Method and apparatus for gas distribution

Abstract

Various embodiments of the present technology provide showerhead plates.SOLUTION: A showerhead plate may be provided having a first surface and an opposing second surface, a circular cutout in the second surface, the cutout comprising an opening having a first diameter in the second surface and a groove protruding radially outward from a vertical axis and forming a second diameter, the second diameter being greater than the first diameter, and a protrusion disposed between the first surface and the second surface that protrudes inward toward the axis, the protrusion forming the groove.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates generally to methods and apparatus for gas distribution. More particularly, the present disclosure relates to a showerhead with integrated flow features for providing improved airflow. [Background technology]

[0002] Reaction chambers used in semiconductor manufacturing typically utilize gas distribution systems to deliver chemicals to wafers within the reaction space and remove vapors from the reaction space. Conventional gas distribution systems can create undesirable turbulence in the exhaust stream near the wafer. Summary of the Invention [Means for solving the problem]

[0003] Various embodiments of the present technology can provide a showerhead plate having a first surface and a second surface opposite the first surface, a circular cutout in the second surface, the cutout comprising an opening in the second surface having a first diameter and a groove projecting radially outward from a vertical axis and forming the second diameter, the second diameter being larger than the first diameter, and a protrusion projecting inward toward the axis and disposed between the first and second surfaces, the protrusion forming the groove.

[0004] According to one aspect, an apparatus includes a first surface and a second surface opposite the first surface; a circular cutout in the second surface, the cutout including an opening in the second surface having a first diameter and a groove projecting radially outward from a vertical axis and forming the second diameter, the second diameter being greater than the first diameter; and a protrusion disposed between the first and second surfaces projecting inward toward the axis, the protrusion forming at least a portion of the groove.

[0005] In one embodiment, the groove has a depth in the range of 20 mm to 45 mm.

[0006] In one embodiment, the device further comprises a plurality of first through-holes extending from the first surface to the groove.

[0007] In one embodiment, the plurality of first through holes are disposed on an outermost dimension of the groove.

[0008] In one embodiment, the plurality of first through-holes are fluidly connected to the channel.

[0009] In one embodiment, the grooves are angled upwardly toward the first surface.

[0010] In one embodiment, the protrusion comprises a downwardly facing horizontal surface.

[0011] In one embodiment, the first diameter is in the range of 417 mm to 370 mm and the second diameter is in the range of 400 mm to 450 mm.

[0012] In another aspect, an apparatus includes a gas distribution plate including an inlet plenum and an exhaust plenum; and a showerhead plate including: a first surface in direct contact with the gas distribution plate and a second surface opposite the first surface; a circular cutout in the second surface, the cutout including an opening having a first diameter in the second surface and a groove projecting radially outward from a vertical axis and forming the second diameter, the second diameter being larger than the first diameter; a circular protrusion disposed between the first and second surfaces projecting inward toward the axis, the protrusion forming the groove; a plurality of first through-holes extending from the first surface into the groove and in fluid communication with the exhaust plenum; and a plurality of second through-holes extending from the first surface to a surface of the cutout and in fluid communication with the inlet plenum.

[0013] In one embodiment, the grooves are angled upwardly toward the first surface.

[0014] In one embodiment, the plurality of first through holes are disposed on an outermost dimension of the groove.

[0015] In one embodiment, the groove has a depth in the range of 20 mm to 45 mm.

[0016] In one embodiment, the protrusion comprises a downwardly facing horizontal surface configured to contact the susceptor.

[0017] In one embodiment, the first diameter is in the range of 417 mm to 370 mm.

[0018] In one embodiment, the second diameter is in the range of 400 mm to 450 mm.

[0019] In one embodiment, the apparatus further comprises a susceptor configured to engage the opening and the protrusion of the cutout.

[0020] In yet another aspect, an apparatus comprises a first horizontal surface and a second horizontal surface opposite the first horizontal surface; a circular cutout in the second surface, the cutout comprising an opening having a first diameter in the second surface and a groove projecting radially outward from a vertical axis and forming the second diameter, the second diameter being larger than the first diameter; a circular protrusion disposed between the first and second surfaces projecting inward toward the axis, the protrusion forming the groove; a plurality of first through holes extending from the first surface to a surface of the groove, the plurality of through holes being fluidly coupled to the groove; and a plurality of second through holes extending from the first surface to a surface of the cutout and fluidly coupled to the cutout.

[0021] In one embodiment, the first diameter is in the range of 417 mm to 370 mm and the groove has a depth in the range of 20 mm to 45 mm.

[0022] In one embodiment, the second diameter is in the range of 400 mm to 450 mm and the groove has a depth in the range of 20 mm to 45 mm.

[0023] In one embodiment, the grooves are angled upwardly toward the first surface.

[0024] The present technology may be more fully understood by reference to the detailed description in light of the following illustrative drawings, in which like elements and steps are designated with like reference numerals throughout. [Brief explanation of the drawings]

[0025] [Figure 1] 1 representatively illustrates a system in accordance with an embodiment of the present technology; [Figure 2] 1 is a cross-sectional view of a gas distribution system in accordance with an embodiment of the present technique; [Figure 3] 1 is a partial cross-sectional view of a gas distribution system in accordance with an embodiment of the present technique; [Figure 4] FIG. 10 is a top perspective view of a showerhead plate in accordance with an embodiment of the present technique. [Figure 5] FIG. 1 is a cross-sectional view of a showerhead plate in accordance with an embodiment of the present technology. [Figure 6] FIG. 10 is a bottom view of a showerhead plate in accordance with an embodiment of the present technique. DETAILED DESCRIPTION OF THE INVENTION

[0026] The present technology may be described in terms of functional block components and various processing steps. These functional blocks may be realized by any number of components configured to perform the specified functions and achieve various results. For example, the present technology may employ various gas lines, valves, controllers, reaction chambers, vessels, susceptors, and temperature sensors.

[0027] 1 , an exemplary system 100 may include a reactor 102 configured to perform a process on a processed object, such as a substrate 105 (e.g., a wafer). For example, the reactor 102 may be configured to perform heating, deposition, etching, polishing, ion implantation, and / or other processes on the processed object. In some embodiments, the reactor 102 may be configured to perform transfer, vacuum sealing, and evacuation functions. In some embodiments, the reactor 102 may perform an atomic layer deposition (ALD) process or a chemical vapor deposition (CVD) process.

[0028] In an exemplary embodiment, the reactor 102 may include a reaction chamber 115 that includes a reaction space 117 above and / or around the substrate 105. For example, the reaction chamber 115 may include a sidewall and a bottom coupled to the sidewall.

[0029] In various embodiments, the system 100 may further include a substrate mounting unit disposed within the reaction chamber 115 of the reactor 102. The substrate mounting unit may include a susceptor 145 for supporting the substrate 105 and a heater (not shown) for heating the substrate 105 supported by the susceptor 145. The heater may be embedded within the susceptor 145. The substrate mounting unit may further include a pedestal 170 for supporting the susceptor 145. For loading / unloading the substrate 105, the substrate mounting unit may be configured to be vertically (up and down) movable by being connected to a drive unit (not shown). The susceptor 145 may be disposed within or adjacent to the reaction space 117. For example, the susceptor 145 may be positioned to position the substrate 105 within the reaction space 117.

[0030] In various embodiments, the reactor 102 may further include a gas distribution system 110 for delivering vapor to the reaction chamber 115. In an exemplary embodiment, the gas distribution system 110 is disposed above the susceptor 145. The gas distribution system 110 may include an upper portion 120 (i.e., a gas channel plate) and a bottom portion 125 (i.e., a showerhead plate). The upper portion 120 and the bottom portion 125 may be in direct contact with each other. For example, the upper portion 120 may include a first surface 150 and a parallel second surface 165 opposite the first surface, and the bottom portion 125 may include a first surface 155 and a parallel second surface 160 opposite the first surface. A surface of the upper portion 120 (e.g., the second surface 165) may be in direct contact with a surface of the bottom portion 125 (e.g., the first surface 155). In some embodiments, the first portion 120 and the second portion 125 may be coupled together with fasteners such as screws.

[0031] In various embodiments, the gas distribution system 110 may be disposed adjacent to the reaction chamber 115. For example, the gas distribution system 110 may be disposed on a sidewall of the reaction chamber 115, facing the bottom of the reaction chamber 115. In some embodiments, the gas distribution system 110 may be fixed to the sidewall, while in other cases, the gas distribution system 110 may simply rest on the sidewall of the reaction chamber 115. In various embodiments, the gas distribution system 110, together with the sidewall of the reaction chamber 115, forms an enclosed space that includes the reaction space 117.

[0032] In various embodiments, system 100 may further include a vessel 135 configured to contain a chemical (i.e., a precursor). The vessel 135 may be configured to hold a solid or liquid chemical and may further be configured to convert the solid or liquid to a vapor. The vessel 135 may be coupled to the gas distribution system 110. For example, system 100 may further include various gas conduits (not shown) and / or valves (not shown) for flowing the vapor from the vessel 135 into the gas distribution system 110.

[0033] In various embodiments, the system 100 may further include an inert gas source 130 configured to contain an inert gas, such as argon. The inert gas source 130 may be fluidly connected to the gas distribution system 110 via any number of gas lines / conduits and / or valves.

[0034] In an exemplary embodiment, and with reference to FIGS. 1-3 , the upper portion 120 may include an inlet plenum 200 configured to receive vapor from the vessel 135 and an exhaust plenum 205 configured to exhaust vapor from the reaction space 117.

[0035] The exhaust plenum 205 may include an inlet at the second surface 165 and an outlet coupled to the exhaust system 140. For example, gas may flow from the exhaust plenum 205 into the exhaust system 140. In various embodiments, the exhaust plenum 205 may be disposed concentrically with the inlet plenum 200. For example, the exhaust plenum 205 may have a ring shape that surrounds the inlet plenum 200 and is larger than the inlet plenum 200.

[0036] In various embodiments, the exhaust system 140 may include a foreline (not shown) and a pump (e.g., a vacuum pump) (not shown) to facilitate exhaust of gases from the reaction space 117. In various embodiments, an exhaust plenum 205 may be fluidly connected to the exhaust system 140.

[0037] In various embodiments, and with reference to FIGS. 5 and 6 , the bottom portion 125 may include a cutout 505 in the second surface 160. In an exemplary embodiment, the cutout 505 may include a circular opening 530 in the second surface 160 and have a first diameter D1. The cutout 505 may further include a groove 520 that protrudes radially outward from the vertical axis 500 and forms a second diameter D2. The groove 520 may have an outer edge that forms a circular or arcuate shape. In various embodiments, the second diameter D2 is larger than the first diameter D1. For example, in various embodiments, the first diameter D1 is within a range of 417 mm to 370 mm, and the second diameter D1 is within a range of 400 mm to 450 mm. The groove 520 may include a depth DG in a range of 20 mm to 45 mm. In various embodiments, the groove 520 may be angled upward toward the first surface 155 of the bottom portion 125. In other cases, the grooves 520 may be oriented completely horizontally.

[0038] In various embodiments, cutout 505 may further include a protrusion 510 extending or otherwise projecting radially inward into cutout 505 and toward vertical axis 500, forming at least a portion of a surface of groove 520. Protrusion 510 may form a circular shape. Further, protrusion 510 may form an opening having a third diameter D3 smaller than first diameter D1. Protrusion 510 may be disposed between second surface 160 and first surface 155. In other words, protrusion 510 is not flush with second surface 160.

[0039] 2-3, the susceptor 145 may engage with the cutout 505 and the protrusion 510. In particular, the susceptor 145 may be sized to fit within the opening 530 of the cutout 505. Additionally, the protrusion 510 may include a downward-facing horizontal surface configured to contact an edge of the susceptor 145. In some embodiments, a metal seal 310 may be disposed between the downward-facing surface and the susceptor 145. When the susceptor 145 engages with the cutout 505, the reaction space 117 is formed between the susceptor 145 and a surface 525 of the cutout 505.

[0040] In various embodiments, the bottom 125 may further include a plurality of inlet through-holes 300 extending through the first surface 155 and the surface 525 of the cutout 505. The plurality of inlet through-holes 300 may include approximately 1000 to 1200 through-holes. The plurality of inlet through-holes 300 may be disposed in a central region (also referred to as a showerhead region) of the bottom 125. The inlet plenum 200 may be in fluid communication with the plurality of inlet through-holes 300. For example, steam flowing from the vessel 135 into the inlet plenum 200 may continue to flow through the plurality of through-holes 300. The plurality of inlet through-holes 300 may also be in fluid communication with the reaction space 117. For example, steam may flow through the plurality of inlet through-holes 300 into the reaction space 117. In an exemplary embodiment, the plurality of inlet through-holes 300 are disposed radially inward from the protrusion 510.

[0041] In various embodiments, and with reference to FIGS. 3 and 5 , the bottom 125 may further include a plurality of exhaust through-holes 305 (e.g., 20 to 100 holes, particularly 65 to 80 holes) fluidly connected to the exhaust plenum 205. Each of the plurality of exhaust through-holes 305 may have a first opening in the first surface 155 of the bottom 125 and a second opening in a surface of the groove 520, such as an upper surface of the groove 520. In exemplary embodiments, the plurality of exhaust through-holes 305 may be positioned at or near an outermost dimension of the groove 520. For example, the plurality of exhaust through-holes 305 may be aligned with the terminus 535 of the groove 520. The plurality of exhaust through-holes 305 may be arranged in a ring pattern (e.g., as shown in FIG. 4 ). Furthermore, the first openings of the plurality of exhaust through-holes 305 may be positioned to be in fluid communication with the exhaust plenum 205. In particular, the first openings of the plurality of exhaust through-holes 305 may be aligned with an inlet of the exhaust plenum 205. Additionally, the plurality of exhaust through-holes 305 may be positioned radially outward from the plurality of inlet through-holes 300 .

[0042] 1-6, system 100 may be configured to perform atomic layer deposition (ALD), in which precursors from reservoir 135 are pulsed into reaction space 117 via gas distribution system 110 and then purged using an inert gas, such as argon. For example, during the pulsing step, vapor flows from reservoir 135 into inlet plenum 200 and through perforations 300 into reaction space 117. During the purging step, chemical vapor from the pulsing step is evacuated from reaction space 117 by flowing inert gas from inert gas source 130 through perforations 300 into inlet plenum 200. At this point, exhaust system 140 is utilized, allowing vapor to flow radially outward from reaction space 117, directed by grooves 520, through perforations 305, and into exhaust plenum 205.

[0043] In the foregoing description, the present technology has been described with reference to specific exemplary embodiments. The specific embodiments shown and described are illustrative of the present technology and its best mode and are not intended to limit the scope of the present technology in any way. Also, for the sake of brevity, conventional manufacturing, connection, preparation, and other functional aspects of the present methods and systems may not be described in detail. Furthermore, connecting lines shown in the various figures are intended to represent example functional relationships and / or steps between the various elements. Many alternative or additional functional relationships or physical connections may exist in an actual system.

[0044] The present technology has been described with reference to specific exemplary embodiments. However, various modifications and changes can be made without departing from the scope of the present technology. The description and drawings are to be considered in an illustrative manner, not restrictive, and all variations are intended to be included within the scope of the present technology. Thus, the scope of the present technology should be determined solely by the general embodiments described and their legal equivalents, rather than by the specific examples described above. For example, steps described in an embodiment of a method or process may be performed in any order unless otherwise expressly specified, and are not limited to the explicit order presented in a particular embodiment. Furthermore, the components and / or elements described in an embodiment of any apparatus may be assembled or operably configured in various forms to produce substantially the same results as the present technology, and therefore are not limited to the specific configurations described in a particular embodiment.

[0045] Although benefits, other advantages, and solutions to problems have been described above with reference to specific embodiments, any benefit, advantage, solution to a problem, or any element that may cause or make more pronounced any particular benefit, advantage, or solution, is not to be construed as a critical, required, or essential feature or component.

[0046] The terms "comprises / includes / providing / having," "comprises / includes / providing / having," or any variation thereof, are intended to indicate a non-limiting inclusion, such that a process, method, article, composition, or apparatus comprising the listed elements includes not only those elements described, but may also include other elements not expressly described or inherent to such process, method, article, composition, or apparatus. In addition to those not specifically described, other combinations and / or variations of the above-described structures, configurations, applications, proportions, elements, materials, or components used in the practice of the present technology may be changed or specifically adapted to particular environments, manufacturing specifications, design parameters, or other operating requirements without departing from the general principles thereof.

[0047] The present technology has been described above with reference to exemplary embodiments. However, changes and modifications may be made to the exemplary embodiments without departing from the scope of the technology. These and other changes or modifications are intended to be included within the scope of the technology, as expressed in the following claims.

Claims

1. a first surface and a second surface opposite the first surface; a circular cutout in the second surface, the cutout comprising an opening in the second surface having a first diameter and a groove projecting radially outward from the vertical axis and defining a second diameter, the second diameter being greater than the first diameter; a protrusion projecting inwardly toward the vertical axis and disposed between the first surface and the second surface, the protrusion forming at least a portion of the groove.

2. The apparatus of claim 1 , wherein the groove has a depth in the range of 20 mm to 45 mm.

3. The device of claim 1 further comprising a plurality of first through-holes extending from the first surface to the groove.

4. The apparatus of claim 3 , wherein the plurality of first through-holes are disposed at an outermost dimension of the groove.

5. The device of claim 3 , wherein the plurality of first through-holes are fluidly connected to the groove.

6. The apparatus of claim 1 , wherein the groove is angled upwardly toward the first surface.

7. The device of claim 1 , wherein the protrusion comprises a downwardly facing horizontal surface.

8. 2. The apparatus of claim 1, wherein the first diameter is in the range of 417 mm to 370 mm and the second diameter is in the range of 400 mm to 450 mm.

9. a gas distribution plate having an inlet plenum and an exhaust plenum; a showerhead plate, The showerhead plate is a first surface in direct contact with the gas distribution plate and an opposite second surface; a circular cutout in the second surface, the cutout comprising an opening in the second surface having a first diameter and a groove projecting radially outward from the vertical axis and defining a second diameter, the second diameter being greater than the first diameter; a circular protrusion protruding inwardly toward the vertical axis and disposed between the first surface and the second surface, the protrusion forming the groove; a plurality of first through-holes extending from the first surface to the groove and in fluid communication with the exhaust plenum; a plurality of second through-holes extending from the first surface to a surface of the cutout and in fluid communication with the inlet plenum.

10. The apparatus of claim 9 , wherein the groove is angled upwardly toward the first surface.

11. The apparatus of claim 9 , wherein the plurality of first through-holes are disposed at an outermost portion of the groove.

12. The apparatus of claim 9, wherein the groove has a depth in the range of 20 mm to 45 mm.

13. The apparatus of claim 9 , wherein the protrusion comprises a downwardly facing horizontal surface configured to contact a susceptor.

14. 10. The apparatus of claim 9, wherein the first diameter is in the range of 417 mm to 370 mm.

15. 10. The apparatus of claim 9, wherein the second diameter is in the range of 400 mm to 450 mm.

16. The apparatus of claim 9 , further comprising a susceptor configured to engage the cutout opening and the protrusion.

17. a first horizontal surface and a second horizontal surface opposite the first horizontal surface; a circular cutout in the second horizontal plane, the cutout comprising an opening having a first diameter in the second horizontal plane and a groove projecting radially outward from a vertical axis and defining a second diameter, the second diameter being greater than the first diameter; a circular protrusion protruding inwardly toward the vertical axis and disposed between the first horizontal surface and the second horizontal surface, the protrusion forming the groove; a plurality of first through-holes extending from the first horizontal surface to a surface of the groove, the plurality of first through-holes being fluidly connected to the groove; a plurality of second through-holes extending from the first horizontal surface to a surface of the cutout and fluidly connected to the cutout.

18. 18. The apparatus of claim 17, wherein the first diameter is in the range of 417 mm to 370 mm and the groove has a depth in the range of 20 mm to 45 mm.

19. 18. The apparatus of claim 17, wherein the second diameter is in the range of 400 mm to 450 mm and the groove has a depth in the range of 20 mm to 45 mm.

20. 18. The apparatus of claim 17, wherein the groove is angled upward toward the first horizontal plane.

Images