In-cell touch display panel

Abstract

The present disclosure relates to an in-cell touch display panel.SOLUTION: According to an aspect of the present disclosure, there is provided an in-cell touch display panel including a first common electrode connected to N * M first pixels disposed in a display area, a second common electrode connected to N * M second pixels disposed in the display area, and a first pixel driver disposed in the display area to write pixel data to the first pixels and the second pixels and supply voltages to the first common electrode and the second common electrode, where N and M are each a positive integer of 2 or more.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0099484, filed on July 26, 2024, the entire contents of which are incorporated herein by reference.

[0002] The present invention relates to display panels, particularly but not exclusively to in-cell touch display panels. [Background technology]

[0003] Display devices are applied to various electronic devices such as televisions, mobile phones, video phones, smart watches, watch phones, wearable devices, foldable devices, portable multimedia players (PMPs), personal digital assistants (PDAs), laptops, and tablets.

[0004] Display devices include organic light-emitting displays (OLEDs), which emit light themselves, liquid crystal displays (LCDs), which require a separate light source, plasma display panels (PDPs), electroluminescent displays, electrowetting displays, electrophoretic displays (EPDs), stretchable displays, and flexible displays.

[0005] Recently, display devices including inorganic light emitting diodes (LEDs) have been attracting attention as next-generation display devices. Since inorganic light emitting diodes (LEDs) are made of inorganic materials rather than organic materials, they have faster lighting speeds and superior luminous efficiency compared to LCDs and OLEDs, and can display images with high brightness. Summary of the Invention [Problem to be solved by the invention]

[0006] SUMMARY OF THE INVENTION An object of the present invention is to provide an in-cell touch display panel with a reduced thickness.

[0007] An object of the present invention is to provide an in-cell touch display panel with increased touch sensing accuracy and reduced touch sensing time.

[0008] Problems to be solved by the embodiments of the present invention are not limited to the problems mentioned above, and further problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0009] An in-cell touch display panel according to an embodiment of the present invention may include a first common electrode connected to N*M (N and M are each a positive integer greater than or equal to 2) first pixels arranged in a display area, a second common electrode connected to N*M second pixels arranged in the display area, and a first pixel driver arranged in the display area, which writes pixel data to the first and second pixels and supplies voltages to the first common electrode and the second common electrode.

[0010] An in-cell touch display device according to an embodiment of the present invention includes: a plurality of touch units including a plurality of pixels and a plurality of touch groups, and a pixel driver, which are arranged in a display area for displaying an image; the plurality of touch groups include a first touch group including a first common electrode connected to a first pixel of the touch unit among the plurality of pixels; and a second touch group including a second common electrode connected to a second pixel of the touch unit among the plurality of pixels but not connected to the first pixel of the touch unit; the pixel driver outputs a touch drive signal to the first common electrode arranged in the first touch group of each of the plurality of touch units during a first touch period, and outputs a common voltage to the second common electrode of the second touch group arranged in each of the plurality of touch units during the first touch period, so that the second pixel of each of the plurality of touch units displays an image during the first touch period.

[0011] Specific details of various examples of the present invention other than the means for solving the above-mentioned problems are included in the following description and drawings.

[0012] According to the present invention, the thickness of the in-cell touch display panel can be reduced by using a common electrode as a touch electrode required for touch sensing.

[0013] According to the present invention, in touch sensing of an in-cell touch display panel, the touch group and the sensing period are subdivided, thereby increasing the accuracy of sensing and shortening the time required for sensing.

[0014] The effects of the present invention are not limited to those mentioned above, and further effects not mentioned will be clearly understood by those having ordinary skill in the art to which the technical concept of the present invention pertains from the following description. [Brief explanation of the drawings]

[0015] These and other objects, features and advantages of the present invention will become more apparent to those skilled in the art from the following detailed description of illustrative embodiments of the present invention taken in conjunction with the accompanying drawings, in which: [Figure 1] 1 is an exploded perspective view of a display device according to an embodiment of the present invention; [Figure 2] 1 is a plan view showing a display device according to an embodiment of the present invention; [Figure 3] 1 is an enlarged view showing a display device according to an embodiment of the present invention; [Figure 4] FIG. 2 illustrates a circuit structure according to an embodiment of the present invention. [Figure 5] 1 is a diagram showing a plurality of touch blocks arranged in an in-cell touch display panel according to an embodiment of the present invention; [Figure 6] 1 is a diagram illustrating a driving method of an in-cell touch display panel according to an embodiment of the present invention; [Figure 7a] 1 is a diagram illustrating a driving method of an in-cell touch display panel according to an embodiment of the present invention; [Figure 7b] 1 is a diagram illustrating a driving method of an in-cell touch display panel according to an embodiment of the present invention; [Figure 7c] 1 is a diagram illustrating a driving method of an in-cell touch display panel according to an embodiment of the present invention; [Figure 7d] 1 is a diagram illustrating a driving method of an in-cell touch display panel according to an embodiment of the present invention; [Figure 7e] 1 is a diagram illustrating a driving method of an in-cell touch display panel according to an embodiment of the present invention; [Figure 8] FIG. 10 is an enlarged view of a touch group according to an embodiment of the present invention. [Figure 9] FIG. 10 is an enlarged view of pixels arranged in a touch group according to an embodiment of the present invention; [Figure 10] FIG. 10 is an enlarged view of a touch group according to yet another embodiment of the present invention. [Figure 11] FIG. 4 is a cross-sectional view taken along line II' in FIG. [Figure 12] 1 is a cross-sectional view showing a sub-pixel including a light-emitting element disposed in a display region according to an embodiment of the present invention; [Figure 13] 1 is a diagram showing an apparatus to which a display device according to an embodiment of the present invention is applied; [Figure 14] 1 is a diagram showing an apparatus to which a display device according to an embodiment of the present invention is applied; [Figure 15] 1 is a diagram showing an apparatus to which a display device according to an embodiment of the present invention is applied; [Figure 16] 1 is a diagram showing an apparatus to which a display device according to an embodiment of the present invention is applied; DETAILED DESCRIPTION OF THE INVENTION

[0016] The advantages and features of the present invention, as well as methods for achieving them, will become more apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various different forms. These embodiments are provided solely to ensure that the disclosure of the present invention is complete and to fully convey the scope of the invention to those skilled in the art.

[0017] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for illustrating the embodiments of the present invention are merely illustrative and should not be construed as limiting the scope of the present invention. The same reference symbols refer to the same elements throughout the specification. Furthermore, when describing the present invention, if a detailed description of related prior art is deemed to unnecessarily obscure the gist of the present invention, such a detailed description will be omitted. When the terms "comprise," "have," or "consist of" are used in this specification, other elements may be added unless "only" or "only" is used. When an element is referred to in the singular, it may also include a plural reference unless otherwise expressly stated.

[0018] When interpreting elements, they are interpreted as including a range of error even if there is no separate explicit description of the range of error.

[0019] When describing a positional relationship between two parts, for example, using terms such as "above," "on top of," "below," "next to," or "adjacent," one or more other parts may be located between the two parts, as long as terms such as "immediately," "directly," or "close to" are not used.

[0020] When describing a temporal relationship, if the temporal sequence is described using terms such as "after," "following," "next," or "before," then "immediately" or "directly" are not used, it can also include cases where the relationship is not consecutive.

[0021] Although terms such as "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, a first component referred to below may also be a second component within the technical concept of the present invention.

[0022] In describing the components of the present invention, terms such as first, second, A, B, (a), or (b) may be used. These terms are used only to distinguish the components from other components, and do not limit the nature, order, sequence, or number of the components.

[0023] When a component is described as being "coupled," "coupled," "connected," or "attached," "mounted," or "mounted" to another component, it should be understood that the component can be directly coupled, coupled, connected, or attached, mounted, or mounted to the other component, but that there can also be other components between the components that are indirectly coupled, coupled, connected, or attached, mounted, or mounted, unless otherwise expressly stated.

[0024] When a component or layer is described as "contacting" or "overlapping" another component or layer, it should be understood that the component or layer can directly contact or be overlaid on the other component or layer, but that other components can also be interposed between components that can indirectly contact or be overlaid unless otherwise explicitly stated.

[0025] "At least one" should be understood to include all combinations of one or more of the associated components. For example, "at least one of a first, second, and third component" means not only the first, second, or third component, but also all combinations of two or more of the first, second, and third components.

[0026] The terms "first direction," "second direction," "third direction," "X-axis direction," "Y-axis direction," and "Z-axis direction" should not be interpreted only as having a geometric relationship in which the relationship between them is perpendicular, but may also mean having a broader directionality within the range in which the configuration of the present invention can function.

[0027] The features of the various embodiments of the present invention may be partially or fully combined or combined with each other, and may be technically interlocked and driven in various ways, and each embodiment may be implemented independently of the others or may be implemented together in a linked relationship.

[0028] Various embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0029] Fig. 1 is an exploded perspective view of a display device according to an embodiment of the present invention, Fig. 2 is a plan view of a display device according to an embodiment of the present invention, and Fig. 3 is an enlarged view of a display device according to an embodiment of the present invention.

[0030] 1 to 3, a display device 1000 according to an embodiment of the present invention may include, but is not limited to, a display panel 100, a polarizing layer 293, an adhesive layer 295, a cover member 120, a support substrate 110, a flexible circuit board CB, and a printed circuit board 160. For example, one or more of the components or layers described above may be omitted or integrated, or may include one or more sub-components or sub-layers. Alternatively, the display device 1000 may include more or fewer components or layers than those described.

[0031] For example, the display device 1000 may include a substrate 110. The substrate 110 may be a member that supports other components of the display device 1000. The substrate 110 may be made of an insulating material. For example, the substrate 110 may be made of glass or resin. The substrate 110 may also be made of a flexible material. For example, the substrate 110 may be made of a flexible plastic material such as polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone (PES), cyclic olefin copolymer (COC), triacetyl cellulose (TAC) film, polyvinyl alcohol (PVA), polystyrene (PS), etc. However, embodiments of the present invention are not limited thereto.

[0032] The display panel 100 may implement information, videos, and / or images to be provided to a user. For example, the display panel 100 may include a display area AA and a non-display area NA. For example, the substrate 110 may include the display area AA and the non-display area NA. The display area AA and the non-display area NA are not limited to the substrate 110, but may be described throughout the display device 1000.

[0033] The display area AA may be an area where an image is displayed. The non-display area NA may be outside the display area AA (e.g., a periphery of the display area AA or an area completely or partially surrounding the display area AA) and may also be referred to as an edge area or a bezel area. The non-display area NA may include multiple adjacent or separated non-display areas. The display area AA may include multiple pixels PX. Each of the multiple pixels PX may be configured with multiple sub-pixels (e.g., two, three, or more). Each of the multiple sub-pixels may have multiple light-emitting elements disposed therein. The multiple light-emitting elements may be configured differently depending on the type of display device 1000. For example, if the display device 1000 is an inorganic light-emitting display device, the inorganic light-emitting elements may be LEDs (light-emitting diodes), micro LEDs (micro light-emitting diodes), or mini LEDs (mini light-emitting diodes), although embodiments of the present invention are not limited thereto.

[0034] The non-display area NA may be an area where no information, image, or video is displayed. Various wirings and circuits for driving the pixels PX of the display area AA may be arranged in the non-display area NA. For example, various wirings and driving circuits may be implemented in the non-display area NA, and a pad unit PAD to which an integrated circuit, a printed circuit, etc. may be connected may be arranged, but the embodiment of the present invention is not limited thereto.

[0035] For example, the driving circuits may be data driving circuits, gate driving circuits, and / or touch sensing driving circuits, although embodiments of the present invention are not limited thereto. Wiring to which control signals for controlling the driving circuits are supplied may be arranged in the display panel 100. For example, the control signals may include various timing signals including a clock signal, an input data enable signal, and a synchronization signal such as a horizontal synchronization signal or a vertical synchronization signal, although embodiments of the present invention are not limited thereto. The control signals may be received through a pad unit PAD and / or wiring and / or layers. For example, link wiring LL for transmitting signals may be arranged in the non-display area NA. For example, driving components such as a flexible circuit board CB and a printed circuit board 160 may be connected to the pad unit PAD.

[0036] According to the present invention, the non-display area NA may include a first non-display area NA1, a bending area BA, and a second non-display area NA2. For example, the first non-display area NA1 may be an area surrounding at least a portion of the display area AA. The bending area BA may be an area extending from at least one of the sides of the first non-display area NA1 and may be a bendable area. The second non-display area NA2 may be an area extending from the bending area BA in the opposite direction to the first non-display area NA1 and may have a pad unit PAD disposed therein. For example, the bending area BA may be bent, and the remaining area of ​​the substrate 110 excluding the bending area BA may be flat. In this case, the bending area BA may be bent, so that the second non-display area NA2 may be positioned on the back surface of the display area AA. However, embodiments of the present invention are not limited thereto.

[0037] The display area AA of the substrate 110 or the display device 1000 may be configured in various shapes depending on the design of the display device 1000. For example, the display area AA may be configured in a rectangular shape with four rounded corners, but the embodiment of the present invention is not limited thereto. As another example, the display area AA may be configured in a rectangular shape with four right-angled corners, a circular shape, an elliptical shape, an ellipsoidal shape, a polygonal shape (e.g., a hexagon), or the like, but the embodiment of the present invention is not limited thereto.

[0038] According to the present invention, the width of the second non-display area NA2 in which the plurality of pad electrodes PE are arranged may be wider than the width of the bending area BA in which only the plurality of link lines LL are arranged. Also, the width of the display area AA in which the plurality of sub-pixels are arranged may be wider than the width of the bending area BA in which only the plurality of link lines LL are arranged. In the drawings, the width of the bending area BA is illustrated as being narrower than the width of other areas of the substrate 110, but the shape of the substrate 110 including the bending area BA is merely an example, and embodiments of the present invention are not limited thereto.

[0039] Referring to FIG. 3 , a plurality of pixel driving circuits PD may be arranged in the display area AA. The plurality of pixel driving circuits PD may be circuits for driving light-emitting elements of a plurality of sub-pixels. Each pixel driving circuit PD may drive a light-emitting element of at least one sub-pixel. Each of the plurality of pixel driving circuits PD may include a plurality of transistors, including a driving transistor, a storage capacitor, and the like, and may supply control signals, power supplies (e.g., high-potential voltages, low-potential voltages), and driving currents to the light-emitting elements of the plurality of sub-pixels to control the light-emitting operations of the plurality of light-emitting elements. For example, the pixel driving circuit PD may include power supply wiring and signal wiring for controlling the on / off and / or light-emitting duration of the light-emitting elements. For example, the plurality of pixel drivers PD may be driver circuits manufactured on a semiconductor substrate using a MOSFET (Metal-Oxide-Silicon Field Effect Transistor) manufacturing process. Although the embodiments of the present invention have been described using pixel drivers as an example, the embodiments of the present invention are not limited thereto. The driver circuit may include a plurality of pixel driving circuits PD and may drive a plurality of sub-pixels.

[0040] 1, a flexible circuit board CB and a printed circuit board 160 may be disposed below the display panel 100. The flexible circuit board CB and the printed circuit board 160 may be disposed on at least one side edge of the display panel 100, but the embodiment of the present invention is not limited thereto. One side of the flexible circuit board CB is attached to the display panel 100 and the other side is attached to the printed circuit board 160, but the embodiment of the present invention is not limited thereto. The flexible circuit board CB may be a flexible film, but the embodiment of the present invention is not limited thereto. For example, the flexible circuit board CB may be a flexible flat cable FFC or a flexible printed circuit FPC.

[0041] A pad unit PAD including a plurality of pad electrodes PE may be arranged in the second non-display area NA2. Driving components including one or more flexible circuit boards (or flexible films) CB and / or printed circuit boards 160 may be attached or bonded to the pad unit PAD. The plurality of pad electrodes PE of the pad unit PAD are electrically connected to the one or more flexible circuit boards (or flexible films) CB and can transmit various signals (or power, or voltage, or current) from the printed circuit board 160 and the flexible circuit boards (or flexible films) CB to a plurality of pixel drivers PD in the display area AA.

[0042] The flexible circuit board (or flexible film) CB may be a film having various components disposed on a flexible base film. For example, a driving IC such as a gate driver IC, a data driver IC, or a touch sensing driver IC may be disposed on the flexible circuit board (or flexible film) CB, but the embodiment of the present invention is not limited thereto. The driving IC may be a component that processes data and driving signals for displaying images. Depending on the mounting method, the driving IC may be disposed in a manner such as chip-on-glass (COG), chip-on-film (COF), chip-on-plastic (COP), chip-on-plate (COP), or tape carrier package (TCP), but the embodiment of the present invention is not limited thereto. The flexible circuit board (or flexible film) CB may be attached or bonded onto the plurality of pad electrodes PE through a conductive adhesive layer, but the embodiment of the present invention is not limited thereto.

[0043] The printed circuit board 160 may be electrically connected to one or more flexible circuit boards (or flexible films) CB and may be a component that supplies signals to the driving ICs. The printed circuit board 160 may be disposed on one side of the flexible circuit boards (or flexible films) CB and electrically connected to the flexible circuit boards (or flexible films) CB. Various components for supplying various signals (or power, voltage, current) to the driving ICs may be disposed on the printed circuit board 160. For example, various components such as a timing controller, a power supply, a memory, or a processor may be disposed on the printed circuit board 160. For example, the printed circuit board 160 may include a power management integrated circuit (PMIC), although embodiments of the present invention are not limited thereto.

[0044] The printed circuit board 160 may include at least one hole 180, although embodiments of the present invention are not limited thereto. An internal component for sensing ambient light, temperature, humidity, or the like, which may be provided as a plurality of sensors, may be disposed in an area corresponding to the at least one hole 180. The sensor may overlap the hole 180 or may be disposed in the hole 180. For example, the internal component may include an ambient light sensor (ALS), a temperature sensor, or a humidity sensor, although embodiments of the present invention are not limited thereto. For example, the hole 180 may be a transparent hole, although embodiments of the present invention are not limited thereto.

[0045] 1, a polarizing layer 293 may be disposed on the display panel 100. The polarizing layer 293 may prevent or reduce light generated from an external light source from entering the display panel 100 and affecting light emitting elements, etc.

[0046] The cover member 120 may be disposed on the polarizing layer 293. The cover member 120 may be a member for protecting the display panel 100. An adhesive layer 295 may be disposed between the polarizing layer 293 and the cover member 120. The adhesive layer 295 may attach the cover member 120 to the display panel 100. The adhesive layer 295 may include an optically clear adhesive (OCA), an optically clear resin (OCR), a pressure sensitive adhesive (PSA), a silicone resin, an epoxy resin, a UV curable resin, a polyimide resin, an acrylate resin, a polyurethane resin, polydimethylsiloxane (PDMS), or the like, but embodiments of the present invention are not limited thereto.

[0047] A support substrate 110 may be disposed between the display panel 100 and the printed circuit board 160. The support substrate 110 may reinforce the rigidity of the display panel 100. The support substrate 110 may be a backplate, but the embodiment of the present invention is not limited thereto.

[0048] A plurality of link wirings LL may be arranged in the non-display area NA. The plurality of link wirings LL may be wirings that transmit various signals (or power, voltage, current) from one or more flexible circuit boards (or flexible films) CB and / or printed circuit boards 160 to the display area AA. The plurality of link wirings LL may extend from the plurality of pad electrodes PE in the second non-display area NA2 toward the bending area BA and the first non-display area NA1 and be electrically connected to the plurality of drive wirings VL in the display area AA. The plurality of pixel drivers PD may be driven by receiving signals (or power, voltage, current) from one or more flexible circuit boards (or flexible films) CB and / or printed circuit boards 160 via the drive wirings VL in the display area AA and the link wirings LL in the non-display area NA.

[0049] For example, the plurality of drive wirings VL, together with the plurality of link wirings LL, may be wirings for transmitting signals output from the flexible circuit board (or flexible film) CB and / or the printed circuit board 160 to the plurality of pixel drivers PD. The plurality of drive wirings VL may be disposed in the display area AA and electrically connected to each of the plurality of pixel drivers PD. The plurality of drive wirings VL may extend from the display area AA toward the non-display area NA and electrically connected to the plurality of link wirings LL. Therefore, signals (or power, voltage, current) output from the flexible circuit board (or flexible film) CB and / or the printed circuit board 160 may be transmitted to each of the plurality of pixel drivers PD via the plurality of link wirings LL and the plurality of drive wirings VL.

[0050] When the bending area BA is bent, portions of the link lines LL may also be bent. Stress may concentrate in the bent portions of the link lines LL, which may cause cracks in the link lines LL. Therefore, to reduce cracks during bending of the bending area BA, the link lines LL may be made of a highly flexible conductive material. For example, the link lines LL may be made of a highly flexible conductive material such as gold (Au), silver (Ag), copper (Cu), or aluminum (Al), but this is not limited to this embodiment. The link lines LL may also be made of one of the various conductive materials used in the display area AA. For example, the link lines LL may be made of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), gold (Au), aluminum (Al), neodymium (Nd), copper (Cu), or an alloy of silver (Ag) and magnesium (Mg), or an alloy thereof, but this is not limited to this embodiment. The link wires LL may be formed in a multi-layer structure including various conductive materials, for example, a triple-layer structure such as titanium (Ti) / aluminum (Al) / titanium (Ti) or aluminum (Al) / molybdenum titanium (MoTi) / aluminum (Al), but the present invention is not limited thereto.

[0051] The link wirings LL may be configured in various shapes to reduce stress. At least a portion of the link wirings LL arranged on the bending area BA may extend in the same direction as the extension direction of the bending area BA, or may extend in a direction different from the extension direction of the bending area BA to reduce stress. For example, if the bending area BA extends in one direction from the first non-display area NA1 to the second non-display area NA2, at least a portion of the link wirings LL arranged on the bending area BA may extend in a direction oblique to the one direction. As another example, at least a portion of the link wirings LL may be configured in various patterns. For example, at least a portion of the link wirings LL arranged on the bending area BA may have a shape in which conductive patterns having at least one of a diamond shape, a rhombus shape, a trapezoidal wave shape, a stripe shape, a zigzag shape, a triangular wave shape, a sawtooth wave shape, a sinusoidal wave shape, a circular shape, and an omega (Ω) shape are repeatedly arranged. However, the present invention is not limited to this example. Therefore, in order to minimize or reduce the stress concentrated on the link wires LL and the resulting cracks, the shape of the link wires LL may be various shapes including the shapes described above, but embodiments of the present invention are not limited thereto.

[0052] FIG. 4 is a diagram showing a circuit structure according to an embodiment of the present invention.

[0053] 4, one light emitting element ED is connected to a microdriver μDriver, but this is not limiting. For example, eight light emitting elements ED may be connected to one microdriver μDriver. In other examples, 16 light emitting elements ED may be connected to one microdriver μDriver, or 32 light emitting elements ED or 64 light emitting elements ED may be connected to one microdriver μDriver simultaneously. The light emitting elements ED may be micro light emitting elements (μLEDs).

[0054] One microdriver μDriver drives the driving transistor T DR and light-emitting transistor TEM However, embodiments of the present invention are not limited thereto.

[0055] For example, the driving transistor T DR In the figure, a high-potential power supply voltage VDD is applied to the first electrode, and a light-emitting transistor T EM The first electrodes of the driving transistors T are connected to each other, and a scan signal SC can be applied to the gate electrodes of the driving transistors T. DR The scan signal SC applied to the gate electrode of the driving transistor is a direct current power supply, and a fixed reference voltage Vref may be applied every frame or every subframe, but the embodiment of the present invention is not limited thereto. Alternatively, a low potential power supply may be applied to the first electrode of the driving transistor depending on the type of the driving transistor.

[0056] Light-emitting transistor T EM is connected to the first electrode of the driving transistor T DR The light emitting element ED is connected to the second electrode of the light emitting transistor T. An emission signal EM may be applied to the gate electrode of the light emitting transistor T. EM The light-emitting signal EM applied to the gate electrode of the light-emitting transistor T may be a pulse width modulation signal that varies every frame, but the embodiment of the present invention is not limited thereto. EM The light emitting signal EM applied to the gate electrode of may be a pulse width modulated signal that changes for each subframe, but the embodiment of the present invention is not limited thereto.

[0057] The first electrode of the light-emitting element ED is connected to the light-emitting transistor T EM The first electrode of the light-emitting element ED may be connected to the second electrode of the light-emitting element ED, and the second electrode of the light-emitting element ED may be connected to ground. For example, the first electrode of the light-emitting element ED may be an anode electrode and the second electrode of the light-emitting element ED may be a cathode electrode, but the embodiment of the present invention is not limited thereto. Alternatively, the first electrode CE1 may be a negative electrode and the second electrode CE2 may be a positive electrode.

[0058] Drive transistor T DR and light-emitting transistor T EMcan each be an n-type transistor or a p-type transistor.

[0059] The micro driver μDriver controls the driving transistor T by the scan signal SC applied from the timing controller T-CON. DR is turned on, and the light-emitting transistor T EM This allows the driving transistor T DR A high potential power supply voltage VDD applied to the first electrode of the driving transistor T DR and light-emitting transistor T EM is applied to the light emitting element ED via the voltage Vcc, the light emitting element ED can emit light.

[0060] FIG. 5 is a diagram illustrating a plurality of touch blocks arranged in an in-cell touch display panel according to an embodiment of the present invention.

[0061] 5, the in-cell touch display panel according to the embodiment of the present invention may include a plurality of touch units. Each touch unit may include k touch groups of a plurality of touch groups TG1, TG2, ..., TG(n+3) (n is a positive integer greater than or equal to 2, for example, but not limited to, 13) arranged within the display area AA of the display device 1000. Here, k is an integer greater than or equal to 2, for example, but not limited to, 4. Each of the touch groups TG1, TG2, ..., TG(n+3) may include n*m ​​(m is a positive integer greater than or equal to 2, for example, but not limited to, n is 2, and m is 2) pixels PX.

[0062] The touch group TG may include a first touch group TG1, a second touch group TG2 adjacent to the first touch group TG1 in the row direction (e.g., the first direction), a third touch group TG3 adjacent to the first touch group TG1 in the column direction (e.g., the second direction), and a fourth touch group TG4 adjacent to the second touch group TG2 in the column direction. The touch groups of the touch unit may include an nth touch group TG(n), an n+1th touch group TG(n+1) adjacent to the nth touch group TG(n) in the row direction, an n+2th touch group TG(n+2) adjacent to the nth touch group TG(n) in the column direction, and an n+3rd touch group TG(n+3) adjacent to the n+1st touch group TG(n+1) in the column direction. The present invention is not limited to this embodiment.

[0063] 6A to 6E are diagrams illustrating a method for driving an in-cell touch display panel according to an embodiment of the present invention, and FIGS. 7A to 7E are diagrams illustrating a method for driving an in-cell touch display panel according to an embodiment of the present invention.

[0064] 6 and 7a to 7e, an in-cell touch display panel according to an embodiment of the present invention may be configured in such a manner that some of the pixel electrodes for display and touch electrodes for touch sensing are integrated into one another in an in-cell touch manner. Therefore, the touch groups may be driven by dividing the display drive for image output and the touch sensing drive into time periods for one frame (e.g., 16.67 ms) in units of touch groups, but this is not limitative. Depending on the number of touch groups included in a touch unit, one frame may be divided into more or less than four display periods and touch sensing periods.

[0065] The in-cell touch display panel can be driven by dividing one frame period into display periods D1, D2, D3, and D4 and touch sensing periods T1, T2, T3, and T4.

[0066] To divide the display periods D1, D2, D3, and D4 and the touch sensing periods T1, T2, T3, and T4, the touch sensing driving may be performed during periods other than the periods during which the display driving signals are supplied to the touch groups TG1, TG2, ..., TG(n+3). For example, the first touch sensing period T1 may be arranged after the first display period D1, and the second display period D2 may be arranged after the first touch sensing period T1. However, the present invention is not limited thereto.

[0067] During the first to fourth display periods D1, D2, D3, and D4, as shown in FIG. 7a, all of the touch groups TG1, TG2, ..., TG(n+3) output images in response to display driving signals and do not perform touch sensing.

[0068] 7b, during the first touch sensing period T1, the first touch group TG1, the fifth touch group TG5, ..., and the nth touch group TG(n) among the plurality of touch groups TG1, TG2, ..., TG(n+3) may undergo touch sensing driving. Each touch group driven during the first touch sensing period T1 is disposed at the same position within each touch unit. For example, during the first touch sensing period, the first touch group TG1, the fifth touch group TG5, ..., and the nth touch group TG(n) are all located at the top left corner of the quadrant of the touch unit. The first touch group TG1, the fifth touch group TG5, ..., and the nth touch group TG(n) may all be considered the "first touch group" of the touch unit. During the first touch sensing period, the other touch groups except the first touch group TG1, the fifth touch group TG5, ..., and the nth touch group TG(n) can receive display driving signals and output images, similar to the display periods D1, D2, D3, and D4, but do not sense touches. For example, during the first touch sensing period, the common electrodes of the touch groups that display images can receive a common voltage. On the other hand, the common electrodes of the first touch group TG1, the fifth touch group TG5, ..., and the nth touch group TG(n) can receive touch driving signals and sense touches during the first touch sensing period.

[0069] 7c, during the second touch sensing period T2, the second touch group TG2, the sixth touch group TG6, and the (n+1)th touch group TG(n+1) among the plurality of touch groups TG1, TG2, ..., TG(n+3) may undergo touch sensing driving. For example, during the second touch sensing period, the second touch group TG2, the sixth touch group TG6, ..., and the (n+1)th touch group TG(n+1) are all located at the upper right corner of the quadrant of the touch unit. The second touch group TG2, the sixth touch group TG6, ..., and the (n+1)th touch group TG(n+1) may all be considered the "second touch group" of the touch unit. During the second touch sensing period, the other touch groups except the second touch group TG2, the sixth touch group TG6, ..., and the (n+1)th touch group TG(n+1) can receive the display driving signal and output an image, similar to the display periods D1, D2, D3, and D4, but do not sense a touch. For example, during the second touch sensing period, the common electrodes of the touch groups that display an image can receive a common voltage. On the other hand, the common electrodes of the second touch group TG2, the sixth touch group TG6, ..., and the (n+1)th touch group TG(n+1) can receive the touch driving signal and sense a touch during the second touch sensing period.

[0070] 7d, during the third touch sensing period T3, the third touch group TG3, the seventh touch group TG7, and the n+2th touch group TG(n+2) among the plurality of touch groups TG1, TG2, ..., TG(n+3) may undergo touch sensing driving. For example, during the third touch sensing period, the third touch group TG3, the seventh touch group TG7, ..., and the n+2th touch group TG(n+2) are all located at the bottom left corner of the quadrant of the touch unit. The third touch group TG3, the seventh touch group TG7, ..., and the n+2th touch group TG(n+2) may all be considered the "third touch group" of the touch unit. During the third touch sensing period, the other touch groups except the third touch group TG3, the seventh touch group TG7, ..., and the n+2th touch group TG(n+2) can receive display driving signals and output images, similar to the display periods D1, D2, D3, and D4, but do not sense touches. For example, during the third touch sensing period, the common electrodes of the touch groups that display images can receive a common voltage. On the other hand, the common electrodes of the third touch group TG3, the seventh touch group TG7, ..., and the n+2th touch group TG(n+2) can receive touch driving signals and sense touches during the third touch sensing period.

[0071] 7e, during the fourth touch sensing period T4, the fourth touch group TG4, the eighth touch group TG8, and the (n+3)-th touch group TG(n+3) among the plurality of touch groups TG1, TG2, ..., TG(n+3) may undergo touch sensing driving. For example, during the fourth touch sensing period, the fourth touch group TG4, the eighth touch group TG8, ..., and the (n+3)-th touch group TG(n+3) are all located at the bottom right corner of the quadrant of the touch unit. The fourth touch group TG4, the eighth touch group TG8, ..., and the (n+3)-th touch group TG(n+3) may all be considered the "fourth touch group" of the touch unit. During the fourth touch sensing period, the other touch groups except the fourth touch group TG4, the eighth touch group TG8, ..., and the (n+3)th touch group TG(n+3) can receive the display driving signal and output an image, similar to the display periods D1, D2, D3, and D4, but do not sense a touch. For example, during the fourth touch sensing period, the common electrodes of the touch groups that display an image can receive a common voltage. On the other hand, the common electrodes of the fourth touch group TG4, the eighth touch group TG8, ..., and the (n+3)th touch group TG(n+3) can receive the touch driving signal and sense a touch during the fourth touch sensing period.

[0072] Although the above description illustrates an example in which the touch groups of the touch unit are driven sequentially in a clockwise direction starting from the top left quadrant of the touch unit using the touch sensing driving device, embodiments of the present invention are not limited thereto. Alternatively, the touch groups of the touch unit can be driven sequentially in a clockwise direction starting from another quadrant of the touch unit using the touch sensing driving device. Alternatively, the touch groups of the touch unit can be driven non-sequentially or randomly starting from any touch group in any quadrant of the touch unit using the touch sensing driving device in any order until all touch groups are driven by the touch sensing driving device.

[0073] By dividing the touch sensing period and area within one frame and performing touch sensing, the accuracy of touch sensing is increased, and in other touch groups where touch sensing is not performed during the touch sensing period, images can be displayed continuously, thereby improving the display quality.

[0074] Figure 8 is an enlarged view of a touch group according to an embodiment of the present invention, Figure 9 is an enlarged view of pixels arranged in a touch group according to an embodiment of the present invention, and Figure 10 is an enlarged view of a touch group according to an embodiment of the present invention.

[0075] 8 and 9 show only a plurality of signal wirings TL, a plurality of communication wirings NL, a plurality of first electrodes CE1, a plurality of banks BNK, and a plurality of light-emitting elements ED, but the embodiment of the present invention is not limited thereto. Fig. 10 is an enlarged plan view in which a plurality of second electrodes CE2 are additionally arranged in Fig. 8.

[0076] 8 and 9, a plurality of pixels PX (e.g., four pixels) each including a plurality of sub-pixels (e.g., three pixels) may be arranged in a first touch group TG1 disposed in a display area AA. Each of the plurality of sub-pixels disposed in the first touch group TG1 includes a light-emitting element ED and can independently emit light. The plurality of sub-pixels may be arranged in an n*m matrix having a plurality of rows and a plurality of columns, but the present invention is not limited thereto. Alternatively, the sub-pixels may be arranged in a pen-tile, diamond, or diamond-like shape.

[0077] The plurality of subpixels may include a first subpixel SP1, a second subpixel SP2, and a third subpixel SP3. For example, one of the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 may be a red subpixel, another may be a green subpixel, and the remaining subpixels may be blue subpixels. The types of the plurality of subpixels are merely exemplary, and the present invention is not limited thereto. For example, the plurality of subpixels may include different numbers of subpixels that emit light of different colors in a color system such as CMYK.

[0078] Each of the pixels PX may include one or more first subpixels SP1, one or more second subpixels SP2, and one or more third subpixels SP3. For example, one pixel PX may include a pair of first subpixels SP1, a pair of second subpixels SP2, and a pair of third subpixels SP3. The pair of first subpixels SP1 may be composed of a 1-1 subpixel SP1a and a 1-2 subpixel SP1b. The pair of second subpixels SP2 may be composed of a 2-1 subpixel SP2a and a 2-2 subpixel SP2b. The pair of third subpixels SP3 may be composed of a 3-1 subpixel SP3a and a 3-2 subpixel SP3b. For example, one pixel PX may include a 1-1 subpixel SP1a and a 1-2 subpixel SP1b, a 2-1 subpixel SP2a and a 2-2 subpixel SP2b, and a 3-1 subpixel SP3a and a 3-2 subpixel SP3b, but embodiments of the present invention are not limited thereto.

[0079] The subpixels constituting one pixel PX may be arranged in various ways. For example, in one pixel PX, a pair of first subpixels SP1 may be arranged in the same column, a pair of second subpixels SP2 may be arranged in the same column, and a pair of third subpixels SP3 may be arranged in the same column. The first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 may be arranged in the same row. The number and arrangement of the subpixels constituting one pixel PX are merely exemplary, and the present invention is not limited thereto. Alternatively, in one pixel PX, a pair of first subpixels SP1 may be arranged in the same row, a pair of second subpixels SP2 may be arranged in the same row, and a pair of third subpixels SP3 may be arranged in the same row. The first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 may be arranged in the same column.

[0080] A plurality of signal lines TL may be arranged in regions between the plurality of subpixels. The plurality of signal lines TL may extend in the column direction between the plurality of subpixels. The plurality of signal lines TL may be lines that transmit an anode voltage from a pixel driver PD to the plurality of subpixels. For example, the plurality of signal lines TL may be electrically connected to the plurality of pixel drivers PD and the first electrodes CE1 of the plurality of subpixels. The anode voltage output from the pixel driver PD may be transmitted to the first electrodes CE1 of the plurality of subpixels through the plurality of signal lines TL. For example, the first electrodes CE1 may be electrically connected to the anode electrodes 134 (see FIG. 12 ) of the light-emitting elements ED. Therefore, the anode voltage from the signal lines TL may be transmitted to the anode electrodes 134 of the light-emitting elements ED through the first electrodes CE1.

[0081] Therefore, instead of forming multiple transistors and storage capacitors for each of the multiple subpixels, the structure of the display device 1000 can be simplified by using a pixel driver PD in which multiple pixel circuits are integrated. Furthermore, integrating circuits arranged for each of the multiple subpixels SP into a single pixel driver PD enables highly efficient, low-power driving. Integrating circuits arranged for each of the multiple subpixels SP into a single pixel driver PD means that the pixel driver PD includes multiple pixel circuits that can drive multiple light-emitting elements ED. Multiple light-emitting elements ED can be driven by a single pixel driver PD in which multiple pixel circuits are integrated. For example, the 1-1st light-emitting element 130a, the 2-1st light-emitting element 140a, and the 3-1st light-emitting element 150a can be driven by a single pixel driving circuit PD in which multiple pixel circuits are integrated. For example, the 1-2nd light-emitting element 130b, the 2-2nd light-emitting element 140b, and the 3-2nd light-emitting element 150b can be driven by a single pixel driving circuit PD in which multiple pixel circuits are integrated.

[0082] The signal lines TL may include a first signal line TL1, a second signal line TL2, a third signal line TL3, a fourth signal line TL4, a fifth signal line TL5, and a sixth signal line TL6. Each of the first signal line TL1 and the second signal line TL2 may be electrically connected to a pair of first sub-pixels SP1. Each of the third signal line TL3 and the fourth signal line TL4 may be electrically connected to a pair of second sub-pixels SP2. Each of the fifth signal line TL5 and the sixth signal line TL6 may be electrically connected to a pair of third sub-pixels SP3.

[0083] A first signal line TL1 may be arranged on one side (e.g., a first side) of the pair of first sub-pixels SP1, and a second signal line TL2 may be arranged on the other side (e.g., a second side) of the pair of second sub-pixels SP2. The first signal line TL1 may be electrically connected to the first electrode CE1 of one of the pair of first sub-pixels SP1, e.g., the 1-1th sub-pixel SP1a. The second signal line TL2 may be electrically connected to the first electrode CE1 of the other of the pair of first sub-pixels SP1, e.g., the 1-2th sub-pixel SP1b.

[0084] A third signal line TL3 may be arranged on one side (e.g., a first side) of the pair of second subpixels SP2, and a fourth signal line TL4 may be arranged on the other side (e.g., a second side) of the pair of second subpixels SP2. For example, the third signal line TL3 may be arranged adjacent to the second signal line TL2. The third signal line TL3 may be electrically connected to the first electrode CE1 of one of the pair of second subpixels SP2, for example, the 2-1st subpixel SP2a. The fourth signal line TL4 may be electrically connected to the first electrode CE1 of the other of the pair of second subpixels SP2, for example, the 2-2nd subpixel SP2b.

[0085] A fifth signal line TL5 may be arranged on one side (e.g., a first side) of the pair of third subpixels SP3, and a sixth signal line TL6 may be arranged on the other side (e.g., a second side) of the pair of third subpixels SP3. For example, the fifth signal line TL5 may be arranged adjacent to the fourth signal line TL4. The sixth signal line TL6 may be arranged adjacent to the first signal line TL1 connected to the adjacent pixel PX. The fifth signal line TL5 may be electrically connected to the first electrode CE1 of one of the pair of third subpixels SP3, for example, the 3-1st subpixel SP3a. The sixth signal line TL6 may be electrically connected to the first electrode CE1 of the other of the pair of third subpixels SP3, for example, the 3-2nd subpixel SP3b.

[0086] The signal wirings TL may be made of a conductive material. For example, the signal wirings TL may be made of a conductive material such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium gallium oxide (IGO), etc., but the present invention is not limited thereto. As another example, the signal wirings TL may have a multi-layer structure of conductive materials. For example, the multiple signal wirings TL may have a multilayer structure such as titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO), indium tin oxide (ITO) / aluminum (Al) / indium tin oxide (ITO), ITO / APC / ITO, etc., but the embodiments of the present invention are not limited thereto.

[0087] A plurality of communication lines NL may be arranged in the region between the plurality of touch groups TG. The plurality of communication lines NL may be arranged extending in the row direction from the region between the plurality of touch groups TG. The plurality of communication lines NL may be arranged in the region between the plurality of second electrodes CE2 and may not overlap the plurality of second electrodes CE2. For example, the plurality of communication lines NL may be lines used for short-range communication such as NFC (Near Field Communication) or Bluetooth (registered trademark). The plurality of communication lines NL may function as an antenna. For example, the plurality of communication lines NL may be a plurality of connecting lines, etc., but the embodiment of the present invention is not limited thereto.

[0088] According to the present invention, a bank BNK may be disposed in each of a plurality of sub-pixels. The plurality of banks BNK may be structures on which a plurality of light-emitting elements ED are seated. The plurality of banks BNK may guide the positions of the plurality of light-emitting elements ED in a transfer process of transferring the plurality of light-emitting elements ED to the display device 1000. In a transfer process of the plurality of light-emitting elements ED, the plurality of light-emitting elements ED may be transferred onto the plurality of banks BNK. The plurality of banks BNK may be bank patterns or structures, but the embodiment of the present invention is not limited thereto.

[0089] The banks BNK for the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 may be spaced apart from one another. The banks BNK for the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3 may be configured to be separated from one another. This makes it easy to distinguish the banks BNK for the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3, to which different types of light-emitting elements ED are transferred.

[0090] The bank BNK of the 1-1 subpixel SP1a and the bank BNK of the 1-2 subpixel SP1b may be connected to each other, or may be spaced apart or separated from each other. For example, considering design requirements such as transfer process requirements, the bank BNK of the 1-1 subpixel SP1a and the bank BNK of the 1-2 subpixel SP1b, in which the same type of light-emitting element ED is arranged, may be connected to each other, spaced apart or separated from each other. The bank BNK of the 2-1 subpixel SP2a and the bank BNK of the 2-2 subpixel SP2b may be connected to each other, spaced apart or separated from each other. The bank BNK of the 3-1 subpixel SP3a and the bank BNK of the 3-2 subpixel SP3b may be connected to each other, spaced apart or separated from each other. Therefore, the banks BNK of the pair of first subpixels SP1, the pair of second subpixels SP2, and the pair of third subpixels SP3 may be formed in various ways, and the embodiment of the present invention is not limited thereto.

[0091] For example, the plurality of banks BNK may be made of an organic insulating material. The plurality of banks BNK may be made of a single layer or multiple layers of the organic insulating material. For example, the plurality of banks BNK may be made of benzocyclobutene resin, photosensitive polymer, photoresist, polyimide (PI), or acrylic material, but the embodiment of the present invention is not limited thereto.

[0092] A first electrode CE1 may be disposed in each of the plurality of subpixels. The first electrode CE1 may be disposed on a bank BNK. The first electrode CE1 may be electrically connected to one signal line TL among the plurality of signal lines TL. At least a portion of the first electrode CE1 may extend outside the bank BNK and be electrically connected to the signal line TL closest to the first electrode CE1. For example, a portion of the first electrode CE1 of the 1-1 subpixel SP1a may extend to one side region of the 1-1 subpixel SP1a and be electrically connected to the first signal line TL1, and a portion of the first electrode CE1 of the 1-2 subpixel SP1b may extend to the other side region of the 1-2 subpixel SP1b and be electrically connected to the second signal line TL2. A portion of the first electrode CE1 of the 2-1 subpixel SP2a may extend to one side region of the 2-1 subpixel SP2a and be electrically connected to the third signal line TL3, a portion of the first electrode CE1 of the 2-2 subpixel SP2b may extend to the other side region of the 2-2 subpixel SP2b and be electrically connected to the fourth signal line TL4, a portion of the first electrode CE1 of the 3-1 subpixel SP3a may extend to one side region of the 3-1 subpixel SP3a and be electrically connected to the fifth signal line TL5, and a portion of the first electrode CE1 of the 3-2 subpixel SP3b may extend to the other side region of the 3-2 subpixel SP3b and be electrically connected to the sixth signal line TL6.

[0093] The first electrode CE1 is electrically connected to the anode electrode 134 of the light-emitting element ED and can transmit an anode voltage from the pixel driver PD to the light-emitting element ED through the signal line TL. Different voltages may be applied to the first electrode CE1 of each of the plurality of sub-pixels depending on an image to be displayed. For example, different voltages may be applied to the first electrode CE1 of each of the plurality of sub-pixels. Therefore, the first electrode CE1 may be a pixel electrode, although embodiments of the present invention are not limited thereto. Alternatively, the first electrode CE1 may be a common electrode, and the second electrode CE2 may be a pixel electrode.

[0094] The first electrode CE1 may be made of a conductive material. For example, the first electrode CE1 may be integrally formed with the plurality of signal lines TL. For example, the first electrode CE1 may be made of the same, substantially the same, or a different conductive material as the plurality of signal lines TL, but embodiments of the present invention are not limited thereto. For example, the first electrode CE1 may be made of a conductive material such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), indium gallium zinc oxide (IGZO), etc., but embodiments of the present invention are not limited thereto. As another example, the first electrode CE1 may be formed of a multi-layer structure of conductive materials. For example, the plurality of first electrodes CE1 may have a multilayer structure such as titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO), indium tin oxide (ITO) / aluminum (Al) / indium tin oxide (ITO), ITO / APC / ITO, etc., but the embodiments of the present invention are not limited thereto.

[0095] A light-emitting element ED may be arranged in each of the plurality of sub-pixels. The light-emitting elements ED may be any one of LEDs (Light-emitting Diodes), mini LEDs, or micro LEDs (Micro Light-emitting Diodes), but the embodiment of the present invention is not limited thereto. The light-emitting elements ED may be arranged on the bank BNK and the first electrode CE1. The light-emitting elements ED may be arranged on the first electrode CE1 and electrically connected to the first electrode CE1. Therefore, the light-emitting elements ED may emit light when an anode voltage is applied from the pixel driver PD via the signal line TL and the first electrode CE1.

[0096] The plurality of light-emitting elements ED may include a first light-emitting element 130, a second light-emitting element 140, and a third light-emitting element 150. The first light-emitting element 130 may be disposed in a first sub-pixel SP1. The second light-emitting element 140 may be disposed in a second sub-pixel SP2. The third light-emitting element 150 may be disposed in a third sub-pixel SP3. For example, one of the first light-emitting element 130, the second light-emitting element 140, and the third light-emitting element 150 may be a red light-emitting element, another may be a green light-emitting element, and the remaining may be a blue light-emitting element, but this is not limited to this embodiment. Therefore, various colors of light, including white, may be realized by combining the red, green, and blue lights emitted from the plurality of light-emitting elements ED. The number and types of the plurality of light-emitting elements ED are merely exemplary, and this is not a limitation of this embodiment. For example, the plurality of sub-pixels may include different numbers of sub-pixels emitting light of different colors, such as CMYK.

[0097] The first light-emitting element 130 may include a 1-1 light-emitting element 130a arranged in a 1-1 sub-pixel SP1a and a 1-2 light-emitting element 130b arranged in a 1-2 sub-pixel SP1b. The second light-emitting element 140 may include a 2-1 light-emitting element 140a arranged in a 2-1 sub-pixel SP2a and a 2-2 light-emitting element 140b arranged in a 2-2 sub-pixel SP2b. The third light-emitting element 150 may include a 3-1 light-emitting element 150a arranged in a 3-1 sub-pixel SP3a and a 3-2 light-emitting element 150b arranged in a 3-2 sub-pixel SP3b.

[0098] 10, a second electrode CE2 may be disposed in each of the plurality of sub-pixels. The second electrode CE2 may be disposed on the light-emitting element ED. The second electrode CE2 may be electrically connected to the pixel driver PD through a plurality of contact electrodes CCE.

[0099] For example, the second electrode CE2 may be electrically connected to the cathode electrode 135 (see FIG. 12) of the light-emitting element ED and transmit a cathode voltage from the pixel driver PD to the light-emitting element ED. The same cathode voltage may be applied to the second electrode CE2 of each of the plurality of sub-pixels. For example, the same voltage may be applied to the second electrode CE2 of each of the plurality of sub-pixels and the cathode electrode 135 of the light-emitting element ED. Therefore, the second electrode CE2 may be a common electrode. Alternatively, the first electrode CE1 may be a common electrode, and the second electrode CE2 may be a pixel electrode.

[0100] At least some of the subpixels may share the second electrode CE2. At least some of the second electrodes CE2 of the subpixels may be electrically connected to one another. The same voltage may be applied to the second electrode CE2, allowing the second electrode CE2 of at least some of the subpixels to be shared. For example, the second electrodes CE2 of at least some of the pixels PX arranged in the same row may be connected to one another. For example, one second electrode CE2 may be arranged for multiple pixels PX. One second electrode CE2 may be arranged for every n subpixels, where n is an integer greater than 1.

[0101] For example, some of the second electrodes CE2 of the subpixels may be spaced apart or separated from one another. For example, the second electrodes CE2 connected to the n*m ​​pixels PX included in the first touch group TG1 may be spaced apart or separated from the second electrodes CE2 connected to the n*m ​​pixels PX included in the adjacent touch groups TG2 and TG3. For example, the second electrodes CE2 of the first touch group TG1 may be spaced apart from the second electrodes CE2 of the third touch group TG3, with a plurality of communication lines NL extending in the row direction interposed therebetween. Therefore, the number of subpixels may be greater than the number of second electrodes CE2. However, the present invention is not limited thereto.

[0102] 10, the communication lines NL may be disposed in regions between the second electrodes CE2 and may not overlap the second electrodes CE2. Therefore, the second electrodes CE2 used as touch electrodes of the first touch group TG1 and the second electrodes CE2 used as touch electrodes of the third touch group TG3 may be spaced apart from each other. The pixel driver PD may be electrically connected to the second electrodes CE2 of the first touch group TG1 and the second electrodes CE2 of the third touch group TG3 through the contact electrodes CCE. Here, the second electrode CE2 of the first touch group TG1 may be a first common electrode. The second electrode CE2 of the third touch group TG3 may be a second common electrode, but is not limited thereto. For example, the second common electrode may be the second electrode CE2 of the second touch group TG2. When the second electrode CE2 of the second touch group TG2 is the second common electrode, the second electrode CE2 of the third touch group TG3 may be the third common electrode, and the second electrode CE2 of the fourth touch group TG4 may be the fourth common electrode, but is not limited to this. The pixel connected to the second electrode CE2 of the first touch group TG1 may be the first pixel. The pixel connected to the second electrode CE2 of the third touch group TG3 may be the second pixel, but is not limited to this. For example, the second pixel may be the pixel connected to the second electrode CE2 of the second touch group TG2. When the pixel connected to the second electrode CE2 of the second touch group TG2 is the second pixel, the pixel connected to the second electrode CE2 of the third touch group TG3 may be the third pixel, and the pixel connected to the second electrode CE2 of the fourth touch group TG4 may be the fourth pixel, but is not limited to this. Therefore, the pixel driver PD can supply voltages to the first common electrode and the second common electrode. The pixel driver PD can supply a common voltage to the first common electrode and the second common electrode to display an image, or supply a touch drive signal to the first common electrode and the second common electrode to sense a touch.

[0103] In addition, the second electrode CE2 may function as an electrode used for touch sensing. When the second electrode CE2 functions as a touch electrode during the touch sensing periods T1, T2, T3, and T4, the pixel driver PD electrically connected thereto through the plurality of contact electrodes CCE may calculate sensed touch information.

[0104] The plurality of second electrodes CE2 may be made of a transparent conductive material, but embodiments of the present invention are not limited thereto. The plurality of second electrodes CE2 may be made of a transparent conductive material so that light emitted from the light emitting element ED is directed toward the top of the second electrodes CE2. For example, the second electrodes CE2 may be made of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium gallium oxide (IGO), etc., but embodiments of the present invention are not limited thereto.

[0105] A plurality of contact electrodes CCE may be arranged on the substrate 110. For example, the plurality of contact electrodes CCE may be arranged apart from the plurality of banks BNK and the plurality of signal wirings TL. Each of the plurality of second electrodes CE2 may overlap at least one contact electrode CCE. For example, one second electrode CE2 may overlap multiple contact electrodes CCE.

[0106] For example, the plurality of contact electrodes CCE may be electrically coupled to the plurality of second electrodes CE2. The plurality of contact electrodes CCE may be disposed between the substrate 110 and the plurality of second electrodes CE2 and may transmit a cathode voltage from the pixel driver PD to the second electrodes CE2. When the second electrodes CE2 function as touch electrodes, sensed touch information may be transmitted to the pixel driver PD through the plurality of contact electrodes CCE.

[0107] For example, one pixel driver PD may be included in the same touch unit and electrically connected to the second electrodes CE2 arranged in adjacent touch groups TG1 and TG3 through a plurality of contact electrodes CCE. The pixel driver PD may be arranged overlapping the lower portion of two adjacent touch groups in the column direction within the same touch unit. For example, the pixel driver PD may be arranged overlapping between the first touch group TG1 and the third touch group TG3 within the same touch unit, although embodiments of the present invention are not limited thereto. For example, another adjacent pixel driver PD may be arranged overlapping between the second touch group TG2 and the fourth touch group TG4 within the touch unit.

[0108] For example, when micro LEDs are used as the light-emitting elements ED, multiple micro LEDs can be formed on a wafer and transferred to the substrate 110 of the display device 1000 to manufacture the display device 1000. Various defects can occur during the process of transferring multiple light-emitting elements ED, each having a microscopic size, from the wafer to the substrate 110. For example, a defect in which the light-emitting elements ED are not transferred to some subpixels can occur, and a defect in which the light-emitting elements ED are transferred off-position to other subpixels due to alignment errors can occur. Furthermore, the transfer process may proceed normally, but the transferred light-emitting element ED itself may be defective. Therefore, taking into account defects during the transfer process of multiple light-emitting elements ED, multiple light-emitting elements ED of the same type can be transferred to one subpixel. After a lighting test of the multiple light-emitting elements ED, only one light-emitting element ED that is ultimately determined to be normal can be used.

[0109] For example, both the 1-1 light-emitting element 130a and the 1-2 light-emitting element 130b can be transferred to one pixel PX and inspected for defects. If both the 1-1 light-emitting element 130a and the 1-2 light-emitting element 130b are determined to be normal, only the 1-1 light-emitting element 130a can be used, and the 1-2 light-emitting element 130b can be left unused. As another example, if only the 1-2 light-emitting element 130b is determined to be normal among the 1-1 light-emitting element 130a and the 1-2 light-emitting element 130b, the 1-1 light-emitting element 130a can be left unused, and only the 1-2 light-emitting element 130b can be used. Therefore, even if multiple light-emitting elements ED of the same type are transferred to one pixel PX, ultimately only one light-emitting element ED can be used.

[0110] Therefore, one of the pair of light emitting elements ED may be a main (or primary) light emitting element ED, and the other may be a redundancy light emitting element ED. The redundancy light emitting element ED may be an extra light emitting element ED that is transferred in preparation for a failure of the main light emitting element ED. When the main light emitting element ED fails, the redundancy light emitting element ED can be used in place of the main light emitting element ED. Therefore, by transferring both the main light emitting element ED and the redundancy light emitting element ED to one pixel PX, it is possible to minimize or reduce degradation of display quality due to failures of the main light emitting element ED and the redundancy light emitting element ED.

[0111] For example, the 1-1 light-emitting element 130a, the 2-1 light-emitting element 140a, and the 3-1 light-emitting element 150a transferred to one pixel PX can be used as the main light-emitting element ED, and the 1-2 light-emitting element 130b, the 2-2 light-emitting element 140b, and the 3-2 light-emitting element 150b can be used as the redundancy light-emitting element ED.

[0112] Fig. 11 is a cross-sectional view taken along line II' in Fig. 3. Fig. 12 is a cross-sectional view showing a sub-pixel including a light-emitting element arranged in the display region.

[0113] Referring to FIG. 11, a first buffer layer 111a and a second buffer layer 111b may be disposed on the remaining area of ​​the substrate 110 except for the bending area BA.

[0114] The first buffer layer 111a and the second buffer layer 111b may be disposed in the display area AA, the first non-display area NA1, and the second non-display area NA2. The first buffer layer 111a and the second buffer layer 111b may reduce the penetration of moisture, oxygen, hydrogen, or impurities through the substrate 110. The first buffer layer 111a and the second buffer layer 111b may be made of an inorganic insulating material. For example, the first buffer layer 111a and the second buffer layer 111b may be made of a single layer or multiple layers of silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiOxNy), although embodiments of the present invention are not limited thereto.

[0115] For example, portions of the first buffer layer 111a and the second buffer layer 111b on the bending region BA may be removed. The upper surface of the substrate 110 located in the bending region BA may be exposed from the first buffer layer 111a and the second buffer layer 111b. By removing the first buffer layer 111a and the second buffer layer 111b made of an inorganic insulating material from the bending region BA, cracks in the first buffer layer 111a and the second buffer layer 111b that may occur during bending may be minimized or reduced.

[0116] A plurality of alignment keys MK may be disposed between the first buffer layer 111a and the second buffer layer 111b. The plurality of alignment keys MK may be configured to identify the positions of the pixel drivers PD during the manufacturing process of the display device 1000. For example, the plurality of alignment keys MK may be configured to align the positions of the pixel drivers PD to be transferred onto the adhesive layer 112. As another example, the plurality of alignment keys MK may be omitted.

[0117] An adhesive layer 112 may be disposed on the second buffer layer 111b. The adhesive layer 112 may be disposed in the display area AA, the first non-display area NA1, the bending area BA, and the second non-display area NA2. As another example, at least a portion of the adhesive layer 112 may be removed from the non-display area NA including the bending area BA. For example, the adhesive layer 112 may be made of any one of an optically clear adhesive (OCA), an optically clear resin (OCR), a pressure-sensitive adhesive (PSA), a silicone resin, an adhesive polymer, an epoxy resin, a UV-curable resin, a polyimide-based material, an acrylate-based material, a urethane-based material, and polydimethylsiloxane (PDMS), but the embodiment of the present invention is not limited thereto.

[0118] In the display area AA, a pixel driver PD may be disposed on the adhesive layer 112. The pixel driver PD may be mounted on the adhesive layer 112 by a transfer process, but the embodiment of the present invention is not limited thereto.

[0119] A first protective layer 113a and a second protective layer 113b may be disposed on the adhesive layer 112 and the pixel driver PD. The first protective layer 113a and the second protective layer 113b may be disposed to surround the side surfaces of the pixel driver PD, but the embodiment of the present invention is not limited thereto. For example, the second protective layer 113b may be disposed to cover at least a portion of the upper surface of the pixel driver PD. For example, at least one of the first protective layer 113a and the second protective layer 113b disposed on the bending region BA may be omitted. For example, the first protective layer 113a may be disposed entirely in the display region AA and the non-display region NA, and the second protective layer 113b may be disposed partially in the display region AA, the first non-display region NA1, and the second non-display region NA2. For example, the portion of the second protective layer 113b in the bending region BA may be removable. However, the embodiment of the present invention is not limited thereto.

[0120] The first protective layer 113a and the second protective layer 113b may be made of an organic insulating material, but the embodiment of the present invention is not limited thereto. For example, the first protective layer 113a and the second protective layer 113b may be made of an acrylic resin, a phenolic resin, an unsaturated polyester resin, a polyamide resin, a benzocyclobutene, a polyphenylene resin, a polyphenylene sulfide resin, a photoresist, a polyimide (PI), or a photoacryl-based material, but the embodiment of the present invention is not limited thereto. For example, the first protective layer 113a and the second protective layer 113b may be an overcoating layer or an insulating layer, but the embodiment of the present invention is not limited thereto. The first protective layer 113a and the second protective layer 113b may be made of the same or different materials.

[0121] According to the present invention, a plurality of first connecting wires 121 may be disposed on the second protective layer 113b in the display area AA. The plurality of first connecting wires 121 may be wires for electrically connecting the pixel driver PD to other components. For example, the pixel driver PD may be electrically connected to a plurality of signal wires TL and a plurality of contact electrodes CCE through the plurality of first connecting wires 121. For example, the plurality of first connecting wires 121 may include a 1-1 connecting wire 121a, a 1-2 connecting wire 121b, a 1-3 connecting wire 121c, and a 1-4 connecting wire 121d, but the embodiment of the present invention is not limited thereto.

[0122] For example, a plurality of first-first connecting wires 121a may be disposed on the second protective layer 113b. The plurality of first-first connecting wires 121a may be electrically connected to the pixel driver PD. The plurality of first-first connecting wires 121a may transmit a voltage output from the pixel driver PD to the first electrode CE1 or the second electrode CE2.

[0123] For example, a third protective layer 114 may be disposed on the second protective layer 113b. The third protective layer 114 may be disposed over the entire display area AA and non-display area NA. In the bending area BA, the third protective layer 114 may cover or encase the side surfaces of the second protective layer 113b and the top surface of the first protective layer 113a. The third protective layer 114 may be made of an organic insulating material. For example, the third protective layer 114 may be made of an acrylic resin, a phenolic resin, an unsaturated polyester resin, a polyamide resin, benzocyclobutene, a polyphenylene resin, a polyphenylene sulfide resin, a photoresist, a polyimide (PI), or a photoacryl-based material, but the present invention is not limited thereto. For example, the first protective layer 113a, the second protective layer 113b, and the third protective layer 114 may be made of the same material, but the present invention is not limited thereto. Alternatively, the third protective layer 114 can be made of a different material than the first protective layer 113a and the second protective layer 113b.

[0124] A plurality of first-second connecting wires 121b may be disposed on the third protective layer 114. The plurality of first-second connecting wires 121b may be indirectly or directly connected to the pixel driver PD. For example, some of the first-second connecting wires 121b may be directly connected to the pixel driver PD through contact holes in the third protective layer 114. Alternatively, some of the first-second connecting wires 121b may be connected to the pixel driver PD through contact holes in the third protective layer 114 and the first-first connecting wire 121a. Another portion of the first-second connecting wire 121b may be electrically connected to the first-first connecting wire 121a through contact holes in the third protective layer 114. However, embodiments of the present invention are not limited thereto. Voltages and / or signals output from the pixel driver PD may be transmitted to the first electrode CE1 or the second electrode CE2 through connecting wires other than the plurality of first-second connecting wires 121b.

[0125] A first insulating layer 115a may be disposed on the plurality of first and second connecting wires 121b. The first insulating layer 115a may be disposed over the entire display area AA and the non-display area NA, but the embodiment of the present invention is not limited thereto. Alternatively, the first insulating layer 115a may be partially disposed over the display area AA, the first non-display area NA1, and the second non-display area NA2. For example, a portion of the first insulating layer 115a in the bending area BA may be removed. The first insulating layer 115a may be made of an organic insulating material, but the embodiment of the present invention is not limited thereto. For example, the first insulating layer 115a may be made of an acrylic resin, a phenolic resin, an unsaturated polyester resin, a polyamide resin, benzocyclobutene, a polyphenylene resin, a polyphenylene sulfide resin, a photoresist, a polyimide (PI), or a photoacryl-based material, but the embodiment of the present invention is not limited thereto.

[0126] A plurality of 1-3 connecting wires 121c may be disposed on the first insulating layer 115a. The plurality of 1-3 connecting wires 121c may be electrically connected to the plurality of 1-2 connecting wires 121b. For example, the 1-3 connecting wire 121c may be electrically connected to the 1-2 connecting wire 121b through a contact hole in the first insulating layer 115a. For example, the 1-3 connecting wire 121c may be electrically connected to the 1-2 connecting wire 121b through a contact hole in the first insulating layer 115a, and may be electrically connected to the 1-1 connecting wire 121a through a contact hole in the third protective layer 114.

[0127] A second insulating layer 115b may be disposed on the first to third connecting wires 121c. The second insulating layer 115b may be disposed in the remaining area excluding the bending area BA, but the embodiment of the present invention is not limited thereto. The second insulating layer 115b may be disposed in the display area AA, the first non-display area NA1, and the second non-display area NA2, but the embodiment of the present invention is not limited thereto. For example, a portion of the second insulating layer 115b disposed in the bending area BA may be removed. The second insulating layer 115b may be made of an organic insulating material, but the embodiment of the present invention is not limited thereto. For example, the second insulating layer 115b may be made of an acrylic resin, a phenolic resin, an unsaturated polyester resin, a polyamide resin, benzocyclobutene, a polyphenylene resin, a polyphenylene sulfide resin, a photoresist, a polyimide (PI), or a photoacryl-based material, but the embodiment of the present invention is not limited thereto.

[0128] A plurality of first-fourth connecting wires 121d may be disposed on the second insulating layer 115b. The plurality of first-fourth connecting wires 121d may be electrically connected to a plurality of first-third connecting wires 121c. For example, the first-fourth connecting wire 121d may be electrically connected to the first-third connecting wire 121c through a contact hole in the second insulating layer 115b, may be electrically connected to the first-second connecting wire 121b through a contact hole in the first insulating layer 115a, and may be further electrically connected to the first-first connecting wire 121a through a contact hole in the third protective layer 114.

[0129] According to the present invention, a plurality of second connecting wires 122 may be disposed on the second protective layer 113b in the non-display area NA. The plurality of second connecting wires 122 may be wires for transmitting signals transmitted to the pad unit PAD from the flexible circuit board (or flexible film) CB and / or the printed circuit board 160 (see FIG. 1) to the pixel driver PD in the display area AA. For example, the plurality of second connecting wires 122 may be electrically connected to a plurality of pad electrodes PE, and signals from the flexible circuit board (or flexible film) CB and / or the printed circuit board may be applied to the plurality of second connecting wires 122.

[0130] For example, the second connecting wires 122 may extend from the pad unit PAD toward the display area AA to transmit signals to the wires in the display area AA. In this case, the second connecting wires 122 may function as link wires LL. The second connecting wires 122 may include a 2-1 connecting wire 122a, a 2-2 connecting wire 122b, a 2-3 connecting wire 122c, and a 2-4 connecting wire 122d. The 2-1 connecting wire 122a in the first non-display area NA1 may be electrically connected or coupled to the 1-1 connecting wire 121a in the display area AA.

[0131] A plurality of 2-1 connecting wires 122a may be disposed on the second protective layer 113b, and may extend from the second non-display area NA2 to the bending area BA and the first non-display area NA1.

[0132] The plurality of second-first connecting wires 122a may be electrically connected to the plurality of first-second connecting wires 121b in the display area AA. The plurality of second-first connecting wires 122a may transmit signals transmitted from the flexible circuit board (or flexible film) CB and / or the printed circuit board to the pad unit PAD to the pixel driver PD in the display area AA.

[0133] A plurality of 2-2 connecting wires 122b may be disposed on the third protective layer 114. The plurality of 2-2 connecting wires 122b may be disposed in the second non-display area NA2. The 2-2 connecting wires 122b may be electrically connected to the 2-1 connecting wires 122a through contact holes in the third protective layer 114. Therefore, signals from the flexible circuit board (or flexible film) CB and / or the printed circuit board can be transmitted to the 2-1 connecting wires 122a through the 2-2 connecting wires 122b.

[0134] The second-third connecting wire 122c may be disposed on the first insulating layer 115a. The second-third connecting wire 122c may be disposed in the second non-display area NA2. The second-third connecting wire 122c may be electrically connected to the second-second connecting wire 122b through a contact hole in the first insulating layer 115a and to the second-first connecting wire 122a through a contact hole in the third protective layer 114. Therefore, signals from the flexible circuit board (or flexible film) CB and / or the printed circuit board may be transmitted to the second-first connecting wire 122a through the second-third connecting wire 122c and the second-second connecting wire 122b.

[0135] A second-fourth connecting wire 122d may be disposed on the second insulating layer 115b. The second-fourth connecting wire 122d may be disposed in the second non-display area NA2. The second-fourth connecting wire 122d may be electrically connected to the second-third connecting wire 122c through a contact hole in the second organic insulating layer 115b, to the second-third connecting wire 122c through a contact hole in the second insulating layer 115b, to the second-second connecting wire 122b through a contact hole in the first insulating layer 115a, and to the second-first connecting wire 122a through a contact hole in the third protective layer 114. Therefore, a signal from the flexible film FF and / or the printed circuit board can be transmitted to the 2-1 connecting wire 122a via the 2-4 connecting wire 122d, the 2-3 connecting wire 122c, and the 2-2 connecting wire 122b.

[0136] The first connecting wires 121 and the second connecting wires 122 may be made of a flexible conductive material or any one of various conductive materials used in the display area AA. For example, the second connecting wire 122, a portion of which is disposed in the bending area BA, may be made of a flexible conductive material such as gold (Au), silver (Ag), copper (Cu), or aluminum (Al), but this embodiment is not limited thereto. As another example, the first connecting wires 121 and the second connecting wires 122 may be made of molybdenum (Mo), chromium (Cr), titanium (Ti), gold (Au), aluminum (Al), nickel (Ni), neodymium (Nd), copper (Cu), an alloy of silver (Ag) and magnesium (Mg), or alloys thereof, but this embodiment is not limited thereto. The first connecting wires 121 and the second connecting wires 122 may be made of the same or different materials.

[0137] A third insulating layer 115c may be disposed on the plurality of first connecting wires 121 and the plurality of second connecting wires 122. The third insulating layer 115c may be disposed in the remaining area excluding the bending area BA, but the embodiment of the present invention is not limited thereto. The third insulating layer 115c may be disposed in the display area AA, the first non-display area NA1, and the second non-display area NA2. A portion of the third insulating layer 115c in the bending area BA may be removed. The third insulating layer 115c may be made of an organic insulating material, but the embodiment of the present invention is not limited thereto. For example, the third insulating layer 115c may be made of an acrylic resin, a phenolic resin, an unsaturated polyester resin, a polyamide resin, benzocyclobutene, a polyphenylene resin, a polyphenylene sulfide resin, a photoresist, a polyimide (PI), or a photoacryl-based material, but the embodiment of the present invention is not limited thereto.

[0138] In the display area AA, a plurality of banks BNK may be arranged on the third insulating layer 115c. The plurality of banks BNK may be arranged so as to overlap with each of a plurality of sub-pixels. One or more light-emitting elements ED of the same or different types may be arranged on top of each of the plurality of banks BNK.

[0139] In the display area AA, a plurality of signal lines TL may be arranged on the third insulating layer 115c. The plurality of signal lines TL may be arranged in the regions between the plurality of banks BNK. For example, the plurality of signal lines TL may be arranged adjacent to any one of the plurality of banks BNK.

[0140] In the display area AA, a plurality of contact electrodes CCE may be disposed on the third insulating layer 115c. The contact electrodes CCE may supply a cathode voltage from the pixel driver PD to the second electrode CE2.

[0141] A first electrode CE1 may be arranged on the bank BNK. For example, the first electrode CE1 may be arranged extending from the adjacent signal wiring TL toward the top of the bank BNK. The first electrode CE1 may be arranged on the top surface of the bank BNK and on the side surface of the bank BNK. For example, the first electrode CE1 may be arranged extending from the signal wiring TL on the top surface of the third insulating layer 115c to the side surface of the bank BNK and on the top surface of the bank BNK.

[0142] 12, the first electrode CE1 may be composed of a plurality of conductive layers. For example, the first electrode CE1 may include a first conductive layer CE1a, a second conductive layer CE1b, a third conductive layer CE1c, and a fourth conductive layer CE1d, but the embodiment of the present invention is not limited thereto.

[0143] The first conductive layer CE1a may be disposed on the bank BNK. The second conductive layer CE1b may be disposed on the first conductive layer CE1a. The third conductive layer CE1c may be disposed on the second conductive layer CE1b. The fourth conductive layer CE1d may be disposed on the third conductive layer CE1c. For example, each of the first conductive layer CE1a, the second conductive layer CE1b, the third conductive layer CE1c, and the fourth conductive layer CE1d may be composed of titanium (Ti), molybdenum (Mo), aluminum (Al), or a titanium (Ti) alloy, and indium tin oxide (ITO) or an alloy thereof, although embodiments of the present invention are not limited thereto.

[0144] According to the present invention, among the plurality of conductive layers constituting the first electrode CE1, some conductive layers with high reflective efficiency may be configured as an alignment key and / or a reflector for aligning the light emitting element ED. For example, among the plurality of conductive layers of the first electrode CE1, the second conductive layer CE1b may include a reflective material. For example, the second conductive layer CE1b may include aluminum (Al), silver (Ag), gold (Au), or magnesium (Mg), but the present invention is not limited thereto. Therefore, the second conductive layer CE1b may be configured as a reflector. Furthermore, the high reflective efficiency of the second conductive layer CE1b facilitates identification during the manufacturing process, and therefore, the position or transfer position of the light emitting element ED can be aligned based on the second conductive layer CE1b.

[0145] For example, to configure the second conductive layer CE1b as a reflector, the third conductive layer CE1c and the fourth conductive layer CE1d covering the second conductive layer CE1b may be partially removed or etched. For example, portions of the third conductive layer CE1c and the fourth conductive layer CE1d disposed on the bank BNK may be removed or etched to expose the top surface of the second conductive layer CE1b. For example, the central and edge portions (or margins) of the third conductive layer CE1c and the fourth conductive layer CE1d where the solder pattern SDP is disposed may be left, and the remaining portions may be removed. For example, the edge portions (or margins) of the third conductive layer CE1c made of titanium (Ti) and the fourth conductive layer CE1d made of indium tin oxide (ITO) may not be etched. This prevents or reduces corrosion of other conductive layers of the first electrode CE1 by a TMAH (Tetra Methyl Ammonium Hydroxide) solution used in the mask process of the first electrode CE1.

[0146] According to the present invention, the first conductive layer CE1a and the third conductive layer CE1c may include titanium (Ti) or molybdenum (Mo). The second conductive layer CE1b may include aluminum (Al), silver (Ag), gold (Au), magnesium (Mg), etc. The fourth conductive layer CE1d may include a transparent conductive oxide layer such as indium tin oxide (ITO), indium gallium oxide (IGO), indium gallium zinc oxide (IGZO), or indium zinc oxide (IZO), which has good adhesion to the solder pattern SDP and corrosion and acid resistance. However, embodiments of the present invention are not limited thereto.

[0147] The first conductive layer CE1a, the second conductive layer CE1b, the third conductive layer CE1c, and the fourth conductive layer CE1d may be deposited sequentially and then patterned by performing a photolithography process and an etching process, but embodiments of the present invention are not limited thereto.

[0148] According to the present invention, the signal line TL, contact electrode CCE, and pad electrode PE, which are arranged on the same layer as the first electrode CE1, may be formed of multiple layers of conductive materials, but the embodiment of the present invention is not limited thereto. For example, the signal line TL, contact electrode CCE, and pad electrode PE may be formed of multiple layers of indium tin oxide (ITO) / titanium (Ti) / aluminum (Al) / titanium (Ti), ITO / aluminum (Al) / ITO, etc., but the embodiment of the present invention is not limited thereto.

[0149] According to the present invention, in each of the plurality of subpixels, a solder pattern SDP may be disposed on the first electrode CE1, and the solder pattern SDP is between the first electrode CE1 and the first semiconductor layer 131. The solder pattern SDP may bond the light emitting element ED to the first electrode CE1. The first electrode CE1 and the light emitting element ED may be electrically connected through eutectic bonding using the solder pattern SDP, although embodiments of the present invention are not limited thereto. For example, if the solder pattern SDP is made of indium (In) and the anode electrode 134 of the light emitting element ED is made of gold (Au), the solder pattern SDP and the anode electrode 134 may be bonded by applying heat and pressure during the light emitting element ED transfer process. The light emitting element ED may be bonded to the solder pattern SDP and the first electrode CE1 through eutectic bonding without a separate adhesive. For example, the solder pattern SDP may be made of indium (In), tin (Sn), or an alloy thereof, although embodiments of the present invention are not limited thereto. For example, the solder patterns SDP may be bonding pads or bonding pads, but the embodiments of the present invention are not limited thereto.

[0150] According to the present invention, the passivation layer 116 may be disposed on the signal lines TL, the first electrodes CE1, the contact electrodes CCE, and the third insulating layer 115c. For example, the passivation layer 116 may be disposed in the display area AA, the first non-display area NA1, and the second non-display area NA2. A portion of the passivation layer 116 disposed in the bending area BA may be removed. A portion of the passivation layer 116 covering the pad electrodes PE in the second non-display area NA2 may be removed. The passivation layer 116 is disposed to cover the remaining areas except for the bending area BA, the pad electrodes PE, and the area where the solder pattern SDP is disposed, thereby reducing the penetration of moisture or impurities into the light emitting element ED. For example, the passivation layer 116 may be formed of a single layer or multiple layers of silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), or the like, but the present invention is not limited thereto. For example, the passivation layer 116 may be a protective layer or an insulating layer, but embodiments of the present invention are not limited thereto. For example, the passivation layer 116 may include openings 116h that expose the solder patterns SDP.

[0151] In each of the plurality of sub-pixels, a light-emitting element ED may be arranged on the solder pattern SDP. A first light-emitting element 130 may be arranged in the first sub-pixel SP1. A second light-emitting element 140 may be arranged in the second sub-pixel SP2. A third light-emitting element 150 may be arranged in the third sub-pixel SP3.

[0152] The light-emitting element ED can be formed on a silicon wafer by a method such as metal organic chemical vapor deposition (MOCVD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), molecular beam epitaxy (MBE), hydride vapor phase epitaxy (HVPE), or sputtering, but embodiments of the present invention are not limited thereto.

[0153] The first light emitting element 130 may include an anode electrode 134, a first semiconductor layer 131, an active layer 132, a second semiconductor layer 133, a cathode electrode 135, and a sealing film 136, but the embodiment of the present invention is not limited thereto. For example, the first light emitting element 130 may not include the sealing film 136.

[0154] A first semiconductor layer 131 may be disposed on the solder pattern SDP. A second semiconductor layer 133 may be disposed on the first semiconductor layer 131.

[0155] For example, one of the first semiconductor layer 131 and the second semiconductor layer 133 may be implemented using a compound semiconductor of a group III-V, a group II-VI, etc., and may be doped with impurities (or dopants). For example, one of the first semiconductor layer 131 and the second semiconductor layer 133 may be a semiconductor layer doped with n-type impurities, and the other may be a semiconductor layer doped with p-type impurities, but embodiments of the present invention are not limited thereto. For example, one or more of the first semiconductor layer 131 and the second semiconductor layer 133 may be a layer in which a material such as gallium nitride (GaN), gallium phosphide (GaP), gallium arsenide phosphide (GaAsP), aluminum gallium indium phosphide (AlGaInP), indium aluminum phosphide (InAlP), aluminum gallium nitride (AlGaN), aluminum indium nitride (AlInN), aluminum indium gallium nitride (AlInGaN), aluminum gallium arsenide (AlGaAs), or gallium arsenide (GaAs) is doped with n-type or p-type impurities, but the embodiment of the present invention is not limited thereto. For example, the n-type impurity may be silicon (Si), germanium (Ge), selenium (Se), carbon (C), tellurium (Te), or tin (Sn), but the embodiment of the present invention is not limited thereto. For example, the p-type impurity may be magnesium (Mg), zinc (Zn), calcium (Ca), strontium (Sr), barium (Ba), or beryllium (Be), but embodiments of the present invention are not limited thereto.

[0156] For example, the first semiconductor layer 131 and the second semiconductor layer 133 may be a nitride semiconductor containing n-type impurities and a nitride semiconductor containing p-type impurities, respectively, but the embodiment of the present invention is not limited thereto. For example, the first semiconductor layer 131 may be a nitride semiconductor containing p-type impurities, and the second semiconductor layer 133 may be a nitride semiconductor containing n-type impurities, but the embodiment of the present invention is not limited thereto.

[0157] The active layer 132 may be disposed between the first semiconductor layer 131 and the second semiconductor layer 133. The active layer 132 may emit light when holes and electrons are supplied from the first semiconductor layer 131 and the second semiconductor layer 133. For example, the active layer 132 may have one of a single well structure, a multi-well structure, a single quantum well structure, a multi-quantum well (MQW) structure, a quantum dot structure, and a quantum wire structure, but the embodiment of the present invention is not limited thereto. For example, the active layer 132 may be made of indium phosphide (InP), gallium arsenide (GaAs), aluminum gallium arsenide (AlGaAs), indium gallium nitride (InGaN), gallium nitride (GaN), or the like, but the embodiment of the present invention is not limited thereto.

[0158] As another example, the active layer 132 may include a multi-quantum well (MQW) structure having well layers and barrier layers with a bandgap higher than that of the well layers. For example, the active layer 132 may be configured with InGaN well layers and AlGaN barrier layers, but the embodiment of the present invention is not limited thereto.

[0159] The anode electrode 134 may be disposed between the first semiconductor layer 131 and the solder pattern SDP. For example, the anode electrode 134 may electrically connect the first semiconductor layer 131 and the first electrode CE1. An anode voltage output from the pixel driver PD may be applied to the first semiconductor layer 131 through the signal line TL, the first electrode CE1, and the anode electrode 134. For example, the anode electrode 134 may be made of a conductive material capable of eutectic bonding with the solder pattern SDP, but the present invention is not limited thereto. For example, the anode electrode 134 may be made of gold (Au), tin (Sn), tungsten (W), silicon (Si), silver (Ag), titanium (Ti), iridium (Ir), chromium (Cr), indium (In), zinc (Zn), lead (Pb), nickel (Ni), platinum (Pt), copper (Cu), or an alloy thereof, but the present invention is not limited thereto.

[0160] The cathode electrode 135 may be disposed on the second semiconductor layer 133. For example, the cathode electrode 135 may electrically connect the second semiconductor layer 133 and the second electrode CE2. A cathode voltage output from the pixel driver PD may be applied to the second semiconductor layer 133 through the contact electrode CCE, the second electrode CE2, and the cathode electrode 135. The cathode electrode 135 may be made of a transparent conductive material so that light emitted from the light emitting element ED is directed toward the upper part of the light emitting element ED, although embodiments of the present invention are not limited thereto. For example, the cathode electrode 135 may be made of a material such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO), although embodiments of the present invention are not limited thereto.

[0161] The sealing film 136 may be disposed on at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135. For example, the sealing film 136 may surround at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135.

[0162] For example, the sealing film 136 can protect the first semiconductor layer 131, the active layer 132, and the second semiconductor layer 133. For example, the sealing film 136 can be disposed on the side surfaces of the first semiconductor layer 131, the active layer 132, and the second semiconductor layer 133.

[0163] For example, the sealing film 136 may be disposed on at least a portion of the anode electrode 134 and the cathode electrode 135, for example, an edge portion (or a rim or one side) of the anode electrode 134 and an edge portion (or a rim or one side) of the cathode electrode 135. At least a portion of the anode electrode 134 may be exposed from the sealing film 136 to allow the anode electrode 134 to be connected to the solder pattern SDP. For example, at least a portion of the cathode electrode 135 may be exposed from the sealing film 136 to allow the cathode electrode 135 to be connected to the second electrode CE2. For example, the sealing film 136 may be made of an insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx), but embodiments of the present invention are not limited thereto.

[0164] As another example, the encapsulation layer 136 may have a structure in which a reflective material is dispersed in a resin layer, but the embodiment of the present invention is not limited thereto. For example, the encapsulation layer 136 may be made of a reflector having various structures, but the embodiment of the present invention is not limited thereto. The encapsulation layer 136 may reflect light emitted from the active layer 132 upward, thereby improving light extraction efficiency. For example, the encapsulation layer 136 may be a reflective layer, but the embodiment of the present invention is not limited thereto.

[0165] Although the light emitting device ED has been described as having a vertical structure according to the present invention, embodiments of the present invention are not limited thereto. For example, the light emitting device ED may have a lateral structure or a flip chip structure.

[0166] 12, the first light emitting element 130 has been described, but the second light emitting element 140 and the third light emitting element 150 may have substantially the same structure as the first light emitting element 130. For example, the second light emitting element 140 and the third light emitting element 150 may have substantially the same first semiconductor layer 131, active layer 132, second semiconductor layer 133, anode electrode 134, cathode electrode 135, and sealing film 136 as the first light emitting element 130.

[0167] A first optical layer 117a may be disposed in the display area AA to surround the light-emitting elements ED. For example, the first optical layer 117a may be disposed to cover the light-emitting elements ED and the banks BNK in the region of the subpixels. For example, the first optical layer 117a may cover the banks BNK, a portion of the passivation layer 116, and the spaces between the light-emitting elements ED. The first optical layer 117a may be disposed or cover the spaces between the light-emitting elements ED and the banks BNK included in one pixel PX. For example, the first optical layer 117a may extend in the first direction (X) and be spaced apart from each other in the second direction (Y). For example, the first optical layer 117a may be disposed between the passivation layer 116 and the second electrode CE2 to surround the sides of the light-emitting elements ED and the banks BNK, although this embodiment is not limited thereto. For example, the first optical layer 117a may be a diffusion layer or a sidewall diffusion layer, but this embodiment is not limited thereto.

[0168] The first optical layer 117a may include an organic insulating material in which fine particles are dispersed, but embodiments of the present invention are not limited thereto. For example, the first optical layer 117a may be made of siloxane in which fine metal particles, such as titanium dioxide (TiO2) particles, are dispersed, but embodiments of the present invention are not limited thereto. Light from the plurality of light emitting elements ED may be scattered by the fine particles dispersed in the first optical layer 117a and emitted to the outside of the display device 1000. Therefore, the first optical layer 117a may improve the extraction efficiency of light emitted from the plurality of light emitting elements ED.

[0169] For example, the first optical layer 117a may be disposed in each of the plurality of pixels PX, or may be disposed together in some of the pixels PX arranged in the same row, but the embodiment of the present invention is not limited thereto. For example, the first optical layer 117a may be disposed in each of the plurality of pixels PX, or a plurality of pixels PX may share one first optical layer 117a. As another example, each of the plurality of sub-pixels may include a separate first optical layer 117a, but the embodiment of the present invention is not limited thereto.

[0170] According to the present invention, a third optical layer 117c may be disposed on the passivation layer 116 in the display area AA. For example, the third optical layer 117c may be disposed to surround the first optical layer 117a. For example, the third optical layer 117c may be in contact with a side surface of the first optical layer 117a. For example, the third optical layer 117c may be disposed in an area between multiple pixels PX. However, embodiments of the present invention are not limited thereto. For example, the third optical layer 117c may be a diffusion layer, a diffusion layer window, a window diffusion layer, or the like, but embodiments of the present invention are not limited thereto.

[0171] The third optical layer 117c may be made of an organic insulating material, but embodiments of the present invention are not limited thereto. The third optical layer 117c may be made of the same material as the first optical layer 117a, but embodiments of the present invention are not limited thereto. For example, the first optical layer 117a may include microparticles, and the third optical layer 117c may not include microparticles. For example, the third optical layer 117c may be made of siloxane, but embodiments of the present invention are not limited thereto.

[0172] For example, the thickness of the first optical layer 117a may be smaller than the thickness of the third optical layer 117c, but the embodiment of the present invention is not limited thereto. As a result, in plan view, the region where the first optical layer 117a is disposed may include a recess that is recessed inward from the top surface of the third optical layer 117c.

[0173] According to the present invention, a second electrode CE2 may be disposed on the first optical layer 117a and the third optical layer 117c. For example, the second electrode CE2 may be electrically connected to the plurality of contact electrodes CCE through contact holes in the third optical layer 117c. For example, the second electrode CE2 may be disposed on the plurality of light-emitting elements ED. For example, the second electrode CE2 may include a transparent conductive oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO), but the present invention is not limited thereto. For example, the second electrode CE2 may be disposed to contact the cathode electrode 135. For example, the second electrode CE2 may overlap the first optical layer 117a. For example, the second electrode CE2 may cover the outer plane of the first optical layer 117a.

[0174] The second electrode CE2 may be continuously extended in the first direction (X) of the substrate 110. Thus, the second electrode CE2 may be commonly connected to a plurality of pixels PX arranged in the first direction (X) of the substrate 110. For example, the second electrode CE2 may be commonly connected to a plurality of pixels PX.

[0175] According to the present invention, the second electrode CE2 may be continuously extended over the first optical layer 117a, the third optical layer 117c, and the light emitting element ED. The region where the first optical layer 117a is disposed may include a recess recessed inward from the top surface of the third optical layer 117c. As a result, a first portion of the second electrode CE2 disposed on the first optical layer 117a is disposed along the recess and may be positioned lower than a second portion of the second electrode CE2 disposed on the third optical layer 117c.

[0176] A second optical layer 117b may be disposed on the second electrode CE2. The second optical layer 117b may be disposed to overlap the plurality of light-emitting elements ED and the first optical layer 117a. The second optical layer 117b is disposed on the second electrode CE2 and the plurality of light-emitting elements ED, thereby improving unevenness that may occur in some of the plurality of light-emitting elements ED. For example, when the plurality of light-emitting elements ED are transferred onto the substrate 110 of the display device 1000, uneven spacing between the plurality of light-emitting elements ED may occur due to process variations or the like. If the spacing between the plurality of light-emitting elements ED is uneven, the light-emitting areas of each of the plurality of light-emitting elements ED may be unevenly arranged, which may result in unevenness being visible to the user. Therefore, the second optical layer 117b configured to diffuse light uniformly is disposed above the plurality of light-emitting elements ED, thereby reducing the likelihood that light emitted from some of the light-emitting elements ED will appear as uneven. Therefore, the second optical layer 117b allows the light emitted from the plurality of light emitting elements ED to be uniformly diffused and extracted to the outside of the display device 1000, so that the brightness uniformity of the display device 1000 can be improved.

[0177] The second optical layer 117b may be made of an organic insulating material in which fine particles are dispersed, but this embodiment is not limited thereto. For example, the second optical layer 117b may be made of siloxane in which fine metal particles, such as titanium dioxide (TiO2) particles, are dispersed, but this embodiment is not limited thereto. For example, the second optical layer 117b may be made of the same material as the first optical layer 117a, but this embodiment is not limited thereto. For example, the second optical layer 117b may be a diffusion layer or a top diffusion layer, but this embodiment is not limited thereto.

[0178] According to the present invention, light from the plurality of light-emitting elements ED is scattered by the fine particles dispersed in the second optical layer 117b and can be emitted to the outside of the display device 1000. The second optical layer 117b can uniformly mix the light emitted from the plurality of light-emitting elements ED to further improve the luminance uniformity of the display device 1000. Furthermore, the light scattered by the plurality of fine particles can improve the light extraction efficiency of the display device 1000, and therefore the display device 1000 can be driven with low power.

[0179] In the display area AA, a black matrix BM may be disposed on the second electrode CE2, the first optical layer 117a, the third optical layer 117c, and the second optical layer 117b. For example, the black matrix BM may fill the contact hole of the third optical layer 117c. Because the black matrix BM is configured to cover the display area AA, it is possible to reduce color mixing of light from multiple sub-pixels and external light reflection. For example, because the black matrix BM is also disposed in the contact hole connecting the second electrode CE2 and the contact electrode CCE, it is possible to prevent light leakage between adjacent sub-pixels.

[0180] For example, the black matrix BM may be made of an opaque material, but the present invention is not limited thereto. For example, the black matrix BM may be made of an organic insulating material to which a black pigment or black dye is added, but the present invention is not limited thereto.

[0181] In the display area AA, a cover layer 118 may be disposed on the black matrix BM. The cover layer 118 can protect the components below the cover layer 118. For example, the cover layer 118 may be made of an organic insulating material, although embodiments of the present invention are not limited thereto. For example, the cover layer 118 may be made of an acrylic resin, a phenolic resin, an unsaturated polyester resin, a polyamide resin, benzocyclobutene, a polyphenylene resin, a polyphenylene sulfide resin, a photoresist, a polyimide (PI), or a photoacrylic material, although embodiments of the present invention are not limited thereto. For example, the cover layer 118 may be an overcoating layer or an insulating layer, although embodiments of the present invention are not limited thereto.

[0182] A polarizing layer 293 may be disposed on the cover layer 118 via a first adhesive layer 291. A cover member 120 may be disposed on the polarizing layer 293 via a second adhesive layer 295. For example, the first adhesive layer 291 and the second adhesive layer 295 may include an optically clear adhesive (OCA), an optically clear resin (OCR), a pressure sensitive adhesive (PSA), or the like, but the present invention is not limited thereto.

[0183] According to the present invention, a plurality of pad electrodes PE may be disposed on the third insulating layer 115c in the second non-display area NA2. For example, at least a portion of the plurality of pad electrodes PE may be exposed from the passivation layer 116. For example, the plurality of pad electrodes PE may be electrically connected to the 2-4th connecting wire 122d through a contact hole in the third insulating layer 115c, further electrically connected to the 2-3rd connecting wire 122c through a contact hole in the second insulating layer 115b, further electrically connected to the 2-2nd connecting wire 122b through a contact hole in the first insulating layer 115a, and further electrically connected to the 2-1st connecting wire 122a through a contact hole in the third protective layer 114.

[0184] An adhesive layer ACF may be disposed on the plurality of pad electrodes PE. The adhesive layer ACF may be an adhesive layer in which conductive balls are dispersed in an insulating material, but embodiments of the present invention are not limited thereto. When heat or pressure is applied to the adhesive layer ACF, the conductive balls may be electrically connected at the portions to which heat or pressure is applied, thereby providing conductive properties. The adhesive layer ACF may be disposed between the plurality of pad electrodes PE and a flexible circuit board (or flexible film) CB, and the flexible circuit board (or flexible film) CB may be attached or bonded to the plurality of pad electrodes PE. For example, the adhesive layer ACF may be an anisotropic conductive film (ACF), but embodiments of the present invention are not limited thereto.

[0185] A flexible circuit board (or flexible film) CB may be disposed on the adhesive layer ACF. The flexible circuit board (or flexible film) CB may be electrically connected to a plurality of pad electrodes PE through the adhesive layer ACF. Therefore, signals output from the flexible circuit board (or flexible film) CB and the printed circuit board may be transmitted to the pixel driver PD of the display area AA through the plurality of pad electrodes PE, the second-fourth connecting wire 122d, the second-third connecting wire 122c, the second-second connecting wire 122b, and the second-first connecting wire 122a.

[0186] 13 to 16 are diagrams showing an apparatus to which a display device according to an embodiment of the present invention is applied.

[0187] 13 to 16, a display device 1000 according to an embodiment of the present invention may be incorporated into various devices or electronic devices. For example, referring to Fig. 13 to 16, various electronic devices may include a wearable device 1100, a mobile device 1200, a laptop computer 1300, and a monitor or television 1400, but the embodiment of the present invention is not limited thereto.

[0188] Each of the wearable device 1100, mobile device 1200, laptop 1300, and monitor or television 1400 may include a housing portion 1005, 1010, 1015, 1020 and a display panel 100 according to the above-described embodiments of the present invention, as well as a display device 1000.

[0189] For example, a display device according to an embodiment of the present invention may be applied to a mobile device, a video phone, a smart watch, a watch phone, a wearable apparatus, a foldable apparatus, a rollable apparatus, a bendable apparatus, a flexible apparatus, a curved apparatus, a sliding apparatus, a variable apparatus, an electronic organizer, an electronic book, a portable multimedia player (PMP), a personal digital assistant (PDA), an MP3 player, a mobile medical device, a desktop PC, a laptop PC, a netbook computer, a workstation, a navigation system, an in-vehicle display device, a theater display device, a television, a wallpaper device, a signage device, a game device, a notebook computer, a monitor, a camera, a camcorder, and a home appliance.

[0190] An in-cell touch display panel according to one or more embodiments of the present invention can be described as follows.

[0191] An in-cell touch display panel according to one or more embodiments of the present invention may include a first common electrode connected to N*M (each of N and M is a positive integer greater than or equal to 2) first pixels arranged within a display area, a second common electrode connected to N*M second pixels arranged within the display area, and a first pixel driver arranged within the display area to write pixel data to the first and second pixels and supply voltages to the first common electrode and the second common electrode.

[0192] In an in-cell touch display panel according to one or more embodiments of the present invention, the first pixel driver may be electrically connected to the first pixel and the second pixel through a plurality of connecting wires, respectively, and may be electrically connected to the first common electrode and the second common electrode through a plurality of connecting wires, respectively.

[0193] In an in-cell touch display panel according to one or more embodiments of the present invention, the connecting wires are arranged at different heights in the Z-axis direction, which is the height direction of the display panel, between multiple insulating layers, and each of the connecting wires can be electrically connected to each other through contact holes arranged in the insulating layers.

[0194] In an in-cell touch display panel according to one or more embodiments of the present invention, the first pixel driver may be disposed overlapping between the first common electrode and the second common electrode.

[0195] In an in-cell touch display panel according to one or more embodiments of the present invention, the first pixel driver may be disposed to overlap a portion of the first pixel and the second pixel.

[0196] In an in-cell touch display panel according to one or more embodiments of the present invention, the connection wiring may be electrically connected to each of the first and second common electrodes through contact electrodes.

[0197] In an in-cell touch display panel according to one or more embodiments of the present invention, the first common electrode and the second common electrode may include a first touch block and a second touch block, respectively.

[0198] An in-cell touch display panel according to one or more embodiments of the present invention may further include a third common electrode connected to N*M third pixels arranged in the display area, a fourth common electrode connected to N*M fourth pixels arranged in the display area, and a second pixel driver that writes pixel data to the third and fourth pixels and supplies voltages to the third and fourth common electrodes, and the second pixel driver may be arranged adjacent to the first pixel driver.

[0199] In an in-cell touch display panel according to one or more embodiments of the present invention, a pixel may include a plurality of sub-pixels, and the sub-pixels may include a first light-emitting element that emits light in a first wavelength band, a second light-emitting element that emits light in a second wavelength band, and a third light-emitting element that emits light in a third wavelength band.

[0200] In an in-cell touch display panel according to one or more embodiments of the present invention, the first light-emitting element may include an anode electrode, a first semiconductor layer disposed on the anode electrode, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, and a cathode electrode disposed on the second semiconductor layer.

[0201] In an in-cell touch display panel according to one or more embodiments of the present invention, the first light emitting element may have a vertical structure.

[0202] In an in-cell touch display panel according to one or more embodiments of the present invention, the in-cell touch display panel may further include a solder pattern disposed between the first electrode and the anode electrode, and the first electrode and the anode electrode may be electrically connected by eutectic bonding through the solder pattern.

[0203] In an in-cell touch display panel according to one or more embodiments of the present invention, the first light emitting element may be a micro light emitting diode.

[0204] In an in-cell touch display panel according to one or more embodiments of the present invention, the first light emitting element, the second light emitting element, and the third light emitting element may be arranged in a substantially identical structure.

[0205] In an in-cell touch display panel according to one or more embodiments of the present invention, the first light-emitting element, the second light-emitting element, and the third light-emitting element may each include a main light-emitting element and a redundancy light-emitting element that emits light of the same wavelength as the main light-emitting element in one pixel.

[0206] In an in-cell touch display panel according to one or more embodiments of the present invention, the main light emitting element and the redundancy light emitting element may be arranged on the same bank.

[0207] In an in-cell touch display panel according to one or more embodiments of the present invention, the pixel driver may include a micro-driver.

[0208] In an in-cell touch display panel according to one or more embodiments of the present invention, a method for driving the in-cell touch display panel may include sensing a touch input based on a voltage received from the common electrode.

[0209] Although the embodiments of the present invention have been described in more detail above with reference to the accompanying drawings, the present invention is not necessarily limited to such embodiments and can be implemented in various modified forms within the scope of the technical concept of the present invention.

[0210] Therefore, the embodiments disclosed in the present invention are intended to illustrate, rather than limit, the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by such embodiments.

[0211] Therefore, the above-described embodiments should be understood in all respects as illustrative and not restrictive.

[0212] The scope of protection of the present invention should be interpreted by the scope of the claims, and any technical ideas within the equivalent range should be interpreted as being included in the scope of the present invention. [Explanation of symbols]

[0213] 100: Display panel 1005, 1010, 1015, 1020: Housing 110: Substrate 112: Adhesive layer 114:Third protective layer 116: Passivation layer 118: Cover layer 120: Cover member 121: a plurality of first connecting wirings 122: A plurality of second connecting wirings 130: First light-emitting element 130, 140, 150: Light-emitting element 131: First semiconductor layer 132:Active layer 133: Second semiconductor layer 134: Anode electrode 135: Cathode electrode 136: Sealing film 140: Second light-emitting element 150: Third light-emitting element 160: Printed circuit board 180:Hall 291: 1st adhesive layer 293: Polarizing layer 295: Adhesive layer AA:Display area ACF:adhesive layer Ag:Silver Al: Aluminum Au: Gold BA: Bending area BM: Black Matrix BNK: Bank Ba: Barium Be: Beryllium CB: Flexible circuit board CCE: Contact electrode CE1: 1st electrode CE2: 2nd electrode Ca: Calcium Cr: Chromium Cu: Copper D1, D2, D3, D4: Display period ED: Light-emitting element EM: luminescence signal PD: Pixel Driver SDP: Solder pattern SP: Multiple sub-pixels SP1: First sub-pixel SP2: second sub-pixel SP3: Third sub-pixel T1, T2, T3, T4: Touch sensing period TDR: Drive transistor TEM: Light-emitting transistor TG: Touch Group TL: Signal wiring TL1: First signal wiring TL2: 2nd signal wiring TL3: 3rd signal wiring TL4: 4th signal wiring TL5: 5th signal wiring TL6: 6th signal wiring Te: Tellurium Ti: Titanium VDD: High potential power supply voltage VL: Drive wiring W: Tungsten X: 1st direction Y: Second direction Zn: Zinc

Claims

1. a first common electrode coupled to a first pixel disposed within the display area; a second common electrode coupled to second pixels disposed within the display area; and a first pixel driver disposed within the display area to write pixel data to the first pixel and the second pixel, and to supply a voltage or a signal to the first common electrode and the second common electrode;

2. 2. The display panel of claim 1, further comprising a plurality of interconnections electrically connecting the first pixel driver to the first pixel and the second pixel, and to the first common electrode and the second common electrode.

3. the plurality of interconnections are located at different heights between the plurality of insulating layers, The display panel of claim 2 , wherein the plurality of interconnection lines are electrically connected to each other through a plurality of contact holes disposed in the plurality of insulating layers.

4. The display panel of claim 1 , wherein the first pixel driver overlaps the first common electrode and the second common electrode.

5. The display panel of claim 1 , wherein the first pixel driver overlaps a portion of the first pixel and a portion of the second pixel.

6. The display panel of claim 2 , further comprising a plurality of contact electrodes electrically connecting the first common electrode and the second common electrode to the plurality of connecting wires, respectively.

7. The display panel of claim 1 , wherein the first common electrode includes a first touch block that senses a touch, and the second common electrode includes a second touch block that senses a touch.

8. a third common electrode connected to a third pixel disposed within the display area; a fourth common electrode connected to a fourth pixel disposed in the display area; and a second pixel driver configured to write pixel data to the third pixel and the fourth pixel and to supply a voltage or a signal to the third common electrode and the fourth common electrode; The display panel of claim 1 , wherein the second pixel driver is disposed adjacent to the first pixel driver.

9. each of the first pixel and the second pixel includes a plurality of sub-pixels; The sub-pixels are a first light-emitting element that emits light in a first wavelength band; a second light-emitting element that emits light in a second wavelength band; and The display panel according to claim 1 , further comprising a third light-emitting element that emits light in a third wavelength band.

10. The first light-emitting element is anode electrode, a first semiconductor layer disposed on the anode electrode; an active layer disposed on the first semiconductor layer; a second semiconductor layer disposed on the active layer; and The display panel of claim 9 , further comprising a cathode electrode disposed on the second semiconductor layer.

11. The display panel of claim 10 , wherein the first light emitting element has a vertical structure.

12. The first light-emitting element is The anode electrode further includes a solder pattern disposed below the anode electrode, The display panel of claim 10 , wherein the anode electrode between the solder pattern and the first semiconductor layer is electrically connected to the solder pattern.

13. The display panel of claim 10 , wherein the first light-emitting element is a micro light-emitting diode.

14. The display panel of claim 10 , wherein the first light-emitting element, the second light-emitting element, and the third light-emitting element have the same structure.

15. The display panel of claim 9 , wherein the first light-emitting element, the second light-emitting element, and the third light-emitting element each include a main light-emitting element and a redundancy light-emitting element that emits light of the same wavelength as the main light-emitting element.

16. further comprising a plurality of banks; The display panel of claim 15 , wherein the main light emitting element and the redundancy light emitting element of each of the first light emitting element, the second light emitting element, and the third light emitting element are disposed on the bank.

17. The display panel of claim 1 , wherein the first pixel driver comprises a micro-driver.

18. a first contact electrode connected to the first common electrode; a second contact electrode connected to the second common electrode; and The display panel according to claim 1 , further comprising a communication wiring disposed between the first contact electrode and the second contact electrode.

19. a passivation layer disposed on the anode electrode; and further comprising a conductive layer disposed on the anode electrode; The display panel of claim 10 , wherein the conductive layer includes a surface in contact with the passivation layer.

20. a plurality of pixels arranged within a display area for displaying an image; a plurality of touch units, each including a plurality of touch groups; and Includes pixel drivers, The plurality of touch groups of each touch unit include: a first touch group including a first common electrode connected to a first pixel of the touch unit among the plurality of pixels; and a second touch group including a second common electrode connected to a second pixel of the touch unit among the plurality of pixels but not connected to the first pixel of the touch unit; the pixel driver outputs a touch drive signal to the first common electrode arranged in the first touch group of each of the plurality of touch units during a first touch period, while outputting a common voltage to the second common electrode of the second touch group arranged in each of the plurality of touch units during the first touch period, so that the second pixels of each of the plurality of touch units display an image during the first touch period.

Images