Inspection apparatus and inspection method using the same

Abstract

To provide an inspection device for inspecting the state of a conveyance case used in a semiconductor manufacturing line, and to provide an inspection method.SOLUTION: A holding unit 1 configured to hold the conveyance case 9, a laser light source 22 configured to emit a laser toward the conveyance case 9, and a support frame 21 to which the laser light source 22 is attached, the laser light source 22 and the support frame 21 being disposed apart from each other; And an image capture 23 for generating an analysis image by photographing a light pattern formed on the conveyance case 9 by the laser for structured irradiation emitted from the laser light source 22, and a processing means 3 having a determination module 31 for generating a corresponding detection signal by determining a state of the conveyance case 9 based on the analysis image received from the image capture 23 by signal connection with the image capture 23.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an inspection device for transport cases used in a semiconductor manufacturing line and an inspection method using the inspection device. [Background technology]

[0002] Transport cases (magazines) used in semiconductor manufacturing lines store and transport semiconductor workpieces for processing, such as packaging and plating. The dimensions and specifications of the transport cases that store the semiconductor workpieces vary depending on the dimensions and specifications of the workpieces being processed. Furthermore, the dimensions and specifications of accessories such as stoppers and caps attached to the openings of the transport cases also vary. Therefore, unless accessories such as stoppers and caps are inspected and confirmed to be correctly attached, the semiconductor manufacturing line will not operate smoothly.

[0003] Furthermore, Patent Document 1 describes a technique for removing a substrate from a transport case. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Taiwan Patent Publication No. 460690 Specification Summary of the Invention [Problem to be solved by the invention]

[0005] SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an inspection device for inspecting the condition of transport cases used exclusively in semiconductor manufacturing lines, and an inspection method using the inspection device. [Means for solving the problem]

[0006] In order to achieve the above object, the present invention provides an inspection device that is applied to a transport case used in a semiconductor manufacturing line, comprising: a holding means configured to hold the carrying case; a structured irradiation means including a laser light source disposed at a distance from the holding means and emitting a laser beam toward the carrying case, a support frame to which the laser light source is attached, and an image capture disposed at a distance from the laser light source and capturing an image of a light pattern formed on the carrying case by the structured irradiation laser emitted by the laser light source to generate an image for analysis; and processing means having a judgment module signally connected to the image capture of the structured illumination means to judge the state of the transport case based on the analysis image received from the image capture and generate a corresponding detection signal.

[0007] The present invention also provides an inspection method for inspecting a transport case used in a semiconductor manufacturing line using the inspection device, comprising: a holding step of holding the transport case in the holding means; an irradiation step in which the laser light source of the structured irradiation means emits the structured irradiation laser toward the carrying case, thereby forming the light pattern extending along a second axis line perpendicular to the first axis line on the carrying case, and the image capture captures the light pattern and outputs it to the processing means as the analysis image; a definition step in which the judgment module of the processing means determines a detection range for the received analysis image, and sets first and second reference lines that are spaced apart from each other in the direction of the first axis within the detection range based on the specifications of the transport case and indicate an upper limit position and a lower limit position, respectively, thereby defining a tolerance range between the first reference line and the second reference line; an analysis step in which the determination module of the processing means recognizes a portion of the light pattern that is within the detection range as a detection logic portion, and generates the detection signal as a signal containing information indicating whether the detection logic portion is beyond the first reference line or the second reference line from the tolerance range along the first axis; The present invention also provides an inspection method in which the determination module executes a determination step of determining whether or not to suspend operation of the semiconductor manufacturing line based on the generated detection signal. [Effects of the Invention]

[0008] The inspection device of the present invention can form a light pattern at a specific position on a transport case used in a semiconductor production line by irradiating the transport case with a structured irradiation laser emitted from a laser light source possessed by a structured irradiation means. This light pattern can then be identified from the analysis image to perform specialized detection such as whether a cap is attached to the transport case or whether the position of a stopper is correct, thereby ensuring the smooth operation of the semiconductor production line. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a partial front view of an embodiment of an inspection device according to the present invention when used in a semiconductor manufacturing line; [Figure 2] 1 is a perspective view showing an example of the configuration of a transport case inspected by an inspection device of the present invention; [Figure 3] 2 is an explanatory diagram illustrating the positional relationship between a laser light source 22 and an image capture 23 of the structured irradiation means in the inspection device of the present invention. FIG. [Figure 4] 1 is a flowchart showing an embodiment of an inspection method of the present invention. [Figure 5] 1 is an explanatory diagram illustrating a definition step of the inspection method of the present invention; [Figure 6] FIG. 2 is an explanatory diagram illustrating the results obtained by the analysis step of the testing method of the present invention. [Figure 7] FIG. 10 is a perspective view showing another example of the configuration of a transport case inspected by the inspection device of the present invention. [Figure 8] 8 is an explanatory diagram illustrating the results of an analysis process performed on the transport case shown in FIG. 7. FIG. [Figure 9]8 is an explanatory diagram illustrating the results of an analysis process performed on the transport case shown in FIG. 7. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] Before describing the present invention in detail, it should be noted that in the following description, elements with similar functions are numbered the same even if the configuration is not identical.

[0011] As shown in Figures 1 and 2, the inspection device of the present invention is applied to a transport case 9 used in a semiconductor production line, and comprises: holding means 1 configured to be able to hold the transport case 9; structured irradiation means 2 having a laser light source 22 arranged at a distance from the holding means 1 and emitting a laser toward the transport case 9, a support frame 21 to which the laser light source 22 is attached, and an image capture 23 arranged at a distance from the laser light source 22 and capturing a light pattern formed on the transport case 9 by the structured irradiation laser emitted by the laser light source 22 to generate an image for analysis; and processing means 3 having a judgment module 31 that is signal-connected to the image capture 23 of the structured irradiation means 2 and judges the state of the transport case 9 based on the image for analysis received from the image capture 23 and generates a corresponding detection signal.

[0012] In this embodiment, the specifications of the carrying case 9 include a case body 91 that extends along the first axis L1 and has openings 910 at both ends, and two caps 92 that are attached to cover the two openings 910 of the case body 91, although only one opening 910 and one cap 92 are shown in the drawing due to the angle. In addition, to accommodate various cap specifications, two identification slits 911 are formed on one side of the case body 91, each extending from one opening 910 toward the other opening 910 in a manner parallel to the first axis L1.

[0013] The holding means 1 is a base that holds the transport case 9, and this allows the transport case 9 to be positioned appropriately in accordance with the processing equipment and transport equipment (not shown) in the semiconductor manufacturing line.

[0014] In this embodiment, the structured irradiation means 2 has two laser light sources 22 arranged on a support frame 21 at a distance from each other along a third axis L3 which is in the vertical direction and movable along the third axis L3.

[0015] Here, the position of the laser light source 22 that irradiates the structuring irradiation laser can be adjusted by the above-mentioned movement, and the structuring irradiation laser is irradiated onto any one of the identification slits 911 in a direction oblique to the third axis L3. Therefore, the present invention can accurately irradiate a desired target position on the transport case 9 by changing the irradiation direction and angle of the structuring irradiation laser emitted by the laser light source 22.

[0016] In this embodiment, the laser light source 22 of the structuring irradiation means 2 emits a structuring irradiation laser toward the location where the identification slit 911 is formed on the carrying case 9. This forms a light pattern on the carrying case 9 extending along a second axis L2 perpendicular to both the first axis L1 and the third axis L3. The image capture 23 then captures the light pattern and outputs it to the processing means 3 as an analysis image. A CCD camera can be used as the image capture 23, but other imaging means can be used as long as they are capable of capturing an analysis image that allows the judgment module 31 to make an analytical judgment in the irradiation environment required for semiconductor production line operation. The image capture 23 captures the carrying case 9 in a direction parallel to the third axis L3, which is the vertical direction, thereby avoiding any blocking by the laser light source 22. Furthermore, the laser light source 22, which obliquely irradiates the carrying case 9 with the structuring irradiation laser, is positioned away from the image capture 23 along the first axis L1, as shown in FIG. 3 .

[0017] The processing means 3 has a judgment module 31 that is connected to the image capture 23 via signals, analyzes the analysis image output from the image capture 23, and outputs a detection signal indicating the status of the case 9. The judgment module 31 can be realized, for example, as a program executed by a computer that controls the operation of each part in the production line to which the present invention is applied, or as an assembly of hardware required for image recognition to analyze the analysis image.

[0018] 4 shows an embodiment of the method for inspecting a transport case used in a semiconductor manufacturing line of the present invention. As shown, this inspection method utilizes the inspection device of the present invention and will be described using the transport case 9 equipped with the cap 92 shown in FIG. 2. This embodiment of the method includes a holding step 61, an irradiating step 62, a defining step 63, an analyzing step 64, and a determining step 65.

[0019] As shown in Figures 4, 1 and 2, the holding process 61 places the transport case 9 in the holding means 1, which allows the transport case 9 to be stably held in the correct position, making the subsequent detection process and processing smoother.

[0020] In the irradiation step 62, after appropriately adjusting each laser light source 22 of the structured irradiation means 2, the structured irradiation laser emitted by each laser light source 22 is irradiated obliquely onto the top of the carrying case 9 to form a light pattern, and the carrying case 9 is photographed with the image capture 23 to obtain an image for analysis. Here, each structured irradiation laser is generally based on a position where it crosses each identification slit 911 along the second axis L2, as shown in Figure 2, thereby clearly showing the difference in light pattern that occurs depending on whether or not the cap 92 is attached.

[0021] 5 and 4, the definition step 63 determines the detection range Z within which the judgment module 31 (see FIG. 1) will perform image recognition by writing specific logic into the analysis image using software, and also sets a first reference line A1 and a second reference line A2 spaced apart along the first axis L1 within the detection range Z, with the first reference line A1 indicating the upper limit position and the second reference line A2 indicating the lower limit position. This defines the tolerance range between the first reference line A1 indicating the upper limit position and the second reference line A2 indicating the lower limit position. The first reference line A1 and the second reference line A2 are set based on the specifications of the transport case 9.

[0022] In the analysis step 64, the judgment module 31 recognizes the portion of the light pattern within the detection range Z as a detection logic portion, and analyzes whether this detection logic portion exceeds the tolerance along the first axis L1. Note that in this embodiment, only the method for recognizing the structured irradiation laser on one side is described, but the method performed on the other side is exactly the same.

[0023] As shown in FIGS. 5, 6, and 1, there are two types of light patterns: a single line extending along the second axis L2 as shown in FIG. 6, and two separate lines extending along the second axis L2 as shown in FIG. 5. For a carrying case 9 with this specification, a light pattern corresponding to the position of the identification slit 911 is set as the detection logic portion. In the carrying case 9, the light pattern generated on the side where the cap 92 is attached to the opening 910 of the case body 91 is not separated by the identification slit 911 because the identification slit 911 is not exposed. Furthermore, the presence of the cap 92 causes a misalignment. Therefore, the detection logic portion exceeds the tolerance range along the first axis L1, as shown in FIG. 6. On the other hand, when the light pattern is separated as shown in FIG. 5, the light pattern is recognized as being separated by the identification slit 911, and this can be interpreted as indicating that the cap 92 is not attached. In addition, at this time, the detection logic portion of the light pattern does not exceed the allowable range along the first axis L1, so the cap 92 is not attached to the case body 91 of the transport case 9. That is, in the analysis step 64, a detection signal is output as a signal including information indicating whether or not the detection logic portion exceeds the allowable range along the first axis L1.

[0024] 4 to 6 and 1, in judgment step 65, judgment module 31 judges whether or not to suspend operation of the semiconductor production line based on this detection signal. Specifically, if the detection signal indicates that cap 92 is not attached, that is, opening 910 of case body 91 is open, meaning that semiconductor components inside transport case 9 can be removed, it is judged that the semiconductor production line can continue to operate. Conversely, if the detection signal indicates that cap 92 is attached, that is, opening 910 of case body 91 is not open, meaning that semiconductor components inside transport case 9 cannot be removed, it is judged that continuing operation of the semiconductor production line would lead to operational errors or damage to the equipment, and an error signal is output or even operation of the semiconductor production line is suspended.

[0025] 7 to 9 and 4 show another embodiment of the inspection method of the present invention. As shown, in this embodiment, only the specifications of the carrying case 9 are different. The carrying case 9 is configured to include a case body 91 extending along a first axis L1 and having openings 910 formed at both ends along the first axis L1, a stopper 93 pivotally supported by the case body 91 and movable between a blocking position located at one of the openings 910 of the case body 91 and blocking the opening 910, and an open position away from the opening 910 and not blocking the opening 910, and an interlocking module 94 connected to the stopper 93, exposed to the outside of the case body 91, and switching between a first state and a second state to drive the movement of the stopper 93 between the open position and the blocking position. Therefore, in the irradiation step 62, the structured irradiation laser is irradiated onto the interlocking module 94 of the carrying case 9.

[0026] In an embodiment using a carrying case 9 having such a structure, when the light pattern shows that a short linear sector away from a long linear sector aligns with another short linear sector, as shown in FIG. 8, the interlocking module 94 is in a first state and the stopper 93 is in the open position. When the light pattern shows that a short linear sector away from a long linear sector aligns with the long linear sector, as shown in FIG. 9, the interlocking module 94 is in a second state and the stopper 93 is in the blocked position. Therefore, in this embodiment, the short linear sector away from the long linear sector is set as a detection logic portion, and this detection logic portion determines whether the first reference line A1 or the second reference line A2 has exceeded the tolerance range. Specifically, when the detection logic portion determines that the second reference line A2 has exceeded the tolerance range, as shown in FIG. 9, it can be determined that the stopper 93 is in the blocked position. In this way, the inspection method of the present invention utilizes the inspection device of the present invention to perform professional inspections on transport cases 9 of such specifications, ensuring that the transport cases 9 are in the correct condition at each process of the semiconductor production line, and that the workpieces to be processed can be removed or placed inside, thereby ensuring the normal operation of the semiconductor production line.

[0027] To summarize the above, the inspection device and inspection method of the present invention are applicable to transport cases used in semiconductor production lines, and according to different specifications of the transport case 9, a light pattern is formed at a specific position on the transport case 9 by the structured irradiation laser irradiated by the structured irradiation means 2, and the judgment module 31 of the processing means 3 recognizes the image for analysis and can read the state of the transport case 9 from the light pattern, thereby providing professional and accurate detection to the semiconductor production line. Thus, the object of the present invention is reliably achieved.

[0028] Although the embodiment of the present invention has been described above, the present invention is not limited to this, and various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0029] 1 Holding means 2 Structured irradiation means 21 Support Frame 22 Laser light source 23 Image Capture 3. Processing Methods 31 Judgment Module 61 Holding process 62 Irradiation process 63 Definition process 64 Analysis process 65 Judgment process 9 Transport Case 91 Case body 910 Aperture 911 Identification slit 92 Cap 93 Stopper 94 Interlocking Module A1 First Reference Line A2 Second Reference Line L1 First axis L2 Second axis L3 Third axis Z detection range

Claims

1. An inspection device applied to a transport case used in a semiconductor manufacturing line, a holding means configured to hold the carrying case; a structured irradiation means including a laser light source disposed at a distance from the holding means and emitting a laser beam toward the carrying case, a support frame to which the laser light source is attached, and an image capture disposed at a distance from the laser light source and capturing an image of a light pattern formed on the carrying case by the structured irradiation laser emitted by the laser light source to generate an image for analysis; and processing means having a determination module signally connected to the image capture of the structured illumination means to determine the state of the transport case based on the analysis image received from the image capture and generate a corresponding detection signal.

2. the carrying case has a case body extending along a first axis and formed with openings at both ends, and two caps attached to cover the two openings of the case body, respectively; Furthermore, two identification slits are formed on one surface of the case body, each extending from one of the openings to the other opening in parallel with the first axis, 2. The inspection device according to claim 1, wherein the structured irradiation laser emitted by the laser light source of the structured irradiation means toward the location where the identification slit is formed on the carrying case forms a light pattern on the carrying case extending along a second axis perpendicular to the first axis, and the light pattern is captured by the image capture and output to the processing means as the image for analysis.

3. The carrying case includes a case body extending along a first axis and having an opening at at least one end; a stopper pivotally supported on the case body and movable between a blocking position at one of the openings of the case body to block the opening and an open position away from the opening so as not to block the opening; a linking module connected to the stopper and exposed to the outside of the case body, the linking module driving the movement of the stopper between the blocking position and the open position, 2. The inspection device of claim 1, wherein the structured irradiation laser emitted by the laser light source of the structured irradiation means toward the location of the transport case where the interlocking module is formed forms a light pattern on the transport case extending along a second axis perpendicular to the first axis, and the light pattern is captured by the image capture and output to the processing means as the analysis image.

4. 4. The inspection device according to claim 2, wherein the laser light source of the structured irradiation means is arranged on the support frame so as to be movable along a third axis perpendicular to both the first axis and the second axis.

5. 5. The inspection device according to claim 4, wherein said structured irradiation means comprises two of said laser light sources arranged on said support frame with a space between them.

6. The image capture of the structured illumination means comprises: The inspection device according to claim 2 or 3, which is disposed apart from the laser light source along the first axis.

7. The inspection device according to claim 6 , wherein the image capture is performed toward the transport case in a direction parallel to a third axis that is perpendicular to both the first axis and the second axis.

8. 10. An inspection method for inspecting a transport case used in a semiconductor manufacturing line using the inspection device according to claim 1, comprising: a holding step of holding the transport case in the holding means; an irradiation step in which the laser light source of the structured irradiation means emits the structured irradiation laser toward the carrying case, thereby forming the light pattern extending along a second axis line perpendicular to the first axis line on the carrying case, and the image capture captures the light pattern and outputs it to the processing means as the analysis image; a definition step in which the judgment module of the processing means determines a detection range for the received analysis image, and sets first and second reference lines that are spaced apart from each other in the direction of the first axis within the detection range based on the specifications of the transport case and indicate an upper limit position and a lower limit position, respectively, thereby defining a tolerance range between the first reference line and the second reference line; an analysis step in which the determination module of the processing means recognizes a portion of the light pattern that is within the detection range as a detection logic portion, and generates the detection signal as a signal that includes information indicating whether the detection logic portion is beyond the first reference line or the second reference line from the tolerance range along the first axis; the determination module executes a determination step of determining whether or not to suspend operation of the semiconductor manufacturing line based on the generated detection signal.

Images