Vibration-damped electronic assembly for a process variable transmitter

The vibration-damped electronic assembly for field devices uses a shroud with elastomeric stops to absorb vibration energy, addressing the challenge of mechanical shocks and improving the reliability of electrical connections in industrial process control systems.

JP2025536934APending Publication Date: 2025-11-12ROSEMOUNT INC
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Patent Information

Application Number
JP2025522269
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-11-30
Filing Date
2023-10-03
Publication Date
2025-11-12

AI Technical Summary

Technical Problem

Field devices in industrial process control systems face challenges in withstanding mechanical shocks and vibrations, leading to potential failure of electrical connections due to stress buildup from opposing movements of subassemblies.

Method used

A vibration-damped electronic assembly for field devices, featuring a shroud with overmolded elastomeric stops that support and isolate electronic boards, absorbing vibration energy and reducing interconnect failure by allowing limited movement within the housing.

Benefits of technology

The solution effectively dampens vibrations, enhancing the robustness of electronic assemblies by reducing stress on connections and maintaining electrical integrity under mechanical shocks, thus extending the assembly's vibration resistance and reliability.

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Abstract

A process variable transmitter 102 is provided. The process variable transmitter 102 includes a process variable sensor 200 and an electronics board 134 having circuitry electrically connected to the process variable sensor 200. The process variable transmitter 102 further includes a shroud 152 that holds the electronics board 134 and at least one stop member 154 that provides vibration damping. A method of manufacturing the process variable transmitter 102 is provided. The method includes providing the process variable sensor 200. The method also includes providing the electronics board 134 having circuitry configured to be electrically connected to the process variable sensor 200. The method further includes forming the shroud 152 that holds the electronics board 134 and forming at least one stop member 154 that supports the electronics board 134 when the electronics board 134 is within the shroud 152.
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Citation Information

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