faster, higher frequencies, and larger capacities for the transmission of voice, video, and data. Also, as these electronic products become thinner and smaller, electrical circuit boards tend to become more complex, denser, and multi-layered. To maintain high-speed transmission and signal integrity, printed circuit boards ("PCBs") require materials with low dielectric loss (also known as the loss factor or dissipation factor, Df), thereby resulting in reduced signal loss.

[0004] Polymer insulating materials are typically used as PCB substrate materials. PCB laminates are either made solely of polymer insulating materials or are obtained by blending polymer insulating materials with glass, fiber, nonwoven fabric, inorganic fillers, etc. Epoxy resins have traditionally been used due to their low cost and high heat and chemical resistance upon curing. However, their relatively high dielectric constant and high dielectric loss tangent make it difficult to achieve a low dissipation factor suitable for high-frequency signals. Polyphenylene ether (PPO) resins have also been used in laminates due to their lower dielectric constant and dissipation characteristics, but the use of high-frequency signals in new electronic fields requires even lower dielectric loss constants and dissipation factors. Fluororesins, typically represented by polytetrafluoroethylene (PTFE), have low dielectric constants and dissipation factors, but are thermoplastic resins and therefore undergo significant expansion and contraction during molding and processing, making them difficult to handle.

[0005] Other types of resins are known, but do not reach the low dielectric loss values ​​Df required in view of the requirements in high frequency signal transmission.

[0006] There is a need to provide curable polyvinylbenzyl compounds that are easily processable and have improved properties, particularly Df, thermomechanical properties, and moisture resistance. There is a need to improve high-speed signal transmission while reducing power and interference problems in electronics applications. This requires material compositions that have improved dielectric properties while ensuring the thermomechanical properties and simplified manufacturing required for the high-volume, sustainable production of printed circuit boards and antennas.

[0007] Patent Document 1 discloses a curable polyvinylbenzyl compound obtained by reacting a fluorene compound with a vinylbenzyl halide and a dihalomethyl compound. However, the disclosed composition is not completely satisfactory.

[0008] There remains a need for resin compositions that can be used in electronic devices and that provide a higher dissipation factor and / or a higher first G' onset and / or a higher decomposition temperature.

[0009] SUMMARY OF THE INVENTION It is an object of the present invention to overcome the above-mentioned drawbacks of prior art resin compositions. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] US2005 / 176909 Summary of the Invention

[0011] A first object of the present invention is a curable resin composition obtainable or obtainable by a process comprising at least the following steps: (i) mixing at least the following compounds (a), (b), and (c); and (ii) reacting the compound in the presence of an alkali; Including, (a) one or more indene compounds represented by the following general formula 1:

[0012] [ka] wherein each R1 is independently selected from a hydrogen atom, a halogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a thioalkoxy group having 1 to 5 carbon atoms, a thioaryloxy group having 6 to 14 carbon atoms, and an aryl group having 6 to 14 carbon atoms, and combinations thereof; (b) one or more biphenyl compounds represented by the following general formula 2:

[0013] [ka] During the ceremony, each X is independently selected from a halogen atom, tosylate, mesylate, triflate, and combinations thereof; each Q is independently selected from a hydrogen atom and a straight or branched C1-C6 alkyl group, and combinations thereof; and Each R2 is independently selected from a hydrogen atom, a linear or branched C1-C6 alkyl group, a halogen atom, and combinations thereof; (c) one or more vinylbenzyl compounds represented by the following general formula 3:

[0014] [ka] During the ceremony X' is selected from a halogen atom, tosylate, mesylate, triflate, and combinations thereof. The method described above is also an object of the present invention. Another object of the present invention is a curable resin composition comprising at least: (1) A compound having the following formula C1:

[0015] [ka] wherein each R1 is independently selected from a hydrogen atom, a halogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a thioalkoxy group having 1 to 5 carbon atoms, a thioaryloxy group having 6 to 14 carbon atoms, and an aryl group having 6 to 14 carbon atoms, and combinations thereof; and Each F is independently selected from a hydrogen atom and a vinylbenzyl group, and combinations thereof, provided that at least one F is a vinylbenzyl group:

[0016] [ka] (2) A compound having the following formula C2:

[0017] [ka] wherein each R1 is independently selected from a hydrogen atom, a halogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a thioalkoxy group having 1 to 5 carbon atoms, a thioaryloxy group having 6 to 14 carbon atoms, and an aryl group having 6 to 14 carbon atoms, and combinations thereof; and Each F2 is independently a hydrogen atom, a vinylbenzyl group,

[0018] [ka] or structures of formula F3, with the proviso that at least one of F2 is a structure of formula F3:

[0019] [ka] During the ceremony: n, p, and p' can independently range from 0 to 50, preferably from 0 to 10; each R1 is independently selected from a hydrogen atom, a halogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a thioalkoxy group having 1 to 5 carbon atoms, a thioaryloxy group having 6 to 14 carbon atoms, and an aryl group having 6 to 14 carbon atoms, and combinations thereof; each F'2 is independently selected from a hydrogen atom, a vinylbenzyl group, provided that at least one F2 or one F'2 is a vinylbenzyl group;

[0020] [ka] F4 is selected from divalent groups of formula F4 or a combination thereof:

[0021] [ka] During the ceremony: each Q is independently selected from a hydrogen atom and a straight or branched C1-C6 alkyl group, or a combination thereof; and Each R2 is independently selected from a hydrogen atom, a straight or branched C1-C6 alkyl group, a halogen atom, or a combination thereof.

[0022] The curable resin composition disclosed above, comprising at least the following: (1) a compound having formula C1, and (2) a compound having formula C2; Advantageously, the curable resin composition comprising at least the following steps: (i) mixing at least compounds (a), (b), and (c); and (ii) reacting the compound in the presence of an alkali; The method is obtained by the method disclosed above, which comprises:

[0023] However, the curable resin composition comprising at least one compound C1 and at least one compound C2 can also be obtained by other methods known to those skilled in the art, and is not limited to those obtained by the method disclosed above, one of which is to mix compound C1 and compound C2.

[0024] At a minimum, the following steps: (i) mixing at least compounds (a), (b), and (c); and (ii) reacting the compound in the presence of an alkali; makes it possible to obtain compositions that contain, in addition to the compound of formula C1 and the compound of formula C2, other compounds that are well known to those skilled in the art.

[0025] The present invention further relates to a process for manufacturing an article, the process comprising at least the following steps: -Step 1: preparing a curable resin composition according to the method disclosed above; or preparing a curable resin composition comprising at least a compound having formula C1 as disclosed above and a compound having formula C2 as disclosed above; The composition optionally comprises one or more additives, such as curing agents, curing accelerators, radical inhibitors, extenders, etc.; -Step 2: shaping the composition; -Step 3: Allowing the composition to cure. The invention also relates to the articles obtainable by said method. [Brief explanation of the drawings]

[0026] [Figure 1] 1 shows the H-NMR spectrum of Compound 1 in Example 1; [Figure 2] 1H-NMR spectrum of Compound 2 in Example 2: [Figure 3] 1H-NMR spectrum of Compound 3 in Example 3: [Figure 4] The H-NMR spectrum of compound 4 in Example 4 is shown below: [Figure 5] 1H-NMR spectrum of Compound 5 of Example 5; and [Figure 6] 1H-NMR spectrum of Compound 6 of Comparative Example 6 DETAILED DESCRIPTION OF THE INVENTION

[0027] General Description Throughout this specification, a reference to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described with respect to that embodiment is included in at least one embodiment of the present invention. That is, the appearances of the phrase "in one embodiment" or "an embodiment" in various places throughout this specification do not necessarily all refer to the same embodiment, but may, in some cases. Furthermore, particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments, as would be apparent to one of ordinary skill in the art from this disclosure. Furthermore, even if some embodiments described herein include some features but not other features included in other embodiments, combinations of features from different embodiments are intended to be within the scope of the present invention and form different embodiments, as would be understood by one of ordinary skill in the art. For example, in the appended claims, any of the claimed embodiments may be used in any combination.

[0028] As used herein, the singular forms "a," "an," and "the" include both singular and plural referents unless the context clearly dictates otherwise. By way of example, "a halogen" means one halogen atom or more than one halogen atom.

[0029] The terms "comprising," "comprises," and "comprised of," as used herein, are synonymous with "including," "includes," or "containing," and "contains," and are inclusive or open-ended, and do not exclude additional, unrecited members, elements, or method steps. It should be understood that the terms "comprising," "comprises," and "comprised of," as used herein, encompass the terms "consisting of," "consists," and "consists of." This preferably means that the above terms such as "comprising", "comprises", "comprised of", "containing", "contains" and "contained of" are interchangeable with "consisting", "consisting of" and "consists".

[0030] Throughout this application, the term "about" is used to indicate that a value includes the standard deviation of error for the device or method being employed to determine the value.

[0031] As used herein, the terms "wt %", "wt %, "weight percentage" or "percentage by weight" are used interchangeably.

[0032] The recitation of numerical ranges by endpoints includes all integers and, where appropriate, fractions subsumed within that range (e.g., 1 to 5, when referring to, e.g., numbers, can include 1, 2, 3, and 4; when referring to, e.g., measurements, can also include 1.5, 2, 2.75, and 3.80). The recitation of endpoints also includes the endpoint values ​​themselves (e.g., 1.0 to 5.0 includes both 1.0 and 5.0). Any numerical range recited herein is intended to include all subranges subsumed therein.

[0033] The term "CX-CY alkyl" refers to a straight or branched chain hydrocarbyl radical having from X to Y carbon atoms, and "substituted alkyl" refers to an alkyl further bearing one or more substituents selected from hydroxy, alkoxy, mercapto, cycloalkyl, heterocycle, aryl, heteroaryl, aryloxy, halogen, trifluoromethyl, cyano, nitro, nitrone, amino, amido, C(O)H, acyl, oxyacyl, carboxyl, carbamate, sulfonyl, sulfonamido, and sulfuryl.

[0034] The term "cycloalkyl" refers to a divalent ring-containing group having from 3 to 8 carbon atoms in the ring, and "substituted cycloalkyl" refers to a cycloalkyl further bearing one or more substituents selected from hydroxy, alkoxy, mercapto, cycloalkyl, heterocycle, aryl, heteroaryl, aryloxy, halogen, trifluoromethyl, cyano, nitro, nitrone, amino, amido, C(O)H, acyl, oxyacyl, carboxyl, carbamate, sulfonyl, sulfonamido, and sulfuryl.

[0035] The term "aryl" refers to a divalent aromatic group having 6 to 14 carbon atoms, and "substituted aryl" refers to an aryl further bearing one or more substituents selected from hydroxy, alkoxy, mercapto, cycloalkyl, heterocycle, aryl, heteroaryl, aryloxy, halogen, trifluoromethyl, cyano, nitro, nitrone, amino, amido, C(O)H, acyl, oxyacyl, carboxyl, carbamate, sulfonyl, sulfonamido, and sulfuryl.

[0036] The term "heteroaryl" refers to a divalent aromatic group having one or more heteroatoms (e.g., N, O, S, etc.) as part of the ring structure and having in the range of 3 to 14 carbon atoms, and "substituted aryl" refers to an arylene group further bearing one or more substituents selected from hydroxy, alkoxy, mercapto, cycloalkyl, heterocycle, aryl, heteroaryl, aryloxy, halogen, trifluoromethyl, cyano, nitro, nitrone, amino, amido, C(O)H, acyl, oxyacyl, carboxyl, carbamate, sulfonyl, sulfonamido, and sulfuryl.

[0037] The term "halogen" refers to an atom selected from Cl, Br, I.

[0038] The terms "dissipation factor (Df)" and "loss tangent" are synonymous as used herein and refer to the amount of energy dissipated into an insulating material (i.e., electrical loss) when a voltage is applied to a circuit. Df represents the signal loss in the circuit.

[0039] The terms "dielectric constant (Dk)" and "permittivity" as used herein are synonymous and refer to the relative capacitance of an insulating material to the capacitance of air or vacuum. The permittivity determines the speed of electronic signals.

[0040] All references cited herein are hereby incorporated by reference in their entirety. In particular, the teachings of all references herein that are specifically mentioned are incorporated by reference.

[0041] Unless otherwise defined, all terms used in disclosing the present invention, including technical and scientific terms, have the meanings commonly understood by one of ordinary skill in the art to which this invention belongs. Definitions of terms are included as a means of further guidance to provide a better understanding of the teachings of the present invention.

[0042] Throughout this application, different aspects of the invention are defined in more detail. Each aspect so defined can be combined with any other aspect(s), unless expressly stated to the contrary. In particular, any feature indicated as being preferred or advantageous can be combined with any other feature(s) indicated as being preferred or advantageous. While preferred embodiments of the invention have been disclosed for illustrative purposes, those skilled in the art will recognize that various modifications, additions, or substitutions can be made therein without departing from the scope and spirit of the invention as disclosed in the appended claims.

[0043] compound According to a preferred embodiment of the present invention, one or more indene compounds represented by the above general formula 1 are reacted with one or more dimethylbiphenyl compounds of formula 2 and one or more vinylbenzyl compounds of formula 3 in the presence of alkali to obtain a curable composition comprising at least compound C1 and at least compound C2. Optionally, a fluorene compound can be included in the reaction mixture. The reaction can be carried out according to known conditions for vinylbenzylation reactions. The vinylbenzylation reaction is described, for example, in US2005 / 0176909.

[0044] According to the present invention, in formula 1 representing the indene compound, and / or in compound C1, and / or in compound C2, the R1 group is located on the phenyl portion of the indene bicycle.

[0045] According to a preferred embodiment, in formula 1, which represents an indene compound, and / or in compound C1, and / or in compound C2: all R groups represent H, or one R1 group is a halogen atom, an alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms, and the other R1 groups represent H.

[0046] According to the most preferred embodiment, all R1 groups represent H and the compound of general formula 1 is an indene.

[0047] According to a preferred embodiment, in the general formula 2 representing a biphenyl compound, X is selected from a halogen atom, tosylate, mesylate, triflate, and a combination thereof, more preferably a halogen atom, advantageously Cl or Br. Preferably, all X are the same. Even more preferably, all X are Cl.

[0048] According to a preferred embodiment, in the general formula 2 representing a biphenyl compound, in formula F4, each Q is independently selected from H, CH, CH, and combinations thereof, more preferably each Q is independently selected from H, CH, and combinations thereof. Preferably, all Qs are the same. According to the most preferred embodiment, all Qs are H.

[0049] According to a preferred embodiment, in the general formula 2 representing a biphenyl compound, R2 is independently selected from H, CH3, and combinations thereof. Preferably, all R2 are the same. Preferably, all R2 are H.

[0050] According to a preferred embodiment, compound (b) of general formula 2 is 4,4'-bis(chloromethyl)biphenyl.

[0051] According to the most preferred embodiment, compound (b) of general formula 1 is indene and compound (b) of general formula 2 is 4,4'-bis(chloromethyl)biphenyl.

[0052] According to a preferred embodiment, in the general formula 3 representing a vinylbenzyl compound, X' is selected from Cl, Br, I, tosylate, mesylate, triflate, and combinations thereof, more preferably Br, Cl, and combinations thereof. The -CH2-X' group can be located at the ortho, meta, or para position of the aromatic ring, or can be a mixture of positional isomers.

[0053] According to the most preferred embodiment, the vinylbenzyl compound represented by general formula 3 is selected from the group comprising 2-vinylbenzyl chloride, 3-vinylbenzyl chloride, 4-vinylbenzyl chloride, 2-vinylbenzyl bromide, 3-vinylbenzyl bromide, 4-vinylbenzyl bromide, and mixtures thereof.

[0054] More preferably, the vinylbenzyl compound represented by general formula 3 is a mixture of 10 to 50% by weight of 2-vinylbenzyl chloride, 0 to 10% by weight of 3-vinylbenzyl chloride, and 50 to 80% by weight of 4-vinylbenzyl chloride.

[0055] More preferably, in compound C2, F'2 is a vinylbenzyl compound corresponding to a mixture of 10 to 50% by weight of 2-vinylbenzyl substituents, 0 to 10% by weight of 3-vinylbenzyl substituents, and 50 to 80% by weight of 4-vinylbenzyl substituents.

[0056] Preferably, in compound C2, each F3 independently verifies that n+p is in the range of 0-50, preferably 0-10.

[0057] Preferably, in compound C2, each F2 is independently selected from a hydrogen atom, a vinylbenzyl group, or a structure of formula F3 where p=0. In the method according to the present invention, the molar ratio of the indene compound of formula 1 to the dimethylbiphenyl compound of formula 2 is selected so that gelation, i.e., precipitation, is not caused by the dimethylbiphenyl compound of formula 2. If the amount of the vinylbenzyl compound of formula 3 is too small, the curability deteriorates, and the physical properties of the cured product, such as heat resistance, deteriorate.

[0058] When all halomethyl (preferably chloromethyl) groups are present, the preferred molar ratio of such groups in compounds (b) and (c) to reactive sites in compound (a) is 0.95 or less. A "halomethyl group" (also known as a "halogenated methyl radical") in this context means a methyl group substituted with one halogen atom, such that in the case of formula 2, Q = H and X = halogen, and in the case of formula 3, X' = halogen. A "reactive site" in this context designates the carbon atom bearing the acidic hydrogen in the five-membered indene ring, which can be dehydrogenated by the alkali used in step (ii).

[0059] The molar ratio of the indene compound of formula 1 to the dimethylbiphenyl compound of formula 2 is preferably in the range of 1.8 / 1 to 3 / 1.

[0060] The molar ratio of the indene compound of formula 1 to the vinylbenzyl compound of formula 3 is preferably in the range of 1 / 1 to 1 / 2, preferably 1 / 1.75, most preferably 1 / 1.5. To achieve optimal results, preferably at least two, and most preferably all, of the above conditions regarding the ratio of compounds should be met.

[0061] reaction The reaction (ii) of compounds (a), (b) and (c) in the presence of an alkali is advantageously carried out under the following conditions: Advantageously, the reaction is carried out in a solvent. Suitable reaction solvents include nonpolar solvents such as toluene, xylene, etc., or aprotic polar solvents such as dimethylformamide, dimethyl sulfoxide, dimethylacetamide, N-methylpyrrolidone, dioxane, acetonitrile, tetrahydrofuran, ethylene glycol dimethyl ether, 1,3-dimethoxypropane, 1,2-dimethoxypropane, tetramethylene sulfone, hexamethylphosphamide, methyl ethyl ketone, methyl isobutyl ketone, acetone, cyclohexanone, etc., and mixtures thereof, preferably toluene, xylene, methyl ethyl ketone, and mixtures thereof. The solvent can be selected from this list according to the type of raw materials and reaction conditions so that the reaction mixture is completely dissolved in the solvent.

[0062] Examples of alkalis that can be used in the present invention include alkali metal or alkaline earth metal alkoxides, hydrides, hydroxides, and combinations thereof, such as sodium hydroxide, sodium methoxide, sodium ethoxide, sodium hydride, sodium borohydride, potassium hydride, and potassium hydroxide. The alkali is introduced into the reaction mixture as an aqueous solution.

[0063] The amount of alkali is preferably 1 to 3 equivalents based on the sum of the X and X' groups in the compound of formula 2 and the compound of formula 3 introduced into the reaction mixture. If this amount is less than 1 equivalent, the reaction rate becomes too low and the reaction does not proceed to completion, which is detrimental to the physical properties of the cured product. If the amount of alkali exceeds 3 equivalents, the conditions for removing the residual alkali, such as washing, become more cumbersome and expensive.

[0064] Preferably, an onium salt catalyst is introduced into the reactant mixture of step (i). Advantageously, the onium salt catalyst is selected from the list comprising tetra-n-butylammonium bromide, tetra-n-butylammonium chloride, tetra-n-butylammonium hydrogen sulfate, benzyltrimethylammonium chloride, and tricaprylmethylammonium chloride, tetra-n-butylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium chloride, tetraphenylphosphonium bromide, benzyltetramethylenesulfonium bromide, and mixtures thereof.

[0065] The reaction temperature and reaction time can be varied depending on the type of raw material compounds and the expected physical properties of the curable composition. Generally, the temperature of the reaction mixture can be between 30°C and 100°C. If the reaction temperature is too high or otherwise unsuitable, reactions such as thermal polymerization may occur. If the reaction temperature is too low, the reaction proceeds slowly, which is not advantageous from an industrial and economic standpoint. Generally, the reaction time can be between 0.5 hours and 20 hours.

[0066] Curable resin composition In this section, percentages are expressed based on the weight of compounds C1 and C2 relative to the total weight of resin, which may include other products resulting from the reaction of compounds (a), (b), and (c), but excluding optional additives detailed hereinafter.

[0067] Advantageously, the amount of one or more compounds C1 in the resin composition ranges from 1 to 50% by weight, based on the total weight of the resin composition.

[0068] Advantageously, the amount of one or more compounds C2 in the resin composition ranges from 50 to 99% by weight, based on the total weight of the resin composition.

[0069] The following properties of the resin composition according to the invention relate to the mixture of C1 and C2 or to the product obtained from the process disclosed above.

[0070] Advantageously, the resin composition according to the invention has a weight average molecular weight Mw=500 g / mol to 10000 g / mol, more preferably in the range of 500 to 5000 g / mol, measured by GPC according to method ISO 13885-1:2020.

[0071] Advantageously, the resin composition according to the invention has a polydispersity ranging from 2.01 to 5, more preferably from 2.01 to 3, measured by GPC according to method ISO 13885-1:2020.

[0072] Additional ingredients Before curing, the curable resin composition can be mixed with various additives selected according to the intended use and expected properties. Such additives are described in detail hereinafter in a non-limiting manner. In this section, percentages are expressed based on the weight of the additional compound relative to the total weight of the additive-containing resin composition. The amounts stated are in addition to the mixture of C1 and C2 and / or in addition to the compound resulting from the reaction of compounds (a), (b), and (c).

[0073] The use of a co-curing agent in the resin composition can lower the curing temperature or accelerate the curing reaction. According to a preferred embodiment, the composition of the present invention comprises at least a co-curing agent, which can be selected from, for example, polyphenylene ether derivatives, maleimide, bismaleimide, styrene, divinylbenzene, trivinylcyclohexane, trialkenyl isocyanurate compounds such as triallyl isocyanurate (TAIC), and mixtures thereof.

[0074] Polyphenylene ether derivatives are commercially available, examples include Noryl™ SA9000 resin (manufactured by Sabic), and OPE-2St 1200 and OPE-2St 2200 (manufactured by Mitsubishi Gas Chemical Company, Inc.).

[0075] The amount of co-curing agent used is adjusted depending on the type and content of unsaturated groups contained in the curable resin composition, the selection of the specific co-curing agent, its half-life temperature, and the required stability. In one embodiment, the composition of the present invention can contain the co-curing agent or mixture thereof in an amount ranging from about 1% to about 90% by weight, or from about 5% to about 50% by weight, based on the total weight of the additive-containing composition.

[0076] Although the resin composition of the present disclosure can be cured simply by heating, a curing catalyst that generates a cationic species or a free radical species can be added to improve curing efficiency. Examples of such curing catalysts include diaryliodonium salts, triarylsulfonium salts, and aliphatic sulfonium salts (which have BF4, PF6, AsF6, or SbF6 as a counter anion), benzoin-type compounds such as benzoin and benzoinmethyl, acetophenone-type compounds such as acetophenone and 2,2-dimethoxy-2-phenylacetophenone, thioxanthone-type compounds such as thioxanthone and 2,4-diethylthioxanthone, and bisazide compounds such as Examples of suitable peroxides include, but are not limited to, 4,4'-diazidochalcone, 2,6-bis(4-azidobenzal)cyclohexanone, and 4,4'-diazidobenzophenone; azo compounds such as azobisisobutyronitrile, 2,2-azobispropane, and 2,2'-azobis(2,4,4-trimethylpentane); and organic peroxides such as 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, 2,5-dimethyl-2,5-di(t-butylperoxy)hexyne-3, and dicumyl peroxide.

[0077] The compositions of the present invention may contain the cure catalyst in an amount of about 0.1 wt % to 10 wt %, or about 0.3 wt % to 7 wt %, or about 0.5 wt % to 5 wt %, or about 1 wt % to 3 wt %, where the wt % is based on the total weight of the additive-containing composition.

[0078] In another embodiment, a polymerization inhibitor can be optionally added to the composition to improve storage stability. Examples include quinone, phenol, catechol, phenothiazine, (2,2,6,6-tetramethylpiperidin-1-yl)oxyl, and hydroxylamine, as well as their corresponding salts, such as hydroquinone, p-benzoquinone, 2,6-di-tert-butyl-4-methylphenol, phenothiazine, (2,2,6,6-tetramethylpiperidin-1-yl)oxyl, and 4-t-butylpyrocatechol. If present, the composition can contain about 0.0005% to 5% by weight of the polymerization inhibitor, where the weight percentage is based on the total weight of the additive-containing composition.

[0079] In particularly preferred embodiments, the resin composition may optionally include an inorganic filler, an organic filler, or a mixture thereof. The fillers contemplated for use in the practice of the present disclosure may be in any of a variety of forms, such as angular, platelet-like, spherical, amorphous, sintered, calcined, powder, flake, crystalline, crushed, pulverized, ground, or the like, or a mixture of any two or more thereof. Presently preferred particulate fillers contemplated for use herein are substantially spherical.

[0080] Such fillers can optionally be thermally conductive. Both powder and flake fillers can be used in the resin compositions of the present disclosure. Fillers having a wide range of particle sizes can also be employed in the practice of the present disclosure.

[0081] Particle sizes ranging from about 500 nm up to about 300 microns are acceptable, with particle sizes less than about 100 microns being preferred, and particle sizes ranging from about 5 up to about 75 microns being particularly preferred.

[0082] A wide variety of fillers can be employed in the practice of the present disclosure, including, for example, soft fillers (e.g., uncalcined talc), natural minerals (e.g., aluminum nitride, boron nitride, silicon carbide, diamond, graphite, beryllium oxide, magnesia, silica, alumina, aluminum silicate, etc.), calcined natural minerals (e.g., enstatite), synthetic fused minerals (e.g., cordierite), treated fillers (e.g., silane-treated minerals), organic polymers (e.g., polytetrafluoroethylene), hollow spheres, microspheres, powdered polymeric materials, and the like.

[0083] Examples of extenders include talc, mica, calcium carbonate, calcium sulfate, aluminum nitride, boron nitride, silicon carbide, diamond, graphite, beryllium oxide, magnesia, silica, alumina, TiO2, aluminum silicate, aluminum zirconium silicate, cordierite, silane-treated minerals, polytetrafluoroethylene, polyphenylene sulfide, and the like.

[0084] Thermally conductive fillers contemplated for optional use in the practice of the present disclosure include, for example, aluminum nitride, boron nitride, silicon carbide, diamond, graphite, beryllium oxide, magnesia, silica, alumina, zirconium silicate, and the like. Preferably, the particle size of such fillers will be about 20 microns. When aluminum nitride is used as the filler, it is preferably passivated with an adherent conformal coating (e.g., silica, etc.).

[0085] Preferably, the extender is a silanized extender, more preferably a silanized amorphous silica. When an extender is present, the additive-containing resin composition can contain up to about 75 wt. %, or up to about 50 wt. %, or up to about 25 wt. %, or up to about 10 wt. % of the extender, where the wt. % is based on the total weight of the additive-containing composition.

[0086] The resin compositions of the present disclosure may optionally contain one or more additives, such as, for example, flexibilizers, antioxidants, dyes, pigments, surfactants, defoamers, silane coupling agents, dispersants, thixotropic agents, processing aids, flow control agents, cure accelerators, strengthening agents, toughening agents, UV protectants (particularly UV-blocking dyes suitable for enabling automated optical inspection (AOI) of circuits), flame retardants, and the like, as well as mixtures of any two or more thereof.

[0087] Flexibility agents (also called plasticizers) contemplated for use in certain embodiments of the present invention include compounds that reduce the brittleness of the formulation, such as branched polyalkanes or polysiloxanes, which lower the glass transition temperature of the composition. Examples of such plasticizers include polyethers, polyesters, polythiols, polysulfides, polybutadienes, styrenic block copolymers, and polybutadiene-polystyrene copolymers, such as those sold under the tradenames Poly BD® and RICON®. Plasticizers, when employed, are typically present in a range of from about 0.5% up to about 30% by weight of the additive-containing composition.

[0088] Antioxidants contemplated for use in the practice of the present invention include hindered phenols (e.g., BHT (butylated hydroxytoluene), BHA (butylated hydroxyanisole), TBHQ (tert-butylhydroquinone), 2,2′-methylenebis(6-tert-butyl-p-cresol), etc.), hindered amines (e.g., diphenylamine, N,N′-bis(1,4-dimethylpentyl-p-phenylenediamine, N-(4-anilinophenyl)methacrylamide, 4,4′-bis(α,α-dimethylbenzyl)diphenylamine, etc.), phosphorous compounds, etc. If used, the amount of antioxidant will typically range from about 100 up to 2000 ppm by weight of the additive-containing composition.

[0089] Dyes contemplated for use in certain embodiments of the present disclosure include nigrosine, Orasol Blue GN, phthalocyanines, fluorescent dyes (e.g., Fluoral Green Gold dye, etc.), etc. When used, relatively small amounts of organic dyes (i.e., less than about 0.2% by weight based on the weight of the additive-containing composition) provide contrast.

[0090] Pigments contemplated for use in certain embodiments of the present disclosure include any particulate material added for the sole purpose of imparting color to a formulation, such as carbon black, metal oxides (e.g., Fe2O3, titanium oxide), and the like.

[0091] When present, pigments are typically present in a range of from about 0.5% up to about 5% by weight based on the weight of the additive-containing composition.

[0092] Toughening agents contemplated for use in the practice of the present disclosure are materials that impart improved impact resistance to various articles. Examples of toughening agents include synthetic rubber-containing compounds such as Hypro, Hypox, and the like.

[0093] UV protectants contemplated for use in certain embodiments of the present invention include compounds that absorb incident ultraviolet (UV) radiation, thereby reducing the negative effects of such exposure on the resin or polymer system to which they are added. Examples of UV protectants include bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacinate, silicon, powdered metal compounds, hindered amines (known in the art as "HALS"), and the like.

[0094] Antifoaming agents contemplated for use in certain embodiments of the present invention include materials that inhibit the formation of foam or bubbles when the solution is shaken or sheared during processing. Examples of antifoaming agents contemplated for use herein include n-butyl alcohol, silicon-containing antifoaming agents, and the like.

[0095] Examples of silane coupling agents contemplated for use in the practice of the present invention include materials that form crosslinks between the inorganic surface and the reactive polymer component, including epoxy silanes, amino silanes, and the like materials.

[0096] Examples of thixotropic agents contemplated for use in the practice of the present invention include materials that cause a liquid to change in properties such that it has improved flowability when shear is applied to the liquid, including materials such as high surface area bulking agents (e.g., fumed silica) having particle sizes in the range of about 2-3 microns, or even submicron diameters.

[0097] hardening After preparing a curable resin composition, for example, by carrying out a process comprising mixing compounds (a), (b), and (c) and reacting them in the presence of an alkali, or by mixing one or more compounds C1 and one or more compounds C2, or by any other process, the resin is separated from the reaction medium. The resulting resin can be used in a variety of applications. In particular, the resin can be used as is or mixed with one or more additives, such as those described above by way of example, and then cured to obtain a cured article.

[0098] The resin composition of the present disclosure can be prepared by appropriately mixing the components described above, i.e., the C1 / C2 mixture or the product obtained from the reaction of compounds (a), (b), and (c), with the additives disclosed above (co-curing agent, extender, antioxidant, catalyst, etc.), and, if necessary, kneading or mixing by kneading or stirring means. Examples of kneading means include a three-roll mill, a ball mill, a bead mill, or a sand mill, and examples of stirring means include a high-speed rotary mixer, a super mixer, or a planetary mixer.

[0099] In another embodiment, the composition can be dissolved or dispersed in an organic solvent to form a resin composition varnish, which can then be cured. The amount of solvent is not limited, but is typically used in an amount sufficient to achieve a solids concentration in the solvent of at least 30% to 90% by weight, or about 50% to 85% by weight, or about 55% to 75% by weight.

[0100] The organic solvent is not specifically limited, and may be a ketone, an aromatic hydrocarbon, an ester, an amide, an alcohol, etc. More specifically, examples of usable organic solvents include acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, toluene, xylene, methoxyethyl acetate, ethoxyethyl acetate, butoxyethyl acetate, ethyl acetate, N-methylpyrrolidone formamide, N-methylformamide, N,N-dimethylacetamide, methanol, ethanol, ethylene glycol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol, propylene glycol monomethyl ether, dipropylene glycol monoethyl ether, propylene glycol monopropyl ether, dipropylene glycol monopropyl ether, and mixtures thereof.

[0101] The curable resin composition of the present invention can be cured by a known method, for example, by heat, light, or electron beam.

[0102] When the resin is cured by heat, the curing temperature varies depending on the type of polymerizable unsaturated group and the type and amount of curing agent used. Generally, the curing temperature is in the range of 20°C to 250°C, preferably 50°C to 250°C.

[0103] Purpose According to yet another embodiment of the present disclosure, an article is provided having a partially or fully cured layer of the above composition, preferably in association with a substrate.

[0104] The cured article can be suitably used as an organic insulating material for use in electronic devices such as communication devices, particularly for the manufacture of high frequency laminates.

[0105] It has been discovered that by using the present compositions of the present invention, it is possible to achieve ultra-low dissipation factors Df in the gigahertz range (e.g., 1-10 GHz, well below 0.00179 at 10 GHz), which is unexpected in view of the prior art.

[0106] Specifically, the curable resin compositions of the present invention, upon curing, result in articles having a dielectric loss tangent (Df) of less than 0.00100 as measured by a split post dielectric resonator (SPDR) at a frequency of 10 GHz. It is noted that characterization of the dielectric loss tangent of organic films by SPDR is subject to uncertainties of up to 10%, typically to four decimal places. Furthermore, it is known in the art that reducing the dissipation factor of hydrocarbon materials below 0.00100 can be challenging due to defects typically introduced into the polymer structure.

[0107] According to preferred embodiments, the compositions of the present disclosure are cured to produce articles having a dielectric constant (Dk) at 10 GHz of less than about 3, or less than about 2.9, or less than about 2.8.

[0108] The selection of the biphenyl compound of formula 2 and / or the biphenyl radical of formula F4 provides special benefits to the composition. This ultra-low loss resin can be used to manufacture copper clad laminates (CCLs), which can also be used to manufacture printed circuit boards (PCBs). PCBs obtained from the resin composition of the present invention demonstrate improvements over existing material solutions, particularly with regard to processing, dielectric properties, thermomechanical properties, and reduced water sensitivity. The composition of the present invention provides key final properties for PCBs. The composition of the present invention makes it possible to provide resins exhibiting higher thermomechanical properties and higher moisture resistance. Benefits attributable to the composition of the present invention also relate to higher thermal decomposition temperatures (Td2 / Td5), higher thermal properties (G' onset), and lower loss (dissipation) factors (Df).

[0109] The present invention relates to a method for making an article, said method comprising at least the steps of preparing a curable resin composition, molding the composition, and curing the composition.

[0110] In the context of the present invention, the preparation of a curable resin composition comprises the steps of: preparing a curable resin composition according to the method disclosed above; or preparing a curable resin composition comprising at least a compound having formula C1 as disclosed above and a compound having formula C2 as disclosed above; wherein the composition optionally includes one or more additives such as, for example, catalytic curing agents, crosslinking curing agents, cure accelerators, radical inhibitors, extenders, and the like.

[0111] Shaping involves structuring the composition by giving it a predicted shape and / or assembling it with another material, for example a support material, also designated as a substrate or support article. Shaping can include dissolving the resin composition in a solvent.

[0112] Hereinafter, several variants of the method for producing the article according to the invention are described in detail: The present invention further relates to a process for manufacturing an article, for example a high frequency laminate, comprising at least the following steps: Step 1: preparing a curable resin composition; Step 2: dissolving the curable resin composition of step 1 in a solvent to form a varnish and applying the varnish to a support article; Step 3: Curing the composition.

[0113] Applying the varnish to the support article can be done by any method known to those skilled in the art, such as brushing the curable resin composition onto the support article, spraying the curable resin composition onto the support article, spin-coating the curable resin composition onto the support article, etc.

[0114] The present invention further relates to a process for the manufacture of an article, in particular a high frequency laminate, comprising at least the following steps: Step 1: preparing a curable resin composition; - step 2: impregnating a support material, in particular a fibrous material, with the composition of step 1; Step 3: Curing the composition.

[0115] Impregnation of the textile material with the curable resin composition can be carried out by any method known to those skilled in the art, such as immersing the textile material in a solution of the curable resin composition, spraying the textile material with the curable resin composition, spin-coating the textile material with the curable resin composition, etc. Such methods may require dissolving the curable resin composition in a solvent to form a varnish.

[0116] The present invention further relates to a process for manufacturing an article, said process comprising at least the following steps: Step 1: preparing a curable resin composition; - step 2: introducing the composition of step 1 into a mold, Step 3: Curing the composition.

[0117] The present invention also relates to an article obtainable by a process comprising at least a curing step of a composition according to the invention.

[0118] The compositions of the present invention make it possible to provide products that can be used in a variety of applications, such as prepregs, metal clad laminates (eg, copper clad laminates), printed circuit boards, light emitting diodes, and electronic coatings.

[0119] In particular, the present invention relates to a prepreg obtainable by impregnating a fibrous material with a curable resin composition according to the present invention and curing said resin.

[0120] The present invention also provides a laminate sheet usable as a high frequency laminate, said laminate sheet comprising a prepreg as defined above and a layer of conductive material disposed on at least one surface of the prepreg.

[0121] The present invention also relates to a printed wiring board produced by forming a conductor pattern on the surface of a laminate sheet as defined hereinabove.

[0122] As one skilled in the art will readily recognize, a variety of fibrous materials are suitable as substrates / support articles for use in practicing the present disclosure, including, for example, polyesters, liquid crystal polymers, polyamides (e.g., aramids), polyimides, polyamideimides, polyolefins, polyphenylene oxides, polyphenylene sulfides, polybenzoxazines, conductive materials (e.g., conductive metals), and the like, as well as combinations of any two or more thereof.

[0123] When a conductive metal substrate is employed as the support article, materials such as silver, nickel, gold, cobalt, copper, aluminum, alloys of such metals, and the like are contemplated for use herein.

[0124] According to yet another embodiment of the present disclosure, there is provided a method of making the above-described article (i.e., an article comprising a composition according to the present disclosure on a substrate / support article), said method comprising applying a resin composition to a substrate and, if an organic solvent is optionally employed to facilitate such application, removing substantially all of the organic solvent therefrom. The resin composition can be applied to the substrate by dipping, impregnation, spraying, etc.

[0125] According to yet another embodiment of the present disclosure, there is provided a prepreg made by impregnating a porous substrate with a composition according to the present disclosure, and, if an organic solvent is optionally employed to facilitate such impregnation, subjecting the resulting impregnated substrate to conditions suitable to remove substantially all of the organic solvent therefrom.

[0126] As those skilled in the art will readily recognize, various porous substrates can be used to prepare the prepregs of the present invention. The porous substrate can be a woven or nonwoven fabric. The thickness of such a substrate is not particularly limited and can range, for example, from about 0.01 mm to 0.3 mm.

[0127] Examples of porous substrates include, but are not limited to, woven glass fabric, nonwoven glass fabric, woven aramid fiber fabric, nonwoven aramid fiber fabric, woven liquid crystal polymer fiber fabric, nonwoven liquid crystal polymer fiber fabric, woven synthetic polymer fiber fabric, nonwoven synthetic polymer fiber fabric, randomly dispersed fiber reinforcement, expanded polytetrafluoroethylene (PTFE) structure, and combinations of any two or more of these.

[0128] Specifically, materials contemplated for use as porous substrates include, but are not limited to, glass fibers, quartz, polyester fibers, polyamide fibers, polyphenylene sulfide fibers, polyetherimide fibers, cyclic olefin copolymer fibers, polyalkylene fibers, liquid crystal polymers, poly(p-phenylene-2,6-benzobisoxazole), copolymers of polytetrafluoroethylene and perfluoromethylvinylether (MFA), and combinations of any two or more thereof.

[0129] According to yet another embodiment of the present disclosure, there is provided a laminated sheet manufactured by stacking and molding a predetermined number of sheets of the above prepreg.

[0130] Laminate sheets according to the present disclosure have many particularly beneficial properties, such as low dielectric constants, low dissipation factors, high thermal decomposition temperatures, etc. In preferred embodiments, laminate sheets according to the present disclosure have a dielectric constant nominally ≦3.0, a dissipation factor ≦0.002 at 10 GHz, and a glass transition temperature of at least 100° C. or at least 150° C.

[0131] In one aspect of the present disclosure, the laminate sheet as described herein can optionally further comprise one or more conductive layers. Such optional conductive layers are selected from the group consisting of metal foils, metal plates, conductive polymer layers, etc. In one embodiment, the metal can be copper, silver, nickel, gold, cobalt, aluminum, and alloys of such metals.

[0132] In another embodiment, a method for forming a laminate sheet is provided. The method includes contacting a porous substrate with a varnish bath containing a resin composition of the present disclosure dissolved in a solvent or solvent mixture and thoroughly mixed. The contacting is performed under conditions such that the porous substrate is coated with the resin composition. The coated porous substrate is then passed through a heated zone at a temperature sufficient to cause evaporation of the solvent but below a temperature at which the resin composition undergoes significant curing during the residence time in the heated zone to form a prepreg.

[0133] The porous substrate preferably has a residence time in the bath of 1 to 300 seconds, more preferably 1 to 120 seconds, and most preferably 1 to 30 seconds. The temperature of such a bath is preferably 0°C to 100°C, more preferably 10 to 40°C, and most preferably 15 to 30°C. The residence time of the coated porous substrate in the heating zone is 0.1 to 15 minutes, more preferably 0.5 to 10 minutes, and most preferably 1 to 5 minutes.

[0134] The temperature in such zones is sufficient to evaporate any remaining solvent, but not so high as to result in complete curing of the composition during the residence time. Suitable temperatures in such zones are between 80°C and 250°C, more preferably between 100°C and 225°C, and most preferably between 150°C and 210°C. Preferably, there is a means for removing the solvent in the heated zone, either by passing an inert gas through the oven or by applying a slight vacuum to the oven. In many embodiments, the coated substrate is exposed to zones of increasing temperature. The first zone is designed to cause solvent evaporation, thereby removing the solvent. Subsequent zones are designed to result in partial curing (B-staging) of the resin composition.

[0135] One or more sheets of prepreg are preferably processed into a laminate, optionally with one or more sheets of conductive material, such as copper. In such further processing, one or more sections or portions of the coated porous substrate are contacted with each other and / or with the conductive material. The contacted portions are then subjected to high pressure and temperature sufficient to cause the components to cure, during which the resin in adjacent portions reacts to form a continuous resin matrix between the porous substrates. Prior to curing, these portions can be cut and stacked or folded and stacked to form sections of the desired shape and thickness. Pressures can range anywhere from 1 psi to 1000 psi, with 10 psi to 800 psi being preferred. The temperature used to cure the resin composition of the sections or laminates depends on the specific residence time, pressure, and components used. Suitable temperatures that can be used are 100°C to 250°C, more preferably 120°C to 220°C, and most preferably 170°C to 200°C. The residence time is preferably 10 to 120 minutes, more preferably 20 to 90 minutes.

[0136] In one embodiment, the process is a continuous process, in which the porous substrate is removed from the oven, properly positioned into the desired shape and thickness, and pressed at a very high temperature for a short period of time. Specifically, such high temperature is 180°C to 250°C, more preferably 190°C to 210°C, for a period of 1 minute to 10 minutes, and more preferably 2 minutes to 5 minutes. Such high-speed pressing allows for more efficient utilization of processing equipment. In such an embodiment, the preferred reinforcing material is a glass web or woven fabric.

[0137] In some embodiments, it may be desirable to subject the laminate or final product to a post-cure outside of the press. This step is designed to complete the curing reaction. Post-cure is typically performed at temperatures between 130°C and 220°C for a period of 20 minutes to 200 minutes. This post-cure step can be performed under vacuum to remove any volatilizable components.

[0138] That is, according to yet another embodiment of the present disclosure, there is provided a method for making a laminate sheet, said method comprising stacking and molding a predetermined number of sheets of prepreg according to the present disclosure.

[0139] According to a further embodiment of the present disclosure, there is provided a printed wiring board manufactured by forming a conductor pattern on the surface of the above-mentioned laminate sheet(s). The conductor pattern can be formed, for example, by forming a resist pattern on the surface of the laminate sheet(s), removing unnecessary portions of the sheet by etching, removing the resist pattern, forming necessary through-holes by drilling, forming a resist pattern again, connecting the through-holes by plating, and finally removing the resist pattern.

[0140] In accordance with still further embodiments of the present disclosure, there is provided a multilayer printed wiring board manufactured by stacking and molding a predetermined number of sheets of the above-described patterned laminate layer bonded together with one or more layers of prepreg from which the printed wiring board layers were prepared.

[0141] In accordance with yet a further embodiment of the present invention, there is provided a method of making a printed wiring board, said method comprising forming a conductor pattern on a surface of a laminate sheet according to the present disclosure.

[0142] According to yet another embodiment of the present disclosure, a multilayer printed wiring board is provided by obtaining a printed wiring board for an internal layer by stacking and molding a predetermined number of sheets of the above prepreg, and laminating the prepreg on the printed wiring board for an internal layer on which a conductor pattern is formed on the surface.

[0143] Therefore, the prepreg and printed wiring board of the present disclosure may be effectively utilized as components of network printed circuit boards used in various electronic and electrical devices such as mobile communication devices that handle high-frequency signals of GHz or more, or their base station devices, as well as in network-related electrical devices such as servers and routers, and large-scale computers.

[0144] The present disclosure will now be further described with reference to the following non-limiting examples. [Example]

[0145] Materials and Methods Tetrabutylammonium bromide (99+%). Supplier: Thermo Fisher Scientific, Belgium. Vinylbenzyl chloride (mixture of o / m / p-isomers). Supplier: AK Scientific, Inc., USA. Indene (90%, technical grade, stabilized). Supplier: Thermo Fisher Scientific, Belgium. 4,4'-Bis(chloromethyl)biphenyl (>95%). Supplier: Tokio Chemical Industry, Belgium. α,α'-Dichloro-p-xylene (98%). Supplier: Merck KGaA, Germany.

[0146] TGA stands for thermogravimetric analysis and conforms to ISO 11358.

[0147] DMA stands for dynamic mechanical analysis, according to ISO 6721.

[0148] GPC stands for gel permeation chromatography.

[0149] 1H-NMR: 1H-Nuclear Magnetic Resonance Spectroscopy.

[0150] G' Onset: The storage modulus G' is a measure of the elastic behavior of a sample. G' onset refers to the temperature at which the cured resin undergoes a change from a glassy state to a softer, more rubbery state.

[0151] Td2 / Td5: Td2 is the temperature at which the weight loss of the sample reaches 2%. Td5 is the temperature at which the weight loss of the sample reaches 5%.

[0152] Examples 1-5 - In accordance with the present invention Example 1 A 1.5-liter reaction flask equipped with a mechanical stirrer, condenser, and addition funnel was charged with 500 mL of toluene at an internal temperature of 40°C. 32.8 g (0.131 mol) of 4,4'-bis(chloromethyl)biphenyl, 25.0 g (0.209 mol) of indene, 3.4 g (0.010 mol) of tetrabutylammonium bromide, and 41.1 g (0.269 mol) of vinylbenzyl chloride were dissolved in the flask with continuous stirring to prepare a homogeneous solution. 140 mL (2.610 mol) of a 50 wt% aqueous solution of NaOH was added dropwise over 30 minutes. After the addition was complete, the internal temperature was raised to 50°C by external heating. After 9 hours of reaction time, the mixture was diluted with water and the two layers were separated. The toluene was removed by distillation to give Example 1 (69.7 g, 88% yield) as a yellow solid.

[0153] The obtained compound 1 of Example 1 was identified from its H-NMR spectrum (FIG. 1) and GPC measurement. GPC showed that the weight average molecular weight Mw was 2886 g / mol and the polydispersity was 2.8. The molar ratio of total chloromethyl groups to reactive sites of indene was 0.85.

[0154] Example 2 The same synthetic procedure as in Example 1 was used, except that a different molar ratio was used between indene (1 molar equivalent), 4,4'-bis(chloromethyl)biphenyl (0.50 molar equivalent), and vinylbenzyl chloride (1.13 molar equivalent). Compound 2 was obtained as a yellow solid in 86% yield and was identified from its H-NMR spectrum (Figure 2) and GPC measurement. GPC showed a weight-average molecular weight Mw = 1411 g / mol and a polydispersity of 2.6. The molar ratio of total chloromethyl groups to reactive sites on indene is 0.71.

[0155] Example 3 The same synthesis procedure as described in Example 1 was used, except that a different molar ratio was used between indene (1 molar equivalent), 4,4'-bis(chloromethyl)biphenyl (0.40 molar equivalent), and vinylbenzyl chloride (1.34 molar equivalent). Compound 3 was obtained as a yellow solid in 87% yield and was identified from its H-NMR spectrum (Figure 3) and GPC measurement. GPC showed a weight-average molecular weight Mw = 1091 g / mol and a polydispersity of 2.3. The molar ratio of chloromethyl groups to reactive sites on indene is 0.71.

[0156] Example 4 The same synthetic procedure as described in Example 1 was used, except that a different molar ratio was used between indene (1 molar equivalent), 4,4'-bis(chloromethyl)biphenyl (0.44 molar equivalent), and vinylbenzyl chloride (1.47 molar equivalent). Compound 4 was obtained as a yellow solid in 83% yield and was identified from its H-NMR spectrum (Figure 4) and GPC measurement. GPC showed a weight-average molecular weight Mw = 1216 g / mol and a polydispersity of 2.1. The molar ratio of total chloromethyl groups to reactive sites on indene is 0.78.

[0157] Example 5 The same synthetic procedure as in Example 1 was used, except that a different molar ratio was used between indene (1 molar equivalent), 4,4'-bis(chloromethyl)biphenyl (0.51 molar equivalent), and vinylbenzyl chloride (1.73 molar equivalent). Compound 5 was obtained as a yellow solid material in 88% yield, and Example 5 was identified from its H-NMR spectrum (Figure 5) and GPC measurement. GPC showed a weight-average molecular weight Mw = 1726 g / mol and a polydispersity of 2.4. The molar ratio of total chloromethyl groups to reactive sites on indene is 0.92.

[0158] Table 1 below shows the results for Examples 1 to 5 when the compositions disclosed above were mixed with a bulking agent.

[0159] [Table 1]

[0160] Application Examples -Coating onto metal films The compounds listed in Table 1 were dissolved in toluene at room temperature at a concentration of 40 wt. %, and then silica extender was added to form a homogeneous resin composition varnish. The homogeneous resin composition was cast onto a metal plate, and the toluene was allowed to evaporate overnight at ambient conditions. The pre-dried resin film was placed in an oven and cured stepwise under nitrogen using the following cure cycle: 70°C for 1 hour, 90°C for 1 hour, 140°C for 1 hour, and 200°C for 2 hours. The resulting plate was approximately 0.5 mm thick and was evaluated for dielectric constant (Dk) and dissipation factor (Df) using a split-post dielectric resonator (SPDR) at a frequency of 10 GHz. The results are shown in Table 2 below.

[0161] [Table 2]

[0162] -Preparation of prepreg: All the components shown in Table 1 were dissolved in toluene at room temperature, and then a silica extender was added to produce a uniform resin composition varnish with a solids concentration of 50 to 60 wt %. Glass fibers (E2116NE glass) were immersed in the varnish, then placed vertically in an oven and dried at 150°C for 3 minutes to produce a prepreg sheet.

[0163] - Preparation of the laminate: The prepreg sheet was press-cured for 2 hours at 220° C. The resin content of the final laminate was about 45% to about 50% by weight.

[0164] Comparative Example 6 The same synthetic procedure as disclosed in Example 1 was carried out, except that 4,4'-bis(chloromethyl)biphenyl was replaced with an equimolar amount of α,α'-dichloro-p-xylene. Compound 6 (comparative example) was obtained as a yellow solid in 87% yield and was identified by its H-NMR spectrum (FIG. 6) and GPC measurement. GPC showed a weight-average molecular weight Mw=2062 g / mol and a polydispersity of 2.5. The compounds were further processed as disclosed above (see Table 3). The results are shown in Table 4 below.

[0165] [Table 3]

[0166] [Table 4]

Claims

1. A curable resin composition comprising at least the following: (1) A compound having the following formula C1: 【Chemical 1】 wherein each R1 is independently selected from a hydrogen atom, a halogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a thioalkoxy group having 1 to 5 carbon atoms, a thioaryloxy group having 6 to 14 carbon atoms, and an aryl group having 6 to 14 carbon atoms, and combinations thereof; and each F1 is independently selected from a hydrogen atom and a vinylbenzyl group, and combinations thereof, provided that at least one F1 is a vinylbenzyl group; and 【Chemistry 2】 (2) A compound having the following formula C2: 【Chemistry 3】 wherein each R1 is independently selected from a hydrogen atom, a halogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a thioalkoxy group having 1 to 5 carbon atoms, a thioaryloxy group having 6 to 14 carbon atoms, and an aryl group having 6 to 14 carbon atoms, and combinations thereof; and Each F2 independently represents a hydrogen atom, a vinylbenzyl group, 【Chemistry 4】 or a structure of formula F3, with the proviso that at least one of F2 is a structure of formula F3: 【Chemistry 5】 During the ceremony: n, p, and p' can independently range from 0 to 50, preferably from 0 to 10; each R1 is independently selected from a hydrogen atom, a halogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a thioalkoxy group having 1 to 5 carbon atoms, a thioaryloxy group having 6 to 14 carbon atoms, and an aryl group having 6 to 14 carbon atoms, and combinations thereof; each F'2 is independently selected from a hydrogen atom, a vinylbenzyl group, provided that at least one F2 or one F'2 is a vinylbenzyl group; 【Chemistry 6】 F4 is selected from divalent groups of formula F4, and combinations thereof: 【Chemistry 7】 During the ceremony: each Q is independently selected from a hydrogen atom and a straight or branched C1-C6 alkyl group, or a combination thereof; and each R2 is independently selected from a hydrogen atom, a straight or branched C1-C6 alkyl group, a halogen atom, or a combination thereof; The composition comprising:

2. The following conditions: - each Q is independently selected from H, CH3, and combinations thereof; - all R1 groups represent H, - all R2 groups represent H, - all R groups represent H, The composition of claim 1 , wherein one or more of the following is satisfied:

3. 3. The composition of claim 1 or 2, further comprising one or more extenders, preferably silanized extenders, more preferably silanized amorphous silica.

4. The composition of claim 3, wherein the one or more extenders comprise 10 to 40 wt % based on the total weight of the additive-containing resin composition.

5. A method for preparing a curable resin composition, comprising at least the following steps: (i) mixing at least compounds (a), (b), and (c); and (ii) reacting the compound in the presence of an alkali; Including, Compound (a) is one or more indene compounds represented by the following general formula 1: 【Chemistry 8】 wherein each R1 is independently selected from a hydrogen atom, a halogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a thioalkoxy group having 1 to 5 carbon atoms, a thioaryloxy group having 6 to 14 carbon atoms, and an aryl group having 6 to 14 carbon atoms, and combinations thereof; Compound (b) is one or more biphenyl compounds represented by the following general formula 2: 【Chemistry 9】 During the ceremony each X is independently selected from a halogen atom, tosylate, mesylate, triflate, and combinations thereof; each Q is independently selected from a hydrogen atom and a straight or branched C1-C6 alkyl group, and combinations thereof; and each R2 is independently selected from a hydrogen atom, a linear or branched C1-C6 alkyl group, a halogen atom, and combinations thereof; Compound (c) is one or more vinylbenzyl compounds represented by the following general formula 3: 【Chemistry 10】 During the ceremony, X' is selected from a halogen atom, tosylate, mesylate, triflate, and combinations thereof; The method.

6. 6. The process of claim 5, wherein the molar ratio of total halomethyl, preferably chloromethyl, groups in compounds (b) and (c), if present, to reactive sites in compound (a) is not greater than 0.

95.

7. 7. The method according to claim 5 or 6, wherein the molar ratio of the indene compound of formula 1 (a) to the biphenyl compound of formula 2 (b) is in the range of 1.8 / 1 to 3 / 1.

8. 8. The method according to any one of claims 5 to 7, wherein the molar ratio of the indene compound of formula 1 (a) to the vinylbenzyl compound of formula 3 (c) is in the range of 1 / 1 to 1 / 2, preferably 1 / 1.75, and most preferably 1 / 1.

5.

9. The following conditions: - each Q is independently selected from H, CH3, and combinations thereof; - all R groups represent H, - all R2 groups represent H, - all R groups represent H, The method according to any one of claims 5 to 8, wherein one or more of the following are satisfied:

10. 10. The method according to any one of claims 5 to 9, wherein the vinylbenzyl compound represented by general formula 3 is selected from the group consisting of 2-vinylbenzyl chloride, 3-vinylbenzyl chloride, 4-vinylbenzyl chloride, 2-vinylbenzyl bromide, 3-vinylbenzyl bromide, 4-vinylbenzyl bromide, and mixtures thereof, and preferably, the vinylbenzyl compound represented by general formula 3 is a mixture of 10 to 50% by weight of 2-vinylbenzyl chloride, 0 to 10% by weight of 3-vinylbenzyl chloride, and 50 to 80% by weight of 4-vinylbenzyl chloride.

11. The method according to any one of claims 5 to 10, wherein the compound (b) is 4,4'-bis(chloromethyl)biphenyl.

12. 12. The process of any one of claims 5 to 11, further comprising the addition of an onium salt based catalyst selected from the list comprising tetra-n-butylammonium bromide, tetra-n-butylammonium chloride, tetra-n-butylammonium hydrogen sulfate, benzyltrimethylammonium chloride, and tricaprylmethylammonium chloride, tetra-n-butylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium chloride, tetraphenylphosphonium bromide, benzyltetramethylenesulfonium bromide, and mixtures thereof.

13. 13. The method of any one of claims 5 to 12, further comprising adding a radical inhibitor, wherein the radical inhibitor is selected from the group consisting of quinone, phenol, catechol, phenothiazine, (2,2,6,6-tetramethylpiperidin-1-yl)oxyl, hydroxylamine and their corresponding salts, and mixtures thereof.

14. A curable resin composition obtainable or obtained by the method according to any one of claims 5 to 13.

15. A method for manufacturing an article, comprising at least the following steps: -Step 1: A step of preparing a curable resin composition comprising at least a compound having formula C1 according to any one of claims 1 to 4 and a compound having formula C2 according to any one of claims 1 to 4; or Preparing the curable resin composition of claim 14; the composition optionally comprising one or more additives; -Step 2: shaping the composition; -Step 3: curing the composition; The method comprising:

16. An article obtained by carrying out the method of claim 15.

17. 17. The article of claim 16, having a dissipation factor (Df) of less than 0.00100 as measured in a split post dielectric resonator (SPDR) at a frequency of 10 GHz.

18. 18. The article according to claim 16 or claim 17, which is a prepreg obtained by impregnating a fibrous material with the composition according to any one of claims 1 to 4 or 14.

19. 20. A high frequency laminate comprising the prepreg of claim 18 and a layer of conductive material disposed on at least one surface of the prepreg.

20. A printed wiring board produced by forming a conductor pattern on the surface of the laminate sheet according to claim 19. 。

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