Liquid ejection head

Abstract

To provide a highly reliable liquid ejection head in which an adhesive for bonding a protective member for protecting an ejection face to an ejection substrate does not scatter.SOLUTION: A liquid ejection head includes an ejection substrate including an ejection port array in which a plurality of ejection ports for ejecting a liquid are arranged on a first surface, and a protective member bonded to the first surface of the ejection substrate via an adhesive and including a first opening corresponding to the ejection port array, wherein the protective member further includes a second opening between the first opening and an outer edge of the protective member or between adjacent first openings when viewed from a direction perpendicular to the first surface.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present invention relates to a liquid ejection head. [Background technology]

[0002] A line-type liquid ejection device is known that performs high-speed printing using a liquid ejection head with an array of multiple printing element substrates corresponding to the width of the recording medium. When multiple recording media are transported continuously or intermittently and continuous printing is performed in one pass, the recording media may float up during transportation and come into contact with the printing element substrate, damaging the liquid ejection head. Patent Document 1 discloses a configuration in which a protective member made of resin or metal is adhered to the ejection surface where the ejection ports are formed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP2006-334910 Public Relations Summary of the Invention [Problem to be solved by the invention]

[0004] However, in a configuration in which a protective member is bonded to the ejection surface with an adhesive, as in Patent Document 1, air bubbles can become trapped in the adhesive. These trapped air bubbles expand when the adhesive is heated and hardened, and burst near the ejection port, causing the adhesive to splash and adhere to the edge of the ejection port.

[0005] In view of the above problems, an object of the present invention is to provide a highly reliable liquid ejection head in which the risk of air bubbles being trapped in the adhesive that bonds the protective member is reduced. [Means for solving the problem]

[0006] One aspect of the liquid ejection head of the present invention is a liquid ejection head having an ejection substrate having an ejection port array on a first surface, in which a plurality of ejection ports for ejecting liquid are arranged, and a protective member bonded to the first surface of the ejection substrate via an adhesive and having a first opening corresponding to the ejection port array, wherein when viewed from a direction perpendicular to the first surface, the protective member further has a second opening between the first opening and the outer edge of the protective member.

[0007] Another aspect of the liquid ejection head of the present invention is a liquid ejection head having an ejection substrate having a plurality of ejection port arrays on a first surface, each array having a plurality of ejection port arrays for ejecting liquid, and a protective member bonded to the first surface of the ejection substrate via an adhesive and having a plurality of first openings corresponding to the ejection port arrays, wherein when viewed from a direction perpendicular to the first surface, the protective member further has second openings between adjacent first openings. [Effects of the Invention]

[0008] According to the present invention, even if the protective member is adhered to the ejection surface with an adhesive, the risk of air bubbles being trapped in the adhesive is reduced, and there is no adhesive splattering, making it possible to provide a highly reliable liquid ejection head. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic diagram illustrating the configuration of a liquid ejection device according to the present disclosure. [Figure 2] 1 is a conceptual diagram illustrating a control system of a liquid ejection device according to the present disclosure. [Figure 3] Schematic diagram of a liquid circulation path of a liquid ejection device according to the present disclosure. [Figure 4] 1 is a perspective view of a liquid ejection head according to the present disclosure; [Figure 5] 1 is an exploded perspective view of a liquid ejection head according to the present disclosure; [Figure 6] 1 is a plan view of each flow path member of a liquid ejection head according to the present disclosure; [Figure 7] 1A and 1B are a perspective view and a cross-sectional view of a flow path in a flow path member of a liquid ejection head according to the present disclosure, as viewed from the side on which an ejection module is mounted; [Figure 8] 1A and 1B are perspective and exploded perspective views of a discharge module of a liquid discharge head according to the present disclosure; [Figure 9] 1A and 1B are a plan view of a surface of an element substrate on which ejection ports are formed, a partially enlarged plan view thereof, and a plan view of a rear surface thereof according to the present disclosure; [Figure 10] 9(a) is a cross-sectional perspective view of the element substrate and the lid member according to the present disclosure, taken along line XX in FIG. [Figure 11] FIG. 1 shows a simplified dispensing module according to a first embodiment. [Figure 12] FIG. 10 is a diagram showing a comparative example in which a protective member that does not have an opening outside the ejection port area is bonded to an element substrate. [Figure 13] FIG. 10 is a diagram showing a configuration in which a protection member having an opening outside the ejection port area is bonded to an element substrate in the first embodiment. [Figure 14] FIG. 10 is a top view illustrating a part of a process of bonding a protective member to an element substrate in a comparative example. [Figure 15] 10 is a cross-sectional view of an element substrate in a state where a water-repellent layer is provided on the element substrate in a modified example of the first embodiment. [Figure 16] FIG. 10 is a top view of a modified example of the first embodiment in which a water-repellent layer is provided on an element substrate; [Figure 17] FIG. 10 is a top view of an element substrate in a modified example of the first embodiment, in which an adhesive is applied to the element substrate; [Figure 18] FIG. 18 is a schematic diagram showing an example of a protective member bonded to the element substrate shown in FIG. 17 in a modified example of the first embodiment. [Figure 19] FIG. 10 is a perspective view of an element substrate in which the non-water-repellent area has a concave shape in the second embodiment; [Figure 20] 19(b) is a perspective view of the element substrate according to the second embodiment, showing a state in which a protective member is bonded to the element substrate shown in FIG. 19(b). [Figure 21] 21 is a cross-sectional view taken along line XXI-XXI of FIG. 20 in the second embodiment. [Figure 22] 10A to 10C are diagrams illustrating a method for forming a recess in an element substrate according to a second embodiment. [Figure 23] Schematic diagram of a protective member in a third embodiment. [Figure 24] 10A and 10B are schematic diagrams illustrating a cleaning operation of a liquid ejection head according to a third embodiment; [Figure 25] FIG. 10 is a schematic diagram showing an example of another protective member in the third embodiment. [Figure 26] FIG. 13 is a schematic diagram showing an example of a protective member in the fourth embodiment. [Figure 27] FIG. 13 is a schematic diagram illustrating an example of a protective member according to a fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment of the present invention will now be described with reference to the accompanying drawings. However, the following description is not intended to limit the scope of the present invention. As an example, the present embodiment employs a thermal system in which a heat-generating element generates bubbles to eject liquid. However, the present invention can also be applied to liquid ejection heads employing a piezo system that uses a piezoelectric element as the energy-generating element for ejecting liquid, or various other liquid ejection systems. The liquid ejection head and liquid ejection device incorporating the liquid ejection head of the present invention can be used in devices such as inkjet printers, copiers, facsimiles with communication systems, and word processors with printer units. Furthermore, the liquid ejection head and liquid ejection device can be used in industrial recording devices combined with various processing devices. For example, the liquid ejection head can also be used in applications such as biochip fabrication, electronic circuit printing, and semiconductor substrate fabrication.

[0011] Although this embodiment is a liquid ejection device in which a liquid such as ink is circulated between a tank and a liquid ejection head, other configurations are also possible. For example, instead of circulating the liquid, two tanks may be provided upstream and downstream of the liquid ejection head, and the liquid may flow from one tank to the other to cause the liquid to flow within the pressure chamber. Furthermore, this embodiment is a so-called line-type (page-wide) liquid ejection head having a length corresponding to the width of the recording medium, but the present invention can also be applied to so-called serial-type liquid ejection heads that print while scanning the recording medium. An example of a serial-type liquid ejection head is one that includes one element substrate for black ink and one for color ink, but this is not limited to this. Alternatively, a short line head shorter than the width of the recording medium may be created by arranging several element substrates so that the ejection openings overlap in the direction of the ejection opening array, and this line head may be used to scan the recording medium.

[0012] <Explanation of the basic configuration of the present invention> (Overall configuration of the device) 1 is a diagram showing an example of a liquid ejection device according to the present embodiment. The liquid ejection device according to the present embodiment is a liquid ejection device 1000 (hereinafter simply referred to as device 1000) that serves as an inkjet printer that records a color image on a recording medium 2 by ejecting yellow (Y), magenta (M), cyan (C), and black (Bk) inks. In the figure, the X direction is the transport direction of the recording medium 2, the Y direction is the width direction of the recording medium, and the Z direction is the direction that intersects the X and Y directions and is the direction in which liquid is ejected.

[0013] FIG. 1 shows an apparatus 1000 in which a liquid ejection head 3 directly applies ink to a recording medium 2 transported in the X direction. The recording medium 2 is mounted on a transport unit 1 and transported in the X direction at a predetermined speed below four liquid ejection heads 3 (3Y, 3M, 3C, 3Bk) that eject different inks. In FIG. 1, the four liquid ejection heads 3 are arranged in the X direction in the order 3Bk, 3C, 3M, 3Y, and inks are applied to the recording medium 2 in the order black, cyan, magenta, and yellow. Each liquid ejection head 3 has a plurality of ejection ports arranged in the Y direction for ejecting ink.

[0014] 1 shows cut paper as the recording medium 2, the recording medium 2 may be continuous paper supplied from a roll of paper. Also, the recording medium is not limited to paper, and may be, for example, film.

[0015] In addition, although the present embodiment shows a liquid ejection device configured such that one liquid ejection head ejects ink of a single color, one liquid ejection head may be configured to eject ink of multiple colors, or may be configured to eject liquids other than ink, such as reaction liquids or overcoat agents.

[0016] 2 is a block diagram illustrating the control configuration of the liquid ejection device 1000. The control unit 500 is composed of a CPU and other components, and controls the entire liquid ejection device 1000 while using a RAM 502 as a work area in accordance with programs and various parameters stored in a ROM 501. The control unit 500 performs predetermined image processing on image data received from an externally connected host device 600 in accordance with the programs and parameters stored in the ROM 501, and generates ejection data that can be ejected by the liquid ejection head 3. The control unit 500 then drives the liquid ejection head 3 in accordance with this ejection data, causing it to eject ink at a predetermined frequency.

[0017] During the ejection operation by the liquid ejection head 3, the control unit 500 drives the transport motor 503 to transport the recording medium 2 in the X direction at a speed corresponding to the drive frequency. As a result, an image is recorded on the recording medium 2 in accordance with the image data received from the host device 600. Information on the use areas of the ejection ports used for ejection in the liquid ejection head 3 is stored in the ROM 501 in a rewritable manner for each liquid ejection head 3.

[0018] (liquid circulation path) 3 is a schematic diagram showing the circulation paths of liquid in the liquid ejection device of this embodiment, and shows the liquid ejection head 3 fluidly connected to a first circulation pump 1002, a buffer tank 1003, etc. Note that while FIG. 3 only shows the path through which ink flows in a liquid ejection head corresponding to one color of ink, the liquid ejection device 1000 is provided with circulation paths corresponding to the type of liquid, such as ink, to be ejected.

[0019] The buffer tank 1003, which serves as a sub-tank and is connected to the main tank 1006, has an air communication port (not shown) that connects the inside of the tank with the outside, and is capable of discharging air bubbles in the ink to the outside. The buffer tank 1003 is also connected to a refill pump 1005. When liquid is consumed in the liquid ejection head 3 by ejecting (discharging) ink from the ejection ports of the liquid ejection head for recording by ejecting ink or for suction recovery, the refill pump 1005 transfers the consumed ink from the main tank 1006 to the buffer tank 1003.

[0020] The first circulation pump 1002 has the role of drawing liquid from the liquid connection part 111 of the liquid ejection head 3 and flowing it into the buffer tank 1003. When the liquid ejection head 3 is driven, the first circulation pump 1002 causes a constant amount of ink to flow through the common recovery channel 212.

[0021] The negative pressure control unit 230 is provided between the second circulation pump 1004 and the liquid discharge unit 300. Even if the flow rate in the circulation system fluctuates due to differences in the duty ratio during printing, the negative pressure control unit 230 has the function of maintaining the pressure downstream (on the liquid discharge unit 300 side) at a preset constant pressure.

[0022] As shown in Fig. 3, the negative pressure control unit 230 has two pressure adjustment mechanisms, each of which is set to a different control pressure. Of the two pressure adjustment mechanisms, the relatively high pressure setting side (negative pressure control section 230H, indicated as H in Fig. 3) and the relatively low pressure setting side (negative pressure control section 230L, indicated as L in Fig. 3) are respectively connected to a common supply channel 211 and a common recovery channel 212 in the liquid ejection unit 300 via the liquid supply unit 220. The liquid ejection unit 300 is provided with the common supply channel 211, the common recovery channel 212, and individual supply channels 213a and individual recovery channels 213b that communicate with each element substrate (ejection substrate) 10 having an ejection port. Details of the element substrate 10 will be described later. Because the individual flow paths 213 communicate with the common supply flow path 211 and the common recovery flow path 212, a portion of the liquid flowed by the second circulation pump 1004 flows from the common supply flow path 211 through the internal flow paths of the element substrate 10 to the common recovery flow path 212 (arrows in FIG. 3). This is because a pressure difference is provided between the pressure adjustment mechanism H connected to the common supply flow path 211 and the pressure adjustment mechanism L connected to the common recovery flow path 212, and the first circulation pump 1002 is connected only to the common recovery flow path 212.

[0023] In this way, in the liquid ejection unit 300, a liquid flow that passes through the common recovery channel 212 and a liquid flow that passes from the common supply channel 211 through each element substrate 10 to the common recovery channel 212 are generated. As a result, heat generated in each element substrate 10 can be discharged to the outside of the element substrate 10 by the flow from the common supply channel 211 to the common recovery channel 212. Furthermore, with this configuration, when recording is being performed with the liquid ejection head 3, ink flows can also be generated in ejection ports and pressure chambers that are not performing recording, thereby suppressing thickening of the ink in those areas. Furthermore, thickened ink and foreign matter in the ink can be discharged to the common recovery channel 212. As a result, the liquid ejection head 3 of this embodiment is capable of high-speed, high-quality recording.

[0024] (Configuration of liquid ejection head) 4(a) and 4(b) are perspective views of a liquid ejection head 3 according to this embodiment. The liquid ejection head 3 is a line-type liquid ejection head in which 17 element substrates 10 capable of ejecting ink are arranged in a straight line (arranged inline). As shown in FIGS. 4(a) and 4(b), the liquid ejection head 3 includes signal input terminals 91 and power supply terminals 92 electrically connected to each element substrate 10 via an electric wiring board (flexible wiring board) 40 and an electric wiring board 90. The signal input terminals 91 and power supply terminals 92 are electrically connected to the control unit of the device 1000 and supply ejection drive signals and power required for ejection to the element substrate 10, respectively. By consolidating the wiring using the electrical circuit within the electric wiring board 90, the number of signal output terminals 91 and power supply terminals 92 can be reduced compared to the number of element substrates 10. This reduces the number of electrical connections that need to be removed when assembling the liquid ejection head 3 to the device 1000 or when replacing the liquid ejection head 3. 4(a), a liquid connection part 111 provided on one side of the liquid ejection head 3 is connected to a liquid supply system of the device 1000. This allows ink to be supplied from the supply system of the device 1000 to the liquid ejection head 3, and ink that has passed through the liquid ejection head 3 is collected by the supply system of the device 1000. In this way, ink can be circulated via the paths of the device 1000 and the paths of the liquid ejection head 3.

[0025] FIG. 5 shows an exploded perspective view of each component or unit constituting the liquid ejection head 3. The liquid ejection unit 300, liquid supply unit 220, and electrical wiring board 90 are attached to the housing 80. The liquid supply unit 220 is provided with a liquid connection 111, and a filter 221 (FIG. 3) is provided inside the liquid supply unit 220. The filter 221 communicates with each opening of the liquid connection 111 to remove foreign matter from the ink being supplied. The liquid that passes through the filter 221 is supplied to a negative pressure control unit 230 disposed above the liquid supply unit 220. The negative pressure control unit 230 is a unit comprising a pressure adjustment valve. The valves and spring members provided inside the unit significantly attenuate pressure loss changes in the supply system of the device 1000 (the supply system upstream of the liquid ejection head 3) that occur due to fluctuations in the liquid flow rate. This makes it possible to stabilize negative pressure changes downstream of the negative pressure control unit 230 (the liquid ejection unit 300 side) within a certain range. The negative pressure control unit 230 has two pressure adjustment valves built in, each set to a different control pressure, and the high-pressure side is connected to the common supply flow path 211 in the liquid ejection unit 300, and the low-pressure side is connected to the common recovery flow path 212 via the liquid supply unit 220.

[0026] The housing 80 has a liquid discharge unit support portion 81 and an electric wiring board support portion 82, and supports the liquid discharge unit 300 and the electric wiring board 90 while ensuring the rigidity of the liquid discharge head 3. The electric wiring board support portion 82 is for supporting the electric wiring board 90, and is fixed to the liquid discharge unit support portion 81 by screws. The liquid discharge unit support portion 81 is provided with openings 83 and 84 into which a joint rubber 100 is inserted. The liquid supplied from the liquid supply unit 220 is guided via the joint rubber 100 to the second flow path member 60 that constitutes the liquid discharge unit 300.

[0027] Next, the configuration of the flow path member 210 included in the liquid discharge unit 300 will be described. As shown in FIG. 5, the flow path member 210 is formed by stacking a first flow path member 50 and a second flow path member 60. A plurality of discharge modules 200 are bonded to the bonding surface of the first flow path member 50 with an adhesive (not shown). The flow path member 210 distributes the liquid supplied from the liquid supply unit 220 to each discharge module 200 and returns the liquid flowing out of the discharge module 200 to the liquid supply unit 220. The flow path member 210 is fixed to the liquid discharge unit support part 81 with screws, which prevents the flow path member 210 from warping or deforming.

[0028] FIG. 6 is a diagram illustrating a detailed configuration of the flow path member 210. FIG. 6(a) shows the support member 30 provided on the surface of the first flow path member 50 on which the discharge module 200 is mounted, and FIG. 6(b) shows the surface of the first flow path member 50 that abuts against the support member 30. FIG. 6(c) shows a cross-sectional view of the first flow path member 50 in a plane perpendicular to the Z direction and near the center in the Z direction, and FIG. 6(d) shows the surface of the second flow path member 60 that abuts against the liquid discharge unit support part 81. Note that FIGS. 6(a) to 6(c) are views seen from the discharge module 200 side, and FIG. 6(d) is a view seen from the liquid discharge unit support part 81 side.

[0029] A plurality of support members 30 arranged in the Y direction are disposed on the surface of the first flow path member 50 opposite to the second flow path member 60, and one element substrate 10 is disposed on each support member 30. By adjusting the number of arranged discharge modules 200, it is possible to configure liquid discharge heads 3 of various sizes.

[0030] 6(a), the support member 30 has, on its surface that abuts against the element substrate 10, communication ports 31 that are fluidly connected to the element substrate 10 and serve as the individual supply flow channels 213a and the individual recovery flow channels 213b described above in Fig. 3. As shown in Fig. 6(b), the communication ports 31 are fluidly connected to the common supply flow channel 211 or the common recovery flow channel 212 via communication ports 51 that the flow channel member 50 has.

[0031] 6(c), common flow path grooves 61 and 62, which become the common supply flow path 211 and the common recovery flow path 212 described in FIGS. 3(a) and 3(b), extend in the Y direction in a middle layer located near the center in the Z direction of the first flow path member 50. As shown in FIG. 6(d), a common communication port 63, which is fluidly connected to the liquid supply unit 220, is formed at both ends or one end of the common flow path grooves 61 and 62.

[0032] 7(a) and 7(b) are a perspective view and a cross-sectional view for explaining the flow path structure formed inside the liquid discharge unit 300. Fig. 7(a) is an enlarged perspective view of the flow path member 210 as viewed from the Z direction, and Fig. 7(b) is a cross-sectional view taken along line VIIb-VIIb in Fig. 7(a).

[0033] The element substrate 10 of the ejection module 200 is placed on the communication port 51 of the first flow path member 50 via the support member 30. Note that while only the communication port 51 corresponding to the common supply flow path 211 is shown in FIG. 7(b), in another cross section, the common recovery flow path 212 and the communication port 51 are communicated with each other as shown in FIG. 6. The support member 30 and the element substrate 10 included in each ejection module 200 are formed with a flow path for supplying ink from the first flow path member 50 to the heating resistor elements 15 (see FIG. 9) provided on the element substrate 10. Furthermore, the support member 30 and the element substrate 10 are formed with a flow path for recovering (circulating) part or all of the liquid supplied to the heating resistor elements 15 to the first flow path member 50.

[0034] As described above, the common supply flow path 211 is connected to the negative pressure control unit 230H, which has a relatively high pressure, and the common recovery flow path 212 is connected to the negative pressure control unit 230L, which has a relatively low pressure. An ink supply path is formed that supplies ink to a flow path formed in the element substrate 10 through the common communication port 63 (see FIG. 6), the common supply flow path 211, and the communication port 31. Similarly, an ink recovery path is formed from the flow path in the element substrate 10, having the communication port 31, the communication port 51, the common recovery flow path 212, and the common communication port 63 (see FIG. 6(d)). While the ink is circulated in this way, an ejection operation is performed in the element substrate 10 in accordance with the ejection data, and the ink supplied by the ink supply path that is not consumed by the ejection operation is recovered by the ink recovery path.

[0035] (Configuration of the discharge module) FIG. 8(a) is a perspective view showing one discharge module 200, and FIG. 8(b) is an exploded view thereof. First, the protective member 140 is bonded to the element substrate 10 using an adhesive. Then, the element substrate 10 and the flexible wiring substrate 40 to which the protective member 140 has been bonded are attached to a support member 30 having a liquid communication port 31 formed thereon. Furthermore, the terminals 16 on the element substrate 10 and the terminals 41 on the flexible wiring substrate 40 are electrically connected by wire bonding, and then the wire bonding portion (electrical connection portion) is covered with a sealing material to form a sealing portion 110. The terminals 42 on the flexible wiring substrate 40 on the side opposite to the element substrate 10 are electrically connected to the connection terminals 93 (see FIG. 4) of the electrical wiring substrate 90. The support member 30 is a support that supports the element substrate 10 and also a flow path member that fluidly connects the element substrate 10 and the flow path member 210. Therefore, it is preferable that the support member 30 has high flatness and can be bonded to the element substrate with sufficiently high reliability. The protective member 140 is preferably made of alumina or a resin material. The protective member 140 is bonded to the ejection surface 120 of the element substrate 10 via an adhesive and has openings 141 corresponding to each of the ejection port arrays 14. The protective member 140 prevents contact between the recording medium 2 and the element substrate 10, thereby reducing the risk of damage to the liquid ejection head 3. Therefore, the material of the protective member 140 preferably has a higher elastic modulus than the resin ejection port forming member 12. Suitable materials for the protective member 140 include metal materials such as stainless steel and aluminum, silicon, and alumina. In addition, using a material with approximately the same linear expansion coefficient as the material of the element substrate 10 for the protective member 140 reduces the risk of the protective member 140 peeling off from the ejection port forming member 12. The contour and openings 141 of the protective member 140 are preferably processed with high precision. Suitable processing methods include, for example, etching, laser processing, and mechanical processing. Different processing methods may be used for the back and front surfaces of the protective member 140 or for different locations.

[0036] (Configuration of element substrate) The configuration of the element substrate 10 in this embodiment will be described. Fig. 9(a) shows a plan view of the surface of the element substrate 10 on which the ejection ports 13 are formed, Fig. 9(b) shows an enlarged view of the portion indicated by A in Fig. 9(a), and Fig. 9(c) shows a plan view of the back surface of Fig. 9(a). Fig. 10 is a cross-sectional perspective view of the element substrate 10 taken along line XX in Fig. 9(a). Hereinafter, the direction in which an ejection port array 14 in which a plurality of ejection ports 13 are arranged extends will be referred to as the "ejection port array direction."

[0037] As shown in FIG. 9(b), a heating resistor element 15, which is a heating element (pressure-generating element) for generating bubbles from the liquid by utilizing the thermal energy generated by the liquid, is disposed at a position corresponding to each ejection port 13. Pressure chambers 23, each containing a heating resistor element 15, are defined by partition walls 22 formed by a first layer 121 (described later) of the ejection port forming member 12. The heating resistor element 15 is electrically connected to terminals 16 by electrical wiring (not shown) provided on the element substrate 10. The heating resistor element 15 generates heat and boils the liquid based on pulse signals input from the control circuit of the liquid ejection device 1000 via an electrical wiring board 90 (see FIG. 5) and a flexible wiring board 40 (see FIG. 8). The liquid is ejected from the ejection port 13 by the bubbling force caused by this boiling. As shown in FIG. 9(b), a liquid supply channel 18 extends on one side along each ejection port row, and a liquid recovery channel 19 extends on the other side. The liquid supply path 18 and the liquid recovery path 19 are flow paths that extend in the direction of the ejection port array provided on the element substrate 10, and communicate with the ejection ports 13 via the supply ports 17a and the recovery ports 17b, respectively. Figures 9(a) to 9(c) show, as an example, an element substrate 10 that has a plurality of ejection port arrays, specifically 16 arrays.

[0038] As shown in FIGS. 9(c) and 10, a sheet-like cover plate 20 is laminated on the back surface of the element substrate 10 opposite the surface on which the ejection ports 13 are formed. As shown in FIG. 9(c), the cover plate 20 is provided with a plurality of openings 21 that communicate with the liquid supply channels 18 and the liquid recovery channels 19, which will be described later. In this embodiment, the cover plate 20 is provided with four supply openings 21a for each liquid supply channel 18 and three recovery openings 21b for each liquid recovery channel 19, but the number of openings is not limited to this. As shown in FIG. 9(b), each opening 21 in the cover plate 20 communicates with the communication port 51 shown in FIG. 7(a). The cover plate 20 is preferably made of a material that has sufficient corrosion resistance against liquid. Furthermore, the opening shape and position of the openings 21 must be highly accurate to ensure that ink is supplied to the pressure chambers. For this reason, it is preferable to use a photosensitive resin material or a silicon plate as the material for the cover plate 20, and form the openings 21 using photolithography. In this way, the cover plate 20 changes the pitch of the flow paths by the openings 21, and from the viewpoints of pressure loss, strength and processability, the cover plate is preferably made of a film-like material having a thickness of about 30 to 600 μm.

[0039] Next, the flow of liquid within the element substrate 10 will be described. The element substrate 10 is formed by stacking a substrate 11 made of silicon and a discharge port forming member (flow path forming member) 12 made of photosensitive resin. In this embodiment, the discharge port forming member 12 has a first layer 121 (middle layer) for forming pressure chambers 23 and a second layer 122 (upper layer) having discharge ports 13. The first layer 121 and the second layer 122 are stacked (laminated) in this order on the surface (first surface 11a) of the substrate 11, and are patterned by exposure to light with the optimal photosensitive wavelength for each layer, followed by development, to form the discharge port forming member 12. Note that the discharge port forming member 12 can be manufactured by any method, such as the above-mentioned method of stacking the first and second layers, or a method of forming pressure chambers and discharge ports using a mold material or the like. A cover plate 20 is bonded to the back surface of the substrate 11. The cover plate 20 functions as a lid that forms part of the walls of the liquid supply channels 18 and liquid recovery channels 19 formed in the substrate 11 of the element substrate 10. The element substrate 10 has heating resistor elements 15 formed on one surface of the substrate 11 (see FIG. 9), and grooves that form the liquid supply channels 18 and liquid recovery channels 19 that extend along the ejection port array are formed on the back surface. The liquid supply channels 18 and liquid recovery channels 19 formed by the substrate 11 and the cover plate 20 are connected to a common supply channel 211 and a common recovery channel 212 in a flow path member 210, respectively (see FIG. 7), and a pressure difference is generated between the liquid supply channels 18 and the liquid recovery channels 19. This pressure difference causes a circulation flow C in which the liquid in the liquid supply channels 18 provided in the substrate 11 flows to the liquid recovery channels 19 via the supply ports 17a, the pressure chambers 23, and the recovery ports 17b (the flow indicated by arrows C in FIG. 10). This flow allows the ink in the ejection ports 13 and pressure chambers 23 that are not performing an ejection operation to be recovered into the liquid recovery path 19, including thickened ink, bubbles, and foreign matter that are generated by evaporation from the ejection ports 13. It also makes it possible to prevent the ink in the ejection ports 13 and pressure chambers 23 from becoming thicker or the concentration of the coloring material from increasing.As shown in Figure 7, the liquid recovered into the liquid recovery path 19 is recovered in the order of the opening 21 in the cover plate 20 and the communication port 31 in the support member 30, the communication port 31 in the support member 30, the communication port 51 in the first flow path member 50, and the common recovery flow path 212, and is then recovered into the supply path of the liquid ejection device 1000.

[0040] In other words, the liquid supplied from the liquid ejection device main body to the liquid ejection head 3 flows, and is supplied and recovered, in the following order: The liquid first flows into the liquid ejection head 3 from the liquid connection portion 111 of the liquid supply unit 220. The liquid is then supplied, in this order, to the joint rubber 100, the common communication port 63 provided in the second flow path member, and the common flow path groove 61 and communication port 51 provided in the first flow path member. The liquid is then supplied to the pressure chamber 23 via the communication port 31 provided in the support member 30, the opening 21 provided in the cover plate 20, the liquid supply path 18 and supply port 17a provided in the substrate 11, in that order. Of the liquid supplied to the pressure chamber 23, the liquid that is not ejected from the ejection port 13 flows, in that order, through the recovery port 17b and liquid recovery path 19 provided in the substrate 11, the opening 21 provided in the cover plate 20, and the communication port 31 provided in the support member 30. The liquid then flows in this order through the communication port 51 and the common flow path 62 provided in the first flow path member, the common communication port 63 provided in the second flow path member, and the joint rubber 100. The liquid then flows from the liquid connection part 111 provided in the liquid supply unit to the outside of the liquid ejection head 3. In the configuration of the circulation path shown in FIG. 3, the liquid that flows in from the liquid connection part 111 passes through the negative pressure control unit 230 and is then supplied to the joint rubber 100.

[0041] The liquid ejection head of this embodiment further includes a temperature adjustment mechanism (not shown) on the element substrate 10. The element substrate 10 is divided into multiple temperature adjustment areas, each of which is provided with a temperature sensor and an individually controllable sub-heater. The control unit 500 (see FIG. 2) uses these temperature sensors and sub-heaters to adjust the temperature based on the temperature (target temperature) set for each area. That is, the control unit 500 drives the sub-heater only in areas where the temperature detected by the temperature sensor is equal to or lower than the target temperature. Setting the target temperature of the element substrate 10 to a relatively high temperature reduces the viscosity of the ink, enabling optimal ejection and circulation. This temperature control keeps temperature variations within the element substrate 10 and among multiple element substrates 10 within a predetermined range. This reduces ejection volume variations due to temperature variations and suppresses density unevenness in printed images. The target temperature of the element substrate 10 is preferably set to a temperature equal to or higher than the equilibrium temperature of the element substrate 10 when all of the heating resistor elements 15 are driven at the highest possible driving frequency. As the temperature sensor, a diode sensor, an aluminum sensor, or the like can be used. Furthermore, a heating resistor element 15, which is a heat generating element, can also be used as a heating means for the element substrate 10. Specifically, the element substrate 10 can be heated by applying a voltage to the heating resistor element 15 that is not strong enough to cause bubbles. For example, the heating resistor element 15 can be used instead of a sub-heater as a heating means, or a sub-heater and a heating resistor element 15 can be used together.

[0042] In this embodiment, the material of the ejection port forming member 12 is a photosensitive resin, but the present disclosure is not limited to this, and the configuration of the present disclosure can be preferably applied even when, for example, silicon, metal, ceramic, glass, or other materials are used.

[0043] <Description of the embodiment of the present invention> (First embodiment) A first embodiment of the present invention will be described. Explanation of functions and configurations similar to the basic configuration of the present invention will be omitted, and only differences will be described.

[0044] Fig. 11(a) is a schematic perspective view of the discharge module in the first embodiment. Fig. 11(b) is a schematic view showing the state after adhesive has been applied. Fig. 11(c) is a cross-sectional view taken along line XI-XI in Fig. 11(a). Fig. 11(d) is a schematic view showing the state after adhesive has been applied along line XI-XI in Fig. 11(a). In Figs. 11(a) and 11(b), some of the configurations are simplified to facilitate understanding.

[0045] In the first embodiment, the ejection surface 120 is not water-repellent, and adhesive 150 is applied in dots on the ejection surface 120. Openings 142 are provided outside the ejection port region in the protective member 140 at locations corresponding to the centers of the applied adhesive 150. Here, openings 141 in the protective member 140 that correspond to the ejection port arrays 14 and expose the ejection port arrays 14 are referred to as first openings. In this case, a portion of the openings 142 provided outside the ejection port region is a second opening provided between the first opening 141 and the outer edge of the protective member 140 when viewed from a direction perpendicular to the first surface, which is the ejection surface 120. Furthermore, another portion of the openings 142 provided outside the ejection port region is a second opening provided between adjacent first openings 141 when viewed from a direction perpendicular to the first surface, which is the ejection surface 120.

[0046] FIG. 12 shows a state in which a protective member 140 without an opening 142 outside the ejection port area is bonded to an element substrate 10. FIG. 12(a) shows the state before the protective member 140 is bonded, and FIG. 12(b) shows the state after the protective member 140 has been bonded and the two applied adhesives are close to each other. FIG. 12(c) shows the state after the protective member 140 has been completely bonded and an air bubble 143 has been trapped. FIG. 13 shows a state in which a protective member 140 with an opening 142 outside the ejection port area is bonded to an element substrate 10. FIG. 13(a) shows the state before the protective member 140 is bonded, and FIG. 13(b) shows the state after the protective member 140 has been bonded and the two applied adhesives 150 are close to each other. FIG. 13(c) shows the state after the protective member 140 has been completely bonded. With the configuration of this embodiment, the opening 142 outside the ejection port area is provided, so air bubbles 143 are not trapped. Providing the second opening 142 in a location where the adhesive area between the protective member 140 and the element substrate 10 is large is effective in terms of suppressing the entrapment of air bubbles. In particular, it is preferable to provide the second opening 142 between the first opening 141 and a terminal row in which a plurality of terminals 16 are arranged, when viewed from a direction perpendicular to the ejection surface 120.

[0047] FIG. 14 shows a state in which a heating step for hardening the adhesive 150 has been performed with air bubbles 143 trapped in the adhesive 150. FIG. 14(a) shows the state of FIG. 12(c) observed from above, and FIG. 14(b) shows a state in which the adhesive 150 has been hardened after further heating. In FIG. 14(b), the air bubbles 143 have expanded and burst due to heating, and the adhesive 150 has scattered around the outlets 13. In the first embodiment, as an example, the outlet size is Φ20 μm, the outlet pitch is 600 dpi, there are 512 outlets in one row, there are four outlet rows, and the distance between the outlet rows is 500 μm. The protective member 140 is made of SUS303 and is 30 μm thick. The openings 141 in the ejection port area have a width of 300 μm, the openings 142 outside the ejection port area have a size of 100 μm x 100 μm, and the pitch between the ejection port rows is 500 μm. The adhesive used is an epoxy adhesive, such as EA-421-B5 (manufactured by Sanyu Rec Co., Ltd.). The adhesive is heated on a hot plate at 150°C / min and in an oven at 150°C / 60 min.

[0048] Furthermore, in the above-described embodiment, the ejection surface 120 is not water-repellent. However, as a modification, a water-repellent layer 144 may be provided on the ejection surface 120. FIG. 15(a) shows a state in which the entire ejection surface 120 is water-repellent, FIG. 15(b) shows a state in which the area where the adhesive 150 is applied is a non-water-repellent area 145, and FIG. 15(c) shows a state in which the area where the protective member 140 is bonded is a non-water-repellent area 145. When the ejection surface 120 is not water-repellent, a footing 146 occurs, as shown in FIG. 11(c). Controlling the amount of this footing 146 is difficult, but when the water-repellent layer 144 is provided, the adhesive 150 does not generally flow outside the area of ​​the protective member 140 even when the protective member 140 is bonded, and footing 146 does not occur, making it easier to control.

[0049] FIG. 16 shows various shapes of the non-water-repellent region 145 provided on the ejection surface 120. In FIG. 16(a), the non-water-repellent region 145 is substantially circular, in FIG. 16(b), the non-water-repellent region 145 is substantially square, and in FIG. 16(c), the non-water-repellent region 145 is rectangular. In FIG. 16(d), the non-water-repellent region 145 is continuously formed substantially parallel to the ejection port array 14 so as to correspond to the length of the ejection port array 14. In FIG. 16(e), the non-water-repellent region 145 is formed so as to surround each ejection port array 14, and further, the non-water-repellent region 145 is continuously formed even in areas where no ejection port array 14 is formed. In FIG. 16(f), when the protective member 140 is joined, part of the non-water-repellent region 145 on the periphery of the opening 142 outside the ejection port area is interrupted. In both Figures 16(e) and 16(f), the non-water-repellent regions 145 corresponding to different ejection port arrays 14 are provided in a continuous, connected manner. Figures 17(a) to 17(f) show the state in which adhesive 150 has been applied to the non-water-repellent regions of Figures 16(a) to 16(f). Figure 18(a) shows the protective member 140 to be bonded to Figures 17(a) and 17(b). Figure 18(b) shows the protective member 140 to be bonded to Figure 17(c). Figure 18(c) shows the protective member 140 to be bonded to Figures 17(d) to 17(f). Increasing the bonding area increases the adhesive strength and improves the adhesive reliability. Note that some of the configurations in Figures 16 to 18 are simplified to facilitate understanding.

[0050] However, if the openings 141 and 142 of the protective member 140 are made too large, the recording medium 2 may come into contact with the element substrate 10 and damage the liquid ejection head 3 if the recording medium 2 is lifted during transportation due to a paper jam or the like. Also, from the viewpoint of the strength of the protective member 140, it is desirable that the total area of ​​the openings 141 and 142 not be too large. Therefore, the ratio of the total area of ​​the openings 141 and 142 to the area of ​​the main plane of the protective member 140 (opening ratio) is preferably 90% or less, more preferably 80% or less, and even more preferably 70% or less. Furthermore, the width of the openings 141 may be equal to or greater than the diameter of the ejection port and less than the distance between adjacent ejection port rows, and the thickness of the protective member 140 may be equal to or less than the thickness of the element substrate 10. For example, it is preferable that the width of the openings 141 is 200 μm or more, and the thickness of the protective member 140 is less than 50 μm. This ensures cleanability around the ejection port 13, while reducing stress when the recording medium 2 and the element substrate 10 come into contact, thereby reducing the possibility of damaging the liquid ejection head 3. Furthermore, even if foreign matter such as dust gets into the pressure chamber 23 due to the recording medium 2 coming into contact with the ejection port 13, the liquid inside the pressure chamber 23 can be circulated between the pressure chamber 23 and the outside, as described above, so that the liquid can flow out of the pressure chamber 23.

[0051] The minimum opening width of the openings 142 outside the discharge port area is preferably 5 μm or more, more preferably 10 μm or more, and even more preferably 15 μm or more, so that air can be reliably released when the protective member 140 is joined.

[0052] (Second embodiment) A second embodiment of the present disclosure will be described. Descriptions of the basic configuration of the present disclosure and functions and configurations similar to those of the first embodiment will be omitted, and differences will be described.

[0053] FIG. 19 shows an element substrate 10 in which a water-repellent layer 144 is provided on the ejection surface 120 and recesses 147 are formed in the non-water-repellent regions 145 to which adhesive 150 is applied. Note that FIG. 19 and FIG. 20, which will be described later, partially simplify the configuration for ease of understanding. FIG. 19(a) shows a state in which continuous non-water-repellent recesses 147 are formed around the periphery of each ejection port array 14. Furthermore, when a protective member 140 is bonded, continuous non-water-repellent recesses 147 are also formed around the periphery of the ejection port region outer opening 142. FIG. 19(b) shows a state in which adhesive 150 has been applied to the recesses 147. The protective member 140 to be bonded is the protective member 140 shown in FIG. 17, and FIG. 20 shows the bonded state of the protective member 140. FIG. 21(a) is a cross-sectional view taken along line XXI-XXI in FIG. 20, and FIG. 21(b) is a cross-sectional view showing the state before the protective member 140 of FIG. 21(a) is bonded. FIG. 22 shows a method for forming the recess 147 in this embodiment, as shown in FIG. 21 XXII. First, in FIG. 22(a), a 100 μm-thick PET film was prepared as the substrate 160. Next, as shown in FIG. 22(b), the material for the first dry film 161 listed in Table 1 was applied to the substrate 160 by spin coating, and the substrate 160 was baked at 90°C for 20 minutes to volatilize the solvent, forming an 8 μm film (first dry film 161). Next, as shown in FIG. 22(c), an element substrate 10 was prepared (the supply port 17a and the recovery port 17b are not shown). Next, as shown in FIG. 22(d), the substrate 160 having the first dry film 161 prepared in FIG. 22(b) was heated to 80°C using a lamination method, and transferred under pressure to form a layer of the first dry film 161. Then, the substrate 160 was peeled off from the first dry film 161 (not shown). Next, as shown in FIG. 22(e), the first dry film 161 is irradiated with 16000 J / m 2 through a flow path forming mask 162 having a flow path pattern. 2The exposed portion was then cured by a pattern exposure at an exposure dose of 100 J / m , followed by a heat treatment at 50°C for 5 minutes. Next, as shown in FIG. 22(f), a second dry film 163 was formed on the first dry film 161. The second dry film 163 was prepared by applying a material for the second dry film 163, consisting of the components listed in Table 1, to a 100 μm-thick PET film and baking it at 90°C for 5 minutes to volatilize the solvent, forming a 6 μm-thick film (second dry film 163). Next, the second dry film 163 was transferred and laminated onto the first dry film 161 by a lamination method while applying heat at 50°C, thereby obtaining a laminate. Next, as shown in FIG. 22(g), the second dry film 163 was applied to a discharge port forming mask 164 having a pattern of the discharge ports 13 and recesses 147 at a dose of 1100 J / m . 2 The exposed portions were then cured by heat treatment at 90°C for 5 minutes. In Figure 22(h), the uncured portions of the first dry film 161 and the second dry film 163 were removed in one go by developing with PGMEA for 1 hour, forming the discharge port formation member 12. The discharge port formation member 12 was then completed by further accelerating the curing by heat treatment at 200°C.

[0054] The recessed shape of the non-water-repellent region 145 allows the recessed portions 147 to act as wedges, increasing the bonding strength of the protective member 140. To increase the bonding strength between the element substrate 10 and the protective member 140, it is desirable to make the bonding area as wide as possible. Therefore, as shown in FIGS. 17(d) to (f), it is desirable to continuously apply the adhesive 150 between each of the ejection port arrays 14. Furthermore, as shown in FIGS. 17(e) to (f), by continuously applying the adhesive to the entire ejection port array 14, an even wider bonding area can be achieved. Even in a wide area where no ejection port array 14 is arranged, as shown in FIGS. 17(d) to (f), forming recessed portions 147 that are continuously connected to the ejection port array 14 and substantially parallel to the ejection port array 14 and applying the adhesive 150 makes it possible to easily supply the optimal amount of adhesive to the bonding area. Furthermore, as shown in Figure 18(c), by joining the protective member 140 so that the openings 142 outside the outlet area are approximately parallel to the outlet row 14, there are openings in all areas where the adhesive 150 spreads, which makes it possible to further reduce the rate of occurrence of entrapped air bubbles 143.

[0055] (Third embodiment) A third embodiment of the present disclosure will be described. Descriptions of the basic configuration of the present disclosure and the same functions and configurations as those of the first and second embodiments will be omitted, and only differences will be described.

[0056] FIG. 23 shows the protective member 140 of this embodiment. Note that FIG. 23 and the following FIGS. 24 and 25 partially simplify the configuration for ease of understanding. The four corners of the opening of the protective member 140 are provided with rounded shapes 148. FIG. 24 also shows a state in which foreign matter and the like are being wiped off the ejection surface 120 by a blade 149 of a cleaning mechanism. In this embodiment, cleaning is performed by the blade 149 wiping in a direction substantially parallel to the direction in which the ejection ports 13 are arranged in the ejection port array 14. In this case, if the four corners of the opening of the protective member 140 are acute-angled, the rubber blade may be damaged. By providing the rounded shapes 148 at the four corners of the opening of the protective member 140, the possibility of the blade 149 being damaged during cleaning can be significantly reduced. In this embodiment, the element substrate 10 shown in FIG. 19 is used. A water-repellent layer 144 is provided on the ejection surface 120, and a non-water-repellent region 145 to which an adhesive 150 is applied is formed by a recess 147. Other conditions of the element substrate 10 are the same as those of the first embodiment. The protective member 140 has an opening width of 150 μm for the outlet area outer opening 142, and an arc radius of the R-shape of 50 μm, and other conditions are the same as those of the first embodiment. The arc radius of the R-shape is preferably 5 μm or more, more preferably 10 μm or more, and even more preferably 15 μm or more.

[0057] 19, the element substrate 10 may have a shape in which all adhesive application areas are connected by recesses 147, but the protective member 140 may have divided openings 142 outside the ejection port area as shown in Figures 25(a) and 25(b). By dividing the openings 142 outside the ejection port area and making each opening smaller, the rigidity of the protective member 140 can be increased, and handling during bonding can be improved.

[0058] (Fourth embodiment) A fourth embodiment of the present disclosure will be described. Descriptions of the basic configuration of the present disclosure and the same functions and configurations as those of the first to third embodiments will be omitted, and only differences will be described.

[0059] Figure 26 shows the protective member 140 of this embodiment. Note that in Figure 26, some of the configuration is simplified for ease of understanding. In this embodiment, the blade 149 of the cleaning mechanism moves in the same direction as in the second embodiment. The protective member 140 is provided with an outlet region outside opening 142 on the side (end) of the outlet row 14, which extends in a direction intersecting the arrangement direction of the outlets 13. This allows the blade 149 to pass through the outlet region outside opening 142 before entering the outlet row 14. Therefore, even if foreign matter or the like adheres to the blade 149, the foreign matter is removed when it passes through the outlet region outside opening 142, and the outlets 13 can be cleaned with a clean blade 149.

[0060] (Fifth embodiment) FIG. 27 shows a protective member 140 of this embodiment, which is a modification of the protective member 140 shown in FIG. 26 . Note that FIG. 27 simplifies some of the configuration for ease of understanding. In this embodiment, the direction in which the blade 149 of the cleaning mechanism moves differs from that of the fourth embodiment and FIG. 24 . Cleaning is performed by the blade 149 wiping in a direction intersecting the direction in which the outlets 13 are arranged in the outlet array 14. Therefore, two openings 142 outside the outlet area are disposed on each side of the opening 141 in the outlet area in a direction intersecting the direction in which the outlets 13 are arranged. The blade 149 of the cleaning mechanism passes through the openings 142 outside the outlet area before entering the outlet array 14. Therefore, even if foreign matter or the like adheres to the blade 149, the foreign matter is removed as it passes through the openings 142 outside the outlet area, allowing the clean blade 149 to clean the outlets 13.

[0061] [Table 1]

[0062] (Technical Features of the Present Disclosure) The present disclosure includes the following configurations.

[0063] [Configuration 1] a discharge substrate having, on a first surface thereof, a discharge port array in which a plurality of discharge ports for discharging liquid are arranged; a protection member bonded to the first surface of the ejection substrate via an adhesive, the protection member having first openings corresponding to the ejection port arrays; A liquid ejection head having The liquid ejection head, wherein the protection member further includes a second opening between the first opening and an outer edge of the protection member when viewed from a direction perpendicular to the first surface.

[0064] [Configuration 2] a discharge substrate having a first surface provided with a plurality of discharge port arrays, each array having a plurality of discharge ports for discharging liquid; a protection member bonded to the first surface of the ejection substrate via an adhesive, the protection member having a plurality of first openings corresponding to the ejection port arrays; A liquid ejection head having The liquid ejection head, wherein the protection member further includes second openings between adjacent first openings when viewed from a direction perpendicular to the first surface.

[0065] [Configuration 3] 3. The liquid ejection head according to configuration 1 or 2, wherein the first surface has a water-repellent region and a non-water-repellent region, and at least a portion of the adhesive is disposed in the non-water-repellent region.

[0066] [Configuration 4] 4. The liquid ejection head according to configuration 3, wherein the non-water-repellent area has a concave shape.

[0067] [Configuration 5] 5. The liquid ejection head according to configuration 3 or 4, wherein the non-water-repellent region is provided so as to surround the ejection port array.

[0068] [Configuration 6] 5. The liquid ejection head according to configuration 3 or 4, wherein the non-water-repellent regions corresponding to different ejection port arrays are provided so as to be continuously connected.

[0069] [Configuration 7] The liquid ejection head according to any one of configurations 3 to 6, wherein at least a portion of the non-water-repellent region and at least a portion of the second opening are provided substantially parallel to the ejection port array.

[0070] [Configuration 8] 8. The liquid ejection head according to configuration 7, wherein the non-water-repellent region corresponding to the first opening and the non-water-repellent region corresponding to the second opening are formed continuously.

[0071] [Configuration 9] 9. The liquid ejection head according to any one of configurations 1 to 8, wherein the second opening has an opening width of at least 5 μm or more when viewed from a direction perpendicular to the first surface.

[0072] [Configuration 10] 10. The liquid ejection head according to any one of configurations 1 to 9, wherein the second opening has an opening width of at least 10 μm or more when viewed from a direction perpendicular to the first surface.

[0073] [Configuration 11] 11. The liquid ejection head according to any one of configurations 1 to 10, wherein the second opening has an opening width of at least 15 μm or more when viewed from a direction perpendicular to the first surface.

[0074] [Configuration 12] A liquid ejection head described in any one of configurations 1 to 11, wherein, when viewed from a direction perpendicular to the first surface, the ratio of the total area of ​​the first opening and the second opening to the area of ​​the protective member is 70% or less.

[0075] [Configuration 13] 13. The liquid ejection head according to any one of configurations 1 to 12, wherein the second opening has an R-shape when viewed from a direction perpendicular to the first surface.

[0076] [Configuration 14] 14. The liquid ejection head according to configuration 13, wherein the radius of the R shape is 5 μm or more.

[0077] [Configuration 15] 15. The liquid ejection head according to any one of configurations 1 to 14, wherein the first surface is made of resin.

[0078] [Configuration 16] 16. The liquid ejection head according to any one of configurations 1 to 15, wherein the protective member is made of metal.

[0079] [Configuration 17] the ejection substrate includes an energy generating element for ejecting liquid from the ejection port, and a terminal array in which a plurality of terminals for supplying a drive signal or power to the energy generating element are arranged, 2. The liquid ejection head according to configuration 1, wherein the protection member has the second opening between the first opening and the terminal row when viewed from a direction perpendicular to the first surface. [Explanation of symbols]

[0080] 10 Element substrate 12 Discharge port forming member 13 Outlet 14 Discharge port row 15 Recording element 16 terminals 120 Discharge surface 140 Protective material 141 outlet area opening (first opening) 142 Outlet area outer opening (second opening) 150 adhesive 3 Liquid ejection head 300 Liquid Dispensing Unit 40 Flexible wiring board

Claims

1. a discharge substrate having a discharge port array on a first surface, in which a plurality of discharge ports for discharging liquid are arranged; a protection member bonded to the first surface of the ejection substrate via an adhesive and having first openings corresponding to the ejection port arrays; A liquid ejection head having The liquid ejection head, wherein the protection member further includes a second opening between the first opening and an outer edge of the protection member when viewed from a direction perpendicular to the first surface.

2. a discharge substrate having a first surface provided with a plurality of discharge port arrays, each array having a plurality of discharge ports for discharging liquid; a protection member bonded to the first surface of the ejection substrate via an adhesive, the protection member including a plurality of first openings corresponding to the ejection port arrays; A liquid ejection head having The liquid ejection head, wherein the protection member further includes second openings between adjacent first openings when viewed from a direction perpendicular to the first surface.

3. 3. The liquid ejection head according to claim 1, wherein the first surface has a water-repellent area and a non-water-repellent area, and at least a part of the adhesive is disposed in the non-water-repellent area.

4. The liquid ejection head according to claim 3 , wherein the non-water-repellent area has a concave shape.

5. The liquid ejection head according to claim 3 , wherein the non-water-repellent region is provided so as to surround the ejection port array.

6. The liquid ejection head according to claim 3 , wherein the non-water-repellent regions corresponding to different ejection port arrays are provided so as to be continuously connected.

7. The liquid ejection head according to claim 3 , wherein at least a portion of the non-water-repellent region and at least a portion of the second opening are provided substantially parallel to the ejection port array.

8. The liquid ejection head according to claim 7 , wherein the non-water-repellent area corresponding to the first opening and the non-water-repellent area corresponding to the second opening are formed continuously.

9. 3. The liquid ejection head according to claim 1, wherein the second opening has an opening width of at least 5 [mu]m or more when viewed in a direction perpendicular to the first surface.

10. 3. The liquid ejection head according to claim 1, wherein the second opening has an opening width of at least 10 [mu]m or more when viewed from a direction perpendicular to the first surface.

11. 3. The liquid ejection head according to claim 1, wherein the second opening has an opening width of at least 15 [mu]m or more when viewed from a direction perpendicular to the first surface.

12. 3. The liquid ejection head according to claim 1, wherein a ratio of a total area of ​​the first opening and the second opening to an area of ​​the protection member is 70% or less when viewed in a direction perpendicular to the first surface.

13. The liquid ejection head according to claim 1 , wherein the second opening has an R-shape when viewed from a direction perpendicular to the first surface.

14. 14. The liquid ejection head according to claim 13, wherein the radius of the R-shape is 5 [mu]m or more.

15. The liquid ejection head according to claim 1 , wherein the first surface is made of resin.

16. The liquid ejection head according to claim 1 , wherein the protective member is made of metal.

17. the ejection substrate includes an energy generating element for ejecting liquid from the ejection port, and a terminal array in which a plurality of terminals for supplying a drive signal or power to the energy generating element are arranged, The liquid ejection head according to claim 1 , wherein the protection member has the second opening between the first opening and the terminal row when viewed from a direction perpendicular to the first surface.

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