Equipment abnormality detection sensor

Abstract

This specification discloses an apparatus abnormality detection sensor that detects an abnormality in an apparatus. In the device abnormality detection sensor of the present invention, the elastic plate changes in response to changes in the device, and the sensing unit recognizes an abnormality signal from the sensing circuit printed on the elastic plate. Therefore, the present invention can quickly detect minute changes in the device.

Description

[Technical Field]

[0001] The present invention relates to a device abnormality detection sensor.

[0002] In particular, the present invention relates to an apparatus abnormality detection sensor that can detect problems caused by deformation of the apparatus in advance. [Background technology]

[0003] The device is gradually damaged over time, especially even when no external force is applied, so continuous inspection and repair are necessary.

[0004] However, it is very difficult to inspect equipment continuously. Inspecting equipment means that an operator or the equipment itself must be positioned adjacent to the equipment and check for abnormalities using visual inspection or other means.

[0005] This requires time and effort from the operator.

[0006] Furthermore, while workers can easily grasp abnormalities that they can intuitively grasp, they cannot easily grasp parts that are difficult to grasp intuitively, such as loose bolts and nuts. To solve this problem, various methods have been used, such as a method of detecting the loosening of bolts and nuts by generating a sound using a striking means, but this method requires a high level of skill from the operator, is less accurate, and it is not easy to determine the location of the abnormality. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Korean Utility Model Publication No. 2000-0013662 Summary of the Invention [Problem to be solved by the invention]

[0008] SUMMARY OF THE INVENTION The present invention according to one embodiment has been made to solve the above-mentioned problems, and an object of the present invention is to provide an apparatus abnormality detection sensor that can accurately detect an abnormality in an apparatus in real time. [Means for solving the problem]

[0009] According to one embodiment, the device abnormality detection sensor may include an elastic plate connected to the device, a sensing circuit printed on one surface, which is deformed by deformation of the device, and a sensing unit which detects abnormality in the sensing circuit by deformation of the elastic plate, thereby detecting abnormality in the device.

[0010] The sensing circuit is preferably a plurality of circuits, each of which is located on one surface of the elastic plate.

[0011] The sensing circuit is characterized in that it is composed of a first sensing circuit, a second sensing circuit, and a third sensing circuit, and each sensing circuit may have a different thickness.

[0012] At least one of the sensing circuits is characterized by at least one non-linear shape.

[0013] A substrate unit capable of applying a current to the sensing circuit is connected to the sensing circuit on one side of the elastic plate.

[0014] The sensing unit senses an abnormality signal from the sensing circuit at a set period. [Effects of the Invention]

[0015] In one embodiment, the present invention allows for accurate real-time detection of abnormalities in the device by detecting changes in the strength of the current in the sensing circuit printed on the elastic plate, which contracts and relaxes as the device moves. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is a diagram illustrating the operation of an apparatus abnormality detection sensor according to an embodiment of the present invention. [Figure 2] FIG. 2 shows an apparatus abnormality detection system according to one embodiment of the present invention. [Figure 3] FIG. 3 is an enlarged view of an elastic plate of an apparatus abnormality detection system according to an embodiment of the present invention. [Figure 4] FIG. 4 shows another embodiment of the device abnormality detection sensor of the present invention. [Figure 5] FIG. 5 is an enlarged view of an elastic plate of an apparatus abnormality detection sensor according to another embodiment of the present invention. [Figure 6] FIG. 6 is an exploded view of a sensing unit of an apparatus abnormality sensor according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0017] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings, which are not intended to limit the scope of the present invention.

[0018] In assigning reference numerals to components in each drawing, it should be noted that the same components are assigned the same numerals as much as possible even if they are shown in different drawings. Furthermore, in describing the present invention, if it is determined that a detailed description of related publicly known configurations or functions may obscure the gist of the present invention, the detailed description thereof will be omitted.

[0019] In addition, the size and shape of components shown in the drawings may be exaggerated for clarity and convenience of explanation. Furthermore, terms specifically defined in consideration of the configuration and operation of the present invention are merely used to describe the embodiments of the present invention and do not limit the scope of the present invention.

[0020] FIG. 1 is a diagram illustrating the operation of an apparatus abnormality detection sensor according to an embodiment of the present invention.

[0021] The device abnormality detection sensor 10 according to an embodiment of the present invention may include an elastic plate 100 and a sensing unit 200 .

[0022] The elastic plate 100 may have the sensing circuit 110 printed on one side thereof and may be made of a flexible material. The elastic plate 100 is connected to a device. The elastic plate 100 is connected to a device and its shape can be deformed by the movement of the device.

[0023] 1, when a bolt loosens, the elastic plate 100 may stretch due to the movement of the bolt. As the elastic plate 100 deforms, the spacing or thickness of the sensing circuit 110 may change. As a result, the resistance value of the sensing circuit 110 changes from the previous value, and the current value flowing through the sensing circuit 110 also changes from the previous current value.

[0024] The sensing unit 200 can sense a device abnormality by sensing a change in the sensing circuit 110. For example, the sensing unit 200 can sense a device abnormality by sensing a change in a current value. In this way, the present invention can accurately detect device abnormalities in real time.

[0025] Also, for example, the sensing unit 200 may be located on one side of the elastic plate 100 , generate energy by solar power generation, and apply a current to the sensing circuit 110 .

[0026] In addition, the sensing unit 200 can apply a current to the sensing circuit 110 at a set period to sense an abnormality in the sensing circuit 110. That is, the sensing unit 200 can apply a current at a set period to determine a change in the current value of the sensing circuit 110 at the set period.

[0027] Therefore, the present invention can utilize energy efficiently.

[0028] FIG. 2 shows an apparatus abnormality detection system according to one embodiment of the present invention.

[0029] The device abnormality detection system according to an embodiment of the present invention may include the device abnormality detection sensor 10, the short-range communication unit 300, and the monitoring unit 400.

[0030] That is, the sensing unit 200 can transmit the sensed information to the monitoring unit 400 through the communication unit 300 .

[0031] Here, the communication unit 300 may include a short-range communication unit 310 capable of short-range communication and a server system unit 320 capable of transmitting and receiving information received through the short-range communication unit 310. That is, the sensing unit 200 may transmit information regarding the presence or absence of an abnormality in the device to the short-range communication unit 310, and the short-range communication unit 310 may transmit the received information to the server system unit 320.

[0032] The monitoring unit 400 is connected to the server system unit 320 and can check the information transmitted to the server system unit 320 in real time to check for any abnormalities in the device in real time.

[0033] FIG. 3 is an enlarged view of an elastic plate of an apparatus abnormality detection system according to an embodiment of the present invention.

[0034] In one embodiment of the present invention, a plurality of sensing circuits 110 can be printed on the elastic plate 100 .

[0035] As an example, the sensing circuit 110 may be composed of a first sensing circuit 111, a second sensing circuit 112, and a third sensing circuit 113.

[0036] The first sensing circuit 111, the second sensing circuit 112, and the third sensing circuit 113 may be positioned at a distance from each other on the elastic plate 100. That is, the second sensing circuit 112 may be positioned between the first sensing circuit 111 and the third sensing circuit 113. In this way, the present invention allows a plurality of sensing circuits 110 to be positioned at different positions on the elastic plate 100, thereby enabling even minute deformations of the device to be detected.

[0037] Here, each sensing circuit 110 may be made of Ag / epoxy paste.

[0038] FIG. 4 shows another embodiment of the device abnormality detection sensor of the present invention.

[0039] In another embodiment of the device abnormality detection sensor 10 of the present invention, the first sensing circuit 111, the second sensing circuit 112, and the third sensing circuit 113 may have different thicknesses. That is, the first sensing circuit 111, the second sensing circuit 112, and the third sensing circuit 113 may have different thicknesses, and the third sensing circuit 113 may be thicker than the first sensing circuit 111, or the second sensing circuit 112 may be thicker than the first sensing circuit 111 and the third sensing circuit 113.

[0040] Therefore, in the present invention according to one embodiment, the current value of the sensing circuit 110 may change more significantly due to an abnormality in the device. Therefore, when the elastic portion of the present invention is deformed due to a slight change in the device, the resistance value may change significantly, and the current value may change significantly.

[0041] Therefore, the present invention according to one embodiment can check for abnormalities in the device more accurately.

[0042] FIG. 5 is an enlarged view of an elastic plate of an apparatus abnormality detection sensor according to another embodiment of the present invention.

[0043] In another embodiment, the present invention may also be adapted to print sensing circuit 110 in a shape other than a straight line.

[0044] For example, as shown in FIG. 5, the first sensing circuit 111 of the elastic plate 100 of the present invention may be formed in a serpentine shape.

[0045] In this manner, the first sensing circuit 111 may be formed in a serpentine shape, and the second sensing circuit 112 and the third sensing circuit 113 may be formed in a straight line shape.

[0046] Therefore, in the present invention, the first sensing circuit 111 having a large resistance value changes its resistance value greatly even with a slight change in the device, so that the abnormality of the device can be detected.

[0047] However, the widths of the first sensing circuit 111 and the second sensing circuit 112 may be similar. For example, the width of the first sensing circuit 111 and the second sensing circuit 112 may be 2 mm. However, the width of the third sensing circuit 113 located outside the elastic plate 100 may be smaller than the widths of the first sensing circuit 111 and the second sensing circuit 112. For example, the width of the third sensing circuit 113 may be 1 mm. Therefore, in the present invention, the second sensing circuit 112 can maintain a stable resistance value, but the resistance values ​​of the first sensing circuit 111 and the third sensing circuit 113 may change significantly due to deformation of the device.

[0048] In this way, the present invention can easily detect even the smallest changes in the device due to the unique shape of the sensing circuit 110. Meanwhile, although only the device abnormality sensing circuit is described in Figures 3 to 5, it is no problem if all of these are implemented in the system described in Figure 2.

[0049] FIG. 6 is an exploded view of a sensing unit of an apparatus abnormality sensor according to an embodiment of the present invention.

[0050] The sensing unit 200 according to an embodiment of the present invention may include an upper case 210 , a power generating unit 220 , a substrate unit 230 , a middle case 240 , and a lower case 250 .

[0051] The upper case 210 is located above the sensing unit 200. The upper case 210 may be formed in a shape that is open at the bottom. The upper case 210 may be formed to be transparent, so that sunlight may be transmitted through the upper case 210. Fixing portions extending downward may be formed near corners of the upper case 210.

[0052] The power generation unit 220 may be disposed in a form surrounded by the upper case 210. The power generation unit 220 has cells disposed on one side thereof and can generate energy by receiving sunlight. Here, the power generation unit 220 may be formed smaller than the upper case 210.

[0053] The substrate unit 230 may be located below the power generation unit 220 and connected to the power generation unit 220. The substrate unit 230 may also be connected to the elastic plate 100. Therefore, the substrate unit 230 can apply a current to the sensing circuit 110 of the elastic plate 100 using the energy generated by the power generation unit 220. Here, a fixing groove may be formed at a corner portion of the substrate unit 230 (at a position corresponding to a portion where the fixing portion of the upper case 210 is formed).

[0054] The intermediate case 240 may be located below the upper case 210, support the power generation unit 220 on its upper side, and have the substrate unit 230 located on its lower side. Fixing portions into which the fixing portions of the upper case 210 can be fitted and fixed may be located near corners of the intermediate case 240. Therefore, the fixing portions of the upper case 210 may be interconnected and fixed to the fixing portions of the intermediate case 240. Therefore, the power generation unit 220 can be fixed between the upper case 210 and the intermediate case 240.

[0055] The lower case 250 may be positioned below the intermediate case 240. The lower case 250 may have fixing portions formed at positions corresponding to the fixing portions of the intermediate case 240. Therefore, the lower case 250 may be positioned below the intermediate case 240 and coupled to it via the fixing portions. Therefore, the substrate unit 230 disposed below the intermediate case 240 may be fixed between the intermediate case 240 and the lower case 250.

[0056] Meanwhile, a groove is formed in the lower case 250, forming a space in which the elastic plate 100 connected to the base unit 230 can be placed. More precisely, an upward-facing peripheral wall is formed around the lower case 250, and the height of the peripheral wall where the elastic plate 100 is placed may be lower than the height of the other peripheral walls. Therefore, the elastic plate 100 can be placed outside.

[0057] While the present invention has been shown and described with respect to specific embodiments, it will be apparent to those skilled in the art that various modifications and variations of the present invention can be made without departing from the spirit and scope of the present invention as defined by the following claims. [Explanation of symbols]

[0058] 10: Device abnormality detection sensor 100: Elastic plate 110: Sensing circuit 111: 1st sensing circuit 112:Second sensing circuit 113:Third sensing circuit 200: Sensing part 210: Upper case 220: Power Generation Department 230: Circuit board section 240: Intermediate case 250: Lower case 300: Communications Department 310: Near Field Communication Department 320: Server Systems Department 400: Monitoring Department

Claims

1. In a device abnormality detection sensor that detects abnormalities in a device, an elastic plate coupled to the device, having a sensing circuit printed on one side thereof, and deformed by deformation of the device; and a sensing unit for sensing an abnormality in the sensing circuit according to the deformation of the elastic plate, thereby sensing an abnormality in the device; An apparatus abnormality detection sensor including:

2. The sensing circuit is configured in plural and is located on one surface of the elastic plate. The device abnormality detection sensor according to claim 1 ,

3. The sensing circuit a first sensing circuit, a second sensing circuit, and a third sensing circuit; Each sensing circuit can have a different thickness. The device abnormality detection sensor according to claim 2 ,

4. At least one of the sensing circuits has a shape that is not linear. The device abnormality detection sensor according to claim 3,

5. A substrate unit capable of applying a current to the sensing circuit is connected to the sensing circuit on one side of the elastic plate. The device abnormality detection sensor according to claim 1 ,

6. The sensing unit Detecting an abnormal signal from the detection circuit at a set period. The device abnormality detection sensor according to claim 1 ,

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