Wafer placement device and semiconductor process equipment

Abstract

The present application discloses a wafer support device and a semiconductor processing equipment, the wafer support device including a base, a power supply unit, and a first adapter, the first adapter being located below the base, the first adapter having a central hole and an annular electrical connection surface that is disposed around the central hole, an end of the power supply unit being inserted into the central hole and electrically connected to the first adapter, and the base being electrically connected to the annular electrical connection surface.

Description

[Technical Field]

[0001] This application relates to the technical field of semiconductor process equipment design, and more particularly to wafer placement devices and semiconductor process equipment. [Background technology]

[0002] The wafer holder is an important component of semiconductor processing equipment and is used to support wafers during processing. The base of the wafer holder is provided with a coolant passage. During a specific operating process, a coolant (such as cooling water) flows through the coolant passage to regulate the temperature and temperature uniformity of the wafer holder.

[0003] However, the base also functions to receive RF current. In wafer holders according to the related art, a power supply is inserted into the center of the base, and modulated RF current is ultimately input to the center of the base via the power supply, ensuring the quality of RF introduction. In this case, to avoid the power supply, wafer holders according to the related art have coolant inlets and outlets on the edges of the base. When a wafer holder is in use, its temperature must be consistent around its circumference. However, when the coolant enters the coolant passage through the coolant inlet, its pressure impacts the inner wall of the coolant passage, resulting in significantly increased heat transfer efficiency at the coolant inlet, thereby forming a localized low-temperature area. Because the coolant inlet is located on a circumference with a large radial dimension, heat from other areas on the same circumference cannot be transferred in a timely manner due to the distance, easily forming a large temperature gradient, and ultimately failing to achieve consistent temperature around the wafer holder. Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention discloses a wafer mount device to solve the problem of poor temperature uniformity in the circumferential direction of the wafer mount device according to the related art. [Means for solving the problem]

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: In a first aspect, an embodiment of the present application discloses a wafer support device including a base, a power supply unit, and a first adaptor, the first adaptor having a central hole and an annular electrical connection surface disposed around the central hole, an end of the power supply unit inserted into the central hole and electrically connected to the first adaptor, and the base electrically connected to the annular electrical connection surface.

[0006] In a second aspect, an embodiment of the present application includes a base, a first adapter located below the base, a refrigerant introduction pipe, and a refrigerant discharge pipe, the base is provided with a refrigerant passage, the refrigerant passage having a refrigerant inlet and a refrigerant outlet, the refrigerant inlet and the refrigerant outlet are provided on a surface of the base facing the first adapter and are provided adjacent to a center of the base, the first adapter is provided with a first connection passage and a second connection passage, the first connection passage communicates the refrigerant inlet with the refrigerant introduction pipe, and the second connection passage a passage that connects the refrigerant outlet and the refrigerant discharge pipe, a port of the first connecting passage connected to the refrigerant supply pipe adjacent to an edge of the first adapter, a port of the first connecting passage connected to the refrigerant inlet adjacent to a center of the first adapter and facing the refrigerant inlet, a port of the second connecting passage connected to the refrigerant discharge pipe adjacent to an edge of the first adapter, and a port of the second connecting passage connected to the refrigerant outlet adjacent to the center of the first adapter and facing the refrigerant outlet.

[0007] In a third aspect, an embodiment of the present application discloses a semiconductor processing device including the wafer holder described above. [Effects of the Invention]

[0008] The technical solutions adopted in the present invention can achieve the following technical effects: The wafer support device disclosed in the embodiments of the present application improves the structure of the wafer support device according to the related art by changing the RF input method from the center of the base, allowing RF to be input to the base from an annular electrical connection surface surrounding the central hole of the first adapter. This is equivalent to inputting RF from a portion surrounding the center of the base, eliminating the need to input RF to the base from its center. This avoids occupying the center of the base, creating free space in the center of the base, allowing the coolant inlet and outlet to be located adjacent to the center of the base. This alleviates the drawback of the related art in that the coolant inlet and outlet cannot be located adjacent to the center of the base because the power supply is connected to the center of the cooling base. This improves the circumferential temperature uniformity of the wafer support device. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a structural schematic diagram of a wafer mounting device disclosed in an embodiment of the present application. [Figure 2] 1 is a structural schematic diagram of a first adapter disclosed in an embodiment of the present application. [Figure 3] FIG. 3 is a top view of FIG. 2. [Figure 4] FIG. 3 is a bottom view of FIG. 2. [Figure 5] FIG. 3 is a cross-sectional view taken along the line AA in FIG. 2. [Figure 6] FIG. 2 is a schematic diagram of a portion of the structure in FIG. 1. [Figure 7] 1 is a structural schematic diagram of a second adapter disclosed in an embodiment of the present application. [Figure 8] FIG. 8 is a cross-sectional view taken along the line BB in FIG. 7. DETAILED DESCRIPTION OF THE INVENTION

[0010] In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to specific embodiments of the present invention and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and are not all of the embodiments. Based on the embodiments of the present invention, all other embodiments that can be obtained by those skilled in the art without any creative efforts fall within the protection scope of the present invention.

[0011] The technical solutions disclosed in the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0012] 1 to 8, an embodiment of the present application discloses a wafer mount device. The disclosed wafer mount device includes a base 100, a power supply unit 210, and a first adapter 300.

[0013] The base 100 is a component that assists in temperature regulation by cooling the wafer mounting apparatus. The base 100 is provided with a coolant passage 110, which is used to pass a coolant (e.g., cooling water, cooling oil, etc.). The coolant exchanges heat with the base 100 while flowing through the coolant passage 110, thereby realizing temperature uniformity regulation of the base 100. The coolant passage 110 has a coolant inlet 111 and a coolant outlet 112. In a specific operating process, the coolant enters the coolant passage 110 through the coolant inlet 111, flows through other regions of the coolant passage 110, and then flows out through the coolant outlet 112. Of course, as described in the background art, the base 100 also receives RF current to perform a preset function.

[0014] The first adapter 300 is a conductive member and is used to perform at least the functions of feeding power and plugging. The first adapter 300 has a central hole 311 and an annular electrical connection surface 312. The annular electrical connection surface 312 is disposed around the central hole 311. The end of the power supply unit 210 is inserted into the central hole 311 and electrically connected to the first adapter 300, thereby realizing RF input.

[0015] The base 100 is electrically connected to the annular electrical connection surface 312 to receive the RF input from the power supply 210, thereby completing the input of RF to the base 100.

[0016] It should be noted that the central axis of the base 100 and the central axis of the first adapter 300 may be relatively close to each other or may even overlap. When the annular electrical connection surface 312 is provided around the central hole 311, it can be considered that the annular electrical connection surface 312 is provided around the central axis of the first adapter 300, and further, it can also be considered that the annular electrical connection surface 312 is provided around the central axis of the base 100. Naturally, it can at least be explained that the position electrically connected to the annular electrical connection surface 312 of the base 100 is not the center of the base 100.

[0017] In the power feeding and transmission process, RF is input from the end of the power feeding part 210 to the wall of the central hole 311 of the first adapter 300, then transmitted from the wall of the central hole 311 to the annular electrical connection surface 312 of the first adapter 300, and finally input to the edge of the base 100 via the annular electrical connection surface 312. In other words, the wafer mount device disclosed in the embodiment of the present application inputs RF from a position other than the center of the base 100.

[0018] Note that RF is essentially a high-frequency alternating current (sine wave), and because there is a phase difference at different positions of one wavelength, there is often a phase difference at different positions in the RF circuit, resulting in different current and voltage magnitudes. In the embodiment of the present application, positions at different distances from the RF power supply location on the base 100 have different current and voltage after the RF is turned on, thus resulting in different electric field strengths, and the attraction ability to the plasma in the process chamber of the semiconductor process equipment is also different, resulting in different plasma energy above the wafer support device, thereby affecting etching uniformity. In the semiconductor process field, the RF frequency commonly used in semiconductor process equipment is 12.65 MHz or 2 MHz, and the corresponding wavelengths are approximately 22 m and 150 m. Whether the RF is input from the center of the base 100 or from the edge of the base 100, the propagation distance in the base 100 is approximately the radius of the base 100. The radius of the base 100 is typically 0.15 m to 0.17 m, and taking the short-wavelength 13.56 MHz RF as an example, the ratio of the radius of the base 100 to the wavelength is approximately 0.007, so the maximum electric field strength difference in the base 100 is within 1%, and therefore it can be concluded that even if the RF input point (feed point) on the base 100 changes, the effect on the plasma in the process chamber of the semiconductor process equipment is negligible. From this, it can be seen that the wafer stage device disclosed in the embodiments of the present application is an improvement over the wafer stage device of the related art, and because the RF feed point is moved from the center of the base 100 to another part of the base 100, the effect on the process parameters of the semiconductor process equipment is negligible.

[0019] In a more preferred solution, the annular electrical connection surface 312 is provided on the edge of the first adapter 300. The edge of the base 100 faces the annular electrical connection surface 312 and is electrically connected to it. In this case, the RF feed portion of the base 100 is on the edge away from the center of the base 100, and this structure can better avoid the influence of the RF feed portion on the central region of the base 100.

[0020] The wafer mount device disclosed in the embodiments of the present application improves the structure of the wafer mount device according to the related art and changes the RF input method from the center of the base 100, allowing RF to be input to the base 100 from the annular electrical connection surface 312 surrounding the central hole 311 of the first adapter 300. This corresponds to inputting RF from a portion surrounding the center of the base 100, and does not require inputting RF to the base 100 from the center of the base 100. This avoids occupying the center of the base 100 and creates an empty space in the center of the base 100, allowing the coolant inlet 111 and the coolant outlet 112 to be located adjacent to the center of the base 100. This alleviates the drawback of the related art in that the coolant inlet 111 and the coolant outlet 112 cannot be located adjacent to the center of the base 100 because the power supply unit 210 is connected to the center of the base 100. This improves the temperature uniformity in the circumferential direction of the wafer mount device.

[0021] In the present embodiment, the structure of the power supply unit 210 may vary. In one preferred solution, the power supply unit 210 may include a power supply tube. Optionally, the end of the power supply tube is inserted into the central hole 311 and electrically connected to the first adapter 300. Specifically, the end of the power supply tube is electrically connected to the wall of the central hole 311 of the first adapter 300. Of course, the power supply unit 210 may have a non-tubular structure, and the present embodiment does not limit the specific structure of the power supply unit 210. The power supply unit 210 is preferably made of a metal material such as copper.

[0022] In a further technical solution, the wafer support apparatus disclosed in the embodiments of the present application may further include a current-carrying layer 510 and a power supply cable 520. The current-carrying layer 510 is disposed on the surface of the base 100 opposite the first adapter 300. The power supply cable 520 is inserted into a power supply tube, and an end of the power supply cable 520 extends out of the power supply tube and is electrically connected to the current-carrying layer 510. In this case, the power supply tube can not only perform a power supply function but also function as a through-passage for the power supply cable 520 to facilitate installation. Of course, the power supply tube can also protect the power supply cable 520 to avoid damage to the power supply cable 520. In one alternative solution, the power supply cable 520 may be electrically connected directly to the current-carrying layer 510.

[0023] In the embodiment of the present application, the current-carrying layer 510 has a layer structure that can perform a preset function after being energized. Specifically, the current-carrying layer 510 may include at least one functional layer laminated on the base 100.

[0024] The wafer support device disclosed in the embodiments of the present application may further include a second adapter 600. The second adapter 600 includes a first electrical connection portion 610 facing toward the base 100 and a second electrical connection portion 620 facing away from the base 100. The base 100 is provided with a third electrical connection portion electrically connected to the current-carrying layer 510. The second electrical connection portion 620 is electrically connected to the power supply cable 520 through the central hole 311. The first electrical connection portion 610 is electrically connected to the third electrical connection portion and is electrically connected to the functional layer, thereby achieving the purpose of supplying power to the functional layer. In this case, the power supply cable 520 is essentially indirectly connected to the functional layer via the second adapter 600. The second adapter 600 is essentially an intermediate electrical adapter, and the second adapter 600 may be pre-designed to function as an intermediate electrical adapter with the first electrical connection portion 610 and the second electrical connection portion 620 pre-installed to facilitate the electrical connection between the power supply cable 520 and the functional layer.

[0025] The at least one functional layer may include at least one of an electric heating layer 511 and an electric adhesion layer 512. The electric heating layer 511 heats the base 100 by applying electricity, thereby allowing the wafer support device to reach a preset temperature and ensuring the required temperature of the wafer in subsequent processes. The electric adhesion layer 512 is a structural layer that realizes electric adhesion after applying electricity, and can adsorb a wafer supported by the wafer support device. This allows the wafer to be placed relatively stably on the wafer support device.

[0026] In one alternative solution, the at least one functional layer described above may include an electric heating layer 511 and an electric adhesion layer 512 sequentially stacked on the base 100. The power supply cable 520 may include a first sub-cable and a second sub-cable, where the first sub-cable is electrically connected to the electric heating layer 511 and the second sub-cable is electrically connected to the electric adhesion layer 512. The electric heating layer 511 is powered by the first sub-cable and can perform heating, thereby heating a wafer on the wafer holder. The electric adhesion layer 512 is powered by the second sub-cable and can adsorb a wafer on the wafer holder.

[0027] When the current-carrying layer 510 is included, the surface of the current-carrying layer 510 opposite the base 100 is a mounting surface on which a wafer can be placed. Naturally, when the electric heating layer 511 and the electric adsorption layer 512 are included, the surface of the electric adsorption layer 512 opposite the electric heating layer 511 is a mounting surface on which a wafer can be placed.

[0028] Specifically, the first sub-cable may be directly electrically connected to the electric heating layer 511 , and the second sub-cable may be directly electrically connected to the electroadhesive layer 512 .

[0029] In a more preferred solution, the first sub-cable is electrically connected to the electric heating layer 511 via a part of the second electrical connection part 620 electrically connected in sequence, a part of the first electrical connection part 610 penetrating the base 100, and the corresponding third electrical connection part. Specifically, the first sub-cable is directly electrically connected to a part of the second electrical connection part 620. The second sub-cable is electrically connected to the electric adhesion layer 512 via another part of the second electrical connection part 620 electrically connected in sequence, another part of the first electrical connection part 610 penetrating the base 100 and the electric heating layer 511 in sequence, and the corresponding third electrical connection part. This method makes it easy to electrically connect the first and second sub-cables to the electric heating layer 511 and the electric adhesion layer 512.

[0030] In the present embodiment, the first electrical connection portion 610 and the second electrical connection portion 620 may be electrical connection terminals, and the third electrical connection portion may be a socket. The second electrical connection portion 620 extends into the central hole 311 and is electrically connected to the power supply cable 520. The first electrical connection portion 610 is inserted into and electrically connected to the third electrical connection portion.

[0031] Specifically, the first electrical connection portion 610 is a first electrical connection terminal, and the second electrical connection portion 620 is a second electrical connection terminal. In an alternative solution, one of the first electrical connection portion 610 and the third electrical connection portion may include an electric plug protrusion, and the other may be provided with an electric plug hole, and the electric plug protrusion and the electric plug hole are inserted and electrically connected. Specifically, one of the first electrical connection portion 610 and the third electrical connection portion may be a plug, and the other may be a socket. The plug and the socket are inserted and fitted together to achieve the electrical connection. Such an inserted electrical connection structure has the advantage of being easy to disassemble and assemble.

[0032] Of course, the first electrical connection portion 610, the second electrical connection portion 620, and the third electrical connection portion may be electrical connection portions of other structures, such as general electrical connectors, and are not limited to these in the embodiments of the present application.

[0033] The second adapter 600 disclosed in the embodiment of the present application may further include an insulating plate 630 and a wiring 640 embedded in the insulating plate 630, where the first electrical connection 610 is electrically connected to the corresponding second electrical connection 620 via the wiring 640 embedded in the insulating plate 630. The insulating plate 630 serves as a mounting base for the first electrical connection 610 and the second electrical connection 620, ensuring a relatively stable electrical connection between the first electrical connection 610 and the second electrical connection 620. The second adapter 600 can be easily assembled by assembling the insulating plate 630, thereby achieving the goal of facilitating installation of the second adapter 600. The wiring 640 may be a gold wire or a conductive adhesive, and the embodiment of the present application does not limit the specific structure of the wiring 640.

[0034] In the wafer mount apparatus disclosed in the embodiments of the present application, the second adapter 600 may be a circuit board. Of course, it may also be any other electrical adapter capable of realizing preset functions, and the present application does not limit the specific type of the second adapter 600.

[0035] In a more preferred solution, the first adapter 300 may be provided with a groove, the surface of the notch into which the groove is formed being the annular electrical connection surface 312, the central hole 311 being formed in the bottom wall opposite the notch, and the insulating plate 630 being provided within the groove. In this case, the groove in the first adapter 300 can provide an attachment space for the insulating plate 630, thereby realizing the attachment of the second adapter 600. Naturally, this arrangement allows the assembly of the first adapter 300 and the second adapter 600 to be more compact, which is advantageous for the miniaturization of the entire wafer support device. Specifically, the insulating plate 630 may be attached to the groove by adhesive, engagement, or other methods.

[0036] In a further technical solution, the insulating plate 630 is positioned and fitted into the groove, in which case the groove can not only accommodate the insulating plate 630 but also position the insulating plate 630, which is advantageous for more stable attachment of the second adapter 600.

[0037] The wafer support device disclosed in the embodiments of the present application further includes an insulating ring 700, which is provided, for example, below the base 100 and surrounds the periphery of the first adapter 300. An annular step 710 is provided on the inner peripheral edge of the end of the insulating ring 700 adjacent to the base 100. A splice step surface 315 is provided on the edge of the first adapter 300, and the splice step surface 315 is spliced ​​into the annular step 710. The first adapter 300 is positioned within the annular step 710, thereby providing a more stable attachment.

[0038] In a further technical solution, both the end face of the insulating ring 700 adjacent to the base 100 and the annular electrical connection surface 312 are supported by and joined to the base 100. In this case, the insulating ring 700 and the annular electrical connection surface 312 together support the base 100. This is advantageous in improving the stability of the support of the base 100. Note that, because the insulating ring 700 is made of an insulating material, the support of the base 100 by the insulating ring 700 does not affect the input of RF from the annular electrical connection surface 312 to the base 100.

[0039] 1 to 4, in one possible solution, the first adapter 300 may include an adapter base 310 and an annular protrusion 320 provided on the edge of the surface of the adapter base 310 facing the base 100. The annular protrusion 320 is provided around a central hole 311, which is provided in the adapter base 310, and the annular end face of the annular protrusion 320 opposite the adapter base 310 is an annular electrical connection surface 312. In this structure, the central hole 311 is drilled in the adapter base 310 and surrounded by the annular protrusion 320, and the annular end face of the annular protrusion 320 opposite to the adapter base 310 protrudes from the adapter base 310, thereby preventing contact between the adapter base 310 and the base 100. Furthermore, it is easy to form an annular electrical connection surface 312 that is electrically connected to the base 100, and it is easy to ensure that areas of the first adapter 300 other than the annular electrical connection surface 312 are not electrically connected to the base 100. This allows for a more accurate determination of the power supply position and better prevents short circuits from occurring between areas of the first adapter 300 other than the annular electrical connection surface 312 and the base 100.

[0040] In a more preferred solution, the adapter base 310 and the annular protrusion 320 can be formed to surround the above-mentioned groove. In this case, the groove formed by the annular protrusion 320 and the adapter base 310 can provide an installation space for the insulating plate 630, thereby making full use of the space in the first adapter 300.

[0041] As described above, the base 100 is provided with the refrigerant passage 110, which has a refrigerant inlet 111 and a refrigerant outlet 112. Specifically, both the refrigerant inlet 111 and the refrigerant outlet 112 are provided on the surface of the base 100 facing the first adapter 300, and are provided adjacent to the center of the base 100.

[0042] The wafer mounting apparatus disclosed in the embodiments of the present application may further include a refrigerant inlet pipe 410 and a refrigerant outlet pipe 420. The refrigerant inlet pipe 410 is connected to the refrigerant inlet 111, and the refrigerant outlet pipe 420 is connected to the refrigerant outlet 112. In a specific operation process, the refrigerant is introduced from the refrigerant inlet pipe 410 to the refrigerant inlet 111, enters the refrigerant passage 110, flows through the refrigerant passage 110, and then flows from the refrigerant outlet 112 to the refrigerant outlet pipe 420, and finally flows out.

[0043] The refrigerant carry-in pipe 410 communicates with the refrigerant inlet 111, and the refrigerant carry-out pipe 420 communicates with the refrigerant outlet 112. Specifically, the refrigerant carry-in pipe 410 can be directly connected to the refrigerant inlet 111, and the refrigerant carry-out pipe 420 can be directly connected to the refrigerant outlet 112. Naturally, relief holes may be formed in the first adapter 300 and / or the second adapter 600 to allow the refrigerant carry-in pipe 410 and the refrigerant carry-out pipe 420 to pass through, so as not to affect the direct communication between the refrigerant carry-in pipe 410 and the refrigerant inlet 111 and the direct communication between the refrigerant carry-out pipe 420 and the refrigerant outlet 112.

[0044] In a further preferred solution, the first adapter 300 may be provided with a first connecting passage 313 and a second connecting passage 314, the first connecting passage 313 connecting the refrigerant inlet 111 and the refrigerant introduction pipe 410, and the second connecting passage 314 connecting the refrigerant outlet 112 and the refrigerant introduction pipe 420, the port of the first connecting passage 313 connected to the refrigerant introduction pipe 410 being adjacent to the edge of the first adapter 300, the port of the first connecting passage 313 connected to the refrigerant inlet 111 being adjacent to the central hole 311, the port of the second connecting passage 314 connected to the refrigerant introduction pipe 420 being adjacent to the edge of the first adapter 300, and the port of the second connecting passage 314 connected to the refrigerant outlet 112 being adjacent to the central hole 311. In this case, if the communication between the refrigerant input pipe 410 and the refrigerant inlet 111 and the communication between the refrigerant output pipe 420 and the refrigerant outlet 112 can be ensured by the transient connection between the first connection passage 313 and the second connection passage 314, the connection position between the refrigerant input pipe 410 and the refrigerant output pipe 420 can be moved away from the center of the base 100, thereby avoiding the problem of space being limited due to the distance to the power supply unit 210 being too close, and since the refrigerant output pipe 420 and the refrigerant input pipe 410 are adjacent to the edge of the first adapter 300, there is a large space and it is easy for the worker to perform the connection operation.

[0045] In a further technical solution, the port connected to the refrigerant inlet pipe 410 of the first connecting passage 313 and the port connected to the refrigerant outlet pipe 420 of the second connecting passage 314 are both opened on the surface of the first adapter 300 opposite the base 100, and the port connected to the refrigerant inlet 111 of the first connecting passage 313 and the port connected to the refrigerant outlet 112 of the second connecting passage 314 are both opened on the surface of the first adapter 300 facing the base 100. With this structure, the refrigerant inlet pipe 410 and the refrigerant outlet pipe 420 may be laid below the first adapter 300, and the first adapter 300 may be laid below the base 100. This makes it easy to rationally lay these components in the space below the base 100 and, at the same time, makes full use of the existing space below the base 100. This is advantageous for reducing the size of the entire structure of the wafer support device.

[0046] The present embodiment discloses another wafer mounting apparatus, which includes a base 100, a first adapter 300, a coolant inlet pipe 410, and a coolant outlet pipe 420.

[0047] The base 100 is provided with a refrigerant passage 110, which has a refrigerant inlet 111 and a refrigerant outlet 112, which are provided on the surface of the base 100 facing the first adapter 300 and adjacent to the center of the base 100.

[0048] The first adapter 300 is located below the base 100 and is provided with a first connection passage 313 and a second connection passage 314. The first connection passage 313 connects the refrigerant inlet 111 to the refrigerant introduction pipe 410, and the second connection passage 314 connects the refrigerant outlet 112 to the refrigerant introduction pipe 420. The port of the first connection passage 313 connected to the refrigerant introduction pipe 410 is adjacent to the edge of the first adapter 300, the port of the first connection passage 313 connected to the refrigerant inlet 111 is adjacent to the center of the first adapter 300 and faces the refrigerant inlet 111, the port of the second connection passage 314 connected to the refrigerant introduction pipe 420 is adjacent to the edge of the first adapter 300, and the port of the second connection passage 314 connected to the refrigerant outlet 112 is adjacent to the center of the first adapter 300 and faces the refrigerant outlet 112.

[0049] In one possible solution, the port connected to the refrigerant inlet pipe 410 of the first connecting passage 313 and the port connected to the refrigerant outlet pipe 420 of the second connecting passage 314 are both opened on the surface of the first adapter 300 opposite the cooling base 100.

[0050] In another alternative solution, the first adapter 300 has a central hole 311 and an annular electrical connection surface 312, the annular electrical connection surface 312 is arranged around the central hole 311, the wafer holder may further include a power supply part 210, an end of the power supply part 210 is inserted into the central hole 311 and electrically connected to the first adapter 300, and the base 100 is electrically connected to the annular electrical connection surface 312.

[0051] It should be noted that the components included in the other wafer support devices disclosed in the present application are interpreted and explained in the above embodiments in a corresponding manner, and for the corresponding parts, it is sufficient to refer to the contents of the above embodiments, and of course, for the beneficial effects brought about by the corresponding structures or components, it is sufficient to refer to the contents of the above embodiments. In consideration of the simplification of the description, a repeated explanation will be omitted here.

[0052] Based on the wafer holder device disclosed in the embodiments of the present application, the embodiments of the present application further disclose a semiconductor processing device, which includes the wafer holder device described in the above embodiments.

[0053] The above embodiments of the present invention focus on explaining the differences between each embodiment, and the different optimization features of each embodiment can be combined to form a better embodiment as long as they are not contradictory to each other. For the sake of brevity, the description will not be repeated here.

[0054] Although the embodiments of the present invention have been described above with reference to the drawings, the present invention is not limited to the above-mentioned specific embodiments. The above-mentioned specific embodiments are merely illustrative and not limiting. Those skilled in the art will recognize that many modifications may be made to the teachings of the present invention without departing from the spirit of the present invention and the scope protected by the claims, and all of these modifications fall within the scope of protection of the present invention. [Explanation of symbols]

[0055] 100 base 110 Refrigerant passage 111 Refrigerant inlet 112 Refrigerant outlet 210 Power supply unit 300 First Adapter 310 adapter base 311 Center hole 312 Annular Electrical Connection Surface 313 First connecting passage 314 Second connecting passage 315 Splice step surface 320 Annular protrusion 410 Refrigerant intake piping 420 Refrigerant discharge piping 510 Current-carrying layer 511 Electric heating layer 512 Electroadsorption layer 520 Power Cable 600 Second Adapter 610 First electrical connection part 620 Second electrical connection part 630 Insulating board 640 Wiring 700 Insulation Ring 710 Circular Step Platform

Claims

1. The device includes a base, a power supply, and a first adapter; the first adapter is located below the base, the first adapter has a central hole and an annular electrical connection surface, the annular electrical connection surface is disposed around the central hole, an end of the power supply part is inserted into the central hole and electrically connected to the first adapter, and the base is electrically connected to the annular electrical connection surface.

2. 2. The wafer support device according to claim 1, wherein the power supply unit includes a power supply tube, and the wafer support device further includes a current-carrying layer and a power supply cable, the current-carrying layer being provided on a surface of the base opposite the first adapter, the power supply cable being inserted into the power supply tube, and an end of the power supply cable extending outside the power supply tube and electrically connected to the current-carrying layer.

3. 3. The wafer placement device according to claim 2, further comprising a second adapter, the second adapter including a first electrical connection portion facing the base and a second electrical connection portion facing away from the base, the base being provided with a third electrical connection portion electrically connected to the current-carrying layer, the second electrical connection portion being electrically connected to the power supply cable through the central hole, and the first electrical connection portion being electrically connected to the third electrical connection portion.

4. 4. The wafer mounting device according to claim 3, wherein the second electrical connection portion is an electrical connection terminal, and one of the first electrical connection portion and the third electrical connection portion is an electrical connection terminal, and the other is a socket.

5. the current-carrying layer includes at least one functional layer laminated on the base, the at least one functional layer including an electric heating layer and an electric adsorption layer laminated on the base in that order; the power supply cable includes a first sub-cable and a second sub-cable; the first sub-cable is electrically connected to the electric heating layer via a part of the second electrical connection portion electrically connected in sequence, a part of the first electrical connection portion penetrating the base, and the corresponding third electrical connection portion; 4. The wafer mounting device according to claim 3, wherein the second sub-cable is electrically connected to the electrical adsorption layer via another portion of the second electrical connection portion electrically connected in sequence, another portion of the first electrical connection portion which passes through the base and the electrical heating layer in sequence, and the corresponding third electrical connection portion.

6. 4. The wafer mounting device according to claim 3, wherein the second adapter further includes an insulating plate and wiring embedded in the insulating plate, and the first electrical connection portion is electrically connected to the second electrical connection portion via the wiring.

7. 7. The wafer mounting device according to claim 6, wherein the first adaptor has a groove, a surface of the notch in which the groove is formed of the first adaptor is the annular electrical connection surface, the central hole is provided in a bottom wall of the groove facing the notch, and the insulating plate is provided within the groove.

8. 2. The wafer support device of claim 1, further comprising an insulating ring surrounding the first adapter, the insulating ring having an inner peripheral edge at an end adjacent to the base with an annular step platform, the edge of the first adapter having a splice step surface that is spliced ​​and fitted with the annular step platform, and the end face of the insulating ring adjacent to the end of the base and the annular electrical connection surface are both supported and joined by the base.

9. 2. The wafer placement device of claim 1, wherein the first adapter includes an adapter base and an annular protrusion, the annular protrusion being provided on an edge of a surface of the adapter base facing the base, the central hole being provided in the adapter base, the annular protrusion being provided around the central hole, and an annular end face of the annular protrusion opposite the adapter base being the annular electrical connection surface.

10. a coolant passage is provided in the base, the coolant passage having a coolant inlet and a coolant outlet, the coolant inlet and the coolant outlet being provided on a surface of the base facing the first adapter and adjacent to a center of the base; and the wafer mounting device further includes a coolant inlet pipe and a coolant outlet pipe; 10. The wafer mounting device according to claim 1, wherein the coolant inlet pipe is connected to the coolant inlet, and the coolant outlet pipe is connected to the coolant outlet.

11. The cooling system includes a base, a first adapter located below the base, a refrigerant inlet pipe, and a refrigerant outlet pipe, a refrigerant passage is provided in the base, the refrigerant passage having a refrigerant inlet and a refrigerant outlet, the refrigerant inlet and the refrigerant outlet being provided on a surface of the base facing the first adapter and adjacent to a center of the base; The first adapter is provided with a first connection passage and a second connection passage, the first connection passage communicating the refrigerant inlet with the refrigerant introduction pipe, and the second connection passage communicating the refrigerant outlet with the refrigerant discharge pipe, a port of the first connecting passage connected to the refrigerant introduction pipe adjacent to an edge of the first adapter, and a port of the first connecting passage connected to the refrigerant inlet adjacent to a center of the first adapter and facing the refrigerant inlet; a port of the second connection passage connected to the coolant discharge pipe adjacent to an edge of the first adapter, and a port of the second connection passage connected to the coolant outlet adjacent to a center of the first adapter and facing the coolant outlet.

12. 12. The wafer mounting device according to claim 11, wherein the port of the first connecting passage connected to the refrigerant inlet pipe and the port of the second connecting passage connected to the refrigerant outlet pipe are both opened on a surface of the first adapter opposite to the base.

13. the first adapter has a central hole and an annular electrical connection surface, the annular electrical connection surface is provided around the central hole, and the wafer mounting device further includes a power supply unit; 12. The wafer support device according to claim 11, wherein an end of the power supply part is inserted into the central hole and electrically connected to the first adapter, and the base is electrically connected to the annular electrical connection surface.

14. A semiconductor process device comprising the wafer mounting device according to any one of claims 1 to 10 or the wafer mounting device according to any one of claims 11 to 13.

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