Cooling module for a backside power supply system

Abstract

To provide a cooling module for a back power supply system capable of radiating heat generated on the back side of a substrate.SOLUTION: In the cooling module for a back power supply system, the back power supply system includes a substrate and an electronic component, the electronic component is provided on the back side of the substrate, the cooling module includes at least one cooling component provided on the electronic component, and the electronic component includes a power supply component.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a cooling module, and more particularly to a cooling module for cooling a rear power supply system. [Background technology]

[0002] With the rapid development of artificial intelligence, the demand for computers is increasing exponentially. At the same time, with the evolution of Moore's Law, the size of transistors is gradually decreasing, the density of their placement is gradually increasing, and the number of stacked layers is also increasing.

[0003] Furthermore, conventional power supply technologies typically supply power from above (top, front) the chip, but to deliver power and data signals to transistors located below (bottom, back) the chip, it may be necessary to pass through 10 to 20 stacked circuit layers.

[0004] This allows data signal patterns and power supply lines to coexist on each circuit layer, resulting in the formation of even more complex circuits.

[0005] Furthermore, an IR drop may occur during the downward transport of electrons, which may result in power loss.

[0006] However, the advancement of backside power delivery technology has provided an effective solution to the above problems. The so-called backside power delivery network (BSPDN) technology moves the power supply lines from the front side of the original chip or circuit board to the back side. Summary of the Invention [Problem to be solved by the invention]

[0007] However, the main problem with this technology is that when the pattern circuit is made too thin, the power supply lines and data signal lines interfere with each other. Therefore, it is necessary to move the power supply line layout to the back side of the chip or substrate to separate the power supply lines and data signal lines so that they do not interfere with each other.

[0008] To explain further, the back-side power supply (BSPDN) technology was first proposed by the Belgian Microelectronics Research Center (IMEC) in 2019.

[0009] The technology connects components on the front side of the wafer to the buried power rail (BPR) using nanosilicon through-hole (nTSV) structures, which are high aspect ratio silicon vias that enable connections between the front and back sides of the wafer.

[0010] Furthermore, small fin field effect transistors (FinFETs) can be interconnected by utilizing these buried power rails (BPRs).

[0011] In the current technological development, Taiwan Semiconductor Manufacturing Company (TSMC)'s A16 chip manufacturing technology adopts the Super Power Rail architecture, which moves the power supply line that supplies power to the transistor below the transistor, known as backside power supply, which helps to produce more efficient chips.

[0012] Here, the power supplied to the source and drain of each transistor uses a special contact method to simultaneously reduce resistance and achieve maximum performance and power efficiency.

[0013] Additionally, Taiwan Semiconductor Manufacturing Company (TSMC) has also developed a backside power technology called "Buried Power Grid" (BPG), which uses a metal mesh to connect power lines to structures on the front layer of the wafer.

[0014] According to Taiwan Semiconductor Manufacturing Co., Ltd., its "embedded power grid" technology can reduce the area occupied by power supply lines by 60%, which can improve wiring efficiency and reduce power consumption.

[0015] Meanwhile, Intel has developed a backside power technology called "Power Via," which uses high-aspect-ratio through-silicon vias to connect power lines to structures on the backside layer of the wafer.

[0016] Intel says its "Power Via" technology can reduce the area occupied by power supply lines by 50%, improving wiring efficiency and reducing power consumption.

[0017] In addition, Intel has also incorporated this rear power supply technology into the manufacturing process of the Intel 20A chip, which not only simplifies power distribution but also allows for a more compact layout of chip circuits, with the goal of packing more transistors into the processor and increasing computing power.

[0018] According to the results of initial testing, the rear power supply method was able to increase the CPU operating frequency by approximately 6% and reduce voltage drop (IR drop) by approximately 30%.

[0019] However, after the power supply lines are placed on the back side of the board, some power supply components (voltage regulation module, VRM, etc.) are also placed on the surface of the back side of the board, so heat dissipation is also required on the back side of the board.

[0020] Specifically, if the conversion efficiency of a power supply component (such as a VRM) is 90%, 10% of the total energy is consumed as heat energy. More specifically, the amount of heat energy that needs to be dissipated on the back side of the board is at least 50W to 120W. For this reason, there is an urgent need to develop technology to dissipate the heat generated on the back side of the board. [Means for solving the problem]

[0021] In view of the above problems, the present invention has the following configuration. In the cooling module for the rear power supply system, The rear power supply system includes a substrate and an electronic component, the electronic component being provided on the rear side of the substrate; the cooling module includes at least one cooling component disposed on the electronic component; The electronic components include power supply components.

[0022] In addition, in the cooling module for the rear power supply system, The rear power supply system includes a substrate and a plurality of electronic components, the plurality of electronic components being respectively provided on a front side and a rear side of the substrate; the cooling module includes a plurality of cooling components, the plurality of cooling components being fixed to the front side and the rear side of the substrate, respectively, and being provided on the plurality of electronic components, respectively; The plurality of electronic components provided on the rear side of the substrate include a power supply component.

[0023] In addition, in the cooling module for the rear power supply system, The rear power supply system includes a substrate and a plurality of electronic components, the plurality of electronic components being respectively disposed on a front side and a rear side of the substrate, and the substrate includes a plurality of through holes; the cooling module includes a first cooling component, a second cooling component, and a plurality of fixtures; the first cooling component and the second cooling component are respectively disposed on the plurality of electronic components, the first cooling component including a plurality of through holes, and the second cooling component including a plurality of perforations; the plurality of fasteners respectively pass through the plurality of perforations of the second cooling component, the plurality of through-holes of the substrate, and the plurality of through-holes of the first cooling component; the first cooling component and the second cooling component are secured to the front side and the back side of the substrate, respectively; The plurality of electronic components provided on the rear side of the substrate include a power supply component.

[0024] In addition, in the cooling module for the rear power supply system, The rear power supply system includes a substrate and at least one electronic component; the cooling module includes at least one cooling component, the at least one cooling component being disposed on the at least one electronic component; The substrate includes a socket, a chip carrier, and a main circuit board; the socket is mounted on the main circuit board, the chip carrier is accommodated in the socket, and the at least one electronic component includes an integrated voltage regulator and is mounted on a rear side of the chip carrier; The main circuit board includes an opening groove, the socket includes a through-groove, and the at least one cooling component corresponds to the through-groove and the opening groove.

[0025] In addition, in the cooling module for the rear power supply system, the rear power supply system includes a substrate and at least one electronic component; the cooling module includes at least one cooling component, the at least one cooling component being disposed on the at least one electronic component; The substrate includes a main circuit board, an interposer board, a mezzanine connector, and a package substrate; the interposer substrate is provided on a front side of the package substrate, and the at least one electronic component is provided on a rear side of the package substrate; The mezzanine connector is disposed between the rear side of the package substrate and the main circuit board, and electrically connects the package substrate to the main circuit board. [Effects of the Invention]

[0026] According to the present invention, a rear power supply system includes a substrate and electronic components, the electronic components are provided on the rear side of the substrate, and the cooling module includes at least one cooling component provided on the electronic components, and the electronic components include power supply components, so that a cooling module for a rear power supply system can be provided that can dissipate heat generated by the power supply components on the rear side of the substrate. [Brief explanation of the drawings]

[0027] [Figure 1A] 1 is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention; [Figure 1B] 1 is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention; [Figure 1C] 1 is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention; [Figure 1D] 1 is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention; [Figure 2A] 1 is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention; [Figure 2B] 1 is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention; [Figure 2C] 1 is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention; [Figure 2D] 1 is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention; [Figure 3] 1 is a cross-sectional view of a cooling module used in a rear power supply system according to an embodiment of the present invention. [Figure 4] 1 is a cross-sectional view of a cooling module used in a rear power supply system according to an embodiment of the present invention. [Figure 5]1 is a cross-sectional view of a cooling module used in a rear power supply system according to an embodiment of the present invention. [Figure 6] 1 is a cross-sectional view of a cooling module used in a rear power supply system according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0028] Various embodiments will be introduced below to explain the invention in detail. However, the following embodiments are merely examples, and are not intended to limit the technical scope of the present invention to those described in the embodiments. In the following embodiments of the present invention, some components may be omitted from the drawings to clearly illustrate the technical features of the present invention. Identical components are given the same reference numerals. Technically related components are given related reference numerals, for example, with different last digits. The drawings are provided for illustrative purposes only, are not necessarily drawn to scale, and do not depict all details of a cooling module for a backplane power supply system using the present invention.

[0029] An embodiment of the present invention will be described with reference to Fig. 1A, which is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention.

[0030] 1A, in this embodiment, the rear power supply system (no reference numeral) includes a substrate 2, a first electronic component C1, and a second electronic component C2, and the first electronic component C1 and the second electronic component C2 are provided on opposite sides of the substrate 2. That is, the first electronic component C1 and the second electronic component C2 are provided on a front side 201 located on the upper side and a rear side 202 located on the lower side, respectively, as viewed from the perspective of FIG. 1A. The second electronic component C2 includes a power supply component (no reference numeral).

[0031] The cooling module (not numbered) comprises a first cooling component 3 provided on a first electronic component C1 and a second cooling component 4 provided on a second electronic component C2.

[0032] To further explain, in one embodiment, the substrate 2 is a printed circuit board 21 (see, for example, FIG. 2A described below), and its power supply circuit (not shown) is provided near the rear side 202 of the substrate 2. Therefore, the second electronic component C2 provided on the rear side 202 of the substrate 2 is a power supply component such as, but not limited to, a voltage regulator module (VRM).

[0033] Additionally, the first electronic component C1 provided on the front side 201 of the substrate 2 can be any electronic component, such as, but not limited to, a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a graphics processing unit (GPU), a central processing unit (CPU), a tensor processing unit (TPU), or a network processing unit (NPU).

[0034] Also, in the embodiment shown in FIG. 1A, the first electronic component C1 and the second electronic component C2 are directly mounted on the front side 201 and the back side 202 of the substrate 2 by surface-mount technology (SMT).

[0035] 1A, in this embodiment, the first cooling component 3 and the second cooling component 4 may be water-cooled plates 31 and 41, respectively, which may be connected to cooling distribution units (not shown). The cooling distribution units then provide forced circulation of fluid through the water-cooled plates 31 and 41 to regulate the temperatures of the first cooling component 3 and the second cooling component 4.

[0036] From the above, it can be seen that in this embodiment, the first cooling component 3 can exchange heat with the first electronic component C1, and the second cooling component 4 can exchange heat with the second electronic component C2, and the cooling fluid in the first cooling component 3 and the second cooling component 4 can flow continuously and forcibly.

[0037] This allows the heat generated by the first electronic component C1 and the second electronic component C2 to be removed, so that the temperatures of the first electronic component C1 and the second electronic component C2 can be maintained or even reduced, thereby keeping the entire rear power supply system in good operating condition.

[0038] 1A and 3, which are cross-sectional views of a cooling module used in a rear power supply system according to an embodiment of the present invention.

[0039] In this embodiment, the first cooling component 3 and the second cooling component 4 are fixed on the substrate 2. To further explain, the cooling module may further include a plurality of fixtures 5, for example, four fixtures 5 as shown in Figure 1. The fixtures 5 are preferably made of a metal with high thermal conductivity, such as copper.

[0040] 3, the first cooling component 3 has a plurality of through holes 51, for example, four through holes 51. The second cooling component 4 also has a corresponding number of perforations 52, and the substrate 2 also has a corresponding number of through holes 211. Fixing devices 5 are inserted into the perforations 52, the through holes 211, and the through holes 51, respectively.

[0041] As shown in FIGS. 1A and 3, the cooling module may further include a plurality of locking devices 55, the number of which may correspond to the number of fasteners 5, for example, four.

[0042] In this embodiment, the locking device 55 may be an independent component such as a nut, or may be a threaded hole formed in the first cooling component 3 or the second cooling component 4.

[0043] Furthermore, one end of each fixing device 5 can be screwed into locking device 55 by passing through drilling hole 52, through-hole 211, and through-hole 51 in that order. In this way, first cooling component 3 and second cooling component 4 can be firmly attached to corresponding surfaces of front side 201 and back side 202 of substrate 2, thereby enabling stable contact between first electronic component C1 and second electronic component C2, respectively, for heat exchange and heat dissipation.

[0044] In addition, in this embodiment, in order to ensure the integrity of the contact between the two contact interfaces, a thermal interface material (not shown) may be additionally provided between the first electronic component C1 and the first cooling component 3, and also between the second electronic component C2 and the second cooling component 4.

[0045] Furthermore, as shown in FIG. 3, each fixture 5 may be provided with a (compression) spring 56, for example, to provide a buffer function between the board 2 and the first cooling component 3, thereby preventing excessive force from being applied to the fixture 5 when locked, which could damage the first electronic component C1 or the board 2.

[0046] In this embodiment, the cooling module may further include a support pad 6 that is arranged on the same side of the substrate 2 as the second electronic component C2.

[0047] The support pad 6 can be made of a hard non-conductive material such as bakelite, and its main purpose is to improve the strength of the substrate 2 and reduce the stress experienced by the second electronic component C2.

[0048] Next, a description will be given with reference to Fig. 4. Fig. 4 is a cross-sectional view of a cooling module used in a rear power supply system according to an embodiment of the present invention. Fig. 4 also shows a fixing method of the first cooling component 3 and the second cooling component 4, which is different from the embodiment shown in Fig. 3.

[0049] In this embodiment, the cooling module includes a plurality of first fasteners 53 and a plurality of second fasteners 54, and may include, for example, four of each (however, those at the far end in the depth direction in FIG. 4 are not shown due to the angle. The same applies to first perforations 521 and second perforations 522, which will be described later). Furthermore, the first cooling component 3 is provided with four through holes 51, the second cooling component 4 has four first perforations 521 and four second perforations 522, and the substrate 2 has eight through holes 211. Here, the second perforations 522 described above are formed further inward in the second cooling component than the first perforations 521.

[0050] Of these, the four first fasteners 53 pass through the four through holes 51, the four through holes 211, and the four first perforations 521, respectively. In addition, the four second fasteners 54 pass through the four second perforations 522 and the four through holes 211, respectively.

[0051] Therefore, in the embodiment shown in FIG. 4, the second cooling component 4 can be more firmly connected to the substrate 2 via the plurality of first fasteners 53 and second fasteners 54 .

[0052] Furthermore, the first fixture 53 and the second fixture 54 may be made of copper, which has excellent thermal conductivity, so that at least a portion of the heat on the substrate 2 can be transferred to the first cooling component 3 and the second cooling component 4.

[0053] That is, the first cooling component 3 and the second cooling component 4 can not only dissipate heat from the first electronic component C1 and the second electronic component C2 but also control the temperature of the substrate 2.

[0054] Next, an embodiment of the present invention will be described with reference to Fig. 1B, which is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention.

[0055] 1B, the second cooling component 4 provided on the second electronic component C2 may also include heat dissipation fins 42. This is applicable to electronic components with a relatively small thermal design power (TDP).

[0056] Moreover, a heat dissipation fin 42 may be provided for each second electronic component C2, or a pair of heat dissipation fins 42 may be shared by a plurality of second electronic components arranged nearby.

[0057] Next, an embodiment of the present invention will be described with reference to Fig. 1C, which is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention.

[0058] The second cooling component 4 disposed on the second electronic component C2 may include a plurality of heat dissipation fins 42 and a plurality of heat pipes 43.

[0059] In the embodiment shown in FIG. 1C, two pairs of heat dissipation fins 42 correspond to the second electronic components C2 arranged spaced apart in two rows along the short side direction perpendicular to the longitudinal direction of the substrate 2, and multiple heat pipes 43 are connected between two heat dissipation fins 42 located toward the center of the longitudinal direction of the substrate 2.

[0060] In other embodiments, a vapor chamber (not shown) can be used in place of the heat pipe 43, or even both the heat pipe 43 and the vapor chamber can be used as thermally conductive components.

[0061] In this way, the heat pipe 43 has the property of quickly conducting heat, which allows the temperature uniformity of the plurality of heat dissipation fins 42 to be maintained, and the second electronic components C2 with different heat dissipation design capabilities can be adjusted to better maintain the overall heat dissipation efficiency.

[0062] Next, an embodiment of the present invention will be described with reference to Fig. 1D, which is an exploded perspective view of a cooling module used in a rear power supply system according to an embodiment of the present invention. In this embodiment, the second cooling component 4 may include a plurality of heat dissipation fins 42 and a plurality of thermally conductive sheets 44.

[0063] However, the thermally conductive sheet 44 is generally made of silicone combined with a thermally conductive powder, which can achieve better thermal conductivity, insulation, compressibility, and the like.

[0064] In the embodiment shown in FIG. 1D, each heat dissipation fin 42 is provided with a thermally conductive sheet 44, and the thermally conductive sheet 44 is interposed between the heat dissipation fin 42 and the second electronic component C2.

[0065] The thermally conductive sheet 44 is a type of thermal interface material (TIM) that is used to fill the thermal interface gap formed between the upper surface of the heat dissipation fin 42 and the lower surface of the second electronic component C2 during the heat conduction process, thereby reducing the contact thermal resistance and improving the heat transfer efficiency.

[0066] Next, description will be made with reference to Figures 2A to 2D, each of which is an exploded perspective view of a cooling module used in a back surface power supply system according to an embodiment of the present invention.

[0067] 2A to 2D and the embodiment shown in Figures 1A to 1D differ as follows: In Figures 2A to 2D, a socket 9 for accommodating a first electronic component C1 is provided on the front side 201 of the substrate 2, which is different from the embodiment shown in Figures 1A to 1D.

[0068] In this embodiment, the socket 9 may be an electronic component fixing device that integrates a fastener (Independent Loading Mechanism, ILM) and a socket. Fasteners are generally made of metal and are characterized by high strength and excellent durability. This allows for a better fixing effect between the first cooling component 3 and the second cooling component 4.

[0069] To further explain, in the embodiment shown in FIG. 2A, the first cooling component 3 and the second cooling component 4 are water-cooled plates 31, 41, respectively.

[0070] In the embodiment shown in FIG. 2B, the first cooling component 3 may be a water-cooled plate 31 and the second cooling component 4 may be a heat dissipation fin 42.

[0071] In the embodiment shown in FIG. 2C, the first cooling component 3 is similarly a water-cooled plate 31 , and the second cooling component 4 may include heat dissipation fins 42 and heat pipes 43 .

[0072] In the embodiment shown in FIG. 2D, the first cooling component 3 is also a water-cooled plate 31, and the second cooling component 4 may include heat dissipation fins 42 and a thermally conductive sheet 44.

[0073] In addition, in this embodiment, the socket 9 includes a metal fastener, and the fixture 5 also uses a post made of copper, so that both the metal fastener and the post made of copper have excellent thermal conductivity properties.

[0074] Therefore, when the temperature of the substrate 2 rises, the metal fasteners and the copper pillars can adequately transfer the heat from the substrate 2 to the first cooling component 3 and the second cooling component 4, and this heat is dissipated through the first cooling component 3 and the second cooling component 4, thereby reducing the temperature of the substrate 2.

[0075] Next, a description will be given with reference to Fig. 5. Here, Fig. 5 is a cross-sectional view of a cooling module used in a rear power supply system according to an embodiment of the present invention.

[0076] In the embodiment shown in FIG. 5, the substrate 2 includes a chip carrier 22 and a main circuit board 23 , and the chip carrier 22 may further include an interposer substrate 221 and a package substrate 222 .

[0077] The first electronic component C1 is disposed on the front side 201 of the interposer substrate 221, and the second electronic component C2 is disposed on the back side 202 of the interposer substrate 221.

[0078] The first cooling component 3 is disposed on the first electronic component C1, specifically, on the opposite side of the interposer substrate 221. The second cooling component 4 is disposed on the second electronic component C2. The second electronic component C2 is provided on the opposite side of the interposer substrate 221 from the side on which the first electronic component C1 is disposed.

[0079] In this embodiment, the first electronic component C1 may be a field programmable gate array, an application specific integrated circuit, a graphics processing unit, a central processing unit, a tensor processing unit, or a network processing unit, and the second electronic component C2 may include an integrated voltage regulator.

[0080] As shown in FIG. 5, the interposer substrate 221 is electrically connected to the main circuit board 23 via a package substrate 222.

[0081] In this embodiment, the socket 9 is provided on the main circuit board 23, and the entire chip carrier 22 is housed in the socket 9. The package substrate 222 is electrically connected to the main circuit board 23 via a land grid array (LGA) (not shown) in the socket 9.

[0082] In other embodiments, the package substrate 222 may be electrically connected to the main circuit board 23 via a pin grid array (PGA) package or a ball grid array (BGA) package.

[0083] Furthermore, the main circuit board 23 includes an opening groove 231, and the socket 9 includes a through groove 91. The second cooling component 4 corresponds to the opening groove 231 and the through groove 91, so that the second cooling component 4 can be accommodated inside the opening groove 231 and the through groove 91.

[0084] Meanwhile, the second cooling component 4 can extend to the outside of the main circuit board 23 through the opening groove 231 and the through groove 91, and for example, the second cooling component 4 may be in the form of a heat pipe, a vapor chamber, or a thermally conductive sheet combined with a heat dissipation fin or a water-cooled plate (none of which are shown).

[0085] Here, the heat dissipation fins and water-cooled plate are arranged on or around the main circuit board 23, and one end of the heat pipe, vapor chamber or thermally conductive sheet can contact the second electronic component C2, and the other end can be connected to the heat dissipation fins and water-cooled plate.

[0086] Next, a description will be given with reference to Fig. 6. Here, Fig. 6 is a cross-sectional view of a cooling module used in a rear power supply system according to an embodiment of the present invention.

[0087] 6, the substrate 2 includes a chip carrier 22 and a main circuit board 23. The chip carrier 22 further includes an interposer substrate 221 and a package substrate 222.

[0088] Here, the first electronic component C1 and the second electronic component C2 are respectively provided on two opposing side surfaces of the chip carrier 22.

[0089] More specifically, the first electronic component C1 is disposed on the front side of the interposer substrate 221, and the second electronic component C2 is disposed on the back side of the package substrate 222.

[0090] The interposer substrate 221 is electrically connected to the main circuit board 23 via a package substrate 222 .

[0091] 6, the chip carrier 22 is electrically connected to the main circuit board 23 via the mezzanine connector 8. In this manner, the chip carrier 22 and the main circuit board 23 are spaced apart by a predetermined distance D.

[0092] In other embodiments, chip carrier 22 may be electrically connected to main circuit board 23 in other ways, and chip carrier 22 and main circuit board 23 may be separated by a predetermined distance D by other means, such as insulating support posts.

[0093] In this embodiment, the predetermined distance D can be used to accommodate the second electronic component C2 and the second cooling component 4.

[0094] Although the embodiments of the present invention have been described above, these embodiments are not intended to limit the present invention. Furthermore, a person skilled in the art may modify or change the present invention without departing from the spirit and scope of the present invention, but the technical scope of the present invention is defined by the claims. [Explanation of symbols]

[0095] 2 boards 3 Primary Cooling Component 4 Secondary Cooling Component 5 Fixtures 6 support pads 8 mezzanine connector 9 sockets 21 Printed Circuit Board 22 Chip Carrier 23 Main circuit board 31, 41 Water cooling plate 42 Heat dissipation fin 43 Heat Pipe 44 Thermally conductive sheet 51 Through hole 52 perforation 53 First Fixture 54 Second Fixture 55 Locking device 56 Spring 91 Through groove 201 Front side 202 rear side 211 Through hole 221 Interposer board 222 Package Substrate 231 Opening groove 521 First Perforation 522 Second Perforation C1 First electronic component C2 Second electronic component D. A specified distance

Claims

1. In the cooling module for the rear power supply system, The rear power supply system includes a substrate and an electronic component, the electronic component being provided on the rear side of the substrate; the cooling module includes at least one cooling component disposed on the electronic component; The electronic components include a power supply component.

1. A cooling module for a rear power supply system, comprising:

2. In the cooling module for the rear power supply system, The rear power supply system includes a substrate and a plurality of electronic components, the plurality of electronic components being respectively provided on a front side and a rear side of the substrate; the cooling module includes a plurality of cooling components, the plurality of cooling components being fixed to the front side and the rear side of the substrate, respectively, and being provided on the plurality of electronic components, respectively; the plurality of electronic components provided on the rear side of the substrate include a power supply component; 1. A cooling module for a rear power supply system, comprising:

3. In the cooling module for the rear power supply system, The rear power supply system includes a substrate and a plurality of electronic components, the plurality of electronic components being respectively disposed on a front side and a rear side of the substrate, and the substrate includes a plurality of through holes; the cooling module includes a first cooling component, a second cooling component, and a plurality of fixtures; the first cooling component and the second cooling component are respectively disposed on the plurality of electronic components, the first cooling component including a plurality of through holes, and the second cooling component including a plurality of perforations; the plurality of fasteners respectively pass through the plurality of perforations of the second cooling component, the plurality of through-holes of the substrate, and the plurality of through-holes of the first cooling component; the first cooling component and the second cooling component are secured to the front side and the back side of the substrate, respectively; the plurality of electronic components provided on the rear surface side of the substrate include a power supply component; 1. A cooling module for a rear power supply system, comprising:

4. In the cooling module for the rear power supply system, The rear power supply system includes a substrate and at least one electronic component; the cooling module includes at least one cooling component, the at least one cooling component being disposed on the at least one electronic component; The substrate includes a socket, a chip carrier, and a main circuit board; the socket is mounted on the main circuit board, the chip carrier is accommodated in the socket, and the at least one electronic component includes an integrated voltage regulator and is mounted on a rear side of the chip carrier; the main circuit board includes an opening groove, the socket includes a through-hole, and the at least one cooling component corresponds to the through-hole and the opening groove; 1. A cooling module for a rear power supply system, comprising:

5. In the cooling module for the rear power supply system, the rear power supply system includes a substrate and at least one electronic component; the cooling module includes at least one cooling component, the at least one cooling component being disposed on the at least one electronic component; The substrate includes a main circuit board, an interposer board, a mezzanine connector, and a package substrate; the interposer substrate is provided on a front side of the package substrate, and the at least one electronic component is provided on a rear side of the package substrate; the mezzanine connector is disposed between the rear side of the package substrate and the main circuit board, and electrically connects the package substrate to the main circuit board; 1. A cooling module for a rear power supply system, comprising:

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