Method and apparatus for imaging a beam onto an object and method for machining an aperture in a workpiece using this method

Abstract

The present invention relates to a method for imaging at least one beam (1) onto an object (2), comprising redirecting the beam (1) over its optical path (3) through an optical assembly (4) at least twice using at least two optical scanners (6) to change the optical path (3) of the beam (1), and further imaging the beam (1) after the redirection onto the object (2) using imaging optics (7), wherein imaging using the imaging optics (7) places a focal region (8) of the beam (1) on and / or within the object. A scanner (6) is used to cause a pivoting movement of at least one beam section of the beam (1), during which a pivot point (10) of the beam section (9) is located in the optical path (3) upstream of or within the imaging optics (7), and the pivoting and / or at least one rotational movement (15) about the pivot point (10) causes a movement of the focal region (8) in at least one direction (X) perpendicular to the optical axis of the imaging optics (7).The invention further relates to a method for machining an aperture in an object (2) made of a transparent material as a workpiece (11) by the above-mentioned method, and to an apparatus for imaging the beam on the object (2).

Description

[Technical Field]

[0001] The present invention relates to a method and apparatus for imaging at least one beam onto an object, wherein the beam is redirected using at least two optical scanners to change the optical path of the beam at least twice over its optical path through an optical assembly, and the beam is further imaged onto the object after redirection using imaging optics, and imaging using the imaging optics places the focal region of the beam on and / or within the object.

[0002] The invention further relates to a method for machining at least one opening in an object made of a transparent material as a workpiece using the method described above. [Background technology]

[0003] Due to its optical, electrical, chemical, and mechanical properties, glass is highly suitable for replacing, for example, silicon not only as a carrier but also as a volume material that can be directly structured at a relatively low cost, thereby offering a wide range of application possibilities. This wide range of application possibilities extends, for example, from microelectronics or nanoelectronics, through applications in the fields of microelectromechanical systems (MEMS) and microfluidics, to use in packaging systems. However, an important prerequisite for these application possibilities is the availability of glass processing methods that allow for the micromachining of glass, preferably with a high degree of freedom in the structure, which allows for the formation of precise structures with extremely small dimensions in glass, thus resulting in short processing times.

[0004] Basically, various glass processing methods are already known from the prior art, and in particular, cutting and grinding methods, etching methods, or laser ablation methods are used to process glass. However, these methods have a disadvantage in that they have a low degree of freedom in shaping, which in some cases results in a long processing time. The above-mentioned methods may also introduce undesirable defects into the glass, such as chipping, microcracks, or thermally induced stresses.

[0005] A method known from the prior art that does not have these drawbacks is to micromachine glass using laser-induced deep etching. This method has come to be known as LIDE (Laser Induced Deep Etching). The LIDE method allows for the machining of extremely precise structures in extremely short machining times, thus fulfilling the prerequisites for increasing the use of glass as a material in the applications mentioned at the beginning.

[0006] The LIDE method contrasts with the method known as selective laser-induced etching, also known as ISLE (In-volume Selective Laser-induced Etching). ISLE is suitable for forming structures made of and within transparent materials. To do this, a laser beam is focused approximately to a point inside a transparent material, such as glass, causing structural and / or chemical changes in a small volume of only a few cubic micrometers. The changed volume can then be etched at an etching rate several orders of magnitude higher than the unaltered material. Due to the small changed volume that exists due to the point-like focusing of the laser beam, a very high number of pulse sequences is required for structuring. However, this high number of pulse sequences also results in long processing times.

[0007] In contrast, in laser-induced deep etching, which is known, for example, from WO 2014 / 161534 and WO 2016 / 041544, a transparent material, correspondingly in particular glass, is modified over an elongated area along the beam axis using a laser pulse or pulse sequence, so that the modified area is again anisotropically etched in a subsequent wet-chemical etching bath. This modification often takes place over the entire thickness of the transparent material, for example over the entire thickness of a glass plate.

[0008] WO 2021 / 239302 also discloses a similar method for forming cutouts, such as blind holes, in transparent materials using laser-induced deep etching, in which the material is modified over the entire elongated area of ​​the cutout to be formed. The modification is achieved by the fact that the focal area of ​​the laser beam has a spatial extension in the beam direction, and thus a beam-shaping shape, rather than a point-like configuration. This spatial extension or extension of the focal area of ​​the laser beam in the beam direction allows a sufficiently high intensity to be input into the transparent material over the length of a certain area in order to modify this area.

[0009] The above-mentioned configuration of laser-induced deep etching, particularly WO 2021 / 239302, further describes that the modification of multiple areas aligned parallel to one another partially overlaps, thereby enabling, for example, larger planar structures to be formed in a transparent material. For this purpose, a laser head emitting a laser beam that causes the modification is typically moved along at least one linear axis, and during this movement, at least one laser pulse is emitted toward the area to be modified. Although laser-induced deep etching can already provide short processing times, this configuration undesirably limits the achievable short processing times because the acceleration and speed in the linear axis are relatively limited due to the high mass.

[0010] However, in this connection it is already known from the prior art that the laser beam can be deflected using an optical scanner system, for example using at least one galvanometer scanner, thereby increasing the area that can be traced by the laser beam in a short period of time.

[0011] However, using a scanner system to redirect a laser beam having such a beam shape is problematic, especially in combination with standard optics that are typically used to image the laser beam onto a material, because it causes a disturbance in the beam shape of the laser beam and therefore does not guarantee an extended focal region.

[0012] However, solutions have already been proposed in the prior art to circumvent this problem.

[0013] Thus, US Patent Application Publication No. 2014 / 0008549 discloses a method and apparatus for creating a volumetric image of a sample with an extended depth of field by laser scanning imaging. For this purpose, a laser beam having an extended focal region in the region of the image to be cut is used, and the laser beam is deflected in a plane, i.e., in two spatial directions, via two scanner mirrors. To provide the extended focal region at the sample, a non-diffracting, approximation-Bessel beam is first generated from a laser beam emitted by a laser source by an axicon. Before each deflection using one of the two scanner mirrors, the non-diffracting, approximation-Bessel beam is converted via a condenser lens into a ring beam with a focal point located on the scanner mirror, thereby avoiding distortion of the laser beam during deflection. After each deflection, the beam is again deflected back into a non-diffracting beam via an achromatic lens. This beam is then converged again by a condenser lens to form a ring beam, thereby providing a beam with an extended focal region that accommodates the sample. In this case, the focal point is located on the back focal plane of an objective lens that images the beam onto the sample. Using the imaging objective lens, the beam is repeatedly transformed into a non-diffracting, approximately Bessel beam with an extended focal region at the sample. However, the complex optical structure selected in this case unfortunately causes a superposition of imaging defects caused by the multiple optical elements on the beam. Furthermore, the structure selected for the microscope system is sometimes largely unsuitable for established applications in the field of laser processing due to the optical elements required.

[0014] WO 2010 / 069987 also discloses a method and device for dynamically moving a light beam relative to a focusing optical system within a confocal microscope. To scan an object with the focused light beam in a two-dimensional scanning region, the light beam is deflected in two different directions relative to the optical axis of the optical system, each deflection being achieved via two independently moving deflection mirrors. The position of the pivot point of the light beam deflected via the deflection mirrors forming the mirror deflection system is adjustable along the length of the optical axis. It is provided that the pivot point of the light beam is fixed at the location of the image of the pupil of the focusing optical system, which is connected to the mirror deflection system. For this purpose, the deflection mirrors are arranged around this location of the image. The pivot points of the beam sections of the light beam emerging from the mirror deflection system are correspondingly located within the mirror deflection system.

[0015] Furthermore, German Patent Application No. 10 2020131405 A1 discloses an apparatus for processing materials, in particular an apparatus for producing perforations, lines, freeform contours, etc., using a laser beam source. In addition to the laser beam source, the apparatus comprises a mirror deflection system for deflecting the laser beam and a focusing lens. The mirror deflection system deflects the laser beam into two different spatial directions relative to the optical axis, each deflection into one direction being achieved by a respective deflection mirror. For this purpose, the two deflection mirrors are configured to be movable independently of each other, and their rotation axes are aligned perpendicular to each other. The pivot point of the beam section of the laser beam emerging from the mirror deflection system is therefore located on the rear deflection mirror in the optical path. Furthermore, a diffractive optical element (DOE) is arranged in the optical path of the laser beam between the mirror deflection system and the focusing lens, which splits the optical path into two or more optical paths, thereby making it possible to create a pattern of processing points on the material to be processed and / or to position one or more processing points on the material. By positioning the "DOE" in the optical path of the laser downstream of the mirror deflection system and upstream of the focusing lens, due to the resulting short beam length, the beam spacing of the individual beam bundles relative to one another can be reduced so that even when deflecting the primary laser beam, all individual beam bundles of the laser beam multiplied by the "DOE" can still be deflected towards the focusing lens and thereby correspondingly focused within the area that the laser beam can trace, which is made possible by the mirror deflection system.

[0016] Similarly, EP 3106943 describes an apparatus for processing materials with a laser beam, which includes a mirror deflection system for deflecting the laser beam. The mirror deflection system is also configured so that deflection of the laser beam in two different spatial directions relative to the optical axis is achieved via the mirror deflection system. Each deflection in one direction is achieved via a respective deflection mirror, which are configured to be movable independently of each other, with their axes of rotation positioned perpendicular to each other. Thus, the pivot point of the beam section of the laser beam emerging from the mirror deflection system is again located on the rear deflection mirror in the optical path. In this case, due to the non-Cardan arrangement of the deflection mirrors, the apparatus provides a control module for integrating the mirror deflection system into the trajectory control system of the machine tool. The control module converts the target data of the two virtual Cardan pivot axes transferred from the trajectory control system into the first and second actual target axis pivot angles of the deflection mirrors.

[0017] WO 2014 / 161534 further discloses a method and apparatus for forming multiple notches in a substrate, particularly one that can be used as an interposer. This method involves positioning a laser beam toward the surface of the substrate, with the duration of the laser beam being intentionally kept very short. This results in the substrate being modified exclusively in a concentric pattern centered on the beam axis of the laser beam. However, the laser beam does not create notches in the substrate material itself. To achieve this, the laser beam is first deflected by a transparent medium having an intensity-dependent refractive index higher than that of air. The laser beam then strikes the substrate. The intensity of the laser beam is varied during each pulse. The intensity rises to a maximum value and then decreases again. This change in intensity also leads to a change in the refractive index of the medium. Due to this change in refractive index, the focal point of the laser beam also moves along the beam axis between the outer surfaces of the substrate. This allows the desired modification along the beam axis to be achieved without the need to reposition the laser processing head along the Z axis. The modification of the substrate thus induced can then be etched in hydrofluoric acid at a significantly higher etch rate than the unmodified areas. [Prior art documents] [Patent documents]

[0018] [Patent Document 1] International Publication No. 2014 / 161534 [Patent Document 2] International Publication No. 2016 / 041544 [Patent Document 3] International Publication No. 2021 / 239302 [Patent Document 4] US Patent Application Publication No. 2014 / 0008549 [Patent Document 5] International Publication No. 2010 / 069987 [Patent Document 6] German Patent Application Publication No. 102020131405 [Patent Document 7] European Patent No. 3106943 Summary of the Invention [Problem to be solved by the invention]

[0019] Against this background, the problem underlying the present invention is to improve methods and devices of the type mentioned at the outset so that they have an even simpler optical structure adapted for use in laser processing applications. [Means for solving the problem]

[0020] This problem is solved according to the invention by a method having the features of claims 1 and 2 and by a device having the features of claim 12.

[0021] Further configurations of the invention can be found in the dependent claims.

[0022] According to the invention, a method is provided for imaging at least one beam of electromagnetic light, in particular a laser beam of laser light, onto an object, such a beam, in particular a pulsed beam, preferably firstly emitted by a beam source, in particular a laser source, of an optical assembly.

[0023] In this case, the emitted beam is deflected over its optical path through the optical assembly by means of an optical scanner system of the optical assembly to change the optical path or propagation direction of the beam, the scanner system having at least two optical scanners via which the beam is deflected at least twice through predetermined and / or configurable variable angles.

[0024] In this case, the beam or ray is not further refracted before and / or during each deflection. Therefore, the beam does not pass through another optical element that specifically deflects the beam, such as a focusing lens, at least during each deflection, which significantly simplifies the optical structure and avoids undesirable aberrations. However, any disturbances in the beam shape that may be caused by this deflection of the beam must be corrected.

[0025] Thus, according to the present invention, after the deflection, the beam is imaged onto an object using an imaging optics, whereby the focal region of the beam is located on and / or within the object by imaging using the imaging optics. The present invention further provides that a scanner system is used to cause at least one pivoting movement of a beam section of the beam emerging from the scanner system, with the pivot or rotation point of the beam section being located upstream of or within the imaging optics in the optical path. The pivoting and / or at least rotation about the pivot point causes a movement of the focal region in at least one spatial direction perpendicular to the optical axis of the imaging optics. By having the pivot point of the beam section located upstream of and / or within the imaging optics, undesirable aberrations imparted to the beam by the deflection are advantageously avoided. This is achieved, in particular, without the need for special imaging optics for avoiding such undesirable aberrations. Instead, standard optics commonly used for imaging beams onto an object can be used as the imaging optics.

[0026] The present invention further provides a method for machining at least one opening, particularly a notch and / or a through-hole, in an object made of a transparent material, particularly glass, as a workpiece, preferably as a substrate. Using the above-described method for imaging a beam, a material modification of the workpiece occurs at least in the focal region of the beam, but particularly only in the focal region of the beam. Since no material removal occurs during the modification due to the action of the beam's rays, the opening is then formed in the workpiece by anisotropic removal of material in the respective region of the modification due to the action of the etching medium. Therefore, material removal occurs exclusively due to the etching action of the etching medium, and not directly due to the action of the beam or its rays. Although the etching rate of one or more modified portions is several orders of magnitude higher than that of the unmodified material, the workpiece may additionally be provided with a mask, particularly an etching mask, preferably consisting of a structured photoresist, which exposes the regions to be etched.

[0027] Each modification is preferably formed by at least one pulse of the beam, and the beam or the beam's focal area is moved across the workpiece by deflection between pulses of the beam, for example, to form multiple modifications located at different positions on the workpiece. This allows for the formation of non-connected, connected, or overlapping modifications on the workpiece, which are removed during subsequent application of the etching medium to form at least one opening in the workpiece. Thus, by forming multiple connected modifications, a structure consisting of a corresponding number of individual openings can be formed in the workpiece with a high degree of freedom of shape.

[0028] Furthermore, the movement of the focal region by deflection via an optical scanner, which is utilized to create multiple modifications, allows for significant reductions in processing time with a high degree of geometric freedom, especially compared to the standard LIDE method.

[0029] The area that can be covered in each spatial direction by the deflection of the beam and thus by the movement of the focal region, and therefore also by the production of multiple modifications without the superposition of further movements, can be, for example, up to plus or minus 10 millimeters around the central axis or center point, which results in extremely small positional errors of the focal region and therefore modifications of less than 10 micrometers.

[0030] In a particularly advantageous refinement of the invention, the rotational movement of each beam section—exclusively—about the rotation axis of the pivot point, and thus the linear movement of each focal region—in only one spatial direction, is performed by two rotational movements of two optical scanners about two parallel rotation axes, which cooperate to deflect the optical path of the beam. The two scanners form a scanner pair. By using two scanners with parallel rotation axes to move the focal region of the beam in only one spatial direction, undesirable aberrations of the beam, particularly of the focal region, which may occur when using only one scanner, can be advantageously and simply minimized or even avoided.

[0031] A further advantageous embodiment of the present invention involves superimposing two rotational movements of the beam section about pivot points, particularly about rotation axes perpendicular to each other, to linearly move the focal region in two spatial directions. Thus, the focal region of the beam, or the beam impinging on the object or workpiece, is not only moved along one line but also in two dimensions on one surface. To achieve the two rotational movements of the beam section about the pivot point, the beam is deflected through two rotational axes per rotational movement, i.e., through a total of four rotational axes included in two groups of two, where the rotational axes of the two groups are aligned perpendicular to each other. The rotational axes are correspondingly provided by optical scanners, and thus one group of two rotational axes is formed via one scanner pair.

[0032] A further advantageous embodiment of the invention provides that the two rotational movements of a scanner pair, which cause a pivotal movement of the beam section about—exclusively—one pivot axis of the pivot point and thereby jointly deflect the beam path, are performed asynchronously. This asynchronous movement can advantageously cause a pivotal movement of the beam about at least one scanner of the scanner pair, in this case especially about a second or rear scanner of the scanner pair in the beam path. It is desirable that at least one of the variables of the scanners, especially the deflection elements of the scanners, i.e., absolute angle, angular velocity, and / or angular acceleration, differ from one another.

[0033] Furthermore, it should be noted that the beam formed within the framework of at least one method may generally have a Gaussian focus at the object or workpiece and / or in the focal region of the beam within the object or workpiece. This would therefore correspond to a configuration without beam shaping of the beam and thus without an extended focal region. However, possible aberrations are nevertheless advantageously avoided.

[0034] However, a preferred refinement of the invention provides that the beam is subjected to beam shaping on its optical path through the optical assembly using beam-shaping optics, so that a focal field that is extended in the direction of the optical path is imaged on and / or within the object, the extended focal field extending over at least a portion of the dimension of the object that is formed in the direction of the optical path. As already mentioned at the beginning, the extended focal field significantly reduces the processing time of objects formed as workpieces compared to point focus, and therefore increases the throughput within the scope of existing LIED methods.

[0035] The beam shaping can be achieved by beam-shaping optics, which are configured, for example, as an axicon, a diffractive optical element (DOE), or a spatial light modulator, also known as a spatial light phase modulator (SLM). In this regard, the beam is configured, in particular, as an approximately Bessel beam. However, in a more preferred configuration, the beam shaping is performed by adding spherical aberration, which in turn leads to an elongated, in particular cigar-shaped, focal region of the beam. For such beam shaping, the beam-shaping element is preferably configured, in particular, as a plane-parallel quartz plate.

[0036] In another advantageous embodiment of the invention, the beam shaping is performed by means of beam shaping optics before the beam enters the optical scanner system of the assembly, thereby avoiding the occurrence of aberrations due to the shaping of a beam that has been deflected and therefore impinges on the beam shaping element at a particular angle.

[0037] Furthermore, a very practical embodiment of the present invention is based on the fact that the focal regions of the beams whose optical paths through the optical assembly are changed by the deflection are imaged by the imaging optics onto a single, particularly common, focal plane on which the respective focal regions are located or extend from this focal plane into the object. Therefore, by having the focal regions always located on or extending from the focal plane, it is possible to advantageously ensure the intensity of the beams that impinge on the object, in particular the workpiece material, in the focal regions. This allows for the formation of multiple modifications in the workpiece material in a uniform or uniform manner. For this purpose, the imaging optics is preferably configured as at least one f-theta objective lens.

[0038] In an equally advantageous embodiment, the invention further provides for the imaging of the respective focal regions by the imaging optics to be telecentric. In this case, the focal regions of the beam are always aligned parallel to the optical axis of the imaging optics, thereby always pointing in the same direction and thus producing modifications in the workpiece whose angular orientation at the workpiece does not differ. This is particularly true when the object or workpiece is aligned accordingly, perpendicular to the surface of the object or workpiece. For this purpose, the imaging optics is preferably configured as at least one telecentric f-theta objective.

[0039] Similarly, a particularly promising refinement of the invention is described by superimposing at least one additional movement, especially a linear movement, of a travel axis on the linear movement of the focal region in at least one spatial direction. Here, the travel axis is part of the device, and at least part of the optical assembly included in the device is arranged on this travel axis. The travel axis is particularly configured as a linear axis. By combining the movement of the focal region, especially by deflecting the beam via one or two scanner pairs, with at least one additional movement of the travel axis, it is possible to process workpieces having dimensions that exceed the maximum possible deflection of the beam or the resulting possible movement section of the focal region, and thus to process the workpiece, preferably over its entire length, at extremely high processing speeds and thus short processing times. Furthermore, it is possible to form multiple individualized and / or connected modifications on the workpiece, so to speak, along any trajectory curve, for example in the form of a spline. The respective possible directions of movement of the focal region and the travel axis do not need to be aligned parallel and / or perpendicular to each other. On the other hand, it is also possible to adjust the position at any angle, for example, an angle of 45 degrees.

[0040] In particular, in connection with the above-mentioned refinements, but also in general, the inventive design is considered advantageous in that it at least partially corrects and / or at least partially compensates for the additional movement of the travel axis by superimposing at least one additional linear movement of the travel axis on the linear movement of the focal region in at least one spatial direction. If the directions of movement of the focal region and the travel axis are oriented in the same direction, the movement of the focal region can be superimposed, particularly redundantly, on the movement of the travel axis, thereby increasing the positioning resolution of the modification area on the workpiece compared to the resolution provided by the travel axis itself. Furthermore, the movement of the travel axis can be completely compensated for by the movement of the focal region. This is the case, for example, when it is desired to produce multiple modification areas on the workpiece at exactly the same position in the direction of movement of the travel axis, or at the same position with a transverse offset, for example, relative to the direction of movement of the travel axis. This allows for structures that result in an extremely high degree of freedom in the forming of the workpiece to be ensured with outstanding precision.

[0041] The present invention also contemplates an apparatus with an optical assembly, particularly for implementing at least one of the methods described above. In this case, the optical assembly of the apparatus includes a beam source, particularly a laser source, emitting a beam of electromagnetic light, particularly a laser beam of laser light, and an optical scanner system. The scanner system itself is configured with at least two optical scanners, each equipped with at least one rotatable beam-diverting element. In this regard, the optical path between the scanners is configured so that no additional optically refractive elements are arranged. The optical assembly further includes at least one imaging optics, which allows the beam to be imaged onto an object, and the focal region of the beam can be located on and / or within the object by imaging using the imaging optics. According to the present invention, each pair of scanners forms a scanner pair, with the two rotation axes of the scanners in each pair aligned parallel to one another. The optical assembly includes at least one scanner pair or at least two, preferably exclusively two, scanner pairs. It should be noted that the rotation axes or groups of rotation axes of the scanners of different scanner pairs are aligned perpendicular to one another. The device according to the invention can advantageously be used to carry out at least part of the method according to the invention, with a significantly simplified optical structure of the optical assembly. Thus, the pivot point or rotation point of the beam section of the beam emerging from the scanner system can be located upstream of the imaging optics in the optical path through the scanner system or within the imaging optics, thereby avoiding undesirable aberrations and simultaneously correcting any disturbances in the beam shape that may occur during beam deflection. In addition to the optical assembly, the device also has at least one travel axis, on which at least part of the optical assembly is arranged.

[0042] In one particularly advantageous refinement of the invention, the optical assembly further comprises beam-shaping optics, which are able to subject the beam to beam shaping. As already mentioned above, the beam-shaping optics is configured, for example, as an axicon, a diffractive optical element (DOE), as a spatial light modulator, also known as a spatial light phase modulator (SLM), or in particular as a plane-parallel quartz plate, and / or is preferably arranged downstream of the beam source and upstream of the optical scanner system.

[0043] The present invention is susceptible to a variety of different embodiments, some of which are shown in the drawings and described below in order to make the underlying principles of these embodiments more clear. [Brief explanation of the drawings]

[0044] [Figure 1] FIG. 1 shows an improved version of the device according to the invention. [Figure 2a] FIG. 1 illustrates an improved version of the method according to the invention. [Figure 2b] FIG. 2 is another diagram illustrating an improved method according to the invention. [Figure 3a] FIG. 10 is yet another diagram illustrating an improved method according to the invention. [Figure 3b] FIG. 10 is yet another diagram illustrating an improved method according to the invention. DETAILED DESCRIPTION OF THE INVENTION

[0045] FIG. 1 shows one variant of the optical assembly 4, which in this case comprises a beam source 19 emitting a beam 1, beam shaping optics 16, a scanner system 5 having two optical scanners 6 each equipped with a rotatable redirecting element for redirecting the beam 1, in this variant one mirror, and imaging optics 7.

[0046] After the beam 1 leaves the beam source 19 , the beam 1 is subjected to beam shaping using beam shaping optics 16 that follows the beam source 19 in the optical path 3 .

[0047] The beam 1 is then deflected twice by a predetermined variable angle by an optical scanner system 5, which follows the beam shaping optics 16 in the optical path 3, so as to change the optical path 3 of the beam 1 each time, so that the beam 1 can be imaged at different positions on the workpiece 11 and in so doing cause a modification of the material of the workpiece 11 in the focal region 8 of the beam 1. In the variant shown in FIG. 1, the focal region 8 of the beam 1 is located within the workpiece 11. The deflection of the beam 1 takes place via two scanners 6 of the scanner system 5.

[0048] In order to avoid disturbance of the beam shaping imparted to the beam 1 via the beam shaping optics 16, a pivoting movement of the beam section 9 of the beam 1 emerging from the scanner system 5 is caused by the scanner system 5, and in particular by the scanner 6 that follows the first scanner 6 in the optical path 3 and is arranged upstream of the imaging optics 7. During this pivoting movement, a rotation or pivot point 10 of this beam section 9 is located in the optical path 3 within the imaging optics 7. This therefore results in a pivoting movement 15 of the beam 1 about the pivot point 10. In this refinement, this also causes a movement of the focal region 8 in the spatial direction X perpendicular to the optical axis of the imaging optics 7.

[0049] In this connection, it is briefly pointed out that FIG. 1 shows the beam profile of the beam 1 in a highly simplified manner, and only one optical path 3 of the beam 1 is illustrated.

[0050] A feature of the deflection of the beam 1 via the scanner system 5, briefly outlined above, is that the rotational movement 15 of the beam section 9 about the rotation axis 12 of the pivot point 10, and thus also the linear movement of the focal region 8 in the spatial direction X, is achieved by means of two rotational movements 13 of the scanners 6 about two parallel rotational axes 14, which cooperate to deflect the optical path 3 of the beam 1. The two scanners 6 form a scanner pair, the rotational movements 13 of the two scanners 6 of which are performed asynchronously.

[0051] By performing beam shaping and imaging the beam 1 having the beam-shaped shape via the imaging optics 7, a focal region 8 is imaged at or in the workpiece 11, which focal region 8 is extended in the direction of the optical path 3 and which in this refinement extends over the entire dimension of the workpiece 11 formed in the direction of the optical path 3, in this refinement over the thickness of the workpiece 11. The extended focal region 8 therefore causes a modification 20 of the material of the workpiece 11 over the entire thickness thereof, whereby an opening, here a through-hole, in the workpiece 11 is formed by an etching step following this modification 20.

[0052] In order to ensure that the intensity of the beam 1 acting on the material of the workpiece 11 in the focal region 8 remains substantially constant when multiple modifications 20 are to be produced at different positions within the workpiece 11, the focal regions 8 that form each one of the modification portions 20 of the beam 1 that is deflected for positioning and thus changes the optical path 3 are telecentrically imaged by the imaging optical system 7 onto only one focal plane 17, from which each focal region 8 extends into the workpiece 1.

[0053] 2a and 2b as well as 3a and 3b further reveal several refinements of the method according to the invention. These figures show that the movement of the focal region 8 in the spatial directions X and Y is superimposed with an additional movement of the travel axis 18 in a movement direction Y' which coincides with the spatial direction Y. Furthermore, in the focal region 8, several modifications 20 are produced in the workpiece 11 shown in detail in FIG. 1, which modifications 20 are formed individually as shown in FIGS. 2a and 3a or as shown in FIGS. 2b and 3b.

[0054] 2a and 2b, the focal region 8, and thus the modified area 20, can in this variant follow any trajectory curve, in the form of a spline, so that, depending on the pulse sequence of the beam 1 shown in Fig. 1, either individual openings are formed, as shown in Fig. 2a, or overlapping cutting of multiple openings occurs in the workpiece 11, as shown in Fig. 2b. For this purpose, in the variant shown in Fig. 2a and 2b, the movement of the focal region 8 exclusively in the spatial direction X is superimposed with a movement of the travel axis 18 in the movement direction Y', where the spatial direction X and the movement direction Y' are perpendicular to each other.

[0055] By superimposing an additional movement of the travel axis 18 in the movement direction Y' on the movement of the focal region 8 in the spatial directions X and Y, the additional movement of the travel axis 18 can further be at least partially corrected and / or at least partially compensated.

[0056] Thus, as shown in Figure 3a, the movement of the focal region 8 can be superimposed on the movement of the travel axis 18, particularly redundantly, thus increasing the positioning resolution of the modified portion 20, for example at the workpiece 11, compared to the resolution provided by the travel axis 18 itself.

[0057] Furthermore, the movement of the travel axis 18 can also be completely compensated for by the movement of the focal region 8. This is especially the case when, as shown in FIG. 3b, multiple modifications 20 are formed on the workpiece 11 at the same position in the direction of movement Y' of the travel axis 18, but with a displacement in the spatial direction X transverse to the direction of movement Y'. [Explanation of symbols]

[0058] 1 beam 2. Object 3 light path 4 Optical Assembly 5 Scanner System 6. Scanner 7 Imaging optical system 8 focal areas 9 Beam Sections 10 Pivot Points 11 Work 12 Rotation axis 13 Rotational Motion 14 Rotation axis 15 Rotational Movement 16 Beam shaping optics 17 Focal plane 18 Traveling axis 19 Beam Source 20 Modified part X,Y spatial direction Y' motion direction

Claims

1. 1. A method for imaging at least one beam (1) of electromagnetic light rays onto an object (2), comprising: deflecting the beam (1) over its optical path (3) through an optical assembly (4) by means of an optical scanner system (5) having at least two optical scanners (6) of said optical assembly (4) at least twice at predetermined and / or settable variable angles, in such a way as to change the optical path (3) of the beam (1) each time, the beam (1) not being refracted between each deflection; and further imaging the beam (1) onto the object (2) by means of imaging optics (7), wherein a focal region (8) of the beam (1) is located on and / or within the object (2) by imaging by means of said imaging optics (7), 1. A method for producing, using the scanner system (5), at least one pivoting movement of a beam section (9) of a beam (1) emerging from the scanner system (5), wherein during the pivoting movement, a pivot point (10) of the beam section (9) is located upstream of the imaging optical system (7) in the optical path (3) or within the imaging optical system (7), and wherein the pivoting and / or at least one rotational movement (15) about the pivot point (10) produces a movement of a focal region (8) in at least one spatial direction (X, Y) perpendicular to the optical axis of the imaging optical system (7).

2. 1. A method for machining at least one opening in an object (2) made of a transparent material as a workpiece (11), the method comprising the steps of: using a method as claimed in claim 1 to produce a modification (20) of the material of the workpiece (11) at least in the focal region (8) of the beam (1); wherein the modification does not involve removal of material by the action of the beam (1); and then forming the opening in the workpiece (11) by anisotropic removal of material in the respective region of the modification (20) by the action of an etching medium.

3. 3. The method according to claim 1, wherein the respective rotational movement (15) of the beam section (9) about the rotation axis (12) of the pivot point (10), and thus the respective linear movement of the focal region (8) in one spatial direction (X, Y), is performed via two rotational movements (13) of two optical scanners (6) forming a scanner pair about two mutually parallel rotation axes (14), which together deflect the optical path (3) of the beam (1).

4. 4. The method according to claim 1, wherein two rotational movements (15) of the beam section (9) about two rotational axes (12) of the pivot point (10) are superimposed to linearly move the focal region (8) in two spatial directions (X, Y).

5. 5. The method according to claim 1, wherein the rotational movements (13) of the two scanners (6) of a scanner pair are formed asynchronously.

6. 6. The method according to claim 1, further comprising: subjecting the beam (1) to beam shaping over its optical path (3) through the optical assembly (4) using beam shaping optics (16), thereby imaging a focal region (8) at and / or within the object (2) that is elongated in the direction of the optical path (3), the elongated focal region (8) extending over at least a part of a dimension of the object (2) that is formed in the direction of the optical path (3).

7. 7. The method according to claim 1, wherein the beam shaping using the beam shaping optics (16) is performed before the beam (1) enters the optical scanner system (5).

8. 8. The method according to claim 1, wherein the respective focal regions (8) of the beam (1) whose optical path (3) passing through the optical assembly (4) is changed based on the deflection are imaged by the imaging optical system (7) onto a focal plane (17) on which the respective focal regions (8) are located or extend from the focal plane (17).

9. 9. A method according to claim 1, wherein the imaging of each focal region (8) is performed telecentrically by the imaging optics (7).

10. 10. The method according to claim 1, wherein the movement of the focal region (8) in at least one spatial direction (X, Y) is superimposed with at least one additional movement of a travel axis (18) included in the device, on which at least a part of the optical assembly (4) included in the device is arranged.

11. 11. The method according to claim 1, wherein the additional movement of the travel axis (18) is at least partially corrected and / or at least partially compensated for by superimposing at least one additional movement of the travel axis (18) on the movement of the focal region (8) in at least one spatial direction (X, Y).

12. 1. An apparatus with an optical assembly (4) for carrying out a method, in particular according to at least one of claims 1 to 11, comprising a beam source (19) for emitting a beam of electromagnetic light (1), a scanner system (5) with at least two optical scanners (6) each with at least one rotatable deflection element for deflecting the beam (1), and at least one imaging optical system (7) by means of which the beam (1) can be imaged onto an object (2) and by means of which a focal region (8) of the beam (1) can be located on and / or within the object (2), wherein no further optical elements are arranged in the optical path (3) between the scanners (6), 1. An apparatus according to claim 1, wherein each two scanners (6) form a scanner pair, the rotation axes (14) of the two scanners (6) being aligned parallel to one another, and wherein the optical assembly (4) has at least one scanner pair or at least two scanner pairs, the rotation axes (14) of the two scanner pairs being aligned perpendicular to one another.

13. 13. The device according to claim 12, characterized in that the optical assembly (4) comprises a beam shaping optical system (16) by means of which the beam (1) can be shaped.

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