Method of manufacturing ceramic component and holding device

Abstract

To provide a technique for improving the durability of a ceramic component in a method for manufacturing the ceramic component.SOLUTION: In a method for manufacturing a ceramic component that contains ceramic as a main component, has a gas flow path formed therein, has a first ceramic porous body in the gas flow path, and is used in a holding device that holds an object, a fitting member including the first ceramic porous body is disposed in an opening that opens on a surface of the ceramic component in the gas flow path, and a portion between the opening and the fitting member is irradiated with a laser beam to fuse an inner wall surface of the opening and the fitting member.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a ceramic component and a holding device. [Background technology]

[0002] BACKGROUND ART Conventionally, ceramic parts used in electrostatic chucks have been known that have a ceramic porous body in a gas flow path that suppresses the occurrence of discharge (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7255659 Summary of the Invention [Problem to be solved by the invention]

[0004] However, even with prior art such as that disclosed in Patent Document 1, there is still room for improvement in the technology for improving the durability of ceramic parts in the manufacturing method of ceramic parts.

[0005] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a technique for improving the durability of a ceramic part in a manufacturing method of the ceramic part. [Means for solving the problem]

[0006] The present invention has been made to solve at least part of the above-mentioned problems, and can be realized in the following aspects.

[0007] (1) According to one aspect of the present invention, there is provided a method for manufacturing a ceramic part used in a holding device for holding an object, the ceramic part being mainly composed of ceramic, having a gas flow path formed therein, and having a ceramic porous body within the gas flow path. The method for manufacturing the ceramic part includes: placing an inserting member including the first porous ceramic body in an opening in the gas flow path that opens on a surface of the ceramic part; and irradiating a laser beam between the opening and the inserting member to fusion-weld the inner wall surface of the opening.

[0008] According to this configuration, when manufacturing a ceramic component having a first porous ceramic body in a gas flow path, laser light is irradiated between an insertion member including the first porous ceramic body and the opening, which is disposed in the surface of the ceramic component in the gas flow path. This melts and bonds the inner wall surface of the opening to the insertion member, making it possible to provide the first porous ceramic body in the gas flow path without using an adhesive containing, for example, a resin. Therefore, the ceramic component can be improved in heat resistance while maintaining plasma resistance during use, thereby improving the durability of the ceramic component.

[0009] (2) In the method for manufacturing a ceramic part according to the above aspect, the fusion welding between the inner wall surface of the opening and the fitting member may be performed by scanning a laser beam over the boundary between the opening and the fitting member on the surface of the ceramic part, thereby locally irradiating the laser beam. According to this configuration, when irradiating the laser beam between the fitting member and the opening, the boundary between the opening and the fitting member is scanned with the laser beam, thereby locally irradiating the laser beam. This results in a relatively small melting area, allowing the opening and the fitting member to be fusion-welded in a relatively short time. Therefore, the difference in thermal expansion between the portion irradiated with the laser beam and the portion not irradiated with the laser beam is relatively small, thereby suppressing damage to the ceramic part.

[0010] (3) In the method for manufacturing a ceramic part according to the above aspect, the laser beam may be irradiated using a pulsed laser. According to this configuration, by fusion welding the opening and the fitting member using a pulsed laser, the area of ​​the part melted by the energy of the laser beam can be made relatively small. This further reduces the difference in thermal expansion between the part irradiated with the laser beam and the part not irradiated with the laser beam, thereby further suppressing damage to the ceramic part.

[0011] (4) In the method for manufacturing a ceramic component according to the above aspect, prior to the step of placing the fitting member in the opening, the opening may be formed by hollowing out a portion of the ceramic component that includes the entire second porous ceramic body, which is a porous body disposed in the gas flow path. According to this configuration, when forming the opening for arranging the fitting member, a portion that includes the entire second porous ceramic body disposed in the gas flow path is hollowed out from the ceramic component. As a result, even if, for example, the second porous ceramic body is damaged and needs to be replaced, the plasma resistance of the ceramic component can be restored to its initial state by simply replacing that portion of the ceramic component.

[0012] (5) In the method for manufacturing a ceramic part according to the above aspect, the operation of hollowing out a portion including the entire second porous ceramic body may be performed at a boundary between the second porous ceramic body and an outer portion adjacent to the second porous ceramic body in the ceramic part. According to this configuration, when forming an opening for arranging an insertion member, hollowing out is performed at the boundary between the second porous ceramic body and the outer portion adjacent to the second porous ceramic body. This makes it possible to reduce the size of the portion of the ceramic part to be replaced.

[0013] (6) In the method for manufacturing a ceramic part according to the above aspect, the operation of hollowing out a portion including the entire second porous ceramic body may be performed so as to hollow out an outer portion of the ceramic part that is adjacent to the second porous ceramic body. According to this configuration, when forming an opening for arranging an insertion member, the hollowing out includes the outer portion that is adjacent to the second porous ceramic body. This makes it possible to suppress damage to the first porous ceramic body by the laser beam when irradiating a laser beam to fusion-weld the insertion member including the first porous ceramic body to the opening.

[0014] (7) In the method for manufacturing a ceramic part according to the above aspect, the fitting member may be a member in which the first ceramic porous body is exposed on a surface that faces the inner wall surface of the opening when the fitting member is placed in the opening. According to this configuration, the fitting member is a member in which the first ceramic porous body is exposed. This allows the fitting member to be prepared relatively inexpensively.

[0015] (8) In the method for manufacturing a ceramic part according to the above aspect, the fitting member may be a member having a dense layer denser than the first porous ceramic body on a surface facing the inner wall surface of the opening when the fitting member is placed in the opening. According to this configuration, the fitting member is a member having a dense layer denser than the first porous ceramic body. This makes it possible to suppress damage to the first porous ceramic body by laser light irradiation when fusion welding is performed between the fitting member including the first porous ceramic body and the opening. Therefore, the plasma resistance of the ceramic part can be restored to its initial state.

[0016] (9) According to another aspect of the present invention, a holding device for holding an object is provided. The holding device includes a ceramic part for placing the object, the ceramic part being primarily composed of ceramic, having a gas flow path formed therein, and a ceramic porous body within the gas flow path. A porous body peripheral portion of the ceramic part surrounding the ceramic porous body contains a specific crystal structure ceramic of the same type as a portion of the ceramic part that is different from the porous body peripheral portion, but with a different crystal structure. According to this configuration, the ceramic porous body of the ceramic part is joined to the ceramic part by the porous body peripheral portion, which contains a specific crystal structure ceramic of the same type as a portion of the ceramic part that is different from the porous body peripheral portion, but with a different crystal structure. This allows the ceramic porous body to be provided within the gas flow path without using an adhesive containing a resin or the like, thereby improving the durability of the ceramic part.

[0017] (10) In the holding device of the above aspect, the porous body peripheral portion may be provided in contact with the outer peripheral surface of the ceramic porous body. According to this configuration, the ceramic porous body is joined to the ceramic portion by the specific crystal structure ceramic provided in contact with the outer peripheral surface of the ceramic porous body. This makes the portion of the specific crystal structure ceramic in the ceramic portion relatively small, thereby suppressing damage to the ceramic portion due to differences in thermal expansion.

[0018] (11) In the holding device of the above embodiment, the porous body peripheral portion may include a first peripheral portion adjacent to the ceramic porous body and relatively inside, and a second peripheral portion surrounding the first peripheral portion and relatively outside, and the specific crystal structure ceramic may be included in the second peripheral portion. According to this configuration, the ceramic porous body is surrounded by the first peripheral portion adjacent to the ceramic porous body and relatively inside, and the second peripheral portion surrounding the first peripheral portion and relatively outside. As a result, the ceramic porous body is supported by the first peripheral portion and is joined to a portion of the ceramic part other than the porous body peripheral portion by the second peripheral portion including the specific crystal structure ceramic. Therefore, damage to the ceramic porous body due to stress caused by differences in thermal expansion, etc., can be suppressed.

[0019] (12) In the holding device of the above embodiment, the specific crystal structure ceramic may contain an amorphous phase of a ceramic material that constitutes a portion different from the peripheral portion of the porous body. According to this configuration, the specific crystal structure ceramic contains an amorphous phase of a ceramic material that constitutes a portion different from the peripheral portion of the porous body. This allows the ceramic porous body to be relatively loosely bonded to the portion of the ceramic part different from the peripheral portion of the porous body via the peripheral portion of the porous body. Therefore, the portion including the ceramic porous body can be easily removed from the ceramic part.

[0020] (13) In the holding device of the above embodiment, the ceramic portion may contain aluminum oxide, and the specific crystal structure ceramic may contain at least one of amorphous alumina, δ-alumina, and γ-alumina. According to this configuration, the specific crystal structure ceramic contains at least one of amorphous alumina, δ-alumina, and γ-alumina. This allows the ceramic porous body to be relatively loosely bonded to a portion of the ceramic portion that is different from the porous body periphery, making it easy to remove the portion containing the ceramic porous body from the ceramic portion.

[0021] The present invention can be realized in various forms, such as a method for repairing ceramic parts, a method for joining a ceramic porous body to a holding device, a method for manufacturing a holding device, a system including a holding device, a control method for these devices and systems, a computer program for causing these devices and systems to hold objects, a server device for distributing the computer program, and a non-transitory storage medium on which the computer program is stored. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 2 is a first perspective view of the holding device of the first embodiment. [Figure 2] FIG. 2 is a first cross-sectional view of the holding device of the first embodiment. [Figure 3] FIG. 3 is an enlarged view of part A in FIG. 2. [Figure 4] FIG. 3 is a partially enlarged view of a ceramic portion provided in the holding device of the first embodiment. [Figure 5] FIG. 3 is a first view illustrating a method for repairing the holding device of the first embodiment. [Figure 6] FIG. 10 is a second view illustrating the repair method for the holding device of the first embodiment. [Figure 7] FIG. 10 is a third view illustrating the repair method for the holding device of the first embodiment. [Figure 8] FIG. 2 is a second perspective view of the holding device of the first embodiment. [Figure 9] FIG. 4 is a second cross-sectional view of the holding device of the first embodiment. [Figure 10] FIG. 10 is an enlarged view of part B in FIG. 9. [Figure 11] 10A and 10B are first diagrams illustrating a method for repairing a holding device according to a second embodiment. [Figure 12] FIG. 10 is a second view illustrating the repair method for the holding device of the second embodiment. [Figure 13] FIG. 10 is a third view illustrating the repair method for the holding device of the second embodiment. [Figure 14] FIG. 10 is a perspective view of a holding device according to a second embodiment. [Figure 15] FIG. 10 is a cross-sectional view of a holding device according to a second embodiment. [Figure 16] FIG. 16 is an enlarged view of part C in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0023] First Embodiment FIG. 1 is a first perspective view of a holding device according to this embodiment. FIG. 2 is a first cross-sectional view of the holding device according to this embodiment. The holding device 100a according to this embodiment is an electrostatic chuck that attracts and holds an object, such as a wafer W, by electrostatic attraction. The electrostatic chuck is used, for example, as a table on which the wafer W is placed in an etching process using plasma in a chamber equipped with the electrostatic chuck. The holding device 100a includes a ceramic part 10, a base part 20, and a bonding part 30. In the holding device 100a according to this embodiment, as shown in FIG. 1, the ceramic part 10, the bonding part 30, and the base part 20 are stacked in this order. For convenience, in FIGS. 1 and 2, the stacking direction of the ceramic part 10, the bonding part 30, and the base part 20 is defined as the z-axis direction, and an x-axis that intersects perpendicularly with the z-axis and a y-axis that intersects perpendicularly with the x-axis are shown.

[0024] 2, a gas flow path 40 is formed inside the holding device 100a. The gas flow path 40 opens to the surface 10a on the positive side in the z-axis direction of the ceramic part 10 and to the surface 20b on the negative side in the z-axis direction of the base part 20. In the gas flow path 40, an inert gas such as helium gas flows from the surface 20b side of the base part 20 to the surface 10a side of the ceramic part 10.

[0025] The ceramic portion 10 is a generally disk-shaped component whose main component is ceramic. Here, "main component" refers to the component with the highest content. The ceramic portion 10 of this embodiment is mainly composed of alumina (Al2O3). That is, the ceramic portion 10 contains aluminum oxide. The ceramic portion 10 includes a base portion 11, a chuck electrode 12, and a ceramic porous body 13.

[0026] The base 11 is a component made of ceramic and has a substantially circular disk shape. The base 11 of this embodiment is made of alumina and has substantially the same shape as the ceramic part 10. Note that the material forming the base 11 may also be other ceramic materials such as aluminum nitride (AlN) or silicon carbide (SiC).

[0027] Gas flow channels 41a, 41b, and 41c are formed inside the base 11 as part of the gas flow channel 40. The gas flow channel 41a is formed on the base portion 20 side of the ceramic part 10 along the z-axis direction and communicates with a gas flow channel 43 formed in the joining part 30, which will be described later. The gas flow channel 41b is formed along a direction substantially parallel to a plane including the x-axis and y-axis and communicates with the gas flow channel 41a. The gas flow channel 41c is formed on the surface 10a side of the ceramic part 10 along the z-axis direction and opens to the outside of the ceramic part 10 at the surface 10a of the ceramic part 10. The gas flow channel 41c communicates with the gas flow channel 41b and the outside of the surface 10a of the ceramic part 10.

[0028] The chuck electrode 12 is disposed inside the base 11. The chuck electrode 12 is formed of a conductive material such as tungsten (W), molybdenum (Mo), or platinum (Pt). The chuck electrode 12 is connected to an external power supply via an electrode terminal (not shown). When power is supplied from the external power supply, the chuck electrode 12 generates an electrostatic attraction force capable of attracting and holding the wafer W on the surface 10a of the ceramic part 10. In addition to the chuck electrode 12, a high-frequency electrode or a heater electrode may be disposed in the ceramic part 10.

[0029] 2, the surface 10a of the ceramic part 10 is formed in an annular shape with the outer peripheral part 101a protruding in the positive direction of the z-axis beyond the inner part 102a of the outer peripheral part 101a. As a result, when the wafer W is attracted and held on the surface 10a by the electrostatic attraction force generated by the chuck electrode 12, a gap G is formed between the wafer W and the inner part 102a of the surface 10a, as shown in FIG.

[0030] The ceramic porous body 13 is a substantially cylindrical member made of ceramic such as alumina, yttria, or a rare earth oxide having relatively high plasma resistance. The ceramic porous body 13 has insulating properties and is provided to suppress discharge that occurs through the gas flow path 40 during a plasma-based etching process. The ceramic porous body 13 corresponds to a "second ceramic porous body" in the claims.

[0031] The ceramic porous body 13 has numerous pores formed as traces of a particulate pore-forming material that has been burned (disappeared) during the manufacturing process of the ceramic porous body 13. Examples of the pore-forming material used when manufacturing the ceramic porous body 13 include synthetic resin beads and carbon powder. Some of the pores formed in the ceramic porous body 13 are interconnected, forming paths through which the inert gas flowing through the gas flow path 40 can pass. This makes the ceramic porous body 13 gas permeable.

[0032] FIG. 3 is an enlarged view of portion A in FIG. 2. FIG. 4 is a partial enlarged view of the ceramic portion included in the holding device of this embodiment. FIG. 4 is a view of the holding device 100a as viewed from the positive side of the z-axis, and is an enlarged view of a portion of the surface 10a of the ceramic portion 10, including the porous ceramic body 13. As shown in FIGS. 3 and 4, the porous ceramic body 13 is disposed in a gas flow path 41c that constitutes the gas flow path 40. The pores of the porous ceramic body 13 communicate with the gas flow path 41b and the outside of the surface 10a of the ceramic portion 10. The ceramic portion 10 has an outer portion 14 adjacent to the porous ceramic body 13, outside the porous ceramic body 13. In the ceramic portion 10, the outer portion 14 has the same characteristics as the base portion 11 and is denser than the porous ceramic body 13. In addition, in Figs. 3 and 4, the range of the outer portion 14 in the base portion 11 is shown by a two-dot chain line for convenience, but the size of the outer portion 14 relative to the ceramic porous body 13 is not limited to this.

[0033] The base portion 20 is a generally disk-shaped component made primarily of a metal such as aluminum or an aluminum alloy, a composite of metal and ceramic such as Al-SiC, or a ceramic such as SiC. In this embodiment, the base portion 20 is made of aluminum. The base portion 20 is larger than the ceramic portion 10. For example, if the diameter of the ceramic portion 10 is 300 mm, the diameter of the base portion 20 is 340 mm. The size relationship between the ceramic portion 10 and the base portion 20 is not limited to this; they may be the same size.

[0034] A plurality of coolant flow paths 21 are formed inside the base portion 20. A coolant such as a fluorine-based inert liquid or water flows through the coolant flow paths 21. When the holding device 100a is used in a plasma etching process, the heat of the plasma is removed from the holding device 100a by the coolant. Furthermore, when the coolant flows through the coolant flow paths 21, the base portion 20 is cooled, and the ceramic portion 10 is cooled via the bonding portion 30. As a result, the wafer W held on the surface 10a of the ceramic portion 10 is cooled.

[0035] A gas flow path 42 constituting the gas flow path 40 is formed inside the base portion 20. The gas flow path 42 is formed in the base portion 20 so as to penetrate the base portion 20 along the z-axis direction. The gas flow path 42 is in communication with a gas flow path 43 formed in the joint portion 30.

[0036] The bonding portion 30 bonds the ceramic portion 10 and the base portion 20. The bonding portion 30 is, for example, a bonding sheet containing a silicone-based organic bonding agent, an inorganic bonding agent, or an Al-based metal adhesive. It is desirable for the bonding portion 30 to have high adhesive strength to both the ceramic portion 10 and the base portion 20, as well as high pressure resistance and high thermal conductivity.

[0037] A gas flow channel 43 constituting the gas flow channel 40 is formed inside the joint portion 30. The gas flow channel 43 is formed in the joint portion 30 so as to penetrate the joint portion 30 along the z-axis direction. The gas flow channel 43 communicates with the gas flow channel 41a formed in the ceramic portion 10 and the gas flow channel 42 formed in the base portion 20.

[0038] Next, a method for manufacturing the retaining device 100a of this embodiment will be described. In the method for manufacturing the retaining device 100a, the ceramic part 10 and the base part 20 are manufactured separately, and the separately manufactured ceramic part 10 and base part 20 are joined together by the joining part 30.

[0039] The method for manufacturing the ceramic portion 10 involves preparing a slurry for the green sheet and a metallization paste. The slurry for the green sheet is prepared by, for example, adding an organic solvent to a mixture containing alumina powder, an acrylic binder, a dispersant, a plasticizer, etc., and mixing the mixture using a ball mill. The metallization paste is prepared by, for example, adding a conductive powder such as tungsten or molybdenum to a mixture of alumina powder, an acrylic binder, and an organic solvent, and kneading the mixture.

[0040] The prepared green sheet slurry is formed into a sheet using a casting device, and the formed product is dried. This results in a green sheet. The portions that will become gas flow channels 41a, 41b, and 41c are processed on some of the green sheets. The portions that will become chuck electrode 12 are printed on specific green sheets of the multiple green sheets using a metallization paste, for example, using a screen printing device. Then, multiple green sheets, including the green sheets with the processed portions that will become gas flow channels 41a, 41b, and 41c and the specific green sheets with the printed metallization paste, are stacked to produce a green sheet laminate.

[0041] In the method for manufacturing the ceramic part 10, the ceramic porous body 13 is manufactured separately from the manufacturing of the green sheet laminate. In manufacturing the ceramic porous body 13, for example, a roughly cylindrical molded body is manufactured by injection molding using a paste for a porous ceramic body obtained by kneading a mixture containing alumina powder, a pore-forming material, a binder, an organic solvent, etc. The manufactured molded body is fitted into a portion that will become the gas flow path 41c, which is formed in the green sheet laminate. The green sheet laminate with the fitted molded body is fired in an electric furnace, thereby manufacturing the ceramic part 10 in which the base 11 and the ceramic porous body 13 are integrated. However, the manufacturing method for the ceramic part 10 is not limited to this.

[0042] In the method for manufacturing the base portion 20, a plurality of metal plates are laminated, each of which has been processed to form the portions that will become the coolant flow path 21 and the gas flow path 42. However, the method for manufacturing the base portion 20 is not limited to this.

[0043] In the manufacturing method of the holding device 100a, a bonding sheet that becomes the bonding portion 30 is placed on the surface of either the ceramic portion 10 or the base portion 20, which are manufactured separately. The bonding sheet has a portion that becomes the gas flow path 43, and is arranged to match the portion that becomes the gas flow path 41a of the ceramic portion 10 and the portion that becomes the gas flow path 42 of the base portion 20. For example, the bonding sheet is placed on the surface of the base portion 20, and the ceramic portion 10 and the base portion 20 are sandwiched by the bonding sheet, and the entire assembly is heated, thereby bonding the ceramic portion 10 and the base portion 20 together at the bonding portion 30. In this manner, the holding device 100a is manufactured. However, the manufacturing method of the holding device 100a is not limited to this.

[0044] Next, a method for repairing the holding device 100a, which is a manufacturing method of the holding device of this embodiment, will be described. In the repair method for the holding device 100a, for example, if a crack occurs in the ceramic porous body 13 due to use of the holding device 100a and the ceramic porous body 13 is damaged, the ceramic porous body 13 can be replaced, thereby preventing a decrease in the plasma resistance of the holding device 100a.

[0045] FIG. 5 is a first diagram illustrating a method for repairing a holding device according to this embodiment. In the method for repairing a holding device 100a according to this embodiment, prior to the step of arranging a fitting member inside the gas flow path 41c (arranging step), the porous ceramic body 13, which is a porous body arranged inside the gas flow path 41c, is removed from the ceramic part 10 (removing step, indicated by an outline arrow R11 in FIG. 5). Specifically, the porous ceramic body 13 arranged inside the gas flow path 41c is cut using a machining center or the like, and the porous ceramic body 13 is removed from the electrostatic chuck 100. In the method for repairing a holding device according to this embodiment, the operation for removing the entire porous ceramic body 13 is performed at the boundary between the porous ceramic body 13 and an outer part 14 adjacent to the porous ceramic body 13 in the ceramic part 10. That is, in the removing step according to this embodiment, only the porous ceramic body 13 is removed from the ceramic part 10. As a result, an opening 41d having the same size as the gas flow path 41c is formed. In the ceramic portion 10, the outer portion 14 is a part of the base portion 11.

[0046] 6 is a second diagram illustrating the method for repairing the retaining device of this embodiment. After the removal step, as shown in FIG. 6, a fitting member A53, which will become the ceramic porous body 53, is placed in the opening 41d that opens in the surface 10a of the ceramic part 10 in the gas flow path 40 (placement step, outline arrow R12 shown in FIG. 6). Upon completion of the placement step, the outer wall surface A53a of the fitting member A53 and the inner wall surface 41e of the opening 41d are in contact with each other. Note that a small gap may exist between the outer wall surface A53a of the fitting member A53 and the inner wall surface 41e of the opening 41d.

[0047] Here, a method for manufacturing the fitting member A53 will be described. The fitting member A53 is manufactured by a method similar to the method for manufacturing the porous ceramic body 13, which is included in the method for manufacturing the ceramic portion 10 of the holding device 100a described above. Specifically, a substantially cylindrical fitting compact is manufactured by injection molding using a paste for a porous ceramic body obtained by kneading a mixture containing alumina powder, a pore-forming material, a binder, an organic solvent, etc. The fitting compact is then fired in an electric furnace to manufacture the fitting member A53. In the repair method for the holding device 100a of this embodiment, the fitting member A53 is a member having an exposed porous portion on its outer wall surface A53a, which faces the inner wall surface 41e of the opening 41d when the fitting member A53 is placed in the opening 41d. That is, in this embodiment, the fitting member A53 can be considered to be the replacement porous ceramic body itself.

[0048] FIG. 7 is a third diagram illustrating a method for repairing a holding device according to this embodiment. After the placement step, as shown in FIG. 7, a laser beam L1 is irradiated between the opening 41d and the fitting member A53, thereby fusing the inner wall surface 41e of the opening 41d and the outer wall surface A53a of the fitting member A53 (a fusion welding step). In the repair method for the holding device 100a according to this embodiment, the fusion welding between the inner wall surface 41e of the opening 41d and the outer wall surface A53a of the fitting member A53 is performed by scanning the laser beam L1 over the boundary between the opening 41d and the fitting member A53 on the surface 10a of the ceramic part 10, thereby locally irradiating the laser beam L1. This melts the inner wall surface 41e of the opening 41d and the outer wall surface A53a of the fitting member A53, thereby joining the fitting member A53 to the gas flow path 41c. Therefore, the fitting member A53 is integrated with the ceramic portion 10 as the ceramic porous body 53.

[0049] As shown in FIG. 7 , in the fusion welding process, the molten inner wall surface 41e of the opening 41d and the outer wall surface A53a of the fitting member A53 are formed around the ceramic porous body 53 as a porous body peripheral portion 54. That is, the porous body peripheral portion 54 is provided in contact with the outer peripheral surface 53a of the ceramic porous body 53. The fusion welding between the inner wall surface 41e of the opening 41d and the outer wall surface A53a of the fitting member A53 by the laser beam L1 preferably proceeds in the negative direction of the z-axis, thereby fusion-welding the entire inner wall surface of the gas flow path 41c to the outer wall surface A53a of the fitting member A53. Therefore, if the fusion welding between the inner wall surface of the gas flow path 41c and the outer wall surface A53a of the fitting member A53 does not easily proceed in the negative direction of the z-axis, an inorganic adhesive such as an alumina-based adhesive may be used to join the ceramic part 10 at a location away from the surface 10a.

[0050] In the repair method for the holding device 100a of this embodiment, the laser beam L1 is irradiated using a pulsed laser in the fusion welding process. As a result, when the inner wall surface 41e of the opening 41d and the outer wall surface A53a of the fitting member A53 are fused together, the melted area is relatively small, resulting in a relatively fast solidification rate. Therefore, the portion that melts and then solidifies upon irradiation with the laser beam L1 does not transform into stable α-alumina, but becomes amorphous alumina, δ-alumina, γ-alumina, or the like. Furthermore, when the melted area is relatively small, a difference in thermal expansion between the portion irradiated with the laser beam L1 and the portion not irradiated with the laser beam L1 is less likely to occur, thereby suppressing damage to the ceramic portion 10.

[0051] Fig. 8 is a second perspective view of the holding device of this embodiment. The holding device 100b shown in Fig. 8 is an electrostatic chuck in which the holding device 100a has been repaired by replacing the ceramic porous body. The holding device 100b includes a ceramic part 50, a base part 20, and a bonding part 30. In the holding device 100b of this embodiment, as shown in Fig. 8, the ceramic part 50, the bonding part 30, and the base part 20 are layered in this order.

[0052] FIG. 9 is a second cross-sectional view of the holding device of this embodiment. FIG. 10 is an enlarged view of portion B in FIG. 9. The ceramic unit 50 included in the holding device 100b shown in FIGS. 9 and 10 includes a base 11, a chuck electrode 12, and a porous ceramic body 53. Like the porous ceramic body 13, the porous ceramic body 53 is formed of insulating ceramic and suppresses discharge through the gas flow path 40. A porous-body peripheral portion 54 surrounding the porous ceramic body 53 contains a specific crystal structure ceramic that is the same type of ceramic as a portion of the ceramic unit 50 that is different from the porous-body peripheral portion 54 (base 11), but has a different crystal structure. In this embodiment, the porous-body peripheral portion 54 is provided in contact with the outer peripheral surface 53a of the porous ceramic body 53. The porosity of the porous-body peripheral portion 54 is smaller than the porosity of the porous ceramic body 53. The porous ceramic body 53 corresponds to a "first porous ceramic body" in the claims.

[0053] The specific crystal structure ceramic contained in the porous body peripheral portion 54 contains an amorphous phase of the ceramic material constituting the base 11. In this embodiment, the specific crystal structure ceramic contains at least one of amorphous alumina, δ-alumina, and γ-alumina. As shown in FIG. 9, the ceramic porous body 53 is disposed inside the gas flow path 41c, thereby connecting the gas flow path 41b to the outside of the surface 10a of the ceramic portion 10. The crystal structure and composition of the specific crystal structure ceramic contained in the porous body peripheral portion 54 can be measured by X-ray diffraction (XRD) using an X-ray diffractometer or electron diffraction (ED) using a transmission electron microscope.

[0054] According to the manufacturing method of the holding device 100b of this embodiment described above, when manufacturing the ceramic part 50 having the porous ceramic body 53 inside the gas flow path 41c, laser light L1 is irradiated between the fitting member A53 including the porous ceramic body 53 and the opening 41d, which is disposed in the surface 10a of the ceramic part 10 in the gas flow path 40. This melts and bonds the inner wall surface 41e of the opening 41d and the fitting member A53, respectively, so that the porous ceramic body 53 can be provided inside the gas flow path 40 without using an adhesive containing, for example, resin. Therefore, by repairing the ceramic part 10 during use, the ceramic part 50 can be made to have improved heat resistance while retaining the plasma resistance provided by the porous ceramic body 53, thereby improving the durability of the ceramic part.

[0055] Furthermore, according to the manufacturing method of the holding device 100b of this embodiment, when the laser beam L1 is irradiated between the fitting member A53 and the opening 41d, the laser beam L1 is scanned over the boundary between the opening 41d and the fitting member A53, and the laser beam L1 is irradiated locally. This makes the melting area relatively small, allowing the opening 41d and the fitting member A53 to be fusion-welded in a relatively short time. Therefore, the difference in thermal expansion between the portion irradiated with the laser beam L1 and the portion not irradiated with the laser beam L1 is relatively small, thereby suppressing damage to the ceramic portion 50.

[0056] Furthermore, according to the manufacturing method of the holding device 100b of this embodiment, the opening 41d and the fitting member A53 are fusion-welded with a pulsed laser, so that the area of ​​the portion melted by the energy of the laser beam L1 can be made relatively small. This further reduces the difference in thermal expansion between the portion irradiated with the laser beam L1 and the portion not irradiated with the laser beam L1, thereby further suppressing damage to the ceramic portion 50.

[0057] Furthermore, according to the manufacturing method of the holding device 100b of this embodiment, when forming the opening 41d for arranging the fitting member A53, a portion including the entire porous ceramic body 13 disposed inside the gas flow path 41c is hollowed out from the ceramic part 10. As a result, even if a crack or the like occurs in the porous ceramic body 13 and replacement is required, for example, by replacing a portion of the ceramic part 10, the plasma resistance of the replaced ceramic part 50 can be restored to the state it was in when the ceramic part 10 was first used. Therefore, the durability of the holding devices 100a, 100b using the ceramic parts 10, 50 can be improved.

[0058] Furthermore, according to the manufacturing method of the retaining device 100b of this embodiment, when forming the opening 41d for arranging the fitting member A53, the porous ceramic body 13 is hollowed out at the boundary between the porous ceramic body 13 and the outer portion 14 adjacent to the porous ceramic body 13, as shown in Fig. 5. This makes it possible to reduce the size of the portion of the ceramic part 10 that is to be replaced.

[0059] Furthermore, according to the manufacturing method of the holding device 100b of this embodiment, the fitting member A53 is a member in which the ceramic porous body 53 is exposed. This allows the fitting member A53 to be prepared relatively inexpensively.

[0060] Furthermore, according to the holding device 100b of this embodiment, the ceramic porous body 53 of the ceramic part 50 is joined to the base 11 by the porous body peripheral part 54, which is a part of the ceramic part 50 different from the porous body peripheral part 54, and which contains a specific crystal structure ceramic that is the same type of ceramic as the base 11 but has a different crystal structure. This allows the ceramic porous body 53 to be provided in the gas flow path 41c without using an adhesive containing resin or the like. Therefore, the heat resistance of the ceramic part 50 can be improved while maintaining the plasma resistance provided by the ceramic porous body 53, thereby improving the durability of the holding device 100b.

[0061] Furthermore, according to the holding device 100b of this embodiment, the porous ceramic body 53 is joined to the base 11 by the specific crystal structure ceramic provided in contact with the outer peripheral surface 53a of the porous ceramic body 53. This makes the portion of the specific crystal structure ceramic in the ceramic part 50 relatively small, thereby suppressing breakage of the ceramic part 50 due to differences in thermal expansion.

[0062] Furthermore, according to the holding device 100b of this embodiment, the specific crystal structure ceramic that bonds the porous ceramic body 53 and the base 11 contains an amorphous phase of the ceramic material that constitutes the base 11. This allows the porous ceramic body 53 to be bonded relatively loosely to the base 11 via the porous body peripheral portion 54. Therefore, the portion including the porous ceramic body 53 can be easily removed from the ceramic portion.

[0063] Furthermore, according to the holding device 100b of this embodiment, the specific crystal structure ceramic that bonds the porous ceramic body 53 to the base 11 includes at least one of amorphous alumina, δ-alumina, and γ-alumina. This allows the porous ceramic body 53 to be bonded to the base 11 relatively loosely, making it possible to easily remove the portion including the porous ceramic body 53.

[0064] Second Embodiment Fig. 11 is a first diagram illustrating a method for manufacturing a retaining device of this embodiment. Fig. 12 is a second diagram illustrating a method for manufacturing a retaining device of this embodiment. Fig. 13 is a third diagram illustrating a method for manufacturing a retaining device of this embodiment. The method for manufacturing a retaining device of the second embodiment differs from the method for manufacturing a retaining device of the first embodiment (Figs. 5 to 7) in that, when repairing the retaining device, a portion including a ceramic porous body is removed and an inserting member including a ceramic porous body is disposed.

[0065] In the repair method for the holding device 100a of the present embodiment, in order to replace the ceramic porous body 13 of the holding device 100a, the outer portion 14 adjacent to the ceramic porous body 13 is removed (removal step, indicated by an outline arrow R21 in FIG. 11 ) from the outside of the ceramic porous body 13, as shown in FIG. 11 . As a result, an opening 41d larger than the gas flow path 41c is formed in the surface 10a of the ceramic part 10 after the removal of the ceramic porous body 13 and the outer portion 14. As in the first embodiment, the method for removing the ceramic porous body 13 and the outer portion 14 from the ceramic part 10 includes, but is not limited to, cutting the ceramic porous body 13 and the outer portion 14 to be replaced using a machining center.

[0066] Fig. 12 is a second diagram illustrating the manufacturing method of the holding device of this embodiment. After the removing step, as shown in Fig. 12, an inserting member A63 that becomes the ceramic porous body 63 is placed in the opening 41d that opens in the surface 10a of the ceramic part 10 in the gas flow path 40 (placement step, white arrow R22 shown in Fig. 12). The ceramic porous body 63 corresponds to the "first ceramic porous body" in the claims.

[0067] In the method for repairing a holding device according to this embodiment, a fitting member A63 is manufactured before the disposing step, corresponding to the porous ceramic body 13 and the outer portion 14 to be removed from the ceramic portion 10 in the removing step. In this embodiment, the fitting member A63 is a member having a layer denser than the porous ceramic body 13 on the surface facing the inner wall surface 41e of the opening 41d when the fitting member A63 is disposed inside the opening 41d. In the manufacturing method for the fitting member A63, first, a base material is prepared, which is made of one green sheet or a laminate of two or more green sheets. The base material may be, for example, sized to correspond to the portion removed from the ceramic portion 10 in the removing step, or may be sized so that multiple fitting members A63 can be manufactured simultaneously. A through hole is formed in the prepared base material, penetrating the base material in the thickness direction. Next, the through hole formed in the base material is filled with the paste for a porous ceramic body, as described in the manufacturing method for the porous ceramic body 13 according to the first embodiment. Examples of methods for filling the through-holes with the paste for the porous ceramic body include a method using an injection molding machine and a method using a screen printing machine. Next, the base material with the through-holes filled with the paste for the porous ceramic body is fired at a predetermined temperature and processed to adjust its shape, thereby producing the fitting member A63. In manufacturing the fitting member A63 of this embodiment, the paste for the porous ceramic body and the green sheet of the base material are fired, and are integrated with each other by solid-state bonding. As shown in FIG. 12 , the fitting member A63 has a porous portion A631 corresponding to the porous ceramic body 63 and a dense layer A632 that is denser than the porous ceramic body 63. However, the manufacturing method of the fitting member A63 is not limited thereto. For example, a tubular pressed alumina body may be formed by using a mold with a double-tube structure having a concentric cross section and filling the space between the inner and outer tubes with alumina powder capable of forming dense alumina, and then the tubular pressed alumina body may be filled with a paste for a ceramic porous body and fired to produce the fitting member A63. Alternatively, a compact may be produced using alumina powder containing a pore-forming material, and a dense green sheet may be wrapped around the outer periphery of the produced compact, followed by firing to produce the fitting member A63.

[0068] 13 is a third diagram illustrating a method for repairing the holding device of this embodiment. After the arrangement step, a laser beam L2 is irradiated between the opening 41d and the fitting member A63, thereby fusing the inner wall surface 41e of the opening 41d and the outer wall surface A63a of the fitting member A63 (fusion welding step). In the repair method for the holding device 100a of this embodiment, the fusion welding between the inner wall surface 41e of the opening 41d and the outer wall surface A63a of the fitting member A63 is performed by scanning the laser beam L2 over the boundary between the opening 41d and the fitting member A63 on the surface 10a of the ceramic part 10, thereby locally irradiating the laser beam L2. As a result, the inner wall surface 41e of the opening 41d and the outer wall surface A63a of the fitting member A63 melt, and the opening 41d and the fitting member A63 are joined, so that the porous portion A631 of the fitting member A63 is integrated with the ceramic portion 10 as the ceramic porous body 63.

[0069] 13, in the fusion welding process, a porous body peripheral portion 64 is formed around the porous ceramic body 63, where the inner wall surface 41e of the opening 41d and the dense layer A632 of the fitting member A63 are melted together. Specifically, the porous body peripheral portion 64 includes a first peripheral portion 641 that is adjacent to the porous ceramic body 63 and relatively inner, and a second peripheral portion 642 that is relatively outer and surrounds the first peripheral portion 641. The first peripheral portion 641 is the portion that was formerly the dense layer A632 of the fitting member A63. The second peripheral portion 642 is mainly the portion where the inner wall surface 41e of the opening 41d is melted together.

[0070] Fig. 14 is a perspective view of the holding device of this embodiment. The holding device 200b shown in Fig. 14 is an electrostatic chuck that has been repaired by replacing the ceramic porous body. The holding device 200b includes a ceramic part 60, a base part 20, and a joint part 30. In the holding device 200b of this embodiment, as shown in Fig. 14, the ceramic part 50, the joint part 30, and the base part 20 are stacked in this order. In Fig. 14, the x-axis, y-axis, and z-axis are shown, as in Fig. 1.

[0071] Fig. 15 is a cross-sectional view of the holding device of this embodiment. Fig. 16 is an enlarged view of part C in Fig. 15. The ceramic part 60 of the holding device 200b shown in Figs. 15 and 16 includes a base 11, a chuck electrode 12, and a porous ceramic body 63. Like the porous ceramic body 13, the porous ceramic body 63 is formed of insulating ceramic and suppresses discharge that uses the gas flow path 40 as a discharge path.

[0072] The porous body peripheral portion 64 surrounding the ceramic porous body 63 contains a specific crystal structure ceramic that is the same type of ceramic as a different portion (base portion 11) of the ceramic portion 60 but has a different crystal structure. The specific crystal structure ceramic contained in the porous body peripheral portion 64 contains an amorphous phase of the ceramic material constituting the base portion 11. In this embodiment, the specific crystal structure ceramic includes at least one of amorphous alumina, δ-alumina, and γ-alumina. The porous body peripheral portion 64 in this embodiment includes a first peripheral portion 641 that is adjacent to the ceramic porous body 63 and relatively inner, and a second peripheral portion 642 that is relatively outer and surrounds the first peripheral portion 641. The specific crystal structure ceramic described above is contained in the second peripheral portion 642. That is, the second peripheral portion 642 is formed of the specific crystal structure ceramic.

[0073] According to the manufacturing method of the holding device 200b of this embodiment described above, when manufacturing the ceramic part 60 having the porous ceramic body 63 inside the gas flow path 41c, laser light L2 is irradiated between the opening 41d and the fitting member A63 including the porous ceramic body 63, which is disposed in the opening 41d that opens on the surface 10a of the ceramic part 60 in the gas flow path 40. This makes it possible to provide the porous ceramic body 63 inside the gas flow path 41c without using an adhesive containing resin or the like. Therefore, by repairing the ceramic part 10 during use, it is possible to obtain a ceramic part 60 that has improved heat resistance while maintaining the plasma resistance provided by the porous ceramic body 63, thereby improving the durability of the ceramic part.

[0074] Furthermore, according to the manufacturing method of the retaining device 200b of this embodiment, when forming the opening 41d for arranging the fitting member A63, the opening 41d is hollowed out including the outer portion 14 adjacent to the porous ceramic body 13. This makes it possible to suppress damage to the porous ceramic body 63 by the laser beam L2 when irradiating the fitting member A63 including the porous ceramic body 63 and the opening 41d with the laser beam L2 to fusion weld them together.

[0075] Furthermore, according to the manufacturing method of the holding device 200b of this embodiment, a member provided with a dense layer A632 that is denser than the porous ceramic body 63 is used as the fitting member A63. This makes it possible to suppress damage to the porous ceramic body 63 caused by the laser beam L2 when fusion welding is performed between the fitting member A63 including the porous ceramic body 63 and the opening 41d by irradiating it with the laser beam L2. Therefore, the plasma resistance of the holding device 200b can be restored to its initial state.

[0076] Furthermore, according to the holding device 200b of this embodiment, the ceramic porous body 63 of the ceramic part 60 is joined to the base 11 by the porous body peripheral part 64, which is a part of the ceramic part 60 different from the porous body peripheral part 64, and which contains a specific crystal structure ceramic that is the same type of ceramic as the base 11 but has a different crystal structure. This allows the ceramic porous body 63 to be provided in the gas flow path 41c without using an adhesive containing resin or the like. Therefore, the heat resistance of the ceramic part 60 can be improved while maintaining the plasma resistance provided by the ceramic porous body 63, thereby improving the durability of the holding device 200b.

[0077] Furthermore, according to the holding device 200b of this embodiment, a first peripheral portion 641 that is adjacent to the porous ceramic body 63 and is relatively inner, and a second peripheral portion 642 that is relatively outer and surrounds the first peripheral portion 641 are arranged around the porous ceramic body 63. As a result, the porous ceramic body 63 is supported by the first peripheral portion 641 and joined to the base 11 by the second peripheral portion 642 that includes the specific crystal structure ceramic. This makes it possible to prevent the porous ceramic body 63 from being damaged by stress due to differences in thermal expansion, etc.

[0078] <Modification of this embodiment> The present invention is not limited to the above-described embodiment, and can be embodied in various forms without departing from the spirit of the invention. For example, the following modifications are also possible.

[0079] [Variation 1] In the above-described embodiment, the fusion welding between the inner wall surface 41e of the opening 41d and the outer wall surface of the fitting member is performed by scanning the laser light on the boundary between the opening 41d and the fitting member on the surface of the ceramic part and locally irradiating the laser light. The position to which the laser light is irradiated is not limited to the boundary between the opening 41d and the fitting member. It is sufficient that the inner wall surface 41e of the opening 41d and the outer wall surface of the fitting member are melted, thereby joining the fitting member to the opening 41d.

[0080] [Variation 2] In the above-described embodiment, the laser beam irradiation in the fusion welding process is performed using a pulsed laser. The laser beam irradiation in the fusion welding process is not limited to a pulsed laser. By using a pulsed laser to irradiate the laser beam, the melted area becomes relatively small, and therefore the solidification rate can be increased.

[0081] [Variation 3] In the above-described embodiment, the specific crystal structure ceramic contains an amorphous phase of alumina oxide, which is the ceramic material constituting the base 11. The specific crystal structure ceramic contains at least one of amorphous alumina, δ-alumina, and γ-alumina. The properties of the material for the portion connecting the ceramic porous body and the base are not limited to these. A material containing the ceramic material constituting the base 11 as its main component is desirable. Furthermore, the inclusion of an amorphous phase makes the ceramic porous body easier to remove, allowing for easy replacement even if it breaks again after repair. This further improves the durability of the electrostatic chuck.

[0082] [Variation 4] In the above-described embodiment, the electrostatic chuck is repaired by fusion welding the inner wall surface of the opening and the fitting member including the porous ceramic body by irradiating a laser beam. When manufacturing a new electrostatic chuck, a laser beam may be used to fusion weld the porous ceramic body and the base. This allows the manufacture of an electrostatic chuck that is plasma-resistant and heat-resistant.

[0083] [Variation 5] In the above-described embodiment, the holding device includes a ceramic portion made of ceramic, a base portion made mainly of metal, and a joining portion joining the ceramic portion and the base portion. The configuration of the holding device is not limited to this. The entire holding device may be made of ceramic, or may be made of a composite material of ceramic and metal.

[0084] This aspect has been described above based on embodiments and modifications. However, the above-described embodiments are intended to facilitate understanding of this aspect and are not intended to limit this aspect. This aspect may be modified or improved without departing from the spirit and scope of the claims, and equivalents thereof are included in this aspect. Furthermore, if a technical feature is not described as essential in this specification, it may be deleted as appropriate.

[0085] <Application example 1> A method for manufacturing a ceramic part used in a holding device for holding an object, comprising: the ceramic part is mainly composed of ceramic, has a gas flow path formed therein, and has a first ceramic porous body within the gas flow path; The manufacturing method includes: a fitting member including the first ceramic porous body is placed in an opening of the gas flow path that opens on a surface of the ceramic component; a laser beam is irradiated between the opening and the fitting member, thereby fusing the inner wall surface of the opening and the fitting member; Manufacturing methods for ceramic parts. <Application example 2> A method for producing a ceramic part according to Application Example 1, The fusion welding between the inner wall surface of the opening and the fitting member is performed by scanning a laser beam on the boundary between the opening and the fitting member on the surface of the ceramic part, thereby locally irradiating the laser beam. Manufacturing methods for ceramic parts. <Application example 3> A method for producing a ceramic part according to Application Example 1 or Application Example 2, The laser light irradiation is performed using a pulsed laser. Manufacturing methods for ceramic parts. <Application Example 4> A method for producing a ceramic part according to any one of Application Examples 1 to 3, the opening is formed by hollowing out a portion of the ceramic component that includes the entire second ceramic porous body, which is a porous body disposed in the gas flow path, prior to the step of arranging the fitting member in the opening. Manufacturing methods for ceramic parts. <Application example 5> A method for producing a ceramic part according to any one of Application Examples 1 to 4, the operation of hollowing out the portion including the entire second ceramic porous body is performed at a boundary between the second ceramic porous body and an outer portion of the ceramic component adjacent to the second ceramic porous body. Manufacturing methods for ceramic parts. <Application Example 6> A method for producing a ceramic part according to any one of Application Examples 1 to 5, the operation of hollowing out the portion including the entire second ceramic porous body is performed so as to hollow out an outer portion of the ceramic component that is adjacent to the second ceramic porous body on the outside of the second ceramic porous body. Manufacturing methods for ceramic parts. <Application Example 7> A method for producing a ceramic part according to any one of Application Examples 1 to 6, The fitting member is a member in which the first ceramic porous body is exposed on a surface that faces an inner wall surface of the opening when the fitting member is placed in the opening. Manufacturing methods for ceramic parts. <Application Example 8> A method for producing a ceramic part according to any one of Application Examples 1 to 7, The fitting member is a member having a dense layer that is denser than the first ceramic porous body on a surface that faces the inner wall surface of the opening when the fitting member is placed in the opening. Manufacturing methods for ceramic parts. <Application Example 9> A holding device for holding an object, a ceramic portion on which the object is placed, the ceramic portion is mainly composed of ceramic, has a gas flow path formed therein, and has a ceramic porous body within the gas flow path; a porous body peripheral portion of the ceramic portion surrounding the ceramic porous body includes a specific crystal structure ceramic that is the same type of ceramic as a portion of the ceramic portion different from the porous body peripheral portion, but has a different crystal structure. holding device. <Application Example 10> The holding device according to Application Example 9, the porous body peripheral portion is provided in contact with the outer peripheral surface of the ceramic porous body, holding device. <Application Example 11> The holding device according to Application Example 9 or Application Example 10, the porous body peripheral portion includes a first peripheral portion adjacent to the ceramic porous body and relatively inside, and a second peripheral portion surrounding the first peripheral portion and relatively outside, The specific crystal structure ceramic is included in the second peripheral portion. holding device. <Application Example 12> The holding device according to any one of Application Examples 9 to 11, The specific crystal structure ceramic is characterized in that it contains an amorphous phase of a ceramic material that constitutes a portion different from the peripheral portion of the porous body. holding device. <Application Example 13> The holding device according to any one of Application Examples 9 to 12, the ceramic portion includes aluminum oxide; The specific crystal structure ceramic contains at least one of amorphous alumina, δ-alumina, and γ-alumina. holding device. [Explanation of symbols]

[0086] 10, 50, 60...Ceramic section 10a...(ceramic part) surface 13, 53, 63...Porous ceramic 14...Outer part 40, 41a, 41b, 41c, 42, 43...Gas flow paths 41d...Opening 41e...Inner wall surface (of opening) 53a...Outer surface 54, 64...Outer periphery of porous body 641...First peripheral area 642...Second peripheral area 100a,100b,200b…holding device A53, A63...Fitting parts A632…Dense layer L1, L2...Laser light W...wafer

Claims

1. A method for manufacturing a ceramic part used in a holding device for holding an object, comprising: the ceramic part is mainly composed of ceramic, has a gas flow path formed therein, and has a first ceramic porous body within the gas flow path; The manufacturing method includes: a fitting member including the first ceramic porous body is placed in an opening of the gas flow path that opens on a surface of the ceramic component; a laser beam is irradiated between the opening and the fitting member, thereby fusing the inner wall surface of the opening and the fitting member; Manufacturing methods for ceramic parts.

2. 2. A method for manufacturing a ceramic part according to claim 1, comprising: The fusion welding between the inner wall surface of the opening and the fitting member is performed by scanning a laser beam on the boundary between the opening and the fitting member on the surface of the ceramic part, thereby locally irradiating the laser beam. Manufacturing methods for ceramic parts.

3. 2. A method for manufacturing a ceramic part according to claim 1, comprising: The laser light irradiation is performed using a pulsed laser. Manufacturing methods for ceramic parts.

4. 2. A method for manufacturing a ceramic part according to claim 1, comprising: the opening is formed by hollowing out a portion of the ceramic component that includes the entire second ceramic porous body, which is a porous body disposed in the gas flow path, prior to the step of arranging the fitting member in the opening. Manufacturing methods for ceramic parts.

5. 5. The method for manufacturing a ceramic part according to claim 4, the operation of hollowing out the portion including the entire second ceramic porous body is performed at a boundary between the second ceramic porous body and an outer portion of the ceramic component adjacent to the second ceramic porous body. Manufacturing methods for ceramic parts.

6. 5. The method for manufacturing a ceramic part according to claim 4, the operation of hollowing out the portion including the entire second ceramic porous body is performed so as to hollow out an outer portion of the ceramic component that is adjacent to the second ceramic porous body on the outside of the second ceramic porous body. Manufacturing methods for ceramic parts.

7. 2. A method for manufacturing a ceramic part according to claim 1, comprising: the fitting member is a member in which the first ceramic porous body is exposed on a surface that faces an inner wall surface of the opening when the fitting member is placed in the opening. Manufacturing methods for ceramic parts.

8. 2. A method for manufacturing a ceramic part according to claim 1, comprising: the fitting member is a member having a dense layer that is denser than the first ceramic porous body on a surface that faces an inner wall surface of the opening when the fitting member is placed in the opening. Manufacturing methods for ceramic parts.

9. A holding device for holding an object, a ceramic portion on which the object is placed, the ceramic portion is mainly composed of ceramic, has a gas flow path formed therein, and has a ceramic porous body within the gas flow path; a porous body peripheral portion of the ceramic portion surrounding the ceramic porous body includes a specific crystal structure ceramic that is the same type of ceramic as a portion of the ceramic portion different from the porous body peripheral portion, but has a different crystal structure. holding device.

10. 10. The holding device of claim 9, the porous body peripheral portion is provided in contact with the outer peripheral surface of the ceramic porous body, holding device.

11. 10. The holding device of claim 9, the porous body peripheral portion includes a first peripheral portion adjacent to the ceramic porous body and relatively inside, and a second peripheral portion surrounding the first peripheral portion and relatively outside, The specific crystal structure ceramic is included in the second peripheral portion. holding device.

12. 10. The holding device of claim 9, The specific crystal structure ceramic is characterized in that it contains an amorphous phase of a ceramic material that constitutes a portion different from the peripheral portion of the porous body. holding device.

13. 10. The holding device of claim 9, the ceramic portion includes aluminum oxide; The specific crystal structure ceramic contains at least one of amorphous alumina, δ-alumina, and γ-alumina. holding device.

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