Heat dissipation fin, thermosiphon heat dissipator and multi-dimensional heat dissipation device

Abstract

A heat dissipation fin, a thermosiphon heat sink, and a multi-dimensional heat dissipation device, relating to the technical field of electronic heat dissipation. The heat dissipation fin includes a housing, an intake port and a drain port installed in the housing, and a gas-liquid chamber installed in the housing. The intake port is used to connect the gas-liquid chamber to an accommodating chamber in a heat dissipation substrate of the thermosiphon heat sink, and the drain port is used to connect the gas-liquid chamber to the accommodating chamber. The intake port has a vertical height greater than that of the drain port. The gas-liquid chamber includes a first guide section used to guide the flow of gas and communicating with the intake port, a second guide section used to guide the flow of liquid and communicating with the drain port, and connecting sections respectively communicating with the first guide section and the second guide section. The angle between the first guide section and the connecting section and the angle between the connecting section and the second guide section are both obtuse angles. The present invention can improve the problem of poor working medium circulation that exists in the prior art, and can improve the heat dissipation performance of the radiator.

Description

[Technical Field]

[0001] This application claims priority to a Chinese patent application filed with the China Patent Office on June 7, 2023, application number 202310674134.0, entitled "Heat Dissipation Fins, Thermosiphon Heat Dissipator and Multi-Dimensional Heat Dissipation Device," the entire contents of which are incorporated herein by reference.

[0002] The present invention relates to the technical field of electronic heat dissipation, more particularly to a heat dissipation fin, and further to a thermosiphon heat dissipator and a multi-dimensional heat dissipation device including said heat dissipation fin. [Background technology]

[0003] In order to meet the heat dissipation needs of electronic devices with high power consumption, related art uses a heat sink based on the thermosiphon principle. This type of heat sink includes a heat dissipation substrate and heat dissipation fins connected to the heat dissipation substrate. Both the heat dissipation substrate and the heat dissipation fins are provided with cavities, and the two cavities are connected. When dissipating heat to an electronic device, a phase change medium circulates between the two cavities, and in this way, heat dissipation for the electronic device is realized based on phase change heat exchange.

[0004] In the process of realizing the present invention, the inventors have found that the prior art has at least the following problems. That is, since the heat dissipation fins do not have a structure for guiding the working medium, there is a large resistance to the flow of the working medium, which results in poor flow of the working medium, thereby affecting the heat dissipation performance of the radiator.

[0005] How to solve the problem of poor working medium flow and improve the heat dissipation performance of the radiator is a current problem that must be solved urgently by those skilled in the art. Summary of the Invention [Problem to be solved by the invention]

[0006] In view of this, an object of the present invention is to provide a heat dissipation fin that can improve the heat dissipation performance of a radiator by improving the problem of poor working medium circulation that exists in the prior art.

[0007] Another object of the present invention is to provide a thermosiphon heat radiator and a multi-dimensional heat radiating device including the heat radiating fins. [Means for solving the problem]

[0008] To achieve the above objectives, the present invention provides the following technical solutions:

[0009] According to a first aspect, the present invention provides a base station communication multi-dimensional heat dissipation device applied to a thermosiphon heat dissipation device, wherein the heat dissipation fins are: Housing and an intake port and a drain port disposed on the housing; a gas-liquid chamber disposed within the housing; the intake port communicates the gas-liquid chamber with a storage chamber in a heat dissipation substrate of the thermosiphon radiator and is used to allow gas in the storage chamber to flow into the gas-liquid chamber; the drain port communicates the gas-liquid chamber with the storage chamber and is used to allow the liquid in the gas-liquid chamber to flow into the storage chamber; The height of the intake port in the vertical direction is greater than the height of the drainage port, The gas-liquid chamber is a first flow guide portion used to guide the flow of gas and communicating with the intake port; a second flow guide portion used to guide the flow of liquid and communicating with the liquid drain port; a connection portion communicating with the first flow guide portion and the second flow guide portion, The angle between the first flow guide portion and the connecting portion and the angle between the connecting portion and the second flow guide portion are both obtuse angles.

[0010] In a possible implementation, the intake port is provided with a third guide portion for guiding the flow of gas, The liquid drain port is provided with a fourth flow guide portion for guiding the flow of liquid.

[0011] In a possible implementation, a plurality of first support members are provided in the gas / liquid chamber, each of the first support members having opposite ends connected to the housing, and each of the first support members having a guide surface.

[0012] In a possible implementation, the housing is provided with at least two of the intake ports, Alternatively, the housing is provided with one intake port and one drain port.

[0013] In a possible implementation, the intake port and the drainage port are located on the same side.

[0014] According to a second aspect, the present invention provides a thermosiphon radiator, the thermosiphon radiator comprising: a heat dissipation substrate having a chamber therein for accommodating a phase change medium; a heat dissipation fin connected to the heat dissipation substrate, The heat dissipation fin is the heat dissipation fin according to any one of the first aspects, and the accommodation chamber communicates with the intake port and the liquid discharge port.

[0015] In a possible implementation, a plurality of second support members are provided in the accommodation chamber, and opposite ends of the second support members are respectively connected to the heat dissipation substrate; The second support members are arranged in a displaced manner.

[0016] According to a third aspect, the present invention provides a multi-dimensional heat dissipation device, the multi-dimensional heat dissipation device comprising: The heat dissipation substrate and heat dissipation fins according to any one of the second aspects; an auxiliary heat dissipation member disposed on a side of the heat dissipation fin away from the heat dissipation substrate, An auxiliary heat dissipation chamber is provided inside the auxiliary heat dissipation member, and the auxiliary heat dissipation chamber communicates with the accommodation chamber.

[0017] In a possible implementation, the auxiliary heat dissipation member comprises: a bottom plate and a cover plate that are connected to each other to form the auxiliary heat dissipation chamber; a gas inlet provided on the bottom plate or the cover plate for communicating the accommodation chamber with the auxiliary heat dissipation chamber; The liquid outlet is provided on the bottom plate or the cover plate, and the liquid outlet is for communicating the auxiliary heat dissipation chamber with the storage chamber.

[0018] In a possible implementation, the gas inlet and the liquid outlet are arranged opposite each other, A guide slope is provided within the auxiliary heat dissipation chamber, with a first side of the guide slope facing the gas inlet and a second side of the guide slope facing the liquid outlet, with an obtuse angle between the first side and the second side.

[0019] In a possible implementation, a plurality of third support members are further provided in the auxiliary heat dissipation chamber, one end of each of the third support members is connected to the bottom plate, and the other end of each of the third support members is connected to the cover plate; The third support members are arranged in a displaced manner.

[0020] In a possible implementation, the third support member has a gas passage therethrough, and the bottom plate and the cover plate each have a through hole at a position corresponding to each of the third support members, and the gas passage communicates with the corresponding through hole to form a complete gas flow path.

[0021] In a possible implementation, the gas inlet communicates with the chamber via an intake pipe, and the liquid outlet communicates with the chamber via a liquid return pipe.

[0022] In a possible implementation, the number of the gas inlet and the intake pipe is one; Alternatively, the number of the gas inlets and the number of the intake pipes are both at least two, and the intake pipes are arranged in parallel.

[0023] In a possible implementation, the heat dissipation substrate, the heat dissipation fins and the auxiliary heat dissipation members are integrally brazed together after the assembly is completed.

[0024] The heat dissipation fin, thermosiphon heat dissipator and multi-dimensional heat dissipation device provided by the present invention have at least the following advantages:

[0025] When using the heat dissipation fin provided by the present invention, the gaseous working medium can pass through the storage chamber in the heat dissipation substrate of the thermosiphon radiator and enter the intake port of the heat dissipation fin. The gaseous working medium then passes along the first flow guide section and the connecting section into the gas-liquid chamber of the housing to undergo phase-change heat exchange. The liquid working medium then passes through the connecting section and the second flow guide section in sequence, and, with the guiding action of the second flow guide section, can enter the storage chamber in the heat dissipation substrate of the thermosiphon radiator through the discharge port.

[0026] One end of the first flow guide section is connected to the intake port, the other end of the first flow guide section is connected to the connecting section, and the angle between the first flow guide section and the connecting section is obtuse, i.e., the first flow guide section is arranged at an angle, which acts as a guide for the gaseous working medium.This makes the process of the gaseous working medium flowing in from the intake port and then along the first flow guide section to the connecting section smoother, and as a result, the guiding effect of the first flow guide section allows the gaseous working medium to flow more quickly into the gas-liquid chamber.

[0027] One end of the second flow guide section is connected to the drain port, and the other end of the second flow guide section is connected to the connecting section. The angle between the connecting section and the second flow guide section is obtuse, i.e., the second flow guide section is arranged at an angle, so that the liquid working medium can flow down the slope and enter the storage chamber in the heat dissipation substrate, which acts as a guide for the liquid working medium. Therefore, the process of the liquid working medium flowing along the connecting section to the second flow guide section and then to the drain port is smoother, so that the liquid working medium can flow more quickly along the second flow guide section to the drain port and ultimately return to the storage chamber in the heat dissipation substrate more quickly.

[0028] Therefore, the heat dissipation fin provided by the present invention achieves the purpose of allowing the gaseous working medium to flow into the gas-liquid chamber more quickly by installing the first flow guide section, and the purpose of allowing the liquid working medium to flow out of the gas-liquid chamber more quickly by installing the second flow guide section, making the flow of the working medium smoother, thereby improving the heat dissipation performance of the heat dissipation fin and further improving the heat dissipation performance of the radiator.

[0029] As described above, the heat dissipation fins provided by the present invention can improve the problem of poor working medium circulation that exists in the prior art, thereby improving the heat dissipation performance of the radiator.

[0030] It should be noted that the thermosiphon radiator and multi-dimensional radiator provided by the present invention include the above-mentioned radiating fins, but these radiating fins have the same advantages as the above-mentioned radiating fins, so the explanation will not be repeated here.

[0031] In order to more clearly describe the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings necessary for describing the embodiments or the prior art. Obviously, the drawings in the following description are only embodiments of the present invention, and those skilled in the art can obtain other drawings according to the provided drawings without any creative efforts. [Brief explanation of the drawings]

[0032] [Figure 1] 1 is a structural schematic diagram of a heat dissipation fin provided by the present invention; [Figure 2] 1 is an exploded view of a multi-dimensional heat dissipation device provided by the present invention; [Figure 3] FIG. 2 is a side view of the multi-dimensional heat dissipation device after assembly. [Figure 4] FIG. [Figure 5] FIG. DETAILED DESCRIPTION OF THE INVENTION

[0033] The following clearly and completely describes the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the present invention. Based on the embodiments of the present invention, all other embodiments that can be obtained by those skilled in the art without any creative efforts shall fall within the protection scope of the present invention.

[0034] The present invention provides a heat dissipation fin that can improve the heat dissipation performance of a heat sink by overcoming the problem of poor working medium flow in the prior art. Another object of the present invention is to provide a thermosiphon heat sink and a multi-dimensional heat dissipation device that include the heat dissipation fin.

[0035] Referring to Figures 1 to 5, Figure 1 is a structural schematic diagram of the heat dissipation fin provided by the present invention, Figure 2 is an exploded view of the multidimensional heat dissipation device provided by the present invention, Figure 3 is a side view of the multidimensional heat dissipation device after assembly, Figure 4 is a front view of the heat dissipation substrate, and Figure 5 is a front view of the auxiliary heat dissipation member.

[0036] This specific embodiment provides a heat dissipation fin applied to a thermosiphon radiator, and the heat dissipation fin comprises: a housing 20, an intake port 21 and a drainage port 25 provided in the housing 20; a gas-liquid chamber (26) disposed within the housing (20); The intake port 21 is used to connect the gas-liquid chamber 26 with the accommodation chamber 11 in the heat dissipation substrate 1 of the thermosiphon radiator, so that the gas in the accommodation chamber 11 flows into the gas-liquid chamber 26. The drain port 25 communicates the gas-liquid chamber 26 with the storage chamber 11 and is used to allow the liquid in the gas-liquid chamber 26 to flow into the storage chamber 11. The height of the intake port 21 in the vertical direction is higher than the height of the drainage port 25, The gas-liquid chamber 26 is a first flow guide portion 22 used to guide the flow of gas and communicating with the intake port 21; a second flow guide portion 23 used to guide the flow of liquid and communicating with a drain port 25; a connecting portion 24 communicating with the first flow guide portion 22 and the second flow guide portion 23, The angle between the first flow guide portion 22 and the connecting portion 24 and the angle between the connecting portion 24 and the second flow guide portion 23 are both obtuse angles.

[0037] When using the heat dissipation fin provided by the present invention, the heat dissipation fin is connected to the heat dissipation substrate 1 of the thermosiphon radiator, which is usually placed vertically. The gaseous working medium can pass through the accommodating chamber 11 in the heat dissipation substrate 1 of the thermosiphon radiator and enter the suction port 21 of the heat dissipation fin. The gaseous working medium then passes along the first guiding section 22 and the connecting section 24 to enter the gas-liquid chamber 26 of the housing 20 to undergo phase-change heat exchange. The liquid working medium then passes through the connecting section 24 and the second guiding section 23 in sequence, and, with the guidance of the second guiding section 23, can enter the accommodating chamber 11 in the heat dissipation substrate 1 of the thermosiphon radiator through the discharge port 25.

[0038] One end of the first flow guide section 22 is connected to the intake port 21, and the other end of the first flow guide section 22 is connected to the connecting section 24. The angle between the first flow guide section 22 and the connecting section 24 is obtuse, i.e., the first flow guide section 22 is arranged at an angle, which acts as a guide for the gaseous working medium. This makes the process of the gaseous working medium flowing in from the intake port 21 and then along the first flow guide section 22 to the connecting section 24 smoother, and as a result, the guiding effect of the first flow guide section 22 allows the gaseous working medium to flow more quickly into the gas-liquid chamber 26.

[0039] One end of the second flow guide section 23 communicates with the drainage port 25, and the other end of the second flow guide section 23 communicates with the connecting section 24. The angle between the connecting section 24 and the second flow guide section 23 is obtuse, i.e., the second flow guide section 23 is arranged at an angle, so that the liquid working medium can flow down the slope and enter the storage chamber 11 in the heat dissipation substrate 1, which acts as a guide for the liquid working medium. This makes the process of the liquid working medium flowing along the connecting section 24 to the second flow guide section 23 and then to the drainage port 25 smoother, so that the liquid working medium can flow more quickly along the second flow guide section 23 to the drainage port 25 and ultimately return to the storage chamber 11 in the heat dissipation substrate 1 more quickly.

[0040] Therefore, the heat dissipation fin provided by the present invention achieves the purpose of allowing the gaseous working medium to flow into the gas-liquid chamber 23 more quickly by installing the first flow guide section 22, and the purpose of allowing the liquid working medium to flow out of the gas-liquid chamber 26 more quickly by installing the second flow guide section 23, making the flow of the working medium smoother, thereby improving the heat dissipation performance of the heat dissipation fin and further improving the heat dissipation performance of the radiator.

[0041] As described above, the heat dissipation fins provided by the present invention can improve the problem of poor working medium circulation that exists in the prior art, thereby improving the heat dissipation performance of the radiator.

[0042] In one embodiment, the intake port 21 is provided with a third flow guide section 211 for guiding the flow of gas (i.e., gaseous working medium) and is used to guide the flow of gas, and the discharge port 25 is provided with a fourth flow guide section 251 for guiding the flow of liquid (i.e., liquid working medium) and is used to guide the flow of liquid. The provision of the third flow guide section 211 allows the gaseous working medium to enter the gas-liquid chamber 26 more smoothly, and the provision of the fourth flow guide section 251 allows the liquid working medium to flow out of the gas-liquid chamber 26 more smoothly.

[0043] In one embodiment, a plurality of first support members 27 are provided in the gas-liquid chamber 26, and opposite ends of the first support members 27 are connected to the housing 20 to provide support to the housing 20; The first support member 27 is provided with a guide surface.

[0044] The first support member 27 can be installed as a square pillar, and the guide surface of the first support member 27 can reduce the evaporation resistance of the working medium, thereby nearly balancing the evaporation rate and liquefaction rate of the working medium and making it easier to press the first support member 27.

[0045] Furthermore, the first support member 27 can be configured as a square pillar, tilted at 45°. After the gaseous working medium enters the gas-liquid chamber, it is divided into two parts by the square pillar. The two working mediums come into contact with the square pillars to exchange heat, further improving the heat dissipation efficiency and effectiveness of the device.

[0046] The multiple first support members 27 of the gas-liquid chamber 26 may be arranged with their positions staggered, which makes the flow of the working medium in the gas-liquid chamber 26 more complex and intricate, allowing the working medium to flow more fully over the surface of the first support members 27 and increasing the heat exchange area, thereby ensuring more efficient heat transfer and heat exchange of the working medium, and further ensuring smoother exchange between the gaseous working medium and the liquid working medium and more efficient heat dissipation.

[0047] In one embodiment, the housing 20 is provided with at least two intake ports 21; Alternatively, the housing 20 is provided with one intake port 21 and one drain port 25 .

[0048] At least two intake ports 21 can be provided at the top of the gas-liquid chamber 26, and one drain port 25 can be provided at the bottom of the gas-liquid chamber 26. Because the working medium vaporizes at a high pressure and speed, providing at least two intake ports 21 at the top of the gas-liquid chamber 26 can effectively reduce the resistance of the working medium during operation. Subsequently, three or more intake ports 21 can be designed according to the characteristics of the device to prevent the product from drying out due to excessive vaporization resistance of the working medium.

[0049] The pitch between the intake port 21 and the drain port 25 is set relatively large rather than close to each other, in order to create a large potential difference and pressure difference between the gas-liquid working medium, allowing the liquid working medium to flow with a sufficient pressure difference, and to prevent the liquid working medium from vaporizing and entering the heat dissipation fins 4 through the drain port 25, thereby avoiding the occurrence of a phenomenon in which reflux is obstructed. For example, the pitch between the drain port 25 and the adjacent intake port 21 needs to be larger than the depth of the liquid surface of the working medium, to ensure that the liquid working medium does not directly enter the intake port 21 and to ensure smooth phase change of the working medium.

[0050] In one embodiment, the intake port 21 and the discharge port 25 are located on the same side. That is, the cross section of the gas-liquid chamber 26 is a trapezoidal surface, and the structure is as shown in Figure 1, where the direction of the arrow indicates the flow direction of the working medium.

[0051] In addition to the heat dissipation fins described above, the present invention further provides a thermosiphon radiator including the heat dissipation fins described above, wherein the thermosiphon radiator comprises: a heat dissipation substrate 1 having a chamber 11 for accommodating a phase change medium therein; a heat dissipation fin 2 connected to the heat dissipation substrate 1; The heat dissipating fin 2 is any one of the heat dissipating fins described above, and the accommodation chamber 11 communicates with the intake port 21 and the drain port 25, respectively.

[0052] In one embodiment, a plurality of second support members 12 are provided in the accommodation chamber 11, and opposite ends of the second support members 12 are connected to the heat dissipation substrate 1, and the plurality of second support members 12 are arranged in a misaligned position.

[0053] The second support member 12 can be installed as a diamond-shaped, regular hexagonal, or elliptical cylinder, and multiple second support members 12 are arranged in a staggered position within the accommodation chamber 11. The elliptical cylinder here is an irregular elliptical cylinder with the same dimensions as a diamond-shaped cylinder; in other words, it can be understood that the four corners of a diamond-shaped cylinder are transitioned into arcs to obtain an irregular elliptical cylinder. In addition, installing the second support member 12 as a diamond-shaped, regular hexagonal, or elliptical cylinder effectively reduces the evaporation resistance of the working fluid and allows the working fluid to flow sufficiently along the side walls of the second support member 12 to perform heat exchange.

[0054] Furthermore, by arranging the second support member 12 in an offset position, the flow path of the working medium can be made more complex and intricate, allowing the working medium to flow more efficiently over the surface of the second support member 12 and increasing the heat exchange area, thereby enabling the working medium to more efficiently transfer and exchange heat, and further ensuring smoother exchange between the gaseous working medium and the liquid working medium, thereby ensuring more efficient heat dissipation.

[0055] In addition to the above-mentioned thermosiphon radiator, the present invention further provides a multi-dimensional heat dissipation device including the above-mentioned thermosiphon radiator, wherein the multi-dimensional heat dissipation device comprises: Any one of the heat dissipation substrate 1 and heat dissipation fins 2 described above; an auxiliary heat dissipation member 4 disposed on the side of the heat dissipation fin 2 that is farther from the heat dissipation substrate 1; An auxiliary heat dissipation chamber 41 is provided inside the auxiliary heat dissipation member 4, and the auxiliary heat dissipation chamber 41 communicates with the accommodation chamber 11.

[0056] When a multi-dimensional heat dissipation device is used, it is usually placed vertically. By installing an auxiliary heat dissipation member 4 on one side of the heat dissipation fin 2, the multi-dimensional heat dissipation device can simultaneously dissipate heat in both horizontal and vertical directions, thereby realizing multi-dimensional heat dissipation operation. This multi-dimensional heat dissipation method is expected to develop greatly in the future.

[0057] Furthermore, although the auxiliary heat dissipation member 4 can be installed in only one layer, if the equipment space is sufficient or power consumption increases, the auxiliary heat dissipation member 4 can be installed in a multi-layer structure and each auxiliary heat dissipation member 4 can be connected to each other to achieve multi-circuit, multi-dimensional simultaneous heat exchange and effectively improve the heat dissipation effect of the device. Furthermore, the accommodation chamber 11 and the auxiliary heat dissipation chamber 41 can be installed in structures of different shapes and connected to each other, so that the working medium in the accommodation chamber 11 can not only pass through the heat dissipation fins but also enter the auxiliary heat dissipation chamber 41 to undergo phase change heat exchange, effectively ensuring and improving the heat dissipation effect of the device.

[0058] In one embodiment, the auxiliary heat dissipation member 4 is A bottom plate 42 and a cover plate 43 are connected to each other to form an auxiliary heat dissipation chamber 41; a gas inlet 44 provided on the bottom plate 42 or the cover plate 43, the gas inlet 44 for communicating the accommodation chamber 11 with the auxiliary heat dissipation chamber 41; The liquid outlet 45 is provided on the bottom plate 42 or the cover plate 43 and serves to connect the auxiliary heat dissipation chamber 41 with the accommodation chamber 11 .

[0059] Since most of the gaseous working medium is in the upper part of the auxiliary heat dissipation chamber 41, the gas inlet 44 may be located at the upper part of the auxiliary heat dissipation chamber 41 and the liquid outlet 45 may be located at the bottom of the auxiliary heat dissipation chamber 41.

[0060] In one embodiment, the gas inlet 44 and the liquid outlet 45 are arranged opposite each other, and a guide slope 46 is provided inside the auxiliary heat dissipation chamber 41, with a first side of the guide slope 46 facing the gas inlet 44 and a second side of the guide slope 46 facing the liquid outlet 45, with an obtuse angle between the first and second sides. In other words, providing the guide slope 46 inside the auxiliary heat dissipation chamber 41 can guide the flow of the working medium and make the phase change of the working medium smoother. The direction of the arrows in each figure indicates the flow direction of the working medium.

[0061] In one embodiment, a plurality of third support members 47 are further provided in the auxiliary heat dissipation chamber 41, one end of each of the third support members 47 being connected to the bottom plate 42 and the other end of each of the third support members 47 being connected to the cover plate 43, thereby facilitating the batch processing and manufacturing of the third support members 47 in the auxiliary heat dissipation chamber 41; The multiple third support members 47 are arranged with a staggered position, which makes the flow process of the working medium in the auxiliary heat dissipation chamber 41 more complex and intricate, allowing the working medium to flow more fully over the surface of the third support members 47 and increasing the heat exchange area, thereby ensuring more efficient heat transfer and heat exchange of the working medium, and further ensuring smoother exchange between the gaseous working medium and the liquid working medium, thereby ensuring more efficient heat dissipation.

[0062] In one embodiment, the third support member 47 has a gas passage therethrough, and the bottom plate 42 and the cover plate 43 each have a through hole at a position corresponding to the third support member 47, and the gas passage communicates with the corresponding through hole to form a complete gas flow path, through which air can flow.

[0063] The hot air between the heat dissipation fins flows out through the gas flow path, forming concentrated convection and promoting air exchange, which contributes to further improving the heat dissipation performance.

[0064] In one embodiment, the gas inlet 44 and the storage chamber 11 communicate with each other via an intake pipe 5 , and the liquid outlet 45 and the storage chamber 11 communicate with each other via a liquid return pipe 6 .

[0065] At least two slots for accommodating the heat dissipation fins 2 can be provided in the heat dissipation substrate 1 so that the plurality of heat dissipation fins 2 are arranged sequentially on the heat dissipation substrate 1. The heat dissipation fins 2 may be arranged at equal intervals to facilitate processing and manufacturing all at once. In addition, an intake pipe 5 and a liquid return pipe 6 can be provided at the intervals between adjacent heat dissipation fins 2.

[0066] For example, an air intake pipe 5 and a liquid return pipe 6 can be respectively installed between the two outermost heat dissipation fins 2 and the adjacent heat dissipation fin 2, so that the air intake pipe 5 and the liquid return pipe 6 are respectively located at both ends of the heat dissipation substrate 1, thereby extending the flow path of the phase change medium in the roof cavity and further improving the heat dissipation effect of the device. Of course, other locations of the air intake pipe 5 and the liquid return pipe 6 may be selected according to actual conditions and requirements.

[0067] In one embodiment, the number of the gas inlet 44 and the intake pipe 5 is one, or the number of the gas inlet 44 and the intake pipe 5 is at least two, and multiple intake pipes 5 are arranged in parallel. Because the working medium vaporizes at a high pressure and speed, installing one or more intake pipes 5 between the accommodation chamber 11 and the auxiliary heat dissipation chamber 41 helps reduce the resistance of the working medium during operation.

[0068] In one embodiment, the heat dissipation substrate 1, the heat dissipation fins 2, and the auxiliary heat dissipation member 4 are integrally brazed together after the assembly is completed.

[0069] Multiple heat dissipating fins 2 are inserted into the heat dissipating substrate 1, and auxiliary heat dissipating members 4 are then secured to the heat dissipating fins 2. After all components are assembled, i.e., the heat dissipating substrate 1, heat dissipating fins 2, and auxiliary heat dissipating members 4 are assembled together to form a single unit. This unit is then brazed in a tunnel furnace to form an integrated brazed structure, i.e., a single-piece brazed mold. Heat from the heat dissipating fins 2 is directly transferred to the auxiliary heat dissipating chamber 41, greatly improving the heat exchange efficiency of the heat dissipating fins 2. At the same time, the auxiliary heat dissipating chamber 41 is connected to the receiving chamber 11 via the intake pipe 5 and liquid return pipe 6. This arrangement allows for multi-dimensional heat dissipation among the receiving chamber 11, the heat dissipating fins 2, and the auxiliary heat dissipating chamber 41, effectively improving the heat dissipation efficiency of the device.

[0070] To further explain how to use this device, an example will be given below. The heat source 3 can be installed on one side of the heat dissipation substrate 1, for example, the heat source 3 can be attached to the side of the heat dissipation substrate 1 away from the heat dissipation fins 2.

[0071] When electricity is applied to the heat source 3, the heat source 3 operates to generate heat, and the phase change medium in the storage chamber 11 absorbs the heat from the heat source 3 and vaporizes into a gaseous working medium. The gaseous working medium enters the intake port 21 of the heat dissipation fin 2 from the storage chamber 11, and then enters the gas-liquid chamber 26 along the first flow guide section 22 to undergo phase change heat exchange. The liquid working medium then passes through the connection section 24 and the second flow guide section 23 in sequence, and can be returned to the storage chamber 11 through the drain port 25 due to the guiding action of the second flow guide section 23.

[0072] Because the distance between the intake port 21 and the drain port 25 is large, the gas-liquid working medium forms a large potential difference and pressure difference, allowing the liquid working medium to flow with a sufficient pressure difference and preventing the liquid working medium from vaporizing and entering the heat dissipation fins 2 through the drain port 25, thereby preventing the phenomenon of reflux being obstructed.

[0073] Similarly, after the heat source 3 is energized, part of the gaseous working medium also simultaneously enters the auxiliary heat dissipation chamber 41 through the intake pipe 5, and the guiding action of the gradient structure causes the liquid working medium to enter the storage chamber 11 through the liquid return pipe 6. The operating principle of this device is shown in Figure 3, where the arrows indicate the flow direction of the working medium. The support members (i.e., heat dissipation columns) of the storage chamber 11 and the auxiliary heat dissipation chamber 41 are both offset from each other, and the support member structures in each cavity are different, so the flow path formed by the two can achieve good, uniform heat exchange of the working medium.

[0074] In addition, the bottom plate 42 and the cover plate 43 are connected to each other to form the auxiliary heat dissipation chamber 41, and the auxiliary heat dissipation chamber 41 can be installed as a hollow cavity, which not only creates a good chimney effect and enables concentrated convection of hot air, but also has a phase change medium inside, so that in addition to receiving heat conduction from the heat dissipation fins 2, the auxiliary heat dissipation chamber 41 itself can exchange heat through the phase change of the working medium.

[0075] Furthermore, the support members (i.e., heat dissipation columns) of the containing chamber 11, the auxiliary heat dissipation chamber 41, and the gas-liquid chamber 26 have special structures designed according to the working fluid's phase change principle, and the gradient and guide structures within each cavity have a significant guiding effect. Each cavity can form a complex heat exchange at different angles, and the containing chamber 11 and the auxiliary heat dissipation chamber 41 are directly connected, so that the two chambers can be simultaneously triggered to perform phase change heat exchange. Therefore, the multi-dimensional heat dissipation method of this device has great prospects for future development and can effectively meet the heat dissipation requirements of future high-power communication equipment.

[0076] In this specification, the terms first, second, and third in the first flow guide section 22 and the second flow guide section 23, the first side and the second side, the first support member 27 and the second support member 12, and the third support member 47 are used merely to distinguish between different positions and do not have any priority.

[0077] Furthermore, the orientations or positional relationships indicated by "in / out" and the like in this application are orientations or positional relationships shown based on the drawings, and are merely for the sake of simplicity of description and convenience of understanding, and are not intended to indicate or imply that the referenced devices or elements have a particular orientation or must be configured and operated in a particular orientation, and therefore should not be understood as limiting the present invention.

[0078] Each embodiment in this specification is described in order, and each embodiment is described by focusing on the differences from other embodiments, and the same or similar parts between each embodiment can be referred to each other. Any combination of all the embodiments provided by the present invention falls within the protection scope of this invention and will not be repeated here.

[0079] The above has provided a detailed introduction to the heat dissipation fins, thermosiphon heat dissipators, and multi-dimensional heat dissipation devices provided by the present invention. In this specification, the principles and embodiments of the present invention are described using specific examples, and the explanations of the above examples are merely used to help understand the method and core idea of ​​the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from the principles of the present invention, and these improvements and modifications are also within the scope of protection of the claims of the present invention. [Explanation of symbols]

[0080] 1. Heat dissipation board 11 Containment Room 12 Second support member 2. Heat dissipation fin 20 Housing 21 Intake port 211...Third flow guide section 22...1st flow guide section 23...Second flow guide section 24 Connection 25 Drainage port 251...4th flow guide section 26 Gas-liquid chamber 27 First support member 3...Heat source 4. Auxiliary heat dissipation member 41...Auxiliary heat radiation chamber 42...bottom plate 43...Lid plate 44 Gas inlet 45...liquid outlet 46 Guide Hill 47 Third support member 5. Intake pipe 6 Liquid return pipe

Claims

1. A heat dissipation fin applied to a thermosiphon radiator, a housing (20); an intake port (21) and a drainage port (25) installed in the housing (20); a gas-liquid chamber (26) disposed within the housing (20); The intake port (21) communicates the gas-liquid chamber (26) with a storage chamber (11) in the heat dissipation substrate (1) of the thermosiphon radiator, and is used to allow gas in the storage chamber (11) to flow into the gas-liquid chamber (26); The drain port (25) communicates the gas-liquid chamber (26) with the storage chamber (11) and is used to allow the liquid in the gas-liquid chamber (26) to flow into the storage chamber (11); The height of the intake port (21) in the vertical direction is higher than the height of the drainage port (25), The gas-liquid chamber (26) is a first flow guide portion (22) used to guide the flow of gas and communicating with the intake port (21); a second flow guide portion (23) used to guide the flow of liquid and communicating with the drain port (25); a connection portion (24) communicating with the first flow guide portion (22) and the second flow guide portion (23), The angle between the first flow guide portion (22) and the connecting portion (24) and the angle between the connecting portion (24) and the second flow guide portion (23) are both obtuse angles. A heat dissipation fin characterized by:

2. The intake port (21) is provided with a third flow guide portion (211) for guiding the flow of gas, The drain port (25) is provided with a fourth flow guide portion (251) for guiding the flow of liquid. The heat dissipation fin according to claim 1 .

3. A plurality of first support members (27) are provided in the gas-liquid chamber (26), and opposite ends of the first support members (27) are connected to the housing (20), The first support member (27) is provided with a guide surface. The heat dissipation fin according to claim 1 .

4. The housing (20) is provided with at least two intake ports (21), Alternatively, the housing (20) is provided with one intake port (21) and one discharge port (25). The heat dissipation fin according to claim 1 .

5. The intake port (21) and the drain port (25) are arranged on the same side. The heat dissipation fin according to claim 1 .

6. a heat dissipation substrate (1) having a chamber (11) for accommodating a phase change medium therein; a heat dissipation fin (2) connected to the heat dissipation substrate (1), The heat dissipation fin (2) is a heat dissipation fin (2) according to any one of claims 1 to 5, and the accommodation chamber (11) is in communication with the intake port (21) and the drainage port (25), respectively. A thermosiphon radiator characterized by:

7. A plurality of second support members (12) are provided in the accommodation chamber (11), and opposing ends of the second support members (12) are connected to the heat dissipation substrate (1), The plurality of second support members (12) are arranged in a staggered manner.

7. The thermosyphon radiator according to claim 6.

8. The heat dissipation substrate (1) and heat dissipation fins (2) according to any one of claims 6 to 7, and an auxiliary heat dissipation member (4) disposed on the side of the heat dissipation fin (2) away from the heat dissipation substrate (1), An auxiliary heat dissipation chamber (41) is provided inside the auxiliary heat dissipation member (4), and the auxiliary heat dissipation chamber (41) communicates with the storage chamber (11). A multi-dimensional heat dissipation device characterized by:

9. The auxiliary heat dissipation member (4) is a bottom plate (42) and a cover plate (43) connected to each other to form the auxiliary heat dissipation chamber (41); a gas inlet (44) provided on the bottom plate (42) or the cover plate (43), the gas inlet (44) for communicating the storage chamber (11) with the auxiliary heat dissipation chamber (41); a liquid outlet (45) provided on the bottom plate (42) or the cover plate (43), the liquid outlet (45) for communicating the auxiliary heat dissipation chamber (41) with the storage chamber (11); The multi-dimensional heat dissipation device according to claim 8 .

10. The gas inlet (44) and the liquid outlet (45) are arranged opposite each other, A guide slope (46) is provided in the auxiliary heat dissipation chamber (41), a first side of the guide slope (46) is arranged toward the gas inlet (44), a second side of the guide slope (46) is arranged toward the liquid outlet (45), and an obtuse angle is formed between the first side and the second side. The multi-dimensional heat dissipation device according to claim 9 .

11. A plurality of third support members (47) are further provided in the auxiliary heat dissipation chamber (41), one end of each of the third support members (47) is connected to the bottom plate (42), and the other end of each of the third support members (47) is connected to the cover plate (43); The plurality of third support members (47) are arranged in a staggered manner. The multi-dimensional heat dissipation device according to claim 9 .

12. The third support member (47) is provided with a gas passage passing therethrough, and through holes are provided in the bottom plate (42) and the cover plate (43) at positions corresponding to the third support member (47), and the gas passage communicates with the corresponding through holes to form a complete gas flow path. The multi-dimensional heat dissipation device according to claim 11 .

13. The gas inlet (44) and the storage chamber (11) communicate with each other via an intake pipe (5), and the liquid outlet (45) and the storage chamber (11) communicate with each other via a liquid return pipe (3). The multi-dimensional heat dissipation device according to any one of claims 9 to 12.

14. The number of the gas inlet (44) and the number of the intake pipe (5) are each one; Alternatively, the number of the gas inlets (44) and the number of the intake pipes (5) are at least two, and the intake pipes (5) are arranged in parallel. The multi-dimensional heat dissipation device according to claim 13 .

15. The heat dissipation substrate (1), the heat dissipation fins (2), and the auxiliary heat dissipation member (4) are integrally brazed together after the assembly is completed. The multi-dimensional heat dissipation device according to any one of claims 8 to 12.

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