Multilayer ceramic capacitor

Abstract

To provide a multilayer ceramic capacitor in which cracks are hard to occur and which is excellent in moisture resistance.SOLUTION: The multilayer ceramic capacitor includes a multilayer body 2 having a first surface A1 and a second surface A2 opposed to each other in a height direction T, a third surface C1 and a fourth surface C2 opposed to each other in a first direction L orthogonal to the height direction T, and a fifth surface B1 and a sixth surface B2 opposed to each other in a second direction W orthogonal to the height direction T and the first direction L, and a plurality of first base electrodes disposed on the third surface C1, the first surface A1, the second surface A2, the fifth surface, and the sixth surface. B1 B2 30A, and a second base electrode 30B disposed on the fourth surface C2, on the first surface A1, on the second surface A2, on the fifth surface B1, and on the sixth surface B2, wherein the first base electrode 30A is disposed on the first surface A1 and includes a first surface inner region A1 within about 1 μm in the height direction T from the first surface, and a concentration of Ni in the first surface inner region is lower than a concentration of Ni in the third surface inner region. 32A1 32A1 C1.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a multilayer ceramic capacitor. [Background technology]

[0002] In conventional multilayer ceramic capacitors, for example, the internal electrodes are primarily composed of Ni or Cu, and the external electrodes are formed by baking a metal paste made of Cu or the like. In contrast, the multilayer ceramic capacitor described in Patent Document 1 has internal electrodes primarily composed of Ni or Cu, and external electrodes made of an underlying conductor film containing an alloy of Cu and Ni and a glass component. According to the multilayer ceramic capacitor described in Patent Document 1, if the distribution of the metal component and the glass component in the underlying conductor film is uniform, the stress generated during baking becomes uniform in the underlying conductor film, and the occurrence of cracks in the laminate can be suppressed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-27987 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the multilayer ceramic capacitor described in Patent Document 1, during the process of firing the metal paste for the base conductor film, which contains a Cu-Ni alloy and a glass component, there is a possibility that cracks will occur in the laminate due to over-sintering of the metal paste. Furthermore, if the sintering conditions are relaxed to prevent over-sintering of the metal paste, there is a possibility that the metal paste will not be sufficiently sintered, resulting in an increase in porosity in the external electrodes and a deterioration in moisture resistance. Furthermore, multilayer ceramic capacitors using a Ni-Cu alloy as the metal paste will have poorer moisture resistance than multilayer ceramic capacitors using Cu as the metal paste, and there is a possibility that the ESR (equivalent series resistance) will decrease when Ni is used for the internal electrodes.

[0005] An object of the present invention is to provide a multilayer ceramic capacitor that is less susceptible to cracking and has excellent moisture resistance. [Means for solving the problem]

[0006] In order to solve the above problems, the present invention provides a laminate having a first surface and a second surface that face each other in a height direction, a third surface and a fourth surface that face each other in a first direction that is orthogonal to the height direction, and a fifth surface and a sixth surface that face each other in a second direction that is orthogonal to the height direction and the first direction, and a first external electrode that is disposed on the third surface, the first surface, the second surface, the fifth surface, and the sixth surface, and a second external electrode that is disposed on the fourth surface, the first surface, the second surface, the fifth surface, and the sixth surface, wherein the first external electrode and the second external electrode have a first base electrode and a second base electrode that contain Cu, respectively, and the first base electrode is disposed on the first surface. a first surface inner region within 1 μm from the first surface in the height direction, a second surface inner region disposed on the second surface and within 1 μm from the second surface in the height direction, a third surface inner region disposed on the third surface and within 1 μm from the third surface in the first direction, a fifth surface inner region disposed on the fifth surface and within 1 μm from the fifth surface in the second direction, and a sixth surface inner region disposed on the sixth surface and within 1 μm from the sixth surface in the second direction, wherein the first surface inner region and the third surface inner region contain Ni, and the Ni concentration in the first surface inner region is lower than the Ni concentration in the third surface inner region. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a multilayer ceramic capacitor that is less susceptible to cracking and has excellent moisture resistance. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic perspective view of a multilayer ceramic capacitor 1 in accordance with a first embodiment. [Figure 2]2 is a partial cross-sectional view of the multilayer ceramic capacitor 1 taken along line II-II in FIG. [Figure 3] 3 is a cross-sectional view of the multilayer ceramic capacitor 1 taken along line III-III in FIG. [Figure 4] 1 is a flowchart of a method for manufacturing the multilayer ceramic capacitor 1 in accordance with the first embodiment. [Figure 5] 10 is a table showing the results of a substrate bending test and a moisture resistance test. [Figure 6] FIG. 1 is a schematic perspective view of a multilayer ceramic capacitor 100 in accordance with a second embodiment. [Figure 7] 7 is a partial cross-sectional view of the multilayer ceramic capacitor 100 taken along line VII-VII in FIG. [Figure 8] 8 is a cross-sectional view of the multilayer ceramic capacitor 100 taken along line VIII-VIII in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] (First embodiment) A first embodiment of the present invention will now be described. Fig. 1 is a schematic perspective view of a multilayer ceramic capacitor 1 according to the first embodiment. Fig. 2 is a partial cross-sectional view of the multilayer ceramic capacitor 1 taken along line II-II in Fig. 1. Fig. 3 is a cross-sectional view of the multilayer ceramic capacitor 1 taken along line III-III in Fig. 1.

[0010] The multilayer ceramic capacitor 1 includes a laminate 2 having a substantially rectangular parallelepiped shape and a pair of external electrodes 3 provided on both ends of the laminate 2. The laminate 2 also includes an effective portion 6 including multiple pairs of dielectric layers 4 and internal electrodes 5.

[0011] In the following description, the direction perpendicular to the mounting surface is referred to as the height direction T, which is a term used to describe the orientation of the multilayer ceramic capacitor 1. In this embodiment, the lamination direction in which the internal electrodes 5 and the dielectric layers 4 are stacked is referred to as the direction perpendicular to the mounting surface, i.e., the height direction T. However, this is not limiting, and the lamination direction in which the internal electrodes 5 and the dielectric layers 4 are stacked may be referred to as the direction horizontal to the mounting surface, and the height direction T may be referred to as the direction perpendicular to the lamination direction in which the internal electrodes 5 and the dielectric layers 4 are stacked.

[0012] The direction in which the pair of external electrodes 3 are provided is defined as a first direction L. A direction intersecting both the first direction L and the height direction T is defined as a second direction W. In the embodiment, the first direction L, the second direction W, and the height direction T are perpendicular to one another.

[0013] (Laminate 2) The laminate 2 has a substantially hexahedral shape having a first surface A1 and a second surface A2 facing in the height direction T, a third surface C1 and a fourth surface C2 facing in the first direction L, and a fifth surface B1 and a sixth surface B2 facing in the second direction W. In this embodiment, the first surface A1 is the mounting surface to be mounted on a substrate.

[0014] When the area between two adjacent faces of the laminate 2 is defined as a ridgeline and the areas between three adjacent faces are defined as corners, it is preferable that the ridgeline and corners have rounded edges, which can prevent chipping at the angular portions of the laminate 2.

[0015] The laminate 2 includes an effective portion 6 and an ineffective portion 7. The effective portion 6 is a region where the internal electrodes 5 and the dielectric layers 4 are laminated. The ineffective portion 7 is a region where the internal electrodes 5 are not arranged, and includes outer layer portions 7A that sandwich the effective portion 6 in the height direction T, and side gap portions 7B that sandwich the effective portion 6 in the second direction W.

[0016] (Dielectric layer 4) The dielectric layer 4 preferably contains, as a main component, for example, a BT-based or CZ-based ceramic material, and may contain a sintering aid as an additive.

[0017] (Internal electrode 5) The internal electrode 5 includes a plurality of first internal electrodes 5A and a plurality of second internal electrodes 5B. The first internal electrodes 5A and the second internal electrodes 5B are arranged alternately. For example, the first internal electrodes 5A are exposed on the third surface C1, and the second internal electrodes 5B are exposed on the fourth surface C2. Note that, unless it is necessary to distinguish between the first internal electrodes 5A and the second internal electrodes 5B, they will be collectively referred to as the internal electrodes 5.

[0018] The components of the internal electrodes 5 are not particularly limited, but are preferably formed from metal materials such as nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), a silver-palladium (Ag-Pd) alloy, and gold (Au). Furthermore, by including Sn at the interface between the internal electrode 5 and the dielectric layer 4, electric field concentration at the interface can be alleviated, leading to improved high-temperature load reliability. In this case, Sn can be effective even if it is included in only one of the first internal electrode 5A and the second internal electrode 5B.

[0019] The internal electrodes 5 include opposing portions 52 that face each other between the first internal electrode 5A and the second internal electrode 5B, and lead portions 51 that do not face each other between the first internal electrode 5A and the second internal electrode 5B and are drawn from the opposing portions 52 toward one of the third surface C1 and the fourth surface C2. The extending directions of the lead portions 51 differ between the first internal electrode 5A and the second internal electrode 5B, and the lead portions 51 are drawn alternately toward the third surface C1 and the fourth surface C2. An end of the lead portion 51 of the first internal electrode 5A is exposed on the third surface C1 and electrically connected to the first external electrode 3A. An end of the lead portion 51 of the second internal electrode 5B is exposed on the fourth surface C2 and electrically connected to the second external electrode 3B. An electric charge is accumulated between the opposing portions 52 of the first internal electrode 5A and the second internal electrode 5B that are adjacent in the height direction T, functioning as a capacitor.

[0020] (Outer layer part 7A) The outer layer portions 7A are disposed on the first surface A1 side and the second surface A2 side of the effective portion 6. The outer layer portions 7A may be made of the same material as the dielectric layer 4 of the effective portion 6.

[0021] (Side gap part 7B) The side gap portions 7B are respectively arranged on the fifth surface B1 side and the sixth surface B2 side of the effective portion 6 of the laminate 2. The side gap portions 7B may be made of the same material as the dielectric layer 4.

[0022] (External electrode 3) The external electrode 3 includes a first external electrode 3A and a second external electrode 3B. The first external electrode 3A is disposed on the third surface C1, and extends from the third surface C1 onto the first surface A1, the second surface A2, the fifth surface B1, and the sixth surface B2. The second external electrode 3B is disposed on the fourth surface C2, and extends from the fourth surface C2 onto the first surface A1, the second surface A2, the fifth surface B1, and the sixth surface B2. Hereinafter, unless it is necessary to distinguish between the first external electrode 3A and the second external electrode 3B, they will be referred to as the external electrode 3.

[0023] The external electrode 3 includes a base electrode 30 disposed on the outer surface of the laminate 2, and a plating layer 31 disposed on the base electrode 30. The base electrode 30 contains Cu as a main component and also contains a glass component.

[0024] The plating layer 31 preferably includes an intermediate plating layer disposed on the base electrode 30 and a top plating layer disposed on the intermediate plating layer. In this embodiment, the intermediate plating layer is a Ni plating layer 31a, and the top plating layer is a Sn plating layer 31b.

[0025] The Ni plating layer 31a can prevent the base electrode 30 from being eroded by solder when mounting a ceramic electronic component, and the Sn plating layer 31b improves the wettability of the solder when mounting the multilayer ceramic capacitor 1, allowing for easy mounting.

[0026] (Inner area 32, outer area 33) The base electrode 30 is disposed on the outer surface of the laminate 2, and has an inner region 32 within a range of 1 μm from the outer surface of the laminate 2. The base electrode 30 also has an outer region 33 within a range of 1 μm from the outermost surface of the base electrode 30, i.e., within a range of 1 μm from the plating layer 31 to the inside.

[0027] (1st external electrode 3A) Regarding the first external electrode 3A, the first external electrode 3A comprises a first base electrode 30A arranged on the third surface C1, the first surface A1, the second surface A2, the fifth surface B1, and the sixth surface B2 of the laminate 2, and a plating layer 31 arranged on the first base electrode 30A.

[0028] The inner region 32 of the first base electrode 30A includes a third surface inner region 32C1 within 1 μm of the third surface C1, a first surface inner region 32A1 within 1 μm of the first surface A1, a second surface inner region 32A2 within 1 μm of the second surface A2, a fifth surface inner region 32B1 within 1 μm of the fifth surface B1, and a sixth surface inner region 32B2 within 1 μm of the sixth surface B2.

[0029] The outer region 33 of the first base electrode 30A includes a third surface outer region 33C1 within 1 μm of the outermost surface of the base electrode 30 arranged on the third surface C1, a first surface outer region 33A1 within 1 μm of the outermost surface of the base electrode 30 arranged on the first surface A1, a second surface outer region 33A2 within 1 μm of the outermost surface of the base electrode 30 arranged on the second surface A2, a fifth surface outer region 33B1 within 1 μm of the outermost surface of the base electrode 30 arranged on the fifth surface B1, and a sixth surface outer region 33B2 within 1 μm of the outermost surface of the base electrode 30 arranged on the sixth surface B2.

[0030] (Second external electrode 3B) Regarding the second external electrode 3B, the second external electrode 3B comprises a second base electrode 30B arranged on the fourth surface C2, the first surface A1, the second surface A2, the fifth surface B1, and the sixth surface B2 of the laminate 2, and a plating layer 31 arranged on the second base electrode 30B.

[0031] The inner region 32 of the second base electrode 30B includes a fourth surface inner region 32C2 within 1 μm of the fourth surface C2, a first surface inner region 32A1 within 1 μm of the first surface A1, a second surface inner region 32A2 within 1 μm of the second surface A2, a fifth surface inner region 32B1 within 1 μm of the fifth surface B1, and a sixth surface inner region 32B2 within 1 μm of the sixth surface B2.

[0032] The outer region 33 of the second base electrode 30B includes a fourth surface outer region 33C2 within 1 μm of the outermost surface of the base electrode 30 arranged on the fourth surface C2, a first surface outer region 33A1 within 1 μm of the outermost surface of the base electrode 30 arranged on the first surface A1, a second surface outer region 33A2 within 1 μm of the outermost surface of the base electrode 30 arranged on the second surface A2, a fifth surface outer region 33B1 within 1 μm of the outermost surface of the base electrode 30 arranged on the fifth surface B1, and a sixth surface outer region 33B2 within 1 μm of the outermost surface of the base electrode 30 arranged on the sixth surface B2.

[0033] (1-1) Ni concentration in the inner region of the first surface A1 and the inner region of the third surface C1 or fourth surface C2 The Ni concentration in the first-surface inner region 32A1 of the first surface A1, which is the mounting surface, is preferably lower than the Ni concentration in the third-surface inner region 32C1 or the fourth-surface inner region 32C2. The Ni concentration in the first-surface inner region 32A1 of the first surface A1, which is the mounting surface, is preferably 4.2% or more and 8.6% or less. Note that in this specification, "%" indicating concentration is in at%. The Ni concentration in the third-surface inner region 32C1 or the fourth-surface inner region 32C2 is preferably 20.8% or more and 26.2% or less. This improves the moisture resistance of the multilayer ceramic capacitor 1 while ensuring connectivity between the internal electrodes 5 and the external electrodes 3.

[0034] In the embodiment, when the multilayer ceramic capacitor 1 is mounted on a substrate, if the substrate is bent or the like, the bending stress may cause cracks to occur on the first surface A1 side, which is the mounting surface of the laminate 2.

[0035] Here, in the base electrode 30 formed on the first surface A1, the lower the Ni concentration in the first surface inside region 32A1, the more densified the first surface inside region 32A1 of the base electrode 30. When the Ni concentration in the first surface inside region 32A1 is lower than 4.2%, cracks are less likely to occur in the portion of the first surface A1 where the external electrode 3 is formed, and cracks are more likely to occur in the portion where the external electrode 3 is not formed.

[0036] Furthermore, in the base electrode 30 formed on the first surface A1, the higher the Ni concentration in the first surface inner region 32A1, the more voids there are in the first surface inner region 32A1 of the base electrode 30. If the Ni concentration in the first surface inner region 32A1 is greater than 8.6%, the increased voids make it more likely that moisture will enter from the outside, causing IR (insulation resistance) degradation.

[0037] However, in this embodiment, the Ni concentration in the first-surface inner region 32A1 is lower than the Ni concentration in the third-surface inner region 32C1 or the fourth-surface inner region 32C2. The Ni concentration in the first-surface inner region 32A1 is 4.2% or more and 8.6% or less. Therefore, cracks are less likely to occur on the outer surface of the laminate 2, and IR degradation due to moisture intrusion from the outside is also less likely to occur.

[0038] (1-2) Ni concentration in the inner regions of the second surface A2, the fifth surface B1, and the sixth surface B2 other than the first surface A1 Like the Ni concentration of the first surface inner region 32A1, the Ni concentrations of the second surface inner region 32A2, the fifth surface inner region 32B1 and the sixth surface inner region 32B2 are also lower than the Ni concentration of the third surface inner region 32C1 or the fourth surface inner region 32C2, and are preferably 4.2% or more and 8.6% or less.

[0039] If only the Ni concentration in the first surface inner region 32A1 is lower than the Ni concentration in the third surface inner region 32C1 or the fourth surface inner region 32C2, that is, 4.2% or more and 8.6% or less, it is necessary to identify the first surface A1 as the mounting surface when mounting the multilayer ceramic capacitor 1 on a substrate. However, if not only the first surface inner region 32A1 but also the second surface inner region 32A2, the fifth surface inner region 32B1, and the sixth surface inner region 32B2 have lower Ni concentrations than the Ni concentration in the third surface inner region 32C1 or the fourth surface inner region 32C2, that is, 4.2% or more and 8.6% or less, any surface may be used as the mounting surface, making it unnecessary to select the orientation of the multilayer ceramic capacitor 1 during mounting.

[0040] (2-1) Ni concentration ratio between the inner region 32 of the first surface A1 and the inner region 32 of the third surface C1 or the fourth surface C2 Furthermore, the Ni concentration ratio obtained by dividing the Ni concentration in the first surface inner region 32A1 by the Ni concentration in the inner region 32 of the third surface C1 or fourth surface C2 is preferably 20.19% or more and 32.82% or less.

[0041] (2-2) Ni concentration ratio between the inner regions 32 of the second surface A2, the fifth surface B1, and the sixth surface B2 other than the first surface A1, and the inner regions 32 of the third surface C1 or the fourth surface C2 Furthermore, it is preferable that not only the first surface inner region 32A1 but also the second surface inner region 32A2, the fifth surface inner region 32B1 and the sixth surface inner region 32B2 have an Ni concentration ratio divided by the Ni concentration of the third surface inner region 32C1 of 20.19% or more and 32.82% or less.

[0042] (3-1) Comparison of Ni concentration between inner region 32 and outer region 33 on first surface A1 The Ni concentration in the first surface inner region 32A1 is preferably higher than the Ni concentration in the first surface outer region 33A1. By making the Ni concentration in the first surface inner region 32A1 closer to the laminate 2 higher than the Ni concentration in the first surface outer region 33A1, it is possible to improve the effect of preventing moisture from entering the laminate 2. This makes it possible to suppress deterioration in moisture resistance.

[0043] (3-2) Comparison of Ni concentration between the inner region 32 and the outer region 33 on the second surface A2, the fifth surface B1, and the sixth surface B2 other than the first surface A1 The Ni concentration in the inner region 32 is preferably higher than the Ni concentration in the outer region 33 not only on the first surface A1 but also on the second surface A2, the fifth surface B1, and the sixth surface B2. This makes it possible to increase the Ni concentration in the inner region 32 close to the laminate 2 on these surfaces as well, thereby enhancing the effect of preventing moisture from entering the laminate 2. This makes it possible to suppress deterioration in moisture resistance.

[0044] (4-1) Glass concentration of the inner region 32 on the first surface A1 The glass concentration in the first surface inner region 32A1 is preferably 1.0% or more and 6.0% or less. When glass is disposed at the interface between the laminate 2 and the base electrode 30, the penetration of moisture can be further suppressed. Furthermore, a decrease in the glass concentration can reduce the adhesive strength between the base electrode 30 and the laminate 2, making it easier to release stress on the laminate 2.

[0045] (4-2) Glass concentration in the inner regions of the second surface A2, the fifth surface B1, and the sixth surface B2 other than the first surface A1 Regarding the glass concentration, it is also preferable that the second-surface inner region 32A2, the fifth-surface inner region 32B1, and the sixth-surface inner region 32B2 have the same concentration as the first-surface inner region 32A1.

[0046] This eliminates the need to select the orientation of the multilayer ceramic capacitor 1 during mounting. Furthermore, moisture can be prevented from entering from the outside not only in the first surface inner region 32A1 but also in the second surface inner region 32A2, the fifth surface inner region 32B1, and the sixth surface inner region 32B2.

[0047] Furthermore, the glass concentration in the first-surface inner region 32A1 is preferably lower than the glass concentration in the first-surface outer region 33A1. This makes it possible to reduce the adhesive strength between the first base electrode 30 and the plating layer 31 without overly strengthening the adhesiveness at the interface between the laminate 2 and the external electrode 3. This allows external stress to be released not only between the first base electrode 30 and the laminate 2, but also between the first base electrode 30 and the plating layer 31, thereby suppressing the propagation of cracks into the laminate 2.

[0048] (Method for measuring Ni concentration in each region) The Ni concentrations in the first surface inner region 32A1 to the sixth surface inner region 32B2 can be measured as follows.

[0049] For example, the multilayer ceramic capacitor 1 is polished in the second direction W to half its size, exposing a cross section passing through the height direction T and the first direction L. Then, the first surface inner region 32A1 is measured using a high-resolution analytical scanning electron microscope (FE-SEMEDX) at a magnification of 5000 times and a field of view of 1.0 μm × 1.0 μm. The first surface inner region 32A1, the second surface inner region 32A2, the third surface inner region 32C1, and the fourth surface inner region 32C2 can be measured on the same cross section.

[0050] In this case, the third surface inner region 32C1 and the fourth surface inner region 32C2 are regions observed from a portion located at (1 / 2) in the height direction T in a field of view (1.0 μm×1.0 μm).

[0051] The Ni concentration in each region can be defined as the ratio of the number of Ni atoms to the total number of Ni and Cu atoms present in the observation field, which is taken as 100%. The glass concentration in each region can be defined as the ratio of the number of Si atoms to the total number of Si, Cu, and Ni atoms present in the observation field, which is taken as 100%.

[0052] (Manufacturing method) Next, a method for manufacturing the multilayer ceramic capacitor 1 in accordance with the first embodiment will be described. Fig. 4 is a flowchart of the method for manufacturing the multilayer ceramic capacitor 1 in accordance with the first embodiment.

[0053] (Laminate manufacturing process S1) First, a material sheet is prepared in which a pattern of the internal electrodes 5 is printed with a conductive paste on a ceramic green sheet for lamination, which is formed by molding a ceramic slurry into a sheet shape. Then, multiple material sheets are stacked so that the patterns of the internal electrodes 5 are shifted by half a pitch between adjacent material sheets in the longitudinal direction. Furthermore, outer layer ceramic green sheets that will become the outer layer portions are stacked on both sides of the multiple stacked material sheets, and the mother block member is formed by thermocompression bonding. The mother block member is divided along the cutting lines to produce the laminate 2.

[0054] (First firing step S2) The divided laminate 2 is degreased under predetermined conditions in a nitrogen atmosphere, and then fired at a predetermined temperature in a nitrogen-hydrogen-water vapor mixed atmosphere.

[0055] (Ni-containing film formation step S3) In the fired laminate 2, for example, a mask is applied to areas other than the area of ​​the first surface A1, the area of ​​the second surface A2, the area of ​​the fifth surface B1, and the area of ​​the sixth surface B2 where the inner region 32 is to be formed, and a Ni / Cu film is applied by sputtering or the like. At this time, the Ni ratio of the Ni / Cu film is set to, for example, 60% to 70%.

[0056] (External electrode formation step S4) Thereafter, a base electrode paste that will become the base electrode 30 is applied onto the third surface C1 and the fourth surface C2 by, for example, a dip method.

[0057] (Second firing step S5) The product is then fired, for example, at a firing temperature of 800°C for 10 to 15 minutes in an oxidizing atmosphere with continuous supply of nitrogen and water. This ensures that the Ni concentration in the first-surface inner region 32A1 is 4.2% to 8.6%. At this time, Ni from the internal electrode 5 penetrates into the third-surface inner region 32C1 and the fourth-surface inner region 32C2. However, if the firing temperature or firing time is too high, the Ni content in the third-surface inner region 32C1 and the fourth-surface inner region 32C2 will become too high, resulting in a deterioration in moisture resistance. Therefore, the firing temperature is set to 800°C for 10 to 15 minutes, for example.

[0058] (Plating layer formation process S6) Next, a Ni plating layer 31a is formed on the outer periphery of the base electrode 30 so as to cover the base electrode 30. Next, a Sn plating layer 31b is formed on the outer periphery of the Ni plating layer 31a so as to cover the Ni plating layer 31a. Through the above steps, the multilayer ceramic capacitor 1 is manufactured.

[0059] (Verification of the Effects of the Multilayer Ceramic Capacitor 1 of the Embodiment) The following multilayer ceramic capacitors 1 were manufactured with different Ni concentrations on the first surface A1 and the third surface C1, and the results of the substrate bending test and moisture resistance test described below will be described. Figure 5 is a table showing the results of the substrate bending test and moisture resistance test.

[0060] The multilayer ceramic capacitor 1 has a height T dimension of 0.2 mm±0.02 mm, a first direction L dimension of 0.5 mm±0.2 mm, and a second direction W dimension of 1.0 mm±0.2 mm. The main component of the dielectric layer 4 is BaTiO 3、 The main component of the internal electrode 5 is Ni, and the external electrode 3 is composed of a base electrode 3 mainly composed of Cu, a Ni plating layer 31a, and a Sn plating layer 31b.

[0061] (Board bending test) The multilayer ceramic capacitor 1 was mounted on a 0.8 mm thick substrate. Then, the surface opposite to the surface on which the multilayer ceramic capacitor 1 was mounted was bent by 2.0 mm. Then, the number of laminates 2 for which cracks had occurred was counted.

[0062] (Results of board bending test) 5, when the Ni concentration in the first surface inner region 32A1 was less than 4.2% or 4.0% or less, cracks occurred in the laminate 2 in the substrate bending test, and the smaller the Ni concentration in the first surface inner region 32A1, the more cracks occurred in the laminate 2. In contrast, when the Ni concentration in the first surface inner region 32A1 was 4.2% or more, no cracks occurred in the laminate 2 in the substrate bending test.

[0063] When the Ni concentration of the third surface C1 was 20.3% or less, which was lower than 20.8%, cracks occurred in the laminate 2 in the substrate bending test, and the smaller the Ni concentration of the third surface C1, the more cracks occurred in the laminate 2. In contrast, when the Ni concentration of the third surface C1 was 20.8% or more, no cracks occurred in the laminate 2 in the substrate bending test.

[0064] Regarding the Ni concentration ratio obtained by dividing the Ni concentration of the first surface inside region 32A1 by the Ni concentration of the third surface C1, when the Ni concentration ratio was less than 20.19% and 19.70% or less, cracks occurred in the laminate 2 in the substrate bending test, and the smaller the Ni concentration ratio, the more cracks occurred in the laminate 2. In contrast, when the Ni concentration ratio was 20.19% or more, no cracks occurred in the laminate 2 in the substrate bending test.

[0065] (Moisture resistance test) Multilayer ceramic capacitor 1 was mounted and subjected to a PCBT (Pressure Cooker Bias Test) test, which accelerates evaluation of the impact of high temperature and humidity on characteristic degradation, at a temperature of 125°C, humidity of 95%, voltage of 4V, and test time of 144 hours. After that, chips whose IR (insulation resistance) dropped by one digit or more were counted as defective (out-of-spec chips). The total number of each test, n=100, is shown in the table in Figure 5.

[0066] As shown in the table, when the Ni concentration in the first surface inner region 32A1 was greater than 8.6%, or 8.9% or greater, defective products were generated in the PCBT test, and the higher the Ni concentration in the first surface inner region 32A1, the greater the number of defective products. In contrast, when the Ni concentration in the first surface inner region 32A1 was 8.6% or less, no defective products were generated.

[0067] When the Ni concentration of the third surface C1 was 27.1% or greater, greater than 26.2%, the number of defective products increased as the Ni concentration of the third surface C1 increased. In contrast, when the Ni concentration of the third surface C1 was 26.2% or less, no defective products occurred.

[0068] The Ni concentration ratio, calculated by dividing the Ni concentration in the first surface inside region 32A1 by the Ni concentration in the third surface C1, was found to be greater than 32.82%, and when the Ni concentration ratio was 32.84 or greater, defective products were produced, and the higher the Ni concentration ratio, the greater the number of defective products.In contrast, when the Ni concentration ratio was 32.82 or less, no defective products were produced in the PCBT test.

[0069] As described above, it has been demonstrated that sufficient bending strength is obtained and moisture resistance is also high when the Ni concentration in the first surface inner region 32A1 is in the preferred range of 4.2% to 8.6% in this embodiment.

[0070] Furthermore, it was demonstrated that sufficient bending strength was obtained and moisture resistance was also high when the Ni concentration of the third surface C1 was in the preferred range of 20.8% to 26.2%, both inclusive, in this embodiment.

[0071] Furthermore, it was demonstrated that sufficient bending strength and high moisture resistance were obtained when the Ni concentration ratio obtained by dividing the Ni concentration in the first surface inner region 32A1 by the Ni concentration in the third surface C1 was 20.19% or more and 32.82% or less.

[0072] (Second embodiment) Next, a multilayer ceramic capacitor 100 according to a second embodiment of the present invention will be described. Fig. 6 is a schematic perspective view of the multilayer ceramic capacitor 100 according to the second embodiment. Fig. 7 is a partial cross-sectional view of the multilayer ceramic capacitor 100 taken along line VII-VII in Fig. 6. Fig. 8 is a cross-sectional view of the multilayer ceramic capacitor 100 taken along line VIII-VIII in Fig. 6.

[0073] The multilayer ceramic capacitor 100 according to the second embodiment is a three-terminal multilayer ceramic capacitor 100. The second embodiment differs from the first embodiment in the shape of the internal electrodes and the external electrodes. Other parts common to the multilayer ceramic capacitor 1 of the first embodiment are given the same reference numerals, and description thereof will be omitted.

[0074] (Internal electrode 5) The internal electrodes 5 include a plurality of internal electrodes 5C exposed in the first direction and a plurality of internal electrodes 5D exposed in the second direction.

[0075] The first direction exposed internal electrode 5C extends between the third surface C1 and the fourth surface C2 on both sides of the first direction L of the laminate 2, and is spaced a certain distance from the fifth surface B1 and the sixth surface B2 on both sides of the second direction W.

[0076] The second direction exposed internal electrode 5D extends between the fifth surface B1 and the sixth surface B2 on both sides in the second direction W of the laminate 2, and is spaced apart from the third surface C1 and the fourth surface C2 on both sides in the first direction L.

[0077] First-direction external electrodes 8 (first external electrode and second external electrode) are arranged on the third surface C1 and fourth surface C2 of the laminate 2. The first-direction exposed internal electrodes 5C are connected to the first-direction external electrodes 8. Like the external electrode 3 of the first embodiment, the first-direction external electrodes 8 cover not only the third surface C1 or the fourth surface C2, but also parts of the first surface A1, the second surface A2, the third surface C1, and the fourth surface C2.

[0078] Second direction external electrodes 9 are arranged on the fifth surface B1 and the sixth surface B2 of the laminate 2. Second direction exposed internal electrodes 5D are connected to the second direction external electrodes 9. The second direction external electrodes 9 cover not only the fifth surface B1 and the sixth surface B2, but also parts of the first surface A1 and the second surface A2.

[0079] Like the external electrode 3 of the first embodiment, the first-direction external electrode 8 and the second-direction external electrode 9 include a base electrode 30 disposed on the outer surface of the laminate 2 and a plating layer 31 disposed on the base electrode 30. The plating layer 31 preferably includes an intermediate plating layer disposed on the base electrode 30 and a top plating layer disposed on the intermediate plating layer. In this embodiment, the intermediate plating layer is a Ni plating layer 31a, and the top plating layer is a Sn plating layer 31b.

[0080] (First direction external electrode 8) In the first direction external electrode 8, the base electrode 30 is disposed on the outer surface of the laminate 2, and has an inner region 82 within a range of 1 μm from the outer surface of the laminate 2. The base electrode 30 has an outer region 83 within a range of 1 μm from the outermost surface of the base electrode 30, that is, a region within 1 μm inward from the plating layer 31.

[0081] (1-1) Ni concentration in the inner region 82 of the first surface A1 and the inner region 82 of the third surface C1 or the fourth surface C2 In the first-direction external electrode 8, the Ni concentration in the first-surface inner region 82A1 of the first surface A1, which is the mounting surface, is preferably lower than the Ni concentration in the third-surface inner region 82C1 or the fourth-surface inner region 82C2. In the first-direction external electrode 8, the Ni concentration in the first-surface inner region 82A1 of the first surface A1, which is the mounting surface, is preferably 4.2% or more and 8.6% or less. The Ni concentration in the third-surface inner region 82C1 or the fourth-surface inner region 82C2 is preferably 20.8% or more and 26.2% or less. This can improve the moisture resistance of the multilayer ceramic capacitor 100 while ensuring the connectivity between the internal electrodes 5 and the first-direction external electrode 8.

[0082] In this embodiment, the Ni concentration in the first-surface inner region 82A1 is lower than the Ni concentration in the third-surface inner region 82C1 or the fourth-surface inner region 82C2. The Ni concentration in the first-surface inner region 82A1 is 4.2% or more and 8.6% or less. Therefore, cracks are less likely to occur on the outer surface of the laminate 2, and IR degradation due to moisture intrusion from the outside is also less likely to occur.

[0083] (1-2) Ni concentration in the inner regions of the second surface A2, the fifth surface B1, and the sixth surface B2 other than the first surface A1 In the first direction external electrode 8, the Ni concentration of the second surface inner region 82A2, the fifth surface inner region 82B1 and the sixth surface inner region 82B2 is also lower than the Ni concentration of the third surface inner region 82C1 or the fourth surface inner region 82C2, similar to the Ni concentration of the first surface inner region 82A1, and is preferably 4.2% or more and 8.6% or less.

[0084] This allows either the first surface A1 or the second surface A2 to be used as the mounting surface, eliminating the need to select the direction of the multilayer ceramic capacitor 100 when mounting.

[0085] (2-1) Ni concentration ratio between the inner region 82 of the first surface A1 and the inner region 82 of the third surface C1 or the fourth surface C2 In the first direction external electrode 8, the Ni concentration ratio obtained by dividing the Ni concentration in the first surface inner region 82A1 by the Ni concentration in the inner region 82 of the third surface C1 or fourth surface C2 is preferably 20.19% or more and 32.82% or less.

[0086] (2-2) Ni concentration ratio between the inner region 82 of the second surface A2, the fifth surface B1, and the sixth surface B2 other than the first surface A1 and the inner region 82 of the third surface C1 or the fourth surface C2 Furthermore, it is preferable that the Ni concentration ratio, calculated by dividing the Ni concentration of the third surface inner region 82C1, of not only the first surface inner region 82A1 but also the second surface inner region 82A2, the fifth surface inner region 82B1, and the sixth surface inner region 82B2 is 20.19% or more and 32.82% or less.

[0087] (3-1) Comparison of Ni concentration between inner region 82 and outer region 83 on first surface A1 In the first direction external electrode 8, the Ni concentration in the first surface inner region 82A1 is preferably higher than the Ni concentration in the first surface outer region 83A1. By making the Ni concentration in the first surface inner region 82A1 closer to the laminate 2 higher than the Ni concentration in the first surface outer region 83A1, it is possible to improve the effect of preventing moisture from entering the laminate 2. This makes it possible to suppress deterioration in moisture resistance.

[0088] (3-2) Comparison of Ni concentration between the inner region 82 and the outer region 83 on the second surface A2, the fifth surface B1, and the sixth surface B2 other than the first surface A1 In the first direction external electrode 8, the Ni concentration in the inner region 82 is preferably higher than the Ni concentration in the outer region 83 not only on the first surface A1 but also on the second surface A2, fifth surface B1, and sixth surface B2. This makes it possible to increase the Ni concentration in the inner region 82 close to the laminate 2 on these surfaces as well, thereby enhancing the effect of preventing moisture from entering the laminate 2. This makes it possible to suppress deterioration in moisture resistance.

[0089] (4-1) Glass concentration in the first surface inner region 82A1 In the first direction external electrode 8, the glass concentration in the first surface inner region 82A1 is preferably 1.0% or more and 6.0% or less. When glass is disposed at the interface between the laminate 2 and the base electrode 30, the penetration of moisture can be further suppressed. Furthermore, when the glass concentration is reduced, the adhesive strength between the base electrode 30 and the laminate 2 can be reduced, making it easier to release stress on the laminate 2.

[0090] (4-2) Glass concentration in the inner regions of the second surface A2, the fifth surface B1, and the sixth surface B2 other than the first surface A1 In the first direction external electrode 8, the glass concentration in the second surface inner region 82A2, the fifth surface inner region 82B1, and the sixth surface inner region 82B2 is also preferably 1.0% or more and 6.0% or less.

[0091] In the first direction external electrode 8, the glass concentration in the first surface inner region 82A1 is preferably lower than the glass concentration in the first surface outer region 83A1.

[0092] (Second direction external electrode 9) In the second direction external electrode 9, the base electrode 30 is disposed on the outer surface of the laminate 2, and has an inner region 92 within a range of 1 μm from the outer surface of the laminate 2. The base electrode 30 has an outer region 93 within a range of 1 μm from the outermost surface of the base electrode 30, that is, a region within 1 μm from the plating layer 31 to the inside.

[0093] (1-1) Ni concentration in the inner region 92 of the first surface A1 and the inner region 22 of the fifth surface B1 or the sixth surface B2 In the second direction external electrode 9, the Ni concentration in the first surface inner region 92A1 of the first surface A1, which is the mounting surface, is preferably lower than the Ni concentration in the fifth surface inner region 92B1 or the sixth surface inner region 92B2. In the second direction external electrode 9, the Ni concentration in the first surface inner region 92A1 is preferably 4.2% or more and 8.6% or less. The Ni concentration in the fifth surface inner region 92B1 or the sixth surface inner region 92B2 is preferably 20.8% or more and 26.2% or less. This can improve the moisture resistance of the multilayer ceramic capacitor 100 while ensuring the connectivity between the internal electrodes 5 and the second direction external electrode 9.

[0094] In this embodiment, the Ni concentration in the first-surface inner region 92A1 is lower than the Ni concentration in the fifth-surface inner region 92B1 or the sixth-surface inner region 92B2. The Ni concentration in the first-surface inner region 92A1 is 4.2% or more and 8.6% or less. Therefore, cracks are less likely to occur on the outer surface of the laminate 2, and IR degradation due to moisture intrusion from the outside is also less likely to occur.

[0095] (1-2) Ni concentration in the inner region of the second surface A2 other than the first surface A1 In the second direction external electrode 9, the Ni concentration of the second surface inner region 92A2, like the Ni concentration of the first surface inner region 92A1, is lower than the Ni concentration of the fifth surface inner region 92B1 or the sixth surface inner region 92B2, and is preferably 4.2% or more and 8.6% or less.

[0096] This allows either the first surface A1 or the second surface A2 to be used as the mounting surface, eliminating the need to select the direction of the multilayer ceramic capacitor 100 when mounting.

[0097] (2-1) Ni concentration ratio between the inner region 92 of the first surface A1 and the inner region 92 of the fifth surface B1 or the sixth surface B2 In the second direction external electrode 9, the Ni concentration ratio obtained by dividing the Ni concentration in the first surface inside region 92A1 by the Ni concentration in the inside region 92 of the fifth surface B1 or sixth surface B2 is preferably 20.19% or more and 32.82% or less.

[0098] (2-2) Ni concentration ratio between the second surface inner region 92A2 other than the first surface A1 and the inner region 92 of the fifth surface B1 and the sixth surface B2 Furthermore, it is preferable that the Ni concentration ratio of not only the first surface inner region 92A1 but also the second surface inner region 92A2 divided by the Ni concentration of the fifth surface inner region 92B1 and the sixth surface inner region 92B2 is 20.19% or more and 32.82% or less.

[0099] (3-1) Comparison of Ni concentration between the inner and outer regions of the first surface A1 In the second direction external electrode 9, the Ni concentration in the first surface inner region 92A1 is preferably higher than the Ni concentration in the first surface outer region 93A1. By making the Ni concentration in the first surface inner region 92A1 closer to the laminate 2 higher than the Ni concentration in the first surface outer region 93A1, it is possible to improve the effect of preventing moisture from entering the laminate 2. This makes it possible to suppress deterioration in moisture resistance.

[0100] (3-2) Comparison of Ni concentration between inner region 92 and outer region 93 on the second surface A2 In the second direction external electrode 9, the Ni concentration in the inner region 92 is preferably higher than the Ni concentration in the outer region 93 not only on the first surface A1 but also on the second surface A2.

[0101] (4-1) Glass concentration in the first surface inner region 92A1 In the second direction external electrode 9, the glass concentration in the first surface inner region 92A1 is preferably 1.0% or more and 6.0% or less. When glass is disposed at the interface between the laminate 2 and the base electrode 30, the penetration of moisture can be further suppressed. Furthermore, when the glass concentration is reduced, the adhesive strength between the base electrode 30 and the laminate 2 can be reduced, making it easier to release stress on the laminate 2.

[0102] (4-2) Glass concentration in the inner region of the second surface A2 In the second direction external electrode 9, the glass concentration in the second surface inner region 92A2 is also preferably 1.0% or more and 6.0% or less.

[0103] This eliminates the need to select the orientation of the multilayer ceramic capacitor 100 during mounting. Furthermore, moisture can be prevented from entering from the outside not only in the first surface inner region 82A1 but also in the second surface inner region 82A2, the fifth surface inner region 82B1, and the sixth surface inner region 82B2.

[0104] As described above, the second embodiment can also achieve the same effects as the first embodiment.

[0105] The preferred embodiments of the present invention have been described above, but the present invention also includes the following combinations.

[0106] <1> a first surface and a second surface facing each other in a height direction; A third surface and a fourth surface facing each other in a first direction perpendicular to the height direction, and a laminate having a fifth surface and a sixth surface facing each other in a second direction perpendicular to the height direction and the first direction; first external electrodes arranged on the third surface, the first surface, the second surface, the fifth surface, and the sixth surface; second external electrodes arranged on the fourth surface, the first surface, the second surface, the fifth surface, and the sixth surface; the first external electrode and the second external electrode have a first base electrode and a second base electrode containing Cu, respectively; The first base electrode is a first surface inner region disposed on the first surface and within 1 μm from the first surface in the height direction; a second surface inner region disposed on the second surface and within 1 μm from the second surface in the height direction; a third surface inner region disposed on the third surface and within 1 μm from the third surface in the first direction; a fifth surface inner region disposed on the fifth surface and within 1 μm from the fifth surface in the second direction; a sixth surface inner region disposed on the sixth surface and within 1 μm from the sixth surface in the second direction, The first surface inner region and the third surface inner region contain Ni, and the concentration of Ni in the first surface inner region is lower than the concentration of Ni in the third surface inner region.

[0107] <2> The Ni concentration in the first surface inner region is 4.2% or more and 8.6% or less. <1> The multilayer ceramic capacitor according to claim 1.

[0108] <3> the second surface inner region contains Ni, and the concentration of Ni in the second surface inner region is lower than the concentration of Ni in the third surface inner region; The Ni concentration in the second surface inner region is 4.2% or more and 8.6% or less. <1> or <2> The multilayer ceramic capacitor according to claim 1.

[0109] <4> the fifth surface inner region contains Ni, and the concentration of Ni in the fifth surface inner region is lower than the concentration of Ni in the third surface inner region; The Ni concentration in the fifth surface inner region is 4.2% or more and 8.6% or less. <1> from <3> 10. The multilayer ceramic capacitor according to claim 9, wherein

[0110] <5> The Ni concentration in the third surface inner region is 20.8% or more and 26.2% or less. <1> from <4> 10. The multilayer ceramic capacitor according to claim 9, wherein

[0111] <6> The first surface inner region contains glass at a concentration of 1.0% or more and 6.0% or less. <1> from <5> 10. The multilayer ceramic capacitor according to claim 9, wherein

[0112] <7> The first base electrode is a first surface outer region disposed on the first surface and within 1 μm from the outermost surface of the first base electrode; a second surface outer region disposed on the second surface and within 1 μm from the outermost surface of the first base electrode; a third surface outer region disposed on the third surface and within 1 μm from the outermost surface of the first base electrode; a fifth surface outer region disposed on the fifth surface and within 1 μm from the outermost surface of the first base electrode; a sixth surface outer region disposed on the sixth surface and within 1 μm from an outermost surface of the first base electrode, the first surface outer region contains Ni, and the concentration of Ni in the first surface inner region is higher than the concentration of Ni in the first surface outer region; <1> from <6> 10. The multilayer ceramic capacitor according to claim 9, wherein

[0113] <8> the first surface inner region and the first surface outer region contain glass, and the concentration of glass in the first surface inner region is lower than the concentration of glass in the first surface outer region; <7> The multilayer ceramic capacitor according to claim 1. [Explanation of symbols]

[0114] A1 Page 1 A2 2nd side B1 5th page B2 side 6 C1 3rd side C2 4th side L 1st direction T Height direction W 2nd direction 1. Multilayer ceramic capacitors 2. Laminate 3 External electrode 3A 1st external electrode 3B 2nd external electrode 4 Dielectric Layer 5 Internal electrode 5A 1st internal electrode 5B 2nd internal electrode 5C 1st direction exposed internal electrode 5D 2nd direction exposed internal electrode 8 First direction external electrode 9 2nd direction external electrode 30 Base electrode 30A First base electrode 30B 2nd base electrode 32 Inner area 32A1 1st surface inner area 32A2 2nd side inner area 32B1 Inner area of ​​face 5 32B2 Inner area of ​​face 6 32C1 Third face inner region 32C2 Inner side of the 4th face 33. Outer Domain 33A1 Outer Territory of the First Face 33A2 Second outer area 33B1 Outer domain of surface 5 33B2 Outer domain of the 6th face 33C1 Third outer area 33C2 Fourth outer area 82 Inner Domain 82A1 First surface inner area 82A2 Second inner side area 82B1 Inner area of ​​face 5 82B2 6th inner side area 82C1 Third face inner region 82C2, inner side of the fourth face 83. Outer Domain 83A1 First outer area 100 laminated セラミックコンデンサ

Claims

1. a first surface and a second surface facing each other in a height direction; a third surface and a fourth surface facing each other in a first direction perpendicular to the height direction; and a laminate having a fifth surface and a sixth surface facing each other in a second direction perpendicular to the height direction and the first direction; first external electrodes disposed on the third surface, the first surface, the second surface, the fifth surface, and the sixth surface; second external electrodes disposed on the fourth surface, the first surface, the second surface, the fifth surface, and the sixth surface; the first external electrode and the second external electrode have a first base electrode and a second base electrode, respectively, containing Cu; The first base electrode is a first surface inner region disposed on the first surface and located within 1 μm from the first surface in the height direction; a second surface inner region disposed on the second surface and located within 1 μm from the second surface in the height direction; a third surface inner region disposed on the third surface and within 1 μm from the third surface in the first direction; a fifth surface inner region disposed on the fifth surface and within 1 μm from the fifth surface in the second direction; a sixth surface inner region disposed on the sixth surface and within 1 μm from the sixth surface in the second direction, The first inner surface region and the third inner surface region contain Ni, and the Ni concentration in the first inner surface region is lower than the Ni concentration in the third inner surface region.

2. The Ni concentration in the first surface inner region is 4.2% or more and 8.6% or less. The multilayer ceramic capacitor according to claim 1 .

3. the second surface inner region contains Ni, and the concentration of Ni in the second surface inner region is lower than the concentration of Ni in the third surface inner region; The Ni concentration in the second surface inner region is 4.2% or more and 8.6% or less. The multilayer ceramic capacitor according to claim 2 .

4. the fifth surface inner region contains Ni, and the concentration of Ni in the fifth surface inner region is lower than the concentration of Ni in the third surface inner region; The Ni concentration in the fifth surface inner region is 4.2% or more and 8.6% or less. The multilayer ceramic capacitor according to claim 3 .

5. The Ni concentration in the third surface inner region is 20.8% or more and 26.2% or less. The multilayer ceramic capacitor according to claim 1 .

6. The Ni concentration in the third surface inner region is 20.8% or more and 26.2% or less. The multilayer ceramic capacitor according to claim 2 .

7. The Ni concentration in the third surface inner region is 20.8% or more and 26.2% or less. The multilayer ceramic capacitor according to claim 3 .

8. The first surface inner region contains glass at a concentration of 1.0% or more and 6.0% or less. The multilayer ceramic capacitor according to claim 1 .

9. The first surface inner region contains glass at a concentration of 1.0% or more and 6.0% or less. The multilayer ceramic capacitor according to claim 2 .

10. The first base electrode is a first surface outer region disposed on the first surface and located within 1 μm from the outermost surface of the first base electrode; a second surface outer region disposed on the second surface and located within 1 μm from the outermost surface of the first base electrode; a third surface outer region disposed on the third surface and located within 1 μm from an outermost surface of the first base electrode; a fifth surface outer region disposed on the fifth surface and within 1 μm from an outermost surface of the first base electrode; a sixth surface outer region disposed on the sixth surface and within 1 μm from an outermost surface of the first base electrode, the first surface outer region contains Ni, and the concentration of Ni in the first surface inner region is higher than the concentration of Ni in the first surface outer region; The multilayer ceramic capacitor according to claim 1 .

11. The multilayer ceramic capacitor according to claim 10 , wherein the first inner surface region and the first outer surface region contain glass, and the concentration of the glass in the first inner surface region is lower than the concentration of the glass in the first outer surface region.

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