Three dimensional heat exchanger molded structure

Abstract

To provide a three dimensional heat exchanger molding structure.SOLUTION: The three dimensional heat exchanger forming structure includes a first plate 1, a pipe body 2, and a second plate 3. The first plate 1 is provided with a mounting hole 12 passing through the inner surface and the outer surface 11. The pipe body 2 has a closed end 21 and an open end respectively located at two ends of the pipe section 20, the closed end 21 of the pipe body 2 penetrates into the mounting hole 12 from the inner surface of the first plate 1, and the closed end 21 protrudes out of the outer surface 11 of the first plate 1 from the mounting hole 12. The second plate 3 seals against the inner surface of the first plate 1. The open end of the pipe body 2 is close to the inner surface of the first plate 1 from the expansion board 22a, and is pressed toward the inner surface of the first plate 1 to overlap with the inner surface of the first plate 1, and the inner surface of the first plate 1 and the inside of the pipe portion 20 of the pipe body 2 jointly form an upper capillary structure.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a heat exchanger, and more particularly to a three-dimensional heat exchanger molding structure. [Background technology]

[0002] Conventional three-dimensional radiators or heat exchangers are mainly constructed by connecting multiple heat pipes to a vapor chamber. To connect the vapor chamber to the inside of each heat pipe, an opening is formed at one end of the heat pipe and then welded to the upper plate of the vapor chamber, forming a vacuum chamber within the vapor chamber and the heat pipe, and the heat transfer effect is achieved by a joint gas-liquid phase change between the two vacuum chambers. Summary of the Invention [Problem to be solved by the invention]

[0003] However, in conventional three-dimensional radiators and heat exchangers, the heat pipe is welded to the upper plate of the vapor chamber to connect the internal capillary structure, and then a powder sintered structure is filled in the capillary junction between the vapor chamber and the heat pipe, allowing the liquid working fluid to be transported by the capillary structure when it circulates. However, this method affects the transport effect of the capillary structure because the capillary structure is not actually connected continuously.

[0004] Therefore, the present inventors believed that the above drawbacks could be improved, and as a result of extensive research, they came up with the proposal of the present invention, which effectively improves the above problems through rational design.

[0005] The present invention has been made through intensive research by the inventors in view of the above problems, and a main object of the present invention is to provide a three-dimensional heat exchanger molding structure. [Means for solving the problem]

[0006] To achieve the above object, one embodiment of the present invention provides a three-dimensional heat exchanger molded structure comprising a first plate, at least one pipe body, and a second plate. The first plate has inner and outer surfaces and is provided with at least one mounting hole penetrating the inner and outer surfaces. The pipe bodies are installed to correspond to the mounting holes, each having a pipe section and a sealed end and an open end located at both ends of the pipe section, with each pipe section of the pipe body having a sealed end inserted into the mounting hole from the inner surface of the first plate and a sealed end protruding from the mounting hole to the outside of the first plate. The second plate is sealed against the inner surface of the first plate. The open ends of each pipe body are adjacent to the inner surface of the first plate through an expansion board and are pressed against the inner surface of the first plate, so that the inner surface of the first plate and the pipe sections of the pipe body jointly form an upper capillary structure.

[0007] At least the following points will become clear from the description and drawings to be described later. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is an exploded perspective view showing a three-dimensional heat exchanger molding structure according to an embodiment of the present invention. [Figure 2] 1 is a schematic diagram showing the steps of the process for manufacturing a three-dimensional heat exchanger molding structure according to an embodiment of the present invention (1); FIG. [Figure 3] 2 is a schematic diagram showing the process steps of a three-dimensional heat exchanger molding structure according to an embodiment of the present invention; FIG. [Figure 4] 1 is a schematic diagram showing the steps of the process for producing a three-dimensional heat exchanger molding structure according to an embodiment of the present invention (III). [Figure 5] 4 is a schematic diagram showing the steps of the process for the three-dimensional heat exchanger molding structure according to one embodiment of the present invention. [Figure 6] 5 is a schematic diagram showing the steps of the process for the three-dimensional heat exchanger molding structure according to one embodiment of the present invention (FIG. 5). [Figure 7] FIG. 6 is a schematic diagram showing the steps of the process for the three-dimensional heat exchanger molding structure according to one embodiment of the present invention. [Figure 8] 1 is a partial cross-sectional view showing a three-dimensional heat exchanger molding structure according to an embodiment of the present invention. [Figure 9] 1 is an assembled perspective view showing a three-dimensional heat exchanger molding structure according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. Note that the present disclosure is not limited to the following embodiments and may take various forms as long as they fall within the technical scope of the present disclosure.

[0010] Fig. 1 is an exploded perspective view showing a three-dimensional heat exchanger molding structure according to one embodiment of the present invention. Fig. 9 is an assembled perspective view showing a three-dimensional heat exchanger molding structure according to one embodiment of the present invention. The three-dimensional heat exchanger molding structure according to the present invention comprises a first plate 1, at least one pipe body 2, and a second plate 3. The configuration of each member will be described below.

[0011] 1 and 2, the first plate 1 is a plate-like body having an inner surface 10 and an outer surface 11, and the first plate 1 is provided with at least one mounting hole 12 penetrating the inner surface 10 and the outer surface 11. Furthermore, a hole edge 120 is protruded from the periphery of the mounting hole 12, and the hole edge 120 protrudes from the outer surface 11.

[0012] As described above, the pipe body 2 is installed corresponding to the mounting hole 12, and has a pipe section 20, and a sealed end 21 and an open end 22 formed at both ends of the pipe section 20, respectively. As shown in Figures 2 and 3, the open end 22 is first manufactured as an extension board 22a, and the extension board 22a has a horn shape. When the pipe body 2 is inserted into the mounting hole 12 from the inner surface 10 of the first plate 1 by the sealed end 21, the sealed end 21 of the pipe body 2 protrudes out of the mounting hole 12 beyond the outer surface 11 of the first plate 1, and the extension board 22a is close to the inner surface 10 of the first plate 1.

[0013] As shown in Figures 3 and 4, a stamping or pressing process (not shown) is used to apply pressure (as indicated by the arrow in Figure 3) to the expansion board 22a toward the inner surface 10 of the first plate 1, compressing the expansion board 22a so that it is superimposed on the inner surface 10 of the first plate 1. Furthermore, as shown in Figure 4, a weldless process such as laser welding or diffusion bonding is performed from the open end 22 toward the inner surface 10, joining the open end 22 and the inner surface 10 of the first plate 1 by laser welding or diffusion bonding. The pipe body 2 is pre-welded to the mounting hole 12, preventing welding marks from remaining on the outer surface 11 of the first plate 1 and affecting the appearance. The gap between the pipe portion 20 of the pipe body 2 and the hole edge 120 is further sealed by welding or other methods.

[0014] Next, as shown in FIG. 5, the inner surface 10 of the first plate 1 and the inside of the pipe section 20 of the pipe body 2 jointly form an upper capillary structure 4. The upper capillary structure 4 includes plate capillary sections 40 coated on the inner surface 10 of the first plate 1 and tube capillary sections 41 coated inside the pipe section 20, and the plate capillary sections 40 and tube capillary sections 41 are interconnected and integrated with the expansion board 22a. Specifically, the upper capillary structure 4 is formed by powder sintering, etching, deep-drawing groove molding, or laying a woven mesh. Thus, the plate capillary sections 40 and tube capillary sections 41 integrally form the upper capillary structure 4 in the above-mentioned manner. In this manner, the plate capillary sections 40 of the first plate 1 and the tube capillary sections 41 in the pipe body 2 maintain continuous capillary transport without interruption.

[0015] 6 and 7, the second plate 3 and the first plate 1 are sealed, and processes such as degassing and vacuuming are carried out simultaneously. Furthermore, a recess 30 is preliminarily formed in the second plate 3, and the inner surface 10 of the first plate 1 is sealed toward the recess 30, thereby forming a hollow between the first plate 1 and the second plate 3. A lower capillary structure 31 is provided on the inner wall of the recess 30, and the portion of the lower capillary structure 31 adjacent to the first plate 1 contacts the plate capillary portion 40.

[0016] Therefore, the three-dimensional heat exchanger molding structure according to the present invention can be obtained by the above-mentioned structural configuration.

[0017] 8, through the above-mentioned process steps, the present invention provides a three-dimensional heat exchanger in which the capillary structure (i.e., plate capillary portion 40) of the upper plate (i.e., first plate 1) of the vapor chamber and the capillary structure (i.e., tube capillary portion 41) of the heat pipe (i.e., pipe body 2) are formed to maintain continuous capillary transport without interruption. Furthermore, the upper capillary structure 4 further has at least one ring-shaped connecting portion 42, which is covered by each extension board 22a of the pipe body 2 and is connected integrally between the plate capillary portion 40 and the tube capillary portion 41.

[0018] The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present invention. [Explanation of symbols]

[0019] 1. Plate 1 10. Inner Surface 11 Exterior 12 mounting holes 120 Hole Edge 2 Pipe body 20 Pipe section 21 Sealed end 22 Open end 22a Expansion Board 3 Second Plate 30 recess 31 Lower capillary structure 4 Upper capillary structure 40 Plate hair detail 41 Tube Hair Detail 42 Ring-shaped connection

Claims

1. a first plate having an inner surface and an outer surface, the first plate having at least one mounting hole extending through the inner surface and the outer surface; at least one pipe body disposed corresponding to the mounting hole, the pipe body having a pipe portion and a sealed end and an open end located at both ends of the pipe portion, the pipe portion being inserted into the mounting hole from the inner surface of the first plate by the sealed end, and the sealed end protruding from the mounting hole to the outside of the outer surface of the first plate; a second plate sealing against the inner surface of the first plate; the open end of the pipe body is pressed against the inner surface of the first plate by applying pressure from the expansion board toward the inner surface of the first plate, and is placed on the inner surface of the first plate, and the inner surface of the first plate and the inside of the pipe portion of the pipe body jointly form an upper capillary structure.

2. 2. The three-dimensional heat exchanger molding structure according to claim 1, wherein a hole edge is protruded from the periphery of the mounting hole, and the hole edge protrudes from the outer surface.

3. 2. The three-dimensional heat exchanger molding structure according to claim 1, wherein the expansion board has a trumpet shape.

4. The three-dimensional heat exchanger molding structure according to claim 1, wherein the pipe body is further welded to the mounting hole.

5. 5. The three-dimensional heat exchanger molding structure according to claim 1, wherein the open end of the pipe body is welded to the inner surface of the first plate with a non-welding material.

6. The three-dimensional heat exchanger molding structure according to claim 5, wherein the non-welded material is laser-welded or diffusion-bonded.

7. 2. The three-dimensional heat exchanger molding structure according to claim 1, wherein the upper capillary structure comprises plate capillary sections coated on the inner surface of the first plate and tube capillary sections coated within the pipe section, and the plate capillary sections and the tube capillary sections are interconnected and integrated with the expansion board.

8. The three-dimensional heat exchanger molding structure according to claim 7, wherein the upper capillary structure is formed by powder sintering, etching, deep drawing grooves, or laying a woven mesh.

9. The three-dimensional heat exchanger molding structure according to claim 7 or 8, characterized in that the upper capillary structure further has at least one ring-shaped connecting portion, which is covered on each of the extension boards of the pipe body and is connected integrally between the plate capillary portion and the tube capillary portion.

10. The three-dimensional heat exchanger molding structure according to claim 9, wherein the second plate has a recess, and the inner surface of the first plate is sealed toward the recess.

11. The three-dimensional heat exchanger molding structure according to claim 10, characterized in that a lower capillary structure is installed on the inner wall of the recess, and the lower capillary structure is in contact with the capillary portion of the plate at a portion adjacent to the first plate.

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