Electronic device

Abstract

To provide an electronic apparatus which contributes to cooling of a heating element such as a CPU and an IC.SOLUTION: An electronic apparatus includes a heating element and a radiator for radiating heat generated by the heating element, wherein the radiator defines a hollow structure having an upper opening and has an air hole for taking air into a hollow part.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electronic device, and more particularly to an electronic device having a heat generating element and a cooling structure for the heat generating element. [Background technology]

[0002] The CPUs and ICs installed in electronic devices generate heat when they are driven, and this heat causes performance degradation. For this reason, cooling structures for heat-generating elements such as CPUs and ICs have been developed (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2013-545265 Summary of the Invention [Problem to be solved by the invention]

[0004] The following analysis has been made from the perspective of the present invention, and the disclosures of the above-mentioned prior art documents are incorporated herein by reference.

[0005] In Patent Document 1, a cooling structure that does not require a cooling fan is realized by utilizing the chimney effect. However, further improvements in the cooling structure are desired.

[0006] Therefore, an object of the present invention is to provide a technique that contributes to cooling of heat-generating bodies such as CPUs and ICs. [Means for solving the problem]

[0007] According to a first aspect of the present invention, The device has a heat generating element and a heat dissipating element that dissipates heat generated by the heat generating element, The heat sink defines a hollow structure having an upper opening and has an air hole for taking air into the hollow portion. An electronic device is provided. [Effects of the Invention]

[0008] According to each aspect of the present invention, an electronic device that contributes to cooling of heat generating elements such as a CPU or an IC is provided. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 illustrates an example of an electronic device. [Figure 2] FIG. 1 illustrates an example of an electronic device. [Figure 3] FIG. 10 is a diagram illustrating an example of air flow in an electronic device. [Figure 4] FIG. 1 illustrates an example of an electronic device. DETAILED DESCRIPTION OF THE INVENTION

[0010] Preferred embodiments of the present invention will be described in detail with reference to the drawings. Note that the reference numerals in the drawings are used for convenience to indicate the respective elements as an example to facilitate understanding, and are not intended to limit the present invention to the illustrated embodiments.

[0011] [Embodiment 1] As shown in FIG. 1, the electronic device 100 includes a heat generating element 10, such as a CPU (Central Processing Unit) or an IC (Integrated Circuit), arranged on a circuit board 40, and a heat sink 20 that dissipates heat generated by the heat generating element 10. The heat sink 20 defines a hollow structure with an upper opening 24 and has air holes 21 that draw air into the hollow portion. More specifically, the heat sink 20 is configured as a heat sink having an outer cylinder 22 and internal fins 23. The upper opening 24 is connected to a heat dissipation hole 110 provided in the housing of the electronic device 100. As shown in FIG. 2, the electronic device 100 has the heat dissipation hole 110 on its top surface and ventilation holes 120 on its side surfaces.

[0012] In this electronic device 100, heat generated by the heat-generating element 10 is absorbed by the heat sink 20 and dissipated through the internal fins 23. The heat dissipated from the internal fins 23 heats the air in the hollow portion of the heat sink 20. The heated air is discharged through the upper opening 24 of the heat sink 20 and the heat dissipation holes 110 of the electronic device 100. At this time, air is taken into the hollow portion through the air holes 21 of the heat sink 20 due to the chimney effect. That is, in the heat sink 20, as shown in FIG. 3, air is taken in through the air holes 21, heated in the gaps between the internal fins 23, and then discharged from the upper opening 24, creating an air circulation. In FIG. 3, arrows indicate the air flow, and diagonal lines indicate the cross-section of the heat sink 20.

[0013] Here, the air heated by the heat generated by the heat-generating element 10 is discharged to the outside of the electronic device 100, so heat does not build up inside the electronic device 100. Therefore, the electronic device 100 not only cools the heat-generating element 10, but also reduces the impact on components other than the heat-generating element 10, and does not require a mechanism (such as an air fan) to expel heat that builds up inside the electronic device 100. In addition, since the air around the internal fins 23 is circulated, the efficiency of heat dissipation from the internal fins 23 to the surrounding air is also improved. As a result, the cooling efficiency of the heat-generating element 10 is also improved.

[0014] It is also possible to prevent the heat generated by the heat generating element 10 from leaking into the inside of the electronic device 100 through the outer tube 22. For example, the outer tube 22 of the heat dissipating element 20 may be made of a heat insulating material. Alternatively, the outer tube 22 may be made of the same material (aluminum, etc.) as the internal fins 23, and the outer tube 22 of the heat dissipating element 20 may be covered with a heat insulating material. As shown in FIG. 4, the heat dissipation holes 110 of the electronic device 100 may have a tapered configuration that narrows from the inside of the housing to the outside.

[0015] As described above, electronic device 100 can efficiently dissipate heat generated by heat generating element 10 to the outside of the housing of electronic device 100, so heat does not build up inside electronic device 100, improving the cooling efficiency of heat generating element 10. Furthermore, because heat does not build up inside electronic device 100, the impact of heat generated by heat generating element 10 on other components is reduced.

[0016] [Transformation] As described above, the heat sink 20 can be configured as a heat sink. Therefore, general existing heat sink technologies can be adopted for the electronic device 100. For example, the heat generating element 10 and the heat sink 20 can be bonded together with an adhesive having high thermal conductivity. The shape of the heat sink 20 can also be changed to match the shape of the heat generating element 10. For example, the heat sink 20 can have a bottom so as to increase the contact area with the heat generating element 10. Furthermore, various shapes, such as a panel shape or a rod shape, can be adopted for the internal fins 23. In other words, the heat sink 20 can be of any shape as long as it has an outer cylinder 22 and generates a chimney effect in the hollow portion. In addition, various existing technologies can be applied to the housing of the heat generating element 10 and the electronic device 100.

[0017] 1, the heat sink 20 is configured to take in air inside the housing of the electronic device 100. However, it may also be configured to directly take in air outside the housing of the electronic device 100. For example, a pipe may be provided that connects the air hole 21 of the heat sink 20 to the outside of the housing.

[0018] Some or all of the above embodiments can be described as, but are not limited to, the following supplementary notes.

[0019] (Appendix 1) The device has a heat generating element and a heat dissipating element that dissipates heat generated by the heat generating element, The heat sink defines a hollow structure having an upper opening and has an air hole for taking air into the hollow portion. electronic equipment.

[0020] (Appendix 2) 2. The electronic device of claim 1, wherein the heat sink is configured as a heat sink having an outer cylinder and internal fins.

[0021] (Appendix 3) 3. The electronic device described in Appendix 2, wherein the outer cylinder is made of a heat-insulating material.

[0022] (Appendix 4) 3. The electronic device of claim 2, wherein the outer tube is lined with a heat-insulating material.

[0023] (Appendix 5) 5. The electronic device according to any one of claims 1 to 4, wherein the upper opening is connected to a heat dissipation hole provided in a housing of the electronic device.

[0024] The disclosures of the above-cited patent documents and other documents are incorporated herein by reference and may be used as the basis or part of the present invention, as necessary. Modifications and adjustments of the embodiments and examples are possible within the scope of the entire disclosure of the present invention (including the claims), and further based on the basic technical concepts thereof. Furthermore, various combinations and selections (including partial deletions) of the various disclosed elements (including each element of each claim, each element of each embodiment or example, each element of each drawing, etc.) are possible within the scope of the entire disclosure of the present invention. In other words, the present invention naturally embraces various modifications and alterations that would be possible by a person skilled in the art in accordance with the entire disclosure and technical concepts, including the claims. In particular, with regard to the numerical ranges set forth herein, any numerical value or subrange within that range should be construed as specifically set forth, even if not otherwise specified. Furthermore, the disclosures of the above-cited documents, when used in part or in whole in combination with the disclosures herein as part of the disclosure of the present invention, in accordance with the spirit of the present invention, are also deemed to be included in the disclosures of this application. [Explanation of symbols]

[0025] 10: Heating element 20: Heat sink 21:Air vent 22: Outer cylinder 23: Internal fin 24: Upper opening 40: Circuit board 100:Electronic equipment 110: Heat radiation hole 120: Ventilation hole

Claims

1. The device has a heat generating element and a heat dissipating element that dissipates heat generated by the heat generating element, The heat sink defines a hollow structure having an upper opening and has an air hole for taking air into the hollow portion. electronic equipment.

2. The electronic device of claim 1 , wherein the heat dissipation body is configured as a heat sink having an outer cylinder and internal fins.

3. The electronic device according to claim 2 , wherein the outer cylinder is made of a heat insulating material.

4. The electronic device according to claim 2 , wherein the outer casing is lined with a heat insulating material.

5. The electronic device according to claim 1 , wherein the upper opening is connected to a heat dissipation hole provided in a housing of the electronic device.

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