State detection of an adhesive connection

Abstract

To provide a method for determining a state of a connection system comprising a first attachment means, a second attachment means and a sensor array.SOLUTION: It can be used to determine the relative position of the attachment means with respect to one another, wherein the first attachment means 12 is brought into proximity and / or attached to the second attachment means 14 and at least one parameter relating to the positioning is captured by the sensor array 16. After alignment of the attachment means, the final mounting can take place. The method can likewise be used to detect the adhesion of the first adhesive means 12 to the second adhesive means 14 and / or to determine the loading or unloading of the adhesive connection. The processed and / or unprocessed sensor data may be transmitted wirelessly using the communication component 18.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method for status acquisition of a connection system. The invention further relates to a connection system configured to implement the aforementioned method and to a set comprising said connection system and a functional element, in particular a mobile wireless router. The invention also relates to a method for manufacturing said connection system and to a development of said connection system comprising a communication component. [Background technology]

[0002] It is known to combine connection systems, in particular manually re-detachable connection systems, with sensors and devices for the subsequent processing and / or transmission of sensor data.

[0003] CN114608623 describes a flexible two-dimensional sensor array using a hook-and-loop fastener, in which a conductive structure is arranged on the back of each adhesive element, and a sensor is attached to the back of each opposing adhesive element. The connection between the sensor and the conductive structure is made by local penetration of each conductor path element from the back of the hook-and-loop fastener to the adhesive surface. In this way, these conductor path elements come into contact with each other when producing the adhesive connection.

[0004] German Patent Application No. 102018104774 describes a skin-attachable electrode that can be used as a sensor. The electrode's skin-contacting layer is arranged on one part of a hook-and-loop fastener, through which it can be flexibly positioned on the support field that forms the second part of the hook-and-loop fastener. The potential transfer through the hook-and-loop fastener connection is ensured by the conductive properties of the hook-and-loop fastener parts, preferably a silver coating.

[0005] US Patent No. 5,714,706 discloses a shoe insole that can be used as an input field for sound control, in which a piezoelectric sensor is placed on a substrate plate using hook-and-loop fasteners.

[0006] DE 102010060222 A1 describes textile products equipped with electrical or electronic components (e.g., sensors), which are assigned contact means comprising a hook-and-loop fastener. The fastening parts of the hook-and-loop fastener each have electrically conductive contact elements, via which an electrically conductive connection can be established beyond the hook-and-loop fastener.

[0007] Chinese Patent No. 105640542, Chinese Utility Model No. 218501232, and Chinese Patent Application Publication No. 109350015 each describe a sensor array for medical applications, in which hook-and-loop fasteners are used to connect the sensor to the support material or to secure the sensor support to the patient, respectively.

[0008] US 2020 / 0338750 A1 describes microstructured attachment means, in which electrodes and / or piezoelectric elements can be considered as components of the attachment means, which can function here as stress sensors and / or contact sensors, among others.

[0009] WO 03 / 085273 describes a hook-and-loop fastener that can be released by electrical excitation. Some of the hooks of the fastening parts are made of an electrically responsive shape-memory material, and each hook contains an additional electrically "inactive" material. When an electric current is passed through the hooks, they straighten, releasing the hook-and-loop fastener. For this purpose, the hook-and-loop fastener, or at least a part of it, must have a suitable electrical conductivity.

[0010] German Utility Model No. 202021002148 describes a textile stop means with an information device, one side of which can be reversibly fastened to the stop means. This can be done, for example, via a hook-and-loop fastener. In one application embodiment, the information device comprises one or more RFID (Radio-Frequency Identification) transponders.

[0011] Chinese Utility Model Nos. 2212433805 and 2209560579 each describe the use of hook-and-loop fasteners to fasten RFID transponders.

[0012] US Patent Application Publication No. 2012 / 0123291 describes a measuring device for determining bioimpedance. For this purpose, multiple probes are arranged on a flexible band. Additionally, the band includes a device for wirelessly transmitting impedance data. In one application, the band is fastened to the body using a hook-and-loop fastener.

[0013] U.S. Patent No. 10,265,019 describes a similar type of sensor array in which sensors for monitoring physiological parameters are arranged on a flexible headband (or similar head-worn device) that can be secured to the body using, for example, hook-and-loop fasteners. Transmission of sensor data can be via a wireless data transmission module, again located on the headband.

[0014] US Patent No. 1,103,9530 describes a communication device that is arranged on a structure and can be attached to clothing, thereby creating a "connected clothing system." This communication device here is particularly equipped with an NFC (Near Field Communication) sensor and can be fixed to the clothing using a hook-and-loop fastener. The controller of the communication device can be housed in a housing that can be closed via the hook-and-loop fastener.

[0015] In the prior art, multiple sensors are used to measure parameters that do not characterize the connection system itself. Summary of the Invention [Problem to be solved by the invention]

[0016] In contrast, the object of the present invention is to make it possible to determine the state of a connection system, in particular a connection system for forming a releasable connection. [Means for solving the problem]

[0017] This problem is solved according to the invention by a method for state acquisition according to claim 1, a connection system according to claim 8, a set according to claim 15 and a method for manufacturing a connection system according to claim 16. The dependent claims show preferred configurations.

[0018] The method includes the steps of bringing a first attachment means into proximity with and / or attaching to a second attachment means, and capturing, with a sensor array, at least one parameter related to the state of the attachment connection formed or to be formed between the first attachment means and the second attachment means. The second attachment means may optionally be in the form of a surface. If the first attachment means is initially only brought into proximity with the second attachment means, the final attachment occurs after capturing the at least one parameter, in which case at least one additional parameter can be captured subsequently in a further implementation of the method.

[0019] The state of the attachment connection may be understood to mean an existing attachment connection or a non-existent attachment connection. In this regard, the parameters may provide information as to whether the attachment means form an attachment connection. For example, it may be assumed that a predetermined minimum distance exists between the attachment means. Furthermore, it may be assumed that, for example, a pressure sensor determines a minimum crimping pressure for the presence of an attachment connection. This may ensure controlled proximity and / or attachment of the attachment means to one another.

[0020] Alternatively or additionally, the parameter may provide information regarding whether an attachment connection is being formed by the attachment means, in other words whether the attachment means are properly positioned and / or aligned with one another for the formation of a predetermined attachment connection.

[0021] The condition of the adhesive connection is understood to alternatively or additionally mean the strength of the formed adhesive connection, which can ensure sufficient strength of the adhesive connection and / or allow early identification of a decrease in the strength of the adhesive connection. For example, the values ​​of the parameters can be compared with reference values ​​whose influence on the strength of the adhesive connection is known. For example, the pressure of the clamping between the adhesive means can be used to assess the strength of the adhesive connection.

[0022] In particular, the step of bringing the first attachment means into proximity with and / or attaching the first attachment means to the second attachment means is performed in dependence on, i.e. in particular using, at least one captured parameter relating to the state of the attachment connection.

[0023] The method can involve the evaluation of at least one parameter, in particular the comparison of the parameter with stored reference quantities and / or look-up tables and / or the calculation of parameter-dependent reference quantities, which preferably allow an unambiguous assignment of these parameter values ​​to a known state of the adhesive fastener, so that the state of the adhesive connection can be determined particularly reliably as a function of the parameter.

[0024] Particularly preferably, the state of the adhesive connection is determined directly between the adhesive means using at least one parameter. In other words, the connection of the adhesive means is determined based on internal and / or external influences on the adhesive fastener. This allows information about the load and / or load-bearing capacity of the adhesive fastener or adhesive connection to be output, regardless of the use of the adhesive fastener. For example, information about the allowable load of the adhesive fastener or adhesive connection can be output via the external tensile load on the adhesive fastener and the holding force per area of ​​the adhesive means.

[0025] The evaluation can in particular envisage determining physical state quantities from at least one parameter. In other words, state quantities of the adhesive fastener can be inferred from the determined parameters. In particular, the contact state of the adhesive means and / or the pressure of the adhesive means can be determined from the relative positions of the adhesive means to one another. For example, when the adhesive means are attached to one another, a relatively short distance between the adhesive means indicates a strong adhesive connection. A moderate distance indicates a reduced adhesive connection, and a large distance indicates reaching the load limit of the adhesive connection. Typically, the relative positions of the adhesive means are determined by positioning between reference positions established on the adhesive means. This allows deformations of the adhesive means, in particular expansion and / or compression, to be taken into account.

[0026] Preferably, the method provides for the output of at least one parameter, the value of the parameter, and also the determined physical quantity and / or the state of the adhesive connection. This output can be visual or can be provided to an electronic monitoring system for further processing. This allows for particularly reliable monitoring of the adhesive connection.

[0027] The method is typically performed computer-assisted, in other words, the implementation of the method is carried out using at least one computer. Particularly preferably, the method is performed in an automated manner.

[0028] The method steps of the method can be repeated, in particular several times, in particular by separating the attachment means from one another again if the attachment connection is not formed as expected, so that the connection means can be repeatedly brought close together and / or attached to one another and the attachment connection to be formed can be guaranteed.

[0029] Preferably, the sensor elements of the sensor array are used to capture one of the following physical quantities between the first and second attachment means: displacement, strain, stress, pressure, radiant energy, molar concentration or magnetic field strength.

[0030] The sensor array typically includes at least one technological sensor for determining a parameter related to the state of the attachment connection.

[0031] In a particularly preferred application of the method, the sensor element is an optical sensor element, a magnetic sensor, a pressure sensor, a stress sensor or a strain sensor.

[0032] Sensor elements from the group of optical sensor elements can be, for example, sensors that capture the radiant energy of ambient lighting or sensors that utilize the capture of the reflection of a previously emitted light beam. From the group of magnetic sensors, Hall sensors and reed switches are particularly suitable. As pressure sensors, preferably bidirectional differential elements are suitable. Examples of stress and strain sensors include mechanical, capacitive, inductive and piezoelectric sensor elements. In principle, any sensor element suitable for capturing at least one parameter can be used. The examples given here regarding the functional manner of sensor elements should not be understood as a definitive list. In particular, it is conceivable that a sensor element can be assigned to several categories (e.g., fiber optic strain sensors).

[0033] At least one parameter allows information about the absolute position of the first attachment means. Alternatively or additionally, at least one parameter allows information about the position of the first attachment means relative to the second attachment means. In this regard, it may be advantageous to initially only bring the attachment means close to each other and then connect them to each other in a subsequent method step. Likewise, it is conceivable that the first attachment means is attached multiple times to determine its position within a succession of iterative processes in which the method is carried out multiple times, and optionally released again until final attachment in the desired position is finally achieved.

[0034] Furthermore, the at least one parameter can also map the state of attachment of the first attachment means to the second attachment means at least in one region of the connection system, where the attachment connection can in particular already be formed in the first method step.

[0035] Alternatively or additionally, at least one parameter can provide information about the load on the attachment connection. For example, the preload that should be applied when the connection is formed can be captured and checked. It is also possible to check whether the load on the attachment connection is still within the expected range after a certain period of time has elapsed. The capture of the load on the attachment connection also includes the capture of the no-load. The no-load is particularly present when the system is open, i.e., when the attachment connection has not been formed. This is also understood in this context as information about the load on the attachment connection.

[0036] Optionally, during the implementation of the method according to the invention, multiple parameters relating to different characteristics of the state of the connection system and / or different local regions of the connection system can be captured.

[0037] More preferably, the sensor array comprises a plurality of similar or different sensor elements for capturing at least one parameter.

[0038] An array of multiple sensor elements can form a sensor matrix that can be used to enable simple position determination and to obtain information through comparison of data from different (preferably homogeneous) sensor elements.

[0039] In an application embodiment of the method, the data of the sensor array, or a portion thereof, is preferably stored at least temporarily in a memory device of the connection system, whereby the need to handle the data in real time (e.g., for data transmission or data processing) is eliminated.

[0040] In a further application embodiment, a data processing device of the connection system is used, by means of which the data of the sensor array is processed, preferably so that the data of the various sensor elements are mutually combined and / or mutually compensated for in order to derive at least one parameter.

[0041] A particularly preferred development of the method according to the invention provides for wireless transmission of the data captured by the sensor array using a communication component of the connection system, whereby these data can be processed before transmission and / or transmitted as raw data.

[0042] In particular, passive elements without their own energy supply are suitable as communication components, and the wireless transmission can be carried out in this case by means of a reading device which provides the necessary energy supply, in particular under the generation of a magnetic or electromagnetic field.

[0043] The object is also achieved by a connection system comprising a first attachment means, a second attachment means, a sensor array and a control unit, the connection system being configured to perform the method according to the invention. The sensor array here can in particular have one or more sensors arranged or formed in or on a sensor film (carrier film).

[0044] To ensure the feasibility of implementing the method in various developments, the connection system preferably comprises a memory device and / or a data processing device, and in particular it may be advantageous if the connection system comprises several memory devices and / or data processing devices.

[0045] Particularly preferably, the sensor array is arranged or formed on or in the first attachment means and / or on or in the second attachment means. In particular, preferred are embodiments in which the sensor element or elements are integral components of the structure of the attachment means or of one of the contact means.

[0046] Preferably, the attachment means are two corresponding halves of an adhesive fastener in the form of a hook-and-loop fastener or clip fastener, where one of the attachment means preferably has hook, mushroom head or palm-type attachment elements, whereas the other attachment means preferably has a palm band, velour band, woven fabric, nonwoven fabric and / or also hook, mushroom head or palm-type attachment elements. The pile band, velour band, woven fabric or nonwoven fabric here in particular has loops and / or fibers for forming an operative connection with the corresponding attachment elements.

[0047] It is likewise conceivable that the two attachment means have two halves of a push button suitable for interaction. Likewise, the attachment means can each have several such halves.

[0048] In an alternative configuration, one of the attachment means has a microstructure for utilizing intermolecular stresses. Preferably, the microstructure is a protrusion protruding from the support material, with the protrusions preferably having a height of 20 μm to 800 μm, particularly preferably 40 μm to 70 μm, and very particularly preferably 50 μm to 60 μm. The protrusions have an elastomer as a material, in particular. The surface density of the protrusions here is preferably less than 1 cm 2 In the range of 10,000 to 100,000 projections per cm, particularly preferably 2 The number of projections is preferably in the range of 15,000 to 50,000 per projection. Furthermore, the projections preferably have a maximum width in the range of 500 nm to 3 μm, particularly preferably in the range of 30 μm to 100 μm. In this case, the corresponding attachment means is a sufficiently smooth surface, which may be provided, for example, by a wall or a glass plate.

[0049] Likewise, it is also conceivable that the connection system can be realized using an adhesive or adhesive layer.

[0050] In order to ensure the feasibility of the particularly preferred development of the method mentioned above, the connection system preferably comprises a communication component.

[0051] More preferably, the communication component is arranged or formed on or in one of the attachment means. As with the sensor array arrangement / configuration, here too, an arrangement is preferred in which the communication component is an integrated component of one or both structured portions of the attachment means. Furthermore, as with the sensor array arrangement / configuration, the communication component may be arranged or formed on or in the carrier film.

[0052] The meaning of the concept "integral component of a structured part" can be derived from the manufacturing methods claimed below, although it is understood that a structured part consisting of one or more attachment means and a sensor array and / or communication component, produced by other manufacturing methods, also falls within this feature, provided that the manufacturing method produces a similar structured composite.

[0053] The communication component may itself be configured to have a memory device and, alternatively or additionally, may itself be configured to have a data processing device.

[0054] As mentioned above, passive elements that do not require connection to an energy supply are particularly suitable as communication components. For example, passive RFID (Radio-Frequency Identification) transponders, especially NFC (Near Field Communication) transponders, or HF (High Frequency) transponders, or UHF (Ultra High Frequency) transponders, are used here. In this case, an external reading device is required for data transmission. In particular, simple construction, easy connectivity, low power consumption, and interoperability are advantageous here. Nevertheless, the method and connection system according to the present invention can be implemented using active or semi-passive communication components. This includes active and semi-passive RFID transponders as well as devices using technologies such as Bluetooth, infrared communication, Wi-Fi, mobile radio, ZigBee, or LoRaWAN (Long Range Wide Area Network).

[0055] In an application embodiment, the connection system comprises at least two, preferably three or more, communication components. For example, a plurality of RFID transponders with sensor elements can be arranged on the attachment means in the form of a matrix, in which case the signal of a particular transponder can be used to determine the position. Alternatively, the sensor array can be formed by the RFID transponder itself. In this case, the RFID transponder does not have separate sensor elements, but provides both the sensor array and the communication components. For example, by using a reading device arranged on the corresponding attachment means of the connection system, it is possible to obtain information about the relative positions of the attachment means with respect to each other by determining which RFID transponder responds to an inquiry by the reading device.

[0056] In a preferred application, the connection system is combined with a functional element as a set. The functional element may in particular be a mobile wireless router, preferably a 5G router. The functional element may here preferably be arranged on one of the attachment means. If the functional element is a mobile wireless router, it may optionally be configured to operate independently of the sensor array and / or communication components of the connection system, or to read or receive and forward data from the sensor array. A functional element can also be understood as any attachment object that independently determines the state of the connected attachment connection. In particular, further network components (e.g., repeaters) or further electronic components (displays, LED films) are considered as functional elements.

[0057] The object is also achieved by a method for manufacturing a connection system, in which a sensor array is integrated into or arranged on a first and / or second attachment means by weaving or embedding, in particular by embedding in a cavity, or by surface bonding.

[0058] An alternative or further method step includes integrating / positioning a communication component in or on the first and / or second attachment means by weaving, embedding, in particular embedding in a cavity, surface bonding, printing or vapor deposition.

[0059] These two method steps do not necessarily have to be performed one after the other. It is also conceivable, for example, to embed the sensor array and the communication component simultaneously in one and the same cavity. Furthermore, it is also possible to realize the manufacturing method via only one of these method steps, in which case the other method step may be considered optional. The connection system here may be configured as described above and / or in the description of the figures.

[0060] A particularly advantageous implementation of the manufacturing method can be achieved by using a continuous sensor film and / or a continuous communication component-carrying film, in which case the respective sensors or communication elements are arranged or formed on or in the film, particularly at regular intervals. This allows the connection system to be completed in a continuous process. For example, one of the attachment means can be unwound from a roll (or directly supplied from its own manufacturing process), an adhesive can be applied in a continuous process, and then the sensor film and / or communication component-carrying film can be applied in a further continuous process. The respective films can also be unwound from a roll, in particular here. A second adhesive layer, in particular, can then be applied to achieve embedding of the respective support film.

[0061] In a similar manner, continuous production can be achieved by partially placing each one of the sensor arrays / communication components (possibly together with a portion of the support film) on the backside of one of the attachment means and then covering it with an adhesive layer.

[0062] Further advantages of the invention will become apparent from the description and drawings. Likewise, the features mentioned above and those described in more detail can be used according to the invention either alone or in any combination. The embodiments shown in the drawings and described in the specification are not to be understood as a definitive enumeration, but rather as exemplary for illustrating the invention. [Brief explanation of the drawings]

[0063] [Figure 1] 1 shows a set of functional elements, here in the form of a mobile wireless router, and a connection system, where the connection system comprises a sensor array with optical sensor elements as well as two communication components. [Figure 2a]10 is a side view, partially in cross section, of a further connection system in a connected state, the connection system including a magnet, a sensor array including a magnetic sensor, and a communication component. FIG. [Figure 2b] 2b is a side view, partly in section, of the connection system of FIG. 2a in a disengaged state; [Figure 3a] 10 is a side view, partially in cross section, of a further connection system in a connected state, the connection system including a magnet, a sensor array including a magnetic sensor, and a communication component. FIG. [Figure 3b] 3b is a side view, partly in section, of the connection system of FIG. 3a in a disengaged state; [Figure 4a] 10A and 10B partially illustrate a further connection system in a disengaged state, the connection system comprising a magnet, a sensor array including a magnetic sensor, and a display. [Figure 4b] 4b shows a partial view of the connection system of FIG. 4a and the corresponding display when connected or proximate in misalignment; FIG. [Figure 4c] FIG. 4C partially illustrates the connection system of FIGS. 4a and 4b and the corresponding display in a connected or proximate state in proper alignment. [Figure 5a] 10 is a side view showing a cross section of a further connection system with a sensor array including a pressure sensor in a connected state and under load in the direction of the connection, and showing the output values ​​of the pressure sensor. FIG. [Figure 5b] 5b is a side view showing a cross section of the connection system of FIG. 5a in a connected state and under load in a direction opposite to the connection direction, and showing the corresponding sensor output values. [Figure 5c] FIG. 6 is a side view showing a cross section of the connection system of FIGS. 5a and 5b in a disengaged state and showing corresponding sensor output values. [Figure 5d] FIG. 5B is a diagram showing a visualization of the output values ​​of FIGS. 5a to 5c. [Figure 6a] 3 shows a flow chart of a development of the method according to the invention; [Figure 6b] 4 is a flow chart showing a further development of the method according to the invention; [Figure 7] 1 is a flowchart illustrating a manufacturing method for a connection system. [Figure 8] 1A and 1B partially show four applications of the first attachment means with a sensor array; [Figure 9] 10A and 10B partially show a further application of the first attachment means with a sensor array; DETAILED DESCRIPTION OF THE INVENTION

[0064] 1 shows a set 1 of a functional element, here in the form of a mobile wireless router 11, and a connection system 10, which in this case comprises a first attachment means 12, which in the frame of the drawing is made up of two pieces, which is arranged by means of a microstructured surface 13 of the first attachment means 12 on a second attachment means 14 (partially shown).

[0065] In this embodiment, the second attachment means 14 is formed by a glass plate. A first optical sensor element 15 and a second optical sensor element 17, each of which captures radiant energy, are embedded in the first attachment means 12. The two optical sensor elements 15 and 17 form a sensor array 16.

[0066] Each optical sensor element 15, 17 is coupled to a respective communication component 18, 19, which in the present example is configured as an RFID transponder with a respective data processing device 20, 21 and a respective antenna 22, 23. Each data processing device 20, 21 here includes a respective memory device 42, 43. In a further development, the control unit 44 is configured to carry out a method 100 according to the invention (see FIG. 6a).

[0067] The mobile wireless router 11 is arranged on the rear side of the first attachment means 12. The mobile wireless router 11 may here be fixed to the first attachment means 12 via any selectable connection mechanism, for example by using an adhesive. Optionally, the mobile wireless router 11 may be configured as a reading device for reading data of the sensor array 16. Likewise, it is also conceivable for the mobile wireless router 11 to operate independently of the communication components 18, 19.

[0068] Within the scope of the illustrated application embodiment, under conditions of adequate ambient lighting by natural and / or artificial light, the state of attachment between the first attachment means 12 and the second attachment means 14 can be derived via a comparison of sensor data from the optical sensor elements 15, 17. In a further application embodiment, the sensor elements 15, 17 can actively emit a light beam and capture data on its reflection.

[0069] 2a and 2b show a further application embodiment of the connection system 10 in a partial and partly cross-sectional side view, respectively. The first attachment means 12 here has, inter alia, a cavity 24 in which a sensor array 16 is embedded. The sensor array 16 is formed by a magnetic sensor 27 in the form of a reed switch. The second attachment means 14 has, inter alia, a permanent magnet 29 (showing magnetic field lines) embedded in a cavity 25 of the second attachment means 14, which is suitable for triggering the magnetic sensor 27 upon proximity / connection between the first and second attachment means 12, 14. In the illustrated embodiment, the adhesive connection can be formed by an adhesive fastener 26, for example via mushroom-shaped heads 31, 33 arranged on the first and second attachment means 12, 14, respectively.

[0070] 2a shows the connection system 10 in a connected state, where the permanent magnet 29 exerts a relatively large influence on the magnetic sensor 27. This causes the contact pieces inside the magnetic sensor 27 to connect with each other, causing the magnetic sensor 27 to generate a corresponding signal.

[0071] 2b shows the connection system 10 in a disengaged state, in which the magnetic sensor 27 is located outside the range of influence of the permanent magnet 29 that it can sense, with the contacts of the magnetic sensor 27 being spaced apart. The sensor data is transmitted to the communication component 18 in the states shown in FIGS. 2a and 2b, respectively. The communication component 18 is configured in the form of an RFID transponder, similar to the application embodiment of FIG. 1. Unlike the sensor array 16, the communication component 18 is not an integrated part of the attachment means 12, 14 in this example.

[0072] 3a and 3b show a further application embodiment of the connection system 10 in partial and partly cross-sectional side views, respectively. The functional scheme of the sensor array 16 and the communication component 18, as well as the basic structure of the connection system 10, correspond here to the application embodiment of FIGS. 2a and 2b. Unlike the previous application, a further form of the adhesive fastener 26 is shown, here in the form of a hook-and-loop fastener. The first attachment means 12 has a loop 36 of the loop tape 35. The second attachment means 14 has a mushroom-shaped head 33 that can be hooked onto the loop 36 of the loop tape 35.

[0073] In Figure 3a, the connection system 10 is again shown in a connected state, whereas Figure 3b depicts a disengaged state.

[0074] 4a, 4b, and 4c each partially illustrate a further application embodiment of the connection system 10. The sensor array 16 includes a plurality of magnetic sensors 37, which are configured as Hall sensors. Reed switches are also possible for the magnetic sensors 27 (see FIGS. 2a to 3b). The sensor array 16 is integrated into the first attachment means 12. The second attachment means 14 includes a permanent magnet 29. One or more communication components 18, 19 (see FIG. 1) are used to transmit raw or processed sensor data. Based on this data, an indication regarding the positioning of the first attachment means 12 relative to the second attachment means 14 is output on the display means 39. It is clear that the connection system 10 in this embodiment is configured such that the proximity of the attachment means 12, 14 is sufficient for outputting the indication; in this case, the formation of an actual adhesive connection is optional for this purpose. Furthermore, it is self-evident that the illustrated display does not necessarily require optical display means 39, but can equally be realized, for example, by acoustically and / or tactilely acting display means 39. It is likewise conceivable that display means 39 is located or formed on connection system 10. Here, wireless transmission of data is not required, and here communication components 18, 19 (see FIG. 1) are not used or are not even present.

[0075] 4a shows the connection system 10 in a disengaged, non-proximity state. Data from the sensor array 16 of the first attachment means 12 is used here to indicate a state, which may include the absence of a signal. The distinction between the non-proximity and proximity states is made based on the capture capability of the permanent magnet 29 by at least one of the magnetic sensors 37.

[0076] 4b shows the attachment means 12, 14 in close proximity or connected to one another, where the relative position of the attachment means 12, 14 does not correspond to the expected configuration. The generated indication then indicates the incorrect configuration as well as the corrective measures to be taken.

[0077] 4c shows the first and second attachment means 12, 14 in proximity or connected state, where their relative position corresponds to the assumed alignment, and the display of the display means 39 indicates the corresponding state.

[0078] 5a, 5b, and 5c show a further application embodiment of the connection system 10 in partial and partly cross-sectional side views, respectively. The sensor array 16 comprises a pressure sensor 41, in particular a bidirectional differential pressure sensor 41. The pressure sensor 41 is depicted in the frame of the figure only diagrammatically as a mechanical element. It is clear that other forms of pressure sensor 41, such as, for example, a piezoresistive element, can also be used. The sensor array 16 is in particular embedded in the cavity 24 of the first attachment means 12. The further components of the connection system 10 correspond to the application embodiment shown in FIGS. 2a and 2b.

[0079] 5a shows the connection system 10 in a connected state, where the first attachment means 12 is loaded with a force F in the direction of the second attachment means 14 (i.e., in the connection direction). The second attachment means 14 is now fixed in position. The force F is applied, for example, manually during the initial connection of the attachment means 12, 14. The pressure sensor 41 of the sensor array 16 captures the effect of the force F on the contact surfaces of the attachment means 12, 14 in the form of a pressure p1.

[0080] In Figure 5b, a force G is acting on the system. The second attachment means 14 is also fixed in position in this figure. The force G can be, for example, gravity acting on the first attachment means 12. Due to the force G, the connection between the first and second attachment means 12, 14 is loaded in the direction opposite to the connection direction, and in this case the pressure sensor 41 captures a value p2.

[0081] In Fig. 5c, the connection between the first attachment means 12 and the second attachment means 14 is or has been released. The pressure sensor 41 records a value p0 in this case, which indicates an intentional or unintentional release of the attachment connection. Using the sensor values, the connection and loaded (or unloaded) states of the connection system 10 can be reliably determined. This can be advantageous both during the intended use of the connection system 10 and in the context of testing and further development of the connection system 10. Preferably, the connection system 10 comprises multiple pressure sensors 41 (not shown).

[0082] In Figure 5d a visualization of the values ​​p1, p0 and p2 of Figures 5a-5c is shown.

[0083] In Figure 6a a flow chart of the application of the method 100 according to the invention in a preferred development is shown. In step A) the first attachment means 12 (see Figure 1) is attached to the second attachment means 14 (see Figure 1). In step B) parameters are acquired by the sensor array 16 (see Figure 1). In step C) transmission of processed or unprocessed sensor data takes place by means of the communication component 18 (see Figure 1).

[0084] 6b shows a flowchart of a further application of the method 100 according to the invention in a further development. In step A), the first attachment means 12 (see FIG. 1) is brought into proximity with the second attachment means 14 (see FIG. 1). In step B), positioning parameters are acquired by the sensor array 16 (see FIG. 1). In particular, the relative positions of the attachment means 12, 14 (see FIG. 1) with respect to one another are acquired in a plane parallel to their surface extension (corresponding to the drawing plane of FIGS. 1, 4a-4c). In step C), processed or unprocessed sensor data are transmitted using the communication component 18 (see FIG. 1). Depending on the content of the sensor data, substeps B) and C) can be performed several times in succession. In step D), the first attachment means 12 (see FIG. 1) is attached to the second attachment means 14 (see FIG. 1). Optionally, step B) can be performed again after step D) to acquire further parameters.

[0085] 7 shows a flowchart of a manufacturing method 200 for the connection system 10 (see FIG. 1). Step I involves, for example, integrating a sensor array 16 (see FIG. 1) into the first attachment means 12 (see FIG. 1). Step II involves, for example, integrating a communication component 18 (see FIG. 1) into the first attachment means 12 (see FIG. 1). Alternatively, step II can be performed first, followed by step I, or steps I and II can be performed simultaneously. Alternatively, only one of these steps can be performed.

[0086] 8 shows four applications of the first attachment means 12 of the connection system 10 (see FIG. 1) with the sensor array 16. These four applications differ solely by the attachment elements used to realize the adhesive fastener 26 (see FIG. 2a). Palm-shaped attachment elements 45, hooks 47, adhesive layers 49 as well as half of a push button 51 are shown.

[0087] These four application forms are advantageously produced in step I of the production method 200 (see FIG. 7). The sensor array 16 in this case has strain sensors 53 arranged in a carrier film 55. The carrier film 55 with the strain sensors 53 is arranged on the first attachment means 12 via an adhesive layer 57′. A further adhesive layer 57″ can be used to embed the carrier film 55. It should be clarified here that the adhesive layer 49 is not used to embed the carrier film 55 but rather to form the adhesive connection of the connection system 10 (see FIG. 1). The adhesive layer 49 can in particular be provided with a release liner during production (not shown).

[0088] 9 shows a further application of the first attachment means 12 with a sensor array 16. The first attachment means here comprises a nonwoven fabric 59 with corresponding fibers 61. The sensor array 16 comprises stress sensors 63 arranged in a carrier film 55. The carrier film 55 with the stress sensors 63 is arranged section by section on the rear side of the first attachment means 12 and embedded with an adhesive layer 57''. The illustrated application can also be produced in a continuous manufacturing process, just like the application of FIG. 8.

[0089] In summary, the present invention relates to a method 100 for determining the state of a connection system 10, which generally comprises a first attachment means 12, a second attachment means 14, and a sensor array 16. The method 100 can be used, in particular, to determine the relative position of the attachment means 12, 14 with respect to one another, in which the first attachment means 12 is adjacent to and / or attached to the second attachment means 14, and at least one parameter related to the positioning is captured by the sensor array 16. After alignment of the attachment means 12, 14, a final attachment (or possibly reattachment) can be performed. The method 100 can also be used, in particular, to capture the attachment of the first attachment means 12 to the second attachment means 14 and / or to determine a load or unload on the attachment connection. In a preferred development of the method 100, processed and / or unprocessed sensor data can be transmitted wirelessly using a communication component 18. The invention further relates to a connection system 10 configured to implement the aforementioned method 100 (including possibly developments of said method 100) and to a set 1 comprising the connection system 10 and functional elements, in particular a mobile wireless router 11. The invention also relates to a method 200 for manufacturing the aforementioned connection system 10. [Explanation of symbols]

[0090] 1 set 10 Connected Systems 11 Mobile Wireless Router 12 First attachment means 13 Microstructured surface 14 Second attachment means 15 First optical sensor element 16 Sensor Array 17 Second optical sensor element 18 Communication Components 19 Communication Components 20 Data Processing Device 21 Data processing device 22 Antenna 23 Antenna 24 Cavity 25 Cavity 26 Adhesive fasteners 27 Magnetic sensor (reed switch) 29 Permanent Magnets 31 Mushroom Head 33 Mushroom Head 35 Loop Tape 36 Loops 37 Magnetic sensor (Hall sensor) 39 Display means 41 Pressure Sensor 42 Memory Device 43 Memory Device 44 Control Unit 45 Palm-shaped adhesive element 47 Hook 49 Adhesive layer 51 Push button half 53 Strain Sensor 55 Support film 57' adhesive layer 57'' adhesive layer 59 Nonwoven fabric 61 Fiber 63 Stress Sensor 100 Method for capturing the state of a connected system 200 Method for manufacturing a connection system

Claims

1. A method (100) for state capture of a connection system (10), comprising: The connection system (10) comprises a first attachment means (12) and a second attachment means (14), an attachment connection being formed between the first attachment means (12) and the second attachment means (14), The connection system (10) comprises a sensor array (16); The method (100) comprises: A) bringing said first attachment means (12) into proximity with and / or attached to said second attachment means (14); B) capturing, by means of said sensor array (16), at least one parameter relating to the state of said attachment connection; D) if not already done under step A), attaching said first attachment means (12) to said second attachment means (14); A method (100) comprising:

2. the sensor array (16) has sensor elements (15, 27, 41, 53, 63) for capturing displacement, strain, stress, pressure, radiation energy, molar concentration or magnetic field strength between the first attachment means (12) and the second attachment means (14); The method (100) of claim 1.

3. The sensor array (16) comprises the following sensor elements (15, 27, 41, 53, 63): a) Optical sensor element (15) b) Magnetic sensor (27) c) Pressure sensor (41) d) Stress sensor (53) e) Strain sensor (63) and With said sensor element (15, 27, 41, 53, 63) at least one parameter is acquired, and / or The at least one parameter is: i. Positioning the first attachment means (12); ii. the adhesive strength of said first adhesive means (12), and / or iii. Loading (including unloading) the attachment connection Regarding, The method (100) of claim 1 or 2.

4. The sensor array (16) has two or more identical or different sensor elements (15, 27, 41, 53, 63), and the at least one parameter is acquired using the sensor elements (15, 27, 41, 53, 63). The method (100) of any one of claims 1 to 3.

5. The sensor array (16) data is stored, in whole or in part, at least temporarily in a memory device (42) of the connection system (10); The method (100) of any one of claims 1 to 4.

6. The connection system (10) includes a data processing device (20) in which data from the sensor array (16) is processed. The method (100) of any one of claims 1 to 5.

7. The connection system (10) comprises a communication component (18), and the method (100) comprises a step C) as follows: C) wirelessly transmitting processed or unprocessed data from the sensor array (16) using the communication component (18); The method (100) of any one of claims 1 to 6.

8. A connection system (10) comprising a first attachment means (12), a second attachment means (14), a sensor array (16), and a control unit (44), The connection system (10) is configured to implement the method (100) according to any one of claims 1 to 4. A connection system (10).

9. The connection system (10) comprises a memory device (42), the connection system (10) being configured to perform the method (100) of claim 5; and / or The connection system (10) comprises a data processing device (20), the connection system (10) being configured to perform the method (100) of claim 6. The connection system (10) of claim 8.

10. the sensor array (16) is disposed or formed on or in the first attachment means (12) and / or on or in the second attachment means (14); A connection system (10) according to claim 8 or 9.

11. a) said first attachment means (12) and / or said second attachment means (14) are part of an adhesive fastener (26), said adhesive fastener (26) comprising: Hook (47), Mushroom-shaped head (31, 33), Palm-shaped adhesive element (45), the fibers (61) and / or loops (36) of a loop tape (35) or a velour band or a woven or nonwoven fabric (59), and / or A push button half (51) b) the first attachment means (12) or the second attachment means (14) have a microstructuring (13) for utilizing intermolecular forces for attachment to smooth surfaces, and / or c) the first attachment means (12) and / or the second attachment means (14) have an adhesive layer (49); A connection system (10) according to any one of claims 8 to 10.

12. The connection system (10) comprises at least one communication component (18), the connection system (10) being configured to perform the method (100) of claim 7. A connection system (10) according to any one of claims 8 to 11.

13. the at least one communication component (18) is disposed or formed on or within the first attachment means (12) and / or on or within the second attachment means (14), The connection system (10) of claim 12.

14. the at least one communication component (18) is a passive element with no inherent energy source, and wireless transmission of data from the sensor array (16) can be triggered using a reading device; A connection system (10) according to claim 12 or 13.

15. A set (1) comprising a connection system (10) according to any one of claims 8 to 14 and a functional element, in particular a mobile wireless router (11), the functional element is arranged on the first or second attachment means (12, 14) of the connection system (10), Set (1).

16. A method (200) for manufacturing a connection system (10), said method (200) comprising: I. Integrating a sensor array (16) into or onto the first attachment means (12) and / or the second attachment means (14) by weaving, embedding, in particular embedding in a cavity (24) or surface bonding, said connection system (10) being formed according to any one of claims 8 to 14; II. Integrating a communication component (18) into or on the first and / or second attachment means (12) by weaving, embedding, in particular embedding in a cavity (24), or by surface bonding, or by printing, or by vapor deposition, wherein the connection system (10) is formed according to any one of claims 12 to 14; A method (200) comprising at least one of the steps:

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