Method for manufacturing ceramic component

Abstract

To provide a technique for improving the durability of a ceramic component in a method for manufacturing the ceramic component.SOLUTION: A manufacturing method of a ceramic component used in a holding device that holds an object, the ceramic component including a ceramic as a main component and having a gas flow path formed therein and a first ceramic porous body in the gas flow path, includes disposing a fitting member including a first ceramic porous body in an opening portion of the gas flow path that opens on a surface of the ceramic component, disposing ceramic powder between an inner wall surface of the opening portion and the fitting member, and irradiating a laser beam between the opening portion and the fitting member. The inner wall surface of the opening and the fitting member are joined by sintering or melting the ceramic powder.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a ceramic component. [Background technology]

[0002] BACKGROUND ART Conventionally, ceramic parts used in electrostatic chucks have been known that have a ceramic porous body in a gas flow path that suppresses the occurrence of discharge (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7255659 Summary of the Invention [Problem to be solved by the invention]

[0004] However, even with prior art such as that disclosed in Patent Document 1, there is still room for improvement in the technology for improving the durability of ceramic parts in the manufacturing method of ceramic parts.

[0005] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a technique for improving the durability of a ceramic part in a manufacturing method of the ceramic part. [Means for solving the problem]

[0006] The present invention has been made to solve at least part of the above-mentioned problems, and can be realized in the following aspects.

[0007] (1) According to one aspect of the present invention, there is provided a method for manufacturing a ceramic part used in a holding device for holding an object, the ceramic part having a ceramic-based material, a gas flow path formed therein, and a ceramic porous body within the gas flow path. This method for manufacturing the ceramic part includes: placing a fitting member including the first ceramic porous body in an opening in the gas flow path that opens on the surface of the ceramic part; placing ceramic powder between the inner wall surface of the opening and the fitting member; and irradiating a laser beam between the opening and the fitting member to sinter or melt the ceramic powder, thereby joining the inner wall surface of the opening and the fitting member.

[0008] According to this configuration, when manufacturing a ceramic part having a first porous ceramic body, the ceramic powder disposed between the opening and an inserting member including the first porous ceramic body disposed in the opening of the gas flow passage is irradiated with laser light to sinter or melt the ceramic powder. This bonds the opening and the inserting member, making it possible to provide the first porous ceramic body in the gas flow passage without using an adhesive containing, for example, resin. Therefore, the ceramic part can maintain plasma resistance while improving its heat resistance during use, thereby improving its durability.

[0009] (2) In the method for manufacturing a ceramic part according to the above aspect, when a laser beam is irradiated between the opening and the fitting member, a shielding plate for blocking the irradiated laser beam may be disposed so as to cover the first porous ceramic body exposed at the surface of the ceramic part. According to this configuration, the shielding plate prevents the laser beam for sintering or melting the ceramic powder from being irradiated onto the first porous ceramic body. This prevents damage to the first porous ceramic body caused by the laser beam, thereby allowing the fitting member to be joined to the opening while ensuring gas flow in the first porous ceramic body.

[0010] (3) In the method for manufacturing a ceramic part according to the above aspect, the ceramic powder may be made of the same type of ceramic as at least one of the ceramic that constitutes the outer periphery of the opening in the ceramic part and the ceramic that constitutes a portion of the fitting member that includes a surface within the opening that faces the inner wall surface of the opening. According to this configuration, the ceramic powder disposed between the fitting member and the opening is made of the same type of ceramic as at least one of the ceramic that constitutes the outer periphery of the opening and the ceramic that constitutes the surface of the fitting member that faces the inner wall surface of the opening. As a result, when the ceramic powder is sintered or melted, it becomes integrated with at least one of the opening and the fitting member, thereby enabling a relatively strong bond between the opening and the fitting member.

[0011] (4) In the method for manufacturing a ceramic component according to the above aspect, prior to the step of placing the fitting member in the opening, the opening may be formed by hollowing out a portion of the ceramic component that includes the entire second porous ceramic body, which is a porous body disposed in the gas flow path. According to this configuration, when forming the opening for arranging the fitting member, a portion that includes the entire second porous ceramic body disposed in the gas flow path is hollowed out from the ceramic component. As a result, even if, for example, the second porous ceramic body is damaged and needs to be replaced, the plasma resistance of the ceramic component can be restored to its initial state by simply replacing that portion of the ceramic component.

[0012] (5) In the method for manufacturing a ceramic part according to the above aspect, the operation of hollowing out a portion including the entire second porous ceramic body may be performed at a boundary between the second porous ceramic body and an outer portion adjacent to the second porous ceramic body in the ceramic part. According to this configuration, when forming an opening for arranging an insertion member, a portion including the entire second porous ceramic body is hollowed out at the boundary between the second porous ceramic body and the outer portion adjacent to the second porous ceramic body. This makes it possible to reduce the size of the portion of the ceramic part to be replaced.

[0013] (6) In the method for manufacturing a ceramic part according to the above aspect, the step of hollowing out a portion including the entire second porous ceramic body may be performed so as to hollow out an outer portion of the ceramic part that is adjacent to the second porous ceramic body. According to this configuration, when forming an opening for arranging an insertion member, the hollowing out includes the outer portion that is adjacent to the second porous ceramic body. This makes it possible to suppress damage to the first porous ceramic body by the laser beam when irradiating the opening with a laser beam to join the insertion member including the first porous ceramic body.

[0014] (7) In the method for manufacturing a ceramic part according to the above aspect, the fitting member may be a member in which the first ceramic porous body is exposed on a surface that faces the inner wall surface of the opening when the fitting member is placed in the opening. According to this configuration, the fitting member is a member in which the first ceramic porous body is exposed. This allows the fitting member to be prepared relatively inexpensively.

[0015] (8) In the method for manufacturing a ceramic part according to the above embodiment, the fitting member may be a member having a dense layer denser than the first porous ceramic body on a surface facing the inner wall surface of the opening when the fitting member is placed in the opening. According to this configuration, the fitting member is a member having a dense layer denser than the first porous ceramic body. This makes it possible to suppress damage to the first porous ceramic body by laser light when the fitting member including the first porous ceramic body is joined to the opening by irradiating it with laser light. Therefore, the plasma resistance of the ceramic part can be restored to its initial state.

[0016] The present invention can be realized in various forms, such as a method for repairing ceramic parts, a method for joining a ceramic porous body to a holding device, a method for manufacturing a holding device, a system including a holding device, a control method for these devices and systems, a computer program for causing these devices and systems to hold objects, a server device for distributing the computer program, and a non-transitory storage medium on which the computer program is stored. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 2 is a first perspective view of the holding device of the first embodiment. [Figure 2] FIG. 2 is a first cross-sectional view of the holding device of the first embodiment. [Figure 3] FIG. 3 is an enlarged view of part A in FIG. 2. [Figure 4] FIG. 2 is a first partially enlarged view of the ceramic portion of the first embodiment. [Figure 5] FIG. 3 is a first view illustrating a method for repairing the holding device of the first embodiment. [Figure 6] FIG. 10 is a second view illustrating the repair method for the holding device of the first embodiment. [Figure 7] FIG. 10 is a third view illustrating the repair method for the holding device of the first embodiment. [Figure 8]FIG. 10 is a fourth diagram illustrating the repair method for the holding device of the first embodiment. [Figure 9] FIG. 2 is a second perspective view of the holding device of the first embodiment. [Figure 10] FIG. 4 is a second cross-sectional view of the holding device of the first embodiment. [Figure 11] FIG. 11 is an enlarged view of part B in FIG. [Figure 12] FIG. 4 is a second partially enlarged view of the ceramic portion of the first embodiment. [Figure 13] 10A and 10B are first diagrams illustrating a method for repairing a holding device according to a second embodiment. [Figure 14] FIG. 10 is a second view illustrating the repair method for the holding device of the second embodiment. [Figure 15] FIG. 10 is a third view illustrating the repair method for the holding device of the second embodiment. [Figure 16] FIG. 10 is a fourth diagram illustrating the repair method for the holding device of the second embodiment. [Figure 17] FIG. 10 is a perspective view of a holding device according to a second embodiment. [Figure 18] FIG. 10 is a cross-sectional view of a holding device according to a second embodiment. [Figure 19] FIG. 19 is an enlarged view of part C in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0018] First Embodiment FIG. 1 is a first perspective view of a holding device according to this embodiment. FIG. 2 is a first cross-sectional view of the holding device according to this embodiment. The holding device 100a according to this embodiment is an electrostatic chuck that attracts and holds an object, such as a wafer W, by electrostatic attraction. The electrostatic chuck is used, for example, as a table on which the wafer W is placed in an etching process using plasma in a chamber equipped with the electrostatic chuck. The holding device 100a includes a ceramic part 10, a base part 20, and a bonding part 30. In the holding device 100a according to this embodiment, as shown in FIG. 1, the ceramic part 10, the bonding part 30, and the base part 20 are stacked in this order. For convenience, in FIGS. 1 and 2, the stacking direction of the ceramic part 10, the bonding part 30, and the base part 20 is defined as the z-axis direction, and an x-axis that intersects perpendicularly with the z-axis and a y-axis that intersects perpendicularly with the x-axis are shown.

[0019] 2, a gas flow path 40 is formed inside the holding device 100a. The gas flow path 40 opens to the surface 10a on the positive side in the z-axis direction of the ceramic part 10 and to the surface 20b on the negative side in the z-axis direction of the base part 20. In the gas flow path 40, an inert gas such as helium gas flows from the surface 20b side of the base part 20 to the surface 10a side of the ceramic part 10.

[0020] The ceramic portion 10 is a generally disk-shaped component whose main component is ceramic. Here, "main component" refers to the component with the highest content. The ceramic portion 10 of this embodiment is mainly composed of alumina (Al2O3). That is, the ceramic portion 10 contains aluminum oxide. The ceramic portion 10 includes a base portion 11, a chuck electrode 12, and a ceramic porous body 13.

[0021] The base 11 is a component made of ceramic and has a substantially circular disk shape. The base 11 of this embodiment is made of alumina and has substantially the same shape as the ceramic part 10. Note that the material forming the base 11 may also be other ceramic materials such as aluminum nitride (AlN) or silicon carbide (SiC).

[0022] Gas flow channels 41a, 41b, and 41c are formed inside the base 11 as part of the gas flow channel 40. The gas flow channel 41a is formed on the base portion 20 side of the ceramic part 10 along the z-axis direction and communicates with a gas flow channel 43 formed in the joining part 30, which will be described later. The gas flow channel 41b is formed along a direction substantially parallel to a plane including the x-axis and y-axis and communicates with the gas flow channel 41a. The gas flow channel 41c is formed on the surface 10a side of the ceramic part 10 along the z-axis direction and opens to the outside of the ceramic part 10 at the surface 10a of the ceramic part 10. The gas flow channel 41c communicates with the gas flow channel 41b and the outside of the surface 10a of the ceramic part 10.

[0023] The chuck electrode 12 is disposed inside the base 11. The chuck electrode 12 is formed of a conductive material such as tungsten (W), molybdenum (Mo), or platinum (Pt). The chuck electrode 12 is connected to an external power supply via an electrode terminal (not shown). When power is supplied from the external power supply, the chuck electrode 12 generates an electrostatic attraction force capable of attracting and holding the wafer W on the surface 10a of the ceramic part 10. In addition to the chuck electrode 12, a high-frequency electrode or a heater electrode may be disposed in the ceramic part 10.

[0024] 2, the surface 10a of the ceramic part 10 is formed in an annular shape with the outer peripheral part 101a protruding in the positive direction of the z-axis beyond the inner part 102a of the outer peripheral part 101a. As a result, when the wafer W is attracted and held on the surface 10a by the electrostatic attraction force generated by the chuck electrode 12, a gap G is formed between the wafer W and the inner part 102a of the surface 10a, as shown in FIG.

[0025] The ceramic porous body 13 is a substantially cylindrical member made of ceramic such as alumina, yttria, or a rare earth oxide having relatively high plasma resistance. The ceramic porous body 13 has insulating properties and is provided to suppress discharge that occurs through the gas flow path 40 during a plasma-based etching process. The ceramic porous body 13 corresponds to a "second ceramic porous body" in the claims.

[0026] The ceramic porous body 13 has numerous pores formed as traces of a particulate pore-forming material that has been burned (disappeared) during the manufacturing process of the ceramic porous body 13. Examples of pore-forming materials used in manufacturing the ceramic porous body 13 include synthetic resin beads and carbon powder. Some of the pores formed in the ceramic porous body 13 are interconnected, forming paths through which the inert gas flowing through the flow path 40 can pass. This gives the ceramic porous body 13 gas permeability.

[0027] FIG. 3 is an enlarged view of portion A in FIG. 2. FIG. 4 is a partial enlarged view of the ceramic portion included in the holding device of this embodiment. FIG. 4 is a view of the holding device 100a as viewed from the positive side of the z-axis, and is an enlarged view of a portion of the surface 10a of the ceramic portion 10, including the porous ceramic body 13. As shown in FIGS. 3 and 4, the porous ceramic body 13 is installed in the gas flow path 41c that constitutes the gas flow path 40. The pores of the porous ceramic body 13 communicate with the gas flow path 41b and the outside of the surface 10a of the ceramic portion 10. The ceramic portion 10 has an outer portion 14 adjacent to the porous ceramic body 13, outside the porous ceramic body 13. In the ceramic portion 10, the outer portion 14 has the same characteristics as the base portion 11 and is denser than the porous ceramic body 13. In addition, in Figs. 3 and 4, the range of the outer portion 14 in the base portion 11 is shown by a two-dot chain line for convenience, but the size of the outer portion 14 relative to the ceramic porous body 13 is not limited to this.

[0028] The base portion 20 is a generally disk-shaped component made primarily of a metal such as aluminum or an aluminum alloy, a composite of metal and ceramic such as Al-SiC, or a ceramic such as SiC. In this embodiment, the base portion 20 is made of aluminum. The base portion 20 is larger than the ceramic portion 10. For example, if the diameter of the ceramic portion 10 is 300 mm, the diameter of the base portion 20 is 340 mm. The size relationship between the ceramic portion 10 and the base portion 20 is not limited to this; they may be the same size.

[0029] A plurality of coolant flow paths 21 are formed inside the base portion 20. A coolant such as a fluorine-based inert liquid or water flows through the coolant flow paths 21. When the holding device 100a is used in a plasma etching process, the heat of the plasma is removed from the holding device 100a by the coolant. Furthermore, when the coolant flows through the coolant flow paths 21, the base portion 20 is cooled, and the ceramic portion 10 is cooled via the bonding portion 30. As a result, the wafer W held on the surface 10a of the ceramic portion 10 is cooled.

[0030] A gas flow path 42 constituting the gas flow path 40 is formed inside the base portion 20. The gas flow path 42 is formed in the base portion 20 so as to penetrate the base portion 20 along the z-axis direction. The gas flow path 42 is in communication with a gas flow path 43 formed in the joint portion 30.

[0031] The bonding portion 30 bonds the ceramic portion 10 and the base portion 20. The bonding portion 30 is, for example, a bonding sheet containing a silicone-based organic bonding agent, an inorganic bonding agent, or an Al-based metal adhesive. It is desirable for the bonding portion 30 to have high adhesive strength to both the ceramic portion 10 and the base portion 20, as well as high pressure resistance and high thermal conductivity.

[0032] A gas flow channel 43 constituting the gas flow channel 40 is formed inside the joint portion 30. The gas flow channel 43 is formed in the joint portion 30 so as to penetrate the joint portion 30 along the z-axis direction. The gas flow channel 43 communicates with the gas flow channel 41a formed in the ceramic portion 10 and the gas flow channel 42 formed in the base portion 20.

[0033] Next, a method for manufacturing the retaining device 100a of this embodiment will be described. In the method for manufacturing the retaining device 100a, the ceramic part 10 and the base part 20 are manufactured separately, and the separately manufactured ceramic part 10 and base part 20 are joined together by the joining part 30.

[0034] The method for manufacturing the ceramic portion 10 involves preparing a slurry for the green sheet and a metallization paste. The slurry for the green sheet is prepared by, for example, adding an organic solvent to a mixture containing alumina powder, an acrylic binder, a dispersant, a plasticizer, etc., and mixing the mixture using a ball mill. The metallization paste is prepared by, for example, adding a conductive powder such as tungsten or molybdenum to a mixture of alumina powder, an acrylic binder, and an organic solvent, and kneading the mixture.

[0035] The prepared green sheet slurry is formed into a sheet using a casting device, and the formed product is dried. This results in a green sheet. The portions that will become gas flow channels 41a, 41b, and 41c are processed on some of the green sheets. The portions that will become chuck electrode 12 are printed on specific green sheets of the multiple green sheets using a metallization paste, for example, using a screen printing device. Then, multiple green sheets, including the green sheets with the processed portions that will become gas flow channels 41a, 41b, and 41c and the specific green sheets with the printed metallization paste, are stacked to produce a green sheet laminate.

[0036] In the method for manufacturing the ceramic part 10, the ceramic porous body 13 is manufactured separately from the manufacturing of the green sheet laminate. In the method for manufacturing the ceramic porous body 13, first, a roughly cylindrical molded body is manufactured by injection molding using a paste for the ceramic porous body obtained by kneading a mixture containing, for example, alumina powder, a pore-forming material, a binder, an organic solvent, etc. The manufactured molded body is fitted into a portion that will become the gas flow path 41c, which is formed in the green sheet laminate. The green sheet laminate with the fitted molded body is fired in an electric furnace, thereby manufacturing the ceramic part 10 in which the base 11 and the ceramic porous body 13 are integrated. However, the manufacturing method for the ceramic part 10 is not limited to this.

[0037] In the method for manufacturing the base portion 20, a plurality of metal plates are laminated, each of which has been processed to form the portions that will become the coolant flow path 21 and the gas flow path 42. However, the method for manufacturing the base portion 20 is not limited to this.

[0038] In the manufacturing method of the holding device 100a, a bonding sheet that becomes the bonding portion 30 is placed on the surface of either the ceramic portion 10 or the base portion 20, which are manufactured separately. The bonding sheet has a portion that becomes the gas flow path 43, and is arranged to match the portion that becomes the gas flow path 41a of the ceramic portion 10 and the portion that becomes the gas flow path 42 of the base portion 20. For example, the bonding sheet is placed on the surface of the base portion 20, and the ceramic portion 10 and the base portion 20 are sandwiched by the bonding sheet, and the entire assembly is heated, thereby bonding the ceramic portion 10 and the base portion 20 together at the bonding portion 30. In this manner, the holding device 100a is manufactured. However, the manufacturing method of the holding device 100a is not limited to this.

[0039] Next, a method for repairing the holding device 100a, which is a manufacturing method of the holding device of this embodiment, will be described. In the repair method for the holding device 100a, for example, if a crack occurs in the ceramic porous body 13 due to use of the holding device 100a and the ceramic porous body 13 is damaged, the ceramic porous body 13 can be replaced, thereby preventing a decrease in the plasma resistance of the holding device 100a.

[0040] FIG. 5 is a first diagram illustrating a method for repairing a holding device according to this embodiment. In the repair method for the holding device 100a according to this embodiment, prior to the step of arranging an insert member inside the gas flow path 41c (first arranging step), the porous ceramic body 13, which is a porous body arranged inside the gas flow path 41c, is removed from the ceramic part 10 (removing step, indicated by an open arrow R11 in FIG. 5). Specifically, the porous ceramic body 13 arranged inside the gas flow path 41c is cut using a machining center or the like, and the porous ceramic body 13 is removed from the electrostatic chuck 100. In the repair method for the holding device 100a according to this embodiment, the operation of removing the entire porous ceramic body 13 is performed at the boundary between the porous ceramic body 13 and an outer part 14 adjacent to the porous ceramic body 13 in the ceramic part 10. That is, in the removing step according to this embodiment, only the porous ceramic body 13 is removed from the ceramic part 10. As a result, an opening 41d having the same size as the gas flow path 41c is formed.

[0041] 6 is a second diagram illustrating the method for repairing the holding device of this embodiment. After the removal step, as shown in FIG. 6, a fitting member A53 that will become the ceramic porous body 53 is placed in the opening 41d that opens in the surface 10a of the ceramic part 10 in the gas flow path 40 (first placement step, outline arrow R12 shown in FIG. 6). The size of the fitting member A53 is smaller than the size of the ceramic porous body 13. Therefore, when the fitting member A53 is placed inside the opening 41d, a gap Sp1 is formed between the outer wall surface A53a of the fitting member A53 and the inner wall surface 41e of the opening 41d.

[0042] Here, a method for manufacturing the fitting member A53 will be described. The fitting member A53 is manufactured by a method similar to the method for manufacturing the porous ceramic body 13, which is included in the method for manufacturing the ceramic part 10 of the holding device 100a described above. Specifically, a substantially cylindrical fitting compact is manufactured by injection molding using a paste for a porous ceramic body obtained by kneading a mixture containing alumina powder, a pore-forming material, a binder, an organic solvent, etc. The fitting compact is then fired in an electric furnace to manufacture the fitting member A53. The fitting member A53 is a member in which a porous portion is exposed on the surface facing the inner wall surface 41e of the opening 41d when the fitting member A53 is placed inside the opening 41d, i.e., on the outer wall surface A53a.

[0043] FIG. 7 is a third diagram illustrating a method for repairing a retaining device according to this embodiment. After the first disposing step, ceramic powder is disposed between the inner wall surface 41e of the opening 41d and the fitting member A53 (second disposing step, indicated by an open arrow R13 in FIG. 7). The ceramic powder Fc1 disposed in the gap Sp1 between the opening 41d and the fitting member A53 is made of the same type of ceramic as at least one of the ceramic constituting the outer portion 14 of the ceramic portion 10, which is the outer periphery of the opening 41d, and the ceramic constituting the portion of the fitting member A53, including the outer wall surface A53a facing the inner wall surface 41e of the opening 41d. In this embodiment, the ceramic powder Fc1 is made of the same type of ceramic as the ceramic constituting the fitting member A53.

[0044] In the second disposition step, a bonding material F1 containing ceramic powder Fc1 to be placed in the gap Sp1 is prepared. The bonding material F1 is a paste-like material containing ceramic powder Fc1, an organic binder Fb, and a solvent. The organic binder Fb is used to loosely bind the ceramic powder Fc1 particles in the bonding material F1 and prevents the ceramic powder Fc1 placed in the gap Sp1 from passing through the gap Sp1 and falling to the gas flow path 41b. This allows the ceramic powder Fc1 to remain in the gap Sp1. The bonding material F1 is filled into the gap Sp1 by, for example, pressing it in by printing using a squeegee or pouring it using a dispenser.

[0045] FIG. 8 is a fourth diagram illustrating a method for repairing the retaining device of this embodiment. After the second arrangement step, laser light L1 is irradiated between the opening 41d and the fitting member A53 to sinter the ceramic powder Fc1, thereby joining the inner wall surface 41e of the opening 41d and the fitting member A53 (joining step). In the repair method for the retaining device 100a of this embodiment, as shown in FIG. 8, when laser light L1 is irradiated between the opening 41d and the fitting member A53, a shielding plate Sh1 that blocks the irradiated laser light L1 is arranged to cover the fitting member A53 exposed on the surface 10a of the ceramic part 10. This suppresses irradiation of the fitting member A53 with laser light L1, thereby suppressing damage to the fitting member A53 due to the laser light L1, such as melting of porous portions.

[0046] In the bonding process, with the shielding plate Sh1 positioned to cover the fitting member A53, a laser beam L1 is irradiated from the positive side of the z-axis direction onto an area including the fitting member A53 and its periphery. The laser beam L1 that reaches the surface 10a of the ceramic portion 10 without being blocked by the shielding plate Sh1 is irradiated onto the bonding material F1 remaining in the gap Sp1. This increases the temperature of the bonding material F1, causing the organic binder Fb to burn. Furthermore, as the temperature of the bonding material F1 increases due to the irradiation of the laser beam L1, the ceramic powder Fc1 is sintered, bonding the fitting member A53 and the outer portion 14 together. This causes the fitting member A53 to be integrated with the ceramic portion 10.

[0047] In the repair method of the holding device 100a of this embodiment, the laser light L1 in the joining process is irradiated using a continuous wave laser. Specifically, a Ne:YAG laser (wavelength: 1064 nm) is used, and the entire joining material F1 is maintained at a temperature range of 1200°C to 1600°C for 10 seconds to 30 minutes. The temperature of the joining material F1 is detected by a radiation thermometer included in the laser device (not shown) that irradiates the laser light L1. The temperature of the joining material F1 can be adjusted by controlling the output power and scanning speed of the laser light L1. The output power and scanning speed of the laser light L1 are controlled according to the detection result of the radiation thermometer included in the laser device.

[0048] 9 is a second perspective view of the holding device of this embodiment. The holding device 100b shown in FIG. 9 is an electrostatic chuck in which the holding device 100a has been repaired by replacing the ceramic porous body. The holding device 100b includes a ceramic part 50, a base part 20, and a bonding part 30. In the holding device 100b of this embodiment, as shown in FIG. 9, the ceramic part 50, the bonding part 30, and the base part 20 are layered in this order.

[0049] 10 is a second cross-sectional view of the holding device of this embodiment. The ceramic part 50 of the holding device 100b includes a base 11, a chuck electrode 12, and a porous ceramic body 53. The porous ceramic body 53 is disposed in a gas flow path 41c of the holding device 100b. Like the porous ceramic body 13, the porous ceramic body 53 is formed of an insulating ceramic and suppresses discharge that would occur through the gas flow path 40.

[0050] FIG. 11 is an enlarged view of portion B in FIG. 10. FIG. 12 is a second enlarged view of the ceramic portion of the retaining device of this embodiment. The ceramic porous body 53 has an inner portion 531 and an outer peripheral portion 532. The inner portion 531 has a substantially cylindrical shape and is the porous portion that was the fitting member A53. The outer peripheral portion 532 is a substantially cylindrical portion disposed outside the inner portion 531. The outer peripheral portion 532 is a portion where the bonding material F1 filled in the gap Sp1 has been altered by irradiation with laser light L1 in the above-described method for repairing the retaining device 100a. The outer peripheral portion 532 is mainly formed from sintered ceramic powder Fc1 and bonds the inner portion 531 of the ceramic porous body 53 to the outer portion 14 of the base 11. The ceramic porous body 53 corresponds to a "first ceramic porous body" in the claims.

[0051] According to the manufacturing method of the holding device 100b of the present embodiment described above, when manufacturing the ceramic part 50 having the porous ceramic body 53, the ceramic powder Fc1 disposed between the fitting member A53 including the porous ceramic body 53 and the opening 41d of the gas flow path 40 is irradiated with laser light L1 to sinter the ceramic powder Fc1. This bonds the opening 41d to the fitting member A53, making it possible to provide the porous ceramic body 53 in the gas flow path 40 without using an adhesive containing, for example, resin. Therefore, by repairing the ceramic part 10 during use, it is possible to obtain a ceramic part 50 having improved heat resistance while retaining the plasma resistance provided by the porous ceramic body 53, thereby improving the durability of the ceramic part.

[0052] Furthermore, according to the manufacturing method of the holding device 100b of this embodiment, when the laser beam L1 is irradiated between the opening 41d and the fitting member A53 in the joining step, the shielding plate Sh1 is arranged to cover the fitting member A53 (porous ceramic body 53) exposed on the surface 10a of the ceramic part 10, thereby preventing the laser beam L1 from being irradiated onto the fitting member A53. This makes it possible to prevent damage to the fitting member A53 due to the laser beam L1, and therefore allows the fitting member A53 to be joined to the opening 41d while ensuring the flow of inert gas in the porous ceramic body 53.

[0053] Furthermore, according to the manufacturing method of the retaining device 100b of this embodiment, the ceramic powder Fc1 disposed between the fitting member A53 and the opening 41d is made of the same type of ceramic as the ceramic that forms the outer portion 14. As a result, when the ceramic powder Fc1 is sintered, it becomes integrated with the opening 41d, and therefore the opening 41d and the fitting member A53 can be joined relatively firmly.

[0054] Furthermore, according to the manufacturing method of the holding device 100b of this embodiment, when forming the opening 41d for arranging the fitting member A53, a portion including the entire porous ceramic body 13 disposed inside the gas flow path 41c is hollowed out from the ceramic part 10. As a result, even if a crack or the like occurs in the porous ceramic body 13 and replacement is required, for example, by replacing a portion of the ceramic part 10, the plasma resistance of the replaced ceramic part 50 can be restored to the state it was in when the ceramic part 10 was first used. Therefore, the durability of the holding devices 100a, 100b using the ceramic parts 10, 50 can be improved.

[0055] Furthermore, according to the manufacturing method of the retaining device 100b of this embodiment, when forming the opening 41d for arranging the fitting member A53, the porous ceramic body 13 is removed from the boundary between the porous ceramic body 13 and the outer portion 14 adjacent to the porous ceramic body 13, as shown in Fig. 5. This makes it possible to reduce the size of the portion of the ceramic part 10 to be replaced.

[0056] Furthermore, according to the manufacturing method of the holding device 100b of this embodiment, the fitting member A53 is a member in which the ceramic porous body 53 is exposed. This allows the fitting member A53 to be prepared relatively inexpensively.

[0057] Second Embodiment Fig. 13 is a first diagram illustrating a method for manufacturing a retaining device of this embodiment. Fig. 14 is a second diagram illustrating a method for manufacturing a retaining device of this embodiment. Fig. 15 is a third diagram illustrating a method for manufacturing a retaining device of this embodiment. Fig. 16 is a fourth diagram illustrating a method for repairing a retaining device of this embodiment. The method for manufacturing a retaining device of the second embodiment differs from the method for manufacturing a retaining device of the first embodiment (Figs. 5 to 8) in that, when repairing the retaining device, a portion including a ceramic porous body is removed and an inserting member including a ceramic porous body is disposed.

[0058] In the repair method for the holding device 100a of the present embodiment, in order to replace the ceramic porous body 13 of the holding device 100a, the outer portion 14 adjacent to the ceramic porous body 13 is removed (removal step, indicated by an outline arrow R21 in FIG. 13 ) from the outside of the ceramic porous body 13, as shown in FIG. 13 . As a result, an opening 41d larger than the size of the gas flow path 41c is formed in the ceramic part 10 after the removal of the ceramic porous body 13 and the outer portion 14, as shown in FIG. 13 . A method for removing the ceramic porous body 13 and the outer portion 14 from the ceramic part 10 includes, but is not limited to, cutting the ceramic porous body 13 and the outer portion 14 to be replaced using a machining center, as in the first embodiment.

[0059] Fig. 14 is a second diagram illustrating a manufacturing method of the holding device of this embodiment. After the removing step, as shown in Fig. 14, an inserting member A63 that becomes the ceramic porous body 63 is placed in the opening 41d that opens in the surface 10a of the ceramic part 10 in the gas flow path 40 (first placing step, white arrow R22 shown in Fig. 14). The ceramic porous body 63 corresponds to the "first ceramic porous body" in the claims.

[0060] In the method for repairing a holding device according to this embodiment, a fitting member A63 corresponding to the porous ceramic body 13 and outer portion 14 removed from the ceramic portion 10 in the removal step is manufactured before the first arrangement step. In the manufacturing method for the fitting member A63, first, a base material composed of one green sheet or a laminate of two or more green sheets is prepared. The base material may be, for example, sized to correspond to the portion removed from the ceramic portion 10 in the removal step, or may be sized to allow for the simultaneous manufacture of multiple fitting members A63. A through hole penetrating the prepared base material in the thickness direction of the base material is formed. Next, the through hole formed in the base material is filled with a paste for a porous ceramic body, as described in the manufacturing method for the porous ceramic body 13 according to the first embodiment. Examples of methods for filling the through hole with the paste for a porous ceramic body include a method using an injection molding device and a method using a screen printing device. Next, the base material with the through-holes filled with the paste for the porous ceramic body is fired at a predetermined temperature and processed to adjust the shape, thereby producing the fitting member A63. In the manufacturing of the fitting member A63 of this embodiment, the paste for the porous ceramic body and the green sheet of the base material are fired to be integrated with each other by solid-state bonding. The manufacturing method of the fitting member A63 is not limited thereto. For example, a tubular alumina pressed body may be formed by using a mold with a double-tube structure having a concentric cross section, filling the space between the inner and outer tubes with alumina powder capable of forming dense alumina, and then filling the tubular alumina pressed body with the paste for the porous ceramic body and firing the tubular alumina pressed body to produce the fitting member A63. Alternatively, the fitting member A63 may be manufactured by manufacturing a compact using alumina powder containing a pore-forming material, wrapping a dense green sheet around the outer periphery of the manufactured compact, and then firing the compact.

[0061] 14, the fitting member A63 of this embodiment has a porous portion A631 corresponding to the ceramic porous body 13 and a relatively dense layer A632 corresponding to the outer portion 14. In this embodiment, the dense layer A632 is formed to be smaller than the outer portion 14. Therefore, when the fitting member A63 is placed inside the opening 41d, a gap Sp2 is formed between the outer wall surface A63a of the fitting member A63 and the inner wall surface 41e of the opening 41d, which is the inner wall surface of the base 11 exposed when the outer portion 14 is removed.

[0062] 15 is a third diagram illustrating the method for repairing the retaining device of this embodiment. After the first disposing step, a bonding material F2 containing ceramic powder Fc2 is disposed between the inner wall surface 41e of the opening 41d and the fitting member A63 (second disposing step, white arrow R23 shown in FIG. 15). In this embodiment, the ceramic powder Fc2 is composed of the same type of ceramic as the ceramic that constitutes the base portion 11, which is also the ceramic that constitutes the outer periphery of the opening 41d in the ceramic portion 10.

[0063] FIG. 16 is a fourth diagram illustrating a method for repairing the holding device of this embodiment. After the second arrangement step, as shown in FIG. 16, laser light L2 is irradiated between the opening 41d and the fitting member A63 to melt the ceramic powder Fc2, thereby joining the inner wall surface 41e of the opening 41d and the fitting member A63 (joining step). As a result, the fitting member A63 is integrated with the ceramic part 10. In the repair method for the holding device 100a of this embodiment, as shown in FIG. 16, when laser light L2 is irradiated between the opening 41d and the fitting member A63, a shielding plate Sh2 that blocks the irradiated laser light L2 is arranged so as to cover the porous part A631 of the fitting member A63 that is exposed on the surface 10a of the ceramic part 10. This suppresses irradiation of the porous part A631 with the laser light L2, thereby suppressing damage to the porous part A631 due to the laser light L2.

[0064] In the repair method for the holding device 100a of this embodiment, the laser light L2 in the joining step is irradiated using a pulsed laser. Specifically, the laser light L2 is irradiated using a Ne:YAG laser (wavelength: 1064 nm). In irradiating the laser light L2, the spot diameter of the laser light L2 is set to φ50 μm, and the pulse time is set to 100 nanoseconds or less. In irradiating the laser light L2, by adjusting at least one of the output, frequency, and scanning speed, it is possible to suppress the occurrence of cracks that tend to occur when the melted portion solidifies.

[0065] Fig. 17 is a perspective view of a holding device of this embodiment. The holding device 200b shown in Fig. 17 is an electrostatic chuck that has been repaired by replacing the ceramic porous body. The holding device 200b includes a ceramic part 60, a base part 20, and a bonding part 30. In the holding device 200b of this embodiment, as shown in Fig. 17, the ceramic part 50, the bonding part 30, and the base part 20 are stacked in this order. In Fig. 17, the x-axis, y-axis, and z-axis are shown, as in Fig. 1.

[0066] Fig. 18 is a cross-sectional view of the holding device of this embodiment. Fig. 19 is an enlarged view of part C in Fig. 18. The ceramic part 60 included in the holding device 200b shown in Figs. 18 and 19 includes a base part 11, a chuck electrode 12, a ceramic porous body 63, a porous body peripheral part 64, and a joint part 65.

[0067] The porous ceramic body 63 is disposed in the holding device 200b at a position corresponding to the gas flow path 41c of the holding device 100a. Like the porous ceramic body 13, the porous ceramic body 63 is formed of insulating ceramic and suppresses discharges that take the gas flow path 40 as a discharge path. The porous ceramic body 63 is the porous portion A631 of the fitting member A63.

[0068] The porous body peripheral portion 64 is formed so as to surround the porous ceramic body 63. The porous body peripheral portion 64 is a portion that is denser than the porous ceramic body 63. The porous body peripheral portion 64 is a dense layer A632 of the fitting member A63.

[0069] The joining portion 65 is formed to surround the porous body peripheral portion 64. The joining portion 65 contains ceramic powder Fc2 that is melted by irradiation with laser light L2 in the joining step of the above-described method for repairing the holding device 100a. The ceramic powder Fc2 is made of the same type of ceramic as the ceramic that makes up the base 11, and therefore has a relatively strong joining strength with the base 11.

[0070] According to the manufacturing method of the holding device 200b of this embodiment described above, when manufacturing the ceramic part 60 having the porous ceramic body 63, the ceramic powder Fc2 disposed between the fitting member A63 including the porous ceramic body 63 disposed in the opening 41d of the gas flow path 40 and the opening 41d is irradiated with laser light L2 to melt the ceramic powder Fc2. This allows the opening 41d to be joined to the fitting member A63 without using an adhesive containing resin or the like. Therefore, by repairing the ceramic part 10 during use, it is possible to obtain a ceramic part 60 having improved heat resistance while maintaining the plasma resistance provided by the porous ceramic body 63, thereby improving the durability of the ceramic part.

[0071] Furthermore, according to the manufacturing method of the retaining device 200b of this embodiment, when forming the opening 41d for arranging the fitting member A63, the opening 41d is hollowed out including the outer portion 14 adjacent to the porous ceramic body 13. This makes it possible to suppress damage to the porous ceramic body 63 by the laser beam L2 when the fitting member A63 including the porous ceramic body 63 is joined to the opening 41d by irradiating the laser beam L2.

[0072] Furthermore, according to the manufacturing method of the retaining device 200b of this embodiment, when forming the opening 41d for disposing the fitting member A63, the opening 41d is hollowed out including the outer portion 14 adjacent to the porous ceramic body 13. This makes it difficult for the ceramic powder Fc2 to enter the porous portion A631 of the fitting member A63, which will become the porous ceramic body 63, when disposing the ceramic powder Fc2 in the second disposing step. Therefore, the gas permeability of the porous ceramic body 63 can be maintained.

[0073] Furthermore, according to the manufacturing method of the holding device 200b of this embodiment, a member provided with a dense layer A632 that is denser than the porous ceramic body 63 is used as the fitting member A63. This makes it possible to suppress damage to the porous ceramic body 63 by the laser beam L2 when the fitting member A63 including the porous ceramic body 63 is joined to the opening 41d by irradiating it with the laser beam L2. Therefore, the plasma resistance of the holding device 200b can be restored to its initial state.

[0074] <Modification of this embodiment> The present invention is not limited to the above-described embodiment, and can be embodied in various forms without departing from the spirit of the invention. For example, the following modifications are also possible.

[0075] [Variation 1] In the first embodiment, the inner wall surface 41e of the opening 41d and the fitting member A53 are joined by sintering the ceramic powder Fc1. In the second embodiment, the inner wall surface 41e of the opening 41d and the fitting member A63 are joined by melting the ceramic powder Fc2. In the first embodiment, the ceramic powder Fc1 may be melted, and in the second embodiment, the ceramic powder Fc2 may be sintered. Alternatively, the opening and the fitting member may be joined by sintering and melting simultaneously. In the first embodiment, the ceramic powder Fc1 may be sintered by irradiating with a pulsed laser, and in the second embodiment, a portion of the ceramic powder Fc2 may be melted by continuous laser irradiation.

[0076] [Variation 2] In the above-described embodiment, a shielding plate is used in the joining process to prevent the laser light from being irradiated onto the porous portion of the fitting member. Although the shielding plate is not necessary, the use of the shielding plate suppresses the laser light from being irradiated onto the porous portion of the fitting member, thereby suppressing damage to the porous portion by the laser light.

[0077] [Variation 3] In the first embodiment, the ceramic powder Fc1 is made of the same type of ceramic as the ceramic that constitutes the outer portion 14 of the base 11. In the second embodiment, the ceramic powder Fc2 is made of the same type of ceramic as the ceramic that constitutes the base 11. The type of ceramic that constitutes the ceramic powder that joins the fitting member and the opening is not limited to this.

[0078] [Variation 4] In the above embodiment, the bonding material filled in the gap between the opening 41d and the fitting member includes ceramic powder, an organic binder, and a solvent. The organic binder and the solvent may be omitted. For example, only ceramic powder may be filled.

[0079] [Variation 5] In the above-described embodiment, the method for repairing the electrostatic chuck involves bonding the inner wall surface of the opening to the fitting member including the porous ceramic body by irradiating the opening with laser light. When manufacturing a new electrostatic chuck, laser light may be irradiated to bond the porous ceramic body to the base. This allows the manufacture of an electrostatic chuck that is plasma-resistant and heat-resistant.

[0080] [Variation 6] In the above-described embodiment, the holding device includes a ceramic portion made of ceramic, a base portion made mainly of metal, and a joining portion joining the ceramic portion and the base portion. The configuration of the holding device is not limited to this. The entire holding device may be made of ceramic, or may be made of a composite material of ceramic and metal.

[0081] This aspect has been described above based on embodiments and modifications. However, the above-described embodiments are intended to facilitate understanding of this aspect and are not intended to limit this aspect. This aspect may be modified or improved without departing from the spirit and scope of the claims, and equivalents thereof are included in this aspect. Furthermore, if a technical feature is not described as essential in this specification, it may be deleted as appropriate.

[0082] <Application example 1> A method for manufacturing a ceramic part used in a holding device for holding an object, comprising: the ceramic part is mainly composed of ceramic, has a gas flow path formed therein, and has a first ceramic porous body within the gas flow path; The manufacturing method includes: a fitting member including the first ceramic porous body is placed in an opening of the gas flow path that opens on a surface of the ceramic part, and ceramic powder is placed between the inner wall surface of the opening and the fitting member; a laser beam is irradiated between the opening and the fitting member to sinter or melt the ceramic powder, thereby bonding the inner wall surface of the opening and the fitting member; Manufacturing methods for ceramic parts. <Application example 2> A method for producing a ceramic part according to Application Example 1, When a laser beam is irradiated between the opening and the fitting member, a shielding plate that blocks the irradiated laser beam is disposed so as to cover the first ceramic porous body exposed on the surface of the ceramic component. Manufacturing methods for ceramic parts. <Application example 3> A method for producing a ceramic part according to Application Example 1 or Application Example 2, the ceramic powder is made of the same kind of ceramic as at least one of the ceramic that constitutes the outer periphery of the opening in the ceramic part and the ceramic that constitutes a portion of the fitting member that includes a surface facing the inner wall surface of the opening within the opening, Manufacturing methods for ceramic parts. <Application Example 4> A method for producing a ceramic part according to any one of Application Examples 1 to 3, the opening is formed by hollowing out a portion of the ceramic component that includes the entire second ceramic porous body, which is a porous body disposed in the gas flow path, prior to the step of arranging the fitting member in the opening. Manufacturing methods for ceramic parts. <Application example 5> A method for producing a ceramic part according to any one of Application Examples 1 to 4, the operation of hollowing out the portion including the entire second ceramic porous body is performed at a boundary between the second ceramic porous body and an outer portion of the ceramic component adjacent to the second ceramic porous body. Manufacturing methods for ceramic parts. <Application Example 6> A method for producing a ceramic part according to any one of Application Examples 1 to 5, the operation of hollowing out the portion including the entire second ceramic porous body is performed so as to hollow out an outer portion of the ceramic component that is adjacent to the second ceramic porous body on the outside of the second ceramic porous body. Manufacturing methods for ceramic parts. <Application Example 7> A method for producing a ceramic part according to any one of Application Examples 1 to 6, the fitting member is a member in which the first ceramic porous body is exposed on a surface that faces an inner wall surface of the opening when the fitting member is placed in the opening. Manufacturing methods for ceramic parts. <Application Example 8> A method for producing a ceramic part according to any one of Application Examples 1 to 7, The fitting member is a member having a dense layer that is denser than the first ceramic porous body on a surface that faces the inner wall surface of the opening when the fitting member is placed in the opening. Manufacturing methods for ceramic parts. [Explanation of symbols]

[0083] 10, 50, 60...Ceramic section 10a…Surface 13, 53, 63...Porous ceramic 14...Outer part 40, 41a, 41b, 41c, 42, 43...Gas flow paths 41d...Opening 41e...Inner wall surface (of opening) 100a,100b,200b…holding device A53, A63...Fitting parts A53a, A63a...exterior wall A632…Dense layer Fc1, Fc2...laser light L1, L2...Laser light Sh1,Sh2…shielding plate W...wafer

Claims

1. A method for manufacturing a ceramic part used in a holding device for holding an object, comprising: the ceramic part is mainly composed of ceramic, has a gas flow path formed therein, and has a first ceramic porous body within the gas flow path; The manufacturing method includes: a fitting member including the first ceramic porous body is placed in an opening of the gas flow path that opens on a surface of the ceramic component, and ceramic powder is placed between an inner wall surface of the opening and the fitting member; a laser beam is irradiated between the opening and the fitting member to sinter or melt the ceramic powder, thereby bonding the inner wall surface of the opening and the fitting member; Manufacturing methods for ceramic parts.

2. 2. A method for manufacturing a ceramic part according to claim 1, comprising: a shielding plate for blocking the irradiated laser light when irradiating the laser light between the opening and the fitting member, the shielding plate being disposed so as to cover the first ceramic porous body exposed on the surface of the ceramic component; Manufacturing methods for ceramic parts.

3. 2. A method for manufacturing a ceramic part according to claim 1, comprising: the ceramic powder is made of the same kind of ceramic as at least one of the ceramic that constitutes the outer periphery of the opening in the ceramic part and the ceramic that constitutes a portion of the fitting member that includes a surface facing the inner wall surface of the opening within the opening, Manufacturing methods for ceramic parts.

4. 2. A method for manufacturing a ceramic part according to claim 1, comprising: the opening is formed by hollowing out a portion of the ceramic component that includes the entire second ceramic porous body, which is a porous body disposed in the gas flow path, prior to the step of arranging the fitting member in the opening. Manufacturing methods for ceramic parts.

5. 5. The method for manufacturing a ceramic part according to claim 4, the operation of hollowing out the portion including the entire second ceramic porous body is performed at a boundary between the second ceramic porous body and an outer portion of the ceramic component adjacent to the second ceramic porous body. Manufacturing methods for ceramic parts.

6. 5. The method for manufacturing a ceramic part according to claim 4, the operation of hollowing out the portion including the entire second ceramic porous body is performed so as to hollow out an outer portion of the ceramic component that is adjacent to the second ceramic porous body on the outside of the second ceramic porous body. Manufacturing methods for ceramic parts.

7. 2. A method for manufacturing a ceramic part according to claim 1, comprising: the fitting member is a member in which the first ceramic porous body is exposed on a surface that faces an inner wall surface of the opening when the fitting member is placed in the opening. Manufacturing methods for ceramic parts.

8. 2. A method for manufacturing a ceramic part according to claim 1, comprising: the fitting member is a member having a dense layer that is denser than the first ceramic porous body on a surface that faces an inner wall surface of the opening when the fitting member is placed in the opening. Manufacturing methods for ceramic parts.

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