Adhesive film, method for manufacturing adhesive film, and method for manufacturing semiconductor device

Abstract

To suppress occurrence of a defective semiconductor device.SOLUTION: The adhesive film 1 includes a long base film 2, an adhesive layer 3, a tacky film 4, and a defect marking 5 formed at least at the same position as a defect 8 in the longitudinal direction LD. The method for producing an adhesive film includes preparing an original film 101 including a long base film 2, an adhesive layer 3, and a pressure-sensitive adhesive film 4, inspecting the original film 101, and, when a defect is detected, forming a defect marking 5 on the original film 101 at least at the same position as the defect in the longitudinal direction LD. In the method of manufacturing a semiconductor device, an adhesive film 1 is prepared, an adhesive layer 3 and an adhesive film 4 are pre-cut in a predetermined pattern to form a plurality of adhesive pieces 6, and an adhesive piece 6 on which a defect marking 5 is not formed among the plurality of adhesive pieces 6 is stuck to a semiconductor wafer 102.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to an adhesive film, a method for manufacturing an adhesive film, and a method for manufacturing a semiconductor device. [Background technology]

[0002] An example of a conventional adhesive film is the laminate sheet support for die attachment described in Patent Document 1. This conventional laminate sheet support for die attachment comprises a long adhesive sheet (substrate film) and a plurality of laminate films for die attachment (adhesive pieces) dispersed on one side of the substrate sheet in the longitudinal direction of the substrate film. This laminate sheet support for die attachment is produced by laminating a die attachment film (adhesive layer) and a light release film (adhesive film) over the entire surface of the substrate sheet, and then punching out the light release film and die attachment film using a cutter with an annular cutting blade, leaving only the area inside the cut by the cutter. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-202927 Summary of the Invention [Problem to be solved by the invention]

[0004] However, during the manufacturing process of the adhesive film, defects such as contamination with foreign matter or scratches may occur in the adhesive film. If such defects occur, there is a possibility that a defective semiconductor device may be produced. However, Patent Document 1 does not disclose a technique for suppressing the production of such defective semiconductor devices.

[0005] An object of the present disclosure is to provide an adhesive film that can suppress the occurrence of defective semiconductor devices, a method for manufacturing an adhesive film, and a method for manufacturing a semiconductor device. [Means for solving the problem]

[0006] [1] The adhesive film comprises a long base film, an adhesive layer and a pressure-sensitive adhesive film provided on one side of the base film, and a defect marking formed at least at the same position as the defect in the longitudinal direction of the base film.

[0007] In this adhesive film, a defect marking is formed at least at the same position as the defect in the longitudinal direction, so that the position of the defect in the longitudinal direction can be identified by detecting the defect marking. Here, when manufacturing a semiconductor device using the adhesive film, the adhesive layer and the adhesive film are precut to form multiple adhesive pieces, and these adhesive pieces are attached to a semiconductor wafer. At this time, by detecting the defect marking from the adhesive film, defect-free adhesive pieces can be attached to the semiconductor wafer. This makes it possible to suppress the generation of defective semiconductor devices.

[0008] [2] In the adhesive film according to [1], the defect marking may be formed on the surface of the adhesive film opposite the adhesive layer. In this adhesive film, the defect marking is formed on the surface of the adhesive film opposite the adhesive layer, so that the defect marking can be easily detected when detecting the defect marking from the side opposite the adhesive layer of the adhesive film.

[0009] [3] In the adhesive film according to [1] or [2], the defect marking may extend beyond both ends of the defect in the longitudinal direction. In this adhesive film, the defect marking extends beyond both ends of the defect in the longitudinal direction, making it possible to easily detect the defect marking. This further reduces the occurrence of defective semiconductor devices.

[0010] [4] In the adhesive film according to any one of [1] to [3], the defect marking may be formed in a line extending in the longitudinal direction. In this adhesive film, the defect marking is formed in a line extending in the longitudinal direction, so that the area in which the defect marking is formed can be made small.

[0011] [5] In the adhesive film according to any one of [1] to [4], the defect marking may be formed in an end region, which is an end region when the adhesive film is divided into three equal parts in the width direction of the base film. In this adhesive film, the defect marking is formed in the end region, which is an end region when the adhesive film is divided into three equal parts in the width direction, so that when the adhesive piece-intended region is circular, the region where the defect marking is formed can be made small.

[0012] [6] In the adhesive film according to any one of [1] to [5], the defect marking may be formed at a predetermined position in the width direction of the base film. In this adhesive film, the defect marking is formed at a predetermined position in the width direction, so that the defect marking can be easily detected.

[0013] [7] In the adhesive film described in [6], the adhesive film has a plurality of adhesive piece-intended regions in which the adhesive layer and the pressure-sensitive adhesive film are pre-cut into a plurality of adhesive pieces in a predetermined pattern, and the length of the defect marking in the longitudinal direction may be longer than the length of each of the plurality of adhesive piece-intended regions in the longitudinal direction at the width direction. In this adhesive film, the length of the defect marking in the longitudinal direction is longer than the length of each of the plurality of adhesive piece-intended regions in the longitudinal direction at the width direction. Therefore, when a defect marking is formed in the adhesive piece-intended region, a portion of the defect marking can be made to protrude from the adhesive piece-intended region. This makes it possible to easily detect the defect marking when the adhesive piece-intended region and the defect marking at least partially overlap.

[0014] [8] In the adhesive film according to [6] or [7], the adhesive film has a plurality of adhesive piece-intended regions that are formed into a plurality of adhesive pieces by pre-cutting the adhesive layer and the pressure-sensitive adhesive film in a predetermined pattern, and the length of the defect marking in the longitudinal direction may be longer than the distance between the plurality of adhesive piece-intended regions in the longitudinal direction at the width direction. In this adhesive film, since the length of the defect marking in the longitudinal direction is longer than the distance between the plurality of adhesive piece-intended regions in the longitudinal direction at the width direction, it can be said that at least a part of the defect mark is formed in the adhesive piece-intended region that includes the defect, regardless of the shape of the adhesive piece-intended region.

[0015] [9] The method for manufacturing an adhesive film according to the present disclosure comprises a preparation process for preparing an original film having a long base film and an adhesive layer and a pressure-sensitive adhesive film provided on one side of the base film, an inspection process for inspecting the original film, and, if a defect is detected in the inspection process, a marking process for forming a defect marking on the original film at least at the same position as the defect in the longitudinal direction of the base film.

[0016] In this method for manufacturing an adhesive film, if a defect is detected in an inspection of the original film, a defect marking is formed on the original film at least at the same position as the defect in the longitudinal direction. This makes it possible to manufacture an adhesive film on which a defect marking is formed at least at the same position as the defect in the longitudinal direction. Therefore, by manufacturing semiconductor devices using this adhesive film, it is possible to reduce the occurrence of defective semiconductor devices.

[0017]

[10] The method for manufacturing a semiconductor device according to the present disclosure includes a preparation step of preparing an adhesive film described in any one of [1] to [8], a cutting step of pre-cutting the adhesive layer and the adhesive film in a predetermined pattern to form a plurality of adhesive pieces, and an attachment step of attaching an adhesive piece among the plurality of adhesive pieces that does not have a defect marking formed thereon to a semiconductor wafer.

[0018] In this semiconductor device manufacturing method, the adhesive layer and pressure-sensitive adhesive film of the above-mentioned adhesive film are pre-cut in a predetermined pattern to form multiple adhesive pieces, and the adhesive pieces that do not have defect markings are attached to the semiconductor wafer, thereby suppressing the generation of defective semiconductor devices.

[0019]

[11] The method for manufacturing a semiconductor device according to

[10] may further include a detection step of detecting defect markings from the adhesive film, and in the cutting step, the adhesive layer and the adhesive film may be pre-cut in a predetermined pattern in a region in the longitudinal direction of the base film where no defect markings were detected in the detection step to form multiple adhesive pieces. In this method for manufacturing a semiconductor device, defect markings are detected from the adhesive film, and the adhesive layer and the adhesive film are pre-cut in a predetermined pattern in a region in the longitudinal direction of the base film where no defect markings were detected to form multiple adhesive pieces, so that multiple adhesive pieces without defects can be formed. Therefore, by attaching each of the multiple adhesive pieces formed to a semiconductor wafer, the occurrence of defective semiconductor devices can be suppressed.

[0020]

[12] The method for manufacturing a semiconductor device according to

[10] may further include a detection step of detecting a defect marking from the plurality of adhesive pieces, and in the attachment step, an adhesive piece for which no defect marking is detected in the detection step may be attached to the semiconductor wafer. In this method for manufacturing a semiconductor device, defect markings are detected from the plurality of adhesive pieces, and an adhesive piece for which no defect marking is detected is attached to the semiconductor wafer, thereby making it possible to suppress the generation of defective semiconductor devices. [Effects of the Invention]

[0021] According to the present disclosure, it is possible to suppress the occurrence of defective semiconductor devices. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 1 is a perspective view of an adhesive film according to an embodiment. [Figure 2]FIG. 2 is a plan view of the adhesive film shown in FIG. [Figure 3] FIG. 3 is a schematic cross-sectional view taken along line III-III shown in FIG. [Figure 4] FIG. 4 is a plan view for explaining the positions of the defect markings. [Figure 5] FIG. 5 is a plan view for explaining the positions of the defect markings. [Figure 6] FIG. 6 is a plan view for explaining the positions of the defect markings. [Figure 7] FIG. 7 is a schematic diagram showing the configuration of an inspection device that is applied to the adhesive film manufacturing method according to the embodiment. [Figure 8] FIG. 8 is a schematic diagram showing the configuration of a bonding apparatus that is applied to the semiconductor device manufacturing method according to the embodiment. [Figure 9] FIG. 9 is a schematic diagram showing the configuration of a bonding apparatus that is applied to the semiconductor device manufacturing method according to the embodiment. [Figure 10] FIG. 10 is a schematic diagram showing the configuration of a bonding device that is applied to the modified semiconductor device manufacturing method. [Figure 11] FIG. 11 is a schematic diagram showing the configuration of a bonding apparatus applied to the modified semiconductor device manufacturing method. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, an adhesive film and a method for manufacturing an adhesive film according to one aspect of the present disclosure will be described in detail with reference to the drawings. In the following description, the same or corresponding parts will be denoted by the same reference numerals, and duplicated explanations will be omitted.

[0024] In this specification and claims, the term "layer" encompasses not only a structure with a shape formed over the entire surface when viewed in a plan view, but also a structure with a shape formed on a portion of the surface. Furthermore, the term "process" includes not only an independent process but also a process that cannot be clearly distinguished from other processes, as long as the intended purpose of the process is achieved. Furthermore, a numerical range indicated using "to" indicates a range that includes the numerical values ​​before and after "to" as the minimum and maximum values, respectively. Furthermore, in numerical ranges described in stages in this specification, the upper or lower limit of a numerical range of a certain stage may be replaced with the upper or lower limit of the numerical range of another stage.

[0025] [Adhesive film] FIG. 1 is a perspective view of an adhesive film according to an embodiment. FIG. 2 is a plan view of the adhesive film shown in FIG. 1. FIG. 3 is a schematic cross-sectional view taken along line III-III in FIG. 2. The adhesive film 1 shown in FIGS. 1 to 3 is a film used, for example, in the manufacturing process of a semiconductor chip, which is one of the manufacturing processes for a semiconductor device. The adhesive film 1 is used, for example, to fix a semiconductor wafer in a back-grinding process, or to bond a semiconductor chip and a wafer in a bonding process. The adhesive film 1 is stored as a roll 9 wound in a roll. The adhesive film 1 is also unwound from the roll 9 when used. The roll 9 is the adhesive film 1 wound in a roll.

[0026] 1 to 3, the adhesive film 1 is composed of a long base film 2, an adhesive layer 3 and a pressure-sensitive adhesive film 4 provided on one surface 2a of the base film 2, and a defect marking 5. Here, the longitudinal direction of the base film 2 is referred to as the longitudinal direction LD, the width direction of the base film 2 is referred to as the width direction WD, and the thickness direction of the base film 2 is referred to as the thickness direction TD. The width direction WD is a direction perpendicular to the longitudinal direction LD and the thickness direction TD, and the thickness direction TD is a direction perpendicular to the longitudinal direction LD and the width direction WD.

[0027] The adhesive layer 3 is disposed on the base film 2, and the pressure-sensitive adhesive film 4 is disposed on the adhesive layer 3. That is, the adhesive film 1 is configured by laminating the base film 2, adhesive layer 3, and adhesive film 4 in this order in the thickness direction TD. The adhesive layer 3, for example, covers the entire surface of one surface 2a of the base film 2, and the adhesive film 4 covers the entire surface of the surface 3a of the adhesive layer 3 opposite to the base film 2. Although not shown in the figure, the adhesive film 4 is configured by the base film and an adhesive layer, and is disposed on the adhesive layer 3 so that the adhesive layer faces the adhesive layer 3.

[0028] The base film 2 is a film-like portion that serves as the base of the adhesive film 1. Examples of materials that can be used for the base film 2 include semi-aromatic polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, wholly aromatic polyester films, liquid crystalline aromatic polyester films, polyamide films, polyimide films, and polyamideimide films. The surface of the base film 2 may be subjected to a release treatment using silicone or the like.

[0029] The adhesive layer 3 is, for example, a film-like portion called an NCF (Non Conductive Film). Examples of materials constituting the adhesive layer 3 include electrically insulating thermosetting resins. Examples of thermosetting resins include epoxy resins, bismaleimide resins, triazine resins, polyimide resins, polyamide resins, cyanoacrylate resins, phenolic resins, unsaturated polyester resins, melamine resins, urea resins, polyurethane resins, polyisocyanate resins, furan resins, resorcinol resins, xylene resins, benzoguanamine resins, diallyl phthalate resins, silicone resins, polyvinyl butyral resins, siloxane-modified epoxy resins, siloxane-modified polyamideimide resins, and acrylate resins. These may be used alone or in combination.

[0030] The adhesive film 4 is, for example, a film-like portion called a backgrind tape. The adhesive film 4 may include one or more adhesive layers and one or more base layers, or may consist of one adhesive layer and one base layer. The thickness of the adhesive film 4 may be, for example, 10 μm to 200 μm, or 20 μm to 150 μm.

[0031] Examples of the substrate layer include plastic films such as polyester film, polytetrafluoroethylene film, polyethylene film, polypropylene film, and polymethylpentene film. Among these, polyester film is preferred, and polyethylene terephthalate film is more preferred. The substrate layer may be a mixture of two or more materials selected from the above materials, or a multi-layer structure of the above films. The thickness of the substrate layer may be, for example, 10 μm to 150 μm, or 20 μm to 120 μm.

[0032] The adhesive layer preferably has adhesive strength at room temperature and has the necessary adhesive strength to adhere to the adherend. The adhesive layer preferably has the property of being cured (its adhesive strength is reduced) by high-energy rays such as radiation or heat, but more preferably is easily peelable from the adhesive film 1 without the application of high-energy rays such as radiation or heat. The adhesive layer may be a pressure-sensitive adhesive layer. The adhesive layer can be formed using, for example, acrylic resin, various synthetic rubbers, natural rubber, or polyimide resin. The thickness of the adhesive layer may be, for example, 5 μm to 100 μm, or 10 μm to 80 μm.

[0033] As will be described later, in the manufacture of a semiconductor device using the adhesive film 1, the adhesive layer 3 and the adhesive film 4 on the base film 2 are pre-cut in a predetermined pattern using a cutting blade such as a roll blade. This pre-cutting is performed at predetermined positions in the width direction WD and at predetermined intervals in the longitudinal direction LD. As a result, a plurality of adhesive pieces 6 (see FIG. 8 ) consisting of a portion of the adhesive layer 3 and a portion of the adhesive film 4 are formed on the base film 2. The areas that will become the adhesive pieces through this pre-cutting are called adhesive piece-intended areas 7. In other words, the adhesive film 1 has a plurality of adhesive piece-intended areas 7 that will become the plurality of adhesive pieces 6 when the adhesive layer 3 and the adhesive film 4 are pre-cut in a predetermined pattern. The adhesive piece-intended areas 7 are, for example, circular areas. The adhesive pieces 6 are peeled off from the base film 2 and attached to a semiconductor wafer 102 (see FIG. 9 ). In the drawings, the dashed two-dot lines indicating the outer edges of the adhesive piece-intended areas 7 are imaginary lines and indicate the positions where the adhesive pieces are pre-cut when manufacturing the semiconductor device. Therefore, in the adhesive film 1, the adhesive layer 3 and the pressure-sensitive adhesive film 4 are not separated at the outer edge of the adhesive piece intended region 7, but are integrated inside and outside the adhesive piece intended region 7.

[0034] The defect marking 5 is a marking for indicating the position of a defect 8 in the adhesive film 1. The defect 8 may be, for example, a foreign object that has entered between the base film 2 and the adhesive layer 3, or between the adhesive layer 3 and the adhesive film 4, a scratch formed in the adhesive layer 3 or the adhesive film 4, a local change in thickness of the adhesive layer 3 or the adhesive film 4, or deterioration of the adhesive layer 3 or the adhesive film 4. Such a defect 8 may be formed, for example, in the form of a dot or a line. The drawings show, as an example, a case where the defect 8 is dot-shaped.

[0035] The defect marking 5 is formed at least at the same position as the defect 8 in the longitudinal direction LD. The defect marking 5 is formed at least at the same position as the defect 8 in the longitudinal direction LD means that at least a part of the defect marking 5 overlaps the entire defect 8 when viewed from the width direction WD. Therefore, the defect marking 5 may extend from a position overlapping with the defect 8 to a position not overlapping with the defect 8 when viewed from the width direction WD.

[0036] The defect marking 5 is formed on at least one of the surface 4a of the adhesive film 4 opposite the adhesive layer 3 and the surface 2b of the base film 2 opposite the adhesive layer 3. The defect marking 5 is formed, for example, on the surface 4a of the adhesive film 4 opposite the adhesive layer 3.

[0037] The defect marking 5 may be a letter or color printed on at least one of the adhesive film 4 and the base film 2, or may be a sticker attached to at least one of the adhesive film 4 and the base film 2.

[0038] The defect marking 5 is formed, for example, in a line extending in the longitudinal direction LD. The defect marking 5 may be formed in a line extending in the longitudinal direction LD by being formed in an elongated rectangular shape in the longitudinal direction LD.

[0039] FIG. 4 is a plan view illustrating the position of the defect marking. As shown in FIGS. 2 and 4, the defect marking 5 is formed at a widthwise position A, which is a predetermined position in the widthwise direction WD. The defect marking 5 is located, for example, in an end region B, which is an end region when the adhesive film 1 is divided into three equal parts, preferably four equal parts, or more preferably five equal parts in the widthwise direction WD. The drawings show, as an example, a case where the end regions B are the end regions when the adhesive film 1 is divided into three equal parts in the widthwise direction WD. The end regions B are located on both sides in the widthwise direction WD, and the defect marking 5 may be formed in either of the two end regions B. When identification information for identifying the adhesive film 1 is printed in one end region B, it is preferable that the defect marking 5 is formed in the other end region B. The identification information is composed of characters such as alphabets and numbers, for example.

[0040] The width W1 of the defect marking 5 in the width direction WD can be, for example, 5 mm or more and 10 mm or less, and preferably 6 mm or more and 9 mm or less.

[0041] The defect marking 5 may be formed at an end 1a of the adhesive film 1 in the width direction WD, or may be formed at a position spaced apart from the end 1a of the adhesive film 1 in the width direction WD. When the defect marking 5 is formed at a position spaced apart from the end 1a, the distance W2 between the end 1a in the width direction WD and the defect marking 5 can be, for example, 25 mm or more and 35 mm or less, preferably 27 mm or more and 33 mm or less, and more preferably 28 mm or more and 32 mm or less.

[0042] The defect marking 5 may extend to a position beyond both ends of the defect 8 in the longitudinal direction LD. Here, one direction in the longitudinal direction LD is referred to as a first longitudinal direction LD1, and the other direction is referred to as a second longitudinal direction LD2. Of the ends of the defect marking 5 in the longitudinal direction LD, the tip on the first longitudinal direction LD1 side is referred to as a first tip 5a, and the tip on the second longitudinal direction LD2 side is referred to as a second tip 5b. Of the ends of the defect 8 in the longitudinal direction LD, the tip on the first longitudinal direction LD1 side is referred to as a first tip 8a, and the tip on the second longitudinal direction LD2 side is referred to as a second tip 8b.

[0043] The first tip 5a of the defect marking 5 may be located closer to the first longitudinal direction LD1 than the first tip 8a of the defect 8. In this case, the distance L1 between the first tip 5a of the defect marking 5 and the first tip 8a of the defect 8 in the longitudinal direction LD can be, for example, 50 mm or more and 200 mm or less, preferably 80 mm or more and 180 mm or less, and more preferably 100 mm or more and 160 mm or less. Furthermore, the second tip 5b of the defect marking 5 may be located closer to the second longitudinal direction LD2 than the second tip 8b of the defect 8. In this case, the distance L2 between the second tip 5b of the defect marking 5 and the second tip 8b of the defect 8 in the longitudinal direction LD can be, for example, 50 mm or more and 200 mm or less, preferably 80 mm or more and 180 mm or less, and more preferably 100 mm or more and 160 mm or less.

[0044] Fig. 5 is a plan view illustrating the position of the defect marking. As shown in Fig. 5, the length L3 of the defect marking 5 in the longitudinal direction LD may be longer than the length L4 in the longitudinal direction LD of each of the plurality of adhesive tape intended areas 7 at the widthwise position A. The length L4 in the longitudinal direction LD of each of the plurality of adhesive tape intended areas 7 at the widthwise position A can be calculated from the geometric relationship between the position of the adhesive tape intended area 7 (precut), the shape of the adhesive tape intended area 7 (precut), and the widthwise position A.

[0045] Fig. 6 is a plan view illustrating the position of the defect marking. As shown in Fig. 6, the length L3 of the defect marking 5 in the longitudinal direction LD may be longer than the spacing L5 in the longitudinal direction LD of the multiple adhesive tape intended areas 7 at the widthwise position A. The spacing L5 in the longitudinal direction LD of the multiple adhesive tape intended areas 7 at the widthwise position A can be calculated from the geometric relationship between the position of the adhesive tape intended area 7 (precut), the shape of the adhesive tape intended area 7 (precut), and the widthwise position A.

[0046] [Adhesive film manufacturing method] Next, we will explain the method for manufacturing the adhesive film for manufacturing the above-mentioned adhesive film 1. The method for manufacturing the adhesive film according to this embodiment includes a preparation step, an inspection step, and a marking step in this order.

[0047] In the preparation step, a raw film 101 (see FIG. 7) is prepared, which includes a long base film 2, and an adhesive layer 3 and a pressure-sensitive adhesive film 4 provided on one surface 2a of the base film 2. The raw film 101 is a film on which no defect markings 5 ​​are formed in the adhesive film 1. In the preparation step, a roll of the raw film 101 wound into a roll is prepared as the raw film 101.

[0048] In the inspection process, the original film 101 is inspected while being unwound from the roll in which the original film 101 is wound. In the inspection process, the presence or absence of defects 8 in the original film 101 and the positions of the defects 8 are detected.

[0049] In the marking step, if a defect 8 is detected in the inspection step, a defect marking 5 is formed on the original film 101 at least in the longitudinal direction LD at the same position as the defect 8. The defect marking 5 is formed, for example, by printing the defect marking 5 on at least one of the adhesive film 4 and the base film 2, or by attaching a sticker with the defect marking 5. This produces an adhesive film 1 on which the defect marking 5 is formed at least in the longitudinal direction LD at the same position as the defect 8.

[0050] Each of the above steps is carried out, for example, using an inspection device 10 shown in Fig. 7. Fig. 7 is a schematic diagram showing the configuration of an inspection device applied to the adhesive film manufacturing method according to the embodiment. The inspection device 10 shown in Fig. 7 includes an inspection unit 11 and a marking forming unit 12. Although not shown, the inspection device 10 also includes a conveying device such as a conveying roller for conveying the original film 101 (adhesive film 1).

[0051] The inspection unit 11 has, for example, a light emitting unit that outputs detection light and a light receiving unit that receives the detection light that has been transmitted through or reflected by the original film 101. The inspection unit 11 detects the presence or absence of defects 8 and the positions of the defects 8 based on the contrast of the detection light that has been input to the light receiving unit.

[0052] The marking forming unit 12 has, for example, a printing device that prints the defect marking 5 on the original film 101, or an attachment device that attaches a sticker of the defect marking 5. The marking forming unit 12 then forms the defect marking 5 on the original film 101 at least in the longitudinal direction LD at the same position as the defect 8 inspected by the inspection unit 11. The position of the defect 8 on the original film 101 can be identified, for example, from the transport distance of the original film 101 from the inspection position of the inspection unit 11 to the formation position of the defect marking 5 in the marking forming unit 12, and the transport speed of the original film 101.

[0053] [Method of manufacturing a semiconductor device] Next, we will explain a method for manufacturing a semiconductor device using the above-mentioned adhesive film 1. The method for manufacturing a semiconductor device according to this embodiment includes, in this order, a preparation step, a detection step, a cutting step, a bonding step, a dicing step, and a bonding step.

[0054] In the preparation step, the above-mentioned adhesive film 1 is prepared. In the preparation step, for example, a roll 9 in which the adhesive film 1 is wound in a roll shape is prepared as the adhesive film 1.

[0055] In the detection step, the defect marking 5 is detected from the adhesive film 1 prepared in the preparation step. In the detection step, for example, the adhesive film 1 is unwound from a roll 9, and the defect marking 5 is detected from the adhesive film 1 while the adhesive film 1 is being transported. Here, if the adhesive layer 3 has low light transmittance, it is preferable in the detection step to detect the defect marking 5 from the side of the adhesive film 1 on which the defect marking 5 is formed. For example, if the defect marking 5 is formed on the side 4a of the adhesive film 4 opposite the adhesive layer 3, it is preferable to detect the defect marking 5 from the side of the adhesive film 4 opposite the adhesive layer 3 in the detection step.

[0056] In the cutting step, the adhesive layer 3 and the adhesive film 4 are pre-cut in a predetermined pattern to form a plurality of adhesive pieces 6. The pre-cutting is performed in an area in the longitudinal direction LD where no defect marking 5 was detected in the detection step. In other words, in an area in the longitudinal direction LD where no defect marking 5 was detected in the detection step, the adhesive layer 3 and the adhesive film 4 are not pre-cut, and no adhesive pieces 6 are formed.

[0057] In the bonding process, adhesive pieces 6 that do not have a defect marking 5 formed thereon are bonded to a semiconductor wafer 102 (see FIG. 9 ) from among the plurality of adhesive pieces 6 formed in the cutting process. In the preceding cutting process, a plurality of adhesive pieces 6 are formed by pre-cutting in an area in the longitudinal direction LD where no defect marking 5 was detected in the detection process, so all of the adhesive pieces 6 formed in the cutting process are adhesive pieces 6 that do not have a defect marking 5 formed thereon. Therefore, in the bonding process, any of the adhesive pieces 6 formed in the cutting process can be used to bond an adhesive piece 6 that does not have a defect marking 5 formed thereon to the semiconductor wafer 102.

[0058] Note that, as a step preceding the attachment step, a step of peeling off the adhesive layer 3 and the pressure-sensitive adhesive film 4 except for the plurality of adhesive pieces 6 from the base film 2 may be performed. Also, a step of peeling off the base film 2 from the plurality of adhesive pieces 6 may be performed in the attachment step.

[0059] In the dicing process, with the adhesive piece 6 consisting of the adhesive layer 3 and the adhesive film 4 attached to the semiconductor wafer 102, the semiconductor wafer 102 and the adhesive layer 3 are diced to separate into a plurality of semiconductor chips (not shown).

[0060] In the bonding step, the individual semiconductor chips are picked up from the adhesive film 4 and bonded to a member to be bonded, such as a circuit board, thereby manufacturing a semiconductor device.

[0061] The above steps are performed using, for example, a bonding device 20 shown in Figures 8 and 9. Figures 8 and 9 are schematic diagrams showing the configuration of a bonding device applied to a semiconductor device manufacturing method according to an embodiment. The bonding device 20 shown in Figures 8 and 9 includes a marking detection unit 21, a cutting unit 22, and a bonding unit 23. Although not shown, the bonding device 20 also includes a transport device such as a transport roller for transporting the adhesive film 1.

[0062] The marking detection unit 21 has, for example, a light emitting unit that outputs detection light and a light receiving unit that receives the detection light that has been transmitted through or reflected by the adhesive film 1. The marking detection unit 21 detects the defect marking 5 based on the contrast of the detection light that has been input to the light receiving unit.

[0063] The cutting unit 22 has, for example, a base and a cutting blade that presses against the adhesive film 1 from the opposite side of the base. The cutting blade is formed in a shape corresponding to the adhesive piece 6 (adhesive piece intended region 7). The cutting blade is, for example, a roll blade. The cutting unit 22 pre-cuts the adhesive layer 3 and the pressure-sensitive adhesive film 4 in a predetermined pattern in the adhesive piece intended region 7 in an area in the longitudinal direction LD where no defect marking 5 was detected in the detection process, to form a plurality of adhesive pieces 6. As a result, a plurality of adhesive pieces 6 are formed in the area in the longitudinal direction LD where no defect marking 5 was detected in the detection process.

[0064] The adhering unit 23 has, for example, a base and a pressing unit that presses the adhesive piece 6 against the semiconductor wafer 102 from the opposite side of the base. The adhering unit 23 then adheres, to the semiconductor wafer 102, an adhesive piece 6 that does not have a defect marking 5, out of the multiple adhesive pieces 6 formed by precutting in the cutting unit 22. The adhering unit 23 may peel off the base film 2 from the adhesive piece 6. In this way, the adhesive piece 6 that does not have a defect 8 is adhered to the semiconductor wafer 102.

[0065] Although not shown in the figure, the application device 20 may also be provided with a peeling section provided between the cutting section 22 and the application section 23, which peels off the adhesive layer 3 and the adhesive film 4 except for the multiple adhesive pieces 6.

[0066] As explained above, in the adhesive film 1 according to this embodiment, the defect marking 5 is formed at least at the same position as the defect 8 in the longitudinal direction LD, and therefore, by detecting the defect marking 5, the position of the defect 8 in the longitudinal direction LD can be identified. Here, when manufacturing a semiconductor device using the adhesive film 1, the adhesive layer 3 and the pressure-sensitive adhesive film 4 are pre-cut to form a plurality of adhesive pieces 6, and these adhesive pieces 6 are attached to the semiconductor wafer 102. At this time, by detecting the defect marking 5 from the adhesive film 1, adhesive pieces 6 without defects 8 can be attached to the semiconductor wafer 102. This makes it possible to suppress the occurrence of defective semiconductor devices.

[0067] Furthermore, in this adhesive film 1, the defect marking 5 is formed on the surface 4a opposite the adhesive layer 3 of the adhesive film 4, so that the defect marking 5 can be easily detected when detecting the defect marking 5 from the side opposite the adhesive layer 3 of the adhesive film 4.

[0068] Furthermore, in this adhesive film 1, the defect marking 5 extends to a position beyond both ends of the defect 8 in the longitudinal direction LD, making it possible to easily detect the defect marking 5. This further reduces the occurrence of defective semiconductor devices.

[0069] Furthermore, in this adhesive film 1, the defect markings 5 ​​are formed in the form of lines extending in the longitudinal direction LD, so that the area in which the defect markings 5 ​​are formed can be made small.

[0070] Furthermore, in this adhesive film 1, the defect marking 5 is formed in the end region B, which is the end region when the adhesive film 1 is divided into three equal parts, preferably four equal parts, and more preferably five equal parts in the width direction WD, so that when the adhesive piece intended region 7 is circular, the region in which the defect marking is formed can be made smaller.

[0071] Furthermore, in this adhesive film 1, the defect marking 5 is formed at the width direction position A, which is a predetermined position in the width direction WD, so that the defect marking 5 can be easily detected.

[0072] Furthermore, in this adhesive film 1, the length L3 of the defect marking 5 in the longitudinal direction LD is longer than the length L4 of each of the plurality of adhesive piece intended regions 7 in the longitudinal direction LD at the width direction position A, so that when the defect marking 5 is formed in the adhesive piece intended region 7, a part of the defect marking 5 can be made to protrude from the adhesive piece intended region 7. This makes it possible to easily detect the defect marking 5 when the adhesive piece intended region 7 and the defect marking 5 at least partially overlap each other.

[0073] Furthermore, in this adhesive film 1, the length L3 of the defect marking 5 in the longitudinal direction is longer than the spacing L5 in the longitudinal direction LD of the multiple adhesive piece intended areas 7 at the widthwise position A, so that at least a portion of the defect marking 5 can be formed in the adhesive piece intended area 7 including the defect 8 regardless of the shape of the adhesive piece intended area 7.

[0074] In the adhesive film manufacturing method according to this embodiment, when a defect 8 is detected during inspection of the original film 101, a defect marking 5 is formed on the original film 101 at least in the longitudinal direction LD at the same position as the defect 8. This makes it possible to manufacture an adhesive film 1 on which the defect marking 5 is formed at least in the longitudinal direction LD at the same position as the defect 8. Therefore, by manufacturing a semiconductor device using this adhesive film 1, it is possible to suppress the occurrence of defective semiconductor devices.

[0075] In the semiconductor device manufacturing method of this embodiment, the adhesive layer 3 and the adhesive film 4 of the above-mentioned adhesive film 1 are pre-cut in a predetermined pattern to form multiple adhesive pieces 6, and the adhesive pieces 6 that do not have defect markings 5 ​​are attached to the semiconductor wafer 102, thereby suppressing the generation of defective semiconductor devices.

[0076] Furthermore, in this semiconductor device manufacturing method, defect markings 5 ​​are detected from the adhesive film 1, and in areas in the longitudinal direction where defect markings 5 ​​are not detected, the adhesive layer 3 and the adhesive film 4 are pre-cut in a predetermined pattern to form multiple adhesive pieces 6, so that multiple adhesive pieces 6 without defects 8 can be formed. Therefore, by attaching each of the multiple formed adhesive pieces 6 to the semiconductor wafer 102, it is possible to suppress the generation of defective semiconductor devices.

[0077] The above describes an adhesive film, a method for manufacturing an adhesive film, and a method for manufacturing a semiconductor device according to one embodiment of the present disclosure, but the present disclosure is not limited to the above-described embodiment, and appropriate modifications can be made within the scope that does not deviate from the spirit thereof.

[0078] For example, the adhesive film 1 of the above embodiment has been described as having the adhesive layer 3 covering the entire surface of one surface 2a of the base film 2, and the pressure-sensitive adhesive film 4 covering the entire surface of the surface 3a of the adhesive layer 3. However, the adhesive layer 3 does not have to cover the entire surface of one surface 2a of the base film 2. Furthermore, the pressure-sensitive adhesive film 4 does not have to cover the entire surface of the surface 3a of the adhesive layer 3.

[0079] The semiconductor device manufacturing method of the above embodiment has been described as including a preparing step, a detecting step, a cutting step, and a bonding step in this order. However, the semiconductor device manufacturing method may include a preparing step, a cutting step, a detecting step, and a bonding step in this order.

[0080] [Modification of Semiconductor Device Manufacturing Method] The method for manufacturing a semiconductor device according to the modified example includes a preparing step, a cutting step, a detecting step, an attaching step, a dicing step, and a bonding step in this order.

[0081] In the preparation step of the modified example, the adhesive film 1 described above is prepared in the same manner as in the preparation step of the above embodiment.

[0082] In the cutting step of the modified example, the adhesive layer 3 and the adhesive film 4 are pre-cut in a predetermined pattern to form a plurality of adhesive pieces 6. The pre-cutting is performed so that adhesive pieces 6 are formed in all of the adhesive piece-planned regions 7.

[0083] In the detection step of the modified example, the defect marking 5 is detected from the plurality of adhesive pieces 6 formed in the cutting step. That is, in the detection step of the modified example, the adhesive pieces 6 on which the defect marking 5 is formed are detected.

[0084] In the bonding step of the modified example, an adhesive piece 6 in which no defect marking was detected in the detection step is bonded to the semiconductor wafer 102. In the cutting step, the adhesive layer 3 and the adhesive film 4 are pre-cut in a predetermined pattern to form a plurality of adhesive pieces 6 regardless of whether or not there are defects 8, but in the bonding step, an adhesive piece 6 in which no defect marking was detected in the previous detection step is bonded to the semiconductor wafer 102, so that an adhesive piece 6 in which no defect marking 5 is formed can be bonded to the semiconductor wafer 102.

[0085] As in the above embodiment, a step of peeling the adhesive layer 3 and the pressure-sensitive adhesive film 4 other than the plurality of adhesive pieces 6 from the base film 2 may be performed as a pre-step of the attachment step. Also, a step of peeling the base film 2 from the plurality of adhesive pieces 6 may be performed in the attachment step.

[0086] The dicing and bonding steps can be the same as those in the above embodiment.

[0087] Each step of the above-described modified example is performed using, for example, a bonding apparatus 30 shown in Figures 10 and 11. Figures 10 and 11 are schematic diagrams showing the configuration of a bonding apparatus applied to the modified semiconductor device manufacturing method. The bonding apparatus 30 shown in Figures 10 and 11 includes a cutting unit 31, a marking detection unit 32, and a bonding unit 33. Although not shown, the bonding apparatus 30 also includes a conveying device such as a conveying roller for conveying the adhesive film 1.

[0088] The cutting unit 31, like the cutting unit 22 in the above embodiment, has, for example, a base and a cutting blade that is pressed against the adhesive film 1 from the opposite side of the base. The cutting blade is formed in a shape corresponding to the adhesive pieces 6 (adhesive piece-planned regions 7). The cutting unit 31 then pre-cuts the adhesive layer 3 and the pressure-sensitive adhesive film 4 in a predetermined pattern to form a plurality of adhesive pieces 6 so that adhesive pieces 6 are formed in all of the adhesive piece-planned regions 7.

[0089] The marking detection unit 32, like the marking detection unit 21 of the above embodiment, has, for example, a light emitting unit that outputs detection light and a light receiving unit that receives the detection light that has been transmitted through or reflected by the adhesive film 1. The marking detection unit 32 then detects the defective markings 5 ​​from the plurality of adhesive pieces 6 formed in the cutting unit 31 based on the contrast of the detection light that has been input to the light receiving unit, etc. In other words, the marking detection unit 32 detects the adhesive pieces 6 on which the defective markings 5 ​​are formed.

[0090] The adhering unit 33, like the adhering unit 23 in the above embodiment, has, for example, a base portion and a pressing portion that presses the adhesive piece 6 against the semiconductor wafer 102 from the opposite side of the base portion. Then, the adhering unit 33 adheres the adhesive piece 6, for which no defect marking has been detected by the marking detection unit 32, to the semiconductor wafer 102. As in the above embodiment, the adhering unit 33 may peel off the base film 2 from the adhesive piece 6. In this way, the adhesive piece 6 that does not have any defect 8 is adhered to the semiconductor wafer 102.

[0091] Although not shown in the figure, similar to the above embodiment, the application device 30 may be provided with a peeling section provided between the cutting section 31 and the marking detection section 32, which peels off the adhesive layer 3 and the adhesive film 4 except for the multiple adhesive pieces 6.

[0092] As described above, in the modified semiconductor device manufacturing method, defective markings 5 ​​are detected from multiple adhesive pieces 6, and adhesive pieces 6 in which defective markings 5 ​​are not detected are peeled off from the base film 2 and attached to the semiconductor wafer 102, thereby suppressing the generation of defective semiconductor devices. [Explanation of symbols]

[0093] 1...adhesive film, 1a...edge, 2...base film, 2a...one side, 2b...side, 3...adhesive layer, 3a...side, 4...adhesive film, 4a...side, 5...defect marking, 5a...first tip, 5b...second tip, 6...adhesive piece, 7...adhesive piece intended area, 8...defect, 8a...first tip, 8b...second tip, 9...roll, 10...inspection device, 11...inspection section, 12...marking formation section, 20...bonding device, 21...marking detection section, 22...cutting section, 23...bonding section, 30...bonding device, 31...cutting section, 32...marking detection section, 33...bonding section, 101...original film, 102...semiconductor wafer, A...width direction position, B...edge region, LD...longitudinal direction, LD1...first longitudinal direction, LD2...second longitudinal direction, TD...thickness direction, WD...width direction.

Claims

1. A long base film, An adhesive layer and a pressure-sensitive adhesive film provided on one side of the base film; and a defect marking formed at least at the same position as the defect in the longitudinal direction of the base film. Adhesive film.

2. The defect marking is formed on the surface of the adhesive film opposite to the adhesive layer. The adhesive film according to claim 1 .

3. the defect marking extends to a position beyond both ends of the defect in the longitudinal direction; The adhesive film according to claim 1 .

4. the defect marking is formed in a linear shape extending in the longitudinal direction; The adhesive film according to claim 1 .

5. The defect marking is formed in an end region, which is an end region when the adhesive film is divided into three equal parts in the width direction of the base film. The adhesive film according to claim 1 .

6. the defect marking is formed at a widthwise position that is a predetermined position in the width direction of the base film; The adhesive film according to claim 1 .

7. The adhesive film has a plurality of adhesive piece planned regions that become a plurality of adhesive pieces by pre-cutting the adhesive layer and the pressure-sensitive adhesive film in a predetermined pattern, a length of the defect marking in the longitudinal direction is longer than a length of each of the plurality of adhesive piece intended regions in the width direction; The adhesive film according to claim 6.

8. The adhesive film has a plurality of adhesive piece planned regions that become a plurality of adhesive pieces by pre-cutting the adhesive layer and the pressure-sensitive adhesive film in a predetermined pattern, a length of the defect marking in the longitudinal direction is longer than a distance between the plurality of adhesive piece-intended regions in the longitudinal direction at the widthwise position; The adhesive film according to claim 6.

9. A preparation step of preparing a raw film including a long base film and an adhesive layer and a pressure-sensitive adhesive film provided on one side of the base film; an inspection step of inspecting the original film; and a marking step of forming a defect marking on the original film at at least the same position as the defect in the longitudinal direction of the base film if a defect is detected in the inspection step. Method for manufacturing adhesive film.

10. A preparation step of preparing the adhesive film according to any one of claims 1 to 8; a cutting step of pre-cutting the adhesive layer and the pressure-sensitive adhesive film in a predetermined pattern to form a plurality of adhesive pieces; and a bonding step of bonding an adhesive piece on which the defect marking is not formed, among the plurality of adhesive pieces, to a semiconductor wafer. A method for manufacturing a semiconductor device.

11. a detecting step of detecting the defect marking from the adhesive film; In the cutting step, the adhesive layer and the pressure-sensitive adhesive film are pre-cut in a predetermined pattern in an area in the longitudinal direction of the base film where the defective marking is not detected in the detection step, to form the plurality of adhesive pieces. The method for manufacturing a semiconductor device according to claim 10.

12. a detection step of detecting the defect marking from the plurality of adhesive pieces, In the attaching step, the adhesive piece on which the defect marking is not detected in the detection step is attached to the semiconductor wafer. The method for manufacturing a semiconductor device according to claim 10.

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