Capacitor, method of manufacturing the same, and method of mounting the same

Abstract

To provide a capacitor which is improved in vibration resistance without using a conventional pedestal member, and to provide a manufacturing method and a mounting method of the capacitor.SOLUTION: The capacitor includes a capacitor body (4) including a capacitor element (8), an exterior case (14), a sealing body (16), and lead terminals (10, 12) connected to the capacitor element and disposed in through-holes (22, 24) provided in the sealing body, an anti-vibration frame (6) provided on an outer surface of the sealing body and supporting the capacitor body on a wiring board (48), and support terminals (40, 42) protruding from the anti-vibration frame and interposed between the anti-vibration frame (6) and the wiring board (48) to support the capacitor body on the wiring board.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to capacitors, such as aluminum electrolytic capacitors, that are soldered by a flow process or a reflow process, and methods for manufacturing and mounting the same. [Background technology]

[0002] Mounting electronic components such as capacitors on wiring boards can be achieved using either the flow process, in which molten solder is sprayed, or the reflow process, in which cream solder is melted and connected using heat. In the flow process, after temporarily attaching an electronic component such as a capacitor to the wiring board, a primary jet of molten solder is applied to the conductor pattern side of the wiring board, and then a secondary jet of molten solder is applied in stages from this primary jet. After this secondary jet, a solder fillet is formed on the leads of the capacitor, etc. In the reflow process, an electronic component such as a capacitor is placed on the wiring board with cream solder between them, and the wiring board is then placed in a reflow oven. As heating progresses in the reflow oven, the flux evaporates from the cream solder, melting it, and the liquefied cream solder seeps in, forming a soldered bond between the electronic component and the conductor pattern on the wiring board.

[0003] A known capacitor has a structure in which lead wires pass through a sealing body, an auxiliary member is provided on the outer surface of the sealing body, and an auxiliary terminal provided on this auxiliary member is fitted into the sealing body (for example, Patent Document 1).

[0004] It is known that an electrolytic capacitor has a molded resin layer that covers a part of a case that houses a capacitor element and a sealing material thereof, and a pair of leads that are drawn out from the sealing material are disposed on the molded resin layer (for example, Patent Document 2). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-213137 [Patent Document 2] Japanese Patent Publication No. 2023-002812 Summary of the Invention [Problem to be solved by the invention]

[0006] Although the use of reflow mounting for capacitors is expanding, the process and equipment management for the two methods, the flow process and the reflow process, are different, and using both processes simultaneously imposes an excessive burden, particularly in the field of car electronics.

[0007] In recent years, there has been a demand for reflow mounting of lead-type aluminum electrolytic capacitors, which were previously mainly mounted using flow processes. Among lead-type aluminum electrolytic capacitors that can be mounted using reflow, aluminum electrolytic capacitors that are compatible with through-hole reflow methods are also becoming popular.

[0008] However, lead-type aluminum electrolytic capacitors require a base member that was not previously provided, and the use of conventional base members increases the manufacturing process and the burden of base materials, increasing product costs.

[0009] While this problem can be solved by removing the base member, the removal of the auxiliary terminals provided on the base member results in a loss of support for the mounting portion of the wiring board by the auxiliary terminals, which reduces the vibration resistance of the capacitor mounted on the wiring board, making it impossible to satisfy the vibration resistance required in the field of car electronics in particular.

[0010] Therefore, an object of the present disclosure is to provide a capacitor with improved vibration resistance without using a conventional base member, as well as a manufacturing method and mounting method thereof. [Means for solving the problem]

[0011] In order to achieve the above object, according to one aspect of the capacitor of the present disclosure, the capacitor includes a capacitor element, an outer case that houses the capacitor element, a sealing body that seals the outer case, a capacitor body that includes a lead terminal that is connected to the capacitor element and that is arranged in a through hole provided in the sealing body, a vibration-resistant frame that is installed on the outer surface of the sealing body and that supports the capacitor body on a wiring board, and a support terminal that protrudes from the vibration-resistant frame and is interposed between the vibration-resistant frame and the wiring board to support the capacitor body on the wiring board, the support terminal having a bent portion.

[0012] In this capacitor, the support terminal may be disposed at an angle in the range of 45° to 135° with respect to the lead terminal with respect to the central axis of the capacitor body.

[0013] The capacitor may further include a fitting portion for fitting the vibration-resistant frame and the sealing body together.

[0014] In this capacitor, the vibration-resistant frame may be held between an opening edge of the exterior case and an outer surface of the sealing body.

[0015] In order to achieve the above object, according to one aspect of the method for manufacturing a capacitor disclosed herein, the method includes the steps of forming a capacitor body including a capacitor element, an outer case that houses the capacitor element, a sealing body that seals the outer case, and a lead terminal that is connected to the capacitor element and is disposed in a through hole provided in the sealing body; forming a vibration-resistant frame that is installed on the outer surface of the sealing body and supports the capacitor body on a wiring board; forming support terminals that protrude from the vibration-resistant frame and are interposed between the vibration-resistant frame and the wiring board to support the capacitor body on the wiring board; and forming bent portions in the support terminals.

[0016] This method of manufacturing a capacitor may include a step of forming bent portions in support terminals of the vibration-resistant frame after the step of placing the vibration-resistant frame on the outer surface of the sealing body.

[0017] In order to achieve the above object, according to one aspect of a capacitor mounting method of the present disclosure, the method includes: a capacitor element; an exterior case that houses the capacitor element; a sealing body that seals the exterior case; a capacitor body that includes a lead terminal connected to the capacitor element and arranged in a through hole provided in the sealing body; a vibration-resistant frame that is installed on the outer surface of the sealing body and supports the capacitor body on a wiring board; support terminals that protrude from the vibration-resistant frame and are interposed between the vibration-resistant frame and the wiring board to support the capacitor body on the wiring board; and bent portions provided on the support terminals, and includes the steps of: arranging the lead terminals in through holes in a mounting portion of the wiring board; and supporting the capacitor body on the wiring board by the support terminals. [Effects of the Invention]

[0018] According to the present disclosure, any of the following effects can be obtained. (1) The support terminals protruding from the vibration-resistant frame fixed to the outer surface of the sealing plate of the capacitor body can be brought into contact with the wiring board, thereby supporting the capacitor body on the wiring board, thereby improving the vibration resistance of the capacitor.

[0019] (2) The bent portion of the support terminal can be abutted against the wiring board to support the capacitor body, stabilizing the capacitor that is temporarily attached to the wiring board before reflow, and improving the reliability of the solder connection, including reflow.

[0020] (3) Since the positions of the lead-out terminals connected to the wiring board and the positions of the support terminals are different, the support area for the wiring board can be enlarged.

[0021] (4) In addition to the connection of the lead terminals to the wiring board, the support strength of the support terminals can be increased, thereby enhancing vibration resistance.

[0022] (5) A thermal buffer section that buffers heat transfer is formed between the capacitor body and the wiring board according to the height of the support terminal, which not only improves the heat transfer of the lead-out terminal but also reduces the heat transfer from the wiring board to the capacitor body, preventing the temperature of the capacitor body from rising. [Brief explanation of the drawings]

[0023] [Figure 1] FIG. 1 is an exploded perspective view illustrating a capacitor and a method for manufacturing the same according to the present disclosure. [Figure 2] 2A is a cross-sectional view showing a capacitor according to the present disclosure and a mounted state according to a mounting method thereof, and FIG. 2B is a cross-sectional view showing Comparative Example 1. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0024] <Capacitor and its manufacturing method> Fig. 1 shows a capacitor and a method for manufacturing the same according to one embodiment of the present disclosure. The configuration shown in Fig. 1 is an example, and the capacitor and the method for manufacturing the same according to the present disclosure are not limited to this configuration.

[0025] <Capacitor 2> The capacitor 2 is an example of a capacitor according to the present disclosure, such as an aluminum electrolytic capacitor. As shown in FIG.

[0026] <Capacitor body 4> The capacitor body 4 includes a capacitor element 8, a lead terminal 10 (anode side), a lead terminal 12 (cathode side), an outer case 14, a sealing body 16, and the like.

[0027] <Capacitor element 8> The capacitor element 8 includes an anode foil, a cathode foil, and a separator, with an electrolyte layer formed between the anode and cathode foils. The anode foil is made of a valve metal base foil, which is subjected to a surface-expansion process to form a dielectric oxide film. Valve metals include aluminum, tantalum, niobium, titanium, hafnium, zirconium, zinc, tungsten, bismuth, and antimony, and the base foil is formed from any of these metals. The surface-expansion process for the base foil expands the surface of the base foil, forming a surface-expansion layer on the base foil by etching, sputtering, or other methods. Etching is performed, for example, by immersing the base foil in an acidic aqueous solution containing halogen ions, such as hydrochloric acid, and passing a direct current (DC etching), an alternating current (AC etching), or both (AC / DC etching). This creates a porous surface-expansion layer in the base foil, such as a concave-convex, tunnel-shaped pore, or spongy pore. This surface-expansion layer may contain countless pits as well as pores that penetrate the base foil (such as through-pits). To increase the capacitance of the capacitor element 8, advanced etching is performed. As another surface-expanding process, instead of etching, metal particles may be vapor-deposited or sintered onto the substrate foil, or metal particles may be vapor-deposited or sintered onto the etched substrate foil to form a surface-expanding layer on the substrate foil. After this surface-expanding process, a dielectric oxide film is formed on the surface of the surface-expanding layer of the substrate foil by chemical conversion treatment, thereby forming the anode foil.

[0028] The cathode foil, like the anode foil, is a base foil made of a valve metal as described above, and may be subjected to a surface expansion treatment. The base foil is formed from a material selected from the valve metals described above. The surface expansion treatment of the base foil is preferably performed using etching, sputtering, metal particle deposition, sintering, or the like. An oxide film is formed on the surface expansion layer of the cathode foil. This oxide film may be formed intentionally or naturally (a natural oxide film). The oxide film is a thin oxide film formed by chemical conversion treatment in which a voltage is applied in a solution free of halogen ions, such as an aqueous solution of adipic acid or boric acid. A natural oxide film is a thin oxide film formed when the base foil is exposed to air and reacts with oxygen.

[0029] The cathode foil may have a conductive layer formed on the substrate foil. The conductive layer is laminated on the substrate foil. The conductive layer is preferably formed of an inorganic material having electrical conductivity, such as titanium, zirconium, tantalum, niobium, their nitrides or carbides, aluminum carbide, carbon material, and composites or mixtures thereof. Specific examples include a conductive layer of a carbon material, a conductive layer of titanium nitride, a conductive layer of titanium carbide, a conductive layer made of a mixture of titanium and a carbon material, and a conductive layer made of a composite of aluminum carbide (Al4C3) and titanium oxide (TiO2).

[0030] The conductive layer containing the carbon material is composed of a carbon material as the main material and additives such as binders and dispersants. Examples of carbon materials that can be used include activated carbon, carbon black, carbon nanohorns, amorphous carbon, natural graphite, artificial graphite, graphitized ketjen black, mesoporous carbon, and fibrous carbon. Activated carbon can be derived from natural plant tissues such as coconut husks, synthetic resins such as phenols, or fossil fuels such as coal, coke, or pitch. Examples of carbon black include ketjen black, acetylene black, channel black, and thermal black. Examples of fibrous carbon include carbon nanotubes and carbon nanofibers. Carbon nanotubes can be single-walled carbon nanotubes, which have a single graphene sheet, or multi-walled carbon nanotubes (MWCNTs), which have two or more graphene sheets curled coaxially to form multiple tube walls. The binder may be a resin binder such as styrene butadiene rubber, polyvinylidene fluoride, or polytetrafluoroethylene, and is bonded to the carbon material. The dispersing agent may be, for example, sodium carboxymethyl cellulose.

[0031] The separators are disposed adjacent to the anode foil on both the front and back sides, and each separator is made of an insulating material (insulating paper) with the same physical properties. This insulating paper may contain other separator materials (hereinafter simply referred to as "separator materials"), such as kraft, Manila hemp, esparto, hemp, rayon, cellulose, mixtures thereof, cotton linter, and non-wood pulp. The separator is preferably made of an insulating material primarily made of natural fibers, such as kraft, Manila hemp, esparto, hemp, cellulose, or mixtures thereof. In other words, a separator material containing natural fibers is preferred. The width of each separator is set larger than the width of the anode foil and the cathode foil, thereby ensuring insulation between the anode foil and the cathode foil.

[0032] The anode foil and cathode foil are then rolled into a cylindrical shape with separators placed on the front and back sides of the anode foil to form capacitor element 8. This capacitor element 8 is impregnated with an electrolytic solution or a solid electrolyte containing a conductive polymer is formed to form an electrolyte layer. The main solvent for the electrolytic solution is, for example, ethylene glycol, γ-butyrolactone, sulfolane, or the like. The electrolyte layer may be a gel electrolyte, or may be a so-called hybrid electrolyte that includes both an electrolytic solution and a solid electrolyte containing a conductive polymer.

[0033] <Pull-out terminals 10 and 12> Lead terminals 10 and 12 are lead terminals of the present disclosure, with lead terminal 10 being an anode terminal connected to an anode foil and lead terminal 12 being a cathode terminal connected to a cathode foil. Each lead terminal 10, 12 has a columnar portion 18, which is flattened on the capacitor element 8 side and electrically connected to the anode foil or cathode foil by a connection method such as stitch connection. A lead wire 20 made of a solderable metal wire is welded to each columnar portion 18. Of the lead wires 20, the lead wire 20 of lead terminal 10 is longer than the lead wire 20 of lead terminal 12, making it easy to distinguish the polarity based on the length of the lead wire 20.

[0034] <Outer case 14> The exterior case 14 is an example of an exterior case of the present disclosure, and is a cylindrical container with a bottom made of a valve metal material, such as aluminum, like the anode foil and cathode foil of the capacitor element 8. Although not shown, the bottom is equipped with a safety valve to prevent the capacitor body 4 from bursting due to gas generated inside the capacitor body 4. The exterior case 14 shown in FIG. 1 shows the state before crimping and curling. After the sealing body 16 is inserted into the exterior case 14, it is crimped, and the open end is curled by sandwiching the annular portion 34 of the vibration-resistant frame 6 against the outer surface of the sealing body 16.

[0035] <Sealing body 16> Sealing body 16 is an example of a sealing body of the present disclosure and is a cylindrical body made of an elastic insulator such as rubber. Through holes 22, 24 are formed in sealing body 16 for installing lead-out terminals 10, 12. A plurality of, for example, four sector-shaped protrusions 26 are formed at regular intervals on the outer surface of sealing body 16, and a vibration-resistant frame installation portion 28 is formed around each sector-shaped protrusion 26. In this embodiment, vibration-resistant frame installation portion 28 forms a flat surface portion.

[0036] A fitting recess 32 for a fitting portion 30 that fits with the vibration-resistant frame 6 is formed on the peripheral wall of each sector-shaped protrusion 26 .

[0037] <Vibration-resistant frame 6> The vibration-resistant frame 6 is an example of a frame member of the present disclosure. The vibration-resistant frame 6 is formed, for example, from stainless steel, aluminum alloy, iron, copper alloy, titanium alloy, nickel alloy, magnesium alloy, ceramics, etc. The vibration-resistant frame 6 is an annular portion 34 concentric with the sealing body 16, and is disposed on the vibration-resistant frame mounting portion 28 on the outer surface of the sealing body 16.

[0038] The annular portion 34 has a pair of protrusions 36, 38 that protrude from the inner edge toward the center, and support terminals 40, 42, which are an example of support posts formed orthogonally from the annular portion 34, protrude from each of the protrusions 36, 38. The support terminal 40 is disposed at an angle ranging from 45° to 135° with respect to the lead terminal 10 relative to the central axis O of the capacitor body 4. Similarly, the support terminal 42 is disposed at an angle ranging from 45° to 135° with respect to the lead terminal 12 relative to the central axis O of the capacitor body 4. In this embodiment, each of the support terminals 40, 42 is disposed on an imaginary line 43b that intersects with the imaginary line 43a at the central axis O, but either of the support terminals 40, 42 may be disposed at a position deviated from the imaginary line 43b.

[0039] Each of the support terminals 40, 42 has a curved portion 41 formed in the middle thereof to form a bent portion 44. The bent portions 44 are formed by bending the support terminals 40, 42 in opposite directions from the middle thereof, and are parallel to the annular portion 34. In other words, each of the support terminals 40, 42 is molded together with the annular portion 34 using, for example, a highly rigid metal material, and integrally includes the protrusion 36, the curved portion 41, and the bent portion 44.

[0040] A plurality of mating protrusions 45 are formed at intervals of, for example, 90 degrees on the inner edge of the annular portion 34 to fit into the mating recesses 32 of the sectorial protrusion 26. In other words, the mating recesses 32 and the mating protrusions 45 form the mating portion 30. Therefore, by utilizing the elasticity of the sectorial protrusion 26, the vibration-resistant frame 6 is positioned and temporarily fixed to the sealing body 16 by fitting the mating recesses 32 and the mating protrusions 45 together.

[0041] <Shape of bent portion 44 and vibration resistance of capacitor 2> (1) Contact area of ​​the bent portion 44 The bent portion 44 is a contact portion that is placed on a mounting portion 56 of a wiring board 48 (described later) and comes into contact with the mounting portion 56. If the width of the bent portion 44 is a and the length is b, the contact area Q [m 2 ] can be expressed by the formula (1), and in this embodiment, since the contact area is formed on each of the pair of support terminals 40, 42, the total contact area Qm [m 2 ] can be expressed by equation (2). Q=a×b〔m 2 ) (1) Qm = Q × 2 = (a × b) × 2 [m 2 ) (2) The stability of the capacitor body 4 relative to the wiring board 48 can be increased in proportion to the total contact area Qm, thereby improving the vibration resistance of the capacitor 2.

[0042] In this embodiment, each bend 44 is arranged in a straight line along the imaginary line 43b, and together with the soldering of the lead-out terminals 10, 12 arranged in a direction intersecting each bend 44, the vibration resistance of the capacitor body 4 on the wiring board 48 is improved.

[0043] (2) Width a and length b of the bent portion 44 The width a of the bent portion 44 may be the same as that of the protruding portion 36 and the intermediate portion of the support terminals 40, 42, or may be wider than these. The length b may be extended to a length exceeding the diameter of the annular portion 34. This configuration not only increases the contact area Q with the mounting portion 56 (A in FIG. 2) of the wiring board 48 and the total contact area Qm, but also increases the resistance to moments applied in a direction perpendicular to the central axis O of the capacitor body 4, thereby improving vibration resistance.

[0044] (3) The distance W between the support terminals 40 and 42 or the distance W between the bent portions 44 Increasing the distance between the support terminals 40, 42 or the distance W between the bent portions 44 can increase the resistance to moments applied in a direction perpendicular to the central axis O of the capacitor body 4, and similarly improve vibration resistance.

[0045] <Method of manufacturing capacitor 2> This method of manufacturing capacitor 2 is an example of a method of manufacturing a capacitor according to the present disclosure, and includes the steps of forming vibration-resistant frame 6, forming capacitor body 4, and processing bent portion 44.

[0046] Forming process of vibration-resistant frame 6: For the vibration-resistant frame 6, a highly rigid material such as stainless steel, aluminum alloy, iron, high-carbon steel, copper alloy, titanium alloy, nickel alloy, magnesium alloy, or ceramic is used, and by molding this material, the vibration-resistant frame 6 having the above-described three-dimensional shape is formed. Note that the bent portion 44 may be processed after the vibration-resistant frame 6 is attached to the capacitor body 4.

[0047] Capacitor body 4 formation process: This capacitor body 4 formation process includes an anode foil formation process, a cathode foil formation process, a separator formation process, attachment of lead terminals 10, 12, winding of capacitor element 8, electrolyte formation process, combining of capacitor element 8 and sealing body 16, installation of capacitor element 8 housing / sealing body 16 and crimping of outer case 14, processing of bent portion 44, curling of outer case 14, aging process, etc.

[0048] As described above, in the anode foil formation process, a surface-expanding layer is formed on the base foil by surface-expanding treatment, a dielectric oxide film is formed on this surface-expanding layer, and the anode foil is cut to the required dimensions to meet the specifications of capacitor element 8. Also, as described above, in the cathode foil formation process, a surface-expanding layer is formed on the base foil by surface-expanding treatment such as etching, and an oxide film is formed as needed on the cathode foil including this surface-expanding layer, and the cathode foil is cut to the required dimensions to meet the specifications of capacitor element 8.

[0049] This formation process is necessary when using a cathode foil with a conductive layer containing a carbon material. A slurry is required to form the conductive layer containing a carbon material. This slurry is formed, for example, by adding the aforementioned carbon material, binder, and dispersant to a dilution liquid and mixing them using a dispersion process such as a mixer, jet mixing (jet collision), ultracentrifugation, or ultrasonic treatment. Examples of dilution liquids include alcohols, hydrocarbon solvents, aromatic solvents, amide solvents, water, and mixtures thereof. Examples of alcohols include methanol, ethanol, and 2-propanol. Examples of amide solvents include N-methyl-2-pyrrolidone (NMP) and N,N-dimethylformamide (DMF). In the carbon foil formation process, a slurry is applied to a substrate foil, and the solvent is evaporated from the slurry to form a carbon layer on the substrate foil. By pressing the substrate foil together with this carbon layer, the carbon material is forced into the pores of the surface-expanding layer of the substrate foil or deformed along the surface-expanding layer. This improves the adhesion between the substrate foil and the carbon layer, and enhances the fixation of the carbon layer to the substrate foil.

[0050] In the separator formation process, a separator material is selected from existing separator materials and cut into a shape that meets the specifications of capacitor element 8.

[0051] In the process of attaching the lead terminals 10 and 12, the flat portion of the lead terminal 10 is attached to the anode foil, and the flat portion of the lead terminal 12 is attached to the cathode foil by a process such as stitching, ultrasonic welding, cold welding, or laser welding, and the anode foil and lead terminal 10 and the cathode foil and lead terminal 12 are electrically connected before the capacitor element 8 is wound.

[0052] In the winding process of capacitor element 8, the cathode foil is layered on the front and back sides of the anode foil with separators interposed between them, and the resulting product is wound into a cylindrical shape. The winding core is formed of one or both of the separators, or both the cathode foil and the separator. Either the separator or the separator may be wrapped around the outer periphery of the wound capacitor element 8.

[0053] In the electrolyte formation step, the capacitor element 8 is impregnated with an electrolyte solution or a solid electrolyte is formed. As described above, the electrolyte solution may be one whose main solvent is, for example, ethylene glycol, γ-butyrolactone, or sulfolane. The solid electrolyte may be, for example, a conductive polymer obtained by polymerizing thiophene or a derivative thereof and doping it with a dopant. Other examples of electrolytes that may be used include gel electrolytes and hybrid electrolytes that include an electrolyte solution and a solid electrolyte containing a conductive polymer.

[0054] In the process of combining the capacitor element 8, sealing body 16, and vibration-resistant frame 6, the lead-out terminals 10, 12 protruding from the end faces of the capacitor element 8 are installed in the through holes 22, 24 of the sealing body 16. At this time, the sealing body 16 to which the vibration-resistant frame 6 has been temporarily attached may be used, or the vibration-resistant frame 6 may be temporarily attached to the sealing body 16 after the sealing body 16 is attached to the capacitor element 8. In this way, the capacitor element 8, sealing body 16, and vibration-resistant frame 6 are combined.

[0055] In the process of placing capacitor element 8 inside sealing body 16 and crimping outer case 14, capacitor element 8 is placed inside pre-formed cylindrical outer case 14 with a closed bottom, and sealing body 16 is installed. Then, in the process of crimping outer case 14, the peripheral side of sealing body 16 is crimped from the periphery of outer case 14 to seal outer case 14.

[0056] In the curling process for the outer case 14, a curling process is performed on the opening edge of the outer case 14, which has already protruded from the outer surface of the sealing body 16. This curling process includes the process of fixing the vibration-resistant frame 6. This curling process shapes the opening edge of the outer case 14 toward the center of the sealing body 16, and the annular portion 34 of the vibration-resistant frame 6 is gripped between the opening edge of the outer case 14 and the outer surface of the sealing body 16. In other words, the vibration-resistant frame 6 is firmly fixed between the outer surface of the sealing body 16 and the opening edge of the outer case 14 by the curling portion 52.

[0057] Processing step of bent portions 44: The bent portions 44 are formed by bending the middle portions of the support terminals 40, 42 protruding from the vibration-resistant frame 6 installed on the capacitor body 4 in the diameter direction of the capacitor body 4.

[0058] The capacitor body 4 is then aged in an aging process before being manufactured into a product, and the capacitor 2 is completed as a product.

[0059] <Capacitor 2 and Electronic Components 46> 2A shows a partial cross section of an electronic component 46 including a capacitor 2 according to the present disclosure. In FIG. 2, the same parts as in FIG. 1 are denoted by the same reference numerals.

[0060] This electronic component 46 includes a capacitor 2 and a wiring board 48. As described above, the capacitor 2 includes the capacitor body 4 and the vibration-resistant frame 6, and the vibration-resistant frame 6 includes support terminals 40, 42. A crimped portion 50 is formed on the capacitor body 4 by crimping the outer case 14. In addition, a curled portion 52 is formed on the opening edge of the outer case 14 by a curling process, and the vibration-resistant frame 6 is firmly fixed between the outer surface of the sealing body 16 and the opening edge of the outer case 14 by this curled portion 52.

[0061] In this way, a pair of support terminals 40, 42 protrude vertically from the vibration-resistant frame 6 mounted on the outer surface of the sealing body 16 of the capacitor body 4. The support terminals 40, 42 have the same protruding length, and each tip abuts against the mounting portion of the wiring board 48, thereby maintaining the capacitor body 4 horizontally on the mounting portion of the wiring board 48. The protruding length of each support terminal 40, 42 maintains a constant distance between the capacitor body 4 and the wiring board 48, thereby forming a thermal buffer portion 54 between the vibration-resistant frame 6 and the wiring board 48. In other words, the support terminals 40, 42 form the thermal buffer portion 54.

[0062] If the vertical projection area of ​​the capacitor body 4 relative to the mounting section 56 is S and the height of the support terminals 40 and 42 is h, then the volume V [m 3] is given by equation (3). V = h × S [m 3 ) (3)

[0063] If this thermal buffer section 54 is formed between the capacitor body 4 and the wiring board 48, then thermally conductive materials include the annular section 34 of the vibration-resistant frame 6, the opening edge of the exterior case 14 that covers the annular section 34, the support terminals 40 and 42, and the air present in the thermal buffer section 54. These thermally conductive materials and their sizes affect the thermal buffering function of the thermal buffer section 54, and if the main factors are the air, the metal material that makes up the support terminals 40 and 42, and the volume V of the thermal buffer section 54, then these have a significant effect on the thermal buffering function.

[0064] A mounting portion 56 for the capacitor 2 is set on the wiring board 48, and a conductor pattern 58 (60) and a through hole 62 (64) are formed in this mounting portion 56. The conductor pattern 58 and the through hole 62 correspond to the lead-out terminal 10, and the conductor pattern 60 and the through hole 64 correspond to the lead-out terminal 12. Therefore, the lead-out terminals 10 (12) of the capacitor 2 are installed in the through holes 62 (64), and each lead-out terminal 10 (12) is connected to the conductor pattern 58 (60) with solder 66.

[0065] <How to mount capacitor 2> This mounting method is an example of mounting the capacitor 2 on the wiring board 48. This mounting method includes a step of arranging the lead-out terminals 10 and 12, a step of forming the heat buffer portion 54, and the like.

[0066] Arranging the lead terminals 10, 12: The lead terminals 10 (12) are arranged in the through holes 62 (64) in the mounting portion 56 of the wiring board 48, and the capacitor body 4 is erected on the mounting portion 56 of the wiring board 48 and temporarily fixed.

[0067] Step of forming heat buffer section 54: The support terminals 40 (42) are arranged on the mounting section 56 of the wiring board 48, and the heat buffer section 54 is formed between the wiring board 48 and the capacitor body 4.

[0068] Then, the lead terminals 10 (12) are connected to the conductor patterns 58 (60) of the wiring board 48 with solder 66 by a reflow process.

[0069] Each of the support terminals 40 , 42 may be fixed to a wiring board 48 .

[0070] <Effects of the embodiment> According to this embodiment, one of the following effects can be obtained. (1) The support terminals 40, 42 protruding from the vibration-resistant frame 6 fixed to the outer surface of the sealing plate of the capacitor body 4 can be brought into contact with the wiring board 48, thereby supporting the capacitor body 4 on the wiring board 48, thereby improving the vibration resistance of the capacitor 2.

[0071] (2) The bent portions 44 on the support terminals 40, 42 can be abutted against the wiring board 48 to support the capacitor body 4, which stabilizes the capacitor that is temporarily attached to the wiring board before reflow, improving the reliability of the solder connection, such as during reflow.

[0072] (3) The positions of the lead-out terminals 10, 12 connected to the wiring board 48 and the positions of the support terminals 40, 42 are different, so that the support area for the wiring board 48 can be enlarged.

[0073] (4) In addition to the connection of the lead-out terminals 10 and 12 to the wiring board 48, the support strength of the support terminals 40 and 42 can be increased, thereby enhancing the vibration resistance of the capacitor 2.

[0074] (5) A thermal buffer section 54 that buffers heat transfer is formed between the capacitor body 4 and the wiring board 48 in accordance with the height h of the support terminals 40, 42. This improves the terminal heating properties of the lead-out terminals 10, 12 and reduces heat transfer from the wiring board 48 to the capacitor body 4, preventing the temperature of the capacitor body 4 from rising.

[0075] (6) The heat buffer 54 can suppress the loss of heat due to heat transfer from the wiring board 48 side to the capacitor body 4 side, allowing the conductive patterns 58 (60) of the wiring board 48 and the soldered connection portions of the lead-out terminals 10, 12 to be heated in a concentrated manner.

[0076] <Modification 1 and its effects> In the embodiment and Example 1, a pair of support terminals 40, 42 are provided, but only a single support terminal 40 may be provided, or three or more support terminals 40, 42 may be provided. In this case, by increasing the area of ​​bent portion 44, the installation stability and vibration resistance of capacitor 2 can be improved.

[0077] If three or more support terminals are used, the independence and stability of the capacitor body 4 relative to the mounting portion 56 can be further improved. [Example]

[0078] In this example, Comparative Example 1 (B in FIG. 2) and Example 1 (A in FIG. 2) were used to verify the vibration resistance depending on whether or not the bent portion 44 is present in the support terminals 40, 42. The specifications, volume, heat capacity, etc. of the capacitor body 4 of Comparative Example 1 and Example 1 are the same.

[0079] <Comparative Example 1> As shown in FIG. 2B, the comparative example includes a vibration-resistant frame 6, but only includes support terminals 40 and 42 and no bent portion 44. In this case, U=3.2 mm 2 ], h and φ are the same as in Example 1.

[0080] Example 1 2A, the vibration-resistant frame 6 is provided with support terminals 40, 42 and a bent portion 44. If the area where the end faces of the support terminals 40, 42 or the bent portion 44 are in contact with the wiring board 48 is U, then U=16 [mm 2 ], and the distance (height) between the curling portion 52 and the wiring board 48 is h, and the thickness of the lead wires 20 of the lead-out terminals 10 and 12 is φ, and the thickness is φ=0.8 mm.

[0081] <Vibration Resistance Test of Comparative Example 1 and Example 1> This vibration resistance test was conducted to find the resonance frequency of capacitors 2 according to Example 1 and Comparative Example 1 mounted on wiring board 48.

[0082] For this vibration resistance test, the capacitors 2 according to the above-described Example 1 and Comparative Example 1 were mounted on a wiring board 48 having a length of 6.0 mm, a width of 6.0 mm, and a thickness of 1.6 mm, and used as the experimental subject.

[0083] The experimental conditions were: Measurement frequency: 50~2000 [Hz] Displacement: 1.5 mm Acceleration: 9.81〔m / s 2 〕 and the Y-direction resonance frequency [Hz] and maximum acceleration [m / s 2 The Y-direction resonance frequency (Hz) is the direction in which the support terminals 40 and 42 are aligned, that is, the longitudinal direction of the bent portion 44 in contact with the wiring board 48, for the capacitor 2 shown in FIG. 2. Maximum acceleration (m / s 2 ] was measured from the outer case 14.

[0084] <Measurement Results of Comparative Example 1 and Example 1> Table 1 shows the presence or absence of the support terminals 40, 42 and bent portion 44, the contact area U, and the measurement results for Comparative Example 1 and Example 1.

[0085] [Table 1]

[0086] <Verification of measurement results> As is clear from these measurement results, the maximum acceleration was obtained on the high frequency side, which means that Example 1 has enhanced resistance to repeated stress and that the shift of the resonance frequency to the high frequency side improves vibration resistance.

[0087] This result shows that Example 1 has excellent characteristics due to the presence of the bent portions 44, and that the vibration resistance improves with the number of bent portions 44 and the contact area U.

[0088] Next, as other examples, Comparative Example 2 (not shown), Example 2 (=A in FIG. 2), and Example 3 (=B in FIG. 2) were presented to verify the terminal heating characteristics depending on the presence or absence of the thermal buffer portion 54 and its volume. The specifications such as the volume and heat capacity of the capacitor body 4 used in Comparative Example 2, Example 2, and Example 3 are the same. Comparative Example 2, Example 2, and Example 3 are as follows.

[0089] <Comparative Example 2> Comparative Example 2 is a conventional standard product equipped with a pedestal. In this Comparative Example 2, the distance h between the capacitor body 4 and the wiring board 48 was set to 1 mm. The pedestal was made of polyamide. The thermal conductivity of this polyamide was 0.25 W / (m K), and the thermal resistance (thickness / thermal conductivity) was 4.0 m. 2 ·K / W].

[0090] <Example 2> Example 2 includes a vibration-resistant frame 6, which includes support terminals 40, 42 and a bent portion 44. h (the distance between the capacitor body 4 and the wiring board 48) is set to 4 mm. This h is determined by the protrusion length of the support terminal 40 and is equal to 4 mm.

[0091] The only thermally conductive material present in the thermal buffer section 54 is air. The thermal conductivity of air is 0.0241 [W / (m·K)], and the thermal resistance (thickness / thermal conductivity) is 166 [m 2 ·K / W].

[0092] Example 3 Example 3 includes a vibration-resistant frame 6, which includes support terminals 40, 42 and a bending portion 44. h is set to 2 mm. That is, the thickness of the thermal buffer portion 54 is determined by the height of the support terminals 40, 42, and is equal to h = 2 mm. Therefore, the volume V of the thermal buffer portion 54 is half the volume of the thermal buffer portion 54 of Example 2.

[0093] The thermally conductive material present in the thermal buffer section 54 is only air, as in Example 2. The thermal conductivity of air is 0.0241 [W / (m·K)], and the thermal resistance (thickness / thermal conductivity) is proportional to h=2 [mm]. 2 ·K / W].

[0094] <Thermal resistance R> The thermal resistance R mentioned above was calculated using formula (4) shown in the calculation method based on JIS A 9521:2017.

[0095] R=d / λ (4) where R: thermal resistance [m 2 ·K / W d: Insulation thickness [m] λ: Thermal conductivity [W / (m·K)] The value of this thermal resistance R was calculated using formula (4) in accordance with JIS A 9521:2017, and rounded to one decimal place.

[0096] <Temperature measurement method> The temperature was measured at a location where the lead terminals 10 and 12 of the capacitors 2 according to Comparative Example 2, Example 2, and Example 3 contacted the wiring board 48 at the mounting portion 56 .

[0097] A reflow furnace was used to heat electronic component 46. Wiring board 48 and each of capacitors 2 according to Comparative Example 2, Example 2, and Example 3 placed in this reflow furnace are subjected to heat by the reflow furnace, and the board temperature and terminal temperature rise to a peak temperature T, after which the temperatures decrease after a time equivalent to the time required for the reflow process.

[0098] From the measurement results of Comparative Example 2, Example 2 and Example 3, the peak temperature T1 of Comparative Example 2, the peak temperature T2 of Example 2 and the peak temperature T3 of Example 3 were determined.

[0099] <Temperature measurement results and evaluation> Regarding this temperature measurement, Table 2 shows the specifications of the capacitors 2 according to Comparative Example 2, Example 2 and Example 3, as well as the peak temperature T, temperature difference ΔT and evaluation results of terminal heating.

[0100] [Table 2]

[0101] <Verification of measurement results> (1) When comparing the peak temperature T2 of Example 2 with the peak temperature T1 of Comparative Example 2, the temperature difference ΔT between them is ΔT = T2 - T1 = +4.6 [°C], which is significantly higher than the peak temperature T1 of Comparative Example 2. Therefore, the terminal heating property of Example 2 was improved, and it was judged to be extremely good (=◎).

[0102] (2) When comparing the peak temperature T3 of Example 3 with the peak temperature T1 of Comparative Example 2, the temperature difference ΔT between the two is ΔT = T3 - T1 = +1.6 [°C], which is lower than that of Example 2 but higher than the peak temperature T1 of Comparative Example 2. Therefore, the terminal heating property was also improved in Example 3, and the terminal heating property was judged to be good (=○).

[0103] (3) Comparing the peak temperature T2 of Example 2 with the peak temperature T3 of Example 3, the temperature difference ΔT between the two is ΔT = T2 - T3 = +3.0 [°C], and Example 2 has significantly improved terminal heating properties compared to Example 3.

[0104] <Effects of the thermal buffer section 54> (1) Regarding heat transfer, it is believed that the heat transfer from the wiring board 48 to the capacitor body 4 is moderated and suppressed, resulting in improved terminal heating properties.

[0105] (2) Regarding the thermal buffering effect of the thermal buffering portion 54, the temperature rise of the capacitor body 4 is suppressed by the mitigation of heat transfer by the thermal buffering portion 54.

[0106] Other Embodiments and Examples The present disclosure includes the following variations:

[0107] (1) Although an aluminum electrolytic capacitor is exemplified as capacitor 2 in one embodiment, comparative examples 1 and 2, example 1, example 2, and example 3, the present disclosure may be applied to capacitors other than aluminum electrolytic capacitors, as well as other energy storage elements.

[0108] (2) In Comparative Examples 1 and 2 and Examples 1, 2, and 3, experiments using a reflow furnace are illustrated, but a reflow process using jet solder may also be used.

[0109] (3) Although the vibration-resistant frame 6 is made of a ferromagnetic material, it may be made of a metal material such as aluminum or stainless steel.

[0110] As explained above, the most preferred embodiments of the present disclosure have been described, but the present disclosure is not limited to the above description. It goes without saying that various modifications and changes are possible for those skilled in the art based on the gist of the present disclosure as described in the claims or disclosed in the specification, and such modifications and changes are naturally included in the scope of the present disclosure. [Industrial Applicability]

[0111] According to the present disclosure, a vibration-resistant frame is provided on the outer surface of the sealing body, and a support terminal protrudes from this vibration-resistant frame and supports the capacitor body on the wiring board, and the support terminal has a bent portion, which is advantageous in that it can improve the vibration resistance of the capacitor. [Explanation of symbols]

[0112] 2 capacitors 4. Capacitor body 6. Vibration-resistant frame 8 Capacitor elements 10, 12 Lead-out terminal 14 Outer case 16 Sealing body 18 Columnar part 20 lead wires 22, 24 Through holes 26 Fan-shaped convex part 28 Vibration-resistant frame installation section 30 Fitting part 32 Fitting recess 34 Annular section 36, 38 protrusion 40, 42 Support terminal 41 Curved section 43a, 43b Virtual lines 44 Bend 45 mating protrusion 46 Electronic Components 48 Wiring board 50 Crimping part 52 Curling Club 54 Thermal buffer 56 Mounting section 58, 60 Conductor pattern 62, 64 Through holes 66 Solder θ angle a width b Length W spacing

Claims

1. a capacitor body including a capacitor element, an outer case that houses the capacitor element, a sealing body that seals the outer case, and a lead terminal that is connected to the capacitor element and disposed in a through hole that is provided in the sealing body; a vibration-resistant frame that is installed on the outer surface of the sealing body and supports the capacitor body on a wiring board; a support terminal that protrudes from the vibration-resistant frame and is interposed between the vibration-resistant frame and the wiring board to support the capacitor body on the wiring board; Including, The support terminal has a bent portion.

2. The capacitor according to claim 1 , wherein the support terminal is disposed at an angle of 45° to 135° with respect to the lead terminal with respect to the central axis of the capacitor body.

3. The capacitor according to claim 1 or 2, further comprising a fitting portion for fitting the vibration-resistant frame and the sealing body together.

4. 2. The capacitor according to claim 1, wherein the vibration-resistant frame is held between an opening edge of the exterior case and an outer surface of the sealing body.

5. forming a capacitor body including a capacitor element, an outer case that houses the capacitor element, a sealing body that seals the outer case, and a lead terminal that is connected to the capacitor element and disposed in a through hole that is provided in the sealing body; forming a vibration-resistant frame that is placed on the outer surface of the sealing body and that supports the capacitor body on a wiring board; forming a support terminal that protrudes from the vibration-resistant frame and is interposed between the vibration-resistant frame and the wiring board to support the capacitor body on the wiring board; forming a bent portion on the support terminal; A method for manufacturing a capacitor, comprising:

6. The method for manufacturing a capacitor according to claim 5 , further comprising the step of forming bent portions in support terminals of the vibration-resistant frame after the step of placing the vibration-resistant frame on the outer surface of the sealing body.

7. a capacitor body including a capacitor element, an outer case that houses the capacitor element, a sealing body that seals the outer case, and a lead terminal that is connected to the capacitor element and disposed in a through hole that is provided in the sealing body; a vibration-resistant frame that is installed on the outer surface of the sealing body and supports the capacitor body on a wiring board; a support terminal that protrudes from the vibration-resistant frame and is interposed between the vibration-resistant frame and the wiring board to support the capacitor body on the wiring board; a bent portion provided on the support terminal, a step of arranging the lead terminal in a through hole in a mounting portion of the wiring board; a step of supporting the capacitor body on the wiring board by the support terminals;

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