Speaker device

Abstract

To provide a speaker device capable of efficiently radiating heat generated in a circuit unit.SOLUTION: The speaker device 2 includes a housing 3 including a speaker housing 4 and a circuit housing 8, a speaker unit 6 housed inside the speaker housing 4, and a circuit unit 10 housed inside the circuit housing 8. An air layer 48 is formed between the speaker housing 4 and the circuit housing 8. A heat dissipation opening 42 is formed in a side surface of the circuit housing 8 facing the air layer 48. The circuit unit 10 includes an amplifier circuit 58 at least a part of which is exposed to the air layer 48 through the heat dissipation opening 42, and a power supply circuit 62 disposed inside the circuit housing 8. The amplifier circuit 58 is cooled by the air flow flowing through the air layer 48. The power supply circuit 62 is cooled by the air flow flowing inside the circuit housing 8.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present disclosure relates to a speaker device for outputting sound. [Background technology]

[0002] Patent Document 1 discloses a speaker device for outputting sound. This speaker device is a so-called active speaker in which a speaker unit and an amplifier are housed inside a housing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Utility Model Application Publication No. 1-149192 Summary of the Invention [Problem to be solved by the invention]

[0004] In the conventional speaker device described above, if the heat generated in the amplifier is not efficiently dissipated, the temperature of the amplifier may exceed its heat-resistant temperature, causing the amplifier to operate unstable.

[0005] The present disclosure provides a speaker device that can efficiently dissipate heat generated in a circuit unit. [Means for solving the problem]

[0006] The speaker device of the present disclosure comprises a housing including a speaker housing having a sound emission opening on its front side and a circuit housing arranged to face the back side of the speaker housing, a speaker unit housed inside the speaker housing so as to block the sound emission opening of the speaker housing, and a circuit unit housed inside the circuit housing and electrically connected to the speaker unit, wherein an air layer is formed between the speaker housing and the circuit housing, and a heat dissipation opening is formed on the side of the circuit housing facing the air layer, and the circuit unit includes a first heat generating portion at least a portion of which is exposed to the air layer through the heat dissipation opening, and a second heat generating portion arranged inside the circuit housing, wherein the first heat generating portion is cooled by the air flow flowing through the air layer, and the second heat generating portion is cooled by the air flow flowing inside the circuit housing. [Effects of the Invention]

[0007] According to the speaker device of the present disclosure, the heat generated in the circuit unit can be efficiently dissipated. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a perspective view showing the appearance of a speaker device according to an embodiment; [Figure 2] 2 is a perspective view showing the appearance of the speaker device according to the embodiment, as viewed from an angle different from that in FIG. 1. FIG. [Figure 3] 1 is a perspective view showing an internal mechanism of a speaker device according to an embodiment, with a part of a speaker housing being transparent; [Figure 4] 1 is a perspective view showing an internal mechanism of a speaker device according to an embodiment, with a part of a speaker housing being transparent; [Figure 5] 1 is an exploded perspective view showing a part of a speaker device according to an embodiment; [Figure 6] 1 is a perspective view showing a circuit unit of a speaker device according to an embodiment with a back panel removed; [Figure 7]7 is a cross-sectional perspective view of the speaker device according to the embodiment taken along line VII-VII in FIG. [Figure 8] 8 is a cross-sectional perspective view of the speaker device according to the embodiment taken along line VIII-VIII in FIG. [Figure 9] 1 is a perspective view showing a speaker device according to an embodiment; [Figure 10] 1 is a front view showing a speaker device according to an embodiment; [Figure 11] FIG. 2 is a rear view showing the speaker device according to the embodiment. [Figure 12] FIG. 2 is a right side view showing the speaker device according to the embodiment. [Figure 13] 1 is a left side view showing a speaker device according to an embodiment; [Figure 14] 1 is a plan view showing a speaker device according to an embodiment; [Figure 15] FIG. 2 is a bottom view showing the speaker device according to the embodiment. [Figure 16] FIG. 2 is an enlarged view of a portion AA' of the speaker device according to the embodiment. [Figure 17] 2 is a cross-sectional end view taken along line BB', omitting the internal mechanism of the speaker device according to the embodiment. FIG. [Figure 18] FIG. 2 is an enlarged end view of a CC' portion of the speaker device according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, more detailed explanation than necessary may be omitted. For example, detailed explanation of well-known matters or redundant explanation of substantially the same configuration may be omitted. This is to avoid unnecessary redundancy in the following explanation and to facilitate understanding by those skilled in the art.

[0010] The inventors provide the accompanying drawings and the following description to enable those skilled in the art to fully understand the present disclosure, and do not intend for them to limit the subject matter described in the claims.

[0011] (Embodiment) [1. Speaker device configuration] The configuration of a speaker device 2 according to an embodiment will be described with reference to FIGS. 1 to 8. FIG. 1 is a perspective view showing the appearance of the speaker device 2 according to the embodiment. FIG. 2 is a perspective view showing the appearance of the speaker device 2 according to the embodiment when viewed from an angle different from that of FIG. 1. FIGS. 3 and 4 are perspective views showing the internal mechanism of the speaker device 2 according to the embodiment when part of the speaker housing 4 is transparent. FIG. 5 is an exploded perspective view showing a part of the speaker device 2 according to the embodiment when disassembled. FIG. 6 is a perspective view showing the circuit unit 10 of the speaker device 2 according to the embodiment when the back panel 36 is removed. FIG. 7 is a cross-sectional perspective view of the speaker device 2 according to the embodiment taken along line VII-VII in FIG. 1. FIG. 8 is a cross-sectional perspective view of the speaker device 2 according to the embodiment taken along line VIII-VIII in FIG. 1.

[0012] 1 to 8, the left-right direction of the speaker device 2 is the X-axis direction, the front-rear direction of the speaker device 2 is the Y-axis direction, and the up-down direction of the speaker device 2 is the Z-axis direction. The positive side of the X-axis is the "right," the negative side of the X-axis is the "left," the positive side of the Y-axis is the "rear," the negative side of the Y-axis is the "front," the positive side of the Z-axis is the "up," and the negative side of the Z-axis is the "down."

[0013] 1 to 4, the speaker device 2 includes a housing 3, a speaker unit 6, and a circuit unit 10. The housing 3 includes a speaker housing 4 and a circuit housing 8. The speaker device 2 is a so-called active speaker.

[0014] The speaker housing 4 is a box-shaped speaker box for accommodating the speaker unit 6. The speaker housing 4 has a front panel 12, a back panel 14, a right side panel 16, a left side panel 18, a top panel 20, and a bottom panel 22.

[0015] The front panel 12 and the back panel 14 are arranged to face each other in the front-to-back direction (Y-axis direction). The front panel 12 forms the front surface of the speaker housing 4. The back panel 14 forms the back surface (the surface opposite to the front surface) of the speaker housing 4. As shown in FIGS. 1, 3, and 4, a circular sound emission opening 24 is formed in the approximate center of the front panel 12 to emit sound from the diaphragm of the speaker unit 6 to the outside of the speaker housing 4. The sound emission opening 24 may support the frame of the speaker unit 6.

[0016] The right side plate 16 and the left side plate 18 are disposed opposite each other in the left-right direction (X-axis direction). The right side plate 16 constitutes the right side of the speaker housing 4 and extends from the side of the front plate 12, past the side of the back plate 14, and further rearward than the back plate 14. The left side plate 18 constitutes the left side of the speaker housing 4 (the side opposite the right side) and extends from the side of the front plate 12, past the side of the back plate 14, and further rearward than the back plate 14. As shown in FIGS. 1 and 3, an intake hole 26 communicating with an air space 48 (described later) is formed in the lower end of the right side plate 16 (i.e., the lower end of the housing 3). As shown in FIGS. 2 and 4, an intake hole 28 communicating with the air space 48 is formed in the lower end of the left side plate 18 (i.e., the lower end of the housing 3). For convenience of explanation, FIGS. 3 and 4 show portions of the right side plate 16 and the left side plate 18 in a see-through manner.

[0017] The top plate 20 and the bottom plate 22 are disposed so as to face each other in the up-down direction (Z-axis direction). The top plate 20 constitutes the top surface of the speaker housing 4 and extends from the upper end of the front plate 12, past the upper end of the back plate 14, and further rearward than the back plate 14. The bottom plate 22 constitutes the bottom surface (the surface opposite the top surface) of the speaker housing 4 and extends from the lower end of the front plate 12, past the lower end of the back plate 14, and further rearward than the back plate 14. As shown in FIGS. 1, 3, and 4, an exhaust hole 30 communicating with the air layer 48 is formed in the top plate 20 (i.e., the upper end of the housing 3). The exhaust hole 30 is formed by a plurality of slits (long holes) arranged side by side in the left-right direction, and each slit is formed elongated in the front-rear direction. The exhaust hole 30 is disposed in a position on the top plate 20 directly above the air layer 48 and covers almost the entire width of the air layer 48 in the left-right direction. In this embodiment, the exhaust hole portion 30 is configured with a plurality of slits, but is not limited to this and may be configured with, for example, (a) a plurality of circular or elliptical round holes, (b) a plurality of polygonal angular holes, or (c) a mesh, etc.

[0018] The speaker unit 6 is an acoustic unit for outputting sound, and includes a diaphragm, a voice coil, etc. The speaker unit 6 is housed inside the speaker housing 4 so as to close the sound emission opening 24 in the front panel 12 of the speaker housing 4. Sound from the diaphragm of the speaker unit 6 is emitted to the outside of the speaker housing 4 through the sound emission opening 24. A cylindrical bass reflex port 32 is disposed inside the speaker housing 4 to communicate between the inside and outside of the speaker housing 4. Note that, in this embodiment, a bass reflex port type in which the bass reflex port 32 is disposed inside the speaker housing 4 is used, but the present invention is not limited to this. A passive radiator type may be adopted instead of the bass reflex port type, or a type other than the bass reflex port type and the passive radiator type (for example, a sealed type) may be adopted.

[0019] The circuit housing 8 is a box-shaped circuit box for accommodating the circuit unit 10. As shown in FIGS. 2 to 5, the circuit housing 8 has a front plate 34, a back plate 36, a right side plate 38, a left side plate 40, a top plate 20, and a bottom plate 22.

[0020] The front plate 34 and the back plate 36 are disposed so as to face each other in the front-rear direction. The front plate 34 constitutes the front surface of the circuit housing 8. The back plate 36 constitutes the back surface (the surface opposite to the front surface) of the circuit housing 8. As shown in FIG. 5, a substantially rectangular heat dissipation opening 42 is formed in the front plate 34. That is, the heat dissipation opening 42 is formed on the side surface of the circuit housing 8 that faces the air layer 48. As shown in FIG. 6, an intake hole 44 that communicates with the interior of the circuit housing 8 is formed in the lower end portion of the back plate 36 (i.e., the lower end portion of the circuit housing 8). The intake hole 44 is composed of a plurality of slits (long holes) arranged in a row in the left-right direction, and each slit is formed elongated in the up-down direction. An exhaust hole 46 that communicates with the interior of the circuit housing 8 is formed in the upper end portion of the back plate 36 (i.e., the upper end portion of the circuit housing 8). The exhaust hole 46 is composed of a plurality of slits (long holes) arranged in a row along the left-right direction, and each slit is formed long in the up-down direction. In this embodiment, the intake hole 44 and the exhaust hole 46 are each composed of a plurality of slits, but this is not limited thereto, and they may be composed of, for example, (a) a plurality of circular or elliptical round holes, (b) a plurality of polygonal angular holes, or (c) a mesh, etc.

[0021] The right side plate 38 and the left side plate 40 are arranged to face each other in the left-right direction. The right side plate 38 forms the right side surface of the circuit housing 8. The left side plate 40 forms the left side surface (the surface opposite the right side surface) of the circuit housing 8. The right side plate 38 and the left side plate 40 are arranged to face the inner surfaces of the right side plate 16 and the left side plate 18 of the speaker housing 4, respectively.

[0022] The front plate 34, right side plate 38, and left side plate 40 are integrally formed by, for example, pressing a metal plate, and are formed into a substantially U-shape when viewed in the XY plane. The back plate 36 is detachably attached to each side of the right side plate 38 and left side plate 40 with screws.

[0023] The top plate 20 and the bottom plate 22 are arranged to face each other in the vertical direction. The top plate 20 is also used as the top plate 20 of the speaker housing 4 described above, and constitutes the top surface of the circuit housing 8. The bottom plate 22 is also used as the bottom plate 22 of the speaker housing 4 described above, and constitutes the bottom surface of the circuit housing 8 (the surface opposite to the top surface).

[0024] In this embodiment, the top plate 20 and the bottom plate 22 of the circuit housing 8 also serve as the top plate 20 and the bottom plate 22 of the speaker housing 4, but this is not limiting, and the top plate and the bottom plate of the circuit housing 8 may be configured as separate pieces from the top plate 20 and the bottom plate 22 of the speaker housing 4. In this case, the above-mentioned exhaust hole 30 will be formed in either the top plate of the speaker housing 4 or the top plate of the circuit housing 8.

[0025] 3 and 4, the front plate 34 of the circuit housing 8 is disposed so as to face the back plate 14 of the speaker housing 4. That is, the front plate 34 of the circuit housing 8 is disposed at a position spaced rearward from the back plate 14 of the speaker housing 4. As a result, an air layer 48 is formed between the front plate 34 of the circuit housing 8 and the back plate 14 of the speaker housing 4. The thickness of the air layer 48 in the front-to-rear direction, i.e., the distance between the front plate 34 of the circuit housing 8 and the back plate 14 of the speaker housing 4, is, for example, approximately 8 mm. In addition to functioning as a heat dissipation path, which will be described later, the air layer 48 also functions to block vibrations of the speaker housing 4 from being transmitted to the circuit housing 8 when sound is output from the speaker unit 6.

[0026] As shown in FIG. 6 , a metal, plate-shaped partition member 50 is disposed in approximately the center of the interior of the circuit housing 8 in the left-right direction. The partition member 50 divides the interior of the circuit housing 8 into two spaces, a first internal space 52 and a second internal space 54, which are arranged side by side in the left-right direction. The first internal space 52 is formed between the partition member 50 and the right side plate 38 of the circuit housing 8. The second internal space 54 is formed between the partition member 50 and the left side plate 40 of the circuit housing 8. The partition member 50 also functions as a noise guard plate for blocking noise generated in a power supply circuit 62 (described below). The partition member 50 does not necessarily have to completely divide the interior of the circuit housing 8 into the first internal space 52 and the second internal space 54; air may circulate between the first internal space 52 and the second internal space 54.

[0027] The intake holes 44 of the back plate 36 cover almost the entire width in the left-right direction of the first internal space 52 and the second internal space 54 of the circuit housing 8. The exhaust holes 46 of the back plate 36 cover almost the entire width in the left-right direction of the first internal space 52 and the second internal space 54 of the circuit housing 8.

[0028] The circuit unit 10 is housed inside the circuit housing 8 and is electrically connected to the speaker unit 6 via a cable 56. As shown in FIGS. 6 to 8, the circuit unit 10 has an amplifier circuit 58 (an example of a first heat generating portion), a signal processing circuit 60 (an example of a third heat generating portion), and a power supply circuit 62 (an example of a second heat generating portion).

[0029] The amplifier circuit 58 amplifies the audio signal processed by the signal processing circuit 60 and outputs the amplified audio signal to the speaker unit 6. The amplifier circuit 58 is disposed in the second internal space 54 of the circuit housing 8 and includes a substrate 64, an electronic component group 66, and a heat sink 68. The substrate 64 is disposed opposite the front plate 34 of the circuit housing 8 and is disposed between the front plate 34 and the signal processing circuit 60. The electronic component group 66 is mounted on the substrate 64. The heat sink 68 is used to dissipate heat from an amplifier IC (Integrated Circuit) 70, which is an electronic component that generates a relatively large amount of heat among the electronic component group 66, and is formed of a metal with high heat dissipation properties, such as aluminum. As shown in FIGS. 5 and 8 , the heat sink 68 is supported on the substrate 64 so as to be in heat-transferable contact with the amplifier IC 70 and is exposed to the air layer 48 through the heat dissipation opening 42 in the front plate 34 of the circuit housing 8. Specifically, a portion of the heat sink 68 protrudes into the air layer 48 through the heat dissipation opening 42 in the front plate 34 of the circuit housing 8 .

[0030] The signal processing circuit 60 is a circuit for processing an audio signal input from outside the speaker device 2 (for example, a music player, a smartphone, etc.). The signal processing circuit 60 is disposed in the second internal space 54 of the circuit housing 8, and includes a substrate 72 and a group of electronic components 74. The substrate 72 is disposed to face the back plate 36 of the circuit housing 8, and is disposed between the back plate 36 and the amplifier circuit 58. That is, in the front-to-rear direction (Y-axis direction) of the second internal space 54, the amplifier circuit 58 is disposed on the front side of the second internal space 54, and the signal processing circuit 60 is disposed on the rear side of the second internal space 54. The group of electronic components 74 is mounted on the substrate 72.

[0031] The power supply circuit 62 is a circuit for supplying power to the speaker unit 6. The power supply circuit 62 is disposed in the first internal space 52 of the circuit housing 8, and has a board 76 and an electronic component group 78. The board 76 is disposed so as to face the front plate 34 of the circuit housing 8, and is disposed between the front plate 34 and the back plate 36. The electronic component group 78 is mounted on the board 76.

[0032] 6 and 7, a guide member 80 is disposed inside the circuit housing 8 above the power supply circuit 62. The guide member 80 is a member for guiding the airflow flowing upward in the first internal space 52 of the circuit housing 8 to the exhaust hole 46. The guide member 80 is disposed so as to provide a barrier between the first internal space 52 of the circuit housing 8 and the air layer 48.

[0033] [2. Heat dissipation path for speaker device] The heat dissipation path of the speaker device 2 according to the embodiment will be described with reference to FIGS. 3, 4, and 6 to 8. FIG.

[0034] In the present embodiment, the amount of heat generated in the circuit unit 10 is greatest for the power supply circuit 62, second greatest for the amplifier circuit 58, and least for the signal processing circuit 60. In relation to this, in the speaker device 2, a heat dissipation path for dissipating heat generated in the amplifier circuit 58, a heat dissipation path for dissipating heat generated in the signal processing circuit 60, and a heat dissipation path for dissipating heat generated in the power supply circuit 62 are all separate.

[0035] First, we will explain the heat dissipation path for dissipating the heat generated in the amplifier circuit 58. Most of the heat generated in the amplifier circuit 58 is generated in the amplifier IC 70, which uses a large current, so it is necessary to mainly dissipate the heat generated in the amplifier IC 70. For this reason, as shown in Figures 4 and 8, the heat sink 68 for dissipating heat from the amplifier IC 70 is exposed to the air layer 48 through the heat dissipation opening 42 in the front panel 34 of the circuit housing 8.

[0036] Heat generated in the amplifier IC 70 (i.e., part of the amplifier circuit 58) is transferred to the heat sink 68 and dissipated from the heat sink 68. As shown in FIGS. 3 and 7, the heat sink 68 is cooled by the airflow that is drawn in through the intake holes 26 of the right side plate 16 and flows upward through the air layer 48. The airflow heated by the heat of the heat sink 68 flows further upward through the air layer 48 and is then discharged to the outside of the speaker device 2 through the exhaust holes 30 of the top plate 20. As shown in FIGS. 4 and 8, the heat sink 68 is cooled by the airflow that is drawn in through the intake holes 28 of the left side plate 18 and flows upward through the air layer 48. The airflow heated by the heat of the heat sink 68 flows further upward through the air layer 48 and is then discharged to the outside of the speaker device 2 through the exhaust holes 30 of the top plate 20. That is, the amplifier IC 70 is cooled by the airflow flowing upward through the air layer 48 via the heat sink 68 .

[0037] Next, a heat dissipation path for dissipating (cooling) heat generated in the power supply circuit 62 will be described. As shown in FIGS. 6 and 7 , the power supply circuit 62 is cooled by airflow that is drawn in through the air intake holes 44 of the back panel 36 and flows upward through the first internal space 52. The airflow heated by the heat generated in the power supply circuit 62 flows further upward through the first internal space 52, and is then guided by the guide member 80 to the exhaust holes 46 of the back panel 36 and discharged from the exhaust holes 46 to the outside of the speaker device 2. That is, the power supply circuit 62 is cooled by the airflow flowing upward through the first internal space 52. At this time, the guide member 80 can prevent the airflow flowing upward through the first internal space 52 (i.e., the airflow that is hotter than the airflow flowing upward through the air layer 48) from flowing into the air layer 48.

[0038] Next, a heat dissipation path for dissipating heat generated in the signal processing circuit 60 will be described. As shown in Fig. 6 and Fig. 8, the signal processing circuit 60 is cooled by the airflow that is drawn in through the air intake holes 44 of the back panel 36 and flows upward through the second internal space 54. The airflow heated by the heat generated in the signal processing circuit 60 flows further upward through the second internal space 54, and then is discharged to the outside of the speaker device 2 through the air exhaust holes 46 of the back panel 36. In other words, the signal processing circuit 60 is cooled by the airflow that flows upward through the second internal space 54.

[0039] In the present embodiment, the guide member 80 is disposed above the power supply circuit 62 inside the circuit housing 8, but this is not limiting. For example, the guide member 80 may be disposed above the signal processing circuit 60 inside the circuit housing 8. In this case, the guide member 80 guides the airflow flowing upward through the second internal space 54 of the circuit housing 8 to the exhaust hole 46. Alternatively, a pair of guide members 80 may be provided, with one guide member 80 disposed above the power supply circuit 62 inside the circuit housing 8 and the other guide member 80 disposed above the signal processing circuit 60 inside the circuit housing 8. Alternatively, if the air layer 48 and the first internal space 52 (or the second internal space 54) are appropriately separated, the guide member 80 may be omitted.

[0040] [3.Effects] The following describes the effects achieved by the speaker device 2 according to the embodiment. If the heat generated in the amplifier circuit 58 and the heat generated in the power supply circuit 62 were to be dissipated through the same heat dissipation path, the amount of heat generated in the power supply circuit 62 would be greater than the amount of heat generated in the amplifier circuit 58. Therefore, the airflow heated by the heat generated in the power supply circuit 62 would be hotter than the airflow heated by the heat generated in the amplifier circuit 58. Since the hotter airflow moves upward through the heat dissipation path, the airflow on the power supply circuit 62 side is preferentially discharged to the outside of the speaker device 2. Meanwhile, the airflow on the amplifier circuit 58 side is further heated and is less likely to be discharged to the outside of the speaker device 2 until it reaches approximately the same temperature as the airflow on the power supply circuit 62 side. Therefore, the temperature of the amplifier circuit 58 increases without promoting heat dissipation. If the heat resistance temperature of the amplifier circuit 58 is lower than that of the power supply circuit 62, the temperature of the amplifier circuit 58 may exceed its heat resistance temperature. As a result, the operation of the amplifier circuit 58 (particularly the operation of the amplifier IC 70) becomes unstable.

[0041] Similarly, even if the heat generated by the signal processing circuit 60 and the heat generated by the power supply circuit 62 were to be dissipated through the same heat dissipation path, for the same reason as above, if the heat resistance temperature of the signal processing circuit 60 is lower than that of the power supply circuit 62, the temperature of the signal processing circuit 60 may exceed the heat resistance temperature. As a result, the operation of the signal processing circuit 60 may become unstable.

[0042] In contrast to this, in the present embodiment, as described above, the amplifier circuit 58, the signal processing circuit 60, and the power supply circuit 62 are housed inside the same circuit housing 8, and the heat dissipation path for dissipating heat generated by the amplifier circuit 58, the heat dissipation path for dissipating heat generated by the signal processing circuit 60, and the heat dissipation path for dissipating heat generated by the power supply circuit 62 are all separate. This makes it possible to efficiently dissipate heat generated by the circuit unit 10 while preventing the operations of the amplifier circuit 58 and the signal processing circuit 60 from becoming unstable due to the influence of the temperature of the airflow that dissipated heat from the power supply circuit 62.

[0043] The heat dissipation path for dissipating heat generated by the amplifier circuit 58, the heat dissipation path for dissipating heat generated by the signal processing circuit 60, and the heat dissipation path for dissipating heat generated by the power supply circuit 62 do not need to be completely separated from each other; it is sufficient that the main heat dissipation paths of the amplifier circuit 58, the signal processing circuit 60, and the power supply circuit 62 are separated. In this specification, "separated heat dissipation paths" means that the heat dissipation paths via airflow are separated. Here, heat dissipation paths via thermal conduction, for example, from a circuit board, chassis, exterior body, etc., naturally exist, but will not be specifically mentioned in this specification.

[0044] [4. Speaker device design] In the speaker device according to the embodiment, the portions indicated by solid lines in Figs. 9 to 18 (portions corresponding to the above-mentioned exhaust hole portion 30) are excellent in terms of partial design. Fig. 9 is a perspective view showing the speaker device according to the embodiment. Fig. 10 is a front view showing the speaker device according to the embodiment. Fig. 11 is a rear view showing the speaker device according to the embodiment. Fig. 12 is a right side view showing the speaker device according to the embodiment. Fig. 13 is a left side view showing the speaker device according to the embodiment. Fig. 14 is a plan view showing the speaker device according to the embodiment. Fig. 15 is a bottom view showing the speaker device according to the embodiment. Fig. 16 is an enlarged view of the A-A' portion of the speaker device according to the embodiment. Fig. 17 is an end view of the speaker device according to the embodiment cut along line B-B', omitting the internal mechanism. Fig. 18 is an enlarged end view of the C-C' portion of the speaker device according to the embodiment.

[0045] 9 to 18 are diagrams in which the exhaust holes (multiple slits) are indicated by solid lines and other parts are indicated by dashed lines. In Fig. 9 to 18, the parts indicated by solid lines are the "parts for which a partial design registration is sought" if a partial design registration application is filed for the speaker device according to the embodiment, and the parts indicated by dashed lines are the "parts other than the part for which a partial design registration is sought." The enlarged view of the A-A' part, the end view of the cross section taken along line B-B', and the enlarged cross-sectional view of the C-C' part identify the parts for which a partial design registration is sought.

[0046] (Addendum) (Technology 1) a speaker unit housed inside the speaker housing so as to close the sound emission opening of the speaker housing; and a circuit unit housed inside the circuit housing and electrically connected to the speaker unit, wherein an air layer is formed between the speaker housing and the circuit housing, and a heat dissipation opening is formed on a side of the circuit housing facing the air layer, and the circuit unit includes a first heat generating portion at least a portion of which is exposed to the air layer through the heat dissipation opening, and a second heat generating portion disposed inside the circuit housing, wherein the first heat generating portion is cooled by an air flow flowing through the air layer, and the second heat generating portion is cooled by an air flow flowing inside the circuit housing.

[0047] According to Technology 1, the first heat-generating portion is cooled by an airflow flowing through the air layer. Furthermore, the second heat-generating portion is cooled by an airflow flowing inside the circuit housing. This allows the heat dissipation path for dissipating heat generated in the first heat-generating portion and the heat dissipation path for dissipating heat generated in the second heat-generating portion to be separated from each other. As a result, it is possible to prevent the operation of one of the first heat-generating portion and the second heat-generating portion from becoming unstable due to the influence of the temperature of the airflow that dissipated heat from the other of the first heat-generating portion and the second heat-generating portion, and it is possible to efficiently dissipate heat generated in the circuit unit.

[0048] (Technology 2) The speaker device according to Technology 1, wherein an intake hole portion communicating with the air layer is formed at the lower end of the housing, and an exhaust hole portion communicating with the air layer is formed at the upper end of the housing, the first heat-generating portion is cooled by an air flow that is drawn in through the intake hole portion and flows upward through the air layer, and the air flow heated by the heat generated in the first heat-generating portion is discharged from the exhaust hole portion.

[0049] According to the second technique, the first heat generating portion can be efficiently cooled by the air flow flowing upward through the air layer.

[0050] (Technology 3) The speaker device according to Technology 1 or 2, wherein an intake hole portion communicating with the interior of the circuit housing is formed at the lower end of the circuit housing, and an exhaust hole portion communicating with the interior of the circuit housing is formed at the upper end of the circuit housing, the second heat-generating portion is cooled by an air flow that is drawn in from the intake hole portion and flows upward inside the circuit housing, and the air flow heated by the heat generated in the second heat-generating portion is discharged from the exhaust hole portion.

[0051] According to the third technique, the second heat-generating portion can be efficiently cooled by the airflow flowing upward inside the circuit housing.

[0052] (Technology 4) The circuit unit further includes a third heat generating portion disposed inside the circuit housing, and the speaker device further includes a partition member disposed inside the circuit housing and dividing the interior of the circuit housing into a first internal space and a second internal space, which are two spaces arranged side by side on the left and right, the second heat generating portion and the third heat generating portion are disposed in the first internal space and the second internal space, respectively, the second heat generating portion is cooled by an airflow that is taken in through the air intake hole and flows upward through the first internal space of the circuit housing, the airflow heated by the heat generated in the second heat generating portion is discharged from the air exhaust hole, the third heat generating portion is cooled by an airflow that is taken in through the air intake hole and flows upward through the second internal space of the circuit housing, and the airflow heated by the heat generated in the third heat generating portion is discharged from the air exhaust hole.

[0053] According to Technology 4, the heat dissipation path for dissipating heat generated in the second heat generating portion and the heat dissipation path for dissipating heat generated in the third heat generating portion can be separated from each other. As a result, it is possible to prevent the operation of one of the second heat generating portion and the third heat generating portion from becoming unstable due to the influence of the temperature of the airflow that dissipated heat from the other of the second heat generating portion and the third heat generating portion, and it is possible to efficiently dissipate heat generated in the circuit unit.

[0054] (Technology 5) The speaker device according to technology 4, wherein a guide member is disposed inside the circuit housing to guide the airflow flowing upward through the first internal space of the circuit housing or the airflow flowing upward through the second internal space of the circuit housing to the exhaust hole portion.

[0055] According to the fifth technique, the guide member can efficiently guide the airflow flowing upward in the first internal space of the circuit housing or the airflow flowing upward in the second internal space to the exhaust hole.

[0056] (Technology 6) The speaker device described in Technology 4 or 5, wherein the third heat generating portion is a signal processing circuit for processing an audio signal input from the outside, the first heat generating portion is an amplifier circuit for amplifying the audio signal processed by the signal processing circuit and outputting the amplified audio signal to the speaker unit, and the second heat generating portion is a power supply circuit for supplying power to the speaker unit.

[0057] According to Technique 6, when the first heat-generating portion is an amplifier circuit, the second heat-generating portion is a power supply circuit, and the third heat-generating portion is a signal processing circuit, the heat generated in the circuit unit can be efficiently dissipated.

[0058] (Other embodiments) As described above, the embodiments have been described as examples of the technology disclosed in this application. However, the technology in this disclosure is not limited to these, and can be applied to embodiments in which appropriate modifications, substitutions, additions, omissions, etc. are made. Furthermore, it is also possible to combine the components described in the above embodiments to create new embodiments.

[0059] Therefore, other embodiments will be exemplified below.

[0060] In the above embodiment, the air intake hole 26 is formed in the lower end of the right side plate 16 of the speaker housing 4, and the air intake hole 28 is formed in the lower end of the left side plate 18 of the speaker housing 4, but this is not limiting. For example, if the right side plate 38 and the left side plate 40 of the circuit housing 8 are not disposed opposite the inner surfaces of the right side plate 16 and the left side plate 18 of the speaker housing 4, respectively, and are exposed to the outside of the speaker device 2, the air intake hole may be formed in the lower end of the right side plate 38 of the circuit housing 8 (i.e., the lower end of the housing 3), and the air intake hole may be formed in the lower end of the left side plate 40 of the circuit housing 8 (i.e., the lower end of the housing 3).

[0061] Furthermore, in the above embodiment, a portion of the amplifier circuit 58 (heat sink 68) is exposed to the air layer 48 through the heat dissipation opening 42 of the circuit housing 8, but this is not limited to this, and the entire amplifier circuit 58 may be exposed to the air layer 48 through the heat dissipation opening 42 of the circuit housing 8.

[0062] Furthermore, in the above embodiment, the first heat generating portion, the second heat generating portion, and the third heat generating portion are respectively the amplifier circuit 58, the power supply circuit 62, and the signal processing circuit 60, but this is not limited to this, and the first heat generating portion, the second heat generating portion, and the third heat generating portion may be combined with the amplifier circuit 58, the power supply circuit 62, and the signal processing circuit 60 in any combination.

[0063] Furthermore, the above-described speaker device 2 may be, for example, a bookshelf type, a floor type, or a speaker that is suspended from the ceiling.

[0064] As described above, the embodiments have been described as examples of the technology in the present disclosure, and for that purpose, the accompanying drawings and detailed description have been provided.

[0065] Therefore, the components shown in the accompanying drawings and detailed description may include not only essential components for solving the problem, but also components that are not essential for solving the problem in order to illustrate the above technology. Therefore, the fact that these non-essential components are shown in the accompanying drawings or detailed description should not be interpreted as immediately indicating that these non-essential components are essential.

[0066] Furthermore, since the above-described embodiments are intended to illustrate the technology of the present disclosure, various modifications, substitutions, additions, omissions, etc. may be made within the scope of the claims or their equivalents. [Industrial Applicability]

[0067] The speaker device according to the present disclosure is applicable to, for example, an active speaker. [Explanation of symbols]

[0068] 2. Speaker equipment 3. Housing 4 Speaker housing 6 speaker units 8 Circuit housing 10 Circuit Unit 12,34 Front panel 14,36 backboard 16,38 Right side plate 18,40 Left side plate 20 Top plate 22 Bottom plate 24 Sound emission opening 26, 28, 44 Intake holes 30,46 Exhaust hole 32 Bass reflex port 42 Heat dissipation opening 48 Air Layer 50 Partition member 52 First Interior Space 54 Second Interior Space 56 Cable 58 Amplifier Circuit 60 Signal Processing Circuit 62 Power supply circuit 64, 72, 76 board 66, 74, 78 Electronic Components 68 Heatsink 70 Amplifier IC 80 Guide member

Claims

1. a housing including a speaker housing having a sound emitting opening on a front surface thereof and a circuit housing arranged to face the rear surface of the speaker housing; a speaker unit accommodated inside the speaker housing so as to close the sound emission opening of the speaker housing; a circuit unit housed inside the circuit housing and electrically connected to the speaker unit; an air layer is formed between the speaker housing and the circuit housing; a heat dissipation opening is formed on a side surface of the circuit housing facing the air layer, The circuit unit includes: a first heat generating portion at least a portion of which is exposed to the air layer through the heat dissipation opening; a second heat generating portion disposed inside the circuit housing, the first heat-generating portion is cooled by an air flow flowing through the air layer, The second heat generating portion is cooled by the air flowing inside the circuit housing. Speaker device.

2. an intake hole communicating with the air layer is formed at a lower end of the housing; An exhaust hole communicating with the air layer is formed at the upper end of the housing, The first heat generating portion is cooled by an air flow that is drawn in through the intake hole and flows upward through the air layer, and the air flow that is heated by the heat generated in the first heat generating portion is discharged through the exhaust hole.

2. The speaker device according to claim 1.

3. an intake hole portion communicating with the inside of the circuit housing is formed at a lower end portion of the circuit housing; an exhaust hole portion communicating with the inside of the circuit housing is formed at an upper end portion of the circuit housing; The second heat generating portion is cooled by the airflow that is drawn in through the intake hole and flows upward inside the circuit housing, and the airflow that is heated by the heat generated in the second heat generating portion is discharged through the exhaust hole.

2. The speaker device according to claim 1.

4. the circuit unit further includes a third heat generating portion disposed inside the circuit housing, the speaker device further includes a partition member disposed inside the circuit housing and partitioning the interior of the circuit housing into two spaces, a first internal space and a second internal space, arranged side by side on the left and right; the second heat generating portion and the third heat generating portion are disposed in the first internal space and the second internal space, respectively; the second heat-generating portion is cooled by an airflow that is drawn in through the air intake hole and flows upward through the first internal space of the circuit housing, and the airflow that is heated by the heat generated in the second heat-generating portion is discharged through the air exhaust hole; The third heat-generating portion is cooled by an air flow that is drawn in through the intake hole and flows upward through the second internal space of the circuit housing, and the air flow that is heated by the heat generated in the third heat-generating portion is discharged through the exhaust hole.

4. The speaker device according to claim 3.

5. A guide member is disposed inside the circuit housing to guide the airflow flowing upward through the first internal space of the circuit housing or the airflow flowing upward through the second internal space to the exhaust hole.

5. The speaker device according to claim 4.

6. the third heat generating portion is a signal processing circuit for processing an audio signal input from an external source, the first heat generating portion is an amplifier circuit for amplifying the audio signal processed by the signal processing circuit and outputting the amplified audio signal to the speaker unit; The second heat generating portion is a power supply circuit for supplying power to the speaker unit.

6. The speaker device according to claim 4 or 5.

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