Etching equipment

Abstract

An etching apparatus according to an embodiment of the present invention may include a laser light source, a scanner that deflects light emitted from the laser light source onto an electrode current collector coated with an electrode active material, and a processor that controls at least one of the laser light source and the scanner so that the pulse interval of the light incident on the electrode current collector is constant.

Description

[Technical Field]

[0001] The present invention relates to an etching apparatus.

[0002] This application claims priority based on Korean Patent Application No. 10-2022-0182357 filed on December 22, 2022 and Korean Patent Application No. 10-2023-0027291 filed on February 28, 2023, and the contents disclosed in the specifications and drawings of those applications are incorporated herein in their entirety. [Background technology]

[0003] In recent years, as demand for portable electronic products such as laptops, video cameras, and mobile phones has grown rapidly and the commercialization of robots and electric vehicles has progressed in earnest, active research efforts have been made on high-performance secondary batteries that can be repeatedly charged and discharged.

[0004] Currently, commercially available secondary batteries include nickel-cadmium batteries, nickel-metal hydride batteries, nickel-zinc batteries, and lithium secondary batteries. Of these, lithium secondary batteries are attracting attention due to their advantages of being able to be freely charged and discharged since they have almost no memory effect compared to nickel-based secondary batteries, as well as their extremely low self-discharge rate and high energy density.

[0005] This type of lithium secondary battery mainly uses a lithium-based oxide and a carbon material as the positive and negative electrode active materials, respectively, and includes an electrode assembly in which a separator is sandwiched between positive and negative electrode plates coated with the positive and negative electrode active materials, and an exterior material, such as a battery case, that encloses the electrode assembly together with an electrolyte.

[0006] In manufacturing an electrode, a positive electrode active material or a negative electrode active material may be coated on an electrode current collector. In this case, if the coating areas on both sides of the electrode current collector are different, the quality of the battery cell may be degraded. Furthermore, the electrode active material coated on the electrode current collector in a slurry state may flow during the drying process, resulting in a sliding phenomenon, which may degrade the quality of the battery cell. Summary of the Invention [Problem to be solved by the invention]

[0007] The present invention is directed to solving the above-mentioned problems and other problems.

[0008] Another object of the present invention may be to provide an electrode having improved coating quality of the active material on the electrode current collector.

[0009] It is yet another object of the present invention to provide an electrode formed so that the active material coating areas on both sides of the electrode current collector are equal.

[0010] Yet another object of the present invention is to provide an etching apparatus that etches an outer portion of a coating using a laser so that the coating area of ​​an active material on both sides of an electrode current collector becomes equal.

[0011] Yet another object of the present invention is to provide an etching apparatus that can minimize damage to an electrode current collector even when etching an outer portion of an active material coating on the electrode current collector with a laser. [Means for solving the problem]

[0012] To achieve the above-described object, an etching apparatus according to an embodiment of the present invention may include a laser light source, a scanner that deflects light emitted from the laser light source onto an electrode current collector coated with an electrode active material, and a processor that controls at least one of the laser light source and the scanner so that the pulse interval of the light incident on the electrode current collector is constant.

[0013] The processor may also interrupt the output of the laser light source while the scanning speed of the scanner is increased or decreased.

[0014] Furthermore, the scanner may include a mirror that reflects the light emitted from the laser light source and a motor that rotates the mirror, and the processor may interrupt the output of the laser light source while the rotational angular velocity of the motor increases or decreases.

[0015] Furthermore, the processor may control the intervals between emission signals sent to the laser light source to become shorter as the scanning speed of the scanner increases.

[0016] Furthermore, the scanner may include a mirror that reflects the light emitted from the laser light source and a motor that rotates the mirror, and the processor may control the motor so that the interval between emission signals sent to the laser light source becomes shorter as the rotational angular velocity of the motor increases.

[0017] Furthermore, the processor may control the interval between emission signals sent to the laser light source to become longer as the scanning speed of the scanner decreases.

[0018] Furthermore, the scanner may include a mirror that reflects the light emitted from the laser light source and a motor that rotates the mirror, and the processor may control the motor so that the interval between emission signals sent to the laser light source becomes longer as the rotational angular velocity of the motor decreases.

[0019] Furthermore, the processor may control the intervals between emission signals sent to the laser light source to be constant while the scanning speed of the scanner is held constant.

[0020] Furthermore, the processor may control at least one of the laser light source and the scanner so that the linear energy density is constant along the trajectory of the light incident on the electrode current collector.

[0021] An electrode according to one aspect of the present invention is an electrode etched by the etching apparatus according to the present invention.

[0022] A battery cell according to one aspect of the present invention includes electrodes etched by the etching apparatus according to the present invention.

[0023] A battery module according to one aspect of the present invention includes electrodes etched by the etching apparatus according to the present invention.

[0024] A battery pack according to one aspect of the present invention includes electrodes etched by the etching apparatus according to the present invention. [Effects of the Invention]

[0025] According to at least one of the embodiments of the present invention, it is possible to provide an electrode having improved coating quality of the active material on the electrode current collector.

[0026] According to at least one of the embodiments of the present invention, it is possible to provide an electrode formed so that the coating areas of the active material on both sides of the electrode current collector are equal.

[0027] According to at least one embodiment of the present invention, an etching device can be provided that uses a laser to etch the outer portion of the coating so that the coating area of ​​the active material on both sides of the electrode current collector becomes equal.

[0028] According to at least one of the embodiments of the present invention, an etching apparatus can be provided that can minimize damage to the electrode current collector, even when the outer portion of the active material coating on the electrode current collector is etched using a laser.

[0029] In addition to these, the present invention can have various other effects, which will be explained in the sections for each embodiment, and explanations of effects that can be easily inferred by those skilled in the art will be omitted.

[0030] The drawings attached to this specification illustrate preferred embodiments of the present invention and serve to further understand the technical concepts of the present invention as well as the content of the invention, and therefore the present invention should not be interpreted as being limited to only the matters depicted in the drawings. [Brief explanation of the drawings]

[0031] [Figure 1] 1 is a diagram schematically illustrating the configuration of an etching apparatus according to an embodiment of the present invention. [Figure 2] FIG. 2 is a diagram illustrating an example of an electrode. [Figure 3] FIG. 10 is a diagram showing an example of an electrode in which an etching region is set. [Figure 4] FIG. 2 shows an electrode etched by an etching apparatus according to an embodiment of the present invention. [Figure 5] 3A to 3C are diagrams illustrating a part of a process in which an electrode is etched by an etching apparatus according to an embodiment of the present invention. [Figure 6] FIG. 2 is a diagram showing an example in which an electrode is etched by the etching apparatus according to an embodiment of the present invention. [Figure 7] 1 is a graph illustrating changes in control variables of an etching apparatus while an electrode is etched by the etching apparatus according to an embodiment of the present invention. [Figure 8] FIG. 2 is a diagram showing an example in which an electrode is etched by the etching apparatus according to an embodiment of the present invention. [Figure 9]1 is a graph illustrating changes in control variables of an etching apparatus while an electrode is etched by the etching apparatus according to an embodiment of the present invention. [Figure 10] FIG. 2 is a diagram showing a side view of an electrode etched by an etching apparatus according to an embodiment of the present invention. [Figure 11] FIG. 2 is a perspective view showing an electrode etched by the etching apparatus according to an embodiment of the present invention. [Figure 12] 10 is a perspective view showing a tab formed on an electrode etched by the etching apparatus according to an embodiment of the present invention. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0032] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, the terms and words used in the specification and claims should not be construed as being limited to their ordinary or dictionary meanings, but should be construed as having meanings and concepts corresponding to the technical ideas of the present invention, in accordance with the principle that the inventor can appropriately define the concepts of terms himself in order to best describe the invention.

[0033] Therefore, it should be understood that the embodiments described in this specification and the configurations shown in the drawings are merely preferred embodiments of the present invention and do not represent the entire technical idea of ​​the present invention, and that there may be various equivalents and modifications that can be substituted therefor at the time of this application.

[0034] Fig. 1 is a diagram schematically illustrating the configuration of an etching apparatus according to an embodiment of the present invention. Fig. 2 is a diagram illustrating an example of an electrode 300. Fig. 3 is a diagram illustrating an example of an electrode 300 in which an etching area ea is set. Fig. 4 is a diagram illustrating an electrode 300 etched by an etching apparatus according to an embodiment of the present invention. Referring to Figs. 1 to 4, an etching apparatus according to an embodiment of the present invention may include a laser light source 100, a scanner 200, and a processor (not shown).

[0035] The laser light source 100 can emit light 1. The laser light source 100 may also be referred to as a laser 100 or a laser oscillator 100. The laser light source 100 can emit nanosecond (ns) pulsed light 1 having an infrared wavelength. The average output of the laser light source 100 can be approximately 100 W to 500 W. The laser light source 100 can be a fiber laser.

[0036] The light 1 emitted from the laser light source 100 may have a wavelength of approximately 1030 to 1070 nm. The pulse width of the light 1 emitted from the laser light source 100 may be approximately 10 to 500 ns. The laser beam quality M2 of the laser light source 100 may be configured to be smaller than approximately 1.7. The pulse repetition frequency of the laser light source 100 may be configured to be approximately 100 to 1000 kHz.

[0037] The scanner 200 can deflect the light l emitted from the laser light source 100 onto the electrode current collector 310 coated with an active material or onto the electrode 300. The scanner 200 can deflect the light l in at least one of the X-axis direction and the Y-axis direction. The light l deflected by the scanner 200 can be incident on the electrode 300 and can etch the electrode active material 320 of the electrode 300.

[0038] The electrode current collector 310 may have a thin plate shape. The electrode current collector 310 may be made of metal. For example, the electrode current collector 310 may be made of aluminum or copper. The electrode active material 320 may be coated, formed, attached, fixed, or bonded to both sides of the electrode current collector 310. The electrode active material 320 and the electrode current collector 310 may constitute the electrode 300. In this case, the electrode active material 320 may be coated on the electrode current collector 310 in a fluid state, such as a slurry. The coated electrode active material 320 may flow during drying. This may cause the electrode active material 320 to slide at the boundary between the portion of the electrode current collector 310 coated with the electrode active material 320 and the portion of the electrode current collector 310 not coated with the electrode active material 320. Therefore, the thickness of the boundary portion coated with the electrode active material 320 may be thinner than the other coated portions.

[0039] 2, the electrode active material 320 coated on the upper surface of the electrode 300 may slide by an amount corresponding to the length D1. The electrode active material 320 coated on the lower surface of the electrode 300 may slide by an amount corresponding to the length D2. The process of coating the electrode active material 320 on the upper surface of the electrode current collector 310 and the process of coating the electrode active material 320 on the lower surface of the electrode current collector 310 may be performed sequentially. As a result, the process conditions for coating the electrode active material 320 on the upper surface of the electrode current collector 310 may differ from the process conditions for coating the electrode active material 320 on the lower surface of the electrode current collector 310. For example, the temperature and humidity of the electrode active material 320 slurry, the temperature and humidity around the coating device, the temperature of the coating device, the process speed, etc. may differ during the process. As a result, there is a risk that the portion where the electrode active material 320 coated on the upper surface of the electrode current collector 310 starts to slide may not match the portion where the electrode active material 320 coated on the lower surface of the electrode current collector 310 starts to slide. In addition, the sliding length of the electrode active material 320 coated on the upper surface of the electrode current collector 310 may differ from the sliding length of the electrode active material 320 coated on the lower surface of the electrode current collector 310. Referring to Fig. 2, there is a risk of mismatching of the electrode active material 320 coated on both surfaces of the electrode current collector 320 by an amount corresponding to the length D3. This may result in a decrease in the capacity of the electrode, and there is also a concern that a lithium plating phenomenon may occur, in which lithium contained in the electrode active material 320 is precipitated due to a difference in loading amount between the positive and negative active materials facing each other.

[0040] Referring to FIG. 3 , an etching apparatus according to an embodiment of the present invention may be configured to etch at least one of the electrode active material 320 coated on the upper surface of the electrode current collector 310 and the electrode active material 320 coated on the lower surface of the electrode current collector 310. The etching apparatus according to an embodiment of the present invention may etch the electrode 300 so that the coating area of ​​the electrode active material 320 coated on the upper surface of the electrode current collector 310 matches the coating area of ​​the electrode active material 320 coated on the lower surface of the electrode current collector 310. Furthermore, the etching apparatus according to an embodiment of the present invention may etch the electrode 300 to remove a sliding area of ​​the electrode active material 320 coated on the upper surface of the electrode current collector 310 or a sliding area of ​​the electrode active material 320 coated on the lower surface of the electrode current collector 310. For example, referring to FIG. 3 , a processor of the electrode apparatus may set an etching area ea corresponding to a width D4 from the boundary between the area coated with the electrode active material 320 and the area not coated with the electrode active material 320, and then proceed with etching. The width D4 may be a length including the sliding region generated in the coated electrode active material 320. The etching region ea may extend along the X-axis direction while maintaining the width D4.

[0041] Referring to FIG. 4 , the processor may control at least one of the laser light source 100 and the scanner 200. The processor may turn on / off the output of the laser light source 100. The processor may control an emission trigger signal of the laser light source 100. The emission trigger signal may also be referred to as an emission signal or a trigger signal. The processor may also control the scanner 200 to adjust the deflection of the light l. The processor may cause the light l emitted from the laser light source 100 to be incident on the electrode current collector 310 coated with the electrode active material 320 or the electrode 300. The processor may control the laser light source 100 and the scanner 200 so that the light l incident on the electrode 300 moves along a straight line. In this case, the path along which the light l moves may be referred to as an etching line el. The etching lines el may be formed in multiple lines. The multiple etching lines el may be arranged at regular intervals within the etching area ea. The processor may control at least one of the laser light source 100 and the scanner 200 so that the pulse interval D5 (pulse distance) of the light l incident on the electrode current collector 310 or electrode 300 coated with the electrode active material 320 is constant. The pulse interval D5 of the light l may be configured to be constant along the etching line e1. The processor may also control at least one of the laser light source 100 and the scanner 200 so that the pulse overlap D6 (pulse overlap) or overlap rate D6 of the light l incident on the electrode current collector 310 or electrode 300 coated with the electrode active material 320 is constant. The pulse overlap D6 or overlap rate D6 of the light l may be configured to be constant along the etching line e1. For example, the pulse overlap rate D6 may be configured to be approximately 50%.

[0042] According to this configuration of the present invention, the line energy or energy density transferred to the electrode 300 becomes uniform while etching the electrode 300. This allows only the electrode active material 320 to be removed while minimizing damage to the electrode current collector 310.

[0043] Furthermore, this configuration of the present invention can eliminate sliding that occurs in the outer region of the electrode active material 320 coated on the electrode current collector 310 or in the boundary region between the portion coated with the electrode active material 320 and the portion not coated with the electrode active material 320. This improves the quality of the electrode 300.

[0044] Furthermore, this configuration of the present invention allows the electrode active material 320 coated on both sides of the electrode current collector 310 to be matched, thereby increasing the capacity of the electrode 300 and improving the quality of the electrode 300.

[0045] An etching apparatus according to an embodiment of the present invention may include a beam expander 400. The light l emitted from the laser light source 100 may enter the scanner 200 through the beam expander 400. The beam expander 400 may be configured to adjust the diameter or divergence angle of the light l emitted from the laser light source 100. The beam expander 400 may be optionally included in the etching apparatus to precisely control the light l.

[0046] An etching apparatus according to one embodiment of the present invention may include a condenser lens 500. The condenser lens 500 may focus the light l deflected in the scanner 200 toward one point. That is, the condenser lens 500 may focus the light l deflected in the scanner 200 toward one point on the surface of the electrode active material 320 coated on the electrode current collector 310. For example, the condenser lens 500 may be an F-theta (Fθ) focusing lens.

[0047] In this case, the focal length of the condenser lens 500 may be approximately 250 mm or more and 420 mm or less in terms of effective focal length. In addition, the fluence strength of the light 1 emitted from the laser light source 100 is approximately 7 J / cm. 2 or more, and 12J / cm 2 It can be the following:

[0048] The higher the fluence intensity of the light l emitted from the laser light source 100, the greater the volume of the electrode active material 320 that can be removed or etched per pulse. However, if the fluence intensity of the light l exceeds the melting threshold or vaporization threshold of the metal material (aluminum or copper) that constitutes the electrode current collector 310, there is a risk that the electrode current collector 310 may be damaged or melted.

[0049] At this time, the diameter and pulse energy of the light l can be calculated by controlling at least one of the diameter of the light l emitted from the laser light source 100, the focal length of the condenser lens 500, and the magnification of the beam expander 400. Using this, the processor can control the fluence intensity of the light l emitted from the laser light source 100 so that it does not exceed the melting threshold or vaporization threshold of the electrode current collector 310.

[0050] The beam expander 400 of the etching apparatus according to one embodiment of the present invention can be used in combination with a plurality of laser light sources 100. The diameter of the light 1 emitted from a typical laser light source 100 is approximately 7 to 9 mm, and expanding the light 1 can result in a decrease in output, which can reduce process efficiency. Therefore, by arranging a plurality of laser light sources 100 in parallel and using a single beam expander 400, the diameter and divergence angle of the light 1 emitted from the plurality of laser light sources 100 can be collectively controlled, thereby improving process efficiency.

[0051] In this case, the effective focal length of the condenser lens 500 may be approximately 250 mm or more and 420 mm or less. This allows the effective process window to be maximized. In addition, the influence of fluctuations in the focal length and the diameter of the light 1 emitted from the laser light source 100 caused by minute changes in the output of the laser light source 100 or vibrations can be reduced.

[0052] An etching apparatus according to one embodiment of the present invention may include a stage 600. The stage 600 may also be referred to as a die 600. The electrode 300 may be placed on the stage 600. The stage 600 may support or fix the electrode 300. The stage 600 may also be configured to be movable, and a processor may control the movement of the stage 600. This allows the electrode 300 placed on the stage 600 to be movable.

[0053] The laser light source 100 of an etching apparatus according to an embodiment of the present invention can emit nanosecond (ns) light l having an infrared wavelength. This allows the etching apparatus to remove only the electrode active material 320 while minimizing damage to the electrode current collector 310. In contrast, when etching the electrode 300 using light l of picosecond (ps) or shorter wavelengths, there is a high risk of damaging the electrode current collector 310. Furthermore, when etching the electrode 300 using light with a wavelength corresponding to green light or ultraviolet light, there is a high risk of damaging the electrode current collector 310. This is because light corresponding to green light or ultraviolet light can be highly absorbed by the aluminum or copper materials constituting the electrode current collector 310. Therefore, it is preferable to perform etching using nanosecond pulsed light l that has low absorbance for the aluminum or copper materials constituting the electrode current collector 310 but high absorbance for the electrode active material 320. This allows the electrode active material 320 to be removed without damaging the electrode current collector 310.

[0054] The processor of the etching apparatus according to an embodiment of the present invention may control multiple scans within the etching area ea. The processor may also control multiple scans along the etching line el. For example, the number of scans may be two. In contrast, when the coating thickness of the electrode active material 320 is about 150 μm or greater, the number of scans may be three.

[0055] If one attempts to complete etching of the electrode active material 320 with one scan, a laser fluence intensity equal to or greater than the melting threshold of the electrode current collector 310 must be used, which may increase the risk of damaging the electrode current collector 310. Furthermore, if the number of scans is increased to four or more, damage to the electrode current collector 310 can be prevented, but the processing time may be prolonged. Therefore, two or three scans are preferable.

[0056] FIG. 5 is a diagram schematically illustrating a portion of a process in which an electrode 300 is etched by an etching apparatus according to an embodiment of the present invention. FIG. 6 is a diagram illustrating an example of etching an electrode 300 by an etching apparatus according to an embodiment of the present invention. FIG. 7 is a graph illustrating changes in control variables of the etching apparatus while etching an electrode 300 by the etching apparatus according to an embodiment of the present invention. Referring to FIGS. 5 to 7, the processor of the etching apparatus according to an embodiment of the present invention can interrupt the output of the laser light source 100 while the scanning speed of the scanner 200 increases or decreases.

[0057] The etching area ea may include multiple etching lines el1. In this case, the progression directions of adjacent etching lines el1 may be opposite. As a result, after etching has progressed in one of the etching lines el1, it may be necessary to switch the scanning direction to move on to the next etching line el1. Furthermore, before the scanning direction is switched, the scanning speed may be slowed down to zero. Then, after the scanning speed reaches zero, the scanning direction may be switched and the scanning speed may be accelerated. In contrast, the scanning speed may be maintained constant while etching progresses along the etching lines el1. In this case, the etching lines el1 may also be referred to as scan lines el1.

[0058] The processor may turn off the output of the laser light source while the scan direction is switched, or while the scan speed is accelerated after being decelerated to 0. That is, the processor may turn on the output of the laser light source 100 only while the scan speed is held constant.

[0059] While the output of the laser light source 100 is turned off, the virtual locus dcl of the scan focus of the scanner 200 may connect adjacent etching lines el1. The virtual locus dcl of the scan focus may connect the end point of any one etching line el1 to the start point of the adjacent etching line el1. The virtual locus dcl of the scan focus may also be referred to as a virtual scan line dcl, a scan line dcl, or a direction change line dcl. In this case, the virtual locus dcl of the scan focus may be located outside the etching area ea.

[0060] 7, the processor may turn off the emission signal sent to the laser light source 100 while the scanning speed is increasing (section A). Therefore, while the scanning speed is increasing (section A), the linear energy delivered to the electrode 300 becomes zero.

[0061] The processor may then send an emission signal to the laser light source 100 at regular intervals while the scanning speed is maintained constant (section B). Accordingly, while the scanning speed is maintained constant (section B), the linear energy delivered to the electrode 300 can be maintained at a constant value. At this time, the processor may etch the electrode 300 while maintaining a constant pulse interval along the etching line el1.

[0062] Additionally, the processor may turn off the emission signal sent to the laser light source 100 while the scanning speed is decreasing (section C). Therefore, while the scanning speed is decreasing (section C), the linear energy transmitted to the electrode 300 may become zero.

[0063] According to this configuration of the present invention, the electrode 300 can be uniformly etched in the etching region ea, which makes it easier to control the etching of the electrode active material 320 without damaging the electrode current collector 310.

[0064] 5 to 7, a scanner of an etching apparatus according to an embodiment of the present invention may include mirrors 220 and 240 that reflect light 1 emitted from a laser light source 100, and motors 210 and 230 that rotate the mirrors 220 and 240. The processor may control the laser light source 100 to interrupt the output of the laser light source 100 while the rotational angular velocity of the motors 210 and 230 increases or decreases.

[0065] The scanner 200 may include at least one or more mirrors 220 and 240. The scanner 200 may include a first mirror 220 and a second mirror 240. For example, the first mirror 220 may deflect the light l in the Y-axis direction. The second mirror 240 may deflect the light l in the X-axis direction. The first mirror 220 may be connected to a rotation shaft of a first motor 210. The second mirror 240 may be connected to a rotation shaft of a second motor 230. The first motor 210 may rotate the first mirror 220. The second motor 230 may rotate the second mirror 240. The processor may control the rotation of the first motor 210 and the second motor 230 to deflect the light l emitted from the laser light source 100 in the XY plane. Specifically, the processor may control the scanning speed of the etching device by controlling the rotational angular velocity of the first motor 210 and the rotational angular velocity of the second motor 230. In this case, the scanner 200 may further include an encoder provided on the motors 210, 230 or the mirrors 220, 240. The processor may sense the rotational angular velocity of the motors 210, 230 or the mirrors 220, 240 from the encoder.

[0066] For example, the processor may control the laser light source 100 to turn off the output of the laser light source 100 while the rotational angular velocity of at least one of the first motor 210 and the second motor 230 increases or decreases. In this case, while the rotational angular velocity of at least one of the first motor 210 and the second motor 230 increases or decreases (sections A and C), the virtual locus dcl of the scan focus of the scanner 200 may connect adjacent etching lines el1. The virtual locus dcl of the scan focus may connect the end point of any one etching line el1 to the start point of the adjacent etching line el1. Furthermore, while the rotational angular velocity of at least one of the first motor 210 and the second motor 230 increases or decreases, the linear energy transmitted to the electrode 300 becomes zero.

[0067] The processor may then send an emission signal to the laser light source 100 at regular intervals while the rotational angular velocity of at least one of the first motor 210 and the second motor 230 is held constant (section B). Accordingly, while the rotational angular velocity of at least one of the first motor 210 and the second motor 230 is held constant (section B), the linear energy transmitted to the electrode 300 can be maintained at a constant value. At this time, the processor may etch the electrode 300 while maintaining a constant pulse interval along the etching line el1.

[0068] According to this configuration of the present invention, the electrode 300 can be uniformly etched in the etching region ea, which makes it easier to control the etching of the electrode active material 320 without damaging the electrode current collector 310.

[0069] 8 is a diagram showing an example of etching an electrode 300 using an etching apparatus according to an embodiment of the present invention. FIG. 9 is a graph showing changes in control variables of the etching apparatus while etching an electrode 300 using the etching apparatus according to an embodiment of the present invention. Referring to FIG. 5, 8, and 9, the processor of the etching apparatus according to an embodiment of the present invention may control the intervals of the emission signals sent to the laser light source 100 to become shorter as the scanning speed of the scanner 200 increases.

[0070] The processor can control the pulse interval of the light 1 incident on the electrode 300 to be constant by shortening the interval of the emission signal sent to the laser light source 100 as the scanning speed of the scanner 200 increases (section E).

[0071] In addition, the processor can control the pulse interval of light l incident on electrode 300 to be constant by keeping the interval of the emission signal sent to laser light source 100 constant while the scanning speed of scanner 200 is kept constant (section F).

[0072] In this case, the processor may control the laser light source 100 so that the pulse interval when the scanning speed of the scanner 200 increases is equal to the pulse interval when the scanning speed is constant. Also, the processor may control the laser light source 100 so that the linear energy delivered to the electrode 300 when the scanning speed of the scanner 200 increases is equal to the linear energy delivered to the electrode 300 when the scanning speed is constant.

[0073] According to this configuration of the present invention, even if the scanning speed is changed, the pulse intervals formed on the electrode 300 are constant, and the electrode 300 can be uniformly etched in the etching area ea. This makes it easy to control the etching so that the electrode active material 320 is etched without damaging the electrode current collector 310.

[0074] Referring to Figures 5, 8 and 9, the processor of the etching apparatus according to one embodiment of the present invention can control the interval between emission signals sent to the laser light source 100 to be longer as the scanning speed of the scanner 200 decreases.

[0075] The processor can control the pulse interval of light l incident on electrode 300 to be constant by increasing the interval between the emission signals sent to laser light source 100 as the scanning speed of scanner 200 decreases (section G).

[0076] In addition, the processor can control the pulse interval of light l incident on electrode 300 to be constant by keeping the interval of the emission signal sent to laser light source 100 constant while the scanning speed of scanner 200 is kept constant (section F).

[0077] In this case, the processor may control the laser light source 100 so that the pulse interval when the scanning speed of the scanner 200 decreases is equal to the pulse interval when the scanning speed is constant. Also, the processor may control the laser light source 100 so that the linear energy transferred to the electrode 300 when the scanning speed of the scanner 200 decreases is equal to the linear energy transferred to the electrode 300 when the scanning speed is constant.

[0078] According to this configuration of the present invention, even if the scanning speed is changed, the pulse intervals formed on the electrode 300 are constant, and the electrode 300 can be uniformly etched in the etching area ea. This makes it easy to control the etching so that the electrode active material 320 is etched without damaging the electrode current collector 310.

[0079] 5, 8 and 9, the processor of the etching apparatus according to an embodiment of the present invention can control the interval between emission signals sent to the laser light source 100 to become shorter as the rotational angular velocity of the motors 210 and 230 increases.

[0080] The processor can control the pulse interval of the light l incident on the electrode 300 to be constant by shortening the interval of the emission signal sent to the laser light source 100 as the rotational angular velocity of at least one of the first motor 210 and the second motor 230 of the scanner 200 increases (section E).

[0081] In addition, the processor can control the pulse interval of light l incident on electrode 300 to be constant by keeping the interval of the emission signal sent to laser light source 100 constant while the rotational angular velocity of at least one of first motor 210 and second motor 230 of scanner 200 is kept constant (interval F).

[0082] In this case, the processor may control the laser light source 100 so that the pulse interval when the rotational angular velocity of at least one of the first motor 210 and the second motor 230 of the scanner 200 increases is equal to the pulse interval when the rotational angular velocity of at least one of the first motor 210 and the second motor 230 is constant. The processor may also control the laser light source 100 so that the linear energy transferred to the electrode 300 when the rotational angular velocity of at least one of the first motor 210 and the second motor 230 of the scanner 200 increases is equal to the linear energy transferred to the electrode 300 when the rotational angular velocity of at least one of the first motor 210 and the second motor 230 is constant.

[0083] According to this configuration of the present invention, even if the rotational angular velocity of at least one of the first motor 210 and the second motor 230 is changed, the pulse intervals formed on the electrode 300 are constant, and etching of the electrode 300 can proceed uniformly in the etching region ea. This makes it easy to control etching of the electrode active material 320 without damaging the electrode current collector 310.

[0084] Referring to Figures 5, 8 and 9, the processor of the etching apparatus according to one embodiment of the present invention can control the interval between emission signals sent to the laser light source 100 to be longer as the rotational angular velocity of the motors 210 and 230 decreases.

[0085] The processor can control the pulse interval of light l incident on electrode 300 to be constant by lengthening the interval between the emission signals sent to laser light source 100 as the rotational angular velocity of at least one of first motor 210 and second motor 230 of scanner 200 decreases (section G).

[0086] In addition, the processor can control the pulse interval of light l incident on electrode 300 to be constant by keeping the interval of the emission signal sent to laser light source 100 constant while the rotational angular velocity of at least one of first motor 210 and second motor 230 of scanner 200 is kept constant (interval F).

[0087] At this time, the processor may control the laser light source 100 so that the pulse interval when the rotational angular velocity of at least one of the first motor 210 and the second motor 230 of the scanner 200 decreases is equal to the pulse interval when the rotational angular velocity of at least one of the first motor 210 and the second motor 230 is constant. The processor may also control the laser light source 100 so that the linear energy transferred to the electrode 300 when the rotational angular velocity of at least one of the first motor 210 and the second motor 230 of the scanner 200 decreases is equal to the linear energy transferred to the electrode 300 when the rotational angular velocity of at least one of the first motor 210 and the second motor 230 is constant.

[0088] According to this configuration of the present invention, even if the rotational angular velocity of at least one of the first motor 210 and the second motor 230 is changed, the pulse intervals formed on the electrode 300 are constant, and etching of the electrode 300 can proceed uniformly in the etching region ea. This makes it easy to control etching of the electrode active material 320 without damaging the electrode current collector 310.

[0089] The processor of the etching apparatus according to an embodiment of the present invention can control the intervals of the emission signals sent to the laser light source 100 to be constant while the scanning speed of the scanner 200 is kept constant.

[0090] In addition, the processor of the etching apparatus according to one embodiment of the present invention can control at least one of the laser light source 100 and the scanner 200 so that the linear energy density is constant along the trajectory of the light l incident on the electrode current collector 310.

[0091] According to this configuration of the present invention, the electrode 300 can be uniformly etched in the etching region ea, which makes it easier to control the etching of the electrode active material 320 without damaging the electrode current collector 310.

[0092] 10 is a side view of an electrode 300 etched by an etching apparatus according to an embodiment of the present invention. Referring to FIG. 10, the electrode 300 etched by an etching apparatus according to an embodiment of the present invention may be configured so that the coating areas of the electrode active material 320 on both sides are matched. In addition, the coating of the electrode active material 320 on both sides of the electrode 300 may be performed so that the sliding area is removed. This allows the thickness of the coating area of ​​the electrode active material 320 to be configured to be consistent.

[0093] FIG. 11 is a perspective view illustrating an electrode 300 etched using an etching apparatus according to an embodiment of the present invention. FIG. 12 is a perspective view illustrating a tab 330 formed on the electrode 300 etched using an etching apparatus according to an embodiment of the present invention. Referring to FIGS. 11 and 12, the electrode 300 etched using an etching apparatus according to an embodiment of the present invention may include the tab 330. The electrode 300 may include regions u1, u2, and u3 that have not been coated with the electrode active material 320 and regions e1, e2, and e3 that have been coated with the electrode active material 320 and then etched. In this case, some regions u1, u3, e1, and e3 of the electrode current collector 310 may be removed, and the remaining regions u2 and e2 may form the tab 330. The tab 330 may be a part of the electrode current collector 310. At least a portion of the tab 330 may be the region u2 that has not been coated with the electrode active material 320, and the remainder may be the region e2 that has been coated with the electrode active material 320 and then etched. The tab 330 may have a uniform thickness and color. Meanwhile, among the regions u2 and e2 used as the tab 330, the regions e1 and e2 located on both sides of the etched region e2 are regions that are cut out or removed, so they may be etched for process efficiency.

[0094] A battery cell according to one embodiment of the present invention may include an electrode 300 etched using the etching apparatus of the present invention. The electrode 300 may be a positive electrode and / or a negative electrode. An electrode assembly can be manufactured by stacking the positive electrode and the negative electrode with a separator sandwiched therebetween. A plurality of positive and / or negative electrodes may be provided, and a plurality of tabs 330 provided on each of the plurality of electrodes having the same polarity may be electrically connected to an electrode lead. A plurality of electrodes 300 may also constitute a battery cell. In this case, the battery cell may be a pouch-type secondary battery. Such a pouch-type secondary battery may be configured in such a way that the electrode 300 and an electrolyte are housed inside a pouch exterior material. The pouch exterior material may be configured in such a way that the edges of two pouches are sealed with the electrode 300 and the electrolyte housed therein. A pouch-type secondary battery may be configured in such a way that a housing portion is located in the center and a sealing portion surrounds the housing portion. The pouch-type secondary battery may be configured in a rectangular shape having four sides (side edges), and three or four of the four sides may be sealed.

[0095] A battery module according to one embodiment of the present invention may include an electrode 300 etched by the etching apparatus of the present invention. In addition to the electrode 300, such a battery module may further include various other components, such as a bus bar assembly, a module case, a cooling unit, and other battery module components known at the time of filing of the present invention.

[0096] A battery pack according to one embodiment of the present invention may include an electrode 300 etched by the etching apparatus of the present invention. In addition to the electrode 300, such a battery pack may further include various components, such as a so-called battery management system (BMS), bus bars, a pack case, a relay, a current sensor, and other battery pack components known at the time of filing of the present invention.

[0097] Meanwhile, although directional terms such as up, down, left, right, front, and rear are used in this specification, it will be obvious to those skilled in the art of the present invention that these terms are used merely for ease of explanation and may differ depending on the position of the object in question, the position of the observer, etc.

[0098] Although the present invention has been described above using limited embodiments and drawings, it goes without saying that the present invention is not limited to these, and that various modifications and variations can be made by a person having ordinary knowledge in the technical field to which the present invention pertains within the technical spirit of the present invention and the equivalent scope of the appended claims.

Claims

1. A laser light source; a scanner that deflects the light emitted from the laser light source onto an electrode current collector coated with an electrode active material; a processor that controls at least one of the laser light source and the scanner so that the pulse interval of the light incident on the electrode current collector is constant; An etching apparatus comprising:

2. The processor:

2. The etching apparatus according to claim 1, wherein the output of the laser light source is interrupted while the scanning speed of the scanner is increased or decreased.

3. The scanner includes: a mirror that reflects the light emitted from the laser light source; a motor for rotating the mirror; Including, The processor: The etching apparatus according to claim 1 , wherein the output of the laser light source is interrupted while the rotational angular velocity of the motor is increasing or decreasing.

4. The processor:

2. The etching apparatus according to claim 1, wherein the intervals between the emission signals sent to the laser light source are controlled to become shorter as the scanning speed of the scanner increases.

5. The scanner includes: a mirror that reflects the light emitted from the laser light source; a motor for rotating the mirror; Including, The processor:

2. The etching apparatus according to claim 1, wherein the interval between emission signals sent to the laser light source is controlled to become shorter as the rotational angular velocity of the motor increases.

6. The processor:

2. The etching apparatus according to claim 1, wherein the interval between emission signals sent to the laser light source is controlled to become longer as the scanning speed of the scanner decreases.

7. The scanner includes: a mirror that reflects the light emitted from the laser light source; a motor for rotating the mirror; Including, The processor:

2. The etching apparatus according to claim 1, wherein the interval between emission signals sent to the laser light source is controlled to become longer as the rotational angular velocity of the motor decreases.

8. The processor:

2. The etching apparatus according to claim 1, wherein the intervals between emission signals sent to the laser light source are controlled to be constant while the scanning speed of the scanner is kept constant.

9. The processor:

2. The etching apparatus according to claim 1, wherein at least one of the laser light source and the scanner is controlled so that a linear energy density is constant along a trajectory of light incident on the electrode current collector.

10. An electrode that has been etched by the etching apparatus according to any one of claims 1 to 9.

11. A battery cell comprising an electrode etched by the etching apparatus according to any one of claims 1 to 9.

12. A battery module comprising electrodes etched by the etching apparatus according to any one of claims 1 to 9.

13. A battery pack comprising an electrode etched by the etching apparatus according to any one of claims 1 to 9.

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