Detection device, semiconductor chip, and detection method

Abstract

To provide a technique for easily detecting a defect in a semiconductor chip.SOLUTION: The detection device 20 includes a detection unit 24 that detects the resistance value of the wiring portion 150 arranged along the outer edge portion 102 of the semiconductor chip 10. When there is no defect in the wiring portion 150, the detection unit 24 detects a first resistance value that the non-defective wiring portion 150 should have, and when there is a defect in the wiring portion 150, the detection unit 24 detects a second resistance value that is higher than the first resistance value.SELECTED DRAWING: Figure 2

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