Substrate transfer method and substrate processing apparatus

Abstract

To properly transfer a plurality of substrates by using a transfer arm having multi-staged picks for holding the substrates.SOLUTION: A substrate transfer method performed in a substrate processing apparatus, the substrate processing apparatus comprising: a processing module configured to process a plurality of substrates; and a transfer mechanism configured to transfer the substrates to the processing module, the transfer mechanism including a transfer arm having a pick configured to hold the substrates in multiple stages, wherein the substrate transfer method includes the steps of: (a) determining a first transfer mode in which the substrates are held by the multiple stages of the pick in a non-influence case where the substrates held by one of the multiple stages of the pick and the substrates held by the other pick do not influence each other, and determining a second transfer mode in which the substrates are held by one of the multiple stages of the pick in an influence case where the substrates held by one of the multiple stages of the pick and the substrates held by the other pick influence each other; and (b) transferring the substrates in the first transfer mode or the second transfer mode determined in the step (a).SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a substrate transfer method and a substrate processing apparatus. [Background technology]

[0002] Patent Document 1 discloses a substrate processing apparatus equipped with a transfer arm that transfers two substrates between a processing chamber having two mounting tables and a transfer chamber. The transfer arm has a pick unit configured by stacking an upper pick and a lower pick spaced a predetermined distance apart, and the pick unit holds the two substrates so that they overlap with a gap between them. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-49873 Summary of the Invention [Problem to be solved by the invention]

[0004] The technology according to the present disclosure appropriately transports a plurality of substrates using a transport arm equipped with multiple stages of picks for holding substrates. [Means for solving the problem]

[0005] One aspect of the present disclosure is a substrate transport method performed in a substrate processing apparatus, the substrate processing apparatus having a processing module for processing a plurality of substrates, and a transport mechanism having a transport arm with multiple stages of picks for holding substrates and transporting substrates to the processing module, the substrate transport method including: (a) a step of determining a first transport mode in which a substrate is held by the multiple picks when a substrate held by one of the multiple picks does not affect another substrate held by another pick, and determining a second transport mode in which a substrate is held by one of the multiple picks when a substrate held by one of the multiple picks affects another substrate; and (b) a step of transporting a substrate in the first transport mode or the second transport mode determined in step (a). [Effects of the Invention]

[0006] According to the present disclosure, a plurality of substrates can be appropriately transported using a transport arm equipped with multiple stages of picks for holding substrates. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a plan view showing an outline of the configuration of a wafer processing apparatus according to an embodiment of the present invention; [Figure 2] FIG. 2 is a perspective view showing the outline of the configuration of a transfer arm. [Figure 3] FIG. 2 is a side view showing an outline of the configuration of a pick unit of the transport arm. [Figure 4] FIG. 2 is an explanatory diagram showing a processing path of a wafer processing. [Figure 5] FIG. 10 is a flow diagram illustrating a method for determining a wafer transport pattern. [Figure 6] FIG. 10 is a flowchart showing main steps of the first transfer pattern. [Figure 7] FIG. 10 is an explanatory diagram showing the movement of the wafer in the first transport pattern. [Figure 8] FIG. 10 is a flowchart showing main steps of the second transport pattern. [Figure 9]FIG. 10 is an explanatory diagram showing the movement of wafers in the second transport pattern. [Figure 10] FIG. 10 is a flowchart showing main steps of a third transfer pattern. [Figure 11] FIG. 10 is an explanatory diagram showing the movement of wafers in the third transport pattern. [Figure 12] FIG. 10 is a flowchart showing main steps of a fourth transfer pattern. [Figure 13] FIG. 10 is an explanatory diagram showing the movement of wafers in a fourth transport pattern. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, a wafer processing apparatus as a substrate processing apparatus and a wafer transfer method as a substrate transfer method according to the present embodiment will be described with reference to the drawings. Note that in this specification, elements having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0009] <Wafer processing equipment> 1 is a plan view showing an outline of the configuration of a wafer processing apparatus 1 according to this embodiment. In this embodiment, the wafer processing apparatus 1 is described as having various processing modules for performing COR (Chemical Oxide Removal) processing, PHT (Post Heat Treatment) processing, cleaning processing, and aligner processing on a wafer W as a substrate. Note that the module configuration of the wafer processing apparatus 1 of the present disclosure is not limited to this and can be selected arbitrarily.

[0010] 1, the wafer processing apparatus 1 has a configuration in which a normal pressure section 10 (e.g., an atmospheric section) and a reduced pressure section 11 (e.g., a vacuum section) are integrally connected via load lock modules 20a and 20b. The normal pressure section 10 includes a plurality of normal pressure modules that perform desired processing on wafers W in a normal pressure atmosphere (e.g., an atmospheric atmosphere). The reduced pressure section 11 includes a plurality of reduced pressure modules that perform desired processing on wafers W in a reduced pressure atmosphere (e.g., a vacuum atmosphere).

[0011] Load lock module 20a, which serves as the first load lock module, temporarily holds wafers W transferred from loader module 30 (described later) in atmospheric pressure section 10, in order to transfer wafers W to transfer module 60 (described later) in decompression section 11. Load lock module 20a has upper stocker 21a and lower stocker 22a, each of which holds two wafers W vertically.

[0012] The load lock module 20a is connected to a loader module 30 (described later) via a gate 24a having a gate valve 23a. This gate valve 23a ensures airtightness between the load lock module 20a and the loader module 30 while allowing communication between them. The load lock module 20a is also connected to a transfer module 60 (described later) via a gate 26a having a gate valve 25a. This gate valve 25a ensures airtightness between the load lock module 20a and the transfer module 60 while allowing communication between them.

[0013] The load lock module 20a is connected to an air supply section (not shown) that supplies gas and an exhaust section (not shown) that exhausts gas, and is configured so that the interior can be switched between a normal pressure atmosphere and a reduced pressure atmosphere by the air supply section and the exhaust section. That is, the load lock module 20a is configured so that the wafer W can be appropriately transferred between the normal pressure section 10, which has a normal pressure atmosphere, and the reduced pressure section 11, which has a reduced pressure atmosphere.

[0014] The load lock module 20b has the same configuration as the load lock module 20a, i.e., it has an upper stocker 21b, a lower stocker 22b, a gate valve 23b and a gate 24b on the loader module 30 side, and a gate valve 25b and a gate 26b on the transfer module 60 side.

[0015] The number and arrangement of the load lock modules 20a and 20b are not limited to those in this embodiment, but can be set arbitrarily.

[0016] The atmospheric pressure section 10 has a loader module 30 equipped with a wafer transport mechanism 40 described later, a load port 32 on which a FOUP 31 capable of storing multiple wafers W is placed, a wafer cleaning module 33 that removes fluorine from the wafers W, and an aligner module 34 that adjusts the horizontal orientation of the wafers W.

[0017] The loader module 30 is made up of a rectangular housing, and the interior of the housing is maintained at normal pressure. A plurality of, for example, three load ports 32 are arranged side by side on one side that forms the long side of the housing of the loader module 30. Load lock modules 20a and 20b are arranged side by side on the other side that forms the long side of the housing of the loader module 30. A wafer cleaning module 33 is provided on one side that forms the short side of the housing of the loader module 30. An aligner module 34 is provided on the other side that forms the short side of the housing of the loader module 30.

[0018] The number and arrangement of the load ports 32, wafer cleaning modules 33, and aligner modules 34 are not limited to those in this embodiment and can be designed as desired. For example, a plurality of wafer cleaning modules 33 may be provided, one on each side of the load lock modules 20a, 20b. The loader module 30 may also be provided with other atmospheric pressure modules, such as a wafer cooling module and an optical film thickness measurement device.

[0019] The FOUP 31 accommodates a plurality of wafers W, for example, 25 wafers per lot, stacked in multiple stages at equal intervals. The interior of the FOUP 31 placed on the load port 32 is filled with, for example, air or nitrogen gas and sealed.

[0020] The wafer cleaning module 33 removes fluorine remaining on the surface of the wafer W after the COR process and the PHT process, thereby cleaning the surface of the wafer W.

[0021] The aligner module 34 adjusts the horizontal orientation of the wafer W by rotating the wafer W. Specifically, when performing wafer processing on each of the multiple wafers W, the aligner module 34 adjusts the wafer W so that the horizontal orientation from a reference position (e.g., notch position) is the same for each wafer processing.

[0022] A wafer transfer mechanism 40 that transfers a wafer W is provided inside the loader module 30. The wafer transfer mechanism 40 has a transfer arm 41 (41a, 41b) that holds and moves the wafer W, a rotary table 42 that rotatably supports the transfer arm 41, and a rotary mounting table 43 on which the rotary table 42 is mounted. The wafer transfer mechanism 40 is configured to be movable in the longitudinal direction inside the housing of the loader module 30.

[0023] The decompression unit 11 has a transfer module 60 that simultaneously transports two wafers W, a COR module 61 that serves as a processing module (first processing module) that performs COR processing on the wafer W, and a PHT module 62 that serves as a processing module (second processing module) that performs PHT processing on the wafer W. The interiors of the transfer module 60, the COR module 61, and the PHT module 62 are each maintained in a decompressed atmosphere. A plurality of, for example, three COR modules 61 and three PHT modules 62 are provided for the transfer module 60.

[0024] The transfer module 60 has an internal rectangular housing and is connected to the load lock modules 20a and 20b via the gate valves 25a and 25b as described above. The transfer module 60 sequentially transfers the wafer W loaded into the load lock module 20a to one COR module 61 and one PHT module 62, where the wafer W is subjected to COR processing and PHT processing, and then transfers the wafer W to the atmospheric pressure section 10 via the load lock module 20b.

[0025] Two stages 63a and 63b for mounting two wafers W side by side in the horizontal direction are provided inside the COR module 61. The COR module 61 simultaneously performs COR processing on two wafers W by mounting the wafers W side by side on the stages 63a and 63b. The COR module 61 is connected to an air supply unit (not shown) that supplies processing gas, purge gas, etc., and an exhaust unit (not shown) that exhausts gases.

[0026] Additionally, the COR module 61 is connected to the transfer module 60 via a gate 65 provided with a gate valve 64. This gate valve 64 ensures airtightness between the transfer module 60 and the COR module 61 while also allowing communication between them.

[0027] Two stages 66a and 66b for mounting two wafers W side by side in the horizontal direction are provided inside the PHT module 62. The PHT module 62 simultaneously performs PHT processing on two wafers W by mounting the wafers W side by side on the stages 66a and 66b. The PHT module 62 is connected to an air supply unit (not shown) for supplying gas and an exhaust unit (not shown) for discharging gas.

[0028] The PHT module 62 is connected to the transfer module 60 via a gate 68 provided with a gate valve 67. This gate valve 67 ensures airtightness between the transfer module 60 and the PHT module 62 while also allowing communication between them.

[0029] A wafer transfer mechanism 70 for transferring wafers W is provided inside the transfer module 60. The wafer transfer mechanism 70 includes transfer arms 71 (71a, 71b) that hold and move two wafers W, a rotary table 72 that rotatably supports the transfer arms 71a, 71b, and a rotary table 73 on which the rotary table 72 is mounted. Also, a guide rail 74 extending in the longitudinal direction of the transfer module 60 is provided inside the transfer module 60. The rotary table 73 is mounted on the guide rail 74, and the wafer transfer mechanism 70 is configured to be movable along the guide rail 74. The number of transfer arms 71 is not limited to that in this embodiment, and may be three or more. The configuration of the transfer arms 71a, 71b will be described later.

[0030] In the transfer module 60, the two wafers W held in the upper stocker 21a and lower stocker 22a in the load lock module 20a are received by the wafer transfer mechanism 70 and transferred to the COR module 61. Furthermore, the two wafers W that have been subjected to, for example, COR processing are held by the wafer transfer mechanism 70 and transferred to the PHT module 62. Furthermore, the two wafers W that have been subjected to, for example, PHT processing are held by the wafer transfer mechanism 70 and transferred to the load lock module 20b.

[0031] The wafer processing apparatus 1 described above includes at least one controller 80. The controller 80 processes computer-executable instructions that cause the wafer processing apparatus 1 to perform the various processes described herein. The controller 80 may be configured to control each element of the wafer processing apparatus 1 to perform the various processes described herein. In one embodiment, part or all of the controller 80 may be included in the wafer processing apparatus 1. The controller 80 may include a processor, a storage unit, and a communication interface. The controller 80 may be implemented, for example, by a computer. The processor may be configured to read from the storage unit a program that provides logic or routines that enable the various control operations and execute the read program to perform the various control operations. This program may be stored in the storage unit in advance or may be acquired via a medium when needed. The acquired program is stored in the storage unit and read from the storage unit by the processor for execution. The medium may be various computer-readable storage media or a communication line connected to the communication interface. The storage medium may be temporary or non-temporary. The processor may be a CPU (Central Processing Unit) or one or more circuits. The storage unit may include a RAM (Random Access Memory), a ROM (Read Only Memory), a HDD (Hard Disk Drive), an SSD (Solid State Drive), or a combination thereof. The communication interface may communicate with the wafer processing apparatus 1 via a communication line such as a LAN (Local Area Network).

[0032] <Transport arm configuration> Fig. 2 is a perspective view showing the outline of the configuration of the transfer arms 71a and 71b, and Fig. 3 is a side view showing the outline of the configuration of pick units 78a and 78b (described later) of the transfer arms 71a and 71b.

[0033] 2, the transfer arm 71a includes a first arm 75a having one end rotatably connected to the turntable 72, a second arm 76a having one end rotatably connected to the other end of the first arm 75a, and a third arm 77a having one end rotatably connected to the other end of the second arm 76a. A pick unit 78a for holding a wafer W is connected to the other end of the third arm 77a. The pick unit 78a is configured with a multi-stage, for example, two-stage, bifurcated, fork-shaped pick, and includes an upper stage pick 78a1 and a lower stage pick 78a2. The number of stages of the pick unit 78a is not limited to that in this embodiment and may be, for example, three or more stages.

[0034] The transfer arm 71b has a first arm 75b having one end rotatably connected to the turntable 72, a second arm 76b having one end rotatably connected to the other end of the first arm 75b, and a third arm 77b having one end rotatably connected to the other end of the second arm 76b. A pick unit 78b for holding a wafer W is connected to the other end of the third arm 77b. The pick unit 78b is configured with a multi-stage, for example, two-stage, bifurcated, fork-shaped pick, and has an upper stage pick 78b1 and a lower stage pick 78b2. The number of stages of the pick unit 78b is not limited to that in this embodiment and may be, for example, three or more stages.

[0035] Each of the upper picks 78a1 and 78b1 and the lower picks 78a2 and 78b2 holds and moves a wafer W. In the following description, the wafer W held by the upper picks 78a1 and 78b1 may be referred to as the upper wafer W, and the wafer W held by the lower picks 78a2 and 78b2 may be referred to as the lower wafer W. As shown in FIG. 3, the inter-pick distance t between the wafer holding surface of the upper pick 78a1 and the wafer holding surface of the lower pick 78a2 and the inter-pick distance t between the wafer holding surface of the upper pick 78b1 and the wafer holding surface of the lower pick 78b2 are, for example, 10 mm to 30 mm. In other words, the two wafers W are held by the transfer arms 71a and 71b so that they overlap with a gap of 10 mm to 30 mm between them.

[0036] <Wafer processing method> Next, a description will be given of wafer processing in the wafer processing apparatus 1. Figure 4 is an explanatory diagram showing the processing path of the wafer processing.

[0037] First, FOUP 31 containing multiple wafers W is carried into and placed on load port 32 (position P1 in FIG. 4). Once FOUP 31 is placed on load port 32, controller 80 controls wafer processing apparatus 1 to remove wafers W from FOUP 31 and perform a series of wafer processing steps. In the series of wafer processing steps, first, wafer transfer mechanism 40 accesses FOUP 31 and removes wafers W from FOUP 31.

[0038] The wafer W unloaded from the FOUP 31 is first transferred by the wafer transfer mechanism 40 to the aligner module 34 (position P2 in FIG. 4). In the aligner module 34, the orientation of the wafer W from the horizontal direction relative to a reference position (e.g., notch position) is adjusted.

[0039] Next, the wafer W is loaded into the load lock module 20a by the wafer transfer mechanism 40 (position P3 in FIG. 4). Two wafers W are successively loaded into the load lock module 20a. Then, the gate valve 23a is closed, the inside of the load lock module 20a is sealed, and the pressure is reduced. Thereafter, the gate valve 25a is opened, and the inside of the load lock module 20a and the inside of the transfer module 60 are connected to each other.

[0040] Next, the two wafers W are held by the transfer arm 71 of the wafer transfer mechanism 70 and transferred from the load lock module 20a into the transfer module 60. After the two wafers W are transferred out of the load lock module 20a, the gate valve 25a is closed.

[0041] Next, the gate valve 64 is opened, and the transfer arm 71 holding the two wafers W enters the COR module 61. The transfer arm 71 then places the wafers W on the stages 63a and 63b (position P4 in FIG. 4). Thereafter, the gate valve 64 is closed, and the two wafers W are subjected to COR processing in the COR module 61.

[0042] When the COR process in the COR module 61 is completed, the gate valve 64 is opened and the transfer arm 71 enters the COR module 61. Then, two wafers W are transferred from the stages 63a and 63b to the transfer arm 71, and the two wafers W are held by the transfer arm 71. When the two wafers W are unloaded from the COR module 61, the gate valve 64 is closed.

[0043] Next, the gate valve 67 is opened, and the transfer arm 71 holding the two wafers W enters the PHT module 62. The transfer arm 71 then places the wafers W on the stages 66a and 66b (position P5 in FIG. 4). Thereafter, the gate valve 67 is closed, and the two wafers W are subjected to PHT processing in the PHT module 62.

[0044] When the PHT processing in the PHT module 62 is completed, the gate valve 67 is opened, and the transfer arm 71 enters the PHT module 62. Then, two wafers W are transferred from the stages 66a and 66b to the transfer arm 71, and the two wafers W are held by the transfer arm 71. When the two wafers W are unloaded from the PHT module 62, the gate valve 67 is closed.

[0045] Next, gate valve 25b is opened, and two wafers W are loaded into load lock module 20b by wafer transfer mechanism 70 (position P6 in FIG. 4). Subsequently, gate valve 25b is closed, the inside of load lock module 20b is sealed, and the inside of load lock module 20b is opened to the atmosphere. Thereafter, gate valve 23b is opened, the inside of load lock module 20b is connected to the inside of loader module 30, and the wafers W are loaded out of load lock module 20b by wafer transfer mechanism 40.

[0046] In some cases, the wafer W may be transferred by the wafer transfer mechanism 40 to the wafer cleaning module 33 (position P7 in FIG. 4). In the wafer cleaning module 33, the surface of the wafer W is cleaned.

[0047] Next, the wafer W is accommodated by the wafer transfer mechanism 40 in the FOUP 31 placed on the load port 32 (position P1 in FIG. 4). Then, the wafer W enters a standby state until wafer processing for all wafers W accommodated in the FOUP 31 is completed and they are recovered into the FOUP 31.

[0048] When all the wafers W are collected into the FOUP 31, the series of wafer processing in the wafer processing apparatus 1 is completed.

[0049] 1, when a plurality of COR modules 61 and PHT modules 62 are provided in the wafer processing apparatus 1, the plurality of COR modules 61 and PHT modules 62 can be operated in parallel. That is, for example, a wafer W, a next wafer W, and a wafer W further next can be subjected to COR processing and PHT processing simultaneously.

[0050] <Wafer transport method> Next, a description will be given of a method for transferring a wafer W in the wafer processing apparatus 1. In this embodiment, a method for transferring a wafer W to the load lock module 20a, the COR module 61, the PHT module 62, and the load lock module 20b by the wafer transfer mechanism 70 will be described.

[0051] Here, in the wafer transfer mechanism 70, the transfer arm 71a has an upper pick 78a1 and a lower pick 78a2. The inter-pick distance t between the upper pick 78a1 and the lower pick 78a2 is small, for example, 10 mm to 30 mm.

[0052] In such a case, for example, when the transfer arm 71a holds two wafers W with picks 78a1 and 78a2, particles may fall from the backside of the upper wafer W held by the upper pick 78a1 onto the lower wafer W held by the lower pick 78a2. For example, if the upper wafer W has undergone COR processing or PHT processing, particles are likely to be generated from the upper wafer W. In particular, by-products remain on the wafer W after the COR processing, and particles are likely to be generated from the upper wafer W.

[0053] Furthermore, for example, when the transfer arm 71a holds two wafers W using picks 78a1 and 78a2, a temperature difference may occur between the upper wafer W held by the upper pick 78a1 and the lower wafer W held by the lower pick 78a2. For example, if the upper wafer W and the lower wafer W are wafers W after COR processing or PHT processing, the upper wafer W and the lower wafer W are in a high-temperature state. The upper surface of the upper wafer W is exposed to the internal atmosphere of the transfer module 60 and is therefore easily cooled. On the other hand, the upper surface of the lower wafer W is exposed to the internal atmosphere of the transfer module 60 only by the small pick distance t between the upper wafer W and the lower wafer W, and is also subject to heat dissipation from the upper wafer W, so it is difficult to cool. As such, the upper wafer W is easily cooled and the lower wafer W is difficult to cool, resulting in a temperature difference between the upper wafer W and the lower wafer W.

[0054] If a temperature difference occurs between the upper wafer W and the lower wafer W, the results after subsequent processing will be different. For example, if the upper wafer W and the lower wafer W are wafers W after COR processing, the temperatures of the upper wafer W and the lower wafer W when held by the transfer arm 71a are high, for example, 300°C to 400°C. Thereafter, during transfer from the COR module 61 to the PHT module 62, the internal atmosphere of the transfer module 60 is, for example, less than 100°C, and the upper wafer W is easily cooled but the lower wafer W is difficult to cool. Then, since the PHT processing is performed on the upper wafer W and the lower wafer W in a state where a temperature difference occurs between the upper wafer W and the lower wafer W, the states of the upper wafer W and the lower wafer W after the PHT processing will be different.

[0055] As described above, for example, when the transfer arm 71a holds two processed wafers W, particles may fall from the upper wafer W to the lower wafer W, and a temperature difference may occur between the upper wafer W and the lower wafer W, affecting the results of subsequent processing. In the following description, such a state in which the upper wafer W and the lower wafer W affect each other and cause problems is referred to as "affected."

[0056] It should be noted that, for example, even when the transfer arm 71a holds two processed wafers W, as described above, particles may fall from the upper wafer W to the lower wafer W, or no temperature difference may occur between the upper wafer W and the lower wafer W. In the following description, this state in which the upper wafer W and the lower wafer W do not affect each other and no problems arise is referred to as "unaffected."

[0057] In this embodiment, when the upper wafer W and the lower wafer W are unaffected, the upper pick 78a1 and the lower pick 78a2 of the transfer arm 71a hold two wafers W, and similarly, the upper pick 78b1 and the lower pick 78b2 of the transfer arm 71b hold two wafers W. In the following description, the mode in which two wafers W are held by each of the transfer arms 71a and 71b in this manner is referred to as a first transfer mode.

[0058] On the other hand, when the upper wafer W and the lower wafer W are affected, the two wafers W are not held by the transfer arm 71a, and the two wafers W are not held by the transfer arm 71b. When the two wafers W are affected, the two wafers W are held by the upper pick 78a1 or the lower pick 78a2 of the transfer arm 71a and the upper pick 78b1 or the lower pick 78b2 of the transfer arm 71b. In the following description, the mode in which two wafers W are held by both the transfer arms 71a and 71b in this manner is referred to as the second transfer mode.

[0059] As described above, when the upper wafer W and the lower wafer W are unaffected, the first transfer mode is selected, and when the upper wafer W and the lower wafer W are affected, the second transfer mode is selected. In this embodiment, once a process recipe for wafer processing in the wafer processing apparatus 1 is determined, a transfer pattern for wafers W by the wafer transfer mechanism 70 according to the process recipe is determined before the wafer processing is performed. Figure 5 is a flow diagram showing a method for determining a transfer pattern for wafers W.

[0060] In this embodiment, wafers W are transported to load lock module 20a, COR module 61, PHT module 62, and load lock module 20b by wafer transport mechanism 70. At this time, the transport pattern for wafers W is determined as one of first to fourth transport patterns depending on the state of two wafers W after COR processing in COR module 61 and the state of two wafers W after PHT processing in PHT module 62. Note that in the first to fourth transport patterns, the transport of two wafers W from load lock module 20a to COR module 61 is determined to be the first transport mode because the two wafers W are unprocessed and will not be affected.

[0061] When two wafers W after the COR process are affected and two wafers W after the PHT process are affected, the first transfer pattern is selected. In the first transfer pattern, the transfer mode of wafers W between modules 20a, 61, 62, and 20b is as follows. (1) Load lock module 20a to COR module 61: First transfer mode (2) From COR module 61 to PHT module 62: Second transfer mode (3) From the PHT module 62 to the load lock module 20b: Second transfer mode

[0062] If the two wafers W after the COR process are affected and the two wafers W after the PHT process are not affected, the second transfer pattern is selected. In the second transfer pattern, the transfer mode of the wafers W between the modules 20a, 61, 62, and 20b is as follows. (1) Load lock module 20a to COR module 61: First transfer mode (2) From COR module 61 to PHT module 62: Second transfer mode (3) From the PHT module 62 to the load lock module 20b: First transfer mode

[0063] If the two wafers W after the COR process are unaffected and the two wafers W after the PHT process are affected, the third transfer pattern is selected. In the third transfer pattern, the transfer mode of the wafers W between the modules 20a, 61, 62, and 20b is as follows. (1) Load lock module 20a to COR module 61: First transfer mode (2) From COR module 61 to PHT module 62: First transfer mode (3) From the PHT module 62 to the load lock module 20b: Second transfer mode

[0064] If the two wafers W after the COR process are unaffected and the two wafers W after the PHT process are unaffected, the fourth transfer pattern is selected. In the fourth transfer pattern, the transfer mode of the wafers W between the modules 20a, 61, 62, and 20b is as follows. (1) Load lock module 20a to COR module 61: First transfer mode (2) From COR module 61 to PHT module 62: First transfer mode (3) From the PHT module 62 to the load lock module 20b: First transfer mode

[0065] Next, the first to fourth transfer patterns will be described in detail.

[0066] (First conveying pattern) Fig. 6 is a flow diagram showing the main steps of the first transfer pattern, and Fig. 7 is an explanatory diagram showing the movement of the wafer W in the first transfer pattern.

[0067] In this example, wafers W1a and W1b are previously stored in load lock module 20a, wafers W2a and W2b are previously stored in COR module 61, and wafers W3a and W3b are previously stored in PHT module 62 (step St100). Wafers W1a and W1b are held in stockers 21a and 22a, respectively, of load lock module 20a. Wafers W2a and W2b are placed on stages 63a and 63b, respectively, of COR module 61, and COR processing is performed on wafers W2a and W2b. Wafers W3a and W3b are placed on stages 66a and 66b, respectively, of PHT module 62, and PHT processing is performed on wafers W3a and W3b.

[0068] First, the wafer transfer mechanism 70 receives the wafers W3a and W3b from the stages 66a and 66b of the PHT module 62 using the upper pick 78a1 of the transfer arm 71a and the upper pick 78b1 of the transfer arm 71b (step St101). In step St101, the wafers W3a and W3b after the PHT processing are affected, and are transferred in the second transfer mode. Also in step St101, the upper pick 78a1, which is closer to the PHT module 62, receives the wafer W3a, and then the upper pick 78b1 receives the wafer W3b.

[0069] In step St101, wafer W3a may be received by transfer arm 71a, and either upper pick 78a1 or lower pick 78a2 may receive wafer W3a. Similarly, wafer W3b may be received by transfer arm 71b, and either upper pick 78b1 or lower pick 78b2 may receive wafer W3b. In step St101, the order in which wafers W3a and W3b are received is not particularly limited; wafer W3b may be received by upper pick 78b1, and then wafer W3a may be received by upper pick 78a1.

[0070] Next, the wafer transfer mechanism 70 transfers the wafer W3a on the pick 78a1 to the stocker 21b of the load lock module 20b (step St102). After the inside of the load lock module 20b is opened to the atmosphere, the wafer W3a held in the stocker 21b is carried out of the load lock module 20b by the wafer transfer mechanism 40. Thereafter, the pressure inside the load lock module 20b is reduced.

[0071] Next, the wafer transfer mechanism 70 transfers the wafer W3b on the pick 78b1 to the stocker 22b of the load lock module 20b (step St102). After the inside of the load lock module 20b is opened to the atmosphere, the wafer W3b held in the stocker 22b is carried out of the load lock module 20b by the wafer transfer mechanism 40. Thereafter, the pressure inside the load lock module 20b is reduced.

[0072] If the distance between stockers 21b and 22b in load lock module 20b is 30 mm or more, wafers W3a and W3b may be held in the stockers simultaneously. In this case, in step St102, wafer W3a is transferred from the upper pick 78a1, which is closer to load lock module 20b, and then wafer W3b is transferred from the upper pick 78b1. Next, after the interior of load lock module 20b is opened to the atmosphere, wafers W3a and W3b held in stockers 21b and 22b are removed from load lock module 20b by wafer transfer mechanism 40. Thereafter, the interior of load lock module 20b is depressurized. In step St102, the order in which wafers W3a and W3b are transferred is not particularly limited; wafer W3b may be transferred from upper pick 78b1, and then wafer W3a may be transferred from upper pick 78a1.

[0073] Next, the wafer transfer mechanism 70 receives the wafers W2a and W2b from the stages 63a and 63b of the COR module 61 using the upper pick 78a1 of the transfer arm 71a and the upper pick 78b1 of the transfer arm 71b (step St103). In step St103, the wafers W2a and W2b after the COR process are affected, and are transferred in the second transfer mode. Also in step St103, the upper pick 78a1, which is closer to the COR module 61, receives the wafer W2a, and then the upper pick 78b1 receives the wafer W2b.

[0074] In step St103, wafer W2a may be received by transfer arm 71a, and either upper pick 78a1 or lower pick 78a2 may receive wafer W2a. Similarly, wafer W2b may be received by transfer arm 71b, and either upper pick 78b1 or lower pick 78b2 may receive wafer W2b. In step St103, the order in which wafers W2a and W2b are received is not particularly limited; wafer W2b may be received by upper pick 78b1, and then wafer W2a may be received by upper pick 78a1.

[0075] Next, the wafer transfer mechanism 70 transfers the wafers W2a and W2b from the picks 78a1 and 78b1 to the stages 66a and 66b of the PHT module 62 (step St104). In step St104, the wafer W2a is transferred from the upper pick 78a1, which is closer to the PHT module 62, and then the wafer W2b is transferred from the upper pick 78b1.

[0076] Next, the wafers W2a and W2b placed on the stages 66a and 66b are subjected to PHT processing.

[0077] In step St104, the order in which the wafers W2a and W2b are transferred is not particularly limited, and the wafer W2a may be transferred from the upper pick 78a1 after the wafer W2b is transferred from the upper pick 78b1.

[0078] Next, wafer transfer mechanism 70 uses upper pick 78a1 and lower pick 78a2 of transfer arm 71a to receive wafers W1a and W1b from stockers 21a and 22a of load lock module 20a (step St105). In step St105, unprocessed wafers W1a and W1b are not affected, and wafers W1a and W1b are transferred in the first transfer mode. Also in step St105, picks 78a1 and 78a2 simultaneously receive two wafers W1a and W1b.

[0079] In step St105, W1a and W1b may be received by the transfer arm 71 closer to the load lock module 20a, and W1a and W1b may be received by the upper pick 78b1 and the lower pick 78b2 of the transfer arm 71b.

[0080] Next, wafer transfer mechanism 70 transfers wafers W1a and W1b from transfer arm 71a to stages 63a and 63b of COR module 61 (step St106). In step St106, wafer W1b is transferred from lower pick 78a2, and then wafer W1a is transferred from upper pick 78a1.

[0081] Next, the wafers W1a and W1b placed on the stages 63a and 63b are subjected to COR processing.

[0082] In step St106, the order in which the wafers W1a and W1b are transferred is not particularly limited, and the wafer W1a may be transferred from the upper pick 78a1 and then from the lower pick 78a2.

[0083] Next, the wafer transfer mechanism 70 receives the wafers W2a and W2b from the stages 66a and 66b of the PHT module 62 using the upper pick 78a1 of the transfer arm 71a and the upper pick 78b1 of the transfer arm 71b (step St107). This step St107 is similar to step St101 described above.

[0084] Next, the wafer transfer mechanism 70 transfers the wafers W2a and W2b on the picks 78a1 and 78b1 to the stockers 21b and 22b of the load lock module 20b (step St108). This step St108 is similar to the above-mentioned step St102.

[0085] Next, the wafer transfer mechanism 70 receives the wafers W1a and W1b from the stages 63a and 63b of the COR module 61 using the upper pick 78a1 of the transfer arm 71a and the upper pick 78b1 of the transfer arm 71b (step St109). This step St109 is similar to step St103 described above.

[0086] Next, the wafer transfer mechanism 70 transfers the wafers W1a and W1b on the picks 78a1 and 78b1 to the stages 66a and 66b of the PHT module 62 (step St110). This step St110 is similar to step St104 described above.

[0087] Next, the wafer transfer mechanism 70 receives the wafers W1a and W1b from the stages 66a and 66b of the PHT module 62 using the upper pick 78a1 of the transfer arm 71a and the upper pick 78b1 of the transfer arm 71b (step St111). This step St111 is similar to steps St101 and St107 described above.

[0088] Next, the wafer transfer mechanism 70 transfers the wafers W1a and W1b on the picks 78a1 and 78b1 to the stockers 21b and 22b of the load lock module 20b (step St112). This step St112 is similar to the above-mentioned steps St102 and St108.

[0089] (Second transport pattern) Fig. 8 is a flow diagram showing the main steps of the second transfer pattern, and Fig. 9 is an explanatory diagram showing the movement of the wafer W in the second transfer pattern.

[0090] In this example, wafers W1a and W1b are previously stored in load lock module 20a, wafers W2a and W2b are previously stored in COR module 61, and wafers W3a and W3b are previously stored in PHT module 62 (step St200). This step St200 is similar to step St100 in the first transfer pattern.

[0091] First, the wafer transfer mechanism 70 receives the wafers W3a and W3b from the stages 66a and 66b of the PHT module 62 using the upper pick 78b1 and lower pick 78b2 of the transfer arm 71b (step St201). In step St201, the wafers W3a and W3b after PHT processing are unaffected, and are transferred in the first transfer mode. Also in step St201, after the wafer W3a is received by the upper pick 78b1, the wafer W3b is received by the lower pick 78b2.

[0092] In step St201, W3a and W3b may be received by the transfer arm 71 closer to the PHT module 62, and W3a and W3b may be received by the upper pick 78a1 and the lower pick 78a2 of the transfer arm 71a. In step St201, the order in which wafers W3a and W3b are received is not particularly limited, and wafer W3b may be received by the lower pick 78b2 and then wafer W3a may be received by the upper pick 78b1.

[0093] Next, wafer transfer mechanism 70 transfers wafers W3a and W3b on picks 78b1 and 78b2 to stockers 21b and 22b in load lock module 20b (step St202). In step St202, picks 78b1 and 78b2 simultaneously transfer two wafers W3a and W3b.

[0094] Subsequently, after the inside of load lock module 20b is opened to the atmosphere, wafers W3a and W3b held in stockers 21b and 22b are carried out of load lock module 20b by wafer transfer mechanism 40. Thereafter, the inside of load lock module 20b is depressurized.

[0095] Next, the wafer transfer mechanism 70 uses the upper pick 78a1 of transfer arm 71a and the upper pick 78b1 of transfer arm 71b to receive the wafers W2a and W2b from the stages 63a and 63b of the COR module 61 (step St203). In step St203, the wafers W2a and W2b after the COR process are affected, and are therefore transferred in the second transfer mode. Also in step St203, the upper pick 78a1, which is closer to the COR module 61, receives the wafer W2a, and then the upper pick 78b1 receives the wafer W2b.

[0096] In step St203, wafer W2a may be received by transfer arm 71a, and either upper pick 78a1 or lower pick 78a2 may receive wafer W2a. Similarly, wafer W2b may be received by transfer arm 71b, and either upper pick 78b1 or lower pick 78b2 may receive wafer W2b. Furthermore, the order in which wafers W2a and W2b are received in step St203 is not particularly limited; wafer W2b may be received by upper pick 78b1, and then wafer W2a may be received by upper pick 78a1.

[0097] Next, the wafer transfer mechanism 70 transfers the wafers W2a and W2b from the picks 78a1 and 78b1 to the stages 66a and 66b of the PHT module 62 (step St204). In step St204, the wafer W2a is transferred from the upper pick 78a1, which is closer to the PHT module 62, and then the wafer W2b is transferred from the upper pick 78b1.

[0098] Next, the wafers W2a and W2b placed on the stages 66a and 66b are subjected to PHT processing.

[0099] In step St204, the order in which the wafers W2a and W2b are transferred is not particularly limited, and the wafer W2a may be transferred from the upper pick 78a1 after the wafer W2b is transferred from the upper pick 78b1.

[0100] Next, wafer transfer mechanism 70 uses upper pick 78a1 and lower pick 78a2 of transfer arm 71a to receive wafers W1a and W1b from stockers 21a and 22a of load lock module 20a (step St205). In step St205, unprocessed wafers W1a and W1b are not affected, and wafers W1a and W1b are transferred in the first transfer mode. Also in step St205, picks 78a1 and 78a2 simultaneously receive two wafers W1a and W1b.

[0101] In step St205, W1a and W1b may be received by the transfer arm 71 closer to the load lock module 20a, and W1a and W1b may be received by the upper pick 78b1 and the lower pick 78b2 of the transfer arm 71b.

[0102] Next, wafer transfer mechanism 70 transfers wafers W1a and W1b from transfer arm 71a to stages 63a and 63b of COR module 61 (step St206). In step St206, wafer W1b is transferred from lower pick 78a2, and then wafer W1a is transferred from upper pick 78a1.

[0103] Next, the wafers W1a and W1b placed on the stages 63a and 63b are subjected to COR processing.

[0104] In step St206, the order in which the wafers W1a and W1b are transferred is not particularly limited, and the wafer W1a may be transferred from the upper pick 78a1 and then from the lower pick 78a2.

[0105] Next, the wafer transfer mechanism 70 receives the wafers W2a and W2b from the stages 66a and 66b of the PHT module 62 with the upper pick 78b1 and the lower pick 78b2 of the transfer arm 71b (step St207). This step St207 is similar to step St201 described above.

[0106] Next, the wafer transfer mechanism 70 transfers the wafers W2a and W2b on the picks 78b1 and 78b2 to the stockers 21b and 22b of the load lock module 20b (step St208). This step St208 is similar to the above-mentioned step St202.

[0107] Next, the wafer transfer mechanism 70 receives the wafers W1a and W1b from the stages 63a and 63b of the COR module 61 using the upper pick 78a1 of the transfer arm 71a and the upper pick 78b1 of the transfer arm 71b (step St209). This step St209 is similar to step St203 described above.

[0108] Next, the wafer transfer mechanism 70 transfers the wafers W1a and W1b on the picks 78a1 and 78b1 to the stages 66a and 66b of the PHT module 62 (step St210). This step St210 is similar to step St204 described above.

[0109] Next, the wafer transfer mechanism 70 receives the wafers W1a and W1b from the stages 66a and 66b of the PHT module 62 with the upper pick 78b1 and the lower pick 78b2 of the transfer arm 71b (step St211). This step St211 is similar to steps St201 and St207 described above.

[0110] Next, the wafer transfer mechanism 70 transfers the wafers W1a and W1b on the picks 78b1 and 78b2 to the stockers 21b and 22b of the load lock module 20b (step St212). This step St212 is similar to the above-mentioned steps St202 and St208.

[0111] (Third transport pattern) Fig. 10 is a flow diagram showing the main steps of the third transfer pattern, and Fig. 11 is an explanatory diagram showing the movement of the wafer W in the third transfer pattern.

[0112] In this example, wafers W1a and W1b are previously stored in load lock module 20a, wafers W2a and W2b are previously stored in COR module 61, and wafers W3a and W3b are previously stored in PHT module 62 (step St300). This step St300 is similar to step St100 in the first transfer pattern.

[0113] First, the wafer transfer mechanism 70 receives the wafers W3a and W3b from the stages 66a and 66b of the PHT module 62 using the upper pick 78a1 of the transfer arm 71a and the upper pick 78b1 of the transfer arm 71b (step St301). In step St301, the wafers W3a and W3b after the PHT processing are affected, and are transferred in the second transfer mode. Also in step St301, the upper pick 78a1, which is closer to the PHT module 62, receives the wafer W3a, and then the upper pick 78b1 receives the wafer W3b.

[0114] In step St301, wafer W3a may be received by transfer arm 71a, and either upper pick 78a1 or lower pick 78a2 may receive wafer W3a. Similarly, wafer W3b may be received by transfer arm 71b, and either upper pick 78b1 or lower pick 78b2 may receive wafer W3b. Furthermore, the order in which wafers W3a and W3b are received in step St301 is not particularly limited; wafer W3b may be received by upper pick 78b1, and then wafer W3a may be received by upper pick 78a1.

[0115] Next, the wafer transfer mechanism 70 transfers the wafer W3a on the pick 78a1 to the stocker 21b of the load lock module 20b (step St302). After the inside of the load lock module 20b is opened to the atmosphere, the wafer W3a held in the stocker 21b is carried out of the load lock module 20b by the wafer transfer mechanism 40. Thereafter, the pressure inside the load lock module 20b is reduced.

[0116] Next, the wafer transfer mechanism 70 transfers the wafer W3b on the pick 78b1 to the stocker 22b of the load lock module 20b (step St302). After the inside of the load lock module 20b is opened to the atmosphere, the wafer W3b held in the stocker 22b is carried out of the load lock module 20b by the wafer transfer mechanism 40. Thereafter, the pressure inside the load lock module 20b is reduced.

[0117] If the distance between stockers 21b and 22b in load lock module 20b is 30 mm or more, wafers W3a and W3b may be held in the stockers simultaneously. In this case, in step St302, wafer W3a is transferred from the upper pick 78a1 closer to load lock module 20b, and then wafer W3b is transferred from the upper pick 78b1. Subsequently, after the interior of load lock module 20b is opened to the atmosphere, wafers W3a and W3b held in stockers 21b and 22b are removed from load lock module 20b by wafer transfer mechanism 40. Thereafter, the interior of load lock module 20b is depressurized. In step St302, the order in which wafers W3a and W3b are transferred is not particularly limited; wafer W3b may be transferred from upper pick 78b1, and then wafer W3a may be transferred from upper pick 78a1.

[0118] Next, the wafer transfer mechanism 70 uses the upper pick 78a1 and lower pick 78a2 of the transfer arm 71a to receive the wafers W1a and W1b from the stockers 21a and 22a of the load lock module 20a (step St303). In step St303, the unprocessed wafers W1a and W1b are not affected, and the wafers W1a and W1b are transferred in the first transfer mode. Also in step St303, the picks 78a1 and 78a2 simultaneously receive the two wafers W1a and W1b.

[0119] In step St303, W1a and W1b may be received by the transfer arm 71 closer to the load lock module 20a, and W1a and W1b may be received by the upper pick 78b1 and the lower pick 78b2 of the transfer arm 71b.

[0120] Next, the wafer transfer mechanism 70 uses the upper pick 78b1 and lower pick 78b2 of the transfer arm 71b to receive the wafers W2a and W2b from the stages 63a and 63b of the COR module 61 (step St304). In step St304, the wafers W2a and W2b after the COR process are unaffected, and are transferred in the first transfer mode. Also in step St304, after the wafer W2a is received by the upper pick 78b1, the wafer W2b is received by the lower pick 78b2.

[0121] In step St304, the order in which the wafers W2a and W2b are received is not particularly limited, and the lower pick 78b2 may receive the wafer W2b, and then the upper pick 78b1 may receive the wafer W2a.

[0122] Next, wafer transfer mechanism 70 transfers wafers W1a and W1b from transfer arm 71a to stages 63a and 63b of COR module 61 (step St305). In step St305, wafer W1b is transferred from lower pick 78a2, and then wafer W1a is transferred from upper pick 78a1.

[0123] Next, the wafers W1a and W1b placed on the stages 63a and 63b are subjected to COR processing.

[0124] In step St305, the order in which the wafers W1a and W1b are transferred is not particularly limited, and the wafer W1a may be transferred from the upper pick 78a1 and then from the lower pick 78a2.

[0125] Next, the wafer transfer mechanism 70 transfers the wafers W2a and W2b on the picks 78b1 and 78b2 of the transfer arm 71b to the stages 66a and 66b of the PHT module 62 (step St306). In step St306, after transferring the wafer W2b from the lower pick 78b2, the wafer W2a is transferred from the upper pick 78b1.

[0126] Next, the wafers W2a and W2b placed on the stages 66a and 66b are subjected to PHT processing.

[0127] In step St306, the order in which the wafers W2a and W2b are transferred is not particularly limited, and the wafer W2a may be transferred from the upper pick 78b1, and then the wafer W2b may be transferred from the lower pick 78b2.

[0128] Next, the wafer transfer mechanism 70 receives the wafers W2a and W2b from the stages 66a and 66b of the PHT module 62 using the upper pick 78a1 of the transfer arm 71a and the upper pick 78b1 of the transfer arm 71b (step St307). This step St307 is similar to step St301 described above.

[0129] Next, the wafer transfer mechanism 70 transfers the wafers W2a and W2b on the picks 78a1 and 78b1 to the stockers 21b and 22b of the load lock module 20b (step St308). This step St308 is similar to the above-mentioned step St302.

[0130] Next, the wafer transfer mechanism 70 receives the wafers W1a and W1b from the stages 63a and 63b of the COR module 61 with the upper pick 78b1 and the lower pick 78b2 of the transfer arm 71b (step St309). This step St309 is similar to step St304 described above.

[0131] Next, the wafer transfer mechanism 70 transfers the wafers W1a and W1b on the picks 78b1 and 78b2 to the stages 66a and 66b of the PHT module 62 (step St310). This step St310 is similar to step St306 described above.

[0132] Next, the wafer transfer mechanism 70 receives the wafers W1a and W1b from the stages 66a and 66b of the PHT module 62 using the upper pick 78a1 of the transfer arm 71a and the upper pick 78b1 of the transfer arm 71b (step St311). This step St311 is similar to steps St301 and St307 described above.

[0133] Next, the wafer transfer mechanism 70 transfers the wafers W1a and W1b on the picks 78a1 and 78b1 to the stockers 21b and 22b of the load lock module 20b (step St312). This step St312 is similar to the above-mentioned steps St302 and St308.

[0134] (Fourth transport pattern) Fig. 12 is a flow diagram showing the main steps of the fourth transfer pattern, and Fig. 13 is an explanatory diagram showing the movement of the wafer W in the fourth transfer pattern.

[0135] In this example, wafers W1a and W1b are previously stored in load lock module 20a, wafers W2a and W2b are previously stored in COR module 61, and wafers W3a and W3b are previously stored in PHT module 62 (step St400). This step St400 is similar to step St100 in the first transfer pattern.

[0136] First, the wafer transfer mechanism 70 receives wafers W1a and W1b from stockers 21a and 22a of load lock module 20a using the upper pick 78a1 and lower pick 78a2 of transfer arm 71a (step St401). In step St401, unprocessed wafers W1a and W1b are not affected, and the wafers W1a and W1b are transferred in the first transfer mode. Also in step St401, the picks 78a1 and 78a2 simultaneously receive two wafers W1a and W1b.

[0137] In step St401, W1a and W1b may be received by the transfer arm 71 closer to the load lock module 20a, and W1a and W1b may be received by the upper pick 78b1 and the lower pick 78b2 of the transfer arm 71b.

[0138] Next, the wafer transfer mechanism 70 uses the upper pick 78b1 and lower pick 78b2 of the transfer arm 71b to receive the wafers W2a and W2b from the stages 63a and 63b of the COR module 61 (step St402). In step St402, the wafers W2a and W2b after the COR process are unaffected, and are transferred in the first transfer mode. Also in step St402, after the wafer W2a is received by the upper pick 78b1, the wafer W2b is received by the lower pick 78b2.

[0139] In step St402, the order in which the wafers W2a and W2b are received is not particularly limited, and the lower pick 78b2 may receive the wafer W2b, and then the upper pick 78b1 may receive the wafer W2a.

[0140] Next, wafer transfer mechanism 70 transfers wafers W1a and W1b from transfer arm 71a to stages 63a and 63b of COR module 61 (step St403). In step St403, wafer W1b is transferred from lower pick 78a2, and then wafer W1a is transferred from upper pick 78a1.

[0141] Next, the wafers W1a and W1b placed on the stages 63a and 63b are subjected to COR processing.

[0142] In step St403, the order in which the wafers W1a and W1b are transferred is not particularly limited, and the wafer W1a may be transferred from the upper pick 78a1 and then from the lower pick 78a2.

[0143] Next, the wafer transfer mechanism 70 uses the upper pick 78a1 and lower pick 78a2 of the transfer arm 71a to receive the wafers W3a and W3b from the stages 66a and 66b of the PHT module 62 (step St404). In step St404, the wafers W3a and W3b after the PHT process are unaffected, and are transferred in the first transfer mode. Also in step St404, after the upper pick 78a1 receives the wafer W3a, the lower pick 78a2 receives the wafer W3b.

[0144] In step St404, the order in which the wafers W3a and W3b are received is not particularly limited, and the lower pick 78a2 may receive the wafer W3b, and then the upper pick 78a1 may receive the wafer W3a.

[0145] Next, the wafer transfer mechanism 70 transfers the wafers W2a and W2b on the picks 78b1 and 78b2 of the transfer arm 71b to the stages 66a and 66b of the PHT module 62 (step St405). In step St405, after the wafer W2b is transferred from the lower pick 78b2, the wafer W2a is transferred from the upper pick 78b1.

[0146] Next, the wafers W2a and W2b placed on the stages 66a and 66b are subjected to PHT processing.

[0147] In step St405, the order in which the wafers W2a and W2b are transferred is not particularly limited, and the wafer W2a may be transferred from the upper pick 78b1, and then the wafer W2b may be transferred from the lower pick 78b2.

[0148] Next, wafer transfer mechanism 70 transfers wafers W3a and W3b on picks 78a1 and 78a2 to stockers 21b and 22b in load lock module 20b (step St406). In step St406, picks 78a1 and 78a2 simultaneously transfer two wafers W3a and W3b.

[0149] Subsequently, after the inside of load lock module 20b is opened to the atmosphere, wafers W3a and W3b held in stockers 21b and 22b are carried out of load lock module 20b by wafer transfer mechanism 40. Thereafter, the inside of load lock module 20b is depressurized.

[0150] Next, the wafer transfer mechanism 70 receives the wafers W1a and W1b from the stages 63a and 63b of the COR module 61 with the upper pick 78b1 and the lower pick 78b2 of the transfer arm 71b (step St407). This step St407 is similar to step St402 described above.

[0151] Next, the wafer transfer mechanism 70 receives the wafers W2a and W2b from the stages 66a and 66b of the PHT module 62 with the upper pick 78a1 and lower pick 78a2 of the transfer arm 71a (step St408). This step St408 is similar to step St404 described above.

[0152] Next, the wafer transfer mechanism 70 transfers the wafers W1a and W1b on the picks 78b1 and 78b2 of the transfer arm 71b to the stages 66a and 66b of the PHT module 62 (step St409). This step St409 is similar to step St405 described above.

[0153] Next, the wafer transfer mechanism 70 transfers the wafers W2a and W2b on the picks 78a1 and 78a2 of the transfer arm 71a to the stockers 21b and 22b of the load lock module 20b (step St410). This step St410 is the same as step St406 described above.

[0154] Next, the wafer transfer mechanism 70 receives the wafers W1a and W1b from the stages 66a and 66b of the PHT module 62 with the upper pick 78a1 and the lower pick 78a2 of the transfer arm 71a (step St411). This step St411 is similar to steps St405 and St408 described above.

[0155] Next, the wafer transfer mechanism 70 transfers the wafers W1a and W1b on the picks 78a1 and 78a2 of the transfer arm 71a to the stockers 21b and 22b of the load lock module 20b (step St412). This step St412 is similar to steps St406 and St410 described above.

[0156] According to the above embodiment, if two processed wafers W are affected, the second transfer mode is selected. In this case, two wafers W are held by the upper pick 78a1 or the lower pick 78a2 of the transfer arm 71a and the upper pick 78b1 or the lower pick 78b2 of the transfer arm 71b, so one wafer W does not affect the other wafer W. That is, as described above, particles do not fall from the upper wafer W held by the upper pick 78a1 to the lower wafer W held by the lower pick 78a2. This prevents particles from adhering to the processed wafers W in this embodiment. Furthermore, because the processed wafer W held by the transfer arm 71a and the processed wafer W held by the transfer arm 71b are cooled in the same manner, the two wafers W can be brought to approximately the same state when the subsequent processing is performed. As a result, the subsequent processing can be performed appropriately on the two wafers W.

[0157] Furthermore, if the two processed wafers W are unaffected, the first transfer mode is selected. In this case, for example, the upper pick 78a1 and the lower pick 78a2 of the transfer arm 71a hold two wafers W, and the other transfer arm 71b can hold the other two wafers W. As a result, the efficiency of transferring wafers W by the wafer transfer mechanism 70 can be improved, and the productivity of wafer processing can be improved.

[0158] As described above, in this embodiment, the first transfer mode or the second transfer mode is determined depending on the state of the wafer W after processing, so that the transfer efficiency of the two wafers W held in the wafer transfer mechanism 70 can be improved while appropriately maintaining the state of the two wafers W after processing.

[0159] In the COR process, a process gas is supplied to the silicon oxide film on the surface of the wafer W, causing a chemical reaction between the silicon oxide film and the process gas, which alters the silicon oxide film and generates reaction products, such as AFS. Then, in the PHT process, the wafer W is heated, and the reaction products generated by the COR process are sublimated and removed. The silicon oxide film is etched by sequentially performing the COR and PHT processes.

[0160] For example, when a silicon oxide film is subjected to COR and PHT treatments with a pattern formed thereon, the compressive stress of the reaction product may attract adjacent patterns when the reaction product sublimes, resulting in pattern collapse. In particular, the probability of pattern collapse increases as the aspect ratio of the pattern increases.

[0161] In order to prevent such pattern collapse, it is important to appropriately adjust the temperature of the wafer W. According to this embodiment, it is possible to prevent a temperature difference from occurring between the two wafers W while the two wafers W are being transported by the wafer transport mechanism 70, and to make the temperatures at which the subsequent processing is performed approximately the same. Therefore, it is possible to appropriately perform the subsequent processing on the two wafers W and prevent pattern collapse.

[0162] <Other embodiments> In the above embodiment, the first transfer mode is selected when the two processed wafers W are unaffected, but the second transfer mode may also be selected. The first transfer mode or the second transfer mode can be selected as desired depending on the storage status of the wafers W in the load lock modules 20a, 20b, the COR module 61, and the PHT module 62, the transfer status of the wafers W by the wafer transfer mechanism 70, etc.

[0163] In the above embodiment, the wafer transfer mechanism 70 has two transfer arms 71a, 71b, but the number of transfer arms is arbitrary and may be three or more. Also, while the transfer arms 71a, 71b each have two-stage pick units 78a, 78b, the number of pick stages is arbitrary and may be three or more. The technology of the present disclosure can be applied to cases where multiple wafers W are transferred using a transfer arm with multiple pick stages.

[0164] In the above embodiment, the decompression unit 11 of the wafer processing apparatus 1 performs the COR process and then the PHT process. However, there are also cases where a first COR process is performed, followed by a second COR process, and then the PHT process is performed. For example, if two wafers W are unaffected after the first COR process, the transfer of the wafers W from the COR module 61 performing the first COR process to the COR module 61 performing the second COR process is arbitrarily determined to be the first transfer mode or the second transfer mode. On the other hand, if two wafers W are affected after the first COR process, the second transfer mode is determined. Even in such a case, the effects of the above embodiment can be enjoyed, i.e., the state of the two processed wafers W held by the wafer transfer mechanism 70 can be appropriately maintained, while the transfer efficiency of the two wafers W can be improved.

[0165] In the above embodiment, the wafer processing apparatus 1 includes the COR module 61 and the PHT module 62, but it may also include other processing modules. That is, the technology of the present disclosure can also be applied to cases where other processes besides the COR process and the PHT process are performed. For example, the wafer processing apparatus 1 may include a film formation module (not shown). The film formation process on the wafers W in the film formation module may be performed in a high-temperature environment, which may affect the two wafers W after the film formation process. Therefore, even when performing the film formation process, the technology of the present disclosure is useful, and the effects of the above embodiment can be enjoyed. That is, it is possible to improve the transfer efficiency of the two wafers W while appropriately maintaining the state of the two processed wafers W held by the wafer transfer mechanism 70.

[0166] In the above embodiment, the wafer transfer mechanism 70 transfers the wafer W under a reduced pressure atmosphere, but the technology of the present disclosure can also be applied to the case where the wafer W is transferred under a normal pressure atmosphere.

[0167] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the components of the above-described embodiments may be arbitrarily combined. Such an arbitrary combination naturally provides the functions and effects of each of the components involved in the combination, and also provides other functions and effects that are apparent to those skilled in the art from the description of this specification.

[0168] Furthermore, the effects described in this specification are merely descriptive or exemplary and are not limiting. In other words, the technology according to the present disclosure may achieve other effects that are apparent to those skilled in the art from the description of this specification, in addition to or in place of the above-described effects.

[0169] Note that the following configuration examples also fall within the technical scope of the present disclosure. (1) A substrate transfer method performed in a substrate processing apparatus, The substrate processing apparatus includes: a processing module for processing a plurality of substrates; a transfer mechanism having a transfer arm with multiple stages of picks for holding substrates, and for transferring the substrates to the processing module; The substrate transport method includes: (a) when a substrate held by one of the multi-stage picks does not affect a substrate held by another of the multi-stage picks, a first transport mode is determined in which the substrate is held by the multi-stage picks; When a substrate held by one of the picks influences another substrate held by another of the picks, a second transport mode is selected in which the substrate is held by any one of the multi-stage picks; (b) transporting the substrate in the first transport mode or the second transport mode determined in (a). (2) the transfer mechanism has a plurality of the transfer arms; In the first transfer mode, a plurality of substrates are held by the multi-stage picks of one of the transfer arms, The substrate transfer method according to (1), wherein in the second transfer mode, the substrate is held by any one of the multi-stage picks on each of the plurality of transfer arms. (3) The substrate processing apparatus has a plurality of the processing modules, The substrate transfer method according to (1) or (2), wherein in the step (a), at least one of the first transfer mode and the second transfer mode is determined depending on the state of the substrate after processing in the processing module. (4) The processing modules include a first processing module for processing the substrate under a reduced pressure atmosphere and a second processing module for processing the substrate under a reduced pressure atmosphere; the substrate processing apparatus includes a first load lock module and a second load lock module; the transfer mechanism transfers substrates to the first processing module, the second processing module, the first load lock module, and the second load lock module under a reduced pressure atmosphere; In the step (a), When the substrate after processing in the first processing module is the affected substrate and the substrate after processing in the second processing module is the affected substrate, determining the first transfer mode when transferring a substrate from the first load lock module to the first processing module; determining the second transfer mode when transferring the substrate from the first processing module to the second processing module; The substrate transfer method according to any one of (1) to (3), wherein the second transfer mode is determined when transferring the substrate from the second processing module to the second load lock module. (5) The processing modules include a first processing module for processing the substrate under a reduced pressure atmosphere and a second processing module for processing the substrate under a reduced pressure atmosphere; the substrate processing apparatus includes a first load lock module and a second load lock module; the transfer mechanism transfers substrates to the first processing module, the second processing module, the first load lock module, and the second load lock module under a reduced pressure atmosphere; In the step (a), When the substrate after processing in the first processing module is the affected substrate and the substrate after processing in the second processing module is the unaffected substrate, determining the first transfer mode when transferring a substrate from the first load lock module to the first processing module; determining the second transfer mode when transferring the substrate from the first processing module to the second processing module; The substrate transfer method according to any one of (1) to (3), wherein the first transfer mode is determined when transferring the substrate from the second processing module to the second load lock module. (6) The processing modules include a first processing module for processing the substrate under a reduced pressure atmosphere and a second processing module for processing the substrate under a reduced pressure atmosphere; the substrate processing apparatus includes a first load lock module and a second load lock module; the transfer mechanism transfers substrates to the first processing module, the second processing module, the first load lock module, and the second load lock module under a reduced pressure atmosphere; In the step (a), When the substrate after processing in the first processing module is the unaffected substrate and the substrate after processing in the second processing module is the affected substrate, determining the first transfer mode when transferring a substrate from the first load lock module to the first processing module; determining the first transfer mode when transferring a substrate from the first processing module to the second processing module; The substrate transfer method according to any one of (1) to (3), wherein the second transfer mode is determined when transferring the substrate from the second processing module to the second load lock module. (7) A substrate processing apparatus, a processing module for processing a plurality of substrates; a transfer mechanism having a transfer arm with multiple stages of picks for holding substrates, the transfer mechanism transferring the substrates to the processing module; a control unit; The control unit When a substrate held by one of the multi-stage picks does not affect a substrate held by another of the multi-stage picks, a first transport mode is selected in which the substrate is held by the multi-stage picks; When a substrate held by one of the picks influences a substrate held by another of the picks, the substrate processing apparatus determines to use a second transport mode in which the substrate is held by any one of the multi-stage picks. (8) The transfer mechanism has a plurality of the transfer arms, In the first transfer mode, a plurality of substrates are held by the multi-stage picks of one of the transfer arms, The substrate processing apparatus according to (7), wherein in the second transfer mode, the substrate is held by any one of the multi-stage picks on each of the plurality of transfer arms. (9) The substrate processing apparatus has a plurality of the processing modules, The substrate processing apparatus according to (7) or (8), wherein the control unit determines at least one of the first transfer mode and the second transfer mode depending on a state of the substrate after processing in the processing module. (10) The processing modules include a first processing module for processing a substrate under a reduced pressure atmosphere and a second processing module for processing a substrate under a reduced pressure atmosphere; the substrate processing apparatus includes a first load lock module and a second load lock module; the transfer mechanism transfers substrates to the first processing module, the second processing module, the first load lock module, and the second load lock module under a reduced pressure atmosphere; The control unit When the substrate after processing in the first processing module is the affected substrate and the substrate after processing in the second processing module is the affected substrate, determining the first transfer mode when transferring a substrate from the first load lock module to the first processing module; determining the second transfer mode when transferring the substrate from the first processing module to the second processing module; The substrate processing apparatus according to any one of (7) to (9), wherein the second transfer mode is determined when the substrate is transferred from the second processing module to the second load lock module. (11) The processing modules include a first processing module for processing the substrate under a reduced pressure atmosphere and a second processing module for processing the substrate under a reduced pressure atmosphere; the substrate processing apparatus includes a first load lock module and a second load lock module; the transfer mechanism transfers substrates to the first processing module, the second processing module, the first load lock module, and the second load lock module under a reduced pressure atmosphere; The control unit When the substrate after processing in the first processing module is the affected substrate and the substrate after processing in the second processing module is the unaffected substrate, determining the first transfer mode when transferring a substrate from the first load lock module to the first processing module; determining the second transfer mode when transferring the substrate from the first processing module to the second processing module; The substrate processing apparatus according to any one of (7) to (9), wherein the first transfer mode is determined when transferring a substrate from the second processing module to the second load lock module. (12) The processing modules include a first processing module for processing the substrate under a reduced pressure atmosphere and a second processing module for processing the substrate under a reduced pressure atmosphere; the substrate processing apparatus includes a first load lock module and a second load lock module; the transfer mechanism transfers substrates to the first processing module, the second processing module, the first load lock module, and the second load lock module under a reduced pressure atmosphere; The control unit When the substrate after processing in the first processing module is the unaffected substrate and the substrate after processing in the second processing module is the affected substrate, determining the first transfer mode when transferring a substrate from the first load lock module to the first processing module; determining the first transfer mode when transferring a substrate from the first processing module to the second processing module; The substrate processing apparatus according to any one of (7) to (9), wherein the second transfer mode is determined when the substrate is transferred from the second processing module to the second load lock module. [Explanation of symbols]

[0170] 1. Wafer processing equipment 61 COR modules 62 PHT modules 70 Wafer transport mechanism 71a, 71b Transfer arms 78a1, 78b1 top pick 78a2, 78b2 bottom pick 80 Control Unit W wafer

Claims

1. A substrate transfer method performed in a substrate processing apparatus, comprising: The substrate processing apparatus includes: a processing module for processing a plurality of substrates; a transfer mechanism having a transfer arm with multiple stages of picks for holding substrates, and for transferring the substrates to the processing module; The substrate transport method includes: (a) when a substrate held by one of the multi-stage picks does not affect a substrate held by another of the multi-stage picks, a first transport mode is determined in which the substrate is held by the multi-stage picks; a step of determining a second transport mode in which a substrate held by one of the picks influences another substrate held by another pick when the substrate held by one of the picks influences the other substrate; (b) transporting the substrate in the first transport mode or the second transport mode determined in the step (a).

2. the transport mechanism has a plurality of the transport arms, In the first transfer mode, a plurality of substrates are held by the multi-stage picks of one of the transfer arms, The substrate transfer method according to claim 1 , wherein in the second transfer mode, the substrate is held by any one of the multi-stage picks on each of the plurality of transfer arms.

3. the substrate processing apparatus includes a plurality of the processing modules; 2. The substrate transfer method according to claim 1, wherein in the step (a), at least one of the first transfer mode and the second transfer mode is determined depending on the state of the substrate after processing in the processing module.

4. the processing modules include a first processing module for processing a substrate under a reduced pressure atmosphere and a second processing module for processing a substrate under a reduced pressure atmosphere; the substrate processing apparatus includes a first load lock module and a second load lock module; the transfer mechanism transfers substrates to the first processing module, the second processing module, the first load lock module, and the second load lock module under a reduced pressure atmosphere; In the step (a), When the substrate after processing in the first processing module is the affected substrate and the substrate after processing in the second processing module is the affected substrate, determining the first transfer mode when transferring a substrate from the first load lock module to the first processing module; determining the second transfer mode when transferring the substrate from the first processing module to the second processing module; 4. The substrate transfer method according to claim 1, wherein the second transfer mode is determined when transferring the substrate from the second processing module to the second load lock module.

5. the processing modules include a first processing module for processing a substrate under a reduced pressure atmosphere and a second processing module for processing a substrate under a reduced pressure atmosphere; the substrate processing apparatus includes a first load lock module and a second load lock module; the transfer mechanism transfers substrates to the first processing module, the second processing module, the first load lock module, and the second load lock module under a reduced pressure atmosphere; In the step (a), If the substrate after processing in the first processing module is the affected substrate and the substrate after processing in the second processing module is the unaffected substrate, determining the first transfer mode when transferring a substrate from the first load lock module to the first processing module; determining the second transfer mode when transferring the substrate from the first processing module to the second processing module; 4. The substrate transfer method according to claim 1, wherein the first transfer mode is determined when transferring the substrate from the second processing module to the second load lock module.

6. the processing modules include a first processing module for processing a substrate under a reduced pressure atmosphere and a second processing module for processing a substrate under a reduced pressure atmosphere; the substrate processing apparatus includes a first load lock module and a second load lock module; the transfer mechanism transfers substrates to the first processing module, the second processing module, the first load lock module, and the second load lock module under a reduced pressure atmosphere; In the step (a), When the substrate after processing in the first processing module is the unaffected substrate and the substrate after processing in the second processing module is the affected substrate, determining the first transfer mode when transferring a substrate from the first load lock module to the first processing module; determining the first transfer mode when transferring a substrate from the first processing module to the second processing module; 4. The substrate transfer method according to claim 1, wherein the second transfer mode is determined when transferring the substrate from the second processing module to the second load lock module.

7. A substrate processing apparatus, a processing module for processing a plurality of substrates; a transfer mechanism having a transfer arm with multiple stages of picks for holding substrates, the transfer mechanism transferring the substrates to the processing module; a control unit; The control unit When a substrate held by one of the multi-stage picks does not affect a substrate held by another of the multi-stage picks, a first transport mode is determined in which the substrate is held by the multi-stage picks; In the case where a substrate held by one of the picks influences another substrate held by another of the picks, the substrate processing apparatus determines to use a second transport mode in which the substrate is held by any one of the multi-stage picks.

8. the transport mechanism has a plurality of the transport arms, In the first transfer mode, a plurality of substrates are held by the multi-stage picks of one of the transfer arms, The substrate processing apparatus according to claim 7 , wherein in the second transfer mode, the substrate is held by any one of the multi-stage picks on each of the plurality of transfer arms.

9. the substrate processing apparatus includes a plurality of the processing modules; The substrate processing apparatus according to claim 7 , wherein the control unit determines at least one of the first transfer mode and the second transfer mode depending on a state of the substrate after processing in the processing module.

10. the processing modules include a first processing module for processing a substrate under a reduced pressure atmosphere and a second processing module for processing a substrate under a reduced pressure atmosphere; the substrate processing apparatus includes a first load lock module and a second load lock module; the transfer mechanism transfers substrates to the first processing module, the second processing module, the first load lock module, and the second load lock module under a reduced pressure atmosphere; The control unit When the substrate after processing in the first processing module is the affected substrate and the substrate after processing in the second processing module is the affected substrate, determining the first transfer mode when transferring a substrate from the first load lock module to the first processing module; determining the second transfer mode when transferring the substrate from the first processing module to the second processing module; The substrate processing apparatus according to any one of claims 7 to 9, wherein the second transfer mode is determined when the substrate is transferred from the second processing module to the second load lock module.

11. the processing modules include a first processing module for processing a substrate under a reduced pressure atmosphere and a second processing module for processing a substrate under a reduced pressure atmosphere; the substrate processing apparatus includes a first load lock module and a second load lock module; the transfer mechanism transfers substrates to the first processing module, the second processing module, the first load lock module, and the second load lock module under a reduced pressure atmosphere; The control unit If the substrate after processing in the first processing module is the affected substrate and the substrate after processing in the second processing module is the unaffected substrate, determining the first transfer mode when transferring a substrate from the first load lock module to the first processing module; determining the second transfer mode when transferring the substrate from the first processing module to the second processing module; 10. The substrate processing apparatus according to claim 7, wherein the first transfer mode is determined when transferring a substrate from the second processing module to the second load lock module.

12. the processing modules include a first processing module for processing a substrate under a reduced pressure atmosphere and a second processing module for processing a substrate under a reduced pressure atmosphere; the substrate processing apparatus includes a first load lock module and a second load lock module; the transfer mechanism transfers substrates to the first processing module, the second processing module, the first load lock module, and the second load lock module under a reduced pressure atmosphere; The control unit When the substrate after processing in the first processing module is the unaffected substrate and the substrate after processing in the second processing module is the affected substrate, determining the first transfer mode when transferring a substrate from the first load lock module to the first processing module; determining the first transfer mode when transferring a substrate from the first processing module to the second processing module; The substrate processing apparatus according to any one of claims 7 to 9, wherein the second transfer mode is determined when the substrate is transferred from the second processing module to the second load lock module.

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