Substrate processing apparatus and substrate processing system

Abstract

To suppress an increase in footprint in a substrate processing apparatus and a substrate processing system for performing predetermined post-processing after application processing to a substrate.SOLUTION: A substrate processing apparatus according to the present invention includes a coating unit configured to perform a coating process at a position spaced apart from a substrate carry-in / out device in a first horizontal direction, a plurality of post-processing units configured to perform a predetermined post-process on a substrate after the coating process, and a transfer unit configured to reciprocally transfer the substrate in the first horizontal direction along a transfer path extending in the first horizontal direction between the substrate carry-in / out device and the coating unit. A substrate conveyance unit configured to stop temporarily at a position on the conveyance path facing the post-processing unit and to be capable of transferring the substrate to and from the post-processing unit for each post-processing unit, wherein the plurality of post-processing units are arranged so as to be distributed with respect to the conveyance path in a second horizontal direction orthogonal to the first horizontal direction, and the coating unit is arranged on one end side of the conveyance path. Then, the transport robot of the substrate transport section reciprocates in the first horizontal direction along the transport path, and accesses the coating section and the post-treatment section in this order to transfer the substrate.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing system that perform a coating process to apply a processing liquid to substrates for semiconductor packages such as substrates for FOWLP (fan out wafer level package), glass substrates for liquid crystal displays, semiconductor substrates, glass substrates for PDPs, glass substrates for photomasks, substrates for color filters, substrates for recording disks, substrates for solar cells, substrates for electronic paper and other substrates for precision electronic devices, rectangular glass substrates, flexible substrates for film liquid crystals, and substrates for organic EL (electronic light emitting diode) (hereinafter simply referred to as "substrates"). [Background technology]

[0002] One of the manufacturing processes for semiconductor devices is a coating process in which a treatment liquid is applied to the surface of a substrate to form a coating film. In recent years, the demand for smaller and thinner devices has been increasing significantly in the field of semiconductor devices. To meet this demand, attention has been focused on FOWLP technology, which surface-mounts individual highly integrated semiconductors on printed circuit boards. Even with this FOWLP technology, the importance of coating processes is increasing in order to produce high-quality products. To address this issue, a coating device has been proposed, as described in Patent Document 1, for example. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-131177 Summary of the Invention [Problem to be solved by the invention]

[0004] Substrates coated with a coating film by a coating device undergo post-processing, such as vacuum drying using a vacuum drying device, heating and drying using a heating plate, and cooling using a cooling plate. In addition, FOWLP technology sometimes requires additional pre-processing, such as a dehydration bake process to remove moisture from printed circuit boards. Therefore, substrate processing apparatuses capable of combining not only coating processes but also vacuum drying, heating, cooling, and dehydration bake processes have been proposed. For example, a substrate processing apparatus has been proposed in which a dehydration bake apparatus, a coating apparatus, a vacuum drying apparatus, and a post-bake heating and cooling apparatus are linearly arranged, and substrates are transported between these apparatuses by a transport device such as a conveyor while undergoing dehydration bake and coating processes. Another proposed substrate processing system includes an Equipment Front End Module (EFEM) on both sides of the substrate processing apparatus, allowing automatic loading and unloading of substrates into and from the substrate processing apparatus.

[0005] In such proposed examples (substrate processing apparatuses and substrate processing systems), pre-processing apparatuses such as dehydration bake apparatuses and post-processing apparatuses such as reduced-pressure drying apparatuses are arranged linearly with respect to the coating apparatuses, which inevitably leads to an increase in the size of the substrate processing apparatuses and substrate processing systems in the direction of arrangement, resulting in a problem of an increased footprint.

[0006] The present invention has been made in consideration of the above-mentioned problems, and aims to suppress an increase in footprint in substrate processing apparatuses and substrate processing systems that not only apply processing liquid to substrates but also perform predetermined post-processing after the application process. [Means for solving the problem]

[0007] A first aspect of the present invention is a substrate processing apparatus that is arranged adjacent to a first horizontal side of a substrate loading / unloading device and performs a coating process to apply a processing liquid to a substrate, and includes a coating section that performs the coating process at a position away from the substrate loading / unloading device in the first horizontal direction, a plurality of post-processing sections that perform predetermined post-processing on the substrate after the coating process, and a substrate transport section that transports the substrate back and forth in the first horizontal direction along a transport path extending in the first horizontal direction between the substrate loading / unloading device and the coating section, and is configured to temporarily stop for each post-processing section at a position on the transport path opposite the post-processing section so that the substrate can be transferred to or from the post-processing section, and the plurality of post-processing sections are allocated and arranged relative to the transport path in a second horizontal direction perpendicular to the first horizontal direction, and the substrate transport section has a transport robot that moves back and forth in the first horizontal direction along the transport path and accesses the coating section and the post-processing section in that order to transfer or receive substrates, and the coating section is arranged at one end of the transport path.

[0008] Here, the multiple post-treatment units may be configured to include a post-heating unit that heats the substrate immediately after the coating process and a post-cooling unit that cools the substrate heated by the post-heating unit. The post-cooling unit may be located at the other end of the transport path, and the post-heating unit may be located so as to face an area of ​​the transport path between the coating unit and the post-cooling unit in the first horizontal direction, and the substrate transport unit may be configured to transport the substrate in the order of the coating unit, the post-heating unit, and the post-cooling unit. This configuration provides the following advantageous effects. In this invention, the substrate that has been subjected to the coating process is transported in the order of the post-heating unit and the post-cooling unit, but the distance from the coating unit to the post-heating unit is shorter than the distance to the post-cooling unit, making it possible to transport the substrate immediately after the coating process to the post-heating unit in a relatively short time. As a result, the film formed on the substrate by the coating process has relatively high fluidity, but the film can be dried quickly and satisfactorily.

[0009] In addition, the post-cooling unit may be located at the other end of the transport path, and the reduced-pressure drying unit and the post-heating unit may be located so as to face an area of ​​the transport path between the coating unit and the post-cooling unit in the first horizontal direction, and the substrate transport unit may be configured to transport the substrate in the order of the coating unit, the reduced-pressure drying unit, the post-heating unit, and the post-processing unit. In this configuration, the same effects as those described above can be obtained. That is, although the film formed on the substrate by the coating process has relatively high fluidity, it is possible to transport the substrate to the reduced-pressure drying unit immediately after the coating process in a relatively short time, allowing the film to dry quickly and satisfactorily.

[0010] A second aspect of the present invention is a substrate processing system comprising a substrate loading / unloading device for loading and unloading a substrate, and the substrate processing apparatus described above.

[0011] In the invention configured as described above, substrates are transported back and forth along a transport path extending in a first horizontal direction. Furthermore, in a second horizontal direction perpendicular to the first horizontal direction, a plurality of post-processing units are allocated to and arranged along the transport path. This makes the substrate processing apparatus compact in both the first and second horizontal directions. [Effects of the Invention]

[0012] As described above, it is possible to suppress an increase in footprint in a substrate processing apparatus that not only applies a processing liquid to a substrate but also performs a predetermined post-processing after the application process, and in a substrate processing system equipped with the same. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a perspective view schematically showing a substrate processing system equipped with a first embodiment of a substrate processing apparatus according to the present invention. [Figure 2] FIG. 2 is a plan view schematically showing the substrate processing system shown in FIG. [Figure 3] FIG. 3 is a perspective view schematically illustrating the configuration of the application unit shown in FIG. 2. [Figure 4A]2A to 2C are schematic diagrams showing the procedure of substrate transport and processing performed in the substrate processing apparatus; [Figure 4B] 2A to 2C are schematic diagrams showing the procedure of substrate transport and processing performed in the substrate processing apparatus; [Figure 4C] 2A to 2C are schematic diagrams showing the procedure of substrate transport and processing performed in the substrate processing apparatus; [Figure 4D] 2A to 2C are schematic diagrams showing the procedure of substrate transport and processing performed in the substrate processing apparatus; [Figure 5] FIG. 10 is a diagram schematically illustrating a substrate processing system equipped with a substrate processing apparatus according to a second embodiment of the present invention. [Figure 6] FIG. 10 is a diagram schematically showing a substrate processing system equipped with a substrate processing apparatus according to a third embodiment of the present invention. [Figure 7] FIG. 10 is a diagram schematically showing a substrate processing system equipped with a fourth embodiment of a substrate processing apparatus according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0014] FIG. 1 is a perspective view schematically illustrating a substrate processing system equipped with a first embodiment of a substrate processing apparatus according to the present invention. FIG. 2 is a plan view schematically illustrating the substrate processing system shown in FIG. 1. The substrate processing system 100 includes a substrate loading / unloading device 200 that loads and unloads substrates S, and a substrate processing apparatus 300 that performs a coating process by applying a processing liquid to the substrates S received from the substrate loading / unloading device 200. The substrate loading / unloading device 200 has a mechanism for transferring cassettes C at its front. The substrate loading / unloading device 200 also has a transfer robot TR0. This transfer robot TR0 has the functions of removing substrates S stored in the cassettes C and transferring them to the substrate processing apparatus 300, and receiving substrates S that have been subjected to a coating process by the substrate processing apparatus 300 and returning them to the cassettes C. In this specification, in order to clarify the arrangement and operation of each component of the substrate processing system 100, a coordinate system is appropriately used in which the Z axis is the vertical direction and the XY plane is the horizontal plane. In each coordinate system, the direction in which the tip of the arrow points is the + (plus) direction, and the opposite direction is the - (minus) direction.

[0015] A substrate processing apparatus 300 is disposed adjacent to the substrate load / unload device 200 on the (+X) side. In this substrate processing apparatus 300, a coating unit 310 is disposed at a position away from the substrate load / unload device 200 on the (+X) side. A first standby unit 320, a pre-processing unit 330, a second standby unit 340, and a post-processing unit 350 are disposed in this order in the (+X) direction between the substrate load / unload device 200 and the coating unit 310. Inside these, a linear transport path TP extends in the X direction, as indicated by the dashed-dotted line in FIG. 2, and a substrate transport section 360 ( FIG. 2 ) for reciprocating the substrate S along the transport path TP is provided inside the substrate processing apparatus 300.

[0016] 1, in the coating unit 310, a coating section 1 is disposed in an internal space in which a downflow is formed by clean air sent in from a fan filter unit FFU attached to the ceiling surface. The coating section 1 moves in the Y direction while discharging a treatment liquid from a slit nozzle, and supplies the treatment liquid to the surface of the substrate S to coat a coating film. The formation of a downflow of clean air in the internal space in this manner is also the case in the first standby unit 320, pre-processing unit 330, second standby unit 340, and post-processing unit 350, which will be described later.

[0017] Fig. 3 is a perspective view schematically showing the configuration of the applicator unit shown in Fig. 2. Applicator unit 1 basically has the same configuration as the applicator described in Patent Document 1. Therefore, in this specification, only the main parts of applicator unit 1 will be described.

[0018] The coating unit 1 is a coating device called a slit coater that uses a slit nozzle 2 (hereinafter simply referred to as "nozzle 2") to coat a treatment liquid on a surface Sf of a substrate S, which is an example of an object to be coated. In this specification, "the surface Sf of the substrate S" means one of the two main surfaces of the substrate S that is coated with the treatment liquid.

[0019] The coating unit 1 includes a stage 4 capable of suction-holding a substrate S in a horizontal position, and a coating processing unit 5 that uses a nozzle 2 to perform a coating process on the substrate S held on the stage 4. The stage 4 is made of a stone material such as granite having a substantially rectangular parallelepiped shape. The (-Y) side of the stage 4's upper surface is machined into a substantially horizontal, flat surface and has a holding surface 41 that holds the substrate S transported along the transport path TP by the substrate transport unit 360. The substrate S is placed on the holding surface 41 via lift pins (not shown). Numerous vacuum suction ports (not shown) are formed and distributed on the holding surface 41. The substrate S is sucked by these vacuum suction ports, thereby holding the substrate S horizontally in a predetermined position during the coating process. Note that the manner in which the substrate S is held is not limited to this; for example, the substrate S may be held mechanically. A nozzle adjustment area RA is provided on the stage 4 on the (+Y) side of the area occupied by the holding surface 41, and a nozzle maintenance unit (not shown) is disposed in this nozzle adjustment area RA.

[0020] The nozzle 2 extends in the X direction. In addition, in the YZ cross section, the lower end (nozzle lip portion) has a shape that tapers downward. A slit-shaped discharge port 21 extends in the X direction at the lower end, and the processing liquid pressure-fed from a processing liquid supply unit (not shown) is discharged from the discharge port 21 onto the surface Sf of the substrate S. In this way, the processing liquid is applied to the surface Sf of the substrate S.

[0021] The coating processing unit 5 has a nozzle support 51 that supports the nozzle 2. This nozzle support 51 has a support member 51a that extends parallel to the X direction above the stage 4, and two elevating mechanisms 51b that support the support member 51a from both sides in the X direction and raise and lower the support member 51a. The support member 51a is a rod member made of carbon fiber reinforced resin or the like and has a rectangular cross section. The lower surface of this support member 51a forms an attachment position 510 for the nozzle 2, and the support member 51a detachably supports the nozzle 2 at the attachment position 510. Note that various fastening mechanisms such as latches or screws can be used as appropriate as a mechanism for attaching and detaching the nozzle 2 to the attachment position 510 of the support member 51a.

[0022] The two lifting mechanisms 51b are connected to both longitudinal ends of the support member 51a, and each has an AC servo motor and a ball screw, etc. These lifting mechanisms 51b raise and lower the support member 51a and the nozzle 2 fixed thereto in the vertical direction (Z direction), thereby adjusting the distance between the discharge outlet 21 opening at the bottom end of the nozzle 2 and the substrate S, i.e., the relative height of the discharge outlet 21 with respect to the substrate S. Note that the vertical position of the support member 51a can be detected, for example, by a linear encoder (not shown) that is composed of a scale unit provided on the side of the lifting mechanism 51b and a detection sensor provided on the side of the nozzle 2 facing the scale unit.

[0023] As shown in FIG. 3 , the nozzle support 51 configured in this manner has a bridge structure spanning the holding surface 41, spanning both left and right ends of the stage 4 in the X direction. The coating processing unit 5 has a slit nozzle moving unit 53 that moves the nozzle support 51 in the Y direction. The slit nozzle moving unit 53 functions as a relative moving means that moves the nozzle support 51 as a bridge structure and the nozzle 2 supported thereby along the Y direction relative to the substrate S held on the stage 4. Specifically, the slit nozzle moving unit 53 has, on each of the ±X sides, guide rails 52 that guide the movement of the nozzle 2 in the Y direction, a linear motor 54 as a drive source, and a linear encoder 55 for detecting the position of the discharge outlet 21 of the nozzle 2.

[0024] The two guide rails 52 are provided at both ends of the stage 4 in the X direction and extend in the Y direction to include the section where the nozzle adjustment area RA and the holding surface 41 are provided. The two guide rails 52 each guide the movement of the two lifting mechanisms 51b in the Y direction. The two linear motors 54 are provided on both sides of the stage 4 and are AC coreless linear motors having a stator 54a and a slider 54b. The stator 54a is provided on the side surface of the stage 4 in the X direction along the Y direction. The slider 54b is fixed to the outside of the lifting mechanism 51b. The two linear motors 54 drive the two lifting mechanisms 51b in the Y direction by the magnetic force generated between the stator 54a and slider 54b.

[0025] Each linear encoder 55 also has a scale unit 55a and a detection unit 55b. The scale unit 55a is provided along the Y direction below a stator 54a of a linear motor 54 fixed to the stage 4. On the other hand, the detection unit 55b is fixed further outside the slider 54b of the linear motor 54 fixed to the lifting mechanism 51b, and is disposed opposite the scale unit 55a. The linear encoder 55 detects the position of the outlet 21 of the nozzle 2 in the Y direction based on the relative positional relationship between the scale unit 55a and the detection unit 55b.

[0026] The slit nozzle moving unit 53 configured in this manner can move the nozzle 2 between above the nozzle adjustment region RA and above the substrate S held on the stage 4 by driving the nozzle support 51 in the Y direction. The coating unit 1 then moves the nozzle 2 relative to the substrate S while discharging the treatment liquid from the discharge port 21 of the nozzle 2, thereby forming a coating layer on the surface Sf of the substrate S.

[0027] Furthermore, during periods when coating processing is not being performed on the stage 4, such as during the transfer period of the substrate S between the coating unit 1 and the substrate transport unit 360 (periods during which the substrate S is loaded and unloaded), the nozzle 2 retreats to a nozzle adjustment area RA that is offset in the (+Y) direction from the holding surface 41 of the substrate S (the state shown in FIG. 3). Then, a nozzle maintenance unit performs various maintenance operations on the nozzle 2 positioned in the nozzle adjustment area RA.

[0028] 1 and 2, the configuration of the first standby unit 320 will be described. The first standby unit 320 is provided adjacent to the substrate loading / unloading device 200. As shown in FIG. 2, a first mounting table 321 configured to temporarily mount a substrate S is provided in the internal space of the first standby unit 320. Therefore, the transport robot TR0 operates in response to a command from a control unit that controls the substrate loading / unloading device 200, thereby removing the substrate S accommodated in the cassette C and placing it on the first mounting table 321. In this manner, the substrate S is temporarily placed on standby before undergoing the coating process and the predetermined pre-processing and post-processing associated with the coating process. Furthermore, the first mounting table 321 is also used to temporarily hold the substrate S that has undergone the above-described processes, as will be described later. Then, at an appropriate timing, the transport robot TR0 accesses the first mounting table 321, picks up the substrate S, and returns it to the cassette C. In this way, the first standby unit 320 smoothly transfers the substrate S between the substrate loading / unloading device 200 and the substrate processing device 300, and also functions to adjust the takt time between these devices.

[0029] A pre-processing unit 330, a second standby unit 340, and a post-processing unit 350 are connected in series to the (+X) direction side of the first standby unit 320. Of these, the second standby unit 340 has a mounting table 341, similar to the first standby unit 320. The mounting table 341 temporarily holds the substrate S that has been pre-processed by the pre-processing unit 330 and the substrate S that has been post-processed by the post-processing unit 350 after the coating process. This facilitates the transfer of the substrate S between the coating unit 310, the pre-processing unit 330, and the post-processing unit 350, and also adjusts the takt time between these units.

[0030] The pre-processing unit 330 is disposed between the first standby unit 320 and the second standby unit 340. As shown in FIG. 1, the pre-processing unit 330 includes a housing 331 whose interior functions as part of the transport path TP, a heating tower 332 in which heating units HPf for performing a dehydration bake process on the substrate S are stacked, and a cooling tower 333 in which cooling units CPf for cooling the substrate S after the dehydration bake process are stacked. The housing 331 is disposed adjacent to the first mounting table 321. The heating tower 332 and the cooling tower 333 are allocated to the housing 331 in the Y direction. More specifically, the heating tower 332 is disposed on the (+Y) side of the housing 331, and the cooling tower 333 is disposed on the (-Y) side. A first transport robot TR1 is fixedly disposed within the housing 331. The first transport robot TR1 is configured so that a hand (not shown) capable of holding a substrate S can access the first mounting table 321, the heating unit HPf, the cooling unit CPf, and the second mounting table 341. Accordingly, when the first transport robot TR1 operates in response to a command from a control unit that controls the substrate processing apparatus 300, the substrate S is reciprocated along the transport path TP between the first mounting table 321 and the second mounting table 341, and is transported among the first mounting table 321, the heating unit HPf, the cooling unit CPf, and the second mounting table 341. In this embodiment, the number of heating units HPf in the heating tower 332 is three, and the number of cooling units CPf in the cooling tower 333 is three. However, these numbers are not limited to three and may be any number. The number of heating towers 332 and cooling towers 333 may also be any number.

[0031] The post-processing unit 350 is disposed on the (+X) direction side of the second standby unit 340 having the second mounting table 341. As shown in Fig. 1, the post-processing unit 350 includes a housing 351 whose interior functions as part of the transport path TP, a reduced-pressure drying tower 352 in which reduced-pressure drying sections VD for performing reduced-pressure drying processing on the substrate S after the coating processing are stacked, a heating tower 353 in which heating sections HPb for heating the substrate S after the reduced-pressure drying processing are stacked, and a cooling tower 354 in which cooling sections CPb for cooling the substrate S after the heating processing are stacked.

[0032] The housing 351 is provided between the second mounting table 341 and the coating unit 310. In addition, a reduced pressure drying tower 352, a heating tower 353, and a cooling tower 354 are allocated to the housing 351 in the Y direction. More specifically, the reduced pressure drying tower 352 is disposed on the (+Y) direction side of the housing 351, and the heating tower 353 and the cooling tower 354 are disposed on the (-Y) direction side. In addition, a second transport robot TR2 is disposed within the housing 351 so as to be movable in the X direction. This second transport robot TR2 is configured so that a hand (not shown) capable of holding a substrate S can access the second mounting table 341, the heating part HPb, the cooling part CPb, and the coating part 1. Therefore, the second transport robot TR2 operates in response to commands from the control unit that controls the substrate processing apparatus 300, causing the substrate S to move back and forth along the transport path TP between the second mounting table 341 and the coating unit 1, and to be transported between the second mounting table 341, the reduced pressure drying unit VD, the heating unit HPb, the cooling unit CPb, and the coating unit 1.

[0033] As described above, in this embodiment, two transport robots TR1 and TR2 are provided. These transport robots TR1 and TR2 cooperate to function as the substrate transport section 360, which transports the substrate S received from the substrate load / unload device 200 in the order described below, and then hands over the substrate S to the substrate load / unload device 200. The transport of the substrate S in the substrate processing apparatus 300 and the processing in each unit will be described below with reference to Figures 4A to 4D. Note that in order to easily understand the order of the transport and processing, the transport and processing will be described focusing on one substrate S.

[0034] Figures 4A to 4D are schematic diagrams showing the procedures for transporting and processing a substrate carried out in the substrate processing apparatus shown in Figures 1 and 2. In these figures, symbols M1 to M9 indicate the transport operations of the substrate S.

[0035] In the substrate processing system 100, when the substrate load / unload device 200 receives a loading command for an unprocessed substrate S, a control unit provided in the substrate load / unload device 200 controls the transport robot TR0 to take out the unprocessed substrate S from the cassette C and place it on the mounting table 321 of the substrate processing apparatus 300. Meanwhile, in the substrate processing apparatus 300, when a processing start command for the substrate S waiting on the mounting table 321 is given to the control unit, the control unit controls each unit of the apparatus as follows, and performs pre-processing (dehydration bake processing, cooling processing), coating processing, and post-processing (reduced pressure drying processing, post-bake processing, cooling processing) on ​​the substrate S, and then places the substrate S on the mounting table 321 to be delivered to the substrate processing apparatus 300. Each processing is performed as follows.

[0036] 4A, the following operations are performed in the pre-processing. That is, after the hand of the first transport robot TR1 receives the substrate S from the mounting table 321, the hand accesses the heating part HPf while holding the substrate S and hands over the substrate S (operation M1). Then, after the hand of the first transport robot TR1 retreats from the heating part HPf, the substrate S is subjected to a dehydration bake process in the heating part HPf.

[0037] When the heating process in the heating part HPf is completed, the hand of the first transport robot TR1 accesses the heating part HPf to pick up the substrate S that has been subjected to the dehydration bake process, and transports it to the cooling part CPf (operation M2). Then, the hand of the first transport robot TR1 retreats from the cooling part CPf, and when the temperature of the substrate S is subsequently reduced to room temperature by the cooling part CPf, the hand of the first transport robot TR1 accesses the cooling part CPf to pick up the substrate S that has been subjected to the dehydration bake process, and transports it to the mounting table 341 (operation M3). In this way, moisture (liquid component) contained in the substrate S is removed before the coating process is performed by the coating part 1, and in this state the substrate S waits on the mounting table 341 for the start of the next coating process.

[0038] In the next coating process, as shown in FIG. 4B, the second transport robot TR2 moves to a position opposite the mounting table 341. Then, the second transport robot TR2 receives the substrate S from the mounting table 341, and while holding the substrate S with its hand, moves along the transport path TP to a position opposite the coating unit 1, where it pauses temporarily. Subsequently, the second transport robot TR2 causes the hand holding the substrate S to enter the coating unit 1 and places the substrate S on the stage 4 (see FIG. 3) (operation M4). At this time, the nozzle 2 is retracted in the Y direction relative to the stage 4, reliably preventing interference between the hand and the substrate S. Then, after the hand of the second transport robot TR2 retracts from the coating unit 1, the coating unit 1 performs the coating process.

[0039] In the next post-processing step, as shown in FIG. 4C , the second transport robot TR2 moves along the transport path TP to a position opposite the coating unit 1, pauses there, and then receives the coated substrate S from the coating unit 1. Then, after the hand holding the substrate S retreats from the coating unit 1, the second transport robot TR2 moves along the transport path TP to a position opposite the reduced-pressure drying unit VD and pauses there. The second transport robot TR2 then inserts the hand holding the substrate S into the reduced-pressure drying unit VD and hands over the substrate S (operation M5). Then, after the hand of the second transport robot TR2 retreats from the reduced-pressure drying unit VD, the reduced-pressure drying unit VD performs the post-processing step.

[0040] When the reduced-pressure drying process is completed, the second transfer robot TR2 moves along the transfer path TP to a position opposite the reduced-pressure drying unit VD and pauses there. The second transfer robot TR2 then moves its hand into the reduced-pressure drying unit VD to pick up the substrate S. The hand, still holding the substrate S, retreats from the reduced-pressure drying unit VD, and the second transfer robot TR2 moves along the transfer path TP to a position opposite the heating unit HPb and pauses there. The second transfer robot TR2 then moves its hand holding the substrate S into the heating unit HPb and transfers the substrate S (operation M6). After the hand of the second transfer robot TR2 retreats from the heating unit HPb, a post-bake process is performed by the heating unit HPb as post-processing.

[0041] When this post-bake process is complete, the second transfer robot TR2 moves along the transfer path TP to a position opposite the heating part HPb and pauses there. The second transfer robot TR2 then inserts its hand into the heating part HPb to pick up the substrate S. The hand, still holding the substrate S, retreats from the heating part HPb, and the second transfer robot TR2 moves along the transfer path TP to a position opposite the cooling part CPb and pauses there. The second transfer robot TR2 then inserts its hand holding the substrate S into the cooling part CPb and hands over the substrate S (operation M7). The hand of the second transfer robot TR2 then retreats from the cooling part CPb, and the cooling part CPb performs a cooling process as post-processing.

[0042] Thereafter, when the temperature of the substrate S is lowered to room temperature by the cooling unit CPb, the second transport robot TR2 moves along the transport path TP to a position opposite the cooling unit CPb and pauses at that position. Subsequently, the second transport robot TR2 moves its hand into the cooling unit CPb and picks up the substrate S. Then, when the hand retracts from the cooling unit CPb while still holding the substrate S, the second transport robot TR2 moves along the transport path TP to a position opposite the mounting table 341 and pauses at that position. Subsequently, the second transport robot TR2 moves the hand holding the substrate S to the mounting table 341 and places the substrate S on the mounting table 341 (operation M8).

[0043] 4D, the hand of the first transport robot TR1 accesses the mounting table 341 to receive the substrate S and transfer it to another mounting table 321 (operation M9), so that the substrate S that has been subjected to the series of processes (=pre-processing + coating process + post-processing) can be removed from the substrate processing apparatus 300. In this way, the processed substrate S waits on the mounting table 321 to be delivered to the cassette C by the transport robot TR0 of the substrate loader / unloader 200.

[0044] As described above, in this embodiment, the coating unit 1 is disposed opposite the substrate loading / unloading device 200 in the X direction (corresponding to the "first horizontal direction" of the present invention). The substrate S is transported back and forth along the transport path TP formed between them. In addition, in the Y direction (corresponding to the "second horizontal direction" of the present invention), the heating unit HPf and cooling unit CPf for pre-processing, and the reduced-pressure drying unit VD, heating unit HPb, and cooling unit CPb for post-processing are allocated and disposed relative to the transport path TP. This makes the substrate processing apparatus 300 compact in the horizontal plane. As a result, the footprint of the substrate processing apparatus 300 can be significantly reduced, reducing the energy and clean air consumption required for substrate processing and making a significant contribution to the SDGs.

[0045] Furthermore, in a substrate processing apparatus in which the pre-processing section, coating section, and post-processing section are linearly arranged as in the proposed example, it is necessary to provide a substrate loading / unloading device on both the substrate loading and unloading sides, which inevitably increases the cost and footprint of the substrate processing system. In contrast, in the substrate processing system 100, it is only necessary to provide the substrate loading / unloading device 200 on the (-X) direction side of the substrate processing apparatus 300, which effectively solves the above problem.

[0046] Furthermore, in the above embodiment, the coating unit 1 is disposed so that the horizontal movement direction of the nozzle 2 in the coating unit 1 is the extension direction of the transport path TP, i.e., the Y direction perpendicular to the X direction. Therefore, the substrate S can be carried in and out of the coating unit 1 with the nozzle 2 not on the extension line of the transport path TP. This not only reduces the time required for the carrying in and out, but also reduces the time from carrying in the substrate to the start of the coating process and the time from the end of coating to the start of the substrate unloading. As a result, the takt time required for the coating process can be reduced.

[0047] Furthermore, the arrangement order of the pre-processing unit 330 and the post-processing unit 350 in the X direction is arbitrary, but adopting the arrangement order shown in FIG. 2 has the following advantages. In the X direction, in the direction from the substrate loading / unloading device 200 toward the coating unit 1 (corresponding to the "forward direction" of the present invention), the post-processing unit 350 is arranged downstream of the pre-processing unit 330. In other words, the post-processing unit 350 is arranged adjacent to the coating unit 1. Therefore, immediately after the coating process, the coating film has relatively high fluidity, and it is desirable for drying to begin early. In this regard, because the distance from the coating unit 1 to the post-processing unit 350 is short, the coating film can be dried early and the coating film can be dried well.

[0048] In the above-described embodiment, the heating unit HPf and the cooling unit CPf correspond to an example of a "pre-treatment unit" of the present invention, and correspond to an example of a "pre-heating unit" and an example of a "pre-cooling unit" of the present invention. The reduced pressure drying unit VD, the heating unit HPb, and the cooling unit CPb correspond to an example of a "post-treatment unit" of the present invention, and among them, the heating unit HPb and the cooling unit CPb correspond to an example of a "post-heating unit" and an example of a "post-cooling unit" of the present invention. The mounting tables 321 and 341 correspond to an example of a "first standby unit" and an example of a "second standby unit" of the present invention.

[0049] The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, pre-treatment and post-treatment units can be arranged on the (+Y) and (-Y) sides of the transport path TP, making it easy to add towers depending on the time required for the dehydration bake process, coating process, reduced-pressure drying process, and post-bake process. For example, in FIG. 1, the area facing the cooling tower 354 across the transport path TP is empty. Therefore, as shown in FIG. 5, a reduced-pressure drying tower 352 may be added depending on the takt time of the reduced-pressure drying process (second embodiment).

[0050] 6, a heating tower 353 and a cooling tower 354 may be added instead of the reduced pressure drying tower 352 (third embodiment). In this way, a layout is adopted that allows for free distribution in the Y direction across the transport path TP, thereby increasing the degree of freedom in the configuration of the pre-processing section and post-processing section, and providing a substrate processing apparatus and substrate processing system with high versatility.

[0051] Furthermore, many of the semiconductor package substrates S are made of resin, and may have absorbed moisture when they are carried in from the substrate carry-in / out device 200. Therefore, in the substrate processing apparatus 300 that applies a processing liquid to the semiconductor package substrates S, it is very effective in improving product quality to perform a dehydration bake process as a preprocessing before the application process, as in the first to third embodiments. On the other hand, in the substrate processing apparatus 300 that applies a processing liquid to a substrate S with low hygroscopicity, such as a glass substrate, the preprocessing unit 330 may be omitted, and one of the mounting tables 321 and 341 may be omitted, as shown in FIG. 7 (fourth embodiment).

[0052] Furthermore, in the above embodiment, the transfer of the substrate S between the substrate loading / unloading device 200 and the substrate processing device 300 is carried out via the mounting table 321, but the substrate may also be transferred directly between the transport robots. [Industrial Applicability]

[0053] The present invention can be applied to the general substrate processing technology for performing a coating process in which a processing liquid is applied to a substrate. [Explanation of symbols]

[0054] 1...Application part 2...Slit nozzle 100...Substrate processing system 200...Substrate loading / unloading device 300...Substrate processing apparatus 310... Coating unit 320...First standby unit 321...First loading platform 321,341...Placement table 330...Pretreatment unit 331,351…Casing 332,353…Heating tower 333,354...Cooling tower 340...Second standby unit 341...Second platform 350...Aftertreatment unit 352...Decompression drying tower 360...Board transport section 510…Installation location CPb: Cooling section (post-processing section) CPf: Cooling section (pre-processing section) HPb: Heating section (post-processing section) HPf: Heating section (pre-processing section) S...Substrate TP...Transport path TR1: First transport robot TR2: Second transport robot VD: Reduced pressure drying section (post-processing section)

Claims

1. A substrate processing apparatus that is disposed adjacent to a substrate loading / unloading device on a first horizontal direction side and performs a coating process of coating a processing liquid on a substrate, a coating unit that performs the coating process at a position separated from the substrate load / unload device in a first horizontal direction; a plurality of post-processing units that perform predetermined post-processing on the substrate after the coating process; a substrate transport unit configured to transport the substrate back and forth in the first horizontal direction along a transport path extending in the first horizontal direction between the substrate load / unload device and the coating unit, and to temporarily stop at a position on the transport path opposite the post-treatment unit for each of the post-treatment units so as to be able to deliver the substrate to and from the post-treatment unit, the plurality of post-processing units are disposed in a second horizontal direction perpendicular to the first horizontal direction, and are distributed with respect to the transport path; the substrate transport unit has a transport robot that reciprocates along the transport path in the first horizontal direction and accesses the coating unit and the post-processing unit in this order to receive and deliver the substrate; The coating unit is disposed on one end side of the transport path. A substrate processing apparatus comprising:

2. The substrate processing apparatus according to claim 1 , The plurality of post-treatment sections include a post-heating section that heats the substrate immediately after the coating process, and a post-cooling section that cools the substrate heated by the post-heating section.

3. 3. The substrate processing apparatus according to claim 2, the post-cooling unit is disposed on the other end side of the transport path, and the post-heating unit is disposed to face a region of the transport path that is located between the coating unit and the post-cooling unit in the first horizontal direction, The substrate transport unit transports the substrate to the coating unit, the post-heating unit, and the post-cooling unit in this order.

4. The substrate processing apparatus according to claim 1 , The plurality of post-treatment sections include a reduced-pressure drying section that dries, under reduced pressure, a coating film of the processing liquid applied to the substrate immediately after the coating process, a post-heating section that heats the substrate that has been dried under reduced pressure by the reduced-pressure drying section, and a post-cooling section that cools the substrate that has been heated by the post-heating section.

5. 5. The substrate processing apparatus according to claim 4, the post-cooling unit is disposed on the other end side of the transport path, and the reduced-pressure drying unit and the post-heating unit are disposed to face a region of the transport path that is located between the coating unit and the post-cooling unit in the first horizontal direction, The substrate processing apparatus, wherein the substrate transport unit transports the substrate through the coating unit, the reduced-pressure drying unit, the post-heating unit, and the post-processing unit in this order.

6. The substrate processing apparatus according to claim 1 , a plurality of pre-treatment units that perform predetermined pre-treatments on the substrate before the coating treatment; the plurality of pre-processing units are disposed at positions different from the positions of the plurality of post-processing units in the first horizontal direction, and are allocated to the transport path; The substrate transport unit includes: each pre-treatment section is configured to be temporarily stopped at a position on the transport path opposite the pre-treatment section so that the substrate can be transferred to and from the pre-treatment section; The substrate processing apparatus transports the substrate received from the substrate carry-in / out device to the pre-processing section prior to transporting the substrate to the coating section.

7. 7. The substrate processing apparatus according to claim 6, The plurality of pre-treatment sections include a pre-heating section that heats the substrate before it is transported to the coating section, and a pre-cooling section that cools the substrate heated by the pre-heating section.

8. 7. The substrate processing apparatus according to claim 6, In the substrate processing apparatus, the plurality of post-processing units are arranged downstream of the plurality of pre-processing units in a forward direction from the substrate loading / unloading device toward the coating unit in the first horizontal direction.

9. 8. The substrate processing apparatus according to claim 7, a first waiting section in the transport path where the substrate is temporarily kept waiting between the substrate loading / unloading device and the plurality of pre-processing sections; a second waiting section in the transport path for temporarily waiting the substrate between the plurality of pre-processing sections and the plurality of post-processing sections, The substrate transport unit includes: a first transport robot configured to reciprocate the substrate along the transport path between the first standby unit and the second standby unit, and to transport the substrate between the first standby unit, the plurality of pre-processing units, and the second standby unit; a second transport robot configured to reciprocate the substrate along the transport path between the second standby section and the coating section, and to transport the substrate between the second standby section, the plurality of post-processing sections, and the coating section.

10. a substrate loading / unloading device for loading and unloading substrates; The substrate processing apparatus according to claim 1 , A substrate processing system comprising:

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