Quantum dot composite, three dimensional display device, and processing method thereof

Abstract

To provide a quantum dot composite, a three dimensional display element, and a method for processing the same.SOLUTION: A method for processing a quantum-dot composite includes the following steps: S1, sequentially providing a first transparent conductive layer, coating a quantum-dot layer, and providing a second transparent conductive layer on one side of a transparent substrate to form a quantum-dot unit; S2, bonding a plurality of quantum-dot units; and S3, trimming the bonded quantum-dot units to obtain a quantum-dot composite. The trimming of the bonded quantum dot units may include leveling, curing, edge trimming, polishing, and the like.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to the field of display technology, and in particular to quantum dot composites, three-dimensional display elements, and methods for fabricating the same. [Background technology]

[0002] Conventional solid volume 3D display technologies, such as 3D display technology using upconversion materials and 3D display technology using liquid crystal layers, each have their own problems: the former has low brightness and low contrast, and the latter has low vertical resolution and a single viewing angle. Summary of the Invention [Problem to be solved by the invention]

[0003] The present disclosure aims to solve at least one of the technical problems existing in the prior art, and therefore, one object of the present disclosure is to provide a quantum dot composite, a three-dimensional display element, and a method for fabricating the same. [Means for solving the problem]

[0004] A method for processing a quantum dot composite according to an embodiment of the first aspect of the present disclosure includes the steps of sequentially providing a first transparent conductive layer on one side of a transparent substrate, applying a quantum dot layer, and providing a second transparent conductive layer to form a quantum dot unit, adhering a plurality of quantum dot units together, and trimming the adhering quantum dot units to obtain a quantum dot composite.

[0005] The processing process proposed in this disclosure can significantly improve the uniformity of the luminous surface of each layer of bulk material used in 3D displays, increase the luminous contrast, improve the transparency of the material, increase the depth resolution, and widen the viewing angle of the 3D image.

[0006] In some embodiments, the step of adhering the multiple quantum dot units includes the steps of providing a spacer, which is a transparent polymer material member, a resin member, an optical glass member, or an optical crystal member, on at least one side of each quantum dot unit; stacking the multiple quantum dot units to form a stack, with adjacent quantum dot units separated by the spacer to form a gap for accommodating adhesive; sealing two opposing side surfaces of the stack and forming the other two opposing side surfaces as an adhesive injection surface and an adhesive discharge surface; and perfusing the adhesive to enter from the adhesive injection surface and fill the gap, so that after curing, an adhesive layer including the spacer is formed between the adjacent quantum dot units.

[0007] In some embodiments, the height of the spacers is 1 μm to 500 μm, the distance between adjacent spacers is 0.1 mm to 5 mm, and the height error of the plurality of spacers is ≦2 μm.

[0008] In some embodiments, the distance between adjacent spacers is 5 μm to 20 mm, the spacers may be silica microspheres, polystyrene microspheres, or polymethyl methacrylate microspheres, the spherical diameter of the spacers is 1 μm to 200 μm, and the diameter uniformity error is less than 10%.

[0009] In some embodiments, the method further includes adjusting the parallelism and flatness of the laminate before sealing or before curing the adhesive to control the error within ±5 μm.

[0010] In some embodiments, a liquid or solid sealant is used to seal the laminate, the liquid sealant being epoxy resin or acrylic resin, the solid sealant being rubber or silicone rubber, the viscosity of the liquid sealant being greater than 20,000 cps, the curing method of the liquid sealant being natural curing at room temperature, heat curing or ultraviolet curing, and the Shore hardness of the liquid sealant after curing is 20A-70A.

[0011] In some embodiments, the adhesive is degassed before perfusion, the viscosity of the adhesive is less than 500 cps, the adhesive is an epoxy resin or an acrylic resin, the volume shrinkage rate of the adhesive after curing is less than 1.1%, the Shore hardness of the adhesive after curing is 60D to 80D, and the refractive index of the adhesive after curing is the same as that of the transparent substrate.

[0012] In some embodiments, perfusion is achieved by one of the following methods:

[0013] First, gravity perfusion method: The adhesive injection surface of the laminate is placed in the adhesive tank of the gravity adhesive injection device, and a sealant or tool is used to create a sealed connection between the adhesive injection device and the adhesive injection surface. The laminate is then placed in a vacuum chamber together with the adhesive injection device, and the adhesive fills the gaps under the combined action of gravity and capillary action. When it is observed that the adhesive has seeped out evenly at each point on the adhesive discharge surface, the vacuum device is closed and the adhesive perfusion is completed.

[0014] The second gravity perfusion method: The adhesive injection surface of the laminate is placed in the adhesive tank of the gravity adhesive injection device, a sealant or tool is used to create a sealed connection between the adhesive injection device and the adhesive injection surface, a vacuum device is connected to the adhesive discharge surface, the vacuum device envelops the entire adhesive discharge surface of the laminate, and the adhesive discharge surface is isolated from the outside using a sealant or tool, the absolute vacuum of the vacuum device is set to <10 kPa, and when it is observed that the adhesive is seeping out evenly from each part of the adhesive discharge surface, the vacuum device is closed and the adhesive perfusion is completed.

[0015] The first pressure perfusion method is to place the adhesive injection surface of the laminate into the adhesive of a pressure adhesive injection device, create a sealed connection between the adhesive injection device and the adhesive injection surface using a sealant or tool, apply mechanical pressure to the adhesive to fill the gap, and install a pressure sensor on the pressure adhesive injection device to monitor and adjust the pressure and control the adhesive injection speed. When it is observed that the adhesive is evenly seeping out from each point on the adhesive discharge surface, close the pressure application device and complete the adhesive perfusion.

[0016] The second pressure perfusion method is to place the adhesive injection surface of the laminate into the adhesive of a gravity adhesive injection device, and then use a sealant or tool to create a sealed connection between the adhesive injection device and the adhesive injection surface. Atmospheric pressure is applied to the adhesive to fill the gap with adhesive. The pressure adhesive injection device is equipped with a gas flow valve that monitors and adjusts the magnitude of the gas pressure to control the adhesive injection speed. When it is observed that the adhesive is seeping out evenly from each point on the adhesive discharge surface, the pressure application device is closed and the adhesive perfusion is completed.

[0017] Vacuum perfusion method: The adhesive injection surface of the laminate is immersed in an adhesive tank containing adhesive so that the entire adhesive injection surface is liquid-sealed with adhesive. A vacuum device is then connected to the adhesive discharge surface, which envelops the entire adhesive discharge surface of the laminate. The adhesive discharge surface is isolated from the outside using a sealant or tool, and the absolute vacuum level of the vacuum device is set to <10 kPa. When it is observed that the adhesive has seeped out evenly at each point on the adhesive discharge surface, the vacuum device is closed and the perfusion of the adhesive is completed.

[0018] In some embodiments, the step of adhering the multiple quantum dot units includes the steps of applying adhesive to a first quantum dot unit, then picking up a second quantum dot unit and placing it on the adhesive to adhere it, and analogously forming a stacked structure accordingly; and adjusting the parallelism and flatness of the stacked structure before curing.

[0019] In some embodiments, the adhesive preferably has a viscosity of less than 1000 cps, is an epoxy resin or an acrylic resin, has a volume shrinkage rate of less than 1.1% after curing, and has a Shore hardness of 60D to 80D after curing.

[0020] In some embodiments, the steps of fabricating the quantum dot unit include the steps of: applying a first photoresist layer on one side of a transparent substrate; exposing and developing the first photoresist layer to leave a portion of the first photoresist layer to form a first residual portion; plating a first transparent conductive layer on the exposed and developed side of the transparent substrate; peeling off the first residual portion; forming a first protrusion on the first transparent conductive layer on one side of the peeled area, the first protrusion being for connecting to a first electrode; and applying a quantum dot layer on the side where the first transparent conductive layer is located. applying a second photoresist layer; exposing and developing the second photoresist layer to leave a portion of the second photoresist layer to form a second residual portion, and arranging the second residual portion and the first residual portion close to the same ridge line of the transparent substrate; plating a second transparent conductive layer on the exposed and developed side of the transparent substrate; peeling off the second residual portion; and forming a second protrusion on the second transparent conductive layer on one side of the second residual portion, the second protrusion being for connecting to a second electrode, and the first protrusion being offset from the second protrusion.

[0021] A method for processing a three-dimensional display element according to an embodiment of the second aspect of the present disclosure includes the method for processing the quantum dot composite, providing a first electrode electrically connected to the first transparent conductive layer of each quantum dot unit outside the quantum dot composite, and a second electrode electrically connected to the second transparent conductive layer of each quantum dot unit, and attaching a circuit board to one side of the quantum dot composite and connecting the circuit board to the electrodes.

[0022] A quantum dot composite according to an embodiment of the third aspect of the present disclosure comprises a plurality of quantum dot units sequentially stacked and bonded in a thickness direction, each of the quantum dot units comprising a transparent substrate, a first transparent conductive layer, a second transparent conductive layer, and a quantum dot layer, the first transparent conductive layer and the quantum dot layer being located on one side of the transparent substrate and spaced apart from the transparent substrate, the second transparent conductive layer being located on the other side of the transparent substrate or outside the quantum dot layer, the first transparent conductive layer being a P-type semiconductor, and the second transparent conductive layer being an N-type semiconductor, and the quantum dot layer forming a PN junction with the first transparent conductive layer, the same quantum dot unit, or the second transparent conductive layer of an adjacent quantum dot unit.

[0023] In some embodiments, one surface of the quantum dot composite is formed as a laser incident surface, and the thickness of the quantum dot unit increases with increasing distance from the laser incident surface along the stacking direction of the quantum dot unit.

[0024] In some embodiments, the quantum dot layer has a thickness of 0.05 μm to 10 μm, the transparent substrate has a thickness of 0.1 mm to 0.5 mm, the parallelism and flatness error of the upper and lower optical surfaces of the transparent substrate does not exceed 2 μm, and the length a and width b of the transparent substrate satisfy 1 mm≦a≦500 mm and 1 mm≦b≦500 mm.

[0025] In some embodiments, the quantum dot layer of each quantum dot unit emits light of the same color when illuminated, or every three adjacent quantum dot units are divided into a color-tuning group, and the quantum dot layers of three quantum dot units in each group emit red light, green light, and blue light, respectively, when illuminated.

[0026] A three-dimensional display element according to an embodiment of the fourth aspect of the present disclosure comprises the quantum dot composite and a circuit board, and the circuit board is electrically connected to the first transparent conductive layer and the second transparent conductive layer of each quantum dot unit by a first electrode and a second electrode, respectively.

[0027] In contrast to the problems existing in conventional solid volumetric 3D display technology, this patent focuses on solving five problems: uniformity of the light-emitting surface, high transparency of the material, high depth resolution, 360° image display, and full-color large-screen 3D display.

[0028] Additional aspects and advantages of the disclosure will be set forth in part in the description that follows, and in part will be obvious from the description, or may be learned by practice of the disclosure.

[0029] The above and / or additional aspects and advantages of the present disclosure will become apparent and easier to understand from the following description of the embodiments taken in conjunction with the drawings. [Brief explanation of the drawings]

[0030] [Figure 1] 1A-1C are schematic diagrams illustrating a method for fabricating quantum dot composites according to embodiments of the present disclosure. [Figure 2] 1A to 1C are schematic diagrams illustrating a method for fabricating a three-dimensional display element according to an embodiment of the present disclosure. [Figure 3] 1A to 1C are schematic diagrams illustrating a method for fabricating a three-dimensional display element according to a specific embodiment of the present disclosure. [Figure 4] 1 is a process flow diagram for fabricating quantum dot composites using a layer-by-layer method according to an embodiment of the present disclosure. [Figure 5] FIG. 1 is a schematic diagram illustrating a quantum dot composite according to an embodiment of the present disclosure. [Figure 6] FIG. 1 is an exploded schematic diagram illustrating a quantum dot composite according to an embodiment of the present disclosure. [Figure 7] FIG. 1 is a schematic diagram illustrating the placement of spacers in a quantum dot composite according to one embodiment of the present disclosure. [Figure 8] FIG. 10 is a schematic diagram illustrating the placement of spacers in a quantum dot composite according to another embodiment of the present disclosure. [Figure 9] FIG. 10 is a schematic diagram illustrating the placement of spacers in a quantum dot composite according to a further embodiment of the present disclosure. [Figure 10]1 is a schematic diagram showing the placement of quantum dot units and spacers in a quantum dot composite according to an embodiment of the present disclosure. [Figure 11] 1 is a schematic diagram illustrating a quantum dot unit and a spacer of a quantum dot composite according to an embodiment of the present disclosure being biased. [Figure 12] FIG. 1 is a schematic diagram illustrating the placement of a sealant on a quantum dot composite according to an embodiment of the present disclosure. [Figure 13] FIG. 1 is a schematic diagram of a perfusion scheme according to several embodiments of the present disclosure. [Figure 14] FIG. 1 is a schematic diagram of a perfusion scheme according to several embodiments of the present disclosure. [Figure 15] FIG. 1 is a schematic diagram of a perfusion scheme according to several embodiments of the present disclosure. [Figure 16] FIG. 1 is a schematic diagram of a perfusion scheme according to several embodiments of the present disclosure. [Figure 17] FIG. 1 is a schematic diagram of a perfusion scheme according to several embodiments of the present disclosure. [Figure 18] FIG. 2 is a schematic diagram of a display element. [Figure 19] FIG. 1 is a schematic diagram of a quantum dot composite bonded in a stacking manner according to an embodiment of the present disclosure. [Figure 20] FIG. 1 is a schematic diagram of a quantum dot composite bonded in a stacking manner according to an embodiment of the present disclosure. [Figure 21] FIG. 1 is a schematic diagram of a quantum dot composite bonded in a stacking manner according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0031] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present disclosure will be described in detail. The embodiments described with reference to the drawings are merely illustrative. Hereinafter, embodiments of the present disclosure will be described in detail.

[0032] Hereinafter, a method for fabricating a quantum dot composite according to an embodiment of the present disclosure will be described with reference to FIGS.

[0033] As shown in FIG. 1, the method for fabricating a quantum dot composite according to the embodiment of the first aspect of the present disclosure includes steps S1 to S3. In step S1, a first transparent conductive layer is sequentially applied to one side of a transparent substrate, followed by a quantum dot layer and a second transparent conductive layer to form a quantum dot unit. Specifically, when preparing the transparent substrate, an ultra-thin glass plate manufactured by a process such as the float method, overflow drawing method, slit drawing method, or secondary drawing method can be selected. The substrate thickness is 0.1 to 5 mm. Surface detection is performed on the glass plate, ensuring that the parallelism and flatness error of the upper and lower light planes does not exceed ±2 μm. The length a and width b of the glass unit are preferably 1 mm≦a≦500 mm and 1 mm≦b≦500 mm. A resin-based transparent plate can be selected as the substrate.

[0034] The transparent substrate is a transparent glass, and the transparent conductive layer can be made of ITO or other transparent conductive materials. When an ITO layer is used as the transparent conductive layer, a first ITO layer is plated on the transparent substrate, a layer of luminescent quantum dots is spin-coated on the first ITO layer, and finally a second ITO layer is plated on the luminescent quantum dot layer. The first ITO layer and the second ITO layer have different majority carriers, i.e., one is n-type ITO and the other is p-type ITO, thus forming an ITO-quantum dot-ITO PN junction structure on a single transparent substrate 11. The refractive index of the ITO is close to that of the transparent glass plate, with an error of no more than 0.01. The ITO plating method can be magnetron sputtering, vacuum reactive evaporation, chemical vapor deposition, sol-gel method, or pulsed laser deposition, and is preferably magnetron sputtering, which has the advantage of fast ITO plating speed and dense, uniform film layer. A solution of quantum dots is spin-coated onto one surface of an ITO-plated transparent substrate 11. The quantum dots can be oil-soluble or water-soluble, and the thickness of the spin-coated quantum dot layer ranges from 0.05 μm to 10 μm. The spin-coating speed is determined by the desired thickness and the viscosity of the solution. Using this method, quantum dots of three different emitting colors are spin-coated onto different substrates: red-emitting quantum dots, green-emitting quantum dots, and blue-emitting quantum dots, respectively.

[0035] In S2, multiple quantum dot units are bonded together.

[0036] In S3, the attached quantum dot unit is trimmed to obtain a quantum dot complex.

[0037] Trimming of the quantum dot units after bonding may include leveling, curing, edge trimming, polishing, and the like.

[0038] The processing process proposed in this disclosure can significantly improve the uniformity of the luminous surface of each layer of bulk material used in 3D displays, increase the luminous contrast, improve the transparency of the material, increase the depth resolution, and widen the viewing angle of the 3D image.

[0039] In some embodiments, a plurality of quantum dot units are bonded together, and the bonding method includes the following steps:

[0040] In step S21, a spacer is provided on at least one side of each quantum dot unit, and the spacer is a transparent polymer material, a resin material, an optical glass material, or an optical crystal material.

[0041] Specifically, the spacer has any one of the following shapes: a trapezoid, a cylinder, an elliptical column, an elongated cylinder, a rectangular parallelepiped, a prism, a sphere, and an elliptical sphere.

[0042] In S22, a plurality of quantum dot units are stacked to form a stack, and adjacent quantum dot units are separated by spacers to form gaps for receiving adhesive.

[0043] In S23, two opposing sides of the laminate are sealed, and the other two opposing sides are formed as an adhesive injection surface and an adhesive discharge surface.

[0044] In S24, the adhesive is perfused from the adhesive injection surface to fill the gaps, and after hardening, an adhesive layer including spacers is formed between adjacent quantum dot units.

[0045] In some embodiments, the height of the spacers is 1 μm to 500 μm, the distance between adjacent spacers is 0.1 mm to 5 mm, the error in height of the spacers is ≦2 μm, and the spacers are preferably distributed in a matrix. After lamination, adjacent coating units are lifted by the spacers to form gaps of equal thickness, and spacers of equal thickness are formed discretely in a regular array.

[0046] This ensures the parallelism of each quantum dot unit, and the final processed quantum dot composite has better parallelism and flatness.

[0047] The spacer can be installed using one of the following methods.

[0048] 1) The spacers are printed using a transparent UV adhesive spray or screen printing, and are made of a material containing a fast-curing resin. After droplet formation, they can be rapidly cured by UV light, ensuring consistent spacer height. The spacers can be circular, square, linear, or other patterns in plan view, with circular dot patterns being preferred, with dots between 0.05 and 2 mm in diameter.

[0049] 2) Photolithography or etching is used to apply a photoresist to the surface to be coated, then expose, develop, etch, and remove the remaining photoresist. The photoresist can be positive or negative. Fabricating spacers using photolithography or etching involves directly applying photoresist to the surface to be coated, then exposing, developing, etching, and then removing the remaining photoresist. The photoresist used can be positive or negative, and the etching can be wet or dry. When using photolithography-etching to fabricate spacers, photoresist must be spin-coated on the surfaces that do not need to be etched to protect them.

[0050] 3) Nanoimprint, nanotransfer.

[0051] In some embodiments, the distance between adjacent spacers is 5 μm to 20 mm, the spacers may be silica microspheres, polystyrene microspheres, or polymethyl methacrylate microspheres, the spherical diameter of the spacers is 1 μm to 200 μm, and the diameter uniformity error is <10%.

[0052] As a result, when the above-mentioned spacer size is adopted, the spacer layer is wet-coated with the adhesive, and the spacer does not interfere with the optical path.

[0053] Furthermore, the method further includes a step of adjusting the parallelism and flatness of the laminate before sealing or before curing the adhesive so that the error is controlled within ±5 μm, thereby ensuring the processing accuracy of the laminate.

[0054] In some embodiments, a liquid or solid sealant is used to seal the laminate, the liquid sealant being epoxy resin or acrylic resin, the solid sealant being rubber or silicone rubber, the viscosity of the liquid sealant being greater than 20,000 cps, and the curing method of the liquid sealant being ambient temperature curing, heat curing, or ultraviolet curing. The Shore hardness of the cured liquid sealant is 20A-70A, which improves the sealing effect of the laminate and ensures the hardness and strength of the sealant region of the laminate.

[0055] Furthermore, the adhesive is degassed before perfusion, the viscosity of the adhesive 60 is less than 500 cps, the adhesive is epoxy resin or acrylic resin, the volume shrinkage rate after curing is less than 1.1%, the Shore hardness after curing is 60D-80D, and the refractive index after curing matches that of the transparent substrate. Thus, using the above adhesive provides better adhesion.

[0056] In some embodiments, perfusion is achieved by one of the following methods:

[0057] 1) The first gravity perfusion method: The adhesive injection surface of the laminate is placed in the adhesive tank of the gravity adhesive injection device, and a sealant or tool is used to create a sealed connection between the adhesive injection device and the adhesive injection surface. The laminate is then placed in a vacuum chamber together with the adhesive injection device, and the adhesive fills the gaps under the combined action of gravity and capillary action. When it is observed that the adhesive has seeped out evenly at each point on the adhesive discharge surface, the vacuum device is closed and the adhesive perfusion is completed.

[0058] 2) The second gravity perfusion method: The adhesive injection surface of the laminate is placed in the adhesive tank of the gravity adhesive injection device, and a sealant or tool is used to create a sealed connection between the adhesive injection device and the adhesive injection surface. A vacuum device is then connected to the adhesive discharge surface, which encases the entire adhesive discharge surface of the laminate and isolates it from the outside using a sealant or tool. When the absolute vacuum of the vacuum device is less than 10 kPa and the adhesive is observed to be uniformly seeping out from each point on the adhesive discharge surface, the vacuum device is closed and the adhesive perfusion is completed.

[0059] 3) The first pressure perfusion method: The adhesive injection surface of the laminate is placed into the adhesive of a gravity adhesive injection device, a sealant or tool is used to create a sealed connection between the adhesive injection device and the adhesive injection surface, mechanical pressure is applied to the adhesive to fill the gap, a pressure sensor is installed on the pressure adhesive injection device to monitor and adjust the pressure and control the adhesive injection speed, and when it is observed that the adhesive is seeping out evenly at each point on the adhesive discharge surface, the pressure application device is closed and the adhesive perfusion is completed.

[0060] 4) The second pressure perfusion method: The adhesive injection surface of the laminate is placed into the adhesive of a gravity adhesive injection device, and a sealant or tool is used to create a sealed connection between the adhesive injection device and the adhesive injection surface. Atmospheric pressure is applied to the adhesive to fill the gap with adhesive. The pressure adhesive injection device is equipped with a gas flow valve to monitor and adjust the magnitude of the gas pressure and control the adhesive injection speed. When it is observed that the adhesive is seeping out evenly at each point on the adhesive discharge surface, the pressure application device is closed and the adhesive perfusion is completed.

[0061] 5) Vacuum perfusion method: The adhesive injection surface of the laminate is immersed in an adhesive tank containing adhesive so that the entire adhesive injection surface is liquid-sealed with adhesive. A vacuum device is then connected to the adhesive discharge surface, which envelops the entire adhesive discharge surface of the laminate and isolates the adhesive discharge surface from the outside with a sealant or tool. When the absolute vacuum level of the vacuum device is less than 10 kPa and it is observed that the adhesive has seeped out uniformly at each point on the adhesive discharge surface, the vacuum device is closed and the perfusion of adhesive is completed.

[0062] Therefore, by adopting the above method for perfusion, the adhesion efficiency is higher.

[0063] In some embodiments, a plurality of quantum dot units are bonded together, and the bonding method includes S25 to S26.

[0064] In S25, after applying adhesive to the first quantum dot unit, a second quantum dot unit is taken and placed on the adhesive 60 to be adhered, and by analogy therewith, a stacked structure is formed.

[0065] In S26, the parallelism and flatness of the laminated structure are adjusted before curing.

[0066] In this way, the spin-coating method does not require the installation of spacers, and the gap between adjacent quantum dot units is smaller, which has less of an effect on the optical path.

[0067] In some embodiments, the adhesive preferably has a viscosity of <1000 cps, is an epoxy resin or an acrylic resin, has a volume shrinkage rate of <1.1% after curing, and has a Shore hardness of 60D to 80D after curing, so that the use of such adhesives in the lamination bonding method can provide better bonding effects.

[0068] Specifically, the quantum dot unit processing steps are as follows: S11 applying a first photoresist layer on one side of a transparent substrate; S12 exposing and developing to leave a portion of the first photoresist layer to form a first residual portion; plating a first transparent conductive layer on the exposed and developed side of the transparent substrate (S13); peeling off the first residual portion, and forming a first protrusion on one side of the peeled area on the first transparent conductive layer, the first protrusion being for connecting to a first electrode (S14); S15: applying a quantum dot layer on the side where the first transparent conductive layer is located; applying a second photoresist layer S16; exposing and developing the second photoresist layer to leave a portion of the second photoresist layer to form a second remaining portion, and arranging the second remaining portion and the first remaining portion close to the same edge line of the transparent substrate (S17); plating a second transparent conductive layer on the exposed and developed side of the transparent substrate (S18); peeling off the second residual portion, and forming a second protrusion on the second transparent conductive layer on one side of the second residual portion, the second protrusion being for connecting to a second electrode, and the first protrusion being distributed with an offset from the second protrusion (S19).

[0069] As a result, the quantum body unit layer forms a transparent conductive layer by plating the first transparent conductive layer and the second transparent conductive layer, thereby realizing independent application of an electric field to each quantum body unit layer, and thereby realizing independent display of each quantum body unit layer.

[0070] A method for processing a three-dimensional display element according to an embodiment of the second aspect of the present disclosure includes the method for processing a quantum dot composite according to the above embodiment, and the steps of providing a first electrode outside the quantum dot composite that is electrically connected to the first transparent conductive layer of each quantum dot unit and a second electrode that is electrically connected to the second transparent conductive layer of each quantum dot unit, and attaching a circuit board to one side of the quantum dot composite and connecting the circuit board to the electrodes.

[0071] In this way, by connecting the first electrode and the second electrode to the circuit, the quantum dots will have high photoluminescence quantum efficiency without applying an electric field, and after applying a certain electric field, the photoluminescence quantum efficiency will decrease and even approach zero. The photons absorbed by the quantum dots will mostly be emitted in a non-radiative manner, and the luminescence efficiency of the quantum dots will return to its initial state after the electric field is removed.

[0072] A quantum dot composite 100 according to an embodiment of the third aspect of the present disclosure comprises a plurality of quantum dot units 10 sequentially stacked and bonded in the thickness direction, each quantum dot unit 10 including a transparent substrate 11, a first transparent conductive layer, a second transparent conductive layer, and a quantum dot layer 13, the first transparent conductive layer and the quantum dot layer 13 being located on one side of the transparent substrate 11 and spaced apart from the transparent substrate 11, the second transparent conductive layer being located on the other side of the transparent substrate 11 or outside the quantum dot layer 13, the first transparent conductive layer 12 being a P-type semiconductor, the second transparent conductive layer 14 being an N-type semiconductor, and the quantum dot layer 13 forming a PN junction with the first transparent conductive layer, the second transparent conductive layer of the same quantum dot unit 10, or an adjacent quantum dot unit 10.

[0073] This disclosure proposes a new quantum dot composite 100. Specifically, by utilizing the effect of the decrease in luminous efficiency of photoluminescent quantum dots due to electric field modulation, a bulk structure having multi-layered multicolor light-emitting quantum dot units 10 is fabricated by combining quantum dots, transparent conductive materials, and other transparent materials, and then a laser scanning system and an electric field modulation system are used to scan a three-dimensional pattern within the bulk structure.

[0074] Quantum dots have high photoluminescence quantum efficiency without applying an electric field, but after applying a certain electric field, the photoluminescence quantum efficiency decreases and even approaches zero. The photons absorbed by the quantum dots are mostly emitted in a non-radiative manner, and after the electric field is removed, the quantum dot luminescence efficiency returns to its initial state. This characteristic of quantum dots is called the quantum dot electric field modulation switching effect. The ratio of the quantum dot luminescence intensity when no electric field is applied to that when an electric field is applied while the excitation light parameters are kept constant is the switching ratio. The switching ratio is preferably greater than 20.

[0075] To ensure that the brightness of the light-emitting points before and after the laser incident surface of the bulk material is the same under the same conditions and to offset the energy loss problem through the laser quantum dot unit 10, the thickness of the laser incident surface of the bulk material gradually increases from the front to the back of the quantum dot unit 10. In other words, one surface of the quantum dot composite 100 is formed as the laser incident surface, and the thickness increases along the stacking direction of the quantum dot unit 10 as it moves away from the laser incident surface.

[0076] In some embodiments, the thickness of quantum dot layer 13 is 0.05 μm to 10 μm, and / or the thickness of transparent substrate 11 is 0.1 mm to 0.5 mm, the parallelism and flatness error of the upper and lower optical surfaces of transparent substrate 11 does not exceed ±2 μm, and the length a and width b of transparent substrate 11 satisfy 1 mm≦a≦500 mm and 1 mm≦b≦500 mm, respectively. Therefore, when quantum dot layer 13 adopts the above dimensions, the resulting quantum dot composite 100 has a more compact structure.

[0077] When the quantum dot layer 13 of each quantum dot unit 10 is selectively irradiated, it emits light of the same color. The structure of the quantum dot composite 100 shown in single color is a periodic arrangement of single-color quantum dot light-emitting layer units, with the layer units bonded together with a transparent adhesive, and electrodes fabricated on both sides of each quantum dot layer 13, with the role of the electrodes being to apply an electric field to the quantum dots whose magnitude and direction can be controlled.

[0078] Each set of three adjacent quantum dot units 10 is selectively divided into a color-tuning group, and when the quantum dot layers 13 of the three quantum dot units 10 in each group are irradiated, they emit red light, green light, and blue light, respectively. For example, the unit layers are distributed as follows: red-emitting quantum dot units 10, green-emitting quantum dot units 10, and blue-emitting quantum dot units 10. The quantum dot units 10 of three colors are periodically arranged, and the unit layers are bonded together with a transparent adhesive. Transparent electrodes are fabricated on both sides of each quantum dot unit 10, and the role of the electrodes is to apply an electric field to the quantum dots, the magnitude and direction of which can be controlled.

[0079] A three-dimensional display element according to an embodiment of the fourth aspect of the present disclosure comprises the quantum dot composite 100 of the above embodiment and a circuit board, and the circuit board is electrically connected to the first transparent conductive layer 12 and the second transparent conductive layer 14 of each quantum dot unit 10 by a first electrode and a second electrode, respectively.

[0080] Advantages of 3D display using liquid crystal layer compared to 3D display elements using electric field and optical field modulation: 1. Higher image frame rate. The modulation time of the single-layer field modulation quantum dot screen is less than 10 μs, while the refresh time of the liquid crystal layer is in the order of milliseconds. 2. While the vertical resolution of 3D imaging is higher, the slow refresh rate of the liquid crystal layer limits the depth resolution of 3D display. For example, if the refresh rate of the liquid crystal layer is 1ms, the maximum number of layers required for the human eye is 40, calculated at 225Hz. To achieve more layers, the frame rate must be sacrificed. The modulation time of a single-layer field-modulated quantum dot screen is less than 10μs, and if calculated at 10μs and 25Hz, 4000 layers can be stacked. 3. Larger viewing angle: Due to the limitations of the LCD panel frame, the viewing angle of the LCD stacked 3D display is limited to a small angle from the front, and the sides and back cannot be seen. In contrast, a 3D display system based on dual modulation of optical and electric fields can see images in all directions except for a small area on one side where the electrodes are distributed, where the image cannot be seen. 4. Higher color gamut, LCD stacked 3D display systems use LED backlights as light sources, while 3D display systems based on dual modulation of optical and electric fields use photoluminescent quantum dots, which are known to have a higher color gamut than LEDs.

[0081] The manufacturing process flow of the quantum dot composite 100 in two specific examples will be briefly described below.

[0082] Example 1: Preparation of quantum dot composite 100 by siphon method

[0083] FIG. 2 shows a process flow for producing the quantum dot composite 100 of the embodiment. 1) Preparation of transparent substrate 11: Figure 3 shows the transparent substrate. An ultra-thin glass plate is selected from processes such as the float method, overflow stretching method, slit stretching method, and secondary stretching method. The thickness of the substrate is 0.1 to 5 mm. Surface profile detection is performed on the glass plate to ensure that the parallelism and flatness error of the upper and lower light planes does not exceed ±2 μm. The length a and width b of transparent substrate 11 are preferably 1 mm ≦ a ≦ 500 mm and 1 mm ≦ b ≦ 500 mm. Alternatively, a resin-based transparent plate may be used as the substrate.

[0084] 2) Quantum dot application process

[0085] Figure 4 shows the fabrication process of a single-layer quantum dot unit 10. Figure 5 shows the shape characteristics of each layer structure. The transparent substrate 11 is transparent glass. A first ITO layer 12 is plated on the transparent substrate 11. A layer of quantum dots 13 is spin-coated on the first ITO layer 12. Finally, a second ITO layer 14 is plated on the quantum dot layer 13. The first ITO layer and the second ITO layer have different majority carriers, i.e., one is n-type ITO and the other is p-type ITO. In this way, an ITO-quantum dot-ITO PN junction structure is formed on the single transparent substrate 11. The refractive index of the ITO is close to that of the transparent glass plate, with an error of no more than 0.01. The ITO plating method can be magnetron sputtering, vacuum reactive evaporation, chemical vapor deposition, sol-gel processing, or pulsed laser deposition, with magnetron sputtering being preferred because it has a fast ITO plating speed and produces a dense, highly uniform film. A solution of quantum dots is spin-coated onto one surface of an ITO-plated transparent substrate 11. The quantum dots can be oil-soluble or water-soluble, and the thickness of the spin-coated quantum dot layer ranges from 0.05 μm to 10 μm. The spin-coating speed is determined by the desired thickness and the viscosity of the solution. Using this method, quantum dots of three different emitting colors are spin-coated onto different substrates: red-emitting quantum dots, green-emitting quantum dots, and blue-emitting quantum dots, respectively.

[0086] It should be noted that other N-type transparent semiconductor materials may be selected for the N-type ITO, and other P-type transparent semiconductor materials may be selected for the P-type ITO.

[0087] In order to ensure that the brightness of the light-emitting points in front of and behind the laser incident surface of the bulk material is the same under the same conditions and to offset the energy loss problem through the laser quantum dot unit 10, the thickness of the quantum dot layer 13 on the laser incident surface of the bulk material gradually increases from front to back.

[0088] 3) Preparation of spacers 20: Spacer 20 formation process: After lamination, adjacent coating units are lifted by the spacers 20 to form gaps of equal thickness, so that spacers 20 of equal thickness are formed discretely in a regular array.

[0089] The spacers 20 can be formed by printing with a transparent UV adhesive spray (FIG. 7), screen printing, photolithography-etching (FIG. 8), nanoimprinting, nanotransfer, etc. The height of the spacers 20 is 1 to 500 μm, the distance between adjacent spacers 20 is 0.1 to 5 mm, the height error of the spacers 20 is ≦2 μm, and the spacers 20 are preferably distributed in a matrix pattern.

[0090] When fabricating the spacers 20 using processes such as spray printing with a transparent UV adhesive (Figure 7) or screen printing, the spacers 20 are preferably made of a material containing a fast-curing resin. This allows the spacers 20 to be rapidly cured by UV light after droplet formation, ensuring consistent height. The spacers 20 can be circular, rectangular, linear, or other patterns in plan view, with a circular dot pattern being preferred, with the dots having a diameter of 0.05 to 2 mm.

[0091] The photolithography or etching method (Figure 8) for producing spacers 20 involves applying photoresist directly to the surface to be coated, followed by exposure, development, etching, and removal of the remaining photoresist. The photoresist used may be positive or negative, and the etching may be wet or dry etching. When using the photolithography-etching method for producing spacers 20, photoresist must be spin-coated on the surfaces that do not require etching to protect them.

[0092] Alternatively, the spacers 20 may be made of particulate material of other uniform size, uniformly distributed between the two spin-coated substrate units with the luminescent quantum dots. The distance between adjacent particles is D, which satisfies the relationship 5 μm≦D≦20 mm. The outer dimensions of the spacers 20 may be trapezoidal, cylindrical, elliptical, oblong, rectangular, prism, spherical, or ellipsoidal. Preferably, the spacers 20 are spherical, with a diameter of 1 μm to 200 μm and a diameter uniformity error of less than 10%. The spacers 20 may be applied by a microsphere spray spacer method (FIG. 9). The microsphere spacers 20 may be silica microspheres, polystyrene microspheres, or polymethyl methacrylate microspheres. The particulate spacers 20 may be made of a polymeric material, a resin material, an optical glass material, or an optical crystal material.

[0093] 4) The transparent substrate 11 on which the spacers 20 are formed is laminated as shown in FIG. When used for full-color imaging, the stacking rule is that the quantum dot units 10 in each layer are oriented in the same direction, and the distribution rule is that three color quantum dot light-emitting layer units, i.e., red-emitting quantum dot units 10, green-emitting quantum dot units 10, and blue-emitting quantum dot units 10, are periodically arranged.

[0094] When used for monochromatic imaging, the stacking rule is to stack quantum dot light-emitting layers of one color, and the orientation of the quantum dot units 10 in each layer is the same.

[0095] 11, the stack is clamped between rigid plates 40 or airbags, and the parallelism and flatness of the top and bottom units are adjusted using a parallelism adjustment device to keep the error within ±5 μm, thereby correcting the cumulative parallelism and flatness errors of each unit due to variations in the thickness of the spacer 20, the transparent substrate 11, and the spin-coated quantum dot layer 13. This step may be performed after perfusion and before the adhesive 60 hardens.

[0096] 6) Sealing process: Two of the four surfaces of the laminate perpendicular to the lamination direction are used as sealing surfaces, and are sealed using sealant 30. As shown in Figure 12, sealant 30 can be either a solid or liquid sealant. If it is a liquid sealant, it preferably has a viscosity of >20,000 cps, is made of epoxy or acrylic resin, and is cured by natural curing at room temperature, heat curing, or ultraviolet irradiation. The Shore hardness of the cured liquid sealant 30 is 20A to 70A. For solid sealants, a ductile rubber plate or silicone rubber can be selected, and can be tightly pressed against the sealing surface using a tool to achieve a sealing effect.

[0097] 7) Perfusion process Of the four surfaces of the laminate parallel to the stacking direction, one of the remaining two opposing surfaces is selected as the adhesive injection surface, and the other is used as the adhesive discharge surface. The cured adhesive 60 penetrates the spacer layer at the center of the substrate unit from the adhesive injection surface and is drawn out from the adhesive discharge surface, uniformly filling each spacer layer and completing the perfusion process. The perfused adhesive 60 preferably has a viscosity of less than 500 cps and is cured by heat curing or ambient temperature curing. The adhesive 60 is preferably epoxy or acrylic resin-based. The volume shrinkage of the adhesive 60 after curing is preferably less than 1.1%. The Shore hardness of the adhesive 60 after curing is preferably 60D to 80D. The adhesive 60 is degassed before perfusion. The adhesive 60 is preferably transparent, and its refractive index after curing is closer to the transparent substrate 11 by less than 0.01.

[0098] The adhesive perfusion methods include gravity perfusion, pressure perfusion and vacuum perfusion.

[0099] Gravity perfusion method 1: The adhesive injection surface of the laminate is placed in the adhesive in the gravity adhesive injection device, and a sealant or tool is used to create a sealed connection between the adhesive injection device and the adhesive injection surface, as shown in Figure 13. The laminate is then placed in the vacuum chamber 52 together with the gravity adhesive injection device, and the spacer layer is filled under the combined action of gravity and capillary action exerted by the adhesive a itself. When it is observed that the adhesive 60 has evenly exuded from each part of the adhesive discharge surface, the pressure application device is closed and the perfusion of the adhesive 60 is completed.

[0100] Gravity perfusion method 2: The adhesive injection surface of the laminate is placed in the gravity adhesive injection device. As shown in Figure 14, a seal or tool is used to create a sealed connection between the adhesive injection device and the adhesive injection surface. A vacuum device is then connected to the adhesive discharge surface, which envelops the entire adhesive discharge surface of the laminate. The seal or tool isolates the adhesive discharge surface from the outside, ensuring no air leaks during vacuuming. An absolute vacuum of less than 10 kPa is preferred for the vacuum device. When the adhesive 60 is observed to be uniformly seeping out from each point on the adhesive discharge surface, the vacuum device is closed, completing the perfusion of the adhesive 60.

[0101] Pressure perfusion method 1: The adhesive injection surface of the laminate is placed in the adhesive in a pressure adhesive injection device, and a sealant or tool is used to create a sealed connection between the adhesive injection device and the adhesive injection surface, as shown in Figure 15. Mechanical pressure is applied to the adhesive to fill the spacer layer with adhesive, and a pressure sensor is attached to the pressure adhesive injection device to monitor and adjust the pressure and control the adhesive injection speed. When it is observed that the adhesive 60 is evenly exuding from each point on the adhesive discharge surface, the pressure application device is closed and the perfusion of the adhesive 60 is completed.

[0102] Pressure perfusion method 2: The adhesive injection surface of the laminate is placed in the adhesive in a pressure adhesive injection device, and a sealant or tool is used to create a sealed connection between the adhesive injection device and the adhesive injection surface, as shown in Figure 16. Air pressure is applied to the adhesive to fill the spacer layer with adhesive. A gas flow valve is installed on the pressure adhesive injection device to monitor and adjust the magnitude of the gas pressure and control the adhesive injection speed. When it is observed that the adhesive 60 is evenly seeping out from each point on the adhesive discharge surface, the pressure application device is closed, and the perfusion of the adhesive 60 is completed.

[0103] Vacuum perfusion method: The adhesive injection surface of the laminate is immersed in an adhesive tank 51 containing adhesive 60, and the entire adhesive injection surface is liquid-sealed with adhesive 60, as shown in Figure 17. Next, a vacuum device is connected to the adhesive discharge surface, which envelops the entire adhesive discharge surface of the laminate. The adhesive discharge surface is isolated from the outside using a sealant or tool to ensure no air leaks during vacuuming. The absolute vacuum level of the vacuum device should preferably be less than 10 kPa. When it is observed that the adhesive 60 has evenly seeped out from each part of the adhesive discharge surface, the vacuum device is closed, completing the perfusion of adhesive 60.

[0104] 8) Hardening and heat treatment process. After the perfusion of adhesive 60 is completed, it is cured by heating or by leaving it at a certain temperature for a certain time, and internal stress is removed using the required heat treatment method to obtain a laminated block. Before curing, the parallelism and flatness of the coating units of the top and bottom layers of the laminated block can be adjusted using a parallelism adjustment device. For example, the laminated block can be compressed using a precision hydraulic device with a compression force of 20 kPa or less, and the laminated block can be adjusted according to the parallelism and flatness of the working surface of the compression machine, and can be held until the adhesive 60 is cured.

[0105] 9) Edge trimming and polishing process: After the curing is completed, the laminated block is subjected to edge trimming and polishing process in sequence. The purpose of edge trimming is to process the laminated block into a roughly standard cube, and then polish each side of it, thereby maintaining high transparency of the laminated block and preparing it for the next process.

[0106] 10) Preparation of electrode 20: To prepare the electrode 20, one of the four faces of the laminate perpendicular to the stacking direction is photolithographically coated, and the electrode 20 is raised for each ITO layer, as shown in Figure 18, so as to prevent short circuits between the ITO layers. The material of the electrode 20 may be gold or silver, and preferably, the material is gold.

[0107] 11) A printed circuit board and bonding wires are attached, and a custom-made circuit board is attached to one side of the electrode 20. An ultrasonic welder is used to connect the electrode 20 on the laminate to the printed circuit board. To achieve a wider viewing angle, it is preferable to fabricate the electrode 20 on one side. A voltage is applied to the ITO layers on both sides of the quantum dot layer 13 using a control system. Under the influence of the electric field, the quantum dots in the electric field will have a reduced luminous efficiency, eventually approaching zero. By controlling the magnitude of the applied electric field and the three colors of the quantum dots (red, green, and blue), a full-color 3D display can be realized.

[0108] Example 2: Preparation of laminated material by lamination method

[0109] The unit layer that has completed the process in Figure 5 is then laminated.

[0110] 19, 20, and 21, the lamination process involves taking one of the flat plates that has undergone the process of FIG. 5 and placing it on a flat plate tool. A “W”-shaped adhesive 60 is applied to one side facing upward. Another flat plate that has undergone the process of FIG. 5 is placed on the adhesive 60, and the orientation of the quantum dot units 10 on the first flat plate is aligned, i.e., both quantum dot units 10 are facing upward or both are facing downward. The adhesive 60 preferably has a viscosity of less than 1000 cps and is cured by heat curing or ambient temperature natural curing. The adhesive 60 is preferably an epoxy resin or acrylic resin. The volume shrinkage of the adhesive 60 after curing is preferably less than 1.1%. The Shore hardness of the adhesive 60 after curing is 60D to 80D. The adhesive 60 is degassed before irrigation. The adhesive 60 is transparent, and its refractive index after curing is close to that of the transparent substrate 11, with an error of less than 0.01.

[0111] When used for full-color imaging, the stacking rule is that the quantum dot units 10 in each layer are oriented in the same direction, and the distribution rule is that three color quantum dot light-emitting layer units, i.e., red-emitting quantum dot units 10, green-emitting quantum dot units 10, and blue-emitting quantum dot units 10, are periodically arranged.

[0112] When used for monochromatic imaging, the stacking rule is to stack quantum dot light-emitting layers of one color, and the orientation of the quantum dot units 10 in each layer is the same.

[0113] 5) The parallelism and flatness of the laminate are adjusted, and the parallelism and flatness of the top layer unit and the bottom layer unit of the laminate are adjusted using a parallelism adjustment device after lamination, and the error is controlled to within ±5 μm, thereby correcting the cumulative parallelism and flatness errors of each layer unit caused by variations in the thickness of the spacer 20, the thickness of the transparent substrate 11, and the thickness of the spin-coated quantum dot unit 10.

[0114] 6) Hardening and heat treatment process. After the perfusion of the adhesive 60 is completed, it is cured by heating or by leaving it at a certain temperature for a certain time, and the internal stress is removed by a necessary heat treatment method to obtain a laminated block.

[0115] 7) Edge trimming and polishing process: After the curing is completed, the laminated block is subjected to edge trimming and polishing process in sequence. The purpose of edge trimming is to process the laminated block into a roughly standard cube, and then polish each side of it, thereby maintaining high transparency of the laminated block and preparing it for the next process.

[0116] 8) Preparation of electrode 20: To prepare electrode 20, photolithography and coating are performed on one of the four faces of the laminate perpendicular to the stacking direction, and electrode 20 is raised for each ITO layer to prevent short circuits between the ITO layers. The material of electrode 20 may be gold or silver, and preferably gold.

[0117] 9) Attach a printed circuit board and bonding wires, and then attach a circuit board made to specifications to the side on which the electrode 20 is made. Use an ultrasonic welding machine to connect the electrode 20 on the laminate to the printed circuit board. In order to achieve a wider viewing angle, it is preferable to make the electrode 20 on a single ridge close to the bulk material.

[0118] In describing the present disclosure, it will be understood that terms indicating directions and positional relationships, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "up," "down," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," are based on the directions or positional relationships shown in the drawings and are intended merely to facilitate and simplify the description of the present disclosure, and do not indicate or imply that the referred devices or elements must have a particular orientation, configuration, or operation in a particular direction, and cannot be considered to limit the present disclosure.

[0119] In the description of this disclosure, a "first feature" or a "second feature" can include one or more of the features. In the description of this disclosure, "plurality" means two or more than two. In the description of this disclosure, a first feature being "above" or "below" a second feature can include direct contact between the first and second features, or can include contact between the first and second features without direct contact but via another feature between them. In the description of this disclosure, a first feature being "above," "above," and "on top of" a second feature can include the first feature being directly above and diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than that of the second feature.

[0120] In the description herein, references such as "one embodiment," "some embodiments," "example," "specific example," or "some examples" mean that the specific features, structures, materials, or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present invention. In the description herein, exemplary references to the above terms do not necessarily refer to the same embodiment or example.

[0121] Although embodiments of the present disclosure have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is limited only by the claims and their equivalents.

[0122] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application claims priority to and benefits from patent application number 202110701334.1, filed with the State Intellectual Property Office of China on June 23, 2021, the entire contents of which are incorporated herein by reference. [Explanation of symbols]

[0123] Quantum dot composite 100, electrode 20, quantum dot unit 10, transparent substrate 11, first transparent conductive layer 12, quantum dot layer 13, second transparent conductive layer 14, spacer 20, sealant 30, rigid plate 40, adhesive tank 51, adhesive a, vacuum chamber 52, adhesive 60, seal member 70.

Claims

1. 1. A method for fabricating a quantum dot composite, comprising: Sequentially providing a first transparent conductive layer on one side of a transparent substrate, coating a quantum dot layer, and providing a second transparent conductive layer to form a quantum dot unit; bonding a plurality of quantum dot units; and trimming the attached quantum dot units to obtain quantum dot composites. The step of sequentially providing a first transparent conductive layer on one side of a transparent substrate, coating a quantum dot layer, and providing a second transparent conductive layer to form a quantum dot unit includes: applying a first photoresist layer to one side of a transparent substrate; exposing and developing to leave a portion of the first photoresist layer to form a first residual portion; plating a first transparent conductive layer on the exposed and developed side of the transparent substrate; peeling off the first remaining portion, and forming a first protrusion on the first transparent conductive layer located on the same side as the peeled region, the first protrusion being for connecting to a first electrode; Applying a quantum dot layer on the side where the first transparent conductive layer is located; applying a second photoresist layer; exposing and developing the second photoresist layer to leave a portion of the second photoresist layer to form a second remaining portion, and locating the second remaining portion and the peeled region close to the same edge line of the transparent substrate; plating a second transparent conductive layer on the exposed and developed side of the transparent substrate; peeling off the second remaining portion, and forming a second protrusion on the second transparent conductive layer located on the same side as the second remaining portion, the second protrusion being for connecting to a second electrode, and the first protrusion being distributed with an offset from the second protrusion.

2. The step of bonding a plurality of quantum dot units includes: applying adhesive to the first quantum dot unit, and then taking a second quantum dot unit and placing it on the adhesive to adhere it to form a stacked structure; The method for fabricating a quantum dot composite according to claim 1, further comprising the step of adjusting the parallelism and flatness of the laminated structure before curing.

3. 3. The method for processing a quantum dot complex according to claim 2, wherein the adhesive has a viscosity of less than 1000 cps, is an epoxy resin or an acrylic resin, has a volume shrinkage rate of less than 1.1% after curing, and has a Shore hardness of 60D to 80D after curing.

4. The method for processing a quantum dot composite according to claim 1; providing a first electrode electrically connected to the first transparent conductive layer of each quantum dot unit outside the quantum dot composite, and a second electrode electrically connected to the second transparent conductive layer of each quantum dot unit; and attaching a circuit board to one side of the quantum dot composite and connecting the circuit board to an electrode.

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