Non-invasive quantitative multi-layer assessment method and resulting multi-layer components
A non-destructive method for multilayer components allows for quantitative layer thickness and depletion analysis, facilitating component reuse and field repairs by creating geometric openings and using digital microscopy, addressing the limitations of existing testing methods.
Patent Information
- Application Number
- JP2025520887
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-10-19
- Filing Date
- 2023-10-13
- Publication Date
- 2025-10-24
Smart Images

Figure 2025535265000001_ABST
Abstract
Description
[Technical Field]
[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation-in-part of U.S. Patent Application No. 16 / 701,243, filed December 3, 2019, which claims the benefit of European Patent Application No. 18210779.7, filed December 6, 2018, the disclosure of which is incorporated herein by reference in its entirety.
[0002] The present disclosure relates generally to non-destructive materials testing, and more particularly to a method for analyzing quantitative data regarding layers of a multi-layer component, and the resulting multi-layer component.
[0003] Quantitative investigations and quality checks of material properties are often required to determine, for example, applied coating thickness, depletion levels, etc. Such evaluations are often required for process qualification, periodic production monitoring, determining the remaining life of multilayer components, or as an initial evaluation to determine the extent of repair of multilayer components. Cutouts from commercially available components are used to perform these evaluations. As a result, the component must be destroyed (scraped) and replaced with a new part. Limited nondestructive testing is available, for example, to evaluate interfacial delamination or layer thickness of ceramic layers on metal substrates via thermography. However, these approaches lack the ability to provide quantitative data on life-related properties, especially bond coat depletion. Furthermore, such evaluations cannot be performed in the field (either on intact or disassembled components). [Prior art documents] [Patent documents]
[0004] [Patent Document 1] US Patent Publication No. 2023 / 0038239 Summary of the Invention
[0005] A first aspect of the present disclosure provides a method for analyzing layer thicknesses of a multilayer component, the method including the steps of: creating an opening having a predetermined partial geometric shape in the multilayer component at a selected location on a surface of the multilayer component, the multilayer component including a plurality of material layers including a substrate and a bond coat, the opening exposing each of the plurality of material layers including the substrate; creating an image of the exposed plurality of material layers in the opening using a digital microscope; and calculating from the image at least a thickness of the bond coat of the exposed plurality of material layers based on the predetermined geometric shape of the opening.
[0006] A second aspect of the present disclosure provides a multilayer component comprising: a substrate; a bond coat over the substrate; a thermal barrier coating (TBC) layer over the bond coat, the TBC layer having a first outer surface having indicia of exposure to a hot gas path environment; a fill opening in the substrate, the bond coat, and the TBC layer, the fill opening including a substrate repair filler filling the fill opening in the substrate; a bond coat repair filler filling the fill opening in the bond coat; and a thermal barrier coating (TBC) plug filling the fill opening in the TBC layer, the TBC plug having a second outer surface having no or reduced indicia of exposure to a hot gas path environment.
[0007] A third aspect of the present disclosure includes a method for analyzing layer thicknesses of a multilayer component, the method including: drilling to form an opening having a predetermined geometric shape partially within the multilayer component at a selected location on a surface of the multilayer component, the multilayer component including a plurality of material layers including a substrate and a bond coat on the substrate, the opening exposing each of the plurality of material layers; polishing the exposed plurality of material layers and etching the exposed plurality of material layers to increase the contrast of the plurality of material layers exposed only within the opening from the contrast present after the opening is created; creating an image of the exposed plurality of material layers within the opening using a digital microscope; calculating from the image at least a thickness of the bond coat based on the predetermined geometric shape of the opening; and repairing the opening, thereby enabling the multilayer component to be used for its intended purpose.
[0008] A fourth aspect of the present disclosure includes an automated system for analyzing layer thicknesses of a multilayer component, the automated system comprising: a manipulator coupled to an aperture forming device configured to form an aperture having a predetermined geometric shape in the multilayer component at a selected location on a surface of the multilayer component, the multilayer component including a plurality of material layers including at least a substrate and a bond coat, the aperture exposing each of the plurality of material layers; an imaging device configured to create an image of the exposed plurality of material layers in the aperture; and a processor configured to calculate from the image at least a thickness of the bond coat of the exposed plurality of material layers based on the predetermined geometric shape of the aperture.
[0009] A fifth aspect of the present disclosure includes a method for analyzing layer thicknesses of a multilayer component using an automated system having a manipulator and a processor, the method including the steps of receiving the multilayer component in the manipulator of the automated system; creating an opening using an opening forming device coupled to the manipulator, the opening having a predetermined geometric shape partially within the multilayer component at a selected location on a surface of the multilayer component, the multilayer component including a plurality of material layers including at least a substrate and a bond coat, the opening exposing each of the plurality of material layers; creating an image of the exposed plurality of material layers within the opening using an imaging device coupled to the manipulator; and calculating, using the processor of the automated system, from the image, at least a thickness of the bond coat of the exposed plurality of material layers based on the predetermined geometric shape of the opening.
[0010] A sixth aspect of the present disclosure includes a method for repairing a multilayer component using an automated system having a manipulator and a processor, the method including the steps of receiving the multilayer component in the manipulator of the automated system; creating an opening using an opening forming device coupled to the manipulator, the opening having a predetermined geometric shape partially within the multilayer component at a selected location on a surface of the multilayer component, the multilayer component including a plurality of material layers including at least a substrate and a bond coat, the opening exposing each of the plurality of material layers; creating an image of the exposed plurality of material layers within the opening using an imaging device coupled to the manipulator; calculating from the image using the processor of the automated system at least a thickness of the bond coat of the exposed plurality of material layers based on the predetermined geometric shape of the opening; and repairing the opening using a repair device coupled to the manipulator of the automated system.
[0011] These and other features of the present disclosure will be more readily understood from the following detailed description of the various aspects of the disclosure, taken in conjunction with the accompanying drawings which illustrate various embodiments of the present disclosure. [Brief explanation of the drawings]
[0012] [Figure 1] 1 is a perspective view of an exemplary multi-layer component in the form of a turbine blade; [Figure 2] 1 is a cross-sectional view of an exemplary layer of a multi-layer component. [Figure 3] 1 is a cross-sectional view of an opening formation according to one embodiment of the present disclosure. [Figure 4] FIG. 10 is a cross-sectional view of an opening formation according to another embodiment of the present disclosure. [Figure 5] 10A-10C are cross-sectional views of optional increase in contrast of layers within an opening according to one embodiment of the present disclosure. [Figure 6] FIG. 10 is a cross-sectional view of imaging a layer within an aperture according to one embodiment of the present disclosure. [Figure 7] 1 is an exemplary image of layers within an opening according to one embodiment of the present disclosure. [Figure 8] FIG. 10 is a schematic diagram of layers of an opening for calculating layer thickness according to one embodiment of the present disclosure. [Figure 9] FIG. 1 is a cross-sectional view of a layer of a repaired multi-layer component according to one embodiment of the present disclosure. [Figure 10] FIG. 10 is a cross-sectional view of a layer of a repaired multi-layer component according to another embodiment of the present disclosure. [Figure 11] FIG. 1 is a block diagram of an exemplary automation system according to one embodiment of the present disclosure. [Figure 12] FIG. 1 is a flow diagram of an exemplary automated method according to an embodiment of the present disclosure. [Figure 13] FIG. 10 is a flow diagram of a second exemplary automated method according to an embodiment of the present disclosure. [Figure 14] FIG. 10 is a flow diagram of a third exemplary automated method according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION
[0013] It should be noted that the drawings of the present disclosure are not to scale. These drawings are intended to depict only typical aspects of the disclosure and should not be considered limiting of the scope of the disclosure. In the drawings, like reference numerals represent like elements throughout.
[0014] As an initial matter, in order to clearly explain this disclosure, it is necessary to select specific terminology when referring to and describing related parts of a multi-layer component. In doing so, wherever possible, common industry terminology will be used and adopted in a manner consistent with its accepted meaning. Unless otherwise noted, such terminology should be given a broad interpretation consistent with the context of this application and the appended claims. Those skilled in the art will recognize that in many cases, a particular component may be referred to using several different or overlapping terms. What may be described herein as being a single component may include and be referred to in other contexts as consisting of multiple components. Alternatively, what may be described herein as comprising multiple components may be referred to elsewhere as a single component.
[0015] When an element or layer is referred to as "overlying," "engaged," "disengaged," "connected," or "coupled" to another element or layer, the element or layer may be directly overlying, engaged, connected, or coupled to the other element or layer, or intervening elements or layers may be present. Conversely, when an element is referred to as "directly overlying," "directly engaged," "directly connected," or "directly coupled" to another element or layer, there may be no intervening elements or layers. Other terms used to describe relationships between elements should be interpreted similarly (e.g., "between" versus "directly between," "adjacent to" versus "directly adjacent to," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.
[0016] Embodiments of the present disclosure provide a method for analyzing quantitative data, such as layer thicknesses, of a multi-layer component. The method obtains the necessary quantitative data in a minimally invasive manner from the multi-layer component. In particular, openings are formed in the multi-layer component that can be fully restored, if necessary, using available (localized) repair procedures, while allowing for reuse of commercially available multi-layer components. Furthermore, component evaluation can be performed during component manufacturing and in the field. The component can be repaired in the field using field repair solutions.
[0017] FIG. 1 shows a perspective view of an exemplary multilayer component 100 in the form of a turbine blade. The teachings of the present disclosure can be applied to any multilayer component manufactured using any method of forming layers, such as welding, brazing, or thermal spraying. As shown in the cross-sectional view of FIG. 2, the multilayer component 100 can include multiple material layers. In the illustrated example, one or more protective layers 106 may overlie a substrate 104. The substrate 104 can include any metal or metal alloy that acts as a metallic substrate, or a ceramic, such as a ceramic matrix composite. For turbine blade purposes, the substrate 104 can include a superalloy, which can refer to an alloy that has numerous superior physical properties compared to conventional alloys, such as high mechanical strength and high thermal creep deformation resistance. Superalloys include, but are not limited to, Rene 108, CM247, Haynes alloy, Incalloy, MP98T, TMS alloy, CMSX single crystal alloy, N5, GTD 444, MarM 247, and IN 738. Alternatively, the substrate 104 can comprise a variety of other metals or metal alloys. “Gamma prime” (γ′) is the primary strengthening phase in nickel-based alloys. Exemplary high-gamma prime superalloys include, but are not limited to, Rene 108, N5, GTD 444, MarM 247, and IN 738. In one embodiment, the bond coat 110 can comprise a gamma-gamma prime structure (e.g., a γ′ [Ni3(Al,Ti)] phase in a gamma matrix γ-Ni(Co,Cr)), while in another embodiment, the substrate 104 can comprise a gamma-beta structure, e.g., a β-NiAl phase in a gamma matrix γ-Ni(Co,Cr). With respect to ceramics, the substrate 104 can comprise any now-known or later-developed ceramic configured to operate in a hot gas path environment.
[0018] The protective layer 106 may include, for example, any now known or later developed protective layer for protecting the substrate 104 from high-temperature, corrosive environments. In one embodiment, the protective layer 106 may include at least one of a bond coat 110 (also known as an overlay coat when used alone) and a top coat 112 over the bond coat (note that "top coat" does not necessarily mean that layer 112 is the outermost coating). The bond coat 110, if used, may include any now known or later developed bond coat material, such as, but not limited to, nickel or platinum aluminide, nickel chromium aluminum yttrium (NiCrAlY), or nickel cobalt chromium aluminum yttrium (NiCoCrAlY). The bond coat 110 may include a gamma-gamma prime structure (e.g., a γ' [Ni(Al,Ti)] phase in a gamma matrix γ-Ni(Co,Cr)). In one embodiment, the bond coat 110 may include a metal (M) having a chromium-aluminum-yttrium alloy (MCrAlY), such as those commercially available from Amdry under model numbers 4522A and 4522C. The bond coat 110 may be applied using, for example, high velocity oxygen fuel (HVOF) application, low pressure plasma spray (LPPS), or atmospheric plasma spray (APS).
[0019] A thermal barrier coating (TBC) layer 114 may be provided over the bond coat 110. Materials for the TBC layer 114 may include, for example, yttria stabilized zirconia (YSZ), mullite, and alumina.
[0020] 3, elements diffuse from bond coat 110, forming a depletion layer 118, portions of which may eventually oxidize to form a thermally grown oxide layer 116 (hereinafter "oxide layer 116"). Depending on the composition of substrate 104 and the method of forming bond coat 110, oxide layer 116 may or may not form during operation by diffusion of aluminum, e.g., the γ' phase [Ni3(Al,Ti)] phase, in the gamma matrix γ-Ni(Co,Cr) from bond coat 110.
[0021] Three exemplary configurations of substrate 104 and bond coat 110 in which embodiments of the present disclosure are advantageous include: A) a substrate 104 having a gamma-gamma prime MCrAlY bond coat 110 applied by HVOF or LPPS, which exhibits depletion in the bond coat 110 and creates a discernible depletion layer 118 using the teachings of the present disclosure. Here, for example, aluminum diffuses and oxidizes to form an oxide layer 116. Embodiments of the present disclosure allow for measurement of depletion in the bond coat 110; B) a substrate 104 having a gamma-beta MCrAlY bond coat 110 applied by APS, where, as shown in FIG. 4 , no depletion occurs and only the thickness of the bond coat 110 is measured using embodiments of the present disclosure, since degradation of the bond coat 110 cannot be measured using this method; and C) a substrate 104 having a gamma-beta MCrAlY bond coat 110 applied by HVOF or LPPS. This latter configuration exhibits a depletion layer 118 within the bond coat 110, as shown in Figure 3, due to behavior (like configuration A) that is discernible using the teachings of the present disclosure, i.e., aluminum diffuses and oxidizes to form an oxide layer 116. While two to three protective layers 106 are shown, it is emphasized that the teachings of the present disclosure are applicable to any number of layers and various diffusion elements. Materials other than TBC can also be used.
[0022] 3 and 4 also illustrate the creation of openings 120, i.e., test site openings, having predetermined geometric shapes in the multilayer component 100 at selected locations on the surface of the multilayer component 100. Prior to creating the openings 120, in most cases, at least a portion of the TBC layer 114 is removed, for example, by grit or sandblasting, as shown in FIG. 3 . Only the area of the TBC layer 114 necessary to create the openings 120 needs to be removed, for example, by drilling. That is, it is not necessary to remove all of the TBC layer 114; only an area slightly larger than the area of the tool used to create the openings 120 needs to be removed. The openings 120 can be created in several ways to create the predetermined geometric shapes in the multilayer component 100. In one embodiment shown in FIG. 3 , the openings 120 are created by drilling to form conical holes 122. Other holes of various shapes are also possible. For example, FIG. 4 illustrates an opening 120 created by carrot grinding to form a spherical segment opening 124. Other material removal tools, such as milling tools, can also be used to create the predetermined geometric shapes in the multilayer component 100. A "predetermined geometric shape" can include points, lines, surfaces, angles, lengths, and any shape with known dimensions. As described below, the predetermined geometric shape allows dimensions obtained from an image of the opening 120 to be used to calculate quantitative data about the layer, particularly the bond coat 110, such as, but not limited to, layer thickness, depletion level, interdiffusion level, or the presence of a heat-affected zone. In one example embodiment of FIG. 3, the drill bit can have a precise point angle of approximately 130° to 150° and a diameter of, for example, approximately 2.5 mm to 7 mm. The location of the opening 120 can be user-selected, for example, to provide a visual assessment of the component (new / used) and, if desired, to define material properties. Multiple openings 120 can be used to test various localized regions of the multilayer component 100. Depending on the condition of the component, different parameters can be evaluated at different locations without the traditional limitations based on a specific cutting plan for the component, which would be required if destructive testing were used.A mask (not shown) can be used for periodic checks at reproducible locations.
[0023] As shown in FIG. 5 for the drilling embodiment of FIG. 3 , the opening 120 exposes each of the material layers 104, 110 (116, 118, if present) comprising the substrate 104. That is, at least a portion of each layer 104, 110 (116, 118, if present) is revealed by the opening 120, e.g., a surface, corner, edge, etc. The size of the opening 120 can be based on various factors, such as, but not limited to, the coating thickness, the expected worst-case wall penetration thickness, and the minimum and / or maximum thickness of the desired opening 120. An appropriate drill bit diameter and angle can be selected based on any of these factors. The substrate 104 should be exposed to a minimal extent and should be exposed in a manner that does not cause cracks or other extensive damage therein. To achieve this, the drilling speed and downpressure are precisely controlled.
[0024] In some cases, it may be beneficial to increase the contrast compared to the contrast present after the opening 120 is formed. FIG. 5 also illustrates optionally increasing the contrast of the material layers 104, 110, 118 exposed only in the opening 120. In one embodiment, this process may include polishing the exposed material layers 104, 106. This process may include polishing using a felt 140 with diamond paste 142, for example. In this case, increasing the contrast may also optionally include etching 144 the exposed material layers 104, 106, for example, after polishing. Etching may include using any now-known or later-developed etchant, such as, but not limited to, a molybdenum etchant for an aluminum-rich phase or a Murakami etchant for a chromium-rich phase. Electrochemical etching may also enhance surface contrast. Polishing may be advantageous when the bond coat 110 is depleted, for example, as in configurations A) and C) described herein. In this manner, embodiments of the present disclosure can obtain the thickness of the bond coat 110 and the thickness of the depletion layer 118, i.e., how much of the bond coat 110 is diffused to form the depletion layer 118 (and oxide layer 116), and how much remains as the bond coat 110. The thickness of the depletion layer 118 and the thickness of the bond coat 110 can be related to the remaining life, i.e., the life expectancy, of the bond coat 110. In other embodiments, no contrast increase is required, i.e., no polishing or etching is performed. This latter process can be applied to certain bond coats 110 that are not depleted, for example, where the degradation is due to internal oxidation, such as in configuration B) described herein.
[0025] 6 illustrates the use of a digital microscope 150, for example, a handheld and portable version, to create images of the exposed material layers 104, 106 within the opening 120. The digital microscope 150 can include any now known or later developed microscope. In one embodiment, the digital microscope 150 can be handheld and portable so that it can be used in the field of use of multi-layer components, for example, inside a turbine.
[0026] FIG. 7 shows an exemplary image 152 of the opening 120 and exposed material layers of a used multilayer component 100. It is understood that a newly fabricated multilayer component 100 will have only the bond coat 110 and substrate 104 present. The depth or thickness of the bond coat 110 can be calculated from the image 152 based on the predetermined geometry of the opening 120. FIG. 8 shows a schematic diagram of dimensions derived from the image 152 of the opening 120 of FIG. 6, e.g., the lateral diameters of layers d1, d2, and d3 of layers 104, 110, and 118, respectively. The predetermined geometry of the opening 120 provides a known angle α of the exposed surfaces of layers 104, 110, and 118. Applying trigonometry, T1 = ((d2 / 2) - (d1 / 2)) tan β, and T2 = ((d3 / 2) - (d2 / 2)) tan β. The angle β is the angle of the opening 120 relative to the horizontal. In this manner, the thickness (T1) of the bond coat 110 can be determined. Additionally, the thickness (T2) of the depletion layer 118, if present, can be determined. The thickness (T2) of the depletion layer 118 indicates the amount of depletion in the bond coat 110. That is, the thickness of the depletion layer 118 can be used to determine the remaining life (life expectancy) of the bond coat 110.
[0027] Based on the calculated thickness, quantitative data such as, but not limited to, the thickness of the bond coat 110, i.e., the thickness of the intact bond coat 110, and the thickness of the depletion layer 118 resulting from the diffusion process, can be determined. In the case of new manufacturing, the thickness of the bond coat 110 can be used, for example, to verify product quality and benchmark the bond coat thickness for later evaluation. For a used multilayer component 100, the depletion volume of the bond coat 110 can be used to predict the remaining life expectancy using, for example, conventional algorithmic or empirical-based modeling techniques. For example, for a known bond coat material, if 50% of the bond coat 110 is used, it can indicate that 1200 operating hours remain under the expected operating conditions of the multilayer component 100. Furthermore, the thickness of the bond coat 110 and / or the thickness of the depletion layer 118 can also be used to determine the life expectancy of the bond coat 110.
[0028] In contrast to traditional destructive material testing, the multilayer component 100 can be evaluated and repaired, if necessary. That is, the opening 120 can be repaired, allowing the multilayer component 100 to be used for its intended purpose, e.g., as an airfoil. The repair process can include any now-known or later-developed repair process for the opening 120 in the provided material. For example, repair of the substrate 104 and bond coat 110 can include at least one of laser wire welding or tungsten inert gas (TIG) welding. The repair device can be handheld. Alternatively, the substrate 104 and / or bond coat 110 can be repaired by a thermal spray process, such as APS, flame spraying, etc. Repair of the TBC layer 114 can include any thermal spray process, such as one of APS and flame spraying. Alternatively, the TBC 114 can include a slurry coating process. The oxide layer 116 is not repaired. FIG. 9 shows the repaired opening 120 (of the embodiment of FIG. 3).
[0029] As discussed above, embodiments of the methods described herein can be performed prior to use, i.e., after fabrication, of the multilayer component 100 to verify proper fabrication and / or benchmark layer thicknesses. Alternatively, embodiments of the present disclosure can be performed at the geographic location of use of the multilayer component 100, e.g., at a power plant in the case of a turbine rotor blade. If the multilayer component 100 is in the field, it can be removed from its use setting or can remain in its use setting, e.g., inside a turbine. If it remains in place, the multilayer component 100 can be used after repair of the opening 120, e.g., without reinstallation. If in the field, repair of the opening 120 can include using at least one handheld device, e.g., a TIG welder, a flame sprayer, or the like.
[0030] 9 illustrates a cross-sectional view of an in-service (i.e., out-of-service) multilayer component 100 after exposure to a method according to an embodiment of the present disclosure. The multilayer component 100 may include a substrate 104, a bond coat 110 on the substrate 104, and a TBC layer 114 on the bond coat 110. The TBC layer 114 has a first exterior surface 170 bearing an indication of exposure to a hot gas path environment, for example, from use in a gas turbine. That is, the first exterior surface 170 may be dirty, worn, and / or have a different color or shading, for example. A fill opening 172 is present in the substrate 104, the bond coat 110, and, if present, the TBC layer 114. An oxide layer 116 and / or a depletion layer 118 may be present outside the fill opening 172. Fill opening 172 includes a substrate repair filler 164 comprising a material that is the same as or similar to (and perhaps with better properties than) the metal of substrate 104, filling fill opening 172 in substrate 104, i.e., substrate portion 160 of opening 120. Multilayer component 100 also includes a bond coat repair filler 174 that fills fill opening 172 in bond coat 110, i.e., in bond coat portion 168 of opening 120. Bond coat repair filler 174 comprises a material that is the same as or similar to (and perhaps with better properties than) the material of bond coat 110. As shown, because opening 120 in substrate 104 is very small, substrate repair filler 164 may be the same material as bond coat repair filler 174, i.e., repair filler 164 and 174 are the same. In this situation, bond coat repair filler 174 extends into substrate 104. A thermal barrier coating (TBC) plug 176 fills the fill opening 172 in the TBC layer 114, i.e., where the TBC layer 114 was removed. The TBC plug 176 has not seen the operating atmosphere and temperature or was applied in a different manufacturing process and therefore has no sign of exposure or a second outer surface 176 that is less than the first outer surface 170 of the TBC layer 114, i.e., is newer (and may have slightly different properties, e.g., porosity), has less contamination thereon, and may have a different color / shade than the TBC layer 114. Either the TBC plug 176 (shown) or the bond coat repair fill 174 can fill the fill opening 172 in the oxide layer 116 and / or the barrier layer 118.In the example of Figure 9, the opening 120 has a perimeter having at least a portion of a conical shape. It is understood that if the opening 120 according to the embodiment of Figure 4 is used, the opening 120 will have a perimeter having at least a spherical portion. In either case, however, as shown in Figure 9, the perimeter of the opening 120 is not visible to the naked eye in the outermost layers, e.g., the TBC layer 114 and the TBC plug 176. A final repair process can include contouring the outer surfaces 170, 176 of the multilayer component 100, for example, by grinding or polishing.
[0031] FIG. 10 illustrates another embodiment in which the repair includes repairing only the substrate 104 with a substrate repair fill 164 in the fill opening 172 and the bond coat 110 with a bond coat repair fill 174. Here, the barrier layer 118, oxide layer 116, and TBC layer 114 are not present. Again, because the opening 120 in the substrate 104 is so small, the substrate repair fill 164 may be the same material as the bond coat repair fill 174; i.e., the repair fills 164 and 174 are the same. The TBC layer 114 is not provided or repaired. The final repair process may include contouring the surface 154 of the multilayer component 100, for example, by grinding or polishing. In FIG. 10, the presence of the opening 120 is not visible to the naked eye on the surface 154. However, if cut open, remnants of the opening 120 can be observed within the multilayer component 100.
[0032] Embodiments of the present disclosure provide quantitative assessment (e.g., thickness, depletion, bonding, heat-affected zone, etc.) of multi-layer components (e.g., substrates with coatings, brazing, welding, etc.) with minimal destructive impact on commercial parts, while enabling their reuse through localized material repair, if necessary. This method thus avoids a full metallurgical investigation by sectioning / destruction of the commercial part, avoiding scrapping of the part for metallurgical investigation of the multi-layer component. Furthermore, the method allows for condition-based repair, narrowing the scope of repair compared to destructive testing techniques. The method can be used in the field, during manufacturing or after use.
[0033] Any of the embodiments of the present disclosure may be performed manually, automatically, or a combination of manually and automatically. In some embodiments, the method is automated. In some embodiments, the method is automated using any suitable automation technique known in the art that facilitates the success of the methods described herein. In some embodiments, the method is automated using an automation system.
[0034] 11 shows a block diagram of an exemplary automated system 200 for analyzing layer thicknesses of a multi-layer component part 300. The automated system 200 can be used in accordance with the methods of the present disclosure, including the methods illustrated in FIGS.
[0035] The automated system 200 includes a processor 202 , a controller 204 , a power supply 206 , a manipulator 208 , and an attachment 210 .
[0036] The processor 202 may be any suitable processor known in the art that facilitates the success of the systems described herein. The processor 202 is configured to process image processing software. The processor 202 is also configured to calculate, from the image, at least a bond coat thickness and / or a barrier layer thickness of the exposed material layers based on the predetermined geometry of the opening.
[0037] The controller 204 may be any suitable controller known in the art that facilitates the success of the systems described herein. The controller 204 is in electronic communication with and configured to control each of the power source 206, the processor 202, and the manipulator 208.
[0038] The power supply 206 may be any suitable power supply known in the art that facilitates the success of the systems described herein.
[0039] The manipulator 208 may be any suitable manipulator known in the art that facilitates the success of the systems described herein. The manipulator 208 may be in the form of a robotic arm. The manipulator 208 may be mechanically and / or electronically coupled to one or more attachments 212 and / or one or more tools 400. The tools 400 may be separate from the automation system 200, and the attachments 210 may be removable from the automation system 200. The manipulator 208 is configured to interact with the multi-layer component part 300, the attachments 210, and the tools 400.
[0040] The attachments 210 may be any suitable attachments known in the art that facilitate the success of the systems described herein. For example, the manipulator may have a drilling device attachment for drilling holes, a polishing device attachment for polishing and preparation, and an imaging device attachment for imaging.
[0041] 12 shows a flow diagram of an exemplary automated method 500 for analyzing layer thicknesses of a multi-layer component part using an automated system including a manipulator and a processor. The method includes steps of receiving 502 the multi-layer component in a manipulator of the automated system, creating 504 an opening using an opening forming device coupled to the manipulator, the opening having a predetermined geometric shape partially within the multi-layer component at a selected location on a surface of the multi-layer component, the multi-layer component including multiple material layers including at least a substrate and a bond coat, the opening exposing each of the multiple material layers, creating 506 an image of the multiple material layers exposed within the opening using an imaging device coupled to the manipulator, and calculating 508 a thickness of at least the bond coat of the multiple material layers exposed from the image based on the predetermined geometric shape of the opening using the processor of the automated system.
[0042] 13 shows a flow diagram of an exemplary automated method 600 for repairing a multilayer component using an automated system including a manipulator and a processor. The method includes steps of receiving 602 the multilayer component in a manipulator of the automated system, creating 604 an opening using an opening forming device coupled to the manipulator, the opening having a predetermined geometric shape partially within the multilayer component at a selected location on a surface of the multilayer component, the multilayer component including multiple material layers including at least a substrate and a bond coat, the opening exposing each of the multiple material layers, creating 606 an image of the exposed multiple material layers within the opening using an imaging device coupled to the manipulator, calculating 608 a thickness of at least the bond coat of the exposed multiple material layers from the image based on the predetermined geometric shape of the opening using a processor of the automated system, and repairing 610 the opening using a repair device coupled to the manipulator of the automated system.
[0043] FIG. 14 shows a flow diagram of an exemplary automated method 700 for analyzing layer thicknesses of a multi-layer component part. A multi-layer component part is loaded 702 into an automated system. A manipulator drills 704 a hole in the multi-layer component part. The manipulator uses a polishing device to polish and prepare the hole surface 706. The manipulator uses an imaging device to record an image of the hole 708. The image is provided to machine vision software 710. The hole and coating layers are located in the image 712. Visual features of depletion and oxidation are located 714 using a deep learning algorithm. The visual features are evaluated for depletion and oxidation 716. The evaluation results are presented 718. This exemplary automated method 700 allows for rapid and cost-effective evaluation and / or repair.
[0044] The multi-layer component part may be loaded 702 with any suitable loading technique known in the art that facilitates the success of the methods described herein. In some embodiments, the multi-layer component part is received in a manipulator. In some embodiments, the multi-layer component part is provided to the manipulator. In some embodiments, the manipulator approaches one or more predetermined points on the multi-layer component part.
[0045] The manipulator may be any suitable loading manipulator known in the art that facilitates the success of the methods described herein. In some embodiments, the manipulator is a robotic manipulator. In some embodiments, the manipulator is fully automated. In some embodiments, the manipulator is partially automated.
[0046] The manipulator uses a variety of tools. The tools may be in the form of individual tools, a tool-containing device, and / or a tool attachment. The tools may be integrated with the manipulator and / or readily available to the manipulator. For example, a manipulator may have a drilling device attachment for drilling holes, a polishing device attachment for polishing and preparation, and an imaging device attachment for imaging. Each of these tools may be used sequentially or simultaneously. If the tools are not integrated with the manipulator, the manipulator may exchange one tool for another. The manipulator may exchange or switch tools at any point during the method.
[0047] The manipulator drills 704 holes in the multi-layer component part. In some embodiments, the manipulator machines the surface of the multi-layer component part to create holes at a predetermined depth and with a required shape. The shape can be any shape, including circular, regular or irregular polygonal, square, rectangular, triangular, pentagonal, hexagonal, heptagonal, or octagonal. In some embodiments, the manipulator machines the surface of the multi-layer component part to create holes at predetermined locations. The predetermined hole shape is deep enough to reach the substrate and sized to show all layers of the coating.
[0048] After drilling the hole, the manipulator uses a polishing device 706 to clean the machined surface and prepare it for inspection. The polishing device removes debris from the hole. The polishing device may also apply an etchant.
[0049] After the holes are prepared, the manipulator records 708 one or more images of the prepared surface. The one or more images may include a single still image in picture format or a series of images in video format. The one or more images may be recorded from the same perspective or from different perspectives. The one or more images may be recorded simultaneously or at different times.
[0050] The one or more recorded images are provided to image processing software (e.g., machine vision software) that analyzes the one or more images with an algorithm 710. The algorithm may be any suitable algorithm known in the art that facilitates the success of the methods described herein. In some embodiments, the algorithm is an artificial intelligence algorithm, a machine learning algorithm, a deep learning algorithm, or a combination thereof.
[0051] The image processing software can perform any suitable analysis known in the art that facilitates the success of the methods described herein. In some embodiments, the image processing software analyzes one or more images to identify 712 the locations of pores and coating layers, identify 714 the locations of visual features related to depletion and oxidation, and / or evaluate 716 the depletion and oxidation.
[0052] After the analysis, the image processing software generates and / or presents 718 a report including the results of the analysis. The report may be generated manually or automatically. In some embodiments, the report includes information regarding the assessed depletion and / or oxidation. In some embodiments, the report includes a pass or fail determination for the multi-layer component part. For example, if the multi-layer component part exhibits depletion and / or oxidation beyond a predetermined standard, the report may indicate a failed condition for the multi-layer component part.
[0053] The above figures illustrate some of the processes involved in some embodiments of the present disclosure. In this regard, it should also be noted that in some alternative embodiments, the described operations may be performed out of the order described, or may actually be performed substantially simultaneously or in reverse order, depending on the operations involved, for example. Those skilled in the art will also recognize that additional steps may be added to describe the processes.
[0054] The terminology used herein is merely for the purpose of describing particular embodiments and is not intended to limit the disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms unless expressly stated otherwise. It will be further understood that the terms "comprise" and / or "comprising," as used herein, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or sets thereof. "Optional" or "optionally" means that the subsequently-stated event or circumstance may or may not occur, and the description includes instances in which the event occurs and instances in which it does not occur.
[0055] As used herein throughout this specification and claims, approximation language can be applied to modify any quantitative expression that can reasonably vary without resulting in a change in the basic function involved. Thus, values modified by terms such as "approximately," "about," and "substantially" are not limited to the exact value specified. In at least some instances, approximation language can correspond to the precision of the instrument used to measure the value. Here, and throughout this specification and claims, range limitations are combinable and / or interchangeable, and unless the context or language dictates otherwise, such ranges are identified and include all subranges encompassed therein. "About," as applied to a particular value in a range, applies to both endpoints and can indicate + / - 10% of the stated value, unless specifically dependent on the precision of the instrument used to measure the value.
[0056] The corresponding structure, material, acts, and equivalents of all means-plus-function or step-plus-function elements in the following claims are intended to encompass any structure, material, or acts for performing that function in combination with other specifically claimed claim elements. The description of the present disclosure has been presented for purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise form disclosed. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the disclosure. The present embodiments were chosen and described in order to best explain the principles and practical application of the disclosure and to enable others skilled in the art to understand the disclosure in various embodiments with various modifications as suited to the particular uses envisioned.
[0057] Further aspects of the present disclosure are provided by the subject matter of the following clauses. [Embodiment 1] 1. A method for analyzing layer thicknesses of a multi-layer component, comprising: creating an opening having a predetermined geometric shape partially within a multilayer component at a selected location on a surface of the multilayer component, the multilayer component including a plurality of material layers including a substrate and a bond coat, the opening exposing each of the plurality of material layers including the substrate; creating an image of the exposed layers of material within the opening using a digital microscope; calculating from the image at least a thickness of the bond coat of the exposed plurality of material layers based on a predetermined geometry of the opening; A method comprising: [Embodiment 2] The bond coat includes MrCrAlY, and the plurality of material layers further includes a barrier layer on the bond coat, and determining a thickness of the barrier layer. The method according to any of the preceding clauses, further comprising: [Embodiment 3] The method of any of the preceding clauses, further comprising determining a life expectancy of the bond coat based on at least one of a barrier layer thickness and a bond coat thickness. [Embodiment 4] The method of any of the preceding clauses, wherein the plurality of material layers further comprises an oxide layer over the barrier layer. [Embodiment 5] The method of any of the preceding clauses, wherein forming the opening includes drilling to form a conical hole. [Embodiment 6] The method of any of the preceding clauses, further comprising increasing the contrast of the plurality of material layers exposed only within the openings from the contrast present after forming the openings. [Embodiment 7] The step of increasing the contrast comprises: polishing the exposed layers of material; Etching the exposed layers of material; The method described in any of the preceding clauses, including: [Embodiment 8] 10. The method of any of the preceding clauses, wherein the polishing step includes using a felt with diamond paste and the etching step includes using an etching solution. [Embodiment 9] The method of any of the preceding clauses, wherein the plurality of material layers includes an oxide layer on the bond coat and a bond coat on the substrate. [Embodiment 10] The method of any of the preceding clauses, further comprising repairing the opening, thereby allowing the multi-layer component to be used for its intended purpose. [Embodiment 11] 10. The method of claim 1, wherein prior to the drilling step, the multilayer component further comprises a thermal barrier coating (TBC) layer over the oxide layer, and further comprising removing at least a portion of the TBC layer prior to the drilling step, and wherein repairing comprises repairing at least a portion of the TBC layer. [Embodiment 12] 10. The method of any of the preceding clauses, wherein the method is performed before use of the multi-layer component. [Embodiment 13] 10. The method of claim 1, wherein prior to the drilling step, the multilayer component further comprises a thermal barrier coating (TBC) layer on the bond coat, and further comprising removing at least a portion of the TBC layer prior to the drilling step, and wherein repairing comprises repairing at least a portion of the TBC layer. [Embodiment 14] 10. The method of any of the preceding clauses, wherein the method is performed at a geographic location of a point of use of the multi-layer component. [Embodiment 15] The method of any of the preceding clauses, wherein repairing the opening includes using at least one handheld device. [Embodiment 16] A multi-layer component comprising: A substrate; a bond coat on the substrate; a thermal barrier coating (TBC) layer over the bond coat, the TBC layer having a first outer surface having an indicia of exposure to a hot gas path environment; a fill opening in the substrate, the bond coat, and the TBC layer, a fill opening including a substrate repair filler filling the fill opening in the substrate; a bond coat repair filler that fills the fill opening in the bond coat; a thermal barrier coating (TBC) plug filling the fill opening in the TBC layer, the TBC plug having a second outer surface that is free of or less than the first outer surface indicative of exposure to the hot gas path environment; A multi-layer component comprising: [Embodiment 17] The multilayer component of any preceding clause, wherein the substrate repair filler filling the fill opening in the substrate is the same material as the bond coat repair filler filling the fill opening in the bond coat. [Embodiment 18] 1. A method for analyzing layer thicknesses of a multi-layer component, comprising: drilling to form openings having a predetermined geometric shape partially within the multilayer component at selected locations on a surface of the multilayer component, the multilayer component including a plurality of material layers including a substrate and a bond coat over the substrate, the openings exposing each of the plurality of material layers; increasing the contrast of the layers of material exposed only in the openings from the contrast that exists after the openings are created by polishing the exposed layers of material and etching the exposed layers of material; creating an image of the exposed layers of material within the opening using a digital microscope; calculating a bond coat thickness from the image based on a predetermined geometry of the opening; repairing the opening, thereby allowing the multi-layer component to be used for its intended purpose; A method comprising: [Embodiment 19] 10. The method of any of the preceding clauses, wherein the method is performed at a geographic location at the site of use of the multi-layer component. [Embodiment 20] 10. The method of claim 1, wherein prior to the drilling step, the multilayer component further comprises a thermal barrier coating (TBC) layer over the oxide layer, and further comprising removing the TBC layer prior to the drilling step, and wherein repairing comprises repairing the TBC layer. [Embodiment 21] 1. A system for analyzing layer thicknesses of a multi-layer component, comprising: an opening forming device configured to form an opening having a predetermined partial geometric shape in the multilayer component at a selected location on a surface of the multilayer component, the multilayer component including multiple material layers including at least a substrate and a bond coat, the opening exposing each of the multiple material layers; an imaging device configured to create an image of the exposed plurality of material layers within the opening; Equipped with The system is configured to calculate from the image at least a thickness of a bond coat of the exposed plurality of material layers based on a predetermined geometry of the opening. [Embodiment 22] The system of any preceding clause, wherein the plurality of material layers further includes a barrier layer extending over the bond coat, the system further configured to determine a thickness of the barrier layer. [Embodiment 23] The system of any of the preceding clauses, wherein the system is further configured to determine a life expectancy of the bond coat based on at least one of a barrier layer thickness and a bond coat thickness. [Embodiment 24] 10. The system of any preceding clause, further comprising a contrast enhancing device configured to increase the contrast of the plurality of exposed material layers within the opening. [Embodiment 25] The system of any of the preceding clauses, wherein the contrast enhancing device is selected from the group consisting of a polisher, a felt containing diamond paste, an etching solution, an electrochemical etching solution, and combinations thereof. [Embodiment 26] 10. The system of any preceding clause, further comprising a TBC layer removal device. [Embodiment 27] The system of any of the preceding clauses, wherein the TBC layer removal device is a grit or sandblaster. [Embodiment 28] The system of any of the preceding clauses, wherein the opening forming device is selected from the group consisting of a drilling device, a carrot grinding device, a material removal tool, a milling tool, and combinations thereof. [Embodiment 29] 10. The system of any of the preceding clauses, wherein the imaging device is a microscope. [Embodiment 30] The system of any preceding clause, wherein the imaging device is handheld and portable. [Embodiment 31] 1. A system for restoring layer thickness of a multi-layer component, comprising: an opening forming device configured to form an opening having a predetermined partial geometric shape in the multilayer component at a selected location on a surface of the multilayer component, the multilayer component including multiple material layers including at least a substrate and a bond coat, the opening exposing each of the multiple material layers; an imaging device configured to create an image of the exposed plurality of material layers within the opening; a repair device for repairing the opening; Equipped with The system is configured to calculate, from the image, at least a thickness of a bond coat of the exposed plurality of material layers based on a predetermined geometry of the opening prior to repairing the opening. [Embodiment 32] 10. The system of any preceding clause, further comprising a contrast enhancing device configured to increase the contrast of the plurality of exposed material layers within the opening. [Embodiment 33] The system of any of the preceding clauses, wherein the contrast enhancing device is selected from the group consisting of a polisher, a felt containing diamond paste, an etching solution, an electrochemical etching solution, and combinations thereof. [Embodiment 34] The system of any preceding clause, wherein the repair device is a handheld device. [Embodiment 35] 10. The system of any preceding clause, wherein the repair device is configured for high velocity oxygen fuel (HVOF) application, low pressure plasma spray (LPPS), and / or atmospheric plasma spray (APS). [Embodiment 36] 10. The system of any of the preceding clauses, wherein the repair device is selected from the group consisting of a laser wire welding device, a tungsten inert gas (TIG) welding device, a thermal spray process device, an atmospheric plasma spray (APS) device, a flame spray device, a slurry coating device, and combinations thereof. [Embodiment 37] The system of any preceding clause, wherein the repair device is configured to receive a multi-layer component removed from a use setting. [Embodiment 38] 10. The system of any of the preceding clauses, wherein the setting of use is inside a turbine. [Embodiment 39] The system of any preceding clause, wherein the multilayer component is used in an airfoil. [Embodiment 40] The system of any preceding clause, wherein the multi-layer component is used in a turbine blade. [Embodiment 41] 1. An automated system for analyzing layer thicknesses of a multi-layer component, comprising: A manipulator, an aperture forming device configured to form apertures having a predetermined partial geometric shape in the multilayer component at selected locations on a surface of the multilayer component, the multilayer component comprising multiple material layers including at least a substrate and a bond coat, the apertures exposing each of the multiple material layers; an imaging device configured to create an image of the plurality of exposed material layers within the opening; and a manipulator coupled to the imaging device; a processor configured to calculate from the image at least a thickness of a bond coat of the exposed plurality of material layers based on a predetermined geometry of the opening; An automation system comprising: [Embodiment 42] 10. The automated system of claim 1, wherein the plurality of material layers further includes a barrier layer extending over the bond coat, and the processor is further configured to determine a thickness of the barrier layer. [Embodiment 43] The automated system of any of the preceding clauses, wherein the processor is further configured to determine a life expectancy of the bond coat based on at least one of a barrier layer thickness and a bond coat thickness. [Embodiment 44] An automated system according to any of the preceding clauses, wherein at least one of the opening forming device and the imaging device is coupled to the manipulator in the form of an attachment attached to the manipulator. [Embodiment 45] An automated system according to any of the preceding clauses, wherein at least one of the opening forming device and the imaging device is coupled to the manipulator in the form of a tool separate from the manipulator. [Embodiment 46] The automated system of any of the preceding clauses, wherein the manipulator is further coupled to at least one of a contrast increasing device configured to increase the contrast of the exposed material layers within the opening, a repair device configured to repair the opening, and a TBC layer removal device. [Embodiment 47] The automated system of any of the preceding clauses, wherein at least one of the contrast enhancing device, the repair device, and the TBC layer removal device is coupled to the manipulator in the form of an attachment attached to the manipulator. [Embodiment 48] The automated system of any of the preceding clauses, wherein at least one of the contrast enhancing device, the repair device, and the TBC layer removal device is coupled to the manipulator in the form of a tool separate from the manipulator. [Embodiment 49] The automated system of any of the preceding clauses, further comprising a controller and / or a power supply. [Embodiment 50] The automated system of any of the preceding clauses, wherein the manipulator is configured to receive a multi-layer component removed from a use setting. [Embodiment 51] 10. The automation system of any of the preceding clauses, wherein the setting of use is inside a turbine. [Embodiment 52] The automation system of any preceding clause, wherein the multi-layer component is used in an airfoil. [Embodiment 53] The automation system of any of the preceding clauses, wherein the multi-layer component is used in a turbine blade. [Embodiment 54] 1. A method for analyzing layer thicknesses of a multi-layer component using an automated system comprising a manipulator and a processor, the method comprising: receiving a multi-layer component at a manipulator of an automation system; creating an opening with an opening forming device coupled to the manipulator, the opening having a predetermined geometric shape partially within the multilayer component at a selected location on a surface of the multilayer component, the multilayer component including multiple material layers including at least a substrate and a bond coat, the opening exposing each of the multiple material layers; creating images of the exposed layers of material within the openings using an imaging device coupled to the manipulator; calculating, from the image using a processor of the automation system, at least a thickness of the bond coat of the exposed plurality of material layers based on the predetermined geometry of the opening; A method comprising: [Embodiment 55] The method of any of the preceding clauses, wherein the plurality of material layers further includes a barrier layer extending over the bond coat, and the method further includes determining a thickness of the barrier layer. [Embodiment 56] The method of any of the preceding clauses, further comprising determining a life expectancy of the bond coat based on at least one of a barrier layer thickness and a bond coat thickness. [Embodiment 57] 1. A method for repairing a multi-layer component using an automated system comprising a manipulator and a processor, the method comprising: receiving a multi-layer component at a manipulator of an automation system; creating an opening with an opening forming device coupled to the manipulator, the opening having a predetermined geometric shape partially within the multilayer component at a selected location on a surface of the multilayer component, the multilayer component including multiple material layers including at least a substrate and a bond coat, the opening exposing each of the multiple material layers; creating images of the exposed layers of material within the openings using an imaging device coupled to the manipulator; calculating, from the image using a processor of the automation system, at least a thickness of the bond coat of the exposed plurality of material layers based on the predetermined geometry of the opening; repairing the opening with a repair device coupled to a manipulator of the automation system; A method comprising: [Embodiment 58] The method of any of the preceding clauses, wherein the plurality of material layers further includes a barrier layer extending over the bond coat, and the method further includes determining a thickness of the barrier layer. [Embodiment 59] The method of any of the preceding clauses, further comprising determining a life expectancy of the bond coat based on at least one of a barrier layer thickness and a bond coat thickness. [Embodiment 60] 10. The method of any of the preceding clauses, wherein prior to the step of forming the opening, the multilayer component further includes a thermal barrier coating (TBC) layer extending over the oxide layer, the method further including removing the TBC layer prior to the step of forming the opening, and wherein the repairing step includes repairing the TBC layer. [Explanation of symbols]
[0058] 100 multilayer components 104 Material layer 104 Base material 104 layers 104 PCB 106 Protective layer 106 Material layer 110 Bond Coat 110 Material layer 110 layers 112 layers 112 Top Coat 114 layers 114 TBC layer 116 Thermally grown oxide layer 116 Oxide layer 118 Material layer 118 layers 118 Depletion Layer 120 opening 122 holes 124 Spherical Segment Opening 140 Felt 142 Diamond Paste 150 Digital Microscope 152 images 154 Surface 160 Board part 164 Restorative Fillings 164 Substrate Repair Filler 168 Bond coat part 170 First Outer Surface 170 Exterior 172 Filling opening 174 Bond Coat Repair Filler 176 Plug 176 TBC plug 176 Second Exterior 176 Exterior 200 Automation Systems 202 processors 204 Controller 206 Power supply 208 Manipulator 210 Attachment 212 Attachment 300 multi-layer component parts 400 Tools 500 automation methods 502 steps 504 steps 506 steps 508 steps 600 Automation methods 602 steps 604 steps 606 steps 608 steps 610 steps 700 Automation methods 702 Loading 704 hole 706 use 708 use 708 records 718 Presentation
Claims
1. An automated system (200) for analyzing layer thicknesses of a multi-layer component (100), comprising: A manipulator (208), an aperture forming device configured to form an aperture (120) having a predetermined partial geometric shape in the multilayer component (100) at a selected location on a surface of the multilayer component (100), the multilayer component (100) including multiple material layers including at least a substrate (104) and a bond coat (110), the aperture (120) exposing each of the multiple material layers; an imaging device configured to create an image of the exposed material layers within the opening; and a manipulator coupled to the imaging device. a processor (202) configured to calculate, from the image, at least a thickness of the bond coat (110) of the exposed plurality of material layers based on the predetermined geometric shape of the opening (120); An automated system (200) comprising:
2. 2. The automated system of claim 1, wherein the plurality of material layers further comprises a barrier layer extending over the bond coat, and the processor is further configured to determine a thickness of the barrier layer.
3. 3. The automation system of claim 2, wherein the processor is further configured to determine a life expectancy of the bond coat based on at least one of the thickness of the depletion layer and the thickness of the bond coat.
4. 2. The automated system (200) of claim 1, wherein at least one of the opening forming device and the imaging device is coupled to the manipulator (208) in the form of an attachment (210, 212) attached to the manipulator (208).
5. 2. The automated system (200) of claim 1, wherein at least one of the opening forming device and the imaging device is coupled to the manipulator (208) in the form of a tool (400) separate from the manipulator (208).
6. 2. The automation system of claim 1, wherein the manipulator is further coupled to at least one of a contrast enhancing device configured to increase the contrast of the exposed material layers within the opening, a repair device configured to repair the opening, and a TBC layer removal device.
7. 7. The automated system (200) of claim 6, wherein at least one of the contrast increasing device, the repair device, and the TBC layer removal device is coupled to the manipulator (208) in the form of an attachment (210, 212) attached to the manipulator (208).
8. 7. The automated system (200) of claim 6, wherein at least one of the contrast increasing device, the repair device, and the TBC layer removal device is coupled to the manipulator (208) in the form of a tool (400) separate from the manipulator (208).
9. The automation system (200) of claim 1, further comprising a controller (204) and / or a power source (206).
10. The automated system (200) of claim 1, wherein the manipulator (208) is configured to receive a multi-layer component (100) removed from a use setting.
11. The automation system (200) of claim 10, wherein the setting of use is inside a turbine.
12. The automation system (200) of claim 10, wherein the multi-layer component (100) is used in an airfoil.
13. The automation system (200) of claim 10, wherein the multi-layer component (100) is used in a turbine blade.
14. A method for analyzing layer thicknesses of a multi-layer component (100) using an automated system (200) comprising a manipulator (208) and a processor (202), comprising: receiving the multi-layer component (100) at the manipulator (208) of the automation system (200); creating an opening (120) using an opening forming device coupled to the manipulator (208), the opening (120) having a predetermined geometric shape partially within the multilayer component (100) at a selected location on a surface of the multilayer component (100), the multilayer component (100) including multiple material layers including at least a substrate (104) and a bond coat (110), the opening (120) exposing each of the multiple material layers; creating an image of the exposed layers of material within the opening (120) using an imaging device coupled to the manipulator (208); calculating, from the image using the processor (202) of the automated system (200), at least thicknesses of the bond coat (110) of the exposed layers of material based on the predetermined geometric shape of the opening (120); A method comprising:
15. The method of claim 14 , wherein the plurality of material layers further comprises a barrier layer extending over the bond coat (110), the method further comprising determining a thickness of the barrier layer.
16. The method of claim 15, further comprising determining a life expectancy of the bond coat (110) based on at least one of the thickness of the barrier layer and the thickness of the bond coat (110).
17. A method for repairing a multi-layer component (100) using an automated system (200) comprising a manipulator (208) and a processor (202), comprising: receiving the multi-layer component (100) at the manipulator (208) of the automation system (200); creating an opening (120) using an opening forming device coupled to the manipulator (208), the opening (120) having a predetermined geometric shape partially within the multilayer component (100) at a selected location on a surface of the multilayer component (100), the multilayer component (100) including multiple material layers including at least a substrate (104) and a bond coat (110), the opening (120) exposing each of the multiple material layers; creating an image of the exposed layers of material within the opening (120) using an imaging device coupled to the manipulator (208); calculating, from the image using the processor (202) of the automated system (200), at least thicknesses of the bond coat (110) of the exposed layers of material based on the predetermined geometric shape of the opening (120); repairing the opening (120) using the repair device coupled to the manipulator (208) of the automation system (200); A method comprising:
18. The method of claim 17 , wherein the plurality of material layers further includes a barrier layer extending over the bond coat (110), the method further comprising determining a thickness of the barrier layer.
19. The method of claim 18, further comprising determining a life expectancy of the bond coat (110) based on at least one of the thickness of the barrier layer and the thickness of the bond coat (110).
20. 18. The method of claim 17, wherein the multilayer component (100) further includes a thermal barrier coating (TBC) layer extending over the oxide layer prior to forming the opening (120), the method further includes removing the TBC layer prior to forming the opening (120), and the repairing step includes repairing the TBC layer.
Citation Information
Patent Citations
Non-invasive quantitative multilayer assessment method and resulting multilayer component
US20230038239A1