Susceptor transfer for process chamber

Abstract

A method for moving a susceptor within a processing system suitable for use in semiconductor processing is provided, comprising: moving a first susceptor from an interior space of a first enclosure to an interior space of a process chamber during a first period of time; and disposing a first substrate on the first susceptor during a second period of time while the first susceptor is within the process chamber, wherein the interior space of the first enclosure and the interior space of the process chamber are maintained at a non-atmospheric pressure from the start of the first period of time to the end of the second period of time.

Description

[Background technology]

[0001] TECHNICAL FIELD

[0001] Embodiments of the present disclosure generally relate to methods for moving susceptors and substrates through various locations in a processing system, and related equipment configured to do so.

[0002] 2. Description of Related Art

[0002] Susceptors are often used when performing processes (e.g., deposition) on substrates, such as semiconductor substrates. During processing, the susceptor, on which the substrate is placed, is often replaced with a new or different susceptor, for example, to perform a different process or if the process performance is out of specification. This is because these processes can be very sensitive to susceptor characteristics, such as particle deposition on the susceptor, which can affect thermal performance. Because susceptor replacement involves extensive disassembly and requalification of the processing equipment, this replacement can result in significant downtime (e.g., hours or days) for the processing equipment.

[0003]

[0003] Therefore, there is a need for improved methods and apparatus that can reduce downtime due to susceptor replacement. Summary of the Invention

[0004] In one embodiment, a method for moving a susceptor within a processing system suitable for use in semiconductor processing is provided, the method including moving a first susceptor from an interior space of a first enclosure to an interior space of a process chamber during a first time period, and disposing a first substrate on the first susceptor during a second time period while the first susceptor is within the process chamber, wherein the interior space of the first enclosure and the interior space of the process chamber are maintained at a non-atmospheric pressure from the start of the first time period to the end of the second time period.

[0005] In another embodiment, a method for moving a susceptor within a processing system is provided, the method including: moving a first susceptor from an interior space of a first enclosure to an interior space of a process chamber by a first robot during a first period of time; and placing a first substrate on the first susceptor by the first robot during a second period of time while the first susceptor is within the process chamber.

[0006] In another embodiment, a method for moving a susceptor in a processing system is provided, the method including: moving a first susceptor from an interior space of a first enclosure to an interior space of a process chamber through a first opening of the process chamber during a first period of time; and, while the first susceptor is in the process chamber, moving a first substrate through the first opening of the process chamber during a second period of time and disposing the first substrate on the first susceptor.

[0007]

[0007] In order that the above-mentioned features of the present disclosure may be understood in detail, a more particular description of the present disclosure, briefly summarized above, will be had by reference to embodiments. Some embodiments are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only exemplary embodiments and therefore should not be considered to limit the scope of the present disclosure, as other equally effective embodiments may also be permitted. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic top view of a multi-chamber processing system, according to one embodiment. [Figure 2] 1 illustrates a cross-sectional view of a processing chamber, according to one embodiment. [Figure 3] FIG. 1B is a process flow diagram of a method for moving one or more susceptors in the processing system of FIG. 1A, according to one embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009]

[0011] For ease of understanding, where possible, the same reference numerals have been used to designate identical elements that are common to multiple figures. It is envisioned that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0010]

[0012]

[0003] Embodiments of the present disclosure generally relate to methods for moving a susceptor and a substrate through various portions of a processing system without requiring significant changes to the conditions (temperature, pressure, presence or absence of gas, etc.) in the various internal volumes of the processing system. Replacing a susceptor in a process chamber, such as a deposition chamber, has traditionally been a manual process that entails significant changes to the internal volumes of various portions of the processing system (e.g., bringing the internal volumes from vacuum pressure to atmospheric pressure), in addition to extensive downtime of the processing system.

[0011]

[0013] The methods and processing systems disclosed herein enable the transfer of substrates and susceptors through a processing system using equipment (e.g., robots) located within the processing system. Furthermore, the same equipment (e.g., robots, load lock chambers, transfer chambers, etc.) can be used to move both substrates and susceptors. Furthermore, the same openings (e.g., slit valve openings leading into a process chamber) can be used in different parts of the processing system to accommodate both substrates and susceptors, which may have different sizes (e.g., different diameters). By enabling susceptor replacement using equipment (e.g., robots) within the processing system, downtime traditionally associated with susceptor replacement can be avoided. Using the same equipment (e.g., the same transfer robot) and other components (e.g., the same slit valve openings) to transfer both substrates and susceptors can add the ability to automatically transfer susceptors without significantly increasing the processing system footprint or capital costs. Additionally, the ability to change susceptors within the process chamber greatly facilitates shorter production runs using different recipes that may require different susceptors. Furthermore, because susceptors are changed using automated equipment, errors associated with manually handling susceptors may be reduced or eliminated, and handling consistency and susceptor placement accuracy may be improved, resulting in improved product uniformity for substrates processed on the susceptor.

[0012]

[0014] 1 is a schematic top view of a multi-chamber processing system 100, according to one embodiment. The processing system 100 includes a factory interface 102, load lock chambers 104, 106, a transfer chamber 108, storage chambers 120, 122, and process chambers 300A, 300B. As described in detail herein, substrates 50 and susceptors 60 can be transferred between various portions of the processing system 100 without exposure to an external ambient environment 190 (e.g., an atmospheric ambient environment such as may exist in a fabrication factory). For example, substrates 50 and susceptors 60 can be transferred within the processing system 100 between various chambers maintained at low or vacuum pressures (e.g., about 300 Torr or less) without breaking the low pressure or vacuum environment. While the processing system 100 is generally described as operating at low or vacuum pressures, the benefits of this disclosure also apply to systems operating at atmospheric or superatmospheric pressures. An advantage of the present disclosure is that while the susceptor is being transported through the processing system, the interior space of the processing system is largely unaffected by the transport of the susceptor and the interior space of the processing system is not exposed to the external ambient environment 190.

[0013]

[0015] The factory interface 102 includes a docking station 132 and factory interface robots 134A, 134B (also referred to as transfer robots) to facilitate the transfer of substrates 50 and susceptors 60. The docking station 132 is adapted to receive one or more front-opening unified pods (FOUPs) 136, 137. The FOUP 136 is configured to store substrates 50. The FOUP 137 is configured to store susceptors 60. In some examples, each of the factory interface robots 134A, 134B generally includes an end effector 138 adapted to transfer the substrates 50 and / or susceptors 60 from the factory interface 102 to one of the load lock chambers 104, 106. Each of the transfer robots 134A, 134B and each of the load lock chambers 104, 106 may be configured to transfer substrates 50 and susceptors 60.

[0014]

[0016] The load lock chambers 104, 106 connect the factory interface 102 to a transfer chamber 108. The transfer chamber 108 is connected to the process chambers 300A, 300B and the storage chambers 120, 122. The transfer chamber 108 may include a transfer robot 112 that may transfer the substrate 50 and susceptor 60 from one of the load lock chambers 104, 106 to one of the process chambers 300A, 300B. The transfer robot 112 may also transfer the susceptor 60 to one of the storage chambers 120, 122. The storage chambers 120, 122 may be used to store frequently used susceptors 60. The storage chambers 120, 122 are optional components of the processing system 100. While the storage chambers 120, 122 may be optional, their use may obviate the need for customized FOUPs designed for susceptors. Thus, in some embodiments, the storage chambers 120, 122 may eliminate the costs associated with customized FOUPs for susceptors, as well as the costs of ensuring other equipment in the processing system 100 (e.g., transfer robots 134A, 134B) is configured to work with the customized FOUPs.

[0015]

[0017] In some embodiments, one or more of the load lock chambers 104, 106 and / or one or more of the storage chambers 120, 122 may include a removable lid or exterior door connected to the external ambient environment 190. The removable lid or exterior door may allow the susceptor 60 to be placed into the corresponding load lock chamber 104, 106 or storage chamber 120, 122 from the external ambient environment without being transferred from the FOUP (e.g., FOUP 137) through the docking station 132. By having the load lock chambers 104, 106 and / or storage chambers 120, 122 include a removable lid or door that opens to the external ambient environment 190, costs associated with customized FOUPs for the susceptors, as well as the costs of reliably configuring other equipment in the processing system 100 (e.g., transfer robots 134A, 134B) to work with the customized FOUP, may be eliminated. The load lock chambers 104, 106 and storage chambers 120, 122 may each include an interior door to isolate the interior environment of the corresponding load lock chamber 104, 106 or storage chamber 120, 122 from the interior environment of the transfer chamber 108. This isolation may prevent pressure changes from occurring in other portions of the processing system when a susceptor 60 is added to one of the load lock chambers 104, 106 or one of the storage chambers 120, 122 through an opening associated with a corresponding removable lid or exterior door.

[0016]

[0018] The process chambers 300A, 300B can be any type of process chamber (e.g., deposition, etching, annealing, etc.) configured to use a susceptor. In one embodiment, the process chambers 300A, 300B can be epitaxial deposition chambers, as described in further detail below.

[0017]

[0019] The processing system 100 may further include a system controller 168 for controlling and monitoring other components of the processing system 100. During operation, the system controller 168 enables data collection and feedback from the corresponding chambers and other equipment to regulate the performance of the processing system 100.

[0018]

[0020] System controller 168 generally includes a central processing unit (CPU) 170, memory 172, and support circuits 174. CPU 170 may be any form of general-purpose processor that may be used in an industrial setting. Memory 172 (or non-transitory computer-readable medium) is accessible by CPU 170 and may be one or more of memory, such as random access memory (RAM), read-only memory (ROM), a floppy disk, a hard disk, or any other form of local or remote digital storage. Support circuits 174 are coupled to CPU 170 and may include cache, clock circuits, an input / output subsystem, power supplies, etc. The various methods disclosed herein may generally be implemented by CPU 170 executing code stored in memory 172 under the control of controller 168. When the code is executed by CPU 170, CPU 170 may control various devices within processing system 100 to perform processing in accordance with the various methods described herein.

[0019]

[0021] 1 is one embodiment of a processing system that may be used for substrate and susceptor transfer. Other processing systems may have different configurations (e.g., more or fewer processing chambers, different types of processing chambers, more or fewer (e.g., zero) storage chambers, etc.).

[0020]

[0022] 2 is a cross-sectional view of a processing chamber 300 according to one embodiment. The processing chamber 300 may be the processing chambers 300A and 300B shown in FIG. 1. The processing chamber 300 may be configured to perform an epitaxial (Epi) deposition process. A susceptor 60 is disposed within the processing chamber 300. A substrate 50 is disposed on the susceptor 60. The process chamber 300 is configured to allow exchange of the substrate 50 and the susceptor 60 through an opening 360 that may be opened by a slit valve 365 of the process chamber 300.

[0021]

[0023] The processing chamber 300 includes a housing structure 302 made of a process-resistant material (e.g., aluminum or stainless steel, such as 316L stainless steel). The housing structure 302 encloses various functional elements of the processing chamber 300, such as a quartz chamber 304 including an upper quartz chamber 306 and a lower quartz chamber 308. The quartz chamber 304 encloses a processing space 310 (also referred to as an interior space). One or more liners 336, 337 may isolate the quartz chamber 304 from the housing structure 302.

[0022]

[0024] The process chamber 300 includes a substrate support assembly 316. The substrate support assembly 316 may include a support 317 and a shaft 318. The susceptor 60 may be positioned on the support 317 using, for example, the transfer robot 112 (see FIG. 1 ). The substrate support assembly 316 may further include an actuator 319 to raise and lower the support 317 to enable exchange of the susceptor 60 and the substrate 50 using the transfer robot 112. In some embodiments, the substrate support assembly 316 may include lift pins (not shown) that can be raised and lowered to facilitate exchange of the susceptor 60 and / or the substrate 50 from the transfer robot 112. In some embodiments, a first set of lift pins may be configured to raise the susceptor 60, and a second set of lift pins may be configured to raise the substrate 50. For example, in one embodiment, the substrate support assembly 316 may include six supports 317, three of which may have lift pins for raising the susceptor 60, and another three of which may have lift pins that may extend through holes in the susceptor 60 for raising the substrate 50.

[0023]

[0025] The susceptor 60 may be formed from a ceramic material, or a graphite material coated with a silicon material (such as silicon carbide), or other process resistant material.

[0024]

[0026] A gas distribution assembly (not shown) may provide reactive species to the processing space 310. Processing by-products may be removed from the processing space 310 by an exit port (not shown), which is typically in communication with a vacuum source (not shown). In some embodiments, gas is provided to an outboard portion of the processing space 310, for example, through one or more openings in the liners 336, 337. In such embodiments, the gas may flow from the outboard portion to the region above the susceptor 60 and substrate 50 and then exit through the exit port.

[0025]

[0027] A purge gas (not shown) may be provided below the susceptor 60 to prevent reactive species from entering the region below the susceptor 60 in the processing space 310. A preheat ring 370 may be positioned around the susceptor 60. The preheat ring 370 may be used to preheat reactive species as they move from the outer portion of the processing space 310 to the inner portion of the processing space (e.g., above the susceptor 60). The preheat ring 370 may also be used to control the flow of purge gas around the susceptor 60.

[0026]

[0028] Heating of the substrate 50 and / or the process space 310 may be performed by a radiation source (such as an upper lamp module 324A and a lower lamp module 324B). In one embodiment, the upper lamp module 324A and the lower lamp module 324B are infrared (IR) lamps.

[0027]

[0029] 3 is a process flow diagram of a method 1000 for moving one or more susceptors 60 within the processing system 100 of FIG. 1A, according to one embodiment. Method 1000 is described with reference to FIGS. 1-3. The system controller 168 may execute a program stored in memory to perform method 1000. The method begins at block 1002.

[0028]

[0030] In block 1002, the first susceptor 60 and the first substrate 50 are moved into the load lock chamber from the FOUPs 136, 137. The first susceptor 60 may be moved from the FOUP 137 into the load lock chamber 106 by the transfer robot 134B. The first substrate 50 may be moved from the FOUP 136 into the load lock chamber 104 by the transfer robot 134A.

[0029]

[0031] In block 1004, a first susceptor 60 may be moved from the load lock chamber 106 into the first process chamber 300A by the transfer robot 112 of the transfer chamber 108 during a first period of time. A slit valve 365 may be opened to provide access for the transfer robot 112 to place the susceptor 60 inside the first processing chamber 300A. All housings of the processing system 100 may be designed with openings (such as slit tunnels) sized to allow the substrate 50 and susceptor 60 to be moved to various portions of the processing system 100.

[0030]

[0032] In block 1006, during a second period when the first susceptor 60 is in the first process chamber 300A, the first substrate 50 may be moved by the transfer robot 112 in the transfer chamber 108 from the load lock chamber 104 into the first process chamber 300A and placed on the first susceptor 60. The second period occurs after the first period.

[0031]

[0033] In block 1008, a first process (e.g., deposition) is performed on the first substrate 50 in the first process chamber 300A during a second time period. All interior spaces of the processing system 100 may be maintained at a non-atmospheric pressure from the start of the first time period to the end of the second time period.

[0032]

[0034] In block 1010, during a third time period, the first substrate 50 is removed from the first process chamber 300A, and then the first susceptor 60 is replaced with a second susceptor 60. The third time period occurs after the second time period. All interior spaces of the processing system 100 may be maintained at a non-atmospheric pressure from the start of the first time period until the end of the third time period. The second susceptor 60 may be provided from the FOUP 137, as described above, or from one of the optional storage chambers 120, 122.

[0033]

[0035] Alternatively, in some embodiments, the first susceptor 60 and / or the second susceptor 60 may be provided in one of the load lock chambers 104, 106 or one of the storage chambers 120, 122 through an opening associated with a corresponding removable lid or door that opens to the external ambient environment 190, as described above. When the susceptor 60 is provided in the load lock chamber 104, 106 or the storage chamber 120, 122 using a removable lid or external door, the interior of the load lock chamber 104, 106 or the storage chamber 120, 122 may remain isolated from the interior of the transfer chamber 108. If the susceptor 60 is provided to one of the load lock chambers 104, 106 or storage chambers 120, 122 through an opening associated with a corresponding removable lid or door that leads to the external ambient environment 190, after the susceptor 60 is added and the corresponding lid is replaced or the external door is closed, the pressure of the corresponding load lock chamber 104, 106 or storage chamber 120, 122 can be adjusted to match the pressure of the transfer chamber 108 (e.g., pumped down to vacuum pressure).

[0034]

[0036] In block 1012, a second substrate 50 is placed on the second susceptor 60 during a fourth period when the second susceptor 60 is within the first process chamber 300A.

[0035]

[0037] In block 1014, a second process (e.g., deposition) is performed on the second substrate 50 in the first process chamber 300A during a fourth time period, the fourth time period occurring after the third time period.

[0036]

[0038] In some embodiments, the second process is a different process from the first process. For example, the first process may be the deposition of a first layer formed from a first set of gases provided to the interior space of the process chamber 300A, while the second process may be the deposition of a different layer formed from a different set of gases provided to the interior space of the process chamber 300A. Furthermore, in some embodiments, the second susceptor 60 is a different susceptor from the first susceptor 60. For example, the second susceptor 60 may be formed from a different material or have other differences in addition to a differently contoured top surface compared to the first susceptor 60.

[0037]

[0039] All interior spaces of the processing system 100, including the interior spaces of the FOUPs 136, 137, the docking station 132, the load lock chambers 104, 106, the transfer chamber 108, the storage chambers 120, 122, and the process chambers 300A, 300B, may be maintained at atmospheric pressure (e.g., 760 Torr), non-atmospheric pressure, or vacuum pressure from the beginning of the first time period to the end of the fourth time period. As used herein, non-atmospheric pressure refers to a pressure at least 5% higher or at least 5% lower than atmospheric pressure (i.e., 760 Torr). As used herein, vacuum pressure refers to a pressure less than 300 Torr. Furthermore, there is little change in temperature or gas (e.g., inert gas) mixture within the various interior spaces of the processing system 100 when the substrate 50 and susceptor 60 are moved between various enclosures within the processing system 100. This is because the movement of the substrate 50 and susceptor 60 is performed by components located inside the processing system 100 (such as transfer robots 134A, 134B, 112), and therefore the interior space within the processing system is not exposed to the external ambient environment 190.

[0038]

[0040] After block 1014, the second substrate 50 may be removed for subsequent processing. The processing system 100 may then continue processing the substrate 50 in the chambers 300A, 300B using the same susceptor 60 or a different susceptor 60. The susceptor 60 in the process chambers 300A, 300B may be easily replaced with another susceptor 60 from the storage chambers 120, 122, the load lock chambers 104, 106, or the FOUPs 136, 137. The ability to easily replace the susceptor 60 in the process chambers 300A, 300B prevents downtime associated with conventional manual susceptor replacement and greatly facilitates the execution of a different process that requires the use of a different susceptor not in one of the process chambers 300A, 300B.

[0039]

[0041] While the above description is directed to examples of the present disclosure, other and further examples of the disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the claims that follow.

Claims

1. 1. A method for moving a susceptor within a processing system suitable for use in semiconductor processing, comprising: moving a first susceptor from an interior space of the first enclosure to an interior space of the process chamber during a first period of time; placing a first substrate on the first susceptor during a second period when the first susceptor is in the process chamber; wherein the interior space of the first enclosure and the interior space of the process chamber are maintained at a non-atmospheric pressure from the start of the first period to the end of the second period. method.

2. 10. The method of claim 1, further comprising performing a first process on the first substrate in the interior space of the process chamber while the first substrate is on the first susceptor during the second period.

3. 3. The method of claim 2, further comprising removing the first substrate from the process chamber and replacing the first susceptor in the process chamber with a second susceptor during a third period, wherein the internal space of the first enclosure and the internal space of the process chamber are maintained at a non-atmospheric pressure from the start of the first period to the end of the third period.

4. 4. The method of claim 3, further comprising placing a second substrate on the second susceptor during a fourth period while the second susceptor is in the process chamber, wherein the interior space of the first enclosure and the interior space of the process chamber are maintained at a non-atmospheric pressure from the start of the first period to the end of the fourth period.

5. 5. The method of claim 4, further comprising performing a second process, different from the first process, on the second substrate in the interior space of the process chamber while the second substrate is on the second susceptor during the fourth period.

6. The method of claim 5 , wherein the non-atmospheric pressure is a vacuum pressure.

7. 2. The method of claim 1, wherein during the first period, the first susceptor is moved through an interior space of a second housing, and during the first period, the interior space of the second housing is maintained at a non-atmospheric pressure.

8. During the first period, the first susceptor is moved from a load lock chamber to the process chamber; During the first period, the interior space of the load lock chamber is maintained at a non-atmospheric pressure; The method of claim 1 , wherein the first susceptor is moved into the load lock chamber through an opening in a removable lid or exterior door of the load lock chamber prior to the first period of time.

9. during the first period, the first susceptor is moved from a storage chamber containing two or more susceptors to the process chamber; During the first period, the interior space of the storage chamber is maintained at a non-atmospheric pressure; The method of claim 1 , wherein the first susceptor is moved into the storage chamber through an opening in a removable lid or exterior door of the storage chamber prior to the first period of time.

10. 1. A method for moving a susceptor in a processing system, comprising: moving a first susceptor from the interior space of the first enclosure to the interior space of the process chamber by a first robot during a first period of time; placing a first substrate on the first susceptor by the first robot during a second period when the first susceptor is in the process chamber; A method comprising:

11. 11. The method of claim 10, further comprising performing a first process on the first substrate in the interior space of the process chamber while the first substrate is on the first susceptor during the second period.

12. removing the first substrate from the process chamber by the first robot during a third period of time; exchanging the first susceptor with a second susceptor in the process chamber by the first robot during the third period; The method of claim 11 further comprising:

13. 13. The method of claim 12, further comprising placing a second substrate onto the second susceptor by the first robot during a fourth period when the second susceptor is within the process chamber.

14. 14. The method of claim 13, further comprising performing a second process, different from the first process, on the second substrate in the interior space of the process chamber while the second substrate is on the second susceptor during the fourth period.

15. 15. The method of claim 14, wherein the interior space of the process chamber and the interior space of the first enclosure are maintained at a vacuum pressure from the start of the first time period to the end of the fourth time period.

16. 1. A method for moving a susceptor in a processing system, comprising: moving a first susceptor from an interior space of a first enclosure to an interior space of a process chamber through a first opening of the process chamber during a first period of time; moving a first substrate through the first opening in the process chamber and placing the first substrate on the first susceptor during a second period when the first susceptor is within the process chamber; A method comprising:

17. 17. The method of claim 16, further comprising performing a first process on the first substrate in the interior space of the process chamber while the first substrate is on the first susceptor during the second period.

18. removing the first substrate from the process chamber through the first opening during a third period of time; 18. The method of claim 17, further comprising: exchanging the first susceptor in the process chamber for a second susceptor during the third period, wherein the first susceptor and the second susceptor are moved through the first opening to exchange the first susceptor for the second susceptor.

19. 20. The method of claim 18, wherein the interior space of the process chamber and the interior space of the first enclosure are maintained at a vacuum pressure from the start of the first time period to the end of the third time period.

20. 17. The method of claim 16, wherein the first susceptor and the first substrate are each moved into the process chamber by a first robot.

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