Power module and electronic device having power module

Abstract

A power module and an electronic device having the same are provided. The power module includes a power frame and multiple power chips. The power frame includes multiple islands. The islands include a die bond portion, a connection portion, a bent portion, a terrace portion, and a power pin, which are connected in this order in the width direction of the power module. The die bond portion, the connection portion, the bent portion, the terrace portion, and the power pin are integrally structured. The connection portion includes at least one oblique side, and the adjacent hypotenuses of two connection portions of adjacent islands extend in approximately the same direction. The bent portion is disposed at an angle relative to the terrace portion. The terrace portion of at least a central island among the multiple islands includes a chamfered portion on the side away from the power pin, and the orthogonal projection of the edge of the chamfered terrace portion of one island onto the plane in which the multiple islands are located and the orthogonal projection of the edge of the bent portion of the other adjacent island onto the plane in which the multiple islands are located extend in approximately the same direction. The multiple power chips are disposed on the die bond portions of the multiple islands.

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority to Chinese patent application having application number 202223074596.9, filed on November 17, 2022, Chinese patent application having application number 202321049262.8, filed on April 28, 2023, and Chinese patent application having application number 202310495811.2, filed on April 28, 2023, each of which is incorporated herein by reference in its entirety.

[0002] The present disclosure relates to the field of electronic device technology, and more particularly to a power module and an electronic device having the same. [Background technology]

[0003] Electronic devices typically incorporate a power module to realize their functional applications. The power module, packaged in a molded resin, includes a power chip and a driver chip for driving the power chip. As electronic devices become more widespread, there is an increasing demand for smaller power modules in applications. Summary of the Invention [Means for solving the problem]

[0004] In one aspect, a power module is provided that includes a power frame and multiple power chips. The power frame includes multiple islands. Each island includes a die bond portion, a connection portion, a bent portion, a terrace portion, and a power pin, which are connected in this order along the width direction of the power module. The die bond portion, the connection portion, the bent portion, the terrace portion, and the power pin are integrally formed. The connection portion includes at least one oblique side, and adjacent hypotenuses of two connection portions of adjacent islands extend in approximately the same direction. The bent portion is disposed at an angle relative to the terrace portion. The terrace portion of at least a central island among the multiple islands includes a chamfered portion on the side away from the power pin, and the orthogonal projection of the edge of the chamfered portion of one island onto the plane in which the multiple islands are located and the orthogonal projection of the edge of the bent portion of the other adjacent island onto the plane in which the multiple islands are located extend in approximately the same direction. The multiple power chips are disposed on the die bond portions of the multiple islands.

[0005] In another aspect, an electronic device is provided that includes the power module described above. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a plan view of a power module according to some embodiments of the present disclosure. [Figure 2] FIG. 1 is a diagram illustrating a configuration of multiple islands according to some embodiments of the present disclosure. [Figure 3] FIG. 2 is another plan view of a power module in accordance with some embodiments of the present disclosure. [Figure 4] FIG. 1 is a cross-sectional view of a power module according to some embodiments of the present disclosure. [Figure 5] FIG. 10 is a cross-sectional view of another power module in accordance with some embodiments of the present disclosure. [Figure 6] FIG. 1 is a schematic diagram of a packaging process for a power module in the prior art. [Figure 7]FIG. 1 is a schematic diagram of a packaging process for a power module in the prior art. [Figure 8] FIG. 10 is a diagram illustrating a configuration in which an ejector pin supports a power frame in a sealing mold according to some embodiments of the present disclosure. [Figure 9] 10A and 10B are diagrams illustrating a configuration in which an ejector pin in a sealing mold according to some embodiments of the present disclosure is separated from a power frame. [Figure 10] 1 is a schematic diagram of a packaging process according to some embodiments of the present disclosure. [Figure 11] 1 is a schematic diagram of a packaging process according to some embodiments of the present disclosure. [Figure 12] 1 is a schematic diagram of a packaging process according to some embodiments of the present disclosure. [Figure 13] FIG. 10 is a distribution diagram of first remaining portions in a power module according to some embodiments of the present disclosure. [Figure 14] FIG. 10 is a diagram illustrating a configuration in which adjacent first remaining portions are in contact with each other in a power module according to some embodiments of the present disclosure. [Figure 15] FIG. 10 is yet another plan view of a power module in accordance with some embodiments of the present disclosure. [Figure 16] FIG. 10 is a distribution diagram of second remaining portions in a power module according to some embodiments of the present disclosure. [Figure 17] FIG. 10 is a distribution diagram of first remaining portions and second remaining portions in a power module according to some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, several embodiments of the present disclosure will be clearly and completely described with reference to the drawings, but it is clear that the described embodiments are only some of the embodiments of the present disclosure and do not include all of the embodiments. All other embodiments that can be obtained by those skilled in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

[0008] Unless the context dictates otherwise, in the specification and claims, the term "comprise" and other forms thereof, such as the third-person singular "comprises" and the present participle "comprising," are intended to be interpreted in an open and inclusive sense, i.e., "including, but not limited to." In the description, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. General references to the above terms do not necessarily refer to the same embodiment or example. Furthermore, a particular feature, structure, material, or characteristic described may be included in any one or more embodiments or examples in any appropriate manner.

[0009] Hereinafter, the terms "first" and "second" are for descriptive purposes only and should not be understood as indicating or suggesting the relative importance or implicitly indicating the number of technical features indicated. Thus, features qualified by "first" and "second" can explicitly or implicitly include one or more of such features. In describing the embodiments of the present disclosure, "plurality" means two or more, unless otherwise specified.

[0010] In describing some embodiments, the term "connected" and its derivatives may be used. For example, in describing some embodiments, the term "connected" is used to mean that two or more elements are in direct physical or electrical contact. The embodiments disclosed herein are not necessarily limited to the present specification.

[0011] "A and / or B" includes the three combinations of A only, B only, and A and B in combination.

[0012] As used herein, "about," "approximately," or "approximate" includes the stated value and the mean within a range of acceptable deviation from the particular value, which range of acceptable deviation would be determined by one of ordinary skill in the art taking into account the measurement under consideration and the error associated with measuring the particular quantity (i.e., limitations of the measurement system).

[0013] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views as idealized, exemplary drawings. In the drawings, thicknesses of layers and regions are exaggerated for clarity. The exemplary embodiments of the present disclosure should not be construed as limited to the shapes of regions shown herein and include, for example, shape deviations due to manufacturing. For example, an etched region shown as a rectangle typically has curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes do not represent the actual shapes of regions of a device, nor do they limit the scope of the exemplary embodiments.

[0014] Electronic devices typically incorporate a power module to realize their functions. The power module may include a power frame with a power chip mounted thereon and a driver frame with a driver chip mounted thereon, packaged together using a molded resin package. The power frame of the power module may include a plurality of die pads spaced apart from one another, each of which requires welding to a corresponding pin. However, ensuring sufficient welding strength requires relatively large dimensions for the welded portions between the die pads and the corresponding pins, which in turn increases the overall size of the power module, making it difficult to meet the demand for a compact design of the power module.

[0015] In light of the above, an embodiment of the present disclosure provides a power module. As shown in FIGS. 1 to 5, the power module 10 includes a plurality of power chips 100 and a power frame 20. The power frame 20 includes a plurality of islands 200, each including a die bond portion 210, a connection portion 220, a bent portion 230, a terrace portion 240, and a power pin 250, which are connected in this order in the width direction Y of the power module 10. The die bond portion 210, the connection portion 220, the bent portion 230, the terrace portion 240, and the power pin 250 are integrally structured. The power chip 100 is disposed on the die bond portion 210 of the island 200.

[0016] It should be understood that the power frame 20 can provide space for arranging multiple power chips 100, which makes the arrangement of multiple power chips 100 on the power frame 20 easier and more stable to assemble. The number of power chips 100 arranged in each island 200 of the power frame 20 can be designed according to actual needs. For example, some islands can be used to arrange south bridge chips in an inverter circuit, and other islands can be used to arrange north bridge chips in the inverter circuit.

[0017] The die bond portion 210 is configured to provide a position for placement of the power chip 100. The connection portion 220 is connected between the die bond portion 210 and the bent portion 230, the bent portion 230 is connected between the connection portion 220 and the terrace portion 240, and one end of the power pin 250 is connected to the terrace portion 240.

[0018] Since the dimension of the connection portion 220 in the longitudinal direction X of the power module 10 is larger than the dimension of the die bond portion 210 in the longitudinal direction X of the power module 10, in order to design the power module 10 in a compact size, the connection portion 220 includes at least one oblique side 221, and the adjacent oblique sides 221 of two connection portions 220 of adjacent islands 200 may extend in the same or approximately the same direction, for example, parallel to each other. In this way, the distance between adjacent islands 200 can be reduced, and the structure of the power frame 20 can be made relatively compact, thereby improving space efficiency.

[0019] In addition, in the plane on which the multiple islands 200 are located, the extension direction of the die bond portion 210, connection portion 220, bent portion 230, terrace portion 240, and power pin 250, which form an integral structure, is the width direction Y of the power module 10, and the arrangement direction of the multiple islands 200 is the longitudinal direction X of the power module 10. The direction perpendicular to the plane on which the multiple islands 200 are located is the thickness direction Z of the power module 10, and this thickness direction Z may be, for example, the direction from the power chip 100 to the power frame 20, or vice versa. Here, the longitudinal direction X intersects with the width direction Y, for example, being perpendicular, and both the longitudinal direction X and the width direction Y are perpendicular to the thickness direction Z.

[0020] In addition, the bending portion 230 is arranged at an angle relative to the terrace portion 240, and the terrace portion 240 of at least the central island 200 among the multiple islands 200 includes a chamfered portion 241 arranged on the side away from the power pin 250, and the orthogonal projection of the edge of the chamfered portion 241 of the terrace portion 240 of one island 200 onto the plane in which the multiple islands 200 are located and the orthogonal projection of the edge of the bending portion 230 of the other adjacent island 200 onto the plane in which the multiple islands 200 are located extend in the same or approximately the same direction, and are, for example, parallel to each other.

[0021] It should be understood that along the thickness direction Z of the power module 10, the terrace portion 240 is higher than the connection portion 220, and the bent portion 230 is connected between the terrace portion 240 and the connection portion 220.

[0022] The bent portion 230 being disposed at an angle with respect to the terrace portion 240 means that the orthogonal projection of the side of the bent portion 230 onto the plane on which the power chip 100 is located intersects with the orthogonal projection of the side of the terrace portion 240 onto the plane on which the power chip 100 is located. For example, the angle formed by the orthogonal projection of the side of the bent portion 230 onto the plane on which the power chip 100 is located and the orthogonal projection of the side of the terrace portion 240 onto the plane on which the power chip 100 is located is an obtuse angle, for example, 100° to 170°.

[0023] In this way, it is possible to ensure that the bending portion 230, located between the connecting portion 220 and the terrace portion 240, forms a certain inclination angle with respect to the terrace portion 240 so that the bending portion 230 is connected obliquely between the two. This not only makes it possible to avoid an increase in the dimension of the connecting portion 220 in the longitudinal direction X of the power module 10 due to the need to connect the connecting portion 220 and the terrace portion 240, but also makes it possible to reduce the dimension of the connecting portion between the connecting portion 220 and the bending portion 230 in the longitudinal direction X of the power module 10, which is advantageous for making the structure of the power frame 20 more compact.

[0024] When the side of the chamfered portion 241 of the terrace portion 240 of one island 200 is parallel to the side of the folded portion 230 of the other adjacent island 200, this means that the orthogonal projection of the side of the chamfered portion 241 of the terrace portion 240 of one island 200 onto the plane on which the power chip 100 is located is parallel to the orthogonal projection of the side of the folded portion 230 of the other adjacent island 200 onto the plane on which the power chip 100 is located.

[0025] In this way, the bent portion 230 arranged at an angle on one island 200 and the terrace portion 240 provided with the chamfered portion 214 on the adjacent island 200 work together to bring the terrace portion 240 closer to the connecting portion 220 in the width direction Y of the power module 10 while maintaining an insulating distance between the terrace portion 240 and the bent portion 230, thereby reducing the overall dimension of the bent portion 230 and the terrace portion 240 in the width direction Y of the power module 10 and making the structure of the power frame 20 more compact. In this way, space efficiency can be further improved and a more compact design of the power module 10 can be realized.

[0026] The die bond portion 210, the connecting portion 220, the bending portion 230, the terrace portion 240, and the power pins 250 of the same island 200 may be integrally formed. For example, the island 200 may be an integrally molded copper frame, and the die bond portion 210, the connecting portion 220, the bending portion 230, the terrace portion 240, and the power pins 250 correspond to different portions of the copper frame. In this manner, the manufacturing process of the power frame 20 can be reduced, simplifying the production flow of the power frame 20. Furthermore, the connection strength between the die bond portion 210, the connecting portion 220, the bending portion 230, the terrace portion 240, and the power pins 250 can be improved, thereby improving the reliability and usability of the power frame 20.

[0027] In the power module 10 according to the embodiment of the present disclosure, an island 200 consisting of a die bond portion 210, a connection portion 220, a bending portion 230, a terrace portion 240, and a power pin 250 is used as the function derivation structure of the power chip 100, thereby making it possible to reduce the distance between adjacent islands 200 and the dimension of the island 200 in the width direction Y of the power module 10, thereby making the structural design of the power frame 20 more compact, improving the space efficiency of the power frame 20, and realizing a miniaturized design of the power module 10.

[0028] 1 and 2 , the multiple islands 200 of the power frame 20 include a first island 201, a second island 202, a third island 203, and a fourth island 204. The first island 201, the second island 202, the third island 203, and the fourth island 204 are sequentially spaced apart in the longitudinal direction X of the power module 10. The second island 202 and the third island 203 are located between the first island 201 and the fourth island 204. The connection portion 220 of the first island 201 and the connection portion 220 of the fourth island 204 each have one hypotenuse 221, and the connection portion 220 of the second island 202 and the connection portion 220 of the third island 203 each have two hypotenuses 221. The adjacent hypotenuses 221 of the two connection portions 220 of adjacent islands 200 are parallel to each other.

[0029] For example, the hypotenuse 221 of the connection portion 220 of the first island 201 is parallel to the hypotenuse 221 of the connection portion 220 of the second island 202 that is close to the first island 201, the hypotenuse 221 of the connection portion 220 of the second island 202 that is close to the third island 203 is parallel to the hypotenuse 221 of the connection portion 220 of the third island 203 that is close to the second island 202, and the hypotenuse 221 of the connection portion 220 of the third island 203 that is close to the fourth island 204 is parallel to the hypotenuse 221 of the connection portion 220 of the fourth island 204. Alternatively, the hypotenuses 221 of the islands 200 may all be parallel to each other. Alternatively, the hypotenuses 221 of the islands 200 do not have to be completely parallel.

[0030] 1, the terrace portion 240 of the first island 201, the terrace portion 240 of the second island 202, and the terrace portion 240 of the third island 203 all include a chamfered portion 241. In the first island 201, the second island 202, and the third island 203, the side of the chamfered portion 241 of the terrace portion 240 of one island 200 is parallel to the side of the bent portion 230 of the other adjacent island 200.

[0031] For example, the side of the chamfered portion 241 of the terrace portion 240 of the first island 201 is parallel to the side of the bent portion 230 of the second island 202, the side of the chamfered portion 241 of the terrace portion 240 of the second island 202 is parallel to the side of the bent portion 230 of the third island 203, and the side of the chamfered portion 241 of the terrace portion 240 of the third island 203 is parallel to the side of the bent portion 230 of the fourth island 204.

[0032] It should be understood that if no other island is arranged on the side of the fourth island 204 away from the third island 203 in the longitudinal direction X of the power module 10, then it is not necessary to provide a chamfer on the terrace portion 240 of the fourth island 204. Naturally, if another island is arranged on the side of the fourth island 204 away from the third island 203, then the chamfered portion 241 may be provided on the terrace portion 240 of the fourth island 204, and the bent portion of the other island may be arranged at an angle like the bent portion 230 of the fourth island 204, thereby realizing a compact power frame 20.

[0033] 1, the power frame 20 may further include a plurality of pads 205 arranged on a side of the first island 201 away from the second island 202 along the longitudinal direction X of the power module 10. The plurality of pads 205 also include a terrace portion and a pin portion, and the terrace portion of the pad 205 closest to the first island 201 has a chamfered portion parallel to the side of the bent portion 230 of the first island 201 on the side away from the pin portion.

[0034] For example, the power frame 20 may include a first island 201 to a fourth island 204 and three pads 205 arranged on a side of the first island 201 away from the second island 202. The pins corresponding to the three pads 205 may be DC (direct current) input pins of UV and W phases in the power module 10, and the power pins 250 corresponding to the first island 201 to the fourth island 204 may be DC output pins of UV and W phases in the power module 10.

[0035] With the above arrangement, the side of the chamfered portion 241 of the terrace portion 240 of one island 200 is parallel to the side of the folded portion 230 of the other adjacent island 200, and the side of the chamfered portion of the terrace portion of the pad closest to the first island 201 is parallel to the side of the folded portion 230 of the first island 201, thereby reducing the dimension of the power module 10 of the power frame 20 in the width direction Y and making the structure of the power frame 20 more compact.

[0036] 1 , the folded portions 230 of at least two of the islands 200 are arranged in parallel, for example, at least two of the folded portions 230 of the first island 201, the second island 202, the third island 203, and the fourth island 204 are arranged in parallel. In this manner, by arranging at least two of the folded portions 230 of the first island 201, the second island 202, the third island 203, and the fourth island 204 in parallel, the structural design of the power frame 20 can be simplified and the structure of the power module 10 can be made compact.

[0037] For example, in order to make the structure of the power frame 20 more compact, the bent portions 230 of each island 200, for example, the bent portions 230 of the first island 201, the second island 202, the third island 203, and the fourth island 204, are all arranged in parallel, thereby greatly simplifying the structural design.

[0038] In some embodiments, as shown in FIGS. 1, 4, and 5, multiple power chips 100 may be disposed on the die bonds 210 of each island 200 of the power frame 20. For example, the multiple power chips 100 may include three first power chips, e.g., low-voltage power chips, and three second power chips, e.g., high-voltage power chips. The three first power chips are disposed on the first island 201, the second island 202, and the third island 203, respectively, and the three second power chips are all disposed on the fourth island 204, and the three second power chips are disposed at intervals in the longitudinal direction X of the power module 10. That is, one first power chip is disposed on each of the first island 201, the second island 202, and the third island 203, and three second power chips are disposed on the fourth island 204.

[0039] In this way, the first island 201, the second island 202, and the third island 203 can provide locations for the construction of low-voltage power chips, and the fourth island 204 can provide a location for the construction of high-voltage power chips. Since multiple high-voltage power chips are all integrated into the fourth island 204, space can be saved and the structure of the power module 10 can be made more compact. In addition, the low-voltage power chips and the high-voltage power chips are spaced apart, which not only satisfies the power demands of different circuits but also prevents mutual interference between different power areas, thereby ensuring the stability and reliability of the power chips.

[0040] For example, the power chip 100 may include an IGBT (Insulated Gate Bipolar Transistor) chip, an FRD (Fast Recovery Diode) chip, a combination of an IGBT chip and an FRD chip, or an RC-IGBT (Reverse-Conducting Insulated Gate Bipolar Transistor) chip that incorporates an FRD chip into an IGBT chip. This allows at least one of the IGBT chip, the FRD chip, and the RC-IGBT chip to be selected and used as needed, improving usability.

[0041] 1 , multiple power chips 100 are arranged on the fourth island 204, so that the area of ​​the fourth island 204 is larger than the areas of the first island 201, the second island 202, and the third island 203. Considering that smaller islands are more easily bonded to the resin than larger islands when the power frame 20 is sealed with a molding resin, at least the fourth island 204 among the first island 201, the second island 202, the third island 203, and the fourth island 204 is provided with at least one first through-hole 206. In this way, the strength of the island 200, which is made up of the die bond portion 210, the connection portion 220, the bent portion 230, the terrace portion 240, and the power pins 250, can be ensured, while the bond between the island and the resin can be improved, thereby ensuring the reliability of the power frame 20.

[0042] For example, as shown in FIG. 1 , the area of ​​the fourth island 204 is larger than the area of ​​the first island 201, the area of ​​the second island 202, and the area of ​​the third island 203. In addition, since the first island 201 and the fourth island 204 are located on both sides of the second island 202 and the third island 203, the area of ​​the connection portion of the first island 201 is larger than the area of ​​the connection portion of the second island 202 and the area of ​​the connection portion of the third island 203. In this case, the fourth island 204 and the first island 201 each have a first through hole 206. One first through hole 206 may be arranged in the first island 201, and multiple first through holes 206 may be arranged in the fourth island 204. Here, the first through hole 206 may be an elongated through hole, for example, a long hole. In this way, the opening of the first through-hole 206 can be ensured to be sufficiently large, and the reliability of the bond between the island and the resin can be further ensured.

[0043] For example, the first island 201 may be provided with one first through hole 206, and the first through hole 206 is located on the side of the connection portion 220 of the first island 201 that is close to the die bond portion 210. Alternatively, the fourth island 204 may be provided with a plurality of first through holes 206, and one of the first through holes 206 is located on the side of the connection portion 220 of the fourth island 204 that is close to the die bond portion 210, and any one of the remaining first through holes 206 is located in a part of the region of the fourth island 204 that corresponds to the space between adjacent power chips 100.

[0044] The position of the first through-holes 206 can be adjusted according to the design requirements of the power frame 20 and the structural design of the power module 10, thereby enabling the power module 10 to be configured compactly.

[0045] 1, the terrace portion 240 of the island 200 includes a first notch 242 disposed adjacent to the bend 230 of the terrace portion 240, for example, adjacent to a connection point between the bend and the terrace portion 240. For example, the first notch 242 disposed in the terrace portion 240 may be a U-shaped notch.

[0046] In this manner, the placement of the first notch 242 in the terrace portion 240 is advantageous for releasing stamping stress when bending the power pin 250 during construction of the power frame 20, thereby improving the structural strength and usability of the power frame 20.

[0047] In some embodiments, as shown in Figure 1, the terrace portion 240 of the island 200 is provided with a second through-hole 243 disposed on a side of the terrace portion 240 adjacent to the power pin 250. For example, the second through-hole 243 disposed on the terrace portion 240 may be a circular hole or an elliptical hole.

[0048] In this manner, the arrangement of the second through-holes 243 can improve the bonding between the island and the resin, ensuring the reliability of use of the power frame 20. Furthermore, the second through-holes 243 are arranged on the side of the terrace portion 240 close to the power pins 250, i.e., at the edge position close to the outward extending portion, preventing external air and moisture from entering the vicinity of the power chip 100 along the island 200 and ensuring the reliability of the power chip 100. Furthermore, since the terrace portion 240 is configured to provide a position for welding the wiring for connecting the power chip 100, the arrangement of the second through-holes 243 at the edge position close to the outward extending portion can avoid the position for wiring welding.

[0049] 1, the power pin 250 of the island 200 has an isolation portion 251 disposed adjacent to the connection point with the terrace portion. For example, the isolation portion 251 disposed on the power pin 250 may include a plurality of parallel grooves.

[0050] In this way, the arrangement of the isolation portion 251 increases the wettability of the power pin 250, blocks external air and moisture from entering the vicinity of the power chip 100 along the island 200, and ensures the reliability of the power chip 100.

[0051] 1 to 5, the power module 10 may further include a driver frame 400 and a driver chip 300. The driver chip 300 drives the power chip 100 to realize the functions of the power module 10.

[0052] The driver frame 400 may include a plurality of driver pins 500 arranged at intervals in the longitudinal direction X of the power module 10. The driver pins 500 and the power pins 250 are arranged on both sides of the power module 10 in the width direction Y. The plurality of driver pins 500 and the plurality of power pins 250 are both arranged at intervals in the longitudinal direction of the power module 10. The driver chip 300 may be arranged on the driver frame 400. That is, the driver frame 400 may further include, in addition to the plurality of driver pins 500, welding portions for providing welding positions for the driver chip 300.

[0053] The plurality of driver pins 500 and the welds for providing the welding positions for the driver chip 300 may be an integral structure. For example, the plurality of driver pins 500 may be connected to the welds of the driver frame 400, that is, the plurality of driver pins 500 may constitute the driver frame 400 together with the above-mentioned welds. In this way, the connection structure of the driver frame can be made more reliable, and the performance of the driver chip 300 can be guaranteed.

[0054] 1 to 5, the power module 10 further includes a package 600. The package 600 is disposed outside the driver frame 400 and the power frame 20, and both the free ends of the driver pins 500 and the free ends of the power pins 250 protrude from the package 600.

[0055] As a result, the package 600 arranged outside the driver frame 400 and the power frame 20 plays a protective role, making the assembly of the driver frame 400 and the power frame 20 more reliable, and also providing good protection for the driver chip 300 and the power chip 100, thereby improving the usability and reliability of the power module 10.

[0056] 3 and 4, the power module 10 may further include a heat sink 700 and an insulating resin layer 800. The insulating resin layer 800 is disposed on the surface of the power frame 20 away from the power chip 100, and the heat sink 700 is disposed on the surface of the insulating resin layer 800 away from the power frame 20, such that the bottom surface of the heat sink 700 away from the insulating resin layer 800 is flush with the bottom surface of the package 600 so that the bottom surface of the heat sink 700 is exposed to the bottom surface of the package 600.

[0057] For example, the heat sink 700 may be made of a metal material with excellent heat dissipation properties, and the insulating resin layer 800 may be made of an insulating resin material with excellent thermal conductivity. The insulating resin layer 800 is disposed between the heat sink 700 and the power frame 20, with the edges of the insulating resin layer 800 aligned with the edges of the heat sink 700 and the bottom surface of the heat sink 700 exposed from the package 600. In this way, the insulating resin layer 800 can be used to transfer heat generated during operation of the power chip 100 to the heat sink 700 and quickly dissipate the heat via the heat sink 700, thereby ensuring good heat dissipation properties of the power module 10 while avoiding current leakage and improving the reliability and usability of the power module 10.

[0058] The power module 10 has a package structure in which its main body structure (including the driver frame 400, driver chips 300, power frame 20, and power chips 100) is packaged by molding. For example, the main body structure of the power module 10 is placed in the cavity of a sealing mold, and liquid resin is injected into the cavity of the sealing mold. After the resin hardens, the external package 600 can be formed. The packaging effect of the package structure affects the reliability of the connection between the frame and the chips mounted thereon, and the connection between the chips themselves, and this reliability of the connection further affects the performance of the power module 10.

[0059] To achieve a compact design for the power module 10 while ensuring a good packaging effect, it is necessary to design the distance d from the underside of the power frame 20 to the underside of the cavity of the sealing mold when packaging the main structure of the power module 10. The larger this distance d, the easier it is to fill the resin. However, in conventional technology, as shown in Figures 6 and 7, the fluidity of the resin can cause the power frame 20 to deform under the pressure of the resin, resulting in a small distance d. At the same time, the low thermal conductivity of the resin results in poor heat dissipation from the package structure, and small holes are easily formed in the thinned areas of the cavity due to the pressure of the resin, making the package unusable.

[0060] Based on the above, as shown in Figures 8 and 9, the sealing mold 90 may include a cavity 900, an ejector plate 910 arranged below the cavity 900, a sleeve 920 located inside the cavity 900 and adjacent to the ejector plate 910, and an ejector pin 930.

[0061] When the power module 10 is sealed with mold resin, as shown in FIGS. 8 to 12, the ejector pins 930 in the sealing mold 90 are passed through an ejector plate 910 and a sleeve 920 to support the power frame 20 from below (the side away from the power chip 100) in the thickness direction Z of the power module 10. This prevents the power frame 20 from being deformed by the pressure of the flowing resin, and prevents the formation of small holes. When the resin begins to harden, the ejector pins 930 begin to return. After the package is completed, the sealing mold is completely removed, and multiple dimples are formed on the underside of the package 600. For example, the ejector pins 930 are passed through the ejector plate 910 and the sleeve 920 and fixed by a bottom plate. They are protruded when power is applied to the ejector rod from the oil passage, and return to their original position by the action of a return spring or a reverse oil passage after the power to the oil passage is cut off.

[0062] To prevent the resin from filling the inside of the sleeve 920, the return positions of the sleeve 920 and the ejector pins 930 are usually higher than the bottom surface of the cavity. Therefore, it should be understood that two circular, nested annular grooves (the sleeve 920 corresponds to the outer circle, and the ejector pins 930 correspond to the inner circle) are ultimately formed on the bottom surface of the package 600, i.e., the first remaining portion 62 described below. Furthermore, the ejector pins 930 are designed to be extendable and retractable. They first support the power frame 20 to prevent deformation during resin filling, and then retract when resin filling is completed and holding pressure begins, completing the entire flow of the molded package. When the ejector pins 930 retract, resin filling is completed, so deformation of the power frame 20 can be prevented.

[0063] Accordingly, as shown in FIGS. 4 and 13 , the package 600 has a first surface 610, which is one of the two surfaces and is relatively far from the power chip 100, and a second surface 620, which is one of the two surfaces and is relatively close to the power chip 100. The upper surface of the island 200 (i.e., the surface adjacent to the first surface 610) is used to place the power chip 100, and the lower surface of the island 200 (i.e., the surface adjacent to the second surface 620) is the surface supported by the ejector pins 930 during the packaging process, as described above. Here, a plurality of first remaining portions 62 are arranged on the second surface 620 of the package 600. In the thickness direction Z of the power module 10, each of the islands 200 corresponds to at least one first remaining portion 62. Along the longitudinal direction X of the power module 10, the first remaining portions 62 corresponding to two adjacent islands 200 are arranged so as to be shifted from each other.

[0064] The correspondence between the island 200 and the first remaining portion 62 means that the orthogonal projection of the first remaining portion 62 onto the island 200 in the thickness direction Z of the power module 10 is located within the island 200. The first remaining portion 62 is essentially a recess left in the packaging process, and therefore the distribution of the first remaining portions 62 in the package 600 corresponds to the distribution of the support positions of the ejector pins in the sealing mold.

[0065] Here, being arranged with the first remaining portions 62 corresponding to two adjacent islands 200 shifted from each other means that the first remaining portion 62 corresponding to one island 200 and the first remaining portion 62 corresponding to the other adjacent island 200 are not on the same straight line in the longitudinal direction X of the power module 10. Furthermore, when the same island 200 corresponds to multiple first remaining portions 62, the multiple first remaining portions 62 may or may not be located on the same straight line, and this is not particularly limited here.

[0066] For example, in the thickness direction Z of the power module 10, the first island 201, the second island 202, and the third island 203 may each correspond to one first remaining portion 62, and the fourth island 204 may correspond to two first remaining portions 62. Here, the two first remaining portions 62 corresponding to the fourth island 204 may be located on the same straight line. The first remaining portion 62 may be, for example, an annular groove.

[0067] 13 and 14 , the first remaining portions 62 corresponding to two adjacent islands 200 are arranged offset from each other in the longitudinal direction X of the power module 10, thereby preventing interference between adjacent enlarged holes in the ejector plate 910 during the packaging process (see FIG. 14 ). This prevents damage to the ejector plate 910 when the ejector pins 930 are retracted, ensures the strength of the ejector plate without changing the distance between adjacent islands 200 in the longitudinal direction X of the power module 10, and enables a compact design of the power module 10. In addition, because the area of ​​the fourth island 204 is relatively large, the fourth island 204 is arranged corresponding to the two first remaining portions 62, and two ejector pins 930 can be used to support the fourth island 204 during the packaging process to prevent tilting of the fourth island 204 and maintain balance of the fourth island 204.

[0068] 15 , in the width direction Y of the power module 10, the first remaining portion 62 may be disposed in a portion corresponding to the side of the die bond portion 210 of the package away from the power pins 250. In this way, during the packaging process, interference between the power pins 250 and the ejector pins 930 corresponding to the multiple first remaining portions 62 can be avoided, and since it is advantageous for the ejector pins 930 to support the island 200 at positions away from the power pins 250, changes in the position of the island 200 can be better avoided.

[0069] 13 , the center-to-center distance d1 in the width direction Y of the power module 10 between the first remaining portions 62 corresponding to two adjacent islands 200 is 1.3 mm or more, i.e., d1 satisfies d1≧1.3 mm. And / or the minimum distance d2 between the first remaining portions 62 corresponding to two adjacent islands 200 is 3.292 mm or more, i.e., d2 satisfies d2≧3.292 mm. By optimizing and adjusting the position of the ejector pin 930 based on the above design, packaging of multiple islands 200 can be achieved when using ejector pins 930 of the same specifications.

[0070] For example, the center distance d1 in the width direction Y of the power module 10 between the first remaining portions 62 corresponding to two adjacent islands 200 is 1.3 mm, 1.4 mm, or 1.5 mm, and the minimum distance d2 between the first remaining portions 62 corresponding to two adjacent islands 200 is 3.292 mm, 3.293 mm, or 3.294 mm.

[0071] For example, the first island 201, the second island 202, and the third island 203 may each correspond to one first remaining portion 62, and the fourth island 204 may correspond to two first remaining portions 62. The first remaining portion 62 corresponding to the first island 201 and the first remaining portion 62 corresponding to the third island 203 are located on the same straight line, and the first remaining portion 62 corresponding to the second island 202 and the two first remaining portions 62 corresponding to the fourth island 204 are located on another straight line, and these two straight lines are parallel and spaced 1.3 mm apart. When the diameter of the enlarged hole in the ejector plate 910 is 4.5 mm, interference between adjacent enlarged holes in the ejector plate 910 can be avoided, ensuring the strength of the ejector plate and realizing a long lifespan of the sealing mold, and the position of the first remaining portion 62 can be designed so as to keep constant the distance in the longitudinal direction X and the distance in the width direction Y of the power modules 10 of adjacent islands 200, thereby realizing a compact design of the power module 10.

[0072] 13 , the center distance d3 in the longitudinal direction X of the power module 10 between the first remaining portions 62 corresponding to two adjacent islands 200 is less than 4.5 mm, i.e., d3 satisfies d3<4.5 mm. For example, the center distance d3 in the longitudinal direction X of the power module 10 between the first remaining portions 62 corresponding to two adjacent islands 200 is 4.5 mm, 4.3 mm, or 4.2 mm.

[0073] For example, if the diameter of the enlarged hole in the ejector plate 910 is 4.5 mm, and the center distance d3 in the longitudinal direction X of the power module 10 between the first remaining portions 62 corresponding to two adjacent islands 200 is 4.5 mm or more, there will be no problem of interference between the adjacent enlarged holes, and the first remaining portions 62 can be directly positioned in the longitudinal direction X of the power module 10. However, if the center distance d3 in the longitudinal direction X of the power module 10 between the first remaining portions 62 corresponding to two adjacent islands 200 is less than 4.5 mm, the adjacent enlarged holes will interfere with each other, and therefore it will be necessary to adopt the misalignment design according to the embodiment of the present disclosure.

[0074] In this way, by setting the center distance d3 in the longitudinal direction X of the power module 10 between the first remaining portions 62 corresponding to two adjacent islands 200 to less than 4.5 mm, it is possible to ensure the realization of a compact design for the power module 10. In addition, the position of the first remaining portions 62 can be designed based on the center distance d3 in the longitudinal direction X of the power module 10 between the first remaining portions 62 corresponding to two adjacent islands 200 and the minimum distance d2 between the first remaining portions 62 corresponding to two adjacent islands 200.

[0075] For example, by setting the center distance d3 in the longitudinal direction X of the power module 10 between the first remaining portions 62 corresponding to two adjacent islands 200 to 4.3 mm, setting the minimum distance d2 between the first remaining portions 62 corresponding to two adjacent islands 200 to 3.292 mm, and setting the diameter of the enlarged hole to 4.5 mm, the distribution positions of the first remaining portions 62 can be designed to avoid interference between adjacent first remaining portions 62, and a compact design of the power module 10 can be achieved.

[0076] In some embodiments, as shown in FIG. 15 , a line connecting the centers of the first remaining portions 62 corresponding to at least two of the plurality of islands 200 can extend along the longitudinal direction X of the power module 10.

[0077] The multiple islands 200 are arranged at intervals in the longitudinal direction X of the power module 10, and a line connecting the centers of the first remaining portions 62 corresponding to at least two islands 200 extends along the longitudinal direction X of the power module 10, so that at least some of the first remaining portions 62 are located on the same straight line. In the width direction Y of the power module 10, the first remaining portions 62 of the multiple islands 200 can have the same distance to the straight line on which the edges of the multiple islands 200 that are close to the driver frame 400 are located. This makes the load positions of the multiple islands 200 the same, improving the uniformity of the load on the power frame 20 and improving the reliability of the molding of the power module 10.

[0078] 15 , the plurality of islands 200 may include a plurality of odd-numbered islands 200 (e.g., a first island 201 and a third island 203) and a plurality of even-numbered islands 200 (e.g., a second island 202 and a fourth island 204), and the plurality of odd-numbered islands 200 and the plurality of even-numbered islands 200 are alternately arranged in the longitudinal direction X of the power module 10. Here, a line 63 connecting the centers of the first remaining portions 62 corresponding to the plurality of odd-numbered islands 200 and a line 64 connecting the centers of the first remaining portions 62 corresponding to the plurality of even-numbered islands 200 both extend along the longitudinal direction X of the power module 10 and are both located on the same side of a central axis 66 in the width direction Y of the power module 10.

[0079] For example, the plurality of odd-numbered islands 200 include a first island 201 and a third island 203, and the plurality of even-numbered islands 200 include a second island 202 and a fourth island 204. The first island 201, the second island 202, the third island 203, and the fourth island 204 are arranged sequentially at intervals in the longitudinal direction X of the power module 10. Here, a line connecting the centers of the first remaining portion 62 corresponding to the first island 201 and the first remaining portion 62 corresponding to the third island 203 is located on a straight line, and a line connecting the centers of the first remaining portion 62 corresponding to the second island 202 and the first remaining portion 62 corresponding to the fourth island 204 is located on another straight line, and these two straight lines are parallel to each other and extend along the longitudinal direction X of the power module 10, and are both located on the same side of the central axis of the power module 10 in the width direction.

[0080] The first remaining portions 62 corresponding to the plurality of odd-numbered islands 200 and the first remaining portions 62 corresponding to the plurality of even-numbered islands 200 are arranged alternately in the longitudinal direction X of the power module 10. The enlarged holes in the ejector plate 910 formed by the ejector pins 930 correspond to the plurality of odd-numbered islands 200 and the plurality of even-numbered islands 200, and therefore these enlarged holes are arranged alternately in the longitudinal direction X of the power module 10 in the ejector plate 910. In this way, stress concentration on the ejector plate 910 is prevented, the strength of the ejector plate 910 is ensured, and the uniformity of the load on the power frame 20 is improved, which is advantageous to the reliability of molding of the power module 10. In addition, by positioning all of the first remaining portions 62 on the same side of the widthwise central axis of the power module 10 so that the straight line connecting the centers of the first remaining portion 62 corresponding to the first island 201 and the first remaining portion 62 corresponding to the third island 203 and the straight line connecting the centers of the first remaining portion 62 corresponding to the second island 202 and the first remaining portion 62 corresponding to the fourth island 204 are both located on the same side, space is provided for arranging the power chips 100, which is advantageous for improving the capacity of the power module 10.

[0081] 15 , the first remaining portions 62 corresponding to the multiple even-numbered islands 200 can intersect with the central axis of the power module 10 in the width direction so that the first remaining portions 62 are adjacent to the central axis of the power module 10, facilitating the arrangement of the ejector pins 930 in the sealing mold. The first remaining portions 62 corresponding to the multiple odd-numbered islands 200 can contact the edges of the multiple islands 200 that are close to the driver frame 400 so that the first remaining portions 62 are adjacent to the edges of the islands 200, ensuring a good support effect.

[0082] 15 , the first remaining portions 62 corresponding to the odd-numbered islands 200 can intersect with the central axis of the power module 10 in the width direction so that the first remaining portions 62 are adjacent to the central axis of the power module 10, facilitating the arrangement of the ejector pins 930 in the sealing mold. The first remaining portions 62 corresponding to the even-numbered islands 200 can contact the edges of the islands 200 that are close to the driver frame 400 so that the first remaining portions 62 are adjacent to the edges of the islands 200, ensuring a good support effect.

[0083] Since the packaging effect of the power module 10 may affect its performance, in order to ensure that the power module 10 has a good packaging effect, in addition to supporting it from the second surface 620 side of the package 600 to avoid deformation of the power frame 20 during the packaging process, the package 600 can be supported (pressed) from the first surface 610 side to ensure the structural stability of the power frame 20.

[0084] Therefore, when packaging the main body structure of the power module 10, the power frame 20 can be supported (pressed) from above (the side where the power chips 100 are arranged) in the thickness direction Z of the power module 10 by the ejector pins of the sealing mold. This allows the power frame 20 to be supported from different directions, ensuring the stability of the structure and position of the power frame 20 and accelerating the mold packaging process. Naturally, during the packaging process, the ejector pins supporting the power frame 20 from above also gradually return to their original position as the resin begins to harden. After the sealing mold is completely removed after packaging is completed, multiple dimples, i.e., the second remaining portion 61 described below, are also formed on the top surface of the package 600. From this, it can be seen that the first remaining portion 62 and the second remaining portion 61 are both dimples left on the surface of the package 600 by the packaging process.

[0085] 5, 16, and 17, a plurality of second remaining portions 61 are arranged on a first surface 610 of a package 600. Along the thickness direction Z of the power module 10, among the plurality of islands 200, two islands 200 located at both ends in the longitudinal direction X of the power module 10 correspond to one second remaining portion 61.

[0086] Here, the second remaining portion 61 corresponds only to two islands 200 among the multiple islands 200 that are located at both ends in the longitudinal direction X of the power module 10. In other words, the ejector pins for forming the second remaining portion 61 are pressed only against the surfaces of the two islands 200, thereby applying pressure from above to the islands 200 located on the outside.

[0087] It should be understood that a plurality of first remaining portions 62 are also arranged on the second surface 620 of the package 600, and that the arrangement method and beneficial effects of the plurality of first remaining portions 62 can be referred to the above-described embodiments. In addition, the origin and shape of the second remaining portion 61 are similar to those of the first remaining portion 62 described above, and therefore will not be described here.

[0088] In this way, when packaging the power frame 20, the power frame 20 can be supported in different directions to ensure the stability of the structure and position of the power frame 20, which is advantageous for accelerating the mold packaging process. In addition, the surface (i.e., the first surface 610) of the package 600 of the power module 10 arranged in this way and the surface of the package of a power module with another structure, for example, a power module having a DBC (Direct Bond Copper) structure, can be formed using the same sealing mold, which improves the versatility of the sealing mold and enables shortening of development time and reducing development costs.

[0089] 15 to 17, in the width direction Y of the power module 10, both the first remaining portion 62 and the second remaining portion 61 can be arranged in a portion corresponding to the side of the die bond portion 210 in the package 600 that is away from the power pins 250. In this way, interference between the power pins and the ejector pins corresponding to the plurality of first remaining portions 62 and the plurality of second remaining portions 61 can be avoided in the packaging process, and this is advantageous for supporting the ejector pins at positions away from the power pins 250 of the island 200, and changes in the position of the island 200 can be more suitably avoided.

[0090] 17 , the plurality of islands 200 may include a plurality of odd-numbered islands 200 (e.g., a first island 201 and a third island 203) and a plurality of even-numbered islands 200 (e.g., a second island 202 and a fourth island 204), and the plurality of odd-numbered islands 200 and the plurality of even-numbered islands 200 are alternately arranged in the longitudinal direction X of the power module 10. Here, a line 63 connecting the centers of the first remaining portions 62 corresponding to the plurality of odd-numbered islands 200 and a line 64 connecting the centers of the first remaining portions 62 corresponding to the plurality of even-numbered islands 200 both extend along the longitudinal direction X of the power module 10, and a line 65 connecting the centers of the plurality of second remaining portions 61 also extends along the longitudinal direction X of the power module 10. In addition, a line 63 connecting the centers of the first remaining portions 62 corresponding to the plurality of odd-numbered islands 200 and a line 64 connecting the centers of the first remaining portions 62 corresponding to the plurality of even-numbered islands 200 may both be located between a line 65 connecting the centers of the plurality of second remaining portions 61 and a central axis 66 in the width direction Y of the power module 10.

[0091] For example, the plurality of odd-numbered islands 200 include a first island 201 and a third island 203, and the plurality of even-numbered islands 200 include a second island 202 and a fourth island 204. The first island 201, the second island 202, the third island 203, and the fourth island 204 are sequentially arranged at intervals in the longitudinal direction X of the power module 10. Here, the first island 201, the second island 202, and the third island 203 may each correspond to one first remaining portion 62, the fourth island 204 may each correspond to two first remaining portions 62, and the first island 201 and the fourth island 204 may each correspond to one second remaining portion 61. A line 63 connecting the centers of the first remaining portion 62 corresponding to the first island 201 and the first remaining portion 62 corresponding to the third island 203 is located on a first straight line, a line 64 connecting the centers of the first remaining portion 62 corresponding to the second island 202 and the first remaining portion 62 corresponding to the fourth island 204 is located on a second straight line, a line 65 connecting the centers of the second remaining portions 61 corresponding to the first island 201 and the fourth island 204 is located on a third straight line, and the first straight line and the second straight line are located between the third straight line and a central axis 66 in the width direction Y of the power module 10.

[0092] With the above arrangement, a plurality of first remaining portions 62 are alternately arranged on the second surface 620 of the package 600, and the enlarged holes in the ejector plate 910 formed by the ejector pins 930 correspond to the respective first remaining portions 62, and these enlarged holes are also alternately arranged on the ejector plate in the longitudinal direction X of the power module 10. In this way, stress concentration on the ejector plate 910 is prevented, the strength of the ejector plate 910 is ensured, and the uniformity of the load on the power frame 20 is improved, which is advantageous to the reliability of molding of the power module 10. Furthermore, a plurality of second remaining portions 61 are arranged on the same straight line on the first surface 610 of the package 600, and the ejector pins corresponding to the second remaining portions 61 are also arranged on the same straight line, maintaining a balance of pressure from above. Furthermore, since the line 63 connecting the centers of the first remaining portions 62 corresponding to the plurality of odd-numbered islands 200 and the line 64 connecting the centers of the first remaining portions 62 corresponding to the plurality of even-numbered islands 200 are located between the line 65 connecting the centers of the plurality of second remaining portions 61 and the central axis 66 in the width direction Y of the power module 10, not only does it become easy to arrange the plurality of ejector pins on different sides of the power frame 20 in the packaging process, but it is also possible to avoid interference between the power pin 250 and the ejector pins corresponding to the plurality of first remaining portions 62 and the plurality of second remaining portions 61.

[0093] 17 , the center-to-center distance d4 between the second remaining portion 61 corresponding to the first island 201 and the second remaining portion 61 corresponding to the fourth island 204 may be greater than the center-to-center distance d5 between the first remaining portion 62 corresponding to the first island 201 and the first remaining portion 62 corresponding to the fourth island 204 that is farthest from the first island 201, i.e., d4>d5. In other words, in the longitudinal direction X of the power module 10, the center-to-center distance d4 between the two second remaining portions 61 located at the ends is greater than the center-to-center distance d5 between the two first remaining portions 61 located at the ends.

[0094] In this way, it is possible to prevent the ejector pins corresponding to the two second remaining portions 61 located at both ends from completely overlapping with the ejector pins corresponding to the two first remaining portions 62 located at both ends in the thickness direction Z of the power module 10 during the packaging process, which is advantageous for realizing the positioning of the island 200 within the package 600.

[0095] 17 , one second notch 67 and two blind holes 68 are arranged on each side of the package 600 in the longitudinal direction X. Here, the one second notch 67 and the two blind holes 68 located on one side of the package 600 and the one second notch 67 and the two blind holes 68 located on the other side of the package 600 are symmetrical with respect to the central axis line in the longitudinal direction X of the package 600. Here, the center of the second notch 67 is located on the central axis line 66 in the width direction Y of the power module 10, and the two blind holes 68 are located on the second surface 620 (rear surface) of the package 600 and are symmetrical with respect to the central axis line 66 in the width direction Y of the power module 10.

[0096] For example, the second notch 67 may be a U-shaped notch that penetrates the power module 10 in the thickness direction Z and is arranged on both sides of the package 600 in the longitudinal direction X, and the blind hole 68 may be a shallow circular groove that is arranged on the surface of the package 600, and its depth may be smaller than the depth of the first remaining portion 62.

[0097] As a result, the center of the second notch 67 is positioned on the central axis 66 of the power module 10 in the width direction Y, making it easy to fix the package 600. Furthermore, by providing two blind holes 68 that are positioned on the second surface 620 (rear surface) of the package 600 and are symmetrical with respect to the central axis 66 of the power module 10 in the width direction Y, it is possible to avoid damage to the package 600 or deformation of the package 600 when it is released from the mold.

[0098] 17 , if the intersection of the second notch 67 and the central axis 66 of the power module 10 in the width direction Y is defined as point A, and the intersection of the line connecting the centers of the two blind holes 68 and the central axis 66 of the power module 10 in the width direction Y is defined as point B, point B is located between the center of the second notch 67 and point A. In this way, easy demolding is possible, damage to the package 600 during demolding can be avoided, the life of the sealing mold can be extended, and it is advantageous for designing a more compact power module 10.

[0099] The following describes an exemplary configuration of a power module 10 with reference to FIGS. 13 to 17. The power module 10 may include a power frame 20 and a drive frame 400, a power chip 100 located on the power frame 20, a drive chip 300 located on the drive frame 400, and a package 600 located outside the power frame 20 and the drive frame 400. The power frame 20 may include a first island 201, a second island 202, a third island 203, and a fourth island 204 arranged at intervals along the longitudinal direction X of the power module 10, and each island may include a die bond portion 210, a connection portion 220, a bent portion 230, a terrace portion 240, and a power pin 250 connected in sequence in the width direction Y of the power module 10. The driver frame 400 may include a plurality of driver pins 500 arranged at intervals along the longitudinal direction X of the power module 10.

[0100] The package 600 has a first side 610 and a second side 620 .

[0101] A plurality of first remaining portions 62 are arranged on the second surface 620 of the package 600. In the thickness direction Z of the power module 10, each of the islands 200 corresponds to at least one first remaining portion 62. In the longitudinal direction X of the power module 10, the first remaining portions 62 corresponding to two adjacent islands 200 are arranged so as to be shifted from each other. For example, in the thickness direction Z of the power module 10, the first island 201 corresponds to the first first remaining portion 62, the second island 202 corresponds to the second first remaining portion 62, the third island 203 corresponds to the third first remaining portion 62, and the fourth island 204 corresponds to the fourth and fifth first remaining portions 62.

[0102] A plurality of second remaining portions 61 are arranged on a first surface 610 of the package 600. In the thickness direction Z of the power module 10, of the plurality of islands 200, two islands 200 located at both ends in the longitudinal direction X of the power module 10 each correspond to one second remaining portion 61, and the plurality of second remaining portions 61 are arranged in the longitudinal direction X of the power module 10 and positioned on the same straight line. For example, in the thickness direction Z of the power module 10, the first island 201 corresponds to the first second remaining portion 61, and the fourth island 204 corresponds to the second second remaining portion 61.

[0103] Accordingly, in the process of packaging the main body structure of the power module 10, enlarged holes corresponding to the first second remaining portion 61 and the second second remaining portion 61 are formed in the ejector plate corresponding to the first surface 610 (front surface) of the package 600 in the thickness direction Z of the power module 10, and enlarged holes corresponding to the first first remaining portion 62, the second first remaining portion 62, the third first remaining portion 62, the fourth first remaining portion 62, and the fifth first remaining portion 62 are formed in the ejector plate corresponding to the second surface 620 (rear surface) of the package 600. In this way, not only interference between the enlarged holes in the ejector plates but also tilting of the fourth island 204 can be avoided.

[0104] In the description of this disclosure, a first feature being "above" or "below" a second feature may include direct contact between the first and second features, or may include contact between the first and second features through another feature between them, rather than direct contact. A first feature being "above," "above," and "above" a second feature may include the first feature being directly above and diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature.

[0105] In describing this disclosure, orientations or positional relationships indicated by the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. are orientations or positional relationships indicated based on the drawings and do not indicate or imply that the devices or elements shown have a particular orientation or are required to be configured and operate in a particular orientation, but are merely intended to facilitate and simplify the description of the present invention.

[0106] While embodiments of the present disclosure have been illustrated and described, it will be understood that those skilled in the art can make various changes, modifications, substitutions and variations to these embodiments without departing from the principles and scope of the present invention, the scope of which is defined by the claims and their equivalents.

[0107] Those skilled in the art will appreciate that the scope of the present disclosure is not limited to the particular examples described above, and that modifications and substitutions can be made to specific elements of the examples without departing from the spirit of the present application. The scope of the present disclosure is limited by the claims.

Claims

1. A power module, a power frame including a plurality of islands each including a die bond portion, a connection portion, a bent portion, a terrace portion, and a power pin, which are connected in this order in the width direction of the power module; a plurality of power chips disposed on the die bond portions of the plurality of islands; the die bond portion, the connection portion, the bent portion, the terrace portion, and the power pin have an integral structure; the connecting portion includes at least one oblique side, adjacent oblique sides of two connecting portions of adjacent islands extend in substantially the same direction, the bent portion is disposed at an angle with respect to the terrace portion, the terrace portion of at least a central island among the plurality of islands includes a chamfered portion on a side away from the power pin, and an orthogonal projection of a side of the chamfered portion of the terrace portion of one island onto a plane in which the plurality of islands are located and an orthogonal projection of a side of the bent portion of the other adjacent island onto the plane in which the plurality of islands are located extend in substantially the same direction; Power module.

2. the plurality of islands include a first island, a second island, a third island, and a fourth island, the first island, the second island, the third island, and the fourth island being sequentially arranged at intervals in the longitudinal direction of the power module; the connection portion of the first island and the connection portion of the fourth island each include one oblique side, the connection portion of the second island and the connection portion of the third island each include two oblique sides, and the adjacent oblique sides of the two connection portions of adjacent islands are parallel to each other; The power module according to claim 1 .

3. an area of ​​the fourth island is larger than an area of ​​the first island, an area of ​​the second island, and an area of ​​the third island; at least one first through-hole is disposed in at least the fourth island among the first island, the second island, the third island, and the fourth island; The power module according to claim 2 .

4. The first island has one first through-hole disposed on a side of the connection portion of the first island that is adjacent to the die-bond portion; and / or a plurality of first through holes are arranged in the fourth island, some of the plurality of power chips are arranged in the fourth island, one of the plurality of first through holes is located on a side of the fourth island close to a die bond portion of a connection portion, and any of the other first through holes of the plurality of first through holes is located in a portion of the fourth island corresponding to a region between adjacent power chips; The power module according to claim 3 .

5. the terrace portion of the first island, the terrace portion of the second island, and the terrace portion of the third island include a chamfered portion; a side of a chamfered portion of a terrace portion of one of the first island, the second island, and the third island is parallel to a side of a bent portion of the other adjacent island; The power module according to any one of claims 2 to 4.

6. The folded portions of at least two of the islands are arranged in parallel. The power module according to any one of claims 1 to 5.

7. the terrace includes a first notch located in the terrace adjacent to the bent portion; and / or the terrace includes a second through hole located on a side of the terrace adjacent to the power pin; and / or the power pin includes an isolation portion adjacent to a connection point between the power pin and the terrace portion, the isolation portion being configured to isolate the power pin from external air and moisture; The power module according to any one of claims 1 to 6.

8. a driver frame including a plurality of driver pins spaced apart along a longitudinal direction of the power module; a driver chip disposed on the driver frame; a package disposed outside the driver frame and the power frame, the driver pin and the power pin are located on opposite sides in a width direction of the power module, and free ends of the driver pin and the power pin protrude from the package. The power module according to any one of claims 1 to 7.

9. an insulating resin layer disposed on a side of the power frame away from the power chip; a heat sink disposed on a side of the insulating resin layer away from the power frame, a bottom surface of the heat sink that is away from the insulating resin layer and is flush with the bottom surface of the package so that the bottom surface of the heat sink is exposed to the bottom surface of the package; The power module according to claim 8.

10. The power supply further includes a package that externally packages the plurality of islands and has a first surface and a second surface, one end of the power pin is located within the package and the other end protrudes to the outside of the package, and the plurality of power chips are installed on a surface of the plurality of islands that is adjacent to the first surface; a plurality of first remaining portions are arranged on the second surface of the package, each island corresponds to at least one first remaining portion in the thickness direction of the power module, and the first remaining portions corresponding to two adjacent islands are arranged offset from each other in the longitudinal direction of the power module; The power module according to claim 1 .

11. The center distance d1 in the width direction of the power module between the first remaining portions corresponding to two adjacent islands satisfies d1≧1.3 mm, and / or The minimum distance d2 between the first remaining portions corresponding to two adjacent islands satisfies d2≧3.292 mm; and / or a center distance d3 in the longitudinal direction of the power module between first remaining portions corresponding to two adjacent islands satisfies d3<4.5 mm; The power module according to claim 10.

12. In a width direction of the power module, the first remaining portion is disposed in a portion of the package corresponding to a side of the die bond portion away from the power pin. The power module according to claim 10 or 11.

13. a line connecting centers of first remaining portions corresponding to at least two of the plurality of islands extends along the longitudinal direction of the power module; The power module according to claim 10 or 11.

14. the plurality of islands include a plurality of odd-numbered islands and a plurality of even-numbered islands, the plurality of odd-numbered islands and the plurality of even-numbered islands being alternately arranged in a longitudinal direction of the power module, a line connecting the centers of the first remaining portions corresponding to the plurality of odd-numbered islands and a line connecting the centers of the first remaining portions corresponding to the plurality of even-numbered islands both extend along the longitudinal direction of the power module and are located on the same side of a central axis of the power module in the width direction. The power module according to claim 13.

15. a plurality of second remaining portions are arranged on a first surface of the package, and in a thickness direction of the power module, among the plurality of islands, two islands located at both ends in a longitudinal direction of the power module correspond to one second remaining portion each; 15. The power module according to claim 14.

16. the first remaining portion and the second remaining portion are both disposed in a portion of the package corresponding to a side of the die bond portion away from the power pins.

16. The power module according to claim 15.

17. a line connecting the centers of the plurality of second remaining portions extends along the longitudinal direction of the power module, and a line connecting the centers of the first remaining portions corresponding to the plurality of odd-numbered islands and a line connecting the centers of the first remaining portions corresponding to the plurality of even-numbered islands are located between the line connecting the centers of the plurality of second remaining portions and a central axis line in the width direction of the power module. The power module according to claim 15 or 16.

18. the plurality of islands include a first island, a second island, a third island, and a fourth island that are arranged in this order in a longitudinal direction of the power module; the plurality of first remaining portions include a first first remaining portion corresponding to the first island, a second first remaining portion corresponding to the second island, a third first remaining portion corresponding to the third island, and a fourth first remaining portion and a fifth first remaining portion corresponding to the fourth island; the plurality of second remaining portions include a first second remaining portion corresponding to the first island and a second second remaining portion corresponding to the fourth island; The power module according to any one of claims 15 to 17.

19. the plurality of power chips include three first power chips and three second power chips; the three first power chips are respectively arranged on the first island, the second island, and the third island, and the three second power chips are all arranged on the fourth island, and are arranged at intervals along the longitudinal direction of the power module; 19. The power module of claim 18.

20. a center distance d4 between the first second remaining portion and the second second remaining portion is greater than a center distance d5 between the first first remaining portion and the fifth first remaining portion; 19. The power module of claim 18.

21. A power module comprising the power module according to any one of claims 1 to 20. electronic equipment.

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