Inspection method and processing apparatus

Abstract

To provide an inspection method and a processing device capable of quickly detecting wafer cracks and suppressing a decrease in yield.SOLUTION: The inspecting method includes a processing step 201 of processing the workpiece placed on the holding surface of the holding table, a holding step 202 of holding the workpiece placed on the holding surface of the holding table by the carrying unit after the processing step 201 is carried out, and an inspecting step 203 of inspecting whether or not part of the workpiece is left on the holding surface of the holding table after the holding step 202 is carried out.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an inspection method and a processing apparatus. [Background technology]

[0002] In the device manufacturing process, a widely known method is the so-called pre-dicing method, in which grooves of a predetermined depth are formed from the surface of a semiconductor wafer along the streets on which devices are formed, and then the back surface of the wafer is ground to separate it into individual device chips (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-103567 Summary of the Invention [Problem to be solved by the invention]

[0004] However, forming grooves on the surface of a semiconductor wafer weakens the wafer, which can lead to the wafer breaking into large pieces when the wafer is released from the holding table by the blowing of fluid. Wafers on the holding table are typically transported using a transfer arm with a non-contact suction holding unit (Bernoulli pad). However, as mentioned above, if the divided pieces are large, the wafer may be held by the non-contact suction holding unit (Bernoulli pad) of the transfer arm. In this case, the wafer may be transported to a cassette without being noticed to be broken, and the broken wafer may fall inside the cassette and damage other wafers. Furthermore, if a new wafer is transported without noticing that a broken wafer remains on the holding table, it may be placed on top of the broken wafer, damaging the unprocessed wafer.

[0005] The present invention has been made in view of the above problems, and its object is to provide an inspection method and processing apparatus that can quickly detect wafer cracks and prevent a decrease in yield. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the inspection method of the present invention is characterized by including a processing step of processing a workpiece placed on a holding surface of a holding table, a holding step of holding the workpiece placed on the holding surface of the holding table with a transport unit after the processing step is performed, and an inspection step of inspecting whether or not any part of the workpiece remains on the holding surface of the holding table after the holding step is performed.

[0007] In the inspection method of the present invention, the inspection step may inspect whether or not a part of the workpiece remains on the holding surface of the holding table by imaging the holding surface of the holding table with an imaging unit.

[0008] In the inspection method of the present invention, the inspection step may inspect whether or not a part of the workpiece remains on the holding surface of the holding table by measuring the height of the holding surface of the holding table.

[0009] In addition, the processing apparatus of the present invention is a processing apparatus for processing a workpiece, comprising a holding table having a holding surface for holding the workpiece, a processing unit for processing the workpiece held on the holding table, a transport unit for transporting the workpiece held on the holding surface from the holding table to another area, and a controller, and further comprising an inspection unit for inspecting the holding surface of the holding table, wherein the controller is capable of controlling the processing unit to process the workpiece, controlling the transport unit to hold the workpiece processed by the processing unit, and controlling the inspection unit to inspect whether or not any part of the workpiece remains on the holding surface of the holding table after the workpiece is held by the transport unit.

[0010] In the processing apparatus of the present invention, the inspection unit may be an imaging unit capable of imaging the holding surface of the holding table.

[0011] In the processing apparatus of the present invention, the inspection unit may be a height measurement unit capable of measuring the height of the holding surface of the holding table. [Effects of the Invention]

[0012] The present invention can quickly detect wafer cracks and prevent a decrease in yield. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a processing device according to an embodiment. [Figure 2] FIG. 2 is a flowchart showing the flow of the inspection method according to the embodiment. [Figure 3] FIG. 3 is a schematic side view showing an example of the processing step shown in FIG. [Figure 4] FIG. 4 is a schematic side view showing one state of the holding step shown in FIG. [Figure 5] FIG. 5 is a schematic side view showing another state of the holding step shown in FIG. [Figure 6] FIG. 6 is a schematic side view showing a first example of the inspection step shown in FIG. [Figure 7] FIG. 7 is a schematic side view showing a second example of the inspection step shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0014] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0015] [Embodiment] [Processing equipment] First, a processing device according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of the configuration of the processing device according to the embodiment. The processing device is a device that processes a workpiece 100, and in the embodiment, it is a cutting device 1 that performs cutting processing. In the following description, the X-axis direction is one direction in a horizontal plane, the Y-axis direction is a direction perpendicular to the X-axis direction in the horizontal plane, and the Z-axis direction is a direction perpendicular to the X-axis direction and the Y-axis direction. In the cutting device 1 of the embodiment, the processing feed direction is the X-axis direction, the indexing feed direction is the Y-axis direction, and the cutting feed direction is the Z-axis direction.

[0016] The cutting device 1 of the embodiment includes a base 2, a holding table 10, a processing unit, an inspection unit 30, a cassette mounting table 40, a cleaning unit 50, a carry-in / out unit 60, two transport units 70, a controller 80, and an alarm device 90. The cutting device 1 shown in Fig. 1 includes two cutting units 20 as processing units, i.e., it is a two-spindle dicer, a so-called facing dual type device, but the present invention is not limited to this.

[0017] A first opening 3 having a rectangular shape elongated in the X-axis direction in a plan view, a second opening 4 having a rectangular shape, and a third opening 5 having a circular shape are formed on the upper surface of the base 2. A holding table 10 (described later) and the like are provided in the first opening 3. The second opening 4 is formed in a position adjacent to the first opening 3 in the Y-axis direction. A cassette mounting table 40 (described later) is provided in the second opening 4. The third opening 5 is formed in a position adjacent to the first opening 3 in the Y-axis direction on the opposite side from the second opening 4. A cleaning unit 50 (described later) is provided in the third opening 5.

[0018] Furthermore, a gate-shaped first frame 6 and a gate-shaped second frame 7 are provided side by side in the X-axis direction on the upper surface of the base 2, and are arranged so as to straddle the first opening 3 in the Y-axis direction. A cutting unit 20, which will be described later, is movably provided on the first frame 6. Two transport units 70, which will be described later, are movably provided on the second frame 7.

[0019] The holding table 10 holds the workpiece 100 on a holding surface 11. The holding table 10 includes, for example, a disk-shaped frame body with a recess formed therein and a disk-shaped suction portion fitted into the recess. The suction portion of the holding table 10 is formed from a porous ceramic or the like with numerous porous holes and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown). The upper surface of the suction portion of the holding table 10 is the holding surface 11 on which the workpiece 100 is placed and which suction-holds the placed workpiece 100 by negative pressure introduced from the vacuum suction source.

[0020] The holding table 10 is supported so as to be rotatable about an axis parallel to the Z-axis direction relative to a table base 12. The holding table 10 can be rotated about its axis by a rotation unit (not shown), thereby enabling the positioning of the workpiece 100 held on the holding surface 11 about the Z-axis.

[0021] The table base 12 is provided so as to be movable in the X-axis direction by an X-axis movement unit (not shown). That is, the holding table 10 is provided so as to be movable in the X-axis direction via the table base 12. The X-axis movement unit is realized, for example, by a well-known guide rail that extends in the X-axis direction on the base 2 and supports the table base 12 so as to be movable in the X-axis direction, a well-known ball screw that is provided so as to be rotatable about an axis parallel to the X-axis direction, and a well-known motor that rotates the ball screw about its axis. As the table base 12 moves in the X-axis direction by the X-axis movement unit (not shown), the holding table 10 is moved between a carry-in / out area where the conveying unit 70 carries the holding table 10 in and out and a processing area where the cutting unit 20 performs cutting processing, and is fed in the X-axis direction in the processing area relative to the cutting unit 20.

[0022] A bellows cover 13 that covers the upper part of an X-axis moving unit (not shown) is provided around the table base 12 of the first opening 3. The bellows cover 13 is a dustproof and drip-proof cover that prevents cutting chips and cutting fluid from entering the inside of the device through the first opening 3.

[0023] The cutting unit 20 is a processing unit that processes the workpiece 100 held on the holding table 10, and in this embodiment, is a cutting means that performs cutting processing. The cutting unit 20 has a cutting blade 21, a spindle 22 (see FIG. 3), a spindle housing 23 (see FIG. 3), and a mount 24 (see FIG. 3), and is supported via a Z-axis moving unit 25 and a Y-axis moving unit 26 relative to the first frame 6 so as to be movable in the Z-axis and Y-axis directions.

[0024] The cutting blade 21 is an extremely thin, annular-shaped grindstone formed to a predetermined thickness, containing abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material such as metal or resin. In the embodiment, the cutting blade 21 is a so-called hub blade having a cutting edge and an annular base to which the cutting edge is fixed at its outer edge, but in the present invention, it may also be a so-called washer blade consisting only of an annular cutting edge.

[0025] The spindle 22 (see FIG. 3) is provided so as to be rotatable about an axis parallel to the Y-axis direction, and the cutting blade 21 is detachably attached to the tip of the spindle 22. The spindle 22 is rotated about its axis by a spindle motor (not shown), thereby rotating the cutting blade 21 about the axis parallel to the Y-axis direction.

[0026] The spindle housing 23 (see FIG. 3) accommodates the portion of the spindle 22 excluding the tip, as well as a spindle motor (not shown), etc. The spindle housing 23 is provided so as to be movable in the Z-axis direction by a Z-axis movement unit 25 and in the Y-axis direction by a Y-axis movement unit 26. The cutting unit 20 can position the cutting blade 21 at any position on the holding surface 11 of the holding table 10 by the Z-axis movement unit 25 and the Y-axis movement unit 26.

[0027] The mount 24 (see FIG. 3) is fixed to the tip of the spindle 22. The mount 24 includes a cylindrical boss portion extending in the Y-axis direction and a receiving flange portion provided at one end of the boss portion closer to the spindle housing 23.

[0028] The Z-axis moving unit 25 moves the spindle housing 23 in the Z-axis direction relative to the first frame 6 and the Y-axis moving unit 26. The Z-axis moving unit 25 is realized by, for example, a well-known guide rail that extends in the Z-axis direction and supports the spindle housing 23 so that it can move in the Z-axis direction, a well-known ball screw that is provided so that it can rotate about an axis parallel to the Z-axis direction, and a well-known motor that rotates the ball screw about its axis. The cutting unit 20 is fed for cutting in the Z-axis direction as the Z-axis moving unit 25 moves the spindle housing 23 in the Z-axis direction.

[0029] The Y-axis moving unit 26 moves the spindle housing 23 in the Y-axis direction relative to the first frame 6 via the Z-axis moving unit 25. The Y-axis moving unit 26 is realized by, for example, a well-known guide rail that extends in the Y-axis direction on the first frame 6 and supports the Z-axis moving unit 25 so that it can move in the Y-axis direction, a well-known ball screw that is provided so as to be rotatable about an axis parallel to the Y-axis direction, and a well-known motor that rotates the ball screw about its axis. The cutting unit 20 is indexed and fed in the Y-axis direction as the Z-axis moving unit 25 and the spindle housing 23 move in the Y-axis direction by the Y-axis moving unit 26.

[0030] The inspection unit 30 inspects the holding surface 11 of the holding table 10. The processed workpiece 100 may break into multiple large pieces, for example, when air is blown up from the holding table 10 to release it. The inspection unit 30 inspects whether any part of the broken workpiece 100 remains on the holding surface 11 of the holding table 10 after the processed workpiece 100 is held by the transport unit 70 (second transport unit 70-2) described below and carried out from the holding surface 11 of the holding table 10. The inspection unit 30 includes, for example, an imaging unit 31 or a height measurement unit 32.

[0031] The imaging unit 31 is an imaging camera provided to capture an image of the upper surface of the workpiece 100 held on the holding table 10. The imaging unit 31 is capable of capturing an image of the holding surface 11 of the holding table 10. The imaging unit 31 has an imaging element including, for example, a CCD imaging element or a CMOS imaging element. In this embodiment, the imaging unit 31 is fixed adjacent to the cutting unit 20 and moves integrally with the cutting unit 20.

[0032] The imaging unit 31 images the workpiece 100 held on the holding table 10, obtains an image for performing alignment of the workpiece 100 and the cutting unit 20, and outputs the obtained image to the controller 80. The imaging unit 31 images the holding surface 11 of the holding table 10 after the processed workpiece 100 has been carried out by the transport unit 70 (second transport unit 70-2), obtains an image for inspecting whether or not any part of the broken workpiece 100 remains on the holding surface 11 of the holding table 10, and outputs the obtained image to the controller 80.

[0033] The height measurement unit 32 is a sensor provided for non-contact measurement of the height of the upper surface of the workpiece 100 that is held on the holding table 10 and has been machined. The height measurement unit 32 can measure the height of the holding surface 11 of the holding table 10. The height measurement unit 32 is realized by, for example, an NSD (Non Contact Surface Detector). The NSD can detect the position of the upper surface of the workpiece 100 by detecting the back pressure value when air is discharged from the nozzle. In this embodiment, the height measurement unit 32 is fixed adjacent to the cutting unit 20 and moves integrally with the cutting unit 20.

[0034] The height measurement unit 32 measures the height of the upper surface of the workpiece 100 that is held on the holding table 10 and has been machined, obtains measurement results for measuring the groove depth, and outputs the obtained measurement results to the controller 80. The height measurement unit 32 measures the height of the holding surface 11 of the holding table 10 after the machined workpiece 100 has been carried out by the transport unit 70 (second transport unit 70-2), obtains measurement results for inspecting whether or not any part of the cracked workpiece 100 remains on the holding surface 11 of the holding table 10, and outputs the obtained measurement results to the controller 80.

[0035] The cassette placing table 40 is provided inside the second opening 4 so as to be able to rise and fall. A cassette 41 having a substantially rectangular parallelepiped shape, which is a container for accommodating a plurality of workpieces 100, is placed on the upper surface of the cassette placing table 40. The cassette placing table 40 raises and lowers the placed cassette 41 in the Z-axis direction between a position where the loading / unloading unit 60 retrieves and stores the workpieces 100, and a position where the cassette 41 is loaded and unloaded from the cutting device 1.

[0036] The cleaning unit 50 is a unit that cleans the workpiece 100 after processing. The cleaning unit 50 has a cleaning table 51 provided inside the third opening 5 and a cleaning liquid supply mechanism (not shown). The cleaning table 51 has a configuration similar to that of the holding table 10, and holds the workpiece 100 on a holding surface 52. The cleaning unit 50 removes processing debris adhering to the workpiece 100 by utilizing centrifugal force, for example, by supplying cleaning liquid to the center of the upper surface of the workpiece 100 while rotating the cleaning table 51 at high speed around an axis parallel to the Z-axis direction.

[0037] The carry-in / out unit 60 is provided adjacent to the removal opening side of the cassette 41 placed on the cassette mounting table 40. The carry-in / out unit 60 removes the unprocessed workpiece 100 stored in the cassette 41 and transfers it to the transport unit 70 (first transport unit 70-1), and also stores the processed and cleaned workpiece 100 in the cassette 41.

[0038] The transport unit 70 is a unit that transports the workpiece 100. The transport unit 70 includes a first transport unit 70-1 and a second transport unit 70-2. The first transport unit 70-1 and the second transport unit 70-2 each have a holder 71 and a holding arm 74, and are supported by a Z-axis moving unit 75 and a Y-axis moving unit 76 relative to the second frame 7 so as to be movable in the Z-axis and Y-axis directions.

[0039] The holding part 71 is a horizontally oriented, generally disc-shaped support body, and holds the workpiece 100 by suction on the underside in a non-contact manner. The holding part 71 is provided with a plurality of Bernoulli pads 72 (see FIG. 4, etc.) and a plurality of fall prevention parts 73 (see FIG. 4, etc.).

[0040] The Bernoulli pads 72 (see FIG. 4, etc.) are fixed at equal intervals around the periphery of the holding portion 71 so that their ejection ports are exposed on the underside of the holding portion 71, and two are provided in this embodiment. The Bernoulli pads 72 eject a fluid (e.g., air) along the underside, generating negative pressure at the center of the underside, thereby sucking the workpiece 100. At the same time, the Bernoulli pads 72 prevent contact with the workpiece 100 by forming a fluid flow between the underside and the upper surface of the workpiece 100 to be held. In this way, the Bernoulli pads 72 hold the workpiece 100 in a non-contact state.

[0041] The fall prevention parts 73 (see FIG. 4, etc.) are members for preventing the held workpiece 100 from falling further downward when it falls off the Bernoulli pad 72. In the embodiment, the fall prevention parts 73 have an L-shaped cross section, with the outer periphery of the holding part 71 as a fulcrum, and the tip thereof can swing back and forth downward from the holding part 71, and are supported at equal intervals in the circumferential direction of the holding part 71, and three of them are provided, for example.

[0042] The holding arm 74 is a shaft-shaped member extending in the Z-axis direction, and supports the holding part 71 at its lower end, while its upper end is supported by a Z-axis movement unit 75. The holding arm 74 is provided so as to be movable in the Z-axis direction by the Z-axis movement unit 75, and so as to be movable in the Y-axis direction by a Y-axis movement unit 76.

[0043] The Z-axis movement unit 75 moves the holding arm 74 in the Z-axis direction relative to the second frame 7 and the Y-axis movement unit 76. The Z-axis movement unit 75 is realized by, for example, a well-known air cylinder. The first transport unit 70-1 and the second transport unit 70-2 each move up and down in the Z-axis direction as the Z-axis movement unit 75 moves the holding arm 74 in the Z-axis direction.

[0044] The Y-axis moving unit 76 moves the holding arm 74 in the Y-axis direction relative to the second frame 7 via the Z-axis moving unit 75. The Y-axis moving unit 76 is realized by, for example, a well-known guide rail that extends in the Y-axis direction on the second frame 7 and supports the Z-axis moving unit 75 so that it can move in the Y-axis direction, a well-known ball screw that is provided so that it can rotate about an axis parallel to the Y-axis direction, and a well-known motor that rotates the ball screw about its axis. The first transport unit 70-1 and the second transport unit 70-2 are transported in the Y-axis direction by the Y-axis moving unit 76 moving the Z-axis moving unit 75 and the holding arm 74 in the Y-axis direction.

[0045] The first transport unit 70-1 transports an unprocessed or cleaned workpiece 100. In this embodiment, the first transport unit 70-1 transports the unprocessed workpiece 100 from the carry-in / out unit 60 to the holding table 10 in the carry-in / out area. The first transport unit 70-1 transports the cleaned workpiece 100 from the cleaning table 51 of the cleaning unit 50 to the carry-in / out unit 60.

[0046] The second transport unit 70-2 transports the workpiece 100 held on the holding surface 11 of the holding table 10 from the holding table 10 to another area. In this embodiment, the second transport unit 70-2 transports the processed workpiece 100 from the holding table 10 in the carry-in / out area to the cleaning table 51 of the cleaning unit 50.

[0047] The controller 80 is a computer including, for example, an arithmetic processing device as a calculation means, a storage device as a storage means, and an input / output interface device as a communication means. The arithmetic processing device includes, for example, a microprocessor such as a CPU (Central Processing Unit). The storage device has a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory). The arithmetic processing device performs various calculations based on predetermined programs stored in the storage device. In accordance with the calculation results, the arithmetic processing device outputs various control signals to the above-mentioned components via the input / output interface device, thereby controlling each of the above-mentioned components of the cutting device 1.

[0048] The controller 80 is at least capable of controlling the processing unit (in this embodiment, the cutting unit 20) to process the workpiece 100, controlling the second conveying unit 70-2 to hold the workpiece 100 processed by the processing unit, and controlling the inspection unit 30 to inspect whether or not any part of the workpiece 100 remains on the holding surface 11 of the holding table 10 after the workpiece 100 is held by the second conveying unit 70-2.

[0049] For example, after the workpiece 100 is held by the second conveyance unit 70-2, the controller 80 causes the imaging unit 31 to capture an image of the holding surface 11 of the holding table 10 and acquires the captured image output from the imaging unit 31. Alternatively, for example, after the workpiece 100 is held by the second conveyance unit 70-2, the controller 80 causes the height measurement unit 32 to measure the height of the holding surface 11 of the holding table 10 and acquires the measurement result output from the height measurement unit 32. The controller 80 determines whether or not a portion of the workpiece 100 remains on the holding surface 11 of the holding table 10 based on the captured image or the measurement result. For example, if the controller 80 determines that a portion of the workpiece 100 remains on the holding surface 11 of the holding table 10, the controller 80 stops the operation of the cutting device 1 and notifies the operator via the alarm device 90, which will be described later.

[0050] The notification device 90 includes at least one of a display device that visually notifies the notification information, an acoustic device that notifies the notification information by sound, and a light-emitting device that notifies the notification information by light. The display device includes, for example, a liquid crystal display device, an organic EL (Electro Luminescence) display device, and an LED (Light Emitting Diode). The light-emitting device includes, for example, an LED. The notification device 90 issues predetermined notification information based on a control signal output from the controller 80. The notification device 90 may be provided as a part of the function of the cutting device 1, or may be an external device connected to the controller 80.

[0051] [Workpiece] The workpiece 100 is a wafer such as a disk-shaped semiconductor device wafer or optical device wafer, with a substrate made of silicon (Si), sapphire (Al2O3), gallium arsenide (GaAs), silicon carbide (SiC), lithium tantalate (LiTaO3), or the like. The workpiece 100 has a plurality of streets 102 arranged in a lattice pattern and devices 103 formed on a surface 101 in an area defined by the intersecting streets 102. The devices 103 are, for example, integrated circuits such as ICs (Integrated Circuits) or LSIs (Large Scale Integration), or image sensors such as CCDs (Charge Coupled Devices) or CMOSs ​​(Complementary Metal Oxide Semiconductors).

[0052] The workpiece 100 is divided into individual devices 103 along the plurality of streets 102 and singulated into device chips. In the embodiment, the device chips are square-shaped, but may be rectangular. In an inspection method according to an embodiment described below, the workpiece 100 is cut on the front surface 101 side along the plurality of streets 102 by the cutting device 1, thereby forming machined grooves 105.

[0053] [Inspection method] Next, an inspection method according to an embodiment of the present invention will be described. Fig. 2 is a flowchart showing the flow of the inspection method according to the embodiment. The inspection method includes a processing step 201, a holding step 202, and an inspection step 203.

[0054] <Processing steps> Fig. 3 is a schematic side view showing an example of the processing step 201 shown in Fig. 2. The processing step 201 is a step of processing the workpiece 100 placed on the holding surface 11 of the holding table 10. In the processing step 201 of the embodiment, a processed groove 105 is formed in the workpiece 100 by cutting, the processed groove 105 following the street 102.

[0055] A cassette 41 containing workpieces 100 is loaded onto a cassette mounting table 40 (see FIG. 1) of the cutting device 1. The controller 80 controls the loading / unloading unit 60 to load the workpieces 100 one by one from the cassette 41, and controls the first transport unit 70-1 (see FIG. 1) to transport the workpieces 100 to the holding table 10. The controller 80 activates a suction source (not shown) of the holding table 10, and the workpieces 100 are sucked and held on the holding surface 11 of the holding table 10. In this embodiment, the back surface 104 of the workpiece 100 is held by the holding surface 11.

[0056] The controller 80 then moves the holding table 10, which holds the workpiece 100 on the holding surface 11, to a processing area to be processed by the cutting unit 20 using an X-axis moving unit (not shown). The controller 80 then causes the imaging unit 31 (see FIG. 1) to capture an image of the workpiece 100, detects the streets 102, and performs alignment to align the streets 102 of the workpiece 100 with the cutting blade 21.

[0057] The controller 80 then starts supplying cutting fluid to the machining point by the cutting blade 21 and starts rotating the spindle 22. The controller 80 causes the cutting edge of the cutting blade 21 to cut to a predetermined depth using the Z-axis movement unit 25 while feeding the holding table 10 in the X-axis direction using an X-axis movement unit (not shown). As a result, a machined groove 105 is formed along the street 102 of the workpiece 100.

[0058] After forming a groove 105 in the workpiece 100 along one street 102, the controller 80 causes the Y-axis movement unit 26 to index and feed the cutting unit 20 so that the cutting blade 21 is positioned on an adjacent street 102, and similarly forms a groove 105 in the workpiece 100 along the street 102. After completing the processing of all the streets 102, the controller 80 uses the height measurement unit 32 (see FIG. 1) to measure the height of the top surface of the workpiece 100, and measures the groove depth of the formed groove 105.

[0059] <Holding step> Fig. 4 is a schematic side view showing one state of the holding step 202 shown in Fig. 2. The holding step 202 is performed after the processing step 201. The holding step 202 is a step in which the workpiece 100 placed on the holding surface 11 of the holding table 10 is held by the transport unit 70 (second transport unit 70-2).

[0060] The holding table 10 holding the machined workpiece 100 is moved to the carry-in / out area by an X-axis movement unit (not shown). The controller 80 causes a fluid to be sprayed onto the holding surface 11 of the holding table 10, thereby releasing the workpiece 100 from its hold. The controller 80 causes the Y-axis movement unit 76 to move the second transport unit 70-2 to a position facing the workpiece 100 held on the holding table 10, and then causes the Z-axis movement unit 75 to lower the holding part 71. The controller 80 causes a fluid to be sprayed onto the Bernoulli pad 72 of the holding part 71, thereby holding the workpiece 100 in a non-contact state.

[0061] The controller 80 causes the Z-axis movement unit 75 to raise the holder 71 and carry the workpiece 100 out of the holding surface 11 of the holding table 10. If there are no cracks in the workpiece 100, the second transport unit 70-2 lifts the entire workpiece 100, as shown in FIG. 4. With the fall prevention unit 73 positioned below the holder 71, the controller 80 causes the Y-axis movement unit 76 to move the second transport unit 70-2 toward the cleaning unit 50 (see FIG. 1).

[0062] 5 is a schematic side view showing another state of the holding step 202 shown in FIG. 2. When a crack has occurred in the workpiece 100, as shown in FIG. 5, the second conveying unit 70-2 holds and lifts up the held portion 106 of the workpiece 100, but a portion 107 remains on the holding surface 11 of the holding table 10. In this case, since the Bernoulli pad 72 itself holds the workpiece 100, the controller 80 moves the second conveying unit 70-2 toward the cleaning unit 50 (see FIG. 1) by the Y-axis moving unit 76, with the fall prevention part 73 positioned below the holding part 71.

[0063] <Inspection steps> The inspection step 203 is performed after the holding step 202. The inspection step 203 is a step for inspecting whether or not a part of the workpiece 100 remains on the holding surface 11 of the holding table 10.

[0064] Fig. 6 is a schematic side view showing a first example of the inspection step 203 shown in Fig. 2. In the first example of the inspection step 203, the holding surface 11 of the holding table 10 is imaged by the imaging unit 31 to inspect whether or not a part of the workpiece 100 remains on the holding surface 11 of the holding table 10.

[0065] The controller 80 uses an X-axis moving unit (not shown) to move the holding table 10 to an imaging area for the imaging unit 31, i.e., a processing area. The controller 80 captures an image of the entire holding surface 11 while moving the imaging unit 31 and the holding table 10 relatively using an X-axis moving unit (not shown), a rotation unit (not shown), a Y-axis moving unit 26, etc. The controller 80 obtains the image captured by the imaging unit 31 and determines, using well-known image processing, whether or not a portion 107 of the workpiece 100 remains on the holding surface 11 of the holding table 10.

[0066] Fig. 7 is a schematic side view showing a second example of the inspection step 203 shown in Fig. 2. In the second example of the inspection step 203, the height of the holding surface 11 of the holding table 10 is measured to check whether or not a part of the workpiece 100 remains on the holding surface 11 of the holding table 10.

[0067] The controller 80 uses an X-axis movement unit (not shown) to move the holding table 10 to the measurement area to be measured by the height measurement unit 32, i.e., the processing area. The controller 80 measures the height of the entire holding surface 11 while moving the height measurement unit 32 and the holding table 10 relatively using an X-axis movement unit (not shown), a rotation unit (not shown), a Y-axis movement unit 26, etc. From the measurement results from the height measurement unit 32, the controller 80 determines whether there is an area higher than the height of the holding surface 11 by the thickness of the workpiece 100, and thereby determines whether a portion 107 of the workpiece 100 remains on the holding surface 11 of the holding table 10.

[0068] In this way, when the controller 80 determines using the inspection unit 30 that a portion 107 of the workpiece 100 remains on the holding surface 11 of the holding table 10, it stops the operation of the cutting device 1 and sends a control signal to the alarm device 90 to issue predetermined alarm information. The operator, for example, removes the workpiece 100 remaining on the holding table 10 and the workpiece 100 held by the transport unit 70 (second transport unit 70-2), and restarts the cutting device 1.

[0069] [effect] As described above, in the inspection method and processing apparatus of the embodiment, after the processed workpiece 100 is held by the transport unit 70 (second transport unit 70-2), the presence or absence of cracks in the workpiece 100 is inspected by checking whether the workpiece 100 remains on the holding surface 11 of the holding table 10 where the workpiece 100 was held. That is, if a part of the workpiece 100 remains on the holding surface 11 of the holding table 10, it is determined that the workpiece 100 is cracked. If a crack is found in the workpiece 100, for example, the processing apparatus is stopped and an alarm device 90 is used to notify the operator. The operator can then remove the workpiece 100 remaining on the holding table 10 and the workpiece 100 held by the transport unit 70 (second transport unit 70-2), thereby preventing a chain reaction of breakage of the workpiece 100 and suppressing a decrease in yield. It is possible to reattach the cracked workpiece 100 to a dicing tape and process it again.

[0070] [Other embodiments] The present invention is not limited to the above-described embodiment, and can be implemented in various modifications without departing from the gist of the present invention.

[0071] For example, the processing device is not limited to the cutting device 1, but may be a laser processing device, a grinding device, or a polishing device. Similarly, the processing unit is not limited to the cutting unit 20, but may be a laser irradiation unit, a grinding unit, or a polishing unit.

[0072] Furthermore, the inspection step 203 is not limited to moving the holding table 10 to the inspection area by the inspection unit 20, but the inspection unit 30 may be moved to the holding table 10. Furthermore, although the inspection unit 30 is fixed adjacent to the cutting unit 20 in the embodiment, it may be movable independently of the cutting unit 20 in the present invention.

[0073] Furthermore, the inspection unit 30 is not limited to the imaging unit 31 (camera) and the height measurement unit 32 (height sensor) of the embodiment, but may be, for example, a line sensor, a reflective sensor, etc. However, since the camera and height sensor are originally provided in the processing device for observing the workpiece 100, there is an advantage in that no additional cost is required.

[0074] Furthermore, the inspection unit 30 may inspect the entire holding surface 11 of the holding table 10, or may inspect only the area of ​​the holding surface 11 corresponding to the area where the Bernoulli pad 72 is not present. In other words, since the workpiece 100 can be held by the Bernoulli pad 72, it may be determined that no workpiece 100 remains in that area, and inspection may be omitted.

[0075] The second transport unit 70-2 may have an arm for holding the workpiece 100 and an arm for transporting it to another area, separately. That is, the holding arm may hold the workpiece 100 from the holding surface 11 of the holding table 10, and then hand it over to the transporting arm for transport. [Explanation of symbols]

[0076] 1 Cutting equipment 10 Holding table 11 Holding surface 20 Cutting unit 21 Cutting blade 25 Z-axis movement unit 26 Y-axis moving unit 30 Inspection Units 31 Imaging unit 32 Height measurement unit 40 Cassette stand 50 cleaning units 60 Loading / unloading unit 70 Transport Unit 70-1 First conveying unit 70-2 Second conveying unit 71 Holding part 72 Bernoulli Pad 73 Fall prevention part 74 Holding Arm 75 Z-axis movement unit 76 Y-axis moving unit 80 Controller 90 Alarm device 100 Workpiece 106 Part to be held 107 part

Claims

1. a processing step of processing a workpiece placed on a holding surface of a holding table; a holding step of holding the workpiece placed on the holding surface of the holding table with a transport unit after the processing step is performed; an inspection step of inspecting whether or not a part of the workpiece remains on the holding surface of the holding table after the holding step is performed; Contains An inspection method comprising:

2. In the inspection step, The holding surface of the holding table is imaged by an imaging unit, Inspect whether or not a part of the workpiece remains on the holding surface of the holding table.

2. The inspection method according to claim 1, wherein:

3. In the inspection step, By measuring the height of the holding surface of the holding table, Inspect whether or not a part of the workpiece remains on the holding surface of the holding table.

2. The inspection method according to claim 1, wherein:

4. A processing device for processing a workpiece, a holding table having a holding surface for holding the workpiece; a processing unit that processes the workpiece held on the holding table; a transport unit that transports the workpiece held on the holding surface from the holding table to another area; A controller; Equipped with an inspection unit that inspects the holding surface of the holding table; The controller controlling the processing unit to process a workpiece; controlling the transport unit to hold the workpiece processed by the processing unit; controlling the inspection unit to inspect whether or not a part of the workpiece remains on the holding surface of the holding table after the workpiece is held by the transport unit; is possible A processing device characterized by:

5. The inspection unit is an imaging unit capable of imaging the holding surface of the holding table.

5. The processing device according to claim 4.

6. The inspection unit is a height measurement unit capable of measuring the height of the holding surface of the holding table.

5. The processing device according to claim 4.

Images