Integrated device, cooling system, cooling method, and terminal

Abstract

An embodiment of the present application provides an integrated device, a cooling system, a cooling method, and a terminal. The integrated device includes a circuit board, a temperature sensor, and a humidity sensor. The dew point temperature of the environment within the integrated device is calculated based on the temperature and humidity measured by the temperature sensor and the humidity sensor, and the cooling mode of the integrated device is selected based on the dew point temperature to prevent condensation. The cooling system includes the integrated device, a cooling pipe, a valve, and a heat exchange medium. The valve opens and closes to control whether the heat exchange medium circulates through the cooling pipe, thereby controlling the cooling mode of the integrated device, preventing condensation and preventing short circuits on the circuit board. According to the solution provided herein, the integrated device only requires an IP52 rating, and does not require a ventilation valve, adhesive seal, or reversible moisture absorbent material. There is also no need to apply a waterproof coating to the circuit board. This reduces the manufacturing and maintenance costs of the integrated device, simplifies disassembly, ensures good heat dissipation performance, and contributes to improving the performance of the integrated device.

Description

[Technical Field]

[0001] The present application relates to the field of electronic devices, and in particular to an integrated device, a cooling system, a cooling method, and a terminal. [Background technology]

[0002] As autonomous driving becomes more advanced, the computing power and power consumption of the system-on-chip (SoC) installed in the vehicle's intelligent module are also increasing. Conventional natural or air-cooled heat dissipation cannot meet the heat dissipation requirements of the SoC, so liquid-cooled heat dissipation is required for the SoC. Condensation may occur when the coolant temperature is lower than the ambient temperature, potentially causing a short circuit on the circuit board. Condensation may also occur when the air is humid or the ambient temperature is low, potentially causing a short circuit on the circuit board. Summary of the Invention

[0003] The present application provides an integrated device, a cooling system, a cooling method, and a terminal for preventing short circuits in a circuit board due to condensation.

[0004] According to a first aspect, an embodiment of the present application provides an integrated device. The integrated device includes a circuit board, a first temperature sensor, and a humidity sensor. The first temperature sensor is configured to measure temperature, and the humidity sensor is configured to measure humidity. The temperature and humidity are used to obtain a dew point temperature of an environment within the integrated device, and the dew point temperature is used to determine a cooling mode for the integrated device. The dew point temperature is related to an ambient temperature and an ambient humidity, and can be obtained by measuring the ambient temperature and the ambient humidity. If there is a risk of condensation when the integrated device is cooled using liquid cooling at the current environmental dew point temperature, the integrated device is cooled using a different cooling mode to avoid short-circuiting of the circuit board due to condensation.

[0005] In a possible implementation of the first aspect, the integrated device further includes a first processing module configured to calculate a dew point temperature based on the temperature and humidity, and the integrated device determines a cooling mode based on the dew point temperature to avoid condensation.

[0006] In a possible implementation of the first aspect, the first temperature sensor is located on the circuit board, the first temperature sensor is integrated into the circuit board and configured to measure temperature to obtain an ambient dew point temperature.

[0007] In a possible implementation of the first aspect, the humidity sensor is located on the circuit board. The humidity sensor is integrated into the circuit board and configured to measure humidity to obtain an ambient dew point temperature.

[0008] In a possible implementation of the first aspect, the integrated device further includes a cooling plate and a second temperature sensor. The cooling plate is used for heat exchange in the integrated device, and the second temperature sensor is configured to measure the temperature of the cooling plate. The cooling plate is a component used by the integrated device for heat exchange and involves a risk of condensation. Since the second temperature sensor measures the temperature of the cooling plate, the risk of condensation can be more accurately determined. When the temperature of the cooling plate is higher than the dew point temperature, there is no risk of condensation. When the temperature of the cooling plate is lower than the dew point temperature, there is a risk of condensation. The cooling mode of the integrated device can be determined based on the temperature.

[0009] The integrated device provided in this embodiment of the present application measures temperature and humidity via a temperature sensor and a humidity sensor, calculates a dew point temperature based on the measured temperature and humidity, determines the risk of condensation based on the dew point temperature, and selects an appropriate cooling mode to avoid the risk of condensation. According to the solution provided in the present application, the integrated device only requires an IP52 rating and does not require a ventilation valve, adhesive seal, or reversible moisture absorbent material. This reduces the manufacturing cost of the integrated device. Because there is no need to seal the integrated module or apply a waterproof coating to the circuit board, the integrated device provided in this embodiment of the present application is easy to disassemble and easy to maintain. Furthermore, because there is no need to apply a waterproof coating to the circuit board, the circuit board has good heat dissipation properties, which contributes to improving the performance of the integrated device. According to a second aspect, an embodiment of the present application provides a cooling system. The cooling system includes the integrated device described in any one of the first aspect, a cooling pipe, a valve, and a heat exchange medium. The cooling pipes are configured to circulate a heat exchange medium, and the heat exchange medium is configured to dissipate heat from the integrated device, and the valves are configured to control the opening and closing of the cooling pipes. When the valves are open, the heat exchange medium circulates through the cooling pipes, and the integrated device is in a liquid cooling heat dissipation state. When the valves are closed, the heat exchange medium does not circulate through the cooling pipes, and the integrated device is in another heat dissipation state, such as natural heat dissipation or air cooling heat dissipation. In other words, in this case, the integrated device dissipates heat in a cooling mode, such as natural heat dissipation or air cooling heat dissipation.

[0010] In a possible implementation of the second aspect, the cooling system further includes a second processing module. The second processing module is configured to control and open a valve when the temperature of the heat exchange medium is higher than a dew point temperature or when the temperature of the heat exchange medium is higher than the sum of the dew point temperature and a first threshold. When the temperature of the heat exchange medium is higher than the dew point temperature or when the temperature of the heat exchange medium is higher than the sum of the dew point temperature and the first threshold, condensation does not occur, and the valve is opened to allow the heat exchange medium to circulate through the cooling pipe, thereby dissipating heat from the integrated equipment and ensuring proper operation of the integrated equipment.

[0011] In a possible implementation of the second aspect, the first threshold value is related to the performance of the temperature sensor and / or humidity sensor. The temperature and humidity measured by the temperature sensor and humidity sensor may have errors. To ensure that condensation does not occur in the integrated device, the first threshold value is set to prevent the measured dew point temperature from being lower than the actual dew point temperature, resulting in a false determination that there is no risk of condensation. As a result, the integrated device enters a liquid-cooled state, causing condensation.

[0012] In a possible embodiment of the second aspect, the valve is closed when the temperature of the heat exchange medium is equal to or lower than the dew point temperature or equal to or lower than the sum of the dew point temperature and a first threshold value. If the temperature of the heat exchange medium does not meet the condition, there is a risk of condensation. By closing the valve, the integrated device enters another heat dissipation state, such as a natural heat dissipation state or an air-cooled state, thereby preventing condensation.

[0013] In a possible implementation example of the second aspect, the cooling system further includes a third temperature sensor configured to measure a temperature of the heat exchange medium, and the risk of condensation can be determined based on the measured temperature of the heat exchange medium, and a cooling mode of the integrated equipment can be determined.

[0014] According to a third aspect, an embodiment of the present application provides a cooling method applied to a cooling system. The cooling system includes an integrated device, a cooling pipe, a valve, and a heat exchange medium. After the integrated device is turned on for a first period, the valve is opened and the heat exchange medium circulates through the cooling pipe, and the heat exchange medium dissipates heat from the integrated device. When the integrated device is turned on, the temperature of the heat exchange medium is low. In this case, there is a risk of condensation as the heat exchange medium circulates and dissipates heat from the integrated device. After the first period, when the temperature of the heat exchange medium rises to a temperature higher than the dew point temperature, the valve is opened and the heat exchange medium circulates through the cooling pipe and dissipates heat from the integrated device, and condensation does not occur.

[0015] According to a fourth aspect, an embodiment of the present application provides a cooling method applied to a cooling system. The cooling system includes an integrated device, a cooling pipe, a valve, and a heat exchange medium. An external ambient temperature of the integrated device is acquired, and when the external ambient temperature of the integrated device is less than a second threshold, the valve is closed. When the ambient temperature is less than the second threshold, the heat dissipation requirements of the integrated device can be met by other heat dissipation modes, such as natural heat dissipation or air-cooled heat dissipation. By closing the valve, the heat exchange medium cannot circulate in the cooling pipe, and there is no risk of condensation.

[0016] In a possible implementation of the fourth aspect, when the ambient temperature is equal to or greater than the second threshold and the power-on period of the integrated equipment is longer than the first period, the valve is opened, causing the heat exchange medium to circulate through the cooling pipe, and then the heat exchange medium dissipates heat from the integrated equipment. When the ambient temperature is equal to or greater than the second threshold and other heat dissipation modes, such as natural heat dissipation or air-cooled heat dissipation, cannot meet the heat dissipation requirements of the integrated equipment, liquid-cooled heat dissipation is required for the integrated equipment. When the power-on period of the integrated equipment is longer than the first period, the temperature of the heat exchange medium rises to a temperature higher than the dew point temperature, and the valve is opened, causing the heat exchange medium to circulate through the cooling pipe to dissipate heat from the integrated equipment, without condensation.

[0017] According to a fifth aspect, an embodiment of the present application provides a cooling method applied to an integrated device. The integrated device includes a circuit board, a first temperature sensor, and a humidity sensor. The first temperature sensor is configured to measure temperature, and the humidity sensor is configured to measure humidity. The temperature and humidity are used to obtain a dew point temperature of an environment within the integrated device, and the dew point temperature is used to determine a cooling mode of the integrated device.

[0018] According to a sixth aspect, an embodiment of the present application provides a cooling method applied to a cooling system. The cooling system includes the integrated device according to any one of the first aspect, a cooling pipe, a valve, and a heat exchange medium. The cooling pipe is configured to circulate the heat exchange medium, and the heat exchange medium is configured to dissipate heat from the integrated device, and the valve is configured to control the opening and closing of the cooling pipe. When the valve is open, the heat exchange medium circulates in the cooling pipe, and the integrated device is in a liquid-cooled heat dissipation state. When the valve is closed, the heat exchange medium does not circulate in the cooling pipe, and the integrated device is in another heat dissipation state, such as natural heat dissipation or air-cooled heat dissipation.

[0019] According to a seventh aspect, an embodiment of the present application provides a terminal, the terminal comprising the integrated equipment or cooling system according to any one of the first or second aspects. Optionally, the terminal is a vehicle.

[0020] According to an eighth aspect, an embodiment of the present application provides a computer-readable storage medium, which, when executed on a computer or processor, performs a method according to any one of the third, fourth, fifth, or sixth aspects.

[0021] For the effects of the embodiments corresponding to the fifth, sixth, seventh, and eighth aspects, please refer to the descriptions of the embodiments of the first and second aspects, and the details will not be described again here. [Brief explanation of the drawings]

[0022] [Figure 1] 1 is a diagram of an integrated device usage scenario. [Figure 2] 1 is a diagram of an integrated device according to the present application. [Figure 3] FIG. 2 is another view of an integrated device according to the present application. [Figure 4] FIG. 10 is another view of an integrated device according to the present application. [Figure 5] FIG. 10 is yet another view of an integrated device according to the present application. [Figure 6] FIG. 10 is yet another view of an integrated device according to the present application. [Figure 7] 1 is a further view of an integrated device according to the present application. [Figure 8] 1 is a diagram of a cooling system according to the present application. [Figure 9] FIG. 2 is another diagram of a cooling system according to the present application. [Figure 10] 1 is a diagram illustrating a cooling system according to the present invention applied to a vehicle. [Figure 11] FIG. 2 is yet another diagram of a cooling system according to the present application. [Figure 12] 1 is a schematic flow chart of a cooling method according to the present application. [Figure 13] 4 is another schematic flow chart of a cooling method according to the present application. [Figure 14] 4 is yet another schematic flow chart of a cooling method according to the present application. DETAILED DESCRIPTION OF THE INVENTION

[0023] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the following describes the embodiments of the present application in more detail with reference to the accompanying drawings.

[0024] For ease of understanding, some concepts related to the embodiments of the present application are described below with examples for reference. The details are as follows:

[0025] 1. Integrated equipment

[0026] The integrated device referred to in the embodiments of the present application may be an intelligent driving module, an in-vehicle infotainment module, a vehicle control module, a mobile data center (MDC), an intelligent cockpit domain controller (CDC), a vehicle domain controller, or other modular units encapsulated in integrated circuits in the in-vehicle field, such as an electronic control unit (ECU), a telematics box (Tbox), or an industrial personal computer (IPC), etc. The integrated device in the embodiments of the present application may be used in various fields such as intelligent driving, intelligent transportation, intelligent manufacturing, intelligent control, and environmental monitoring, and may perform one or more functions such as data processing, automatic control, information collection, simulation calculation, and target recognition.

[0027] 2. Circuit board

[0028] A circuit board may also be called a line board, PCB board, FPC line board, printed line board, or main board. A circuit board is a printed circuit board on which point connections and printed elements are formed based on a predetermined design. The function of a circuit board is to form predetermined circuit connections between electronic components, and the circuit board is the substrate on which the electronic components are mounted and the main interconnection component.

[0029] The circuit board is attached to the integrated device, and the circuit board and the electronic components integrated on the board together form the core for realizing the functions of the integrated device.

[0030] 3. Temperature Sensor

[0031] A temperature sensor is a sensor that senses temperature and converts this temperature into a usable output signal.

[0032] 4. Humidity sensor is a sensor that senses temperature and converts this temperature into a usable output signal.

[0033] Humidity Sensor

[0034] 5.Heat exchange medium

[0035] A heat exchange medium, which may also be referred to as a heat transfer medium, heat exchange working medium, etc., is configured to transfer heat from one location to another. Heat exchange media are typically gases or liquids such as air, water, or oil, but may also be phase change materials, liquid metals, or nanofluids formed by dispersing metal or non-metallic nanoparticles in a fluid medium.

[0036] 6.Dew point temperature

[0037] The dew point temperature, also known as the dew point, is the temperature at which gaseous water in the air becomes saturated and condenses into liquid water at a given atmospheric pressure. This temperature is called the dew point temperature because gaseous water on a solid surface condenses into dew at this temperature.

[0038] At a constant atmospheric pressure, the dew point is related to temperature and humidity. When the air is saturated with water vapor, the dew point is equal to the temperature.

[0039] 7. Valve

[0040] Valves are movable parts and devices that can be used to open, close, or partially block one or more openings or passages to allow, block, or regulate the flow of liquids, air, or other loose substances. Based on the actuation mode, valves can be classified as manual valves, electrically operated valves, hydraulic valves, and atmospheric valves.

[0041] 8. Cooling plate

[0042] In integrated equipment or cooling systems, the components configured for heat exchange for heat dissipation are typically made of metal or non-metallic materials with good thermal conductivity, such as copper, aluminum, or carbon. The cooling plate may be hollow to allow for the circulation of a heat exchange medium. Alternatively, the cooling plate may be a physical structure, and structures such as heat dissipation fins may be present on the cooling plate.

[0043] Alternatively, the cooling plate may be formed by deforming a cooling pipe or may be a part of a cooling pipe. The cooling plate is typically in contact with a heat-generating part in the equipment, and heat is dissipated from the cooling plate by heat exchange.

[0044] 9. Cooling pipe

[0045] The cooling pipe, also called a heat pipe, is a heat transfer element in which a heat exchange medium circulates to rapidly transfer heat from a heat source to the outside of the heat source.

[0046] In the embodiments of the present application, unless otherwise specified, the quantities of nouns refer to "singular nouns" or "plural nouns," i.e., "one or more." "At least one" means one or more, and "plural" means two or more. "And / or" indicates a relationship between related objects, and indicates that three relationships may exist. For example, A and / or B indicates three cases: only A exists, both A and B exist, and only B exists, and A and B may be singular or plural. Unless otherwise specified, the character " / " generally indicates an "or" relationship between related objects. For example, A / B indicates A or B. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of a single item or multiple items. For example, at least one item of a, b, or c can represent a, b, c, a and b, a and c, b and c, or a, b, and c. Here, a, b, and c may be singular or plural.

[0047] In the embodiments of the present application, ordinal notations such as "first" and "second" are used to distinguish between multiple objects and are not intended to limit the size, content, order, chronological order, application scenario, priority, or importance of the multiple objects. For example, the first processing module and the second processing module may be the same processing module or different processing modules. Furthermore, these names do not indicate that the structure, location, priority, application scenario, importance, etc. of the two processing modules are different.

[0048] In the embodiments of the present application, "connection" may mean a direct connection or an indirect connection. Furthermore, "connection" may mean an electrical connection or a communication connection. For example, when two electrical elements A and B are connected, this may mean that A and B are directly connected, or that A and B are indirectly connected via another electrical element or a connection medium, so that an electrical signal can be transmitted between A and B. In another example, when two devices A and B are connected, this may mean that A and B are directly connected, or that A and B are indirectly connected via another communication device or communication medium, provided that A and B can communicate with each other.

[0049] In the embodiments of the present application, unless otherwise specified or there is no logical contradiction, the terms and / or descriptions between the embodiments are consistent and can be cross-referenced, and the technical features of different embodiments can be combined into new embodiments based on their internal logical relationships.

[0050] Those skilled in the art may understand that all or part of the steps of the embodiments may be implemented by hardware or a program instructing related hardware. The program may be stored in a computer-readable storage medium. The storage medium may be a read-only memory, a magnetic disk, an optical disk, etc.

[0051] The above describes some concepts in the embodiments of the present application, and the following describes technical features in the embodiments of the present application.

[0052] FIG. 1 illustrates a usage scenario for an integrated device. The integrated device generates heat during operation, and the heat exchange medium in the cooling pipe needs to dissipate the heat from the integrated device to prevent it from overheating, shutting down, or even burning out. The heat exchange medium absorbs heat within the integrated device, and the heat absorbed by the heat exchange medium is released by the heat exchanger, dissipating the heat from the integrated device. If the temperature of the heat exchange medium is lower than the dew point temperature, condensation may occur in the integrated device. If the condensation drips onto the circuit board of the integrated device, there is a risk of a short circuit.

[0053] Therefore, the present application provides an integrated device. FIG. 2 is a diagram of an integrated device according to the present application. The integrated device includes a circuit board, a first temperature sensor, and a humidity sensor. The first temperature sensor and humidity sensor are located within the integrated device. The first temperature sensor and humidity sensor are configured to measure the temperature and humidity within the integrated device, obtain a dew point temperature based on the temperature and humidity, and determine a cooling mode for the integrated device based on the dew point temperature. When liquid cooling is used to cool the integrated device at the current dew point temperature, there is a risk of condensation. In this case, to avoid short-circuiting of the integrated device due to condensation, heat is dissipated to the integrated device in a different cooling mode. Optionally, the first temperature sensor and humidity sensor may be different sensors, or may be a temperature and humidity sensor capable of measuring both temperature and humidity. FIG. 3 is a diagram of an integrated device according to the present application. The temperature and humidity sensor is both the first temperature sensor and the humidity sensor.

[0054] In a possible embodiment, the first temperature sensor is integrated into the circuit board.

[0055] In a possible embodiment, the humidity sensor is integrated into the circuit board.

[0056] In a possible embodiment, Figure 4 is a diagram of an integrated device according to the present application. The integrated device further includes a first processing module. The first processing module is connected to a first temperature sensor and a first humidity sensor. The first processing module is configured to calculate a dew point temperature based on the temperature data and the humidity data.

[0057] In a possible embodiment, the first processing module is integrated into the circuit board.

[0058] Optionally, the dew point temperature may be calculated according to the Goff-Gratch equation, the Magnus equation, or may be obtained in a form such as table lookup. This is not a limitation in the present application. The processing module may include one or more processors. It should be understood that in the embodiments of the present application, the processing module is described as a processor to facilitate the description of the calculation function. In a specific implementation process, the processor may include a device having a calculation function. For example, the at least one processor may include one or more of the following devices: a central processing unit (CPU), an application processor (AP), a time-to-digital converter (TDC), a filter, a graphics processing unit (GPU), a microprocessor unit (MPU), an application specific integrated circuit (ASIC), an image signal processor (ISP), a digital signal processor (DSP), a field programmable gate array (FPGA), a complex programmable logic device (CPLD), a co-processor (which assists the central processing unit in completing corresponding processes and applications), a microcontroller unit (MCU), and / or a neural-network processing unit (NPU), etc.

[0059] Optionally, the processing module may be located internal to the integrated device or external to the integrated device.

[0060] Alternatively, in some possible designs, the processing module may include multiple components, some of which are located within the integrated device and some of which are located external to the integrated device. For example, the processing module may include a digital-to-analog conversion module, a filtering module, and an output module. The digital-to-analog conversion module and the filtering module are located within the integrated device, and the output module is located external to the integrated device.

[0061] In a possible embodiment, Figure 5 is a diagram of an integrated device according to the present application. The integrated device further includes a cooling plate. The cooling plate is a component used by the integrated device to perform heat exchange and involves a risk of condensation. When the temperature of the cooling plate is higher than the dew point temperature, there is no risk of condensation. When the temperature of the cooling plate is lower than the dew point temperature, there is a risk of condensation. In this case, the cooling mode of the integrated device may be determined based on the temperature. When there is a risk of condensation, the integrated device uses other heat dissipation modes such as natural heat dissipation or air-cooled heat dissipation. When there is no risk of condensation, the integrated device uses a liquid-cooled heat dissipation mode.

[0062] In a possible embodiment, FIG. 6 is a diagram of an integrated device according to the present application. The integrated device further includes a cooling plate and a second temperature sensor. The integrated device further includes a cooling plate, which is configured to exchange heat with the integrated device. The cooling plate is a component that carries a risk of condensation. When the temperature of the cooling plate is higher than the dew point temperature, there is no risk of condensation. When the temperature of the cooling plate is lower than the dew point temperature, there is a risk of condensation. In this case, the cooling mode of the integrated device may be determined based on the temperature. When there is a risk of condensation, the integrated device uses another heat dissipation mode, such as natural heat dissipation or air-cooled heat dissipation. When there is no risk of condensation, the integrated device uses the liquid-cooled heat dissipation mode. The second temperature sensor and the first temperature sensor may be the same temperature sensor or different temperature sensors. Furthermore, these names do not imply that the two temperature sensors have different structures, positions, priorities, application scenarios, importance, etc.

[0063] In a possible implementation, FIG. 7 is a schematic diagram of an integrated device according to an embodiment of the present invention. The integrated device includes a housing, a circuit board, a chip, a temperature sensor, a humidity sensor, and a cooling plate. The chip is the primary heat source of the integrated device, and the cooling plate is connected to the chip and dissipates heat from the chip. The housing surrounds electronic components such as the circuit board and has a packaging function. Optionally, the cooling plate may be hollow or solid to allow a heat exchange medium to circulate. The cooling plate may be in direct contact with heat-generating components within the integrated device or may be connected to the heat-generating components within the integrated device via a separate heat-conducting medium. Optionally, the heat-conducting medium may be a thermally conductive pad, thermally conductive silicone grease, or the like. The heat-conducting medium can improve heat transfer efficiency by filling the gap between the cooling plate and the chip, and also provide a certain protective function for the chip, providing a buffer between the cooling plate and the chip to prevent the cooling plate from damaging the chip during assembly or use.

[0064] The integrated device provided in this embodiment of the present application measures temperature and humidity via a temperature sensor and a humidity sensor, calculates a dew point temperature based on the measured temperature and humidity, determines the risk of condensation based on the dew point temperature, and selects an appropriate cooling mode to avoid the risk of condensation. According to the solution provided in this application, the integrated device only requires an IP52 rating and does not require a ventilation valve, adhesive seal, or reversible moisture absorbent material. This reduces the manufacturing cost of the integrated device. Because there is no need to seal the integrated module or apply a waterproof coating to the circuit board, the integrated device provided in this embodiment of the present application is easy to disassemble and maintain. Furthermore, because there is no need to apply a waterproof coating to the circuit board, the heat dissipation of the circuit board is improved, contributing to improved performance of the integrated device.

[0065] The present application provides a cooling system. FIG. 8 is a diagram of the cooling system provided herein. The cooling system includes the integrated device according to any one of the first aspects, a cooling pipe, a valve, and a heat exchange medium. The cooling pipe is configured to circulate the heat exchange medium, and the heat exchange medium is configured to dissipate heat from the integrated device, and the valve is configured to control the opening and closing of the cooling pipe. When the valve is open, the heat exchange medium circulates through the cooling pipe, and the integrated device is in a liquid-cooled heat dissipation state. When the valve is closed, the heat exchange medium does not circulate through the cooling pipe, and the integrated device is in another heat dissipation state, such as natural heat dissipation or air-cooled heat dissipation. The opening and closing of the valve is determined based on the cooling mode required by the integrated device. When there is no risk of condensation in the integrated device, the valve is opened, and the integrated device is in a liquid-cooled heat dissipation state. When there is a risk of condensation in the integrated device, the valve is closed, and the integrated device is in another heat dissipation state, such as natural heat dissipation or air-cooled heat dissipation, to prevent condensation from occurring.

[0066] In a possible embodiment, FIG. 9 is a diagram of a cooling system according to the present application. The cooling system further includes a second processing module, which is connected to a valve. When the temperature of the heat exchange medium is higher than the dew point temperature or when the temperature of the heat exchange medium is higher than the sum of the dew point temperature and a first threshold, the second processing module controls and opens the valve. When the temperature of the heat exchange medium is higher than the dew point temperature or when the temperature of the heat exchange medium is higher than the sum of the dew point temperature and the first threshold, condensation does not occur, and the valve opens, allowing the heat exchange medium to circulate through the cooling pipe, dissipating heat from the integrated equipment and ensuring normal operation of the integrated equipment. The second processing module and the first processing module may be the same processing module or different processing modules. Furthermore, these names do not imply any differences in structure, location, priority, application scenario, importance, etc. between the two processing modules.

[0067] In a possible embodiment, the cooling system is applied to a vehicle. FIG. 10 is a diagram illustrating a cooling system according to an embodiment of the present application applied to a vehicle. The cooling system includes an electric drive loop and a battery loop. A heat exchange medium circulates through the loop. The arrows in the figure indicate the flow direction of the heat exchange medium, and heat is dissipated to the outside through a heat exchanger and circulated through different loops. When starting the vehicle, the initial temperature of the heat exchange medium is low. In this case, if the heat exchange medium enters the integrated equipment, there is a risk of condensation. Therefore, by closing the valve, the integrated equipment enters a heat dissipation mode such as natural heat dissipation or air-cooled heat dissipation. After the vehicle has been running for a certain period of time, the power battery and motor generate heat, which increases the temperature of the heat exchange medium in the loop, eliminating the risk of condensation. By opening the valve, the integrated equipment enters a liquid-cooled heat dissipation mode. A pump is configured to drive the heat exchange medium to flow through the loop.

[0068] Optionally, the first threshold value is related to the performance of the temperature sensor and / or the performance of the humidity sensor, and the temperature and humidity measured by the temperature sensor and humidity sensor may contain errors. To ensure that condensation does not occur in the integrated device and improve the reliability of condensation prevention, the first threshold value is set to prevent the measured dew point temperature from being lower than the actual dew point temperature, resulting in a false determination that there is no risk of condensation. As a result, the integrated device enters a liquid-cooled state, and condensation occurs.

[0069] Optionally, the first threshold value is related to a dew point calculation method, and different dew point calculation methods have different error ranges. The first threshold value is set to avoid false determination of the risk of condensation caused by errors and to improve the reliability of condensation prevention.

[0070] In a possible embodiment, the valve is closed when the temperature of the heat exchange medium is equal to or lower than the dew point temperature or the sum of the dew point temperature and a first threshold value. If the temperature of the heat exchange medium does not meet the condition, there is a risk of condensation. By closing the valve, the integrated device is put into another heat dissipation state, such as a natural heat dissipation state or an air-cooled state, preventing condensation.

[0071] In a possible embodiment, Figure 11 is a diagram of a cooling system according to the present application. The cooling system further includes a third temperature sensor, which is configured to measure the temperature of the heat exchange medium. Based on the measured temperature of the heat exchange medium, a risk of condensation can be determined and a cooling mode of the integrated equipment can be determined. The heat exchange medium first flows through the third temperature sensor and then through the valve.

[0072] One embodiment of the present application provides a cooling method. FIG. 12 is a schematic flowchart of the cooling method according to the present application. The cooling method is applied to a cooling system. The cooling system may be the cooling system shown in any one of FIGS. 8, 9, and 11. The cooling system includes an integrated device, a cooling pipe, a valve, and a heat exchange medium shown in any one of FIGS. 2 to 7. The process is performed according to the following steps: Step 1: S1201: The integrated device is powered on, and the valve remains closed. Step 2: S1202: After the integrated device is powered on for a first period, the valve is opened, and the heat exchange medium circulates in the cooling pipe, and the heat exchange medium dissipates heat from the integrated device. Step 3: S1203: The valve remains open, and after the integrated device is powered off, the valve is closed. When the integrated device is powered on, the temperature of the heat exchange medium is low. In this case, there is a risk of condensation when the heat exchange medium is circulated to dissipate heat from the integrated device. After the first period, when the temperature of the heat exchange medium rises above the dew point temperature, the valve is opened, allowing the heat exchange medium to circulate through the cooling pipes and dissipate heat from the integrated equipment, so that condensation does not occur.

[0073] In a possible embodiment, the first period of time is related to a user of the cooling system, e.g., a vehicle. The structure, performance, and operating conditions of the user all affect the first period of time. For example, when the cooling system is applied to a vehicle, after a vehicle that generates a large amount of heat starts, the temperature of the heat exchange medium rises quickly to a temperature range where there is no risk of condensation, and the first period of time required for the vehicle is shorter than the period of time required for a vehicle that generates a small amount of heat. As another example, when a vehicle is traveling at a high speed, a large amount of heat is generated, and the first period of time required for the vehicle is shorter than the first period of time required for a vehicle that is traveling at a low speed.

[0074] In one embodiment, the cooling system is installed in a vehicle. After the vehicle is started, the temperature of the heat exchange medium rises. After a first period of time, when the temperature of the heat exchange medium rises to a temperature range where there is no risk of condensation, a valve is opened, allowing the heat exchange medium to circulate through the cooling pipes, thereby liquid-cooling the integrated equipment.

[0075] The present application provides a cooling method. FIG. 13 is a schematic flowchart of the cooling method according to the present application. The cooling method is applied to a cooling system. The cooling system may be the cooling system shown in any one of FIGS. 8, 9, and 11. The cooling system may include an integrated device, which may be the integrated device shown in any one of FIGS. 2 to 7, a cooling pipe, a valve, and a heat exchange medium. The process is performed according to the following steps: Step 1: S1301: The integrated device is powered on, and the valve remains closed. Step 2: S1302: Determine whether the ambient temperature of the integrated device is less than a second threshold. If the ambient temperature of the integrated device is less than the second threshold, execute step S1301. If the ambient temperature of the integrated device is equal to or greater than the second threshold, execute step 3. Step 4: S1304: The valve remains open, and after the integrated device is powered off, the valve is closed. When the ambient temperature is below the second threshold, the heat dissipation requirements of the integrated equipment can be met by other heat dissipation modes, such as natural heat dissipation or air-cooled heat dissipation. By closing the valve, the heat exchange medium cannot circulate in the cooling pipe, and there is no risk of condensation.

[0076] In a possible embodiment, when the ambient temperature is equal to or greater than the second threshold and the power-on period of the integrated equipment is longer than the first period, the valve is opened, causing the heat exchange medium to circulate through the cooling pipe, which then dissipates heat from the integrated equipment. When the ambient temperature is equal to or greater than the second threshold and other heat dissipation modes, such as natural or air-cooled heat dissipation, cannot meet the heat dissipation requirements of the integrated equipment, liquid-cooled heat dissipation is required for the integrated equipment. When the power-on period of the integrated equipment is longer than the first period, the temperature of the heat exchange medium rises above the dew point temperature, and the valve is opened, causing the heat exchange medium to circulate through the cooling pipe to dissipate heat from the integrated equipment, preventing condensation from forming. The second threshold is related to the structure of the cooling system and the performance of the integrated equipment. If the cooling system can still achieve heat dissipation even when the heat exchange medium is not circulating, the second threshold is higher than the second threshold of a cooling system that has a low heat dissipation effect when the heat exchange medium is not circulating. When the integrated device generates a small amount of heat or has good high temperature resistance, the second threshold of the integrated device is higher than the second threshold of an integrated device that generates a large amount of heat or has poor high temperature resistance.

[0077] An embodiment of the present application provides a cooling method applied to an integrated device. The integrated device includes a circuit board, a first temperature sensor, and a humidity sensor. The first temperature sensor is configured to measure temperature, and the humidity sensor is configured to measure humidity. The temperature and humidity are used to obtain a dew point temperature of an environment within the integrated device, and the dew point temperature is used to determine a cooling mode for the integrated device.

[0078] One embodiment of the present application provides a cooling method. FIG. 14 is a schematic flowchart of the cooling method according to the present application. This cooling method is applied to a cooling system. The cooling system may be the cooling system shown in any one of FIGS. 8, 9, and 11. This cooling system includes an integrated device according to any one of the first aspects, for example, the integrated device shown in any one of FIGS. 2 to 7, a cooling pipe, a valve, and a heat exchange medium. The cooling pipe is configured to circulate the heat exchange medium, and the heat exchange medium is configured to dissipate heat from the integrated device, and the valve is configured to control the opening and closing of the cooling pipe. When the valve is open, the heat exchange medium circulates in the cooling pipe, and the integrated device is in a liquid-cooled heat dissipation state. When the valve is closed, the heat exchange medium does not circulate in the cooling pipe, and the integrated device is in another heat dissipation state, such as natural heat dissipation or air-cooled heat dissipation. The process is performed according to the following steps: Step 1: S1401: The integrated device is powered on, and the valve remains closed. Step 2: S1402: The temperature sensor and humidity sensor measure the temperature and humidity to determine the dew point temperature. Step 3: S1403: Determine whether the temperature of the heat exchange medium is higher than the dew point temperature or higher than the sum of the dew point temperature and the first threshold. If the temperature of the heat exchange medium is not higher than the dew point temperature or higher than the sum of the dew point temperature and the first threshold, execute step S1401. If the temperature of the heat exchange medium is higher than the dew point temperature or higher than the sum of the dew point temperature and the first threshold, execute step 4. S1404: The valve remains open, and after the integrated equipment is powered off, the valve is closed.

[0079] An embodiment of the present application provides a terminal, the terminal comprising the integrated equipment or cooling system according to any one of the first or second aspects. Optionally, the terminal is a vehicle.

[0080] An embodiment of the present application provides a computer-readable storage medium, which, when executed on a computer or processor, performs the cooling method of any one of the embodiments of the present application.

[0081] For the technical effects of the cooling method and the terminal, please refer to the descriptions of the various embodiments of the integrated device, the cooling system and the cooling method, and the details will not be described again here.

[0082] From the above description of the embodiments, those skilled in the art will understand that the above division of functional modules is given as an example for convenience and concise description. In actual application, the above functions can be allocated and implemented in different modules as needed. That is, the internal structure of the device can be divided into different functional modules to implement all or part of the above functions.

[0083] In some embodiments provided herein, it should be understood that the disclosed devices and methods may be implemented in other ways. For example, the described device embodiments are merely examples. For example, the division into modules or units is merely a logical division of function, and other divisions may be used in actual implementations. For example, multiple units or components may be combined or integrated into another device, and some functions may be ignored or not performed. Furthermore, the shown or discussed mutual couplings, direct couplings, or communication connections may be implemented via some interface. Indirect couplings or communication connections between devices or units may be implemented in electronic, mechanical, or other forms.

[0084] The units described as separate components may or may not be physically separated, and the components shown as units may be one or more physical units, located in one place or distributed in different places. Some or all of the units may be selected based on actual requirements to achieve the objectives of the solutions of the embodiments.

[0085] Furthermore, the functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit. The integrated unit may be implemented in the form of hardware or in the form of a software functional unit.

[0086] The above description is merely a specific implementation of the embodiments of the present application and is not intended to limit the protection scope of the embodiments of the present application. Any modifications or replacements within the technical scope disclosed in the present application shall be included in the protection scope of the embodiments of the present application. Therefore, the protection scope of the embodiments of the present application shall be subject to the protection scope of the claims.

Claims

1. An integrated device, the integrated device comprising: a circuit board, a first temperature sensor, and a humidity sensor; the first temperature sensor is configured to measure a temperature; the humidity sensor is configured to measure humidity; the temperature and the humidity are used to obtain a dew point temperature of an environment within the integrated device; The dew point temperature is used to determine the cooling mode of the integrated equipment. Integrated equipment.

2. the integrated device further includes a first processing module; The integrated device of claim 1 , wherein the first processing module is configured to calculate the dew point temperature based on the temperature data and the humidity data.

3. 3. The integrated device of claim 1, wherein the first temperature sensor is located on the circuit board.

4. 4. The integrated device of claim 1, wherein the humidity sensor is located on the circuit board.

5. the integrated device further includes a cooling plate and / or a second temperature sensor; the cooling plate is used for heat exchange of the integrated device; The integrated instrument of claim 1 , wherein the second temperature sensor is configured to measure the temperature of the cooling plate.

6. A cooling system comprising the integrated device according to any one of claims 1 to 5, cooling pipes, valves, and a heat exchange medium, the cooling pipe is configured to circulate the heat exchange medium; the heat exchange medium is configured to dissipate heat from the integrated device; The valve is configured to control opening and closing of the cooling pipe. Cooling system.

7. the cooling system further includes a second processing module; The cooling mode of the integrated device is:

7. The cooling system of claim 6, wherein the second processing module is configured to control the valve to open when the temperature of the heat exchange medium is higher than a dew point temperature or when the temperature of the heat exchange medium is higher than the sum of the dew point temperature and a first threshold value.

8. The cooling system of claim 7 , wherein the first threshold value is related to the accuracy of a temperature sensor and / or a humidity sensor.

9. 9. The cooling system of claim 6, wherein the valve is closed when the temperature of the heat exchange medium is equal to or lower than the dew point temperature or when the temperature of the heat exchange medium is equal to or lower than the sum of the dew point temperature and the first threshold value.

10. the cooling system further includes a third temperature sensor; 10. The cooling system of claim 6, wherein the third temperature sensor is configured to measure the temperature of the heat exchange medium.

11. A cooling method applied to a cooling system, the cooling system including an integrated device, a cooling pipe, a heat exchange medium, and a valve; The integrated device is powered on; the valve is opened after the integrated device is powered on for a first period of time; the cooling pipe circulates the heat exchange medium; the heat exchange medium dissipates heat from the integrated device; Cooling method.

12. A cooling method applied to a cooling system, the cooling system including integrated equipment, cooling pipes, valves, and a heat exchange medium; An ambient temperature of the integrated device is obtained; the valve is closed when the ambient temperature is below a second threshold; Cooling method.

13. When the ambient temperature is equal to or higher than the second threshold, if the power-on period of the integrated device is longer than the first period, The valve is opened, the cooling pipe circulates the heat exchange medium; The cooling method of claim 12 , wherein the heat exchange medium dissipates heat from the integrated equipment.

14. A cooling method applied to an integrated device, the integrated device including a circuit board, a first temperature sensor, and a humidity sensor; the first temperature sensor measures a temperature; the humidity sensor measures humidity; obtaining a dew point temperature of an environment within the integrated device based on the temperature and the humidity; determining a cooling mode for the integrated equipment based on the dew point temperature; Cooling method.

15. the integrated device further includes a first processing module; The cooling method of claim 14 , wherein the first processing module calculates the dew point temperature based on the temperature data and the humidity data.

16. 16. The cooling method of claim 14 or 15, wherein the first temperature sensor is located on the circuit board.

17. 17. The cooling method of claim 14, wherein the humidity sensor is located on the circuit board.

18. the integrated device further includes a cooling plate and / or a second temperature sensor; The cooling plate performs heat exchange for the integrated device; The cooling method according to claim 14 , wherein the second temperature sensor measures temperature data of the cooling plate.

19. A cooling method applied to a cooling system, the cooling system comprising an integrated device according to any one of claims 1 to 5, a cooling pipe, a valve, and a heat exchange medium, the cooling pipe circulates the heat exchange medium; the heat exchange medium dissipates heat from the integrated device; The valve controls opening and closing of the cooling pipe. Cooling method.

20. 20. The cooling method of claim 19, wherein the cooling system further includes a second processing module, and the second processing module controls the valve to open when the temperature of the heat exchange medium is higher than a dew point temperature or when the temperature of the heat exchange medium is higher than the sum of the dew point temperature and a first threshold value.

21. 21. The cooling method of claim 20, wherein the first threshold value is related to the accuracy of a temperature sensor and / or a humidity sensor.

22. 22. The cooling method of claim 19, wherein the valve is closed when the temperature of the heat exchange medium is less than or equal to the dew point temperature or when the temperature of the heat exchange medium is less than or equal to the sum of the dew point temperature and the first threshold value.

23. the cooling system further includes a third temperature sensor; 23. The cooling method of any one of claims 19 to 22, wherein the third temperature sensor measures the temperature of the heat exchange medium.

24. A terminal comprising the integrated device according to any one of claims 1 to 5 or the cooling system according to any one of claims 6 to 10. Terminal.

25. The terminal of claim 24, wherein the terminal is a vehicle.

26. 24. A computer readable storage medium configured to store a computer program, the computer program being configured to perform the method of any one of claims 11 to 23 when executed on a computer or processor. A computer-readable storage medium.

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