Sheet body, laminate, lamination displacement amount calculation device, lamination displacement amount calculation program, lamination displacement amount calculation method, and lamination device

Abstract

To highly accurately calculate a lamination deviation amount between two layers of a laminated sheet body.SOLUTION: The sheet body 2 has a first sheet body 3 and a second sheet body 4 which are alternately laminated. The first sheet body includes a first mark 3334 and first through-holes 30c, 30d. The second sheet body includes a second mark 4344 and second through-holes 440c, 40d. The first marker is formed such that the first direction D1 can be specified. The second mark is formed so that the second direction D2 can be specified. When the first sheet element is accurately stacked on the second sheet element, the second mark is located at a predetermined second ideal position with respect to the first mark. When the second sheet element is accurately stacked on the first sheet element, the first mark is located at a predetermined first ideal position with respect to the second mark. In the upward view, the positional relationship between the position of the first marker and the second ideal position with respect to the first direction coincides with the positional relationship between the position of the second marker and the first ideal position with respect to the second direction.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a sheet body, a laminate, a lamination deviation amount calculation device, a lamination deviation amount calculation program, a lamination deviation amount calculation method, and a lamination device. [Background technology]

[0002] In the manufacturing process of multilayer ceramic electronic components having a multilayer structure (for example, multilayer ceramic capacitors (MLCC), chip inductors, low temperature co-fired ceramics (LTCC), etc.), ceramic green sheets (hereinafter referred to as "sheet bodies") are formed on a film-like substrate. Next, internal electrodes are printed appropriately on the sheet bodies. Next, the sheet bodies are peeled from the substrate, and multiple sheet bodies are stacked together to form a sheet body laminate. Next, the laminate body is heated and pressed, and cut to a predetermined size to form the laminate body into chips. Next, the chipped laminate body is fired, and external electrodes are formed on the surfaces of the fired body, completing the multilayer ceramic electronic component (see, for example, Patent Document 1).

[0003] In this way, many multilayer ceramic electronic components are manufactured from a laminate in which a plurality of sheets of a predetermined size are stacked. In recent years, the miniaturization of multilayer ceramic electronic components has progressed, and the number of multilayer ceramic electronic components manufactured from a single laminate has increased. As a result, internal electrodes have become finer, and high-precision lamination of sheet bodies (lamination with little misalignment) is required. Generally, each of the sheet bodies to be stacked has a mark that is used to align the sheets with each other during stacking. The amount of misalignment of the sheets (i.e., lamination precision) can be confirmed by calculating the amount of misalignment of these marks (see, for example, Patent Documents 2 and 3).

[0004] The technology disclosed in Patent Document 2 calculates the amount of misalignment of the signs on each layer by irradiating the stack after stacking with X-rays to see through the stack. This technology can calculate the amount of misalignment of opaque sheet stacks with relatively high accuracy. However, because the amount of misalignment is calculated after stacking is complete, if a sheet in the middle of stacking is misaligned beyond the allowable amount, the sheet stacked thereafter will be wasted. On the other hand, the technology disclosed in Patent Document 3 calculates the amount of misalignment between two layers each time a sheet is stacked based on the amount of misalignment between the signs on the top layer and the layer below it. With this technology, if a sheet in the middle of stacking is misaligned beyond the allowable amount, the stacking is stopped at that point, preventing the aforementioned waste. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2021-122068 [Patent Document 2] Japanese Patent Application Laid-Open No. 2001-168537 [Patent Document 3] Japanese Patent Application Laid-Open No. 2010-050148 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the technology disclosed in Patent Document 3, the imaging device that captures an image of the sign is positioned above the intermediate stack (intermediate stack) in the middle of stacking, in a position that does not interfere with the movement of the sheet conveying device. In other words, the distance between the imaging device and the intermediate stack is relatively large. Therefore, in order to accurately capture an image of a small sign, the imaging magnification of the imaging device is set to a high magnification.

[0007] Here, the imaging device is usually attached to the housing of the device. Therefore, minute vibrations are easily transmitted to the imaging device. Furthermore, the imaging device may tilt slightly due to temperature changes occurring within the stacking device or the effects of heat (expansion / contraction) generated in the imaging device itself. As a result, the field of view of the imaging device changes slightly due to the effects of this vibration or tilt. In other words, the origin of the image coordinate system changes. Therefore, even if the sheet body does not move, the coordinates of the marker in the image coordinate system for each image change unevenly. In other words, the field of view of the imaging device is not a completely fixed point. This change is on the order of several micrometers. Therefore, if the calculation accuracy of the amount of stacking misalignment is on the order of 10 micrometers to several tens of micrometers, this change does not have a significant impact on the calculation of the amount of stacking misalignment. However, when high stacking accuracy (on the order of several micrometers) is required, the measurement accuracy of the amount of stacking misalignment will also be on the order of several micrometers. Therefore, this change has a non-negligible impact on the calculation of the amount of stacking misalignment.

[0008] An object of the present invention is to calculate with high accuracy the amount of stacking misalignment between two layers of stacked sheet bodies. [Means for solving the problem]

[0009] In one embodiment of the present invention, the sheet body is a pair of sheets used to form a laminate, and comprises a first sheet body arranged in the "n" layer (n is a natural number greater than or equal to 2) in the stacking direction of the laminate, and a plurality of second sheet bodies arranged in the "n-1" layer in the stacking direction, wherein the first sheet body has a first upper surface, a first conductive pattern printed on the first upper surface, a first sign printed on the first upper surface together with the first conductive pattern, and a first through hole penetrating in the thickness direction of the first sheet body, and the second sheet body has a second upper surface, a second conductive pattern printed on the second upper surface, a second sign printed on the second upper surface together with the second conductive pattern, and a second through hole penetrating in the thickness direction of the second sheet body, wherein when the first sheet body is stacked on the second sheet body, the first through hole is formed to be positioned above the second sign of the corresponding second sheet body, and when the second sheet body is stacked on the second sheet body, the second through hole is formed to be positioned above the second sign of the corresponding first sheet body. The sheet body is formed to be positioned above the first marker, the size of the first marker is smaller than the size of the second through hole, the size of the second marker is smaller than the size of the first through hole, the first marker is formed so as to identify a first direction on the first upper surface, the second marker is formed so as to identify a second direction on the second upper surface, when the first sheet body is accurately stacked on the second sheet body, the first direction is the opposite direction to the second direction, the second marker, when viewed from above, is located at a predetermined second ideal position relative to the first marker, when the second sheet body is accurately stacked on the first sheet body, the second direction is the opposite direction to the first direction, when viewed from above, the first marker is located at a predetermined first ideal position relative to the second marker, when viewed from above, a first positional relationship between the position of the first marker with respect to the first direction and the second ideal position coincides with a second positional relationship between the position of the second marker with respect to the second direction and the first ideal position.

[0010] A laminate in one embodiment of the present invention is a laminate formed by stacking a plurality of sheet bodies, and the sheet bodies are the sheet bodies of the above-described embodiment.

[0011] A stacking misalignment calculation device in one embodiment of the present invention is a stacking misalignment calculation device that calculates the stacking misalignment between two layers of the stack based on an image captured by an imaging device arranged above the stack, wherein the stack is the stack of one embodiment described above, and the image captures the first marker, the first through hole, and the second marker located below the first through hole when the first sheet is stacked on the second sheet, and the device comprises: a memory unit that stores the first positional relationship; an acquisition unit that acquires the image; an identification unit that identifies the first direction based on the first marker captured in the image; and a calculation unit that calculates the stacking misalignment of the first sheet relative to the second sheet based on the identified first direction, the first positional relationship, and the second marker captured in the image.

[0012] A lamination deviation calculation program according to an embodiment of the present invention causes a computer to function as the lamination deviation calculation device according to the embodiment.

[0013] A stacking misalignment calculation method in one embodiment of the present invention is a stacking misalignment calculation method executed by a stacking misalignment calculation device that determines the stacking misalignment between two layers of the stack based on an image captured by an imaging device arranged above the stack, wherein the stack is the stack of one embodiment described above, the image captures the first marker, the first through hole, and the second marker located below the first through hole in a state where the first sheet is stacked on the second sheet, the stacking misalignment calculation device has a memory unit that stores the first positional relationship, and the stacking misalignment calculation method includes an acquisition process that acquires the image, a direction identification process that identifies the first direction based on the first marker captured in the image, and a calculation process that calculates the stacking misalignment of the first sheet relative to the second sheet based on the identified first direction, the first positional relationship, and the second marker captured in the image.

[0014] A stacking device in one embodiment of the present invention comprises a mounting table on which a sheet body of the above-mentioned embodiment is placed, a stacking table on which multiple sheet bodies are stacked, a conveying device that stacks the sheet bodies placed on the mounting table onto the stacking table, an imaging device that is arranged above the stacking table and images the sheet bodies stacked on the stacking table, and a stacking misalignment calculation device in one embodiment of the present invention. [Effects of the Invention]

[0015] According to the present invention, the amount of stacking misalignment between two layers of stacked sheet bodies can be calculated with high accuracy. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a schematic cross-sectional view of a laminate according to an embodiment of the present invention; [Figure 2] 1 is a schematic plan view of a first sheet body, showing an embodiment of a sheet body according to the present invention. [Figure 3] 1A is a partially enlarged schematic plan view of a first region of the first sheet body, and FIG. 1B is a partially enlarged schematic plan view of another first region of the first sheet body. [Figure 4] 3 is a schematic plan view of a second sheet body, showing an embodiment of the sheet body according to the present invention. FIG. [Figure 5] 1A is a partially enlarged schematic plan view of a second region of the second sheet body, and FIG. 1B is a partially enlarged schematic plan view of another second region of the second sheet body. [Figure 6] 5(a) is a partially enlarged schematic plan view of the first region of FIG. 3 showing the positional relationship between each marker in the first stacked state, and FIG. 5(b) is a partially enlarged schematic plan view of the second region of FIG. 5 showing the positional relationship between each marker in the second stacked state. [Figure 7] 1 is a schematic side view of a stacking device showing an embodiment of the stacking device according to the present invention; [Figure 8] FIG. 2 is a functional block diagram of the stacking device. [Figure 9] 3 is a schematic diagram showing an example of information stored in a storage unit of the stacking device. FIG. [Figure 10] FIG. 10 is a schematic diagram showing another example of information stored in the storage unit. [Figure 11] 4 is a flowchart showing an example of an operation of the stacking device. [Figure 12] 10 is a flowchart illustrating an example of a lamination misalignment amount calculation process executed in the above operation. [Figure 13] 5A and 5B are schematic diagrams showing examples of marks extracted in the lamination misalignment amount calculation method according to the present invention. [Figure 14] FIG. 2 is a schematic diagram showing an example of a specific point identified by the above method. [Figure 15] FIG. 10 is a schematic diagram showing an example of position vectors of specific points calculated by the above method. [Figure 16] FIG. 4 is a schematic diagram showing an example of a direction vector calculated by the above method. [Figure 17] FIG. 4 is a schematic diagram showing an example of an ideal position vector calculated by the above method. [Figure 18] FIG. 10 is a schematic diagram showing an example of a sign deviation vector calculated by the above method. [Figure 19] FIG. 2 is a schematic diagram showing an example of a local coordinate system used in the method. [Figure 20] 10A and 10B are schematic diagrams illustrating an image of a pattern shift amount calculation process executed by the above method. [Figure 21] 1A and 1B are partially enlarged schematic plan views of the laminate, showing (a) a first modified example of the laminate, (b) a second modified example of the laminate, (c) a third modified example of the laminate, (d) a fourth modified example of the laminate, and (e) a fifth modified example of the laminate. DETAILED DESCRIPTION OF THE INVENTION

[0017] Embodiments of a pair of sheet bodies, a laminate, a lamination deviation calculation device, a lamination deviation calculation program, a lamination deviation calculation method, and a lamination device according to the present invention will be described below. In the following description, the drawings will be referred to as appropriate. In the drawings, identical members and elements are designated by the same reference numerals, and duplicated descriptions will be omitted. Furthermore, the dimensional proportions of the elements may be exaggerated for the sake of convenience, and are not limited to the proportions shown in the drawings.

[0018] In the following description and drawings, unless otherwise specified, when three mutually orthogonal axes in space are the X-axis, Y-axis, and Z-axis, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the up-down direction. The "X-axis direction" is the direction along the X-axis, the "+X direction" is one direction along the X-axis, and the "-X direction" is the other direction along the X-axis. The +X direction is an example of the first direction in the present invention, and the -X direction is an example of the second direction in the present invention. The "Y-axis direction" is the direction along the Y-axis, the "+Y direction" is one direction along the Y-axis, and the "-Y direction" is the other direction along the Y-axis. The "Z-axis direction" is the direction along the Z-axis and is the up-down direction. The "+Z direction" is the upward direction, and the "-Z direction" is the downward direction. The "XY direction" is the direction along the X-axis and Y-axis directions, and the "XY plane" is an imaginary plane parallel to the XY direction (horizontal direction). The "XZ direction" is a direction along the X-axis direction and the Z-axis direction, and the "XZ plane" is an imaginary plane parallel to the XZ direction (vertical direction).

[0019] In the following description, the upper surface is a surface that faces upward and is parallel to the X and Y directions, and the lower surface is a surface that faces downward and is parallel to the X and Y directions. In other words, the upper and lower surfaces are flat.

[0020] The present invention calculates the amount of stacking misalignment between two layers, that is, the topmost sheet and the sheet immediately below it, each time a sheet is stacked in a manufacturing process for a laminate produced by stacking multiple sheets. Each sheet has a sign printed on it as part of a conductor pattern, and a through-hole formed therein that allows the sign on the lower layer to be seen from above. The sign is formed so that a specific direction can be identified by image processing. The amount of stacking misalignment between the two layers is calculated based on the positional relationship of the signs printed on each sheet relative to a specific direction. Therefore, the present invention can calculate the amount of stacking misalignment between the two layers with high accuracy even if the field of view of the imaging device that captures the sign is not a completely fixed point (even if the field of view changes slightly).

[0021] ●Laminate● First, an embodiment of a laminate according to the present invention will be described below, along with an embodiment of a sheet according to the present invention.

[0022] Laminate structure FIG. 1 is a schematic cross-sectional view of a laminate according to an embodiment of the present invention. The figure shows a cross section of the laminate 1 along the XZ plane, in which the laminate 1 is cut at the center in the Y-axis direction.

[0023] The laminate 1 is an assembly of sheet bodies 2 formed by stacking a plurality of sheet bodies 2. The configuration of the laminate 1 is the same as, for example, the configuration of a known laminate of ceramic green sheets, except for the configuration of each mark (described later) and its surroundings. The laminate 1 includes a plurality of sheet bodies 2. The laminate 1 is an example of a laminate according to the present invention. The sheet body 2 is an example of a sheet body according to the present invention.

[0024] "Multilayer ceramic electronic components" are electronic components having a multilayer ceramic structure, such as multilayer ceramic capacitors (MLCC), chip inductors, and low temperature co-fired ceramics (LTCC).

[0025] The sheet 2 is a sheet-like member used to form the laminate 1, and serves as, for example, each layer (dielectric layer) of a multilayer ceramic electronic component. The sheet 2 includes a first sheet 3 and a second sheet 4. The first sheet 3 and the second sheet 4 constitute a pair of sheets, which are alternately stacked to form the laminate 1. Here, the first sheet 3 and the second sheet 4 are also stacked on an intermediate laminate during the stacking process. Therefore, the intermediate laminate is an example of the present laminate, and in the following explanation, for convenience of explanation, it will be referred to as the laminate 1.

[0026] 2 is a schematic plan view of a first sheet body 3, showing an embodiment of a sheet body according to the present invention. In the following description, FIG. 1 will be referred to together with FIG.

[0027] The first sheet 3 is a sheet-like member used to form the laminate 1. The first sheet 3 is, for example, a ceramic green sheet. The first sheet 3 includes a first main body portion 30 and a first pattern 31.

[0028] The first main body portion 30 has a rectangular shape extending along the XY direction when viewed from above. The first main body portion 30 has an upper surface 30a, a lower surface 30b, and a plurality of (two in this embodiment) first through holes 30c and 30d.

[0029] The upper surface 30a includes a plurality of (two in this embodiment) first regions R11 and R12. The upper surface 30a is an example of the first upper surface defined in the present invention.

[0030] The first regions R11 and R12 are regions where markers necessary for calculating the amount of stack misalignment (described later, the same applies below) are concentrated and are regions that correspond to (fit within) the fields of view (imaging range) of the imaging devices 11a and 11b (described later, see FIG. 7, the same applies below). The first regions R11 and R12 are located on the outer edge of the upper surface 30a and near diagonal corners of the upper surface 30a. The first region R11 is an example of the first region in the present invention, and the first region R12 is an example of the second region in the present invention.

[0031] The first through holes 30c and 30d are through holes that penetrate the first sheet body 3 in the up-down direction. The first through holes 30c and 30d are, for example, circular in shape. The first through hole 30c is disposed in the first region R11, and the first through hole 30d is disposed in the first region R12.

[0032] The first pattern 31 is disposed (printed) on the upper surface 30a. The first pattern 31 is formed, for example, by printing a known conductive paste on the upper surface 30a using a known printing method (e.g., screen printing). The first pattern 31 includes a first conductive pattern 32 and a plurality of (two in this embodiment) first markers 33 and 34.

[0033] The first conductor pattern 32 is a pattern corresponding to, for example, an internal electrode of a multilayer ceramic electronic component. The first conductor pattern 32 is arranged (printed) in a rectangular area in the center of the upper surface 30a, excluding the outer edge portion. The first conductor pattern 32 is designed, for example, based on the X and Y directions. In other words, the first conductor pattern 32 has a unique coordinate system (hereinafter referred to as a "pattern coordinate system") with the X-axis direction and the Y-axis direction as its coordinate axes.

[0034] 3(a) is a partially enlarged schematic plan view of the first region R11 of the upper surface 30a, and (b) is a partially enlarged schematic plan view of the first region R12 of the upper surface 30a. In the following description, FIG. 2 will be referred to together with FIG. 3 as appropriate.

[0035] The first markers 33 and 34 are markers used to calculate the amount of stacking misalignment. The first markers 33 and 34 are formed so that a specific direction (hereinafter referred to as the "first direction D1") on the upper surface 30a can be identified by image processing. The first marker 33 is arranged (printed) together with the first pattern 31 in the first region R11, and the first marker 34 is arranged (printed) together with the first pattern 31 in the first region R12. The first marker 33 includes a first main marker 33a and a first sub-marker 33b. The first marker 34 includes a first main marker 34a and a first sub-marker 34b. In the following description, when the first main markers 33a and 34a and the first sub-markers 33b and 34b are not particularly distinguished from one another, they may be simply referred to as "markers."

[0036] The "first direction D1" is the direction in which the corresponding second main markers 43a, 44a (described later; the same applies below) are located with respect to the first main markers 33a, 34a when the first sheet body 3 is accurately stacked on the second sheet body 4 (hereinafter referred to as the "first stacked state"). In this embodiment, the "first direction D1" is the direction in which the first sub-markers 33b, 34b are located with respect to the first main markers 33a, 34a (+X direction). More specifically, the first direction D1 is the direction in which the first sub-markers 33b, 34b are located with respect to the center point P of the first main marker 33a. m1 The center point P of the first sub-mark 33b s1 is located in the direction of the center point P of the first main sign 34a. m2 The center point P of the first sub-mark 34b s2 is located. In this manner, in this embodiment, the first direction D1 is determined based on the positional relationship of the first sub-signs 33b and 34b with respect to the first main signs 33a and 34a.

[0037] The "state in which the first sheet body 3 is accurately stacked on the second sheet body 4 (first stacked state)" means a state in which the first sheet body 3 is stacked on the second sheet body 4 without any misalignment in the XY directions (i.e., horizontal direction). Specifically, the first stacked state means a state in which, when viewed from above, the first conductor pattern 32 (first pattern 31) of the first sheet body 3 is superimposed on the second conductor pattern 42 (second pattern 41) (both described below) of the second sheet body 4 as designed, without any misalignment in the XY directions.

[0038] The first main marks 33a, 34a are marks that serve as references in calculating the amount of stacking misalignment. The first main marks 33a, 34a are, for example, circular in shape. The diameters of the first main marks 33a, 34a are smaller than (for example, 1 / 2 or less) the diameters of the corresponding first through holes 30c, 30d. In the X-axis direction, the first main marks 33a, 34a are arranged side by side with the corresponding first through holes 30c, 30d in the -X direction of the first through holes 30c, 30d.

[0039] The first sub-markers 33b and 34b are markers used to identify the first direction D1. The first sub-markers 33b and 34b are, for example, circular in shape. The diameters of the first sub-markers 33b and 34b are smaller (different) than the diameters of the corresponding first main markers 33a and 34a. As a result, the first sub-markers 33b and 34b are easily distinguished from the first main markers 33a and 34a in image processing. The first sub-markers 33b and 34b are arranged side by side with the corresponding first through-holes 30c and 30d on the +X direction side (first direction D1 side) of the first through-holes 30c and 30d.

[0040] The first through hole 30c, the first main mark 33a, and the first sub-mark 33b arranged in the first region R11 correspond to one another. The first through hole 30d, the first main mark 34a, and the first sub-mark 34b arranged in the first region R12 correspond to one another. The first main marks 33a, 34a, the first through holes 30c, 30d, and the first sub-marks 33b, 34b that correspond to one another are arranged parallel to the X axis in order from the -X direction. More specifically, the center point P of the first main mark 33am1 , the design center point P of the first through hole 30c p1 , and the center point P of the first sub-mark 33b s1 are arranged parallel to the X axis in order from the -X direction. m2 , the design center point P of the first through hole 30d p2 , and the center point P of the first sub-mark 34b s2 are arranged parallel to the X axis, starting from the -X direction.

[0041] 4 is a schematic plan view of a second sheet body 4, showing an embodiment of a sheet body according to the present invention. In the following description, FIG. 1 will be referred to together with FIG.

[0042] The second sheet 4 is a sheet-like member used to form the laminate 1. The second sheet 4 is, for example, a ceramic green sheet. The second sheet 4 includes a second main body portion 40 and a second pattern 41.

[0043] The second main body 40 has a rectangular shape extending along the XY direction when viewed from above. The second main body 40 has an upper surface 40a, a lower surface 40b, and a plurality of (two in this embodiment) second through holes 40c and 40d.

[0044] The upper surface 40a includes a plurality of (two in this embodiment) second regions R21, R22. The upper surface 40a is an example of the second upper surface defined in the present invention.

[0045] The second regions R21 and R22 are regions where markers necessary for calculating the amount of stacking misalignment are concentrated and correspond to the fields of view of the imaging devices 11a and 11b. The second regions R21 and R22 are arranged on the outer edge of the upper surface 40a and near diagonal corners of the upper surface 40a. The second region R21 is an example of a third region in the present invention, and the second region R22 is an example of a fourth region in the present invention. When the first sheet body 3 is stacked on the second sheet body 4, the first region R11 overlaps with the second region R21, and the first region R12 overlaps with the second region R22 when viewed from above.

[0046] The second through holes 40c and 40d are through holes that penetrate the second sheet body 4 in the up-down direction. The shapes of the second through holes 40c and 40d are the same as the shapes of the first through holes 30c and 30d. The second through hole 40c is located in the second region R21, and the second through hole 40d is located in the second region R22.

[0047] The second pattern 41 is disposed (printed) on the upper surface 40a. The second pattern 41 is formed by being printed on the upper surface 40a using the same method as the first pattern 31. The second pattern 41 includes a second conductive pattern 42 and a plurality of (two in this embodiment) second markers 43 and 44.

[0048] The second conductor pattern 42 is a pattern corresponding to, for example, an internal electrode of a multilayer ceramic electronic component. The shape of the second conductor pattern 42 differs from the shape of the first conductor pattern 32. The second conductor pattern 42 is disposed (printed) in a rectangular area in the center of the upper surface 40a, excluding the outer edge portion. The second conductor pattern 42 is designed, for example, based on the X and Y directions. In other words, the second conductor pattern 42 has a pattern coordinate system.

[0049] In the present invention, the shape of the second conductor pattern 42 may be the same as the shape of the first conductor pattern 32.

[0050] 5(a) is a partially enlarged schematic plan view of the second region R21 of the upper surface 40a, and (b) is a partially enlarged schematic plan view of the second region R22 of the upper surface 40a. In the following description, FIG. 4 will be referred to together with FIG. 5 as appropriate.

[0051] The second markers 43 and 44 are markers used to calculate the amount of stacking misalignment. The second markers 43 and 44 are formed so that a specific direction (hereinafter referred to as the "second direction D2") on the upper surface 40a can be identified by image processing. The second marker 43 is arranged (printed) together with the second pattern 41 in the second region R21, and the second marker 44 is arranged (printed) together with the second pattern 41 in the second region R22. The second marker 43 includes a second main marker 43a and a second sub-marker 43b. The second marker 44 includes a second main marker 44a and a second sub-marker 44b. In the following description, when the second main markers 43a and 44a and the second sub-markers 43b and 44b are not particularly distinguished from one another, they may be simply referred to as "markers."

[0052] The "second direction D2" is the direction in which the corresponding first main markers 33a, 34a are located with respect to the second main markers 43a, 44a when the second sheet body 4 is accurately stacked on the first sheet body 3 (hereinafter referred to as the "second stacked state"). In this embodiment, the "second direction D2" is the direction in which the second sub-markers 43b, 44b are located with respect to the second main markers 43a, 44a (-X direction). More specifically, the second direction D2 is the direction in which the second sub-markers 43b, 44b are located with respect to the center point P of the second main marker 43a. m3 The center point P of the second sub-mark 43b s3 is located in the direction of the center point P of the second main sign 44a. m4 The center point P of the second sub-mark 44b s4 is located. In this manner, in this embodiment, the second direction D2 is determined based on the positional relationship of the second sub-marks 43b and 44b with respect to the second main marks 43a and 44a. The second direction D2 in the second stacked state is the opposite direction to the first direction D1 in the first stacked state.

[0053] The "state in which the second sheet body 4 is accurately stacked on the first sheet body 3 (second stacked state)" means a state in which the second sheet body 4 is stacked on the first sheet body 3 without any misalignment in the XY directions (i.e., horizontal direction). Specifically, the second stacked state means a state in which, when viewed from above, the second conductor pattern 42 (second pattern 41) of the second sheet body 4 is superimposed on the first conductor pattern 32 (first pattern 31) of the first sheet body 3 as designed, without any misalignment in the XY directions.

[0054] The second main marks 43a, 44a are marks that serve as references in calculating the amount of stacking misalignment. The shapes of the second main marks 43a, 44a are the same as those of the first main marks 33a, 34a. In the X-axis direction, the second main marks 43a, 44a are arranged side by side with the corresponding second through holes 40c, 40d in the +X direction of the second through holes 40c, 40d.

[0055] The second sub-markers 43b and 44b are markers used to identify the second direction D2. The shapes of the second sub-markers 43b and 44b are the same as the shapes of the first sub-markers 33b and 34b. The second sub-markers 43b and 44b are arranged side by side with the corresponding second through-holes 40c and 40d on the -X direction side (second direction D2 side) of the second through-holes 40c and 40d.

[0056] The second through-hole 40c, the second main mark 43a, and the second sub-mark 43b arranged in the second region R21 correspond to one another. The second through-hole 40d, the second main mark 44a, and the second sub-mark 44b arranged in the second region R22 correspond to one another. The corresponding second main marks 43a, 44a, the second through-holes 40c, 40d, and the second sub-marks 43b, 44b are arranged parallel to the X-axis in order from the +X direction. More specifically, the center point P of the second main mark 43a m3 , the design center point P of the second through hole 40c p3 , and the center point P of the second sub-mark 43b s3 are arranged parallel to the X axis in order from the +X direction. m4 , the design center point P of the second through hole 40dp4 , and the center point P of the second sub-mark 44b s4 are arranged parallel to the X axis, starting from the +X direction.

[0057] Here, the center point P of the first main signs 33a and 34a m1 ,P m2 , the center point P of the first sub-marks 33b and 34b s1 ,P s2 , and the design center point P of the first through holes 30c and 30d p1 ,P p2 The positional relationship of the second main signs 43a and 44a with respect to the first direction D1 is m3 ,P m4 , the center point P of the second sub-marks 43b and 44b s3 ,P s4 , and the design center point P of the second through holes 40c and 40d p3 ,P p4 In other words, the positional relationship of the first markers 33, 34 and the first through-holes 30c, 30d in the first direction D1 matches the positional relationship of the second markers 43, 44 and the second through-holes 40c, 40d in the second direction D2.

[0058] In the present invention, the above-mentioned "matching of the positional relationships" does not only mean a perfect match, but also includes manufacturing errors of the first sheet body 3 and the second sheet body 4.

[0059] Figure 6(a) is a partially enlarged schematic plan view of the first region R11 of the laminate 1 showing the positional relationship between each marker in the first stacked state, and (b) is a partially enlarged schematic plan view of the second region R21 of the laminate 1 showing the positional relationship between each marker in the second stacked state. In the figure, the fields of view of the imaging devices 11a and 11b, the first region R11, and the second region R21 are indicated by thick two-dot chain lines.

[0060] As shown in FIG. 6(a), in the first stacked state, the center point P of the second sub-mark 43b s3 , the center point P of the first main sign 33a m1 , the center point P of the second main sign 43a m3, and the center point P of the first sub-mark 33b s1 are arranged in order from the -X direction, parallel to the X axis (i.e., parallel to the first direction D1). The first main mark 33a is arranged above the second through hole 40c, and the second main mark 43a is arranged below the first through hole 30c. That is, the first through holes 30c, 30d are arranged above the second main marks 43a, 44a. When viewed from above, the second main mark 43a is arranged between the first main mark 33a and the first sub-mark 33b, and inside the first through hole 30c. Center point P m3 is the design center point P of the first through hole 30c p1 In the +X direction (first direction D1), the center point P m3 is the center point P m1 It is located at a distance of length "a1" from the center point P s3 It is located at a distance of length "e1" from the center point P s1 is the center point P m1 It is located at a distance of length "c1" from the center point P m3 It is located at a distance of length "b1" from the center point P m1 Based on the center point P m3 is located at a position of length "a1" in the first direction D1, and has a center point P s1 is located at a position of length "c1" in the first direction D1. m1 is the center point P s3 The first marker 33, 34 and the second marker 43, 44 are arranged at a position of length "d1" from the first marker 33, 34. The length "b1" is the same as the length "d1", and the length "c1" is the same as the length "e1". This positional relationship is also common between the first marker 34 and the second marker 44. The positional relationship (first positional relationship) between the first markers 33, 34 and the second markers 43, 44 in this first stacked state has already been determined and is stored as first positional relationship information i1 in the memory unit 7d (both will be described later; see FIG. 8; the same applies below).

[0061] When viewed from above, the positions of the second main marks 43a, 44a in the first stacked state are the ideal positions (hereinafter referred to as "second ideal positions") of the second main marks 43a, 44a relative to the corresponding first main marks 33a, 34a. That is, when the second main marks 43a, 44a are located at the second ideal positions in the first stacked state, the center points P of the second main marks 43a, 44a are located at the ideal positions (hereinafter referred to as "second ideal positions") of the second main marks 43a, 44a in the first stacked state. m3 ,P m4 is the center point P of the corresponding first main sign 33a, 34a m1 ,P m2 The center point P is located at a predetermined distance "a1" in the first direction D1 from the first main marker 33a, 34a. That is, the second ideal position with respect to the first main marker 33a, 34a and the first direction D1 is already determined by design. m1 ,P m2 The position of the predetermined length "a1" in the first direction D1 from the target point is an example of the predetermined second ideal position in the present invention.

[0062] As shown in FIG. 6(b), in the second stacked state, the center point P s1 , the center point P of the second main sign 43a m3 , the center point P of the first main sign 33a m1 , and the center point P of the second sub-mark 43b s3 are arranged in order from the +X direction, parallel to the X axis (i.e., parallel to the second direction D2). The second main mark 43a is arranged above the first through hole 30c, and the first main mark 33a is arranged below the second through hole 40c. That is, the second through holes 40c, 40d are arranged above the first main marks 33a, 34a. When viewed from above, the first main mark 33a is arranged between the second main mark 43a and the second sub-mark 43b, and inside the second through hole 40c. Center point P m1 is the design center point P of the second through hole 40c p3 In the -X direction (second direction D2), the center point P m1 is the center point P m3 It is located at a distance of length "a2" from the center point P s1 It is located at a distance of length "e2" from the center point Ps3 is the center point P m3 It is located at a distance of length "c2" from the center point P m1 It is located at a distance of length "b2" from the center point P m3 Based on the center point P m1 is located at a position of length "a2" in the second direction D2, and has a center point P s3 is located at a position of length "c2" in the second direction D2. m3 is the center point P s1 The second marker 43, 44 and the first marker 33, 34 are arranged at a position of length "d2" from the first marker 33, 34. The length "b2" is the same as the length "d2", and the length "c2" is the same as the length "e2". This positional relationship is also common between the second marker 44 and the first marker 34. The positional relationship (second positional relationship) between the second markers 43, 44 and the first markers 33, 34 in this second stacked state has already been determined and is stored in the memory unit 7d as second positional relationship information i2 (described below; see FIG. 8; the same applies below).

[0063] When viewed from above, the positions of the first main marks 33a, 34a in the second stacked state are located at the ideal positions (hereinafter referred to as "first ideal positions") of the first main marks 33a, 34a relative to the corresponding second main marks 43a, 44a. That is, when the first main marks 33a, 34a are located at the first ideal positions in the second stacked state, the center points P m1 ,P m2 is the center point P of the corresponding second main sign 43a, 44a m3 ,P m4 The center point P is located at a predetermined distance a2 in the second direction D2 from the second main sign 43a, 44a. That is, the first ideal position with respect to the second main sign 43a, 44a and the second direction D2 is already determined by design. m3 ,P m4 The position of the predetermined length "a2" in the second direction D2 from the target point is an example of the predetermined first ideal position in the present invention.

[0064] The length "a2" is the same as the length "a1", the length "b2" is the same as the length "b1", the length "c2" is the same as the length "c1", the length "d2" is the same as the length "d1", and the length "e2" is the same as the length "e1". That is, the positional relationship of each marker in the first stacked state is line-symmetrical with the Y axis as the axis of symmetry. Therefore, when viewed from above, the first positional relationship in the first direction D1 between the positions of the first main markers 33a, 34a and the second ideal positions of the corresponding second main markers 43a, 44a coincides with the second positional relationship in the second direction D2 between the positions of the second main markers 43a, 44a and the first ideal positions of the corresponding first main markers 33a, 34a.

[0065] Here, "matching of the first positional relationship and the second positional relationship" does not only mean perfect match, but also includes errors that may occur in the manufacturing of the first sheet body 3 and the second sheet body 4.

[0066] In the present invention, the first sheet body 3 and the second sheet body 4 may have other patterns printed on the lower surfaces 30b, 40b, or through holes or via holes arranged to penetrate the first main body portion 30.

[0067] In the present invention, the shapes of the first conductor patterns 32 of the plurality of first sheets 3 may be the same or different. The same applies to the shapes of the second conductor patterns 42 of the plurality of second sheets 4.

[0068] ●Stacking device● Next, an embodiment of a stacking device according to the present invention will be described below. In the following description, an embodiment of a stacking misalignment calculation device according to the present invention will also be described together with the stacking device.

[0069] ●Configuration of stacking device FIG. 7 is a schematic side view of the lamination device, showing an embodiment of the lamination device according to the present invention. FIG. 8 is a functional block diagram of the stacking device 5. As shown in FIG.

[0070] The stacking device 5 stacks a plurality of sheet bodies 2 (first sheet body 3, second sheet body 4) to manufacture a stacked body 1. The stacking device 5 includes a housing 6, a control device 7, a mounting table 8, a stacking table 9, a conveying device 10, and an imaging unit 11. The stacking device 5 is an example of a stacking device according to the present invention.

[0071] The housing 6 accommodates a control device 7 , a mounting table 8 , a stacking table 9 , a conveying device 10 , and an imaging unit 11 .

[0072] The control device 7 controls the overall operation of the stacking device 5. The control device 7 is, for example, a PC (Personal Computer). The control device 7 includes, for example, a processor such as a CPU (Central Processing Unit) 7a, a volatile memory such as a RAM (Random Access Memory) 7b that functions as a work area for the CPU 7a, a nonvolatile memory such as a ROM (Read Only Memory) 7c that stores various information such as a stacking misalignment calculation program according to the present invention (hereinafter referred to as "this program"), and a storage unit 7d such as a flash memory. The control device 7 is an example of a stacking misalignment calculation device according to the present invention. The CPU 7a functions as an acquisition unit 71, an image correction unit 72, an identification unit 73, a calculation unit 74, and a determination unit 75. That is, the control device 7 includes the acquisition unit 71, the image correction unit 72, the identification unit 73, the calculation unit 74, and the determination unit 75.

[0073] In the present invention, the control device 7 is not limited to a PC. For example, the control device 7 may be configured by a PLC (Programmable Logic Controller), a microcontroller, or a combination of these PLCs.

[0074] The program runs on the control device 7, and in cooperation with the hardware resources of the stacking device 5, the program realizes the stacking misalignment calculation method according to the present invention (hereinafter referred to as "the method"). By causing a processor (CPU 7a) included in the control device 7 to execute the program, the program can cause the processor to function as an acquisition unit 71, an image correction unit 72, an identification unit 73, a calculation unit 74, and a determination unit 75, thereby causing the processor to execute the method. Similarly, by causing a computer to execute the program, the program can cause the computer to function as the control device 7 (i.e., the device).

[0075] In the present invention, the program may be stored in the storage unit 7d. Alternatively, the program may be stored in an installable file format or an executable file format on a non-transitory storage medium (e.g., a CD (Compact Disc), a DVD (Digital Versatile Disc), a USB (Universal Serial Bus) memory, etc.) and provided to the control device 7 via a dedicated read-out medium.

[0076] The storage unit 7d stores information necessary for the operation of the stacking device 5 (for example, the first positional relationship information i1, the second positional relationship information i2, etc.).

[0077] FIG. 9 is a schematic diagram showing an example of information (part of the first positional relationship information i1) stored in the storage unit 7d.

[0078] The "first positional relationship information i1" is information indicating the first positional relationship. As shown in FIG. 9, the first positional relationship information i1 is information indicating the center point P m1 ,P m2 The center point P of the second main marks 43a and 44a located at the second ideal position from the (reference) m3 ,P m4 and the center point P of the second main marks 43a and 44a located at the second ideal position. m3 ,P m4From the center point P of the first sub-marks 33b and 34b s1 ,P s2 This includes the length "b1" in the first direction D1 up to the point.

[0079] FIG. 10 is a schematic diagram showing an example of other information (part of the second positional relationship information i2) stored in the storage unit 7d.

[0080] The "second positional relationship information i2" is information indicating the second positional relationship. As shown in FIG. 10, the second positional relationship information i2 is the center point P m3 ,P m4 The center point P of the first main marks 33a and 34a located at the first ideal position from (reference) m1 ,P m2 and the center point P of the first main marks 33a and 34a located at the first ideal position. m1 ,P m1 From the center point P of the second sub-signs 43b and 44b s3 ,P s4 This includes the length "b1" in the second direction D2 up to the point.

[0081] In the following description, reference will be made primarily to FIGS. 7 and 8. The acquisition unit 71 acquires information necessary for executing this method (first image g1, second image g2: see FIG. 8 for both; the same applies below.) The specific operation of the acquisition unit 71, the first image g1, and the second image g2 will be described later.

[0082] The image corrector 72 corrects the first image g1 and the second image g2 based on the first correction information stored in the memory 7d. The specific operation of the image corrector 72 and the first correction information will be described later.

[0083] The determination unit 73 determines the first direction D1 based on the first image g1, and determines the second direction D2 based on the second image g2. The specific operation of the determination unit 73 will be described later.

[0084] The calculation unit 74 calculates the amount of stacking misalignment of the first sheet body 3 relative to the second sheet body 4 based on the first direction D1, the first positional relationship, and the second main marks 43a and 44a captured in the first image g1. The calculation unit 74 also calculates the amount of stacking misalignment of the second sheet body 4 relative to the first sheet body 3 based on the second direction D2, the second positional relationship, and the first main marks 33a and 34a captured in the second image g2. Furthermore, the calculation unit 74 calculates the amount of stacking misalignment of the first conductor pattern 32 relative to the second conductor pattern 42 at a specific position of the first conductor pattern 32 (hereinafter referred to as "pattern misalignment amount"). Specific operations of the calculation unit 74 will be described later.

[0085] The "specific position" is, for example, an arbitrary position of the first conductor pattern 32 that is predetermined by the user of the lamination device 5 (for example, a position where the amount of pattern misalignment is maximum).

[0086] The determining unit 75 determines whether or not to continue stacking based on the amount of stacking misalignment or the amount of pattern misalignment. The specific operation of the determining unit 75 will be described later.

[0087] The mounting table 8 is a stage on which the sheet bodies 2 (first sheet body 3, second sheet body 4) before being stacked are placed. The mounting table 8 has an upper surface 8a.

[0088] The stacking table 9 is a stage on which a plurality of sheet bodies 2 are stacked. The stacking table 9 has an upper surface 9a.

[0089] The conveying device 10 conveys the sheet bodies 2 (first sheet body 3, second sheet body 4) placed on the mounting table 8 to the stacking table 9 and stacks them on the stacking table 9. The conveying device 10 includes, for example, a holding member 10a that suction-holds the sheet bodies 2, an elevator (not shown) that raises and lowers the holding member 10a, and a movement mechanism (not shown) that horizontally moves the holding member 10a.

[0090] The imaging unit 11 captures an image of the sheet body 2 (stack 1) stacked on the upper surface 9a of the stacking table 9. The imaging unit 11 includes a plurality of (two in this embodiment) imaging devices 11a and 11b.

[0091] The imaging device 11a captures images of the first region R11 and the second region R21. The imaging device 11a is disposed above the stacking base 9. The imaging device 11a is attached to the housing 6 so that the angle (hereinafter referred to as the "imaging angle") of the imaging direction (imaging axis) of the imaging device 11a with respect to the upper surface 9a is 90°. The field of view (imaging range) of the imaging device 11a is adjusted so that the first region R11 and the second region R21 are captured. The image captured by the imaging device 11a is a first image g1. That is, the first image g1 captures the first marker 33, the first through-hole 30c, and the second main marker 43a located below the first through-hole 30c when the first sheet 3 is stacked on the second sheet 4. Similarly, the first image g1 captures the second marker 43, the second through hole 40c, and the first main marker 33a located below the second through hole 40c when the second sheet body 4 is stacked on the first sheet body 3.

[0092] The imaging device 11b captures images of the first region R12 and the second region R22. The imaging device 11b is disposed above the stacking table 9 and attached to the housing 6 so that the imaging angle of the imaging device 11b is 90°. The field of view (imaging range) of the imaging device 11b is adjusted so that the first region R12 and the second region R22 are captured. The image captured by the imaging device 11b is the second image g2. That is, the second image g2 captures the first marker 34, the first through-hole 30d, and the second main marker 44a located below the first through-hole 30d when the first sheet body 3 is stacked on the second sheet body 4. Similarly, the second image g2 captures the second marker 44, the second through-hole 40d, and the first main marker 34a located below the second through-hole 40d when the second sheet body 4 is stacked on the first sheet body 3.

[0093] ● Operation of stacking device Next, the operation of the stacking device 5 will be described below, focusing mainly on the method executed by the control device 7. In the following description, FIGS. 1 to 11 will be referred to as appropriate.

[0094] FIG. 11 is a flowchart showing an example of the operation of the stacking device 5.

[0095] First, the control device 7 controls the operation of the conveying device 10 to stack one sheet body 2 (first sheet body 3 or second sheet body 4) placed on the mounting table 8 on the stacking table 9 (ST1). The first sheet body 3 and the second sheet body 4 are stacked alternately. That is, for example, when the top layer of the sheet bodies 2 (stack 1) stacked on the stacking table 9 is the first sheet body 3, the next sheet body 2 to be stacked is the second sheet body 4. In this embodiment, the first sheet bodies 3 are stacked in odd-numbered layers, and the second sheet bodies 4 are stacked in even-numbered layers.

[0096] Next, the control device 7 executes a lamination misalignment amount calculation process (ST2).

[0097] FIG. 12 is a flowchart showing an example of the lamination deviation amount calculation process (ST2). In the following description, FIG. 12 will be referred to as appropriate.

[0098] The "lamination misalignment calculation process (ST2)" is a process in which the control device 7 calculates the lamination misalignment between the topmost sheet body 2 and the sheet body 2 in the layer immediately below it each time a sheet body 2 is stacked. The lamination misalignment calculation process (ST2) is an example of this method. In the following description, the topmost sheet body 2 (nth layer) is the first sheet body 3, and the sheet body 2 in the layer immediately below it (n-1th layer) is the second sheet body 4.

[0099] First, the acquisition unit 71 acquires a first image g1 and a second image g2 from the imaging devices 11a and 11b (ST201: image acquisition process). The first image g1 and the second image g2 are stored, for example, in the storage unit 7d. The imaging devices 11a and 11b capture the first image g1 and the second image g2 each time a sheet 2 is stacked. The processes (ST202 to ST212) described below are common to the first image g1 and the second image g2. Therefore, in the following processes (ST202 to ST212), only the processes for the first image g1 will be described, and the processes for the second image g2 will not be described. The image acquisition process (ST201) is an example of the acquisition process of the present invention.

[0100] Next, the image correcting unit 72 corrects the acquired first image g1 (ST202: image correction process).

[0101] As described above, the imaging devices 11a and 11b are attached to the housing 6 so that the imaging angle is 90°. However, it is difficult to attach the imaging devices 11a and 11b so that the imaging angle is exactly 90°. In reality, the imaging angle is not exactly 90° but is slightly tilted from 90°. This tilt occurs in both the X-axis and Y-axis directions of the image coordinate system. Therefore, in the first image g1, the scales of the X-axis and Y-axis directions of the image coordinate system change depending on the tilt angle. That is, for example, the shape of an object captured as a rectangle at an imaging angle of 90° is deformed depending on the tilt direction. The degree of this deformation changes depending on the tilt angle. As a result, the scale of the first image g1 changes depending on the degree of deformation. The change in the scales of the X-axis and Y-axis directions of the image coordinate system due to the tilt deteriorates the calculation accuracy of the stack misalignment amount. The image correction process corrects this scale (corrects it to the scale when the imaging angle is 90°). In this embodiment, the image correcting unit 72 corrects the first image g1 using a scale correction matrix. By executing the image correction process (ST202), the stacking device 5 does not need to attach and adjust the imaging devices 11a and 11b so that the imaging angle is accurately 90°.

[0102] The "scale correction matrix" is a matrix that moves the positions of four reference points (the dimensions of the reference points are known and the reference points correspond to the corners of a rectangle, for example) captured in the first image g1 so that the reference points are located at the corners of the rectangle. The scale correction matrix is ​​a 3-row by 3-column matrix. The scale correction matrix is ​​calculated in advance based on the first image g1, for example, an image of a rectangular jig placed on the upper surface 9a, and is stored in the memory unit 7d. The scale correction matrix is ​​an example of first correction information in the present invention.

[0103] FIG. 13 is a schematic diagram showing an example of each marker extracted by this method.

[0104] Next, based on the corrected first image g1, the identification unit 73 extracts the first main sign 33a, the first sub-sign 33b, and the second main sign 43a located inside the first through-hole 30c that are imaged in the first image g1 (ST203: sign extraction process).

[0105] FIG. 14 is a schematic diagram showing an example of a specific point identified by this method. For the sake of convenience, the first through-holes 30c are not shown in this figure.

[0106] Next, the identification unit 73 identifies a specific point of each sign (ST204: specific point identification process). The specific point is identified using, for example, a known image recognition process.

[0107] The "specific point" is a point on each sign that can be easily identified by image recognition processing. In this embodiment, each sign has a circular shape. Therefore, in this embodiment, the center point P m1 ,P s1 ,P m3 is set as a specific point in advance. The identification unit 73 uses a known center calculation process to determine the center point P m1 ,P s1 ,P m3 is identified as a specific point.

[0108] In the present invention, the specific point may be set based on the shape of each marker, and is not limited to the center point of each marker. For example, the specific point may be the center of gravity of each marker or a corner of each marker.

[0109] FIG. 15 is a schematic diagram showing an example of the position vectors of the specific points calculated by this method.

[0110] Next, the specifying unit 73 calculates the coordinates of each specified point (center point P m1 ,P s1 ,P m3 ) (ST205: position vector calculation process). Specifically, the specification unit 73 calculates the position vector of the center point P m1 The position vector "v m1 ”, center point P s1 The position vector "v s1 " and the center point P m3 The position vector "v m3 Calculate the position vector "v m3 " is an example of a second marker position vector in the present invention.

[0111] Next, the calculation unit 74 calculates the calculated position vector "v m1 "," "v s1 "," "v m3 ” (i.e., each center point P m1 ,P s1 ,P m3 (ST206: position correction process).

[0112] The first markers 33 and 34 are located higher than the second markers 43 and 44 by the thickness of the sheet 2 (first sheet 3). That is, there is a difference in elevation between the two markers. Therefore, unless the lenses of the imaging devices 11a and 11b are telecentric lenses, the apparent positional relationship between the first markers 33 and 34 and the second markers 43 and 44 in the first image g1 (the relative distance of the second markers 43 and 44 to the first markers 33 and 34) changes slightly depending on the thickness of the sheet 2. Therefore, when the imaging angle is not tilted (when the tilt angle is 90°), this positional relationship changes slightly depending on the difference in elevation. The change in this positional relationship becomes larger depending on the tilt angle and the difference in elevation. That is, when the imaging angle is tilted, this positional relationship changes (shifts) depending on the tilt angle and the difference in elevation. That is, for example, when the imaging angle is 90°, two overlapping objects of the same shape are imaged with a shift depending on the tilt angle and the elevation difference. The amount of this shift varies depending on the tilt angle and the elevation difference. As described below, the control device 7 calculates the amount of stacking shift based on the positional relationship between the first markers 33, 34 and the second markers 43, 44 captured in the first image g1. Therefore, a change in the positional relationship between the first markers 33, 34 and the second markers 43, 44 based on the tilt angle and the elevation difference in the first image g1 deteriorates the calculation accuracy of the amount of stacking shift. Specifically, for example, when the tilt angle is 0.5° and the thickness of the sheet 2 is 200 μm, the error in calculation accuracy is at least 1.7 μm or more. The tilt angle is corrected by the image correction process (ST202) described above. The position correction process corrects the positional relationship based on the elevation difference (correcting the positional relationship to that when each marker is located on the same plane). In this embodiment, the calculation unit 74 executes the position correction process using a known perspective projection transformation (projection transformation) technique. Specifically, the calculation unit 74 uses a first position correction matrix to calculate the position of a specific point (center point P m1 ,P s1 ) position vector "v m1 "," "v s1 ” (i.e., coordinates) to the position vector “v m1 "," "v s1Similarly, the calculation unit 74 corrects (first correction) the position of the specific point (P m3 ) position vector "v m3 ” (i.e., coordinates) to the position vector “v m3 As a result, the positional relationship is corrected to the positional relationship when the signs are located on the same plane (upper surface 9a). In other words, there is no change in the positional relationship due to differences in elevation.

[0113] The "first position correction matrix" is a matrix obtained by dividing the height of a specific point (center point P m1 ,P s1 ) to the coordinates on the upper surface 9a. The "second position correction matrix" is a matrix that corrects the coordinates of a specific point (center point P m3 ) to coordinates on the upper surface 9a. The first position correction matrix and the second position correction matrix are matrices of 3 rows by 3 columns, and are calculated based on the reference position coordinates.

[0114] The "reference position coordinates" are the coordinates of four first reference points in a virtual plane in the first image g1 that is parallel to the top surface 9a and located at a height "T" (T is greater than the thickness of the laminate 1) from the top surface 9a, and the coordinates of four second reference points on the top surface 9a that correspond to the first reference points. When the tilt angle is 90°, the coordinates of the first reference points in the image coordinate system of the first image g1 slightly differ from the coordinates of the corresponding second reference points (a figure with the first reference points as corners is similar to a figure with the second reference points as corners). The reference position coordinates are determined in advance based on, for example, the first image g1 (after the image correction process (ST202)) captured of a rectangular parallelepiped jig (thickness "T") placed on the top surface 9a, and are stored in the storage unit 7d. That is, for example, the first reference points are the coordinates of the corners of the top surface of the jig, and the second reference points are the coordinates of the corners of the bottom surface of the jig. The reference position coordinates are an example of second correction information in the present invention.

[0115] The calculation unit 74 calculates the height "t1" of the upper surface 30a and the height "t2" of the upper surface 40a based on the thickness and number of stacked sheets of the sheet body 2. Next, the calculation unit 74 calculates a matrix (first position correction matrix) that corrects the coordinates of four points at the height "t1" on four pairs of virtual line segments (vectors) connecting the coordinates of the first reference point and the coordinates of the second reference point to coordinates on the upper surface 9a. Similarly, the calculation unit 74 calculates a matrix (second position correction matrix) that corrects the coordinates of four points at the height "t2" on the same virtual line segments to coordinates on the upper surface 9a. Next, the calculation unit 74 calculates the position vector "v m1 "," "v s1 " is multiplied by the first position correction matrix from the left to obtain the position vector "v m1 "," "v s1 ”(Specific point (center point P m1 ,P s1 Similarly, the calculation unit 74 corrects the coordinates of the position vector "v m3 " is multiplied by the second position correction matrix from the left to obtain the position vector "v m3 ”(Specific point (center point P m3 By the position correction process, all the markers are displayed with coordinates that are located on the same plane (upper surface 9a).

[0116] FIG. 16 is a schematic diagram showing an example of a direction vector calculated by this method.

[0117] Next, the specifying unit 73 determines the center point P m1 From the center point P s1 The direction vector "v n " and unit direction vector "n" are calculated (ST207: direction vector calculation process). m1 From the center point P s1 A "unit direction vector" is a vector directed toward the center of the object and has a directional component along the first direction D1. A "unit direction vector" is a direction vector with a length of "1". The direction vector "v n " is calculated, for example, by the following formula (1). The unit direction vector "n" is calculated, for example, by the following formula (2). The direction vector "v nBy calculating ", the control device 7 can identify the first direction D1. That is, the direction vector calculation process is an example of the direction identification process of the present invention.

[0118] v n =v s1 -v m1 (1)

[0119] n=(v s1 -v m1 ) / ||v s1 -v m1 ||2(2)

[0120] Next, the determination unit 73 calculates the length per pixel in the first image g1 (pixel size “p”) based on the first positional relationship information i1 (ST208). The pixel size “p” is calculated, for example, by the following equation (3).

[0121] p=(a1+b1) / ||v s1 -v m1 ||2(3)

[0122] FIG. 17 is a schematic diagram showing an example of an ideal position vector calculated by this method. In the figure, the imaginary second main sign 43a located at the second ideal position is indicated by a thick two-dot chain line.

[0123] Next, the calculation unit 74 calculates the center point P m1 The position vector "v m1 " and the unit direction vector "n", the virtual center point P of the virtual second main sign 43a located at the second ideal position is calculated. m3* The position vector of (hereinafter referred to as "ideal position vector") "v m3* " is calculated (ST209: ideal position vector calculation process). The ideal position vector "v m3* " is calculated, for example, by the following equation (4): m3* " is an example of the second ideal position vector in the present invention.

[0124] v m3* =vm1 +(a1 / p)n (4)

[0125] FIG. 18 is a schematic diagram showing an example of a sign deviation vector calculated by this method.

[0126] Next, the calculation unit 74 calculates the ideal position vector "v m3* " to the center point P m3 A vector "u" (hereinafter referred to as "sign deviation vector") pointing toward the second main sign 43a is calculated (ST210: sign deviation vector calculation process). The sign deviation vector "u" indicates the amount of stack deviation from the second ideal position of the second main sign 43a in the image coordinate system. In other words, the sign deviation vector "u" indicates the amount and direction of position deviation from the second ideal position of the second main sign 43a in the image coordinate system. The sign deviation vector "u" is an example of the second sign deviation vector in the present invention. The sign deviation vector "u" is calculated, for example, using the following equation (5).

[0127] u=v m3 -v m3* (5)

[0128] FIG. 19 is a schematic diagram showing an example of a local coordinate system used in this method.

[0129] Next, the calculation unit 74 converts the base of the sign deviation vector "u" from the image coordinate system to a local coordinate system with the center point Pm1 of the first main sign 33a as the origin (ST211: conversion process). As described above, the sign deviation vector "u" calculated by equation (5) indicates the amount and direction of stacking deviation in the image coordinate system. If the image coordinate system (i.e., the imaging range) is fixed and does not fluctuate with each imaging, the amount and direction of stacking deviation of the top layer (first sheet body 3) can be identified using the sign deviation vector "u." However, the imaging range of the imaging devices 11a and 11b may fluctuate slightly with each imaging due to vibrations from the housing 6 or the influence of heat generated inside or outside the imaging devices 11a and 11b. Therefore, while the amount of stacking deviation indicated by the sign deviation vector "u" is accurate, the direction of stacking deviation may be inaccurate. Therefore, the present invention uses a local coordinate system whose origin is the marker (center point Pm1 of the first main marker 33a) of the top layer (first sheet body 3) of the printed patterns (first pattern 31, second pattern 41) that are not affected by fluctuations in the imaging range.

[0130] As mentioned above, the direction indicated by the unit direction vector "n" (first direction D1) is set by the print pattern and is always fixed. Therefore, the coordinate axes of the local coordinate system use the direction indicated by the unit direction vector "n" (first direction D1) and a direction perpendicular to this direction (hereinafter referred to as the "orthogonal direction"). That is, in this embodiment, the local coordinate system has a coordinate axis parallel to the X-axis direction and a coordinate axis parallel to the Y-orthogonal direction. When the unit direction vector is "n v ", the stacking misalignment vector "u" in the local coordinate system is calculated, for example, by the following equation (6). The calculation unit 74 can calculate the stacking misalignment amount and stacking misalignment direction in pixel units based on the stacking misalignment vector "u".

[0131] u=(u·n)n+(u·n v )n v (6)

[0132] Next, the calculation unit 74 converts the unit of the stacking misalignment amount "Δu" indicated by the stacking misalignment vector "u" from the unit of the coordinate system (pixels) to the unit of the print pattern (first pattern 31, second pattern 41) (SI unit: μm) (ST212: unit conversion process). As a result, the calculation unit 74 can calculate the stacking misalignment amount and stacking misalignment direction in SI units. The units are converted, for example, using the following equation (7).

[0133] Δu=p||u||2(7)

[0134] In this way, the control device 7 calculates the amount and direction of stacking misalignment between the two layers based on the positional relationship between the marker (first main marker 33a) on the topmost (nth) layer of the sheet body 2 (first sheet body 3) and the marker (second main marker 43a) on the next lower (n-1th) layer of the sheet body 2 (second sheet body 4). Therefore, even if the imaging ranges of the imaging devices 11a and 11b change due to vibration or heat, the control device 7 can calculate the amount and direction of stacking misalignment between the two layers without being affected by the change. As a result, the present invention can calculate the amount of stacking misalignment between the two layers of stacked sheet bodies with high accuracy (for example, on the order of several μm). Furthermore, each marker has a circular shape. Therefore, the center point of each marker is identified with higher accuracy than a specific point of other shapes by averaging center points obtained multilaterally from multiple directions. As a result, the calculation accuracy of the amount of stacking misalignment is further improved.

[0135] In the present invention, the specifying unit 73 and the calculating unit 74 can further improve the calculation accuracy of the amount of stack misalignment by using known sub-pixel processing in combination.

[0136] Next, the calculation unit 74 calculates the stacking misalignment amount and stacking misalignment direction of the printed pattern at a specific position (in this embodiment, the position where the stacking misalignment amount is maximum) "Px" (see Figure 20) based on the stacking misalignment amount and stacking misalignment direction calculated based on the first image g1 and the stacking misalignment amount and stacking misalignment direction calculated based on the second image g2 (ST213: Pattern misalignment amount calculation process).

[0137] FIG. 20 is a schematic diagram showing an image of the pattern misalignment amount calculation process (ST213). In the figure, any pattern on the first conductor pattern 32 is shown in dark gray, and any pattern on the second conductor pattern 42 is shown in light gray. The circled pattern in the figure indicates an example of a specific position "Px."

[0138] As described above, the first conductor pattern 32 and the second conductor pattern 42 have a pattern coordinate system with the X-axis and Y-axis as coordinate axes. The first direction D1 and the second direction D2 are parallel to the X-axis. Therefore, the local coordinate system described above is parallel to the pattern coordinate system, and the relationship between the two coordinate systems is fixed. The shape of the printed pattern is known, and the coordinates of each position within it can be easily identified. Furthermore, stacking misalignment of the first conductor pattern 32 and the second conductor pattern 42 occurs only through horizontal translation and rotation. Therefore, once the stacking misalignment amount and stacking misalignment direction at two locations in the printed pattern are identified, the stacking misalignment amount and stacking misalignment direction for the entire printed pattern or at any position in the printed pattern can be identified, and the position in the printed pattern with the largest stacking misalignment amount can be identified. Here, as preprocessing for the pattern misalignment amount calculation process (ST213), the control device 7 converts the coordinate systems of each position vector and each ideal position vector from the image coordinate system to the local coordinate system, and then converts the local coordinate system to the pattern coordinate system. By executing this process, the control device 7 can identify the position of each marker in the pattern coordinate system and the amount of deviation thereof.

[0139] Next, the determination unit 75 determines whether the amount of stacking deviation at the specific position "Px" is less than a predetermined threshold "Vt" (ST214: determination process). If the amount of stacking deviation at the specific position "Px" is equal to or greater than the predetermined threshold "Vt" ("N" in ST214), the determination unit 75 stops the continuation of stacking, and the control device 7 notifies of a stacking abnormality (ST215). Thereafter, the stacking deviation amount calculation process (ST2) ends. On the other hand, if the amount of stacking deviation at the specific position "Px" is less than the predetermined threshold "Vt" ("Y" in ST214), the determination unit 75 allows the continuation of stacking, and the stacking deviation amount calculation process (ST2) ends. The predetermined threshold "Vt" is set in advance and is stored, for example, in the memory unit 7d.

[0140] The lamination misalignment calculation process (ST2) described above can also be executed in the same way when the sheet body 2 in the uppermost layer (nth layer) is the second sheet body 4 and the sheet body 2 in the layer immediately below (n-1th layer) is the first sheet body 3. In this case, the position vector calculated in the position vector calculation process (ST205) is the position vector of the center point P m3 The position vector "v m3 ”, center point P s3 The position vector "v s3 " and the center point P m1 The position vector "v m1 The direction vector "v n " is the center point P m3 From the center point P s3 The ideal position vector "v" calculated in the ideal position vector calculation process (ST209) is a vector directed to the second direction D2 and has a directional component along the second direction D2. m3* " is the virtual center point P of the virtual first main sign 33a located at the first ideal position. m1* The local coordinate system of the basis transformation process (ST211) is the position vector of the center point P of the second main sign 43a. m3 is a local coordinate system with the origin at

[0141] In this way, the present invention calculates the amount of stacking misalignment between two layers using a part (first markers 33, 34) of the first pattern 31 and a part (second markers 43, 44) of the second pattern 41 printed on each layer (each sheet 2). Therefore, the present invention can calculate the amount of stacking misalignment between two layers with high accuracy without being affected by slight changes in the field of view of the imaging devices 11a, 11b.

[0142] Furthermore, the first markers 33, 34 are formed so as to be able to specify the first direction D1, and the second markers 43, 44 are formed so as to be able to specify the second direction. The second ideal positions of the second markers 43, 44 with respect to the first direction D1 are located at predetermined positions designed in advance using a specific point on the first markers 33, 34 as a reference. The first ideal positions of the first markers 33, 34 with respect to the second direction D2 are located at predetermined positions designed in advance using a specific point on the second markers 43, 44 as a reference. Therefore, the present invention can calculate the amount of stacking misalignment of the second sheet body 4 stacked on the first sheet body 3 by calculating the amount of deviation of the first main markers 33a, 34a from the first ideal positions. Similarly, the present invention can calculate the amount of stacking misalignment of the first sheet body 3 stacked on the second sheet body 4 by calculating the amount of deviation of the second main markers 43a, 44a from the second ideal positions.

[0143] Generally, when a through-hole is imaged from directly above, the top surface of the lower layer is captured inside the through-hole, so the only feature of the through-hole in the captured image is the edge of the through-hole. Furthermore, when the imaging angle is tilted, the inner surface of the through-hole is captured inside the through-hole. In this case, the illumination must be adjusted to emphasize the edge of the through-hole rather than the edge of the inner surface (especially the lower layer), and the illumination conditions are difficult to determine. Therefore, highly accurate edge detection of the through-hole alone using image recognition is difficult, so a pattern is printed on the outer edge of the through-hole to emphasize the contrast of the through-hole edge. However, through-holes formed in a sheet are prone to burrs and distortion, resulting in low circularity. Furthermore, through-holes are formed in a separate process from the printing of the conductor pattern. Therefore, the positional relationship between the through-hole and the conductor pattern on each sheet may vary slightly. Therefore, edge detection of through-holes is not suitable for improving the accuracy of calculating the amount of stacking misalignment between two layers. Therefore, in the present invention, edge detection of the first through-holes 30c, 30d and the second through-holes 40c, 40d is not used, and only the markers on each sheet 2 are used.

[0144] In the present invention, when the sheet body 2 in the uppermost layer (nth layer) is the second sheet body 4 and the sheet body 2 in the layer immediately below (n-1th layer) is the first sheet body 3, the second sheet body 4 may be treated herein as an example of the first sheet body in the present invention, and the first sheet body 3 may be treated as an example of the second sheet body in the present invention. In this case, the second direction D2 is treated as an example of the first direction in the present invention, and the first direction D1 is treated as an example of the second direction in the present invention.

[0145] Furthermore, in the present invention, the local coordinate system does not have to be parallel to the pattern coordinate system. Even in this case, the first markers 33, 34 are printed as the same first pattern 31 as the first conductive pattern 32. Therefore, some fixed relationship is established between the local coordinate system of the first markers 33, 34, which is formed so that the first direction D1 can be identified, and the pattern coordinate system.

[0146] Summary According to the embodiment described above, the first sheet body 3 includes an upper surface 30a, a first conductive pattern 32, first markers 33 and 34, and first through holes 30c and 30d. The second sheet body 4 includes a second conductive pattern 42, second markers 43 and 44, and second through holes 40c and 40d. When the first sheet body 3 is stacked on the second sheet body 4, the first through holes 30c and 30d are formed so as to be positioned above the corresponding second main markers 43a and 44a. When the second sheet body 4 is stacked on the first sheet body 3, the second through holes 40c and 40d are formed so as to be positioned above the corresponding first main markers 33a and 34a. The size of the first main markers 33a and 34a is smaller than the size of the second through holes 40c and 40d. The size of the second main markers 43a and 44a is smaller than the size of the first through holes 30c and 30d. The first markers 33 and 34 are formed so as to be able to identify a first direction D1, and the second markers 43 and 44 are formed so as to be able to identify a second direction D2. In the first stacked state, the first direction D1 is the opposite direction to the second direction D2, and the second main marker 43a (center point P m3 ) is located at a predetermined second ideal position relative to the first main mark 33a. In the second stacked state, the second direction D2 is the opposite direction to the first direction D1, and the first main mark 33a (center point P m1) is located at a predetermined first ideal position relative to the second main mark 43a. When viewed from above, the positional relationship (first positional relationship) between the position of the first main mark 33a and the second ideal position in the first direction D1 coincides with the second positional relationship between the position of the second main mark 43a and the first ideal position in the second direction D2. With this configuration, when the first sheet body 3 is stacked on the second sheet body 4, it is possible to calculate the amount and direction of deviation of the second main marks 43a and 44a from the second ideal position. The amount and direction of deviation correspond to the amount and direction of stacking deviation of the first sheet body 3 from the second sheet body 4. Similarly, when the second sheet body 4 is stacked on the first sheet body 3, it is possible to calculate the amount and direction of deviation of the first main marks 33a and 34a from the first ideal position. The amount and direction of deviation correspond to the amount and direction of stacking deviation of the second sheet body 4 from the first sheet body 3. In this way, the present invention can calculate the amount and direction of stacking misalignment between two layers based solely on the positional relationship between the first main markers 33a, 34a and the second main markers 43a, 44a. That is, the present invention can calculate the amount of stacking misalignment between two layers without being affected by slight changes in the field of view of the imaging devices 11a, 11b. Therefore, since the laminate 1 is manufactured by alternately stacking the first sheet body 3 and the second sheet body 4, the present invention can calculate the amount of stacking misalignment between the two layers in-line with high accuracy during the manufacture of the laminate 1.

[0147] Furthermore, according to the embodiment described above, the first signs 33, 34 include first main signs 33a, 34a and first sub-signs 33b, 34b. The first sub-signs 33b, 34b are arranged at a distance closer to the first direction D1 than the first main signs 33a, 34a. The second signs 43, 44 include second main signs 43a, 44a and second sub-signs 43b, 44b. The second sub-signs 43b, 44b are arranged at a distance closer to the second direction D2 than the second main signs 43a, 44a. The first direction D1 is the direction in which the first sub-signs 33b, 34b are located relative to the first main signs 33a, 34a. The second direction D2 is the direction in which the second sub-signs 43b, 44b are located relative to the second main signs 43a, 44a. According to this configuration, the first direction D1 and the second direction D2 are identified between two markers spaced apart from each other. Therefore, the accuracy of identifying the first direction D1 and the second direction D2 is improved compared to when they are identified using a single marker. Furthermore, the first direction D1 and the second direction D2 are identified regardless of the shape of each marker.

[0148] Furthermore, according to the embodiment described above, the first main signs 33a, 34a and the first sub-signs 33b, 34b are circular with different diameters. The second main signs 43a, 44a and the second sub-signs 43b, 44b are circular with different diameters. The first direction D1 extends from the center point P of the first main signs 33a, 34a. m1 ,P m2 The center point P of the first sub-marks 33b and 34b s1 ,P s2 The second direction D2 is the direction in which the center point P of the second main signs 43a and 44a is located. m3 ,P m4 The center point P of the second sub-marks 43b and 44b s3 ,P s4 This is the direction in which the first and second directions D1 and D2 are located. With this configuration, the center points of each marker can be identified with high accuracy. Therefore, the accuracy of identifying the first direction D1 and the second direction D2 is further improved. In addition, the first main markers 33a and 34a and the first sub-markers 33b and 34b can be easily distinguished.

[0149] Furthermore, according to the embodiment described above, the laminate 1 includes a pair of first and second sheets 3 and 4. With this configuration, the present invention can calculate the amount of lamination misalignment between the two layers without being affected by slight changes in the field of view of the imaging devices 11a and 11b. Furthermore, the present invention can calculate the amount of lamination misalignment between the two layers in-line with high accuracy during the production of the laminate 1.

[0150] Furthermore, according to the embodiment described above, the control device 7 determines the amount of stacking misalignment between two layers of the stack 1 based on images (first image g1, second image g2) captured by the imaging devices 11a and 11b arranged above the stack 1. The first image g1 captures the first marker 33, the first through-hole 30c, and the second main marker 43a located below the first through-hole 30c in a state in which the first sheet 3 is stacked on the second sheet 4. The control device 7 includes a memory unit 7d, an acquisition unit 71, an identification unit 73, and a calculation unit 74. The memory unit 7d stores first positional relationship information i1. The acquisition unit 71 acquires the first image g1. The identification unit 73 identifies the first direction D1 based on the first marker 33 captured in the first image g1. The calculation unit 74 calculates the amount of stacking misalignment and the direction of stacking misalignment of the first sheet body 3 relative to the second sheet body 4 based on the first direction D1, the first positional relationship, and the second main mark 43a. With this configuration, the control device 7 can calculate the amount of stacking misalignment between the two layers without being affected by slight changes in the field of view of the imaging devices 11a and 11b. Furthermore, the control device 7 can calculate the amount of stacking misalignment between the two layers in-line with high accuracy during the production of the laminate 1.

[0151] Furthermore, according to the embodiment described above, the identification unit 73 identifies the first direction by calculating a first direction vector in the image coordinate system of the first image g1 based on the position vector of the first marker 33. The calculation unit 74 calculates an ideal position vector of the second ideal position in the image coordinate system based on the first direction vector. Next, the calculation unit 74 calculates the position vector of the second main marker 43a in the image coordinate system. Next, the calculation unit 74 calculates the amount of stacking misalignment based on the calculated ideal position vector and position vector. With this configuration, the control device 7 can easily calculate the amount and direction of stacking misalignment in the image coordinate system.

[0152] Furthermore, according to the embodiment described above, the calculation unit 74 calculates a sign deviation vector based on the calculated ideal position vector and position vector. Next, the calculation unit 74 converts the base of the sign deviation vector from the image coordinate system to a local coordinate system with the center point Pm1 of the first main sign 33a as the origin. Next, the calculation unit 74 calculates the stack deviation amount and stack deviation direction based on the converted sign deviation vector. With this configuration, the control device 7 can calculate not only the stack deviation amount but also the stack deviation direction with high accuracy.

[0153] Furthermore, according to the embodiment described above, the storage unit 7d stores a scale correction matrix (first correction information). The scale correction matrix is ​​used to correct changes in scale in the X-axis direction and the Y-axis direction in the image coordinate system of each of the first image g1 and the second image g2, which occur based on the tilt of the imaging angle. The control device 7 corrects the first image g1 and the second image g2 based on the scale correction matrix. This configuration improves the accuracy with which the control device 7 calculates the amount and direction of stack misalignment. Furthermore, there is no need to install and adjust the imaging devices 11a and 11b so that the imaging angle is accurately 90°.

[0154] Furthermore, according to the embodiment described above, the storage unit 7d stores reference position coordinates (second correction information). The reference position coordinates are used to correct a change in the positional relationship between the first markers 33, 34 and the second markers 43, 44 in the image coordinate system, which occurs based on the difference in elevation between the first markers 33, 34 and the second markers 43, 44. The calculation unit 74 calculates the position vectors of the first markers 33, 34 (position vectors "v" and "v") based on the reference position information. m1 "," "v s1 "), and the position vector of the second marker 43, 44 (position vector "v m3 "," "v s3 "). With this configuration, all signs are indicated by coordinates located on the same plane (upper surface 9a). That is, there is no change in the positional relationship of each sign due to differences in elevation. Therefore, the accuracy of the control device 7 in calculating the amount and direction of stacking misalignment is further improved.

[0155] Furthermore, according to the embodiment described above, the upper surface 30a includes first regions R11 and R12, and the upper surface 40a includes second regions R21 and R22. The first marker 33 and the first through-hole 30c are arranged in the first region R11, and the first marker 34 and the first through-hole 30d are arranged in the first region R12. The second marker 43 and the second through-hole 40c are arranged in the second region R21, and the second marker 44 and the second through-hole 40d are arranged in the second region R22. When the first sheet body 3 is stacked on the second sheet body 4, the first regions R11 and R12 are arranged above the corresponding second regions R21 and R22. The acquisition unit 71 acquires the first image g1 and the second image g2. The identification unit 73 identifies the first direction D1 in the first image g1 based on the first marker 33, and identifies the first direction D1 in the second image g2 based on the first marker 34. The calculation unit 74 calculates the amount of stacking misalignment in the first image g1 based on the first direction D1, the first positional relationship, and the second main marker 43a. The calculation unit 74 also calculates the amount of stacking misalignment in the second image g2 based on the first direction D1, the first positional relationship, and the second main marker 44a. The calculation unit 74 also calculates the amount of stacking misalignment at a specific position based on the amount of stacking misalignment in the first image g1 and the amount of stacking misalignment in the second image g2. This configuration improves the accuracy of the control device 7 in calculating the amount of stacking misalignment and the direction of stacking misalignment. The control device 7 can also calculate the amount of stacking misalignment at any position (specific position “Px”) of the first conductor pattern 32.

[0156] ●Variations● Next, modified examples of the present laminate will be described below, focusing on the differences from the previously described embodiment (hereinafter referred to as the "first embodiment"). In the following description of the modifications, the same elements as in the first embodiment and elements having common functions are given the same reference numerals as in the first embodiment for the sake of convenience, and their description will be omitted. In the first to second modifications, the aspects of the first marker and second marker differ from the first embodiment. In the third to fifth modifications, the aspects of the first through hole, second through hole, first marker, and second marker differ from the first embodiment.

[0157] First modified example to fifth modified example Figure 21 is a partially enlarged schematic plan view of the present laminate, where (a) shows a first modified example of the present laminate, (b) shows a second modified example of the present laminate, (c) shows a third modified example of the present laminate, (d) shows a fourth modified example of the present laminate, and (e) shows a fifth modified example of the present laminate. This figure shows only the imaging range of the imaging device 11a in the laminate 1 in a schematic manner.

[0158] As shown in FIG. 21(a), in the first modified example, the first marker 33 includes only the first main marker 33a and does not include the first sub-marker 33b. Similarly, the second marker 43 includes only the second main marker 43a and does not include the second sub-marker 43b. The first main marker 33a and the second main marker 43a are rectangular in shape with their longitudinal direction along the X-axis direction. In this configuration, the identification unit 73 identifies the center point, center of gravity, or corner of the first main marker 33a and the second main marker 43a as the identified points. By identifying the longitudinal directions of the first main marker 33a and the second main marker 43a, the identification unit 73 identifies the first direction D1 and the second direction D2 (not shown in FIG. 21; the same applies below).

[0159] In the first modification, the specific portion 73 is located at the center point P p1 Alternatively, the position vector may be calculated, and the pixel size may be calculated based on the position vector and the first positional relationship information i1.

[0160] 21(b), in the second modified example, similar to the first modified example, the first marker 33 includes only a first main marker 33a, and the second marker 43 includes only a second main marker 43a. The first main marker 33a and the second main marker 43a are shaped like a cross with their longitudinal direction aligned with the X-axis direction. In this configuration, the identification unit 73 identifies the first direction D1 and the second direction D2, similar to the first modified example.

[0161] As shown in FIG. 21(c), in the third modified example, similar to the first modified example, the first marker 33 includes only a first main marker 33a, and the second marker 43 includes only a second main marker 43a. The first through-hole 30c is arranged in a direction (+Y direction) rotated by a predetermined angle (90° in this embodiment) in a predetermined direction (counterclockwise in this embodiment) relative to the first main marker 33a when viewed upward from the first direction D1. The second through-hole 40c is arranged in a direction (-Y direction) rotated by a predetermined angle in a predetermined direction (counterclockwise in this embodiment) relative to the second main marker 43a when viewed upward from the second direction D2. The shapes of the first through-hole 30c and the second through-hole 40c are rectangular and similar to the shapes of the first main marker 33a and the second main marker 43a. In this configuration, the identification unit 73 identifies the first direction D1 and the second direction D2, similar to the first modified example. The determination unit 73 executes the processing (ST208, ST209) using as a reference a direction obtained by rotating the determined first direction D1 and second direction D2 in a predetermined direction by a predetermined angle.

[0162] In the third modified example, the identification unit 73 may identify the longitudinal directions of the first main sign 33a and the second main sign 43a, and then identify the directions obtained by rotating the identified first direction D1 and second direction D2 by a predetermined angle in a predetermined direction as the first direction and the second direction in the present invention.

[0163] As shown in FIG. 21(d), in the fourth modified example, the first marker 33 includes two first main markers 33a and 33c. The first main body portion 30 includes two first through holes 30c and 30e. The positional relationship between the first main marker 33a and the first through hole 30c and the positional relationship between the first main marker 33c and the first through hole 30e are the same as those in the third modified example. The second marker 43 includes two second main markers 43a and 43c. The second main body portion 40 includes two second through holes 40c and 40e. The positional relationship between the second main marker 43a and the second through hole 40c and the positional relationship between the second main marker 43c and the second through hole 40e are the same as those in the third modified example. In this configuration, the identification unit 73 identifies the first direction D1 and the second direction D2, as in the third modified example. The calculation unit 74 calculates the amount of stacking misalignment based on the first main mark 33a and the second main mark 43a, calculates the amount of stacking misalignment based on the first main mark 33c and the second main mark 43c, and calculates the average value as the final amount of stacking misalignment. As a result, the calculation accuracy of the amount of stacking misalignment is improved.

[0164] As shown in FIG. 21(e), in the fifth modified example, the first marker 33 includes three first main markers 33a, 33d, and 33e. The first main markers 33a, 33d, and 33e are arranged at equal intervals to form an equilateral triangle. The first body portion 30 includes three first through holes 30c, 30f, and 30g. The first through holes 30c, 30f, and 30g are arranged at equal intervals to form an equilateral triangle that faces inversely to the equilateral triangle formed by the first main markers 33a, 33d, and 33e. That is, the first through holes 30c, 30f, and 30g are arranged in a direction (+Y direction) rotated by a predetermined angle (30° in this embodiment) in a predetermined direction (counterclockwise in this embodiment) relative to the corresponding first main markers 33a, 33d, and 33e when viewed upward from the first direction D1. The second marker 43 includes three second main markers 43a, 43d, and 43e. The second body unit 40 includes three second through-holes 40c, 40f, and 40g. In this configuration, the identification unit 73 identifies the first direction D1 using two predetermined points (e.g., the first main markers 33a and 33d) among the first main markers 33a, 33d, and 33e. In this case, the first main marker 33d functions as the first sub-marker 33b of the first embodiment. The identification unit 73 performs processing (ST208 and ST209) based on a direction rotated a predetermined angle in a predetermined direction from the identified first direction D1. The calculation unit 74 calculates the amount of stacking misalignment based on the first main marks 33a, 33d and the second main mark 43a, calculates the amount of stacking misalignment based on the first main marks 33d, 33e and the second main mark 43d, calculates the amount of stacking misalignment based on the first main marks 33e, 33a and the second main mark 43e, and calculates the average value as the final amount of stacking misalignment. As a result, the accuracy of calculating (measuring) the amount of stacking misalignment is improved.

[0165] ●Other embodiments● In the present invention, the configuration of the first markers 33, 34 is not limited to that of the first embodiment, as long as the first markers 33, 34 are formed so as to be able to identify the first direction D1. The same applies to the configuration of the second markers 43, 44. That is, for example, the first marker 33 may include only the first main marker 33a having a shape that allows the first direction D1 to be identified, as in the first and second modifications, and may not include the first sub-marker 33b. In this configuration, the accuracy of identifying the first direction D1 may be worse than in the first embodiment. However, the present invention, like the first embodiment, can calculate the amount of stacking misalignment between two layers without being affected by slight changes in the field of view of the imaging devices 11a, 11b.

[0166] Furthermore, in the present invention, the shape of each marker is not limited to a circular shape as long as it allows the present method to be carried out. That is, for example, the shape of each marker may be rectangular as in the first modified example, a polygonal shape other than a rectangular shape, or an elliptical shape. Also, for example, the shapes of each marker may be different.

[0167] Furthermore, in the present invention, the number of first markers 33 arranged in the first region R11 is not limited to "1". That is, for example, the number of first markers 33 arranged in the first region R11 may be "2" as in the fourth modified example. The same applies to the numbers of each of the markers arranged in the first region R12 to the second region R22.

[0168] Furthermore, in the present invention, the number of first markers 33, 34 included in the first pattern 31 is not limited to "2." That is, for example, the number of first markers 33, 34 included in the first pattern 31 may be "1," or "3" or more. In this case, the number of second markers 43, 44 included in the second pattern 41 is the same as the number of first markers 33, 34.

[0169] Furthermore, in the present invention, the diameters of the first main markers 33a and 34a may be the same as the diameters of the first sub-markers 33b and 34b. This relationship also applies to the second markers 43 and 44.

[0170] Furthermore, in the present invention, the shape of the first through-holes 30c, 30d is not limited to a circular shape as long as it allows the second main signs 43a, 44a below to be imaged when viewed from above. That is, for example, the shape of each sign may be rectangular as in the first modified example, a polygonal shape other than a rectangular shape, or an elliptical shape. The same applies to the shape of the second through-holes 40c, 40d.

[0171] Furthermore, in the present invention, the first through holes 30c, 30d and the second through holes 40c, 40d may have any size that allows the present method to be carried out.

[0172] Furthermore, in the present invention, the first through holes 30c, 30d do not have to be arranged in the first direction D1 relative to the first main markers 33a, 34a. That is, for example, the first through holes 30c, 30d may be arranged at positions rotated a predetermined angle in a predetermined direction from the first direction D1, as in the third to fifth modified examples. The same applies to the arrangement of the second through holes 40c, 40d.

[0173] Furthermore, in the present invention, the positions of the first regions R11, R12 may be any positions where the present method can be carried out, and are not limited to the outer edge of the first sheet body 3. The same applies to the positions of the second regions R21, R21.

[0174] Furthermore, in the present invention, the control device 7 does not have to execute the image correction process (ST202).

[0175] Furthermore, in the present invention, the first correction information used in the image correction process (ST202) is not limited to scale correction information as long as it is information that can correct the change in scale based on the tilt of the imaging angle in the first image g1 and the second image g2.

[0176] Furthermore, in the present invention, the control device 7 does not have to execute the position correction process (ST206).

[0177] Furthermore, in the present invention, the second correction information used in the position correction process (ST206) is not limited to reference position coordinates as long as it is information that can correct changes in the positional relationship between markers based on the inclination of the imaging angle and the difference in elevation in the first image g1 and the second image g2.

[0178] Furthermore, in the present invention, the fields of view of the imaging devices 11a and 11b are limited to narrow first regions R11 and R12 and second regions R21 and R22. Therefore, when the tilt angle of the imaging angle is so small that the difference values ​​"xj" and "yj" between the coordinates of the first reference point and the coordinates of the second reference point can be ignored, the calculation unit 74 does not need to use the perspective projection transformation technique. In this case, for example, the calculation unit 74 calculates the value obtained by multiplying the difference value "xj" by the height ratio "t1 / T" as the specific point (center point P m1 ,P s1 ) from the X coordinate of the center point P m1 ,P s1 ) from the Y coordinate of the specific point (center point P m1 ,P s1 ) coordinates (position vector "v m1 "," "v s1 Here, when the tilt angle is small, the four sets of virtual line segments are almost parallel. Therefore, it is preferable to calculate the difference values ​​"xj" and "yj" for one set of virtual line segments out of the four sets of virtual line segments.

[0179] Furthermore, in the present invention, the control device 7 does not need to execute the conversion process (ST211). Even in this case, the present invention can calculate the amount of stack misalignment with high accuracy.

[0180] Furthermore, in the present invention, the control device 7 does not have to execute the pattern shift amount calculation process (ST213) and the determination process (ST214).

[0181] Furthermore, in the present invention, the method only needs to calculate the amount of stacking misalignment between two layers based on the positional relationship between the first main marks 33a, 34a and the first ideal position, and calculate the amount of stacking misalignment between the two layers based on the positional relationship between the second main marks 43a, 44a and the second ideal position, and is not limited to the first embodiment.

[0182] ●Embodiments of the present invention● Next, the embodiments of the present invention that can be understood from the above-described embodiments will be described below, using the terms and symbols used in the embodiments.

[0183] A first embodiment of the present invention is a pair of sheets (e.g., sheet 2) used to form a laminate (e.g., laminate 1), the pair of sheets comprising a first sheet (e.g., first sheet 3) arranged in the "n" layer (n is a natural number equal to or greater than 2) in the stacking direction of the laminate, and a plurality of second sheets (e.g., second sheet 4) arranged in the "n-1" layer in the stacking direction, the first sheet having a first upper surface (e.g., upper surface 30a), a first conductor pattern (e.g., first conductor pattern 32) printed on the first upper surface, and a first conductor pattern (e.g., first conductor pattern 33) printed on the first upper surface. The second sheet body includes first marks (e.g., first marks 33, 34) printed on the first upper surface together with a pattern, and first through holes (e.g., first through holes 30c, 30e to 30g, 30d) penetrating in the thickness direction of the first sheet body, and the second sheet body includes a second upper surface (e.g., upper surface 40a), a second conductive pattern (e.g., second conductive pattern 42) printed on the second upper surface, second marks (e.g., second marks 43, 44) printed on the second upper surface together with the second conductive pattern, and second through holes (e.g., second through holes 40c,40d to 40g), wherein when the first sheet body is stacked on the second sheet body, the first through holes are formed to be arranged above the second markers of the corresponding second sheet body, when the second sheet body is stacked on the second sheet body, the second through holes are formed to be arranged above the first markers of the corresponding first sheet body, a size of the first markers is smaller than a size of the second through holes, a size of the second markers is smaller than a size of the first through holes, the first markers are formed to be able to identify a first direction (e.g., a first direction D1) on the first upper surface, and the second markers are formed to be able to identify a second direction (e.g., a second direction D2) on the second upper surface. When the first sheet body is accurately stacked on the second sheet body, the first direction is the opposite direction to the second direction, and the second marker is located at a predetermined second ideal position relative to the first marker when viewed from above. When the second sheet body is accurately stacked on the first sheet body, the second direction is the opposite direction to the first direction, and the first marker is located at a predetermined first ideal position relative to the second marker when viewed from above. When the second sheet body is accurately stacked on the first sheet body, the second direction is the opposite direction to the first direction, and the first marker is located at a predetermined first ideal position relative to the second marker when viewed from above. A first positional relationship between the position of the first marker and the second ideal position relative to the first direction coincides with a second positional relationship between the position of the second marker and the first ideal position relative to the second direction. According to this configuration, the present invention can calculate the amount of stacking misalignment between two layers without being affected by slight changes in the field of view of the imaging device.

[0184] A second embodiment of the present invention is a sheet body in the first embodiment, wherein the first sign comprises a first main sign (e.g., first main sign 33a, 33c to 33e, 34a) and a first sub-sign (e.g., first sub-sign 33b, 34b) arranged at a distance from the first main sign towards the first direction, and the second sign comprises a second main sign (e.g., second main sign 43a, 43c to 43e, 44a) and a second sub-sign (e.g., second sub-sign 43b, 44b) arranged at a distance from the second main sign towards the second direction, wherein the first direction is the direction in which the first sub-sign is located relative to the first main sign, and the second direction is the direction in which the second sub-sign is located relative to the second main sign. According to this configuration, the accuracy of identifying the first direction and the second direction is improved compared to when they are identified using a single marker.

[0185] A third embodiment of the present invention is the second embodiment, wherein the first main sign and the first sub-sign are each formed in a circular shape, the second main sign and the second sub-sign are each formed in a circular shape, and the first direction is defined by a center point of the first main sign (for example, a center point "P m1 ") relative to the center point of the first sub-mark (for example, center point "P s1 ") is located, and the second direction is the direction in which the center point of the second main sign (for example, the center point "P m3 ") relative to the center point of the second sub-mark (for example, the center point "P s3 ") is located in the sheet body. According to this configuration, the center point of each marker can be identified with high accuracy.

[0186] A fourth embodiment of the present invention is a laminate (for example, laminate 1) formed by stacking a plurality of sheet bodies, wherein the sheet bodies are the sheet bodies described in the first embodiment. According to this configuration, the present invention can calculate the amount of stacking misalignment between two layers without being affected by slight changes in the field of view of the imaging device.

[0187] A fifth embodiment of the present invention is a stacking misalignment amount calculation device (e.g., control device 7) that calculates a stacking misalignment amount between two layers of a stack based on an image (e.g., a first image g1, a second image g2) captured by an imaging device (e.g., imaging devices 11a, 11b) arranged above the stack, wherein the stack is the stack described in the fourth embodiment, and the image (e.g., first image g1) includes the first marker, the first through-hole, and the second marker located below the first through-hole in a state in which the first sheet body is stacked on the second sheet body. , is imaged and the first positional relationship (e.g., first positional relationship information i1) is stored in the memory unit (e.g., memory unit 7d); an acquisition unit (e.g., acquisition unit 71) acquires the image; an identification unit (e.g., identification unit 73) identifies the first direction based on the first marker imaged in the image; and a calculation unit (e.g., calculation unit 74) calculates the stacking misalignment amount of the first sheet body relative to the second sheet body based on the identified first direction, the first positional relationship, and the second marker imaged in the image. According to this configuration, the present invention can calculate the amount of stacking misalignment between two layers without being affected by slight changes in the field of view of the imaging device.

[0188] A sixth embodiment of the present invention is the fifth embodiment, wherein the identification unit is configured to identify a position vector of the first marker (for example, a position vector “v m1 "," "v s1 "), a first direction vector (for example, a direction vector "v n The calculation unit determines the first direction by calculating a second ideal position vector (for example, an ideal position vector “v m3* ") of the second marker captured in the image in the image coordinate system, and m3") and calculates the lamination misalignment amount based on the second ideal position vector and the second marker position vector. According to this configuration, the control device can easily calculate the amount and direction of stack misalignment in the image coordinate system.

[0189] A seventh embodiment of the present invention is a stacking misalignment calculation device in the sixth embodiment, wherein the memory unit stores first correction information (e.g., a scale correction matrix) used to correct changes in scale in each of the X-axis and Y-axis directions in the image coordinate system that occur based on the inclination of the imaging direction of the imaging device relative to the first top surface, and includes an image correction unit (e.g., image correction unit 72) that corrects the image based on the first correction information, and the identification unit identifies the first direction based on the first mark captured in the corrected image. According to this configuration, the accuracy with which the control device calculates the amount and direction of lamination misalignment is improved.

[0190] A seventh embodiment of the present invention is a stacking misalignment calculation device in which, in the seventh embodiment, the memory unit stores second correction information used to correct a change in the positional relationship between the first mark and the second mark in the image coordinate system that occurs based on a difference in elevation between the first mark and the second mark, and the calculation unit corrects the position vector of the first mark based on the second correction information. This configuration further improves the accuracy with which the control device calculates the amount and direction of lamination misalignment.

[0191] A ninth embodiment of the present invention is any one of the sixth to eighth embodiments, wherein the calculation unit calculates a second marker deviation vector (for example, a marker deviation vector “u”) indicating the amount and direction of deviation of the second marker from the second ideal position in the image coordinate system based on the second ideal position vector and the second marker position vector, and calculates a specific point of the first marker (for example, a center point “P m1") as the origin, transforms the base of the second marker deviation vector into a local coordinate system having the first direction and a direction perpendicular to the first direction as coordinate axes, and calculates the stacking deviation amount and stacking deviation direction based on the transformed second marker deviation vector. According to this configuration, the control device can calculate not only the amount of lamination misalignment but also the direction of lamination misalignment with high accuracy.

[0192] A tenth embodiment of the present invention is the fifth embodiment, wherein the first upper surface comprises a first region (e.g., first region R11) and a second region (e.g., first region R12) arranged at a position apart from the first region, the second upper surface comprises a third region (e.g., second region R21) and a fourth region (e.g., second region R22) arranged at a position apart from the third region, the first marker and the first through-hole are arranged in each of the first region and the second region, the second marker and the second through-hole are arranged in each of the third region and the fourth region, the first region is arranged above the third region of the corresponding second sheet body, the second region is arranged above the fourth region of the corresponding second sheet body, and the acquisition unit acquires a first image (e.g., first image g1) obtained by capturing the first region and a second image (e.g., second image g2) obtained by capturing the second region. , the identification unit identifies the first direction in the first image based on the first marker captured in the first image, and identifies the first direction in the second image based on the first marker captured in the second image, the calculation unit calculates a first stacking shift amount of the first sheet body relative to the second sheet body based on the identified first direction, the first positional relationship, and the second marker captured in the first image, calculates a second stacking shift amount of the first sheet body relative to the second sheet body based on the identified first direction, the first positional relationship, and the second marker captured in the second image, and calculates a stacking shift amount of the first conductor pattern relative to the second conductor pattern at a specific position (e.g., specific position "Px") of the first conductor pattern based on the first stacking shift amount and the second stacking shift amount. With this configuration, the control device can calculate the amount of lamination misalignment at any position in the first conductor pattern.

[0193] An eleventh embodiment of the present invention is a lamination deviation amount calculation program that causes a computer to function as the lamination deviation amount calculation device according to the fifth embodiment. According to this configuration, the present invention can calculate the amount of stacking misalignment between two layers without being affected by slight changes in the field of view of the imaging device.

[0194] A twelfth embodiment of the present invention is a lamination misalignment calculation method executed by a lamination misalignment calculation device that identifies a lamination misalignment between two layers of the laminate based on an image captured by an imaging device arranged above the laminate, wherein the laminate is the laminate described in the fourth embodiment, and the image captures the first marker, the first through hole, and the second marker located below the first through hole in a state in which the first sheet is stacked on the second sheet, and the lamination misalignment calculation device includes a memory unit that stores the first positional relationship. In addition, the stacking misalignment calculation method includes an acquisition process (e.g., image acquisition process (ST201)) for acquiring the image, a direction identification process (e.g., direction vector calculation process (ST205)) for identifying the first direction based on the first sign captured in the image, and a calculation process (e.g., sign misalignment vector calculation process (ST208)) for calculating the stacking misalignment amount of the first sheet body relative to the second sheet body based on the identified first direction, the first positional relationship, and the second sign captured in the image. According to this configuration, the present invention can calculate the amount of stacking misalignment between two layers without being affected by slight changes in the field of view of the imaging device.

[0195] A thirteenth embodiment of the present invention is a stacking device (e.g., stacking device 5) comprising a mounting table (e.g., mounting table 8) on which the sheet body described in the first embodiment is placed, a stacking table (e.g., stacking table 9) on which multiple sheet bodies are stacked, a conveying device (e.g., conveying device 10) that stacks the sheet bodies placed on the mounting table onto the stacking table, an imaging device (e.g., imaging devices 11a, 11b) that is arranged above the stacking table and images the sheet bodies stacked on the stacking table, and a stacking misalignment calculation device described in the fifth embodiment. According to this configuration, the present invention can calculate the amount of stacking misalignment between two layers without being affected by slight changes in the field of view of the imaging device. [Explanation of symbols]

[0196] 1. Laminate 2 Sheet body 3 First sheet body 30a Top surface (1st top surface) 30c 1st through hole 30d 1st through hole 30e 1st through hole 30f 1st through hole 30g 1st through hole 33 1st sign 33a 1st Main Sign 33b First sub-sign 33c 1st Main Sign 33d 1st Main Sign 33e 1st Main Sign 34 1st sign 34a 1st Main Sign 34b First sub-sign 4 Second sheet body 40a Top surface (3rd top surface) 40c 2nd through hole 40d 2nd through hole 40e Second through hole 40f 2nd through hole 40g 2nd through hole 43 Second sign 43a Second Main Sign 43b Second sub-sign 43c Second Main Sign 43d Second Main Sign 43e Second Main Sign 44 Second sign 44a Second Main Sign 44b Second sub-sign 5. Stacking device 7. Control device (lamination displacement calculation device) 7d storage section 71 Acquisition Department 72 Image correction section 73 Specific part 74 Calculation Unit 11a Imaging device 11b Imaging device D1 1st direction D2 2nd direction g1 1st image g2 2nd image R11 1st area R12 1st area (2nd area) R21 2nd area (3rd area) R22 2nd area (4th area)

Claims

1. A pair of sheets used to form a laminate, a first sheet body arranged in "n" layers (n is a natural number of 2 or more) in the stacking direction of the laminate; A plurality of second sheets arranged in the “n−1” layer in the stacking direction; and The first sheet body is A first top surface; a first conductor pattern printed on the first top surface; a first mark printed on the first upper surface together with the first conductor pattern; a first through hole penetrating the first sheet body in a thickness direction; With The second sheet body is A second upper surface; and a second conductor pattern printed on the second upper surface; a second mark printed on the second upper surface together with the second conductor pattern; a second through hole penetrating the second sheet body in a thickness direction; With the first through-holes are formed so as to be positioned above the second signs of the corresponding second sheets when the first sheets are stacked on the second sheets, the second through-holes are formed so as to be positioned above the first signs of the corresponding first sheet bodies when the second sheet bodies are stacked on the first sheet body, The size of the first mark is smaller than the size of the second through hole, The size of the second mark is smaller than the size of the first through hole, the first mark is formed so as to be able to identify a first direction on the first upper surface, the second mark is formed so as to be able to identify a second direction on the second upper surface, When the first sheet body is accurately stacked on the second sheet body, the first direction is opposite to the second direction, and the second marker is located at a predetermined second ideal position relative to the first marker when viewed from above, When the second sheet body is accurately stacked on the first sheet body, the second direction is opposite to the first direction, and the first marker is located at a predetermined first ideal position relative to the second marker when viewed from above, When viewed in an upward direction, a first positional relationship between a position of the first marker with respect to the first direction and the second ideal position coincides with a second positional relationship between a position of the second marker with respect to the second direction and the first ideal position. Sheet body.

2. The first marker is The first main sign, a first sub-sign arranged at a distance from the first main sign toward the first direction; With The second mark is The second main sign, a second sub-sign arranged at a distance from the second main sign toward the second direction; With the first direction is a direction in which the first sub-sign is located relative to the first main sign, The second direction is a direction in which the second sub-sign is located relative to the second main sign. The sheet member according to claim 1 .

3. The first main sign and the first sub sign are each formed in a circular shape, The second main sign and the second sub sign are each formed in a circular shape, the first direction is a direction in which the center point of the first sub-sign is located relative to the center point of the first main sign, The second direction is a direction in which the center point of the second sub-sign is located relative to the center point of the second main sign. The sheet member according to claim 2 .

4. A laminate formed by stacking a plurality of sheet bodies, The sheet body is the sheet body according to claim 1. Laminate.

5. A stacking misalignment calculation device that calculates a stacking misalignment amount between two layers of a stack based on an image captured by an imaging device disposed above the stack, comprising: The laminate is the laminate according to claim 4, The image captures the first marker, the first through-hole, and the second marker located below the first through-hole in a state in which the first sheet body is stacked on the second sheet body, a storage unit that stores the first positional relationship; an acquisition unit that acquires the image; an identification unit that identifies the first direction based on the first marker captured in the image; a calculation unit that calculates the amount of stacking misalignment of the first sheet body relative to the second sheet body based on the identified first direction, the first positional relationship, and the second mark captured in the image; consisting of Lamination displacement calculation device.

6. the identification unit calculates a first direction vector having a direction component of the first direction in an image coordinate system of the image based on the position vector of the first marker, thereby identifying the first direction; The calculation unit calculating a second ideal position vector of the second ideal position in the image coordinate system based on the first direction vector; calculating a second marker position vector of the second marker captured in the image in the image coordinate system; calculating the amount of stacking misalignment based on the second ideal position vector and the second marker position vector; The lamination deviation calculation device according to claim 5 .

7. The storage unit First correction information used to correct changes in scale in each of the X-axis direction and the Y-axis direction in the image coordinate system that occur based on an inclination of the imaging direction of the imaging device with respect to the first upper surface; Remember, an image correction unit that corrects the image based on the first correction information; and the identification unit identifies the first direction based on the first marker captured in the corrected image. The lamination deviation calculation device according to claim 6 .

8. The storage unit second correction information used to correct a change in the positional relationship between the first mark and the second mark in the image coordinate system that occurs based on a difference in elevation between the first mark and the second mark; Remember, The calculation unit corrects the position vector of the first marker based on the second correction information. The lamination deviation calculation device according to claim 7 .

9. The calculation unit calculating a second marker deviation vector indicating a positional deviation amount and a positional deviation direction of the second marker from the second ideal position in the image coordinate system based on the second ideal position vector and the second marker position vector; Transforming a basis of the second marker deviation vector from the image coordinate system into a local coordinate system having a specific point of the first marker as an origin and having the first direction and a direction orthogonal to the first direction as coordinate axes, Calculating the stacking misalignment amount and stacking misalignment direction based on the converted second marker misalignment vector. The lamination deviation calculation device according to any one of claims 6 to 8.

10. The first upper surface is A first region; a second region disposed at a position separate from the first region; With The second upper surface is A third region; and a fourth region disposed at a position separate from the third region; With the first marker and the first through-hole are arranged in the first region and the second region, respectively; the second marker and the second through-hole are arranged in the third region and the fourth region, respectively; the first region is disposed above the third region of the corresponding second sheet body, The second region is disposed above the fourth region of the corresponding second sheet body, The acquisition unit acquires a first image g1 obtained by capturing an image of the first region and a second image g2 obtained by capturing an image of the second region, The identification unit Identifying the first direction in the first image g1 based on the first sign captured in the first image g1; Identifying the first direction in the second image g2 based on the first sign captured in the second image g2, The calculation unit calculating a first stacking misalignment amount of the first sheet body relative to the second sheet body based on the specified first direction, the first positional relationship, and the second marker captured in the first image g1; calculating a second stacking misalignment amount of the first sheet body relative to the second sheet body based on the specified first direction, the first positional relationship, and the second marker captured in the second image g2; calculating a lamination misalignment amount of the first conductor pattern relative to the second conductor pattern at a specific position based on the first lamination misalignment amount and the second lamination misalignment amount; The lamination deviation calculation device according to claim 5 .

11. A computer is caused to function as the lamination deviation calculation device according to claim 5. Program for calculating stacking misalignment.

12. 1. A lamination misalignment calculation method executed by a lamination misalignment calculation device that identifies a lamination misalignment amount between two layers of a laminate based on an image captured by an imaging device disposed above the laminate, comprising: The laminate is the laminate according to claim 4, The image captures the first marker, the first through-hole, and the second marker located below the first through-hole in a state in which the first sheet body is stacked on the second sheet body, The lamination deviation amount calculation device is a storage unit that stores the first positional relationship; With The lamination misalignment amount calculation method includes: an acquisition process for acquiring the image; a direction identification process for identifying the first direction based on the first sign captured in the image; a calculation process for calculating the amount of stacking misalignment of the first sheet body relative to the second sheet body based on the identified first direction, the first positional relationship, and the second marker captured in the image; Including, Calculation method for stacking displacement.

13. a mounting table on which the sheet body according to claim 1 is placed; a stacking table on which a plurality of the sheet bodies are stacked; a conveying device that stacks the sheet body placed on the placing table on the stacking table; an imaging device disposed above the stacking table to capture an image of the sheet bodies stacked on the stacking table; The lamination deviation calculation device according to claim 5 ; consisting of Stacking device.

Images