Jig and method for mounting structure

Abstract

To provide a jig used for mounting a structure in which a plurality of substrates are three dimensionally joined.SOLUTION: The jig 20 according to the present disclosure includes a first substrate 5 having a first surface 5a joined to a joining member and a second substrate 7 having a second surface 7a extending to intersect the first surface 5a, and is used for mounting a structure 30 in which the first substrate 5 and the second substrate 7 are joined to each other, and includes a first holding member 21 including a first holding surface 21a and a second holding surface 21b, a second holding member 22 including a third holding surface 22a, and a third holding member 23 detachably fixed to the first holding member 21. The structural body 30 is held such that the first holding surface 21a of the first holding member 21 is in contact with the first back surface 5b, the second holding surface 21b is in contact with one side surface of the first substrate 5 and one side surface of the second substrate 7, the third holding surface 22a of the second holding member 22 is in contact with the second back surface, and the third holding member 23 faces the third holding surface 22a, is in contact with the first end portion of the first substrate 5, and is fixed to the first holding member 21.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present disclosure relates to a mounting jig for a structure and a mounting method for a structure. [Background technology]

[0002] In recent years, commercial services using fifth-generation (5G) mobile communication systems have been launched, and as a fundamental technology that supports industry and society, it is expected to further accelerate the sophistication of multimedia services and provide new value.With the advancement of 5G society, there is an increasing demand for smaller and lighter electronic devices that make up mobile communication systems, such as smartphones and millimeter-wave antenna modules for base stations.

[0003] Electronic devices are equipped with printed circuit boards on which electronic components are mounted. However, as electronic devices become smaller and lighter, the space within the electronic devices for housing the printed circuit boards continues to shrink, and there is a demand for further miniaturization of printed circuit boards on which electronic components are mounted.

[0004] Various methods have been proposed and put into practical use to further miniaturize printed circuit boards on which electronic components are mounted. For example, one known effective method is to three-dimensionally bond multiple printed circuit boards on which electronic components are mounted, and then install the resulting three-dimensional structure inside the electronic device, so as to effectively utilize the narrow space inside the electronic device. To bond multiple printed circuit boards three-dimensionally to create a three-dimensional structure, for example, a mounting jig is used to fix the multiple printed circuit boards in three dimensions.

[0005] Conventionally, jigs used to secure printed circuit boards and mount electronic components include jigs that secure printed circuit boards with heat-resistant tape attached to the jig, and jigs that secure printed circuit boards with fixing claws or guide pins.

[0006] For example, Patent Document 1 discloses a reflow jig that is constructed so that a fixed guide pin and a movable guide pin are inserted into guide holes provided in a printed circuit board, and the printed circuit board is fixed and held in place by the elastic force of the spring of the movable guide pin. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Utility Model Registration No. 3170086 Summary of the Invention [Problem to be solved by the invention]

[0008] However, the reflow jig in Patent Document 1 is designed to be used to mount electronic components by fixing a printed circuit board in a flat state, and this design cannot be applied to mounting a structure in which multiple boards are joined three-dimensionally.

[0009] Therefore, the present disclosure is intended to solve the above-mentioned conventional problems, and aims to provide a jig used in mounting a structure in which multiple substrates are bonded three-dimensionally. [Means for solving the problem]

[0010] In order to achieve the above-mentioned object, a jig according to one embodiment of the present disclosure is a jig used for mounting a structure in which the first substrate and the second substrate are joined via the joining member, the jig including: a first holding member including a first holding surface and a second holding surface that intersect and extend adjacent to each other; a second holding member including a third holding surface that intersects and extends adjacent to the first holding surface and the second holding surface; and one or more third holding members removably fixed to the first holding member, the jig holding the structure such that the first holding surface of the first holding member abuts a first back surface opposite the first surface, the second holding surface abuts one side of the first substrate and one side of the second substrate, the third holding surface of the second holding member abuts a second back surface opposite the second surface, and the third holding member abuts a first end of the first substrate opposite the third holding surface and is fixed to the first holding member. [Effects of the Invention]

[0011] According to one aspect of the present disclosure, it is possible to provide a jig used for mounting a structure in which a plurality of substrates are bonded in three dimensions. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view showing an example of a structure according to a first embodiment; [Figure 2] Top view of the structure of Figure 1 [Figure 3] A side view of the structure of Figure 1 [Figure 4] An exploded side view showing an example of the structure of Figure 1 before mounting. [Figure 5A] FIG. 1 is a top view showing a configuration example of a jig according to the first embodiment; [Figure 5B] 5B is a side view showing an example of the configuration of the jig shown in FIG. 5A; [Figure 5C] 5B is another side view showing the configuration example of the jig of FIG. 5A . [Figure 6A] FIG. 10 is a top view showing a configuration of a modified example of the jig according to the first embodiment. [Figure 6B] 6B is a side view showing an example of the configuration of the jig shown in FIG. 6A; [Figure 6C]Another side view showing a configuration example of the jig in FIG. 6A [Figure 7] Top view showing the state in which the structure according to Embodiment 1 is held by the jig [Figure 8] Side cross-sectional view taken along the cutting line D-D of FIG. 7 showing the state in which the structure according to Embodiment 1 is held by the jig [Figure 9] Flowchart showing an example of the mounting process of the structure according to Embodiment 1 [Figure 10A] Top schematic view showing an example of the mounting process of the structure according to Embodiment 1 [Figure 10B] Side cross-sectional schematic view taken along the cutting line E0-E0 of FIG. 10A showing an example of the mounting process of the structure according to Embodiment 1 [Figure 11A] Top schematic view showing an example of the mounting process of the structure according to Embodiment 1 [Figure 11B] Side cross-sectional schematic view taken along the cutting line E1-E1 of FIG. 11A showing an example of the mounting process of the structure according to Embodiment 1 [Figure 12A] Top schematic view showing an example of the mounting process of the structure according to Embodiment 1 [Figure 12B] Side cross-sectional schematic view taken along the cutting line E2-E2 of FIG. 12A showing an example of the mounting process of the structure according to Embodiment 1 [Figure 13A] Top schematic view showing an example of the mounting process of the structure according to Embodiment 1 [Figure 13B] Side cross-sectional schematic view taken along the cutting line E3-E3 of FIG. 13A showing an example of the mounting process of the structure according to Embodiment 1 [Figure 13A1] Top schematic view showing an example of the mounting process of the structure according to Embodiment 1 [Figure 13B1] Side cross-sectional schematic view taken along the cutting line E31-E31 of FIG. 13A1 showing an example of the mounting process of the structure according to Embodiment 1 [Figure 13A2] Top schematic view showing an example of the mounting process of the structure according to Embodiment 1 [Figure 13B2] Side cross-sectional schematic view taken along the cutting line E32-E32 of FIG. 13A2 showing an example of the mounting process of the structure according to Embodiment 1 [Figure 14A] 1 is a schematic top view illustrating an example of a mounting process for a structure according to Embodiment 1; [Figure 14B] 14B is a schematic side cross-sectional view taken along the line E4-E4 in FIG. 14A, showing an example of a mounting process for the structure according to the first embodiment; [Figure 15A] 1 is a schematic top view illustrating an example of a mounting process for a structure according to Embodiment 1; [Figure 15B] 15B is a schematic side cross-sectional view taken along the line E5-E5 in FIG. 15A, showing an example of a mounting process for the structure according to the first embodiment; DETAILED DESCRIPTION OF THE INVENTION

[0013] According to a first aspect of the present disclosure, there is provided a jig used for mounting a structure including a first substrate having a first surface bonded to a bonding member and a second substrate having a second surface extending intersecting the first surface, wherein the first substrate and the second substrate are bonded via the bonding member, the jig comprising: a first holding member including a first holding surface and a second holding surface that intersect and extend adjacent to each other; a second holding member including a third holding surface that intersects and extends adjacent to the first holding surface and the second holding surface; and one or more third holding members removably fixed to the first holding member, wherein the first holding surface of the first holding member abuts a first back surface opposite the first surface, the second holding surface abuts one side of the first substrate and one side of the second substrate, and the third holding surface of the second holding member abuts a second back surface opposite the second surface, and the third holding member abuts a first end of the first substrate opposite the third holding surface and is fixed to the first holding member.

[0014] According to this aspect, it is possible to provide a jig that is used for mounting a structure in which a plurality of substrates are bonded three-dimensionally.

[0015] According to a second aspect of the present disclosure, there is provided the jig according to the first aspect, wherein the first holding member is disposed on the third holding surface.

[0016] According to a third aspect of the present disclosure, the first holding member and the second holding member form a slit between a first side on the first holding surface and a second side on the third holding surface, and the jig according to the first or second aspect is provided that holds the structure such that a second end portion of the first substrate facing the first end portion is positioned within the slit.

[0017] According to a fourth aspect of the present disclosure, the first holding member is disposed on the third holding surface, the second holding member includes an opening, and the slit is located within the opening, providing the jig according to the third aspect.

[0018] According to a fifth aspect of the present disclosure, the opening penetrates the second holding member, providing the jig according to the fourth aspect.

[0019] According to a sixth aspect of the present disclosure, when the width between the first side and the second side of the slit is T and the thickness between the first surface and the first back surface of the first substrate is t, a jig according to any one of the third to fifth aspects is provided that satisfies t < T < t + 0.2 mm.

[0020] According to a seventh aspect of the present disclosure, in a state where the structure is held, when the sum of the lengths in a direction parallel to the intersection line between the first holding surface and the third holding surface of the projection of the surface that abuts against the first end portion of one or more third holding members on the first holding surface is M, and the length of the first substrate in a direction parallel to the intersection line between the first holding surface and the third holding surface is m, a jig according to any one of the first to sixth aspects is provided that satisfies M > m × 0.2.

[0021] According to an eighth aspect of the present disclosure, one or both of the first holding surface and the third holding surface include one or more recesses or openings, and the one or more recesses or openings hold the structure so as to receive a member disposed on the first back surface or the second back surface, providing the jig according to any one of the first to seventh aspects.

[0022] According to a ninth aspect of the present disclosure, a jig according to any one of the first to eighth aspects is provided, which is made of a material having a heat resistance of 150 °C or higher.

[0023] According to a tenth aspect of the present disclosure, there is provided a method for mounting a structure using a jig described in any one of the first to ninth aspects, the method including the steps of attaching a first substrate and a second substrate to the jig, constructing a structure using the first substrate and the second substrate attached to the jig, holding the constructed structure, and joining the held structure.

[0024] According to an eleventh aspect of the present disclosure, there is provided a method according to the tenth aspect, wherein the step of attaching the first substrate and the second substrate to a jig includes: positioning the first substrate so that its first back surface abuts against the first holding surface and one side surface of the first substrate abuts against the second holding surface; and positioning the second substrate so that its second back surface abuts against the third holding surface and one side surface of the second substrate abuts against the second holding surface.

[0025] According to a twelfth aspect of the present disclosure, there is provided a method according to the tenth or eleventh aspect, wherein the step of constructing a structure using a first substrate and a second substrate attached to a jig includes positioning the first substrate and the second substrate attached to the jig so as to connect a joining member to the second surface.

[0026] According to a thirteenth aspect of the present disclosure, there is provided a method according to the twelfth aspect, wherein the first holding member and the second holding member form a slit between a first side on the first holding surface and a second side on the third holding surface, and the step of forming a structure using the first substrate and the second substrate attached to the jig further includes positioning a second end of the first substrate attached to the jig, the second end facing the first end, within the slit.

[0027] According to a fourteenth aspect of the present disclosure, there is provided a method according to any one of the tenth to thirteenth aspects, wherein the step of holding the configured structure includes fixing a third holding member to the first holding member by abutting the first end of the first substrate opposite the third holding surface.

[0028] According to a fifteenth aspect of the present disclosure, there is provided a method according to any one of the tenth to fourteenth aspects, wherein the step of bonding the held structure includes subjecting the held structure to a thermal reflow to bond the bonding member to the second surface.

[0029] Any of the above-described various embodiments may be combined appropriately to achieve the effects of each of them.

[0030] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, more detailed explanation than necessary may be omitted. For example, detailed explanation of well-known matters or redundant explanation of substantially the same configuration may be omitted. This is to avoid unnecessary redundancy in the following explanation and to facilitate understanding by those skilled in the art.

[0031] A jig used to mount a structure according to a first embodiment of the present disclosure, and a method for mounting a structure using the jig, will be described with reference to FIGS. 1 to 15B. The accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims. Furthermore, in each drawing, elements are exaggerated for ease of explanation. Note that substantially identical components in the drawings are designated by the same reference numerals.

[0032] First Embodiment (Structure configuration) The configuration of an example of a structure according to a first embodiment of the present disclosure will be described with reference to Figs. 1 to 4. Fig. 1 is a perspective view showing an example of a structure 30 according to the first embodiment. Fig. 2 is a top view of the structure 30 of Fig. 1 taken along the XZ plane. Fig. 3 is a side view of the structure 30 of Fig. 1 taken along the YZ plane. Fig. 4 is an exploded view showing an example of the structure 30 of Fig. 1 in a state before mounting.

[0033] The structure 30 shown in FIG. 1 is an example of a three-dimensional structure according to this embodiment, such as an antenna module formed by three-dimensionally bonding two printed circuit boards. In this embodiment, the structure 30 includes a first substrate 5 and a second substrate 7, which are three-dimensionally bonded together via a bonding member 15. As shown in the figure, in the structure 30, the surface 5a of the first substrate 5 extends parallel to the XY plane, and the surface 7a of the second substrate 7 can extend in a plane intersecting with the surface 5a. In this embodiment, the surface 7a is perpendicular to the surface 5a and extends parallel to the XZ plane. The surfaces 5a and 7a are bonded together via the bonding member 15 to form the three-dimensional structure 30.

[0034] The first substrate 5 is a printed circuit board, and in this embodiment, it may be, for example, an antenna substrate. The first substrate 5 can be fabricated using, for example, "MEGTRON7," a multilayer substrate material manufactured by Panasonic Industries Co., Ltd., as a base material, but is not limited to "MEGTRON7." For example, the first substrate 5 can also be fabricated using other glass epoxy materials or ceramic materials as a base material. The shape and dimensions of the first substrate 5 can be tailored to the application. In this embodiment, the first substrate 5 has a rectangular shape in the XY plane, and is fabricated with a length in the Y direction of approximately 4 mm, a length m in the X direction of approximately 40 mm, and a thickness t in the Z direction of approximately 0.8 mm.

[0035] In this embodiment, as shown in Figures 2 and 3, the first substrate 5 can include a plurality of circuit electrodes 6 arranged on the surface 5a and a plurality of patch antenna elements 13 arranged on the back surface 5b opposite the surface 5a.

[0036] In the illustrated configuration example, five patch antenna elements 13 are arranged on the rear surface 5b of the first substrate 5. The five patch antenna elements 13 are arranged at equal intervals along the Y direction in the figure, and each patch antenna element 13 can be made of, for example, copper foil with a thickness of 18 μm, and has a rectangular shape with dimensions of 2 mm × 2 mm. However, the present disclosure is not limited to the shape, dimensions, number, or arrangement of the patch antenna elements.

[0037] The plurality of circuit electrodes 6 arranged on the front surface 5a of the first substrate 5 are electrically connected to the plurality of patch antenna elements 13 on the back surface 5b by, for example, through holes, and can feed power to the patch antenna elements 13. Although not shown, the first substrate 5 may further include other members arranged on the front surface 5a or the back surface 5b in addition to the patch antenna elements 13 and the circuit electrodes 6.

[0038] The second substrate 7 is a printed circuit board, and in this embodiment, it may be, for example, a circuit control board, and may include circuit components that form a signal circuit or a power supply circuit. In this embodiment, for example, the second substrate 7 includes circuit electrodes 8 mounted on the surface 7a. The shape and dimensions of the second substrate 7 can be prepared according to the application. In this embodiment, the second substrate 7 has a rectangular shape in the XZ plane, and is prepared with a length in the X direction shown in the figure, a length in the Z direction shown in the figure of approximately 40 mm, a length in the Z direction shown in the figure of approximately 80 mm, and a thickness in the Y direction shown in the figure. Although not shown, the second substrate 7 may further include other components arranged on the surface 7a or the back surface 7b in addition to the circuit electrodes 8 on the surface 7a.

[0039] The first substrate 5 and the second substrate 7 are bonded at their surfaces 5a and 7a via a bonding member 15. In this embodiment, the bonding member 15 may include, but is not limited to, an insulator 9 and a bonding electrode 10, for example, as shown in FIGS.

[0040] The insulator 9 can be made of an insulating resin. For example, in this embodiment, the insulator 9 is made of LCP (liquid crystal polymer) having a dielectric constant of 4.3 and a dielectric dissipation factor of 0.015, and has a width of approximately 1.0 mm in the Y direction, a width of approximately 2.0 mm in the Z direction, and a length of approximately 40 mm in the X direction. However, the present disclosure is not limited to the material or dimensions of the insulator 9. For example, the insulator 9 may have any dimensions and may be made of insulating materials other than LCP (liquid crystal polymer), such as PPA (polyphthalamide), ABS (acrylonitrile-butadiene-styrene copolymer synthetic resin), PEEK (polyether ether ketone resin), or PC (polycarbonate resin).

[0041] In this embodiment, the bonding electrode 10 includes a conductive layer of copper (Cu) having a thickness of 10 μm, nickel (Ni) having a thickness of 0.2 μm, and gold (Au) having a thickness of 0.05 μm, and is formed by a plating method, but the present disclosure is not limited to this. The bonding electrode 10 may include other conductive layers and may be formed by, for example, conductive resin printing, dispense coating, or other methods.

[0042] The bonding electrode 10 is bonded to the circuit electrode 6 of the first substrate 5 by a first bonding material 11, and to the circuit electrode 8 of the second substrate 7 by a second bonding material 12. In this embodiment, the first bonding material 11 and the second bonding material 12 are made of metal materials. Although not limited thereto, the first bonding material 11 can be, for example, a solder having a melting point of approximately 220°C and a composition of Sn-3.0Ag-0.5Cu, and the second bonding material 12 can be, for example, a Sn—Bi based solder having a melting point of approximately 140°C.

[0043] 4 shows an example of the state before mounting of the structure 30 shown in FIGS. 1 to 3. As shown in the figure, in this embodiment, before mounting the structure 30, a bonding member 15 is bonded to the surface 5a of the first substrate 5 in advance, and at this time, the circuit electrode 6 and the bonding electrode 10 are bonded by a first bonding material 11. Meanwhile, a circuit electrode 8 is disposed on the surface 7a of the second substrate 7, and a second bonding material 12 is disposed on the upper surface of the circuit electrode 8.

[0044] In the mounting process of the structure 30, in the step of constructing the structure 30, the first substrate 5 and the second substrate 7, which extend so as to intersect with each other, are aligned so that their surfaces 5a and 7a are connected via the bonding member 15. Subsequently, in the bonding step, the bonding member 15 bonded to the surface 5a of the first substrate 5 is bonded to the surface 7a of the second substrate 7 via the second bonding material 12 and the circuit electrodes 8, thereby completing the three-dimensional structure 30. The mounting process of the three-dimensional structure 30 will be described in detail later. Below, the configuration of a jig used to mount the structure 30 in which such multiple substrates are bonded three-dimensionally will be described.

[0045] (Configuration of the jig for mounting the structure) The configuration of a jig for mounting structure 30 according to embodiment 1 of the present disclosure will be described with reference to FIGS. 5A to 8. FIG. 5A is a plan view showing an example of the configuration of jig 20 according to embodiment 1. FIG. 5B is a side view in the YZ plane showing the example of the configuration of jig 20 of FIG. 5A. FIG. 5C is a side view in the XY plane showing the example of the configuration of jig 20 of FIG. 5A. FIG. 6A is a plan view showing a modified example of jig 20A according to embodiment 1. FIG. 6B is a side view in the YZ plane showing the example of the configuration of jig 20A of FIG. 6A. FIG. 6C is a side view in the XY plane showing the example of the configuration of jig 20A of FIG. 6A. FIG. 7 is a top view showing a state in which structure 30 according to embodiment 1 is held by jig 20. FIG. 8 is a side cross-sectional view taken along section line DD in FIG. 7, showing a state in which structure 30 according to embodiment 1 is held by jig 20.

[0046] 5A-5C includes a first holding member 21, a second holding member 22, and one or more third holding members 23. The first holding member 21 and the second holding member 22 are fixed to each other, and can be fixed by, for example, but not limited to, adhesive or a connecting member. Note that the first holding member 21 and the second holding member 22 do not necessarily have to be in contact with each other. The one or more third holding members 23 can be removably fixed to the first holding member 21.

[0047] As shown in the figure, first holding member 21 of jig 20 includes first holding surface 21a and second holding surface 21b, which extend adjacent to and intersect with each other. In this embodiment, as shown in the figure, first holding member 21 is formed of a block having two substantially L-shaped sides, with first holding surface 21a extending parallel to the XY plane and second holding surface 21b extending parallel to the YZ plane.

[0048] The second holding member 22 includes a third holding surface 22a, which extends adjacent to and intersects with the first holding surface 21a and the second holding surface 21b. In this embodiment, as shown in the figure, the second holding member 22 is a rectangular flat plate that is substantially perpendicular to the first holding surface 21a and the second holding surface 21b, and the third holding surface 22a extends parallel to the XZ plane. In addition, in the jig 20 of this embodiment, the first holding member 21 is disposed on the third holding surface 22a, and the end surface 21d on the -Y side of the first holding member 21 is disposed adjacent to the third holding surface 22a.

[0049] In FIG. 5B, the height H1 of the first holding member 21 is configured to be greater than the height H1 of the second holding member 22 in the Y direction, but the present disclosure is not limited to the height of the first holding member 21 or the second holding member 22. The first holding member 21 and the second holding member 22 may have the same height in the Y direction, or may have different heights. Furthermore, the present disclosure is not limited to the respective sizes of the first holding member 21 and the second holding member 22, or the dimensions of their respective holding surfaces. These can be designed appropriately depending on the application.

[0050] In the jig 20, the second holding member 22 of the jig 20 has an opening 24 adjacent to the first holding member 21. The first holding member 21 is disposed on the third holding surface 22a so as to cover a portion of the opening 24. This allows a slit 25 to be formed between the first holding member 21 and the second holding member 22. The slit 25 is configured so that its first side 25a is on the first holding surface 21a and its second side 25b is on the third holding surface 22a. The slit 25 is located within the opening 24 in the XZ plane, and the width T between the two sides 25a and 25b in the Z direction is smaller than the width T1 of the opening 24, and the length L in the X direction is smaller than the length L1 of the opening 24. Note that while FIG. 5B shows the opening 24 penetrating the second holding member 22, the present disclosure is not limited thereto. The opening 24 may also be configured not to penetrate the second holding member 22.

[0051] The third holding member 23 is used to hold the structure to be mounted on the jig, and can be removably fixed to the first holding member 21. FIGS. 5A-5C show the arrangement of the third holding member 23 when holding the structure. At this time, the third holding member 23 faces the third holding surface 22a and is adjacent to the first holding surface 21a, and can be fixed to the first holding member 21 by, for example, screwing. Note that the present disclosure is not limited to the method of fixing the third holding member 23. The third holding member 23 can also be fixed to the first holding member 21 by other methods, such as adhesive.

[0052] 5A-5C conceptually illustrate the third holding member 23, depicting it as a block-like member abutting the first holding surface 21a and the +Y-side end surface 21c of the first holding member 21; however, the present disclosure is not limited thereto. The third holding member 23 can be configured in any shape. Furthermore, while FIG. 5B depicts the third holding member 23 abutting the first holding surface 21a and the +Y-side end surface 21c of the first holding member 21 when secured to the first holding member 21, the present disclosure is not limited thereto. For example, the third holding member 23 can be secured to the first holding member 21 by abutting only the end surface 21c. Furthermore, while FIGS. 5A-5C depict two third holding members 23, the present disclosure is not limited to the number of third holding members 23 or the position at which they are disposed in contact with the end surface 5d of the first substrate 5. The third holding member 23 may be one or more. Furthermore, when a plurality of third holding members 23 are provided, each third holding member 23 may be configured to have a different shape and / or size, and may be spaced apart as appropriate.

[0053] The jig 20 may further include one or more recesses or openings 26 provided in the third holding surface 22a of the second holding member 22. The one or more recesses or openings 26 can receive components arranged on the back surface 7b of the second substrate 7 when the structure 30 is mounted. Note that, although not shown, the jig 20 may further include one or more recesses or openings provided in the first holding surface 21a of the first holding member 21. These recesses or openings can receive components arranged on the back surface 5b of the first substrate 5 when the structure 30 is mounted.

[0054] (Configuration of a modified jig) A modified jig 20A shown in Figures 6A to 6C includes a first holding member 21A, a second holding member 22A, and one or more third holding members 23. The first holding member 21A and the second holding member 22A are fixed to each other, and the one or more third holding members 23 can be removably fixed to the first holding member 21A. The configuration of jig 20A differs from the configuration of jig 20 shown in Figures 5A to 5C in that the first holding member 21A is not disposed on the third holding surface 22a1. In Figures 6A to 6C, components that are substantially the same as the components of jig 20 are denoted by the same reference numerals as in Figures 5A to 5C.

[0055] First holding member 21A of jig 20A includes first holding surface 21a1 and second holding surface 21b1, which extend adjacent to and intersect with each other. In this embodiment, first holding member 21A is formed of a block having two substantially L-shaped sides, similar to first holding member 21 of jig 20, with first holding surface 21a1 extending parallel to the XY plane and second holding surface 21b1 extending parallel to the YZ plane.

[0056] Second holding member 22A includes third holding surface 22a1, which extends adjacent to and intersects with first holding surface 21a1 and second holding surface 21b1. In the present embodiment, as shown in the figure, second holding member 22A is a flat plate that is substantially perpendicular to first holding surface 21a1 and second holding surface 21b1, and third holding surface 22a1 extends parallel to the XZ plane.

[0057] As shown in the figure, in jig 20A, first holding member 21A and second holding member 22A are combined in the XZ plane to form slit 25A therebetween. Slit 25A is configured so that first side 25a1 is on first holding surface 21a1 and second side 25b1 is on third holding surface 22a1. Slit 25A has a width Ta between both sides 25a1, 25b1 in the Z direction and a length La in the X direction equal to the length of first holding surface 21a1 in the X direction. In jig 20A, slit 25A is configured to penetrate second holding member 22.

[0058] Other configurations of the jig 20A are similar to those of the jig 20, so detailed description thereof will be omitted.

[0059] (Maintaining the structure) 7 and 8 show the state in which the structure 30 shown in Figures 1 to 4 is held using the jig 20. Note that Figures 7 and 8 do not show the members disposed on the back surface of the first substrate 5 or the second substrate 7 of the structure 30, nor do they show, for example, the recesses or openings 26 in the third holding surface 22a of the second holding member 22 shown in Figures 5A to 5C or 6A to 6C for receiving these members.

[0060] 7, when the structure 30 is held by the jig 20, the back surface 5b of the first substrate 5 of the structure 30 abuts against the first holding surface 21a of the first holding member 21 of the jig 20, and the side surface 5c abuts against the second holding surface 21b of the first holding member 21. This allows the first substrate 5 to be positioned and attached in the Z direction and the X direction.

[0061] In this specification, "contact" refers not only to a state in which the surface of the first member and the surface of the second member are in direct contact with each other, but also to a state in which the surface of the first member and the surface of the second member are in contact with each other via a component included in the first member or the second member. For example, in this embodiment, as shown in Fig. 7, first substrate 5 is in contact with first holding surface 21a of first holding member 21 via patch antenna element 13 arranged on back surface 5b.

[0062] 7, the back surface 7b of the second substrate 7 of the structure 30 abuts against the third holding surface 22a of the second holding member 22 of the jig 20, and the side surface 7c abuts against the second holding surface 21b of the first holding member 21. This allows the second substrate 7 to be positioned and attached in the Y and X directions.

[0063] Next, the first substrate 5 and the second substrate 7 attached to the jig 20 can be further aligned in the Y and Z directions. Specifically, for example, the first substrate 5 can be moved along the first holding surface 21a of the first holding member 21, and the second substrate 7 can be moved along the third holding surface 22a of the second holding member 22, until the second bonding material 12 arranged on the upper surface of the circuit electrode 8 and the bonding electrode 10 of the bonding member 15 are connected. In this way, by positioning the first substrate 5 and the second substrate 7 so that they are connected via the bonding member 15 at the surfaces 5a and 7a, the structure 30 can be formed in the jig 20.

[0064] With the first substrate 5 and the second substrate 7 positioned, as shown in FIG. 8 , the third holding member 23 of the jig 20 faces the third holding surface 22a and can be fixed to the first holding member 21 by abutting against the end 5d of the first substrate 5 on the +Y side. In this embodiment, for example, the third holding member 23 is fixed to the first holding member 21 by abutting against the side surface of the end 5d of the first substrate 5. This allows the structure 30 to be held to the jig 20. Note that the present disclosure is not limited to the shape of the third holding member 23. The third holding member 23 only needs to be fixed to the first holding member 21 by abutting against the end 5d of the first substrate 5, and is not necessarily fixed to the side surface of the end 5d of the first substrate 5. The third holding member 23 can be configured with a shape and dimensions designed according to, for example, the shape and dimensions of the first substrate 5.

[0065] As mentioned above, in the process of mounting a structure, the substrates that make up the structure are aligned and then the bonding process is performed. During the bonding process, the high heat applied to the substrate to melt and harden the bonding material can cause warping of the printed circuit board. Warping can lead to poor connections, such as components on the board being bent or not being bonded correctly in the intended location, which can result in poor quality of the mounted structure. Therefore, it is desirable for the jig used in mounting the structure to have the function of suppressing warping of the printed circuit board.

[0066] In this embodiment, the thickness of the first substrate 5 is approximately 0.8 mm, while the thickness of the second substrate 7 is approximately 1.6 mm, so it is thought that the relatively thin first substrate 5 is more likely to warp due to heating during the bonding process. Furthermore, in this embodiment, the bonding member 15 is bonded to the first substrate 5 in advance before the bonding process. Due to the difference in thermal expansion and contraction characteristics between the bonding member 15 and the first substrate 5, the first substrate 5 is more likely to warp due to heating during the bonding process.

[0067] Therefore, in this embodiment, as shown in Figures 7 and 8, the third holding member 23 abuts against the end 5d of the first substrate 5 and is fixed to the first holding member 21, thereby holding the end 5d of the first substrate 5, which is relatively prone to warping, and suppressing warping that may occur during the bonding process.

[0068] Furthermore, generally, the total length of the projection of the surfaces of one or more third holding members 23 that abut against the end 5d of the first substrate 5 onto the first holding surface 21a in a direction parallel to the intersection line between the first holding surface 21a and the third holding surface 22a is defined as M. The length of the first substrate 5 in a direction parallel to the intersection line between the first holding surface 21a and the third holding surface 22a is defined as m. In this case, in order to hold the end 5d of the first substrate 5 more stably, it is desirable to configure the jig 20 so that M>m×0.2 is satisfied.

[0069] In this embodiment, as shown in the figure, two third holding members 23 are substantially in contact with the side surface parallel to the X-Z plane of the end portion 5d of the first substrate 5, and the intersection line of the first holding surface 21a and the third holding surface 22a is parallel to the X direction. Also, the lengths M1 and M2 in the X direction of the surfaces of the two third holding members 23 that contact the end portion 5d of the first substrate 5 were both 10 mm. At this time, the total length M = M1 + M2 = 20 mm, the length m of the first substrate 5 in the X direction was 40 mm, and m × 0.2 = 8 mm. Therefore, the relationship M > m × 0.2 is satisfied, and the end portion 5d of the first substrate 5 can be held more stably, and warping can be suppressed.

[0070] Furthermore, in this embodiment, a slit 25 is formed between the first holding member 21 and the second holding member 22 of the jig 20. As shown in FIGS. 7-8, when mounting the structure 30, the jig 20 can hold the structure 30 such that the end portion 5e on the -Y side of the first substrate 5 is located within the slit 25. Thereby, the end portion 5e of the first substrate 5 is held within the slit 25, and warping that may occur in the bonding process can be further suppressed.

[0071] Also, in order to hold the end portion 5e of the first substrate 5 more stably, generally, when the width between the first side 25a and the second side 25b of the slit 25 is T and the thickness between the front surface 5a and the back surface 5b of the first substrate 5 is t, it is desirable to configure the jig 20 so as to satisfy t < T < t + 0.2 mm. In this embodiment, the thickness of the first substrate 5 is 0.8 mm, the slit 25 is configured with a width T of 0.9 mm, and the relationship t < T < t + 0.2 mm is satisfied. Note that the thickness of the patch antenna element 13 on the back surface 5b of the first substrate 5 is 18 μm, and the first substrate 5 contacts the first holding surface 21a via the patch antenna element 13, ensuring positioning in the Z direction and holding the end portion 5e within the slit 25, and warping can be suppressed.

[0072] In this way, jig 20 can effectively suppress warping of first substrate 5, which is more susceptible to warping due to heating during the bonding process, by holding end 5d with third holding member 23 and further holding end 5e with slit 25. In this way, the bonding accuracy of the structure can be improved in the bonding process, and the quality of the mounted structure can be enhanced.

[0073] The present disclosure is not limited to the length L in the X direction (shown in FIG. 7) or the depth H in the Y direction (shown in FIG. 8) of the slit 25. The length L in the X direction and the depth H in the Y direction of the slit 25 can be configured according to the dimensions of the first substrate 5 and the position of the bonding member 15. As described with reference to FIGS. 5A to 5C, the slit 25 can be configured to be located within the opening 24 provided in the second holding member 22 in the XZ plane, with the width T in the Z direction being smaller than the width T1 of the opening 24 and the length L in the X direction being smaller than the length L1 of the opening 24. This allows the slit 25 to be configured to stably hold the first substrate 5 and allows the second holding member 22 to be easily processed.

[0074] Furthermore, the present disclosure is not limited to the position of the end 5e of the first substrate 5 within the slit 25 in the Y direction. The end 5e of the first substrate 5 can be disposed at any depth within the slit 25 depending on the application. When the opening 24 is provided so as to penetrate the second holding member 22, the first substrate 5 can be positioned so that a portion of the end 5e of the first substrate 5 penetrates the second holding member 22 in the Y direction.

[0075] After the structure 30 is held in the jig 20, a bonding process is performed. In the bonding process, the structure 30 is heated while being held in the jig 20, so the jig 20 is made of a heat-resistant material. For example, the jig 20 can be made of a material that can withstand heat of 150°C or higher. In this embodiment, for example, the first, second, and third holding members of the jig 20 can all be made of SUS, but the material of the jig 20 is not limited to SUS. For example, the first, second, and third holding members may be made of a metal material such as aluminum or a resin material such as PPS that can withstand heat of 150°C or higher.

[0076] In this way, structure 30 in which multiple substrates are bonded three-dimensionally can be mounted using jigs 20 and 20A. Furthermore, in the mounting process of structure 30, warping due to heating during the bonding step can be suppressed.

[0077] Next, a mounting process for structure 30 will be described with reference to FIGS. 9 to 15B. FIG. 9 is a flowchart showing an example of a mounting process for structure 30 according to embodiment 1. FIGS. 10A-15B are schematic diagrams showing an example of a mounting process for structure 30 according to embodiment 1. FIGS. 10A, 11A, 12A, 13A, 13A1, 13A2, 14A, and 15A are top views in the XZ plane showing an example of a mounting process for structure 30. FIGS. 10B, 11B, 12B, 13B, 13B1, 13B2, 14B, and 15B are schematic side cross-sectional views in the YZ plane taken along cutting lines E0-E0, E1-E1, E2-E2, E3-E3, E31-E31, E32-E32, E4-E4, and E5-E5 in the corresponding top views, respectively, showing an example of a mounting process for structure 30.

[0078] (3D structure mounting process) 9, the mounting process of the structure 30 can include steps S1 to S5. Each step of the mounting process of the structure 30 using the jig 20 will be described below with reference to the schematic diagrams shown in FIGS.

[0079] (Step S1) In step S1, as shown in FIGS. 10A-10B, jig 20 is prepared. At this time, first holding member 21 is placed on and fixed to third holding surface 22a. In this embodiment, slit 25 is formed between first holding member 21 and second holding member 22. Slit 25 is located within opening 24 provided in second holding member 22, with first side 25a on first holding surface 21a and second side 25b on third holding surface 22a. Slit 25 has length L in the X direction and width T in the Z direction. Length L can be configured to be greater than length m in the X direction of first substrate 5 of structure 30 to be mounted (see FIG. 2), and width T can be configured to be greater than thickness t in the Z direction of first substrate 5 (see FIGS. 2-3). Preferably, first holding surface 21a is configured to be greater than surface 5a of first substrate 5 of structure 30 to be mounted, and third holding surface 22a is configured to be greater than surface 7a of second substrate 7 of structure 30 to be mounted. This allows the first substrate 5 and the second substrate 7 to be attached to the jig 20 more stably in the subsequent attachment process.

[0080] In step S1, the third holding member 23 is removed as shown in the drawing.

[0081] (Step S2) 11A-12B, in step S2, the first substrate 5 and the second substrate 7 constituting the structure 30 to be mounted are attached to a jig 20. At this time, a bonding member 15 is bonded to the front surface 5a of the first substrate 5, and a plurality of patch antenna elements 13 can be arranged on the back surface 5b. In addition, a circuit electrode 8 is arranged on the front surface 7a of the second substrate 7, and a second bonding material 12 is arranged on the upper surface of the circuit electrode 8.

[0082] 11A-12B show that the second substrate 7 is attached to the second holding member 22 (see FIGS. 11A-11B) and then the first substrate 5 is attached to the first holding member 21 (see FIGS. 12A-12B), but the present disclosure is not limited to the order in which the first substrate 5 and the second substrate 7 are attached to the jig 20. For example, it is also possible to attach the second substrate 7 to the second holding member 22 after attaching the first substrate 5 to the first holding member 21.

[0083] 11A-11B, second substrate 7 of structure 30 is positioned so that back surface 7b abuts against third holding surface 22a of second holding member 22 of jig 20 and side surface 7c abuts against second holding surface 21b of first holding member 21. This allows second substrate 7 to be positioned and attached in the Y and X directions.

[0084] 12A-12B, the first substrate 5 of the structure 30 is disposed so that the back surface 5b abuts against the first holding surface 21a of the first holding member 21 of the jig 20 and the side surface 5c abuts against the second holding surface 21b of the first holding member 21. This allows the first substrate 5 to be positioned and attached in the Z direction and the X direction. In this embodiment, the back surface 5b of the first substrate 5 abuts against the first holding surface 21a of the first holding member 21 via the antenna element 13.

[0085] 11B and 12B, in step S2, the -Z side end 7d of the second substrate 7 can be positioned on the third holding surface 22a away from the second side 25b of the slit 25. The -Y side end 5e of the first substrate 5 can be positioned on the first holding surface 21a away from the first side 25a of the slit 25.

[0086] (Step S3) In step S3, as shown in FIGS. 13A - 14B, a structure 30 is formed by a first substrate 5 and a second substrate 7 attached to a jig 20. At this time, as shown by arrows A and B in FIG. 13B, the first substrate 5 and the second substrate 7 are aligned in the Y - direction and the Z - direction so that the joining member 15 is connected to the surface 7a of the second substrate 7 via the circuit electrode 8 and the second joining material 12. Specifically, in the Z - direction, the second substrate 7 is moved along the third holding surface 22a toward the first holding surface 21a, and in the Y - direction, the first substrate 5 is moved along the first holding surface 21a toward the third holding surface 22a. Thereby, as shown in FIGS. 14A - 14B, the first substrate 5 and the second substrate 7 can be positioned such that the joining electrode 10 of the joining member 15 and the second joining material 12 disposed on the upper surface of the circuit electrode 8 are connected.

[0087] Also, in the present embodiment, in step S3, as shown in FIG. 14B, the first substrate 5 can be positioned such that the - Y - side end 5e of the first substrate 5 is located within the slit 25. Also, the second substrate 7 can be positioned such that the - Z - side end 7d of the second substrate 7 is adjacent to the second side 25b of the slit 25. In the present embodiment, for example, the second substrate 7 can be positioned such that the - Z - side end 7d of the second substrate 7 is disposed substantially along the second side 25b of the slit 25. Thereby, the first substrate 5 and the second substrate 7 can be positioned more easily, and the end 5e of the first substrate 5 can be held within the slit 25. As described above, by configuring the jig 20 such that the thickness t of the first substrate 5 and the width T of the slit 25 satisfy t < T < t + 0.2 mm, the first substrate 5 abuts against the first holding surface 21a via the patch antenna element 13, ensuring positioning in the Z - direction, holding the end 5e within the slit 25, and suppressing warping of the substrate.

[0088] 13A1-13B1, in step S2, after the second substrate 7 is attached to the second holding member 22, the second substrate 7 attached to the third holding surface 22a can be moved in the Z direction toward the first holding surface 21a as shown by arrow A in FIG. 13B1 until the end 7d on the -Z side is adjacent to the second side 25b of the slit 25.

[0089] Next, as shown in Figures 13A2-13B2, the first substrate 5 is attached to the first holding member 21, and as shown by arrow B in Figure 13B2, the first substrate 5 attached to the first holding surface 21a can be moved in the Y direction toward the third holding surface 22a, for example, so that the end 5e on the -Y side is positioned within the slit 25, and can be moved to a position where it connects to the second bonding material 12 on the upper surface of the circuit electrode 8 arranged on the surface 7a of the second substrate 7.

[0090] By aligning the first substrate 5 and the second substrate 7 in this manner, as shown in Figures 14A-14B, the first substrate 5 and the second substrate 7 attached three-dimensionally to the jig 20 are connected at the surfaces 5a and 7a via the bonding member 15, thereby forming the structure 30.

[0091] (Step S4) 15A-15B, structure 30 configured on jig 20 is held. At this time, second holding member 23 of jig 20 can be fixed to first holding member 21 by facing third holding surface 22a and abutting against end 5d on the +Y side of first substrate 5.

[0092] As described above, generally, M is the total length of the projection of the surfaces of the two third holding members 23 that abut against the end 5d of the first substrate 5 onto the first holding surface 21a, in a direction parallel to the intersection line between the first holding surface 21a and the third holding surface 22a. m is the length of the first substrate 5 in a direction parallel to the intersection line between the first holding surface 21a and the third holding surface 22a. In this case, by configuring the jig 20 so that M > m × 0.2 is satisfied, the end 5d of the first substrate 5 can be stably held and warping of the substrate can be effectively suppressed.

[0093] In this embodiment, as shown in FIG. 15B , two third holding members 23 substantially abut against side surfaces parallel to the XZ plane of the end portion 5d of the first substrate 5, and the intersection line between the first holding surface 21a and the third holding surface 22a is parallel to the X direction. The lengths of the surfaces of the two third holding members 23 that abut against the end portion 5d of the first substrate 5 in the X direction are M1 and M2, respectively, and the sum of these lengths is M = M1 + M2. In this case, by configuring the jig 20 so that M1 + M2 > m × 0.2 is satisfied, warpage of the first substrate 5 can be effectively suppressed. Note that the present disclosure is not limited to the number, shape, or position of the third holding members 23 abutting against the end portion 5d of the first substrate 5. Furthermore, when multiple third holding members 23 are provided, the third holding members 23 can be configured to have different shapes and / or dimensions and can be spaced apart as appropriate.

[0094] (Step S5) In step S5, the structure 30 held on the jig 20 is bonded. At this time, for example, heat reflow is performed on the structure 30 held on the jig 20 to melt and harden the second bonding material 12 arranged on the upper surface of the circuit electrodes 8, thereby bonding the bonding member 15 bonded to the surface 5a of the first substrate 5 to the surface 7a of the second substrate 7 via the circuit electrodes 8 and the second bonding material 12. The peak temperature of the heat reflow process can be set so as not to exceed the heat resistance temperature of the jig 20.

[0095] In this embodiment, first bonding material 11 is made of, for example, solder having a melting point of approximately 220°C and a composition of Sn-3.0Ag-0.5Cu, but is not limited thereto. Second bonding material 12 is made of, for example, Sn-Bi solder having a melting point of approximately 140°C, but is not limited thereto, and can be formed by screen printing using a metal mask with a thickness of, for example, 120 μm. By using solder with a higher melting point than second bonding material 12 as first bonding material 11, it is possible to prevent first bonding material 11 from remelting due to heat conduction when melting second bonding material 12 during heating reflow.

[0096] The present disclosure is not limited to the compositions or melting points of first bonding material 11 and second bonding material 12. The composition of second bonding material 12 does not necessarily have to be selected so that it has a melting point lower than that of first bonding material 11. For example, in mounting structure 30, if there is no risk of first bonding material 11 remelting due to heat conduction when melting second bonding material 12 during the bonding process, second bonding material 12 can be a material having a melting point and composition similar to those of first bonding material 11, or a material having a melting point and composition higher than those of first bonding material 11.

[0097] Through the above steps, the first substrate 5 and the second substrate 7 can be three-dimensionally bonded via the bonding member 15 using the jig 20 according to the present embodiment, thereby mounting the three-dimensional structure 30. Note that the process of mounting the structure 30 via steps S1 to S5 described above is merely an example, and the mounting of the three-dimensional structure 30 is not limited to this process. Furthermore, the materials and parameters used in the mounting process of the structure 30 are also merely an example and are not limited to the above. Furthermore, although FIGS. 10A to 15B conceptually explain the mounting process of the structure 30 using the jig 20 shown in FIGS. 5A-5C as an example, the present disclosure is not limited thereto. The structure 30 can also be similarly mounted using other jigs having equivalent configurations, such as the jig 20A shown in FIGS. 6A-6C.

[0098] In the above embodiment, an antenna module has been described as an example of the structure 30, but the present disclosure does not limit the mounted three-dimensional structure to an antenna module. Furthermore, the present disclosure is not limited to the configurations, dimensions, etc. of the substrates and bonding members that constitute the mounted three-dimensional structure.

[0099] As described above, the accompanying drawings and detailed description have been provided to explain exemplary embodiments of the technology disclosed herein. Therefore, the components described in the accompanying drawings and detailed description may include not only components essential for solving the problem, but also components that are not essential for solving the problem in order to illustrate the technology. Therefore, the fact that these non-essential components are described in the accompanying drawings or detailed description should not be interpreted as immediately indicating that these non-essential components are essential.

[0100] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various modifications are possible within the scope of the claims, and such modifications and embodiments obtained by appropriately combining the technical means disclosed in the different embodiments are also included in the technical scope of the present disclosure. [Industrial Applicability]

[0101] The present disclosure is applicable to the mounting of printed circuit boards, and is applicable to the mounting of structures in which multiple printed circuit boards are joined in three dimensions. [Explanation of symbols]

[0102] 5 First board 6 circuit electrodes 7 Second board 8 circuit electrodes 9. Insulators 10 Junction electrode 11 First joining material 12 Second joining material 13 Patch antenna element 15 Joint materials 20,20A jig 21 first holding member 21a 1st holding surface 21b Second holding surface 22 second holding member 22a 3rd holding surface 23 third holding member 24 Opening 25 slit 26 Recesses or openings 30 Structure m Length of the first board t Thickness of the first substrate L slit length L1 Opening length T1 Opening Width M, M1, M2 Length of the contacting surface

Claims

1. A jig used for mounting a structure including a first substrate having a first surface joined to a joining member and a second substrate having a second surface extending intersecting the first surface, wherein the first substrate and the second substrate are joined via the joining member, a first retaining member including first and second retaining surfaces extending adjacent to and intersecting one another; a second retaining member including a third retaining surface extending adjacent to and intersecting the first retaining surface and the second retaining surface; one or more third retention members removably secured to the first retention member; Equipped with the first holding surface of the first holding member abuts against a first back surface opposite to the first front surface, and the second holding surface abuts against one side surface of the first substrate and one side surface of the second substrate; the third holding surface of the second holding member abuts against a second back surface opposite to the second front surface, the third holding member faces the third holding surface, abuts against a first end of the first substrate, and is fixed to the first holding member; Holding the structure jig.

2. the first holding member is disposed on the third holding surface; The jig according to claim 1 .

3. the first and second holding members define a slit between a first side on the first holding surface and a second side on the third holding surface; holding the structure so that a second end of the first substrate opposite the first end is positioned within the slit; The jig according to claim 1 or 2.

4. the first holding member is disposed on the third holding surface; the second retaining member includes an opening; The slit is located within the opening. The jig according to claim 3.

5. The opening penetrates the second holding member. The jig according to claim 4.

6. When the width between the first side and the second side of the slit is T and the thickness between the first front surface and the first back surface of the first substrate is t, t<T<t+0.2 mm is satisfied. The jig according to claim 3.

7. In a state where the structure is held, The total length of the projection of the surfaces of the one or more third holding members that abut against the first end portions on the first holding surface in a direction parallel to the intersection line between the first holding surface and the third holding surface is defined as M, When the length of the first substrate in a direction parallel to the intersection line between the first holding surface and the third holding surface is m, M>m×0.2 is satisfied. The jig according to claim 1 or 2.

8. one or both of the first and third retention surfaces include one or more recesses or openings; the one or more recesses or openings hold the structure so as to receive a member disposed on the first back surface or the second back surface; The jig according to claim 1 or 2.

9. Made of a material that can withstand temperatures of 150°C or higher. The jig according to claim 1 or 2.

10. A method for mounting the structure using the jig according to claim 1 or 2, comprising the steps of: attaching the first substrate and the second substrate to the jig; forming the structure by the first substrate and the second substrate attached to the jig; retaining the structure as configured; bonding the held structure; Including, method.

11. The step of attaching the first substrate and the second substrate to the jig includes: Arranging the first substrate so that the first rear surface abuts against the first holding surface and one side surface of the first substrate abuts against the second holding surface; disposing the second substrate so that the second rear surface abuts against the third holding surface and one side surface of the second substrate abuts against the second holding surface; Including, The method of claim 10.

12. The step of constructing the structure by the first substrate and the second substrate attached to the jig includes: positioning the first substrate and the second substrate attached to the jig so as to connect the joining member to the second surface; The method of claim 10.

13. the first and second holding members define a slit between a first side on the first holding surface and a second side on the third holding surface; The step of constructing the structure by the first substrate and the second substrate attached to the jig includes: and further comprising: placing a second end portion of the first substrate attached to the jig, the second end portion being opposite to the first end portion, in the slit. The method of claim 12.

14. The step of holding the configured structure includes: the third holding member is fixed to the first holding member by being in contact with the first end of the first substrate, facing the third holding surface. The method of claim 10.

15. The step of joining the held structures includes: and performing a heat reflow process on the held structure to bond the bonding member to the second surface. The method of claim 10.

Images