Substrate pressing device and substrate pressing method

Abstract

To easily mount an electronic component on a solder precoat.SOLUTION: The disclosed substrate pressing device 400 includes a backup portion 405 having a first main surface 1a and a second main surface 1b opposite to the first main surface 1a and having a support surface 1b that supports, from below, the second main surface 405T of the substrate 1 on which the solder precoats 3 are formed on the first main surface 407S, a pair of side clampers 407 that have clamp surface 407S abutting against side surfaces of the substrate 1 and clamp the substrate 1 supported by the backup portion 405 with the clamp surface 1a interposed therebetween, and a roller 432 that presses the substrate 1 clamped by the side clampers 407 from the first main surface wall side to crush top portions of the solder precoats 3. When viewed from the normal direction of first main surface 1a, rotation axis A of roller 432 intersects with the direction in which clamp surface 407S extends.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a substrate pressing device and a substrate pressing method. [Background technology]

[0002] Conventionally, there is known a flux applicator that applies flux to a substrate having a solder precoat formed on a land (hereinafter also referred to as a solder precoated substrate) (for example, Patent Document 1). The flux applicator of Patent Document 1 applies flux to the solder precoat of the solder precoated substrate by a screen printing method. Electronic components are mounted on the solder precoat to which the flux has been applied. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 8-250846 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the surface of the solder precoat is curved due to the surface tension of the solder. When attempting to mount an electronic component on such a curved solder precoat, there is a risk that the electronic component will slip off the solder precoat. In this situation, one of the objectives of the present disclosure is to make it possible to easily mount an electronic component on a solder precoat. [Means for solving the problem]

[0005] One aspect of the present disclosure relates to a substrate pressing device, which includes: a backup unit having a support surface that supports from below a substrate having a first main surface and an opposite second main surface, the second main surface having a solder precoat formed on the first main surface; a pair of side clampers having clamping surfaces that abut against side surfaces of the substrate and clamp the substrate supported by the backup unit between the clamping surfaces; and rollers that press the substrate clamped by the side clampers from the first main surface side to crush the top of the solder precoat, wherein the rotation axis of the rollers intersects with the direction in which the clamping surfaces extend when viewed from a normal direction to the first main surface.

[0006] Another aspect of the present disclosure relates to a substrate pressing method, the substrate pressing method comprising: a preparation step of preparing a substrate having a first main surface and an opposite second main surface, the first main surface being coated with a solder precoat; a support step of supporting the second main surface of the substrate with a support surface of a backup unit; a clamping step of clamping the substrate by pressing clamp surfaces of a pair of side clampers against side surfaces of the substrate; and a pressing step of pressing the supported and clamped substrate from the first main surface side with a roller to crush a top of the solder precoat, wherein in the pressing step, the roller crushes the top of the solder precoat with a state in which the rotation axis of the roller intersects with the extension direction of the clamp surface as viewed from a normal direction of the first main surface. [Effects of the Invention]

[0007] According to the present disclosure, electronic components can be easily mounted on the solder precoat. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a front view schematically showing the configuration of a mounting substrate manufacturing apparatus according to a first embodiment. [Figure 2] 1 is a front view schematically showing the configuration of a flux application device (substrate pressing device) according to a first embodiment. [Figure 3]1 is a side view schematically showing the configuration of a flux application device (substrate pressing device) according to a first embodiment. [Figure 4] 10 is a plan view for explaining an example of the orientation of the roller and the pair of side clampers. FIG. [Figure 5] 10 is a plan view for explaining another example of the orientation of the roller and the pair of side clampers. FIG. [Figure 6A] 10A and 10B are diagrams for explaining a supporting step and a clamping step. [Figure 6B] FIG. 10 is a diagram for explaining a pressing step. [Figure 6C] 10A and 10B are diagrams for explaining a substrate placement step and a flux placement step. [Figure 7] 10A to 10C are diagrams illustrating a pressing step, a substrate placement step, and a flux placement step according to the first embodiment. [Figure 8] FIG. 10 is a side view schematically showing the configuration of a flux application device (substrate pressing device) of a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] The following describes an example of an embodiment of a substrate pressing device and a substrate pressing method according to the present disclosure. However, the present disclosure is not limited to the example described below. While the following description may use specific numerical values ​​and materials, other numerical values ​​and materials may be used as long as the effects of the present disclosure are obtained.

[0010] (Substrate pressing device) A substrate pressing device according to the present disclosure includes a backup unit, a pair of side clampers, and a roller.

[0011] The backup unit has a support surface that supports from below the second main surface of a substrate having a first main surface and a second main surface opposite to the first main surface. A solder precoat is formed on the first main surface of the substrate. The solder precoat may be formed by melting and solidifying solder particles contained in cream solder. The solder precoat may be formed on lands provided on the first main surface of the substrate. The backup unit may support the substrate from below with the support surface while the second main surface faces downward. The backup unit may, for example, be a block-shaped member that receives and supports the second main surface of the substrate with one support surface, or may be a plurality of pin-shaped members that receive and support the second main surface of the substrate with multiple support surfaces.

[0012] The pair of side clampers have clamping surfaces that come into contact with the side surfaces of the substrate, and clamp the substrate supported by the backup unit by sandwiching it with the clamping surfaces. The side surfaces may be areas that connect the first main surface and the second main surface. The clamping surfaces of each side clamper may extend along the transport direction of the substrate. The pair of side clampers may clamp the substrate with its first main surface facing upward by sandwiching it from the sides with the clamping surfaces.

[0013] The roller crushes the top of the solder precoat by pressing the substrate clamped by the side clamper from the first main surface side. The roller may crush the top of the solder precoat by pressing the substrate from above with the first main surface facing upward. When crushing the top of the solder precoat, the roller may roll on the first main surface of the substrate while rotating around its own rotation axis.

[0014] The rollers flatten the top of the solder precoat, making it easier to mount electronic components on the solder precoat. That is, the rollers flatten the top of the solder precoat, making it less likely for electronic components to slide off.

[0015] The backup unit supports the substrate by contacting the second main surface at a position away from the side surface toward the center of the substrate. Therefore, the backup unit is located away from the clamping surface of each side clamper when viewed from the normal direction of the first main surface (e.g., when viewed from above). The inventors discovered that if an attempt is made to crush the top of the solder precoat with a roller extending parallel to the clamping surface, the roller, viewed from the normal direction of the first main surface, passes through a gap between the clamping surface and the backup unit, causing the substrate to lift up and come off the side clamper. This problem occurs because the pressing force of the roller is concentrated on the portion of the substrate corresponding to the gap.

[0016] In contrast, in the substrate pressing device of the present disclosure, when viewed from the normal direction of the first main surface (for example, when viewed from above), the rotation axis of the roller intersects with the extension direction of the clamping surface. In other words, the roller of the present disclosure has a shape that extends intersecting with the extension direction of the clamping surface. With this configuration, when the roller passes through the gap when viewed from the normal direction of the first main surface, the concentration of the pressing force of the roller on the portion of the substrate corresponding to the gap is alleviated, making it less likely that the substrate will come off the side clamper.

[0017] When viewed from the normal direction of the first main surface, the angle between the rotation axis of the roller and the extension direction of the clamping surface may be 1° or more and 10° or less. Setting this angle to 1° or more sufficiently prevents the substrate from lifting. Setting this angle to 10° or less allows the roller to roll smoothly, for example, along the opposing direction of the pair of side clampers. The angle may be 3° or more and 8° or less. The pair of side clampers may clamp the rectangular substrate by abutting against the longer sides of the substrate. In this case, setting this angle to 10° or less allows the roller to roll along the shorter sides of the substrate, thereby shortening the time required to crush the solder precoat.

[0018] The substrate pressing device may further include an angle adjustment unit that rotates the roller and the pair of side clampers relative to one another in a horizontal plane to adjust the intersection of the rotation axis of the roller with the extension direction of the clamping surfaces when viewed from the normal direction of the first main surface. This configuration allows the angle to be optimized depending on the dimensions of various substrates. The angle adjustment unit may rotate both the roller and the pair of side clampers in a horizontal plane. Alternatively, the angle adjustment unit may rotate only the roller in a horizontal plane, or only the pair of side clampers in a horizontal plane. The angle adjustment unit may adjust the angle between the rotation axis of the roller and the extension direction of the clamping surfaces within a range of 1° or more and 10° or less by such rotational movement.

[0019] The roller may roll in a direction intersecting the direction in which the clamping surface extends when viewed from the normal direction of the first main surface. In other words, the roller may roll in a direction intersecting the direction in which the side surface of the substrate (the side surface that contacts the clamping surface) extends when viewed from the normal direction of the first main surface. In this case, the rolling direction of the roller may be perpendicular to the rotation axis of the roller.

[0020] The rollers may roll in a direction perpendicular to the clamping surface as viewed from the normal to the first main surface. In this case, the direction in which the rotation axes of the rollers extend must intersect the direction in which the rollers roll as viewed from the normal to the first main surface. This angle may be, for example, greater than or equal to 80° and less than or equal to 89°.

[0021] The board pressing device may further include a flux application unit that applies flux to the solder precoat whose top has been crushed by the roller. In this case, the board pressing device may be said to be a board pressing device with a flux application function, or a flux application device with a board pressing function. Note that the board pressing device may not include a flux application unit and may be provided upstream of an independent flux application device.

[0022] (Substrate pressing method) The substrate pressing method according to the present disclosure includes a preparing step, a supporting step, a clamping step, and a pressing step.

[0023] In the preparation step, a substrate having a first main surface and a second main surface opposite thereto is prepared. A solder precoat is formed on the first main surface of the substrate. The substrate further has a side surface. The side surface may be a region connecting the first main surface and the second main surface.

[0024] In the supporting step, the second main surface of the substrate is supported by a supporting surface of the backup unit. In the supporting step, the substrate with the second main surface facing downward may be supported from below by the supporting surface of the backup unit.

[0025] In the clamping step, the clamping surfaces of the pair of side clampers are pressed against the side surfaces of the substrate to clamp the substrate. The clamping surfaces of the side clampers may extend along the substrate transport direction.

[0026] In the pressing step, the supported substrate is pressed from the first main surface side with a roller to crush the top of the solder precoat. Electronic components can be easily mounted on the solder precoat with its top crushed.

[0027] When viewed from the normal direction of the first main surface (for example, viewed from above), there is a gap between the clamping surface of each side clamper and the support surface of the backup unit, and as described above, there is a risk that the substrate may lift up during the pressing process due to the existence of this gap.

[0028] In the substrate pressing method of the present disclosure, in the pressing step, the roller crushes the top of the solder precoat with the roller's rotation axis intersecting the direction in which the clamping surface extends when viewed from the normal direction of the first main surface (e.g., viewed from above). This prevents the roller from lifting the substrate, as described above.

[0029] In the pressing step, the angle between the rotation axis of the roller and the direction in which the clamping surface extends, as viewed from the normal direction of the first main surface, may be 1° or more and 10° or less. By setting this angle to 1° or more, lifting of the substrate can be sufficiently prevented. Furthermore, by setting this angle to 10° or less, when the roller is rolled along the opposing direction of a pair of side clampers, the rolling can be performed smoothly. The angle may be 3° or more and 8° or less.

[0030] In the pressing step, the roller may be rolled in a direction intersecting the direction in which the clamping surface extends when viewed from the normal direction of the first main surface. In other words, the roller may be rolled in a direction intersecting the direction in which the side surface of the substrate (the side surface that contacts the clamping surface) extends. In this case, the rolling direction of the roller may be perpendicular to the rotation axis of the roller.

[0031] In the pressing step, the roller may be rolled in a direction perpendicular to the clamping surface as viewed from the normal direction of the first main surface. In this case, the direction in which the rotation axis of the roller extends must intersect with the rolling direction of the roller as viewed from the normal direction of the first main surface. This angle may be, for example, 80° or more and 89° or less.

[0032] As described above, according to the present disclosure, by crushing the top of the solder pre-coat, electronic components can be easily mounted on the solder pre-coat. Furthermore, according to the present disclosure, when the solder pre-coat is crushed by the roller, the board can be prevented from lifting up and coming off the side clamper.

[0033] An example of a substrate pressing device and a substrate pressing method according to the present disclosure will be described in detail below with reference to the drawings. The components and steps described above can be applied to the components and steps of the example substrate pressing device and substrate pressing method described below. The components and steps of the example substrate pressing device and substrate pressing method described below can be modified based on the above description. Furthermore, the matters described below may be applied to the above embodiment. Among the components and steps of the example substrate pressing device and substrate pressing method described below, components and steps that are not essential to the substrate pressing device and substrate pressing method according to the present disclosure may be omitted. Note that the diagrams shown below are schematic and do not accurately reflect the shapes and numbers of actual components.

[0034] First Embodiment A first embodiment of the present disclosure will be described below. A mounting substrate manufacturing apparatus 10 (hereinafter also simply referred to as manufacturing apparatus 10) of this embodiment is an apparatus for manufacturing a mounting substrate on which a plurality of electronic components are mounted.

[0035] (Mounted circuit board manufacturing equipment) As shown in FIG. 1, the manufacturing apparatus 10 includes a substrate conveying line 11, an information processing device 20, a loader 50, a solder precoat forming device 90, a solder precoat inspection device 300, a flux applying device 400, electronic component mounting devices 501 and 502, a mounting state inspection device 600, a reflow device 700, a substrate inspection device 800, and an unloader 900. The components from the loader 50 to the unloader 900 are arranged in this order from upstream to downstream. A known configuration may be applied to configurations other than those specific to the present disclosure. Hereinafter, the electronic component mounting devices 501 and 502 may be collectively referred to as the electronic component mounting device 500.

[0036] (Substrate transfer line) The substrate conveying line 11 conveys the substrate 1 (see FIG. 2) from the solder precoat forming device 90 to the substrate inspection device 800. The substrate conveying line 11 may be a single continuous conveyor, or may be configured with multiple conveyors arranged in series. The substrate conveying line 11 may be a conveyor using a known belt, chain, roller, transfer device, or the like.

[0037] (Information processing device) The information processing device 20 is communicably connected to other elements included in the manufacturing apparatus 10 (such as the solder precoat forming device 90, the solder precoat inspection device 300, the flux applying device 400, the electronic component mounting device 500, and the reflow device 700) via a wired or wireless local area network 20N. The information processing device 20 exchanges data with these devices. In this way, the information processing device 20 manages the processes performed in the manufacturing apparatus 10.

[0038] The information processing device 20 has an arithmetic processing device and a storage device. The arithmetic processing device is configured with a CPU (Central Processing Unit) and the like. The storage device is configured with one or more RAMs (Random Access Memories), hard disks and the like. These may be configured as separate circuits or LSIs (Large Scale Integrated Circuits), or may be configured as an integrated unit. The storage device stores programs required for each device of the manufacturing apparatus 10 and the data required for them.

[0039] (loader and unloader) The loader 50 supplies substrates stored in a rack (not shown) to the solder precoat forming device 90. The unloader 900 retrieves completed mounted substrates into the rack. Each device from the solder precoat forming device 90 to the substrate inspection device 800 includes a conveyor (substrate transport line 11) for transporting substrates. Each conveyor is positioned so that it can receive substrates from a device on the upstream side (loader 50 side) and hand them over to a device on the downstream side (unloader 900 side).

[0040] (Solder pre-coating device) The solder precoat forming device 90 is a device that forms a solder precoat 3 (see FIG. 7) on lands 2 (see FIG. 7) provided on the first main surface 1a of the substrate 1. The solder precoat forming device 90 has a solder paste supply unit 100, a heating unit 210, and a cooling unit 220. A part of the substrate conveying line 11 is arranged inside these units.

[0041] The solder paste supply unit 100 supplies solder paste to the lands 2 of the substrate 1, for example, by screen printing. The heating unit 210 heats the solder paste supplied to the lands 2, melting the solder particles contained in the solder paste. The cooling unit 220 cools and solidifies the melted solder particles. As a result, a solder precoat 3 is formed on the lands 2 of the substrate 1. Here, residue of flux components is present on the surface of the solder precoat 3. This residue is formed when the thermoplastic resin contained in the flux liquefies upon heating, spreads over the surface of the solder precoat 3, and then solidifies into a film upon cooling. The substrate 1 with the solder precoat 3 formed thereon is transported to the solder precoat inspection device 300 by the substrate transport line 11.

[0042] (Solder pre-coat inspection device) The solder precoat inspection device 300 is a device that inspects whether the solder precoat 3 is properly formed. The solder precoat inspection device 300 may, for example, detect the thickness of the solder precoat 3 and determine whether the solder precoat 3 is properly formed based on the detected thickness. The board 1 that is determined to have the solder precoat 3 properly formed is transported by the board transport line 11 to the flux application device 400.

[0043] (Flux application device) The flux application device 400 is a device that applies flux for reflow soldering onto the solder pre-coat 3. There are no particular limitations on the method of applying the flux. For example, the flux may be applied onto the solder pre-coat 3 by a screen printing method using a mask and a squeegee, by a dispenser that ejects flux from a nozzle, or by a sprayer that sprays flux. The flux application device 400 is an example of a board pressing device. The configuration of the flux application device 400 will be described in detail later. The board 1 to which the flux has been applied is transported to the electronic component mounting device 500 by the board transport line 11.

[0044] (Electronic component mounting equipment) The electronic component mounting device 500 is a device that mounts electronic components (not shown) on a solder precoat 3 covered with flux. The electronic component mounting device 500 may mount the electronic components on the solder precoat 3 using, for example, a suction nozzle (not shown) that sucks the electronic components. After the mounting of the electronic components is complete, the board 1 is transported to a mounting state inspection device 600 by a board transport line 11.

[0045] (Mounting status inspection device) The mounting state inspection device 600 is a device that inspects the mounting state of electronic components. The mounting state inspection device 600 may use an optical measuring device such as a camera or a three-dimensional measuring machine to recognize the mounting state of electronic components, such as their mounting position, posture, and presence or absence, and determine whether they meet predetermined standards. After inspection, the board 1 is transported to the reflow device 700 by the board transport line 11.

[0046] (reflow equipment) The reflow device 700 heats the board 1 on which electronic components are mounted to melt the solder precoat 3 and solder the electronic components to the lands 2 (see FIG. 7). This produces a mounted board on which electronic components are mounted. The board 1 (mounted board) on which the electronic components have been soldered is transported to the board inspection device 800 by the board transport line 11.

[0047] (Board inspection equipment) The board inspection device 800 is a device that inspects whether a mounted board is good or bad. After the inspection by the board inspection device 800, the board 1 (mounted board) is transported to the unloader 900 by the board transport line 11. The unloader 900 collects the completed mounted board into a rack.

[0048] (Details of the flux application device) Next, the flux coating device 400 will be described in detail with reference to Figures 2 to 4. In the following description, the transport direction of the substrate 1 is referred to as the X direction, the vertical direction as the Z direction, and the direction perpendicular to these as the Y direction. Also, axes extending along these directions are referred to as the X axis, Y axis, and Z axis, respectively.

[0049] 2 and 3, support frames 411 are erected on both ends in the X direction of the base 401. Between the pair of support frames 411, the components of the flux coating device 400 are arranged.

[0050] A print stage movement mechanism 403 and a print stage 402 that is moved thereby are provided on the upper surface of the base 401 between the pair of support frames 411. The print stage movement mechanism 403 has a structure in which a print stage lifting mechanism 403z is stacked on top of a print stage table 403xyθ. When the print stage table 403xyθ is driven, the print stage 402 moves horizontally along the X-axis and Y-axis and rotates around the Z-axis. When the print stage lifting mechanism 403z is driven, the print stage 402 moves up and down. The print stage 402 has the function of holding the substrate 1 that is carried in from the upstream side and aligning it with a mask plate 422 in which pattern holes for printing (see FIG. 7) are formed.

[0051] The printing stage 402 is equipped with a lifting table 404 connected to a printing stage lifting mechanism 403z. Support members 404a are erected on both ends of the upper surface of the lifting table 404. As shown in FIG. 3, a substrate guide 404b extending in the X direction is connected to the upper end of the support member 404a. A printing stage conveyor 406b consisting of a transport belt that transports the substrate 1 is provided on the inner surface of the substrate guide 404b. The substrate guide 404b guides the substrate 1 while making contact with the side of the substrate 1 transported by the printing stage conveyor 406b.

[0052] The printing stage conveyor 406b is connectable to an inlet conveyor 406a and an outlet conveyor 406c which are provided through openings provided in the upstream and downstream support frames 411, respectively. The substrate 1 carried in by the inlet conveyor 406a is transferred to the printing stage conveyor 406b and held by the printing stage 402. After screen printing on the printing stage 402 is completed, the substrate 1 is transferred from the printing stage conveyor 406b to the outlet conveyor 406c and carried out. The printing stage conveyor 406b, inlet conveyor 406a, and outlet conveyor 406c each constitute part of the substrate transport line 11.

[0053] A backup lifting mechanism 405a and a backup unit 405 that is driven to move up and down by the backup lifting mechanism 405a are provided on the upper surface of the lifting table 404. The upper surface of the backup unit 405 forms a support surface 405T. By driving the backup lifting mechanism 405a while the substrate 1 has been carried onto the printing stage conveyor 406b, the backup unit 405 rises and uses the support surface 405T to lift and support the lower surface (second main surface 1b shown in FIG. 7) of the substrate 1 that has been transported by the printing stage conveyor 406b.

[0054] A pair of side clampers 407 that grip the side surfaces of the substrate 1 are provided on the upper surfaces of the pair of substrate guides 404b. The pair of side clampers 407 have clamping surfaces 407S on their opposing sides. The pair of side clampers 407 can be freely opened and closed relative to one another by a side clamper drive mechanism (not shown), and clamp the substrate 1 by pressing the clamping surfaces 407S against the side surfaces of the substrate 1. By closing the side clampers 407 while the backup unit 405 supports the lower surface of the substrate 1, both side surfaces of the substrate 1 are clamped between the side clampers 407 on the printing stage 402. In this way, the substrate 1 is clamped.

[0055] To align the substrate 1 held by the print stage 402 with the mask plate 422 in this manner, an alignment operation is performed in which the print stage 402 holding the substrate 1 is moved relative to the mask plate 422. In other words, the print stage table 403xyθ, which moves the print stage 402 horizontally, functions as an alignment mechanism that moves the print stage 402 and the mask plate 422 relatively to align the substrate 1 and the mask plate 422.

[0056] A print head support beam 412 that supports a print head 413 is mounted on the upper ends of the pair of support frames 411 so as to be movable along the Y axis via a linear guide mechanism 412a. One end of the print head support beam 412 is connected to one of the support frames 411 via a print head movement mechanism 414 configured as shown in Figure 3. The print head movement mechanism 414 has a nut portion 414c that is threadedly engaged with a feed screw 414b that is driven to rotate by a print head motor 414a, and is connected to the print head support beam 412. By driving the print head motor 414a forward and backward, the print head 413 supported by the print head support beam 412 moves back and forth (squeezing operation) along the Y axis.

[0057] As shown in FIG. 3, the print head 413 includes a rear squeegee 413b and a front squeegee 413c that extend downward from the print head support beam 412. By driving a squeegee drive unit 413a that is provided on the upper surface of the print head support beam 412, either the rear squeegee 413b or the front squeegee 413c descends and lands on the mask plate 422 depending on the direction of the squeegeeing operation. Specifically, the rear squeegee 413b lands on the mask plate 422 when performing a squeegeeing operation in the left direction (first direction) in FIG. 3. On the other hand, the front squeegee 413c lands on the mask plate 422 when performing a squeegeeing operation in the right direction (second direction) in FIG. 3. The rear squeegee 413b and the front squeegee 413c are each an example of a flux applicator.

[0058] The mask plate 422 has pattern holes 422a, which are predetermined openings, formed in correspondence with the printing pattern on the substrate 1. In screen printing using the flux application device 400, first, a printing flux F (see FIG. 6A, etc.) is supplied to the upper surface of the mask plate 422. Then, the substrate 1 is held by the printing stage 402, and with the substrate 1 abutting against the lower surface of the mask plate 422, a squeegeeing operation is performed on the upper surface of the mask plate 422 using either the rear squeegee 413b or the front squeegee 413c. As a result, the flux F is printed on the substrate 1 through the pattern holes 422a in the predetermined printing pattern.

[0059] A camera movement mechanism 416 is provided between the upper surface of the printing stage 402 and the lower surface of the mask plate 422. The camera movement mechanism 416 moves a camera mounting base 417, to which a first camera 418 and a second camera 419 are attached, along the X-axis and Y-axis. The camera movement mechanism 416 is composed of a camera X-axis movement mechanism 416X that moves the camera mounting base 417 along the X-axis along the camera X-axis beam 415, and a camera Y-axis movement mechanism 416Y that moves the camera X-axis beam 415 along the Y-axis. The movement of the camera X-axis beam 415 is guided by a linear guide mechanism 415g arranged on the inner surface of the support frame 411.

[0060] The camera X-axis movement mechanism 416X is composed of a camera X-axis motor 415a and a feed screw 415b shown in FIG. 2, and a nut portion 415d shown in FIG. 3. By driving the camera X-axis motor 415a, the camera mounting base 417 connected to the nut portion 415d moves along the X-axis. The camera Y-axis movement mechanism 416Y is composed of a camera Y-axis motor 416a, a feed screw 416b, and a nut portion 416c connected to the camera X-axis beam 415, as shown in FIG. 3. By driving the camera Y-axis motor 416a, the camera X-axis beam 415 connected to the nut portion 416c moves along the Y-axis. As a result, the first camera 418 moves horizontally above the substrate 1 held by the printing stage 402, and the second camera 419 moves horizontally below the mask plate 422.

[0061] Here, the functions of the first camera 418 and the second camera 419 will be described. The first camera 418 is disposed with its imaging direction facing downward, and captures an image of the substrate 1 held on the printing stage 402. By recognizing and processing the image results, the position of the substrate 1 and the positions of the lands 2 to be printed on the substrate 1 are detected. The second camera 419 is disposed with its imaging direction facing upward, and captures an image of a mask recognition mark (not shown) formed on the mask plate 422. By recognizing and processing the image results, the mask center and the positions of the pattern holes 422a on the mask plate 422 are recognized.

[0062] A roller mechanism 430 is fixed to the side of the camera X-axis beam 415. The roller mechanism 430 has a pressure cylinder 431 and a roller 432 that are connected to each other. The pressure cylinder 431 is fixed to the camera X-axis beam 415 and applies a downward force to the roller 432. The roller 432 is rotatable around a rotation axis A (see FIG. 4). The roller mechanism 430, including the roller 432, moves horizontally along the Y-axis in accordance with the horizontal movement of the camera X-axis beam 415. The roller mechanism 430 has the function of pressing the roller 432 against the substrate 1 using the pressure cylinder 431 while moving horizontally, thereby crushing the top of the solder precoat 3 on the substrate 1. In other words, the roller 432 crushes the top of the solder precoat 3 by rolling while pressing the substrate 1 from the first main surface 1a side. In this embodiment, the camera Y-axis movement mechanism 416Y functions as a horizontal movement mechanism that moves the roller 432 horizontally relative to the substrate 1 held by the printing stage 402.

[0063] As shown in Fig. 4, when the printing stage 402 is viewed from the normal direction of the first main surface 1a (the direction perpendicular to the plane of the paper in Fig. 4), a gap G extending along the clamping surface 407S (extending in the left-right direction in Fig. 4) exists between the clamping surface 407S of each side clamper 407 and the support surface 405T of the backup unit 405. This gap G inevitably exists between the clamping surface 407S of each side clamper 407 and the support surface 405T of the backup unit 405 due to the presence of the printing stage conveyor 406b. When viewed from the normal direction of the first main surface 1a, the rotation axis A of the roller 432 intersects with the direction in which the clamping surface 407S extends (the X direction in this example).

[0064] 4, when viewed from the normal direction of the first principal surface 1a, the rotation axis A of the roller 432 and the direction in which the clamp surface 407S extends intersect at an angle Q. The angle Q is adjusted within a range of 1° to 10°. The angle Q is adjusted by changing the fixed angle of the roller mechanism 430 relative to the camera X-axis beam 415 or the fixed angle of the roller 432 relative to the pressure cylinder 431.

[0065] In FIG. 4, the movement trajectory of the roller 432 is shown in stages by dashed lines. The chain-line arrow M indicates the movement direction of the roller 432 by the camera Y-axis movement mechanism (horizontal movement mechanism) 416Y. In this example, the roller 432 rolls in the direction of the chain-line arrow M, i.e., in the direction (Y direction) perpendicular to the extension direction (X direction) of the clamp surface 407S. At this time, the rotation axis A of the roller 432 and the extension direction of the clamp surface 407S intersect at an angle Q, so that only a portion of the roller 432 overlaps with the gap G when passing through the gap G. In other words, when the roller 432 passes through the gap G, a portion of the roller 432 always overlaps with the support surface 405T of the side clamper 407 or the backup unit 405 in a plan view. This distributes the pressing force when the roller 432 passes through the gap G, preventing the pressing force from concentrating on the portion of the substrate 1 located in the gap G.

[0066] As shown in FIG. 5, the rolling direction of the roller 432 (the direction of the chain arrow M) and the rotation axis A of the roller 432 may be perpendicular to each other. In this case, the rotation axis A is parallel to the X direction, but before the roller 432 starts to crush the top of the solder precoat 3, the extension direction of the clamp surface 407S (i.e., the extension direction of the gap G) is adjusted so that it intersects with the X direction. This adjustment of the orientation is performed by horizontally rotating the print stage 402 around the Z axis using the print stage table 403xyθ. In this way, the print stage table 403xyθ can adjust the angle Q between the rotation axis A of the roller 432 and the extension direction of the clamp surface 407S. The print stage table 403xyθ functions as an angle adjustment unit that adjusts the angle Q between the rotation axis A of the roller 432 and the extension direction of the clamp surface 407S. In the example of FIG. 5, the rotation axis A of the roller 432 is perpendicular to the rolling direction of the roller 432, which has the advantage that the roller 432 can roll more smoothly when pressing the substrate 1 than in the example of FIG.

[0067] (Mounting board manufacturing method) Next, a mounting substrate manufacturing method according to this embodiment will be described with reference to the accompanying drawings. The mounting substrate manufacturing method includes a preparation step, a support step, a clamping step, a pressing step, a substrate placement step, a flux placement step, a component mounting step, and a reflow step. The preparation step, the support step, the clamping step, and the pressing step constitute at least a part of the substrate pressing method.

[0068] The preparation process includes a paste placement process and a melting and solidifying process. The paste placement process is performed in a solder paste supply unit 100. In the paste placement process, solder paste is placed on the lands 2 of the substrate 1 by, for example, screen printing.

[0069] The melting and solidifying step is performed in a heating unit 210 and a cooling unit 220. In the melting and solidifying step, the solder paste is heated and melted by the heating unit 210, and then the molten solder paste is cooled and solidified by the cooling unit 220, thereby forming a solder precoat 3 on the lands 2. Through the paste placement step and the melting and solidifying step, a substrate 1 having a solder precoat 3 formed on its first main surface 1a is prepared.

[0070] The supporting step, clamping step, pressing step, substrate placement step, and flux placement step are performed by the flux application device 400. In the supporting step and clamping step, the substrate 1 is held by a backup unit 405 and a pair of side clampers 407. In the supporting step and clamping step, as shown in FIG. 6A, the backup lifting mechanism 405a is driven on the printing stage 402 to raise the backup unit 405 (arrow a). As a result, the substrate 1 is lifted from the printing stage conveyor 406b and raised to the same height as the upper surfaces of the side clampers 407. Thereafter, the side clamper driving mechanism (not shown) is driven to cause the pair of side clampers 407 to perform a closing operation. As a result, with the first main surface 1a (upper surface in this example) of the substrate 1 being substantially flush with the upper surfaces of the side clampers 407, the second main surface 1b (lower surface in this example) is supported from below by the support surface 405T of the backup unit 405, and the side surfaces are clamped by the clamp surfaces 407S of the pair of side clampers 407. At this time, when viewed from the normal direction of the first main surface 1a, a gap G extending along the side surface of the substrate 1 exists between the clamp surface 407S of each side clamper 407 and the support surface 405T of the backup unit 405 (see FIG. 4).

[0071] In the pressing step, the supported and clamped substrate 1 is pressed from the first main surface 1a side (in this example, the upper side) by the roller 432 to crush the top of the solder precoat 3. At this time, the roller 432 crushes the top of the solder precoat 3 with the rotation axis A of the roller 432 intersecting the extension direction of the clamp surface 407S when viewed from the normal direction to the first main surface 1a. In the pressing step, the angle Q between the rotation axis A of the roller 432 and the extension direction of the clamp surface 407S when viewed from the normal direction to the first main surface 1a is set to be equal to or greater than 1° and equal to or less than 10°.

[0072] In the pressing step, as shown in FIG. 6B, the print stage lifting mechanism 403z is driven to raise the print stage 402 (arrow b), and then, with a downward force being applied to the roller 432 by the pressure cylinder 431, the roller 432 is moved along the Y axis and pressed against the substrate 1 (arrow c). As a result, as shown in FIG. 7, the top of the solder precoat 3 on the substrate 1 is flattened. At this time, cracks are generated in the film-like residue present on the top of the solder precoat 3, destroying the residue. As a result, at least a portion of the solder is exposed through the cracks.

[0073] In the substrate placement step, the substrate 1 is brought into contact with the lower surface of the mask plate 422. In the substrate placement step, as shown in Fig. 6C, after the roller mechanism 430 is retracted (arrow d), the printing stage 402 is raised and the substrate 1 supported by the backup unit 405 and the side clamper 407 is brought into contact with the lower surface of the mask plate 422 (arrow e). At this time, flux F has been supplied to the upper surface of the mask plate 422, and the front squeegee 413c that performs the squeegeeing operation is in the print preparation position.

[0074] In the flux placement process, flux F is applied to the squashed solder precoat 3 via the mask plate 422 using the rear squeegee 413b or the front squeegee 413c. In the flux placement process, as shown in FIG. 6C, the print head 413 is moved along the Y axis (arrow f) on the upper surface of the mask plate 422, and in this example, a squeegeeing operation is performed in which flux F is filled into the pattern holes 422a while the front squeegee 413c is slid relative to the mask plate 422. As a result, as shown in FIG. 7, flux F is applied to the solder precoat 3 on the substrate 1 via the pattern holes 422a of the mask plate 422.

[0075] The flux disposing step is preferably performed within 30 seconds after the pressing step is performed, and more preferably within 10 seconds after the pressing step is performed. In other words, the time from the end of the pressing step to the start of the flux disposing step is preferably within 30 seconds, and more preferably within 10 seconds.

[0076] The component mounting process is performed by electronic component mounting apparatus 500. In the component mounting process, the electronic component is mounted on substrate 1 with its terminals aligned with solder precoat 3. The mounting method for mounted components of this embodiment makes it easy to mount the electronic component. This is because the flat top of solder precoat 3 makes it easy to mount the electronic component, and the viscosity of flux F makes it easy to hold the electronic component on solder precoat 3.

[0077] The reflow process is carried out in a reflow device 700. In the reflow process, the substrate 1 on which the electronic component is mounted is heated to melt the solder precoat 3 and solder the terminals of the electronic component to the lands 2.

[0078] Second Embodiment A second embodiment of the present disclosure will be described. The mounting substrate manufacturing apparatus 10 of this embodiment differs from the first embodiment in that the configuration of the flux application device 400 is such that the roller mechanism 430 is fixed. The following mainly describes the differences from the first embodiment. Note that the parts and components in FIG. 8 that are denoted by the same reference numerals as those used in the first embodiment are the same as those in the first embodiment, and therefore description thereof will be omitted.

[0079] 8, the roller mechanism 433 includes a roller 432 and a pressure unit 434. The pressure unit 434 is fixed to a beam 408 that is fixed inside the flux coating device 400. Therefore, in this embodiment, the roller 432 does not move along the Y axis. The pressure unit 434 has a function of pressing the roller 432 against the substrate 1, as well as a function of rotating the roller 432 horizontally around the Z axis to change the orientation of the rotation axis A. In other words, the pressure unit 434 functions as an angle adjustment unit that adjusts the angle Q between the rotation axis A of the roller 432 and the extension direction of the clamp surface 407S.

[0080] In the pressing step, the print stage 402 is moved from the printing position shown in FIG. 8 to a pressing position (not shown) by the print stage moving mechanism 403. The pressing position is a position where the print stage 402 is located below the roller mechanism 433. In the pressing step, the print stage 402 is moved along the Y axis at the pressing position and the roller 432 is pressed against the substrate 1, thereby crushing the top of the solder precoat 3 on the substrate 1. At this time, the surface residue at the top of the solder precoat 3 is destroyed, exposing at least a portion of the solder inside. In this embodiment, the print stage moving mechanism 403 functions as a horizontal movement mechanism that horizontally moves the roller 432 relative to the substrate 1 held by the print stage 402.

[0081] The substrate pressing devices of the first and second embodiments have been described above, but modifications may be made without departing from the spirit and scope of the invention. In the first embodiment, the camera Y-axis moving mechanism 416Y is described as a horizontal movement mechanism that moves the roller 432 horizontally relative to the substrate 1 held on the print stage 402. However, as in the second embodiment, the print stage moving mechanism 403 may be a horizontal movement mechanism that moves the roller 432 horizontally relative to the substrate 1 held on the print stage 402. Furthermore, the substrate pressing devices of the first and second embodiments have been described as being implemented as the flux coating device 400, but the invention is not limited to this and may be implemented as a dedicated device having a substrate pressing function.

[0082] <<Notes>> The above description of the embodiments discloses the following techniques. (Technology 1) a backup section having a first main surface and a second main surface opposite to the first main surface, the backup section having a support surface that supports from below the second main surface of a substrate having a solder precoat formed on the first main surface; a pair of side clampers each having a clamping surface that contacts a side surface of the substrate, and clamping the substrate supported by the backup section by sandwiching the clamping surface; a roller that presses the substrate clamped by the side clamper from the first main surface side to crush the top of the solder precoat; Equipped with A substrate pressing device, wherein, when viewed from the normal direction of the first main surface, the rotation axis of the roller intersects with the direction in which the clamp surface extends. (Technology 2) The substrate pressing device according to technique 1, wherein an angle formed between the rotation axis of the roller and a direction in which the clamp surface extends is 1° or more and 10° or less when viewed from a normal direction of the first main surface. (Technology 3) The substrate pressing device according to Technology 1 or 2 further includes an angle adjustment unit that rotates the roller and the pair of side clampers relative to each other in a horizontal plane, thereby causing the rotation axis of the roller to intersect with the direction in which the clamping surface extends, as viewed from the normal direction of the first main surface. (Technology 4) 4. The substrate pressing device according to any one of techniques 1 to 3, wherein the roller rolls in a direction intersecting the direction in which the clamp surface extends when viewed from the normal direction of the first main surface. (Technology 5) The substrate pressing device according to technique 4, wherein the roller rolls in a direction perpendicular to the clamping surface when viewed from the normal direction of the first main surface. (Technology 6) The substrate pressing device according to any one of techniques 1 to 5, further comprising a flux applying unit that applies flux to the solder precoat whose top portion has been crushed by the roller. (Technology 7) a preparation step of preparing a substrate having a first main surface and a second main surface opposite to the first main surface, the first main surface having a solder precoat formed thereon; a supporting step of supporting the second main surface of the substrate with a supporting surface of a backup part; a clamping step of pressing clamping surfaces of a pair of side clampers against side surfaces of the substrate to clamp the substrate; a pressing step of pressing the supported and clamped substrate from the first main surface side with a roller to crush the top of the solder precoat; Equipped with A substrate pressing method, wherein in the pressing step, the roller crushes the top of the solder precoat while the rotation axis of the roller intersects with the direction in which the clamping surface extends, as viewed from the normal direction of the first main surface. (Technology 8) The substrate pressing method according to Technology 7, wherein in the pressing step, the angle formed between the rotation axis of the roller and the direction in which the clamp surface extends is set to be 1° or more and 10° or less when viewed from the normal direction of the first main surface. (Technology 9) 9. The substrate pressing method according to technique 7 or 8, wherein in the pressing step, the roller is rolled in a direction intersecting the direction in which the clamp surface extends when viewed from the normal direction of the first main surface. (Technology 10) 10. The substrate pressing method according to claim 9, wherein in the pressing step, the roller is rolled in a direction perpendicular to the clamp surface when viewed from the normal direction of the first main surface. [Industrial Applicability]

[0083] The present disclosure can be used for a substrate pressing device and a substrate pressing method. [Explanation of symbols]

[0084] 1: Circuit board 1a: First main surface 1b: Second main surface 2: Land 3: Solder pre-coating 10: Mounting board manufacturing equipment 11: Substrate transfer line 20: Information processing device 20N: Local Area Network 50: Loader 90: Solder precoat forming device 300: Solder pre-coat inspection device 400: Flux application device (substrate pressing device) 402: Printing Stage 403: Printing stage movement mechanism 403xyθ: Printing stage table (angle adjustment part) 405: Backup Department 405T: Support surface 406b: Printing stage conveyor 407: Side clamper 407S: Clamping surface 413: Print head 414: Print head moving mechanism 415: Camera X-axis beam 416: Camera movement mechanism 416Y: Camera Y-axis movement mechanism 417: Camera mounting base 418: First Camera 419: Second camera 422: Mask plate 430, 433: Roller mechanism 431: Pressure cylinder 432: Laura 434: Pressure unit (angle adjustment part) 500: Electronic component mounting equipment 501: Electronic component mounting device 502: Electronic component mounting device 600: Mounting condition inspection device 700: Reflow equipment 800: PCB inspection equipment 900: Unloader A: Rotation axis F: Flux G: Gap Q: The angle between the rotation axis and the direction of extension of the clamping surface

Claims

1. a backup portion having a first main surface and a second main surface opposite to the first main surface, the backup portion having a support surface that supports, from below, the second main surface of a substrate having a solder precoat formed on the first main surface; a pair of side clampers each having a clamping surface that contacts a side surface of the substrate, and clamping the substrate supported by the backup section by sandwiching the clamping surface; a roller that presses the substrate clamped by the side clamper from the first main surface side to crush the top of the solder precoat; Equipped with a gap exists between the clamp surface and the backup portion when viewed from a normal direction of the first main surface, a substrate pressing device in which the rotation axis of the roller intersects with the extension direction of the clamping surface when viewed from the normal direction of the first main surface so that when the roller moves from the upper surface of the side clamper to the upper surface of the substrate and passes over the gap, a portion of the roller always overlaps with the side clamper or the support surface in a planar view.

2. 2. The substrate pressing device according to claim 1, further comprising an angle adjustment unit that rotates the roller and the pair of side clampers relative to each other in a horizontal plane, thereby causing the rotation axis of the roller to intersect with the direction in which the clamping surface extends, as viewed from the normal direction of the first main surface.

3. The substrate pressing device according to claim 1 , wherein the roller rolls in a direction intersecting a direction in which the clamp surface extends when viewed from a normal direction of the first main surface.

4. The substrate pressing device according to claim 1 , further comprising a flux applying unit that applies flux to the solder precoat whose top portion has been crushed by the roller.

5. a preparation step of preparing a substrate having a first main surface and a second main surface opposite to the first main surface, the first main surface having a solder precoat formed thereon; a supporting step of supporting the second main surface of the substrate with a supporting surface of a backup part; a clamping step of pressing clamping surfaces of a pair of side clampers against side surfaces of the substrate to clamp the substrate; a pressing step of pressing the supported and clamped substrate from the first main surface side with a roller to crush the top of the solder precoat; Equipped with a gap exists between the clamp surface and the backup portion when viewed from a normal direction of the first main surface, A substrate pressing method in which, in the pressing step, when the roller is moved from the upper surface of the side clamper to the upper surface of the substrate while passing over the gap, a portion of the roller always overlaps with the side clamper or the support surface in a planar view.

6. 6. The substrate pressing method according to claim 5, wherein in the pressing step, the roller presses down the top of the solder precoat while the rotation axis of the roller intersects with the direction in which the clamping surface extends, as viewed from the normal direction of the first main surface.

7. The substrate pressing method according to claim 5 , wherein in the pressing step, the roller is caused to roll in a direction intersecting a direction in which the clamp surface extends when viewed from a normal direction to the first main surface.

Images