Heater

Abstract

The present application discloses a heat sink comprising a group of substrate chambers and a cavity fin array, each cavity fin of which is connected to a refrigerant intake passage of the group of substrate chambers. The inner wall of each cavity fin is provided with a flow guide wall with a predetermined inclination angle. The liquid working medium absorbs heat generated by a heat source, vaporizes, and then enters the inner chamber of the cavity fin through the refrigerant intake passage for heat exchange. The use of multiple cavity fins increases the heat exchange area, achieving efficient heat dissipation from the heat source. Meanwhile, the predetermined inclination angle structure on the inner wall of the cavity fin helps the liquefied liquid in the inner chamber of the cavity fin to circulate along the inclined edge of the predetermined inclination angle structure into the group of substrate chambers, with little or no resistance due to gravity. This allows the working medium to circulate within the group of substrate chambers, improving the gas-liquid conversion efficiency of the working medium and further enhancing the heat exchange effect of the heat sink.

Description

[Technical Field]

[0001] This application claims priority from a Chinese patent application filed with the China Patent Office on November 8, 2022, bearing application number 202211391793.5 and entitled "Heat Dissipator," the entire contents of which are incorporated herein by reference.

[0002] TECHNICAL FIELD Embodiments of the present application relate to the field of heat dissipation devices, and more particularly to heat sinks. [Background technology]

[0003] With the development of the times, the degree of integration of electronic devices such as desktop hosts is becoming higher and higher, and the computing speed is rapidly increasing, which leads to an increase in their power consumption and heat flow density, resulting in a large amount of heat generation.

[0004] In the process of realizing this application, the inventors have discovered that the prior art has at least the following problems: Because the fins of conventional heat sinks have a large resistance to the liquid that liquefies when heated, the current heat sink's effectiveness in dissipating the heat of devices is limited, and it can only solve the problem of low-end electronic devices with low power consumption and small heat flow density. When these devices are upgraded and generate more heat, such heat sinks will have difficulty meeting the heat dissipation needs of the upgraded devices. Summary of the Invention [Problem to be solved by the invention]

[0005] The embodiments of the present application provide a heat sink to solve the technical problem that the heat dissipation effect of the conventional heat sink is poor. [Means for solving the problem]

[0006] The heat sink provided in the embodiment of the present application includes a group of substrate chambers and a cavity fin array; Each cavity fin in the cavity fin array is connected to a refrigerant intake passage of the substrate chamber group, so that the liquid working medium filled in the substrate chamber group absorbs heat and vaporizes, and then dissipates heat through the refrigerant intake passage into the internal chamber of the cavity fin, and the heat absorbed by the liquid working medium is generated from a heat source to be dissipated; The inner wall of each cavity fin is provided with a guide wall having a predetermined inclination angle structure, and the inclined edge formed by the predetermined inclination angle structure relative to the horizontal plane is used to guide the liquid in the cavity fin chamber back to the substrate chamber group.

[0007] Preferably, the cavity fins are inserted vertically into the refrigerant intake passage, and / or The preset inclination angle structure includes an oblique square or an oblique semicircular structure having a preset inclination angle with respect to the refrigerant intake passage.

[0008] Preferably, the cavity fin further includes a spoiler fin spaced apart from the cavity fin; Each of the spoiler fins has a through hole that faces the plate wall of the refrigerant intake passage.

[0009] Preferably, the spoiler fin is integrally press molded.

[0010] Preferably, the cavity fins and the spoiler fins are provided with connection layers for connecting to the vertical side walls of the substrate chamber group, respectively.

[0011] Preferably, the connecting layer is an aluminum material layer as a solder, specifically a 4343 type aluminum material layer or a 4045 type aluminum material layer.

[0012] Preferably, the spoiler fin is a wave-shaped tooth plate including a square wave or a sinusoidal wave, The tooth pitch between two adjacent corrugated tooth plates is 2.2±0.2 mm, and the plate wall thickness of each corrugated tooth plate is 0.2±0.1 mm.

[0013] Preferably, the substrate chamber group includes a chamber cover plate, a substrate chamber, and a liquid-absorbent wick structure; the chamber cover plate is attached to the top of the substrate chamber, and has a plurality of the refrigerant intake passages, the number of passages being equal to or greater than the number of the cavity fins; The liquid-absorbing wick structure is attached to the inside of the substrate chamber, and the liquid-absorbing wick structure is used to allow the liquid working medium filled in the substrate chamber to absorb heat and vaporize, and then become a gaseous working medium that flows to the cavity fins.

[0014] Preferably, the liquid-absorbent wick structure is a cylindrical structure having a diameter φ of 1 mm and a height of 3 mm.

[0015] Preferably, the device further includes a fin protection plate; The fin protection plates are attached longitudinally to the side edges of the substrate chambers and provide circumferential enclosure and protection for the cavity fin array.

[0016] From the above technical solutions, it can be seen that the embodiments of the present application have at least the following advantages: The liquid working fluid absorbs heat from the heat source and vaporizes. After vaporizing, it enters the inner chamber of the cavity fin through the refrigerant intake passage and exchanges heat. The use of multiple cavity fins increases the heat exchange area, achieving efficient heat dissipation from the heat source. Meanwhile, the preset inclination angle structure on the inner wall of the cavity fin allows the liquefied liquid in the inner chamber of the cavity fin to flow along the inclined edges of the preset inclination angle structure into the substrate chamber group without resistance due to gravity, thereby circulating the working fluid within the substrate chamber group, improving the gas-liquid conversion efficiency of the working fluid and enhancing the heat exchange effect of the radiator. [Brief explanation of the drawings]

[0017] In order to more clearly explain the technical solutions in the embodiments of the present application, the following briefly introduces the drawings necessary for describing the embodiments. Obviously, the drawings in the following description are only some of the embodiments described in the present application, and those skilled in the art can also obtain other drawings from these drawings.

[0018] [Figure 1a] FIG. 1 is an assembly schematic diagram of a traditional heat sink in a host casing. [Figure 1b] FIG. 1b is a schematic diagram of the configuration of a traditional heat dissipation module in the configuration of FIG. 1a; [Figure 2] 1 is a schematic diagram of the working medium flow of a traditional heat dissipation module. FIG. [Figure 3] 1 is a schematic diagram of the configuration of a heat sink according to the present application; [Figure 4a] FIG. 2 is a schematic side view of the cavity fin of the present application. [Figure 4b] FIG. 2 is a schematic diagram of another side of the cavity fin of the present application. [Figure 4c] FIG. 2 is a schematic diagram of another side of the cavity fin of the present application. [Figure 5] FIG. 2 is another schematic diagram of the heat sink of the present application. [Figure 6a] FIG. 2 is a schematic side view of the spoiler fin of the present application. [Figure 6b] 2 is a schematic view of another side of the spoiler fin of the present application and a partial enlarged view thereof; FIG. [Figure 6c] 2 is a schematic view of another side of the spoiler fin of the present application and a partial enlarged view thereof; FIG. [Figure 7a] FIG. 2 is an assembly schematic diagram of a heat sink in a host casing of the present application. [Figure 7b] FIG. 7b is a schematic side view of FIG. 7a. [Figure 8a] 1 is a schematic diagram illustrating the configuration of a substrate chamber group according to the present application. [Figure 8b] FIG. 8b is a schematic diagram of the internal configuration of the configuration in FIG. 8a. [Figure 8c] FIG. 8b is a schematic diagram of a configuration corresponding to that in FIG. 8b. [Figure 9] FIG. 2 is a heat dissipation schematic diagram of the heat sink of the present application in a host casing. [Figure 10] FIG. 1 is a comparison diagram of the simulation effect of a traditional heat sink and the heat sink of the present application. DETAILED DESCRIPTION OF THE INVENTION

[0019] In order to help those skilled in the art to better understand the solutions of the present application, the following clearly and completely describes the technical solutions in the embodiments of the present application in combination with the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments in the present application without any inventive efforts fall within the scope of protection of the present application.

[0020] In describing the embodiments of the present application, it should be explained that the orientations or positional relationships indicated by terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," etc. are orientations or positional relationships based on those shown in the drawings, and are intended merely to facilitate and simplify the description of the embodiments of the present application, and do not indicate or imply that the devices or elements shown must have a particular orientation, be configured and operated in a particular orientation, and should not be understood as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only, and are not to be understood as indicating or implying relative importance.

[0021] In the description of the embodiments of the present application, it should be explained that unless otherwise clearly specified or limited, the terms "attached," "connected," and "connected" should be understood in a broad sense, and may refer to, for example, a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, or an indirect connection via an intermediate medium, and may enable communication between the interiors of two elements. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application according to specific circumstances.

[0022] As shown in Figures 1a and 1b, the heat sinks used in current desktop hosts generally adopt traditional heat dissipation module configurations such as heat pipes + copper plate + aluminum extrusions or heat pipes + copper plate + heat exchanger sheet. The peripheral assembly further includes a housing 1, a power supply 2, an inductor 3, an electrical resistor 4, a heat sink fan 5, a capacitor 6, and an integrated circuit (IC) chip 7. Although there are many power-consuming electronic components inside the host, the main heat-generating element is the central processing unit (CPU) 13. Specifically, a traditional heat dissipation module mainly consists of three components: aluminum extrusions 9, heat pipes 10, and copper plate 11. During production, these three components are assembled and then welded in a soldering furnace using tin paste applied to the welding surfaces to form a heat dissipation product, and the heat pipes 10 are then embedded in the heat pipe slots 12. During use, the entire heat sink is fixed inside the host casing and is always fixed facing above the CPU 13. After the host system starts operating, the heat generated in the power consumption area of ​​the CPU 13 is transferred sequentially to the heat pipe 10, copper plate 11 and aluminum extrusion 9 via a heat conductive medium (e.g., a working medium), and the heat removal fan 5 sends the heat in the heat pipe slot 12 out of the host casing system. At the same time, part of the heat from the power consumption elements above the printed circuit board 8 is also sent out of the host casing system, for example, outside the housing, by the wind force of the heat removal fan 5.

[0023] Thus, traditionally, the core component of the entire heat dissipation module is the heat pipe 10. As shown in Figure 2, after the heat pipe is turned on, the heated liquid working medium 16 flows from the evaporation stage 15 to the condensation stage 17 (arrow pointing to the right). After cooling, the working medium is circulated by the capillary force of the capillary structure (copper powder / copper mesh / groove) 14, i.e., from the condensation stage 17 to the evaporation stage 15. This cycle achieves a balanced heat exchange. However, this traditional water-cooled heat dissipation module often uses pure water as the working medium 16. After the pure water is injected into the heat pipe and turned on, the phase change process is minute, resulting in low heat exchange efficiency of the working medium. Therefore, if the heat pipe is too long or the CPU power consumption is too high, the traditional heat dissipation product is prone to burnout or loss of heat dissipation efficiency, which cannot meet the heat dissipation requirements of modern or upgraded electronic devices. Furthermore, traditional water-cooled heat dissipation modules require an additional power pump to drive the internal working fluid circulation, and at the same time, sensors must be installed to detect whether the module product is leaking, which increases the number of auxiliary parts and makes assembly difficult.

[0024] The above describes the configuration and use of a traditional heat sink. The heat sink of the present application will now be described in detail. For example, in an actual assembly process, the heat sink is fixed to the heat source surface of the host PCB, facing above the CPU power consumption area.

[0025] 3 to 4b, the present application provides an embodiment of a heat sink, which comprises: It includes a group of substrate chambers 22 and a cavity fin array, and each cavity fin 21 in the cavity fin array is connected to the refrigerant intake passage 26 of the group of substrate chambers, so that the liquid working medium filled in the group of substrate chambers absorbs heat and vaporizes, and then passes through the refrigerant intake passage 26 to the internal chamber of the cavity fin to dissipate the heat. The heat absorbed by the liquid working medium is generated from the heat source to be dissipated (e.g., a CPU). The inner wall of each cavity fin 21 is provided with a guide wall with a preset inclination angle structure 210, and the inclined edge formed by the preset inclination angle structure 210 with respect to the horizontal plane is used to guide the liquid in the chamber of the cavity fin to the group of substrate chambers.

[0026] In this way, heat generated from the heat source is vaporized and absorbed by the liquid working fluid and sent to the inner chamber of the cavity fin through the refrigerant intake passage for heat exchange. The use of multiple cavity fins increases the heat exchange area, enabling efficient heat dissipation from the heat source. Meanwhile, the preset inclination angle structure of the inner wall of the cavity fin contributes to reducing the resistance experienced by the liquefied liquid in the inner chamber of the cavity fin, allowing the liquid to circulate more smoothly along the inclined edges of the preset inclination angle structure within the substrate chamber group, thereby circulating the working fluid within the substrate chamber group, improving the gas-liquid conversion efficiency of the working fluid and further enhancing the heat exchange efficiency of the radiator. Therefore, it can be seen that the use of the preset inclination angle structure effectively increases the resource utilization rate of the working fluid and maintains the heat exchange balance of the radiator.

[0027] In addition to the heat sink of the present application described in the above examples, specific and feasible examples are provided below, and in actual applications, the implementation contents between these examples can be combined as needed according to the corresponding functional principles and application logic.

[0028] In one possible embodiment, the cavity fins 21 are inserted vertically into the refrigerant intake passage 26, and / or the internal preset inclination structure 210 includes an inclined square or semicircular structure with a preset inclination angle relative to the refrigerant intake passage. Of course, the cavity fins can be indirectly connected to the refrigerant intake passage via an assembly (e.g., screws or adhesive). The preset inclination structure can also be configured in a shape other than an inclined square or semicircular, as long as the shape reduces the resistance of the liquid and provides a flow-guiding effect for the liquid. In practical applications, the vapor (including the gaseous working medium obtained after the liquid working medium is evaporated) flows upward along the vertical direction. When it liquefies at a low temperature, it flows downward along the inclined edge of the preset inclination structure and circulates into the substrate chambers under its own gravity, effectively reducing the wetting damage to the radiator assembly and improving the circulation of the working medium. Furthermore, this circulation effect can also provide a preliminary indication of whether the heat dissipation capacity of the radiator will be compromised. For example, as shown in Figures 4a to 4c, the preset inclination angle structure 210 may be a 5 x 5 mm oblique square structure with a 45° inclination angle relative to the refrigerant intake passage, and the refrigerant intake port width H corresponding to the cavity fin of such a structure may be 1.5 mm.

[0029] In addition, the heat sink of the present application further includes a fin protection plate 29 as shown in Figure 3, which is attached vertically to the side ends of the substrate chamber group, thereby forming a circumferential enclosure and protection for the cavity fin array and preventing the cavity fins from being damaged by external forces. Specifically, two fin protection plates are welded vertically to both ends of the substrate chamber group, corresponding to being arranged at the beginning and end of the cavity fin array. The fin protection plate is specifically a press-molded solid cover plate, and the process of such a press-molded solid cover plate is simpler and more structurally stable than the aluminum extrusion process.

[0030] As shown in Figures 5 to 6c, in some specific examples, the heat sink of the present application further includes spoiler fins 20 (referred to as spoiler fins or spoiler structures) installed at intervals from the cavity fins, and each spoiler fin 20 has a through hole 201 (e.g., a rectangular through hole) opened toward the plate wall of the refrigerant intake passage. For example, the spoiler FIN is a corrugated toothed plate having a rectangular or sinusoidal wave shape, and the tooth pitch P (Pitch) between two adjacent corrugated toothed plates is specifically 2.2±0.2 mm, and the plate wall thickness T (thickness) of each corrugated toothed plate is specifically 0.2±0.1 mm. Of course, the corrugated toothed plate may have a shape other than a rectangular or sinusoidal wave shape, as long as the shape is designed to maximize the heat exchange area with vertical offset or undulations to improve the cooling effect. The tooth distance and plate wall thickness of the corrugated toothed plate can be set according to actual needs (e.g., heat exchange efficiency). Specifically, as shown in Figures 5, 7a, and 7b, a group of spoiler fins 20 (also referred to as spoiler structures) with a tooth pitch P of 2.2 mm and a wall thickness T of 0.1 mm are stacked to form a fin group. Each spoiler structure has a pair of fin through-holes 201 aligned in a one-to-one relationship to form a perforated airway. When a heat-removal fan (which can be mounted inside the housing, marked with 1 in Figure 7a) blows air from the side, the air flows from one spoiler structure to the other through the perforated airway, increasing the heat exchange area and improving the heat dissipation performance of the radiator. To ensure the overall hardness and surface flatness of the spoiler fin (to prevent surface bulges during the aluminum extrusion manufacturing process), the spoiler fin can be press-molded as a single unit, and the material can be selected from a coil material that is easy to braze, such as AL3003.

[0031] In some embodiments, the cavity fins and spoiler fins may be provided with connecting layers for connecting to the vertical sidewalls of the substrate chambers. The connecting layers may be, for example, aluminum solder layers (e.g., 4343-type aluminum or 4045-type aluminum). Therefore, the spoiler fins of the present application can be directly welded (e.g., brazed) to the outer walls of two adjacent cavity fins without the need for traditional tin paste. Of course, materials other than 4343-type or 4045-type aluminum may also be used, as long as they maintain the connection between the cavity fins and spoiler fins and provide heat transfer. In practical applications, the connecting layers may be components of the wall of the corrugated plate. As mentioned above, the thickness of the connecting layers accounts for half of the wall thickness of the corrugated plate, which is 0.2±0.1 mm.

[0032] 8a and 8b, in some embodiments, the substrate chamber group may specifically include a chamber cover plate 24, a substrate chamber 25, and a liquid-absorbent wick structure 23. The chamber cover plate is attached to the top of the substrate chamber (e.g., the two are brazed together), and a plurality of refrigerant intake passages 26 are provided, the number of passages being greater than the number of cavity fins, thereby ensuring more heat dissipation paths for the heat generated by the heat source and shortening the heat dissipation time. In order to intensively deal with and dissipate the heat generated in the power consumption heat source area, the heat dissipation level is appropriately improved. During the installation process, the liquid-absorbent wick structure 23 is specifically attached inside the substrate chamber and faces the heat source. This liquid-absorbent wick structure 23 can be used to absorb heat from the liquid working medium filled in the substrate chamber, vaporize it, and then become a gaseous working medium that flows through the cavity fins.

[0033] Specifically, as shown in Figures 8b and 8c, the heat source, which is the two central CPUs 13, is the area with the highest power consumption or the main heat source when the entire PCB is operating. Therefore, in order to ensure the normal operation of the electronic device and the reliability of the product, a liquid-absorbent core structure 23 is added to the heat sink in the heat source area corresponding to the CPUs 13, which are the heat sources. The liquid-absorbent core structure enhances the boiling of the liquid working medium, i.e., the refrigerant, and at the same time, enhances the liquefaction and absorption ability during the circulation process, thereby facilitating the circulation of the working medium and improving the operating performance of the product.

[0034] Furthermore, based on practical experience, the liquid-absorbing wick structure 23 of the present application can be specifically a cylindrical structure with a diameter φ of 1 mm and a height of 3 mm. The thermosiphon-type liquid-absorbing wick structure with verified parameters not only has a simpler structure and production process than traditional capillary structures such as sintered ones, but also has a better liquid-absorbing effect due to its capillary force, which provides good support for the circulation of the working medium and the heat exchange capacity of the radiator.

[0035] In some embodiments, two-phase phase change refrigeration materials such as R134a or R1233zd can be used as the liquid working medium (referred to as the heat-dissipating working medium or refrigerant) of the present application, which can solve the problems of increasing power consumption of electronic devices but not increasing the heat dissipation amount per unit area or causing the device to burn out due to delayed heat dissipation, i.e., can be used to address the heat dissipation challenges of upgraded high-power electronic devices.

[0036] In some embodiments, according to actual needs, for example, the height of the host casing can be increased by the height of the cavity fins to obtain a larger chamber volume and heat exchange area, etc. The heat sink of the present application is generally mainly made of aluminum material, and is assembled, positioned and clamped by a brazing jig, and finally brazed in an aluminum brazing tunnel furnace.

[0037] From the above, as shown in Figures 5, 7a and 7b, in addition to the substrate chamber group and the cavity fin array, the present application can also add FINs, and these three parts are welded and assembled into a heat sink by an aluminum brazing process, and then the whole is fixed above the PCB power consumption area 19 (similar to the power consumption area of ​​a traditional heat dissipation module) with screws, so that the PCB power consumption area 19 and the heat sink 18 are combined to form a host operating module, and after the PCB power consumption area 19 starts to consume power, the heat sink 18 starts to operate, and of course, the bottom of this substrate chamber can also contact power consumption elements other than the CPU, so that the heat sink can further provide auxiliary heat dissipation to each power consumption component and reduce the temperature inside the host casing. Furthermore, the cavity fins and spoiler fins installed at intervals can be regarded as the heat exchange chamber that constitutes the heat sink, and this heat exchange chamber is used to provide a larger heat exchange area for the amount of heat generated from the heat source. This heat sink product is not only suitable for current mid-end electronic devices, but can also address the heat dissipation issues of upgraded high-end servers and desktop hosts, etc., laying an updated foundation for heat dissipation in future high-end electronic devices and expanding the field of application.

[0038] As shown in Figure 9, the operating process of the heat sink shown in Figures 5 and 7a includes the following: after the heat source surface of the CPU is heated, the liquid working medium 27 absorbs heat and vaporizes inside the substrate chamber group, and then becomes gaseous working medium 28. This gaseous working medium 28 enters the cavity fins through the refrigerant intake passage 26 and is transferred to the fin sheets along the side walls to perform heat exchange. At the same time, the heat is sent out of the heat sink and the host casing in horizontal and vertical directions by the wind force of the heat removal fan, thereby realizing continuous and efficient heat dissipation for high-power consumption products. Furthermore, the liquid working medium in the gas-liquid mixture is guided into the substrate chamber group through the preset inclination angle structure of the cavity fins by gravity, thereby facilitating the circulation of the working medium and the mutual heat dissipation of heat from the heat source.

[0039] Below, a comparison is made between a traditional radiator and the radiator of the present application using finite element analysis. Furthermore, the radiator of the present application has a spoiler fin and a liquid-absorbing core structure with a diameter φ of 1 mm and a height of 3 mm, and uses R134a refrigeration material as the liquid working medium. Since the main power consumption of the electronic device (host) is concentrated in the two CPUs, the simulation comparison results only need to reflect the temperatures of the two CPUs.

[0040] Specifically, the power consumption parameters of the four CPUs, CPU1 and CPU2, which are corresponding to the traditional heat sink, and CPU1-1 and CPU2-2, which are corresponding to the heat sink of the present application, are all 350W, the airflow Q of the heat removal fans of the two heat sinks is 120CFM, and the ambient temperature of each CPU is Ta=25℃. The 3D drawings are imported into the finite element analysis software Flotherm, and after optimizing the component fillets, the simulation result of the entire host casing system is shown in Figure 10, where the left figure is a schematic diagram of the simulation of the traditional heat sink, and the right figure is a schematic diagram of the simulation of the heat sink of the present application. When the host system is in equilibrium, CPU1_Temperature = 50.1°C, CPU2_Temperature = 58.7°C, According to two sets of data, CPU1-1_Temperature=46.1℃ and CPU2-2_Temperature=46.7℃, the heat dissipation effect of the heat sink of the present application for the CPU is 4℃ and 12℃ better than that of the traditional heat sink, respectively. Thus, the heat sink of the present application reaches a better heat dissipation level than the traditional heat sink, thereby effectively meeting the heat dissipation requirements of high-power consumption products. It should be noted that the heat sink of the present application has cavity fins with a certain heat exchange area even when no spoiler fins are provided, so its heat dissipation effect is also better than that of the traditional heat sink.

[0041] The above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the same. [Explanation of symbols]

[0042] 1. Housing 2 Power supply 3. Inductance 4 Electrical Resistance 5 Heat removal fan 6 capacitors 7 Integrated Circuits IC Chips 8 PCB 9. Aluminum extrusions 10 Heat pipe 11 Copper plate 12 heat pipe slots 13 CPU 14 Capillary structure 15 Evaporation stage 16 (or 27) Liquid working medium 17 Condensation stage 18 Heat sink 19 PCB power consumption area 20 Spoiler fin or spoiler fin 201 Through hole 21 Cavity fin 210 Pre-set tilt angle structure 22 Substrate chamber group 23 Liquid absorption core structure 24 Chamber cover plate 25 Substrate Chamber 26 Refrigerant intake passage 28 Gaseous working medium 29 Fin protection plate

Claims

1. a group of substrate chambers and a cavity fin array; Each cavity fin in the cavity fin array is connected to a refrigerant intake passage of the substrate chamber group, so that the liquid working medium filled in the substrate chamber group absorbs heat and vaporizes, and then dissipates heat through the refrigerant intake passage into the internal chamber of the cavity fin, and the heat absorbed by the liquid working medium is generated from a heat source to be dissipated; A heat sink characterized in that the inner walls of each of the cavity fins are provided with a flow-guiding wall having a predetermined inclination angle structure, and the inclined edge of the predetermined inclination angle structure formed with respect to the horizontal plane is used to guide the liquid in the chambers of the cavity fins back to the group of substrate chambers.

2. The cavity fins are inserted vertically into the refrigerant intake passage, and / or 2. The heat sink according to claim 1, wherein the predetermined inclination angle structure comprises an oblique square or an oblique semicircular structure having a predetermined inclination angle with respect to the refrigerant intake passage.

3. further comprising a spoiler fin spaced apart from the cavity fin; 2. The radiator according to claim 1, wherein each of the spoiler fins has a through hole facing the plate wall of the refrigerant intake passage.

4. 4. The heat sink according to claim 3, wherein the spoiler fin is integrally press-molded.

5. 5. The heat sink according to claim 3, wherein the cavity fins and the spoiler fins are provided with connection layers for connecting to the vertical sidewalls of the substrate chamber group.

6. 6. The heat sink according to claim 5, wherein the connecting layer is an aluminum material layer as solder.

7. The spoiler fin is a wave-shaped tooth plate including a rectangular wave shape or a sinusoidal wave shape, 4. The heat sink according to claim 3, wherein the tooth pitch between two adjacent corrugated tooth plates is 2.2±0.2 mm, and the plate wall thickness of each corrugated tooth plate is 0.2±0.1 mm.

8. the substrate chamber group includes a chamber cover plate, a substrate chamber, and a liquid-absorbent wick structure; the chamber cover plate is attached to the top of the substrate chamber, and has a plurality of the refrigerant intake passages, the number of passages being equal to or greater than the number of the cavity fins; The heat sink of claim 1, wherein the liquid-absorbing wick structure is attached inside the substrate chamber, and the liquid-absorbing wick structure is used to absorb heat and vaporize the liquid working medium filled in the substrate chamber, and then become a gas working medium that flows to the cavity fins.

9. The heat sink according to claim 8, wherein the liquid-absorbent wick structure is a cylindrical structure having a diameter φ of 1 mm and a height of 3 mm.

10. Further, a fin protection plate is included, 2. The heat sink of claim 1, wherein the fin protection plate is attached longitudinally to the side edges of the substrate chambers to provide circumferential enclosure and protection for the cavity fin array.

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