Hybrid PCB with planar antenna

Abstract

The present invention provides a printed circuit board formed of at least two layers, a first layer being thermally conductive and a second layer being thermally insulating, both layers providing structural support and / or mechanical rigidity to the printed circuit board, and a planar antenna being mounted on the second layer.

Description

[Technical Field]

[0001] The present invention relates to the field of printed circuit boards, and in particular to printed circuit boards that mount planar antennas. [Background technology]

[0002] Printed circuit boards are a widely established and common part of modern electronic devices. Generally, printed circuit boards not only provide structural support for the electronic components of an electronic device, but also define the electrical interconnections between the electronic components coupled to the printed circuit board.

[0003] It is common for electronic devices to have multiple printed circuit boards, for example, each designed for a different function of the electronic device. As an example, a connected lighting configuration may include a printed circuit board each for lighting, control, and wireless / external communication functions. Summary of the Invention [Problem to be solved by the invention]

[0004] There is a continuing desire to reduce the size and / or number of printed circuit boards to make electronic devices more compact. [Means for solving the problem]

[0005] The invention is defined by the claims.

[0006] According to an example of an aspect of the present invention, there is provided a printed circuit board having: a first layer providing a core for the printed circuit board, the first layer being formed of a thermally conductive material to spread or dissipate heat and provide structural support for the printed circuit board; a second layer being formed of an electrically insulating and mechanically rigid material, the second layer being at least partially mounted on the first layer and suitable for supporting one or more electronic components requiring heat dissipation, wherein at least one electronic component mounted on the first portion dissipates heat through the first layer; and a planar antenna disposed on the second layer.

[0007] The present invention provides a printed circuit board for use in performing multiple functions, including external communication (via the planar antenna) and at least one other function (via electronic components in the first portion of the second layer), which provides a more compact and space-efficient solution for electronic devices.

[0008] By providing the first (thermally conductive) layer, a heat sink / spreader is incorporated into the printed circuit board to spread or dissipate heat from the electronic components. For example, the first layer may dissipate heat directly to the external environment or may spread / conduct heat to a (further) heat sink (e.g., a housing for the printed circuit board).

[0009] A mechanically rigid (but electrically insulating) material forms a second layer attached to the first layer, which serves the dual functions of providing additional structural support to the printed circuit board and electrically insulating electronic components from the first layer and / or any other layers between the first and second layers (if present).

[0010] The approach thereby provides a more compact printed circuit board, as multiple layers or elements perform two functions in an efficient manner.

[0011] In some embodiments, the second layer has a first portion mounted on the first layer for supporting one or more electronic components requiring heat dissipation, where any electronic components mounted on the first portion dissipate heat through the first layer, and a second portion not mounted on the first layer, and the planar antenna is disposed on the second portion of the second layer.

[0012] It has been recognized that such layers, especially thermally and / or electrically conductive layers, near the antenna affect the efficiency and / or sensitivity of the antenna, and based on this recognition it has been proposed to remove or not provide the first layer below the antenna.

[0013] This approach thereby improves the sensitivity and accuracy of the planar antenna, thereby improving the operation of any PCB assembly that includes the disclosed printed circuit board.

[0014] Optionally, the second portion of the second layer is not completely surrounded by the first portion of the second layer, which improves the efficiency and / or sensitivity of the antenna by reducing the amount of material surrounding the antenna making it more sensitive to incoming / outgoing electromagnetic waves.

[0015] The first layer may be formed of metal, which provides a mechanically robust core for the printed circuit board with good thermal conductivity. Among commercially available high-reliability materials, metal has been found to have the best properties for performing the dual functions of heat spreading / dissipation and structural support. Examples of suitable metals include aluminum (preferred for its weight), iron, and / or steel.

[0016] The second layer is made of FR4 material, which provides a mechanically robust core for the printed circuit board with good insulating properties.

[0017] The planar antenna is preferably a meander antenna.

[0018] The printed circuit board may further include a first interconnect layer between the first layer and the second layer, the first interconnect layer being formed of a conductive material, and the first interconnect layer may be suitably patterned to connect any associated electronic components.

[0019] The printed circuit board may further include an insulating layer between the first interconnect layer and the first layer, the insulating layer being formed from an electrically insulating material.

[0020] In some instances, the electrically insulating material is formed of a dielectric material.

[0021] Preferably, the thickness of the first layer is 1 mm or greater. For example, the thickness of the first layer is preferably 2 mm or greater, and more preferably 5 mm or greater. In some instances, the first layer is 10 mm or greater in thickness. Increasing the thickness of the first layer (e.g., to 1 mm or greater) enhances structural support for the remainder of the printed circuit board.

[0022] The printed circuit board may further include a second interconnect layer attached to the second layer, with at least a portion of the second layer disposed between the second interconnect layer and the first layer, the second interconnect layer being formed of a conductive material, and the second interconnect layer may be suitably patterned to connect any associated electronic components.

[0023] The second interconnect layer may provide a ground plane for the planar antenna.

[0024] The planar antenna may be a radio frequency planar antenna, i.e. a planar antenna sized and shaped for providing and / or receiving radio frequency communications.

[0025] Also provided is a printed circuit board (PCB) assembly having the aforementioned printed circuit board and one or more electronic components attached to the second layer, wherein when the second layer is formed to have a first portion and a second portion, the one or more electronic components are preferably attached to the second portion.

[0026] The one or more electronic components may include, for example, control logic, radio frequency communication processors, etc. The one or more electronic components may include, for example, one or more resistors, inductors, capacitors, microprocessors, transistors, transformers, diodes, etc.

[0027] The printed circuit board assembly may further include a housing that houses the printed circuit board and the one or more electronic components. In some examples, the housing is thermally coupled to the first layer and configured to thermally dissipate and / or spread heat away from the first layer. In some examples, the housing is formed of a thermally conductive material, such as a metal.

[0028] A method for manufacturing a printed circuit board as disclosed herein is also proposed, comprising the steps of: providing a first layer that provides a core for the printed circuit board, the first layer being made of a thermally conductive material to spread or dissipate heat; providing a second layer on the first layer, the second layer being made of an electrically insulating and mechanically rigid material; removing at least a portion of the first layer to thereby define in the second layer a first portion mounted on the first layer for supporting one or more electronic components requiring heat dissipation and a second portion not mounted on the first layer; and providing a planar antenna on the second portion of the second layer.

[0029] The method may further include providing a first interconnect layer on the first layer and the second layer, the first interconnect layer being formed of a conductive material, and the step of providing the second layer including providing the second layer on the first interconnect layer.

[0030] Another method for manufacturing a printed circuit board as disclosed herein has also been proposed, comprising the steps of: providing a first layer providing a core for the printed circuit board, the first layer being made of a thermally conductive material to spread or dissipate heat; providing a first portion of a second layer on the first layer, the second layer being made of an electrically insulating and mechanically rigid material; forming a second portion of the second layer separately from the first layer and the first portion of the second layer; and bonding the second portion of the second layer to the first portion of the second layer, thereby defining a second layer including the first portion mounted on the first layer, the first portion for supporting one or more electronic components requiring heat dissipation, and the second portion not mounted on the first layer; and providing a planar antenna on the second portion of the second layer.

[0031] These and other aspects of the invention will be elucidated and elucidated with reference to the following embodiments. [Brief explanation of the drawings]

[0032] For a better understanding of the present invention, and to show more clearly how the same may be carried into effect, reference will now be made, by way of example only, to the accompanying drawings, in which: [Figure 1] 1 shows a cross-sectional view of a portion of a printed circuit board. [Figure 2] 1 illustrates a conceptual diagram of a printed circuit board. [Figure 3] 1 is a flowchart illustrating a method for manufacturing a printed circuit board. [Figure 4] 10 is a flowchart illustrating another approach for manufacturing a printed circuit board. DETAILED DESCRIPTION OF THE INVENTION

[0033] The present invention will be described with reference to the drawings.

[0034] It should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the devices, systems, and methods, are for purposes of illustration only and are not intended to limit the scope of the invention. These and other features, aspects, and advantages of the devices, systems, and methods of the present invention will become better understood from the following description, appended claims, and accompanying drawings. It should be understood that the figures are merely schematic and are not drawn to scale. It should also be understood that the same reference numerals are used throughout the figures to indicate the same or similar parts.

[0035] A printed circuit board is provided that is formed of at least two layers, a first layer that is thermally conductive and a second layer that is thermally insulating, both layers providing structural support and / or mechanical rigidity to the printed circuit board, and a planar antenna disposed on the second layer.

[0036] The embodiments are based on the recognition that a thermally conductive core for a printed circuit board, while providing good heat spreading / dissipation, may affect the operation of the antenna and may not provide sufficient structural support. The present invention proposes to further provide an additional (second) layer of thermally insulating but structurally rigid material for mounting the electronic components and the planar antenna.

[0037] Further embodiments further recognize that a conductive core near a planar antenna can affect the operation of the planar antenna, for example, reducing the sensitivity and / or accuracy of the planar antenna. To allow the planar antenna to be spaced away from the core, it is proposed to divide the second layer into a first portion disposed on the core and a second portion not attached to the core. The second layer provides sufficient structural support for the planar antenna.

[0038] The disclosed techniques can be employed in any suitable printed circuit board configuration utilizing planar antennas, and can be used in particular in radio frequency printed circuit board assemblies.

[0039] In the context of this disclosure, when a layer is mounted "on top of" another layer, the layers are configured such that one layer structurally supports the other. There may be additional layers disposed between the layers mounted one on top of the other.

[0040] In particular, immediately after manufacturing a printed circuit board including a first virtual layer and a second virtual layer, the first virtual layer may be considered to be "above" the second virtual layer if, for example, the first virtual layer is vertically above the second virtual layer such that a vertical virtual line (a line parallel to the direction of gravity) passes through the first virtual layer and the second virtual layer.

[0041] Figure 1 conceptually illustrates a cross-sectional view of a printed circuit board 100 according to an embodiment. Figure 1 is used to conceptually illustrate the proposed approach and is merely schematic.

[0042] The printed circuit board has a first layer 110 that provides a core for the printed circuit board 100. The first layer 110 is formed of a thermally conductive material that is configured to spread or dissipate heat. The first layer also provides structural support for the printed circuit board.

[0043] Examples of suitable materials for performing the required functions will be apparent to those skilled in the art and include metals such as aluminum, iron or steel, and other materials such as ceramics (e.g., aluminum oxide or alumina (Al2O3) or aluminum nitride). Preferably, the first layer has a resistance of 20 Wm (e.g., at 20°C). -1 K -1 It is made of a material with a thermal conductivity of 0.01 and a Young's modulus of 50 GPa or more.

[0044] The first layer can be appropriately sized to achieve its desired function, e.g., at least the function of providing structural support for the printed circuit board. For example, the first layer can have a thickness of 1 mm or greater. In some instances, the thickness of the first layer is preferably 2 mm or greater, and more preferably 5 mm or greater. In some instances, the first layer is 10 mm or greater in thickness. Increasing the thickness of the first layer (e.g., to 1 mm or greater) enhances structural support for the remainder of the printed circuit board.

[0045] The first layer 110 thereby acts as both a structural support for the printed circuit board 100 and a heat spreader / sink or heat spreader.

[0046] The printed circuit board 100 also has a second layer 120 at least partially mounted on the first layer. In the illustrated example, the second layer is only partially mounted on the first layer. The thickness of the second layer 120 may be between 0.1 mm and 4 mm, for example between 0.1 mm and 2 mm, for example between 0.1 mm and 1 mm, for example 0.5 mm.

[0047] The second layer is formed of an electrically insulating and mechanically rigid material, examples of which include FR4 (or FR-4) material or other similar materials with high dielectric constants or relative permittivities, such as ceramics.

[0048] The second layer is configured to support one or more electronic components requiring heat dissipation. At least one electronic component 125 attached to the first portion dissipates heat through the first layer. Thus, the first layer may dissipate heat directly from the at least one electronic component 125 and / or may diffuse / conduct the heat to a heat sink / another heat sink for dissipation.

[0049] The second layer provides additional structural support for the printed circuit board, particularly for the components disposed thereon, and also serves to electrically isolate the electronic components from the first layer and / or any other layers between the first and second layers (if present).

[0050] The printed circuit board 100 also has a planar antenna 130 disposed on the second layer, which may be, for example, a meander antenna.

[0051] The planar antenna may be a radio frequency planar antenna, i.e., a planar antenna sized and shaped for providing and / or receiving radio frequency communications. Accordingly, the planar antenna may be configured to generate a varying electrical signal in response to incoming radio frequency waves and / or to generate radio frequency waves in response to an electrical signal supplied to it. Techniques for configuring planar antennas for such purposes are well known in the art.

[0052] In other embodiments of the present invention, other types of planar antennas (ie, non-radio frequency planar antennas) may also be employed.

[0053] 1 illustrates a particularly advantageous version of the printed circuit board, in which the second layer can be conceptually divided into a first part 121 and a second part 122. This division is conceptually represented by a dotted line.

[0054] The first portion 121 is mounted on the first layer and is configured to support one or more electronic components 125 that require heat dissipation. As before, any electronic components mounted on the first portion will dissipate heat through the first layer.

[0055] The second portion 122 is not attached to the first layer, but rather is structurally supported by the first layer 110 via the first portion 121. Thus, the second portion 122 is structurally supported by the portion 121 of the second layer.

[0056] The planar antenna 130 is disposed on the second portion 122 of the second layer. The material of the second layer 120 provides mechanical rigidity to support the antenna on the second portion 122 of the second layer. Among other things, the second portion 122 of the second layer provides mechanical stability to the planar antenna 130.

[0057] In this manner, areas of the first layer 110 are not in close proximity to the planar antenna and the second portion 122 of the second layer, and therefore the first layer does not provide direct structural support for the second portion 122 of the second layer 120 or the planar antenna 130 (rather, it only provides support via the first portion 121 of the second layer).

[0058] Preferably, the second portion 122 of the second layer 120 is not completely surrounded by the first portion of the second layer 110. Thus, the second portion 122 can effectively overhang the first layer 110. This approach reduces the amount of material near the antenna, which can increase the antenna's sensitivity to electromagnetic radiation.

[0059] It will be appreciated that the printed circuit board 100 may include one or more electronic components 125 requiring heat dissipation to form a printed circuit board assembly, however, this is not required, and the printed circuit board 100 may instead have locations or zones to which one or more electronic components 125 can later be coupled or connected, as is well known in the art.

[0060] Although only one electronic component 125 is shown in Figure 1, this is merely a schematic representation for purposes of understanding. In practice, a printed circuit board may be configured to mount any number of electronic components, for example, more than 10 components or more than 100 components.

[0061] Other optional features of printed circuit board 100 are also shown in FIG.

[0062] Some electronic components, such as LEDs, generate a significant amount of heat, and therefore it may be preferable to thermally couple such components more closely to the first layer 110 (which acts as a heat spreader / sink).

[0063] Thus, in some instances, one or more additional electrical components 140 may be attached to the first layer 110 and not to the second layer 120. Thus, the one or more electrical components may be structurally supported directly by the first layer 110 and not structurally supported by the second layer 120 (i.e., when the first layer is on a flat surface).

[0064] This allows one or more additional electrical components to be more closely thermally coupled to the first layer 110, improving the heat dissipation of such components to the printed circuit board.

[0065] As before, it will be appreciated that the printed circuit board 100 may include one or more additional electronic components 140. However, this is not required, and the printed circuit board 100 may instead have locations or zones to which one or more additional electronic components 140 can later be coupled or connected, as is well known in the art.

[0066] Although only one additional electronic component 140 is shown in Figure 1, this is merely a schematic representation for purposes of understanding. In practice, the printed circuit board may be configured to mount any number of additional electronic components, for example, more than 10 additional components or more than 100 additional components.

[0067] It is generally desirable to provide interconnects on the printed circuit board 100 to connect components supported on the interconnects to perform a desired function. The printed circuit board may thereby have one or more interconnect layers 151, 152, 153 formed of a conductive material.

[0068] For example, the printed circuit board may have a first interconnect layer 151 between the first layer 110 and the second layer 120. The first interconnect layer 151 may provide electrical connection to, for example, any additional electronic components 140 attached to the first layer 110 (but not attached to the second layer 120). The first interconnect layer 151 is formed of a conductive material.

[0069] The printed circuit board 100 may have a second interconnect layer 152 attached to the second layer 120. In particular, the second interconnect layer is positioned such that at least a portion of the second layer is located between the second interconnect layer and the first layer. The second interconnect layer 152 is also formed of a conductive material.

[0070] The second interconnect layer may also provide a ground plane for the planar antenna.

[0071] It will be appreciated that the second interconnect layer 152 does not have to be disposed below the planar antenna 130 as shown in Figure 1. Rather, the second interconnect layer 152 and the planar antenna 130 may both be (directly) attached to the second layer 120. In particular, the planar antenna 130 may in fact form part of the second interconnect layer 130 and / or the second interconnect layer may provide electrical connections to the planar antenna 130.

[0072] The printed circuit board 100 may also have a third interconnect layer 153 attached between the first interconnect layer 151 and the second layer 120. The third interconnect layer 152 allows for improved ease of assembly or manufacturing of the printed circuit board (e.g., by allowing for separate manufacturing of the first and second layers before being bonded together via the first and second interconnect layers). The third interconnect layer 153 is also formed of a conductive material.

[0073] Examples of conductive materials for use as materials for the first, second and / or third interconnect layers (if relevant) include copper, gold or silver, with copper being typically preferred due to its low cost and ease of manufacture (e.g., for performing soldering or the like).

[0074] Each interconnect layer 151, 152, 153 (if present) may be configured in the form of one or more electrical traces, for example, to connect locations where electronic components are or should be coupled. The electrical traces may form a predetermined connection pattern to achieve a desired communication goal. Techniques for forming such traces are well known in the art of printed circuit boards.

[0075] To prevent components from supplying current to the first layer 110 (which acts as a heat spreader / sink), the printed circuit board may further include an insulating layer 160 between the first interconnect layer 151 and the first layer 110. The insulating layer may have a thickness between 0.05 mm and 1 mm, for example 0.1 mm.

[0076] The insulating layer is formed of an electrically insulating material, such as a dielectric material (e.g., aluminum nitride or silicon carbide). Preferably, the insulating material has a resistance of 20 W / m (e.g., at 20°C) for improved heat dissipation. -1 K -1 It has a thermal conductivity of more than 1000kJ / cm2.

[0077] The use of an insulating layer is particularly advantageous when the first layer is formed of a conductive material, such as a metal (e.g., aluminum), to prevent the first layer from becoming electrically charged and potentially dangerous to a subject who (e.g., unintentionally) touches the first layer.

[0078] The printed circuit board 100 may further include one or more vias 170 or interconnects through the second layer 120. This allows components mounted on the second layer 120 to electrically communicate with any components not mounted on the first layer through the vias and the first / second interconnect layers.

[0079] Each via is a hole through the second layer 120 that is coated or filled with a conductive material, such as a metal (eg, copper, gold, or silver).

[0080] The vias also serve to provide heat dissipation for components attached to the second layer, for example, by conducting heat through the vias to the first layer 110. This approach is particularly advantageous if the second layer is thermally insulating, for example, formed of FR4 material or the like.

[0081] Each via may have a plug of thermally conductive material, for example, filling the via completely or partially, to improve heat dissipation. Examples of thermally conductive materials include metals and some ceramics. In some examples, each via is a hole coated with metal (to provide electrical connection) and filled with a plug of thermally conductive material, such as ceramic.

[0082] Although only one via is shown, one skilled in the art will readily appreciate that a printed circuit board may have any number of vias.

[0083] 2 shows a perspective view of an example printed circuit board 100. For clarity, only two electronic components are shown, but those skilled in the art will readily appreciate that in practice such a printed circuit board 100 may be configured to mount any number of electronic components.

[0084] FIG. 2 more clearly illustrates how the planar antenna 130 may be attached to the second portion 122 of the second layer 120, which is not attached to the first layer 110 (e.g., is not directly structurally supported by the first layer 110).

[0085] This figure also more clearly shows how additional electronic and electrical components 140 can be attached to the first layer 110 without being attached to the second layer 120. Notably, the second layer 120 may have one or more cavities 129 in which any such additional electronic components can be placed.

[0086] For clarity of illustration, other layers, such as interconnect layers and / or insulating layers, are not directly shown in Figure 2. Among other things, Figure 2 is useful for understanding the spatial relationship between the first and second layers.

[0087] FIG. 3 is a flow chart illustrating a method 300 for manufacturing a printed circuit board as disclosed herein.

[0088] The method 300 includes providing a first layer 310 that provides a core for the printed circuit board, formed of a thermally conductive material to spread or dissipate heat. Step 310 can be performed using, for example, a deposition technique or a cutting / dicing technique.

[0089] Method 300 also includes step 320 of providing a second layer formed of an electrically insulating and mechanically rigid material over the first layer. Step 320 may be performed, for example, by depositing the second layer over the first layer. As another example, step 320 may be performed by separately fabricating the second layer and bonding or otherwise attaching the second layer to the first layer.

[0090] Alternatively, steps 310 and 320 may be performed by depositing the first layer on the second layer, or by attaching or bonding separately fabricated first and second layers together.

[0091] After performing steps 310 and 320, the first layer and the second layer may have the same cross-sectional area (eg, when viewed from above).

[0092] The method also includes removing 330 at least a portion of the first layer, thereby defining a first portion of the second layer mounted on the first layer for supporting one or more electronic components requiring heat dissipation, and a second portion not mounted on the first layer.

[0093] The method 300 also includes step 340 of providing a planar antenna on the second portion of the second layer. Techniques for performing this step will be readily apparent to those skilled in the art. The technique may include forming the planar antenna using a deposition or printing technique, optionally followed by an etching step. Of course, some deposition techniques do not require an etching step to create the shape or form of the planar antenna.

[0094] Steps 330 and 340 may be performed in reverse order, such that removal of at least a portion of the first layer occurs after the planar antenna is provided on the second portion of the second layer.

[0095] Of course, the method 300 may be suitably modified to include providing other optional layers of a printed circuit board.

[0096] For example, method 300 may further include step 350 of providing a first interconnect layer between the first and second layers, the first interconnect layer being formed of a conductive material, and step 320 may be modified accordingly to include providing a second layer over the first interconnect layer.

[0097] Similarly, method 300 may further comprise step 360 of providing a second interconnect layer on the second layer (such that the second layer is disposed between the first layer and the second interconnect layer), which may be performed after performing step 320 and / or may be incorporated into performing step 340. Thus, the planar antenna and the second interconnect layer may be fabricated or provided at the same time or in the same process (e.g., the same deposition and optional etching process).

[0098] Method 300 may further include step 370 of providing an insulating layer between the first interconnect layer and the first layer. This may be performed, for example, using deposition techniques. Of course, the first interconnect layer may not yet be present when step 370 is performed.

[0099] FIG. 4 is a flow chart illustrating an alternative method 400 for manufacturing a printed circuit board as disclosed herein.

[0100] The method 400 includes providing 410 a first layer that provides a core for the printed circuit board, formed of a thermally conductive material to spread or dissipate heat.

[0101] The method 400 further includes providing 420 a first portion of a second layer formed of an electrically insulating and mechanically rigid material on the first layer, the portion of the second layer provided in this manner on the first layer being capable of serving as the first portion.

[0102] Steps 410 and 420 may be performed in a manner similar to steps 310, 320 described above (with reference to FIG. 3).

[0103] The method 400 further includes forming 430 a second portion of the second layer separately from the first layer and the first portion of the second layer.

[0104] The method then performs step 440 of bonding the second portion of the second layer to the first portion of the second layer, which can be performed using any suitable bonding technique.

[0105] Performance of step 440 thereby defines a second layer having a first portion mounted on the first layer for supporting one or more electronic components requiring heat dissipation, and a second portion not mounted on the first layer.

[0106] Method 400 also includes step 450 of providing a planar antenna on a second portion of the second layer, which can be performed in any manner similar to step 340 described above. Step 450 can be performed before or after step 440.

[0107] In one variation on method 400, step 450 is performed as part of steps 420 and 440. In this approach, step 420 includes step 421 of providing an initial second layer over the first layer, step 422 of providing a planar antenna on the second layer, and step 423 of etching or removing portions of the first and second layers near the planar antenna. The remaining (unremoved) portion of the second layer forms the first portion of the second layer. The second portion (produced in step 430) is then bonded to the first portion to perform both steps 440 and 450.

[0108] As with the method 300 described above, the method 400 may be suitably modified to include providing other optional layers of a printed circuit board.

[0109] For example, method 400 may further include step 460 of providing a first interconnect layer between the first layer and the second layer, the first interconnect layer being formed of a conductive material, and step 420 may be modified accordingly to include providing a second layer over the first interconnect layer.

[0110] Similarly, method 400 may further comprise step 465 of providing a second interconnect layer on the second layer (such that the second layer is disposed between the first layer and the second interconnect layer), which may be performed after performing step 420 and / or may be incorporated into performing step 450, if desired. Thus, the planar antenna and the second interconnect layer may be fabricated or provided at the same time or in the same process (e.g., the same deposition and optional etching process).

[0111] The method 400 may further include step 470 of providing an insulating layer between the first interconnect layer and the first layer. This may be performed, for example, using deposition techniques. Of course, the first interconnect layer may not yet be present when step 470 is performed.

[0112] Other variations and modifications to the methods for manufacturing printed circuit boards described herein will be apparent to those skilled in the art.

[0113] Deposition techniques suitable for use in the proposed embodiments are well known in the art of circuit fabrication and will not be described here for the sake of brevity. Examples of deposition techniques include physical or chemical vapor deposition techniques, sputtering techniques, etc.

[0114] Those skilled in the art can understand and effect variations to the disclosed embodiments in practicing the claimed invention, from a study of the drawings, the specification and the appended claims. In the claims, the word "comprises" does not exclude other elements or steps, and the singular does not exclude a plurality.

[0115] The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

[0116] It should be noted that when the term "adapted to" is used in the claims or the specification, the term "adapted to" is intended to be equivalent to the term "configured to." It should be noted that when the term "configuration" is used in the claims or the specification, the term "configuration" is intended to be equivalent to the term "system," and vice versa.

[0117] Any reference signs in the claims should not be construed as limiting the scope.

Claims

1. 1. A printed circuit board comprising: a first layer providing a core for the printed circuit board formed of a thermally conductive material to spread or dissipate heat and provide structural support for the printed circuit board; The second layer, a first portion mounted on the first layer for supporting one or more electronic components requiring heat dissipation, wherein all electronic components mounted on the first portion dissipate heat through the first layer; and a second layer including a second portion not attached onto the first layer, the second layer is formed of an electrically insulating and mechanically rigid material, the second layer is at least partially mounted on the first layer, and is suitable for supporting one or more electronic components requiring heat dissipation, and at least one electronic component mounted on the first portion dissipates heat through the first layer; a planar antenna disposed on the second portion of the second layer.

2. 2. The printed circuit board of claim 1, wherein the second portion of the second layer is not completely surrounded by the first portion of the second layer.

3. 3. The printed circuit board according to claim 1, wherein the first layer is made of metal.

4. 4. The printed circuit board of claim 1, wherein the second layer is formed from FR4 material.

5. The printed circuit board according to claim 1 , wherein the planar antenna is a meander antenna.

6. 6. The printed circuit board of claim 1, further comprising a first interconnect layer between the first layer and the second layer, the first interconnect layer being formed from a conductive material.

7. 7. The printed circuit board of claim 6, further comprising an insulating layer between said first interconnect layer and said first layer, said insulating layer being formed of an electrically insulating material.

8. 8. The printed circuit board of claim 7, wherein the electrically insulating material is formed of a dielectric material.

9. 9. The printed circuit board according to claim 1, wherein the first layer has a thickness of 1 mm or more.

10. 7. The printed circuit board of claim 6, further comprising a second interconnect layer attached to the second layer, at least a portion of the second layer being disposed between the second interconnect layer and the first layer, the second interconnect layer being formed of a conductive material.

11. The printed circuit board of claim 10 wherein the second interconnect layer provides a ground plane for the planar antenna.

12. A method for manufacturing a printed circuit board according to any one of claims 1 to 11, comprising the steps of: providing a first layer that provides a core for the printed circuit board, the first layer being formed of a thermally conductive material to spread or dissipate heat; providing a second layer formed of an electrically insulating and mechanically rigid material over the first layer; removing at least a portion of the first layer, thereby forming in the second layer: a first portion mounted on the first layer, the first portion for supporting one or more electronic components requiring heat dissipation; and defining a second portion not attached to the first layer; and providing a planar antenna on the second portion of the second layer.

13. providing a first interconnect layer on the first layer and the second layer, the first interconnect layer being formed of a conductive material; 13. The method of claim 12, wherein providing the second layer comprises providing the second layer over the first interconnect layer.

14. A method for manufacturing a printed circuit board according to any one of claims 1 to 11, comprising the steps of: providing a first layer that provides a core for the printed circuit board, the first layer being formed of a thermally conductive material to spread or dissipate heat; providing a first portion of a second layer formed of an electrically insulating and mechanically rigid material on the first layer; forming a second portion of the second layer separately from the first layer and the first portion of the second layer; bonding the second portion of the second layer to the first portion of the second layer, thereby a first portion mounted on the first layer, the first portion for supporting one or more electronic components requiring heat dissipation; and defining a second layer including the second portion not attached onto the first layer; and providing a planar antenna on the second portion of the second layer.

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