Processing apparatus and processing method

Abstract

To compactly constitute a processing device.SOLUTION: The processing apparatus 1 processes a protective member T that is a protective member of a frame unit FU in which the protective member T is fixed to a wafer W. The processing apparatus 1 includes the transfer mechanism 30 as a transfer section for transferring the frame unit FU, the light source unit 110 as a fixing force reducing section for reducing the fixing force of the protective member T to the wafer W in the transfer path of the frame unit FU by the transfer mechanism 30, and the marking section 140 for forming a mark on at least one of the protective member T and the wafer W in the transfer path of the frame unit FU by the transfer mechanism 30.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing device and a processing method. [Background technology]

[0002] In a processing apparatus for processing a workpiece to which a tape serving as a protective member is attached, there is known a technique for reducing the adhesiveness of the tape fixed to the workpiece so that various processes on the workpiece can be performed smoothly. Such a technique is described in, for example, Patent Documents 1 to 4. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-072296 [Patent Document 2] Japanese Patent Application Laid-Open No. 2007-329300 [Patent Document 3] Japanese Patent Application Laid-Open No. 2017-188548 [Patent Document 4] Japanese Patent Application Laid-Open No. 2012-009731 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, the above-mentioned processing equipment is also expected to have a marking function for forming marks on the workpiece or protective member for product identification, quality control, processing automation, and other purposes, but it is undesirable for the processing equipment to become larger as a result of adding a marking function.

[0005] The present invention has been made in view of the above points, and aims to provide a technique that enables a processing device to be configured compactly. [Means for solving the problem]

[0006] A processing device according to one embodiment of the present invention is a processing device for processing a protective member of a workpiece unit in which the protective member is fixed to the workpiece, and includes a transport section for transporting the workpiece unit, a fixing force reduction section for reducing the fixing force of the protective member to the workpiece along the transport path of the workpiece unit by the transport section, and a marking section for forming a mark on at least either the protective member or the workpiece along the transport path of the workpiece unit by the transport section.

[0007] One aspect of the processing method of the present invention is a processing method for processing a protective member of a workpiece unit in which the protective member is fixed to the workpiece, and includes a transport step for transporting the workpiece unit, a fixing force reducing step for reducing the fixing force of the protective member to the workpiece along the transport path of the workpiece unit by the transport unit, and a marking step for forming a mark on at least one of the protective member or the workpiece along the transport path of the workpiece unit by the transport unit. [Effects of the Invention]

[0008] According to the present invention, the processing device can be configured compactly. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a perspective view of a processing apparatus according to an embodiment; [Figure 2] 1 is a cross-sectional view of a processing apparatus according to an embodiment of the present invention; [Figure 3] 10A and 10B are diagrams illustrating the positional relationship between a transport path and a light source unit. [Figure 4] 10 is a diagram illustrating the positional relationship between a transfer path, a measurement unit, and a gas supply unit. FIG. [Figure 5] 10A and 10B are diagrams illustrating a state in which a frame unit is transported from a cassette to a guide rail. [Figure 6] FIG. 10 is another view showing the frame unit being transported from the cassette to the guide rail. [Figure 7]FIG. 10 is yet another diagram showing a state in which the frame unit is transported from the cassette to the guide rail. [Figure 8] FIG. 10 is a diagram showing an example of temporal change in received light intensity measured by a measurement unit. [Figure 9] FIG. 2 is a diagram schematically illustrating a transport path within the processing apparatus. DETAILED DESCRIPTION OF THE INVENTION

[0010] Fig. 1 is a perspective view of a processing apparatus 1 according to one embodiment. Fig. 2 is a cross-sectional schematic view of the processing apparatus 1 according to one embodiment. The configuration of the processing apparatus 1 will be described below with reference to Figs. 1 and 2. Note that the X-axis, Y-axis, and Z-axis directions shown in the drawings are perpendicular to one another. The X-axis and Y-axis directions are approximately horizontal, and the Z-axis direction is an up-down direction (approximately vertical).

[0011] Although the processing device 1 will be described as an example where it is a processing device that performs cutting processing on a wafer W, the processing device 1 is not limited to a processing device that performs cutting processing. The processing device 1 may be any device that performs processing on a wafer W to which a protective member T is attached. The processing device 1 may be, for example, any processing device that performs grinding, polishing, cutting, laser processing, etc., or may be a device that performs processing other than processing, such as inspection, imaging, peeling off a protective member, film formation, cleaning, transport, and changing orientation.

[0012] In the processing apparatus 1, a wafer W, which is a workpiece, is handled in the form of a frame unit FU. As shown in Fig. 1, the frame unit FU is formed by integrating the frame F and the wafer W by adhering the wafer W to a protective member T, which is an adhesive tape that covers the opening of the annular frame F. The frame unit FU is an example of a workpiece unit in which the protective member T is fixed to the wafer W, which is a workpiece.

[0013] The wafer W is not particularly limited. The wafer W is, for example, a semiconductor wafer such as silicon or gallium arsenide, and is formed in a substantially plate shape. The wafer W is not limited to a semiconductor wafer, and may be a ceramic, glass, or sapphire-based optical device wafer. The frame F is not particularly limited. The frame F is, for example, made of metal, formed in a ring shape, and has an opening.

[0014] In this embodiment, the protective member T is an ultraviolet-curable adhesive tape, and is composed of, for example, a base material and an adhesive layer containing an ultraviolet-curable resin. The adhesive layer is attached to the frame F and the wafer W, and the protective member T, together with the frame F and the wafer W, constitutes a frame unit FU. When the protective member T is irradiated with ultraviolet light, the adhesive layer containing the ultraviolet-curable resin hardens. As a result, the adhesive strength of the adhesive layer decreases, and the adhesiveness of the protective member T decreases. In other words, the protective member T is configured so that the adhesive layer hardens when irradiated with ultraviolet light, thereby reducing the adhesiveness of the protective member T.

[0015] The protective member T may be any material that can be fixed to the workpiece to protect it, and is not limited to adhesive tape with an adhesive layer. In this example, the protective member T and the workpiece are fixed by adhesion, but they may also be fixed by adhesion, not limited to adhesion. That is, the protective member T can be fixed to the workpiece by any method, including adhesion, bonding, etc. Fixation also includes mechanical bonding, physical bonding, chemical bonding, and combinations thereof. Therefore, the protective member T may be a thermoplastic resin without an adhesive layer, or may be a material that softens by thermocompression bonding to adhere to the workpiece and then cools and fixes. In this case, the fixing force of the protective member T to the workpiece (wafer W) may be reduced by infiltrating a nail or fluid into the interface between the protective member T and the workpiece, thereby peeling the protective member T from the workpiece. The protective member T may also be a cured liquid resin, or a laminate of liquid resin and adhesive tape or tape without an adhesive layer. The fixing force reduction portion described later need only be adapted to the characteristics of the protective member T fixed to the workpiece, and may be configured to be selectable between a form that uses heat or ultraviolet rays, and a form that reduces the fixing force by allowing fluid or nails to enter.

[0016] 1, the processing apparatus 1 includes an apparatus main body 2 and gate-shaped support bases 3 and 4. A rectangular opening extending in the X-axis direction is formed in the upper surface of the apparatus main body 2, and the support bases 3 and 4 are provided on the upper surface of the apparatus main body 2 so as to straddle the opening. The opening formed in the apparatus main body 2 is covered by a bellows-shaped cover 5 that is movable together with a chuck table 60, which will be described later. Furthermore, below the cover 5 of the apparatus main body 2, there are provided an X-axis direction movement mechanism (not shown) that moves the chuck table 60 in the X-axis direction, and a table rotation mechanism (not shown) that rotates the chuck table 60 about the Z-axis direction.

[0017] As shown in FIG. 1, the processing apparatus 1 further includes a cassette stage 20, a transport mechanism 30 having a transport arm 40, a pair of guide rails 50, a chuck table 60, a pair of cutting units 70, a pair of moving mechanisms 80, a transport mechanism 90 having a transport arm 100, a light source unit 110, a measurement unit 120, a gas supply unit 130 (see FIG. 3), a cleaning unit 150, and a control unit 200.

[0018] A cassette 10 containing a frame unit FU is placed on the cassette stage 20. The cassette 10 is an example of a storage section that stores the frame unit FU. The cassette 10 has an opening 11 (see FIG. 2) for loading and unloading the frame unit FU, and is placed on the cassette stage 20 with the opening 11 facing a frame clamping section 42 provided on the transport arm 40, that is, facing in the +Y-axis direction. Furthermore, support guides 12 (see FIG. 2) that support the frame units FU are provided in multiple stages in the Z-axis direction within the cassette 10, and the frame unit FU can be placed on any of the support guides 12. In other words, the cassette 10 is also an example of a placement section on which the frame unit FU is placed.

[0019] The cassette stage 20 is configured to be able to move up and down in the Z-axis direction by an elevation mechanism provided inside the apparatus main body 2. The cassette stage 20 moves up and down to move the cassette 10 relative to the frame clamping section 42, thereby enabling the frame unit FU to be loaded and unloaded from any of the support guides 12 of the cassette 10.

[0020] The transport mechanism 30 is an example of a transport section that transports the frame unit FU, and loads and unloads the frame unit FU between the cassette 10 and a pair of guide rails 50. The transport mechanism 30 is supported by a support base 3. The transport mechanism 30 includes a transport arm 40, an elevation drive section 31 that moves the transport arm 40 in the Z-axis direction (vertical direction), and a horizontal drive section 32 that moves the transport arm 40 in the Y-axis direction (horizontal direction).

[0021] The transport arm 40 includes a frame clamping section 42 that clamps the frame F of the frame unit FU, and an arm section 41 that supports the frame clamping section 42. With the frame clamping section 42 clamping the frame unit FU, the horizontal drive section 32 and the elevation drive section 31 move the transport arm 40, causing the frame unit FU to move between the cassette 10 and the pair of guide rails 50, and the transport mechanism 30 loads and unloads the frame unit FU.

[0022] The pair of guide rails 50 are a support mechanism that supports the frame F and are an example of a mounting portion on which the frame unit FU is mounted. Each of the pair of guide rails 50 is provided along the Y-axis direction. Each of the pair of guide rails 50 has an L-shaped cross section in the XZ cross section and is configured to be movable in the X-axis direction by a spacing adjustment mechanism (not shown). When the frame unit FU is transported from the cassette 10 to the pair of guide rails 50, the spacing between the guide rails 50 is adjusted to be slightly wider than the spacing between the outer edges of the supported portions FN supported by the guide rails 50 of the frame F shown in FIG. 2. As a result, the frame unit FU transported onto the pair of guide rails 50 is supported by the pair of guide rails 50.

[0023] When a transport mechanism 90 (described later) places the frame unit FU on the chuck table 60 or the cleaning unit 150, the gap between the pair of guide rails 50 is widened sufficiently relative to the width of the outer edge of the supported portion FN supported by the guide rails 50. This allows the frame unit FU to be moved between the pair of guide rails 50 to the chuck table 60 or the cleaning unit 150.

[0024] The chuck table 60 is a table that holds the frame unit FU and is an example of a mounting portion on which the frame unit FU is placed. The chuck table 60 has a holding surface 61 that holds the wafer W by suction and a clamp portion 62 that holds the frame F. The chuck table 60 is moved by an X-axis direction movement mechanism (not shown) between a carry-in / out position where the frame unit FU is carried in and out by the transport mechanism 90 and a cutting position where cutting processing is performed by the cutting unit 70. In other words, the X-axis direction movement mechanism is an example of a transport portion that transports the frame unit FU held on the chuck table 60. In addition, the chuck table 60 rotates around the Z-axis by a rotation mechanism (not shown) to change the orientation of the held frame unit FU.

[0025] The pair of cutting units 70 are devices that cut the wafer W on the frame unit FU held on the chuck table 60, and each has a blade fixed to a spindle whose rotation axis faces the Y-axis direction. The pair of moving mechanisms 80 are supported on the support base 4 and move the pair of cutting units 70 in the Z-axis direction and the Y-axis direction. The cutting units 70 are moved in the Z-axis direction and the Y-axis direction by the moving mechanisms 80, thereby cutting any position on the wafer W along the X-axis direction.

[0026] The transport mechanism 90 is an example of a transport section that transports the frame unit FU, and transports the frame unit FU in and out of the chuck table 60 and the cleaning unit 150. The transport mechanism 90 is supported by a support base 3. The transport mechanism 90 includes a transport arm 100, an elevation drive unit 91 that moves the transport arm 100 in the Z-axis direction (vertical direction), and a horizontal drive unit 92 that moves the transport arm 100 in the Y-axis direction (horizontal direction).

[0027] The transport arm 100 holds by suction the frame F of the frame unit FU held by the pair of guide rails 50 and carries it onto the chuck table 60. Also, the transport arm 100 holds by suction the frame F of the frame unit FU held by the chuck table 60 and carries it into the cleaning unit 150. Also, the transport arm 100 holds by suction the frame F of the frame unit FU held by the cleaning unit 150 and carries it onto the guide rails 50.

[0028] The light source unit 110 is a unit that irradiates ultraviolet light onto an area on the transport path between the cassette 10 and the guide rail 50, along which the frame unit FU is transported. The light source unit 110 irradiates ultraviolet light onto the protective member T of the frame unit FU transported on the transport path between the cassette 10 and the guide rail 50, thereby reducing the adhesiveness of the protective member T. The light source unit 110 includes a UV light source 111 that emits ultraviolet light. The UV light source 111 is, for example, an LED that emits ultraviolet light, but is not limited to an LED as long as it emits ultraviolet light. The UV light source 111 may also be, for example, a mercury lamp. The light source unit 110 is an example of a fixing force reducing unit that applies a stimulus to the protective member T to reduce its adhesiveness, thereby reducing the fixing force of the protective member T to the wafer W. In this example, the stimulus applied to the tape is light energy.

[0029] The measurement unit 120 is a unit that detects ultraviolet light emitted from the UV light source 111 and measures its intensity. The measurement unit 120 includes a sensor 121 that is sensitive to ultraviolet light. The sensor 121 is not particularly limited, but may include, for example, a photodiode and may further include a filter that transmits ultraviolet light. The measurement unit 120 is provided at a position facing the light source unit 110. The sensor 121 is provided at a position that is approximately facing the UV light source 111.

[0030] The gas supply unit 130 is a unit that supplies an inert gas to an area on the transport path between the cassette 10 along which the frame unit FU is transported and the guide rail 50, which is irradiated with ultraviolet light by the UV light source 111 (hereinafter referred to as the UV irradiation area), as shown in FIG. 2. The inert gas is, for example, nitrogen gas. The gas supply unit 130 includes a gas supply source 131, a gas supply path 132 through which gas supplied from the gas supply source 131 passes, and a gas supply port 133 that releases the gas that has passed through the gas supply path 132 toward the transport path. The gas supply path 132 and the gas supply port 133 are formed in the housing of the measurement unit 120 and are provided in a position that is approximately opposite to the light source unit 110.

[0031] The marking unit 140 is a unit that forms a mark on the frame unit FU that is transported on the transport path between the cassette 10 and the guide rail 50. More specifically, the marking unit 140 is configured to form a mark on at least one of the protective member T or the wafer W of the frame unit FU.

[0032] The marking unit 140 forms marks by, for example, ejecting ink onto at least one of the protective member T or the wafer W. However, the marks formed by the marking unit 140 are not limited to those formed by printing using ink. The marking unit 140 may form marks by other printing methods involving printing or coloring, or may form marks by methods other than printing. The marking unit 140 may, for example, transfer unevenness onto the protective member T. The marking unit 140 may, for example, form marks by altering at least one of the protective member T or the wafer W using a laser. The marking unit 140 may, for example, form marks by forming grooves, holes, notches, etc. in the protective member T or the wafer W.

[0033] The mark may be any mark capable of conveying necessary information in a small space, such as a character string, a symbol, a graphic, a one-dimensional or two-dimensional code, or a combination thereof. The information conveyed by the mark is not particularly limited, and may include, for example, information regarding the duration and conditions of ultraviolet irradiation performed to reduce the adhesiveness of the protective material T, or information regarding the results of the process, such as the success or failure of the process to reduce the adhesiveness of the protective material T. The information conveyed by the mark may also include information regarding the history of processing performed on the frame unit FU, such as the conditions and results of other processes performed on the frame unit FU by the processing device 1, or the conditions and results of processes already performed on the frame unit FU by devices other than the processing device 1. The information conveyed by the mark may also include, for example, information regarding the schedule or plan for processing to be performed on the frame unit FU. Furthermore, the information conveyed by the mark is not limited to information regarding processing to be performed or has been performed on the frame unit FU, but may also include information about the frame unit FU itself, such as information identifying the individual frame unit FU. Furthermore, the information conveyed by the mark may include any other information.

[0034] The cleaning unit 150 cleans and dries the wafer W cut by the cutting unit 70. The cleaning unit 150 cleans the wafer W on the frame unit FU placed on the spinner table 151 with cleaning water, and then dries the wafer W with jetted air.

[0035] The control unit 200 comprehensively controls the processing device 1. The control unit 200 includes a processor that executes various processes, and a storage unit (memory) that stores various parameters, programs, and the like.

[0036] In the processing apparatus 1 configured as above, the flow from the transport of the frame unit FU from the cassette 10 to the apparatus main body 2 to the transport of the frame unit FU from the apparatus main body 2 to the cassette 10 is as follows.

[0037] The transport mechanism 30 pulls out the frame unit FU from the cassette 10 placed on the cassette stage 20, carries it into the apparatus main body 2, and places it on the pair of guide rails 50. The distance between the guide rails 50 is adjusted in advance so that it roughly matches the distance between the outer edges of the supported parts FN supported by the guide rails 50 and is equal to or greater than the width of the outer edges of the supported parts FN. In this way, the pair of guide rails 50 function as a temporary storage area for the frame unit FU.

[0038] Next, the transport mechanism 90 holds and lifts the frame unit FU placed on the guide rails 50, and a gap adjustment mechanism (not shown) widens the gap between the guide rails 50 to ensure a gap for the frame unit FU to pass through. Once the gap is ensured, the transport mechanism 90 lowers the frame unit FU, passes it through the guide rails 50, and places it on the chuck table 60.

[0039] The chuck table 60 holds the frame unit FU carried in by the transport mechanism 90, and then moves in the -X-axis direction from the carry-in / out position to the cutting position. Thereafter, the cutting unit 70 performs cutting processing on the wafer W on the frame unit FU held on the chuck table 60, thereby dicing the wafer W. The cutting processing is performed while the position and attitude of the cutting unit 70 relative to the wafer W are adjusted by the movement mechanism 80 and a table rotation mechanism (not shown). As a result, the wafer W is cut along the streets and divided into individual chips.

[0040] When the cutting process is completed, the chuck table 60 moves in the +X-axis direction from the cutting position to the carry-in / out position. When the chuck table 60 returns to the carry-in / out position, the transport mechanism 90 transports the frame unit FU from the chuck table 60 to the cleaning unit 150. The cleaning unit 150 then cleans and dries the frame unit FU.

[0041] When the cleaning and drying are completed, the transport mechanism 90 places the frame unit FU on a pair of guide rails 50 with an adjusted gap between them. The gap between the guide rails 50 is the same as when the transport mechanism 30 places the frame unit FU on the guide rails 50.

[0042] Finally, the transport mechanism 30 pushes out the frame unit FU arranged on the guide rails 50 and transports it to the cassette 10. As a result, the frame unit FU having the wafer W that has been machined is accommodated in the cassette 10.

[0043] During the series of processes described above, the processing device 1 adjusts the fixing force between the protective material T and the wafer W by irradiating the protective material T with ultraviolet light to appropriately adjust the adhesiveness of the protective material T. Specifically, the processing device 1 adjusts the fixing force between the protective material T and the wafer W by adjusting the adhesiveness of the protective material T, for example, before and after dicing, which divides the wafer W into chips. The fixing force adjustment before dicing is performed by appropriately hardening the adhesive layer of the protective material T to reduce its adhesiveness, thereby reducing the fixing force. This adjustment is performed during the process of transporting the frame unit FU from the cassette 10 to the guide rails 50. This appropriately hardens the glue layer (adhesive layer), preventing chip movement during dicing of the wafer W and contributing to suppressing chipping. The fixing force adjustment after dicing is performed by further reducing the adhesiveness of the protective material T, thereby reducing the fixing force. This adjustment is performed during the process of transporting the frame unit FU from the guide rails 50 to the cassette 10. This prevents a large stress from being applied to the chip when it is picked up from the frame unit FU.

[0044] Dicing may be performed in a device separate from the processing device 1. The processing device 1 may not have a processing unit such as a dicing unit, but may be a processing device independent of the processing unit, which includes a cassette for accommodating processed workpiece units, a transport unit, a fixing force reducing unit, and a marking unit, and performs the process of reducing the fixing force and marking.

[0045] Fig. 3 is a diagram illustrating the positional relationship between the transfer path and the light source unit. Fig. 4 is a diagram illustrating the positional relationship between the transfer path and the measurement unit and the gas supply unit. Below, with reference to Figs. 1 to 4, the light source unit 110, measurement unit 120, and gas supply unit 130 related to the process of adjusting the adhesiveness of the protective member T, i.e., the process of adjusting the fixing force between the protective member T and the wafer W, will be described in more detail.

[0046] First, we will explain the arrangement of the light source unit 110, the measurement unit 120, and the gas supply unit 130. As shown in Figures 1 and 2, the light source unit 110, the measurement unit 120, and the gas supply unit 130 are each arranged between the cassette 10 and the guide rail 50.

[0047] The light source unit 110 and the measurement unit 120 are arranged to face each other at a predetermined interval across the transport path between the cassette 10 and the guide rail 50. More specifically, as shown in Fig. 2, the light source unit 110 and the measurement unit 120 are arranged so that the UV light source 111 and the sensor 121 face each other at a predetermined interval across the transport path between the cassette 10 and the guide rail 50. The transport path between the cassette 10 and the guide rail 50 refers to a transport path in which the frame unit FU is transported between the cassette 10 and the guide rail 50, with the Y-axis direction as the transport direction, and is an example of a transport path for the frame unit FU by the transport mechanism 30.

[0048] The light source unit 110 and the gas supply unit 130 are arranged to face each other at a predetermined interval across the transport path between the cassette 10 and the guide rail 50. More specifically, as shown in FIG. 2 , the light source unit 110 and the gas supply unit 130 are arranged so that the UV light source 111 and the gas supply port 133 face each other at a predetermined interval across the transport path between the cassette 10 and the guide rail 50.

[0049] In other words, the light source unit 110 and the measurement unit 120 are arranged so that the frame unit FU being transported by the transport mechanism 30 passes between the light source unit 110 and the measurement unit 120. In addition, the light source unit 110 and the gas supply unit 130 are also arranged so that the frame unit FU being transported by the transport mechanism 30 passes between the light source unit 110 and the gas supply unit 130.

[0050] More specifically, the light source unit 110 is disposed on the side of the transfer path where the wafer W is not exposed, i.e., on the base material side of the protective member T. In contrast, the measurement unit 120 and the gas supply unit 130 are disposed on the side of the transfer path where the wafer W is exposed, i.e., on the adhesive layer side of the protective member T. The arrangement of each unit with respect to the transfer path is not limited to this example, but it is more desirable that the gas supply unit 130 be disposed on the adhesive layer side of the protective member T with respect to the transfer path in order to effectively prevent oxygen inhibition, which will be described later.

[0051] Next, we will explain the configurations and functions of the light source unit 110, the measurement unit 120, and the gas supply unit 130. The general configurations have already been described, and here we will explain the configuration and functions of each unit, focusing particularly on the shape and arrangement of the components within the unit.

[0052] 1 and 3, the light source unit 110 has a long shape extending along a direction intersecting the transport path between the cassette 10 and the guide rail 50. That is, the light source unit 110 has a relatively short width along the transport path (transport direction) and is configured compactly. The light source unit 110 further includes a plurality of UV light sources 111 aligned in a direction intersecting the transport path. Specifically, the plurality of UV light sources 111 are aligned in the X-axis direction, which is parallel to the surface of the wafer W (XY plane) and perpendicular to the transport direction (Y-axis direction).

[0053] With this configuration, the light source unit 110 can irradiate ultraviolet rays onto a UV irradiation area, which is an area on the transport path between the cassette 10 and the guide rail 50 and is a roughly rectangular area whose length is in a direction perpendicular to the transport direction. Furthermore, as the frame unit FU is transported along the transport path by the transport mechanism 30, the UV irradiation area moves relative to the frame unit FU and passes over the frame unit FU. Therefore, by emitting ultraviolet rays in accordance with the timing at which the frame unit FU is transported and the UV irradiation area moves relatively, the light source unit 110 can irradiate ultraviolet rays onto a wide area of ​​the protective material T with a compact configuration, thereby reducing the adhesiveness of a wide area of ​​the protective material T.

[0054] The light source unit 110 is desirably designed so that the longitudinal length of the UV irradiation area is at least longer than the diameter of the wafer W, preferably the diameter of the protective member T. Furthermore, the light source unit 110, which serves as a clamping force reducer, preferably reduces the clamping force, i.e., irradiates UV light, while transporting the workpiece unit (frame unit FU) by the transport unit (transport mechanism 30) in a direction intersecting the longitudinal direction of the UV irradiation area where UV light is irradiated. This allows UV light to be irradiated onto at least the entire area of ​​the protective member T that is bonded to the wafer W, preferably the entire protective member T, by simply moving the workpiece unit and the light source unit 110 relative to each other in a direction intersecting the extension direction of the light source unit 110, thereby adjusting the clamping force. Furthermore, if the light source unit 110 has multiple light-emitting elements, the number of emitting light-emitting elements may be adjusted depending on the diameter of the workpiece or the diameter of the protective member T that passes through the UV irradiation area where UV light is irradiated by the light source unit 110, thereby saving energy.

[0055] 1 and 4, the measurement unit 120 has a long shape extending along a direction intersecting the transport path between the cassette 10 and the guide rail 50. That is, the measurement unit 120 has a relatively short width in the transport direction and is configured compactly. The measurement unit 120 further includes a plurality of sensors 121 aligned in a direction intersecting the transport path. Specifically, the plurality of sensors 121 are aligned in the X-axis direction, which is parallel to the surface of the wafer W (the XY plane) and perpendicular to the transport direction (the Y-axis direction). This allows the UV light source 111 and the sensors 121 to be arranged facing each other with a predetermined gap between them across the transport path.

[0056] With this configuration, the measurement unit 120 can detect ultraviolet light emitted from the UV light source 111, pass through the UV irradiation area, and enter the sensor 121, and can measure the intensity of the received light. Therefore, it is possible to appropriately evaluate the intensity and amount of ultraviolet light irradiated onto the UV irradiation area from the received light intensity measured by the measurement unit 120. In addition, the measurement unit 120 can also obtain the spatial distribution of the received light intensity using the received light intensity measured for each sensor 121.

[0057] Furthermore, by outputting to the control unit 200 the received light intensity measured by the measurement unit 120 while the frame unit FU is being transported by the transport mechanism 30, the control unit 200 can determine whether the transport process between the cassette 10 and the guide rails 50 has been successful, and whether the process of adjusting the adhesiveness of the protective material T (the fixing force between the protective material T and the wafer W) has been successful. This is because the received light intensity at the sensor 121 changes depending on the transmittance of the ultraviolet light of the substances present in the UV irradiation area.

[0058] More specifically, if the relationship between the UV transmittance of the wafer W, protective member T, and frame F constituting the frame unit FU is known, the control unit 200 can identify which part of the frame unit FU is located in the UV irradiation area based on the received light intensity measured by the measurement unit 120. Then, based on the identification result, the position and posture (orientation) of the frame unit FU on the transport path can be grasped. Therefore, by tracking, that is, repeatedly identifying, the position and posture of the frame unit FU, the control unit 200 can determine whether the frame unit FU was transported as planned, that is, whether the transport process was successful. Furthermore, by considering the time required for transport, the amount of light irradiated to each area of ​​the protective member T can also be estimated. Therefore, in addition to the success or failure of the transport process, it is also possible to determine whether the adhesiveness of the protective member T was appropriately adjusted, that is, whether the adhesiveness adjustment process was successful.

[0059] An example of a case in which the transport process is determined to have failed is when the wafer W gets caught on a structure within the processing device 1 and is unable to be transported to the destination. An example of a case in which the process of adjusting the adhesiveness (fixing force) is determined to have failed is when the wafer W gets temporarily caught during transport and takes longer than expected to be transported through a predetermined section. In this case, a portion of the protective member T is excessively exposed to ultraviolet light, which may result in poor adjustment of the adhesiveness (fixing force).

[0060] Furthermore, by having the measurement unit 120 output the received light intensity to the control unit 200, the processing device 1 can omit from the conveying mechanism 30 structures for identifying the conveying position, such as a motor with an encoder that detects the amount of rotation, a scale that measures the amount of linear movement, etc., thereby simplifying the configuration of the conveying mechanism 30.

[0061] 2 and 4, the gas supply unit 130 includes a rectangular gas supply port 133 formed in the measurement unit 120 and elongated in a direction intersecting the transfer path. A plurality of gas supply paths 132 are formed at the bottom of the gas supply port 133 along the longitudinal direction of the gas supply port 133, and each is connected to a gas supply source 131. Specifically, the plurality of gas supply paths 132 are aligned in the X-axis direction, which is parallel to the surface of the wafer W (XY plane) and perpendicular to the transfer direction (Y-axis direction). This allows the UV light source 111 and the gas supply port 133 to be arranged facing each other with a predetermined gap between them across the transfer path.

[0062] This configuration allows the gas supply unit 130 to supply inert gas to the UV irradiation area irradiated with ultraviolet light by the light source unit 110, thereby enabling the area to which the gas is supplied (hereinafter referred to as the gas supply area) to correspond to the UV irradiation area. This suppresses oxygen inhibition, which occurs when the adhesive layer of the protective member T located in the UV irradiation area reacts with oxygen in the air, and more reliably reduces adhesion through UV curing. In particular, supplying inert gas from the adhesive layer side toward the adhesive layer in the UV irradiation area more effectively suppresses oxygen inhibition. Furthermore, by continuously supplying gas while the frame unit FU is being transported by the transport mechanism 30, a structure to prevent gas from escaping from the UV irradiation area is not required. This allows the gas supply unit 130 to be compact and can be incorporated into the housing of the measurement unit 120. This also contributes to the miniaturization of the processing device 1.

[0063] It is desirable that the gas supply unit 130 be designed so that the longitudinal length of the gas supply region is at least longer than the diameter of the wafer W. This makes it possible to suppress oxygen inhibition at least in the region of the protective member T that is attached to the wafer W. It is even more desirable that the gas supply unit 130 be designed so that the longitudinal length of the gas supply region is longer than the diameter of the outer edge of the protective member T. This makes it possible to suppress oxygen inhibition over the entire region of the protective member T.

[0064] As described above, the processing apparatus 1 is provided with at least the light source unit 110 near the transport path of the frame unit FU, and preferably further includes the measurement unit 120 and the gas supply unit 130, so that the transport process of the frame unit FU can be used to reduce the adhesiveness of any region of the protective material T. This makes it possible to reduce the size of each unit in the transport direction, and the entire apparatus can be configured compactly.

[0065] Furthermore, the processing apparatus 1 includes the light source unit 110 and the gas supply unit 130 near the transport path of the frame unit FU transported by the transport mechanism 30 so that the UV irradiation area corresponds to the gas supply area. This allows for a compact configuration to suppress oxygen inhibition, efficiently adjust the adhesion of any desired area, and adjust the fixing force between the protective material T and the wafer W. Specifically, compared to, for example, storing the frame unit FU in a dedicated gas chamber and irradiating the frame unit FU with UV rays within the gas chamber, using the transport path eliminates the need to secure a dedicated space, thereby enabling space savings. Furthermore, by utilizing the transport (movement) of the frame unit FU, it is not necessary to move the UV light source 111 to irradiate the desired area with UV rays, and a mechanism for moving the UV light source 111 can be omitted, thereby enabling space savings.

[0066] Furthermore, by providing a measurement unit 120 near the transport path of the frame unit FU by the transport mechanism 30, the processing device 1 can determine whether the transport process and the process of adjusting the adhesiveness (fixing force) have been performed appropriately. Therefore, by performing processing according to the determination result, it is possible to maintain the quality of the products processed by the processing device 1. Furthermore, by recording the determination result, it is possible to ensure the traceability of the products processed by the processing device 1.

[0067] The processing device 1 is configured to further perform a marking process using a marking unit 140 on the transport path where a process for adjusting the adhesiveness of the protective material T (the fixing force between the protective material T and the wafer W) is performed. The marking unit 140 is provided above the guide rails 50, for example, as shown in FIGS. 1 and 2, and forms a mark on the wafer W or the protective material T while the frame unit FU is being transported from the cassette 10 to the guide rails 50 or while the frame unit FU is placed on the guide rails 50. Below, the advantages obtained by the marking unit 140 forming a mark on the transport path will be described.

[0068] By arranging the marking unit 140 near the transport path and configuring it to form marks on the frame units FU on the transport path, it is possible to change the position of the frame units FU relative to the marking unit 140 using the transport mechanism 30. Therefore, there is no need to provide a mechanism for moving the marking unit 140 itself to position the frame unit FU at a desired position relative to the marking unit 140, and even if such a movement mechanism is provided, a simple mechanism can be adopted, such as a mechanism that moves only in a direction perpendicular to the transport direction. Therefore, the processing device 1 can be configured compactly.

[0069] Furthermore, by arranging the marking unit 140 near a transport path having a UV irradiation area and forming marks on the frame units FU on that transport path, the throughput of the processing apparatus 1 can be improved. When various processes are performed on the frame units FU on the transport path, the transport speed on that transport path can be adjusted according to each process. By arranging the marking unit 140 near a transport path having a UV irradiation area and performing the process of adjusting the adhesion of the protective material T (the fixing force between the protective material T and the wafer W) and the process of forming marks on the same transport path, the number of transport paths that require transport speed adjustment can be reduced. This makes it possible to increase the number of transport paths that can be moved at high transport speeds, contributing to improving the throughput of the processing apparatus 1.

[0070] As described above, according to the processing device 1, by arranging the marking unit 140 so as to perform processing on the same transport path as the light source unit 110, it is possible to achieve a higher throughput with a more compact configuration than before.

[0071] 5 to 7 are diagrams showing how a frame unit is transported from a cassette to a guide rail. Fig. 8 is a diagram showing an example of the change over time in the received light intensity measured by the measurement unit. Below, with reference to Figs. 5 to 8, we will explain typical examples of patterns of received light intensity obtained when transporting a frame unit FU from a cassette 10 to a guide rail 50, and a specific example of a method for determining whether the processing was successful.

[0072] The intensity of the received ultraviolet light detected by the sensor 121 provided near the center of the measurement unit 120 forms a pattern as shown in FIG. 8 while the frame unit FU is transported from the cassette 10 to the guide rail 50.

[0073] First, at time tA, when a transport instruction is input to the processing device 1 and ultraviolet irradiation and measurement are initiated, the frame unit FU is still in the cassette 10, and there is nothing blocking the path between the light source unit 110 and the measurement unit 120. Therefore, a high value IC is measured as the received light intensity. Thereafter, the value IC continues to be measured for a while (from time tA to time tB) until the frame unit FU is drawn into the UV irradiation area by the transport mechanism 30. When the frame unit FU is drawn into the UV irradiation area, the frame F first overlaps the UV irradiation area. The frame F is made of metal with low transmittance to ultraviolet light, and when the frame F overlaps the UV irradiation area, the amount of ultraviolet light reaching the sensor 121 decreases. As a result, at time tB, when the frame F begins to overlap the UV irradiation area, the measured received light intensity drops sharply from value IC to value IA, and the value IA is continuously measured during the period when the frame F overlaps the UV irradiation area (from time tB to time tC).

[0074] As the transfer progresses, the protective member T overlaps the UV irradiation area. The UV transmittance of the protective member T is higher than that of the frame F. Therefore, the received light intensity measured at time tC when the protective member T begins to overlap the UV irradiation area increases from value IA to value IB. After that, when the protective member T passes through the UV irradiation area and the wafer W overlaps the UV irradiation area, the received light intensity measured at time tD decreases from value IB to value IA, and continues to be measured at value IA while the wafer W overlaps the UV irradiation area (from time tD to time tE). This is because silicon, the material of the wafer W, has a lower UV transmittance than the protective member T. Note that the value measured during the period when the frame F overlaps the UV irradiation area (from time tB to time tC) does not necessarily match the value measured during the period when the wafer W overlaps the UV irradiation area (from time tD to time tE). However, in both cases, the measured values ​​are lower than the value IB measured during the period when the protective member T overlaps (from time tC to time tD).

[0075] As transport continues, when protective member T overlaps the UV irradiation area again, the received light intensity measured at time tE rises from value IA to value IB. After that, when protective member T passes through the UV irradiation area and frame F overlaps the UV irradiation area, the received light intensity measured at time tF falls from value IB to value IA. Furthermore, when frame F passes through the UV irradiation area at time tG, there is no longer any obstruction, so the received light intensity rises again to value IC, and then measurement ends at time tH.

[0076] As described above, during transport of the frame unit FU, materials with high and low transmittance alternately pass through the UV irradiation area in the following order: frame F (low transmittance), protective member T (high transmittance), wafer W (low transmittance), protective member T (high transmittance), and frame F (low transmittance). Therefore, as shown in FIG. 8, for example, six change points (time tB, time tC, time tD, time tE, time tF, and time tG) are detected. Detection of each change point may be performed by comparing the amount of change in the received light intensity with a threshold value, or by detecting whether the absolute value of the received light intensity has changed to a value within a predetermined range. The control unit 200 may determine whether transport was performed appropriately based on whether an expected change point is detected within a predetermined time.

[0077] In order to appropriately adjust the adhesiveness (fixing force), the transport speed when transporting the frame unit FU from the cassette 10 to the guide rail 50 is predetermined in relation to the intensity of the ultraviolet light emitted from the light source unit 110. Therefore, the elapsed time from the start of transport until each change point is detected is also known, and an allowable range for the elapsed time until the change point is detected can also be set in advance. The control unit 200 may verify whether the transport was performed at the scheduled transport speed by determining whether a change point is detected within the elapsed time within such a predetermined allowable range, and thereby determine whether the process of adjusting the adhesiveness (fixing force) was performed appropriately.

[0078] Furthermore, the pattern of received light intensity as shown in FIG. 8 may differ depending on the position of the sensor 121 that detects ultraviolet light. For example, if measurement is performed using a sensor 121 located near the center of the measurement unit 120, the UV irradiation area crosses an area equivalent to the diameter of the wafer W, resulting in a longer period from time tD to time tE. In contrast, the closer the sensor 121 is to the edge of the measurement unit 120, the shorter the period from time tD to time tE. Not only do such differences in the time difference between change points differ, but the number of change points themselves may also differ. For example, the sensor 121 located at the edge of the measurement unit 120 does not cross the wafer W during transport. Therefore, the received light intensity measured using such a sensor 121 does not exhibit the intensity changes that occur at times tD and tE shown in FIG. 8, resulting in a pattern with only four change points. The control unit 200 may determine whether such a pattern corresponding to the position of the sensor 121 is correctly detected, thereby determining whether an abnormality in the posture of the frame unit FU exists.

[0079] When an abnormality is detected by the determination, the control unit 200 may record the abnormality and then stop the processing, or in addition to or instead of stopping the processing, may notify an operator or the like of the error. Alternatively, the control unit 200 may simply record the abnormality without stopping the processing or notifying an error.

[0080] The embodiments of the present invention are not limited to the above-described embodiments, and may be variously modified, substituted, or altered without departing from the spirit and scope of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological advances or other derived technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention.

[0081] FIG. 9 is a diagram schematically illustrating the transport path within the processing apparatus 1. In the above-described embodiment, the light source unit 110, the measurement unit 120, the gas supply unit 130, and the marking unit 140 are arranged so that each unit performs processing on the transport path Ra between the cassette 10 and the guide rail 50. However, the arrangement of these units is not limited to this example. These units may be arranged between the loading / unloading position and the cutting position of the chuck table 60, for example, so that they perform processing on the transport path Rc shown in FIG. 9. Furthermore, these units may be arranged between the guide rail 50 and the cleaning unit 150, for example, so that they perform processing on the transport path Rd shown in FIG. 9.

[0082] In the above-described embodiment, an example was shown in which the adhesiveness (fixing force) adjustment process and the marking process were performed on the outbound and return paths of the same conveying path, but these processes may be performed on at least one of the outbound and return paths. For example, only the fixing force adjustment process may be performed on the outbound path and only the marking process may be performed on the return path, or the fixing force adjustment process and the marking process may be performed on both the outbound and return paths. If it is sufficient to achieve a predetermined fixing force between the time the protective member T is removed from the cassette 10 and returned to the cassette 10, the conveying speed on the outbound and return paths can be increased by irradiating the protective member T with different amounts of light to achieve the predetermined fixing force on the outbound and return paths.

[0083] In the above-described embodiment, an example has been shown in which the light source unit 110 and the measurement unit 120 are arranged upstream of the marking unit 140 in the transport direction (closer to the cassette 10), but the arrangement of the light source unit 110 and the measurement unit 120 and the marking unit 140 is not limited to this example. However, if it is necessary to include information about the processing result in the mark, it is desirable to arrange the marking unit 140 downstream of the point where the processing corresponding to the processing result to be included in the mark is performed.

[0084] In the above-described embodiment, an example of adjusting the adhesiveness of an ultraviolet-curing adhesive tape was described. However, the adhesiveness-adjusting tape is not limited to ultraviolet-curing tape, and the stimulus for reducing the adhesiveness is not limited to light energy. The stimulus may be, for example, thermal energy, pressure, or a form in which a fluid or a nail is inserted between the workpiece and the protective member, or a combination of these. The adhesiveness-adjusting tape may be, for example, a thermosetting adhesive tape or a tape using a pressure-sensitive adhesive. When a thermosetting adhesive tape is used, the fixing force reducing section for reducing the adhesiveness of the tape may employ a dryer that blows warm air onto the protective member T, or the temperature may be measured using a temperature sensor instead of the received light intensity.

[0085] In the above-described embodiment, an example has been shown in which the processing apparatus 1 transports a frame unit FU, but the workpiece unit handled by the processing apparatus 1 is not limited to the frame unit FU. It may be anything that includes a wafer W to which a protective member T is attached. The wafer W to which the protective member T is attached may be transported itself. In this case, too, the marking unit 140 may form a mark on at least one of the wafer W or the protective member T.

[0086] In the above-described embodiment, the light source unit 110 and the gas supply unit 130 are disposed opposite each other across the transfer path, but the light source unit 110 and the gas supply unit 130 may be disposed on the same side of the transfer path as long as the UV irradiation area and the gas supply area roughly correspond to each other. In this case, it is desirable to dispose the light source unit 110 and the gas supply unit 130 on the adhesive layer side where the wafer W is exposed so that the inert gas can effectively act on the adhesive layer of the protective member T.

[0087] In the above-described embodiment, an example was shown in which the process for adjusting adhesiveness (fixing force) and the marking process were performed on the same transport path, but each process only needs to be performed on the transport path, regardless of whether the frame unit FU is moving or stationary. Each process may be performed while the frame unit FU is moving, or while the frame unit FU is stopped during repeated stops and movements.

[0088] In the above-described embodiment, an example was shown in which it was determined based on the received light intensity whether the transport process and the process of adjusting the adhesiveness (fixing force) were performed normally, but the received light intensity used for the determination may be measured using a specific sensor 121 in the measurement unit 120, or may be an average of the received light intensities measured using multiple sensors 121. Furthermore, a determination process may be performed based on the received light intensities measured using each sensor 121, and a final determination may be made by combining these multiple determination results.

[0089] Although not specifically mentioned in the above-described embodiment, the processing device 1 is configured to adjust the ultraviolet irradiation intensity when the cumulative ultraviolet irradiation amount required to achieve the desired adhesiveness (fixing force) is set. In other words, the processing device 1 achieves high throughput by setting the conveying speed to the maximum speed and adjusting the ultraviolet irradiation intensity to ensure the required cumulative irradiation amount. However, if the required cumulative irradiation amount is large and the required light amount cannot be ensured by adjusting the ultraviolet irradiation intensity alone, the conveying speed may be adjusted. [Industrial Applicability]

[0090] As described above, the processing device of the present invention is compact and capable of adjusting the fixing force between the protective member fixed to the workpiece and the workpiece, and of marking the protective member or the workpiece, making it useful in processing devices that handle workpieces to which a protective member is fixed. [Explanation of symbols]

[0091] 1 Processing equipment 10 cassettes 30 Conveying mechanism 50 guide rail 90 Transport mechanism 110 Light source unit 111 UV light source 120 measurement units 121 Sensors 130 Gas supply unit 131 Gas Supply Source 132 Gas supply line 133 Gas supply port 140 Marking section 200 Control Unit F Frame FU Frame Unit Ra, Rb, Rc, Rd transport route T Protective member W wafer

Claims

1. A processing device for processing a protective member of a workpiece unit in which the protective member is fixed to the workpiece, a transport unit that transports the workpiece unit; a fixing force reducing section that reduces the fixing force of the protection member to the workpiece along a transport path of the workpiece unit by the transport section; a marking unit that forms a mark on at least one of the protection member and the workpiece along the transport path of the workpiece unit by the transport unit; A processing device comprising:

2. The fixing force reducing portion is characterized by providing a stimulus to the protective member. The processing device of claim 1 .

3. the retention force reduction portion includes a UV light source; The UV light source further includes a gas supply unit that supplies an inert gas to the UV irradiation region of the UV light source. The processing device of claim 1 .

4. 1. A method for processing a protective member of a workpiece unit in which the protective member is fixed to a workpiece, comprising: a transport step of transporting the workpiece unit; a fixing force reducing step of reducing the fixing force of the protection member to the workpiece in a transport path of the workpiece unit by a transport section; a marking step of forming a mark on at least one of the protection member and the workpiece along the transport path of the workpiece unit by the transport unit; A processing method comprising:

Images