Display panel, method for manufacturing display panel, and display device

Abstract

A display panel, a method for manufacturing the display panel, and a display device are provided.SOLUTION: The display panel 10 includes a substrate 100, a pixel defining layer 200 disposed on a side of the substrate 100 and including a pixel defining portion 210 and a pixel opening 220 formed by the pixel defining portion 210, an isolating structure 300 disposed on the side of the substrate 100 and including an isolating opening 301 communicating with the pixel opening 220, and a light emitting device 400 at least partially located in the pixel opening 220, wherein a side of the pixel defining portion 210 exposed from at least a portion of the isolating opening 301 away from the substrate 100 has a recessed structure side 10a.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present application belongs to the technical field of displays, and in particular to a display panel, a manufacturing method for a display panel, and a display device. [Background technology]

[0002] Flat panel displays based on technologies such as organic light emitting diodes (OLEDs) and light emitting diodes (LEDs) have advantages such as high image quality, low power consumption, a thin body, and a wide range of applications. As a result, they are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers, and have become the mainstream display device.

[0003] However, the process performance of current OLED display products needs to be improved. Summary of the Invention [Problem to be solved by the invention]

[0004] The embodiments of the present application provide a display panel, a manufacturing method for the display panel, and a display device for improving the display effect of the display panel. [Means for solving the problem]

[0005] An embodiment of a first aspect of the present application provides a display panel including: a substrate; a pixel defining layer provided on one side of the substrate, the pixel defining layer having a pixel limiting portion and a pixel opening formed by being surrounded and closed by the pixel limiting portion; an isolation structure provided on one side of the substrate, the isolation structure having an isolation opening communicating with the pixel opening; and a light-emitting element, at least a portion of which is located within the pixel opening, wherein the pixel limiting portion exposed from at least a portion of the isolation opening has a recess structure on a side away from the substrate.

[0006] An embodiment of the first aspect of the present application further provides a display panel comprising: a substrate; an isolation structure provided on one side of the substrate, with an isolation opening; a conductive portion having a first isolation portion and a second protrusion provided on a side of the first isolation portion facing the substrate and protruding from the first isolation portion toward the isolation opening; and a light-emitting element at least a portion of which is located within the isolation opening, wherein at least a portion of the second protrusion of the conductive portion has a recess structure on a side away from the substrate.

[0007] An embodiment of a second aspect of the present application provides a method for manufacturing a display panel, including forming an isolation material layer on a substrate, opening first and second openings through the isolation material layer, disposing a first type of element in the first opening, fabricating a second type of element in the second opening, the second type of element having an emission color different from that of the first type of element, opening a third opening through the isolation material layer, and disposing a third type of element in the third opening. [Effects of the Invention]

[0008] In a display panel according to an embodiment of the present application, the display panel comprises a substrate, a pixel defining layer, an isolation structure, and a light-emitting element. The pixel defining layer comprises a pixel limiting portion and a pixel opening formed by the pixel limiting portion surrounding and enclosing the pixel limiting portion, at least a portion of the light-emitting element is located within the pixel opening. The isolation structure is provided on one side of the substrate and surrounds and defines an isolation opening communicating with the pixel opening. Both the pixel defining layer and the isolation structure can be used to define sub-pixels of the display panel. At least a portion of the pixel limiting portion exposed within the isolation opening has a recessed structure on a side away from the substrate, which can improve the display effect of the display panel. [Brief explanation of the drawings]

[0009] In order to more clearly explain the technical aspects in the embodiments of the present application, the drawings that need to be used in the embodiments of the present application will be briefly introduced below. However, the drawings described below are only some embodiments of the present application, and it is obvious that a person skilled in the art can further obtain other drawings according to these drawings without paying any creative labor.

[0010] [Figure 1] 1 is a partial schematic diagram of an isolation structure according to an embodiment of the present application; [Figure 1a] FIG. 2 is a partial schematic diagram of a pixel definition layer according to an embodiment of the present application. [Figure 2] FIG. 2 is a partial cross-sectional view of a display panel according to an embodiment of the present application. [Figure 2a] FIG. 2 is a partially enlarged cross-sectional view of a display panel according to an embodiment of the present application. [Figure 3] FIG. 10 is a partial cross-sectional view of a display panel according to another embodiment of the present application. [Figure 3a] FIG. 10 is a partially enlarged cross-sectional view of a display panel according to another embodiment of the present invention. [Figure 4] FIG. 10 is a partial cross-sectional view of a display panel according to yet another embodiment of the present application. [Figure 5] FIG. 10 is a partial cross-sectional view of a display panel according to still another embodiment of the present application. [Figure 6] FIG. 10 is a partial cross-sectional view of a display panel according to a further embodiment of the present application. [Figure 7] FIG. 10 is a partial cross-sectional view of a display panel according to a further embodiment of the present application. [Figure 8] FIG. 10 is a partial cross-sectional view of a display panel according to a further embodiment of the present application. [Figure 9] 1A to 1C are schematic diagrams illustrating a flow of a method for manufacturing a display panel according to an embodiment of the present application. [Figure 10] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 11] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 12] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 13] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 14] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 15] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 16]1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 17] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 18] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 19] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 20] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 21] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 22] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 23] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 24] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 25] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 26] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 27] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 28] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 29] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 30] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 31] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 32] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 33] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 34] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 35] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 36] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 37] 1A to 1C are schematic diagrams illustrating a flow of a method for manufacturing a display panel according to an embodiment of the present application. [Figure 38] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 39] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 40] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 41] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 42] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 43] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. [Figure 44] 1A to 1C are schematic diagrams illustrating a manufacturing process of a display panel manufacturing method according to an embodiment of the present application. DETAILED DESCRIPTION OF THE INVENTION

[0011] As used herein, relational terms such as "first," "second," etc., are merely intended to distinguish one entity or operation from another and do not necessarily require or imply the existence of any such actual relationship or ordering between those entities or operations. Furthermore, the terms "comprise," "include," or any other variation thereof are intended to cover non-exclusive inclusions, such that a process, method, article, or device comprising a series of elements includes not only those elements but also other elements not expressly listed or inherent in such process, method, article, or device. Absent further limitations, elements qualified by the phrase "comprising" do not exclude the presence of additional identical elements in the process, method, article, or device that includes the elements.

[0012] When describing the structure of a component, a layer or region is referred to as being located "on" or "above" another layer or region, which may mean that the layer or region is located directly on top of the other layer or region, or that there are other layers or regions between the layer or region and the other layer or region. Furthermore, when the component is inverted, the layer or region is located "below" or "below" the other layer or region.

[0013] The embodiments of the present application provide a display panel, a manufacturing method of a display panel, and a display device. Hereinafter, the embodiments of the display panel, the manufacturing method of a display panel, and the display device will be described in conjunction with the drawings.

[0014] FIG. 1 is a partial schematic view of an isolation structure 300 according to an embodiment of the present disclosure, FIG. 1a is a partial schematic view of a pixel definition layer 200 according to an embodiment of the present disclosure, FIG. 2 is a partial cross-sectional view of a display panel 10 according to an embodiment of the present disclosure, and FIG. 2a is a partial enlarged cross-sectional view of the display panel 10 according to an embodiment of the present disclosure. In particular, FIG. 2a may be a partial enlarged view of the second opening 301b in FIG. 2. The partial cross-sectional view of the display panel 10 showing the first opening 301a, the second opening 301b, and the third opening 301c according to the present disclosure may be a cross-sectional view of the AA portion in FIG. 1.

[0015] As shown in Figures 1, 1a, 2 and 2a, an embodiment of a first aspect of the present application provides a display panel 10 including: a substrate 100; a pixel defining layer 200 provided on one side of the substrate 100, the pixel defining layer 200 having a pixel limiting portion 210 and a pixel opening 220 formed by being surrounded and closed by the pixel limiting portion 210; an isolation structure 300 provided on one side of the substrate 100, the isolation structure 300 having an isolation opening 301 communicating with the pixel opening 220; and a light-emitting element 400 at least a portion of which is located within the pixel opening 220, wherein at least a portion of the pixel limiting portion 210 exposed from the isolation opening 301 has a recess structure 10a on a side away from the substrate 100.

[0016] In the display panel according to the embodiment of the present application, the display panel 10 includes a substrate 100, a pixel defining layer 200, an isolation structure 300, and a light-emitting element 400. The pixel defining layer 200 includes a pixel limiting portion 210 and a pixel opening 220 formed by being surrounded and closed by the pixel limiting portion 210. At least a portion of the light-emitting element 400 is located within the pixel opening 220. The isolation structure 300 is provided on one side of the substrate 100, and the isolation structure 300 includes an isolation opening 301 communicating with the pixel opening 220. Both the pixel defining layer 200 and the isolation structure 300 can be used to define sub-pixels of the display panel 10.

[0017] Preferably, the configuration, manufacturing, etc. of the isolation structure 300 are further described in Patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 100935, PCT / CN2024 / 102785, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN116685174A, which are hereby incorporated by reference.

[0018] The number of the isolation openings 301 is plural, and each isolation opening 301 communicates with at least one pixel opening 220 .

[0019] Preferably, the isolation structure 300 may be provided on the side of the pixel limiting portion 210 that is away from the substrate 100 .

[0020] Of these, the pixel limiting portion 210 exposed from at least a part of the isolating opening 301 has a recess structure 10a on the side away from the substrate 100.

[0021] In some embodiments of the present application, the substrate 100 may be provided in a variety of ways. For example, the substrate 100 may include a substrate 110 and a driving circuit 150 provided on the substrate 110. Preferably, the substrate 100 includes a first insulating layer 120, a second insulating layer 130, and a third insulating layer 140, which are stacked one on top of the other. For example, the driving circuit 150 may include a transistor 151, a storage capacitor 152, and driving signal lines for connecting the elements. The transistor 151 includes a semiconductor, a gate electrode 151a, and a source / drain electrode 151b. The storage capacitor 152 includes a first electrode plate 152a and a second electrode plate 152b. As an example, the gate electrode 151a and the first electrode plate 152a may be located on the side of the first insulating layer 120 facing the substrate 110, the second electrode plate 152b may be located between the first insulating layer 120 and the second insulating layer 130, and the source / drain electrode 151b may be located between the second insulating layer 130 and the third insulating layer 140.

[0022] In some preferred embodiments, the light emitting element 400 comprises a first electrode 410, a light emitting layer 420, and a second electrode 430, which are stacked in this order away from the substrate 100.

[0023] Preferably, the light-emitting layer 420 may include a hole-injection layer (HIL), a hole-transport layer (HTL), a light-emitting structure, an electron-injection layer (EIL), and an electron-transport layer (ETL).

[0024] Preferably, the first electrode 410 and the second electrode 430 can be pixel electrodes of the display panel 10, one of which serves as an anode and the other as a cathode to drive the light emitting unit to emit light. In the embodiment of the present application, the first electrode 410 is an anode of the display panel 10, and the second electrode 430 is a cathode of the display panel 10.

[0025] In some embodiments of the present application, the isolation structure 300 and the pixel definition layer 200 may both have a mesh-like structure, and the cutout areas in the mesh-like isolation structure 300 may form isolation openings 301, and the cutout areas in the mesh-like pixel definition layer 200 may form pixel openings 220.

[0026] In some preferred embodiments, the isolation structure 300 includes a first isolation portion 310 and a second isolation portion 320 located on a side of the first isolation portion 310 that faces away from the substrate, and the second isolation portion 320 may be provided to protrude from the first isolation portion 310 toward the isolation opening 301. For example, the second isolation portion 320 includes a first protrusion 321 that protrudes from the first isolation portion 310 toward the isolation opening 301.

[0027] By providing the second isolation portion 320 so as to protrude from the first isolation portion 310 toward the isolation opening 301, when manufacturing the light-emitting element 400 of the display panel 10, the material of the light-emitting element 400 (e.g., the material of the light-emitting layer 420 and the material of the second electrode 430) can be directly deposited over the entire surface, and the second isolation portion 320 can block at least a portion of the material used to manufacture the light-emitting element 400 and block the material of the light-emitting element 400 between adjacent sub-pixels. This allows for the formation of multiple light-emitting elements 400 that are spaced apart and located in different isolation openings 301. This eliminates the need to provide a highly accurate mask plate when manufacturing the light-emitting element 400 of the display panel 10. For example, it eliminates the need to provide a fine metal mask plate (FMM) when depositing the material of the light-emitting element 400. This effectively reduces the production and manufacturing costs of the display panel 10.

[0028] In some preferred embodiments, the material of the isolation structure 300 may include a conductive material, and the second electrode 430 may be connected to the isolation structure 300, so that the second electrodes 430 of adjacent subpixels can be electrically connected through the isolation structure 300, and the second electrodes 430 are easy to control.

[0029] In some preferred embodiments, the isolation structure 300 further includes a conductive portion 330 provided on a side of the first isolation portion 310 facing the substrate 100, and the conductive portion 330 protrudes from the first isolation portion 310 toward the isolation opening 301. For example, the conductive portion 330 includes a second protrusion 331 protruding from the first isolation portion 310 toward the isolation opening 301.

[0030] Preferably, the second electrode 430 is connected to the second protrusion 331 .

[0031] In these preferred embodiments, the conductive portion 330 is arranged to protrude from the first isolation portion 310 toward the isolation opening 301, thereby allowing the conductive portion 330 to have a large area for connection to the second electrode 430, making it easier to achieve electrical connection between the second electrode 430 and the isolation structure 300.

[0032] Preferably, the second electrode 430 may be connected to the first isolation portion 310, so that the second electrodes 430 of adjacent sub-pixels can also be electrically connected via the first isolation portion 310.

[0033] Preferably, the orthogonal projection of the conductive portion 330 on the substrate 100 may be located within the orthogonal projection of the second isolation portion 320 on the substrate 100, thereby allowing the second isolation portion 320 to have sufficient dimensions and further improving the shielding ability of the second isolation portion 320 against the material of the light-emitting element 400.

[0034] In some preferred embodiments, the isolation opening 301 includes a first opening 301a and a second opening 301b, and the light-emitting element 400 includes a first type element 401 corresponding to the first opening 301a and a second type element 402 corresponding to the second opening 301b.

[0035] The first-type element 401 provided corresponding to the first opening 301a may mean that the first-type element 401 can be positioned at least partially within the first opening 301a. Preferably, the second-type element 402 provided corresponding to the second opening 301b may mean that the second-type element 402 can be positioned at least partially within the second opening 301b.

[0036] In order to realize color display on the display panel 10, the first kind elements 401 and the second kind elements 402 emit light of different colors.

[0037] Preferably, the isolation opening 301 may further include a third opening 301c, and the light emitting element 400 includes a third type element 403 provided corresponding to the third opening 301c.

[0038] The third-type element 403 provided corresponding to the third opening 301c may mean that the third-type element 403 can be positioned at least partially within the third opening 301c.

[0039] In order to realize color display on the display panel 10, the first kind elements 401, the second kind elements 402, and the third kind elements 403 emit light of different colors.

[0040] For example, the first kind element 401 is a light emitting element 400 that emits blue light, the second kind element 402 is a light emitting element 400 that emits green light, and the third kind element 403 is a light emitting element 400 that emits red light.

[0041] In some embodiments of the present application, the shielding effect of the isolation structure 300 on the light emitting element 400 can be utilized to realize the independent fabrication of light emitting elements 400 of different colors.

[0042] In some preferred embodiments, the isolation structure 300 can be used to fabricate the first type element 401 and the second type element 402, respectively.

[0043] Specifically, the first opening 301a and the second opening 301b can be simultaneously fabricated. Then, the material of the first-type elements 401 can be deposited over the entire surface, with the isolation structure 300 blocking some of the material of the first-type elements 401. Then, the material of the first-type elements 401 outside the first opening 301a is removed to form the first-type elements 401 that correspond to the first opening 301a. Then, the material of the second-type elements 402 is deposited over the entire surface, with the isolation structure 300 blocking some of the material of the second-type elements 402. Then, the material of the second-type elements 402 outside the second opening 301b is removed to form the second-type elements 402 that correspond to the second opening 301b.

[0044] Preferably, in the step of removing the material of the first type element 401 outside the first opening 301a, the etching material can etch to a certain extent the pixel limiting portion 210 exposed from within the isolation openings 301 other than the first opening 301a, thereby forming a recess structure 10a.

[0045] In some preferred embodiments, the pixel limiting portion 210 exposed through the second opening 301b may have a recess structure 10a on the side facing away from the substrate 100.

[0046] In this preferred embodiment, in the step of removing the material of the first type element 401 outside the first opening 301a, the etching material can etch to a certain extent the pixel limiting portion 210 exposed from within the second opening 301b, thereby forming a recess structure 10a.

[0047] Preferably, the pixel limiting portion 210 exposed from the first opening 301a has a first flat surface 10b on the side that faces away from the substrate 100. The pixel limiting portion 210 exposed from the first opening 301a has no recessed structure on the side that faces away from the substrate 100.

[0048] Preferably, the pixel limiting portion 210 exposed through the third opening 301c has a recessed structure 10a or a first flat surface 10b on the side facing away from the substrate 100.

[0049] Among these, when the third opening 301c is manufactured simultaneously with the first opening 301a and the second opening 301b, in the step of removing the material of the first-type elements 401 outside the first opening 301a and the step of removing the material of the second-type elements 402 outside the second opening 301b, the etching material can etch to some extent the pixel limiting portion 210 exposed from inside the third opening 301c and form the recess structure 10a, which makes it possible to have the recess structure 10a on the side of the pixel limiting portion 210 exposed from the third opening 301c that is away from the substrate 100.

[0050] When the third opening 301c is manufactured independently from the other isolation openings 301, for example, when the third opening 301c is manufactured after the first type elements 401 and the second type elements 402 have been manufactured, the pixel limiting portion 210 exposed from within the third opening 301c is less susceptible to the effects of the etching material, and as a result, the first flat surface 10b is present on the side of the pixel limiting portion 210 exposed from the third opening 301c that deviates from the substrate 100.

[0051] In these preferred embodiments, the first flat surface 10b refers to the flat surface of the pixel limiting portion 210 on the side away from the substrate 100, and the first flat surface 10b may be relatively flat and may not have a recess structure 10a.

[0052] In some embodiments of the present application, the recessed structure 10a located on the side of the pixel limiting portion 210 away from the substrate 100 and the film layer located within the recessed structure 10a have a recessed shape, which can improve the adhesion between the film layer and the film layer above it and advantageously enhance the display effect of the display panel. For example, by positioning a portion of the light-emitting layer 420 within the recessed structure 10a, the adhesion between the light-emitting layer 420 within the recessed structure 10a and the second electrode 430 above it can be improved. Furthermore, since the light-emitting layer 420 within the recessed structure 10a has a recessed shape, and the second electrode 430 above the light-emitting layer 420 also has a corresponding recessed shape, the adhesion between the recessed second electrode 430 and the encapsulation layer is better.

[0053] 3 is a partial cross-sectional view of a display panel 10 according to another embodiment of the present invention, and FIG. 3a is a partial enlarged cross-sectional view of the display panel 10 according to another embodiment of the present invention, where FIG. 3a may be a partial enlarged view of the second opening 301b in FIG.

[0054] 3, in some preferred embodiments, at least some of the conductive portions 330 have recessed structures 10a on the side of the second protrusions 331 that are separated from the substrate 100. The recessed structures 10a provided on the side of the second protrusions 331 of the conductive portions 330 that are separated from the substrate 100 can increase the connection area between the second electrode 430 and the conductive portion 330, and can effectively improve the effectiveness of the electrical connection between the second electrode 430 and the conductive portion 330.

[0055] In some preferred embodiments, the depth of the recess structure 10a is in the range of 0.3 micrometers to 0.7 micrometers and / or the width of the recess structure 10a is smaller than 1.5 micrometers. For example, the depth of the recess structure 10a of the pixel limiting portion 210 and the conductive portion 330 is in the range of 0.3 micrometers to 0.7 micrometers and / or the width of the recess structure 10a of the pixel limiting portion 210 and the conductive portion 330 is smaller than 1.5 micrometers.

[0056] Preferably, the depth of the recess structure 10a may refer to the dimension of the recess structure 10a in the thickness direction of the display panel 10, for example, G1 in Figures 2a and 3a may indicate the depth of the recess structure 10a. Preferably, the width of the recess structure 10a may refer to the dimension of the recess structure 10a in the direction from the isolation structure 300 to the pixel opening 220, for example, G2 in Figures 2a and 3a may indicate the width of the recess structure 10a.

[0057] Preferably, the recess structure 10a may have a depth of 0.3 micrometers, 0.4 micrometers, 0.5 micrometers, 0.6 micrometers, or 0.7 micrometers, and preferably a width of 1.4 micrometers, 1.3 micrometers, 1.2 micrometers, 1.1 micrometers, 1.0 micrometers, 0.9 micrometers, or 0.8 micrometers.

[0058] In these preferred embodiments, by rationally setting the dimensions of the recess structure 10a, the water vapor penetration path can be well adjusted and the connection area between the second electrode 430 and the conductive part 330 can be well adjusted, thereby well improving the display effect of the display panel 10.

[0059] In some embodiments of the present application, when the isolation structure 300 is used to manufacture the first type element 401 and the second type element 402, respectively, due to the influence of the manufacturing process of the display panel 10, the recess structure 10a may only be located in the conductive portion 330 within some of the isolation openings 301.

[0060] Preferably, in the step of removing the material of the first type element 401 outside the first opening 301a, the etching material can to some extent etch the second protrusion 331 exposed from within other isolation openings 301 other than the first opening 301a, thereby forming a recess structure 10a.

[0061] In some preferred embodiments, the second protruding portion 331 protruding from the first isolation portion 310 toward the second opening 301b has a recessed structure 10a on the side away from the substrate 100.

[0062] In this preferred embodiment, in the step of removing the material of the first type element 401 outside the first opening 301a, the etching material can to some extent etch the second protrusion 331 protruding from the first isolation portion 310 toward the second opening 301b in the second opening 301b, thereby forming a recess structure 10a.

[0063] Preferably, the second protruding portion 331, which protrudes from the first isolation portion 310 toward the first opening 301a, has a second flat surface 10c on the side away from the substrate 100.

[0064] Preferably, second protruding portion 331 protruding from first isolation portion 310 toward third opening 301c has recessed structure 10a on a side thereof that faces away from substrate 100, or second flat surface 10c on a side thereof that faces away from substrate 100, second protruding portion 331 protruding from first isolation portion 310 toward third opening 301c. Second flat surface 10c refers to the flat surface of second protruding portion 331 on the side that faces away from substrate 100.

[0065] Among these, when the third opening 301c is manufactured simultaneously with the first opening 301a and the second opening 301b, in the step of removing the material of the first type element 401 outside the first opening 301a and the step of removing the material of the second type element 402 outside the second opening 301b, the etching material can etch to a certain extent the second protrusion 331 protruding from the first isolation portion 310 toward the third opening 301c exposed from inside the third opening 301c, thereby forming the recess structure 10a, which makes it possible to have the recess structure 10a on the side of the second protrusion 331 exposed from the third opening 301c that is away from the substrate 100.

[0066] When the third opening 301c is manufactured independently from the other isolation openings 301, for example, when the third opening 301c is manufactured after the first type elements 401 and the second type elements 402 have been manufactured, the second protrusion 331 that protrudes from the first isolation portion 310 toward the third opening 301c exposed from within the third opening 301c is less susceptible to the effects of the etching material, and as a result, the second flat surface 10c is present on the side of the second protrusion 331 exposed from the third opening 301c that deviates from the substrate 100.

[0067] In these preferred embodiments, the second planar surface 10c may be relatively flat and may not have recessed structures 10a.

[0068] In some preferred embodiments, the film layers of the light emitting device 400 may be partially located within the recess structure 10a.

[0069] For example, a portion of the film layer of the light-emitting element 400 may be located within the recess structure 10 a of the pixel limiting portion 210 and / or a portion of the film layer may be located within the recess structure 10 a of the conductive portion 330 .

[0070] Preferably, a portion of the light-emitting layer 420 is located within the recess structure 10 a. For example, the light-emitting layer 420 may extend from within the pixel opening 220 to a side of the pixel limiting portion 210 that is away from the substrate 100, and may also be located partially within the recess structure 10 a of the pixel limiting portion 210 (not shown).

[0071] Preferably, a portion of the second electrode 430 is located within the recess structure 10a. For example, the second electrode 430 may extend from within the pixel opening 220 to a side of the pixel limiting portion 210 that is away from the substrate 100, and a portion of the second electrode 430 may be located within the recess structure 10a of the pixel limiting portion 210. For example, the second electrode 430 may extend to a side of the conductive portion 330 that is away from the substrate 100, and a portion of the second electrode 430 may be located within the recess structure 10a of the conductive portion 330.

[0072] Preferably, the number of the recessed structures 10a may be one or more, and the recessed structures 10a may be spaced apart and / or connected to each other. The recessed structures 10a may be randomly arranged and may have a variety of shapes, which is not specifically limited in the present application.

[0073] In some preferred embodiments, at least a portion of the orthogonal projection of the recess structure 10a on the substrate 100 is located within the orthogonal projection of the first protrusion 321 on the substrate 100. For example, at least a portion of the orthogonal projection of the recess structure 10a of the pixel limiting portion 210 on the substrate 100 is located within the orthogonal projection of the first protrusion 321 on the substrate 100, and / or at least a portion of the orthogonal projection of the recess structure 10a of the conductive portion 330 on the substrate 100 is located within the orthogonal projection of the first protrusion 321 on the substrate 100. For example, a portion of the orthogonal projection of the recess structure 10a of the pixel limiting portion 210 on the substrate 100 is located within the orthogonal projection of the first protrusion 321 on the substrate 100, and another portion is located outside the orthogonal projection of the first protrusion 321 on the substrate 100. Alternatively, all of the orthogonal projections of the recess structure 10a of the pixel limiting portion 210 on the substrate 100 are located within the orthogonal projection of the first protrusion 321 on the substrate 100.

[0074] In this preferred embodiment, due to the influence of the shielding of the first protrusion 321, when the material of the light-emitting element 400 is evaporated, the amount of material of the light-emitting element 400 that falls below the first protrusion 321 is small, so the thickness of the film layer below the first protrusion 321 is relatively thin. Therefore, in the step of removing the material of the first type element 401 outside the first opening 301a and the step of removing the material of the second type element 402 outside the second opening 301b, the etching material etches and removes the material of the light-emitting element 400 below the first protrusion 321, and is also likely to etch the material of the pixel limiting portion 210 and / or the conductive portion 330 below the first protrusion 321, so that the recess structure 10a is easily formed below the first protrusion 321.

[0075] In the embodiments of the present application, there are several ways to realize that "the second isolation portion 320 is provided to protrude from the first isolation portion 310 toward the isolation opening 301" and several ways to realize that "the conductive portion 330 is provided to protrude from the first isolation portion 310 toward the isolation opening 301."

[0076] For example, during the manufacturing process of the display panel 10, by controlling the degree of etching of the material of the first isolation portion 310, it is possible to realize that "the second isolation portion 320 is provided to protrude from the first isolation portion 310 toward the isolating opening 301" and that "the conductive portion 330 is provided to protrude from the first isolation portion 310 toward the isolating opening 301." Furthermore, during the manufacturing process of the display panel 10, by controlling the degree of etching of the materials of the second isolation portion 320 and the conductive portion 330, it is possible to realize that "the second isolation portion 320 is provided to protrude from the first isolation portion 310 toward the isolating opening 301" and that "the conductive portion 330 is provided to protrude from the first isolation portion 310 toward the isolating opening 301." Furthermore, for example, during the manufacturing process of the display panel 10, by controlling the degree of etching of the material of the first isolation portion 310 and the second isolation portion 320 and by controlling the degree of etching of the material of the first isolation portion 310 and the conductive portion 330, it is possible to realize that "the second isolation portion 320 is provided to protrude from the first isolation portion 310 toward the isolation opening 301" and that "the conductive portion 330 is provided to protrude from the first isolation portion 310 toward the isolation opening 301."

[0077] For ease of explanation, the embodiments described below will use as an example an example that, by controlling the degree of etching of the material of the first isolation portion 310 during the manufacturing process of the display panel 10, it is possible to realize that "the second isolation portion 320 is protruding from the first isolation portion 310 toward the isolation opening 301" and "the conductive portion 330 is protruding from the first isolation portion 310 toward the isolation opening 301."

[0078] Preferably, the material of the conductive portion 330 may include a conductive material, so that the second electrodes 430 of adjacent light-emitting elements 400 can be electrically connected by the conductive portion 330. Preferably, the material of the first isolation portion 310 may include a conductive material, so that at least a portion of the second electrodes 430 can be connected to the first isolation portion 310, so that the second electrodes 430 of adjacent light-emitting elements 400 can be electrically connected by the first isolation portion 310, and the resistance of the display panel 10 can be effectively reduced.

[0079] For example, the material of the conductive portion 330 may include molybdenum, the material of the first isolation portion 310 may include aluminum, and the material of the second isolation portion 320 may include titanium, which allows a large etching selectivity between the first isolation portion 310 and the second isolation portion 320 and a large etching selectivity between the first isolation portion 310 and the conductive portion 330, and when performing an etching process, the etching rate of the etching material for the first isolation portion 310 is greater than the etching rate of the etching material for the second isolation portion 320 and the etching rate of the etching material for the first isolation portion 310 is greater than the etching rate of the etching material for the conductive portion 330, thereby realizing that "the second isolation portion 320 is provided to protrude from the first isolation portion 310 toward the isolation opening 301" and "the conductive portion 330 is provided to protrude from the first isolation portion 310 toward the isolation opening 301."

[0080] FIG. 4 is a partial cross-sectional view of a display panel 10 according to yet another embodiment of the present invention.

[0081] As shown in FIG. 4, in some preferred embodiments, the protruding length of the second isolation portion 320 toward the first opening 301a relative to the first isolation portion 310 is smaller than the protruding length of the second isolation portion 320 toward the second opening 301b relative to the first isolation portion 310.

[0082] Preferably, the first isolation portion 310 has a first surface 310a on a side away from the substrate 100, and the second isolation portion 320 has a second surface 320a on a side facing the substrate 100. There is a first spacing distance D1 between an orthogonal projection of an edge of the first surface 310a corresponding to the first opening 301a on the substrate 100 and an orthogonal projection of an edge of the second surface 320a corresponding to the first opening 301a on the substrate 100. There is a second spacing distance D2 between the orthogonal projection of the edge on the substrate 100 and the orthogonal projection of the edge corresponding to the second opening 301b of the second surface 320a on the substrate 100, and the first spacing distance D1 is smaller than the second spacing distance D2, thereby realizing that the protruding length of the second isolation portion 320 toward the first opening 301a relative to the first isolation portion 310 is smaller than the protruding length of the second isolation portion 320 toward the second opening 301b relative to the first isolation portion 310.

[0083] Preferably, the first isolation portion 310 has a third surface 310b on the side closer to the substrate 100, and there is a third spacing distance D3 between the orthogonal projection on the substrate 100 of the edge of the third surface 310b corresponding to the first opening 301a and the orthogonal projection on the substrate 100 of the edge of the second surface 320a corresponding to the first opening 301a, and there is a fourth spacing distance D4 between the orthogonal projection on the substrate 100 of the edge of the third surface 310b corresponding to the second opening 301b and the orthogonal projection on the substrate 100 of the edge of the second surface 320a corresponding to the second opening 301b, and the third spacing distance D3 is smaller than the fourth spacing distance D4, so that the protruding length of the second isolation portion 320 toward the first opening 301a relative to the entire first isolation portion 310 is smaller than the protruding length of the second isolation portion 320 toward the second opening 301b relative to the entire first isolation portion 310.

[0084] In these preferred embodiments, the protruding length of the second isolation portion 320 toward the first opening 301a relative to the first isolation portion 310 is smaller than the protruding length of the second isolation portion 320 toward the second opening 301b relative to the first isolation portion 310, which allows the isolation structure 300 on the peripheral side of the second opening 301b to have a better shielding effect on the material of the light-emitting element 400, making it easier to manufacture the second type element 402.

[0085] In some preferred embodiments, the length of the conductive portion 330 protruding from the first isolation portion 310 toward the first opening 301a is smaller than the length of the conductive portion 330 protruding from the first isolation portion 310 toward the second opening 301b.

[0086] Preferably, S1 in the figure may indicate the protrusion length of the conductive portion 330 relative to the first isolation portion 310 toward the first opening 301a, and S2 in the figure may indicate the protrusion length of the conductive portion 330 relative to the first isolation portion 310 toward the second opening 301b.

[0087] Preferably, the protruding length of the conductive portion 330 from the first isolation portion 310 toward the second opening 301b is greater than the protruding length of the conductive portion 330 from the first isolation portion 310 toward the first opening 301a, and is not greater than three times the protruding length of the conductive portion 330 from the first isolation portion 310 toward the first opening 301a.

[0088] Preferably, the range of the protrusion length of the conductive portion from the first isolation portion 310 towards the first opening 301a is 0.05 micrometers to 0.4 micrometers, for example, the protrusion length of the conductive portion from the first isolation portion 310 towards the first opening 301a may be 0.05 micrometers, 0.1 micrometers, 0.15 micrometers, 0.2 micrometers, 0.25 micrometers, 0.3 micrometers, 0.35 micrometers or 0.4 micrometers.

[0089] In these preferred embodiments, the protrusion length of the conductive portion 330 from the first isolation portion 310 toward the first opening 301a is smaller than the protrusion length of the conductive portion 330 from the first isolation portion 310 toward the second opening 301b. This allows the second type element 402 to have a larger overlapping connection area with the conductive portion 330 on the periphery of the second opening 301b, and makes it less likely that the material of the conductive portion 330 in the second opening 301b will be etched and destroyed during the manufacturing process of the display panel 10. This effectively improves the stability of the electrical connection between the second type element 402 and the conductive portion 330 on the periphery of the second opening 301b, and effectively improves the reliability of operation of the display panel 10.

[0090] In some embodiments of the present application, by adjusting the degree of etching of the first isolation portion 310 on the peripheral side of the first opening 301a by the etching material to be smaller than the degree of etching of the first isolation portion 310 on the peripheral side of the second opening 301b by the etching material, the protruding length of the second isolation portion 320 from the first isolation portion 310 toward the first opening 301a can be made smaller than the protruding length of the second isolation portion 320 from the first isolation portion 310 toward the second opening 301b, and the protruding length of the conductive portion 330 from the first isolation portion 310 toward the first opening 301a can be made smaller than the protruding length of the conductive portion 330 from the first isolation portion 310 toward the second opening 301b.

[0091] Therefore, the second electrode 430 can have a larger connection area with the conductive portion 330 on the peripheral side of the second opening 301b. Due to the shielding effect of the relatively long second isolation portion 320 on the peripheral side of the second opening 301b, the second electrode 430 can have a relatively small connection area with the first isolation portion 310 on the peripheral side of the second opening 301b. When the material of the conductive portion 330 includes molybdenum and the material of the first isolation portion 310 includes aluminum, the conductive portion 330 is less likely to be oxidized than the first isolation portion 310, so the second electrode 430 can be connected to a larger portion of the conductive portion 330 which is less likely to be oxidized, which can favorably improve the reliability of the overall electrical connection between the second electrode 430 and the isolation structure 300.

[0092] In some embodiments of the present application, when the isolation structure 300 is used to manufacture the first-type elements 401 and the second-type elements 402, after removing the material of the first-type elements 401 outside the first openings 301a, the second openings 301b can be cleaned with an etching solution to remove impurities in the second openings 301b. For example, the second openings 301b can be cleaned with an etching material to remove impurities in the second openings 301b. In the process of cleaning the second openings 301b, the etching material tends to etch the first isolation portions 310. As a result, the etching material etches the first isolation portions 310 on the periphery of the second openings 301b but does not etch the conductive portions 330 on the periphery of the second openings 301b, resulting in a large protrusion length of the conductive portions 330 on the periphery of the second openings 301b relative to the first isolation portions 310. In this embodiment, since the etching material etches the first isolation portion 310 on the peripheral side of the second opening 301b, the protruding length of the second isolation portion 320 from the first isolation portion 310 toward the first opening 301a is smaller than the protruding length of the second isolation portion 320 from the first isolation portion 310 toward the second opening 301b, and the protruding length of the conductive portion 330 from the first isolation portion 310 toward the first opening 301a is smaller than the protruding length of the conductive portion 330 from the first isolation portion 310 toward the second opening 301b.

[0093] In some preferred embodiments, the protruding length of the second isolation portion 320 toward the third opening 301c relative to the first isolation portion 310 is not smaller than the protruding length of the second isolation portion 320 toward the first opening 301a relative to the first isolation portion 310 and / or is not greater than the protruding length of the second isolation portion 320 toward the second opening 301b relative to the first isolation portion 310.

[0094] For example, the protrusion length of second isolation portion 320 toward third opening 301c relative to first isolation portion 310 may be greater than or equal to the protrusion length of second isolation portion 320 toward first opening 301a relative to first isolation portion 310. For example, the protrusion length of second isolation portion 320 toward third opening 301c relative to first isolation portion 310 may be less than or equal to the protrusion length of second isolation portion 320 toward second opening 301b relative to first isolation portion 310.

[0095] Preferably, there is a fifth spacing distance D5 between the orthogonal projection on the substrate 100 of the edge of the first surface 310a corresponding to the third opening 301c and the orthogonal projection on the substrate 100 of the edge of the second surface 320a corresponding to the third opening 301c.

[0096] The fifth spacing distance D5 may not be smaller than the first spacing distance D1, thereby realizing that the protruding length of the second isolation portion 320 from the first isolation portion 310 toward the third opening 301c is not smaller than the protruding length of the second isolation portion 320 from the first isolation portion 310 toward the first opening 301a. The fifth spacing distance D5 may not be larger than the second spacing distance D2, thereby realizing that the protruding length of the second isolation portion 320 from the first isolation portion 310 toward the third opening 301c is not larger than the protruding length of the second isolation portion 320 from the first isolation portion 310 toward the second opening 301b.

[0097] Preferably, there is a sixth spacing distance D6 between the orthogonal projection on the substrate 100 of the edge of the third surface 310b corresponding to the third opening 301c and the orthogonal projection on the substrate 100 of the edge of the second surface 320a corresponding to the third opening 301c.

[0098] The sixth spacing distance D6 may not be smaller than the third spacing distance D3, so that the protruding length of the second isolation portion 320 toward the third opening 301c relative to the entire first isolation portion 310 is not smaller than the protruding length of the second isolation portion 320 toward the first opening 301a relative to the entire first isolation portion 310. The sixth spacing distance D6 may not be larger than the fourth spacing distance D4, so that the protruding length of the second isolation portion 320 toward the third opening 301c relative to the entire first isolation portion 310 is not larger than the protruding length of the second isolation portion 320 toward the second opening 301b relative to the entire first isolation portion 310.

[0099] In these preferred embodiments, the protruding length of the second isolation portion 320 toward the third opening 301c relative to the first isolation portion 310 is not smaller than the protruding length of the second isolation portion 320 toward the first opening 301a relative to the first isolation portion 310, and the protruding length of the second isolation portion 320 toward the third opening 301c relative to the first isolation portion 310 is not greater than the protruding length of the second isolation portion 320 toward the second opening 301b relative to the first isolation portion 310. This makes it possible for the shielding ability of the isolation structure 300 around the third opening 301c against the material of the light-emitting element 400 to be between the shielding ability of the isolation structure 300 around the first opening 301a and the shielding ability of the isolation structure 300 around the second opening 301b, making it easier to manufacture the third type element 403.

[0100] In some preferred embodiments, the protruding length of the conductive portion 330 from the first isolation portion 310 toward the third opening 301c is not smaller than the protruding length of the conductive portion 330 from the first isolation portion 310 toward the first opening 301a and / or is not greater than the protruding length of the conductive portion 330 from the first isolation portion 310 toward the second opening 301b.

[0101] For example, the protrusion length of conductive portion 330 toward third opening 301c relative to first isolation portion 310 is greater than or equal to the protrusion length of conductive portion 330 toward first opening 301a relative to first isolation portion 310. For example, the protrusion length of conductive portion 330 toward third opening 301c relative to first isolation portion 310 is less than or equal to the protrusion length of conductive portion 330 toward second opening 301b relative to first isolation portion 310.

[0102] Preferably, S3 in the drawing may indicate the length of the conductive portion 330 projecting from the first isolation portion 310 toward the third opening 301c.

[0103] Preferably, the protrusion length of the conductive portion 330 toward the third opening 301c relative to the first isolation portion 310 ranges from 0.05 micrometers to 0.4 micrometers. For example, the protrusion length of the conductive portion 330 toward the third opening 301c relative to the first isolation portion 310 may be 0.05 micrometers, 0.1 micrometers, 0.15 micrometers, 0.2 micrometers, 0.25 micrometers, 0.3 micrometers, 0.35 micrometers, or 0.4 micrometers.

[0104] In these preferred embodiments, the protrusion length of the conductive portion 330 from the first isolation portion 310 toward the third opening 301c is not smaller than the protrusion length of the conductive portion 330 from the first isolation portion 310 toward the first opening 301a, and the protrusion length of the conductive portion 330 from the first isolation portion 310 toward the third opening 301c is not greater than the protrusion length of the conductive portion 330 from the first isolation portion 310 toward the second opening 301b. This allows the third-type element 403 to have an appropriate overlapping connection area with the conductive portion 330 on the periphery of the third opening 301c, and makes it difficult for the material of the conductive portion 330 in the third opening 301c to be etched and destroyed during the manufacturing process of the display panel 10. This effectively improves the stability of the electrical connection between the third-type element 403 and the conductive portion 330 on the periphery of the third opening 301c, and effectively improves the reliability of operation of the display panel 10.

[0105] FIG. 5 is a partial cross-sectional view of a display panel 10 according to still another embodiment of the present invention.

[0106] As shown in FIG. 5, in some preferred embodiments, the isolation opening 301 further includes a fourth opening 301d, and the light-emitting element includes a fourth type element 404 provided corresponding to the fourth opening 301d.

[0107] Preferably, the fourth type element 404 provided corresponding to the fourth opening 301d may mean that the fourth type element 404 can be at least partially positioned within the fourth opening 301d.

[0108] Preferably, the first kind elements 401, the second kind elements 402, the third kind elements 403 and the fourth kind elements 404 emit light of different colors so that the display panel 10 can display a variety of colors.

[0109] Preferably, the fourth type element 404 is a light emitting element 400 that emits white light.

[0110] In some preferred embodiments, the pixel limiting portion 210 exposed through the fourth opening 301d has a recessed structure 10a or a first flat surface 10b on the side facing away from the substrate 100.

[0111] Among these, when the fourth opening 301d is manufactured simultaneously with the first opening 301a and the second opening 301b, in the step of removing the material of the first-type elements 401 outside the first opening 301a and the step of removing the material of the second-type elements 402 outside the second opening 301b, the etching material can etch to some extent the pixel limiting portion 210 exposed from inside the fourth opening 301d and form the recess structure 10a, which makes it possible to have the recess structure 10a on the side of the pixel limiting portion 210 exposed from the fourth opening 301d that is away from the substrate 100.

[0112] Alternatively, when the fourth opening 301d is manufactured simultaneously with the third opening 301c, the third-kind elements 403 may be manufactured first by the same or similar method as used to manufacture the first-kind elements 401 and the second-kind elements 402, followed by the fourth-kind elements 404. During this process, in the step of removing the material of the third-kind elements 403 outside the third opening 301c, the etching material can etch to some extent the pixel limiting portion 210 exposed from within the fourth opening 301d, thereby forming the recessed structure 10a, which enables the recessed structure 10a to be present on the side of the pixel limiting portion 210 exposed from the fourth opening 301d that is away from the substrate 100.

[0113] When the fourth opening 301d is manufactured independently from the other isolation openings 301, for example, when the fourth opening 301d is manufactured after the first type elements 401, the second type elements 402, and the third type elements 403 have been manufactured, the pixel limiting portion 210 exposed from within the fourth opening 301d is less susceptible to the effects of the etching material, and as a result, the first flat surface 10b is present on the side of the pixel limiting portion 210 exposed from the fourth opening 301d that deviates from the substrate 100.

[0114] In some preferred embodiments, the second protrusion 331 protruding from the first isolation portion 310 toward the fourth opening 301d has a recess structure 10a or a second flat surface 10c on the side facing away from the substrate 100.

[0115] Among these, when the fourth opening 301d is manufactured simultaneously with the first opening 301a and the second opening 301b, in the step of removing the material of the first type element 401 outside the first opening 301a and the step of removing the material of the second type element 402 outside the second opening 301b, the etching material can etch the second protrusion 331 exposed from inside the fourth opening 301d to some extent and form the recess structure 10a, thereby making it possible to have the recess structure 10a on the side of the second protrusion 331 exposed from the fourth opening 301d that is away from the substrate 100.

[0116] Alternatively, when the fourth opening 301d is manufactured simultaneously with the third opening 301c, the third-kind elements 403 may be manufactured first by the same or similar method as that used to manufacture the first-kind elements 401 and the second-kind elements 402, followed by the fourth-kind elements 404. During the step of removing the material of the third-kind elements 403 outside the third opening 301c, the etching material etches the second protruding portions 331 exposed from the inside of the fourth opening 301d to some extent, thereby forming the recessed structures 10a, which enable the recessed structures 10a to be present on the side of the second protruding portions 331 exposed from the fourth opening 301d that is away from the substrate 100.

[0117] When the fourth opening 301d is manufactured independently from the other isolation openings 301, for example, when the fourth opening 301d is manufactured after the first type element 401, the second type element 402, and the third type element 403 have been manufactured, the second protrusion 331 exposed from within the fourth opening 301d is less susceptible to the etching material, and as a result, the first flat surface 10b is present on the side of the second protrusion 331 exposed from the fourth opening 301d that faces away from the substrate 100.

[0118] In some preferred embodiments, the protruding length of the second isolation portion 320 relative to the first isolation portion 310 toward the fourth opening 301d is greater than or equal to the protruding length of the second isolation portion 320 relative to the first isolation portion 310 toward the third opening 301c.

[0119] Preferably, there is a seventh spacing distance D7 between the orthogonal projection on the substrate 100 of the edge corresponding to the fourth opening 301d of the first surface 310a and the orthogonal projection on the substrate 100 of the edge corresponding to the fourth opening 301d of the second surface 320a, and the seventh spacing distance D7 is greater than or equal to the fifth spacing distance D5, thereby realizing that the protrusion length of the second isolation portion 320 toward the fourth opening 301d relative to the first isolation portion 310 is greater than or equal to the protrusion length of the second isolation portion 320 toward the third opening 301c relative to the first isolation portion 310.

[0120] Preferably, the seventh spacing distance D7 is not smaller than the first spacing distance D1 and / or the seventh spacing distance D7 is not larger than the second spacing distance D2, so that the protruding length of the second isolation portion 320 toward the fourth opening 301d relative to the first isolation portion 310 can be between the protruding length of the second isolation portion 320 toward the first opening 301a relative to the first isolation portion 310 and the protruding length of the second isolation portion 320 toward the second opening 301b relative to the first isolation portion 310.

[0121] Preferably, there is an eighth spacing distance D8 between the orthogonal projection on the substrate 100 of the edge corresponding to the fourth opening 301d of the third surface 310b and the orthogonal projection on the substrate 100 of the edge corresponding to the fourth opening 301d of the second surface 320a, and the eighth spacing distance is greater than or equal to the sixth spacing distance, thereby realizing that the protrusion length of the second isolation portion 320 toward the fourth opening 301d relative to the entire first isolation portion 310 is greater than or equal to the protrusion length of the second isolation portion 320 toward the third opening 301c relative to the entire first isolation portion 310.

[0122] Preferably, the eighth spacing distance D8 is not smaller than the third spacing distance D3 and / or the eighth spacing distance D8 is not greater than the fourth spacing distance D4, so that the protruding length of the second isolation portion 320 toward the fourth opening 301d relative to the entire first isolation portion 310 can be between the protruding length of the second isolation portion 320 toward the first opening 301a relative to the entire first isolation portion 310 and the protruding length of the second isolation portion 320 toward the second opening 301b relative to the entire first isolation portion 310.

[0123] In these preferred embodiments, the protruding length of the second isolation portion 320 toward the fourth opening 301d relative to the first isolation portion 310 is greater than or equal to the protruding length of the second isolation portion 320 toward the third opening 301c relative to the first isolation portion 310, which allows the isolation structure 300 on the peripheral side of the fourth opening 301d to have a better shielding effect on the material of the light-emitting element 400, making it easier to manufacture the fourth type element 404.

[0124] In some preferred embodiments, the protruding length of the conductive portion 330 toward the fourth opening 301d relative to the first isolation portion 310 is greater than or equal to the protruding length of the conductive portion 330 toward the third opening 301c relative to the first isolation portion 310.

[0125] Preferably, S4 in the drawing may indicate the length of the conductive portion 330 projecting from the first isolation portion 310 toward the fourth opening 301d.

[0126] In these preferred embodiments, the protrusion length of the conductive portion 330 toward the fourth opening 301d relative to the first isolation portion 310 is greater than or equal to the protrusion length of the conductive portion 330 toward the third opening 301c relative to the first isolation portion 310, so that the fourth type element 404 can have a larger overlapping connection area with the conductive portion 330 on the periphery of the fourth opening 301d, and the material of the conductive portion 330 in the fourth opening 301d is less likely to be etched and destroyed during the manufacturing process of the display panel 10, which can effectively improve the stability of the electrical connection between the fourth type element 404 and the conductive portion 330 on the periphery of the fourth opening 301d and effectively improve the reliability of operation of the display panel 10.

[0127] As shown in FIG. 5, in some preferred embodiments, there is a ninth spacing distance D9 between the orthogonal projection on the substrate 100 of the edge of the second isolation portion 320 facing the first opening 301a and the orthogonal projection on the substrate 100 of the edge of the conductive portion 330 facing the first opening 301a, and there is a tenth spacing distance D10 between the orthogonal projection on the substrate 100 of the edge of the second isolation portion 320 facing the second opening 301b and the orthogonal projection on the substrate 100 of the edge of the conductive portion 330 facing the second opening 301b, and the ninth spacing distance D9 may be equal to the tenth spacing distance D10.

[0128] Preferably, the ninth spacing distance D9 and the tenth spacing distance D10 range in value from 0.1 micrometers to 0.6 micrometers, and may be, for example, 0.1 micrometers, 0.2 micrometers, 0.3 micrometers, 0.4 micrometers, 0.5 micrometers, or 0.6 micrometers.

[0129] Preferably, there is an eleventh spacing distance D11 between the orthogonal projection on the substrate 100 of the edge of the second isolation portion 320 facing the third opening 301c and the orthogonal projection on the substrate 100 of the edge of the conductive portion 330 facing the third opening 301c, and the ninth spacing distance D9, the tenth spacing distance D10 and the eleventh spacing distance D11 are all equal.

[0130] Preferably, the eleventh spacing distance D11 ranges from 0.1 micrometers to 0.6 micrometers. For example, the eleventh spacing distance D11 may be 0.1 micrometers, 0.2 micrometers, 0.3 micrometers, 0.4 micrometers, 0.5 micrometers, or 0.6 micrometers.

[0131] Preferably, there is a twelfth spacing distance D12 between the orthogonal projection on the substrate 100 of the edge of the second isolation portion 320 facing the fourth opening 301d and the orthogonal projection on the substrate 100 of the edge of the conductive portion 330 facing the fourth opening 301d, and the ninth spacing distance D9, the tenth spacing distance D10, the eleventh spacing distance D11 and the twelfth spacing distance D12 are all equal.

[0132] Preferably, the twelfth spacing distance D12 ranges from 0.1 micrometers to 0.6 micrometers. For example, the twelfth spacing distance D12 may be 0.1 micrometers, 0.2 micrometers, 0.3 micrometers, 0.4 micrometers, 0.5 micrometers, or 0.6 micrometers.

[0133] In these preferred embodiments, by controlling the degree of etching of the material of the first isolation portion 310, the second isolation portion 320 is formed to protrude from the first isolation portion 310 toward the isolation opening 301, and when the conductive portion 330 is formed to protrude from the first isolation portion 310 toward the isolation opening 301 is realized, since it is the degree of etching of the first isolation portion 310 that is adjusted, the relative positional relationship between the first isolation portion 310 and the second isolation portion 320 in each isolation opening 301 does not change excessively, and therefore the 12th spacing distance D12, the 9th spacing distance D9, the 10th spacing distance D10, the 11th spacing distance D11 and the 12th spacing distance D12 may all be equal.

[0134] FIG. 6 is a partial cross-sectional view of a display panel 10 according to a further embodiment of the present invention.

[0135] As shown in FIG. 6, in some preferred embodiments, the display panel 10 further includes an encapsulation layer 500 disposed on the side of the light-emitting element 400 and the isolation structure 300 that is away from the substrate 100, and the encapsulation layer 500 can be used to encapsulate the light-emitting element 400.

[0136] Preferably, the sealing layer 500 may include a first sealing layer 510 arranged on the side of the light-emitting element 400 and the isolation structure 300 that is away from the substrate 100, and the first sealing layer 510 may include sealing units 511 arranged corresponding to each light-emitting element 400, each of which can be used to independently seal each light-emitting element 400, thereby effectively improving the sealing effect of the display panel 10.

[0137] Preferably, the material of the first encapsulating layer 510 may include an inorganic material, so that the first encapsulating layer 510 can effectively limit the influence of water vapor on the light-emitting element 400 .

[0138] Preferably, the first encapsulation layer 510 may be fabricated by a chemical vapor deposition (CVD) process.

[0139] Preferably, the sealing layer 500 may further include a second sealing layer 520 provided on the side of the first sealing layer 510 that is away from the substrate 100, and the second sealing layer 520 can also seal the display panel 10, thereby further improving the sealing effect of the display panel 10.

[0140] Preferably, the material of the second sealing layer 520 may include an organic material, which allows the material of the second sealing layer 520 to have good fluidity during manufacturing of the second sealing layer 520, so that the surface of the manufactured second sealing layer 520 that faces away from the substrate 100 can have good flatness, making it easy to arrange elements subsequently.

[0141] Preferably, the second sealing layer 520 may be manufactured by an inkjet printing technology process (Inkjet Printing, IJP).

[0142] Preferably, the sealing layer 500 may further include a third sealing layer 530 provided on the side of the second sealing layer 520 that is away from the substrate 100, and the third sealing layer 530 can also seal the display panel 10, thereby further improving the sealing effect of the display panel 10.

[0143] Preferably, the material of the third encapsulation layer 530 includes an inorganic material.

[0144] Preferably, the third encapsulation layer 530 may be fabricated by a chemical vapor deposition process.

[0145] FIG. 7 is a partial cross-sectional view of a display panel 10 according to a further embodiment of the present invention.

[0146] Referring to Figure 7 in conjunction with Figures 1 to 6, an embodiment of the first aspect of the present application further provides a display panel 10, which includes a substrate 100, an isolation structure 300 provided on one side of the substrate 100, with an isolation opening 301, and including a first isolation portion 310 and a conductive portion 330 having a second protrusion 331 provided on the side of the first isolation portion 310 facing the substrate 100 and protruding from the first isolation portion 310 toward the isolation opening 301, and a light-emitting element 400 at least a portion of which is located within the isolation opening 301, wherein at least a portion of the second protrusion 331 of the conductive portion 330 has a recess structure 10a on the side away from the substrate 100.

[0147] The present embodiment further provides a display panel, in which the display panel 10 includes a substrate 100, an isolation structure 300, and a light-emitting element 400. The isolation structure 300 is disposed on one side of the substrate 100, and the isolation structure 300 has an isolation opening 301 formed therein. The light-emitting element 400 is at least partially located within the isolation opening 301, and the isolation structure 300 can be used to define sub-pixels of the display panel 10.

[0148] The isolation structure 300 comprises a first isolation portion 310 and a conductive portion 330 provided on the side of the first isolation portion 310 facing the substrate 100, and at least a part of the conductive portion 330 has a recess structure 10a on the side of the second protrusion 331 that deviates from the substrate 100, which can improve the display effect of the display panel.

[0149] Preferably, the display panel 10 further provided by the embodiment of the first aspect of the present application may be the display panel 10 in any one of the above-mentioned embodiments, and therefore the display panel 10 further provided by the embodiment of the present application may have the structure and beneficial effects of the display panel 10 in any one of the above-mentioned embodiments, which will not be described again in this application.

[0150] For example, the light-emitting element 400 may be the light-emitting element 400 of any one of the above-described embodiments, or may include the first-type element 401, the second-type element 402, the third-type element 403, and the fourth-type element 404 of any one of the embodiments. The light-emitting element 400 may include a first electrode 410, a light-emitting layer 420, and a second electrode 430, which are sequentially stacked in a direction away from the substrate 100. The second electrode 430 may be connected to the conductive portion 330. This allows the second electrodes 430 of adjacent subpixels to be electrically connected via the isolation structure 300, making it easier to control the second electrodes 430. By providing a recess structure 10a on the side of the second protrusion 331 of at least some of the conductive portions 330 that is away from the substrate 100, the connection area between the second electrode 430 and the conductive portion 330 can be increased, thereby improving the effectiveness of the electrical connection between the second electrode 430 and the conductive portion 330.

[0151] For example, the isolation structure 300 may be the isolation structure 300 in any one of the above-mentioned embodiments, and the isolation structure 300 may be enclosed to form the isolation opening 301 in any one of the above-mentioned embodiments. Specifically, the isolation opening 301 may include the first opening 301a, the second opening 301b, the third opening 301c, and the fourth opening 301d in any one of the above-mentioned embodiments. The isolation structure 300 may also include the conductive portion 330, the first isolation portion 310, and the second isolation portion 320 in any one of the above-mentioned embodiments, where the relative positional relationship and dimensional relationship between the conductive portion 330, the first isolation portion 310, and the second isolation portion 320 can be set with reference to any one of the above-mentioned embodiments.

[0152] Preferably, the display panel 10 according to the first aspect of the present application may further include the pixel defining layer 200 of any one of the above-described embodiments, and the pixel defining layer 200 may include the pixel defining portion 210 and the pixel opening 220 of any one of the above-described embodiments. At least a portion of the pixel defining portion 210 may have a recess structure 10a on a side facing away from the substrate 100.

[0153] FIG. 8 is a partial cross-sectional view of a display panel 10 according to a further embodiment of the present invention.

[0154] 8 in conjunction with FIGS. 1 to 7, an embodiment of a first aspect of the present application further provides a display panel 10, the display panel 10 including a substrate 100, an isolation structure 300 including a substrate 100, an isolation opening 301 provided on one side of the substrate 100 and including a first opening 301a, a second opening 301b, and a third opening 301c, a first isolation portion 310, and a second isolation portion 320 located on a side of the first isolation portion 310 away from the substrate 100 and protruding from the first isolation portion 310 toward the isolation opening 301, and a first-type element 4 provided corresponding to the first opening 301a. and a light-emitting element 400 including a second-type element 402 provided corresponding to the second opening 301b and a third-type element 403 provided corresponding to the third opening 301c, wherein the first isolation portion 310 has a first surface 310a on a side away from the substrate 100, and the second isolation portion 320 has a second surface 320a on a side facing the substrate 100, and a first spacing distance D is between an orthogonal projection of an edge of the first surface 310a corresponding to the first opening 301a on the substrate 100 and an orthogonal projection of an edge of the second surface 320a corresponding to the first opening 301a on the substrate 100. 1, a second spacing distance D2 is between the orthogonal projection on the substrate 100 of the edge corresponding to the second opening 301b of the first surface 310a and the orthogonal projection on the substrate 100 of the edge corresponding to the second opening 301b of the second surface 320a, and a fifth spacing distance D5 is between the orthogonal projection on the substrate 100 of the edge corresponding to the third opening 301c of the first surface 310a and the orthogonal projection on the substrate 100 of the edge corresponding to the third opening 301c of the second surface 320a, the first spacing distance D1 being smaller than the second spacing distance D2, and the fifth spacing distance D5 being smaller than the first spacing distance and / or the first isolation portion 310 has a third surface 310b on the side closer to the substrate 100, and there is a third spacing distance D3 between the orthogonal projection on the substrate 100 of the edge of the third surface 310b corresponding to the first opening 301a and the orthogonal projection on the substrate 100 of the edge of the second surface 320a corresponding to the first opening 301a, and there is a fourth spacing distance D4 between the orthogonal projection on the substrate 100 of the edge of the third surface 310b corresponding to the second opening 301b and the orthogonal projection on the substrate 100 of the edge of the second surface 320a corresponding to the second opening 301b,There is a sixth spacing distance D6 between the orthogonal projection on the substrate 100 of the edge of the third surface 310b corresponding to the third opening 301c and the orthogonal projection on the substrate 100 of the edge of the second surface 320a corresponding to the third opening 301c, where the third spacing distance D3 is smaller than the fourth spacing distance D4 and the sixth spacing distance D6 is equal to the third spacing distance D3.

[0155] In these preferred embodiments, the embodiments of the present application further provide a display panel, in which the display panel 10 includes a substrate 100, an isolation structure 300, and a light-emitting element 400. The isolation structure 300 is disposed on one side of the substrate 100 and includes an isolation opening 301 including a first opening 301a, a second opening 301b, and a third opening 301c. The light-emitting element 400 includes a first type element 401 disposed corresponding to the first opening 301a, a second type element 402 disposed corresponding to the second opening 301b, and a third type element 403 disposed corresponding to the third opening 301c. The isolation structure 300 can be used to define sub-pixels of the display panel 10.

[0156] The isolation structure 300 includes a first isolation portion 310 and a second isolation portion 320 located on the side of the first isolation portion 310 that is away from the substrate 100. The second isolation portion 320 protrudes from the first isolation portion 310 toward the isolation opening 301. This allows the light-emitting element 400 of the display panel 10 to be directly deposited over the entire surface with materials for the light-emitting element 400 (e.g., materials for the light-emitting layer 420 and the second electrode 430). The second isolation portion 320 can shield at least a portion of the materials used to fabricate the light-emitting element 400, thereby blocking the material for the light-emitting element 400 between adjacent subpixels. This allows the formation of multiple light-emitting elements 400 that are spaced apart and located in different isolation openings 301. This eliminates the need for a highly accurate mask plate during the fabrication of the light-emitting element 400. For example, this eliminates the need for a fine metal mask plate during the deposition of materials for the light-emitting element 400. This effectively reduces the production costs of the display panel 10.

[0157] By rationally setting the protruding length of the second isolation portion 320 around each isolation opening 301, the shielding and blocking effect of the isolation structure 300 around each isolation opening 301 on the material of the light-emitting element 400 can be rationally adjusted, thereby improving the display effect of the display panel 10.

[0158] Preferably, the display panel 10 further provided by the embodiment of the first aspect of the present application may be the display panel 10 in any one of the above-mentioned embodiments, and therefore the display panel 10 further provided by the embodiment of the present application may have the structure and beneficial effects of the display panel 10 in any one of the above-mentioned embodiments, which will not be described again in this application.

[0159] For example, the light-emitting element 400 may be the light-emitting element 400 in any one of the above-mentioned embodiments, and the light-emitting element 400 may include the first type element 401, the second type element 402, the third type element 403, and the fourth type element 404 in any one of the embodiments, and in a direction away from the substrate 100, the light-emitting element 400 includes a first electrode 410, a light-emitting layer 420, and a second electrode 430 that are sequentially stacked.

[0160] For example, the isolation structure 300 may be the isolation structure 300 of any one of the above-described embodiments, and the isolation structure 300 may be enclosed to form the isolation opening 301 of any one of the above-described embodiments. Specifically, the isolation opening 301 may include the first opening 301a, the second opening 301b, the third opening 301c, and the fourth opening 301d of any one of the above-described embodiments. The isolation structure 300 may also include the conductive portion 330, the first isolation portion 310, and the second isolation portion 320 of any one of the above-described embodiments, where the relative positional and dimensional relationships among the conductive portion 330, the first isolation portion 310, and the second isolation portion 320 can be set with reference to any one of the above-described embodiments. At least a portion of the conductive portion 330 may have a recessed structure 10a on the side facing away from the substrate 100.

[0161] Preferably, the display panel 10 according to the first aspect of the present application may further include the pixel defining layer 200 of any one of the above-described embodiments, and the pixel defining layer 200 may include the pixel defining portion 210 and the pixel opening 220 of any one of the above-described embodiments. At least a portion of the pixel defining portion 210 may have a recess structure 10a on a side facing away from the substrate 100.

[0162] FIG. 9 is a schematic diagram of a flow of a method for manufacturing a display panel 10 according to an embodiment of the present invention, and FIGS. 10 to 36 are schematic diagrams of manufacturing steps of the method for manufacturing a display panel 10 according to an embodiment of the present invention.

[0163] In the method for manufacturing a display panel according to the embodiment of the third aspect of the present application, the display panel manufactured by the manufacturing method may be any one of the display panels 10 according to the embodiment of the first aspect described above. With reference to FIG. 9 in combination with FIGS. 1 to 8 and 10 to 36, the manufacturing method includes: As shown in FIG. 12, step S01 of forming an isolation material layer on a substrate; As shown in FIG. 13, step S02 of opening a first opening and a second opening through the isolation material layer; As shown in FIGS. 14 and 15, a step S03 of providing a first type element in a first opening; As shown in FIGS. 16 to 18, step S04 is for manufacturing second-type elements in second openings, the second-type elements having a different emission color from the first-type elements; Step S05, as shown in FIG. 19, opens a third opening through the isolation material layer; As shown in FIGS. 20 and 21, the method includes step S06 of providing a third type element in the third opening.

[0164] In this embodiment, the third opening 301c is fabricated after the first-type elements 401 and the second-type elements 402 are fabricated, thereby reducing adverse effects on the fabrication of the third-type elements. For example, the etching material does not affect the isolation structure 300 and the conductive portion 330 around the third opening 301c to be fabricated later. This makes it less likely that the fabricated conductive portion 330 around the third opening 301c will be damaged or broken by the etching material, thereby improving the reliability of the connection between the second electrode 430 of the third-type element 403 and the conductive portion 330 around the third opening 301c. Because the etching material does not affect the conductive portion 330 around the third opening 301c, the conductive portion 330 around the third opening 301c does not need to have a recessed structure 10a.

[0165] In some preferred embodiments, step S03 may include:

[0166] In step S031, as shown in FIG. 14, a first element material layer is formed over the entire surface.

[0167] Among them, the first element material layer 15 can be used to form the first type element 401 in any one of the above-mentioned embodiments.

[0168] Preferably, the first element material layer 15 may include a first light emitting material layer 15a and a first kind of electrode material layer 15b located on the side of the first light emitting material layer 15a that is farther away from the substrate 100.

[0169] Among them, the first light-emitting material layer 15a can be used to form the light-emitting layer 420 of the first element 401 in any one of the above-mentioned embodiments, and the first electrode material layer 15b can be used to form the second electrode 430 of the first element 401 in any one of the above-mentioned embodiments.

[0170] Preferably, step S031 may further include manufacturing an encapsulating material layer 18 over the entire surface of the first element material layer 15. A portion of the encapsulating material layer 18 can be used to form an encapsulating unit 511 corresponding to the first opening 301a.

[0171] In step S032, as shown in FIG. 15, the first element material layer in the second opening 301b is removed to form a first type element provided corresponding to the first opening.

[0172] Preferably, the first type element 401 is connected to the conductive material layer 12 on the periphery side of the first opening 301a.

[0173] Preferably, the second electrode 430 of the first type element 401 is connected to the conductive material layer 12 on the periphery side of the first opening 301a.

[0174] Preferably, step S032 may further include removing the sealing material layer 18 outside the first opening 301a, and forming a sealing unit 511 corresponding to the first opening 301a.

[0175] In some preferred embodiments, the isolation material layer includes a first isolation material layer 13, a second isolation material layer 14 located on a side of the first isolation material layer 13 away from the substrate 100, and a conductive material layer 12 located on a side of the first isolation material layer 13 toward the substrate 100. The conductive material layer 12 can be used to form the conductive portion 330 of the isolation structure 300 in any one of the above-mentioned embodiments. The first isolation material layer 13 can be used to form the first isolation portion 310 of the isolation structure 300 in any one of the above-mentioned embodiments. The second isolation material layer 14 can be used to form the second isolation portion 320 of the isolation structure 300 in any one of the above-mentioned embodiments.

[0176] Preferably, as shown in Figure 22, the conductive material layer 12 on the periphery of the second opening 301b has a recessed structure 10a. In step S03, the etching material etches the conductive material layer 12 on the periphery of the second opening 301b to a certain extent, thereby forming the recessed structure 10a.

[0177] Preferably, in step S03, a recess structure 10a is formed in the pixel defining material layer 11 exposed from the second opening, as shown in FIG.

[0178] Preferably, before step S04, As shown in FIG. 16, this may include cleaning the second opening 301b with an etching material and etching at least a portion of the first isolation material layer 13 so that the conductive material layer 12 protrudes toward the second opening 301b relative to the first isolation material layer 13.

[0179] In this preferred embodiment, by cleaning the second opening 301b with an etching material, impurities remaining in the second opening 301b are cleaned and removed, and the etching material also performs an etching process on the first isolation material layer 13 around the second opening 301b, so that the protrusion length of the conductive material layer 12 from the first isolation material layer 13 toward the first opening 301a can be made smaller than the protrusion length of the conductive material layer 12 from the first isolation material layer 13 toward the second opening 301b, thereby making it easy to subsequently form the protrusion length of the conductive portion 330 from the first isolation portion 310 toward the first opening 301a to be smaller than the protrusion length of the conductive portion 330 from the first isolation portion 310 toward the second opening 301b.

[0180] Preferably, step S04 may include:

[0181] In step S041, as shown in FIG. 17, a second element material layer is formed over the entire surface.

[0182] Preferably, the second element material layer 16 may include a second light emitting material layer 16a and a second electrode material layer 16b located on the side of the second light emitting material layer 16a that is farther from the substrate 100.

[0183] Among them, the second light-emitting material layer 16a can be used to form the light-emitting layer 420 of the second element 402 in any one of the above-mentioned embodiments, and the second electrode material layer 16b can be used to form the second electrode 430 of the second element 402 in any one of the above-mentioned embodiments.

[0184] Preferably, step S04 may further include manufacturing an encapsulating material layer 18 over the entire surface of the second element material layer 16. A portion of the encapsulating material layer 18 can be used to form an encapsulating unit 511 corresponding to the second opening 301b.

[0185] In step S042, as shown in FIG. 18, the second element material layer outside the second opening is removed to form a second type element provided corresponding to the second opening.

[0186] Preferably, the second type element 402 is connected to the conductive material layer 12 on the peripheral side of the second opening 301b, and the protruding length of the conductive material layer 12 from the first isolation material layer 13 toward the first opening 301a is smaller than the protruding length of the conductive material layer 12 from the first isolation material layer 13 toward the second opening 301b.

[0187] Preferably, the second electrode 430 of the second type element 402 is connected to the conductive material layer 12 on the periphery side of the second opening 301b.

[0188] Preferably, step S042 may further include removing the sealing material layer 18 outside the second opening 301b, and forming a sealing unit 511 corresponding to the second opening 301b.

[0189] Step S06 includes step S061 of manufacturing a third device material layer over the entire surface, as shown in FIG.

[0190] Among them, the third element material layer 17 can be used to form the third element 403 in any one of the above-mentioned embodiments.

[0191] Preferably, the third element material layer 17 may include a third light emitting material layer 17a and a third electrode material layer 17b located on the side of the third light emitting material layer 17a that is farther away from the substrate 100.

[0192] Among them, the third light-emitting material layer 17a can be used to form the light-emitting layer 420 of the third element 403 in any one of the above-mentioned embodiments, and the third electrode material layer 17b can be used to form the second electrode 430 of the third element 403 in any one of the above-mentioned embodiments.

[0193] Preferably, step S061 may further include forming an encapsulation material layer 18 over the entire surface of the third element material layer 17. A portion of the encapsulation material layer 18 can be used to form the encapsulation unit 511 corresponding to the third opening 301c. In some preferred embodiments, before step S061, cleaning the third opening 301c with an etching material may be performed, and etching at least a portion of the first isolation portion 310 such that the protrusion length of the first isolation portion 310 of the conductive portion 330 toward the third opening 301c is greater than or equal to the protrusion length of the first isolation portion 310 of the conductive portion 330 toward the first opening 301a, or such that the protrusion length of the first isolation portion 310 of the conductive portion 330 toward the third opening 301c is greater than or equal to the protrusion length of the first isolation portion 310 of the conductive portion 330 toward the second opening 301b.

[0194] In this preferred embodiment, the third opening 301c is cleaned with an etching material to clean and remove impurities remaining in the third opening 301c, and the etching material can also etch the first isolation material layer 13, so that the conductive portion 330 of the isolation structure 300 protrudes from the first isolation portion 310 toward the third opening 301c. By adjusting the etching degree of the first isolation material layer 13 around the third opening 301c, it is possible to achieve the following: a protrusion length of the conductive portion 330 from the first isolation portion 310 toward the third opening 301c is greater than or equal to a protrusion length of the conductive portion 330 from the first isolation portion 310 toward the first opening 301a; or a protrusion length of the conductive portion 330 from the first isolation portion 310 toward the third opening 301c is greater than or equal to a protrusion length of the conductive portion 330 from the first isolation portion 310 toward the second opening 301b.

[0195] In step S062, as shown in FIG. 21, the third element material layer outside the third opening is removed, and a third type element is formed corresponding to the third opening.

[0196] Preferably, the third type element 403 is connected to the conductive portion 330 on the peripheral side of the third opening 301c, and the protruding length of the conductive portion 330 from the first isolation portion 310 toward the third opening 301c is greater than or equal to the protruding length of the conductive portion 330 from the first isolation portion 310 toward the first opening 301a.

[0197] Preferably, the length of the conductive portion 330 projecting from the first isolation portion 310 toward the third opening 301c is greater than or equal to the length of the conductive portion 330 projecting from the first isolation portion 310 toward the second opening 301b.

[0198] Preferably, the second electrode 430 of the third kind element 403 is connected to the conductive material layer 12 on the periphery side of the third opening 301c.

[0199] Preferably, step S062 may further include removing the sealing material layer 18 outside the third opening 301c, and forming a sealing unit 511 corresponding to the third opening 301c.

[0200] In some preferred embodiments, before step S01, the manufacturing method further includes forming a pixel defining material layer on the substrate, as shown in FIGS.

[0201] Step S01 includes forming an isolation material layer on a pixel-defining material layer, as shown in FIG.

[0202] In step S02, as shown in FIG. performing a patterning process on the pixel defining material layer exposed through the first opening and the second opening to open pixel openings corresponding to the first opening and the second opening; In step S05, as shown in FIG. The pixel defining material layer exposed through the third opening is patterned to form a pixel opening corresponding to the third opening.

[0203] In the embodiment of the present application, the third opening is not opened before step S05, so the first electrode corresponding to the third opening is not exposed, which can improve the damage to the first electrode caused by the etching process.

[0204] In some preferred embodiments, step S03 includes: cleaning the first and second openings with an etching material to etch at least a portion of the first isolation material layer so that a conductive material layer protrudes from the first isolation material layer toward the first and second openings; Providing a first type element in the first opening.

[0205] In these preferred embodiments, by cleaning the first opening 301a and the second opening 301b with an etching material, the conductive material layer 12 is protruded from the first isolation material layer 13 toward the first opening 301a and the second opening 301b, so that the area of ​​the conductive material layer 12 is large and it is easy to make an overlapping connection between the second electrode 430 and the conductive material layer 12.

[0206] In some preferred embodiments, when the isolation material layer comprises a first isolation material layer 13, a second isolation material layer 14 located on the side of the first isolation material layer 13 away from the substrate 100, and a conductive material layer 12 located on the side of the first isolation material layer 13 facing the substrate 100, step S04 further includes cleaning the second opening with an etching material to etch at least a portion of the first isolation material layer so that the conductive material layer protrudes from the first isolation material layer toward the second opening, as shown in FIG. 16, and providing a second type element in the second opening.

[0207] In the embodiment of the present application, after step S03, the second opening 301b is cleaned with an etching material, thereby improving the effect of the cleaning on the first-type element 401 and enhancing the overlapping connection effect between the second electrode 430 and the conductive material in the second-type element 402.

[0208] In step S06, Step S063: cleaning the third opening with an etching material to etch at least a portion of the first isolation material layer, so that the conductive material layer protrudes from the first isolation material layer toward the third opening; The method further includes a step S064 of providing a third type element in the third opening.

[0209] Preferably, step S064 may include the above-mentioned steps S061 and S062.

[0210] In some preferred embodiments, in step S03, a recess structure 10a is formed in the conductive material layer 12 exposed from the second opening 301b.

[0211] In some preferred embodiments, step S02 precedes step S05, or step S02 follows step S05. That is, after the first opening 301a and the second opening 301b are opened and the first-type elements 401 and the second-type elements 402 are fabricated, the third opening 301c may be opened and the third-type elements 403 may be fabricated. Alternatively, after the third opening 301c is opened and the third-type elements 403 are fabricated, the first opening 301a and the second opening 301b may be opened and the first-type elements 401 and the second-type elements 402 may be fabricated.

[0212] In some preferred embodiments, step S05 further includes opening a fourth opening through the isolation material layer, as shown in Figure 24. After step S04, for example, after step S06, the method further includes providing a fourth type element in the fourth opening, as shown in Figures 25 and 26.

[0213] In these preferred embodiments, the fourth opening 301d is further opened and the fourth type element 404 is manufactured, and the provision of the fourth type element 404 can improve the display effect of the display panel 10. Furthermore, the third opening 301c and the fourth opening 301d are manufactured together, which can improve the manufacturing efficiency of the display panel 10.

[0214] Preferably, step S06 includes the following steps as shown in FIG. The method may further include cleaning the fourth opening with an etching material and etching at least a portion of the first isolation material layer so that the conductive material layer protrudes from the first isolation material layer toward the fourth opening.

[0215] In these preferred embodiments, in step S06, the fourth opening 301d is further cleaned, so that the conductive material layer 12 protrudes from the first isolation material layer 13 toward the fourth opening 301d, facilitating an overlap connection between the second electrode 430 of the fourth type element 404 and the conductive material layer 12.

[0216] Preferably, the step of cleaning the fourth opening 301d with an etching material includes: The method further includes etching at least a portion of the first isolation material layer 13 using an etching material so that a protrusion length of the second isolation material layer 14 toward the third opening 301c relative to the first isolation material layer 13 is smaller than a protrusion length of the second isolation material layer 14 toward the fourth opening 301d relative to the first isolation material layer 13. This can facilitate overlapping connection between the second electrode 430 of the fourth type element 404 and the conductive material layer 12.

[0217] In some preferred embodiments, step S06 includes the following steps, as shown in FIG. The conductive material layer exposed from the fourth opening is etched with an etching material to form a recess structure in the conductive material layer exposed from the fourth opening.

[0218] In these preferred embodiments, when manufacturing the third-type element 403, for example, when an etching material is used to remove the material used to manufacture the third-type element 403 in the area where the first opening 301a and the second opening 301b are located, the conductive material layer 12 exposed from the fourth opening 301d is also etched to form the recess structure 10a.

[0219] In some preferred embodiments, in step S05, a third opening 301c and a fourth opening 301d are opened through the isolation material layer, and the pixel defining material layer 11 exposed through the third opening 301c and the fourth opening 301d is patterned to open pixel openings 220 corresponding to the third opening 301c and the fourth opening 301d.

[0220] Preferably, step S06 includes the following steps as shown in FIG. The pixel defining material layer exposed from the fourth opening is etched with an etching material to form a recess structure.

[0221] In these preferred embodiments, in step S05, not only are third opening 301c and fourth opening 301d opened, but pixel openings 220 corresponding to third opening 301c and fourth opening 301d are also opened in pixel defining material layer 11, thereby improving manufacturing efficiency. In step S06, because fourth opening 301d has already been opened, part of pixel defining material layer 11 is exposed through fourth opening 301d, and this part of pixel defining material layer 11 is easily etched in step S06 to form recess structure 10a.

[0222] In some preferred embodiments, the manufacturing method comprises: Step S07 of opening a fourth opening through the isolation material layer, as shown in FIG. 29; As shown in FIG. 30, the method further includes a step S08 of providing a fourth type element in the fourth opening; Wherein, step S07 is located after step S05, or step S07 is located between step S02 and step S05, or step S07 is located before step S02.

[0223] In these preferred embodiments, the fourth opening 301d may be further opened to fabricate the fourth element 404, and the fourth opening 301d may be opened to fabricate the fourth element 404 before step S02, between step S02 and step S05, or after step S05, so that the inner wall of the fourth opening 301d is less likely to be etched and destroyed when other steps are being performed.

[0224] In some preferred embodiments, step S02 includes: 31, further comprising opening a fourth opening through the isolation material layer; After step S04, as shown in FIG. 32, the method further includes providing a fourth type element in the fourth opening.

[0225] In these preferred embodiments, the first opening 301a, the second opening 301b, and the fourth opening 301d are formed in the same process step, thereby simplifying the manufacturing process and increasing manufacturing efficiency.

[0226] In some preferred embodiments, when step S01 includes the above-mentioned steps S011 and S012, in step S02, a fourth opening 301d may be further opened through the isolation material layer, and the pixel defining material layer 11 exposed from the first opening 301a, the second opening 301b, and the fourth opening 301d may be patterned to open pixel openings 220 corresponding to the first opening 301a, the second opening 301b, and the fourth opening 301d.

[0227] In these preferred embodiments, the manufacturing process can be simplified by opening the first opening 301a, the second opening 301b, and the fourth opening 301d synchronously in step S02.

[0228] Preferably, step S03 includes: cleaning the first opening, the second opening, and the fourth opening with an etching material to etch at least a portion of the first isolation material layer so that a conductive material layer protrudes from the first isolation material layer toward the first opening, the second opening, and the fourth opening; Providing a first type element in the first opening.

[0229] In these preferred embodiments, the etching material further cleans the fourth opening 301d, thereby causing the conductive material layer 12 to protrude from the first isolation material layer 13 toward the fourth opening 301d, facilitating an overlapping connection between the first electrode 410 of the fourth type element 404 and the conductive material layer 12.

[0230] Preferably, in step S04, the method further includes cleaning the second opening and the fourth opening with an etching material to etch at least a portion of the first isolation material layer, so that the conductive material layer is provided protruding from the first isolation material layer toward the second opening and the fourth opening, as shown in FIG. 33; In these preferred embodiments, the etching material further cleans the second opening 301b and the fourth opening 301d, which allows the conductive material layer 12 to have a long protrusion length toward the second opening 301b and the fourth opening 301d relative to the first isolation material layer 13, facilitating mutual overlapping connection between the first electrodes 410 of the second type elements 402 and the fourth type elements 404 and the conductive material layer 12.

[0231] Preferably, the step of cleaning the second opening 301b and the fourth opening 301d with an etching material includes: The method further includes etching at least a portion of the first isolation material layer 13 with an etching material so that the protrusion length of the second isolation material layer 14 toward the first opening 301a relative to the first isolation material layer 13 is smaller than the protrusion lengths of the second isolation material layer 14 toward the second opening 301b and the fourth opening 301d relative to the first isolation material layer 13. This makes it easier to connect the first electrodes 410 of the second type elements 402 and the fourth type elements 404 to the conductive material layer 12 in an overlapping manner.

[0232] In some preferred embodiments, after step S04, as shown in FIG. The method may include cleaning the fourth opening with an etching material and etching at least a portion of the first isolation material layer so that the conductive material layer protrudes from the first isolation material layer toward the fourth opening.

[0233] In these preferred embodiments, the etching material further cleans the fourth opening 301d, which allows the conductive material layer 12 to have a longer protrusion length toward the fourth opening 301d relative to the first isolation material layer 13, making it easier to interconnect the first electrode 410 of the fourth type element 404 and the conductive material layer 12.

[0234] Preferably, the step of cleaning the fourth opening 301d with an etching material includes: The method further includes etching at least a portion of the first isolation material layer 13 with an etching material so that a protrusion length of the second isolation material layer 14 toward the first opening 301 a and the second opening 301 b relative to the first isolation material layer 13 is smaller than a protrusion length of the second isolation material layer 14 toward the fourth opening 301 d relative to the first isolation material layer 13. This makes it easier to connect the first electrodes 410 of the fourth type elements 404 and the conductive material layer 12 to each other by overlapping them.

[0235] Preferably, step S03 includes the following steps as shown in FIG. The method includes etching the pixel defining material layer exposed from the second opening and the fourth opening with an etching material to form a recess structure in the pixel defining material layer exposed from the second opening and the fourth opening.

[0236] In these preferred embodiments, since the first opening 301a, the second opening 301b, and the fourth opening 301d are opened in step S02, when etching the material used to manufacture the first type element 401 in the second opening 301b and the fourth opening 301d, the etching material may affect the pixel defining material layer 11 exposed from the second opening 301b and the fourth opening 301d, forming a recess structure 10a.

[0237] In step S04, as shown in FIG. Etching the pixel defining material layer exposed from the fourth opening with an etching material to form a recess structure in the pixel defining material layer exposed from the fourth opening.

[0238] As described above, since the first opening 301a, the second opening 301b, and the fourth opening 301d are opened in step S02, when the material used to manufacture the second-type element 402 in the fourth opening 301d is etched in step S04, the etching material may affect the pixel defining material layer 11 exposed from the fourth opening 301d, forming a recess structure 10a.

[0239] In some preferred embodiments, step S03 includes the following steps, as shown in FIG. The method includes etching the conductive material layer exposed from the second opening and the fourth opening with an etching material to form a recess structure 10a in the conductive material layer exposed from the second opening and the fourth opening.

[0240] In this preferred embodiment, by forming the recess structure 10a in the conductive material layer 12 exposed from the second opening 301b and the fourth opening 301d, the overlap connection effect between the second electrode 430 and the conductive material in the second type element 402 and the fourth type element 404 can be enhanced.

[0241] In some preferred embodiments, step S04 includes the following steps, as shown in FIG. The conductive material layer exposed from the fourth opening is etched with an etching material to form a recess structure in the conductive material layer exposed from the fourth opening.

[0242] In this preferred embodiment, by forming the recess structure 10a in the conductive material layer 12 exposed from the fourth opening 301d, the overlap connection effect between the second electrode 430 and the conductive material in the fourth type element 404 can be improved.

[0243] FIG. 37 is a schematic diagram of the flow of the method for manufacturing the display panel 10 according to the embodiment of the present application, and FIGS. 38 to 44 are schematic diagrams of the manufacturing process of the method for manufacturing the display panel 10 according to the embodiment of the present application.

[0244] An embodiment of the third aspect of the present application further provides a method for manufacturing a display panel 10. The display panel manufactured by the manufacturing method may be any one of the display panels 10 according to the embodiment of the first aspect described above. With reference to FIG. 37 in conjunction with FIGS. 1 to 8 and 38 to 44, the manufacturing method can be As shown in FIG. 38, step S01′ of forming a pixel defining material layer on a substrate; As shown in FIG. 39, step S02′ of forming an isolation material layer on the pixel defining material layer; Step S03', as shown in FIG. 40, opens a first opening, a second opening, and a third opening through the isolation material layer; As shown in FIG. 41, a step S04′ of opening pixel openings corresponding to the first opening and the second opening in the pixel defining material layer; As shown in FIG. 42, step S05′ of providing a first-kind element in a pixel opening corresponding to the first opening and a second-kind element in a pixel opening corresponding to the second opening; Step S06', as shown in FIG. 43, opens a pixel opening in the pixel defining material layer corresponding to the third opening; As shown in FIG. 44, the method includes a step S07' of providing a third type element in a pixel opening corresponding to the third opening.

[0245] In this embodiment, different pixel openings 220 are opened in steps S04' and S06', respectively. For example, if step S04' precedes step S06', in step S05', the pixel defining material corresponding to the third opening 301c can protect the underlying first electrode 410 and reduce the impact of the etching material on the first electrode 410 corresponding to the third opening 301c to be fabricated later. Alternatively, if step S04' follows step S06', in step S07', the pixel defining material corresponding to the first opening 301a and the second opening 301b can protect the underlying first electrode 410 and reduce the impact of the etching material on the first electrode 410 corresponding to the third opening 301c to be fabricated later.

[0246] In some preferred embodiments, step S04' may precede step S06', or step S04' may follow step S06'. Steps S04' and S06' may be two different process steps.

[0247] An embodiment of the third aspect of the present application provides a display device including the display panel 10 of any one of the above-described embodiments. The display device according to the embodiment of the third aspect of the present application includes the display panel 10 of any one of the above-described embodiments of the first aspect, or includes the display panel 10 manufactured by the manufacturing method of any one of the above-described embodiments of the second aspect, and therefore has the beneficial effects of the display panel 10 of any one of the above-described embodiments of the first aspect or the display panel 10 manufactured by the manufacturing method of any one of the above-described embodiments of the second aspect, which will not be described again here.

[0248] The display device in the embodiments of the present application includes, but is not limited to, devices with display capabilities such as mobile phones, personal digital assistants (abbreviated as PDA), tablets, e-books, televisions, access control, smart landlines, and consoles.

[0249] According to the above-described embodiments of the present application, these embodiments do not describe all details in detail, nor are they intended to limit the present invention to specific embodiments. Based on the above description, various modifications and variations are possible. The present application is limited only by the claims, their full scope, and equivalents.

Claims

1. A substrate; a pixel defining layer provided on one side of the substrate, the pixel defining layer including a pixel defining portion and a pixel opening formed by being surrounded and closed by the pixel defining portion; an isolation structure provided on one side of the substrate, the isolation structure having an isolation opening communicating with the pixel opening; a light-emitting element at least partially located within the pixel aperture; a recessed structure is provided on a side of the pixel limiting portion exposed from within at least a part of the isolation opening, the side being away from the substrate; A display panel characterized by:

2. the isolating opening includes a first opening and a second opening, the light-emitting element includes a first kind of element provided corresponding to the first opening and a second kind of element provided corresponding to the second opening, which emit light of different colors, and the recess structure is provided on a side of the pixel limiting portion exposed from the second opening that is separated from the substrate, a first flat surface is provided on a side of the pixel limiting portion exposed from the first opening that is separated from the substrate; the isolating opening further includes a third opening, the light emitting element includes a third type element provided corresponding to the third opening, and the recessed structure or a first flat surface is provided on a side of the pixel limiting portion exposed from the third opening that is separated from the substrate, the isolating opening further includes a fourth opening, the light emitting element includes a fourth type element provided corresponding to the fourth opening, and the recessed structure or a first flat surface is provided on a side of the pixel limiting portion exposed from the fourth opening that is separated from the substrate, The first type element is a light-emitting element that emits blue light, the second type element is a light-emitting element that emits green light, the third type element is a light-emitting element that emits red light, and the fourth type element is a light-emitting element that emits white light.

2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

3. a film layer of the light-emitting element is partially located within the recess structure; In a direction away from the substrate, the light-emitting element includes a first electrode, a light-emitting layer, and a second electrode that are sequentially stacked, and a portion of the light-emitting layer is located within the recess structure, and / or a portion of the second electrode is located within the recess structure.

2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

4. The number of the recessed structures may be one or more, and the recessed structures may be spaced apart and / or connected to each other.

2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

5. the isolation structure includes a first isolation portion and a second isolation portion having a first protrusion located on a side of the first isolation portion away from the substrate and protruding from the first isolation portion toward the isolation opening, an orthogonal projection of the recess structure on the substrate is at least partially located within an orthogonal projection of the first protrusion on the substrate; 5. The display panel according to claim 1, wherein the first and second electrodes are electrically connected to each other.

6. the isolation opening includes a first opening and a second opening, the light-emitting element includes a first type element provided corresponding to the first opening and a second type element provided corresponding to the second opening, and a protrusion length of the second isolation portion toward the first opening relative to the first isolation portion is smaller than a protrusion length of the second isolation portion toward the second opening relative to the first isolation portion; 6. The display panel according to claim 5.

7. the first isolation portion has a first surface on a side away from the substrate, the second isolation portion has a second surface on a side facing the substrate, a first spacing distance exists between an orthogonal projection on the substrate of an edge of the first surface corresponding to the first opening and an orthogonal projection on the substrate of an edge of the second surface corresponding to the first opening, and a second spacing distance exists between an orthogonal projection on the substrate of an edge of the first surface corresponding to the second opening and an orthogonal projection on the substrate of an edge of the second surface corresponding to the second opening, the first spacing distance being smaller than the second spacing distance; the first isolation portion has a third surface on a side closer to the substrate, a third spacing distance being between an orthogonal projection, on the substrate, of an edge of the third surface corresponding to the first opening and an orthogonal projection, on the substrate, of an edge of the second surface corresponding to the first opening, and a fourth spacing distance being between an orthogonal projection, on the substrate, of an edge of the third surface corresponding to the second opening and an orthogonal projection, on the substrate, of an edge of the second surface corresponding to the second opening, the third spacing distance being smaller than the fourth spacing distance; 7. The display panel according to claim 6, wherein the first and second electrodes are arranged parallel to each other.

8. the isolation opening further includes a third opening, the light-emitting element includes a third type element provided corresponding to the third opening, and a protruding length of the second isolation portion toward the third opening relative to the first isolation portion is not smaller than a protruding length of the second isolation portion toward the first opening relative to the first isolation portion and / or is not larger than a protruding length of the second isolation portion toward the second opening relative to the first isolation portion; 7. The display panel according to claim 6, wherein the first and second electrodes are arranged parallel to each other.

9. a fifth separation distance not smaller than the first separation distance and / or not larger than the second separation distance between an orthogonal projection on the substrate of an edge of the first surface corresponding to the third opening and an orthogonal projection on the substrate of an edge of the second surface corresponding to the third opening; a sixth spacing distance not smaller than the third spacing distance and / or not larger than the fourth spacing distance between an orthogonal projection on the substrate of an edge of the third surface corresponding to the third opening and an orthogonal projection on the substrate of an edge of the second surface corresponding to the third opening; 9. The display panel according to claim 8.

10. the isolation opening further includes a fourth opening, the light-emitting element includes a fourth type element provided corresponding to the fourth opening, and a protrusion length of the second isolation portion toward the fourth opening relative to the first isolation portion is greater than or equal to a protrusion length of the second isolation portion toward the third opening relative to the first isolation portion; 9. The display panel according to claim 8.

11. a seventh separation distance not smaller than the first separation distance and / or not larger than the second separation distance between an orthogonal projection on the substrate of an edge of the first surface corresponding to the fourth opening and an orthogonal projection on the substrate of an edge of the second surface corresponding to the fourth opening; a fifth spacing distance exists between an orthogonal projection on the substrate of an edge of the first surface corresponding to the third opening and an orthogonal projection on the substrate of an edge of the second surface corresponding to the third opening, and the seventh spacing distance is greater than or equal to the fifth spacing distance; an eighth separation distance not smaller than the third separation distance and / or not larger than the fourth separation distance between an orthogonal projection on the substrate of an edge of the third surface corresponding to the fourth opening and an orthogonal projection on the substrate of an edge of the second surface corresponding to the fourth opening; a sixth spacing distance is between an orthogonal projection on the substrate of an edge of the third surface corresponding to the third opening and an orthogonal projection on the substrate of an edge of the second surface corresponding to the third opening, and the eighth spacing distance is greater than or equal to the sixth spacing distance; 11. The display panel according to claim 10.

12. the isolation structure further includes a conductive portion having a second protrusion provided on a side of the first isolation portion facing the substrate and protruding from the first isolation portion toward the isolation opening, and at least a part of the conductive portion has a recess structure on a side of the second protrusion away from the substrate, the isolation opening includes a first opening and a second opening, the light-emitting element includes a first type element provided corresponding to the first opening and a second type element provided corresponding to the second opening, and the recess structure is provided on a side of the second protrusion provided to protrude from the first isolation portion toward the second opening, the side being separated from the substrate; the second protruding portion protruding from the first isolation portion toward the first opening has a second flat surface on a side away from the substrate, the isolation opening further includes a third opening, the light emitting element includes a third type element provided corresponding to the third opening, the second protruding portion protruding from the first isolation portion toward the third opening has the recessed structure on a side away from the substrate, or the second protruding portion protruding from the first isolation portion toward the third opening has a second flat surface on a side away from the substrate, the isolation opening further includes a fourth opening, the light-emitting element includes a fourth type element provided corresponding to the fourth opening, and the second protruding portion provided to protrude from the first isolation portion toward the fourth opening has the recessed structure on a side away from the substrate, or the second protruding portion provided to protrude from the first isolation portion toward the fourth opening has a second flat surface on a side away from the substrate.

6. The display panel according to claim 5.

13. a portion of the light emitting element is located within the recess structure of the conductive portion; the light-emitting element includes a first electrode, a light-emitting layer, and a second electrode connected to the conductive portion and partially located within the recessed structure of the conductive portion, which are sequentially stacked in a direction away from the substrate; the second electrode is further connected to the first isolation portion; 13. The display panel according to claim 12.

14. the isolation opening includes a first opening and a second opening, the light-emitting element includes a first type element provided corresponding to the first opening and a second type element provided corresponding to the second opening, the isolation structure includes a first isolation portion and a conductive portion located on a side of the first isolation portion facing the substrate, a protruding length of the conductive portion toward the first opening relative to the first isolation portion is smaller than a protruding length of the conductive portion toward the second opening relative to the first isolation portion, a protrusion length of the conductive portion toward the first opening with respect to the first isolation portion ranges from 0.05 micrometers to 0.4 micrometers; a protruding length of the conductive portion from the first isolation portion toward the second opening is greater than a protruding length of the conductive portion from the first isolation portion toward the first opening, but is not greater than three times a protruding length of the conductive portion from the first isolation portion toward the first opening; a protruding length of the conductive portion toward the second opening relative to the first isolation portion is not smaller than a protruding length of 3 / 2 times the conductive portion toward the first opening relative to the first isolation portion, and is not larger than a protruding length of 2 times the conductive portion toward the first opening relative to the first isolation portion, 2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

15. the isolation opening further includes a third opening, the light-emitting element includes a third type element provided corresponding to the third opening, a protrusion length of the conductive portion from the first isolation portion toward the third opening is not smaller than a protrusion length of the conductive portion from the first isolation portion toward the first opening and / or a protrusion length of the conductive portion from the first isolation portion toward the second opening, the isolation opening further includes a fourth opening, the light-emitting element includes a fourth type element provided corresponding to the fourth opening, and a protrusion length of the conductive portion toward the fourth opening relative to the first isolation portion is greater than or equal to a protrusion length of the conductive portion toward the third opening relative to the first isolation portion; 15. The display panel according to claim 14.

16. A substrate; an isolation structure including a conductive portion provided on one side of the substrate, the conductive portion having an isolation opening, a first isolation portion, and a second protrusion provided on a side of the first isolation portion facing the substrate, the second protrusion protruding from the first isolation portion toward the isolation opening; a light emitting element at least partially located within the isolation opening; a recessed portion is formed on a side of at least a part of the conductive portion that is separated from the substrate by the second protrusion portion; A display panel characterized by:

17. the isolation opening includes a first opening and a second opening, the light-emitting element includes a first type element provided corresponding to the first opening and a second type element provided corresponding to the second opening, and the recess structure is provided on a side of the second protrusion provided to protrude from the first isolation portion toward the second opening, the side being separated from the substrate; the second protruding portion protruding from the first isolation portion toward the first opening has a second flat surface on a side away from the substrate, the isolation opening further includes a third opening, the light-emitting element includes a third type element provided corresponding to the third opening, the second protruding portion provided to protrude from the first isolation portion toward the third opening has the recessed structure on a side away from the substrate, or the second protruding portion provided to protrude from the first isolation portion toward the third opening has a second flat surface on a side away from the substrate, the isolation opening further includes a fourth opening, the light-emitting element includes a fourth type element provided corresponding to the fourth opening, and the second protruding portion provided to protrude from the first isolation portion toward the fourth opening has the recessed structure on a side away from the substrate, or the second protruding portion provided to protrude from the first isolation portion toward the fourth opening has a second flat surface on a side away from the substrate.

17. The display panel according to claim 16.

18. the light-emitting element is partially located within the recess structure; It is preferable that the light-emitting element includes a first electrode, a light-emitting layer, and a second electrode connected to the conductive portion and partially located within the recess structure, which are sequentially stacked in a direction away from the substrate.

17. The display panel according to claim 16.

19. The number of the recessed structures may be one or more, and the recessed structures may be spaced apart and / or connected to each other.

17. The display panel according to claim 16.

20. forming an isolation material layer on a substrate; creating a first opening and a second opening through the isolation material layer; providing a first type element in the first opening; fabricating a second-type element in the second opening, the second-type element having a different light emission color than the first-type element; creating a third opening through the isolation material layer; and providing a third type element in the third opening.

10. A display panel manufacturing method comprising:

21. Providing a first type element in the first opening includes: forming a first device material layer over the entire surface; removing the first element material layer in the second opening to form a first type element corresponding to the first opening; Providing a second type element in the second opening includes: forming a second device material layer over the entire surface; removing the second element material layer outside the second opening to form a second type element corresponding to the second opening; Providing a third type element in the third opening forming a third device material layer over the entire surface; removing the third element material layer outside the third opening, and forming a third type element provided corresponding to the third opening.

21. The method for manufacturing a display panel according to claim 20.

22. Prior to forming the isolation material layer on the substrate, forming a pixel-defining material layer on the substrate; Forming an isolation material layer on a substrate includes: forming the isolating material layer on the pixel defining material layer; The forming of the first and second openings through the isolation material layer includes: performing a patterning process on the pixel defining material layer exposed through the first opening and the second opening to open pixel openings corresponding to the first opening and the second opening; The forming of a third opening through the isolation material layer includes: performing a patterning process on the pixel defining material layer exposed through the third opening to open a pixel opening corresponding to the third opening; In providing the first type element in the first opening, it is preferable to form a recess structure in the pixel defining material layer exposed from the second opening.

21. The method for manufacturing a display panel according to claim 20.

23. the isolation material layer comprises a first isolation material layer, a second isolation material layer located on a side of the first isolation material layer away from the substrate, and a conductive material layer located on a side of the first isolation material layer facing the substrate; Providing a first type element in the first opening includes: cleaning the first and second openings with an etching material to etch at least a portion of the first isolation material layer so that the conductive material layer protrudes from the first isolation material layer toward the first and second openings; and providing the first type element in the first opening.

21. The method for manufacturing a display panel according to claim 20.

24. the isolation material layer comprises a first isolation material layer, a second isolation material layer located on a side of the first isolation material layer away from the substrate, and a conductive material layer located on a side of the first isolation material layer facing the substrate; Providing a second type element in the second opening includes: cleaning the second opening with an etching material to etch at least a portion of the first isolation material layer so that the conductive material layer protrudes from the first isolation material layer toward the second opening; and providing the second type element in the second opening; Cleaning the second opening with an etching material includes: Preferably, the method further includes etching at least a portion of the first isolation material layer with an etching material, so that a protruding length of the second isolation material layer toward the first opening relative to the first isolation material layer is smaller than a protruding length of the second isolation material layer toward the second opening relative to the first isolation material layer.

21. The method for manufacturing a display panel according to claim 20.

25. the isolation material layer comprises a first isolation material layer, a second isolation material layer located on a side of the first isolation material layer away from the substrate, and a conductive material layer located on a side of the first isolation material layer facing the substrate; Providing a third type element in the third opening includes: cleaning the third opening with an etching material to etch at least a portion of the first isolation material layer so that the conductive material layer protrudes from the first isolation material layer toward the third opening; and providing the third type element in the third opening.

21. The method for manufacturing a display panel according to claim 20.

26. the isolation material layer comprises a first isolation material layer and a conductive material layer located on a side of the first isolation material layer facing the substrate; In providing a first type element in the first opening, a recess structure is formed in the conductive material layer exposed from the second opening; 21. The method for manufacturing a display panel according to claim 20.

27. forming a first opening and a second opening through the isolation material layer prior to forming a third opening through the isolation material layer; Alternatively, opening the first and second openings through the isolation material layer is performed after opening a third opening through the isolation material layer.

21. The method for manufacturing a display panel according to claim 20.

28. The forming of a third opening through the isolation material layer includes: creating a fourth opening through the isolation material layer; After providing the third type element in the third opening, and further including providing a fourth type element in the fourth opening; Alternatively, the manufacturing method includes: creating a fourth opening through the isolation material layer; and providing a fourth type element in the fourth opening; The opening of the fourth opening through the isolation material layer is located after the opening of the third opening through the isolation material layer, or is located between the opening of the first and second openings through the isolation material layer and the opening of the third opening through the isolation material layer, or is located before the opening of the first and second openings through the isolation material layer; Alternatively, forming the first and second openings through the isolation material layer may include: and forming a fourth opening through the isolation material layer; After providing the second type element in the second opening, Further comprising providing a fourth type element in the fourth opening.

28. The method for manufacturing a display panel according to claim 20.

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