Cooling system and heating element mounting device

Abstract

To reduce noise when cooling a heating element.SOLUTION: To provide a cooling system for a heating element of a heating element mounting device. The cooling system includes a structure having an internal space for housing a heating element, an air supply device arranged in the structure and supplying outside air to the internal space, and a valve body arranged in the structure. The structure is configured to form a passage for an air flow circulating around the heating element by the outside air supplied by the air supply device in a state where the heating element is accommodated in the structure. The valve body is configured to open when the pressure in the internal space of the structure exceeds a predetermined threshold while the air supply device is operating.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a cooling system and a heat-generating device. Note that in the present disclosure, a heat-generating device refers to a device that is equipped with a heat-generating device as a component. [Background technology]

[0002] 2. Description of the Related Art Electronic devices such as communication devices, including routers, have a heat generating element, such as a CPU (Central Processing Unit), in their housings, and have a cooling device for removing heat generated by the heat generating element and cooling the heat generating element. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-228461 Summary of the Invention [Problem to be solved by the invention]

[0004] The following analysis was carried out by the inventors.

[0005] The electronic device described in Patent Document 1 has an intake mechanism (cooling fan) and an exhaust mechanism (cooling fan) attached to its housing as a cooling device for a heat generating element.

[0006] However, cooling fans, especially forced exhaust cooling fans, are loud and cause noise, so there are cases where the installation locations for electronic devices equipped with such cooling devices are limited or they are inconvenient for mobile use.

[0007] An object of the present disclosure is to provide a cooling system and a heat-generating element mounting device that contribute to reducing noise when cooling a heat-generating element. [Means for solving the problem]

[0008] A first aspect of the present disclosure provides a cooling system for a heat generating element of a heat generating element-mounted device. The cooling system comprises: A structure having an internal space for accommodating the heating element; an air supply device disposed in the structure and supplying outside air to the interior space; and A valve body disposed in the structure containing, The structure is configured such that, when the heat generating element is housed in the structure, a passage is formed for an air flow (hereinafter referred to as a "circulating air flow") that circulates around the heat generating element by the outside air supplied by the air supply device; The valve body is configured to open when the pressure in the internal space of the structure exceeds a predetermined threshold value while the air supply device is operating. It is characterized by: A second aspect of the present disclosure provides a heating element mounting device. the heat generating element mounting device includes the cooling system of the present disclosure; The heating element is contained within the structure of the cooling system. It is characterized by: [Effects of the Invention]

[0009] The present disclosure and each aspect thereof can contribute to reducing noise when cooling a heat-generating body. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic plan view of an example cooling system according to the present disclosure; [Figure 2] 1 is a schematic side view of an example cooling system according to the present disclosure. [Figure 3] 1 is a schematic cross-sectional view of an example cooling system according to the present disclosure. [Figure 4] FIG. 10 is a schematic plan view of another example of a cooling system according to the present disclosure. [Figure 5]FIG. 10 is a schematic cross-sectional view of another example of a cooling system according to the present disclosure disposed in an example of a heat generating element mounting device according to the present disclosure. [Figure 6] 4 is a flowchart illustrating an example of the operation of the cooling system according to the present disclosure. [Figure 7] FIG. 1 is a block diagram illustrating an example of a configuration of hardware resources. DETAILED DESCRIPTION OF THE INVENTION

[0011] Preferred embodiments of the present disclosure will be described below, but the present disclosure is not limited thereto. (Mode 1) See the first aspect of this disclosure above. (Feature 2) In the cooling system according to feature 1, The valve body is configured to close when the pressure in the internal space of the structure becomes equal to or lower than a predetermined threshold value. is preferred. (Feature 3) In the cooling system according to feature 1, The structure has a straightening wall that at least partially separates the airflow generated directly by the air supply device ("direct airflow") from the circulating airflow. is preferred. (Feature 4) In the cooling system according to feature 1, The structure has a slit-shaped opening into which a plate-shaped member having a heating element disposed thereon can be at least partially inserted. is preferred. (Feature 5) In the cooling system according to feature 4, The structure includes a sealing member that airtightly seals the opening when the plate-like member is inserted into the internal space through the opening. is preferred. (Feature 6) In the cooling system according to feature 1, The valve body is a pressure valve that automatically opens when the pressure in the internal space of the structure exceeds a predetermined threshold, and automatically closes when the pressure in the internal space of the structure falls below the predetermined threshold. is preferred. (Embodiment 7) In the cooling system according to embodiment 1, The cooling system includes an exhaust duct for airtightly communicating an exhaust section of the heat-generating-element mounting device with the valve body when the heat-generating element is housed in the structure. is preferred. (Embodiment 8) In the cooling system according to embodiment 1, The cooling system includes an air intake duct for communicating an air intake section of the heat generating element mounting device with the air intake device when the heat generating element is housed in the structure. is preferred. (Mode 9) See the second aspect of the present disclosure above. (Mode 10) In the cooling system according to any one of modes 1 to 6, The structure is a housing for a heating element-mounted device. is preferred.

[0012] An outline of the present disclosure will be described below. Note that the reference numerals in the drawings attached to this outline are intended solely to aid in understanding the present disclosure and are not intended to limit the present disclosure to the illustrated embodiments. Furthermore, the drawings themselves are merely conceptual diagrams that schematically illustrate the structure or main components of the cooling system and the heat-generating device.

[0013] Furthermore, in the following description and drawings, elements having the same or common functions are designated with the same drawing reference numerals.

[0014] In addition, in the present disclosure, the terms "over" and "equal to" can also be interpreted as "greater than" and "less than," respectively.

[0015] Furthermore, the present disclosure may be embodied as a computer-executable program, which may be recorded on a computer-readable, non-transitory storage medium. That is, the present disclosure may also be embodied as a computer program product. The program is input to a computer device via an input device or externally via a communication interface, stored in a storage device, and causes a processor to execute predetermined steps or processes. The program may display the processing results, including intermediate states as needed, at each stage on a display device. Alternatively, the program may communicate with internal or external devices (including computers) via the communication interface, whether wired or wireless. For example, a computer device for this purpose typically includes a processor, a storage device, an input device, a communication interface, and, if necessary, a display device, all of which are connectable via a bus.

[0016] (An example of a cooling system) FIG. 1 is a schematic plan view of an example of a cooling system according to the present disclosure.

[0017] The cooling system 1 includes a structure 2 , an air supply device 3 and a valve body 4 .

[0018] The structure 2 has an internal space 5 (see FIG. 3) that houses a heating element 6 of a heating element-mounted device (not shown). The heating element 6 is an electronic component such as a CPU that generates heat particularly during operation, and in the illustrated example, is disposed on a plate-like member 7 such as a circuit board. The heating element-mounted device is an electronic device such as a communication device, including a router, that mounts such a heating element as a component thereof. The entire structure 2, in particular, can be formed from a heat insulating material or a material with low thermal conductivity so that heat generated inside is not dissipated to the outside.

[0019] The structure 2 is provided with an air supply device 3 and a valve body 4 .

[0020] The air supply device 3 can be configured as any type of air supply or blowing mechanism capable of supplying outside air of the structure 2 to the internal space 5 of the structure 2, and is typically configured as a cooling fan.

[0021] The valve body 4 is configured to exhaust gas from the internal space 5 of the structure 2 to the outside of the structure 2.

[0022] In this example, the valve body 4 is configured as a pressure valve that automatically opens when the pressure in the internal space 5 of the structure 2 exceeds a predetermined threshold and automatically closes when the pressure in the internal space 5 of the structure 2 is below the predetermined threshold.

[0023] The structure 2 has a slit-shaped opening 8 into which a plate-shaped member 7 having a heating element 6 disposed thereon can be at least partially inserted (see FIG. 2). The plate-shaped member 7 is inserted into the internal space 5 through the opening 8 so that the heating element 6 is positioned within the internal space 5.

[0024] The structure 2 further includes a sealing member 9 (see FIG. 2) at the opening 8, which airtightly seals the opening 8, and therefore the internal space 5 of the structure 2, when the plate-like member 7 is inserted into the internal space 5 through the opening 8. The sealing member 9 can be made of a flexible plastic material such as silicone rubber.

[0025] It should be noted that FIG. 1 is merely a conceptual diagram for illustrating an example of the components of the cooling system 1 and their arrangement, and is not intended to limit the cooling system 1 to the structure shown in the figure.

[0026] For example, in the example of Figure 1, the plate-like member 7 is formed in an approximately L-shape, but is not limited to this and can be formed in any shape that can be inserted into the internal space 5 of the structure 2 through the opening 8 so that the heating element 6 is accommodated within the internal space 5 of the structure 2.

[0027] 1, the structure 2 is configured so that when the heating element-equipped portion of the L-shaped plate-like member 7 is inserted into the internal space 5 through the opening 8, the end of the heating element-equipped portion is exposed to the outside of the structure 2, but it is also possible to configure the heating element-equipped portion so that the entire portion is contained within the internal space 5 (i.e., so that the end is not exposed to the outside of the structure 2). In the illustrated case, the structure 2 also has an opening in the side wall corresponding to the end of the heating element-equipped portion of the plate-like member 7, and if necessary, this opening can have a sealing member that airtightly seals the internal space 5 of the structure 2.

[0028] Furthermore, in the example of Figure 1, the structure 2 is configured to accommodate only the heating element-equipped portion of the plate-shaped member 7 within the internal space 5, but it is also possible to configure the structure 2 to accommodate the entire plate-shaped member 7 within the internal space 5.

[0029] Furthermore, in the example of FIG. 1, the structure 2 has a trapezoidal shape in plan view, but it may have other shapes.

[0030] 1, the air supply device 3 and the pressure valve 4 are disposed on the structure 2 at a distance from each other in a direction approximately parallel to the surface of the plate-like member 7, but they can also be disposed on the structure 2 at a distance from each other in a direction approximately perpendicular to the surface of the plate-like member 7. Furthermore, in the illustrated state, the air supply device 3 and the pressure valve 4 can be disposed at approximately the same position (or height) in the direction approximately perpendicular to the surface of the plate-like member 7, or can be disposed at different positions (or heights). Furthermore, although the air supply device 3 and the pressure valve 4 are disposed on the same wall of the structure 2 in the example of FIG. 1, they can also be disposed on different wall parts.

[0031] 2 is a schematic side view of an example of a cooling system according to the present disclosure, showing an example of the opening 8 formed in the structure 2 and a sealing member 9 provided in the opening 8. However, FIG. 2 shows a state in which the plate-like member 7 is not inserted in the opening 8.

[0032] In addition, when the structure 2 is configured so that the end of the heating element-mounted portion of the L-shaped plate-like member 7 is exposed from the structure 2 as in the example of Figure 1, the structure 2 may also have an opening similar to the example of Figure 2 and, if necessary, a sealing member on the side wall corresponding to the end of the heating element-mounted portion of the plate-like member 7.

[0033] FIG. 3 is a schematic cross-sectional view of an example of a cooling system according to the present disclosure, showing an example of the state of airflow formation within the structure 2 when the cooling system is in operation.

[0034] In Fig. 3, the solid arrows indicate an example of an airflow formed in the internal space 5 of the structure 2 when the valve element 4 is closed, and the dashed arrows indicate an example of an airflow formed in the internal space 5 of the structure 2 when the valve element 4 is open. Note that although Fig. 3 shows the valve element 4 in an open state, the valve element 4 is closed when the cooling system 1 is started.

[0035] When the valve body 4 is closed, the air supply device 3 continuously supplies outside air into the internal space 5, thereby forming a circulating airflow that circulates around the heating element in the internal space 5 (see the solid arrows). In the illustrated example, the airflow generated by the air supply device 3 flows along the heating element mounting side of the plate-shaped member 7, changes direction at one end of the plate-shaped member 7, then flows along the opposite side of the heating element mounting side of the plate-shaped member 7 (also referred to as the "back side"), changes direction at the other end of the plate-shaped member 7, and flows again along the heating element mounting side, thereby forming a circulating convection current. When a direct airflow generated directly from the air supply device 3 directly hits the heating element 6, this convection current transfers (at least partially) the heat generated by the heating element 6 to the gas that has flowed into the structure 2, thereby cooling the heating element 6.

[0036] When the valve element 4 is open, the airflow in the internal space 5 is exhausted to the outside of the structure 2 through the valve element 4 without (substantially) changing direction from the back side of the plate-like member 7 to the heating element mounting side in the region on the right side of the page in Fig. 3 (see dashed arrow). As a result, the heat generated by the heating element 6 is exhausted to the outside of the structure 2, but in the present disclosure, because the heated gas is exhausted through the valve element 4, the operating noise can be significantly reduced compared to when a cooling fan or the like is used.

[0037] In the example of Figure 3, the air supply device 3 is arranged on the structure 2 so that the air flow from the air supply device 3 flows directly over the heating element mounting side of the plate-shaped member 7, but it is also possible to arrange it on the structure 2 so that the air flow from the air supply device 3 flows directly over the back side of the plate-shaped member 7, conversely.

[0038] (Another example of a cooling system) FIG. 4 is a schematic plan view of another example of a cooling system according to the present disclosure.

[0039] The cooling system 1 shown in Fig. 4 has components in common with the cooling system 1 shown in Fig. 1 to Fig. 3, and further includes a straightening wall 10. The straightening wall 10 at least partially separates the direct airflow and the circulating airflow, and enables the direct airflow and the circulating airflow to influence each other as little as possible, thereby enabling smooth formation of convection.

[0040] In FIG. 4, the airflow flowing on the rear surface side of the plate-like member 7 is omitted.

[0041] (Another example of a cooling system) FIG. 5 is a schematic cross-sectional view of another example of a cooling system according to the present disclosure disposed in an example of a heat-generating-element mounting device according to the present disclosure.

[0042] The cooling system 1 shown in FIG. 5 has components in common with the cooling system 1 shown in FIGS. 1 to 3 and further includes an exhaust duct 11. The exhaust duct 11 allows airtight communication between the valve body 4 of the cooling system 1 and the exhaust section 21 of the heat-generating-element mounting device 20 when the heat-generating element 6 of the heat-generating-element mounting device 20 is housed within the structure 2 of the cooling system 1. The exhaust duct 11 allows heat generated by the heat-generating element 6 to be discharged to the outside of the heat-generating-element mounting device 20 without dissipating into the internal space of the heat-generating-element mounting device 20. Therefore, when the housing 23 of the heat-generating-element mounting device 20 is made of metal or a material with high thermal conductivity, it is possible to prevent a temperature rise on the housing surface of the heat-generating-element mounting device 20, thereby making it possible to avoid problems such as low-temperature burns caused by a temperature rise on the housing surface.

[0043] The exhaust section 21 shown in Figure 5 is configured as an exhaust port formed in the housing 23 of the heat-generating element mounting device 20 and directly connected to the exhaust duct 11 of the cooling system 1, but the exhaust section 21 of the heat-generating element mounting device 20 can also be provided with a connecting duct (not shown) that enables airtight communication between the exhaust port formed in the housing 23 and the exhaust duct 11 of the cooling system 1.

[0044] The cooling system 1 of this example may further include, as shown in the drawing, an air intake duct 12 for communicating between the air intake device 3 and the air intake section 22 of the heat-generating element mounting device 20 when the heat-generating element 6 of the heat-generating element mounting device 20 is housed in the structure 2 of the cooling system 1. The communication between the air intake device 3 and the air intake section 22 may also be formed airtight.

[0045] Furthermore, like the exhaust section 21, the air intake section 22 shown in Figure 5 is configured as an air intake port formed in the housing 23 of the heat generating element mounting device 20 and directly connected to the air intake duct 12 of the cooling system 1, but the air intake section 22 of the heat generating element mounting device 20 can also be provided with a connecting duct (not shown) that enables communication between the air intake port formed in the housing 23 and the air intake duct 12 of the cooling system 1.

[0046] (Example of cooling system operation) FIG. 6 shows a flowchart of an example of the operation of the cooling system of the present disclosure.

[0047] First, with the heat generating element 6 of the operating heat generating element mounted device housed in the internal space 5 of the structure 2 of the cooling system 1, the air supply device 3 is started (step 1 (S1); hereinafter, "step" may be abbreviated as "S"). At this time, the pressure valve 4 is closed. The operation of the air supply device 3 (adjustment of the amount of air supply (air blown), etc.) can be electronically controlled, for example, by a computer mounted on the structure 2 of the cooling system 1 or the plate-like member 7 of the heat generating element mounted device, or by an external computer.

[0048] When the air supply device 3 is activated, outside air (usually air) flows into the internal space 5 of the structure 2, and the pressure in the internal space 5 of the structure 2, which is kept airtight, rises (S2). At this time, the heating element 6 is cooled by the circulating airflow formed by the air supply device 3 continuously generating an airflow, and if the heating element 6 is directly hit by the direct airflow from the air supply device 3, it is also cooled by this direct airflow.

[0049] Then, when the pressure in the internal space 5 of the structure 2 exceeds a predetermined threshold (S3; YES), the pressure valve 4 automatically opens (S4). As a result, the gas that has absorbed the heat generated by the heating element 6 is exhausted to the outside of the structure 2, thereby lowering the temperature of the heating element 6. Note that in the present disclosure, a valve body is used for this exhaust, which contributes to a significant reduction in operating noise compared to using an exhaust cooling fan, which has a loud operating noise, and also makes it possible to achieve power savings for the cooling fan.

[0050] The pressure valve 4 opens, reducing the internal pressure of the structure 2 (S5). When the pressure in the internal space 5 of the structure 2 falls below a predetermined threshold (S6; YES), the pressure valve 4 automatically closes (S7), the process returns to S2, and the above operations are repeated.

[0051] If the pressure in the internal space 5 of the structure 2 is equal to or lower than the predetermined threshold value in S3 (NO), the process returns to S2. If the pressure in the internal space 5 of the structure 2 exceeds the predetermined threshold value in S6 (NO), the process returns to S5.

[0052] In the above example, if the cooling system 1 is equipped with an exhaust duct 11, in steps S4 and S5, the heated exhaust air is discharged to the outside of the heat-generating device without being dispersed into the internal space of the heat-generating device, thereby avoiding problems such as low-temperature burns caused by a rise in the temperature of the surface of the housing of the heat-generating device.

[0053] Also, in S4, when the pressure valve 4 opens, the air supply device 3 can be stopped or its output can be reduced (reduced air supply volume), or in some cases, its output can be increased (increased air supply volume), and then, when the pressure valve 4 closes in S7, the air supply device 3 can be started again or its output can be increased (increased air supply volume), or in some cases, its output can be decreased (decreased air supply volume).

[0054] (Another example of cooling system operation) In the above example, a pressure valve that automatically opens and closes depending on the internal pressure of the structure 2 is used as the valve element 4, but it is also possible to use a valve element whose opening and closing can be electronically controlled. In this case, for example, a pressure sensor can be provided in the internal space 5 of the structure 2, and the opening and closing operation of the valve can be electronically controlled, for example, by a computer, based on the pressure in the internal space 5 of the structure 2 measured by the pressure sensor. Furthermore, for example, by providing a temperature sensor in addition to the pressure sensor in the internal space 5 of the structure 2, it is possible to forcibly open the valve when the temperature in the internal space 5 of the structure 2 measured by the temperature sensor exceeds the predetermined threshold even if the pressure in the internal space 5 of the structure 2 is below the predetermined threshold. When an electronically controllable valve element is used, the predetermined threshold in S3 (the "upper threshold" or "upper limit value") and the predetermined threshold in S6 (the "lower threshold" or "lower limit value") can be different values.

[0055] (Another example of a cooling system) If the heat-generating device on which the cooling system of the present disclosure is installed has a structure capable of forming a passage for the above-mentioned circulating airflow, for example, if the heat-generating device has a thin housing and there is adequate space on both the upper and lower surfaces and on both ends of the plate-like member on which the heat-generating device is disposed, the cooling system of the present disclosure can be directly applied to the heat-generating device, i.e., the structure of the cooling system can be used as the housing of the heat-generating device, which also reduces operating noise during operation.

[0056] The server according to each of the above examples and modes can be configured by so-called hardware resources (information processing device, computer), and can have the configuration shown in Fig. 7. For example, the hardware resource 1000 includes a processor 1001, a memory 1002, a network interface 1003, etc., which are interconnected by an internal bus 1004.

[0057] However, the configuration shown in Fig. 7 is not intended to limit the hardware configuration of the hardware resource 1000. The hardware resource 1000 may include hardware (e.g., an input / output interface) that is not shown. Furthermore, the number of units such as the processor 1001 included in the device is not intended to be limited to the example shown in Fig. 7, and for example, multiple processors 1001 may be included in the hardware resource 1000. The processor 1001 may be, for example, a central processing unit (CPU), a microprocessor unit (MPU), a graphics processing unit (GPU), or the like.

[0058] The memory 1002 may be, for example, a random access memory (RAM), a read only memory (ROM), a hard disk drive (HDD), or a solid state drive (SSD).

[0059] The network interface 1003 may be, for example, a LAN (Local Area Network) card, a network adapter, a network interface card, or the like.

[0060] The functions of the hardware resource 1000 are realized by the above-mentioned processing module. The processing module is realized, for example, by the processor 1001 executing a program stored in the memory 1002. The program can be updated by downloading it over a network or by using a storage medium storing the program. Furthermore, the processing module may be realized by a semiconductor chip. In other words, it is sufficient that the functions performed by the processing module can be realized by executing software on some kind of hardware.

[0061] Some or all of the above embodiments can be described as, but are not limited to, the following supplementary notes. [Appendix 1] A cooling system for a heat generating element in a device that has a heat generating element mounted as a component (hereinafter referred to as a "heat generating element mounted device"). The cooling system comprises: A structure having an internal space for accommodating the heating element; an air supply device disposed in the structure and supplying outside air to the interior space; and A valve body disposed in the structure Includes. The structure is configured so that, when the heating element is housed in the structure, a passage is formed (within the internal space) for an airflow (hereinafter referred to as a "circulating airflow") that circulates around the heating element using outside air supplied (continuously) by the air supply device. The valve body is configured to open when the pressure in the internal space of the structure exceeds a predetermined threshold value while the air supply device is operating. [Appendix 1a] In the above cooling system, When the valve body is open, the air supply system stops operating or reduces its output, or in some cases increases its output. [Appendix 2] In the above cooling system, The valve element is configured to close when the pressure in the internal space of the structure falls below a predetermined threshold. [Appendix 2a] In the above cooling system, When the valve body is closed, the air supply system starts to operate or the output increases, or in some cases the output decreases. [Appendix 3] In the above cooling system, The structure has a flow straightening wall that at least partially separates the airflow generated directly by the air supply device (the "direct airflow") from the circulating airflow. [Appendix 4] In the above cooling system, The structure has a slit-shaped opening into which a plate-shaped member on which a heating element is disposed can be at least partially inserted. [Appendix 5] In the above cooling system, The structure includes a sealing member (at the opening) that airtightly seals the opening when the plate-like member is inserted into the internal space through the opening. [Appendix 6] In the above cooling system, The valve body is a pressure valve that automatically opens when the pressure in the internal space of the structure exceeds a predetermined threshold, and automatically closes when the pressure in the internal space of the structure falls below the predetermined threshold. [Appendix 6a] In the above cooling system, The valve element is a valve element whose opening and closing can be electronically controlled, in particular by a computer provided on the structure or on the plate-like member. [Appendix 6a1] In the above cooling system, The cooling system includes a pressure sensor in the interior space of the structure for measuring pressure within the interior space. [Appendix 6a2] In the above cooling system, The cooling system includes a temperature sensor in the interior space of the structure for measuring the temperature within the interior space. [Appendix 6a3] In the above cooling system, The valve element (forcibly) opens when the temperature of the internal space of the structure exceeds a predetermined threshold value. [Appendix 6a4] In the above cooling system, The predetermined threshold value of the pressure in the internal space of the structure when the valve body opens (the "upper threshold value" or "upper limit value") and the predetermined threshold value of the pressure in the internal space of the structure when the valve body closes (the "lower threshold value" or "lower limit value") are different values. [Appendix 7] In the above cooling system, The cooling system includes an exhaust duct for airtightly connecting an exhaust section of the heat generating element mounting device and the valve body when the heat generating element is housed in the structure. [Appendix 8] In the above cooling system, The cooling system includes an air intake duct for airtightly communicating the air intake section of the heat generating element mounting device with the air intake device when the heat generating element is housed in the structure. [Appendix 9] Heat-generating device. The heat generating element mounting device includes the cooling system described in any one of Supplementary Notes 1 to 8. The heating element is contained within the structure of the cooling system. [Appendix 9a] In the above-mentioned heating element mounting device, The housing of the heat generating device has an exhaust portion, particularly an exhaust port, that is directly connected to an exhaust duct of the cooling system. [Appendix 9b] In the above-mentioned heating element mounting device, The housing of the heat generating device has an air intake section, particularly an air intake port, that is directly connected to the air intake duct of the cooling system. [Appendix 10] In the above cooling system, The structure is a housing of a heating element mounting device. [Appendix 11] a structure having an internal space for accommodating a heat generating element of the heat generating element mounting device; an air supply device provided in the structure and supplying air into the structure; and A valve body provided in the structure A cooling system control program including: The control program is configured to The air supply device supplies air into the structure; and A process in which the valve body opens when the pressure in the internal space of the structure exceeds a predetermined threshold. Execute the following. [Appendix 12] In the above control program, The control program is configured to A process in which the valve body closes when the pressure in the internal space of the structure becomes equal to or lower than a predetermined threshold value. Execute the following.

[0062] Within the scope of the entire disclosure of the present invention (including the scope of the claims), modifications and adjustments of the embodiments and examples are possible based on the basic technical ideas. Furthermore, within the scope of the entire disclosure of the present invention, various combinations and selections (including partial deletions) of various disclosed elements (including each element of each claim, each element of each embodiment or example, each element of each drawing, etc.) are possible. In other words, the present invention naturally includes various modifications and alterations that would be possible for a person skilled in the art based on the entire disclosure, including the scope of the claims, and the technical ideas. [Explanation of symbols]

[0063] 1. Cooling system 2 structure 3 Air supply device 4 Valve body 5. Interior space 6 Heating element 7 Plate-shaped members 8 Openings 9 Sealing member 10 Rectification wall 11 Exhaust duct 12 Air supply duct 20 Heating element mounting device 21 Exhaust section 22 Air supply section 23 Case 1000 hardware resources 1001 processor 1002 memory 1003 Network Interface 1004 Internal Bus

Claims

1. A cooling system for a heat generating element of an apparatus (hereinafter referred to as a "heat generating element-mounted apparatus") that is equipped with a heat generating element as a component, comprising: The cooling system comprises: A structure having an internal space for accommodating the heating element; an air supply device disposed in the structure and supplying outside air to the interior space; and A valve body disposed in the structure containing, The structure is configured such that, when the heat generating element is housed in the structure, a passage is formed for an air flow (hereinafter referred to as a "circulating air flow") that circulates around the heat generating element by outside air supplied by the air supply device; The valve body is configured to open when the pressure in the internal space of the structure exceeds a predetermined threshold value while the air supply device is operating. A cooling system characterized by:

2. 10. The cooling system of claim 1, The valve body is configured to close when the pressure in the internal space of the structure becomes equal to or lower than a predetermined threshold value. A cooling system characterized by:

3. 10. The cooling system of claim 1, The structure has a flow straightening wall that at least partially separates the airflow directly generated by the air supply device from the circulating airflow. A cooling system characterized by:

4. 10. The cooling system of claim 1, The structure has a slit-shaped opening into which a plate-shaped member having a heating element disposed thereon can be at least partially inserted. A cooling system characterized by:

5. 5. The cooling system of claim 4, The structure includes a sealing member that airtightly seals the opening when the plate-like member is inserted into the internal space through the opening. A cooling system characterized by:

6. 10. The cooling system of claim 1, The valve body is a pressure valve that automatically opens when the pressure in the internal space of the structure exceeds a predetermined threshold, and automatically closes when the pressure in the internal space of the structure falls below the predetermined threshold. A cooling system characterized by:

7. 10. The cooling system of claim 1, The cooling system includes an exhaust duct for airtightly communicating an exhaust section of the heat-generating-element mounting device with the valve body when the heat-generating element is housed in the structure. A cooling system characterized by:

8. 10. The cooling system of claim 1, The cooling system includes an air intake duct for communicating an air intake section of the heat generating element mounting device with the air intake device when the heat generating element is housed in the structure. A cooling system characterized by:

9. A heating element mounting device, The heat generating element mounting device includes the cooling system according to any one of claims 1 to 8. The heating element is contained within the structure of the cooling system. A heating element-equipped device characterized by:

10. The cooling system according to any one of claims 1 to 6, The structure is a housing for a heating element-mounted device. A cooling system characterized by:

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