Capacitor, method of manufacturing the same, method of mounting the same, and electronic

Abstract

To suppress temperature rise on the capacitor body side by enhancing the heating performance of a lead-out terminal.SOLUTION: The capacitor includes a capacitor main body (4) including a capacitor element (8), an outer case (14), a sealing body (16), and lead terminals (10, 12) connected to the capacitor element and disposed in through-holes (22, 24) provided in the sealing body, a plate member (6) provided on an outer surface portion of the sealing body, and support post portions (40, 42) protruding from the plate member and forming a heat buffer portion (54) between the plate member and a wiring board (48) on which the capacitor main body is mounted.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to various capacitors, such as aluminum electrolytic capacitors that are soldered in a reflow process, as well as manufacturing methods, mounting methods, and electronic components. [Background technology]

[0002] Soldering is used to mount electronic components such as capacitors on wiring boards. Common soldering processes include the flow process, which uses a jet of molten solder, and the reflow process, which heats and connects solder paste.

[0003] In the flow process, after temporarily attaching an electronic component such as a capacitor to a wiring board, a primary jet of molten solder is applied to the conductor pattern side of the wiring board, and then a secondary jet of molten solder is applied in stages from the primary jet, forming a solder fillet on the lead of the electronic component after the secondary jet.

[0004] In the reflow process, electronic components such as capacitors are placed on a circuit board with cream solder between them, and the circuit board is then placed in a reflow furnace. As heating progresses in the reflow furnace, the flux in the cream solder evaporates, the cream solder melts, and the liquefied cream solder seeps in, soldering the conductor pattern of the circuit board to the leads of the electronic components.

[0005] A known structure of a capacitor has a lead wire passing through a sealing body, in which an auxiliary member having an auxiliary terminal is provided on the outer surface of the sealing body, and this auxiliary terminal is fitted into the sealing body (for example, Patent Document 1).

[0006] Furthermore, with regard to electrolytic capacitors, it is known that the capacitor has a molded resin layer that covers a portion of the case that houses the capacitor element and the sealing member, and a pair of leads that extend from the sealing member are arranged on the molded resin layer (for example, Patent Document 2). [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-213137 [Patent Document 2] Japanese Patent Publication No. 2023-002812 Summary of the Invention [Problem to be solved by the invention]

[0008] Incidentally, the solder heating temperature is an important factor when mounting electronic components such as capacitors. Capacitors such as electrolytic capacitors have a particularly large heat capacity among electronic components, and the temperature of the reflow oven depends on this heat capacity. In other words, the larger the capacitor, the larger its heat capacity, and the higher the temperature setting of the reflow oven must be.

[0009] However, if the temperature setting of the reflow oven is increased, the heating temperature of the wiring board and the lead-out terminals of the electronic components will increase, but due to the structure of the capacitor, there is a problem in that the temperature of the capacitor body must be prevented from rising.

[0010] Thus, there is a contradictory requirement that the temperature rise of the capacitor body be suppressed while the temperature setting of the reflow furnace is increased. In response to this requirement, the inventors of the present disclosure discovered that the heat resistance of the lead terminals can be increased by providing thermal buffering properties to the sealing body side of the capacitor.

[0011] Patent Documents 1 and 2 do not suggest such problems or findings, and the configurations disclosed in Patent Documents 1 and 2 cannot solve the problems described above.

[0012] Therefore, an object of the present disclosure is to provide a capacitor that increases the heatability of the lead terminals and suppresses temperature rise on the capacitor body side, a manufacturing method thereof, a mounting method, and an electronic component. [Means for solving the problem]

[0013] In order to achieve the above object, according to one aspect of a capacitor of the present disclosure, the capacitor comprises a capacitor element, an outer case that houses the capacitor element, a sealing body that seals the outer case, a capacitor body that includes a lead terminal that is connected to the capacitor element and that is disposed in a through hole provided in the sealing body, a plate member that is provided on the outer surface of the sealing body, and a support portion that protrudes from the plate member and forms a thermal buffer portion between the plate member and a wiring board on which the capacitor body is mounted.

[0014] In this capacitor, the plate member may be held between the edge of the opening of the exterior case and the outer surface of the sealing body.

[0015] In this capacitor, the thermal resistance of the thermal buffer section is 0.04 [m 2 ·K / W) or more is sufficient.

[0016] In this capacitor, the thermal resistance of the thermal buffer section is 0.16 [m 2 ·K / W) or more is sufficient.

[0017] In this capacitor, the support portion may include a bent portion.

[0018] In this capacitor, the support portion may include a through portion that is installed in a through hole in the mounting portion of the wiring board.

[0019] In this capacitor, the plate member and the sealing body may have a fitting portion for fitting them together.

[0020] In order to achieve the above object, according to one aspect of the method for manufacturing a capacitor disclosed herein, the method includes the steps of forming a capacitor body including a capacitor element, an outer case that houses the capacitor element, a sealing body that seals the outer case, and a lead terminal that is connected to the capacitor element and disposed in a through hole provided in the sealing body; installing a plate member on the outer surface of the sealing body; and forming support members that protrude from the plate member and form a thermal buffer between the plate member and a wiring board on which the capacitor body is mounted.

[0021] In order to achieve the above object, according to one aspect of the capacitor mounting method of the present disclosure, there is provided a capacitor mounting method comprising: a capacitor element; an outer case that houses the capacitor element; a sealing body that seals the outer case; a capacitor body that includes a lead terminal connected to the capacitor element and disposed in a through hole provided in the sealing body; a plate member provided on the outer surface of the sealing body; and a support portion that protrudes from the plate member, the method comprising the steps of: arranging the lead terminal in a through hole in a mounting portion of a wiring board; and arranging the support portion in the mounting portion of the wiring board to form a thermal buffer portion between the wiring board and the capacitor body.

[0022] In order to achieve the above object, according to one aspect of the electronic component of the present disclosure, the electronic component includes a wiring board, a capacitor element, an outer case that houses the capacitor element, a sealing body that seals the outer case, a capacitor body that includes a lead terminal that is connected to the capacitor element and that is arranged in a through hole provided in the sealing body, a plate member that is provided on the outer surface of the sealing body, and a capacitor that protrudes from the plate member and includes the plate member and a support portion, and when mounted, heat transfer from the wiring board to the capacitor is buffered by the heat buffer portion. [Effects of the Invention]

[0023] According to the present disclosure, any of the following effects can be obtained. (1) The heat buffer formed between the wiring board and the sealing body of the capacitor body can increase the heat resistance of the lead-out terminals, thereby suppressing the temperature rise on the capacitor body side.

[0024] (2) The heat buffering section can suppress the transfer of heat from the wiring board to the capacitor body, allowing concentrated heating of the soldered connection areas of the wiring board and the lead-out terminals. [Brief explanation of the drawings]

[0025] [Figure 1] FIG. 1 is an exploded perspective view illustrating a capacitor and a method for manufacturing the same according to a first embodiment of the present disclosure. [Figure 2] FIG. 2A is a cross-sectional view showing an example of a capacitor, a mounting method thereof, and a mounted state of an electronic component according to the present disclosure, and FIG. 2B is a cross-sectional view showing a capacitor, a mounting method thereof, and an electronic component according to Modification 1. [Figure 3] FIG. 3 is an exploded perspective view showing a capacitor and a method for manufacturing the capacitor according to the second embodiment. [Figure 4] FIG. 4 is a diagram showing the mounting process and the mounted state of the capacitor. DETAILED DESCRIPTION OF THE INVENTION

[0026] [First embodiment] <Capacitor and its manufacturing method> Fig. 1 shows a capacitor and a manufacturing method thereof according to a first embodiment of the present disclosure. The configuration shown in Fig. 1 is an example, and the capacitor and the manufacturing method thereof according to the present disclosure are not limited to this configuration.

[0027] <Capacitor 2> The capacitor 2 is an example of a capacitor according to the present disclosure, for example, an aluminum electrolytic capacitor. As shown in FIG.

[0028] <Capacitor body 4> The capacitor body 4 includes a capacitor element 8, a lead terminal 10 (anode side), a lead terminal 12 (cathode side), an outer case 14, a sealing body 16, and the like.

[0029] <Capacitor element 8> The capacitor element 8 includes an anode foil, a cathode foil, and a separator, with an electrolyte layer formed between the anode and cathode foils. The anode foil is made of a valve metal base foil, which is subjected to a surface-expansion process to form a dielectric oxide film. Valve metals include aluminum, tantalum, niobium, titanium, hafnium, zirconium, zinc, tungsten, bismuth, and antimony, and the base foil is formed from any of these metals. The surface-expansion process for the base foil expands the surface of the base foil, forming a surface-expansion layer on the base foil by etching, sputtering, or other methods. Etching is performed, for example, by immersing the base foil in an acidic aqueous solution containing halogen ions, such as hydrochloric acid, and passing a direct current (DC etching), an alternating current (AC etching), or both (AC / DC etching). This creates a porous surface-expansion layer in the base foil, such as a concave-convex, tunnel-shaped pore, or spongy pore. This surface-expansion layer may contain countless pits as well as pores that penetrate the base foil (such as through-pits). To increase the capacitance of the capacitor element 8, advanced etching is performed. As another surface-expanding process, instead of etching, metal particles may be vapor-deposited or sintered onto the substrate foil, or metal particles may be vapor-deposited or sintered onto the etched substrate foil to form a surface-expanding layer on the substrate foil. After this surface-expanding process, a dielectric oxide film is formed on the surface of the surface-expanding layer of the substrate foil by chemical conversion treatment, thereby forming the anode foil.

[0030] The cathode foil, like the anode foil, is a base foil made of a valve metal as described above, and may be subjected to a surface expansion treatment. The base foil is formed from a material selected from the valve metals described above. The surface expansion treatment of the base foil is preferably performed using etching, sputtering, metal particle deposition, sintering, or the like. An oxide film is formed on the surface expansion layer of the cathode foil. This oxide film may be formed intentionally or naturally (a natural oxide film). The oxide film is a thin oxide film formed by chemical conversion treatment in which a voltage is applied in a solution free of halogen ions, such as an aqueous solution of adipic acid or boric acid. A natural oxide film is a thin oxide film formed when the base foil is exposed to air and reacts with oxygen.

[0031] The cathode foil may have a conductive layer formed on the substrate foil. The conductive layer is laminated on the substrate foil. The conductive layer is preferably formed of an inorganic material having electrical conductivity, such as titanium, zirconium, tantalum, niobium, their nitrides or carbides, aluminum carbide, carbon material, and composites or mixtures thereof. Specific examples include a conductive layer of a carbon material, a conductive layer of titanium nitride, a conductive layer of titanium carbide, a conductive layer made of a mixture of titanium and a carbon material, and a conductive layer made of a composite of aluminum carbide (Al4C3) and titanium oxide (TiO2).

[0032] The conductive layer containing the carbon material is composed of a carbon material as the main material and additives such as binders and dispersants. Examples of carbon materials that can be used include activated carbon, carbon black, carbon nanohorns, amorphous carbon, natural graphite, artificial graphite, graphitized ketjen black, mesoporous carbon, and fibrous carbon. Activated carbon can be derived from natural plant tissues such as coconut husks, synthetic resins such as phenols, or fossil fuels such as coal, coke, or pitch. Examples of carbon black include ketjen black, acetylene black, channel black, and thermal black. Examples of fibrous carbon include carbon nanotubes and carbon nanofibers. Carbon nanotubes can be single-walled carbon nanotubes, which have a single graphene sheet, or multi-walled carbon nanotubes (MWCNTs), which have two or more graphene sheets curled coaxially to form multiple tube walls. The binder may be a resin binder such as styrene butadiene rubber, polyvinylidene fluoride, or polytetrafluoroethylene, and is bonded to the carbon material. The dispersing agent may be, for example, sodium carboxymethyl cellulose.

[0033] The separators are disposed adjacent to the anode foil on both the front and back sides, and each separator is made of an insulating material (insulating paper) with the same physical properties. This insulating paper may contain other separator materials (hereinafter simply referred to as "separator materials"), such as kraft, Manila hemp, esparto, hemp, rayon, cellulose, mixtures thereof, cotton linter, and non-wood pulp. The separator is preferably made of an insulating material primarily made of natural fibers, such as kraft, Manila hemp, esparto, hemp, cellulose, or mixtures thereof. In other words, a separator material containing natural fibers is preferred. The width of each separator is set larger than the width of the anode foil and the cathode foil, thereby ensuring insulation between the anode foil and the cathode foil.

[0034] The anode foil and cathode foil are then rolled into a cylindrical shape with separators placed on the front and back sides of the anode foil to form capacitor element 8. This capacitor element 8 is impregnated with an electrolytic solution or a solid electrolyte containing a conductive polymer is formed to form an electrolyte layer. The main solvent for the electrolytic solution is, for example, ethylene glycol, γ-butyrolactone, sulfolane, or the like. The electrolyte layer may be a gel electrolyte, or may be a so-called hybrid electrolyte that includes both an electrolytic solution and a solid electrolyte containing a conductive polymer.

[0035] <Pull-out terminals 10 and 12> Lead terminals 10 and 12 are lead terminals of the present disclosure, with lead terminal 10 being an anode terminal connected to an anode foil and lead terminal 12 being a cathode terminal connected to a cathode foil. Each lead terminal 10 and 12 has a columnar portion 18, which is flattened on the capacitor element 8 side and electrically connected to the anode foil or cathode foil by a connection method such as stitch connection. A lead wire 20 made of a solderable metal wire is welded to each columnar portion 18. Of the lead wires 20, the lead wire 20 of lead terminal 10 is longer than the lead wire 20 of lead terminal 12, making it easy to distinguish the polarity based on the length of each lead wire 20.

[0036] <Outer case 14> The outer case 14 is an example of an outer case of the present disclosure. This outer case 14 is a cylindrical container with a bottom made of a valve metal material, such as aluminum, like the anode foil and cathode foil of the capacitor element 8, and although not shown, is provided with a safety valve at the bottom to prevent the capacitor body 4 from bursting due to gas generated inside the capacitor body 4. The outer case 14 shown in FIG. 1 shows the state before crimping and curling. After the sealing body 16 is inserted into the outer case 14, it is crimped, and the open end is curled by sandwiching the annular portion 34 of the plate member 6 against the outer surface of the sealing body 16.

[0037] <Sealing body 16> Sealing body 16 is an example of a sealing body of the present disclosure and is a cylindrical body made of an elastic insulator such as rubber. Sealing body 16 has through holes 22, 24 formed therein for installing lead-out terminals 10, 12. A plurality of, for example, four sector-shaped protrusions 26 are formed at regular intervals on the outer surface of sealing body 16, and a plate member installation portion 28 is formed around each sector-shaped protrusion 26. In this embodiment, plate member installation portion 28 is formed as a flat surface portion.

[0038] A fitting recess 32 is formed on the peripheral wall of each sector-shaped protrusion 26 as one member of a fitting portion 30 that fits with the plate member 6 .

[0039] <Plate member 6> Plate member 6 is an example of a plate member of the present disclosure. This plate member 6 is formed, for example, from stainless steel, aluminum alloy, iron, copper alloy, titanium alloy, nickel alloy, magnesium alloy, ceramics, or the like. Alternatively, plate member 6 may be formed, for example, from engineering plastics including thermoplastics such as polyphthalamide (PPA). This plate member 6 is an annular portion 34 concentric with sealing body 16, and is disposed on plate member mounting portion 28 on the outer surface of sealing body 16.

[0040] The annular portion 34 is formed with a pair of protrusions 36, 38 that protrude from the inner edge toward the center, and support posts 40, 42 formed perpendicular to the annular portion 34 protrude from each of the protrusions 36, 38.

[0041] The inner edge of the annular portion 34 is formed with a plurality of mating protrusions 44, for example at 90-degree intervals, that mate with the other component of the mating portion 30, i.e., the mating recesses 32 of the sector-shaped protrusions 26. The mating portion 30 is made up of the mating recesses 32 and the mating protrusions 44. Therefore, by utilizing the elasticity of the sector-shaped protrusions 26, the plate member 6 is positioned and temporarily fixed to the sealing body 16 by the mating of the mating recesses 32 and the mating protrusions 44.

[0042] <Method of manufacturing capacitor 2> This method of manufacturing capacitor 2 is an example of a method of manufacturing a capacitor according to the present disclosure, and includes steps of forming plate member 6 and capacitor body 4.

[0043] Forming process of plate member 6: For the plate member 6, a highly rigid material such as stainless steel, aluminum alloy, iron, high carbon steel, copper alloy, titanium alloy, nickel alloy, magnesium alloy, or ceramic is used, and by molding this material, the plate member 6 having the three-dimensional shape described above is formed.

[0044] Capacitor body 4 formation process: This capacitor body 4 formation process includes an anode foil formation process, a cathode foil formation process, a separator formation process, attachment of lead terminals 10, 12, winding of capacitor element 8, formation of electrolyte, combining of capacitor element 8, sealing body 16 and plate member 6, installation of capacitor element 8 housing / sealing body 16 and crimping of outer case 14, curling of outer case 14, aging process, etc.

[0045] As described above, in the anode foil formation process, a surface-expanding layer is formed on the base foil by surface-expanding treatment, a dielectric oxide film is formed on this surface-expanding layer, and the anode foil is cut to the required dimensions to meet the specifications of capacitor element 8. Also, as described above, in the cathode foil formation process, a surface-expanding layer is formed on the base foil by surface-expanding treatment such as etching, and an oxide film is formed as needed on the cathode foil including this surface-expanding layer, and the cathode foil is cut to the required dimensions to meet the specifications of capacitor element 8.

[0046] This formation process is necessary when using a cathode foil with a conductive layer containing a carbon material. A slurry is required to form the conductive layer containing a carbon material. This slurry is formed, for example, by adding the aforementioned carbon material, binder, and dispersant to a dilution liquid and mixing them using a dispersion process such as a mixer, jet mixing (jet collision), ultracentrifugation, or ultrasonic treatment. Examples of dilution liquids include alcohols, hydrocarbon solvents, aromatic solvents, amide solvents, water, and mixtures thereof. Examples of alcohols include methanol, ethanol, and 2-propanol. Examples of amide solvents include N-methyl-2-pyrrolidone (NMP) and N,N-dimethylformamide (DMF). In the carbon foil formation process, a slurry is applied to a substrate foil, and the solvent is evaporated from the slurry to form a carbon layer on the substrate foil. By pressing the substrate foil together with this carbon layer, the carbon material is forced into the pores of the surface-expanding layer of the substrate foil or deformed along the surface-expanding layer. This improves the adhesion between the substrate foil and the carbon layer, and enhances the fixation of the carbon layer to the substrate foil.

[0047] In the separator formation process, a separator material is selected from existing separator materials and cut into a shape that meets the specifications of capacitor element 8.

[0048] In the process of attaching the lead terminals 10 and 12, the flat portion of the lead terminal 10 is attached to the anode foil, and the flat portion of the lead terminal 12 is attached to the cathode foil by a process such as stitching, ultrasonic welding, cold pressure welding, or laser welding, and the anode foil and lead terminal 10 and the cathode foil and lead terminal 12 are electrically connected before the capacitor element 8 is wound.

[0049] In the winding process of capacitor element 8, the cathode foil is layered on the front and back sides of the anode foil with separators interposed between them, and the resulting product is wound into a cylindrical shape. The winding core is formed of one or both of the separators, or both the cathode foil and the separator. Either the separator or the separator may be wrapped around the outer periphery of the wound capacitor element 8.

[0050] In the electrolyte formation step, the capacitor element 8 is impregnated with an electrolyte solution or a solid electrolyte is formed. As described above, the electrolyte solution may be one whose main solvent is, for example, ethylene glycol, γ-butyrolactone, or sulfolane. The solid electrolyte may be, for example, a conductive polymer obtained by polymerizing thiophene or its derivatives and doping with a dopant. Other examples of electrolytes that may be used include gel electrolytes and hybrid electrolytes that include an electrolyte solution and a solid electrolyte containing a conductive polymer.

[0051] In the process of combining capacitor element 8, sealing body 16, and plate member 6, lead terminals 10, 12 protruding from the end face of capacitor element 8 are placed in through holes 22, 24 of sealing body 16. At this time, sealing body 16 to which plate member 6 has been temporarily attached in advance may be used, or sealing body 16 may be attached to capacitor element 8 and then plate member 6 may be temporarily attached to sealing body 16. In this way, capacitor element 8, sealing body 16, and plate member 6 are combined.

[0052] In the process of placing capacitor element 8 inside sealing body 16 and crimping outer case 14, capacitor element 8 is placed inside pre-formed cylindrical outer case 14 with a closed bottom, and sealing body 16 is installed. Then, in the process of crimping outer case 14, the peripheral side of sealing body 16 is crimped from the periphery of outer case 14 to seal outer case 14.

[0053] In the curling process of the outer case 14, a curling process is performed on the opening edge of the outer case 14, which has already protruded from the outer surface of the sealing body 16. This curling process shapes the opening edge of the outer case 14 toward the center of the sealing body 16, and the annular portion 34 of the plate member 6 is gripped between the opening edge of the outer case 14 and the outer surface of the sealing body 16. In this way, the capacitor body 4 is obtained.

[0054] The capacitor body 4 is then aged in an aging process before being manufactured into a product, and the capacitor 2 is completed as a product.

[0055] <Capacitor 2 and Electronic Components 46> 2A shows a partial cross section of an electronic component 46 mounted with a capacitor 2 according to the present disclosure. In FIG. 2, the same parts as in FIG. 1 are denoted by the same reference numerals.

[0056] This electronic component 46 includes a capacitor 2 and a wiring board 48. As described above, the capacitor 2 includes the capacitor body 4 and the plate member 6, and the plate member 6 includes the support portions 40, 42. The capacitor body 4 has a crimped portion 50 formed by crimping the outer case 14. In addition, a curled portion 52 is formed at the opening edge of the outer case 14 by a curling process, and the plate member 6 is firmly fixed between the outer surface of the sealing body 16 and the opening edge of the outer case 14 by this curled portion 52.

[0057] In this way, a pair of support pillars 40, 42 protrude vertically from the plate member 6 mounted on the outer surface of the sealing body 16 of the capacitor body 4. The support pillars 40, 42 preferably have the same protruding length, and the tip of each pillar abuts against the mounting portion of the wiring board 48, thereby maintaining the capacitor body 4 horizontally on the mounting portion of the wiring board 48. The protruding length of each support pillar 40, 42 maintains a constant distance between the capacitor body 4 and the wiring board 48, thereby forming a thermal buffer portion 54 that buffers heat transfer between the plate member 6 and the wiring board 48. In other words, the support pillars 40, 42 form the thermal buffer portion 54.

[0058] If the vertical projection area of ​​the capacitor body 4 with respect to the mounting surface of the wiring board 48 is S and the protruding length of the support parts 40, 42 (= the distance between the apex of the curling part 52 of the outer case 14 and the mounting surface of the wiring board 48) is h, then the volume of the thermal buffer part 54 is V [m 3 ] can be expressed by equation (1). V = S × h [m 3 ) (1)

[0059] This thermal buffer section 54 is formed between the capacitor body 4 and the wiring board 48, and in this thermal buffer section 54, the annular section 34 of the plate member 6, the opening edge of the exterior case 14 that covers the annular section 34, the support sections 40, 42, and the air present in the thermal buffer section 54 are present as thermally conductive materials. These thermally conductive materials and their sizes affect the thermal buffering function of the thermal buffer section 54, and the main factors are the air, the metal material that makes up the support sections 40, 42, and the volume V [m 3 ], these have a significant effect on the thermal buffer function.

[0060] A mounting portion 56 for the capacitor 2 is set on the wiring board 48, and a conductor pattern 58 (60) and a through hole 62 (64) are formed in this mounting portion 56. The conductor pattern 58 and the through hole 62 correspond to the lead-out terminal 10, and the conductor pattern 60 and the through hole 64 correspond to the lead-out terminal 12. Therefore, the lead-out terminals 10 (12) of the capacitor 2 are installed in the through holes 62 (64), and each lead-out terminal 10 (12) is connected to the conductor pattern 58 (60) with solder 66.

[0061] Each of the support posts 40, 42 may be fixed to the wiring board 48 by a material other than solder.

[0062] <How to mount capacitor 2> This mounting method is an example of mounting the capacitor 2 on the wiring board 48. This mounting method includes a step of arranging the lead-out terminals 10 and 12, a step of forming the heat buffer portion 54, and the like.

[0063] Arranging the lead terminals 10, 12: The lead terminals 10 (12) are arranged in the through holes 62 (64) in the mounting portion 56 of the wiring board 48, and the capacitor body 4 is erected on the mounting portion 56 of the wiring board 48 and temporarily fixed.

[0064] Step of forming the heat buffer section 54: The support section 40 (42) is arranged on the mounting section 56 of the wiring board 48, and the heat buffer section 54 is formed between the wiring board 48 and the capacitor body 4.

[0065] Then, the lead terminals 10 (12) are connected to the conductor patterns 58 (60) of the wiring board 48 with solder 66 by a reflow process.

[0066] As previously mentioned, each of the support posts 40, 42 may be fixed to the wiring board 48 by a material other than solder.

[0067] <Advantages of the First Embodiment> According to the first embodiment, one of the following effects can be obtained. (1) The heat buffer portion 54 formed between the wiring board 48 and the sealing body 16 of the capacitor body 4 improves the heat resistance of the lead-out terminals 10, 12, thereby suppressing the temperature rise on the capacitor body 4 side.

[0068] (2) The heat buffering portion 54 can suppress the loss of heat due to heat transfer from the wiring board 48 side to the capacitor body 4 side, and the conductive pattern 58 (60) of the wiring board 48 and the soldered connection parts of the lead-out terminals 10, 12 can be heated in a concentrated manner.

[0069] (3) Heat transfer to the capacitor body 4 can be buffered, and the capacitor element 8 can be prevented from being deteriorated due to heat caused by the heat transfer.

[0070] <Modification 1 and its effects> Fig. 2B shows Modification 1 of the present disclosure. In Fig. 2B, the same parts as in Fig. 1 are denoted by the same reference numerals.

[0071] A bent portion 68 may be provided at the tip of each of the support portions 40 and 42, and each bent portion 68 may be brought into contact with the mounting portion of the wiring board 48.

[0072] According to this configuration, the heat buffer portion 54 is formed between the wiring board 48 and the sealing body 16 of the capacitor body 4, which can further increase the heatability of the lead-out terminals 10, 12 and suppress the temperature rise on the capacitor body 4 side. In addition, the independence and stability of the capacitor body 4 relative to the mounting portion 56 can be further improved.

[0073] <Modification 2 and its effects> In the above-described embodiment and Example 1, a pair of support pillars 40, 42 are provided, but only a single support pillar 40 may be provided, or three or more support pillars 40, 42 may be provided.

[0074] If the support structure has three or more support pillars, the capacitor body 4 can be made more self-supporting and stable relative to the mounting portion 56, and if a bent portion 68 is provided, the capacitor body 4 can be made even more self-supporting and stable relative to the mounting portion 56.

[0075] <Modification 3 and its effects> Each of the support columns 40, 42 may have a tapered tip to form a through-portion to be inserted into the wiring board 48, and this through-portion may be inserted into through-holes 62, 64 formed in the wiring board 48 side.

[0076] According to this configuration, the capacitor body 4 can be fixed to the mounting portion 56 by the support portions 40, 42, and the self-supporting ability and stability of the capacitor body 4 can be improved.

[0077] <Modification 4 and its effects> For example, the support column 42 may be omitted from the support columns 40, 42, and a rubber protrusion may be provided in place of the support column 42 to support the capacitor body 4 on the mounting portion 56 of the wiring board 48.

[0078] With this configuration, the capacitor body 4 can be fixed to the mounting portion 56 by the support portions 40, 42, improving the self-supporting ability and stability of the capacitor body 4, and the polarity of the capacitor 2 can be determined by the position of the rubber protrusions. [Example]

[0079] For electronic component 46 shown in Fig. 2, examples 1 and 2 (=B in Fig. 2) and examples 3, 4 and 5 (=A in Fig. 2) were presented along with comparative examples 1 and 2 (not shown), and the terminal heating characteristics depending on the presence or absence of thermal buffer section 54 and its volume were examined. The specifications, such as the volume and heat capacity, of capacitor body 4 used in comparative examples 1 and 2 and examples 1 to 5 were the same. The comparative examples and examples were configured as follows:

[0080] <Comparative Example 1> Comparative Example 1 is a conventional standard product equipped with a base. In this Comparative Example 1, the distance (=thickness) between the capacitor body 4 and the wiring board 48 was set to 1.0 [mm]. The base was made of polyamide. The thermal conductivity of this polyamide was 0.25 [W / (m·K)], and the thermal resistance (thickness / thermal conductivity) was 0.004 [m 2 ·K / W].

[0081] <Comparative Example 2> In Comparative Example 2, a space (distance = thickness) of 2.0 mm is formed between the capacitor body 4 and the wiring board 48, and a member made of ceramic felton is placed in this space. This ceramic felton is a material whose main component is inorganic fiber, and is a heat-resistant member made in the form of felt or other shapes. Ceramic felton has, for example, a thermal conductivity of 0.0607 W / (m·K) and a thermal resistance (thickness / thermal conductivity) of 0.033 m 2 ·K / W].

[0082] Example 1 Example 1 includes a plate member 6, which includes support posts 40, 42 and a bent portion 68. h (the distance between the capacitor body 4 and the wiring board 48) was set to 1.0 mm. In other words, the thickness of the thermal buffer portion 54 is determined by the height of the support posts 40, 42, and is equal to h = 1.0 mm. The only thermally conductive material present in the thermal buffer section 54 is air. The thermal conductivity of air is 0.0241 [W / (m·K)], and the thermal resistance (thickness / thermal conductivity) is 0.041 [m 2 ·K / W].

[0083] <Example 2> Example 2 includes a plate member 6, which includes support columns 40, 42 and a bent portion 68. h is set to 2.0 mm. In other words, the thickness of the thermal buffer section 54 is determined by the height of the support columns 40, 42, and is equal to h = 2.0 mm. The only thermally conductive material present in the thermal buffer section 54 is air, as in Example 1. The thermal conductivity of air is 0.0241 W / (m·K), and the thermal resistance (thickness / thermal conductivity) is 0.083 m K in proportion to h = 2.0 mm. 2 ·K / W].

[0084] Example 3 Example 3 includes a plate member 6, which includes only support posts 40 and 42 and does not include a bending portion 68. h was set to 3.0 mm. The thickness of the thermal buffer portion 54 is determined by the protruding length of the support posts 40, and is equal to h = 3.0 mm. The only thermally conductive material present in the thermal buffer section 54 is air. The thermal conductivity of air is 0.0241 [W / (m·K)], and the thermal resistance (thickness / thermal conductivity) is 0.124 [m 2 ·K / W].

[0085] Example 4 Example 4 includes a plate member 6, which includes only support posts 40 and 42 and does not include a bending portion 68. h was set to 4.0 mm. The thickness of the thermal buffer portion 54 is determined by the protruding length of the support posts 40, and is equal to h = 4.0 mm. The only thermally conductive material present in the thermal buffer section 54 is air. The thermal conductivity of air is 0.0241 [W / (m·K)], and the thermal resistance (thickness / thermal conductivity) is 0.166 [m 2 ·K / W].

[0086] <Example 5> Example 5 includes a plate member 6, which includes only support posts 40 and 42 and does not include a bending portion 68. h was set to 8.0 mm. The thickness of the thermal buffer portion 54 is determined by the protruding length of the support posts 40, and is equal to h = 8.0 mm. The only thermally conductive material present in the thermal buffer section 54 is air. The thermal conductivity of air is 0.0241 [W / (m·K)], and the thermal resistance (thickness / thermal conductivity) is 0.332 [m 2 ·K / W].

[0087] <Thermal resistance R> The thermal resistance R mentioned above was calculated using formula (2) shown in the calculation method based on JIS A 9521:2017.

[0088] R=d / λ (2) where R: thermal resistance [m 2 ·K / W d: Insulation thickness [m] λ: Thermal conductivity [W / (m·K)] The value of this thermal resistance R was calculated using formula (2) in accordance with JIS A 9521:2017, and rounded to one decimal place.

[0089] <Temperature measurement method> In this temperature measurement, the terminal temperature was measured at a location where the lead-out terminals 10 and 12 of the capacitor 2 and the wiring board 48 contacted each other at the mounting portion 56 .

[0090] A reflow furnace was used to heat electronic component 46. Wiring board 48 and each of capacitors 2 according to Examples 1 and 2 and the comparative example, which were placed in this reflow furnace, received heat from the reflow furnace, and the terminal temperature rose to a peak temperature T, after which the temperature decreased after a time equivalent to that of the reflow process had elapsed.

[0091] From the measurement results of Comparative Examples 1 and 2 and Examples 1 to 5, the peak temperature Tx of the terminal of Comparative Example 1, the peak temperature Ty of the terminal of Comparative Example 2, the peak temperature T1 of the terminal of Example 1, the peak temperature T2 of the terminal of Example 2, the peak temperature T3 of the terminal of Example 3, the peak temperature T4 of the terminal of Example 4, and the peak temperature T5 of the terminal of Example 5 were determined.

[0092] <Temperature measurement results and evaluation> Regarding this temperature measurement, Table 1 shows the specifications of the capacitors 2 according to Comparative Examples 1 and 2 and Examples 1 to 5, as well as the peak temperature T, temperature difference ΔT, and evaluation results of terminal heating.

[0093] [Table 1]

[0094] <Verification of measurement results> (1) When comparing the peak temperature T4 of the terminal of Example 4 and the peak temperature T5 of the terminal of Example 5 with the peak temperature Tx of the terminal of Comparative Example 1, the temperature difference is ΔT4 = T4 - Tx = +35.1 [°C] and the temperature difference ΔT5 = T5 - Tx = +33.2 [°C], which is significantly higher than the peak temperature Tx of Comparative Example 1. Therefore, the terminal heating properties of Examples 4 and 5 are improved, and the terminal heating properties are judged to be extremely good (= ⊚).

[0095] (2) When the peak temperature T3 of the terminal in Example 3 is compared with the peak temperature Tx of the terminal in Comparative Example 1, the temperature difference ΔT3 is ΔT3 = T3 - Tx = +25.8 [°C], which is smaller than the temperature difference in Examples 4 and 5, but is higher than the peak temperature Tx of the terminal in Comparative Example 1. Therefore, the terminal heating property was also improved in Example 3, and the terminal heating property was judged to be good (=○).

[0096] (3) When comparing the peak temperature T1 of Example 1 and the peak temperature T2 of the terminal of Example 2 with the peak temperature Tx of Comparative Example 1, the temperature difference ΔT1 is ΔT1 = T1 - Tx = +14.5 [°C], and the temperature difference ΔT2 is ΔT2 = T2 - Tx = +19.3 [°C], which is smaller than the temperature difference in Examples 4 and 5, but higher than the peak temperature Tx of the terminal of Comparative Example 1. Therefore, the terminal heating properties were improved in Examples 1 and 2 as well, and the terminal heating properties were judged to be good (=○).

[0097] (4) Comparing the peak temperature T1 of Example 1 with the peak temperature T2 of Example 2, the temperature difference ΔT between the two is ΔT = T2 - T1 = +4.8 [°C], and Example 2, which has a thicker thermal buffer portion 54, has significantly improved terminal heating properties compared to Example 1.

[0098] (5) Comparing the peak temperature T2 of Example 2 with the peak temperature T3 of Example 3, the temperature difference ΔT between the two is ΔT = T3 - T2 = +6.5 [°C]. Example 3, which has a thicker thermal buffer portion 54, has significantly improved terminal heating properties compared to Example 2.

[0099] (6) Comparing the peak temperature T3 of Example 3 with the peak temperature T4 of Example 4, the temperature difference ΔT between the two is ΔT = T4 - T3 = +9.3 [°C]. Example 4, which has a thicker thermal buffer portion 54, has significantly improved terminal heating properties compared to Example 3.

[0100] (7) Comparing the peak temperature T4 of Example 4 with the peak temperature T5 of Example 5, the temperature difference ΔT between the two is ΔT = T5 - T4 = -1.9 [°C], and Example 5, which has a thicker thermal buffer portion 54, has lower terminal heating properties than Example 4.

[0101] (8) Comparing the peak temperature Tx of the terminal in Comparative Example 1 with the peak temperature Ty of the terminal in Comparative Example 2, the temperature difference ΔT between the two is ΔT = Ty - Tx = -1.5 [°C], and the terminal heating performance is lower when ceramic felton is placed than in Comparative Example 1 where a base is placed.

[0102] (9) Comparing the peak temperature T1 of the terminal in Example 1 with the peak temperature Ty of the terminal in Comparative Example 2, the temperature difference ΔT between the two was ΔT = T1 - Ty = +16.0 [°C], and the presence of the thermal buffer portion 54 resulted in good terminal heating properties.

[0103] (10) Comparing the peak temperature T2 of the terminal of Example 2 with the peak temperature Ty of the terminal of Comparative Example 2, the temperature difference ΔT between the two was ΔT = T2 - Ty = +20.8 [°C], and the presence of the thermal buffer portion 54 resulted in good terminal heating properties.

[0104] (11) Comparing the peak temperature T3 of the terminal of Example 3 with the peak temperature Ty of the terminal of Comparative Example 2, the temperature difference ΔT between the two was ΔT = T3 - Ty = +27.3 [°C], and the presence of the thermal buffer portion 54 resulted in good terminal heating properties.

[0105] (12) Comparing the peak temperature T4 of the terminal of Example 4 with the peak temperature Ty of the terminal of Comparative Example 2, the temperature difference ΔT between the two was ΔT = T4 - Ty = +36.6 [°C], and the presence of the thermal buffer portion 54 resulted in good terminal heating properties.

[0106] (13) Comparing the peak temperature T5 of the terminal of Example 5 with the peak temperature Ty of the terminal of Comparative Example 2, the temperature difference ΔT between the two was ΔT = T5 - Ty = +34.7 [°C], and the presence of the thermal buffer portion 54 resulted in good terminal heating properties.

[0107] <Effects of the thermal buffer section 54> (1) Regarding heat transfer, it is believed that the heat transfer from the wiring board 48 to the capacitor body 4 is moderated and suppressed, resulting in improved terminal heating properties.

[0108] (2) Regarding the thermal buffering effect of the thermal buffering portion 54, the temperature rise of the capacitor body 4 is suppressed by the mitigation of heat transfer by the thermal buffering portion 54.

[0109] (3) From the comparison between this embodiment and the comparative example, it is found that the thermal buffer section 54 has a thermal resistance of, for example, 0.04 [m 2 ·K / W] or more, a preferable terminal heating property can be obtained. 2 By configuring it so that the heat dissipation is at least 1000 kJ / W, higher terminal heating performance can be achieved.

[0110] Second Embodiment Fig. 3 shows a capacitor and a manufacturing method thereof according to a second embodiment, and Fig. 4 shows a partial cross section of an electronic component 46 mounted with a capacitor 2. The configurations shown in Figs. 3 and 4 are merely examples, and the capacitor and manufacturing method of the present disclosure are not limited to such configurations. In Figs. 3 and 4, the same components as those in Figs. 1 and 2 are denoted by the same reference numerals.

[0111] Capacitor 2 of the second embodiment includes, for example, capacitor body 4 including capacitor element 8 and sealing body 16 described above, as well as plate member 70 having an annular portion 34 formed thereon that is placed on plate member installation portion 28 of sealing body 16. As shown in FIG. 3 , for example, annular portion 34 has support portion 72 formed thereon that protrudes from part of the inner edge toward the center and extends to the inner edge on the opposite side, with support post portion 74 protruding perpendicularly from annular portion 34 on or near the central axis. The support column 74 is made up of, for example, a spacer portion 76 and a through portion 78 from the side closer to the support portion 72 .

[0112] The spacer portion 76 is an example of a functional portion that regulates the distance between the capacitor body 4 and the mounting portion 56 of the wiring board 48 during mounting and forms a space that serves as the thermal buffer portion 54. For example, it is formed in an angular shape with the same width as or close to that of the support portion 72 and a predetermined height, and is formed so that at least part or all of it is wider than the through portion 78.

[0113] Penetrating portion 78 is an example of a functional portion that is inserted into insertion hole 80 (FIG. 4) at the mounting position of wiring board 48 to support capacitor 2, and includes a support shaft 82 (FIG. 4) that has a shape that corresponds to at least the opening shape of insertion hole 80 and has an outer diameter that allows insertion. Furthermore, penetrating portion 78 includes a so-called wedge-shaped locking protrusion 84 whose tip portion has a diameter equal to or smaller than the opening diameter of insertion hole 80 and whose diameter increases toward support shaft 82.

[0114] Additionally, a series of slits 86 of a predetermined width are formed in the support column 74, for example along the length of the support section 72, in the central portions of the support column 74, spacer portion 76, and locking protrusions 84. These slits 86 are an example of a means for deforming part or all of the support column 74. That is, when the support column 74 receives a pressing force, for example, on its outer periphery, it is capable of deforming by the width of the slits 86 in the opening direction, and this deformation can reduce the outer diameter of part or all of the locking protrusions 84 and the support shaft 82. The opening width of the slits 86 is set within a range that satisfies one or more of the desired deformation amount, elastic deformation, and rigidity sufficient to support the mounted capacitor 2, depending on the material of the support column 74, for example.

[0115] As already mentioned, the plate member 70 is formed from, for example, stainless steel, aluminum alloy, iron, copper alloy, titanium alloy, nickel alloy, magnesium alloy, ceramics, or engineering plastics including thermoplastics such as polyphthalamide.

[0116] The manufacturing method including the assembly of the capacitor 2, including the process of attaching the plate member 70 to the capacitor body 4, is the same as that of the first embodiment.

[0117] <Capacitor 2 and Electronic Components 46> On the opening side of the capacitor body 4, as shown in FIG. 4A, for example, a support post 74 protrudes vertically from a plate member 70 attached to the outer surface of the sealing body 16 at or near the central axis of the capacitor body 4. When a support shaft 82 of the support post 74 is inserted into an insertion hole 80 of the wiring board 48, as shown in FIG. 4B, a locking wall 88 formed on one surface of the spacer portion 76 comes into contact with the mounting portion 56 of the wiring board 48, thereby maintaining the capacitor body 4 horizontally relative to the mounting portion 56 of the wiring board 48. At this time, a constant distance is maintained between the capacitor body 4 and the wiring board 48 due to the height from the support portion 72 to the tip of the spacer portion 76, thereby forming a thermal buffer portion 54 that buffers heat transfer between the plate member 70 and the wiring board 48. In other words, the thermal buffer portion 54 is formed by the spacer portion 76.

[0118] At this time, the volume V [m 3 ] can be calculated in the same manner as in the above-mentioned formula (1), where h is the length of the spacer portion 76. In addition, the configuration of the conductor patterns 58 (60) and through holes 62 (64) formed on the wiring board, and the soldering 66 of each lead-out terminal 10 (12) to the conductor patterns 58 (60) are as described above.

[0119] The support post 74 may be formed, for example, so that either the tip of the locking protrusion 84 or the tip of the support shaft 82 has the same length as the lead-out terminals 10, 12. When the capacitor 2 is mounted on the wiring board 48, the support shaft 82 is placed inside the insertion hole 80. Therefore, the length of the support post 74 may be determined by setting the lengths of the spacer portion 76 and the support shaft 82 so that the lead-out terminals 10, 12 protrude from the through holes 62, 64 of the wiring board in a state where they can be soldered.

[0120] <How to mount capacitor 2> This mounting method is an example of mounting the capacitor 2 on the wiring board 48. This mounting method includes a step of arranging the lead-out terminals 10 and 12, a step of forming the heat buffer portion 54, and the like.

[0121] Arranging the lead terminals 10, 12: The lead terminals 10 (12) are arranged in the through holes 62 (64) in the mounting portion 56 of the wiring board 48, and the capacitor body 4 is erected on the mounting portion 56 of the wiring board 48 and temporarily fixed.

[0122] Formation process of the heat buffer portion 54: The locking protrusions 84 of the support portions 74 are placed in the insertion holes 80 formed in the mounting portion 56 of the wiring board 48. Next, when the capacitor body 4 and the wiring board 48 are pressed together to reduce the distance between them, the inclined surfaces of the wedge-shaped locking protrusions 84 are pressed against the opening surfaces of the insertion holes 80, reducing the diameter of the locking protrusions 84 alone, or the locking protrusions 84 and the support shaft 82, by the opening width of the slits 86, and the tip of the support portions 74 is inserted into the insertion holes 80. At this time, the support portions 74 have, for example, an inner diameter W1 of the insertion holes 80 and an outer diameter W2 of the maximum portion of the locking protrusions 84 that are equal to each other. In other words, the opening width X of the slits 86 needs to be greater than or equal to the difference between the outer diameter W2 of the maximum portion of the locking protrusions 84 and the inner diameter W1 of the insertion holes 80 before pressing. When the locking protrusions 84 pass through the insertion holes 80, the pressing force of the support portions 74 is released, and the outer diameter W2 of the support portions 74 becomes larger than the inner diameter W1 of the insertion holes 80 due to the restoring force of elastic deformation. Furthermore, the locking wall portions 88 of the spacer portions 76 of the support portions 74, which have an outer diameter W3 formed larger than the inner diameter W1 of the insertion holes 80, come into contact with the mounting portion 56. As a result, the support portions 74 sandwich the front and back surfaces of the wiring board 48 between the locking protrusions 84 and the locking wall portions 88, and are held within the insertion holes 80 by the outer diameters W2, W3, which are larger than the inner diameter W1 of the insertion holes 80, so that the capacitor body 4 is supported and the thermal buffer portion 54 is formed.

[0123] Then, the lead terminals 10 (12) are connected to the conductor patterns 58 (60) of the wiring board 48 with solder 66 by a reflow process.

[0124] As described above, the support posts 74 may be fixed to the wiring board 48 by a member other than solder.

[0125] <Advantages of the second embodiment> According to the second embodiment, one of the following effects can be obtained.

[0126] (1) The same effects as those of the first embodiment, examples, and modifications can be obtained.

[0127] (2) By disposing a portion of the support pillar 74 inside the wiring board 48, the mounting stability of the capacitor body 4 on the wiring board 48 is improved, and it is possible to prevent the capacitor body 4 from tilting with respect to the mounting portion 56 before and after the reflow process. This not only stabilizes and optimizes the mounting state of the capacitor 2, but also stabilizes the spacing of the thermal buffer portion 54 between the capacitor body 4 and the mounting portion 56.

[0128] (3) By providing large-diameter spacer portions 76 and locking protrusions 84 on the front and rear of the support shaft 82 inserted into the insertion hole 80 of the wiring board 48, tilting of the capacitor body 4 is prevented, and separation from the wiring board 48 or over-insertion is prevented, thereby achieving the desired thermal buffering effect.

[0129] Other Embodiments and Examples The present disclosure includes the following variations:

[0130] (1) Although an aluminum electrolytic capacitor is exemplified as the capacitor 2 in the first embodiment, the second embodiment, comparative examples 1 and 2, and examples 1 to 5, the present disclosure may be applied to capacitors other than aluminum electrolytic capacitors, as well as other energy storage elements.

[0131] (2) In Examples 1 to 5 and Comparative Examples 1 and 2, experiments using a reflow furnace are illustrated, but a reflow process using jet solder may also be used.

[0132] (3) Although the plate member 6 is made of a ferromagnetic material, it may be made of a metal material such as aluminum or stainless steel.

[0133] (4) In the second embodiment described above, the tip of the support post 74 is wedge-shaped and includes the locking protrusion 84 that is larger in diameter than the insertion hole 80. However, this is not limiting. The support post 74 may not include the locking protrusion 84, as long as at least the support shaft 82 is inserted into the insertion hole 80 of the wiring board 48. Even with this configuration, the support shaft 82 inside the insertion hole 80 can prevent the capacitor body 4 from tilting relative to the wiring board 48, and the spacer portion 76 maintains the distance between the capacitor body 4 and the mounting portion 56, thereby forming the heat buffer portion 54 with the set distance h.

[0134] As explained above, the most preferred embodiments of the present disclosure have been described, but the present disclosure is not limited to the above description. It goes without saying that various modifications and changes are possible for those skilled in the art based on the gist of the present disclosure as set forth in the claims or disclosed in the specification, and such modifications and changes are naturally included in the scope of the present disclosure. [Industrial Applicability]

[0135] According to the present disclosure, a plate member is provided on the outer surface of the sealing body, and a support portion protruding from this plate member forms a thermal buffer between the plate member and the wiring board on which the capacitor body is mounted, which is advantageous in that it can increase the heatability of the lead-out terminal and suppress temperature rise on the capacitor body side. [Explanation of symbols]

[0136] 2 capacitors 4. Capacitor body 6 Plate member 8 Capacitor elements 10, 12 Lead-out terminal 14 Outer case 16 Sealing body 18 Columnar part 20 lead wires 22, 24 Through holes 26 Fan-shaped convex part 28 Plate member installation section 30 Fitting part 32 Fitting recess 34 Annular section 36, 38 protrusion 40, 42 Support section 44 mating protrusion 46 Electronic Components 48 Wiring board 50 Crimping part 52 Curling Club 54 Thermal buffer 56 Mounting section 58, 60 Conductor pattern 62, 64 Through holes 66 Solder 68 Bend 70 Plate member 72 Support part (example of protruding part) 74 Pillar section 76 Spacer part 78 Penetration 80 Insertion hole (board side) 82 Support shaft 84 Locking protrusion 86 Slit 88 Locking wall

Claims

1. a capacitor body including a capacitor element, an outer case that houses the capacitor element, a sealing body that seals the outer case, and a lead terminal that is connected to the capacitor element and disposed in a through hole that is provided in the sealing body; a plate member provided on an outer surface of the sealing body; a support portion protruding from the plate member and forming a thermal buffer portion between the plate member and a wiring board on which the capacitor body is mounted; A capacitor comprising:

2. 2. The capacitor according to claim 1, wherein the plate member is held between an opening edge of the outer case and an outer surface of the sealing body.

3. The thermal resistance of the thermal buffer portion is 0.04 [m 2 3. The capacitor according to claim 1, wherein the capacitance is equal to or greater than 1.0 K / W.

4. The thermal resistance of the thermal buffer portion is 0.16 [m 2 3. The capacitor according to claim 1, wherein the capacitance is equal to or greater than 1.0 K / W.

5. The capacitor according to claim 1 or 2, wherein the support portion includes a bent portion.

6. 3. The capacitor according to claim 1, wherein the support portion includes a through-hole that is disposed in a mounting portion of the wiring board.

7. The capacitor according to claim 1 , wherein the plate member and the sealing body have mating portions that allow them to be mated together.

8. forming a capacitor body including a capacitor element, an outer case that houses the capacitor element, a sealing body that seals the outer case, and a lead terminal that is connected to the capacitor element and disposed in a through hole that is provided in the sealing body; a step of placing a plate member on an outer surface of the sealing body; forming a support portion that protrudes from the plate member and forms a thermal buffer portion between the plate member and a wiring board on which the capacitor body is mounted; A method for manufacturing a capacitor, comprising:

9. a capacitor body including a capacitor element, an outer case that houses the capacitor element, a sealing body that seals the outer case, and a lead terminal that is connected to the capacitor element and disposed in a through hole that is provided in the sealing body; a plate member provided on an outer surface of the sealing body; a support portion protruding from the plate member; A capacitor mounting method comprising: a step of arranging the lead terminal in a through hole in a mounting portion of a wiring board; a step of arranging the support portion in the mounting portion of the wiring board to form a thermal buffer portion between the wiring board and the capacitor body; A method for mounting a capacitor, including:

10. A wiring board; a capacitor body including a capacitor element, an outer case that houses the capacitor element, a sealing body that seals the outer case, a lead terminal that is connected to the capacitor element and that is disposed in a through hole that is provided in the sealing body, a plate member that is provided on an outer surface of the sealing body, and a capacitor that protrudes from the plate member and includes the plate member and a support portion; and when mounted, the heat transfer from the wiring board to the capacitor is buffered by the heat buffer section.

Images