Photosensitive resin composition, liquid-repellent antifouling film, and inkjet recording head

Abstract

To provide a photosensitive resin composition containing a silicone compound capable of achieving both high liquid repellency and mechanical strength.SOLUTION: The photosensitive resin composition comprises an alkyl-containing siloxane resin (A) having a specific structure, an alkyl-containing siloxane resin (B) having a specific structure, and a photopolymerization initiator, wherein the molar ratio A:B of the alkyl-containing siloxane resin (A) to the alkyl-containing siloxane resin (B) is 3:1 to 1:3. The technology described herein can contribute to the realization of sustainable societies such as decarbonization / recycling societies.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a photosensitive resin composition, a liquid-repellent and stain-resistant film, and an inkjet recording head. [Background technology]

[0002] Fluorine-based water-repellent materials are generally known as materials for forming liquid-repellent and stain-resistant films. Compounds containing perfluoroalkyl or perfluoropolyether groups, in particular, have excellent liquid-repellent and durability properties and are widely used in a variety of applications. However, because fluorine-containing compounds are highly chemically stable and persistent, if they are continuously released into the environment, they may remain in the environment for long periods of time, potentially affecting human health and the habitat and growth of plants and animals through the environment and food chain. Therefore, in recent years, there has been a demand for a shift from fluorine-based water-repellent materials to non-fluorine-based water-repellent materials in order to realize a sustainable society, such as a recycling-oriented society.

[0003] Silicone compounds are fluorine-free water repellents that exhibit excellent liquid repellency and can be used as an alternative to fluorine-based water repellents. Silicone compounds can eliminate concerns about environmental impact and fluorine sources. For example, Patent Document 1 discloses a technique using a silicone compound, particularly a siloxane-containing epoxy resin composition, as a non-fluorine-based water repellent material. In the composition described in Patent Document 1, the epoxy groups form a crosslinked structure upon curing, which can impart not only liquid repellency but also mechanical strength. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-158818 Summary of the Invention [Problem to be solved by the invention]

[0005] When a silicone compound has a functional group at only one end of the siloxane main chain, the siloxane main chain is likely to be oriented on the surface, enabling high liquid repellency to be achieved, as in Patent Document 1. However, according to the studies of the present inventors, since only one end of the siloxane main chain is fixed in the cured product, the mechanical strength may be insufficient. On the other hand, when a silicone compound having functional groups at both ends is used, the fixation in the cured product is strengthened, and the flexibility of the siloxane main chain is improved, making it possible to obtain high mechanical strength. However, in this case, the orientation of the siloxane main chain on the surface is reduced, which reduces the liquid repellency and may make it difficult to maintain the liquid repellency.

[0006] The present disclosure provides a photosensitive resin composition containing a silicone compound that can achieve both high liquid repellency and mechanical strength, and also provides a liquid-repellent, stain-resistant film and an inkjet recording head that use the photosensitive resin composition. [Means for solving the problem]

[0007] The present disclosure provides a photosensitive resin composition, The photosensitive resin composition contains an alkylsiloxane-containing resin (A) represented by the following formula (1), an alkylsiloxane-containing resin (B) represented by the following formula (2), and a photopolymerization initiator: The photosensitive resin composition is characterized in that the molar ratio A:B of the alkyl-containing siloxane resin (A) to the alkyl-containing siloxane resin (B) is 3:1 to 1:3. TIFF2026028213000002.tif41153 (In formula (1), R1, R2, R3, and X2 each independently represent an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, Either R4 or X1 is an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, the other is an epoxy-containing group, and n+m is an integer of 1 to 60. The arrangement of the parenthesized structure with m and the parenthesized structure with n may be random or block. TIFF2026028213000003.tif39153 (In formula (2), R5 and R6 each independently represent an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, At least two of R7, R8, X3, and X4 are each independently an epoxy-containing group, and the others are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, and n+m is an integer of 1 to 60. The arrangement of the parenthesized structure with m and the parenthesized structure with n may be random or block.

[0008] The present disclosure also relates to a liquid-repellent and stain-resistant film that is a cured product of the photosensitive resin composition. The present disclosure also provides an inkjet recording head, the ink jet recording head has a liquid-repellent and stain-resistant film on a surface where the ejection ports are provided, The present invention relates to an ink jet recording head, wherein the liquid-repellent and stain-resistant film is the liquid-repellent and stain-resistant film described above. [Effects of the Invention]

[0009] According to the present disclosure, it is possible to provide a photosensitive resin composition containing a silicone compound that can achieve both high liquid repellency and mechanical strength, and also to provide a liquid-repellent and stain-resistant film and an inkjet recording head that use the photosensitive resin composition. [Brief explanation of the drawings]

[0010] [Figure 1] 1A and 1B are schematic diagrams of an inkjet recording head using a liquid-repellent and stain-resistant film. [Figure 2] 2A to 2H are diagrams illustrating an example of a method for manufacturing an inkjet recording head using a liquid-repellent and stain-resistant film. [Figure 3] 3A and 3B are diagrams for explaining the procedure for forming a liquid-repellent and stain-resistant film. DETAILED DESCRIPTION OF THE INVENTION

[0011] In the present disclosure, unless otherwise specified, the description of a numerical range such as "XX or more and YY or less" or "XX to YY" means a numerical range including the lower and upper limits, which are the endpoints. When a numerical range is described in stages, the upper and lower limits of each numerical range can be combined in any way. In addition, in the present disclosure, for example, a description such as "at least one selected from the group consisting of XX, YY, and ZZ" means any of XX, YY, ZZ, a combination of XX and YY, a combination of XX and ZZ, a combination of YY and ZZ, or a combination of XX, YY, and ZZ. When XX is a group, multiple XXs may be selected, and the same applies to YY and ZZ.

[0012] Hereinafter, embodiments of the present disclosure will be described, but the present disclosure is not limited to these embodiments, and not all of the combinations of features described in the embodiments are necessarily essential to the solutions of the present disclosure. The components described in the embodiments are merely examples, and are not intended to limit the scope of the present disclosure to only those.

[0013] Components for obtaining the photosensitive resin composition according to the present disclosure will be described below. (Alkylsiloxane resin) In order to achieve both high liquid repellency and mechanical strength, the photosensitive resin composition contains an alkylsiloxane resin (A) and an alkylsiloxane resin (B) in a molar ratio of the alkylsiloxane resin (A) to the alkylsiloxane resin (B) (alkylsiloxane resin (A):alkylsiloxane resin (B) (sometimes simply referred to as "A:B")) of 3:1 to 1:3.

[0014] The alkylsiloxane-containing resin (A) has an epoxy-containing group at either R4 or X1 in the silicone molecule represented by the following formula (1). The alkylsiloxane-containing resin (B) has an epoxy-containing group at at least two of R7, R8, X3, and X4 in the silicone molecule represented by the following formula (2).

[0015] [ka]

[0016] (In formula (1), R1, R2, R3, and X2 each independently represent an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, Either R4 or X1 is an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, the other is an epoxy-containing group, and n+m is an integer of 1 to 60. The arrangement of the parenthesized structure with m and the parenthesized structure with n may be random or block.

[0017] [ka]

[0018] (In formula (2), R5 and R6 each independently represent an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, At least two of R7, R8, X3, and X4 are each independently an epoxy-containing group, and the others are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, and n+m is an integer of 1 to 60. The arrangement of the parenthesized structure with m and the parenthesized structure with n may be random or block.

[0019] The epoxy-containing group may be a group having a glycidyl ether group or a group having an alicyclic epoxy group, and the epoxy-containing group is preferably a group having a glycidyl ether group or a group having an epoxycyclohexyl group. The epoxy-containing group is more preferably a glycidoxyalkyl group having an alkyl chain of 1 to 4 carbon atoms (preferably 2 to 4) or an epoxycyclohexylalkyl group having an alkyl chain of 1 to 8 carbon atoms (preferably 2 to 6).The epoxy-containing group is even more preferably a 3-glycidoxyalkyl group having an alkyl chain of 1 to 4 carbon atoms (preferably 2 to 4) or a 2-(3,4-epoxycyclohexyl)alkyl group having an alkyl chain of 1 to 8 carbon atoms (preferably 2 to 6).

[0020] More preferred examples of the epoxy-containing group include a 3-glycidoxypropyl group, a 2-(3,4-epoxycyclohexyl)ethyl group, and a 2-(3,4-epoxycyclohexyl)pentyl group. In particular, epoxycyclohexylalkyl groups have excellent reactivity and can provide high liquid repellency.

[0021] A high proportion of siloxane resin (A) improves the orientation of the siloxane main chain, resulting in high water repellency. On the other hand, a high proportion of siloxane resin (B) results in a strong fixation in the film, resulting in excellent durability and the ability to maintain water repellency for a long period of time. Therefore, by mixing these two siloxane resins in a molar ratio (A:B) of 3:1 to 1:3, it is possible to achieve both high liquid repellency and mechanical strength. The molar ratio A:B is preferably 2:1 to 1:2. One or more types of resin (A) may be used. One or more types of resin (B) may be used.

[0022] As the alkyl group having 1 to 12 carbon atoms in the formulas (1) and (2), an alkyl group having 1 to 4 carbon atoms, such as a methyl group, an ethyl group, a propyl group, or a butyl group, is particularly preferred. From the viewpoint of compatibility with the resin and film strength, a phenyl group or the like may be present as an aryl group having 6 to 12 carbon atoms in the formulas (1) and (2).

[0023] From the viewpoint of achieving both high liquid repellency and mechanical strength at a higher level, X1 in formula (1) is preferably an epoxy-containing group. In addition, in formula (2), it is preferable that two of R7, R8, X3, and X4 are epoxy-containing groups. It is preferable that X3 and X4 are epoxy-containing groups, and R7 and R8 are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms.

[0024] In the formulas (1) and (2), m+n is 1 to 60, preferably 10 to 60, from the viewpoint of compatibility with resins and solubility in solvents. From the viewpoint of liquid repellency, m+n is more preferably 30 to 60. In the formula (2), m+n is preferably 20 to 60, more preferably 25 to 45. In formulas (1) and (2), m is preferably 0 or 1. The arrangement of the parenthesized structures with m and the parenthesized structures with n may be random or block. The arrangement of the parenthesized structures with m and the parenthesized structures with n is preferably random.

[0025] In the photosensitive resin composition, an alkylsiloxane-containing resin (A) represented by formula (1) and The total content of the alkylsiloxane-containing resin (B) represented by formula (2) is preferably 0.1 to 50.0 mass %, more preferably 0.5 to 40.0 mass %. When the photosensitive resin composition contains an epoxy resin, the total content of the alkyl-containing siloxane resin (A) represented by formula (1) and the alkyl-containing siloxane resin (B) represented by formula (2) is preferably 0.1 to 5.0 mass%, more preferably 0.5 to 1.0 mass%. The total content of the alkyl-containing siloxane resin (A) represented by formula (1) and the alkyl-containing siloxane resin (B) represented by formula (2) is preferably 0.1 to 5.0 mass parts, more preferably 0.5 to 1.0 mass part, per 100 mass parts of the epoxy resin.

[0026] (epoxy resin) The photosensitive resin composition may further contain an epoxy resin. The epoxy resin is preferably a cationic polymerization type epoxy resin, and can be selected taking into consideration the adhesion performance, mechanical strength, and swelling resistance of the cured product of the photosensitive resin composition. The epoxy resin is, for example, a resin different from the alkylsiloxane-containing resin (A) represented by the above-mentioned formula (1) and the alkylsiloxane-containing resin (B) represented by the above-mentioned formula (2).

[0027] The epoxy resin is preferably at least one selected from the group consisting of epoxy resins having an alicyclic skeleton, epoxy resins having a bisphenol skeleton, epoxy resins having a phenol novolac skeleton, epoxy resins having a cresol novolac skeleton, epoxy resins having a norbornene skeleton, epoxy resins having a terpene skeleton, epoxy resins having a dicyclopentadiene skeleton, and epoxy resins having an oxycyclohexane skeleton.

[0028] More specifically, examples of the epoxy resins include cationically polymerizable epoxy resins such as epoxy resins having an alicyclic skeleton such as a cyclohexane skeleton, epoxy resins having a bisphenol skeleton such as bisphenol A-type and F-type epoxy resins, epoxy resins having a phenol novolac skeleton such as phenol novolac-type epoxy resins, epoxy resins having a cresol novolac skeleton such as cresol novolac-type epoxy resins, epoxy resins having a norbornene skeleton, epoxy resins having a terpene skeleton, epoxy resins having a dicyclopentadiene skeleton, and polyfunctional epoxy resins such as epoxy resins having an oxycyclohexane skeleton. One or a combination of two or more of these can be used.

[0029] The epoxy resin is more preferably at least one selected from the group consisting of epoxy resins having an alicyclic skeleton, epoxy resins having a bisphenol skeleton, and epoxy resins having a dicyclopentadiene skeleton.

[0030] By using an epoxy resin having two or more epoxy groups, the cured product can be three-dimensionally crosslinked, and the desired curing properties can be obtained. It is more preferable to use an epoxy resin having three or more epoxy groups. Furthermore, at least one bifunctional epoxy resin may be added to a trifunctional or higher functional epoxy resin. Commercially available trifunctional or higher epoxy resins include "jER157S70" and "jER1031S" (trade names) manufactured by Mitsubishi Chemical Corporation, "Epiclon N-695" and "Epiclon N-865" (trade names) manufactured by Dainippon Ink and Chemicals, Inc., "Celloxide 2021," "GT-300 series," "GT-400 series," and "EHPE3150" (trade names) manufactured by Daicel Corporation, "SU8" (trade name) manufactured by Nippon Kayaku Co., Ltd., "VG3101" (trade name) and "EPOX-MKR1710" (trade name) manufactured by Printec Co., Ltd., and "Denacol series" manufactured by Nagase ChemteX Corporation. Commercially available bifunctional epoxy resins include "jER1004", "jER1007", "jER1009", "jER1010", and "jER1256" (trade names) manufactured by Mitsubishi Chemical Corporation. , Dainippon Ink and Chemicals Co., Ltd. "EPICLON 7200L", "EPICLON 4050" and "EPICLON 7050" (trade names).

[0031] The content of the epoxy resin in the photosensitive resin composition is preferably 30.0 to 99.0 mass %, more preferably 50.0 to 99.0 mass %, and even more preferably 85.0 to 99.0 mass %.

[0032] (curing accelerator) The photosensitive resin composition may contain a phenolic compound or a polyol having at least two hydroxyl groups as a curing accelerator, which is effective in accelerating the cationic polymerization reaction of the epoxy resin.

[0033] Specific examples of the phenolic compounds include cardanol, terpene diphenols, and their derivatives. Examples of cardanol compounds include cardanol and cardanol derivatives. Examples of cardanol derivatives include derivatives in which the -OH of cardanol is epoxy-modified. Commercially available products include Cardolite NX-2026, Cardolite NC-510, Cardolite LITE2020, and Cardolite Ultra LITE 513 manufactured by Cardolite.

[0034] If the polyol has one hydroxyl group, the effect of promoting the cationic polymerization reaction of the epoxy resin is small, so two or more hydroxyl groups are preferred. Furthermore, from the viewpoints of solubility in resins and solvents and reactivity, the polyol preferably has a number-average molecular weight of 3,000 or less. Furthermore, in order to avoid disappearance during the heating process, it is preferred that the polyol have a number-average molecular weight of 200 or more or a boiling point of 200°C or higher. The number-average molecular weight can be calculated in terms of polystyrene by a known method using gel permeation chromatography (e.g., manufactured by Shimadzu Corporation).

[0035] Specific examples of polyols include polyethylene glycols (200, 300, 400, 600, 1000, 2000) commercially available from various companies. In addition, examples of polyether polyols include the "ADEKA Polyether P Series," "BPX Series," "G Series," "SP Series," "SC Series," "CM Series," "AM Series," "EM Series," "BM Series," "PR Series," and "GR Series" (all trade names) manufactured by ADEKA.

[0036] The polyol may be a low-molecular-weight polyhydric alcohol. Examples of low-molecular-weight polyhydric alcohols include 1,2- or 1,6-hexanediol, glycerin, trimethylolpropane, 3-methyl-1,5-pentanediol, 3-methyl-1,5-pentanediol, 1,2,6-hexanetriol, 1,5-dihydroxypentan-3-one, 6-hydroxycaproic acid, and 2-hydroxymethyl-1,3-propanediol. At least one of these may be used.

[0037] (Coating solvent) When the photosensitive resin composition is applied as a solution, it is preferable to use a polar organic solvent as the application solvent from the viewpoint of solubility. Specific examples of polar solvents include alcohols, ketones, esters such as ethyl acetate, butyl acetate, and PGMEA (propylene glycol monomethyl ether acetate), ethers such as diglyme, tetrahydrofuran, and PGME, and glycols such as diethylene glycol. Examples of alcohols include methanol, ethanol, propanol, isopropanol, and butanol, and examples of ketones include methyl ethyl ketone and methyl isobutyl ketone.

[0038] (Photopolymerization initiator) The photosensitive resin composition contains a photopolymerization initiator. When the photosensitive resin composition is applied to a substrate and cured, the photopolymerization initiator allows the composition to be cured by light irradiation, forming a liquid-repellent and stain-resistant film. In this case, the liquid repellency and mechanical strength are significantly improved compared to thermal curing, and microfabrication by patterning is also possible.

[0039] As the photopolymerization initiator, a cationic photopolymerization initiator capable of low-temperature curing and having high catalytic function can be suitably used. Specific examples of the cationic photopolymerization initiator include ionic acid generators. The photopolymerization initiator is preferably an ionic acid generator.

[0040] As the cation part of the ionic acid generator, an onium ion with high absorption can be selected, such as oxonium, ammonium, phosphonium, sulfonium, or iodonium. Among them, those with high absorption of i-line (wavelength 365 nm) and excellent cationic polymerization performance and crosslinking ability can be selected. Sulfonium is more preferred because of its excellent reactivity. The cation of the ionic acid generator is preferably a sulfonium ion.

[0041] Specific examples of sulfonium-based cations include the following: Triphenylsulfonium, tri-p-tolylsulfonium, tri-o-tolylsulfonium, tris(4-methoxyphenyl)sulfonium, 1-naphthyldiphenylsulfonium, 2-naphthyldiphenylsulfonium, tris(4-fluorophenyl)sulfonium, tri-1-naphthylsulfonium, tri-2-naphthylsulfonium, tris(4-hydroxyphenyl)sulfonium, 4-(phenylthio)phenyldiphenylsulfonium, 4-(p-trilthio) (o)phenyldi-p-tolylsulfonium, 4-(4-methoxyphenylthio)phenylbis(4-methoxyphenyl)sulfonium, 4-(phenylthio)phenylbis(4-fluorophenyl)sulfonium, 4-(phenylthio)phenylbis(4-methoxyphenyl)sulfonium, 4-(phenylthio)phenyldi-p-tolylsulfonium, [4-(4-biphenylylthio)phenyl]-4-biphenylylphenylsulfonium, [4-(2-thioxanthonylthio)phenyl phenyl]diphenylsulfonium, bis[4-(diphenylsulfonio)phenyl]sulfide, bis[4-{bis[4-(2-hydroxyethoxy)phenyl]sulfonio}phenyl]sulfide, bis{4-[bis(4-fluorophenyl)sulfonio]phenyl}sulfide, bis{4-[bis(4-methylphenyl)sulfonio]phenyl}sulfide, bis{4-[bis(4-methoxyphenyl)sulfonio]phenyl}sulfide, 4-(4-benzoyl-2-chlorophenyl) thio)phenylbis(4-fluorophenyl)sulfonium, 4-(4-benzoyl-2-chlorophenylthio)phenyldiphenylsulfonium, 4-(4-benzoylphenylthio)phenylbis(4-fluorophenyl)sulfonium, 4-(4-benzoylphenylthio)phenyldiphenylsulfonium, 7-isopropyl-9-oxo-10-thia-9,10-dihydroanthracen-2-yldi-p-tolylsulfonium, 7-isopropyl-9-oxo-10-thia-9,10-dihydroanthracen-2-yldi-p-tolylsulfonium,10-Dihydroanthracen-2-yldiphenylsulfonium, 2-[(di-p-tolyl)sulfonio]thioxanthone, 2-[(diphenyl)sulfonio]thioxanthone, 4-(9-oxo-9H-thioxanthen-2-yl)thiophenyl-9-oxo-9H-thioxanthen-2-yl phenylsulfonium, 4-[4-(4-tert-butylbenzoyl)phenylthio]phenyldi-p-tolylsulfonium, 4-[4-(4-tert-butylbenzoyl)phenylthio]phenyldiphenylsulfonium, 4-[4-(benzoylphenylthio)]phenyldi-p-tolylsulfonium, 4-[4-(benzoylphenylthio)]phenyldiphenylsulfonium, 5-(4-methoxyphenyl)thiaanthrenium, triarylsulfoniums such as 5-phenylthiaanthreneium, 5-trilylthiaanthreneium, 5-(4-ethoxyphenyl)thiaanthrenenium, and 5-(2,4,6-trimethylphenyl)thiaanthrenenium; Diarylsulfoniums such as diphenylphenacylsulfonium, diphenyl 4-nitrophenacylsulfonium, diphenylbenzylsulfonium, and diphenylmethylsulfonium; monoarylsulfoniums such as phenylmethylbenzylsulfonium, 4-hydroxyphenylmethylbenzylsulfonium, 4-methoxyphenylmethylbenzylsulfonium, 4-acetocarbonyloxyphenylmethylbenzylsulfonium, 4-hydroxyphenyl-methyl-1-naphthylmethylsulfonium, 4-hydroxyphenyl(2-naphthylmethyl)methylsulfonium, 2-naphthylmethylbenzylsulfonium, 2-naphthylmethyl(1-ethoxycarbonyl)ethylsulfonium, phenylmethylphenacylsulfonium, 4-hydroxyphenylmethylphenacylsulfonium, 4-methoxyphenylmethylphenacylsulfonium, 4-acetocarbonyloxyphenylmethylphenacylsulfonium, 2-naphthylmethylphenacylsulfonium, 2-naphthyloctadecylphenacylsulfonium, and 9-anthracenylmethylphenacylsulfonium; trialkylsulfonium compounds such as dimethylphenacylsulfonium, phenacyltetrahydrothiophenium, dimethylbenzylsulfonium, benzyltetrahydrothiophenium, and octadecylmethylphenacylsulfonium;

[0042] The molar absorption coefficient of the photopolymerization initiator at a wavelength of 365 nm is 400 M -1 ·cm -1 It is preferable that the molar extinction coefficient is 400M or more. -1 ·cm -1 By satisfying the above conditions, the crosslinking density does not decrease during the curing reaction, and the liquid repellency and photopatterning properties can be further improved.

[0043] The molar absorption coefficient of a compound such as a photopolymerization initiator is measured as follows. The target compound is dissolved in a solvent that has no absorption at 365 nm, such as acetonitrile, to prepare a solution. The resulting solution is placed in a quartz cell, and the absorbance at 365 nm is measured using a UV-Vis-Infrared spectrophotometer (manufactured by JASCO). The molar extinction coefficient can be calculated from the absorbance using the following formula: Molar extinction coefficient = absorbance ÷ molar concentration of compound ÷ light path of cell

[0044] As the anion portion of the ionic acid generator, for example, borate-based, phosphorus-based, antimony-based, gallate-based, or other compounds having high acid strength can be selected. Among them, tetrakis(pentafluorophenyl) is excellent in cationic polymerization and crosslinking reaction performance. trifluorotris(pentafluoroethyl)phosphate ion, Hexafluoroantimonate ion and tetrakis(pentafluorophenyl)gallate ion are more preferred, as the use of these ions can further improve the liquid repellency and the photopatterning properties.

[0045] The anion of the ionic acid generator is preferably at least one selected from the group consisting of a tetrakis(pentafluorophenyl)borate ion, a trifluorotris(pentafluoroethyl)phosphate ion, a hexafluoroantimonate ion, and a tetrakis(pentafluorophenyl)gallate ion.

[0046] Suitable photopolymerization initiators include "ADEKA Optomer SP-170," "ADEKA Arcles SP-172," and "ADEKA Arcles SP-150" (all trade names) manufactured by ADEKA Corporation, and "BBI-103" and "BBI-102" (all trade names) manufactured by Midori Chemical Co., Ltd. Other examples include "IBPF," "IBCF," and "TS-0" manufactured by Sanwa Chemical Co., Ltd. 1" and "TS-91" (all trade names), and San-Apro's "CPI-410S", "CR-C1", "CPI-410B", "CPI-310B", and "CPI-310FG" (all trade names). Furthermore, the composition may contain basic substances such as amines, photosensitizers such as anthracene derivatives, silane coupling agents, etc. for the purpose of improving photolithography performance, adhesion performance, etc.

[0047] The content of the photopolymerization initiator can be appropriately changed depending on the resin used and is not particularly limited. The amount of the photopolymerization initiator added is, for example, in the range of 0.5 to 200 parts by mass, preferably 0.5 to 5 parts by mass, relative to 100 parts by mass of the resin contained in the photosensitive resin composition.

[0048] (base material) The substrate on which the liquid-repellent and stain-resistant film is formed is not particularly limited, and can be selected mainly from inorganic substrates and resin compositions.

[0049] Examples of inorganic substrates include Si, SiO2, SiOC, SiC, SiCN, Ta, TaO, and Al2O3.

[0050] The resin composition used is a negative epoxy resin composition containing a polyfunctional epoxy resin as a main component, such as bisphenol A epoxy resin, bisphenol E epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, cresol novolac epoxy resin, and alicyclic epoxy resin.

[0051] Commercially available epoxy resins include "157S70" and "jER1031S" (all trade names) manufactured by Mitsubishi Chemical Corporation, and "Epiclon N-695" and "Epiclon N-865" (all trade names) manufactured by DIC Corporation. Other examples include "Celloxide 2021," "GT-300 Series," "GT-400 Series," and "EHPE3150" (all trade names) manufactured by Daicel Corporation, and "SU8" (trade name) manufactured by Nippon Kayaku Co., Ltd. Further examples include "VG3101" and "EPOX-MKR1710" (trade names) manufactured by Printec Co., Ltd., and "Denacol Series" (trade names) manufactured by Nagase ChemteX Corporation.

[0052] As an example of the application of the liquid-repellent and stain-resistant film, a method for manufacturing an inkjet recording head will be described below with reference to the drawings. However, the scope of application of the liquid-repellent and stain-resistant film according to the present disclosure is not limited to this.

[0053] <Method of manufacturing a recording head> Fig. 1A is a schematic diagram showing an example of an inkjet recording head, and Fig. 1B is a cross-sectional view of the recording head taken along a line AB in Fig. 1A and perpendicular to a substrate 1.

[0054] 1A and 1B has a substrate 1 on which energy generating elements 2 that generate energy used to eject liquid are arranged in two rows at a predetermined pitch. A liquid supply port 3 is opened in the substrate 1 between the two rows of the energy generating elements 2. On the substrate 1, ejection ports 5 are formed by an ejection port forming member 4 at positions facing each of the energy generating elements 2.

[0055] The shape of the discharge port 5 may be a so-called tapered shape in which the area of ​​the cross section parallel to the substrate 1 decreases from the substrate 1 side toward the discharge port 5. The discharge port forming member 4 is composed of a side wall 8 that forms individual flow paths 6 that communicate from the supply port 3 to each discharge port 5, and a top plate 9 on which the discharge ports 5 open. The discharge port forming member 4 may have the side wall 8 and the top plate 9 integrated together.

[0056] A liquid-repellent, anti-fouling film (liquid-repellent layer) 7 is provided on the ejection port forming member. For example, an inkjet recording head has the liquid-repellent, anti-fouling film 7 on the surface where the ejection ports are provided. The liquid-repellent, anti-fouling film 7 prevents ink ejected from the ejection ports 5 from adhering to the surface of the recording head. The shape, material, etc. of the substrate 1 are not particularly limited as long as it functions as part of the members that make up the flow path 6 and can also function as a support for the ejection port forming member 4. In this embodiment, a silicon substrate is used as the substrate 1 because it is easy to process.

[0057] This recording head is arranged so that the surface where the ejection ports 5 open faces the recording surface of the recording medium. Energy generated by the energy generating elements 2 is applied to ink filled in the flow paths 6 via the supply ports 3, causing ink droplets to be ejected from the ejection ports 5 and attached to the recording medium, thereby performing recording. The energy generating elements 2 can be elements that generate energy by heat, such as electrothermal conversion elements (so-called heaters), or elements that generate energy mechanically, such as piezoelectric elements.

[0058] The liquid-repellent, antifouling film 7 is a cured product of a photosensitive resin composition. Specifically, the liquid-repellent, antifouling film 7 can be formed as a cured product by applying a solution containing the photosensitive resin composition and curing the coating of the solution.

[0059] 2A to 2H, an example of a method for manufacturing an inkjet recording head will be described. In the inkjet recording head, known materials can be used except for the liquid-repellent and stain-proofing film 7.

[0060] 2A to 2H are schematic cross-sectional views showing an example of a method for manufacturing an inkjet recording head according to the steps, and the positions of the cross sections are the same as those in FIG. 1B.

[0061] First, as shown in Fig. 2A, a substrate 1 having energy generating elements 2 provided on its surface is prepared. Electrodes (not shown) for inputting control signals to operate the energy generating elements 2 are connected to the energy generating elements 2. Various functional layers may also be provided, such as a protective layer (not shown) for improving the durability of the energy generating elements 2 and an adhesion improving layer (not shown) for improving adhesion between the ejection port forming member 4 and the substrate 1.

[0062] 2B, an ink supply port 3 is formed penetrating the substrate 1. The supply port 3 can be formed by wet etching using an alkaline etching solution such as TMAH (tetramethylammonium hydroxide), or by dry etching such as reactive ion etching.

[0063] Next, as shown in FIG. 2C, a first photosensitive resin layer 10 containing a photosensitive resin and a photopolymerization initiator is formed on the substrate 1 including the energy generating elements 2. The first photosensitive resin layer 10 is a so-called negative photosensitive resin layer. The first photosensitive resin layer 10 is preferably formed by applying a photosensitive resin to a film substrate made of PET or polyimide and transferring it onto the substrate 1 using a lamination method. Epoxy resin is preferably used as the photosensitive resin contained in the first photosensitive resin layer 10 because it satisfies various performance requirements, such as high mechanical strength, adhesion to the substrate, ink resistance, and resolution for patterning the fine pattern of the ejection orifices 5.

[0064] The epoxy resin and photopolymerization initiator may be the same as those described above. The amount of the photopolymerization initiator added can be any amount that achieves the target sensitivity. The amount of the photopolymerization initiator added is preferably in the range of 0.5 to 5% by mass relative to the epoxy resin. If necessary, a wavelength sensitizer may be added, and an example of such a wavelength sensitizer is "SP-100" (trade name) manufactured by Adeka Corporation.

[0065] Furthermore, additives can be added to the photosensitive resin composition as needed, such as a flexibility-imparting agent to reduce the elastic modulus of the epoxy resin, or a silane coupling agent to improve adhesion to the substrate.

[0066] Next, as shown in FIG. 2D, pattern exposure is performed through a mask (not shown), followed by heat treatment to form side walls 8. The mask is a substrate made of a material such as glass or quartz that transmits light of the exposure wavelength, on which a light-shielding film such as a chromium film is formed in accordance with the pattern of the flow channel 6. As the exposure device, a single-wavelength light source such as an i-line exposure stepper or KrF stepper, or a projection exposure device having a broad-wavelength light source of a mercury lamp such as Canon's "Mask Aligner MPA-600Super" (product name) can be used.

[0067] On the substrate 1 on which the sidewalls 8 have been formed in this manner, a second photosensitive resin layer 11 is formed as shown in FIG. 2E. The second photosensitive resin layer 11 is a negative photosensitive resin layer similar to the first photosensitive resin layer 10. As the photosensitive resin contained in the second photosensitive resin layer 11, a bisphenol-type epoxy resin or a novolac-type epoxy resin is preferably used. The second photosensitive resin layer 11 can be formed by the same method as the first photosensitive resin layer 10.

[0068] 2F, a coating film 12 of a solution of a photosensitive resin composition for forming the liquid-repellent and stain-resistant film 7 is formed on the second photosensitive resin layer 11. The coating film 12 can be formed by applying the photosensitive resin composition by a method such as spin coating, roll coating, or slit coating.

[0069] Next, as shown in FIG. 2G, pattern exposure is performed through a mask (not shown) and the coating is cured to form a top plate 9 and a liquid-repellent, stain-resistant coating 7. The mask is a substrate made of a material such as glass or quartz that transmits light of the exposure wavelength, on which a light-shielding film such as a chrome film is formed in accordance with the pattern of the discharge ports 5. As the exposure device, a single-wavelength light source such as an i-line exposure stepper or KrF stepper, or a projection exposure device having a broad-wavelength mercury lamp as a light source such as Canon's "Mask Aligner MPA-600Super" (product name) can be used.

[0070] Next, as shown in FIG. 2H, the unexposed portions of the second photosensitive resin layer 11 and the coating film 12 are removed by a development process to form the discharge ports 5. By simultaneously exposing and developing the second photosensitive resin layer 11 and the coating film 12, the cationic polymerizable groups in the second photosensitive resin layer 11 and the coating film 12 react with each other, resulting in a highly durable, highly antistatic, liquid-repellent, and stain-resistant film 7. At this time, the unexposed portions of the first photosensitive resin layer 10 are also dissolved and removed at the same time, forming the flow paths 6.

[0071] Furthermore, if necessary, a heat treatment is carried out, and then bonding of members (not shown) for ink supply and electrical bonding (not shown) for driving the energy generating elements 2 are carried out to complete the inkjet recording head.

[0072] <Recording method> The recording method according to the embodiment of the present disclosure uses the inkjet recording head to record an image on a recording medium by ejecting a liquid, particularly an ink containing a pigment, from the inkjet recording head. When the inkjet recording head is filled with ink, the side surface of the liquid-repellent and stain-resistant film is always in contact with the ink. By using the inkjet recording head, even after long-term use, non-discharge can be suppressed because the liquid-repellent and stain-resistant film 7 has ink durability. [Example]

[0073] The present disclosure will be described in further detail below with reference to examples, but the present disclosure is not limited to the following examples.

[0074] <Formation of liquid-repellent and stain-resistant film> Example 1 A liquid-repellent and stain-resistant film was formed according to the procedures shown in Figures 3A and 3B. A photosensitive resin composition 1 shown in Table 5-1 was applied to a silicon substrate 13 to form a coating film 12, which was then heat-treated at 70°C for 3 minutes. Subsequently, the coating film 12 was exposed to 5000 Jm using an i-line exposure stepper (Canon Inc.'s "FPA-3000i5+"). -2 The film was exposed to light at 1000 K and then heat-treated at 90° C. for 5 minutes. After washing with PGMEA, the film was further heat-treated at 200° C. for 1 hour to form a liquid-repellent and stain-resistant film 7. The formulation of photosensitive resin composition 1 is as follows: a Epoxy resin: 100 parts by mass d Photopolymerization initiator: 1.5 parts by mass h Resin (A): 0.4 parts by mass n Resin (B): 0.4 parts by mass Solvent PGMEA: adjusted to a solids concentration of 20% by mass.

[0075] Incidentally, materials a to v used in the photosensitive resin compositions in the examples and comparative examples, including those below, are shown in Tables 4-1, 4-2, 4-3 and 4-4.

[0076] (Examples 2 to 118) A liquid-repellent and stain-resistant film 7 was formed in the same manner as in Example 1, except that photosensitive resin compositions 2 to 135 shown in Tables 5-1, 5-2, 5-3, and 5-4 were used. In the examples where a curing accelerator was used, the curing accelerator was used in an amount of 3 mass % relative to the epoxy resin. In the examples where no epoxy resin was used, the photosensitive resin compositions were prepared in the following amounts. Photopolymerization initiator: 1.5 parts by mass Resin (A): 0.4 parts by mass Resin (B): 0.4 parts by mass Solvent PGMEA: adjusted to a solids concentration of 20% by mass.

[0077] (Comparative Examples 1 to 8) In forming the liquid-repellent and stain-resistant film 7, a liquid-repellent and stain-resistant film was produced in the same manner as in Example 1, except that photosensitive resin compositions 136 to 143 shown in Table 6 were used.

[0078] <Fabrication of Ink Jet Recording Head> In addition to the liquid-repellent and stain-proofing film, an inkjet recording head was fabricated by the steps shown in FIGS. 2A to 2H. First, as shown in FIG. 2A, a substrate 1 having an energy generating element 2 provided on its surface was prepared, and an ink supply port 3 penetrating the substrate 1 was formed by etching using TMAH as shown in FIG. 2B.

[0079] Next, as shown in FIG. 2C, a cationic polymerizable resin composition shown in Table 1 was transferred onto the substrate 1 including the energy generating elements 2 by lamination to form a first photosensitive resin layer 10. Furthermore, as shown in FIG. 2D, pattern exposure was performed through a quartz mask (not shown), and side walls 8 were formed by heat treatment at 90°C for 5 minutes. An i-line exposure stepper (Canon Inc.'s "FPA-3000i5+") was used as the exposure device, and the exposure dose was 10,000 Jm. -2 It was decided.

[0080] On the substrate 1 on which the sidewalls 8 were thus formed, a second photosensitive resin layer 11 was formed as shown in Fig. 2E. The second photosensitive resin layer 11 was formed by transferring the cationic polymerizable resin composition shown in Table 2 by a lamination method. Next, as shown in FIG. 2F, the photosensitive resin composition having the formulation of Example 1 shown in Table 5-1 was applied onto the second photosensitive resin layer 11, and then heat-treated at 70°C for 3 minutes. Furthermore, the second photosensitive resin layer 11 and the coating film 12 were simultaneously subjected to pattern exposure through a mask (not shown) having a pattern of the discharge ports 5, and then heat-treated at 90°C for 5 minutes. An i-line exposure stepper (Canon Inc.'s "FPA-3000i5+") was used as the exposure device, and the exposure dose was 5000 Jm -2 (Figure 2G). Finally, the non-exposed areas of the photosensitive resin layer and coating were dissolved and removed using PGMEA, and the resulting product was heat-treated at 200°C for 1 hour to form an ejection port 5, a flow path 6, and a liquid-repellent and antifouling film 7 (Figure 2H).

[0081] [Table 1]

[0082] [Table 2]

[0083] (Examples 2 to 135) Inkjet recording heads of Examples 2 to 135 were prepared in the same manner as in Example 1, except that in the preparation of the inkjet recording head of Example 1, the coating solution used to form the liquid-repellent and stain-proofing film 7 was changed to photosensitive resin compositions 2 to 135 shown in Tables 5-1, 5-2, 5-3 and 5-4, respectively.

[0084] (Comparative Examples 1 to 8) Inkjet recording heads of Comparative Examples 1 to 8 were prepared in the same manner as in Example 1, except that in the preparation of the inkjet recording head of Example 1, the coating solution used to form the liquid-repellent and stain-proofing film 7 was changed to photosensitive resin compositions 136 to 143 shown in Table 6, respectively.

[0085] <Evaluation of liquid-repellent and stain-resistant films> The liquid-repellent and stain-resistant films prepared by the methods of Examples 1 to 135 and Comparative Examples 1 to 8 were evaluated as follows.

[0086] (Initial water repellency) The dynamic receding contact angle θγ of the liquid-repellent and anti-fouling film with pure water was measured using a microcontact angle meter (Microjet Corporation, product name: "DropMeasure") to evaluate the initial water repellency. A rating was given to cases where water repellency was good and the film exhibited a good receding contact angle θγ of 85° or more, a rating of B was given to cases where the film was usable as a liquid-repellent and anti-fouling film with a value of θγ of 70° or more but less than 85°, and a rating of C was given to cases where the film was insufficient as a liquid-repellent and anti-fouling film because the value was less than 70°.

[0087] (ink durability) The liquid-repellent and stain-resistant coating was immersed in a pigment-containing ink and kept at 70°C for one week. Then, θγ was measured in the same manner as above to evaluate ink durability. A rating was given to a θγ of 85° or greater, a rating of B to a repellent angle of 70° or greater but less than 85°, and a rating of C to a θγ of less than 70°, which was insufficient as a liquid-repellent and stain-resistant coating.

[0088] (wipe durability) The liquid-repellent and stain-resistant film was wiped using a pigment ink under the conditions shown in Table 3. Then, θγ was measured in the same manner as above using a microcontact angle meter (Microjet Corporation, product name: "DropMeasure") to evaluate the mechanical strength. A rating was given to cases where θγ was 85° or greater, B to cases where θγ was 70° or greater but less than 85°, and C to cases where θγ was less than 70° and the film was insufficient as a liquid-repellent and stain-resistant film.

[0089] [Table 3]

[0090] The evaluation results are shown in the following Tables 5-1, 5-2, 5-3, 5-4 and Table 6. In the tables, n-Bu represents an n-butyl group, and Me represents a methyl group.

[0091] <Evaluation of inkjet recording head> The ink jet recording heads produced in Examples 1 to 135 and Comparative Examples 1 to 8 were evaluated as follows. Using a Canon MB5330 printer, the inkjet recording head was replaced with the one to be evaluated, and a continuous printing test was carried out in an environment of 30°C and 80% RH, and the presence or absence of dot distortion was visually confirmed. The continuous printing test consisted of printing 100 sheets of A4 solid print in succession. If distortion occurred in even one place within the A4 print, the print quality was deemed NG.

[0092] [Table 4-1]

[0093] [Table 4-2] [Table 4-3] In each compound in Tables 4-3 and 4-4, the arrangement of the parenthesized structures with m and the parenthesized structures with n is random.

[0094] [Table 4-4]

[0095] [Table 5-1]

[0096] [Table 5-2]

[0097] [Table 5-3]

[0098] [Table 5-4]

[0099] [Table 6]

[0100] As shown in Tables 5-1, 5-2, 5-3, and 5-4, Examples 1 to 135 were able to achieve excellent initial water repellency, ink durability, and wipe durability. In particular, the combination of resin composition p and resin composition v showed excellent ink durability and wipe durability. It is believed that the resin composition has three highly reactive 2-(3,4-epoxycyclohexyl)alkyl groups, which allows for sufficient curing.

[0101] On the other hand, in Comparative Examples 1 to 8, the θγ after ink immersion or wiping was 70° or less, indicating insufficient mechanical strength. When using only resin (A), a siloxane resin containing one epoxy group is likely to have excellent ink durability because the water-repellent group is likely to segregate on the surface, but it is thought that the wiping durability is poor because the resin is not cured sufficiently. On the other hand, when only resin (B) is used, a siloxane resin containing two or more epoxy groups has excellent wipe durability, but its liquid repellency is insufficient and the resin is thought to be deteriorated by the ink. Furthermore, in Comparative Examples 1, 2, 5, 6, 7 and 8, when A:B was out of the range of 3:1 to 1:3, the ink durability or wipe durability also decreased.

[0102] In the evaluation using an inkjet recording head, there was no distortion even in continuous printing and high print quality was achieved for Examples 1 to 135. On the other hand, distortion was observed after continuous printing for Comparative Examples 1 to 8.

[0103] As mentioned above, fluorine-based water-repellent materials exhibit good water-repellency, but there are concerns about their impact on the environment. On the other hand, the photosensitive resin composition according to this embodiment exhibits good water repellency even without containing a fluorine-based water repellent material. Therefore, the technology described in this specification can contribute to the realization of a sustainable society, such as a decarbonized / recycling-based society.

[0104] The present disclosure relates to the following configurations. (Configuration 1) A photosensitive resin composition comprising: The photosensitive resin composition contains an alkylsiloxane-containing resin (A) represented by the following formula (1), an alkylsiloxane-containing resin (B) represented by the following formula (2), and a photopolymerization initiator: The photosensitive resin composition is characterized in that the molar ratio A:B of the alkyl-containing siloxane resin (A) to the alkyl-containing siloxane resin (B) is 3:1 to 1:3. TIFF2026028213000018.tif41153 (In formula (1), R1, R2, R3, and X2 each independently represent an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, Either R4 or X1 is an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, the other is an epoxy-containing group, and n+m is an integer of 1 to 60. The arrangement of the parenthesized structure with m and the parenthesized structure with n may be random or block. TIFF2026028213000019.tif39153 (In formula (2), R5 and R6 each independently represent an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, At least two of R7, R8, X3, and X4 are each independently an epoxy-containing group, and the others are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, and n+m is an integer of 1 to 60. The arrangement of the parenthesized structure with m and the parenthesized structure with n may be random or block. (Configuration 2) 2. The photosensitive resin composition according to claim 1, wherein X1 in formula (1) is the epoxy-containing group. (Configuration 3) In the formula (2), X3 and X4 are epoxy-containing groups, 3. The photosensitive resin composition according to claim 1, wherein R7 and R8 are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms. (Configuration 4) 4. The photosensitive resin composition according to any one of Aspects 1 to 3, wherein the epoxy-containing group is a group having a glycidyl ether group or a group having an epoxycyclohexyl group. (Configuration 5) The photosensitive resin composition according to any one of Aspects 1 to 4, wherein the epoxy-containing group is a glycidoxyalkyl group having 1 to 4 carbon atoms in the alkyl chain, or an epoxycyclohexylalkyl group having 1 to 8 carbon atoms in the alkyl chain. (Configuration 6) 6. The photosensitive resin composition according to any one of aspects 1 to 5, wherein the photopolymerization initiator is cationic polymerizable. (Configuration 7) 7. The photosensitive resin composition according to any one of configurations 1 to 6, wherein the photopolymerization initiator is an ionic acid generator, and the cation of the ionic acid generator is a sulfonium ion. (Configuration 8) The molar absorption coefficient of the photopolymerization initiator at a wavelength of 365 nm is 400 M -1 ·cm -1 The photosensitive resin composition according to any one of Configurations 1 to 7, wherein: (Configuration 9) The photopolymerization initiator is an ionic acid generator, and the anion of the ionic acid generator is a tetrakis(pentafluorophenyl)borate ion, a trifluorotris(pentafluorophenyl)borate ion, or a tetrakis(pentafluorophenyl)borate ion. at least one selected from the group consisting of tetrakis(pentafluorophenyl) gallate ion, hexafluoroantimonate ion, and tetrakis(pentafluorophenyl) phosphate ion, 9. The photosensitive resin composition according to any one of Reactions 1 to 8. (Configuration 10) 10. The photosensitive resin composition according to any one of configurations 1 to 9, wherein the photosensitive resin composition contains an epoxy resin. (Configuration 11) 11. The photosensitive resin composition according to claim 10, wherein the epoxy resin is at least one selected from the group consisting of epoxy resins having an alicyclic skeleton, epoxy resins having a bisphenol skeleton, epoxy resins having a phenol novolac skeleton, epoxy resins having a cresol novolac skeleton, epoxy resins having a norbornene skeleton, epoxy resins having a terpene skeleton, epoxy resins having a dicyclopentadiene skeleton, and epoxy resins having an oxycyclohexane skeleton. (Configuration 12) 12. The photosensitive resin composition according to any one of configurations 1 to 11, wherein the photosensitive resin composition contains a phenolic compound or a polyol having at least two hydroxyl groups as a curing accelerator. (Configuration 13) 13. A liquid-repellent and stain-resistant film which is a cured product of the photosensitive resin composition according to any one of aspects 1 to 12. (Configuration 14) An inkjet recording head, the ink jet recording head has a liquid-repellent and stain-resistant film on a surface where the ejection ports are provided, 14. An ink jet recording head, wherein the liquid-repellent and stain-resistant film is the liquid-repellent and stain-resistant film according to Configuration 13. [Explanation of symbols]

[0105] REFERENCE SIGNS LIST 1 substrate, 2 energy generating element, 3 ink supply port, 4 ejection port forming member, 5 ejection port, 6 flow path, 7 liquid-repellent and stain-resistant film, 8 side wall, 9 top plate, 10 first photosensitive resin layer, 11 second photosensitive resin layer, 12 coating film, 13 silicon substrate

Claims

1. A photosensitive resin composition comprising: The photosensitive resin composition contains an alkylsiloxane-containing resin (A) represented by the following formula (1), an alkylsiloxane-containing resin (B) represented by the following formula (2), and a photopolymerization initiator: The photosensitive resin composition is characterized in that the molar ratio A:B of the alkyl-containing siloxane resin (A) to the alkyl-containing siloxane resin (B) is 3:1 to 1:

3. (In formula (1), R １ , R ２ , R ３ , and X ２ are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, R ４ , and X １ One of the groups is an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, and the other is an epoxy-containing group, and n+m is an integer of 1 to 60. The arrangement of the parenthesized structure with m and the parenthesized structure with n may be random or block. (In formula (2), R ５ , and R ６ are each independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, R ７ , R ８ , X ３ , and X ４ At least two of the groups are independently an epoxy-containing group, and the others are independently an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, and n+m is an integer of 1 to 60. The arrangement of the parenthesized structure with m and the parenthesized structure with n may be random or block.

2. The X in the formula (1) １ The photosensitive resin composition according to claim 1 , wherein: is the epoxy-containing group.

3. The X in the formula (2) ３ and X ４ is an epoxy-containing group, The R ７ and R ８ and each independently represent an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms.

4. The photosensitive resin composition according to claim 1 , wherein the epoxy-containing group is a group having a glycidyl ether group or a group having an epoxycyclohexyl group.

5. 2. The photosensitive resin composition according to claim 1, wherein the epoxy-containing group is a glycidoxyalkyl group having an alkyl chain containing 1 to 4 carbon atoms or an epoxycyclohexylalkyl group having an alkyl chain containing 1 to 8 carbon atoms.

6. The photosensitive resin composition according to claim 1 , wherein the photopolymerization initiator is cationically polymerizable.

7. 2. The photosensitive resin composition according to claim 1, wherein the photopolymerization initiator is an ionic acid generator, and the cation of the ionic acid generator is a sulfonium ion.

8. The molar absorption coefficient of the photopolymerization initiator at a wavelength of 365 nm is 400 M －１ ・cm －１ The photosensitive resin composition according to claim 1 .

9. The photopolymerization initiator is an ionic acid generator, and the anion of the ionic acid generator is a tetrakis(pentafluorophenyl)borate ion, a trifluorotris(pentafluorophenyl)borate ion, or a tetrakis(pentafluorophenyl)borate ion. at least one selected from the group consisting of tetrakis(pentafluorophenyl) gallate ion, hexafluoroantimonate ion, and tetrakis(pentafluorophenyl) phosphate ion, 2. The photosensitive resin composition according to claim 1.

10. The photosensitive resin composition according to claim 1 , wherein the photosensitive resin composition comprises an epoxy resin.

11. 8. The photosensitive resin composition according to claim 7, wherein the epoxy resin is at least one selected from the group consisting of epoxy resins having an alicyclic skeleton, epoxy resins having a bisphenol skeleton, epoxy resins having a phenol novolac skeleton, epoxy resins having a cresol novolac skeleton, epoxy resins having a norbornene skeleton, epoxy resins having a terpene skeleton, epoxy resins having a dicyclopentadiene skeleton, and epoxy resins having an oxycyclohexane skeleton.

12. 2. The photosensitive resin composition according to claim 1, wherein the photosensitive resin composition contains a phenolic compound or a polyol having at least two hydroxyl groups as a curing accelerator.

13. A liquid-repellent and stain-resistant film which is a cured product of the photosensitive resin composition according to any one of claims 1 to 12.

14. An inkjet recording head, the ink jet recording head has a liquid-repellent and stain-resistant film on a surface where the ejection ports are provided, An ink jet recording head, wherein the liquid-repellent and stain-resistant film is the liquid-repellent and stain-resistant film according to claim 13.

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