Inspection apparatus

Thicker probes with multiple contact capabilities and switching elements address the challenges of miniaturized pads, ensuring reliable and cost-effective resistance testing on printed circuit boards.

JP2026028449AInactive Publication Date: 2026-02-20T·I·M CO LTD
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Patent Information

Application Number
JP2024130880
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-08-07
Publication Date
2026-02-20
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The miniaturization of pads on printed circuit boards poses challenges for probe cards compatible with the four-terminal method, leading to physical difficulties and increased defects such as probe breakage and wear, as conventional thin probes approach their practical limits.

Method used

The probe card employs thicker probes that allow multiple contacts with adjacent pads, reducing the number of probes required and incorporating switching elements for selective connection to a constant current power supply and voltmeter, enabling high-precision resistance value testing.

Benefits of technology

Ensures the practicality of resistance value testing using the four-terminal method by reducing probe defects and costs while accommodating miniaturization, allowing for efficient and reliable electrical conductivity testing.

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Abstract

To provide a probe card corresponding to a four terminal method capable of coping with miniaturization of a pad on a printed circuit board.SOLUTION: The probe card 10 is equipped with a plurality of probes 11 that come into contact with a plurality of pads 42 on the printed circuit board 40. The probe 11 has a thickness to be in multiple contact with at least two adjacent pads 42 among the plurality of pads 42. A lead wire 16 connected to a constant current power supply 34 and a lead wire 17 connected to a voltmeter 35 are connected to each of the probes 11.SELECTED DRAWING: Figure 1
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Citation Information

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