Inspection system and probe card holding method

Abstract

To provide a technique capable of stably holding a probe card with a simple configuration.SOLUTION: The inspection system includes a probe card configured to inspect a substrate, a plate having a communication path capable of applying a negative pressure for adsorbing the probe card, and a depressurization path having one end communicating with the communication path and provided outside the plate. The depressurization path is branched at an intermediate position into a negative pressure line capable of applying the negative pressure and a positive pressure line capable of applying a positive pressure equal to or higher than an atmospheric pressure to the probe card. Further, in the pressure reduction path, a first check valve and a second check valve having different cracking pressures are arranged in parallel in opposite directions between the one end and the intermediate position.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a testing system and a method for holding a probe card. [Background technology]

[0002] Patent Document 1 discloses an inspection device having multiple inspection cells (inspection units) capable of inspecting substrates. In each inspection cell, a suction mechanism applies negative pressure to attract a probe card via an interface, electrically connecting the probe card to a tester. If a power outage occurs in a factory or other facility where the inspection device is installed, the suction mechanism stops attracting the probe card, which could cause the probe card to fall. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-254812 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that can stably hold a probe card with a simple configuration. [Means for solving the problem]

[0005] According to one aspect of the present disclosure, there is provided an inspection system including a probe card for inspecting a substrate, a plate having a connecting passage capable of applying a negative pressure to adsorb the probe card, and a reduced pressure path provided outside the plate, having one end connected to the connecting passage, wherein the reduced pressure path branches off at an intermediate position into a negative pressure line capable of applying the negative pressure and a positive pressure line capable of applying a positive pressure equal to or greater than atmospheric pressure to the probe card, and a first check valve and a second check valve having different cracking pressures are arranged in parallel and opposite to each other between the one end and the intermediate position. [Effects of the Invention]

[0006] According to one aspect, the probe card can be stably held with a simple configuration. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a perspective view showing an inspection system according to an embodiment; [Figure 2] FIG. 2 is a schematic cross-sectional view showing an inspection device provided in each inspection cell. [Figure 3] FIG. 10 is a diagram illustrating a schematic diagram of a suction mechanism connected to an interface. [Figure 4] FIG. 10 is a perspective view showing a check valve unit applied to the suction mechanism. [Figure 5] Figure 5(A) is an explanatory diagram showing the operation of the check valve unit when negative pressure is generated, Figure 5(B) is an explanatory diagram showing the operation of the check valve unit when positive pressure is generated, and Figure 5(C) is an explanatory diagram showing the operation of the check valve unit during a power outage. [Figure 6] FIG. 10 is a diagram showing a state when a probe card is loaded. [Figure 7] 10 is a flowchart showing a process flow of an inspection method including a probe card holding method. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and redundant explanations may be omitted.

[0009] 1 is a perspective view showing an inspection system 10 according to an embodiment. The inspection system 10 is a system that inspects the electrical characteristics of a plurality of devices under test (DUTs, hereinafter also referred to as DUTs) formed on a substrate W. Examples of the substrate W to be inspected include a wafer, a carrier, a glass substrate, an electronic circuit board, etc. on which a plurality of DUTs are arranged. The DUTs may be any of silicon semiconductor devices, compound semiconductor devices, other electronic devices, etc.

[0010] The inspection system 10 includes an inspection unit 12 that inspects substrates W, a loader unit 13 that keeps a plurality of substrates W waiting before inspection or a plurality of inspected substrates W waiting, and a transport unit 14 that transports the substrates W between the inspection unit 12 and the loader unit 13. The inspection unit 12, transport unit 14, and loader unit 13 are arranged in this order along the positive direction of the X-axis, so that the inspection system 10 has a substantially rectangular parallelepiped shape. The inspection system 10 also has a controller 90 that controls the entire system.

[0011] The inspection unit 12 is formed in a cell tower shape having a plurality of inspection cells 11. The inspection unit 12 illustrated in Fig. 1 has four inspection cells 11 arranged in a line in the Y-axis direction, and these rows are arranged in three rows in the Z-axis direction. An inspection device 20, which will be described later, is provided in each inspection cell 11.

[0012] A container such as a FOUP (Front Opening Unified Pod) containing a plurality of substrates W is set in the loader unit 13. The loader unit 13 may also include an aligner device that adjusts the attitude of the substrates W. Furthermore, the loader unit 13 may also include a card standby unit that allows a plurality of probe cards 50 (described later) to be on standby.

[0013] A transport robot (not shown) capable of transporting the substrate W and / or the probe card 50 is installed in the transport unit 14. For example, the transport robot receives an uninspected substrate W from the loader unit 13 and transports it into a target inspection cell 11 among the inspection cells 11, and also receives an inspected substrate W from an inspection cell 11 where the inspection has been completed and transports it into the loader unit 13.

[0014] 2 is a schematic cross-sectional view showing the inspection device 20 provided in each inspection cell 11. The inspection device 20 includes a tester 30, an interface 40, and a probe card 50. The inspection device 20 inspects the electrical characteristics of each DUT on the substrate W by transmitting power and test signals output from the tester 30 to the substrate W via the interface 40 and the probe card 50.

[0015] The tester 30 has a tester motherboard 31, a plurality of test circuit boards 32 (test heads) mounted upright in slots on the tester motherboard 31, and a housing 33 that houses the test circuit boards 32. The underside of the tester motherboard 31 is provided with a plurality of terminals (not shown) that can output power and test signals.

[0016] The probe card 50 has a plate-shaped base 51 having a plurality of terminals on its upper surface, and a plurality of probes 52 provided on the lower surface of the base 51. The plurality of probes 52 come into contact with electrode pads, solder bumps, etc. of each DUT on the substrate W as the stage 60 and the substrate W are sucked during testing.

[0017] The interface 40 is a member for electrically connecting the tester 30 and the probe card 50, and includes a pogo frame 41 and a pogo block 42. The pogo frame 41 is a plate made of a material with high strength, high rigidity, and a small thermal expansion coefficient, such as a NiFe alloy. The pogo frame 41 has multiple holes 43 penetrating it in the thickness direction (Z-axis direction). A pogo block 42 is inserted into each of the holes 43. The pogo blocks 42 are positioned in the pogo frame 41 by being inserted into each hole 43, and connect terminals of the tester motherboard 31 and terminals of the base 51 of the probe card 50.

[0018] The inspection device 20 also includes a seal member 45 between the tester motherboard 31 and the pogo frame 41, and a seal member 46 between the pogo frame 41 and the probe card 50. The inspection device 20 depressurizes a space 45s between the tester motherboard 31 and the interface 40, which is surrounded by the seal member 45, thereby adsorbing the interface 40 to the tester motherboard 31. The inspection device 20 also depressurizes a space 46s between the interface 40 and the probe card 50, which is surrounded by the seal member 46, thereby adsorbing the probe card 50 to the interface 40.

[0019] Furthermore, the inspection device 20 has a bellows 47 that protrudes vertically downward from the probe card 50 and surrounds the substrate W. The inspection system 10 uses a transfer robot (not shown) to raise the stage 60 and bring each probe 52 of the probe card 50 into contact with the electrodes of each DUT on the substrate W. At this time, the inspection device 20 brings the upper surface of the stage 60 into contact with the bellows 47 and reduces the pressure in a space 47s surrounded by the bellows 47, thereby adsorbing the stage 60 to the interface 40. This adsorption brings each DUT on the substrate W into contact with the probes 52 of the probe card 50. Note that the sealing structure between the stage 60 is not limited to the bellows 47 and may have various configurations.

[0020] Fig. 3 is a diagram schematically illustrating a suction mechanism 70 connected to the interface 40. As shown in Fig. 3, the inspection device 20 includes the suction mechanism 70 that depressurizes the spaces 45s, 46s to a vacuum atmosphere by sucking gas from the spaces 45s, 46s surrounded by the sealing members 45, 46. The suction mechanism 70 has, for example, a depressurization path 70L outside the inspection cell 11, and includes a depressurization pump 75, a pressurization pump 76, and the like outside the inspection unit 12.

[0021] The depressurization path 70L includes a common line 71, a negative pressure line 72, and a positive pressure line 73. The common line 71, the negative pressure line 72, and the positive pressure line 73 are connected to each other via a first switching valve 78 provided at a midpoint in the depressurization path 70L. The positive pressure line 73 branches into a pump connection line 73a and an atmosphere release line 73b via a second switching valve 79 provided at a midpoint.

[0022] The common line 71 is a path formed downstream of the decompression path 70L, and is a pipe capable of applying both negative pressure (gas suction) and positive pressure (gas supply) to the interface 40. One end of the common line 71 is connected to the pogo frame 41 of the interface 40. The other end of the common line 71 is connected to a first switching valve 78. A pressure sensor 77 and a check valve unit 80 are provided between one end and the other end of the common line 71.

[0023] Furthermore, inside the pogo frame 41 to which the common line 71 is connected, a communication path 41a communicating with the flow path of the decompression path 70L is formed. For example, the communication path 41a branches to the vertically upper side of the pogo frame 41 and the vertically lower side of the pogo frame 41, and communicates with an opening on the top surface and an opening on the bottom surface of the pogo frame 41. This allows the inspection device 20 to apply the pressure of the suction mechanism 70 to each of the space 45s of the seal member 45 and the space 46s of the seal member 46 via the communication path 41a.

[0024] The first switching valve 78 is connected to the controller 90 and is a solenoid valve that can switch paths based on the control of the controller 90. The first switching valve 78 switches between a first mode in which the common line 71 and the negative pressure line 72 communicate with each other, and a second mode in which the common line 71 and the positive pressure line 73 communicate with each other.

[0025] The negative pressure line 72 is a path that transmits negative pressure in the decompression path 70L. One end of the negative pressure line 72 is connected to a first switching valve 78, and the other end of the negative pressure line 72 is connected to a decompression pump 75. Note that devices such as an open / close valve and a regulator may be provided midway along the negative pressure line 72.

[0026] The decompression pump 75 is connected to the controller 90, and applies an appropriate negative pressure to the negative pressure line 72 to suck in gas and exhaust the sucked gas to the outside based on the control of the controller 90. This decompression pump 75 can be, for example, a vacuum pump such as a turbomolecular pump or a rotary pump.

[0027] The positive pressure line 73 is a path that transmits positive pressure in the decompression path 70L, and one end thereof is connected to the first switching valve 78. As described above, the positive pressure line 73 branches at the second switching valve 79 into the pump connection line 73a and the atmosphere release line 73b.

[0028] The second switching valve 79 is connected to the controller 90 and is a solenoid valve that can switch paths based on the control of the controller 90. The second switching valve 79 switches between a pump connection mode in which the positive pressure line 73 communicates with the pump connection line 73a, and an atmosphere open mode in which the positive pressure line 73 communicates with the atmosphere open line 73b.

[0029] The pump connection line 73a is a path that connects the second switching valve 79 and the pressure pump 76. Devices such as an open / close valve, a regulator, and a filter may be provided midway along the pump connection line 73a.

[0030] The pressure pump 76 is connected to the controller 90, and applies an appropriate positive pressure by sending gas to the pump connection line 73a based on the control of the controller 90. For example, a compressor that compresses and feeds gas, or a blower that blows gas, can be used as the pressure pump 76.

[0031] The atmosphere release line 73b is a path that connects the second switching valve 79 to the outside (atmosphere) of the inspection system 10. Note that devices such as an open / close valve and a filter may be provided midway along the atmosphere release line 73b.

[0032] Furthermore, a pressure sensor 77 provided in the decompression path 70L (common line 71) detects the pressure inside the common line 71, in other words, the pressure inside the spaces 45s and 46s of the seal members 45 and 46. The pressure detected by the pressure sensor 77 is transmitted to the controller 90 as detection information and is used for control by the controller 90.

[0033] The check valve unit 80 provided in the suction mechanism 70 forms a structural part that mechanically controls the flow of gas through the decompression path 70L without relying on the control of the controller 90. This check valve unit 80 includes a first check valve 81 and a second check valve 82 with different cracking pressures, and the first check valve 81 and the second check valve 82 are connected in parallel with their orientations reversed to each other.

[0034] Fig. 4 is a perspective view showing a check valve unit 80 that is applied to the suction mechanism 70. As shown in Fig. 4, the check valve unit 80 has a first check valve 81 and a second check valve 82 that extend in parallel, and includes three-port connectors 83 and 84 that connect the first check valve 81 and the second check valve 82 to one end and the other end of the extension direction, respectively.

[0035] The first check valve 81 is formed as a straight cylinder, with relay tubes 85 connected to both ends. Inside the first check valve 81, a valve body, a spring member, a seal member, etc. are provided, and the check valve function is realized by the spring member biasing the valve body. The cracking pressure of the first check valve 81 is set by the internal spring member.

[0036] The first check valve 81 is oriented in such a way that it opens when it receives negative pressure equal to or greater than the cracking pressure from the primary side (the side of the first switching valve 78), but automatically closes when it receives positive pressure from the primary side. The first check valve 81 is set to a pressure that causes it to open when it receives negative pressure from the negative pressure line 72, and is capable of opening and closing at a low cracking pressure. The cracking pressure of the first check valve 81 depends on the capacity of the decompression pump 75, but may be set to a range of, for example, about 10 kPa to 100 kPa.

[0037] The second check valve 82 is also formed as a straight cylinder, with relay tubes 85 connected to both ends. Similar to the first check valve 81, the inside of the first check valve 81 is also provided with a valve body, spring member, seal member, etc., and the check valve function is realized by biasing the valve body with the spring member. In other words, the cracking pressure of the second check valve 82 is also set by the internal spring member.

[0038] The second check valve 82 is oriented in such a way that it opens when it receives a positive pressure equal to or greater than the cracking pressure from the primary side (the side of the first switching valve 78) and automatically closes when it receives a negative pressure from the primary side. The second check valve 82 is set to a pressure at which it opens when it receives a positive pressure from the positive pressure line 73, and is capable of opening and closing at a high cracking pressure that is higher than the cracking pressure of the first check valve 81. The cracking pressure of the second check valve 82 depends on the positive pressure of the pressure pump 76, but may be set to a range of, for example, about 400 kPa to 800 kPa.

[0039] In other words, the cracking pressure of the second check valve 82 is set to 4 to 80 times the cracking pressure of the first check valve 81. This allows the second check valve 82 to smoothly open when it receives a high positive pressure from the upstream side (pressurizing pump 76), and to remain closed when it receives a low negative pressure from the downstream side (pogo frame 41).

[0040] The three-port connectors 83, 84 connect a relay tube 85 connected to the first check valve 81, a relay tube 85 connected to the second check valve 82, and the common line 71, thereby communicating their internal flow paths. Each of the three-port connectors 83, 84 is fixed to a fixing plate 86 that extends parallel to the first check valve 81 and the second check valve 82. By fixing the three-port connectors 83, 84 to the fixing plate 86, the check valve unit 80 indirectly fixes the first check valve 81 and the second check valve 82 to the fixing plate 86, making it possible to handle these valves as a unit. The check valve unit 80 is installed in an appropriate location within the inspection cell 11 (for example, on a frame surrounding the inspection cell 11).

[0041] Next, the function of the check valve unit 80 will be described with reference to Figures 5(A) to 5(C). Figure 5(A) is an explanatory diagram showing the operation of the check valve unit 80 when negative pressure is generated. Figure 5(B) is an explanatory diagram showing the operation of the check valve unit 80 when positive pressure is generated. Figure 5(C) is an explanatory diagram showing the operation of the check valve unit 80 during a power outage. Note that in Figures 5(A) to 5(C), for ease of understanding, paths that communicate with the interface 40 of the inspection device 20 are shown with thick lines, and paths that do not communicate with the interface 40 are shown with thin lines.

[0042] When reducing the pressure in the spaces 45s, 46s between the sealing members 45, 46, the inspection device 20 applies negative pressure to the spaces 45s, 46s using the suction mechanism 70 to suck in the gas. In this case, as shown in FIG. 5(A), the suction mechanism 70 uses the first switching valve 78 to connect the common line 71 and the negative pressure line 72. The suction mechanism 70 also operates the decompression pump 75 to generate negative pressure in the decompression path 70L. For example, the negative pressure applied by the decompression pump 75 is set to −60 kPa. The controller 90 may control the operation of the decompression pump 75 while monitoring the pressure of the pressure sensor 77 when applying the negative pressure.

[0043] The first check valve 81 of the check valve unit 80 opens against the cracking pressure due to the negative pressure received from the decompression pump 75. As a result, the negative pressure of the decompression pump 75 is applied to the spaces 45s, 46s of the seal members 45, 46 via the negative pressure line 72, the first switching valve 78, the common line 71 including the first check valve 81, and the communication passage 41a of the pogo frame 41. As a result, the gas in the spaces 45s, 46s is smoothly sucked in. On the other hand, the second check valve 82 of the check valve unit 80 remains closed even when it receives negative pressure from the decompression pump 75 because it is oriented in the opposite direction to the first check valve 81.

[0044] Furthermore, when removing the probe card 50, the inspection device 20 breaks the vacuum (to a pressure greater than atmospheric pressure) in the depressurized spaces 45s, 46s of the seal members 45, 46 to separate them from the interface 40. In this case, as shown in FIG. 5B, the suction mechanism 70 connects the common line 71 and the positive pressure line 73 via the first switching valve 78 and connects the positive pressure line 73 and the pump connection line 73a via the second switching valve 79. The suction mechanism 70 stops the operation of the depressurization pump 75 and operates the pressure pump 76 to generate positive pressure in the depressurization path 70L. For example, the positive pressure applied by the pressure pump 76 is set to 500 to 550 kPa. The controller 90 may control the operation of the pressure pump 76 while monitoring the pressure of the pressure sensor 77 when applying the positive pressure.

[0045] The second check valve 82 of the check valve unit 80 opens against the cracking pressure due to the positive pressure received from the pressurizing pump 76. As a result, the positive pressure of the pressurizing pump 76 is applied to the spaces 45s, 46s via the pump connection line 73a, the second switching valve 79, the positive pressure line 73, the first switching valve 78, the common line 71 including the second check valve 82, and the communication passage 41a of the pogo frame 41. As a result, gas is smoothly supplied to and pressurized in the spaces 45s, 46s. Meanwhile, the first check valve 81 of the check valve unit 80 remains closed even when it receives positive pressure from the pressurizing pump 76 because it is oriented in the opposite direction to the second check valve 82.

[0046] Here, in the inspection system 10, for example, when a power outage occurs in the factory while negative pressure is being generated to adsorb the probe card 50, the decompression pump 75 and the first switching valve 78 may stop without the control of the controller 90. The decompression pump 75, which had been operating, becomes open to the atmosphere. If a check valve unit is not provided in the decompression path, the decompression pump that has been opened to the atmosphere will be connected to the communication path of the interface. Therefore, the space around the seal member of the inspection device will transition from negative pressure to atmospheric pressure, causing the probe card to fall off from the interface. In particular, if probe cards fall off in multiple inspection cells, it will take a long time to restore the inspection system even after the power outage is resolved.

[0047] In contrast, the suction mechanism 70 according to the embodiment is equipped with a check valve unit 80, which allows the spaces 45s, 46s of the inspection device 20 to be effectively closed and a vacuum atmosphere to be maintained even during a power outage. Specifically, as shown in FIG. 5(C), assume that the decompression pump 75 is in a state where the spaces 45s, 46s of the sealing members 45, 46 are in a negative pressure state due to the decompression pump 75, and the decompression pump 75 stops due to a power outage. As described above, the decompression pump 75 is in an open-to-atmosphere state. Meanwhile, the first check valve 81, which was open due to the negative pressure of the decompression pump 75, is closed as the primary side (the decompression pump 75 side) is in an open-to-atmosphere state and the secondary side (the interface 40 side) is in a vacuum atmosphere.

[0048] In this state, the vacuum atmosphere in the spaces 45s and 46s on the secondary side (the interface 40 side) exerts a force on the check valve unit 80 that draws gas toward the interface 40 (a force in the positive pressure direction when viewed from the primary side). However, since the cracking pressure of the second check valve 82 is sufficiently higher than the cracking pressure of the first check valve 81 as described above, the second check valve 82 will not open due to the drawing force (e.g., -5 kPa) on the interface 40 side. As a result, the check valve unit 80 will form a closed state with both the first check valve 81 and the second check valve 82. In other words, the check valve unit 80 can maintain the vacuum atmosphere in the spaces 45s and 46s even during a power outage, preventing the probe card 50 from falling off the interface 40. In particular, the check valve unit 80 does not require electrical drive and is therefore not affected by power outages.

[0049] Incidentally, during operation of the inspection system 10, the first check valve 81 or the second check valve 82 itself of the check valve unit 80 may fail. For example, failures of the first check valve 81 or the second check valve 82 may be caused by a defect in the internal spring member or wear of the components inside the check valve. If one of the first check valve 81 or the second check valve 82 fails, an abnormality may occur, for example, the line of the failed valve may remain blocked, the line of the failed valve may remain open, or gas may leak from the failed valve.

[0050] Therefore, the inspection system 10 is configured to execute a failure detection mode in which the controller 90 (see FIG. 1) and the pressure sensor 77 inspect for failures in the first check valve 81 and / or the second check valve 82. When the controller 90 recognizes a failure in the first check valve 81 and / or the second check valve 82, it can notify the user of the failure via a user interface (not shown).

[0051] The controller 90 is configured as a computer having a processor, memory, input / output interface, communication interface, etc. The processor is one or a combination of a CPU (Central Processing Unit), GPU (Graphics Processing Unit), ASIC (Application Specific Integrated Circuit), FPGA (Field-Programmable Gate Array), a circuit made up of multiple discrete semiconductors, etc. The memory includes a main storage device and an auxiliary storage device, and stores programs and the like that control the entire inspection system 10.

[0052] For example, when inspecting the substrate W, the controller 90 operates the transport robot to unload the substrate W from the container of the loader unit 13, transport it to the target inspection cell 11, and inspect the substrate W in this inspection cell 11. The controller 90 also operates the transport robot to unload the probe card 50 waiting in the card waiting unit of the loader unit 13, transport it to the target inspection cell 11, and attach the probe card 50 to this inspection cell 11.

[0053] The controller 90 also functions as an information processing unit that determines whether or not a failure has occurred in the first check valve 81 and the second check valve 82 of the suction mechanism 70. Examples of the timing for the failure detection mode include the timing when the probe card 50 is attached to the interface 40 (when loading) and the timing when the probe card 50 is removed from the interface 40 (when unloading). A representative example of the failure detection mode being performed when the probe card 50 is loaded will be described below with reference to FIG. 6. FIG. 6 is a diagram showing the state of the probe card 50 when loaded.

[0054] When attaching the probe card 50 to the interface 40, the inspection device 20 uses a support 61 capable of supporting the probe card 50. In a side cross-sectional view, the support 61 is formed in a concave shape having a recess 61a capable of accommodating multiple probes 52 of the probe card 50. The support 61 can support the outer periphery of the probe card 50 by means of an annular protrusion that surrounds the recess 61a.

[0055] In the failure detection mode when the probe card 50 is loaded, the time may be measured while monitoring the detection information of the pressure sensor 77. For example, after the decompression pump 75 is operated, the controller 90 measures the time from when the first switching valve 78 connects the common line 71 and the negative pressure line 72 to when the pressure of the pressure sensor 77 reaches the negative pressure threshold (set pressure). If the measured time is close to the time of the previous failure detection mode (time for comparison), the controller 90 determines that the first check valve 81 is not malfunctioning, and if the measured time deviates from the time of the previous failure detection mode, the controller 90 determines that the first check valve 81 is malfunctioning. Note that the time for comparison is not limited to the time of the previous failure detection mode, and a time obtained in advance by performing a simulation, experiment, or the like may be used.

[0056] Furthermore, after operating the pressure pump 76, the controller 90 measures the time from when the first switching valve 78 connects the common line 71 and the positive pressure line 73 to when the pressure of the pressure sensor 77 reaches a predetermined positive pressure threshold (set pressure). If the measured time is close to the time (comparison time) of the previous failure detection mode, the controller 90 determines that the second check valve 82 is not malfunctioning, and if the measured time deviates from the time of the previous failure detection mode, the controller 90 determines that the second check valve 82 is malfunctioning. In particular, when loading or unloading the probe card 50, since the support 61 is located near the probe card 50, even if the probe card 50 falls due to a vacuum break, the support 61 can immediately support the probe card 50.

[0057] Alternatively, the controller 90 may switch the connection to the atmosphere release line 73b when applying negative or positive pressure during loading of the probe card 50. FIG. 6 shows the state in which the controller 90 is connected to the atmosphere release line 73b. As a result, the primary sides of the first check valve 81 and the second check valve 82 are at atmospheric pressure. Under normal conditions, the secondary sides of the first check valve 81 and the second check valve 82 are balanced at the set cracking pressure of the first check valve 81 and the second check valve 82. Therefore, the controller 90 can also detect a failure of the check valve unit 80 by monitoring the pressure of the pressure sensor 77 and determining that the pressure is maintained at the cracking pressure of the first check valve 81 and the second check valve 82.

[0058] The controller 90 can detect a failure of the first check valve 81 and / or the second check valve 82 by the same method as above even when the probe card 50 is unloaded. The failure detection mode is not limited to when the probe card 50 is loaded or unloaded, and may be performed, for example, when the probe card 50 is not attached (before loading begins).

[0059] At this time, the controller 90 applies negative pressure using the decompression pump 75 in the absence of the probe card 50, and monitors the pressure in the common line 71 using the pressure sensor 77. If this pressure is close to the pressure (comparison pressure) in the previous failure detection mode, it is determined that there is no failure in the first check valve 81. On the other hand, if this pressure deviates from the pressure in the previous failure detection mode, it is determined that there is a failure in the first check valve 81. Note that the comparison pressure is not limited to the time during the previous failure detection mode, and it is also possible to use a pressure obtained in advance by performing a simulation, experiment, or the like.

[0060] Furthermore, for example, the controller 90 applies positive pressure using the pressure pump 76 in the absence of the probe card 50, and monitors the pressure in the common line 71 using the pressure sensor 77. If this pressure is close to the pressure (comparison pressure) in the previous failure detection mode, it determines that there is no failure in the second check valve 82. On the other hand, if this pressure deviates from the pressure in the previous failure detection mode, it determines that there is a failure in the second check valve 82.

[0061] The inspection device 20 according to the embodiment is basically configured as described above, and its operation (method of holding the probe card 50) will be described below with reference to Fig. 7. Fig. 7 is a flowchart showing the processing flow of the inspection method including the method of holding the probe card 50.

[0062] The inspection system 10 installs a probe card 50 in the inspection device 20 of each inspection cell 11 and inspects the substrate W. In this inspection method, the controller 90 sequentially executes, for example, steps S101 to S107 shown in FIG.

[0063] Specifically, the inspection system 10 transports the probe card 50 supported by the support body 61 (see FIG. 6) using the transport device of the transport unit 14, and positions the probe card 50 relative to the interface 40 (step S101).

[0064] Thereafter, the controller 90 executes the failure detection mode of the check valve unit 80 described above with the support body 61 present (step S102). This enables the controller 90 to recognize a failure in the first check valve 81 and / or the second check valve 82. If a failure in the first check valve 81 or the second check valve 82 is determined, the controller 90 stops the attachment of the probe card 50 to the interface 40 and notifies the user of the part where the failure has occurred via the user interface.

[0065] If it is determined that the first check valve 81 and the second check valve 82 are not malfunctioning, the controller 90 controls the suction mechanism 70 to apply negative pressure from the decompression pump 75 to the spaces between the seal members 45 and 46, and fixes the probe card 50 to the interface 40 (step S103). Due to the suction by the suction mechanism 70, the inspection device 20 brings the tester 30, the interface 40, and the probe card 50 into a state in which they are electrically connected to each other.

[0066] The suction mechanism 70 continues to apply negative pressure to the probe card 50 via the check valve unit 80. At this time, if a power outage occurs in the inspection system 10 as described above, the first check valve 81 and the second check valve 82 can continue to suction the probe card 50. This allows the inspection system 10 to prevent the probe card 50 from falling off in the event of a power outage, and enables inspection to be resumed quickly after the power outage.

[0067] Thereafter, the inspection system 10 transports the substrate W to be inspected to a position facing the probe card 50 of each inspection cell 11, and inspects the substrate W by bringing the substrate W into contact with the probes 52 of the probe card 50 by adsorbing the substrate W and the stage 60 (step S104). After inspecting the substrate W, the inspection system 10 detaches the inspected substrate W from the probe card 50 and transports the inspected substrate W from each inspection cell 11 to a container in the loader unit 13.

[0068] After the inspection of the substrate W, the controller 90 determines whether or not to replace the probe card 50 for each inspection cell 11 (step S105). For example, the controller 90 counts the number of inspections of the substrate W, and if the counted number of inspections does not reach the planned number of replacements, it determines not to replace the probe card 50 (step S105: NO), returns to step S104, and repeats the same processing flow. On the other hand, if the counted number of inspections reaches the planned number of replacements, the controller 90 determines to replace the probe card 50 (step S105: YES), and proceeds to step S106.

[0069] In step S106, the controller 90 controls the suction mechanism 70 to apply positive pressure from the pressure pump 76 to the spaces 45s, 46s between the seal members 45, 46, causing a vacuum break, thereby detaching the probe card 50 from the interface 40. At this time, the inspection system 10 controls the transport device to make the support 61 wait below the probe card 50. As a result, the detached probe card 50 is supported by the support 61. As described above, the controller 90 may also execute a failure detection mode when removing the probe card 50.

[0070] Thereafter, the inspection system 10 moves the probe card 50 supported by the support body 61 using the transport device of the transport unit 14, and returns the used probe card 50 to the card waiting unit of the loader unit 13 (step S107). Furthermore, when the probe card 50 is to be replaced, the inspection system 10 takes out a new probe card 50 from the waiting location of the probe card 50 of the loader unit 13, and repeats the same processing flow from step S101.

[0071] As described above, the inspection system 10 has the first check valve 81 and the second check valve 82 in the decompression path 70L, so that the probe card 50 can be easily attracted by the vacuum atmosphere and detached by breaking the vacuum. Furthermore, even if the power to the inspection system 10 is cut off due to a power outage or the like, the probe card 50 can be prevented from falling off from the interface 40 (pogo frame 41).

[0072] The inspection system 10 is not limited to the above embodiment and may take various modified forms. For example, in the above embodiment, the inspection system 10 having a plurality of inspection cells 11 (inspection devices 20) has been described. However, the technology of the present disclosure is not limited to this, and the same configuration may be adopted for the configuration for adsorbing the probe card 50 in the inspection system 10 having one each of the tester 30, the interface 40, and the prober device that moves the substrate W.

[0073] Furthermore, in the decompression path 70L according to the above embodiment, the first switching valve 78 switches between the negative pressure line 72 and the positive pressure line 73, and the second switching valve 79 switches between the pump connection line 73a and the atmosphere release line 73b. However, the path switching is not limited to this, and for example, a valve may be provided in each of the negative pressure line 72, the positive pressure line 73, the pump connection line 73a, and the atmosphere release line 73b, and the path may be switched by opening and closing the valve.

[0074] The technical ideas and effects of the present disclosure explained in the above embodiments will be described below.

[0075] A first aspect of the present disclosure is an inspection system 10 including a probe card 50 for inspecting a substrate W, a plate (pogo frame 41) having a connecting passage 41a capable of applying negative pressure to adsorb the probe card 50, and a decompression path 70L having one end connected to the connecting passage 41a and provided outside the plate, wherein the decompression path 70L branches off at an intermediate position into a negative pressure line 72 capable of applying negative pressure and a positive pressure line 73 capable of applying positive pressure above atmospheric pressure to the probe card 50, and between the one end and the intermediate position, a first check valve 81 and a second check valve 82 having different cracking pressures are arranged in parallel and opposite to each other.

[0076] As described above, the inspection system 10 has a simple configuration in which the first check valve 81 and the second check valve 82, which have different cracking pressures, are arranged in parallel and facing in opposite directions to each other, and can maintain the suction state of the probe card 50 even when the inspection system 10 is opened to the atmosphere due to a power outage or the like. That is, the inspection system 10 can stably hold the probe card 50, and can quickly recover from the interruption. Moreover, by adopting a simple configuration using the first check valve 81 and the second check valve 82, the number of parts can be reduced, which reduces the footprint, and installation costs and operating costs can be reduced.

[0077] Furthermore, the cracking pressure of the first check valve 81 is set to a pressure that is released by the negative pressure applied from the negative pressure line 72, and the cracking pressure of the second check valve 82 is set to a pressure that is released by the positive pressure applied from the positive pressure line 73. This allows the inspection system 10 to stably perform suction when attaching the probe card 50 and vacuum breaking when removing the probe card.

[0078] Furthermore, the cracking pressure of the second check valve 82 is set in the range of 4 to 80 times the cracking pressure of the first check valve 81. This allows the inspection system 10 to maintain the closed state of the second check valve 82 well even if vacuum atmosphere pressure is applied to the second check valve 82 from the plate (pogo frame 41) side during a power outage.

[0079] In addition, a switching valve (first switching valve 78) provided midway between the negative pressure line 72 and the positive pressure line 73 is used to switch so that one of them communicates with the communication passage 41a of the plate (pogo frame 41). This allows the inspection system 10 to further simplify the configuration of the pressure reduction path 70L and further reduce its footprint.

[0080] The first check valve 81 and the second check valve 82 are formed into a check valve unit 80 in which they are fixed in a state of being arranged in parallel and facing in opposite directions to each other. This makes it possible for the inspection system 10 to handle the first check valve 81 and the second check valve 82 as a single unit, facilitating installation of the unit.

[0081] The inspection system 10 also has a pressure sensor 77 that detects the pressure in the decompression path 70L between one end and a midway position, and an information processing unit (controller 90) that processes the detection information of the pressure sensor 77, and the information processing unit determines a failure of the first check valve 81 and / or the second check valve 82 based on the detection information of the pressure sensor 77. This allows the inspection system 10 to notify the user of a failure of the first check valve 81 and / or the second check valve 82 at an early stage, allowing the user to take the necessary measures.

[0082] Furthermore, the information processing unit (controller 90) acquires detection information from the pressure sensor 77 when the probe card 50 is attached to the plate (pogo frame 41) or when the probe card 50 is removed from the plate, and determines whether the first check valve 81 has failed based on the time it takes for the detected pressure to reach the set pressure from the time when negative pressure is applied to the negative pressure line 72 and the comparison time, and determines whether the second check valve 82 has failed based on the time it takes for the detected pressure to reach the set pressure from the time when positive pressure is applied to the positive pressure line 73 and the comparison time. This allows the inspection system 10 to accurately recognize failures in the first check valve 81 and / or the second check valve 82.

[0083] Furthermore, the information processing unit (controller 90) acquires detection information from the pressure sensor 77 when the probe card 50 is not attached to the plate (pogo frame 41), and determines whether the first check valve 81 has failed based on the pressure of the pressure sensor 77 when negative pressure is applied from the negative pressure line 72 and the comparison pressure, and determines whether the second check valve 82 has failed based on the pressure of the pressure sensor 77 when positive pressure is applied from the positive pressure line 73 and the comparison pressure. Even in this case, the inspection system 10 can accurately recognize failures of the first check valve 81 and / or the second check valve 82.

[0084] A second aspect of the present disclosure is a method for holding a probe card in an inspection system 10, the inspection system 10 including a probe card 50 for inspecting a substrate W, a plate (pogo frame 41) having a communication passage 41a capable of applying a negative pressure for adsorbing the probe card 50, and a decompression path 70L provided outside the plate and having one end communicating with the communication passage 41a, the decompression path 70L branching at a midpoint into a negative pressure line 72 capable of applying a negative pressure and a positive pressure line 73 capable of applying a positive pressure equal to or higher than atmospheric pressure to the probe card 50, and a first check valve 81 and a second check valve 82 having different cracking pressures are arranged in parallel and opposite to each other between the one end and the midpoint, and the holding method applies the negative pressure of the negative pressure line 72 to the communication passage 41a via the decompression path 70L to adsorb the probe card 50. Even in this case, the method for holding the probe card 50 can stably hold the probe card 50 with a simple configuration.

[0085] The inspection system 10 and the holding method of the probe card 50 according to the presently disclosed embodiments are illustrative in all respects and are not limiting. The embodiments can be modified and improved in various ways without departing from the spirit and scope of the appended claims. The matters described in the above-described embodiments can be configured in other ways as long as they are not inconsistent, and can be combined as long as they are not inconsistent. [Explanation of symbols]

[0086] 10 Inspection System 41 Pogo Frame 41a Communication path 50 probe cards 70L decompression path 72 Negative pressure line 73 Positive pressure line 81 First check valve 82 Second check valve W substrate

Claims

1. a probe card for inspecting the substrate; a plate having a communication path capable of applying a negative pressure for adsorbing the probe card; a pressure reduction path having one end communicating with the communication path and provided outside the plate, The pressure reduction path is a negative pressure line capable of applying the negative pressure and a positive pressure line capable of applying a positive pressure equal to or higher than atmospheric pressure to the probe card; and a first check valve and a second check valve having different cracking pressures are arranged in parallel and opposite directions to each other between the one end and the intermediate position. Inspection system.

2. The cracking pressure of the first check valve is set to a pressure at which the first check valve is released by the negative pressure applied from the negative pressure line, The cracking pressure of the second check valve is set to a pressure at which the second check valve is released by the positive pressure applied from the positive pressure line. The inspection system of claim 1 .

3. The cracking pressure of the second check valve is set to 4 to 80 times the cracking pressure of the first check valve. The inspection system of claim 2 .

4. The negative pressure line and the positive pressure line are switched by a switching valve provided at the midpoint so that one of them communicates with the communication passage of the plate. The inspection system according to any one of claims 1 to 3.

5. The first check valve and the second check valve are formed into a check valve unit that is fixed in a state in which they are arranged in parallel and facing in opposite directions to each other. The inspection system according to any one of claims 1 to 3.

6. a pressure sensor for detecting a pressure in the pressure reduction path between the one end and the intermediate position; an information processing unit that processes detection information from the pressure sensor, the information processing unit determines a failure of the first check valve and / or the second check valve based on the detection information of the pressure sensor. The inspection system according to any one of claims 1 to 3.

7. the information processing unit acquires detection information from the pressure sensor when the probe card is attached to the plate or when the probe card is removed from the plate; determining whether the first check valve has failed based on a time required for the detected pressure to reach a set pressure from the time when the negative pressure in the negative pressure line is applied and a comparison time; determining whether or not the second check valve has failed based on a time required for the detected pressure to reach a set pressure from the time when the positive pressure in the positive pressure line is applied and a comparison time; The inspection system of claim 6 .

8. the information processing unit acquires detection information from the pressure sensor in a state where the probe card is not attached to the plate, determining whether or not the first check valve has failed based on the pressure of the pressure sensor when the negative pressure in the negative pressure line is applied and a comparison pressure; determining whether or not the second check valve has failed based on the pressure of the pressure sensor when the positive pressure is applied to the positive pressure line and a comparison pressure; The inspection system of claim 6 .

9. a probe card for inspecting the substrate; a plate having a communication path capable of applying a negative pressure for adsorbing the probe card; a pressure reduction path provided outside the plate and having one end communicating with the communication path, The pressure reduction path is a negative pressure line capable of applying the negative pressure and a positive pressure line capable of applying a positive pressure equal to or higher than atmospheric pressure to the probe card; and a first check valve and a second check valve having different cracking pressures are arranged in parallel and opposite directions to each other between the one end and the intermediate position; In the holding method, The probe card is attracted by suction by applying the negative pressure of the negative pressure line to the communication path via the decompression path. How to hold the probe card.

Images