Cutting blade and processing method

Abstract

To suppress replacement of a holding table and contamination of a workpiece.SOLUTION: The processing method includes a preparing step 301 of preparing a cutting blade including a ring-shaped cutting edge part containing abrasive grains and a coating layer covering at least an outer periphery in a radial direction of the cutting edge part, a relative position detecting step 302 of detecting a first relative position between the cutting blade and a holding table that holds a workpiece by relatively moving the holding table and the cutting blade close to each other and detecting contact between a tip of the cutting blade and the holding table, and a cutting step 304 of positioning the cutting blade with respect to the workpiece held by the holding table on the basis of the first relative position detected in the relative position detecting step 302 and cutting the workpiece by the cutting blade.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a cutting blade and a processing method. [Background technology]

[0002] In a cutting device, the cutting blade cuts into the workpiece based on the relative position between the cutting blade and a holding table that holds the workpiece, thereby cutting the workpiece.

[0003] For example, a cutting device has been disclosed that is equipped with an origin detection mechanism that determines the relative position of the cutting blade and the holding table by detecting the sound or electrical conduction when the cutting edge of the cutting blade comes into contact with the holding table, and detects the origin position of the cutting blade in the cutting direction relative to the holding table by electrical conduction (see, for example, Patent Document 1).

[0004] When the cutting blade comes into contact with the holding table, the holding table is cut by the cutting blade. A slight depression is formed in the cut area, and depending on the material, a burr may form around the depression. Therefore, even if the cutting blade is brought into contact with an area that has already been cut, the accurate relative position cannot be detected.

[0005] A setup method has been disclosed in which a cutting blade is brought into contact with an area of ​​a holding table where no cutting marks are formed (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2019-018331 [Patent Document 2] Japanese Patent Application Publication No. 2019-129282 Summary of the Invention [Problem to be solved by the invention]

[0007] In the method described in Patent Document 2, when cutting marks are formed on the entire circumference of the holding table, the holding table must be replaced with a new one, and improvement is desired.

[0008] Furthermore, cutting chips are generated when the cutting blade cuts the holding table, which can become a source of contamination for the workpiece, and therefore improvement is highly desired.

[0009] An object of the present invention is to provide a cutting blade and a processing method that can suppress replacement of the holding table and contamination of the workpiece. [Means for solving the problem]

[0010] In order to solve the above-mentioned problems and achieve the object, the cutting blade of the present invention is characterized by having a ring-shaped cutting edge portion containing abrasive grains that cuts the workpiece, and a coating layer that covers at least the radial outer periphery of the cutting edge portion.

[0011] In the cutting blade, the cutting edge portion and the coating layer may be electrically conductive.

[0012] The processing method of the present invention is characterized by comprising a preparation step of preparing a cutting blade having a ring-shaped cutting edge portion containing abrasive grains for cutting a workpiece and a coating layer covering at least the radial outer periphery of the cutting edge portion; a relative position detection step of moving the cutting blade relatively close to a holding table that holds the workpiece and the holding table and detecting contact between the tip of the cutting blade and the holding table to detect the relative position between the cutting blade and the holding table; and a cutting step of positioning the cutting blade with respect to the workpiece held by the holding table based on the relative position detected in the relative position detection step and cutting the workpiece with the cutting blade.

[0013] The processing method may further include a removing step of removing the coating layer from the cutting blade after performing the relative position detecting step and before performing the cutting step. [Effects of the Invention]

[0014] The present invention has the effect of suppressing replacement of the holding table and contamination of the workpiece. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a processing device to which a cutting blade according to the first embodiment is attached. [Figure 2] FIG. 2 is a cross-sectional view schematically showing a holding table and the like of the processing apparatus shown in FIG. [Figure 3] 3 is a front view of the cutting unit and the like of the processing apparatus shown in FIG. [Figure 4] FIG. 4 is a side view of a cutting blade attached to the spindle of the processing device shown in FIG. [Figure 5] FIG. 5 is a cross-sectional view taken along line VV in FIG. [Figure 6] FIG. 6 is an enlarged cross-sectional view schematically showing a portion VI in FIG. [Figure 7] FIG. 7 is a flowchart showing the flow of the processing method according to the first embodiment. [Figure 8] FIG. 8 is a side view, partly in section, schematically showing the removing step of the processing method shown in FIG. [Figure 9] FIG. 9 is a side view, partly in section, schematically showing the cutting step of the processing method shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0016] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0017] [Embodiment 1] A cutting blade according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing an example of the configuration of a processing device to which the cutting blade according to the first embodiment is attached. Fig. 2 is a cross-sectional view schematically showing a holding table and the like of the processing device shown in Fig. 1. Fig. 3 is a front view of a cutting unit and the like of the processing device shown in Fig. 1.

[0018] (Workpiece) A cutting blade 21 according to the first embodiment is attached to a processing apparatus 1 shown in Fig. 1. The processing apparatus 1 shown in Fig. 1 is a cutting apparatus that cuts a workpiece 200 with a cutting blade 21 having a cutting edge portion 211. In the first embodiment, the workpiece 200 to be processed by the processing apparatus 1 shown in Fig. 1 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, whose base material is silicon, gallium arsenide, SiC (silicon carbide), sapphire, or the like. The workpiece 200 has devices 203 formed in areas partitioned in a grid pattern by a plurality of planned division lines 202 formed in a grid pattern on a surface 201.

[0019] Furthermore, the workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer having a thin central portion and a thick peripheral portion, or may be a resin package substrate such as a rectangular QFN (Quad Flat No leaded) package substrate having a plurality of devices sealed with resin, a ceramic substrate, a ferrite substrate, a substrate containing at least one of nickel and iron, or a glass substrate, etc. In the first embodiment, the back surface 204 of the workpiece 200 is attached to an adhesive tape 206 having an annular frame 205 attached to its outer periphery, and the workpiece 200 is supported by the annular frame 205.

[0020] (Processing equipment) 1 is a cutting device that holds a workpiece 200 on a holding table 10 and cuts it with a cutting blade 21 along a planned division line 202. As shown in FIG. 1, the processing device 1 includes the holding table 10 that holds the workpiece 200 by suction on a holding surface 11, a cutting unit 20 that cuts the workpiece 200 held on the holding table 10 with the cutting blade 21, an imaging unit 30 that takes an image of the workpiece 200 held on the holding table 10, and a control unit 100.

[0021] 1, the processing apparatus 1 also includes a moving unit 50 that moves the holding table 10 and the cutting unit 20 relative to one another. The moving unit 50 includes at least an X-axis moving unit 51, which is a processing feed unit that processes and feeds the holding table 10 in the X-axis direction parallel to the horizontal direction, a Y-axis moving unit 52, which is an indexing feed unit that indexes and feeds the cutting unit 20 in the Y-axis direction that is parallel to the horizontal direction and perpendicular to the X-axis direction, a Z-axis moving unit 53, which is a cutting feed unit that cuts and feeds the cutting unit 20 in the Z-axis direction that is parallel to the vertical direction and perpendicular to both the X-axis and Y-axis directions, and a rotational moving unit 54 that rotates the holding table 10 around an axis parallel to the Z-axis direction.

[0022] The X-axis moving unit 51 is installed in the device main body 2. The X-axis moving unit 51 moves the moving plate 12 that supports the holding table 10 and the rotational moving unit 54 in the X-axis direction, which is the processing feed direction, thereby processing-feeding the holding table 10 and the cutting unit 20 relatively along the X-axis direction.

[0023] The Y-axis moving unit 52 is installed on a gate-shaped support frame 3 that stands upright from the device main body 2. The Y-axis moving unit 52 moves the moving frame 4 in the Y-axis direction, which is the indexing feed direction, thereby moving the cutting unit 20 along the Y-axis direction and indexing and feeding the holding table 10 and the cutting unit 20 relatively along the Y-axis direction.

[0024] The Z-axis moving unit 53 is installed on the moving frame 4. The Z-axis moving unit 53 moves the second moving frame 5 in the Z-axis direction, which is the cutting feed direction, to move the cutting unit 20 along the Z-axis direction, and perform cutting feed between the holding table 10 and the cutting unit 20 relatively along the Z-axis direction. The rotational moving unit 54 is disposed on the moving plate 12.

[0025] The X-axis moving unit 51, the Y-axis moving unit 52, and the Z-axis moving unit 53 each include a well-known ball screw rotatably mounted about its axis, a well-known motor for rotating the ball screw about its axis, and a well-known guide rail for supporting the holding table 10 or the cutting unit 20 movably in the X-axis, Y-axis, or Z-axis direction. The rotational moving unit 54 also includes a well-known motor for rotating the holding table 10 about the Z-axis.

[0026] The holding table 10 is disk-shaped, and a holding surface 11 for holding the workpiece 200 is formed from porous ceramic or the like. The holding table 10 is provided so as to be movable in the X-axis direction by an X-axis moving unit 51 between a processing area below the cutting unit 20 and a carry-in / out area spaced from below the cutting unit 20 where the workpiece 200 is carried in and out.

[0027] The holding table 10 is supported by a rotary movement unit 54 and is provided so as to be rotatable about an axis parallel to the Z-axis direction by the rotary movement unit 54. As shown in FIG. 2 , the holding surface 11 of the holding table 10 is connected to a suction source 15 via an on-off valve 14. When the on-off valve 14 is opened, the holding table 10 is sucked by the suction source 15, thereby sucking and holding the workpiece 200 placed on the holding surface 11. In the first embodiment, the holding table 10 sucks and holds the back surface 204 of the workpiece 200 via an adhesive tape 206.

[0028] The holding table 10 has a frame 16 that surrounds the outer periphery of the holding surface 11 and is made of a conductive metal (for example, stainless steel). The upper surface of the frame 16 is located on the same plane as the holding surface 11. As shown in FIGS. 1 and 2, a plurality of clamps 13 that clamp annular frames 205 are provided around the periphery of the holding table 10.

[0029] The cutting unit 20 is a processing unit that has a spindle 23 to which a cutting blade 21 is attached, and cuts a workpiece 200 held on the holding table 10 with the cutting blade 21 rotated by the spindle 23. As shown in FIG. 1, the processing device 1 is equipped with two cutting units 20, i.e., a two-spindle dicer, a so-called facing dual type cutting device.

[0030] Each cutting unit 20 is provided so as to be movable in the Y-axis direction by a Y-axis movement unit 52 relative to the workpiece 200 held on the holding table 10, and so as to be movable in the Z-axis direction by a Z-axis movement unit 53. As shown in FIG. 1 , each cutting unit 20 is provided on a support frame 3 erected from the apparatus main body 2 via the Y-axis movement unit 52 and the Z-axis movement unit 53. The cutting unit 20 is capable of positioning the cutting blade 21 at any position on the holding surface 11 of the holding table 10 by the Y-axis movement unit 52 and the Z-axis movement unit 53.

[0031] As shown in Figure 3, the cutting unit 20 comprises a cutting blade 21, a spindle housing 22 that is movable in the Y-axis and Z-axis directions by a Y-axis moving unit 52 and a Z-axis moving unit 53, a spindle 23 that is rotatable about its axis on the spindle housing 22 and is rotated by a motor (not shown), and has the cutting blade 21 attached to its tip, and a blade cover 24 (shown in Figure 1) that is fixed to the tip surface of the spindle housing 22.

[0032] (Cutting blade) Next, the cutting blade 21 will be described. Fig. 4 is a side view of the cutting blade attached to the spindle of the processing device shown in Fig. 1. Fig. 5 is a cross-sectional view taken along line VV in Fig. 4. Fig. 6 is a cross-sectional view schematically showing an enlarged view of part VI in Fig. 5.

[0033] The cutting blade 21 is an extremely thin cutting stone having a substantially ring shape. In the first embodiment, the cutting blade 21 is a so-called hubless blade having a ring-shaped cutting edge portion 211 and a coating layer 212, as shown in Figures 4, 5, and 6. As shown in Figure 6, the cutting edge portion 211 includes abrasive grains 213 such as diamond or CBN (Cubic Boron Nitride), and a bonding material 214 such as metal or resin, and is formed to a predetermined thickness.

[0034] 6, some abrasive grains 213 protrude from the outer periphery 215 (also referred to as the outer edge) of the cutting blade portion 211. The maximum particle size of the abrasive grains 213 is about 200 μm. The abrasive grains 213 protruding from the outer periphery 215 of the cutting blade portion 211 cut the workpiece 200.

[0035] The coating layer 212 covers at least the outer periphery 215 in the radial direction of the cutting edge portion 211. In the first embodiment, the coating layer 212 covers the outer periphery 215 in the radial direction of the cutting edge portion 211, and also covers the abrasive grains 213 protruding from the outer periphery 215. In the first embodiment, both the cutting edge portion 211 and the coating layer 212 are electrically conductive.

[0036] In the first embodiment, the coating layer 212 does not contain abrasive grains 213, but contains at least a conductive powder such as carbon. The coating layer 212 is formed by applying a liquid made of a conductive powder such as carbon and an organic solvent in which the powder is dispersed to the outer periphery 215, and then evaporating the organic solvent, so that the powder covers the outer periphery 215. In the present invention, the coating layer 212 may also be formed by applying a liquid made of the powder and a liquid resin (e.g., a thermosetting resin) in which the powder is dispersed to the outer periphery 215, and then heating the liquid resin to harden the liquid resin, so that the coating layer 212 covers the outer periphery 215.

[0037] In the first embodiment, thickness 216 (shown in FIG. 6) of coating layer 212 is 100 μm, but may be less than 100 μm as long as it covers abrasive grains 213 protruding from outer periphery 215. In the present invention, thickness 216 of coating layer 212 can cover abrasive grains 213 protruding from outer periphery 215 if it is about half the average grain size of abrasive grains 213.

[0038] The spindle housing 22 is fixed to the lower end of the second moving frame 5. The spindle 23 is rotated around its axis by a motor, thereby rotating the cutting blade 21. The blade cover 24 covers at least the upper part of the cutting blade 21.

[0039] The blade cover 24 is fixed to the tip surface of the spindle housing 22. The blade cover 24 also includes a cutting water supply nozzle 25 that supplies cutting water to the cutting edge portion 211 of the cutting blade 21.

[0040] The axes of the cutting blade 21 and spindle 23 of the cutting unit 20 are set parallel to the Y-axis direction.

[0041] The imaging unit 30 is fixed to one of the cutting units 20 so as to move integrally with the other cutting unit 20. The imaging unit 30 is equipped with an imaging element that captures an image of an area to be divided of the workpiece 200 held on the holding table 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 30 captures an image of the workpiece 200 held on the holding table 10 to obtain an image for performing alignment between the workpiece 200 and the cutting blade 21, and outputs the obtained image to the control unit 100.

[0042] The processing device 1 also includes an X-axis position detection unit (not shown) for detecting the position of the holding table 10 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction, and a Z-axis position detection unit 55 (shown in FIGS. 2 and 3) for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis position detection unit and the Y-axis position detection unit can be configured with a linear scale parallel to the X-axis direction or the Y-axis direction, and a read head.

[0043] The Z-axis position detection unit 55 detects the position of the cutting unit 20 in the Z-axis direction using pulses from the motor of the Z-axis movement unit 53. The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit 55 output the position of the holding table 10 in the X-axis direction and the position of the cutting unit 20 in the Y-axis direction or the Z-axis direction to the control unit 100.

[0044] In the first embodiment, the positions of the holding table 10 and the cutting unit 20 of the processing device 1 in the X-axis direction, Y-axis direction, and Z-axis direction are determined based on a predetermined reference position (not shown). In the first embodiment, the reference position of the cutting unit 20 in the Z-axis direction is a position where the holding surface 11 of the holding table 10 and the lower end (corresponding to the tip) of the cutting blade 21 are located on the same plane.

[0045] (Relative position detection unit) In the first embodiment, the processing device 1 includes a contact-type relative position detection unit 60 shown in Fig. 2 and a non-contact-type relative position detection unit 40 shown in Fig. 3. The contact-type relative position detection unit 60 and the non-contact-type relative position detection unit 40 detect the relative position between the cutting blade 21 and the holding table 10.

[0046] As shown in Figure 2, the contact-type relative position detection unit 60 includes a DC power supply 61 that supplies power to both the cutting blade 21 of the cutting unit 20 and the frame body 16 of the holding table 10, a power supply path 62, and a detection unit 63 that detects whether or not current flows through the power supply path 62.

[0047] The power supply path 62 is electrically connected to both the cutting blade 21 and the frame 16 of the holding table 10. A DC power supply 61 is provided in the power supply path 62. When the frame 16 of the holding table 10 and the cutting blade 21 of the cutting unit 20 are separated from each other, no current flows through the power supply path 62 even if power is supplied from the DC power supply 61. When the frame 16 of the holding table 10, which has been moved closer by the moving unit 50, comes into contact with the cutting edge portion 211 of the cutting blade 21, a current flows through the power supply path 62 due to the power supplied from the DC power supply 61.

[0048] The detection unit 63 detects the current flowing through the power supply path 62 and outputs a detection result indicating that a current has flowed through the power supply path 62 to the control unit 100. The function of the detection unit 63 may be realized by the arithmetic processing unit of the control unit 100 performing arithmetic processing in accordance with a computer program stored in a storage device, or may be realized by a dedicated processing circuit (hardware) such as a single circuit, a composite circuit, a programmed processor, or a parallel programmed processor.

[0049] The contact-type relative position detection unit 60 outputs a detection result indicating that current has flowed through the power supply path 62 to the control unit 100, and thereby outputs information indicating the relative position between the cutting blade 21 and the holding table 10 in the Z-axis direction to the control unit 100.

[0050] In embodiment 1, the non-contact relative position detection unit 40 is provided around the holding table 10 and attached to the inner surface of a water case 70 having a drain outlet (not shown) that receives and discharges cutting water containing cutting chips generated when the cutting unit 20 cuts the workpiece 200.

[0051] As shown in Fig. 3, the non-contact relative position detection unit 40 includes a pair of legs 42 erected in the Z-axis direction and a connecting portion 43. The pair of legs 42 are spaced apart from each other in the Y-axis direction. The distance between the pair of legs 42 is wider than the thickness of the cutting edge portion 211 of the cutting blade 21. For this reason, the pair of legs 42 are provided with an entry portion 44 between them, into which the cutting edge portion 211 of the cutting blade 21 enters.

[0052] The pair of legs 42 are arranged so that when the cutting edge portion 211 of the cutting blade 21 is inserted between them, the cutting edge portion 211 of the cutting blade 21 is sandwiched between them. The connecting portion 43 connects the lower ends of the pair of legs 42 together, and extends horizontally parallel to the Y-axis direction.

[0053] The non-contact relative position detection unit 40 also includes a light emitter 45 and a light receiver 46, which sandwich the entrance portion 44 in the Y-axis direction, a light source 41, and a photoelectric converter 47.

[0054] The light emitting unit 45 is provided on one of the pair of legs 42. The light emitting unit 45 includes an optical fiber 48 that is connected to the light source 41, propagates pulsed light (hereinafter referred to as pulsed light) from the light source 41, and emits the light toward the other leg 42, i.e., the light receiving unit 46. In the first embodiment, the outer diameter of the optical fiber 48 of the light emitting unit 45 is, for example, 0.3 mm or more and 5 mm or less, and the spot diameter of the pulsed light is, for example, 0.3 mm or more and 5 mm or less. The light emitting unit 45 also emits pulsed light at a predetermined frequency.

[0055] The light receiving section 46 is provided on the other leg section 42 and includes an optical fiber 49 that receives the pulsed light emitted from the light emitting section 45 and outputs the received pulsed light to the photoelectric conversion section 47 .

[0056] The photoelectric conversion unit 47 converts the amount of pulsed light received by the light receiving unit 46 into a voltage. The photoelectric conversion unit 47 converts the amount of pulsed light input from the light receiving unit 46 into a signal with a voltage value corresponding to the amount of pulsed light. In the first embodiment, the amount of pulsed light received by the light receiving unit 46 is proportional to the voltage value of the signal converted by the photoelectric conversion unit 47. The photoelectric conversion unit 47 outputs the signal converted from the pulsed light to the control unit 100.

[0057] As the amount of light of the pulsed light blocked by the cutting blade portion 211 of the cutting blade 21 increases, the voltage value of the signal converted by the photoelectric conversion unit 47 decreases. Also, as the amount of light of the pulsed light blocked by the cutting blade portion 211 of the cutting blade 21 decreases, the voltage value of the signal converted by the photoelectric conversion unit 47 increases.

[0058] The function of the photoelectric conversion unit 47 may be realized by the arithmetic processing device of the control unit 100 performing arithmetic processing in accordance with a computer program stored in a memory device, or may be realized by a dedicated processing circuit (hardware) such as a single circuit, a composite circuit, a programmed processor, or a parallel programmed processor.

[0059] The non-contact relative position detection unit 40 outputs a signal converted from pulsed light to the control unit 100, thereby outputting information indicating the relative position in the Z-axis direction between the cutting blade 21 and the holding table 10 to the control unit 100.

[0060] The control unit 100 controls each component of the processing device 1 to cause the processing device 1 to perform processing operations on the workpiece 200. That is, in the first embodiment, the control unit 100 controls at least the cutting unit 20, the non-contact relative position detection unit 40, the contact relative position detection unit 60, and the moving unit 50.

[0061] The control unit 100 is a computer having an arithmetic processing device with a microprocessor such as a CPU (central processing unit), a storage device with memory such as a ROM (read only memory) or RAM (random access memory), and an input / output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the processing device 1 and the non-contact relative position detection unit 40 to each component of the processing device 1 and the non-contact relative position detection unit 40 via the input / output interface device.

[0062] The control unit 100 is connected to a display unit 110 configured with a liquid crystal display device or the like that displays the status and images of the machining operation, an input unit (not shown) that the operator uses to register machining content information, and a notification unit 120 that notifies the operator. The input unit is configured with at least one of a touch panel provided on the display unit 110 and an external input device such as a keyboard. The notification unit 120 notifies the operator by emitting at least one of sound and light.

[0063] Furthermore, when the control unit 100 receives a detection result indicating that a current has flowed from the contact-type relative position detection unit 60 to the power supply path 62, it refers to the detection result of the Z-axis direction position detection unit 55. The control unit 100 detects, as the first relative position, the position of the cutting unit 20 in the Z-axis direction detected by the Z-axis direction position detection unit 55 at the time when the detection result indicating that a current has flowed from the contact-type relative position detection unit 60 to the power supply path 62 is received.

[0064] When the voltage value of the signal input from non-contact relative position detection unit 40 reaches a predetermined reference voltage, control unit 100 refers to the detection result of Z-axis direction position detection unit 55. Control unit 100 detects, as a second relative position, the position of cutting unit 20 in the Z-axis direction detected by Z-axis direction position detection unit 55 when the voltage value of the signal input from non-contact relative position detection unit 40 reaches the reference voltage.

[0065] The first relative position and the second relative position correspond to the relative positions of the cutting blade 21 and the holding table 10 in the Z-axis direction.

[0066] (Processing method) Next, a processing method according to embodiment 1 will be described. Fig. 7 is a flowchart showing the flow of the processing method according to embodiment 1. The processing method according to embodiment 1 is a method of cutting a workpiece 200 along planned division lines 202 and dividing the workpiece 200 into individual devices 203. In other words, the processing method according to embodiment 1 is also a processing operation of the processing apparatus 1.

[0067] The processing method according to the first embodiment is, for example, a processing operation of the processing device 1 performed when the cutting blade 21 on which the coating layer 212 is formed is attached to the cutting unit 20 and the workpiece 200 is cut after the holding table 10 is replaced. However, the processing method according to the first embodiment is not limited to the processing operation of the processing device 1 performed as described above. As shown in Fig. 7, the processing method according to the first embodiment includes a preparation step 301, a relative position detection step 302, a removal step 303, and a cutting step 304.

[0068] (Preparation step) The preparation step 301 is a step of preparing a cutting blade 21 that includes a ring-shaped cutting edge portion 211 containing abrasive grains 213 and that cuts the workpiece 200, and a coating layer 212 that covers at least the outer periphery of the cutting edge portion 211 in the radial direction. In the first embodiment, in the preparation step 301, the cutting blade 21 that includes the cutting edge portion 211 and the coating layer 212 is prepared, and the prepared cutting blade 21 is attached to the spindle 23 of the cutting unit 20.

[0069] (Relative position detection step) The relative position detection step 302 is a step in which the holding table 10 that holds the workpiece 200 and the cutting blade 21 are moved closer to each other and contact between the tip of the cutting blade 21 and the holding table 10 is detected to detect a first relative position between the cutting blade 21 and the holding table 10. In the first embodiment, in the relative position detection step 302, an operator or the like inputs detection conditions into the control unit 100, and the processing device 1 registers the input detection conditions in the control unit 100. The detection conditions include the rotation speed of the spindle 23.

[0070] In the first embodiment, in the relative position detection step 302, when the control unit 100 receives an instruction to start the detection operation from an operator or the like, the detection operation is started by, for example, rotating the spindle 23 at the number of rotations determined by the detection conditions. In the first embodiment, in the relative position detection step 302, the control unit 100 of the processing apparatus 1 controls the moving unit 50 to position the cutting edge portion 211 of the cutting blade 21 rotated by the spindle 23 above the frame 16 of the holding table 10, and then lowers the cutting unit 20 to move the holding table 10 and the cutting blade 21 close to each other.

[0071] In the first embodiment, in the relative position detection step 302, when the control unit 100 of the processing device 1 detects contact between the lower end, which is the tip of the cutting edge portion 211 of the cutting blade 21, and the frame body 16 of the holding table 10 from the detection result from the contact-type relative position detection unit 60, the control unit 100 controls the moving unit 50 to raise the cutting unit 20 and relatively separate the holding table 10 and the cutting blade 21. In the first embodiment, in the relative position detection step 302 of the processing device 1, the control unit 100 detects the first relative position.

[0072] In the first embodiment, in the relative position detecting step 302, the control unit 100 of the processing apparatus 1 controls the moving unit 50 to position the cutting edge portion 211 of the cutting blade 21 rotated by the spindle 23 above the entrance portion 44 of the non-contact relative position detecting unit 40, and then lowers the cutting unit 20 to cause the cutting blade 21 to enter the entrance portion 44. In the first embodiment, in the relative position detecting step 302, when the voltage value of the signal input from the non-contact relative position detecting unit 40 by the control unit 100 reaches the reference voltage, the processing apparatus 1 controls the moving unit 50 to lift the cutting unit 20 and relatively separate the cutting blade 21 from the entrance portion 44. In the first embodiment, in the relative position detecting step 302, the control unit 100 of the processing apparatus 1 detects the second relative position.

[0073] In the first embodiment, in the relative position detection step 302, when the control unit 100 detects the first relative position and the second relative position, the rotation of the spindle 23 is stopped.

[0074] (Removal step) 7. The removing step 303 is a step of removing the coating layer 212 from the cutting edge portion 211 of the cutting blade 21 after the relative position detecting step 302 and before the cutting step 304. In the first embodiment, in the removing step 303, an operator or the like inputs the removal conditions into the control unit 100, and the processing device 1 registers the input removal conditions in the control unit 100. The removal conditions include the rotation speed of the spindle 23 and the relative movement path of the cutting blade 21 with respect to the holding table 10.

[0075] Also, in the first embodiment, in the removing step 303, an adhesive tape 251 with a dressing material 250 attached to the center thereof is placed on the holding surface 11 of the holding table 10 in the carry-in / out area by an operator or the like in the processing apparatus 1. The dressing material 250 is cut by the cutting edge portion 211 of the cutting blade 21 to remove the coating layer 212. The dressing material 250 is also used for sharpening the cutting edge portion 211 of the cutting blade 21, and is a plate in which the abrasive grains described above are bonded with a binder. An annular frame 252 is attached to the outer edge of the adhesive tape 251.

[0076] In the first embodiment, in the removal step 303, when the control unit 100 receives an instruction to start the removal operation from an operator or the like, the control unit 100 rotates the spindle 23 at a rotation speed determined by the removal conditions, and supplies cutting water from the cutting water supply nozzle 25 to the cutting edge portion 211 of the cutting blade 21. Also in the first embodiment, in the removal step 303, when the control unit 100 receives an instruction to start the removal operation from an operator or the like, the control unit 100 opens the on-off valve 14 to suction-hold the workpiece 200 to the holding surface 11 via the adhesive tape 251, and clamps the annular frame 252 with the clamp portion 13.

[0077] In the first embodiment, in the removal step 303, the control unit 100 controls the moving unit 50 in the processing apparatus 1 to move the holding table 10 from the loading / unloading area toward the processing area to below the imaging unit 30. In the first embodiment, in the removal step 303, the control unit 100 controls the imaging unit 30 in the processing apparatus 1 to capture an image of the dressing material 250 suction-held on the holding table 10, thereby performing alignment.

[0078] In the first embodiment, in the removing step 303, the control unit 100 of the processing apparatus 1 controls the moving unit 50 based on the relative position detected in the relative position detecting step 302 and the removing conditions, and causes the cutting blade 21 to cut into the dressing material 250 while moving the cutting blade 21 and the dressing material 250 relatively, as shown in Fig. 8, to remove the coating layer 212 from the cutting edge portion 211 of the cutting blade 21. In the first embodiment, in the removing step 303, when the control unit 100 of the processing apparatus 1 completes cutting of the dressing material 250 by the cutting blade 21 based on the removing conditions, the control unit 100 controls the moving unit 50 to move the holding table 10 from the processing area toward the carry-in / out area.

[0079] In the first embodiment, in the removal step 303, the control unit 100 of the processing apparatus 1 controls the moving unit 50 to stop the holding table 10 in the carry-in / out area. In the first embodiment, in the removal step 303, the control unit 100 of the processing apparatus 1 closes the on-off valve 14 to stop suction holding of the dressing material 250 on the holding table 10, releases the clamp of the clamp unit 13, and stops rotation of the spindle 23 and supply of cutting water. In the first embodiment, in the removal step 303, the processing apparatus 1 has an operator or the like remove the dressing material 250 from the holding surface 11 of the holding table 10.

[0080] (Cutting step) Fig. 9 is a side view, partially in cross section, schematically showing the cutting step of the processing method shown in Fig. 7. In the cutting step 304, the cutting blade 21 is positioned with respect to the workpiece 200 held by the holding table 10 based on the first relative position and the second relative position detected in the relative position detection step 302, and the workpiece 200 is cut by the cutting blade 21.

[0081] In the first embodiment, in the cutting step 304, an operator or the like inputs cutting conditions into the control unit 100, and the processing device 1 registers the input cutting conditions in the control unit 100. The cutting conditions include the rotation speed of the spindle 23 and the relative movement path of the cutting blade 21 with respect to the holding table 10. Also, in the first embodiment, in the cutting step 304, the processing device 1 places the workpiece 200 on the holding surface 11 of the holding table 10 in the carry-in / out area via adhesive tape 206 by an operator or the like.

[0082] In the cutting step 304 of the first embodiment, when the control unit 100 receives a command to start the cutting operation from an operator or the like, the control unit 100 rotates the spindle 23 at a rotation speed determined by the cutting conditions, and supplies cutting water from the cutting water supply nozzle 25 to the cutting edge portion 211 of the cutting blade 21. Also in the first embodiment, when the control unit 100 receives a command to start the cutting operation from an operator or the like, the control unit 100 opens the on-off valve 14 to suction-hold the workpiece 200 to the holding surface 11 via the adhesive tape 206, and clamps the annular frame 205 with the clamp portion 13.

[0083] In the cutting step 304 in the embodiment 1, the control unit 100 of the processing apparatus 1 controls the moving unit 50 to move the holding table 10 from the carry-in / out area toward the processing area to below the imaging unit 30. In the embodiment 1, in the cutting step 304, the control unit 100 of the processing apparatus 1 controls the imaging unit 30 to capture an image of the workpiece 200 held by suction on the holding table 10, and performs alignment.

[0084] In the first embodiment, in the cutting step 304, the control unit 100 controls the moving unit 50 based on the relative position detected in the relative position detecting step 302 and the cutting conditions to relatively move the cutting blade 21 and the workpiece 200 along the planned dividing lines 202, and cut the workpiece 200 by causing the cutting blade 21 to cut into the planned dividing lines 202 until it reaches the adhesive tape 206, as shown in Fig. 9. In the first embodiment, in the cutting step 304, when the processing apparatus 1 has cut all of the planned dividing lines 202 of the workpiece 200, the control unit 100 controls the moving unit 50 to move the holding table 10 from the processing area toward the carry-in / out area.

[0085] In the first embodiment, in the cutting step 304, the control unit 100 of the processing apparatus 1 controls the moving unit 50 to stop the holding table 10 in the carry-in / out area. In the first embodiment, in the cutting step 304, the control unit 100 of the processing apparatus 1 closes the on-off valve 14 to stop the suction holding of the workpiece 200 on the holding table 10, releases the clamping of the clamping unit 13, and stops the rotation of the spindle 23 and the supply of cutting water.

[0086] As described above, the cutting blade 21 according to the first embodiment includes the ring-shaped cutting edge portion 211 containing abrasive grains 213 that cut the workpiece 200, and the coating layer 212 that does not contain abrasive grains 213 and covers at least the radial outer periphery of the cutting edge portion 211. Therefore, when the cutting blade 21 according to the first embodiment is brought into contact with the frame 16 of the holding table 10 to detect the first relative position or the like, the coating layer 212 comes into contact with the frame 16 of the holding table 10, thereby suppressing cutting marks from being formed on the frame 16 and suppressing the generation of chips.

[0087] As a result, the cutting blade 21 according to the first embodiment has the effect of suppressing replacement of the holding table 10 and contamination of the workpiece 200.

[0088] Furthermore, the processing method according to embodiment 1 detects the first relative position using the cutting blade 21 having the cutting edge portion 211 and the coating layer 212 described above, and therefore, when detecting the first relative position, it is possible to suppress cutting marks formed on the frame body 16.

[0089] As a result, the processing method according to the first embodiment has the effect of suppressing the need to replace the holding table 10 and the contamination of the workpiece 200.

[0090] The present invention is not limited to the above-described embodiment. In other words, various modifications can be made without departing from the gist of the present invention. For example, the contact-type relative position detection unit 60 may be a well-known AE (Acoustic Emission) sensor that detects sound generated when the holding table 10 and the cutting blade 21 come into contact with each other. In this case, the coating layer 212 may not be electrically conductive.

[0091] In the present invention, in the relative position detecting step 302, the coating layer 212 of the cutting blade 21 may be brought into contact with the frame 16 of the holding table 10, and the coating layer 212 may be removed from the outer periphery 215 of the cutting edge portion 211. That is, in the present invention, the relative position detecting step 302 may also serve as the removing step 303. [Explanation of symbols]

[0092] 10 Holding table 200 Workpiece 211 Cutting edge 212 Coating layer 213 Abrasive grain 215 perimeter 301 Preparation Steps 302 Relative position detection step 303 Removal Step 304 Cutting Step

Claims

1. a ring-shaped cutting blade portion containing abrasive grains that cuts the workpiece; a coating layer covering at least the outer periphery of the cutting edge portion in the radial direction.

2. The cutting blade according to claim 1 , wherein the cutting edge portion and the coating layer are electrically conductive.

3. a preparation step of preparing a cutting blade including a ring-shaped cutting edge portion containing abrasive grains for cutting a workpiece, and a coating layer covering at least the outer periphery of the cutting edge portion in the radial direction; a relative position detection step of moving a holding table that holds a workpiece and the cutting blade relatively close to each other and detecting contact between the tip of the cutting blade and the holding table to detect the relative position between the cutting blade and the holding table; a cutting step of positioning the cutting blade with respect to the workpiece held by the holding table based on the relative position detected in the relative position detection step, and cutting the workpiece with the cutting blade.

4. The processing method according to claim 3 , further comprising a removing step of removing the coating layer from the cutting blade after performing the relative position detecting step and before performing the cutting step.

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