Substrate, system, method of controlling system, method of manufacturing article using system, control program, and recording medium

Abstract

To reduce local warpage of a substrate.SOLUTION: A substrate, wherein a member capable of deforming at least a part of the substrate on which a predetermined component is mounted is provided at a position within a predetermined range from the predetermined component having higher rigidity than the substrate.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a substrate and a system. [Background technology]

[0002] In recent years, demand for smaller and more sophisticated electronic devices has increased. Technological developments aimed at miniaturizing and improving the performance of printed circuit boards have been progressing, and high-density packaging through multilayer printed wiring boards and thinner wiring patterns has been considered. Substrates used in printed circuit boards are also required to be thinner, reducing the rigidity of the board itself. On the other hand, highly functional electronic components such as semiconductor chips are often mounted on boards. In boards with highly rigid electronic components mounted on them, the rigidity within the board surface is not uniform due to the shape and arrangement of the mounted components, resulting in board warpage. For example, Patent Document 1 discloses a technique for correcting warpage of a multilayer ceramic substrate used as a testing board for inspecting ICs on a wafer by pushing and pulling a protruding member brazed to the ceramic substrate. Patent Document 2 also discloses a technique for correcting warpage of a glass substrate by holding the glass substrate with a correction unit and a suction pad in order to mount film electronic components on the glass substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-165945 [Patent Document 2] Japanese Patent Application Laid-Open No. 2006-319345 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the technology described in Patent Document 1, the suction force of the suction pad is used to attract the substrate to the support. Therefore, for example, if the substrate is locally warped due to a highly rigid component mounted on the substrate, the suction force of the suction pad may be overwhelmed by the warpage reaction force of the substrate, making it impossible to correct the warpage. Furthermore, in the technology described in Patent Document 2, the mounting position of the protruding member must be positioned a certain distance away from the interlayer connection conductor formed on the substrate to prevent cracks from occurring during bonding of the protruding member. Therefore, the mounting position of the protruding member is limited, and if local warpage occurs around a highly rigid component mounted on the substrate, it may be impossible to correct the warpage. Therefore, conventional technologies may not be able to reduce local warpage of the substrate. [Means for solving the problem]

[0005] According to the present invention, The present invention employs a substrate characterized in that a member capable of deforming at least a part of the substrate on which a predetermined component having higher rigidity than the substrate is mounted is provided at a position within a predetermined range from the predetermined component. [Effects of the Invention]

[0006] According to the present invention, local warpage of the substrate can be reduced. [Brief explanation of the drawings]

[0007] [Figure 1] 10A and 10B are diagrams for explaining local warpage that occurs on a board on which highly rigid components are mounted. [Figure 2] 1 is a diagram showing the configuration of a substrate 1 in an embodiment. [Figure 3] 1 is a diagram showing the configuration of a substrate 1 in an embodiment. [Figure 4] 1 is a diagram showing an outline of a system 1000 according to an embodiment. [Figure 5] 1A and 1B are diagrams showing a pulling jig 21 in the embodiment. [Figure 6]10 is a flowchart showing a procedure for correcting warpage using a pulling mechanism 20 in the embodiment. [Figure 7] 10A to 10C are diagrams illustrating an operating state of the system 1000 when a warpage correction procedure is performed using the pulling mechanism 20 according to the embodiment. [Figure 8] 1 is a diagram showing a state in which the substrate 1 and another component are assembled in the embodiment. [Figure 9] 10A and 10B are diagrams showing the results of measuring the deformation state of the substrate 1 before and after the pulling of the pulling component 3 in the embodiment. [Figure 10] 10A to 10C are diagrams illustrating an operating state of the system 1000 when a warpage correction procedure is performed using the pulling mechanism 20 according to the embodiment. [Figure 11] 10 is a diagram for explaining the amount of misalignment when the substrate 1 is pulled in the embodiment. FIG. [Figure 12] 1 is a diagram showing an outline of a system 1000 according to an embodiment. [Figure 13] 10 is a flowchart showing a procedure for correcting warpage using a pulling mechanism 20 in the embodiment. [Figure 14] 1 is a diagram showing the configuration of a substrate 1 in an embodiment. [Figure 15] 1 is a schematic diagram illustrating an overview of a system 1000 according to an embodiment. [Figure 16] 10A to 10C are diagrams illustrating an operating state of the system 1000 when a warpage correction procedure is performed using the pressing mechanism 30 according to the embodiment. [Figure 17] 1 is a diagram showing the configuration of a substrate 1 in an embodiment. [Figure 18] 1 is a diagram of a substrate 1 on which a linear pulling component 5 is mounted in an embodiment. [Figure 19] 1 is a diagram showing an outline of a system 1000 according to an embodiment. [Figure 20] 1 is a diagram showing an outline of a system 1000 according to an embodiment. [Figure 21] FIG. 10 is a diagram showing an outline of a system 1000 according to a modified example of the embodiment. [Figure 22] FIG. 10 is a diagram showing an outline of a system 1000 according to a modified example of the embodiment. [Figure 23] 10 is a detailed view of a through-hole pulling jig 65 in a modified example of the embodiment. FIG. [Figure 24] 1 is a diagram showing the configuration of a substrate 1 in an embodiment. [Figure 25] 1 is a diagram showing an outline of a system 1000 according to an embodiment. [Figure 26] 10A and 10B are diagrams illustrating an operating state of the system 1000 when a warpage correction procedure is performed using the substrate lifting mechanism 70 according to the embodiment. [Figure 27] 10 is a flowchart showing a procedure for correcting warpage using a pulling mechanism 20 in the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, a description will be given of an embodiment of the present invention with reference to the accompanying drawings. The embodiment shown below is merely an example, and those skilled in the art can appropriately modify the detailed configuration, for example, without departing from the spirit of the present invention. Furthermore, the numerical values ​​used in the present embodiment are for reference only and do not limit the present invention. In the following drawings, the arrows X, Y, and Z in the figures indicate the coordinate system of the entire system. Generally, an XYZ three-dimensional coordinate system indicates the world coordinate system of the entire installation environment. In addition, a local coordinate system may be used as appropriate for control purposes, etc.

[0009] (First embodiment) First, using Figure 1, we will explain localized warpage that occurs in a board on which highly rigid components are mounted. As shown in Figure 1(a), board 1 experiences convex warpage in the surface direction due to the effects of heat treatment and other processes during the manufacturing process. The reason for convex warpage in a board is that components are mounted on a heated board, and after cooling, stress is applied to the interface due to the difference in thermal expansion coefficients between the board and the components. For example, if the thermal expansion coefficient of the components is higher than that of the board, compressive stress is applied to the interface of the board that is in contact with the components as the board cools, causing downward convex warpage in the board.

[0010] Next, as shown in Figure 1(b), the convexly warped substrate 1 is sucked and held flat using a suction pad 11 that sucks and holds the substrate 1 and a support 12 that supports the substrate surface together with the suction pad 11. However, for example, if a highly rigid component 2 is mounted on the substrate 1, it is difficult to correct the warpage in region U of the substrate 1 that is in contact with the highly rigid component 2, and it is also difficult to sufficiently correct the warpage in region V near the highly rigid component 2. This is because the highly rigid component 2 increases the rigidity of the warped portion of the substrate 1. The highly rigid component 2 is sometimes referred to as the "predetermined component."

[0011] If the warpage of the substrate 1 cannot be reduced to a sufficient extent, the following problems may occur. For example, in an exposure unit that incorporates a substrate mounted with a row of light-emitting chips as a light-emitting element and focuses light onto the exposure surface through a lens, defocusing may occur in areas where the warpage has not been reduced to a sufficient extent, potentially reducing exposure accuracy. Furthermore, when testing electrical characteristics by applying a test probe to a pad on the substrate, poor contact may result in incorrect test results. Furthermore, when additional components are glued and crimped to the substrate, the mounting accuracy may be reduced or poor adhesion may occur.

[0012] FIG. 2 is a diagram showing the configuration of a board according to this embodiment, showing the board 1 as viewed from the side (XZ plane). As shown in FIG. 2, the board 1 is mounted with a highly rigid component 2 and a pull component 3, which is a portion that reduces warpage. The pull component 3 is a member that deforms at least a portion of the board 1. The board 1 is a printed circuit board on which various components are mounted, and is made of a material such as glass epoxy resin. The Young's modulus of the board 1 varies depending on the base material and the mounted components, but is approximately 20,000 to 50,000 MPa. The highly rigid component 2 has a higher Young's modulus than the board 1, and its thickness H is greater than the board thickness h. In this embodiment, the board thickness h is 1.2 mm.

[0013] The mounting position of the pulling component 3 on the board 1 has the following relationship, where S is the dimension of the highly rigid component in the X direction and T is the distance from the center position C1 of the highly rigid component 2 to the center position C2 of the pulling component 3. The X direction can be rephrased as the direction of the distance from the center position of the highly rigid component 2 to the center position of the pulling component 3. T < S × 1.5 (1) As shown in the above formula, the distance T is set to be shorter than 1.5 times the dimension S. The smaller the distance T, the greater the effect of warpage correction, and it is preferable to position the pulling component 3 closer to the highly rigid component 2. In this embodiment, the distance T is set so that the distance from the end of the pulling component 3 to the end of the highly rigid component 2 is 1.2 mm. Depending on the occurrence of warpage in the substrate 1, the distance from the end of the pulling component 3 to the end of the highly rigid component 2 may be within 1.2 mm or longer than 1.2 mm. For convenience of explanation, the distances shown in the drawings are not scaled to the actual distance values.

[0014] FIG. 3 is a perspective view of the board configuration of this embodiment. As shown in FIG. 3, the pull-in component 3 is preferably a commercially available electronic component such as a check terminal with a hole in the center. It does not have to be annular, as long as it has a portion into which a protruding jig can be inserted to lift the component. The pull-in component 3 must be fixed to the board 1 so that it can withstand the load during pulling, and is fixed by soldering, adhesive, or the like. The pull-in component 3 may also be fixed to the board 1 by a method other than soldering or adhesive.

[0015] Fig. 4 is a schematic diagram showing an outline of a system 1000 according to this embodiment. Fig. 4(a) is a diagram showing a state in which the pulling jig 21 is not in contact with the pulling component 3. Fig. 4(b) is a diagram showing a state in which the pulling jig 21 is in contact with the pulling component 3. As shown in Figs. 4(a) and 4(b), the system 1000 includes a substrate holder 10, a pulling mechanism 20, an air pressure means 110 that generates an adsorption force, and a control device 100 that controls the substrate holder 10, the pulling mechanism 20, and the air pressure means 110. The air pressure means 110 may be a vacuum pump, an ejector, or the like.

[0016] As shown in FIG. 4(a), a substrate 1 on which a highly rigid component 2 and a pull-out component 3 are mounted is held by a substrate holder 10. The substrate holder 10 includes a suction pad 11, a support 12 that supports the substrate surface together with the suction pad 11, and a substrate holding bracket 13 to which the suction pad 11 and support 12 are attached. The substrate 1 is held by suction so that warpage is corrected and flattened by the upward suction force of the suction pad 11 and the downward reaction force of the support 12. However, within a certain range from the highly rigid component 2, there are some areas where warpage cannot be corrected. A drive source may be provided to move the substrate holder 10 in the X, Z, or Y directions. A drive source may also be provided to move the support 12 in the Z direction to correct warpage.

[0017] 4, one suction pad 11 and two support portions 12 are arranged as a set, but this is not limiting, and the suction pads 11 and support portions 12 may be arranged in a 1:1 ratio. Also, the support portion 12 may be hollow, and the suction pad 11 may be arranged inside the support portion 12. In order to reduce warpage of the substrate, it is effective to shorten the distance between multiple support portions 12, and warpage can be further reduced by increasing the suction force of the suction pad 11 and the number of suction pads 11 and support portions 12.

[0018] As shown in Figure 4(b), a pulling mechanism 20 is provided to correct local warpage caused by a highly rigid component 2. The pulling mechanism 20 is equipped with a pulling jig 21 to be inserted into the pulling component 3, a Z-direction drive unit 22 that can be driven in the Z-axis direction, and an X-direction drive unit 23 that can be driven in the X-axis direction, and the pulling jig 21 can be driven in the Z direction and the X direction. In this embodiment, the pulling jig 21 and the substrate holding unit 10 are offset in the Y direction, but the mechanism for driving the pulling jig 21 may be movable inside the substrate holding unit 10.

[0019] The Z-direction drive unit 22 and the X-direction drive unit 23 can use an air cylinder, a robot, a motor, or the like. When pulling the component 3, if the pulling force is too weak, the warp cannot be corrected completely, and if the pulling force is too strong, warp in the opposite direction occurs, causing damage to the board or the mounted product, so the pulling force must be precisely controlled. Therefore, it is preferable that the Z-direction drive unit 22 be provided with not only a drive mechanism but also a spring or the like so that a constant load is applied. In addition, the pulling mechanism 20 is equipped with a sensor for acquiring (detecting) information regarding the pulling force.

[0020] The computer constituting the control device 100 has a CPU (Central Processing Unit), ROM (Read Only Memory), and RAM (Random Access Memory). It also includes a communication interface (hereinafter referred to as "I / F") and the like. The CPU, which is a processor, is an example of a control unit. The ROM stores a program. The program causes the computer, i.e., the CPU, to output commands for controlling the drive sources of the substrate holder 10, the drive sources of the attraction mechanism 20, and the air pressure means 110. The RAM is used to temporarily store programs for controlling the entire system, as well as data such as the execution timing of tasks for each control target and control commands.

[0021] The CPU acquires data transmitted from the sensors of the drive sources of the substrate holding unit 10, the pull mechanism 20, and the pneumatic means 110 by receiving the data via the I / F. Based on programs and data input by the user, the CPU can also transmit commands as control target values ​​via the I / F to the control devices controlling the respective control targets. While the present embodiment describes an example in which the control device 100 directly controls the drive sources of the substrate holding unit 10, the pull mechanism 20, and the pneumatic means 110, this is not limiting. For example, the substrate holding unit 10, the pull mechanism 20, and the pneumatic means 110 each include a control device configured by a computer including a microprocessor. The control device 100 may output commands to each control device, and the actual control may be performed by the installed control device. In other words, at least one control device may control the system 1000. Communication between the control device 100 and other control targets and control devices may be wired or wireless.

[0022] In this embodiment, the program is recorded in a ROM, but this is not limiting. The program may be recorded on any non-transitory recording medium that is readable by a computer. Examples of recording media that can be used to supply the program to a computer include flexible disks, hard disks, optical disks, magneto-optical disks, magnetic tapes, and non-volatile memories.

[0023] In this way, it is possible to play a part in the manufacture of an article by performing a process to correct the warpage of the substrate 1. By performing a process to correct the warpage of the substrate 1, it is possible to manufacture a substrate 1 with reduced warpage as an end product. Furthermore, by performing a process to assemble the substrate 1 with reduced warpage to another component, it is possible to manufacture a product in which the substrate 1 and another component are assembled as an end product.

[0024] Fig. 5 is a diagram showing the pulling jig 21 in this embodiment. As shown in Fig. 5, the pulling jig 21 has a protrusion 25 for inserting into a hole in the pulling part 3. When the pulling part 3 is pulled, a pulling load is applied to the pulling jig 21, so the pulling jig 21 is preferably made of a rigid metal or the like, and stainless steel, iron or steel, etc. are preferred.

[0025] Fig. 6 is a flowchart showing the warpage correction procedure using the pulling mechanism 20 in this embodiment. Fig. 7 is a diagram showing the operating state of the system 1000 when the warpage correction procedure using the pulling mechanism 20 in this embodiment is executed. The control flow shown in Fig. 6 is executed by the CPUs of the respective control devices in cooperation with each other through communication. It is also assumed that the process starts with the substrate 1 being held by the substrate holder 10.

[0026] 6 and 7(a), first, in step S1, the control device 100 moves the pulling jig 21 in the −Z direction to insert the protrusion 25 provided on the pulling jig 21 into the hole of the pulling component 3.

[0027] Next, in step S2 in FIGS. 6 and 7(a), the control device 100 moves the pulling jig 21 in the +X direction, thereby inserting the protrusion 25 into the rear part of the pulling part 3.

[0028] Next, in step S3 in FIG. 6 and FIG. 7(b), the control device 100 moves the pulling jig 21 in the +Z direction to pull the pulling component 3.

[0029] 6, in step S4, the control device 100 determines whether the value from the sensor has reached a predetermined attractive force. The attractive force of the attractive jig 21 can be determined from the dimensions and material of the substrate, the amount of warping of the substrate, and the distance between the support parts, and it is preferable to attract with a force that is about 1 to 2 times the attractive force F calculated using the formula for calculating the amount of deflection of a concentrated load on a beam supported at both ends described below.

[0030]

number

[0031] For example, in a glass epoxy substrate with a distance between supporting portions of 50 mm, a substrate width of 9 mm, a substrate thickness of 1.6 mm, and a Young's modulus of 22,000 MPa, to correct a warpage of 0.5 mm, it is preferable to set the pulling force to 2 to 4 N. The thickness of the substrate 1 in this embodiment is set to 0.8 mm to 1.6 mm.

[0032] If the value from the sensor is not the predetermined attractive force value, step S4: No, and the process returns to just before step S3, where the attractive jig 21 is moved in the +X direction again to increase the attractive force. If the value from the sensor is the predetermined attractive force value, the process ends. By using the above process, it is possible to reduce local warpage of the substrate 1.

[0033] Figure 8 shows the state in which the substrate 1 and another component are assembled in this embodiment. Figure 8(a) shows the state in which the warp-corrected substrate 1 is assembled with another component. Figure 8(b) is a view of the AA cross section of Figure 8(a) as seen from the X-axis direction.

[0034] As shown in Figures 8(a) and 8(b), while the pulling part 3 is pulled, it is aligned with the case part 101 and bonded and fixed with adhesive 102, thereby maintaining the warpage-corrected state and assembling the substrate 1 to the case part 101. A UV-curable adhesive that can be hardened by irradiating ultraviolet light is optimal for the adhesive 102, but other adhesives may also be used. The substrate 1 and case part 101 are bonded and fixed in a state where they are cross-linked by the adhesive 102. In order to maintain the warpage-corrected state even when the pulling jig 21 is retracted and the pulling force is released, it is preferable that the adhesive 102 be bonded near the pulling part 3.

[0035] In this embodiment, the case part 101 and the substrate 1 are bonded and fixed with adhesive 102, but this is not limiting and the case part 101 and the substrate 1 may be fixed with screws or thermal caulking after the warpage has been corrected. Furthermore, after the warpage has been corrected, inspection may be performed with a verification probe or component mounting may be performed. After the warpage of the substrate 1 has been corrected, the pull-in part 3 may be used as a check terminal or as an earth continuity terminal.

[0036] As described above, according to this embodiment, by using the pulling component 3, it is possible to reduce local warpage that occurs in a predetermined range of the substrate 1 from the highly rigid component 3. FIG. 9 shows the results of measuring the deformation state of the substrate 1 before and after pulling the pulling component 3. The horizontal axis of FIG. 9 represents displacement on the X axis, and the vertical axis represents displacement on the Z axis. Before pulling the pulling component 3, the substrate 1 warped in a downward convex direction in the drawing near the highly rigid component 2. It can be seen that by pulling the pulling component 3, the warpage near the highly rigid component 2 was corrected and the substrate 1 became flat. Comparing the flatness a before pulling the pulling component 3 with the flatness b after pulling the pulling component 3, the flatness a of 0.088 mm changed to the flatness b of 0.048 mm, indicating that the warpage was reduced.

[0037] (Second embodiment) Next, a second embodiment of the present invention will be described in detail. In this embodiment, a butting guide portion 24 is provided on the substrate holding portion 10. In the following, the same reference numerals will be used for the same or corresponding components as those in the above-described embodiment, and their description will be omitted or simplified. The following description will focus on the differences from the above-described embodiment.

[0038] FIG. 10 illustrates the operating state of the system 1000 when performing the warpage correction procedure using the pulling mechanism 20 of this embodiment. As shown in FIG. 10(a), a butting guide 24 is provided above the pulling component 3. This allows the pulling height to be adjusted when the pulling component 3 is pulled by the pulling jig 21, enabling effective warpage correction. FIG. 10(b) illustrates the state in which the pulling component 3 is pulled and the substrate 1 is butted against the butting guide 24. The pulled substrate 1 butts against the butting guide 24, reducing the risk of reverse warpage or damage to the substrate 1 or the mounted components due to excessively strong pulling force. The butting guide 24 must be made of a highly rigid material to prevent deformation or misalignment even when subjected to a pulling load. For example, it is preferable to make it from stainless steel or steel.

[0039] In order to effectively correct warpage of the substrate 1, it is preferable that the height of the abutment surface of the abutment guide portion 24 be the same height as the surface where the support portion 12 contacts the substrate 1. FIG. 11 is a diagram for explaining the amount of misalignment when the substrate 1 is pulled in this embodiment. From FIGS. 11(a) and 11(b), it is assumed that the amount of deformation and positional misalignment of the abutment guide portion 24 in the +Z direction due to the pulling component 3 being pulled and the pulling load being applied is W. In order to enhance the effect of warpage correction, it is preferable to calculate the amount W of displacement of the abutment guide portion 24 and set the abutment surface height of the abutment guide portion 24 at a position that is lower by the amount W than the surface height where the support portion 12 contacts the substrate 1.

[0040] According to the present embodiment, by using the pull-up component 3, it is possible to reduce local warpage that occurs in a predetermined area of ​​the substrate 1 from the highly rigid component 3. Furthermore, the abutment guide portion 24 can reduce the occurrence of reverse warpage and damage to the substrate 1 or the mounted object. Furthermore, the various embodiments and modified examples described above may be combined and implemented.

[0041] (Third embodiment) Next, a third embodiment of the present invention will be described in detail. In this embodiment, a displacement meter 26 is provided in a system 1000. In the following, the same reference numerals will be used for the same or corresponding components as those in the above-described embodiment, and their description will be omitted or simplified. The following description will focus on the differences from the above-described embodiment.

[0042] FIG. 12 is a schematic diagram showing an outline of a system 1000 according to this embodiment. As shown in FIG. 12(a), a displacement meter 26 is installed above or below the substrate 1, and by measuring the distance to the substrate 1, the amount of warpage of the substrate is measured and the attracting force is controlled to be appropriate for the amount of warpage. In FIG. 11(a), the displacement meter 26 is installed below the substrate 1. The displacement meter 26 can move in the X-axis direction along the substrate 1, and can measure the deformation state of the substrate 1 in detail. The movement of the displacement meter 26 is controlled by a control device 100, which acquires measurement information from the displacement meter 26. Based on the acquired measurement information, the control device 100 controls the movement of the attracting jig 21 and controls the attracting force.

[0043] 12(b), two or more fixed displacement meters 26 that do not move may be arranged, and the control device 100 may acquire measurement information from each of the displacement meters 26. In this case, the amount of warpage can be acquired from the difference between the distance to the substrate 1 near the highly rigid component 2 and the distance to the substrate 1 near the support portion 5, and the pulling force can be controlled according to the amount of warpage. Furthermore, after the pulling component 3 is pulled, the displacement meters 26 measure the distance to the substrate 1, thereby making it possible to check the surface condition of the substrate 1 after warpage correction. A non-contact laser displacement meter is preferably used as the displacement meter 26, but a white light interferometer or contact type displacement meter may also be used.

[0044] Fig. 13 is a flowchart showing the warpage correction procedure using the pulling mechanism 20 in this embodiment. Fig. 13 is a diagram showing the operating state of the system 1000 when the warpage correction procedure using the pulling mechanism 20 in this embodiment is executed. The control flow shown in Fig. 13 is executed by the CPUs of the respective control devices in cooperation with each other through communication. It is also assumed that the process starts from a state in which the substrate 1 is held by the substrate holding part 10. Steps S1 to S3 shown in Fig. 13 are the same as those in the above-mentioned embodiment, and therefore their explanation will be omitted.

[0045] 13, the control device 100 acquires measurement information from the displacement meter 26 in step S11.

[0046] Next, in step S12, the control device 100 determines whether the amount of warpage of the substrate 1 is within a predetermined value range based on the measurement information from the displacement meter 26. If the amount of warpage is within the predetermined value range, step S12: YES is returned, and the control flow is terminated, assuming that the warpage of the substrate 1 has been reduced. If the amount of warpage is outside the predetermined value range, step S12: NO is returned, and the flow proceeds to step S13.

[0047] In step S13, the control device 100 moves the pulling jig 21 in the +Z direction or the -Z direction based on the amount of warpage acquired. If the change in the amount of warpage based on the acquired amount of warpage is within a predetermined value range, it is determined that the warpage has not been sufficiently corrected, and the pulling jig 21 is moved in the +Z direction. At this time, the amount of movement may be changed. If the change in the amount of warpage is outside the predetermined value range based on the acquired amount of warpage, it is determined that the warpage has been corrected more than necessary, and the pulling jig 21 is moved in the -Z direction. At this time, the amount of movement may be changed. Then, the process returns to just before step S11, and the control device 100 again acquires measurement information from the displacement meter 26.

[0048] As described above, according to this embodiment, by using the pulling component 3, it is possible to reduce local warpage that occurs in a predetermined range of the substrate 1 from the highly rigid component 3. Furthermore, since the surface state of the substrate 1 can be acquired based on the measurement information from the displacement meter 26, it is possible to correct the warpage of the substrate 1 with an appropriate pulling force. If the correction of the warpage is insufficient, the pulling force can be increased. If the correction of the warpage is more than necessary, the pulling force can be reduced to reduce the occurrence of warpage that is convex in the pulling direction (+Z direction).

[0049] (Fourth embodiment) Next, a fourth embodiment of the present invention will be described in detail. In the following, the same reference numerals will be used for the same or corresponding components as those in the above-described embodiment, and their description will be omitted or simplified. The following description will focus on the differences from the above-described embodiment.

[0050] FIG. 14 is a perspective view of the substrate 1 according to this embodiment, viewed from the bottom. As shown in FIG. 14, a pressing component 4 is mounted on the back side (opposite side) of the substrate 1, opposite the side on which the highly rigid component 2 is mounted, as a warp correction unit. The pressing component 4 is a member that deforms at least a portion of the substrate 1. The pressing component 4 is, for example, a commercially available electronic component such as a check terminal. Preferably, the pressing component 4 has a flat top surface so that it can be easily pressed against the substrate 1 in the Z-axis direction. The pressing component 4 is not limited to a check terminal; any shape is acceptable as long as it can apply a load vertically to the substrate. Note that the pressing component 4 must be fixed to the substrate 1 so that it can withstand the pressing load, and is fixed by soldering, adhesive, or the like. Note that direct pressing of the substrate against the substrate 1 without mounting the pressing component 4 is acceptable if the substrate is unlikely to be scratched, resulting in disconnection of the wiring pattern or the generation of foreign matter, if pressed directly against the substrate.

[0051] FIG. 15 is a schematic diagram illustrating a system 1000 according to this embodiment. A pressing component 4, which is a warpage correction unit, is provided on the substrate 1 on the opposite side of the rigid component 2. The substrate 1 is held flat by a substrate holder 10, which includes a suction pad 11 and a support 12 that cooperates with the suction pad 11 to support the substrate surface. However, within a certain range from the rigid component 2, localized areas where warpage cannot be corrected occur, as illustrated in FIG. 15(a). In the example of FIG. 15, the pressing component 4 is positioned at or substantially at the center of the rigid component 2. However, this is not limited to this. It may be positioned anywhere within the length of the rigid component 2, or it may be positioned so that the relationship between distance T and dimension S described in the first embodiment is satisfied. Alternatively, the pressing component 4 may be positioned so that the distance from the end of the pressing component 4 to the end of the rigid component 2 is within 1.2 mm.

[0052] To correct localized warpage due to the highly rigid component 2, a pressing mechanism 30 is provided below the pressing component 4, as shown in FIG. 15(a). The pressing mechanism 30 is connected to a control device 100 so as to be able to communicate with the control device 100, and its operation is controlled by the control device 100. The pressing mechanism 30 is equipped with a pressing jig 31 for pressing the pressing component 4 and a Z-direction drive unit 32 that can drive the pressing jig 31 in the Z direction. The Z-direction drive unit 32 can be an air cylinder, a robot, a motor, or the like. Note that, as described in the above embodiment, the pressing force can be calculated from the dimensions and material of the substrate, the amount of warpage of the substrate, and the distance between the support parts, and the pressing force can be one to two times the calculated value.

[0053] When pressing the pressing component 4, if the pressing force is too weak, the warpage cannot be completely corrected, and if the pressing force is too strong, warpage occurs in the opposite direction, causing damage to the board or the mounted product, so the pressing force must be precisely controlled. For this reason, it is preferable that the Z-direction driving unit 32 be provided with not only a driving mechanism but also a spring or the like so that a constant load is applied. In addition, the pressing mechanism 30 is equipped with a sensor for acquiring (detecting) information regarding the pressing force.

[0054] The pressing jig 31 preferably has a flat shape so that the load is applied evenly when the pressing part 4 is pressed against it, but any shape is acceptable as long as the load can be applied vertically to the substrate. Because a load is applied to the pressing jig 31 when pressing, it is preferable to make it from a rigid metal, such as stainless steel or steel.

[0055] 15(b) is a diagram showing the state in which the warpage of the substrate 1 has been corrected by pressing the pressing jig 31. The pressing jig 31 is driven in the +Z direction to press the pressing part 4, thereby correcting the warpage of the substrate 1. After the warpage of the substrate 1 has been corrected, the pressing part 4 may be used as a check terminal or as an earth conduction terminal.

[0056] According to the present embodiment, by using the pressing component 4, it is possible to reduce local warpage that occurs in a predetermined area of ​​the substrate 1 from the highly rigid component 2. Furthermore, the above-described various embodiments and modified examples may be combined and implemented.

[0057] (Fifth embodiment) Next, a fifth embodiment of the present invention will be described in detail. In this embodiment, a butting guide portion 33 is provided on the substrate holding portion 10. In the following, the same reference numerals will be used for the same or corresponding configurations as those in the above-described embodiment, and their description will be omitted or simplified. The following description will focus on the differences from the above-described embodiment.

[0058] FIG. 16 is a diagram showing the operating state of the system 1000 when a warpage correction procedure is performed using the pressing mechanism 30 of this embodiment. As shown in FIG. 16(a), by providing a butting guide unit 33 on the opposite side of the pressing component 4, the pressing position can be adjusted when pressing the pressing component 4 with the pressing jig 31, thereby enabling effective warpage correction. FIG. 16(b) shows the BB cross section in FIG. 16(a) as viewed from the X-axis direction, with the butting guide unit 33 positioned so as to straddle the highly rigid component 2. In other words, the butting guide unit 33 is provided on the substrate holding unit 10 so as to sandwich the highly rigid component 2 between the butting guide units 33.

[0059] FIG. 16(c) shows the state in which the pressing component 4 is pressed against the board 1, causing it to butt against the butt guide portion 33. FIG. 16(d) shows the BB cross section of FIG. 16(c) as viewed from the X-axis direction. When the pressed board 1 butts against the butt guide portion 33, it is possible to prevent reverse warping and damage to the board or mounted components caused by excessive pressing force. The butt guide portion 33 must not deform or shift in position even when a pressing load is applied, and must be made of a highly rigid material. For example, it is preferable to make it from stainless steel, iron, or the like.

[0060] According to the present embodiment, by using the pressing component 4, it is possible to reduce local warpage that occurs in a predetermined area of ​​the substrate 1 from the highly rigid component 2. Furthermore, the abutment guide portion 33 can reduce the occurrence of reverse warpage and damage to the substrate 1 or the mounted object. Furthermore, the various embodiments and modified examples described above may be combined and implemented.

[0061] (Sixth embodiment) Next, a sixth embodiment of the present invention will be described in detail. In the following, the same reference numerals will be used for the same or corresponding components as those in the above-described embodiments, and their description will be omitted or simplified. The following description will focus on the differences from the above-described embodiments.

[0062] Fig. 17 is a perspective view of the substrate 1 in this embodiment. As shown in Fig. 17, a linear pulling component 5 is mounted within a predetermined range of a highly rigid component 2 on the substrate 1, and the linear pulling component 5 is, for example, a linear component such as a jumper wire. The linear pulling component 5 is a member that deforms at least a portion of the substrate 1. Because the linear pulling component 5 uses a linear component such as a jumper wire, costs can be reduced compared to using a ring-shaped pulling component 3.

[0063] 18 is an XY plan view of a substrate 1 on which a linear pulling component 5 according to this embodiment is mounted. Even if the annular pulling component 3 described in the first embodiment cannot be mounted within a predetermined range of the highly rigid component 2 due to the wiring pattern on the substrate or interference with other mounted components, a linear pulling component 5 such as a jumper wire can still be mounted. The pulling component 5 may be arranged so that the relationship between the distance T and the dimension S described in the first embodiment is satisfied, or the pulling component 5 may be arranged so that the distance from the end of the pulling component 5 to the end of the highly rigid component 2 is within a range of 1.2 mm.

[0064] For example, as shown in Fig. 18(a), even when there is an unmountable area 6 around a highly rigid component 2 and there is no space to mount a pulling component 3, a linear pulling component 5 can be mounted across the unmountable area. Also, as shown in Fig. 18(b), by mounting a linear pulling component 5 across the highly rigid component 2, it is possible to pull the component to a position equivalent to that of the highly rigid component 2, thereby enabling effective warpage correction.

[0065] As described in the first embodiment, a pulling jig similar to the pulling jig 21 described in Figures 4 to 6 can be used as the pulling jig for pulling the linear pulling part 5. The warpage can be corrected by inserting the protrusion 25 into the linear pulling part 5 and lifting it in the +Z direction. The material of the linear pulling part 5 can be any material that can withstand the pulling force, and it is preferable to make it into a chain made of stainless steel, steel, etc.

[0066] According to the present embodiment, by using the pulling component 5, it is possible to reduce local warpage that occurs within a predetermined range of the highly rigid component 2 on the substrate 1. Furthermore, even if it is not possible to mount a pulling component within a predetermined range of the highly rigid component 2 due to interference with the wiring pattern on the substrate or other mounted components, a linear pulling component 5 such as a jumper wire can be mounted. Furthermore, by mounting a linear pulling component 5 across the highly rigid component 2, it is possible to pull the component to a position equivalent to the highly rigid component 2, thereby effectively correcting the warpage. Furthermore, the various embodiments and modified examples described above may be combined and implemented.

[0067] (Seventh embodiment) Next, a seventh embodiment of the present invention will be described in detail. In the following, the same reference numerals will be used for the same or corresponding components as those in the above-described embodiments, and their description will be omitted or simplified. The following description will focus on the differences from the above-described embodiments.

[0068] FIG. 19 is a schematic diagram showing an outline of a system 1000 according to this embodiment. A magnetic attracting component 7, which is a warpage correction unit, is provided on the substrate 1 within a predetermined range from the rigid component 2. The magnetic attracting component 7 is a member that deforms at least a portion of the substrate 1. The substrate 1 is held flat by a substrate holder 10 that includes a suction pad 11 and a support 12 that cooperates with the suction pad 11 to support the substrate surface. As shown in FIG. 19(a), local warpage occurs within a predetermined range from the rigid component 2. The magnetic attracting component 7 may be positioned so that the relationship between the distance T and the dimension S described in the first embodiment is satisfied, or the attracting component 7 may be positioned so that the distance from the end of the attracting component 7 to the end of the rigid component 2 is within 1.2 mm.

[0069] To correct localized warpage due to the highly rigid component 2, as shown in FIG. 19(a), a magnetic attraction mechanism 50 is provided above the magnetic attraction component 7. The magnetic attraction mechanism 50 is connected to the control device 100 so as to be able to communicate with the control device 100, and its operation is controlled by the control device 100. In this embodiment, the magnetic attraction mechanism 50 and the substrate holder 10 are offset in the Y direction, but the magnetic attraction mechanism 50 may also be provided inside the substrate holder 10. Here, the magnetic attraction component 7 is made of a ferromagnetic material, such as Fe, Ni, or an alloy thereof. The shape of the magnetic attraction component 7 is not critical as long as it can be attracted by magnetic force. However, it is preferable that the surface that comes into contact with the magnetic attraction mechanism 50 be flat to facilitate stability during magnetic attraction.

[0070] The magnetic attraction mechanism 50 includes a magnet 51 that magnetically attracts the magnetic attraction part 7, a Z-direction drive unit 52 that can be driven in the Z-axis direction, and an abutment guide unit 53 against which the magnetic attraction part 7 attracted by the magnetic force abuts. The magnet 51 is provided at the tip of the Z-direction drive unit 52 and can be driven in the Z direction. A permanent magnet is preferably used as the magnet 51, and suitable examples include a neodymium magnet and a ferrite magnet.

[0071] FIG. 19(b) shows the magnet 51 being brought close to the magnetic attraction part 7 and attracted to it. As shown in FIG. 19(b), when the Z-direction drive unit 52 is driven to bring the magnet 51 close to the substrate 1, the magnetic attraction part 7 is attracted by magnetic force, correcting the warpage that has occurred in a predetermined area of ​​the highly rigid part 2. Here, the magnetic attraction part 7 is stopped by hitting the abutment guide part 53, and it is preferable that it does not come into direct contact with the magnet 51. If the magnetic attraction part 7 is directly attracted by the magnet 51, the attraction force may excessively pull the substrate 1 when the magnet 51 is retracted, potentially damaging the substrate 1.

[0072] In this embodiment, the abutment guide portion 53 is incorporated into the magnetic attraction mechanism 50, but the abutment guide portion 53 may be provided as a separate mechanism. The attracting position of the magnetic attraction part 7 can be adjusted by the height of the abutment guide portion 53. The attracting force to the magnetic attraction part 7 can be adjusted by changing the distance from the magnet 51 to the substrate 1.

[0073] When attracting the annular attracting component 3 described in the above embodiment, the protrusion 25 of the attracting jig 21 must be inserted into the hole in the attracting component 3, requiring drive operations in the X-axis and Z-axis directions. In this embodiment, the attracting operation is performed by moving the magnet 51 in the Z-axis direction, eliminating the need for multiple drive operations and simplifying the mechanism. Alternatively, the abutment guide 53 may be omitted, and warpage may be corrected by adjusting the distance between the magnetic attracting component 7 and the magnet 51 and balancing the warpage reaction force of the board with the magnetic attraction force. The warpage correction operation for the board 1 can be performed without contact, reducing the possibility of scratches on the board or mounted components.

[0074] Furthermore, an electromagnet may be used for the magnet 51 to attract the magnetic attraction part 7. In this case, there is no need to drive the magnet 51 in the Z-axis direction, which simplifies the device and reduces costs. Either an AC or DC type electromagnet can be used, and for example, an air-core electromagnet, an iron-core electromagnet, a superconducting electromagnet, etc. can be used as the electromagnet.

[0075] According to the present embodiment, by using the pull-up component 7, it is possible to reduce local warpage that occurs in a predetermined range of the substrate 1 from the highly rigid component 2. Furthermore, it is possible to reduce the number of directions of operation when reducing the warpage of the substrate 1, and to simplify the mechanism for reducing the warpage. Furthermore, the various embodiments and modified examples described above may be combined and implemented.

[0076] (Eighth embodiment) Next, an eighth embodiment of the present invention will be described in detail. In the following, the same reference numerals will be used for the same or corresponding components as those in the above-described embodiments, and their description will be omitted or simplified. The following description will focus on the differences from the above-described embodiments.

[0077] FIG. 20 is a schematic diagram illustrating the system 1000 of this embodiment. The substrate 1 is provided with through-holes 8, which serve as warpage correction units, within a predetermined range from the highly rigid component 2. The through-holes 8 are components that deform at least a portion of the substrate 1. The through-holes 8 may be positioned to satisfy the relationship between distance T and dimension S described in the first embodiment, or may be positioned so that the distance from the end of the through-hole 8 to the end of the highly rigid component 2 is within 1.2 mm. Using the through-holes 8 as warpage correction units eliminates the need for dedicated warpage correction components, avoids interference with other components, and reduces costs. The substrate 1 is held flat by a substrate holder 10 equipped with suction pads 11 and support units 12 that cooperate with the suction pads 11 to support the substrate surface. However, within a predetermined range from the highly rigid component 2, localized areas where warpage cannot be corrected occur, as shown in FIG. 20(a).

[0078] To correct localized warpage due to the highly rigid component 2, a through-hole pulling mechanism 60 is provided above the through-hole 8, as shown in FIG. 20( a). The through-hole pulling mechanism 60 is communicatively connected to the control device 100, and its operation is controlled by the control device 100. The through-hole pulling mechanism 60 includes a through-hole pulling tool 61 for inserting into the through-hole 8, a Z-direction drive unit 62 that can be driven in the Z-axis direction, and an X-direction drive unit 63 that can be driven in the X-axis direction. The through-hole pulling tool 61 has an L-shaped tip and can be driven in both the Z-axis and X-axis directions. The Z-direction drive unit 62 and the X-direction drive unit 63 can be implemented using air cylinders, robots, motors, etc. In this embodiment, the through-hole pulling tool 61 and the substrate holder 10 are offset in the Y direction; however, the mechanism for driving the through-hole pulling tool 61 may be movable within the substrate holder 10.

[0079] The warpage correction procedure using the through-hole pulling mechanism 60 is as follows. The same flow as in the first embodiment is performed. As shown in FIG. 20(a), the L-shaped bent portion at the tip of the through-hole pulling jig 61 is moved in the -Z direction to a position where it passes through the through-hole 8. Next, as shown in FIG. 20(b), the through-hole pulling jig 61 is moved in the +X direction to a position where the L-shaped bent portion at the tip of the through-hole pulling jig 61 will catch on the back surface (rear side) of the board 1 and is on the component 2 side when moved in the +Z direction. Next, the through-hole pulling jig 61 is moved in the +Z direction to pull the board in at the L-shaped bent portion, thereby correcting the warpage of the board 1.

[0080] FIG. 21 is a schematic diagram showing an outline of a system 1000 according to a modified example of this embodiment. In order to correct local warpage due to a highly rigid component 2, as shown in FIG. 21(a), a through-hole drawing jig 61 for insertion into a through-hole 8 is positioned above the through-hole 8. The through-hole drawing jig 61 is operated by a Z-direction drive unit 62 that can be driven in the Z-axis direction and a Z-rotation drive unit 64 that can be driven in directions around the Z-axis. The tip of the through-hole drawing jig 61 is L-shaped, and it can be driven in the Z-axis direction and in directions around the Z-axis. The Z-direction drive unit 62 and the Z-rotation drive unit 64 can be implemented using an air cylinder, a robot, or a motor.

[0081] The warpage correction procedure for driving the through-hole pulling jig 61 in the direction around the Z-axis is as follows. As shown in FIG. 21(a), the L-shaped bent portion at the tip of the through-hole pulling jig 61 is moved in the -Z direction to a position where it passes through the through-hole 8. Next, as shown in FIG. 21(b), the through-hole pulling jig 61 is rotated in the direction around the Z-axis. Then, the L-shaped bent portion at the tip of the through-hole pulling jig 61 is moved in the +Z direction to a position where it will catch on the back surface of the board 1 and is on the side of the component 2. Next, the through-hole pulling jig 61 is moved in the +Z direction, and the L-shaped bent portion pulls the board in, thereby correcting the warpage of the board 1.

[0082] Fig. 22 is a schematic diagram showing an outline of a system 1000 according to a modified example of this embodiment. Fig. 23 is a detailed diagram of a through-hole pulling jig 65 according to this modified example. First, as shown in Fig. 22(a), in order to correct local warpage due to a highly rigid component 2, a through-hole pulling jig 65 for insertion into the through-hole 8 and a Z-direction driving unit 62 that can be driven in the Z-axis direction are provided above the through-hole 8.

[0083] As shown in Figure 23, the tip of through-hole pulling jig 65 is bifurcated. As shown in Figure 23(a), the tip of through-hole pulling jig 65 is equipped with grappling claws 66 and 67, and is driven by a fulcrum 68. As shown in Figure 23(b), as a grappling drive unit 69 moves in the Z-axis direction, grappling claws 66 and 67 move closer to or farther away from each other, resulting in a bifurcated mechanism.

[0084] Next, as shown in FIG. 22(b), the through-hole pulling jig 65 is moved in the -Z direction to a position where the grappling claws 66 and 67 at the tip thereof pass through the through-hole 8. Next, as shown in FIG. 22(c), the grappling claws 66 and 67 are moved away from each other, and the through-hole pulling jig 65 is moved in the +Z direction, and the grappling claws 66 and 67 pull the board in, thereby reducing warpage of the board 1. Note that a collet chuck may be used instead of the through-hole pulling jig 65. With the collet chuck inserted into the through-hole 8, the through-hole 8 is internally gripped by the collet chuck and moved in the +Z direction, thereby correcting warpage of the board 1.

[0085] According to this embodiment, by using the through-holes 8, it is possible to reduce local warpage that occurs within a predetermined range from the highly rigid component 2 on the substrate 1. Furthermore, there is no need to mount a dedicated warpage correction component as a warpage correction section, and interference with other components can be avoided. Furthermore, the above-described various embodiments and modified examples may be combined and implemented.

[0086] (Ninth embodiment) Next, a ninth embodiment of the present invention will be described in detail. In the following, the same reference numerals will be used for the same or corresponding components as those in the above-described embodiments, and their description will be omitted or simplified. The following description will focus on the differences from the above-described embodiments.

[0087] Fig. 24 is a perspective view of the substrate 1 in this embodiment. As shown in Fig. 24(a), the substrate 1 is provided with cutout portions 9, which are warpage correction portions, within a predetermined range from the highly rigid component 2, and the cutout portions 9 are provided in two locations on opposite sides of the substrate 1. The cutout portions 9 are members that deform at least a portion of the substrate 1. The cutout portions 9 may be arranged so that the relationship between the distance T and the dimension S described in the first embodiment is satisfied, or the cutout portions 9 may be arranged so that the distance from the end of the cutout portion 9 to the end of the highly rigid component 2 is within a range of 1.2 mm.

[0088] 24(b), the tip of the substrate lifting claw 71 is L-shaped, and the bent part of the L-shape is shaped to lift the back surface of the substrate 1. The substrate is more likely to deform at the cutout portion 9 than other areas on the substrate, which improves the warpage correction effect when pulled up.

[0089] FIG. 25 is a schematic diagram illustrating an outline of a system 1000 according to this embodiment. As shown in FIG. 25(a), a substrate lifting mechanism 70 is provided above the cutout 9. The substrate lifting mechanism 70 includes substrate lifting claws 71 for hooking onto the cutout 9, a Y-direction gripping chuck 72 for chucking the substrate lifting claws 71 in the Y direction, and a Z-direction driver 73 that can drive the substrate in the Z direction. In this embodiment, the substrate lifting claws 71 and the substrate holder 10 are offset in the Y direction; however, the mechanism for driving the substrate lifting claws 71 may be movable inside the substrate holder 10. The Y-direction gripping chuck 72 is provided with the substrate lifting claws 71 at its tip, and can drive the substrate lifting claws 71 to grip the substrate in the Y-axis direction. Furthermore, the Y-direction gripping chuck 72 is driven by a Z-direction driver 73. The Z-direction driver 73 and the Y-direction gripping chuck 72, which are movable in the Z direction, can be driven by an air cylinder, a robot, or a motor.

[0090] As shown in Figure 25(a), the substrate lifting claws 71 are moved in the -Z direction to below the cutout portions 9. Thereafter, as shown in Figure 25(b), the Y-direction gripping chucks 72 are moved closer to each other to position the substrate lifting claws 71 in the cutout portions 9. Then, by moving the substrate lifting claws 71 in the +Z direction, the substrate 1 is lifted and the warpage is corrected.

[0091] Figure 26 is a diagram showing the operating state of the system 1000 when a warpage correction procedure is performed using the substrate lifting mechanism 70 in this embodiment. Figure 26(a) is a perspective view of a substrate 1 having a cutout 9 within a predetermined range from a highly rigid component 2. Figures 26(b) to 26(d) are views of the CC cross section of Figure 26(a) viewed from the X-axis direction, illustrating the operation of lifting the cutout 9 with the substrate lifting claws 71.

[0092] As shown in Figure 26(b), with the Y-direction gripping chucks 72 (not shown) spaced apart from each other, the substrate lifting claws 71 are moved in the -Z direction until the L-shaped portions of the substrate lifting claws 71 are positioned below the cutout portions 9.

[0093] 26(c), the Y-direction gripping chucks 72 (not shown) are moved closer to each other, and the substrate lifting claws 71 are inserted into the cutouts 9. In this case, the L-shaped portions of the substrate lifting claws 71 are moved to a position where they catch on the rear surface of the substrate 1. Furthermore, it is preferable to create a gap between the substrate lifting claws 71 and the side surfaces of the substrate 1 so that positional displacement due to friction does not occur when the substrate 1 is lifted.

[0094] 24(d), the substrate lifting claws 71 are moved in the +Z direction to bring them into contact with the substrate 1 and lift the substrate 1. Then, based on the flowcharts described in FIG. 6 or FIG. 13, information regarding the attractive force or the amount of warping is acquired, the operation of the substrate lifting claws 71 is controlled, and the warping of the substrate 1 is reduced.

[0095] According to this embodiment, by using the cutout portion 9, it is possible to reduce local warpage that occurs in a predetermined range from the highly rigid component 2 on the substrate 1. Furthermore, there is no need to mount a dedicated warpage correction component as a warpage correction unit, and interference with other components can be avoided. Furthermore, the cutout portion 9 makes the substrate more susceptible to deformation than other areas on the substrate, which improves the warpage correction effect when the substrate is pulled. Furthermore, the various embodiments and modified examples described above may be combined and implemented.

[0096] (Other embodiments) Warpage of the substrate 1 may also be reduced using the flowchart shown in FIG. 27. The flowchart shown in FIG. 27 is executed by the CPUs of the control devices in cooperation with each other via communication. This flowchart differs from the above-described embodiment in that step S0 is added. In step S0, components are mounted on the substrate 1 by performing a heating process using solder or the like. The substrate 1 is then held by the substrate holder 10, and steps S1 to S4 are executed. Steps S1 to S4 are executed while the substrate 1 is being cooled. Cooling may be performed by natural heat dissipation, air cooling by blowing air, or water cooling depending on the function of the substrate 1. This allows the substrate 1 to be deformed while still retaining some heat, making the substrate 1 more likely to deform and effectively reducing warpage of the substrate 1. Natural heat dissipation is particularly preferable because it leaves some heat behind. Furthermore, since a process for reducing warpage is executed during cooling of the substrate 1, warpage of the substrate 1 can be efficiently reduced, and the substrate 1 can be efficiently manufactured. The flowchart shown in FIG. 27 may also be implemented in combination with the various embodiments and modifications described above.

[0097] The processing procedures of the above-described embodiments are specifically executed by at least one CPU of each control device. Therefore, it is also possible to configure the system to read and execute a software control program capable of executing the above-described functions from a recording medium. In this case, the control program itself read from the recording medium will realize the functions of each of the above-described embodiments, and the control program itself and the recording medium on which the control program is recorded constitute the present invention.

[0098] In addition, in each embodiment, the computer-readable recording medium is a ROM, a RAM, or a flash ROM, and the program is stored in the ROM, the RAM, or the flash ROM. However, the present invention is not limited to this embodiment. The program for implementing the present invention may be recorded on any computer-readable recording medium, such as an SSD (Solid State Drive).

[0099] Furthermore, the various embodiments described above can be implemented using robots with different types of joints, such as horizontal articulated robots, parallel link robots, Cartesian robots, etc. Furthermore, the various embodiments described above can be applied to machines that can automatically perform movements such as expansion and contraction, bending and stretching, vertical movement, horizontal movement, or rotation, or a combination of these movements, based on information stored in a storage device provided in a control device.

[0100] The present invention is not limited to the above-described embodiments, and many modifications are possible within the technical concept of the present invention. Furthermore, the effects described in the embodiments of the present invention are merely a list of the most preferable effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments of the present invention. Furthermore, the above-described various embodiments and modifications may be combined and implemented.

[0101] The disclosure of this embodiment also includes the following configurations and methods.

[0102] (Item 1) A substrate, a member capable of deforming at least a part of the substrate on which a predetermined component having a higher rigidity than the substrate is mounted, provided at a position within a predetermined range from the predetermined component; A substrate characterized by:

[0103] (Item 2) In the substrate according to item 1, The member can locally deform the at least part. A substrate characterized by:

[0104] (Item 3) In the substrate according to item 1 or 2, Pulling or pushing the member to deform the at least part. A substrate characterized by:

[0105] (Item 4) Item 4. The substrate according to any one of items 1 to 3, the predetermined component has a higher Young's modulus than the substrate; A substrate characterized by:

[0106] (Item 5) 5. The substrate according to any one of items 1 to 4, The member has a distance from a center position of the member to a center position of the predetermined part that is shorter than 1.5 times the width of the predetermined part in the direction of the distance. A substrate characterized by:

[0107] (Item 6) 5. The substrate according to any one of items 1 to 4, The member is provided on the back side of the portion where the predetermined part is executed. A substrate characterized by:

[0108] (Item 7) 5. The substrate according to any one of items 1 to 4, The member is linear and is provided so as to straddle the predetermined component. A substrate characterized by:

[0109] (Item 8) 5. The substrate according to any one of items 1 to 4, The member is linear and is provided so as to span the region. A substrate characterized by:

[0110] (Item 9) Item 9. The substrate according to any one of items 1 to 8, The member is at least one of a check terminal, a jumper wire, a magnetic body, a through hole, and a notch. A substrate characterized by:

[0111] (Item 10) Item 9. The substrate according to any one of items 1 to 8, the member is a through hole, passing an L-shaped jig through the through hole to deform at least the portion; A substrate characterized by:

[0112] (Item 11) Item 9. The substrate according to any one of items 1 to 8, the member is a through hole, Passing a bifurcated claw through the through hole to deform at least the portion; A substrate characterized by:

[0113] (Item 12) Item 12. The substrate according to any one of items 1 to 11, deforming the at least part of the substrate by the member while the substrate is held by a holder; A substrate characterized by:

[0114] (Item 13) Item 13. The substrate according to item 12, the holding portion is provided with a guide portion that comes into contact with the at least one portion when the at least one portion is deformed by the member; A substrate characterized by:

[0115] (Item 14) Item 14. The substrate according to Item 12 or 13, acquiring information about a force when deforming the at least one portion, and controlling the deformation of the at least one portion based on the information about the force; A substrate characterized by:

[0116] (Item 15) 15. The substrate according to any one of items 12 to 14, controlling the deformation of the at least one portion based on information on a deformation state when the at least one portion is deformed; A substrate characterized by:

[0117] (Item 16) Item 16. The substrate according to any one of items 1 to 15, After heating the substrate, the at least one portion is deformed by the member. A substrate characterized by:

[0118] (Item 17) Item 17. The substrate according to item 16, deforming the at least part of the substrate with the member while cooling the substrate; A substrate characterized by:

[0119] (Item 18) 1. A system comprising: a mechanism for deforming at least a portion of the substrate; a member that comes into contact with the mechanism is provided on the substrate at a position within a predetermined range from a predetermined component that has higher rigidity than the substrate; deforming the at least part using the mechanism and the member; A system characterized by:

[0120] (Item 19) Item 19. A method for manufacturing an article, comprising manufacturing the article using the system according to Item 18.

[0121] (Item 20) 1. A method for controlling a system, comprising: the system comprising: a mechanism for deforming at least a portion of a substrate; a member that comes into contact with the mechanism is provided on the substrate at a position within a predetermined range from a predetermined component that has higher rigidity than the substrate; deforming the at least part using the mechanism and the member; A control method comprising:

[0122] (Item 21) Item 21. A control program that can execute the control method according to Item 20 by a computer.

[0123] (Item 22) 22. A computer-readable recording medium having the control program according to item 21 recorded thereon. [Explanation of symbols]

[0124] 1 board 2. Highly rigid parts 3 Pulling parts 4 Pressing parts 5 Linear pull parts 6 Unmountable Area 7 Magnetic attraction parts 8 through holes 9 Cutout 10 Board holding part 11 Suction pad 12 Support part 13 Board holding bracket 20 Pulling mechanism 21 Pulling jig 22, 32, 52, 62, 73 Z-direction drive unit 23, 63 X-direction drive unit 24, 33, 53 Abutment guide 25 Protrusion 26 Displacement meter 30 Pressing mechanism 31 Pressing jig 50 Magnetic attraction mechanism 51 Magnet 60 Through-hole pull-in mechanism 61 Through-hole pull-in jig 64 θZ rotation drive unit 65 Through-hole pull-in jig 66, 67 Grabbing claws 68 Fulcrum 69 Claw drive unit 70 Substrate lifting mechanism 71 PCB lifting part 72 Y-direction gripping chuck 100 control device 101 Case parts 102 Adhesive 110 Pneumatic means 1000 systems

Claims

1. A substrate, a member capable of deforming at least a part of the substrate on which a predetermined component having a higher rigidity than the substrate is mounted, provided at a position within a predetermined range from the predetermined component; A substrate characterized by:

2. The substrate according to claim 1 , The member can locally deform the at least part. A substrate characterized by:

3. The substrate according to claim 1 , Pulling or pushing the member to deform the at least part. A substrate characterized by:

4. The substrate according to claim 1 , the predetermined component has a higher Young's modulus than the substrate; A substrate characterized by:

5. The substrate according to claim 1 , The distance from the center position of the member to the center position of the predetermined part is shorter than 1.5 times the width of the predetermined part in the direction of the distance. A substrate characterized by:

6. The substrate according to claim 1 , The member is provided on the back side of the portion where the predetermined part is executed. A substrate characterized by:

7. The substrate according to claim 1 , The member is linear and is provided so as to straddle the predetermined component. A substrate characterized by:

8. The substrate according to claim 1 , The member is linear and is provided so as to span the region. A substrate characterized by:

9. The substrate according to claim 1 , The member is at least one of a check terminal, a jumper wire, a magnetic body, a through hole, and a notch. A substrate characterized by:

10. The substrate according to claim 1 , the member is a through hole, passing an L-shaped jig through the through hole to deform at least the portion; A substrate characterized by:

11. The substrate according to claim 1 , the member is a through hole, Passing a bifurcated claw through the through hole to deform at least the portion; A substrate characterized by:

12. The substrate according to claim 1 , deforming the at least part of the substrate by the member while the substrate is held by a holder; A substrate characterized by:

13. The substrate according to claim 12, the holding portion is provided with a guide portion that comes into contact with the at least one portion when the at least one portion is deformed by the member; A substrate characterized by:

14. The substrate according to claim 12, acquiring information about a force when deforming the at least one portion, and controlling the deformation of the at least one portion based on the information about the force; A substrate characterized by:

15. The substrate according to claim 12, controlling the deformation of the at least one portion based on information on a deformation state when the at least one portion is deformed; A substrate characterized by:

16. The substrate according to claim 1 , After heating the substrate, the at least one portion is deformed by the member. A substrate characterized by:

17. 17. The substrate of claim 16, deforming the at least part of the substrate with the member while cooling the substrate; A substrate characterized by:

18. 1. A system comprising: a mechanism for deforming at least a portion of the substrate; a member that comes into contact with the mechanism is provided on the substrate at a position within a predetermined range from a predetermined component that has higher rigidity than the substrate; deforming the at least part using the mechanism and the member; A system characterized by:

19. A method for manufacturing an article, comprising manufacturing the article using the system according to claim 18.

20. 1. A method for controlling a system, comprising: the system comprising: a mechanism for deforming at least a portion of a substrate; a member that comes into contact with the mechanism is provided on the substrate at a position within a predetermined range from a predetermined component that has higher rigidity than the substrate; deforming the at least part using the mechanism and the member; A control method comprising:

21. A control program that enables a computer to execute the control method according to claim 20.

22. A computer-readable recording medium on which the control program according to claim 21 is recorded.

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