Temperature-controlled showerhead for processing tools

Abstract

The apparatus includes a showerhead having a disk and a stem coupled to the disk, and an adjuster coupled to the stem. The adjuster includes an adapter with a heater cartridge and a fluid conduit adjacent to the heater cartridge, the fluid conduit extending from a top surface of the adapter through a first cavity in the adapter to a second cavity in the stem. The adapter further includes a bellows having a flange, the bellows coupled to the adapter through the flange.

Description

[Technical Field]

[0001] [Priority Claim] This application claims priority to U.S. Provisional Patent Application No. 63 / 373,981, filed August 30, 2022, entitled "TEMPERATURE CONTROLLED SHOWER HEAD FOR A PROCESSING TOOL," which is incorporated by reference in its entirety. [Background technology]

[0002] Substrate processing for etching and deposition is the backbone of the semiconductor industry. While a variety of processing techniques can be used, virtually all processes utilize showerheads to deliver process gases to the substrate awaiting processing. Depending on the process (deposition or etching), the process gases may be heated to allow chemical deposition or to enhance etching. While heating is important for many processes, maintaining the temperature of the process gas is crucial for process uniformity and reproducibility. Therefore, methods for achieving effective temperature control are being investigated. [Brief explanation of the drawings]

[0003] The materials described herein are illustrated by way of example, and not by way of limitation, in the accompanying drawings. For simplicity and clarity of illustration, elements illustrated in the figures have not necessarily been drawn to scale. For example, the dimensions of some elements may be exaggerated relative to other elements for clarity of illustration. Also, while various physical features may be depicted in their simplified, "idealized" form and shape for clarity of illustration, it should be understood that actual embodiments may only approximate the illustrative ideal. For example, smooth surfaces and right-angle intersections may be depicted while ignoring finite roughness, chamfers, imperfect angle intersections, and structural features formed by nanofabrication techniques. Furthermore, where considered appropriate, reference numerals have been repeated among the figures to indicate corresponding or similar elements.

[0004] [Figure 1] 1 is a cross-sectional view of a process chamber including a showerhead and a substrate support assembly according to an embodiment of the present disclosure.

[0005] [Figure 2] 1 illustrates a cross-sectional view of an apparatus including a showerhead coupled to an adjuster, according to an embodiment of the present disclosure.

[0006] [Figure 3] 3 is a top view of the device of FIG. 2 according to an embodiment of the present disclosure.

[0007] [Figure 4A] FIG. 4 is an isometric view of the fluid conduit shown in FIGS. 2 and 3 according to an embodiment of the present disclosure.

[0008] [Figure 4B] 4B is a cross-sectional view of the fluid conduit of FIG. 4A through line AA' according to an embodiment of the present disclosure.

[0009] [Figure 5] 1 illustrates a cross-sectional view of an apparatus including a showerhead coupled to an adjuster, according to an embodiment of the present disclosure.

[0010] [Figure 6A] FIG. 6 is an isometric view of the fluid conduit shown in FIG. 5 according to an embodiment of the present disclosure.

[0011] [Figure 6B] 6B is a cross-sectional view of the fluid conduit of FIG. 6A through line AA' according to an embodiment of the present disclosure.

[0012] [Figure 7] 1 illustrates a cross-sectional view of a system including a showerhead and a substrate support assembly according to an embodiment of the present disclosure.

[0013] [Figure 8] 1 is a flow diagram of a method for controlling the temperature of a showerhead during substrate processing according to an embodiment of the present disclosure.

[0014] [Figure 9A] 8 is a cross-sectional view of the system of FIG. 7 under operating conditions where the temperature of the showerhead increases during processing, in accordance with an embodiment of the present disclosure.

[0015] [Figure 9B] 8 is a cross-sectional view of the system of FIG. 7 under operating conditions in which the temperature of the showerhead is reduced during processing, in accordance with an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0016] An apparatus for diverting heat flow in a process tool is described. In the following description, several specific details, such as structural schemes, are set forth in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that embodiments of the present disclosure may be practiced without these specific details. In other instances, well-known features, such as radio frequency sources, are not described in great detail so as not to unnecessarily obscure embodiments of the present disclosure. Furthermore, it should be understood that the various embodiments shown in the figures are representative examples and are not necessarily drawn to scale.

[0017] In some instances, in the following description, well-known methods and devices are shown in block diagram form rather than in detail in order to avoid obscuring the disclosure. Throughout this specification, the use of "an embodiment," "one embodiment," or "some embodiments" means that a particular feature, structure, function, or characteristic described in connection with an embodiment is included in at least one embodiment of the present disclosure. Thus, the appearances of the phrases "in an embodiment," "in one embodiment," or "some embodiments" in various places throughout this specification do not necessarily refer to the same embodiment of the present disclosure. Furthermore, particular features, structures, functions, or characteristics may be combined as appropriate in one or more embodiments. For example, a first embodiment may be combined with a second embodiment wherever particular features, structures, functions, or characteristics associated with the two embodiments are not mutually exclusive.

[0018] As used herein, the terms "coupled" and "connected," along with their derivatives, may be used to describe a functional or structural relationship between components. These terms are not intended as synonyms for each other. Rather, in particular embodiments, "connected" may be used to indicate that two or more elements are in direct, physical, optical, or electrical contact with each other. "Coupled" may be used to indicate that two or more elements are in direct or indirect (with intervening elements present), physical, electrical, or magnetic contact with each other, and / or that two or more elements cooperate or interact with each other (e.g., causally).

[0019] As used herein, "above," "below," "between," and "on" may generally refer to the relative location of one component or material with respect to another component or material, where such physical relationship is notable. Unless these terms are modified to "directly" or "directly," one or more intervening components or materials may be present. A similar distinction is made with respect to part assemblies. As used herein and in the claims, a list of items described by "at least one" or "one or more" may refer to any combination of the listed items.

[0020] As used herein, "adjacent" may generally mean next to another thing (e.g., immediately adjacent to or near one or more intervening things) or adjacent (e.g., bordering) a location.

[0021] The terms "substantially equal," "approximately equal," and "approximately equal," unless expressly stated in their use, mean that there is only a slight difference between the two items so described. In the present technology, such a difference is typically within + / - 10% of the reference value.

[0022] Processing tools are used to accomplish various deposition and etching processes in semiconductor device manufacturing. Processing tools can include a process chamber and one or more substrate support assemblies for single-wafer or multiple-wafer processing capabilities for batch processing. The substrate support assembly may include various components such as cooling gas lines, push pins, RF lines, and heating electrodes. Heating electrodes within the substrate support assembly may be implemented to promote or enhance chemical reactivity to facilitate substrate processing. The process chamber may be heated to provide uniform processing conditions for multiple-wafer processing.

[0023] The processing tool further includes a gas delivery system and a showerhead coupled to the gas delivery system. In at least one embodiment, process gases may be delivered through the showerhead to a substrate mounted on the substrate support assembly at a desired processing temperature. In at least one embodiment, the desired processing temperature may be greater than room temperature. In some such embodiments, the showerhead may include an electrically conductive material. In at least one embodiment, the electrically conductive material may be heated to maintain the desired processing temperature of the process gases. However, the substrate support assembly may be heated. In at least one embodiment, the substrate support assembly may be heated to a temperature greater than the temperature of the process gases or the showerhead. During processing, heat may be dissipated from the substrate support assembly. Heat dissipated from the chamber as well as the substrate support assembly may affect the temperature of the showerhead. For example, absorption of heat dissipated from the substrate support assembly may increase the temperature of the showerhead. Temperature changes (e.g., an increase in temperature) at the showerhead may change the properties of the delivered gases. Additionally, temperature changes at the showerhead may be non-uniform across the surface area of ​​the showerhead. A non-uniform temperature region near the showerhead exit hole can result in non-uniform processing conditions across the substrate. Additionally, temperature variations at the showerhead can occur during processing or between processing two consecutive substrates.

[0024] To minimize fluctuations in processing temperature, it may be desirable to implement a temperature control system integrated locally within the showerhead. In at least one embodiment, the apparatus for controlling temperature includes an adjuster coupled to the showerhead. The adjuster is a structure including a thermally conductive material. In at least one embodiment, the adjuster further includes one or more fluid conduits as well as one or more heater cartridges. In at least one embodiment, the heater cartridges may be inserted into respective cavities within the adjuster and the showerhead and be in thermal contact with the adjuster and the showerhead. In at least one embodiment, the one or more fluid conduits may at least partially surround the one or more heater cartridges and carry water or other chemicals to reduce the ambient temperature of the adjuster and the showerhead. In at least one embodiment, the fluid conduits may be formed by grooves within the adjuster body. In at least one embodiment, to achieve functionality, the showerhead and the adjuster may be in thermal equilibrium with each other. In at least one embodiment, the adjuster may be mechanically coupled to a stabilizer system such that the showerhead is substantially equilibrium with the water surface.

[0025] At the beginning of a processing operation, temperatures may be monitored by temperature sensors at one or more locations on the showerhead and adjuster. In at least one embodiment, the substrate support assembly temperature and chamber temperature may be set to desired set points. In at least one embodiment, the temperature of the showerhead and adjuster may be regulated by a combination of heating and cooling. In at least one embodiment, the heater cartridge may include a resistive heating element activated, for example, by the passage of electrical current. In at least one embodiment, the heater cartridge may locally heat the material of the adjuster and showerhead, for example, by thermal conduction. The heat may be rapidly transferred throughout the conductive material. Fine temperature adjustment may be achieved by simultaneously passing a cooling fluid through one or more fluid conduits. In at least one embodiment, the one or more fluid conduits may perform localized cooling, and the cooling effect may be rapidly transferred throughout the conductive material. For example, heat from the showerhead may be transferred to a cooled adjuster, resulting in a reduction in the temperature of the showerhead. In at least one embodiment, the temperature of the showerhead may be monitored in real time by one or more temperature sensors. In at least one embodiment, an active feedback mechanism may be implemented to control the desired temperature set point for the duration of the process or longer. In at least one embodiment, an additional feedback mechanism may be implemented to actively account for predicted temperature changes during processing (e.g., early or late in processing).

[0026] 1 is a cross-sectional view of a system 100 including a showerhead 102 and a substrate support assembly 104, according to at least one embodiment. In at least one embodiment, the showerhead 102 includes a stem 106 and a disk 108 coupled to the stem 106. In at least one embodiment, the showerhead 102 includes a cavity 110. The cavity 110 is in communication with a gas delivery conduit 112. In at least one embodiment, the gas delivery conduit 112 is in communication with a gas source 114.

[0027] Here, a "disk" may generally refer to a circular object having an internal cavity. Here, a "showerhead" may generally refer to an apparatus that distributes process gases to a process chamber. In at least one embodiment, the showerhead 102 may generally comprise a non-conductive material or a conductive material, such as quartz. In at least one embodiment, the showerhead 102 comprises a conductive material, such as aluminum. Here, the term "stem" may generally refer to a columnar structure. In at least one embodiment, the columnar structure may be a hollow cylinder or a solid cylinder with a cavity. The columnar structure may be a tube. Here, a "cavity" may generally refer to a hollow structure within a solid object. The cavity may have a variety of shapes and sizes, both regular and irregular. Here, a "gas delivery tube" may generally refer to a tube comprising a conductive material with a hollow interior. In at least one embodiment, the tube may be double-walled with an insulating barrier between them to provide thermal insulation from the surroundings. The gas delivery tube 112 may be heated. A "gas source" herein may generally refer to a container or storage facility for one or more process gases. In the figures, the gas source 114 is shown adjacent to the showerhead 102, although the gas delivery tube 112 is not drawn to scale in the figures. A "substrate support assembly" herein may generally refer to a plate electrode connected to a stem. In at least one embodiment, the substrate support assembly may include an electrostatic chuck that includes heating and / or cooling elements to aid in substrate processing. In at least one embodiment, the substrate support assembly may be connected to a radio frequency power source.

[0028] In at least one embodiment, temperatures T1, T2, and T3 of the showerhead 102, the substrate support assembly 104, and the gas source 114, respectively, may be monitored when the system 100 is not in use or is not processing a substrate. In at least one embodiment, temperatures T1, T2, and T3 may be monitored by temperature sensors coupled to the showerhead 102, the substrate support assembly 104, and the gas source 114. In at least one embodiment, during operation, gas 116 flows from the gas source 114 through the gas delivery tube 112 and the cavity 110 and impinges on the distribution plate 118. As used herein, a "distribution plate" may generally refer to an opaque structure that provides a barrier to impinging gas molecules. In at least one embodiment, during operation, the gas 116 impinging on the distribution plate 118 spreads within the cavity 119 of the disk 108 and enters the holes 120 in the disk 108. The gas 116 flows toward a substrate 122 placed on the substrate support assembly 104. In at least one embodiment, the gas may be used to perform etching or deposition. In at least one embodiment, the substrate support assembly 104 is heated, and temperature T3 may be substantially greater than T2. ​​In at least one embodiment, the gas 116 may be heated in the gas source 114 to temperature T1. In at least one embodiment, temperature T1 is substantially less than temperature T3. In at least one embodiment, temperature T1 may be substantially less than temperature T3, and temperature T2 may be substantially equal to room temperature. In at least one embodiment, heat 124 may radiate from the substrate 122 and substrate support assembly 104 during processing, causing temperature T2 to fluctuate. In at least one embodiment, fluctuations in temperature T2 may affect the properties of the gas 116 passing through the cavity 110. Without active control of temperature T2 during processing or between subsequent substrate 122 processing, changes in gas properties may adversely affect etch or deposition rates. Therefore, temperature control of the showerhead 102 is highly desirable.

[0029] FIG. 2 is a cross-sectional view of an apparatus 200 including a showerhead 202 including a disk 204 and a stem 206 coupled to the disk 204, according to at least one embodiment. In at least one embodiment, the disk 204 may include a hollow cavity 208 and holes 210 for process gas distribution. In at least one embodiment, the showerhead 202 includes a highly thermally conductive material, such as aluminum. In one example, the highly thermally conductive material may have a thermal conductivity greater than 80 Watts per meter per degree Kelvin (W / mK). In at least one embodiment, the apparatus 200 further includes an adjuster 212 coupled to the stem 206. The term “adjuster” as used herein may refer to a structure that provides adjustment, such as temperature control or mechanical control (e.g., tilt function), to a connected structure. In at least one embodiment, the adjuster 212 includes a highly thermally conductive material. In at least one embodiment, the adjuster 212 includes aluminum. In an embodiment, the adjuster 212 includes an adapter 214 and a bellows 216 coupled to the adapter 214. In at least one embodiment, the adapter 214 further includes a heater cartridge 218 and a fluid conduit 220 adjacent to the heater cartridge 218.

[0030] In at least one embodiment, the fluid conduit 220 and the adapter 214 may have a cylindrical structure to facilitate routing of the heater cartridge 218. As used herein, "adapter" may generally refer to a structure that allows two or more objects to be connected to one another. In at least one embodiment, the adapter may have specific internal features and structures. In at least one embodiment, the adapter 214 includes a cylindrical portion 219 and a cylindrical portion 221. The cylindrical portions 219 and 221 are contiguous. In at least one embodiment, the cylindrical portions 219 and 221 have diameters D1 and D2, respectively. In at least one embodiment, the diameters D1 and D2 are different. The different diameters D1 and D2 of the cylindrical portions 219 and 221, respectively, facilitate the connection of the bellows 216 between the cylindrical portion 221 and the support structure 222. In at least one embodiment, the support structure 222 is a component of a process chamber that houses the apparatus 200. In at least one embodiment, the adapter 214 further includes holes or cavities for restraints such as bolts or for passing components used to implement temperature control of the showerhead 202 .

[0031] In at least one embodiment, the device 200 includes three heater cartridges. A "heater cartridge," as used herein, may generally refer to a heating element that conductively or radiatively radiates heat to a surrounding area. In at least one embodiment, the heater cartridges 218A and 218B are visible in cross section. In at least one embodiment, the heater cartridge 218A extends from the adapter surface 214A through the cavity 226 of the adapter 214 to the cavity 224 of the stem 206. In at least one embodiment, the surface 214A may be the top surface of the adapter 214. The heater cartridges 218A and 218B may be resistively heated by passing an electric current through a filament within the body of the heater cartridge. In at least one embodiment, the heater cartridges 218A and 218B may be at least 5 mm wide. In at least one embodiment, the heater cartridges 218A and 218B are between 5 mm and 15 mm wide. In at least one embodiment, the heater cartridges 218A and 218B extend at least 50% of the length of the stem 206, measured from the interface 227 between the stem 206 and the adapter 214. In the illustrated embodiment, the heater cartridges 218A and 218B extend at least 75% of the length of the stem 206.

[0032] In at least one embodiment, the fluid conduit 220 is positioned near the interface 227 to advantageously provide thermal conductivity to the showerhead 202 by flowing a temperature-controlled fluid or coolant therethrough. Here, the terms fluid and coolant may be used interchangeably. In at least one embodiment, the flow of coolant through the fluid conduit 220 can reduce the temperature of the adapter 214 and the showerhead 202, which is in thermal contact with the adapter 214. In at least one embodiment, the coolant can be maintained at a certain temperature range, and the flow rate of the coolant in the fluid conduit 220 can be controlled to regulate heat exchange with the adapter 214.

[0033] In at least one embodiment, the fluid conduit 220 may be a flow channel within the sidewall 214B of the cylindrical portion 219 of the adapter 214. In at least one embodiment, the fluid conduit 220 may extend the length of a portion of the cylindrical portion 219, as shown. In at least one embodiment, the flow channel within the sidewall 214B provides at least three surfaces for the refrigerant flowing within the fluid conduit 220 to contact the adapter 214. In at least one embodiment, the fluid conduit 220 is covered by a cap 228 that extends along the sidewall 214B. A "cap" as used herein may generally refer to an object used to cover an open structure, such as a flow channel. In at least one embodiment, the cap 228 comprises the same or substantially the same material as the adapter 214. In at least one embodiment, the cap 228 may be in thermal equilibrium with the adapter 214. A "fluid conduit" as used herein may generally refer to a structure, such as a flow channel or a body, that can support fluid flow. In at least one embodiment, the fluid conduit 220 may be a tube that is separate from but in thermal contact with the adapter 214. In some such embodiments, the fluid conduit 220 in tubular form may surround the stem 206. Further details and embodiments of the fluid conduit 220 are described below.

[0034] In at least one embodiment, the showerhead 202 further comprises a cavity 230 extending from the disk 204 to the top of the stem 206. In at least one embodiment, the stem 206 may further be connected to a hollow cylinder 232 directly above the cavity 230. In at least one embodiment, the hollow cylinder 232 includes a cavity 234 having a width substantially the same as the width of the cavity 230. The cavities 230 and 234 together form a conduit used to convey or facilitate the flow of gas from the gas source 114 towards the holes 210 in the disk 204.

[0035] In at least one embodiment, bellows 216 further comprises a convolution 216A between flanges 216B and 216C. The term "bellows" herein may generally refer to a device used to connect two objects that require structural adjustment (e.g., tilting). The term "convolution" herein may generally refer to a flexible accordion-type structure that can expand, collapse, and tilt within 5 degrees. The term "flange" herein may generally refer to a metal structure that can be connected to an external structure. In at least one embodiment, convolution 216A may comprise a stainless steel material and may be welded to flanges 216B and 216C. Flanges 216B and 216C may also comprise a stainless steel material. The number of convolutions 216A may depend on the height H of bellows 216. B may vary depending on the

[0036] In at least one embodiment, the adapter 214 is connected to a flange 216C. As shown, the cylindrical portion 221 of the adapter 214 rests on the flange 216C. In at least one embodiment, the flange 216B is supported by a support structure 222. The adjuster 212 and showerhead 202 may be tilted (with respect to the z-axis) relative to the flange 216B by adjusting the tilt adjustment screws 236A and 236B. In at least one embodiment, adjusting the tilt adjustment screws 236A and 236B can orient the showerhead surface 204A to be parallel to the surface of a substrate placed on an underlying substrate support assembly (not shown). In at least one embodiment, it is highly desirable for the showerhead surface 204A to be parallel to the substrate, since gases exiting through the holes 210 distributed throughout the showerhead 202 travel equal distances to the underlying substrate 122. In at least one embodiment, a non-parallel showerhead surface 204A can cause changes in gas trajectories. In at least one embodiment, variations in gas trajectory can result in differences in etch or deposition rates across the substrate, causing process non-uniformity.

[0037] 3 is a top view 300 of the adapter 214 in accordance with at least one embodiment of the present disclosure. In at least one embodiment, the adapter 214 includes three tilt adjustment screws 236A, 236B, and 236C. In at least one embodiment, the tilt adjustment screws 236A, 236B, and 236C are substantially equidistant from each other and from the axial center 301 of the adjuster 212. In at least one embodiment, the tilt adjustment screws 236A, 236B, and 236C, as positioned, can provide substantial fine adjustment of the tilt angle between the showerhead surface 204A ( FIG. 2 ) and the surface of the substrate support assembly, as described below.

[0038] In at least one embodiment, three heater cartridges 218A, 218B, and 218C are shown. In at least one embodiment, heater cartridges 218A, 218B, and 218C may be evenly distributed from axial center 301. In at least one embodiment, heater cartridges 218A, 218B, and 218C are distributed the same radial distance from axial center 301. In at least one embodiment, heater cartridges 218A, 218B, and 218C as arranged can provide substantial uniformity in heat transport throughout the volume of adjuster 212.

[0039] In at least one embodiment, fluid conduit 220 follows a substantially circular path. Pipe segments 302 and 304 connect to fluid conduit 220 to provide an inlet and an outlet, respectively, for fluid flow through fluid conduit 220. Pipe segments 302 and 304 further connect to fittings 306 and 308, respectively, to provide connection to supply and drain pipes (not shown). Fittings 306 and 308 may include connectors.

[0040] In at least one embodiment, heater cartridges 218A, 218B, and 218C are radially dispersed between cavity 230 and fluid conduit 220. Heater cartridges 218A, 218B, and 218C may be radially spaced at least 5 cm from fluid conduit 220.

[0041] In at least one embodiment, adapter 214 undergoes heat exchange with a refrigerant flowing within fluid conduit 220 during operation. In at least one embodiment, heat may be transferred from adapter 214, which may be at a high temperature, to the refrigerant, which is maintained at a low temperature. In at least one embodiment, the refrigerant circulating within fluid conduit 220 flows toward an outlet (e.g., via fitting 308), thereby allowing heat to escape from adapter 214. Tubing segments 302 and 304 do not have to be coplanar with fluid conduit 220. For example, tubing segments 302 and 304 may extend out of the plane of the figure.

[0042] 4A is an isometric view 400 of fluid conduit 220 including tube segments 302 and 304, in at least one embodiment. In at least one embodiment, adapter 214 is not shown for clarity. In at least one embodiment, a portion of cap 228 covering fluid conduit 220 is shown to provide information about the volume and shape of fluid conduit 220. In at least one embodiment, fluid conduit 220 is a partial cylinder with a break 402. In at least one embodiment, fluid conduit 220 is connected to tube segments 302 and 304. In at least one embodiment, tube segments 302 and 304 extend from fluid conduit 220 along vertical and horizontal directions. In at least one embodiment, tube segments 302 and 304 provide a continuous path for fluid to flow into and out of fluid conduit 220.

[0043] In at least one embodiment, tube portion 302 includes a vertical portion 302A and a horizontal portion 302B connected to vertical portion 302A. In at least one embodiment, tube portion 304 includes a vertical portion 304A and a horizontal portion 304B connected to vertical portion 304A. In at least one embodiment, vertical portions 302A and 304A and horizontal portions 302B and 304B may be grooves or channels in cylindrical portion 221 (not shown).

[0044] 4B is a cross-sectional view 410 of the structure of FIG. 4A through line A-A'. Portions of adapter 214 and cap 228 are also shown for context. In at least one embodiment, fluid conduit 220 has the same structure as that shown in FIG. 2. In at least one embodiment, fluid conduit 220 allows for heat exchange between the fluid flowing within fluid conduit 220 and surfaces 214C, 214D, and 214E. In at least one embodiment, the fluid volume is 100 sq ft across a cross-sectional area A F (The height H of the fluid pipe 220 F and width W F In at least one embodiment, if the fluid conduit 220 is a flow path within the cylindrical portion 219 of the adapter 214, the maximum height of the fluid conduit 220 is determined by the height of the cylindrical portion 219. In at least one embodiment, the cross-sectional shape of the fluid conduit 220 may be determined by the total heat capacity to be reduced within the adapter 214. In at least one embodiment, the total heat capacity to be reduced may depend on the total contact surface area between the fluid and the adapter 214. In at least one embodiment, the total contact surface area may be increased by the presence of grooves (described below) or protrusions from the surface 214D. In at least one embodiment, a fixed W F , the protrusion from surface 214D reduces the total volume of fluid that can flow through fluid conduit 220.

[0045] 5 is a cross-sectional view of a device 500 according to an embodiment of the present disclosure. In at least one embodiment, device 500 includes all of the features of device 200 except for fluid conduit 220. In at least one embodiment, device 500 includes a fluid conduit 502 that includes one or more characteristics of fluid conduit 220. Fluid conduit 502 includes grooves or channels. In at least one embodiment, fluid conduit 502 includes three channels 502A, 502B, and 502C. Channels 502A, 502B, and 502C are covered by cap 228 as shown.

[0046] 6A is an isometric view 600 of fluid conduit 502 including tube segments 504 and 506, according to at least one embodiment. In at least one embodiment, adapter 214 is not shown for clarity. In at least one embodiment, a portion of cap 228 covering fluid conduit 502 is shown to provide information regarding the volume of fluid conduit 502. As shown, channels 502A, 502B, and 502C are molded into cylindrical rings with cuts 602. In at least one embodiment, the individual cylindrical rings do not contact each other, but each channel 502A, 502B, and 502C is connected to tube segment 504 at a first end and to tube segment 506 at a second end. In at least one embodiment, tube segments 504 and 506 provide a path for fluid to flow into and out of each channel 502A, 502B, and 502C.

[0047] In at least one embodiment, pipe section 504 includes a vertical section 504A and a lateral section 504B connected to vertical section 504A. In at least one embodiment, pipe section 506 includes a vertical section 506A and a lateral section 506B connected to vertical section 506A. In at least one embodiment, lateral section 504B may connect to a fluid source and lateral section 506B may connect to a fluid drain.

[0048] Figure 6B is a cross-sectional view 610 through line A-A' of the structure of Figure 6A. For context, a portion of the adapter 214 and cap 228 are also shown. In at least one embodiment, the fluid conduit 502 has the same structure as that shown in Figure 5. The fluid conduit 502 allows for heat exchange between the fluid flowing within the fluid conduit 502 and various surfaces within the adapter 214 during operation.

[0049] In at least one embodiment, the fluid volume of the fluid conduit 502 is determined by the cross-sectional area A of the individual flow channels 502A, 502B, and 502C. N is proportional to the cross-sectional area A N is the height H of each of the channels 502A, 502B, and 502C. F and width W Fand . In at least one embodiment, when the fluid conduit 502 is confined to the cylindrical portion 219 of the adapter 214, the maximum height of the individual flow channels 502A, 502B, and 502C is limited by the height of the cylindrical portion 219. The cross-sectional shape of the individual flow channels 502A, 502B, and 502C may be determined by the total heat capacity to be reduced within the adapter 214. The total heat capacity to be reduced may depend on the total surface area of ​​contact between the fluid and the adapter 214. In at least one embodiment, the total surface area of ​​contact may be increased by the presence of protrusions within the adapter 214.

[0050] In at least one embodiment, the total contact surface area in fluid conduit 502 is increased compared to the total contact surface area in fluid conduit 220 (FIGS. 4A and 4B) having a partial cylindrical shape. In at least one embodiment, fluid that may be transported in flow path 502A contacts surfaces 214E, 214F, and 214G. In at least one embodiment, fluid that may be transported in flow path 502B contacts surfaces 214H, 214I, and 214J. In at least one embodiment, fluid that may be transported in flow path 502C contacts surfaces 214C, 214K, and 214L. In at least one embodiment, there is no contact between the fluid and surfaces 214X and 214Y, so these surfaces do not contribute to surface conduction.

[0051] In at least one embodiment, there may be a net reduction in fluid capacity of fluid conduit 502 compared to fluid conduit 220 (FIG. 4B). In at least one embodiment, an increase in the total contact surface area in fluid conduit 502 may increase the total amount of heat exchange between the fluid transported in fluid conduit 502 and adapter 214. The height H of flow channels 502A, 502B, and 502C C The spacing S between successive channels (e.g., 502A and 502B, or 502B and 502C) C It should be appreciated that can be adjusted to control the total contact surface area. In at least one embodiment, the individual channels 502A, 502B, and 502C have the same or substantially the same height H C Furthermore, the spacing S between the channels (for example, 502A and 502B, or 502B and 502C)C However, in other embodiments, the height H of each of the channels 502A, 502B, and 502C is the same or substantially the same. C In at least one embodiment, the spacing S between the flow channels 502A and 502B is C is the distance S between 502B and 502C C may be different from.

[0052] Although three channels 502A, 502B, and 502C are shown in FIGS. 5, 6A, and 6B, the number of channels may be greater than three and depends on the vertical thickness of the cylindrical portion 219.

[0053] In at least one embodiment, the fluid conduit 502 may comprise a volute structure. The volute structure may be connected between a first end connector and a second end connector. In at least one embodiment, the first end connector and the second end connector may not be coplanar. In at least one embodiment, the end connector may be a coupling used to connect the volute structure to a refrigerant source or a refrigerant drain. Such a volute structure may not include a vertical pipe portion. In at least one embodiment, the volute structure may be implemented with tubes. The tubes may be located within the flow paths 502A, 502B, and 502C.

[0054] 7 is a cross-sectional view of a system 700 including the apparatus 500 and the substrate support assembly 104 in accordance with an embodiment of the present disclosure. In at least one embodiment, the system 700 includes temperature sensors 702, 704, and 706. In at least one embodiment, the temperature sensors 702, 704, and 706 are coupled to the showerhead 202, the gas source 114, and the substrate support assembly 104, respectively. In at least one embodiment, the temperature sensors 702, 704, and 706 may be coupled to individual components designed to set the temperatures of the showerhead 202, the gas source 114, and the substrate support assembly 104, respectively. In at least one embodiment, such individual components may include temperature controllers. In at least one embodiment, the temperature sensors 702, 704, and 706 measure temperatures T1, T2, and T3 of the gas source 114, the showerhead 202, and the substrate support assembly 104, respectively. In at least one embodiment, measurements can be made in real time while the system 700 is processing the substrate 122. In at least one embodiment, active feedback from the temperature sensors 702, 704, and 706 can be used to modify the temperature of the showerhead 202.

[0055] FIG. 8 shows a flow diagram of a method 800 of operating an apparatus (e.g., apparatus 500) of system 700 (FIG. 7) in accordance with an embodiment of the present disclosure. In at least one embodiment, method 800 begins at operation 810 by providing system 700 (FIG. 7). In at least one embodiment, method 800 continues at operation 820 by setting a first setpoint temperature for a substrate support assembly and a second setpoint temperature for a showerhead. In at least one embodiment, method 800 continues at operation 830 by placing a substrate on the substrate support assembly and flowing process gas through the showerhead toward the substrate to process the substrate. In at least one embodiment, method 800 continues at operation 840 by monitoring the temperature on the showerhead and comparing the monitored temperature to a second setpoint temperature. In at least one embodiment, method 800 ends at operation 850 by controlling the temperature on the showerhead by controlling power to a heater cartridge and / or controlling fluid flow through a fluid conduit if the monitored temperature differs from the second setpoint temperature.

[0056] 9A is a cross-sectional view of a system 700 including the apparatus 500 and the substrate support assembly 104 during processing of a substrate 122 in accordance with an embodiment of the present disclosure. As described with respect to FIG. 7, measurements can be taken while the system 700 is processing the substrate 122. In at least one embodiment, active feedback from temperature sensors 702, 704, and 706 can be used to change the temperature of the showerhead 202. In at least one embodiment, the temperature T2 of the showerhead 202 can be changed by applying power to the heater cartridges 218A and 218B and / or by flowing fluid through the fluid conduit 502. In at least one embodiment, the setpoint temperature of the showerhead 202 can be lower than the setpoint temperature of the substrate support assembly 104. In at least one embodiment, the initial temperature T2 is lower than the initial temperature T1.

[0057] In at least one embodiment, temperature T2 may increase as processing begins. In at least one embodiment, temperature T2 may increase because heat (shown by arrow 900) from the substrate support assembly 104 radiates toward the showerhead 202, increasing temperature T2. Because the showerhead 202 is in thermal contact with the adjuster 212, temperature changes in the showerhead 202 can be compensated for by cooling the interior of the adjuster 212. Heat may be transferred from the showerhead 202 to the adjuster 212 (shown by arrow 902). In at least one embodiment, the fluid flow rate in the fluid conduit 502 may be increased to draw heat from the showerhead 202, allowing for rapid heat exchange with the body of the adjuster 212. In at least one embodiment, if power is initially applied to the heater cartridges 218A and 218B, the applied power may be reduced to reduce the temperature within the adjuster 212 and the showerhead 202. In at least one embodiment, the system 700 provides two paths for controlling the temperature rise in the showerhead 202 while processing the substrate 122.

[0058] 9B is a cross-sectional view of the system 700 during processing of a substrate 122 in accordance with an embodiment of the present disclosure. In at least one embodiment, the setpoint temperature of the substrate support assembly 104 may be lower than the setpoint temperature of the showerhead 202. For example, the initial temperature T2 is higher than the initial temperature T1. In at least one embodiment, a lower temperature (e.g., a temperature less than 70° C.) of the substrate support assembly 104 may be desirable for certain processing conditions. In at least one embodiment, the showerhead 202 may be heated to a temperature T2 that is substantially the same as temperature T1 (T1 being the temperature of the gases in the gas source 114). In at least one embodiment, the temperature T1 of the process gas may be heated to the process temperature before passing through the cavities 234 and 230 and out the holes 210 (illustrated by arrow 910).

[0059] In at least one embodiment, temperature T2 may decrease as processing begins. In at least one embodiment, temperature T2 may decrease because heat (illustrated by arrow 904) radiates from the showerhead 202 toward the substrate support assembly 104, decreasing temperature T2. In at least one embodiment, power applied to the heater cartridges 218A and 218B may increase, increasing the temperature within the showerhead 202. Because the heater cartridges 218A and 218B extend to both the adjuster 212 and the showerhead 202, there are two paths for heating the showerhead 202. Some of the heat may be generated within the showerhead 202, and another portion of the heat may be generated within the adjuster 212. The heat generated from the adjuster 212 may be transferred to the showerhead 202 (illustrated by arrow 906). In at least one embodiment, if a fluid is flowing through the fluid conduit 502, the flow rate of the fluid may be reduced to maintain temperature T2. In at least one embodiment, a reduction in fluid flow rate may reduce the amount of heat present in the adapter 214. In at least one embodiment, the heater cartridges 218A and 218B and fluid conduit 502 may be used during processing to actively control the temperature of the showerhead 202.

[0060] Example 1: An apparatus comprising: a showerhead including a disk and a stem coupled to the disk; an adjuster coupled to the stem; an adapter including a heater cartridge and a fluid conduit adjacent to the heater cartridge, the heater cartridge extending from a top surface of the adapter through a first cavity in the adapter to a second cavity in the stem; and an adjuster comprising: a bellows having a flange, the bellows coupled to the adapter through the flange.

[0061] Example 2: The apparatus of example 1, wherein the showerhead comprises a cavity extending from the disk to the top of the stem.

[0062] Example 3 is the apparatus of any of the examples, particularly example 2, wherein the showerhead further comprises a hollow cylinder connected to the stem above the cavity.

[0063] Example 4 is the device of any of the examples, particularly example 2, wherein the cavity is cylindrical.

[0064] Example 5 is the device of any of the examples, particularly example 1, wherein the heater cartridge extends at least 50% of the length of the stem.

[0065] Example 6 is the device of any of the examples, particularly example 1, wherein the adjuster further comprises a first cylindrical portion and a second cylindrical portion above the first cylindrical portion, the first cylindrical portion being on the stem and the second cylindrical portion being connected to the flange.

[0066] Example 7 is the device of any of the examples, particularly example 6, wherein the fluid conduit comprises a channel of the adapter in a sidewall of the first cylindrical portion.

[0067] Example 8 is the device of any of the examples, particularly example 7, wherein the flow tube comprises a volute structure.

[0068] Example 9 is the device of any of the examples, particularly Example 7, wherein the fluid conduit includes a first flow path above the second flow path, the first flow path and the second flow path being connected at first respective ends by a first connector, and the first flow path and the second flow path being connected at second respective ends by a second connector.

[0069] Example 10 is the device of any of the examples, particularly example 2, wherein the cavity extends along the axial center of the stem and disc.

[0070] Example 11 is the device of any of the examples, particularly example 10, wherein the heater cartridge is radial between the cavity and the fluid conduit.

[0071] Example 12 is the device of any of the examples, particularly example 11, wherein the heater cartridge is radially spaced at least 5 mm from the fluid conduit.

[0072] Example 13 is the device of any of the examples, particularly example 1, wherein the adjuster comprises three heater cartridges.

[0073] Example 14 is the device of any of the examples, particularly example 1, wherein the adjuster further comprises a tilt adjustment screw coupled to the flange.

[0074] Example 15: A method of controlling a temperature at a showerhead in a processing tool, the method comprising: providing an apparatus, the apparatus comprising: a substrate support assembly; a showerhead comprising a disk and a stem coupled to the disk; an adjuster coupled to the stem, the adjuster comprising: an adapter, the adapter including a heater cartridge and a fluid conduit adjacent to the heater cartridge, the heater cartridge extending from a top surface of the adapter through a first cavity in the adapter to a second cavity in the stem; and a bellows having a flange, the bellows coupled to the adapter through the flange. setting a first setpoint temperature at the substrate support assembly; setting a second setpoint temperature at the showerhead by controlling power to the heater cartridge and / or flowing fluid through the fluid conduit; placing a substrate on the substrate support assembly; performing processing by flowing process gas toward the substrate through the first cavity, the second cavity and the showerhead; monitoring the temperature at the showerhead; and controlling the temperature at the showerhead by controlling power to the heater cartridge and / or flowing fluid through the fluid conduit.

[0075] Example 16 is the method of any of the examples, particularly Example 15, wherein the process gas is heated to the processing temperature before flowing through the first cavity and the second cavity.

[0076] Example 17 is the method of any of the examples, particularly example 16, wherein the first setpoint temperature is greater than the second setpoint temperature.

[0077] Example 18: The method of example 16, wherein the first setpoint temperature is lower than the second setpoint temperature.

[0078] Example 19 is the method of any of the examples, particularly Example 17, wherein the treating increases the second setpoint temperature and controlling the temperature at the showerhead includes reducing power to the heater cartridge and increasing flow through the fluid conduit.

[0079] Example 20 is the method of any of the examples, particularly example 18, wherein the treating reduces the second setpoint temperature and controlling the temperature at the showerhead includes increasing power to the heater cartridge and decreasing flow through the fluid conduit.

[0080] In addition to the description herein, various modifications may be made to the disclosed embodiments without departing from the scope thereof. Therefore, the description of the embodiments herein should not be construed as limiting the scope of the disclosure, but as illustrative only. The scope of the present invention should be determined solely by reference to the claims that follow.

Claims

1. 1. An apparatus comprising: a showerhead having a disk and a stem connected to the disk; an adjuster coupled to the stem, An adapter, A heater cartridge; a fluid conduit adjacent to the heater cartridge, the fluid conduit extending from a top surface of the adapter through a first cavity in the adapter to a second cavity in the stem; an adapter having a bellows having a flange, the bellows being connected to the adapter through the flange; an adjuster having An apparatus comprising:

2. 10. The apparatus of claim 1, the showerhead includes a cavity extending from the disk to an upper portion of the stem.

3. 3. The apparatus of claim 2, The showerhead further comprises a hollow cylinder above the cavity and connected to the stem.

4. 3. The apparatus of claim 2, The device, wherein the cavity is cylindrical.

5. 10. The apparatus of claim 1, The heater cartridge extends at least 50% of the length of the stem.

6. 10. The apparatus of claim 1, the adjuster further comprises a first cylindrical portion and a second cylindrical portion above the first cylindrical portion, the first cylindrical portion being on the stem and the second cylindrical portion being connected to the flange.

7. 7. The apparatus of claim 6, The fluid conduit comprises a flow passage of the adapter in a sidewall of the first cylindrical portion.

8. 8. The apparatus of claim 7, The apparatus, wherein the fluid conduit comprises a volute structure.

9. 8. The apparatus of claim 7, The fluid conduit comprises a first flow path above a second flow path, the first flow path and the second flow path being connected at first respective ends by a first connector, and the first flow path and the second flow path being connected at second respective ends by a second connector.

10. 3. The apparatus of claim 2, The cavity extends along an axial center of the stem and the disk.

11. 11. The apparatus of claim 10, The heater cartridge is radial between the cavity and the fluid conduit.

12. 12. The apparatus of claim 11, The apparatus, wherein the heater cartridge is radially spaced at least 5 mm from the fluid conduit.

13. 10. The apparatus of claim 1, The apparatus, wherein the adjuster comprises three heater cartridges.

14. 10. The apparatus of claim 1, The adjuster further comprises a tilt adjustment screw coupled with the flange.

15. 1. A method for controlling a temperature at a showerhead in a processing tool, comprising: Providing an apparatus, said apparatus comprising: a substrate support assembly; the showerhead having a disk and a stem connected to the disk; an adjuster coupled to the stem, An adapter, A heater cartridge; a fluid conduit adjacent to the heater cartridge, the fluid conduit extending from a top surface of the adapter through a first cavity in the adapter to a second cavity in the stem; an adapter having a bellows having a flange, the bellows being connected to the adapter through the flange; an adjuster having a step of setting a first setpoint temperature in the substrate support assembly; setting a second setpoint temperature at the showerhead by controlling power to a heater cartridge and / or flowing fluid through a fluid conduit; placing a substrate on the substrate support assembly; performing processing by flowing a process gas through the first cavity, the second cavity, and the showerhead toward the substrate; monitoring the temperature at the showerhead; controlling the temperature at the showerhead by controlling power to the heater cartridge and / or controlling fluid flow in a fluid conduit; A method comprising:

16. 16. The method of claim 15, The method wherein the process gas is heated to a processing temperature before flowing through the first cavity and through the second cavity.

17. 17. The method of claim 16, The method, wherein the first setpoint temperature is greater than the second setpoint temperature.

18. 17. The method of claim 16, The method, wherein the first setpoint temperature is lower than the second setpoint temperature.

19. 18. The method of claim 17, The method, wherein the treatment increases the second setpoint temperature and controlling the temperature at the showerhead includes reducing power to the heater cartridge and increasing flow through the fluid conduit.

20. 20. The method of claim 18, The method, wherein the processing reduces the second setpoint temperature and controlling the temperature at the showerhead includes increasing power to the heater cartridge and decreasing flow through the fluid conduit.

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